CN1916718A - Substrate alignment apparatus, substrate processing apparatus, and substrate transfer apparatus - Google Patents
Substrate alignment apparatus, substrate processing apparatus, and substrate transfer apparatus Download PDFInfo
- Publication number
- CN1916718A CN1916718A CNA2006101091662A CN200610109166A CN1916718A CN 1916718 A CN1916718 A CN 1916718A CN A2006101091662 A CNA2006101091662 A CN A2006101091662A CN 200610109166 A CN200610109166 A CN 200610109166A CN 1916718 A CN1916718 A CN 1916718A
- Authority
- CN
- China
- Prior art keywords
- substrate
- aforementioned
- processed substrate
- support
- worktable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
Abstract
A substrate alignment apparatus of the present invention comprises a plurality of supporting elements(152)discretely arranged on a basically horizontal work table(100)to support a substrate to be treated(G)in a nearly horizontal state, wherein the supporting elements are capable of displacing in the horizontal direction; and a positioning mechanism(102)for positioning the substrate which is to be treated(G)and supported by the supporting elements by pressing the substrate to the specified direction in the horizontal. By such a structure, the alignment of a substrate can be safely, accurately, and efficiently performed, without causing flaws or scratches or generating pollution.
Description
The application is dividing an application in first to file (applying date: on October 27th, 2003, application number: 200310102643.9, denomination of invention: substrate alignment apparatus, substrate board treatment and substrate transfer apparatus).
Technical field
The present invention relates to the substrate alignment apparatus that uses in the manufacturing process of LCD (LCD) etc., substrate board treatment and substrate transfer apparatus particularly, relate to the technology of mechanically carrying out the contraposition of processed substrate.
Background technology
Always, in the manufacturing process of LCD, in order before processing is handled or in the carrying way, processed substrate (glass substrate) to be carried out contraposition in worktable upper edge XY direction, adopt one side that substrate essentially horizontally is bearing in and separate being disposed on a plurality of fulcrum posts on the worktable of regulation, the correcting mechanism that one side pushes the mechanical system that the side on the corner part of substrate or each limit positions to the direction of regulation with suitable anchor clamps (for example, the special Fig. 2 that opens the 2001-44118 communique of reference reaches the explanation based on this figure, and the spy opens Fig. 5 of flat 6-143177 communique, Fig. 6 reaches the explanation based on these figure).In addition, in that substrate is fixing being held under the situation of the desired location on the worktable, the interval that separates regulation on worktable is provided with a plurality of vacuum suction pads, with after substrate-placing is on the pad of desired location, immediately each pad is connected on the vacuum source, utilizes vacuum suction substrate (for example the special Fig. 4 that opens flat 10-106945 communique of reference reaches the explanation based on this figure).
The correcting mechanism of above-mentioned prior mechanical hour can not have obstacle ground to carry out contraposition at substrate.But recently, substrate quite maximizes, and for example it is of a size of 850 * 1000mm, 1000 * 1200mm in making, each weight is the substrate of 2～4kg.Under the situation of this large substrate, utilize the correcting mechanism of prior art, exist the side of promptly using anchor clamps pushing substrate, substrate also can not slide on fulcrum post but be crooked, perhaps, even the back side of sliding substrate also can be abraded by force by the front end of pin, perhaps produce problems such as particle.
Summary of the invention
The objective of the invention is, provide a kind of not can to processed substrate damage and scratch and can not produce particle, can be safely and correct, and then the substrate alignment apparatus that carries out the contraposition of substrate expeditiously.
Other purpose of the present invention is, provide a kind of safe, carry out the contraposition of processed substrate correctly, efficiently, and improve the substrate board treatment of handling quality and efficient.
Another object of the present invention is, provide a kind of safe, carry out the contraposition of processed substrate correctly, efficiently, improve the substrate transfer apparatus of carrying precision, reliability and the efficient of substrate.
In order to achieve the above object, substrate alignment apparatus of the present invention comprises:, mounting essentially horizontally is configured in the support of a plurality of top offsets in the horizontal direction on the substantially horizontal worktable dispersedly for supporting processed substrate, and the detent mechanism that mounting is positioned to the direction pushing of regulation in surface level in the processed substrate on the support.
In this substrate alignment apparatus, when carrying out the contraposition of processed substrate,, support also carries out displacement because imitateing the displacement of processed substrate in the horizontal direction, so can not damage the lower surface of processed substrate and scratch, can suppress to pollute.
In the present invention, preferably, detent mechanism can be with a pair of corner part of the mutual subtend of processed substrate to pushing along the linea angulata direction, with processed substrate orientation, perhaps, also can be with part or all the side on limit of processed substrate to the direction vertical pushing, with processed substrate orientation with this limit.
Substrate board treatment of the present invention comprises substrate alignment apparatus of the present invention, and to carry out the processing mechanism of predetermined process by the processed substrate after this substrate alignment apparatus contraposition.Since utilize substrate alignment apparatus of the present invention can be with substrate safety, correctly, contraposition promptly, so, can safety, high precision and expeditiously processed substrate is carried out required processing.
Substrate transfer apparatus of the present invention comprises substrate alignment apparatus of the present invention, and will be by the carrying mechanism of the processed board carrying after this substrate alignment apparatus contraposition to the place of regulation.Owing to utilize substrate alignment apparatus of the present invention can safely, correctly, promptly carry out the contraposition of processed substrate, so can improve precision, reliability and the efficient of board carrying.
Above-mentioned and other purpose, feature, form and advantage of the present invention, in order to understand the detailed description of the lower surface that the present invention carries out, it is clearer to become by relevant with accompanying drawing.
Description of drawings
Fig. 1 is the planimetric map of structure that expression can be adopted the coating developing system of substrate alignment apparatus of the present invention, substrate board treatment and substrate transfer apparatus.
Fig. 2 is the process flow diagram of the treatment step in the coating developing system of presentation graphs 1.
Fig. 3 is the planimetric map of the major part structure of coating processing unit group in the coating developing system in the presentation graphs 1.
Fig. 4 is the side view of the major part structure of coating processing unit group in the coating developing system in the presentation graphs 1.
Fig. 5 is the skeleton view of major part structure of the correcting mechanism of expression first embodiment according to the invention.
Fig. 6 is the major part structure of correcting mechanism of expression first embodiment according to the invention and a kind of diagram of state.
Fig. 7 is the major part structure of correcting mechanism of expression first embodiment according to the invention and a kind of cut-away section side view of state.
Fig. 8 is the skeleton view of expression according to the major part structure of the correcting mechanism of second embodiment of the present invention.
Fig. 9 is the enlarged perspective of expression according to the major part structure of the correcting mechanism of second embodiment of the present invention.
Figure 10 is the framework of expression according to the major part structure of the correcting mechanism of second embodiment of the present invention.
Figure 11 is that expression is according to the major part structure of the correcting mechanism of second embodiment of the present invention and a kind of longitudinal diagram of state.
Figure 12 is the block diagram of expression according to the major part structure of the correcting mechanism of second embodiment of the present invention.
Figure 13 is that expression is according to the major part structure of the correcting mechanism of second embodiment of the present invention and a kind of longitudinal diagram of state.
Figure 14 is that expression is according to the major part structure of the correcting mechanism of the 3rd embodiment of the present invention and a kind of longitudinal diagram of state.
Figure 15 is that expression is according to the major part structure of the correcting mechanism of the 3rd embodiment of the present invention and a kind of longitudinal diagram of state.
Figure 16 is that expression is according to the structure of the variation of the 3rd embodiment of the present invention and a kind of longitudinal diagram of state.
Figure 17 is that expression is according to the major part structure of the correcting mechanism of the 4th embodiment of the present invention and a kind of longitudinal diagram of state.
Figure 18 is the planimetric map of structure of a kind of form of implementation of expression carrying mechanism of the present invention.
Figure 19 is the longitudinal diagram of the variation of expression the 4th embodiment shown in Figure 17.
Figure 20 is a longitudinal diagram of representing the major part of variation shown in Figure 19 enlargedly.
Figure 21 is the longitudinal diagram of major part of representing the another one variation of the 4th embodiment shown in Figure 17 enlargedly.
Embodiment
Following with reference to description of drawings preferred implementation of the present invention.
Fig. 1 represents as the coating developing system that can adopt the structure example of substrate alignment apparatus of the present invention, substrate board treatment and substrate transfer apparatus.This coating developing system is arranged in the Clean room, for example, as processed substrate, in the LCD manufacture process, carries out the cleaning in the photoetching process, the coating of photoresist with the LCD substrate, prebake, various processing such as development and back oven dry.Exposure-processed is used with the outside exposure device (not shown) of this adjacent setting of system and is carried out.
This coating developing system is roughly divided by substrate box station (C/S) 10, handles station (P/S) 12, and interface portion (I/F) constitutes.
The substrate box station (C/S) 10 that is arranged on the end of system comprises that the mounting defined amount is for example up to 4 substrate box worktable 16 that hold the substrate box C of a plurality of substrate G, side on this substrate box worktable 16 and the carrying path 17 that is provided with abreast with the orientation of substrate box C, and can carry on the path 17 at this and move freely, carry out the carrying mechanism 20 that the taking-up of substrate G is put into respect to the substrate box C on the worktable 16.This carrying mechanism 20 has the mechanism that can keep substrate G, for example carries arm, can carry out X, Y, four actions of Z, θ, carry out the handing-over of substrate G with the Handling device 38 of the described processing station in back (P/S) 12 sides.
Handle station (P/S) 12 from aforesaid substrate box station (C/S) station, via (across) substrate relay 23, soup feeding unit 25 and gap 27 set gradually cleaning treatment portion 22 with being arranged to a line, is coated with handling part 24, development treatment portion 26.
The interface portion (I/F) 14 that is arranged on another end of system is provided with carrying mechanism 59 with a side of handling station 12 adjacency extension (substrate delivery/reception portion) 56 and buffer table 57 being set in the side with the exposure device adjacency.This carrying mechanism 59 can move freely on the carrying path 19 of extending along the Y direction, puts into respect to the taking-up that buffer table 57 carries out substrate G, will or carry out the handing-over of substrate G and extension (substrate delivery/reception portion) 56 and adjacent exposure device.
Fig. 2 is illustrated in the step of handling in this coating developing system.At first,, take out a substrate G the substrate box C of the regulation of carrying mechanism 20 from worktable 12, transfer to the Handling device 38 (step S 1) of the cleaning treatment portion 22 that handles station (P/S) 12 at substrate box station (C/S) 10.
In cleaning treatment portion 22, successively substrate G is transported into ultraviolet ray irradiation/cooling unit (UV/COL) 30, carry out initial cleaning, the secondly temperature (step S2) that is cooled to stipulate at cooling unit (COL) in ultraviolet irradiation unit (UV) with the ultraviolet dry type of carrying out of shining.In this ultraviolet ray is cleaned, mainly be the organism of removing substrate surface.
Secondly, substrate G accepts to clean cleaning treatment one of in cleaning cleaning unit (SCR) 28, removes emboliform dirt (step S3) from substrate surface.After the scouring, substrate G is received in the processed (step S4) that heating unit (HP) 32 undertaken by heating, secondly, is cooled to certain substrate temperature (step S5) at cooling unit 34.Arrive this, the pre-treatment end in cleaning treatment portion 22 utilizes main Handling device 38 that substrate G is transported to coating handling part 24 via substrate delivery/reception portion 23.
At coating handling part 24, at first successively substrate G is transported into bonding/cooling unit (AD/COL) 46, accept hydrophobization at bonding element (AD) at first and handle (HMDS) (step S6), secondly, be cooled to certain substrate temperature (step S7) at cooling unit (COL).
Then, substrate G accepts the coating of photoresist liquid at photoresist coater unit (CT) 40 and handles, next is received in the dried that drying under reduced pressure unit (VD) 42 undertaken by decompression, secondly removes the photoresist of the redundance (not wanting) of substrate periphery in cleaning unit, edge (ER) 44.
Secondly, substrate G is transported into heating/cooling unit (HP/COL) 48 successively, and secondly the oven dry (prebake) (step S9) after heating unit (HP) is coated with at first, is cooled to certain substrate temperature (step S10) at cooling unit (COL).In addition, in the oven dry after this coating, also can utilize heating unit (HP) 50.
After above-mentioned coating is handled, utilize the main Handling device 54 of coating handling part 24 and the main Handling device 60 of development treatment portion 26 to be transported to interface portion (I/F) 14 substrate G, deliver to exposure device (step S11) from this.The enterprising professional etiquette of the photoresist on the substrate G is decided the exposure of circuitous pattern with exposure device.Then, the substrate G that finishes of graph exposure turns back to interface portion (I/F) 14 from exposure device.The carrying mechanism 59 of interface portion (I/F) 14 will be handed to the development treatment portion 26 (step S11) that handles station (P/S) 12 from the substrate G that exposure device is accepted via extension 56.
In development treatment portion 26, the development treatment (step S12) that substrate G one of accepts in the developing cell (DEV) 52, secondly, one of be transported into successively in heating/cooling unit (HP/COL) 53, carry out back oven dry (step S13) at heating unit (HP) at first, secondly, be cooled to certain substrate temperature (step S14) at cooling unit (COL).For this back oven dry, also can use heating unit (HP) 55.
Substrate G after development treatment portion 26 carried out a series of processing turns back to substrate box station (C/S) 10 by the Handling device of handling in the station (P/S) 24 60,54,38, at this place, utilizes carrying mechanism 20 to be received among any one substrate box C (step S1).
In this coating developing system, for example, edge cleaning portion unit (ER) 44 for coating handling part 24 can adopt the present invention.Below, based on Fig. 3～Figure 17, the form of implementation that applies the present invention to cleaning unit, edge (ER) 44 is described.
Fig. 3 and Fig. 4 represent to be coated with photoresist coater unit (CT) 40 in the handling part 12, the structure of the major part of drying under reduced pressure unit (VD) 42 and cleaning unit, edge (ER) 44.
These coating system processing unit groups (CT) 40, (VD) 42, (ER) 44 on supporting station 60 arranged in order according to treatment process become a line.Lay pair of guide rails 62,62 in the both sides of supporting station 60, utilize along two guide rails, 62,62 parallel one or more groups mobile carrying arms 64,64 direct between the unit (without the main Handling device 54 of main carrying path 52 sides) exchange substrate G.
Photoresist coater unit (CT) 40 comprises: the container handling 66 of the cup-shaped of upper surface open, the liftable worktable 68 that the substrate of mounting maintenance flatly G uses in this container handling 66, be arranged on the lifting drive division 70 of the bottom of container handling 66 in order to make these worktable 68 liftings, the photoresist nozzle 72 that the photoresist that will drip from the substrate G on the last direction worktable 68 is used is along the nozzle scan mechanism 74 of XY direction driving, out-of-operation photoresist nozzle 72 is keeped in repair the nozzle maintenance department 76 of usefulness in the outside of container handling 66, control the controller (not illustrating among the figure) of each one.Nozzle maintenance department 76 comprises nozzle cleaning portion 78 and nozzle standby portion 80.
Drying under reduced pressure unit (VD) 42 has the lower chamber 90 of the pallet or the container type of the shallow end of upper surface open, can hermetic be adjacent to or be fitted to the upper chamber 92 of the lid shape that the upper surface ground of this lower chamber 90 constitutes.Lower chamber 90 is essentially square, and the worktable 94 that configuration level ground mounting supporting substrates G uses on central part is provided with exhausr port 96 on four jiaos of bottom surface.The gas outlet 98 that is connected on each exhausr port 96 from the bottom of lower chamber 90 leads on the vacuum pump (not shown).Under the state that upper chamber 92 is layed onto on the lower chamber 90, with this vacuum pump with the specified vacuum degree that reduces pressure of the processing space between two chambers 90,92.
On cleaning unit, edge (ER) 44, the worktable 100 that for example is made of aluminium sheet with the horizontal mounting of substrate G is set, the correcting mechanism 102 according to first embodiment that substrate G is located on worktable 100 is removed four cleanings 104 of unnecessary photoresist etc. from the circumference (edge) on four limits of substrate G.Correcting mechanism 102 is navigating to substrate G on the position of setting on the worktable 100, and under the fixing state that keeps with flat-hand position, each cleaning 104 one side move along each limit of substrate G, and one side is removed the unnecessary photoresist dissolving on the circumference on each limit of attaching substrates with solvent, for example thinning agent.
The correcting mechanism 102 of this first embodiment is in the ground configuration of a pair of diagonal line institute direction upper surface opposite of worktable 100, and having can be along a pair of pushing portion 106,106 that equidirectional moves.As shown in Figure 3, two pushing portions 106,106 have leading section end effector of flare up right angle (90 °) basically in surface level.With substrate G on worktable 100 during contraposition, for two end effectors on the corner part of the subtend that is engaged to substrate G on the diagonal of substrate G from both sides with fitting together perfectly, two pushing portions 106,106 move to the position of the outside motion of regulation respectively to the center of worktable 100 from position of readiness.
And then, as shown in Figure 5, correcting mechanism 102 has the interval that separates regulation and is configured in a plurality of fulcrum posts 108 that substrate G horizontal supporting is used on the worktable 100 dispersedly, makes substrate G float the portion of floating 110 of usefulness in fact from fulcrum post 108, and the absorption fixed part 112 that utilizes vacuum suction fixing base G to use.In illustrated embodiment, the direction that the row of the row of the fulcrum post 108 and the portion 110 of floating and absorption fixed part 112 follow alternately disposes.
As shown in Figure 6, fulcrum post 108 extends or outstanding to vertical top from the upper end central part that is fixedly installed to the tubular supporting mass 114 on the worktable 100, is born the lower surface of substrate G by the front end of pin.Float portion 110 and comprise the gas ejection portion 116 of the trumpet type that extends upward from the upper end circumference of tubular supporting mass 114, and be connected to gases at high pressure source of supply (not shown) in this gas ejection portion 116 via ventilating path 114a in the tubular supporting mass 114 and feed tube 118.The open and close valve (not shown) that opening/closing control usefulness is set midway in feed tube 118.The upper end of gas ejection portion 116 can be set in and mounting on the position of the height that forms small gap g between the back side of the substrate G on the fulcrum post 108 (lower surface).
As shown in Figure 7, in substrate G mounting under the state on the worktable 100, will be from the next gases at high pressure of above-mentioned gases at high pressure source of supply, air (also can be nitrogen etc.) for example, via the ventilating path 114a in feed tube 118 and the tubular supporting mass 114 from gas ejection portion 116 with the pressure of offsetting regulation, when being the gravity of substrate G or the pressure ejection that surpasses it, substrate G floats in fact from fulcrum post 108.Because gas ejection portion 116 forms trumpet type, so the air of running into the lower surface of substrate G can not produce eddy current, discharges by gap g smoothly.
The material of fulcrum post 108, owing to can very strong mutual friction mutually not take place with substrate G basically, so, can be the high arbitrary substance of physical strength, but preferably with respect to low rubber of substrate G friction factor or resin etc.The float gas ejection portion 116 of portion 110 also can be a material arbitrarily, even but preferably contact with substrate G can be with the flexible material of its injury by flexible bending, for example rubber, cloth, engineering plastics etc.
As shown in Figure 5, absorption fixed part 112 is made of the cylindrical body that is installed in the upper surface of worktable 100 with the height substantially the same with fulcrum post 108 vertically upward, is connected on vacuum source, for example vacuum pump or the ejector (not shown) via the air intake duct (not shown) at the back side of worktable 100.With substrate G mounting under the state on the worktable 100, when the open and close valve (not shown) of the opening/closing control usefulness midway that will be located at this air intake duct is opened, will adsorb fixed part 112 and is connected on the vacuum source, utilize vacuum adsorption force that substrate G absorption is remained to and adsorb on the fixed part 112.In addition, the upper end that preferably contacts with substrate G at least of material of absorption fixed part 112 is not easy to injure the rubber of substrate and resin etc.
Here, the mass action to the correcting mechanism in the present embodiment 102 describes.As mentioned above, will be with photic resist-coating unit (CT) 40 painting photoresist liquid, accept to be transported into the edge by carrying arm 64,64 then and clear up unit (ER) 44, on the worktable 101 more correctly essentially horizontally on mounting and the fulcrum post 108 with the substrate G that drying under reduced pressure unit (VD) 42 carried out dried.When this substrate was transported into, float portion 110 and absorption fixed part 112 were in non-action status.
After substrate was transported into, at first, portion's 110 actions of floating as mentioned above, from gas ejection portion 116 ejection pressure-airs, utilized the pressure of air that substrate G is floated in fact from fulcrum post 108.Under the state that like this substrate G is floated, 106,106 actions of pushing portion, as mentioned above, two end effectors move on the corner part that is engaged to both sides in a pair of diagonal of substrate G always with fitting together perfectly, in this moving process, the position of substrate G is finely tuned in the XY direction, navigate on the desired location on the worktable 100.
When carrying out this contraposition, substrate G can be unsettled fully, also can contact gently with part or all fulcrum post 108.Since utilize the pressure of air that the gravity of substrate G is almost offset, even the lower surface of substrate G contacts also and can slide smoothly with fulcrum post 108, so, can not damage and scratch, can not pollute.In addition, near the substrate G of suspended state is higher than pin at least partly each fulcrum post 108 front end gets final product, between the pin 108,108 of adjacency and substrate circumference deflection downwards and be lower than the height and position of the front end of pin.
After the contraposition of aforesaid substrate G finished, the portion 110 of floating disconnected, and stops the ejection of pressure-air.Then, replace the portion of floating.112 actions of absorption fixed part are worked vacuum adsorption force, and substrate G is fixedly remained on desired location with flat-hand position.Pushing portion 106,106 is in this stage, and perhaps substrate G is left after just having finished in location in front, keeps out of the way position of readiness.
Like this, utilize correcting mechanism 102 that substrate G is navigated to desired location on worktable 100, and keep so that flat-hand position is fixing.In this state, as mentioned above, cleaning 104 action are removed unnecessary photoresist from the circumference of substrate G.After this edge cleans end, in correcting mechanism 102, will adsorb fixed part 112 and close, remove vacuum adsorption force.Afterwards, carrying arm 64,64 or other carrying mechanism transport the substrate G that disposes from worktable 100, are transported to back operation handling part.
As mentioned above, in the correcting mechanism 102 of present embodiment, when on worktable 100, utilizing pushing portion 106,106 mechanically to carry out the contraposition of XY direction, substrate G is become the state that floats in fact from the fulcrum post 108 by the portion of floating 100, can not make injury and scratch to the lower surface of substrate G, and can not pollute yet, can be along on the desired location of sliding and accurately substrate G being positioned on the worktable 100.And then, since the gas ejection portion 116 of the portion 110 of floating with the mode of surrounding fulcrum post 108 be arranged on fulcrum post 108 near, so, can substrate G be floated from fulcrum post 108, can reduce the consumption of gases at high pressure as much as possible.
In addition, in the cleaning unit, edge (ER) 44 of present embodiment, since can utilize correcting mechanism 102 with substrate G safety, correctly, contraposition promptly is on the desired location on the worktable 100, so, can utilize the circumference on each limit of cleaning 104 couples of substrate G to carry out safety, high precision and the cleaning of high efficiency edge.
Secondly, based on the calibration substrate 102 of Fig. 8～Figure 13 explanation according to second embodiment.The correcting mechanism 102 of this second embodiment for example also can be applied to the cleaning unit, edge (ER) 44 of present embodiment, has the pushing portion 106 (Fig. 3, Fig. 4) the same with above-mentioned first embodiment.
As shown in Figure 8, in the present embodiment, the interval that on worktable 100, separates regulation dispersedly, for example with latticed configuration pattern arrangement double as support and float portion and the fixing jut 120 for example cylindraceous of absorption.
This jut 120 is as Fig. 9, Figure 11, shown in Figure 13, bottom cylinder 122 with the upper surface that is fixedly installed to worktable 100, and via trumpet type gas channeling portion 124 on the top of bottom cylinder 122 direction and the horizontal direction top cylinder portion 126 of installing with displacement up and down.The flange shape bottom 124a that forms on the inwall of bottom cylinder 122 gas channeling portion 124 embeds the fixedly slot part 122a of the ring-type of usefulness, and the trumpet type upper end 124b that forms on the inwall of top cylinder body 126 gas channeling portion 124 embeds the fixedly ring-type slot part 126a of usefulness.The bottom of gas channeling portion 124 is connected on the flue 128 that runs through worktable 100.
The material of bottom cylinder 122 can be the high any member of physical strength.The material of top cylinder body 126 is owing to directly contact with the lower surface of substrate G, so be preferably the rubber that can not injure substrate G or resin etc.The material of gas channeling portion 124 is preferably flexible rubber or cloth etc.
As Figure 10 and shown in Figure 12, the flue 128 that is connected on the jut 120 (gas channeling portion 124 more correctly says so) is communicated with gases at high pressure source of supply 134 and vacuum source 136 via the open and close valve 130 of opening/closing control usefulness and the dibit pattern T-valve 132 of stream switching usefulness.Open and close valve 130 and T-valve 132 for example are made of solenoid valve, the open/close position of control part 138 control open and close valves 130 and the switching position of T-valve 132.In addition, in gases at high pressure source of supply 134 and vacuum source 136, include the pressure control device (not shown) respectively.
In substrate G mounting under the state on the worktable 100, as shown in figure 10, when open and close valve 130 being switched to the locational while of opening, when T-valve 132 is switched to gases at high pressure source of supply 134 1 sides, be supplied to gas channeling portion 124 in each cylinder 120 via flue 128 from the gases at high pressure of gases at high pressure source of supply 134, for example air (also can be nitrogen etc.).Whereby, as shown in figure 11, gas channeling portion 124 plays a part ejection portion, and vertically upward gases at high pressure are blown on the lower surface of substrate G.By with the pressure that makes this air vertically upward the counteract gravity forces of substrate G or the mode that surpasses this gravity being set the air pressure of gases at high pressure source of supply 134 1 sides, substrate G can float from the upper surface of top cylinder body 126.At this moment, the air that sprays vertically upward from gas channeling portion 124 by being formed on substrate G lower surface and the gap g between the upper surface of top cylinder body 126 discharge.In addition, as shown in figure 11, the pressure of gas channeling portion 124 quilts air vertically upward stretches upward, and top cylinder body 126 becomes from the state of bottom cylinder 122 come-ups.
In the present embodiment, same, at float state, the lower surface of substrate G also can contact lightly with the upper surface of top cylinder body 126.In this case, when because the pushing force of the horizontal direction that pushing portion 106,106 produces, substrate G is to the horizontal direction displacement or when mobile, because top cylinder body 126 is bearing in the flexible gas channeling portion 124, so, can imitate moving of substrate G to identical direction displacement.Therefore, can not damage and scratch substrate G.Thereby, can be safely, rapidly, correctly substrate G is navigated on the desired location of worktable 100.
After above-mentioned contraposition finishes, as shown in figure 12, when T-valve 132 is switched to vacuum source 132 1 sides, gases at high pressure source of supply 134 is cut off, and replace vacuum source 136 is connected in the gas channeling portion 124 in each cylinder 120 via flue 128.Whereby, as shown in figure 13, gas channeling portion 124 plays a part suction unit, and substrate G is adsorbed, and fixedly remains on the upper surface of top cylinder body 126.At this moment, utilize pull of vacuum, vertically attract gas channeling portion 124 and top cylinder Figure 126 downwards, top cylinder body 126 is seated on the bottom cylinder 122 and is fixed.Like this, substrate G is fixed and remains on desired location on the worktable 100.In cleaning unit, edge (ER) 44, in this state,, can carry out good edge cleaning treatment to the circumference of substrate G by making cleaning 104 action as mentioned above.
As mentioned above, in second embodiment, equally, when utilizing pushing portion 106,106 mechanically on worktable 100, to carry out the contraposition of XY direction, the function of floating of utilizing the jut 120 on the worktable 100 to be had, by making substrate G be in the state that floats in fact from substrate supporting portion (upper surface of top cylinder body 126), can not damage the lower surface of substrate G and scratch, in addition, can not produce pollution yet, can be along on the desired location of sliding and accurately substrate G being positioned on the worktable 100.In addition, owing to, the mechanism of floating is arranged on the inboard of substrate supporting portion,, can reduce the consumption of gases at high pressure as much as possible from substrate supporting portion so substrate G will be floated partly at jut 120.
And then, in this second embodiment,,, reduce the number of parts so can omit special-purpose absorption fixed part because the cylinder 120 on the worktable 100 possesses the vacuum suction function, can reduce the cost of parts, improve the flatness of worktable mounting surface.
In addition, the shape of jut 120 and structure can have various distortion.For example, can adopt jut 120 is formed the structure of square tube bodies and the structure that top cylindrical shell 126 and bottom cylindrical shell 122 is formed an integral body.Can replace trumpet type, adopt gas channeling portion 124 is formed columnar structure, and the structure that substitutes with the through hole of cylindrical shell etc.
In Figure 14 and Figure 15, expression is according to the structure of the major part of the correcting mechanism 102 of the 3rd embodiment.The correcting mechanism 102 of this embodiment for example also goes for the cleaning unit, edge (ER) 44 of this form of implementation, has the pushing portion 106 (Fig. 3, Fig. 4) the same with above-mentioned first embodiment.
In the 3rd embodiment, the interval that separates regulation on worktable 100 disposes the double as support and the movable support pad 140 of portion of floating dispersedly.The fixing function of substrate G that keeps can for example be born by the absorption fixed part 112 among above-mentioned first embodiment by the adsorption element of special use.
In Figure 14 and Figure 15, support pads 140 constitutes the disc that bottoms have flange part 140a, can along continuous straight runs and vertical direction be contained in displacement in the recess 142a of the circle on the upper surface that is formed at cylindrical base member 142.In more detail, form smooth teat or the seat portion 144 of upper surface in the portion of bottom center of recess 142a, support pads 140 is taken one's seat at the upper surface of this one 144.Have supporting functions from the upper end circumference of base component 142 to the flange part 142c of the outstanding annular of the upper horizontal of recess 142a, stop the function of block of the flange part 140a of support pads 140 with lower surface with upper surface mounting substrate G.
As shown in figure 14, in the present portions 144 of support pads 140 when in place, set the upper surface of support pads 140 lower than the upper surface of the flange part 142c of base component 142.A plurality of gas squit hole 144a that vertically connect are set in the present portion 144, and these gas squit holes 144a is connected on the gas passage or feed tube 146 that connects base component 142 and worktable 100.This feed tube 146 is led to high pressure via opening/closing control with the open and close valve (not shown) and is risen on the (not shown) of gas generation source.
On the bottom surface of the recess 142a of base component 142, form a plurality of exhausr port 142d.These exhausr ports 142d leads on exhaust system, for example exhaust manifolds (not shown) via the exhaust pathway or the gas outlet 148 that connect base component 142 and worktable 100.
In the present embodiment, when on worktable 100, carrying out the contraposition of substrate G, as shown in figure 15, gases at high pressure, for example air that will come from gases at high pressure generation source, be supplied to the gas squit hole 144a of a portion 144 via feed tube 146, by the pressure ejection air of gas squit hole 144a with regulation.The air that contacts with the lower surface of substrate G is supported the lower surface guiding of the decurvation of pad 140 flange part 140a, emits to the side of seat portion 144, is discharged by exhausr port 142d.The pressure vertically upward that acceptance is produced by this pressure-air, support pads 140 become intactly mounting and the state that substrate G floats from seat portion 144.Under this float state, by making 106,106 actions of pushing portion, can make substrate G and support pads 140 displacement integrally, navigate on the desired location on the worktable 100.
After the location finishes, cut off the gases at high pressure that come from gases at high pressure generation source, support pads 140 is descended.Substrate G keeps with the vacuum adsorption force of absorption fixed part (112) is fixing at this height and position on the flange part 142c that transfers to base component 142 midway that support pads 140 descends.
In the present embodiment, preferably, the neutral condition before pushing portion 106,106 is about to action, the center mounting substrate G of support pads 140 in base component recess 142a.In order to realize this neutral position function, as shown in figure 16, for example, between the medial surface of the outer peripheral face of support pads 140 and recess 142a, a plurality of (for example along the circumferential direction every 120 ° three) volute spring 150 is set radially.
In the present embodiment, when on worktable 100, utilizing pushing portion 106,106 mechanically to carry out the contraposition of XY direction, by utilizing on worktable 100 function of floating of the gaseous tension formula of the support pads 140 of configuration dispersedly, make substrate G be in float state in fact, can not damage the lower surface of substrate G and scratch, and can not pollute, can be with substrate G along on the desired location of sliding and being positioned at accurately on the worktable 100.In addition, because on the dispersed ground of the support pads 140 and even the mechanism of floating and affact partly on the worktable 100, so, substrate G is floated expeditiously, can reduce the consumption of gases at high pressure.
In Figure 17, expression is according to the structure of the major part of the correcting mechanism 102 of the 4th embodiment.The correcting mechanism 102 of present embodiment for example also is applicable to the cleaning unit, edge (ER) 44 of this form of implementation, has the pushing portion 106 (Fig. 3, Fig. 4) identical with above-mentioned first embodiment.
In the correcting mechanism 102 of present embodiment, but the interval that separates regulation on worktable 102 disposes the support 152 of along continuous straight runs displacement dispersedly.The fixing function that keeps substrate G is by special-purpose adsorption element, for example the absorption fixed part 112 in above-mentioned first embodiment is born.
As shown in figure 17, on the upper surface of worker's platform 100, form recess 100a, inside at this recess 100a, for example columniform support 152 with the spherical Caster 154 that can rotate to any direction is set in the horizontal direction, use a plurality of (for example circumferencial direction three) volute spring 156 to support these supports 152 with 120 ° arranged spaced into configuration radially.
When on worktable 100, carrying out the contraposition of substrate G, as shown in figure 17, substrate G mounting on the upper surface of support 152, in this state, is made 106,106 actions of pushing portion.Support 152 and substrate G along continuous straight runs displacement integrally navigate to substrate G on the position of regulation.
In the 4th embodiment, owing to be not equipped with the mechanism of floating that as above states gaseous tension formula such among the first～three embodiment, so, when contraposition, can not make substrate G to the vertical direction displacement, but utilize the mechanism that makes support 152 displacements with displacement that imitates substrate G in the horizontal direction, can be difficult for the lower surface of substrate G is damaged and scratch.In addition, support 152 is not limited to right cylinder, can be different shape.
In the coating developing system of this form of implementation, except that cleaning unit, the edge of above-mentioned coating handling part 14 (ER) 44, in the carrying mechanism 59 of the carrying mechanism 20 of substrate box station (C/S) 10 and interface portion (I/F) 14, also can use the present invention.
Figure 18 represents a kind of form of implementation of the structure of carrying mechanism 59.This carrying mechanism 59 has on the carrying main body (not shown) that can move along carrying path 19 can and move the substantially horizontal roughly rectangular carrying worktable of installing 160 along the vertical direction along the rotation of θ direction (lifting).
At the upper surface of carrying worktable 160, the carrying arm 162 that installation can be moved along the horizontal forward/backward of the length direction of worktable.Among Figure 18, carrying arm 162 is positioned on the original position on the worktable 160.At the upper surface of carrying arm 162, the absorption layer 162a of a plurality of en plaques that absorption fixing base G uses is set.
And then at the upper surface of carrying worktable 160, being provided with respectively on the position of not disturbing with carrying arm 162 can free lifting or the contraposition that is provided with of the ground of coming in and going out a plurality of (for example 4) fulcrum posts 164 and a plurality of (for example 4) pushing pin 166 used.Carrying arm 162 is under the state of original position releasing with respect to the absorption maintenance of substrate G, and by fulcrum post 164 height from retreating position outstanding (rising) to regulation, substrate G hands to fulcrum post 164 from carrying arm 162.
Each pushing portion 166 disposes in the carrying arm 162 in original position or the outside of the substrate G on the fulcrum post 164 near mounting at the length direction (moving direction of arm) of carrying worktable 160, can move along the length direction of worktable in gathering sill or slotted hole 168.In substrate G mounting under the state on the fulcrum post 164, when each pushing pin 166 when substrate center moves on the position of outwards moving of regulation, substrate G is pushed pad 166 from the both sides pushing and locate at the worktable length direction.In addition, on each pushing pin 166 and position that substrate G contacts, rubber or the resinous roller (not shown) that can rotate around Z-axis can be installed also.
And then, in order to carry out the location with the Width of length direction (moving direction of the arm) quadrature of worktable, the pair of right and left pushing-pressing arm 170,170 that can broad ways moves is set on worktable 100.Be installed in pushing pad 172,172 on these pushing-pressing arms 170,170 respectively from the side of the substrate G subtend of pushings mounting in both sides on fulcrum post 164.Impact and friction when contacting with substrate G in order to dwindle, on these pushing pads 172, also installing can be around the rubber of Z-axis rotation or the roller 174 of resin manufacture.
In the present embodiment, for example the portion of floating 110 among first embodiment can be attached on the fulcrum post 164.That is, can with above-mentioned first embodiment in the portion 110 of will floating be attached to structure on the fulcrum post 108 (structure applications of Fig. 5～Fig. 7) identical be in fulcrum post 164.But, owing to be not fixedly installed on the worktable 160, be necessary to be deformed into lifting type.In the present embodiment, also gases at high pressure can be supplied to the portion of floating 110, substrate G be floated in fact from fulcrum post 108 the samely with above-mentioned first embodiment.Simultaneously, undertaken as the described effect of upper surface by the substrate G that makes pushing pin 166 and 170 pairs of pushing-pressing arms become float state, can not damage the lower surface of substrate G and scratch, can not pollute yet, can be along on the desired location of sliding and will correctly substrate G being navigated on the worktable 100.
After above-mentioned this contraposition finished, the portion 110 of will floating disconnected, and substrate G is bearing on the fulcrum post 164 at desired location.Secondly, when keeping out of the way the origin-location of regulation, fulcrum post 164 is also kept out of the way the origin-location, that is, make it to descend to vertical lower in that each pushing pin 166 and pushing-pressing arm 170 are left from substrate G.By the decline of this fulcrum post 164, substrate G from the fulcrum post 164 mobile mounting on carrying arm 162.Carrying arm 162 utilizes the vacuum adsorption force of absorption layer 162a to be maintained fixed on the substrate G when accepting substrate G.Like this, carrying mechanism 59 can will be transported at the substrate G that carried out contraposition on the worktable 160 on buffer table 57, extension 56 and the adjacent exposure device.
In addition, be accompanied by the complicated of mechanism and maximize, in this form of implementation, replace fulcrum post 164, can adopt movable support pad 140 according to above-mentioned the 3rd the embodiment (structure of Figure 14～Figure 16).
In addition, under the situation of the carrying mechanism 20 that applies the present invention to substrate box station (C/S) 10, obtain and above-mentioned same structure and effect.
In the 4th embodiment shown in Figure 17, support 152 and substrate G along continuous straight runs displacement integrally, G is positioned on the desired location with substrate, but utilization structure as shown in figure 19 also can be carried out the location of substrate G.In variation shown in Figure 19, with being installed, along continuous straight runs can be screwed on the upper surface of worktable 100 to for example columniform support 182 of any direction spherical component 184 that rotate, for example ceramic, rotation by spherical component 184, the displacement of substrate G along continuous straight runs navigates to substrate G on the position of setting.
Figure 20 is a major part of representing support shown in Figure 19 182 enlargedly.Ball bearing 186 is installed on the upper surface of support 182, is rotatably mounted spherical component 184.
In addition, also can carry out the location of substrate G with structure shown in Figure 21.In variation shown in Figure 21, in support 182, form ventilation path 188, substrate G mounting before on the spherical component 184, gases at high pressure, for example air (also can be nitrogen etc.) are supplied to ventilation path 188, mounting substrate G under the state that spherical component 184 is floated.When making 106,106 actions of pushing portion in this state, ball 184 rotations, substrate G is top offset in the horizontal direction, and substrate G is positioned on the position of setting.Secondly, when stopping to supply air in ventilation path 188, spherical component 184 descends, and its rotation is suppressed.Then, remove the pushing of using pushing 106,106 couples of substrate G of portion.
And then, in order to suppress the rotation of spherical component 184, vent passage 188 can be connected on the vacuum source (not shown), utilize attractive force that the rotation of spherical component 184 is fixed.
Above-mentioned air supply status, the state with the air supply stops to attract the switching of state, for example uses Figure 10 and structure control shown in Figure 12.
As mentioned above, when the displacement of substrate G along continuous straight runs, can make spherical component 184 come-up and rotate because substrate G suppresses the rotation of member 184 when being positioned, so, can not can to substrate G damage and scratch position.
And then the present invention can be applied to various substrate board treatments or the substrate transfer apparatus except that above-mentioned form of implementation.In addition, the processed substrate among the present invention is not limited to the LCD substrate, can be the various substrates that flat panel shows usefulness, semiconductor wafer, CD substrate, glass substrate, mask, tellite etc.
As above surface description according to substrate alignment apparatus of the present invention, can not damage and scratch processed substrate, and can not pollute, can be safely and correctly and then carry out the contraposition of substrate expeditiously.
In addition,, can carry out the contraposition of processed substrate safely, correctly, effectively, can improve and handle quality and efficient according to substrate board treatment of the present invention.
In addition,, can carry out the contraposition of processed substrate safely, correctly, effectively, improve the board carrying precision, reliability, efficient etc. according to substrate transfer apparatus of the present invention.
Upper surface has been described in detail the present invention, but they just are used for for example, and the present invention is not limited thereto, should be appreciated that the spirit and scope of the present invention are limited by appended claims.
Claims (9)
1. substrate alignment apparatus comprises:
Support processed substrate (G) for mounting essentially horizontally and be configured in the support (152) of a plurality of top offsets in the horizontal direction on the substantially horizontal worktable (100) dispersedly,
The detent mechanism (102) that the aforementioned processed substrate of mounting on aforementioned support positioned to the direction pushing of regulation in surface level.
2. substrate alignment apparatus as claimed in claim 1, aforementioned detent mechanism (102) pushes a pair of corner part of the subtend of aforementioned processed substrate (G) along diagonal, with aforementioned processed substrate orientation.
3. substrate alignment device,
Be equipped with: a plurality of supports (182) of configuration dispersedly in order essentially horizontally to support processed substrate (G), the detent mechanism (102) that aforementioned processed substrate is positioned to the direction pushing of regulation in surface level,
On the upper surface of each aforementioned support, comprise and to make aforementioned processed substrate move the spherical component of installing rotationally (184) to direction arbitrarily in the horizontal direction.
4. substrate alignment apparatus as claimed in claim 3, aforementioned spherical component (184) is installed via the ball bearing on the upper surface that is configured in aforementioned support (182) (186).
5. substrate alignment apparatus as claimed in claim 3, aforementioned spherical component (184) can be installed by the mechanism of floating on the upper surface that is configured in aforementioned support (182), that utilize gases at high pressure (188) with floating.
6. substrate alignment apparatus comprises:
The a plurality of supports (182) that dispose dispersedly in order essentially horizontally to support processed substrate (G),
On the upper surface of aforementioned support, aforementioned processed substrate supporting is become to maintain horizontality, and the substrate level that can be provided with movably keeps mechanism on any direction of level,
To keep the detent mechanism (102) that aforementioned processed substrate that mechanism maintains level positions to the direction pushing of regulation in surface level by the aforesaid base plate level.
7. as each described substrate alignment apparatus in the claim 1～6, aforementioned detent mechanism (102) with part or all the side on limit of aforementioned processed substrate (G) to the direction pushing vertical, with aforementioned processed substrate orientation with described limit.
8. substrate board treatment comprises:
Each described substrate alignment apparatus in the claim 1～6,
To carry out the processing mechanism of predetermined process by the processed substrate (G) after the contraposition of aforesaid base plate calibrating installation.
9. substrate transfer apparatus comprises:
Each described substrate alignment apparatus in the claim 1～6,
To be transported to the processing mechanism (38,54,60) in the place of regulation by the processed substrate (G) after the contraposition of aforesaid base plate calibrating installation.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP311675/2002 | 2002-10-25 | ||
| JP2002311675 | 2002-10-25 |
Related Parent Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031010261A Division CN1209850C (en) | 2002-01-16 | 2003-01-08 | Dielectric resonator, dielectric filter and its transceiver and communicator |
| CNB2003101026439A Division CN1277299C (en) | 2002-10-25 | 2003-10-27 | Substrate calibrating appts, its processing device and delivery appts. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1916718A true CN1916718A (en) | 2007-02-21 |
| CN100429758C CN100429758C (en) | 2008-10-29 |
Family
ID=34260190
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006101091662A Expired - Fee Related CN100429758C (en) | 2002-10-25 | 2003-10-27 | Substrate alignment apparatus, substrate processing apparatus, and substrate transfer apparatus |
| CNB2003101026439A Expired - Fee Related CN1277299C (en) | 2002-10-25 | 2003-10-27 | Substrate calibrating appts, its processing device and delivery appts. |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2003101026439A Expired - Fee Related CN1277299C (en) | 2002-10-25 | 2003-10-27 | Substrate calibrating appts, its processing device and delivery appts. |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR101018909B1 (en) |
| CN (2) | CN100429758C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113753580A (en) * | 2020-06-03 | 2021-12-07 | 韩国光洋热电系统有限公司 | Substrate transfer unit of heat treatment apparatus |
| CN115140412A (en) * | 2022-07-04 | 2022-10-04 | 深圳市华星光电半导体显示技术有限公司 | Bearing device |
| TWI815073B (en) * | 2020-01-17 | 2023-09-11 | 荷蘭商Ａｓｍｌ荷蘭公司 | Suction clamp, object handler, stage apparatus and lithographic apparatus |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100396387C (en) * | 2004-07-16 | 2008-06-25 | 鸿富锦精密工业（深圳）有限公司 | Coating device |
| CN100587103C (en) * | 2005-08-25 | 2010-02-03 | 日立造船株式会社 | Calibration device for vacuum evaporation plating |
| JP4642610B2 (en) * | 2005-09-05 | 2011-03-02 | 東京エレクトロン株式会社 | Substrate alignment device and substrate accommodation unit |
| JP4673180B2 (en) * | 2005-10-13 | 2011-04-20 | 東京エレクトロン株式会社 | Coating apparatus and coating method |
| KR101276038B1 (en) * | 2006-06-16 | 2013-06-20 | 엘지디스플레이 주식회사 | Non-contact transfer apparatus |
| CN101526760B (en) * | 2009-04-10 | 2011-09-07 | 友达光电股份有限公司 | Base plate processing system and developing method |
| CN102402131A (en) * | 2011-11-11 | 2012-04-04 | 深南电路有限公司 | Exposure system |
| JP5912642B2 (en) * | 2012-02-20 | 2016-04-27 | 日本電気硝子株式会社 | Glass plate conveying apparatus and conveying method thereof |
| CN102942062B (en) * | 2012-11-21 | 2016-01-06 | 深圳市华星光电技术有限公司 | For transmitting device and the transmission method of glass substrate |
| CN104122710B (en) * | 2013-04-27 | 2017-08-08 | 北京京东方光电科技有限公司 | A kind of display panel and its manufacture method |
| CN104669284A (en) * | 2013-11-30 | 2015-06-03 | 深圳富泰宏精密工业有限公司 | Material sucking and discharging device |
| CN104483770B (en) | 2015-01-05 | 2019-01-22 | 合肥京东方光电科技有限公司 | Anti-static device and FPD manufacturing equipment |
| US10381256B2 (en) * | 2015-03-12 | 2019-08-13 | Kla-Tencor Corporation | Apparatus and method for chucking warped wafers |
| TWI699582B (en) * | 2015-07-01 | 2020-07-21 | 日商信越工程股份有限公司 | Manufacturing device and manufacturing method of bonded device |
| CN105093588B (en) * | 2015-08-24 | 2018-05-08 | 京东方科技集团股份有限公司 | A kind of supporting pin and absorption board |
| CN105957823B (en) * | 2016-06-29 | 2018-09-18 | 昆山国显光电有限公司 | Substrate deviates means for correcting, substrate deviates bearing calibration and deviates the microscope carrier of means for correcting with substrate |
| CN106111492B (en) * | 2016-08-26 | 2022-09-27 | 合肥京东方光电科技有限公司 | Curing equipment and curing method |
| CN107601341B (en) * | 2017-09-25 | 2019-07-05 | 武汉华星光电技术有限公司 | Ejector pin component and hoistable platform |
| CN107585575A (en) * | 2017-09-27 | 2018-01-16 | 浙江云峰莫干山家居用品有限公司 | Efficient air-floating apparatus |
| CN107555174A (en) * | 2017-09-27 | 2018-01-09 | 浙江云峰莫干山家居用品有限公司 | Air floating platform |
| CN107814201A (en) * | 2017-09-27 | 2018-03-20 | 浙江云峰莫干山家居用品有限公司 | For conveying the air floating table of sheet material |
| CN108519693B (en) * | 2018-04-16 | 2021-10-29 | 京东方科技集团股份有限公司 | Substrate alignment device, substrate and substrate alignment method |
| JP7131334B2 (en) * | 2018-11-29 | 2022-09-06 | 株式会社安川電機 | Substrate support device, substrate transfer robot and aligner device |
| TWI758121B (en) * | 2021-03-08 | 2022-03-11 | 上利新科技股份有限公司 | Air flotation adsorption device |
| CN115072369A (en) * | 2022-06-28 | 2022-09-20 | 深圳市华星光电半导体显示技术有限公司 | Transport module and film forming apparatus |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05235151A (en) * | 1992-02-20 | 1993-09-10 | Canon Inc | Substrate holding base |
| JPH06275701A (en) * | 1993-03-19 | 1994-09-30 | Kokusai Electric Co Ltd | Substrate conveyor |
| JPH09278179A (en) * | 1996-04-16 | 1997-10-28 | Hitachi Ltd | Carrying device |
| US5993552A (en) * | 1996-08-08 | 1999-11-30 | Tokyo Electron Ltd | Processing apparatus |
| JP2001093962A (en) * | 1999-09-24 | 2001-04-06 | Toshiba Mach Co Ltd | Positioner for large substrate |
| JP2002252268A (en) * | 2001-02-22 | 2002-09-06 | Yaskawa Electric Corp | Holding device for conveying substrate |
-
2003
- 2003-10-23 KR KR1020030074140A patent/KR101018909B1/en not_active IP Right Cessation
- 2003-10-27 CN CNB2006101091662A patent/CN100429758C/en not_active Expired - Fee Related
- 2003-10-27 CN CNB2003101026439A patent/CN1277299C/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI815073B (en) * | 2020-01-17 | 2023-09-11 | 荷蘭商Ａｓｍｌ荷蘭公司 | Suction clamp, object handler, stage apparatus and lithographic apparatus |
| CN113753580A (en) * | 2020-06-03 | 2021-12-07 | 韩国光洋热电系统有限公司 | Substrate transfer unit of heat treatment apparatus |
| CN115140412A (en) * | 2022-07-04 | 2022-10-04 | 深圳市华星光电半导体显示技术有限公司 | Bearing device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100429758C (en) | 2008-10-29 |
| CN1499299A (en) | 2004-05-26 |
| CN1277299C (en) | 2006-09-27 |
| KR20040036610A (en) | 2004-04-30 |
| KR101018909B1 (en) | 2011-03-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1277299C (en) | Substrate calibrating appts, its processing device and delivery appts. | |
| CN1284710C (en) | Apparatus for conveying substrate in horizontal and verticle direction | |
| CN1828828A (en) | Substrate processing device, method and program | |
| CN100341113C (en) | Coating method and coating device | |
| US9153464B2 (en) | Substrate processing apparatus and substrate processing method | |
| CN1732555A (en) | Coating device and coating film forming method | |
| CN1924704A (en) | Apparatus and method of forming an applied film | |
| CN1237402C (en) | Systme and method for coating and developing | |
| JP4175988B2 (en) | Substrate alignment apparatus, substrate processing apparatus, and substrate transfer apparatus | |
| KR101908143B1 (en) | Substrate processing apparatus and substrate processing method | |
| CN101038858A (en) | Substrate buffer device, method of buffering substrate, substrate processing apraratus and computer readable storage medium | |
| CN1746776A (en) | Substrate processing apparatus and substrate positioning device | |
| CN1892423A (en) | Substrate processing apparatus | |
| CN1808274A (en) | Coating and developing system and coating and developing method | |
| CN101060093A (en) | Substrate transportation and processing apparatus | |
| CN1939603A (en) | Coating method and coating device | |
| CN1651155A (en) | Device and method for forming coating film | |
| JP5611152B2 (en) | Substrate heat treatment equipment | |
| CN101060066A (en) | Substrate processing apparatus | |
| CN1260801C (en) | Fragile sheel transporting device and fragile sheet processing | |
| CN1279579C (en) | Base board transporting device, base board processing system and base board transporting method | |
| CN1913101A (en) | Decompression drying device | |
| KR20060122287A (en) | Apparatus for transporting substrates capable of sucking and exhausting particles effectively | |
| TWI463591B (en) | Substrate processing apparatus and substrate processing method | |
| CN1278380C (en) | Treating method and treating device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CI01 | Correction of invention patent gazette |
Correction item: Original application number of the case Correct: 200310102643.9 False: 03101026.4 Number: 44 Page: 1336 Volume: 24 |
|
| CI03 | Correction of invention patent |
Correction item: Original application number of the case Correct: 200310102643.9 False: 03101026.4 Number: 44 Page: The title page Volume: 24 |
|
| ERR | Gazette correction |
Free format text: CORRECT: ORIGINAL APPLICATION NUMBER OF DIVISION; FROM: 03101026.4 TO: 200310102643.9 |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081029 Termination date: 20131027 |