JP6049820B1 - Bonding device manufacturing apparatus and manufacturing method - Google Patents

Abstract

An apparatus for manufacturing a bonding device in which a partial strain remaining on a lower workpiece is removed and vacuum bonded to an upper workpiece in a smooth state. Even if distortion due to partial expansion and contraction remains in the lower work W2, the lower work W2 is supported in a non-contact manner so that the lower work W2 is lifted from the lower chuck surface 21 by the levitation unit 22. After the partial distortion of W2 is released, the lower work W2 is in a smooth state along the smooth lower chuck surface 21 of the lower holding member 2, and then the contact holding portion 21a before the bonding space S1 is in a reduced pressure atmosphere. Then, the lower workpiece W2 in a smooth state comes into contact with the lower chuck surface 21 and is held immovable. Thereafter, the controller 7 causes the lifting drive unit 3 to move one or both of the upper holding member 1 and the lower holding member 2 to each other. By moving relatively close, the lower workpiece W2 in a smooth state in a vacuum or a reduced-pressure atmosphere close to vacuum overlaps the upper workpiece W1 held by the holding portion 11a on the upper chuck surface 11 without being displaced. Can be combined Apparatus for manufacturing a bonding device. [Selection] Figure 2

Description

  The present invention may be a flat panel display (FPD) or a sensor device such as a liquid crystal display (LCD), an organic EL display (OLED), a plasma display (PDP), or a flexible display, or a touch panel type FPD or 3D (three-dimensional). Another plate such as a touch panel, cover glass, cover film, or FPD for a plate-like work (substrate) such as a liquid crystal module (LCM) or flexible printed wiring board (FPC) such as a display or an electronic book The present invention relates to a manufacturing apparatus for a bonding device that bonds a workpiece (substrate) and a method for manufacturing the bonding device.

Conventionally, as a manufacturing apparatus and a manufacturing method for this type of bonding device, lift pins for transferring the upper substrate and the lower substrate are respectively moved up and down along the through holes provided in the upper substrate holder and the lower substrate holder. When carrying in at atmospheric pressure, the upper substrate and the lower substrate held and transferred by the arm of the transfer robot were moved up and down so as to protrude from the surfaces of the upper substrate holder and the lower substrate holder. Receiving at the upper and lower lift pins, respectively. Subsequent to this, there is a substrate overlaying device in which the upper lift pin and the lower lift pin move in the opposite directions to transfer the upper substrate and the lower substrate to the surfaces of the upper substrate holder and the lower substrate holder, respectively (for example, patents) Reference 1).
In particular, since the lower substrate is the element surface on the upper side, the lower surface is conveyed by vacuum suction with the arm of the transfer robot, and the lower substrate is vacuum-sucked by the lower lift pin that has been lifted at a position that does not interfere with this arm. Then, it is delivered from the arm of the transfer robot to the lower lift pin. Thereafter, the lower substrate is transferred from the lower lift pin to the lower substrate holder, and the vacuum suction mechanism is operated to vacuum-suck the lower substrate to the lower substrate holder.
At this time, the lower substrate holder is provided with a plurality of (for example, four) through holes for lift pins, and the lower lift pins are lifted from the through holes by the lifting mechanism to receive and lower the lower substrate. The lower substrate is transferred to the lower substrate holder, and then the lower lift pin is further lowered to stop at a predetermined standby position.
Furthermore, after the upper substrate and the lower substrate are delivered, the upper substrate holder and the lower substrate holder move closer to each other, and the vacuum chamber between them is evacuated, and then the upper substrate and the lower substrate are overlapped. Then, the sealing material between the two is temporarily fixed, and after the inside of the vacuum vessel becomes atmospheric pressure, the bonded upper substrate and lower substrate are transferred to the arm of the transfer robot by lift pins and are carried out of the vacuum vessel. .

JP 2002-229471 A

However, in such a conventional bonding device manufacturing apparatus, a plurality of through holes or grooves for lift pins are opened on the surface of the lower substrate holder used for bonding the upper substrate and the lower substrate. As a result, a part of the lower substrate falls due to its own weight, partially expands and contracts due to its own weight, and is bent into an uneven shape, and is bonded to the upper substrate with the distortion caused by this partial expansion and contraction remaining. .
The partial distortion generated in the lower substrate before the bonding becomes the residual distortion of the substrate after the final bonding, which not only affects the bonding accuracy, but also the upper substrate and the lower substrate. There was a problem that air bubbles were generated during the period to deteriorate the quality, resulting in poor yield.
Further, the holding position of the lower substrate by the arm of the transfer robot is not a whole surface of the lower substrate but a partial linear shape, and the holding position of the lower substrate by vacuum suction of the lower lift pin is Since it is a partial dot shape rather than the entire surface, the lower substrate partially expands and contracts due to its own weight in these holding states and bends into an uneven shape. That is, the transfer of the lower substrate from the arm of the transfer robot to the lower lift pin also causes the distortion due to partial expansion / contraction generated during holding to remain on the lower substrate, further reducing the bonding accuracy. There was a problem that the yield was worse.
In addition, foreign matter such as dust adheres to the part of the lower substrate where the arm of the transfer robot and the lower lift pin come into contact, and unevenness occurs with other parts, making it impossible to perform high-precision bonding. There was also a problem.
In particular, LCDs in recent years tend to be larger and thinner, and are generally G8 (2200 x 2500 mm) size liquid crystal glass substrates with a thickness of 0.2 mm and G11 (3000 x 3320 mm) size liquid crystal. The glass substrate has a thickness of 0.5 mm and is very flexible and easily deformed. High-definition panels such as 4k x 2k panels, high-definition panels, and multi-view 3D technology are required. The alignment error between the TFT substrate and the color filter substrate is less than 2μm. It is required for the entire surface.
On the other hand, the reference mark position for aligning the bonding apparatus and the camera for confirming the mark position are not performed on the entire surface of the substrate. About 4 to 8 alignments are performed at the end positions.
Therefore, if partial distortion remains at the center position of the glass substrate, there is very little positional deviation at the end position where the mark is aligned with the camera, but at the center position of the glass substrate, the substrates are closer to each other than the end position. Therefore, it is very difficult to make the alignment error of the G8 size liquid crystal glass substrate to submicron accuracy.

  An object of the present invention is to deal with such a problem, and it is an object of the present invention to remove a partial distortion remaining on a lower work and vacuum-bond it to an upper work in a smooth state. It is.

In order to achieve such an object, the bonding device manufacturing apparatus according to the present invention holds the upper work in the upper holding member and holds the lower work in the lower holding member in the bonding space, and the upper holding member. And an apparatus for manufacturing a bonding device for bonding the upper work and the lower work in a reduced-pressure atmosphere by relative movement of the lower holding member, and the upper work is disposed in the bonding space. The upper holding member having an upper chuck surface that is detachably held, and the lower holding member having a smooth lower chuck surface that is disposed in the bonding space and is detachably held by the lower work. Then, either the upper holding member or the lower holding member or both of them are moved relatively close to each other so that the upper work and the lower work are overlapped with each other. An elevating drive unit, a depressurizing drive unit for depressurizing the bonding space, and a control unit for controlling the operation of the upper chuck surface, the lower chuck surface, the elevating drive unit, and the depressurizing drive unit, respectively. The upper holding member has a holding portion for holding the upper work so as not to move, and the lower holding member generates a separation pressure and an approaching pressure in opposite directions with the lower work , respectively. And a contact holding part provided with means for adjusting the separation pressure and the approaching pressure, and the control part causes the lower work to be the lower holding member. On the other hand , the separation pressure and the approaching pressure of the levitation unit are balanced, and the lower work is supported in a non-contact manner so as to float from the lower chuck surface, and the bonding space is depressurized by the depressurization driving unit. Complete At a time prior to switching from the flotation unit to the contact holding portion, the gradually increasing the approaching pressure than separation pressure, the lower workpiece is held in contact with the lower chuck surface, before SL lifting One or both of the upper holding member and the lower holding member are moved relatively close by the drive unit, and after the pressure reduction of the bonding space by the pressure reduction drive unit is completed, the upper chuck and controls so that said held by the holding portion to face the upper workpiece and said lower workpiece overlap.

Moreover, the manufacturing method of the bonding device by this invention hold | maintains an upper workpiece | work in an upper holding member in a bonding space, hold | maintains a lower workpiece | work in a lower holding member, and the relative of the said upper holding member and the said lower holding member A method of manufacturing a bonding device in which the upper work and the lower work are bonded together in a reduced-pressure atmosphere by a general approaching movement, wherein the upper work is held on the upper chuck surface of the upper holding member, and the lower holding is performed. A holding step of holding the lower work on the smooth lower chuck surface of the member, and a relative approaching movement of one or both of the upper holding member and the lower holding member, and the upper work and the lower work includes a bonding step of superimposing the side workpiece, wherein the holding step, against the lower workpiece on the lower retaining member, and the lower workpiece by flotation section Each is balanced spaced pressure and close pressure generated in opposite directions, the lower workpiece to float from the lower chuck surface is supported in a non-contact, is this bonding said by continued vacuum drive portion space Before the completion of the pressure reduction, the approaching pressure is gradually increased by the contact holding unit from the separation pressure, the lower work is brought into contact with the lower chuck surface and held immovable, The upper work and the lower work are overlapped after the pressure reduction of the bonding space by the pressure reducing drive unit is completed.

In the bonding device manufacturing apparatus and manufacturing method according to the present invention having the above-described features, even if distortion due to partial expansion and contraction remains in the lower work due to carrying in by a transfer robot, the lower work is attached to the floating part. By supporting in a non-contact manner so as to float from the lower chuck surface, the partial distortion of the lower workpiece is released, and the lower workpiece is brought into a smooth state along the smooth lower chuck surface of the lower holding member. Subsequently, before the bonding space becomes a reduced pressure atmosphere, the lower work in a smooth state comes into contact with the lower chuck surface and is immovably held by the contact holding portion. Thereafter, the control unit moves the one or both of the upper holding member and the lower holding member relatively closer to each other so that the lower work and the upper chuck surface in a smooth state in a vacuum or a reduced-pressure atmosphere close to vacuum. The upper workpiece held by the holding portion can be overlapped without being displaced.
Therefore, it is possible to remove the partial distortion remaining on the lower workpiece and vacuum-bond it to the upper workpiece in a smooth state.
As a result, compared to the conventional one in which a plurality of through holes or grooves for lift pins are opened and recessed on the surface of the lower substrate holder, a through hole or groove for lift pins is formed on the surface of the lower holding member. Since there is no dent and the lower chuck surface is smooth, a part of the lower work is not partially expanded or contracted by its own weight and bent into an uneven shape. Thereby, the bonding accuracy of the upper workpiece and the lower workpiece can be improved. At the same time, even with an extremely thin plate-shaped workpiece (substrate) with low rigidity, it is possible to prevent bubbles from being generated on the bonding surface between the upper workpiece and the lower workpiece, and uniform bonding without bubbles can be achieved. Yes.
Furthermore, because the arm of the transfer robot and the lower lift pin can transport the plate-shaped workpiece (substrate) without contacting the plate-shaped workpiece (substrate), foreign matter such as dust caused by the contact of the arm of the transfer robot and the lower lift pin can be removed. Adhesion can be prevented, and very uniform bonding can be performed without causing unevenness with other portions.
As a specific example, even if a G8 size glass substrate for liquid crystal with a thickness of 0.2 mm is pasted by a conventional alignment method, the alignment error of the upper workpiece and the lower workpiece can be improved to submicron accuracy, Yield can be improved.
Moreover, since the lower workpiece and the upper workpiece are bonded together in a vacuum or a reduced-pressure atmosphere close to vacuum, it is possible to reliably prevent air from entering the bonding surface of the upper workpiece and the lower workpiece from the bonding space. As a result, it is possible to prevent the predetermined gap from becoming partially non-uniform due to air bubbles entering the overlapping surface of the upper work W1 and the lower work W2, and it is possible to manufacture a higher quality bonding device W. Become.

It is explanatory drawing which shows the whole structure of the manufacturing apparatus of the bonding device which concerns on embodiment of this invention, (a) is a vertical front view at the time of upper work carrying in, (b) is a vertical front view at the time of upper work delivery. . It is the same explanatory drawing, (a) is a longitudinal front view at the time of loading a lower work, (b) is a longitudinal front view at the time of overlay. It is the same explanatory drawing, (a) is a longitudinal front view after pasting, (b) is a longitudinal front view at the time of carrying out a pasting device. It is the same explanatory drawing, (a) is a cross-sectional plan view of FIG. 2 (a), (b) is a cross-sectional plan view of FIG. 3 (b). It is explanatory drawing which shows the modification of the manufacturing apparatus of the bonding device which concerns on embodiment of this invention, (a) is a longitudinal front view at the time of upper work carrying in, (b) is a longitudinal front view at the time of upper work delivery. . It is the same explanatory drawing, (a) is a longitudinal front view at the time of loading a lower work, (b) is a longitudinal front view at the time of overlay. It is the same explanatory drawing, (a) is a longitudinal front view after pasting, (b) is a longitudinal front view at the time of carrying out a pasting device.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
The manufacturing apparatus A and the manufacturing method of the bonding device W according to the embodiment of the present invention are arranged so that the upper holding member 1 and the lower holding member 2 face each other in the bonding space S1, as shown in FIGS. Then, the upper work W1 is held by the upper holding member 1, and the lower work W2 is held by the lower holding member 2. Thereafter, by moving either one or both of the upper holding member 1 and the lower holding member 2 relative to each other, the upper work W1 and the lower work W2 are relatively aligned, and both of them in a reduced pressure atmosphere. Are stacked (attached) with a predetermined gap.
In particular, it is preferable that the upper work W1 and the lower work W2 are carried into the bonding space S1, and are transferred to and held by the upper holding member 1 and the lower holding member 2, respectively. Moreover, the bonding device W in which the bonding is completed in the bonding space S1 is carried out of the bonding space S1, and thereafter, the above-described operation is repeated to continuously produce a plurality of bonding devices W. It is preferable.
That is, the manufacturing apparatus A of the bonding device W is a vacuum workpiece bonding apparatus for manufacturing the bonding device W.

If it demonstrates in detail, the manufacturing apparatus A of the bonding device W which concerns on embodiment of this invention will be arrange | positioned in bonding space S1, the upper holding member 1 which is arrange | positioned in bonding space S1, and hold | maintains the upper workpiece W1. The lower side holding member 2 holding the side workpiece W2 and either one or both of the upper side holding member 1 and the lower side holding member 2 are moved so as to be relatively close to or separated from each other to move the upper side workpiece W1 and the lower side workpiece. An elevating drive unit 3 that overlaps W2 is provided as a main component.
In addition to this, a carry-in member 4 that carries in at least the lower work W2 toward the bonding space S1 and a carry-out member 5 that carries out the bonding device W that has been bonded from the bonding space S1 toward the external space S2. And a chamber 6 in which the bonding space S1 is formed, and a control unit 7 that controls the operation of the upper holding member 1, the lower holding member 2, the lifting drive unit 3, the carry-in member 4, the carry-out member 5, and the like. It is preferable.
As shown in FIGS. 1 to 7, the upper work W1 and the lower work W2 are usually arranged so as to face each other in the vertical direction, that is, the direction in which the upper work W1 and the lower work W2 are overlapped, that is, The workpiece bonding direction is referred to as “Z direction”. The direction along the bonding surface of the upper workpiece W1 and the lower workpiece W2 that intersects the Z direction is hereinafter referred to as “XY direction”.

The bonding device W is a thin plate-like structure in which a plurality of components such as an FPD and a sensor device are integrally assembled.
In the case of the example shown in FIGS. 1 to 7 as a specific example of the bonding device W, the upper work W1 is a rectangular thin plate made of LCM, FPC, or the like. The lower work W2 is a rectangular thin plate made of a touch panel, a cover glass, a cover film, or the like that is thinner than the upper work W1, and forms an FPD, a sensor device, or the like by being bonded so as to cover the upper work W1. Yes.
It is preferable that a sealing material (not shown) is applied to one or both of the bonding surfaces formed of a film surface or the like in the upper workpiece W1 and the lower workpiece W2 by a constant discharge nozzle such as a dispenser. As this sealing material, a photo-curing adhesive such as UV curable optical transparent resin (OCR) that absorbs light energy such as ultraviolet rays and cures as a result of polymerization proceeds to develop adhesiveness is used. Is preferred.
The space surrounded by the sealing material is filled with a sealing material (not shown) such as liquid crystal.
Although not shown in the drawings as another example, the upper work W1 thinner than the lower work W2 is bonded together, or instead of a photo-curing adhesive as the sealing material, heat that is polymerized and cured by absorption of heat energy is cured. It is also possible to use a curable adhesive or a two-component mixed curable adhesive, or to directly bond or change the workpieces without including the sealing material or the encapsulating material.

The upper holding member 1 and the lower holding member 2 are composed of a platen having a thickness that does not deform (bend) with a rigid body such as metal or ceramics, and the upper side thereof facing the Z direction. It has a chuck surface 11 and a smooth lower chuck surface 21.
The upper holding member 1 and the lower holding member 2 are installed so that the upper chuck surface 11 and the lower chuck surface 21 are parallel to each other in the bonding space S1.
The upper chuck surface 11 of the upper holding member 1 has a holding portion 11a on which an upper work W1 carried in by a carrying-in member 4 described later is detachably held and cannot be moved.
As the holding portion 11a of the upper chuck surface 11, an adsorption force, an adhesion force, an electrostatic adsorption force, a combination thereof, or the like by negative pressure suction is used. Even if the bonding space S1 is depressurized to a vacuum by arranging these in a planar shape over substantially the entire upper chuck surface 11 or by disposing a plurality of them all over the upper chuck surface 11, The work W1 is configured to continue to be held without dropping.

Further, the upper holding member 1 holds an upper workpiece W1 carried in by a carrying-in member 4 described later in addition to the upper chuck surface 11, and transfers it from the lower chuck surface 21 described later to the upper chuck surface 11. A delivery mechanism 12 is provided. The delivery mechanism 12 is composed of lift pins and other structures, and has a delivery drive unit 12a for approaching and holding the upper work W1 carried by a carry-in member 4 described later and delivering it to the upper chuck surface 11. ing.
In the example shown in FIGS. 1 to 3 as a specific example of the delivery mechanism 12, a lift pin 12b movable in the Z direction is used. As shown in FIG. 1B, the tip of the lift pin 12b lowered. The non-bonding surface (upper surface) of the upper work W1 is detachably sucked and held by the surface. Thereafter, as shown in FIG. 2A, the lift pin 12b is lifted by the operation of the delivery drive unit 12a to bring the non-bonded surface of the upper work W1 into contact with the upper chuck surface 11, and at the same time, the holding unit 11a. Switching to the work holding by means of this enables the delivery of the upper work W1.
In the illustrated example, a plurality of lift pins 12b are arranged at predetermined intervals in the XY direction, the ends thereof are integrated by a connecting member 12c, and all the lift pins 12b reciprocate in the Z direction via the connecting member 12c by a delivery drive unit 12a. It is configured to move freely.
As another example, the delivery mechanism 12 can be changed to another structure instead of the lift pin 12b.

A smooth lower chuck surface 21 of the lower holding member 2 includes a levitation unit 22 that supports a lower workpiece W2 carried by a carry-in member 4 described later so as to float from the lower chuck surface 21 so as to be movable in a non-contact manner. It has a contact holding part 21a that comes into contact with the lower chuck surface 21 and is detachably held and held immovably.
The levitation portion 22 of the lower chuck surface 21 uses gas jet power, ultrasonic force, or the like, and the lower chuck surface 21 is located in a space facing the lower chuck surface 21 and the non-bonded surface of the lower workpiece W2. The separation pressure from the side toward the lower work W2 and the approaching pressure from the lower work W2 toward the lower chuck surface 21 are generated simultaneously. By balancing these separation pressure and approaching pressure, an air film 22a is formed in the Z direction between the lower chuck surface 21 and the lower work W2, and the lower work W2 is lifted off from the lower chuck surface 21. Maintaining contact.
As a specific example of the levitation unit 22, in the example shown in FIGS. 1 to 7, a plate-like porous layer 22 b made of a porous material is laminated on the surface of the lower chuck surface 21, and the porous layer By generating gas from the whole 22b toward the lower workpiece W2, the separation pressure is generated, and at the same time, negative pressure is sucked from a plurality of minute intake holes (not shown) formed in the porous layer 22b. The approaching pressure is generated.
The contact holding unit 21a uses a suction force or an electrostatic suction force by negative pressure suction or a combination thereof, and adjusts the balance between the separation pressure and the approaching pressure by the levitation unit 22 in the control unit 7 described later, Operation control is performed so that the approach pressure gradually increases rather than the separation pressure. As a result, the thickness of the air film 22a gradually decreases, the non-bonding surface of the lower workpiece W2 smoothly lands on the surface of the lower chuck surface 21, and the lower workpiece W2 cannot move due to the approach pressure. Is held in contact.
In the case of the example shown in FIGS. 1 to 7 as a specific example of the contact holding portion 21a, the flow rate of the gas ejected from the entire porous layer 22b toward the lower workpiece W2 is gradually decreased to reduce the separation. At the same time as the pressure is suppressed, negative pressure suction is maintained or increased from a plurality of minute intake holes opened in the porous layer 22b.
Although not shown as another example, a plate-shaped sonotrode is integrally laminated on the surface of the lower chuck surface 21 instead of the porous layer 22b, and the air on the surface of the sonotrode is periodically passed by ultrasonic waves by energization. The separation pressure is generated by compression and decompression, and at the same time, the approach pressure can be changed by generating negative pressure from a plurality of minute intake holes opened in the sonotrode. is there.

Further, either the upper holding member 1 or the lower holding member 2 or both the upper holding member 1 and the lower holding member 2 are supported so as to be movable in the Z direction. 1 and the lower holding member 2 are moved so as to approach or separate from each other relatively.
The raising / lowering drive part 3 is comprised from an actuator etc., and the control part 7 mentioned later mutually connects the upper workpiece | work W1 and the lower workpiece | work W2 through the said sealing material apply | coated to those bonding surfaces in one or both. Operation control is performed so that either one or both of the upper holding member 1 and the lower holding member 2 are relatively moved in the Z direction so as to overlap each other.
In the case of the example shown in FIGS. 1 to 7 as a specific example of the lifting drive unit 3, the upper holding member 1 is lowered toward the lower holding member 2.
Although not shown in the drawings as another example, the lower holding member 2 is raised instead of the upper holding member 1, or both the upper holding member 1 and the lower holding member 2 are moved closer to each other, or the upper holding member is moved. 1 is rotated and reversed to face the lower holding member 2 in the Z direction, and then either or both of the upper holding member 1 and the lower holding member 2 are relatively moved or changed in the Z direction. It is also possible to do.

The carry-in member 4 is a work-carrying transport mechanism that carries the upper work W1 and the lower work W2 from the external space S2 toward the bonding space S1.
The carry-in member 4 includes a floating conveyance method in which the upper workpiece W1 and the lower workpiece W2 are lifted from the smooth conveyance surface 41 in a non-contact manner, and an upper workpiece W1 and a lower workpiece W2 by a conveyance robot (not shown). There are a robot transport system that transports the upper workpiece W1 and a lower work W2 by a transport conveyor (not shown). These levitation transfer methods, robot transfer methods, conveyor transfer methods, etc., carry-in driving for moving the transfer surface 41 or the transfer robot, the transfer conveyor, and the like toward or away from the external space S2 toward the bonding space S1. A portion 42 is provided.
In particular, when the carry-in member 4 is a levitation conveyance method, a smooth conveyance surface 41 and a levitation conveyance unit 43 that conveys the upper workpiece W1 and the lower workpiece W2 in a non-contact manner while floating from the conveyance surface 41. It is preferable to have.
The carry-in drive unit 42 of the carry-in member 4 is configured by an actuator or the like. When the upper work W1 or the lower work W2 is carried in by the control unit 7 which will be described later, the transfer surface 41 or the transfer robot, the transfer conveyor, etc. The operation is controlled so as to move toward the lower chuck surface 21 of the holding member 2 in the X direction or the Y direction. After carrying in the upper work W1 and the lower work W2, the transfer surface 41 or the transfer robot, the transfer conveyor, and the like are moved away from the lower chuck surface 21 of the lower holding member 2 in the X direction, the Y direction, and the like. .

In addition, the smooth conveyance surface 41 of the floating conveyance type carrying-in member 4 is supported so as to be able to reciprocate in the X direction and the Y direction crossing the Z direction, and the upper workpiece W1 and the lower workpiece W2 float from the conveyance surface 41. In this way, the levitation unit 41a for carrying in is movably supported in a non-contact manner.
The carry-in levitation unit 41a is directed from the conveyance surface 41 side to the lower workpiece W2 side in a space facing the conveyance surface 41 and the non-bonding surface of the lower workpiece W2 by using a gas jet force or ultrasonic force. The separation pressure and the approaching pressure from the lower workpiece W2 side toward the conveying surface 41 side are generated simultaneously at the same time. By balancing the separation pressure and the approaching pressure, an air film 41b is formed in the Z direction between the transport surface 41 and the lower work W2, and the lower work W2 is kept floating from the transport surface 41. It is configured as follows.

As the floating part 41a for carrying in using gas jet power, a “Bernoulli type” that holds the upper work W1 and the lower work W2 in a non-contact manner due to a pressure difference between the negative pressure air film 41b and the atmospheric atmosphere, and a porous material The separation pressure is generated by jetting gas toward the lower workpiece W2 from the whole, and at the same time, the approaching pressure is generated by sucking negative pressure from a plurality of intake holes (not shown) formed in the porous material. There is a “porous type”.
In the “Bernoulli type”, the lower work W2 is conveyed by the negative pressure air film 41b formed by jetting gas from the conveyance surface 41 side toward the lower work W2 and the pressure difference between the atmospheric air. It is drawn toward the surface 41 side. Accordingly, when the interval between the negative pressure air films 41b becomes narrow and the pressure rapidly increases, the lower work W2 is pushed away, and the balanced pressure of the air film 41b is maintained. This requires a large amount of gas ejection during non-contact holding.
Therefore, in the case of the example shown in FIGS. 1-7 as the floating part 41a for carrying in, compared with the above-mentioned "Bernoulli type", the instantaneous flow rate of the gas is at least the upper work W1 and the lower work W2. The above-mentioned “porous type” is adopted, in which an air film 41b is formed between the upper work W1 and the lower work W2 from the transfer surface 41.

In the carry-in member 4 of the levitation conveyance method, the levitation conveyance unit 43 is a handling mechanism (not shown) that holds the upper workpiece W1 and the lower workpiece W2 supported in a non-contact manner so as to float from the conveyance surface 41 by the levitation unit 41a. Etc.
This handling mechanism is configured to be movably supported in the XY directions along the conveyance surface 41 using an actuator or the like.
Further, the handling mechanism grips the upper work W1 and the lower work W2 as a whole by suction or the like, or a chuck portion (not shown) that partially grips the ends of the upper work W1 and the lower work W2. It is configured to move to the lower chuck surface 21 of the lower holding member 2 by moving in the X direction, the Y direction, etc. while floating from the conveying surface 41.

In the case of the example shown in FIGS. 1 to 7 as a specific example of the carry-in member 4, the carrying surface 41 is moved closer to the lower chuck surface 21 of the lower holding member 2 in the X direction by the carry-in drive unit 42. Then, the upper workpiece W1 and the lower workpiece W2 are sequentially levitated and conveyed in the X direction by the levitating and conveying unit 43, and are carried into the lower chuck surface 21 of the lower holding member 2.
Although not shown as another example, the moving direction of the conveying surface 41 by the loading drive unit 42 and the loading direction of the upper workpiece W1 and the lower workpiece W2 are changed to other than the X direction, or the upper workpiece W1 is moved by the loading member 4. Alternatively, the lower work W2 can be carried into the bonding space S1 without being lifted from the transfer surface 41, or can be changed to use the transfer robot, the transfer conveyor, or the like as the loading member 4 instead of the floating transfer method. It is.

The carry-out member 5 is a transport mechanism for carrying out a workpiece for carrying out the bonding device W that has been bonded from the bonding space S1 toward the external space S2.
As the carry-out member 5, similarly to the carry-in member 4, the bonding device W is conveyed by a floating conveyance method that conveys the bonding device W in a non-contact manner so that the bonding device W floats from the second conveyance surface 51, and a conveyance robot (not shown). There are a robot transport system that performs the above and a conveyor transport system that transports the bonding device W by a transport conveyor (not shown). These levitation transfer method, robot transfer method, conveyor transfer method, and the like have an unloading drive unit 52 that moves the second transfer surface 51 or the transfer robot toward or away from the external space S2 toward the bonding space S1. doing.
In particular, when the carry-out member 5 is a levitation conveyance method, a smooth second conveyance surface 51, and a second levitation conveyance unit 53 that conveys the bonding device W in a non-contact manner so as to float from the second conveyance surface 51; It is preferable to have.
The unloading drive unit 52 of the unloading member 5 is configured by an actuator or the like. After the upper work W1 and the lower work W2 are bonded together by the control unit 7 described later, the second transfer surface 51, the transfer robot, the transfer conveyor, or the like Is controlled to move toward the lower chuck surface 21 of the lower holding member 2 in the X direction, the Y direction, or the like. After carrying out the bonding device W, the second transfer surface 51 or the transfer robot or the transfer conveyor is moved away from the lower chuck surface 21 of the lower holding member 2 in the X direction or the Y direction.

In the case of the example shown in FIGS. 1 to 7 as a specific example of the carry-out member 5, the second drive surface 51 is directed from the external space S2 to the lower chuck surface 21 of the lower holding member 2 by the carry-out drive unit 52. Are moved closer to the X direction, and the second levitation conveyance unit 53 levitates and conveys the bonding device W from the lower chuck surface 21 of the lower holding member 2, and is aligned with the loading direction toward the second conveyance surface 51. It is being carried out.
Although not shown in the drawings as other examples, the moving direction of the second transport surface 51 by the unloading drive unit 52 and the unloading direction of the bonding device W are changed to other than the X direction, or the work loading direction and unloading by the loading member 4 are performed. The work carry-out direction by the member 5 is bent at a predetermined angle in the XYθ direction, the carry-in member 4 and the carry-out member 5 are integrated and carried out in the direction opposite to the work carry-in direction, and the second bonding device W is carried out by the carry-out member 5. It is also possible to change the transfer surface 51 so that it is carried out without being lifted, or to change the carry-out member 5 to use the transfer robot, the transfer conveyor, or the like instead of the floating transfer method.

The bonding space S1 is formed inside the transformable chamber 6 and is separated from the external space S2 by the wall of the chamber 6, and the upper holding member 1 and the lower holding member 2 are provided in the bonding space S in the chamber 6. Is preferably deployed.
The chamber 6 includes an entrance / exit 61 through which the upper work W1 and the lower work W2 pass by the carry-in member 4 and the carry-out member 5, an opening / closing drive unit 62 for opening / closing the entrance / exit 61, a compressor for decompressing the bonding space S1, and the like. And a decompression drive unit 6a.
Further, either one or both of the upper holding member 1 and the lower holding member 2 is provided with a position detection unit (such as a camera for detecting a mark or a corner portion previously attached to the upper work W1 or the lower work W2). (Not shown) and an alignment driving unit (not shown) for moving either the upper holding member 1 or the lower holding member 2 in the XYθ direction relative to the other. Based on the output from the position detection unit, the positioning drive unit is actuated to move the upper holding member 1 and the lower holding member 2 in the XYθ directions relatively, whereby the upper work W1 and the lower work W2 are moved. Alignment in the XYθ direction.
More specifically, the upper work W1 and the lower work W2 are respectively carried from the external space S2 to the bonding space S1 in the chamber 6 by the loading member 4 in the air atmosphere, and the upper work W1 and the upper work W1 in the decompressed bonding space S1. The lower workpiece W2 is superposed, and at the same time, alignment in the XYθ direction is performed. Thereafter, the bonding device W in which the bonding of the upper workpiece W1 and the lower workpiece W2 is completed is carried out from the bonding space S1 to the external space S2 by the carry-out member 5 in the air atmosphere.

In the case of the example shown in FIGS. 1 to 7 as a specific example of the chamber 6, the lid wall 63 provided with the upper holding member 1 in the chamber 6 is Z with respect to the bottom wall 64 provided with the lower holding member 2. By being reciprocated so as to be relatively close to or separated from each other in the Z direction, the bonding space S1 can be opened and closed and has a sealed structure. When the lid wall 63 of the chamber 6 is separated from the bottom wall 64 in the Z direction by the opening / closing drive unit 62, the loading path 61a and the loading path 61b are opened as the entrance / exit 61, and at the same time, the upper holding member 1 and the lower holding member 2 are opened. Are moved relatively apart.
Therefore, the opening / closing drive unit 62 and the lift drive unit 3 of the chamber 6 can be configured by a single drive source.
Further, the lower holding member 2 is supported so as to be movable in the XYθ direction with respect to the bottom wall 64 of the chamber 6, and the lower work W 2 is moved upward via the lower holding member 2 by the operation of the positioning drive unit. The upper workpiece W1 held by the holding member 1 is aligned in the XYθ direction.
Although not shown in the drawings as another example, it can be configured to be openable and closable and have a sealed structure by inverting one of the chambers 6 divided in the Z direction toward the other, Instead, a door that can be opened and closed is provided in a part of the chamber 6 so that the bonding space S1 can be opened and closed and has a sealed structure, or the opening and closing drive unit 62 and the elevation drive unit 3 of the chamber 6 are provided. It is also possible to configure with another drive source, or to align or change the upper work W1 of the upper holding member 1 with respect to the lower work W2 of the lower holding member 2 in the XYθ direction.

The control unit 7 includes a holding unit 11 a of the upper holding member 1, a delivery driving unit 12 a of the delivery mechanism 12, a levitation unit 22 of the lower holding member 2, a lifting drive unit 3, a carry-in drive unit 42 of the carry-in member 4, and a lift. In addition to being electrically connected to the transfer unit 43, the unloading drive unit 52 of the unloading member 5 and the second levitation transfer unit 53, respectively, the opening / closing drive unit 62 of the chamber 6 and the transformer drive unit, the upper work W1 And a controller that is electrically connected to the positioning driving unit for relatively moving the lower workpiece W2 in the XYθ direction, a curing mechanism that cures the sealing material, and the like.
The controller serving as the controller 7 sequentially controls the operation at a preset timing in accordance with a preset program in its control circuit (not shown).

More specifically, as shown in FIG. 1A and FIG. 5A, for example, the control unit 7 has an inlet / outlet 61 (carrying path 61a) of the chamber 6 by an opening / closing drive unit 62 (lifting / lowering drive unit 3). The operation is controlled so that the bonding space S1 in the chamber 6 becomes an atmospheric atmosphere by opening.
In this state, the control unit 7 causes the carry-in drive unit 42 of the carry-in member 4 to bring the transfer surface 41 or the transfer robot or the like closer toward the lower chuck surface 21 of the lower holding member 2, and the floating transfer unit 43 or The operation is controlled so that the upper workpiece W1 is carried toward the lower chuck surface 21 in the atmospheric air through the entrance / exit 61 (loading path 61a) by a transfer robot or the like.
Thereafter, the control unit 7 transfers the upper work W1 to the upper chuck surface 11 of the upper holding member 1 by the transfer drive unit 12a of the transfer mechanism 12, as shown in FIG. The operation is controlled so as to be held immovable by the holding portion 11a.

Subsequently, as shown in FIG. 2A and FIG. 6A, the control unit 7 moves the lower workpiece W2 from the external space S2 to the conveyance guide 44 by the floating conveyance unit 43 or the conveyance robot. The operation is controlled so as to be carried in toward the lower chuck surface 21 in the air atmosphere through the entrance / exit 61 (carry-in path 61a) while restricting the position.
At this time, even if the upper workpiece W1 or the lower workpiece W2 is carried toward the lower chuck surface 21 of the lower holding member 2 by any one of the floating conveyance unit 43 and the conveyance robot, the upper workpiece W1 and the lower workpiece W2 The operation is controlled so that the side workpiece W2 is supported by the levitation unit 22 so as to be lifted from the smooth lower chuck surface 21 so as to be movable in a non-contact manner.
Next, switching from the levitation unit 22 to the contact holding unit 21a is performed, and the operation is controlled so that the lower workpiece W2 contacts the lower chuck surface 21 and is immovably held.

Thereafter, as shown in FIG. 2B and FIG. 6B, the control unit 7 closes the inlet / outlet port 61 (loading path 61a) of the chamber 6 by the opening / closing drive unit 62 and the elevation drive unit 3. The operation is controlled so as to start the decompression of the bonding space S1 in the chamber 6 by the decompression drive unit 6a.
At substantially the same time, the upper holding member 1 and the lower holding member 2 are moved relatively close to each other by the elevating drive unit 3, and at this timing, the upper holding member 1 or the lower holding member 2 is moved by the positioning drive unit. By adjusting and moving either one in the XYθ direction relative to the other, the upper workpiece W1 and the lower workpiece W2 are controlled to be aligned (aligned).
After this alignment is completed, the control unit 7 uses the lift drive unit 3 to further move the upper chuck surface 11 of the upper holding member 1 and the lower chuck surface 21 of the lower holding member 2 closer to each other and hold it on the upper chuck surface 11. The upper work W1 thus made and the lower work W2 held in contact with the lower chuck surface 21 are controlled so as to overlap each other with the sealing material and the sealing material sandwiched in the Z direction therebetween.
When the alignment described above is completed, the bonding space S1 is depressurized to a vacuum or a depressurized atmosphere close to vacuum by the depressurizing drive unit 6a, and the upper work W1 and the lower work W2 are stacked in the Z direction in the vacuum atmosphere. It is controlled to match.

Following this, as shown in FIG. 3A and FIG. 7A, the control unit 7 has the opening / closing drive unit 62 (lifting / lowering drive unit 3) to open and close the inlet / outlet 61 (unloading path 61b) of the chamber 6. The operation is controlled so that the bonding space S1 in the opening and the chamber 6 communicates with the outside air space S2 to be an atmospheric atmosphere.
For this reason, the upper workpiece W1 and the lower workpiece W2 are crushed to a predetermined gap by the atmospheric pressure to form the bonding device W.
Thereafter, as shown in FIG. 3B and FIG. 7B, the control unit 7 moves the second transport surface 51 or the transport robot or the like to the lower holding member by the unloading drive unit 52 of the unloading member 5. 2 is approached toward the lower chuck surface 21, and the bonding device W is passed from the lower chuck surface 21 through the entrance / exit 61 (unloading path 61 b) by the second levitation transport unit 53 or the transport robot, and the external space S <b> 2. The operation is controlled so as to be carried out toward the vehicle.

Furthermore, the program set to the control circuit of the control part 7 is demonstrated as a manufacturing method of the bonding device W. FIG.
In the manufacturing method of the bonding device W according to the embodiment of the present invention, the upper work W1 is held on the upper chuck surface 11 of the upper holding member 1 and the lower work is placed on the smooth lower chuck surface 21 of the lower holding member 2. Mainly includes a holding step for holding W2 and a bonding step for superposing the upper workpiece W1 and the lower workpiece W2 by a relative approaching movement of one or both of the upper holding member 1 and the lower holding member 2. Included as a major process.
In addition to this, as a pre-process of the holding process, the upper work W1 is carried by the carry-in member 4 toward the upper chuck surface 11 of the upper holding member 1 arranged in the bonding space S1 from the external space S2, and is moved into the bonding space S1. It is preferable to include a carrying-in process in which the lower work W2 is carried by the carrying-in member 4 toward the smooth lower chuck surface 21 of the lower holding member 2 to be arranged.
Further, in the holding step, the lower work W2 carried into the bonding space S1 by the carry-in member 4 is supported in a non-contact manner with respect to the lower holding member 2 so as to float from the lower chuck surface 21 by the levitation unit 22. Subsequently, the lower work W2 is held in contact with the lower chuck surface 21 by the contact holding part 21a before the pressure reduction of the bonding space S1 by the pressure reducing drive part 6a.
In the attaching step, either the upper holding member 1 or the lower holding member 2 is moved relatively close to the Z direction toward the other by the elevating drive unit 3, or the upper holding member 1 and the lower holding member are moved. 2 are moved relatively close to each other in the Z direction, and after the decompression of the bonding space S1 by the decompression drive unit 6a is completed, the upper workpiece W1 and the lower workpiece W2 are placed between them with the sealing material therebetween. Alternatively, the encapsulating materials are overlapped so as to be sandwiched in the Z direction, or the workpieces are directly overlapped.

According to the manufacturing apparatus A and the manufacturing method of the bonding device W according to the embodiment of the present invention, even if distortion due to partial expansion and contraction remains in the lower workpiece W2 due to carrying in by the transfer robot, the lower side By supporting the lower workpiece W2 in a noncontact manner on the chuck surface 21 so as to float from the lower chuck surface 21 by the levitation unit 22, the partial distortion of the lower workpiece W2 is released, and the lower workpiece W2 is held by the lower holding member. It becomes possible to hold in a smooth state along the two smooth lower chuck surfaces 21.
Following this, before the bonding space S1 becomes a reduced-pressure atmosphere, the lower workpiece W2 in a smooth state is landed on the lower chuck surface 21 by the contact holding portion 21a on the lower chuck surface 21 so that it cannot move. Is done.
Thereafter, after the relative positioning of the upper workpiece W1 and the lower workpiece W2 is performed, the control unit 7 causes the elevating drive unit 3 to relatively move one or both of the upper holding member 1 and the lower holding member 2 closer together. Let
As a result, in a vacuum or a reduced-pressure atmosphere close to vacuum, the lower workpiece W2 in a smooth state and the upper workpiece W1 held by the holding portion 11a on the upper chuck surface 11 can be superimposed without being displaced.
Therefore, the partial distortion remaining on the lower workpiece W2 can be removed and vacuum bonded to the upper workpiece W1 in a smooth state.
As a result, the surface of the lower holding member 2 has a smooth lower chuck surface 21 having no recesses such as through holes or grooves for lift pins, so that a part of the lower work W2 partially expands and contracts by its own weight. Therefore, it does not bend in an uneven shape. Thereby, the bonding accuracy of the upper workpiece W1 and the lower workpiece W2 can be improved. At the same time, even if it is a very thin plate-like workpiece (substrate) with low rigidity, it is possible to prevent bubbles from being generated on the bonding surface between the upper workpiece W1 and the lower workpiece W2, and to apply uniform bonding without bubbles. Can be combined.
Furthermore, because the arm of the transfer robot and the lower lift pin can transport the plate-shaped workpiece (substrate) without contacting the plate-shaped workpiece (substrate), foreign matter such as dust caused by the contact of the arm of the transfer robot and the lower lift pin can be removed. Adhesion can be prevented, and very uniform bonding can be performed without causing unevenness with other portions.
As a specific example, even if a G8 size glass substrate for liquid crystal with a thickness of 0.2 mm is pasted by a conventional alignment method, the alignment error of the upper workpiece W1 and the lower workpiece W2 is improved to submicron accuracy. And the yield can be improved.
Further, since the lower workpiece W2 and the upper workpiece W1 are bonded together in a vacuum or a reduced-pressure atmosphere close to vacuum, it is possible to reliably prevent air from being mixed from the bonding space S1 into the overlapping surface of the upper workpiece W1 and the lower workpiece W2. it can. As a result, it is possible to prevent the predetermined gap from becoming partially non-uniform due to air bubbles entering the overlapping surface of the upper work W1 and the lower work W2, and it is possible to manufacture a higher quality bonding device W. Become.

In particular, it is preferable that the upper holding member 1 and the lower holding member 2 are arranged inside a transformable chamber 6, and the chamber 6 has an openable / closable entrance / exit 61 through which the carry-in member 4 passes.
In this case, the inlet / outlet 61 of the chamber 6 is opened in the atmosphere, and the lower work W2 is carried into the lower chuck surface 21 of the lower holding member 2 by the carry-in member 4. Thereafter, in a state where the inlet / outlet 61 of the chamber 6 is closed and the pressure is reduced, one or both of the upper holding member 1 and the lower holding member 2 are relatively moved closer to each other so as to The upper work W1 is overlaid without being displaced.
Therefore, the lower workpiece W2 and the upper workpiece W1 in a smooth state from which the remaining partial distortion has been removed can be bonded together in a vacuum atmosphere.
As a result, the upper workpiece W1 and the lower workpiece W2 can be bonded to each other without bubbles and with high positional accuracy, so that a higher quality bonding device W can be manufactured.

Furthermore, it is preferable that the carry-in member 4 has a levitation conveyance unit 43 that conveys in a non-contact manner so that at least the lower workpiece W2 floats from the smooth conveyance surface 41.
In this case, when at least the lower work W2 is carried into the lower holding member 2 by the carry-in member 4, the floating work unit 43 causes the lower work W2 to float from the smooth conveyance surface 41 of the carry-in member 4. By conveying in a non-contact manner, partial distortion does not occur in a part of the lower work W2, and the lower work W2 is delivered to the lower chuck surface 21 of the lower holding member 2 while being in a smooth floating state.
Therefore, the partial distortion remaining on the lower work W2 can be further removed and bonded to the upper work W1 in a smoother state.
As a result, since the transfer robot and lift pins are not required compared to the conventional one in which partial distortion remains on a part of the lower substrate due to vacuum suction of the arms and lift pins of the transfer robot, the lower workpiece W2 is substantially It can be carried in without any unevenness. Accordingly, even when the lower workpiece W2 is held on the smooth lower chuck surface 21 of the lower holding member 2, partial distortion does not remain completely, and the upper workpiece W1 and the lower workpiece W2 are bonded together. The bonding surface can be uniformly and precisely aligned.
Furthermore, according to the carrying-in by a conventional transfer robot, it is difficult to transfer glass or plastic film having a thickness of several tens of um. In particular, a large thin substrate such as a G8 size cannot be transferred. However, when the lower workpiece W2 is carried in by the levitation conveyance unit 4b, direct conveyance can be realized without using a conveyance robot or lift pins, and the thin substrate can be directly connected without using an auxiliary carrier or jig. Can be bonded with high accuracy.

Next, each embodiment of the present invention will be described with reference to the drawings.
As shown in FIGS. 1 (a) (b) to 4 (a) (b), a manufacturing apparatus A for a bonding device W according to Example 1 of the present invention is a robot using a transfer robot in which a carry-in member 4 is described above. Instead of the conveyance method, the above-described floating conveyance method in which the workpiece is floated and conveyed is adopted, and a workpiece positioning guide is provided.
More specifically, the carry-in member 4 is in contact with the upper workpiece W1 and the lower workpiece W2 during the workpiece conveyance by the levitation conveyance unit 43 and intersects the workpiece conveyance direction (X direction) by the levitation conveyance unit 43 (Y direction). A conveyance guide 44 for restricting the position is provided.
It is preferable that a plurality of the conveyance guides 44 be arranged in the Y direction intersecting with the X direction as the workpiece conveyance direction by the levitation conveyance unit 43 with an interval substantially corresponding to the width dimension of the upper workpiece W1 and the lower workpiece W2.
When a plurality of transport guides 44 are arranged, at the time of workpiece transport by the levitation transport unit 43, one or both of the transport guides 44 are moved closer to the direction (Y direction) intersecting the workpiece transport direction (X direction), At the time of standby other than workpiece conveyance, it is preferable to move one or both of the conveyance guides 44 apart.

In the example shown in FIGS. 1A and 1B to FIGS. 4A and 4B, the conveyance guide 44 is a pair of guide rails. The upper work W1 and the lower work W2 that are conveyed in a non-contact manner while floating from the conveyance surface 41 by the levitation conveyance unit 43 and the pair of conveyance guides 44 are brought into direct or indirect contact with each other so that the upper work W1 and the lower work W2 are guided toward a fixed position of the lower chuck surface 21 of the lower holding member 2 without being displaced in the Y direction.
In the case of the illustrated example, the end portions of the upper workpiece W1 and the lower workpiece W2 are slidably contacted with the inner surfaces of the pair of guide rails serving as the conveyance guides 44, respectively.
Although not shown as another example, by arranging a rotating body such as a roller on the inner side surface of the guide rail serving as the conveyance guide 44, the frictional resistance with the workpiece can be reduced or the inner side of one guide rail can be reduced. Various changes can be made by blowing a gas such as compressed air from the side to the workpiece and pressing the workpiece toward the inner surface of the other guide rail, or adding a stopper to position the workpiece in the X direction as the conveyance guide 44 is there.

The lower chuck surface 21 of the lower holding member 2 is in contact with the upper workpiece W1 and the lower workpiece W2 carried in by the floating conveyance unit 43 of the loading member 4 and the workpiece conveyance direction (X direction) and the crossing direction (Y direction). It has a positioning guide 23 for restricting the position.
The positioning guide 23 includes a pair of guide rails 23a arranged in the Y direction, a stopper 23b for positioning the workpiece in the X direction, and the like.
The pair of guide rails 23a move close to each other in the crossing direction (Y direction) of the workpiece transfer direction (X direction) when the workpiece is transferred by the floating transfer portion 43 of the loading member 4, and move apart in the standby state other than the workpiece transfer. It is preferable to wait at a position that does not interfere with the movement of the upper holding member 1 by the elevating drive unit 3.
In the example shown in FIGS. 1A, 1 </ b> B to 4 </ b> A, 4 </ b> B, a pair of guide rails 23 a configured in the same manner as the guide rails of the conveyance guide 44 is transferred to the conveyance surface 41 by the levitation conveyance unit 43. The upper workpiece W1 and the lower workpiece W2 are displaced in the Y direction by directly or indirectly contacting the ends of the upper workpiece W1 and the lower workpiece W2 that are conveyed in a non-contact state while floating from the top. Instead, it is guided toward a fixed position of the lower chuck surface 21 of the lower holding member 2.
The stopper 23 b is provided so as to protrude or immerse with respect to the lower chuck surface 21, and is positioned by abutting the tip end surface of the workpiece in the X direction.

According to the manufacturing apparatus A of the bonding device W according to the first embodiment of the present invention, at least the lower work W2 is levitated from the conveying surface 41 of the loading member 4 toward the lower holding member 2 by the levitating conveyance unit 43. During the conveyance, the conveyance guide 44 and the positioning guide 23 are sequentially contacted and positioned in a direction (Y direction) intersecting the workpiece conveyance direction (X direction).
Therefore, the lower workpiece W2 can be accurately levitated and conveyed to a predetermined position on the lower holding member 2.
As a result, there is an advantage that the bonding accuracy of the upper workpiece W1 and the lower workpiece W2 is improved, and a higher quality bonding device W can be manufactured.

And the manufacturing method of the bonding device W which concerns on Example 1 of this invention carries out the bonding device W which the bonding of the upper side workpiece | work W1 and the lower side workpiece | work W2 was completed as a post process of the said bonding process, and the carrying-out member 5 is carried out. And an unloading step of unloading from the bonding space S1 toward the external space S2.
In the unloading step, the bonding device W is floated from the lower chuck surface 21 of the lower holding member 2 toward the second transfer surface 51 of the unloading member 5 by the second levitating conveyance unit 53 of the unloading member 5. It is carried out to space S2.
The second conveyance surface 51 of the carry-out member 5 of the levitation conveyance method includes a carry-out levitation unit 51 a that supports the bonding device W in a non-contact manner so that the bonding device W floats from the second conveyance surface 51, similarly to the carry-in member 4. Yes. The levitation unit 51a for carrying out forms a second air film 51b in the Z direction in the facing space between the second transport surface 51 and the lower work W2 of the bonding device W using a jet of gas or ultrasonic force. It is comprised so that the bonding device W may float from the 2nd conveyance surface 51.

According to the manufacturing method of the bonding device W which concerns on such Example 1 of this invention, after the bonding of the upper workpiece | work W1 and the lower workpiece | work W2 was completed in bonding space S1, the bonding device which bonding was completed. W is levitated and carried out while floating from the second conveyance surface 51 of the carry-out member 5.
Therefore, even when the lower workpiece W2 is a thin plate-like substrate such as a film, the upper workpiece W1 and the lower workpiece W2 that have been bonded once partially expand and contract, and both are relatively misaligned. No distortion occurs, and it is carried out with the accuracy at the time of bonding maintained.
Therefore, there exists an advantage that the bonding device W by which the film-like lower side workpiece | work W2 was bonded can be carried out with bonding with high positional accuracy.
As a result, a higher-quality bonding device W can be manufactured as compared with the conventional method of carrying out by a transfer robot or lift pins.

The manufacturing apparatus A for the bonding device W according to Example 2 of the present invention, as shown in FIGS. 5 (a) (b) to 7 (a) (b), as the delivery mechanism 12 of the upper holding member 1, The configuration in which the upper work W1 is transferred to the upper chuck surface 11 by the relative approaching movement of either one or both of the upper holding member 1 and the lower holding member 2 is shown in the first embodiment shown in FIGS. Unlike the above, the other configuration is the same as that of the first embodiment shown in FIGS.
More specifically, in the second embodiment, as the delivery mechanism 12 for the upper holding member 1, instead of the lift pin 12 b shown in FIGS. 1 to 3, as shown in FIGS. 5B and 6A. The upper holding member 1 is lifted from the lower chuck surface 21 by the levitation unit 22 of the lower holding member 2 by the relative approaching movement of the upper holding member 1 and the lower holding member 2 by the lifting drive unit 3. The workpiece W1 is handed over to the holding portion 11a of the upper chuck surface 11 while being floated.
Further, the holding portion 11a of the upper chuck surface 11 as a delivery destination is not a partial holding like the lift pin 12b shown in FIGS. 1 to 3, but an adsorption force and an adhesion force or an electrostatic adsorption force by negative pressure suction. It is preferable to configure the upper work W1 in a structure that holds the upper work W1 in a smooth surface along the upper chuck surface 11 by a combination.

The control unit 7 moves one of the upper holding member 1 and the lower holding member 2 closer to the other by the elevating drive unit 3 at the time of delivery of the upper work W1 shown in FIG. The operation of the holding portion 11a of the upper chuck surface 11 is controlled so as to come into surface contact with the non-bonding surface of the upper work W1 that is lifted from the lower chuck surface 21 by the floating portion 22.
After the upper chuck surface 11 of the upper holding member 1 comes into surface contact with the upper work W1, the work is held by the holding portion 11a to allow the upper work W1 to be delivered.
Following this, as shown in the two-dot chain line in FIG. 5B and FIG. 6A, either the upper holding member 1 or the lower holding member 2 is moved away from the other by the elevating drive unit 3. By doing so, the subsequent lower workpiece W2 can be carried in.

In the example shown in FIGS. 5A and 5B to FIGS. 7A and 7B, the opening / closing drive unit 62 and the elevation drive unit 3 of the chamber 6 are configured by a single drive source, and the opening / closing drive unit 62. As a result of the lid wall 63 of the chamber 6 being moved closer to the bottom wall 64 and the entrance / exit 61 (loading path 61a) being closed, the lifting / lowering drive unit 3 moves the holding part 11a of the upper chuck surface 11 to the upper work piece. The surface is held in contact with the non-bonded surface of W1. As a result, the upper workpiece W1 is transferred to the holding portion 11a of the upper chuck surface 11 while being lifted from the lower chuck surface 21.
Although not shown as another example, the opening / closing drive unit 62 and the elevation drive unit 3 of the chamber 6 are configured by separate drive sources, respectively, and the entrance / exit 61 (loading path 61a) of the chamber 6 by the opening / closing drive unit 62 is provided. Regardless of the closing movement, the upper and lower drive members 3 bring the upper holding member 1 close to the position where the holding portion 11a of the upper chuck surface 11 comes into surface contact with the non-bonding surface of the upper work W1 that is lifted from the lower chuck surface 21. It is also possible to move it.

According to the manufacturing apparatus A and the manufacturing method of the bonding device W according to the second embodiment of the present invention, the upper work W1 that is levitated and held from the lower chuck surface 21 by the levitating portion 22 of the lower holding member 2 is levitated. As it is, the sheet is delivered to the upper chuck surface 11 of the upper holding member 1 in a planar shape.
Therefore, the upper workpiece W1 can be transferred to the upper chuck surface 11 of the upper holding member 1 without complete partial distortion.
As a result, there is an advantage that the bonding accuracy of the upper workpiece W1 and the lower workpiece W2 is improved, and a higher quality bonding device W can be manufactured.
Further, as shown in FIGS. 1 to 3, the delivery mechanism 12 for the upper holding member 1 includes a lift pin 12 b that passes through the lid wall 63 of the chamber 6 and is movable in the Z direction, as compared with the first embodiment. There is no need to provide a sealing member such as an O-ring between the lid wall 63 and the lift pin 12b, and there is an advantage that the structure of the delivery mechanism 12 and the chamber 6 can be simplified.

  In the previous embodiment, the carry-in member 4 and the carry-out member 5 are not the robot transfer method using the transfer robot described above, but the levitating transfer method in which the workpiece is levitated and conveyed. 4 or one or both of the carry-out members 5 may be changed to a robot conveyance system or a conveyor conveyance system.

DESCRIPTION OF SYMBOLS A Manufacturing apparatus of a bonding device 1 Upper holding member 11 Upper chuck surface 11a Holding part 2 Lower holding member 21 Lower chuck surface 21a Contact holding part 22 Floating part 6a Decompression drive part 7 Control part S1 Bonding space W1 Upper work W2 Lower work W Bonding device

Claims (2)

The upper work is held by the upper holding member and the lower work is held by the lower holding member in the bonding space, and the upper work and the lower work are moved by the relative approaching movement of the upper holding member and the lower holding member. It is a manufacturing device of a bonding device that bonds a side workpiece in a reduced pressure atmosphere,
The upper holding member having an upper chuck surface that is disposed in the bonding space and is detachably held by the upper work;
The lower holding member having a smooth lower chuck surface that is disposed in the bonding space and is detachably held by the lower workpiece;
An elevating drive unit that relatively moves either one or both of the upper holding member and the lower holding member to overlap the upper work and the lower work, and
A decompression drive section for decompressing the bonding space;
A control unit that controls the operation of the upper chuck surface, the lower chuck surface, the elevating drive unit, and the pressure reducing drive unit, respectively.
The upper holding member has a holding portion in which the upper work is held immovably,
The lower holding member is provided with a levitation unit provided with means for generating a separation pressure and an approaching pressure in opposite directions with the lower work, and a means for adjusting the separation pressure and the approaching pressure. A contact holding part,
The control unit balances the separation pressure and the approaching pressure of the levitation unit with respect to the lower holding member with respect to the lower holding member, so that the lower work is lifted off the lower chuck surface. in is supported, at a time prior to the bonding space by the vacuum drive portion is vacuum completed, switching to the contact holder from the flotation section, gradually increasing the approaching pressure than the separation pressure, the the lower workpiece on the lower chuck surface is held in contact, before Symbol said one or both either upper retaining member and the lower retaining member are relatively moved closer by the elevating drive unit, the pressure reducing drive after decompression is complete the bonding space by part, wherein said held by the holding unit in the upper chuck surface upper workpiece and said lower workpiece is controlled so as to overlap Manufacturing apparatus lamination devices. The upper work is held by the upper holding member and the lower work is held by the lower holding member in the bonding space, and the upper work and the lower work are moved by the relative approaching movement of the upper holding member and the lower holding member. It is a manufacturing method of the pasting device which bonds a side work in a decompression atmosphere,
Holding the upper work on the upper chuck surface of the upper holding member, and holding the lower work on the smooth lower chuck surface of the lower holding member;
A bonding step of superimposing the upper work and the lower work by a relative approach movement of either one or both of the upper holding member and the lower holding member,
Said holding step, the against the lower workpiece on the lower retaining member, spaced pressure and close the pressure generated in the opposite directions respectively between the lower workpiece is balanced by the flotation section, the lower workpiece was supported in a non-contact to float from the lower chuck surface, this before the bonding space is vacuum completed by continued pressure reducing drive unit, the approaching pressure by the contact holding portion gradually than the separation pressure Increased to hold the lower workpiece in contact with the lower chuck surface and immovable,
In the bonding step, the upper work and the lower work are overlapped after the pressure reduction in the bonding space by the pressure reducing drive unit is completed.

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