TW396490B - Wafer processor - Google Patents

Wafer processor Download PDF

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Publication number
TW396490B
TW396490B TW087118839A TW87118839A TW396490B TW 396490 B TW396490 B TW 396490B TW 087118839 A TW087118839 A TW 087118839A TW 87118839 A TW87118839 A TW 87118839A TW 396490 B TW396490 B TW 396490B
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Taiwan
Prior art keywords
substrate
processing
unit
section
mentioned
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TW087118839A
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Chinese (zh)
Inventor
Satoshi Taniguchi
Satoshi Yamamoto
Masami Nishida
Kazuo Kise
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Dainippon Screen Mfg
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Priority claimed from JP31296397A external-priority patent/JP4044994B2/en
Priority claimed from JP07932198A external-priority patent/JP4045008B2/en
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Application granted granted Critical
Publication of TW396490B publication Critical patent/TW396490B/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706Mechanical details, e.g. roller, belt

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

This is a wafer processor, which can suppress particles generation in wafer processing. A wafer processor 101 transfers wafer and performs a series of processing operations upon the wafer, including several pivoting robots 104 to 108 and several units 110, 120, 130, 140, 160, 170, 180 and 190. The pivoting robots 104 to 108 have body and arm. Body can rotate and will not move in horizontal direction. The arm, which is extended from body, can hold the wafer. The wafer is transported in and out of each processing unit by the rotating robots 104 to 108.

Description

經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明(1 ) [發明所屬之技術領域] 本發明有關於用K搬運基板,藉Μ對基板進行一連貫之 處理之基板處理裝置。 [習.知之技術] 在液晶顯示裝置或電漿顯示装置用之電漿基板(FPD基板 )和半導體晶圓等之製造處理中*需要有基板處理裝置用 來在基板之表面形成抗蝕劑膜,和對其進行曝光/顯像。 該基板處理裝置是連接多個處理單位形成可Μ進行一連貫 之處理之裝置(成線(ί η 1 i n e )条統),例如在影印工程中 、 ,形成塗膜器/顯像器裝置,連接曝光機*可Μ連續的進 行從抗蝕劑塗布前之洗淨到抗蝕劑之塗布,曝光,顯像止 之工程。 此種基板處理裝置被揭示在專案公報(專利號碼第 2 5 1 9 0 9 6號)。該基板處理裝置具有旋轉式洗淨單位(旋轉 塗膜器),旋轉塗布單位(旋轉塗膜器),旋轉式顯像單位( 旋轉顯像器),加熱單位,曝光機等之處理部,另外具有 輸送架(搬蓮機器人)用來在各個處理部進行基板之搬入/ 搬出。其中,在輸送架安裝有用Μ保持基板之小紺,輸送 架依水平方向活動用來在各個處理部之間移動,利用該小 鉗用來將基板搬出/搬入各個處理部。亦即,輸送架所擔 任之功能包括將基板搬入/搬出各個處理部之功能和將基 板從一個處理部搬運到另外一個處理部之功能。 [發明所欲解決之問題] 在上述之基板處理裝置中,利用輸送架將基板從一涸處 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ 297公釐) — -4 - 1':>”--1----裝------訂-------Φ--^---f ./—\. (請先閲讀背面之注意事項再填寫本頁) A7 B7 經濟部中央標準局員工消費合作社印袋 五、發明説明( 2 ) 理 部 搬 運 到 另 外 一 個 處 理 部 0 因 此 j 當 輸 送 架 依 水 平 方 向 移 動 時 f 周 圍 氣 體 會 被 擾 亂 而 產 生 風 〇 由 於 該 氣 體 之 擾 亂 (風)而產生粒 子 9 很 容 易 造 成 對 基 板 和 各 個 處 理 部 之 污 染 ————_。——尤-其—是在――最—近――之將來-會-要求處--理--民--寸-較--大一之-基-板- 例—如------------------ 處 理 lm對角 或 Iffl對角 Μ 上 之 尺 寸 之 玻 璃 基 板 9 在 這 種 情 況 假 如 輸 送 架 依 水 平 方 向 移 動 時 , 會 造 成 粒 子 之 產 生 量 之 増 加 0 另 外 9 在 上 逑 之 基 板 處 理 裝 置 中 是 採 用 m 轉 刷 洗 和 旋 轉 顯 像 器 用 Μ 進 行 洗 淨 和 顯 像 處 理 但 是 當 基 板 之 尺 寸 變 大 時 用 Μ 使 基 板 旋 轉 所 需 要 之 功 率 要 另 外 的 增 加 9 因 此 馬 達 等 之 成 本 會 變 高 而 且 用 Μ 使 該 等 旋 轉 之 能 量 之 蓮 轉 成 本 亦 會 增 大 〇 另 外 一 方 面 用 Μ 進 行 基 板 搬 理 之搬運機器 人 亦 會 變 成 高 價 格 當 使 用 台 數 變 多 時 亦 會 使 成 本 增 加 0 因 此 有 需 要 尋 找 ΚΚ 眧 各 個 處 理 部 之 特 性 之 適 當 之 處 理 ,•月 法 和 搬 運 方 法 而 且 可 Μ 使 成 本 降 低 0 本 發 明 之 百 的 是 促 成 可 Μ 抑 制 基 板 處 理 時 之 粒 子 之 發 生 和 減 低 基 板 處 理 之 成 本 〇 另 外 9 在 上 述 之 各 個 基 板 處 理 裝 置 中 9 因 為 需 要 有 用 使 輸 送 架 移 動 之 空 間 9 和 進 行 基 板 之 授 受 之 授 受 部 之 空 間 , 所 Μ 基 板 處 理 裝 置 之 設 置 所 需 要 之 平 面 空 間 會 變 大 0 基 板 處 理 裝 置 必 需 設 置 在 有 限 之 清 潔 室 之 空 間 9 因 此 其 佔 用 空.間 之 問 題 成 為 重 要 之 問 題 0 本 發 明 之 吕 的 是 促 成 使 基 板 處 理 裝 置 成 為 平 面 上 很 小 之 裝 置 0 本紙張尺度適用中國國家標準(CNS ) Α4規格(2丨0Χ 297公釐) 請 先 閎 讀 -背 之 注 意 事 項 再 填 寫 本 Έ A7 B7 經濟部中央標準局員工消費合作社印製 五、發明説明(3 ) [解決問題之手段] 申請專利範圍第1項是一種基板處理裝置,用來搬蓮被 處理基板和對被處理基板進行一連貫之處理*具備有多個 旋轉機器人和多個處理部。旋轉機器人具有軀幹部和臂部 。軀幹部可Μ旋轉和不能依水平方向移動。臂部從軀幹部 延伸,用來保持被處理基板。在各個處理部利用旋轉機器 人用來進行被處理基板之搬入/搬出。 其中,利用不會依水平方向移動之多個旋轉機器人用來 進行被處理基板之搬入/搬出各個處理部。因此,可Κ抑 制習知方式之用Μ保持被處理基板之輸送架依水平方向Μ 高速移動長距離時之產生粒子之問題,粒子之產生量可Κ 減少,藉Μ減少對被處理基板和各個處理部之污染。 申請專利範圍第2項之基板處理裝置是在申請專利範圍 第1項之裝置中使該多個處理部是1個或多個之靜止式處理 部,和1個或多個之葉片式處理部。靜止式處理部是使被 處理基板不移動的進行處理之處理部。葉片式處理部是包 含有使被處理基板移動之工程之處理部。 其中,適於不使被處理基板移動的進行處理之處理以靜 止式處理部進行,包含有使被處理基板移動之工程之處理 Κ葉片式處理部進行。例如,加熱/冷卻處理等以靜止式 處理部進行處理、洗淨、塗布液塗布,顯像等之處理Μ葉 片式處理部進行處理。依照這種方式,經由在靜止式處理 部組合包含多個處理所獲得之葉片式處理部,可以減少處 理部之數目,亦可以削減旋轉機器人之數目,可Μ節省裝 本紙張尺度適用中國國家標準(CNS ) Α4規格(210 X 297公釐) (請先閎讀背面之注意事項再填寫本頁) 装-- 6 __ β _ A7 B7 經濟部中央標準局員工消費合作社印製 五、 發明説明 [) 1 1 1 置 之 空 間 0 1 1 1 實 質 上 9 將 旋 轉 式 塗 布 9 減 壓 乾 燥 和 端 面 洗 淨 之 處 理 集 1 I 中 在 1個?ί ?稱為塗布單位之處8 !部0 塗布單位具備有: 搬 請 先 鬩 1 人 部 和 搬 出 部 ; 和 輸 送 帶 或 滑 動 器 9 從 W 入 部 經 由 旋 轉 式 背 面 塗 布 之 處 理 部 份 > 減 Μ 乾 燥 之 處 理 部 份 和 彌 面 洗 淨 之 處 之 注 1 I 意 i 理 部 份 , 用 來 使 被 處 理 基 板 移 動 到 搬 出 部 〇 利 用 這 種 方 式 事 項 1 I f 1 Λ 9 當 將 相 關 之 處 理 集 中 在 1個處理部時 可Μ採用簡單而 填( 寫 本 ) 袭 且 運 轉 成 本 和 裝 置 成 本 均 很 低 之 輸 送 帶 等 之 搬 蓮 茨 置 , 用 頁 1 I 來 代 替 Μ 旋 轉 禅 m 器 人 搬 蓮 被 處 理 基 板 〇 另 外 當 與 旋 轉 式 I 1 1 塗 布 減 壓 乾 燥 3 和 端 面 洗 淨 分 別 成 為 單 獨 之 處 理 部 9 在 1 1 3個處理部間配置旋轉機器人之情況比較時 可Μ減小佔 1 訂 用 空 間 〇 1 1 另 外 經 由 加 入 葉 片 式 處 理 部 在 被 處 理 基 材 大 型 化 之 1 I 情 況 時 可 Μ 很 容 易 採 用 刷 子 刷 洗 和 噴 霧 顯 像 器 等 而 不 1 1 1 採 用 旋 轉 式 之 處 理 方 法 例 如 旋 轉 刷 洗 和 旋 轉 顯 像 器 (其 1 中 由 於 基 板 之 破 損 和 水 洗 時 之 水 之 飛 濺 使 粒 子 之 發 生 m 率 1 i Hki. 高 9 而 且 會 使 洗 淨 特 性 和 顯 像 特 性 劣 化 〇 利 用 本 發 明 之 I 方 式 9 可 Μ 不 必 增 加 成 本 的 因 ItfP 懕 被 處 理 基 板 之 大 型 化 0 1 I 串 請 專 利 範 圍 第 3項之基板處理装置是在申請專利範圍 1 1 第 2項之裝置中 ,使靜止式處理部是ί 設入部考 搬出部相同 1 J 和 使 葉 片 式 處 理 部 是 搬 入 部 和 搬 出 部 不 同 0 1 1 申 請 專 利 範 圍 第 4項之基板處理裝置是在申請專〗 W範圍 1 1 第 1. g 3項 之 任 何 一 項 之 裝 置 中 » 更 具 備 有 授 受 部 0 該 授 受 1 I 部 被 配 置 在 旋 轉 機 器 人 間 9 用 來 進 行 被 處 理 基 板 之 授 受 0 1 1 各紙張尺度適用中國國家標準(CMS ) A4規格(2ίOX 297公釐) A7 B7 五、發明説明(5) 其中,因為設有授受部,所Μ被處理基板可Μ暫時在該 處進行等待,可Μ順利的進行被處理基板之授受,和可Μ 進行多樣之搬蓮控制。利用這種方式,可Κ獲得被處理基 板之有效處理,可Μ提高總處理速度。 申請專利範圍第5項之基板處理裝置是在申請專利範圍 第4項之裝置中,使授受部具有第1裝載部,第2裝載部, 和移動機構。第1裝載部可Μ用來裝載被處理基板。第2裝 載部位於第1裝載部之上部,可Μ用來裝載被處理基板。 移動機構用來將被處理基板從第1裝載部和第2裝載部之一 方移動到另外一方。 其中,可Μ抑制授受部之平面上之佔用空間,和強化掩 受部之作為緩衝器之功能。利用這種方式,授受部之前工 程側之處理部和後工程側之處理部之時間之調整變成可Μ 很容易控制。 經濟部中央標準局員工消費合作社印製 (請先閲讀背面之注意事項再填寫本頁) 申請專利範圍第6項之基板處理裝置是在申請專利範圍 第5項之裝置中,使第1裝載部成為可上下移動之第1支持 構件。第2裝載部成為可水平移動之第2支持構件。移動機 構具備有用來使第1支持構件上下移動之上下移動機構, 和用來使第2支持構件依水平方向移動之水平移動機構。 其中,首先被裝載在第1裝載部之被處理基板,經由上 下移動機構之將第1支持構件提升,上升到第2裝載部之高 度之位置。其次,利用水平移動機構使第2支持構件水平 移動到可Μ用來支持被處理基板之下面之位置。然後,使 第1支持構件下降,其次形成可Μ支持搬運到第1裝載部之 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ_297公釐) _ 〇 _ A7 B7 五、發明説明(6) 其他被處理基板之狀態。 申請專利範圍第7項之基板處理裝置是在申請專利範圍 之第1至6項之任何一項之裝置中,使臂部可K屈伸和上下 移動。 其中,利用臂部之屈伸運動和上下移動用來將被處理基 板搬入到各個處理部,和從各個處理部將被處理基板搬出。 申請專利範圍第8項之基板處理裝置是在申請專利範圍 第1至7項之任何一項之裝置中使該多個處理部包含有洗淨 單位和加熱單位。洗淨單位用來對被處理基板進行洗淨。 加熱單位用來對被處理基板進行加熱。 在本項申請專利範圍之裝置中,可Μ對被處理基板進行 洗淨處理,和對由於洗淨而沾濕之被處理基板進行乾燥脫 水處理。另外,可Μ進行預烘乾處理和後烘乾處理。 經濟部中央標準局員工消費合作社印製 (請先閲讀背面之注意事項再填寫本頁) 申請專利範圍第9項之基板處理裝置是在申請專利範圍 第8項之裝置中,使該多個處理部更包含有塗布單位,曝 光單位,和顯像單位。塗布單位用來將塗布液塗布在被處 理基板。曝光單位用來使塗布有塗布液之被處理基板之至 少之一部份進行曝光。顯像單位用來對曝光後之被處理基 板進行顯像。 在本項申請專利範圍之基板處理裝置中,可Κ對被處理 基板進行洗淨、塗布液塗布、曝光和顯像之一連貫之處理。 申請專利範圍第1 0項之基板處理裝置是在申請專利範圚 第8或9項之装置中,使洗淨單位具有用Κ搬運被處理基板 之搬運裝置。在洗淨單位設有位置不同之搬入部和搬出部 本紙張尺度適用中國國家標準(CNS ) Λ4規格(_ 210X297公釐) _ 〇 _~' 五、發明説明(7) A7 B7 板 基 理 處 被 使 不Μ 可 同 相。 部理 出處 搬行 和進 部板 入基 搬理 之處 位被 單對 熱的 加動 。 移 之 而 淨蓮 洗搬 式等 轉器. 旋動 於滑 高或 般帶 1 送 力輸 淨由 洗於 有對 具理 行處 進式 位片 單葉 淨 。 洗理 ’ 處 中式 其片 葉 部處 入式 搬片 從葉 板種 基此 理用 處採 被由 。 經 WHI > 3= 理 。理 處淨處 行洗之 進被貫 的和連 序部 一 順出行 , 搬進 板到的 基運利 理搬順 處被 Μ 被,可 之入 , 來搬理 洗 氧 臭 線 外 紫 由 如 例 時 較 LU fc 理 處 式 Η 葉 〇 與 )°當 理 , 處位 淨單 洗熱 之加 成於 構對 所 , 淨面 洗方 水一 6 LT 魏 夕 和另 淨 之 一 多 間之為 空謂成 面所部 平之位 和 同單 率相熱 效部加 熱出個 其搬多 理和使 處部., 行入外 進搬另 態用。 狀採式 止 Μ 方 靜所Γ) L— Θ 為 ,b 板利am 基有ch 理較 處均ne 被省(0 在節室 範 利 專 請 Φ 在 是 置 裝 3Ε 理 處 板 基 〇 之 間項 空11 省第 節圍 Μ範 可利 亦專 造請 構申 段 處 被 運 搬 Μ 用 有 具 位 單 像 顯 和 位 單 布 塗 使 中 置 裝 之 項 9 第 部 出 搬 和 部 入 擁 之 同 不 置 位 有 設 置 裝 蓮 搬 之 板 基 理 (請先閎讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 用 ’ 利布 。 塗 理液 處布 式塗 片式 葉轉 行旋 進之 位 貫· 單 連 像 一 顯行 和進 位的 單利 布順 塗M 於可 對 , ’ 式 中方 til 其 種 這 連1 行 進 板 基 對 〇 是 理置 處裝 位理 單 處 布板 塗基 之 之 等項 P 2 0 1 洗第 面圍 端範 , 利 燥專 乾請 壓 申 減 處 K 段用 多是 該室 。 運 人搬 器 。 機疊 和重 部向 理方 處下 段上 多依 有室 備理 具處 , 和 置室 裝運 之搬 理有 處具 之部 貫理 之 。: 理動 處移 加之 施板 板基 基之 對間 是之 室室 理理 處處 。 和 室室 之運 出搬 搬行 或進 入來 搬用 之人 板器 基機 行 。 進室 本紙張尺度適用中國國家標準(CNS ) A4規格(7丨0X297公釐) A7 B7 經濟部中央標準局員工消費合作社印製 五、發明説明( ς η 1 1 1 習 知 技 術 是 將 用 Μ 進 行 基 板 之 搬 入 或 搬 出 之 場 所 設 在 健 機 1 1 | 器 人 之 近 傍 > 利 用 該 場 所 用 來 搬 運 基 板 〇 1 I 請 J 與 此 相 對 的 9 在 本 發 明 中 9 用 Μ 進 行 基 板 之 搬 入 或 搬 出 先 1 閲 之 場 所 之 搬 蓮 室 重 疊 在 處 理 室 〇 亦 即 > 經 由 將 搬 運 室 和 處 讀 背 面 理 室 配 置 成 上 下 重 疊 y 則 習 知 技 術 所 設 之 用 >1 搬 入 或 搬 出 之 注 1 I 意 1 1 基 板 之 m 器 人 近 傍 之 場 所 (空間)可Μ供作其他 百 的 使 用 或 事 項 1 I 再 1 加 Μ 省 略 〇 假 如 縮 小 該 空 間 時 , 功 能 和 性 能 不 會 劣 化 f 可 填 % 本 ,) 裝 Μ 獲 得 使 基 板 處 理 裝 置 之 平 面 變 小 之 装 置 0 頁 1 I Φ 請 專 利 範 圍 第 1 3項之基板處理 裝置是在_鹄'%則貌暖 1 1 第 12項 之 裝 置 中 使 多 段 處 理 部 具 有 依 上 下 方 向 重 疊 之 多 1 1 個 處 理 室 0 1 訂 其 中 因 為 搬 蓮 室 和 多 個 處 理 室 依 上 下 方 向 重 疊 所 1 I 可 Μ 更 進 一 步 的 提 高 空 間 效 率 可 >λ 更 進 一 步 的 減 小 基 板 1 I 處 理 裝 置 之 佔 用 空 間 〇 1 I | 申 請 專 利 範 圍 第 14項 之 基 板 處 理 裝 置 是 在 申 請 專 利 範 圍 第12項 之 裝 置 中 1 使 搬 運 室 具 有 用 Κ 搬 運 基 板 之 搬 運 裝 置0 1 1 其 中 f 利 用 搬 蓮 裝 置 動 作 , 可 Μ 將 基 板 搬 入 到 多 段 處 I } 理 部 9 和 從 多 段 處 理 部 中 搬 出 〇 I 1 申 請 專 利 範 圍 第 15項 之 基 板 處 理 装 置 是 在 甲 請 專 利 範 圍 1 第 1 2項 之 裝 置 中 > 使 機 器 人 具 有 基 板 保 持 臂 〇 該 基 板 保 持 1 臂 可 以 依 上 下 方 向 移 動 > 和 可 以 進 入 和 退 出 m 搬 蓮 室 和 處 1 1 理 室 0 1 | 其 中 1 該 機 器 人 利 用 基 板 保 持 臂 用 來 保 持 基 板 9 和 使 基 1 I 板 在 搬 運 室 和 處 理 室 之 間 移 動 〇 1 1 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -11 - Μ Β7 五、發明説明(9 ) 申請專利範圍第1 6項之基板處理裝置是在申請專利範圍 第12項之裝置中更具備有另外之處理部。該另外之處理部 鄰接多段處理部,位於與搬運室大致相同高度之位Μ。 其中,因為該另外之處理部與多段處理部之搬運室位於 大致相同高度之位置,所Κ該其他處理部和多段處理部之 間之基板之搬蓮可Μ順利的進行。例如,當將完成多段處 理部之處蹲之基板移動到搬運室時,對鄰接之其他處理部 之搬蓮,只需要利用任何之搬蓮裝置(輸送帶搬蓮裝置或 滑動器搬運裝置等),使基板平行移動即可。 申請專利範圍第1 7項之基板處理裝置是在申請專利範圍 第12項之裝置中使該多段裝置具有多個上述之搬運室。 經濟部中央標準局員工消費合作社印製 (請先閱讀背面之注意事項再填寫本頁) 其中*因為在多段處理部設#多個搬蓮室,所Μ可以分 開的設置搬入專用之搬運室和搬出專用之搬蓮室。利用這 種方式可以在某一個基板之搬出前,將其他之基板搬入到 多段處理部,另外,即使在多段處理部之前處理部之搬運 路徑和多段處理部之後處理部之搬蓮路徑不同之情況時, 亦可Μ使搬入專用之搬運室對應到前處理部之搬運路徑, 和使搬出專用之搬運室對應到後處理部之搬運路徑。 另外,經由將多個搬運室配置成多段,可Μ抑制多段處 理部之平面上空間之增大。 申請專利範圍第1 8項之基板處理裝置是用Μ對基板進行 一連貫之處理之裝置,具備有多段處理部和機器人。該多 段處理部具有緩衝器室和處理室依上下方向重蠱。鍰衝器 室是用Μ暫時保管基板之室。處理室是對基板施加處理之 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公釐) -12 - A7 B7 經濟部中央標準局員工消費合作社印製 五、發明説明(K)) 1 1 室 〇 m 器 人 用 來 在 緩 衝 器 室 和 處 理 室 之 間 進 行 基 板 之 移 動。 1 1 I 在 習 知 技 術 中 9 將 用 Μ 暫 時 保 管 基 板 之 場 所 設 定 在 Μ 器 1 1 人 之 近 傍 利 用 該 場 所 用 來 吸 收 各 個 處 理 部 之 處 理 之 時 間 請 閎 I 差 等 〇 讀 背 1 1 與 此 相 對 的 9 在 本 發 明 中 設 有 緩 衝 器 室 作 為 用 Μ 暫 時 保 面 之 1 1 管 基 板 之 場 所 9 使 其 重 疊 在 處 理 室 〇 亦 即 $ 將 緩 衝 器 室 和 意 事 項 1 1 處 理 室 配 置 成 上 下 重 疊 9 習 知 技 術 所 設 用 Μ 暫 時 保 管 基 再 4 % 裝 1 板 之 位 於 m 器 人 近 傍 之 場 所 (空間)可Μ供作其他 的 使 用 本 或 加 Μ 省 略 0 假 如 縮 小 該 空 間 時 功 能 和 性 能 不 會 劣 化 > 1 1 可Μ獲得使基板處理裝置之平面變小 之 裝 置 0 I 1 申 請 專 利 範 圍 第 19項之 基 板 處 理 裝 置 是 在 申 m 專 利 範 圍 1 訂 第 18項 之 裝 置 中 使 m 多 段 處 理 部 具 有 依 上 下 方 向 重 疊 之 1 1 多 個 處 理 室 0 1 其 中 因 為 搬 運 室 和 多 個 處 理 室 依 上 下 方 向 重 疊 所 以 1 1 可 Μ 更 進 一 步 的 提 高 工 間 效 率 可 Μ 更 進 一 步 的 減 小 基 板 1 處 理 裝 置 之 佔 用 空 間 〇 1 卜 甲 請 專 利 範 圍 第Μ;項 之 基 板 處 理 裝 置 是 在 請 專 利 範 圍 厂 1 第 18項 之 裝 置 中 9 使 緩 /gj- m 器 室 具 有 多 個 用 以 裝 載 基 板 之 裝 卜 1 載 裝 置 0 1 其 中 t 因 為 在 緩 衝 器 室 設 置 多 個 之 裝 載 裝 置 9 所 在 媛 1 衝 器 室 內 可 K 保 管 多 個 之 基 板 0 1 1 | 申 請 專 利 範 圍 第21項 之 基 板 處 理 裝 置 是 在 請 專 利 範 圍 1 1 第 18項 之 裝 置 中 r 使 機 器 人 具 有 基 板 保 捋 臂 〇 該 基 板 保 持 1 1 臂 可 Μ 依 上 下 方 向 移 動 , 藉 Μ 進 入 和 退 出 該 媛 衝 器 室 和 處 1 1 本紙張尺度適用中國國家標準(CNS ) A4規格(2丨0X297公釐) A7 B7 五、發明説明(11) 理室。 其中,該機器人利用基板保持臂用來保持基板,和用來 使基板在緩衝器室和前處理室之間移動。 申請專利範圍第22項之基板處理裝置由我的綠和返回線所 構成,用來將指定位置之基板搬運到各個處理部,在進行 一連貫之處理之後,使基板迫回到指定之位置。該基板處 理裝置具備有第1多段處理部和機器人。第1多段處理部被 包含在往行線或返回線,具有通過室和處理室依上下方向 重疊。通過室是用Μ讓基板通過之室。處理室是對基板施 加處理之室。機器人用來進行基板之移動到第1多段處理 部之處理室。 經濟.部中央標準局員工消費合作社印製 (請先閲讀背面之注意事項再填寫本頁) 該基板處理裝置具有往行線和返回線,用來使完成各個 處理後之基板回到原來之場所。在此種裝置之情況時,在 布置上,或是將類似之處理部之有關設備集合之關係上, 在返回線之途中配置往行線之處理所使用之處理部,和在 往行線之途中配置返回線之處理所使用之處理部。在此種 配置時,可Μ回避該處理部的搬蓮基板。這種回避之進行 是利用旋轉機器人和授受部之組合和在平面上移動之機器 人等。 與此相對的,在本發明中,因為具備有第1多段處理部 使通過室和處理室依上下方向重疊*例如將其配置在返回 線之途中,即使在使用第1多段處理部之處理室進行往行 線之處理時,在返回線被搬運之基板不需要回避第1多段 處理部,可以通過該通過室。利用這種方式,用以回避第 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ 297公釐) I~~" _ A7 B7 經濟部中央標準局員工消費合作社印製 五、發明説明( 12) 1 1 1 1多段處理部之與基板之搬運有關之步驟可Μ省1¾ ί , 可Μ 1 1 | 抑 制 裝 置 成 本 和 搬 運時間。 ^ 1 1 申 請 專 利 範 圍 第 23項之基板 處 理 裝 置是在 Φ 請 專 利 範 圍 請 Λ I 閲 I 第 22 項 之 裝 置 中 更 具備有第2多段處理部。第2多 段 處 理 部 讀 背 1 面 I 被 包 含 在 往 行 線 或 返回線,具 有 搬 蓮 室和處 理 室 依 上 下 方 1 1 意 1 I 向 重 疊 〇 搬 運 室 是 用來進行基 板 之 搬 入或搬 出 之 室 〇 處 理 拳 項 1 再 1 室 是 對 基 板 施 加 處 理之室。機 器 人 用 來進行 第 1多段處理 } 裝 寫 本 部 之 處 理 室 第 2多段處理部之處理室和第2 多 段 處 理 部 之 頁 、---r 1 I 搬 蓮 室 之 間 之 基 板 之移動。 1 1 I 其 中 利 用 m 器 人之存取, 使 用 第1和第2多 段 處 理 部 之 1 1 處 理 室 可 Μ 對 基 板 施加一連貫 之 處 理 。另外 5 第 1多段處 1 訂 理 部 之 通 過 室 是 只 讓基板通過 之 室 9 掷 Άψ t 人 不 能 存 取 0 1 1 串 請 專 利 範 圍 第 2 4項之基板 處 理 裝 置是在 申 請 專 利 範 圍 1 I 第 23 項 之 装 置 中 使第2多段處理部具有用Μ進行基板之 1 1 搬 入 之 第 1搬運室和用Μ進行基板之搬出之第2 搬 運 室 〇 m λ 器 人 用 來 在 第 1多段處理部之處理室 第2多 段 處 理 部 之 處 i r 理 室 第 2多段處理部之第1搬 送 室 和第2多段處理部之 1 第 2搬蓮室之間 ,進行基板之移動 1 I 其 中 9 利 用 抛 m 器 人將被搬入 到 第 2多段處理部之第1 搬 運 1 1 室 之 基 板 f 移 動 到 第1和第2多 段 處 理 部之各 個 處 理 室 > 對 1 其 施 加 處 理 將 完 成各個處理 後 之 基 板移動 到 第 2多段處 1 1 理 部 之 第 2搬 里室藉Μ進行搬出 C? 1 1 申 請 專 利 範 圍 第 25項之基板 處 理 裝 置是在 申 請 專 利 範 園 1 1 第 23或 2 4項 之 裝 置 中,將注行 m 和 返 回線配 置 成 大 致 平 行 1 1 本紙張尺度適用中國國家標準(CNS ) Λ4規格(210X297公釐) ' -15 - A7 B7 經濟部中央標準局員工消費合作社印製 五、發明説明(13) 1 1 0 第 1多段處理部被包含在往行線和 E 丨線之一 -方。 第2 多 1 1 I 段 處 理 部 被 包 含 在 往 行 線 和 返 回 線 之 另 外 一 方 〇 m 器 人 被 1 1 I 設 置 成 鄰 接 第 1 fl ]第2多 段 處 理 部 9 可 Μ 對 第 1和 第2多 段 處 請 先 -ί··* 1 閱 I 理 部 之 處 理 室 和 搬 蓮 室 進 行 存 取 0 讀 面 其 中 t 例 如 在 將 第 1多段读 1理部配置在返回線和 1將第2 多 之 1 I 意 1 段 處 理 部 配 置 在 往 行 線 之 情 況 時 9 可 以 在 往 行 線 進 行 使 用 事 項 1 I 第 1和第2多 段 處 理 部 之 處 理 室 之 . 連 貫 之 處 理 t 另 外 . 方 再 填 避 第 寫 裝 面 在 返 回 線 被 搬 運 之 基 板 不 需 要 回 1多段處理部, 頁 1 可 Μ 通 過 第 1多段處理部之通過室。 另外, 因為布置成使 1 1 機 器 人 鄰 接 第 1和第2多 段 處 理 部 之 兩 個 處 理 部 , 所 K 不 需 1 1 要 機 器 人 之 水 平 移 動 f 機 器 人 利 用 旋 轉 就 可 對 該 兩 個 處 1 訂 1 I 理 部 進 行 存 取 0 甲 請 專 利 範 圍 第 26 項 之 基 板 處 理 裝 置 是 在 甲 m 專 利 範 圍 1 1 I 第 23 至 25 項 之 任 何 一 項 之 裝 置 中 使 第 1和第2 多 段 處 理 部 是 1 1 多 段 爐 包 含 有 加 熱 室 用 來 對 基 板 進 行 加 熱 0 ▲ 其 中 1 第 1和第2多 段 處 理 部 是 多 段 爐 假 如 使 該 等 接 近 1 | 時 f 可 Μ 將 計 測 器 和 懕 用 集 中 〇 1 L 申 請 專 利 範 圚 第 27 項 之 基 板 處 理 装 置 是 在 申 請 專 利 範 圍 1 I 1 第 2e >項 之 裝 置 中 更 具 備 有 洗 淨 處 理 部 〇 該 洗 淨 處 理 部 在 第 1 1和第2 多 段 處 理 部 之 處 理 室 之 處 理 之 前 9 用 來 對 基 板 施 加 1 包 含 有 洗 淨 處 理 之 處 理 0 1 | 其 中 > 在 對 基 板 施 加 洗 淨 處 理 之 後 利 用 多 段 爐 -y 第 1 1 | 和 第 2多段處理部用來進行加熱等之處理 〇 1 1 1 申 請 專 利 範 圍 第 28項 之 基 板 處 理 裝 置 是 在 串 請 專 利 範 圍 1 1 本紙張尺度適用中國國家標準(CNS ) Λ4規格(210X29?公釐) ,n 一 1 6 - A7 B7 五、發明説明(卜1) 第2 7項之裝置中,义淨處理部成為連續對被搬運之基板進 行處理之處理部。另外,第1和第2多段處理部之至少之一 方具有緩衝器室。媛衝器室是用Μ暫時保管基板之室,與 處理室,通過室,或搬蓮室依上下方向重疊。 其中,在洗淨處理部基板被連續的處理,為著緩和控制 之困難性,所Μ將緩衝器室設在第1和第2多段處理部之至 少之一方。緩衝器室被配置成與處理室、通過室,或搬運 室依上下方向重疊,不需要緩衝器室用之新的空間。 申請專利範圍第2 9項之基板處理裝置是在申請專利範圍 第25項之基板處理裝置中,使第1多段處理部和第2多段處 理部被配置成包夾機器人的互相面對。另外,該基板處理 裝置是在申請專利範圍第25項之基板處理裝置中,具備有 第3多段處理部,第4多段處理部,和第2機器人。第3多段 處理部是被包含在與往行線和返回線中之與第1多段處理 部相同之線之處理部,被設置成與第1多段處理部鄰接。 該第3多段處理部具有用Κ搬入基板之第1搬蓮室,用Κ搬 出基板之第2搬運室,和用Μ對基板施加處理之處理室, 經濟部中央標準局員工消費合作社印製 (請先閱讀背面之注意事項再填寫本頁) 依上下方向重疊。第4多段處理部是被包含在與往行線和 返回線中之與第2多段處理部相同線之處理部,被設置成 與第2多段處理部鄰接。第4多段處理部和第3多段處理部 被配置成互相面對。該第4多段處理部具有用以讓基板通 過之通過室和用Κ對基板施加處理之處理室形成依上下方 向重疊。第2機器人是與位於第1和第2多段處理部之間之 機器人分開設置之機器人,被設在第3和第4多段處理部之 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ 297公釐) ,。 -17 - A7 B7五、發明説明(U) 和 室 trnl 理 處 之 部 Ϊ: 理 處 段 多 4 第 和 3 第 對 可 人 器 機 2 第 該 ο 間 租 2 , 第 線用 行利 往, 在時 含況 包情 被之 部線 理回 處返 段在 多含 3包 被 取15部 存第理 行當處 進如段 室例多 運 , 搬中 個其 各 第 第 和 第 和 室器 1 理機 處用 個利 各和 之 , ">**> 31t § 理 理處 處之 段 貫 多連 fit 1 之 行 第進 HU 斤 至" 蓮線 搬行 板往 基在 將行 人進 器 K 機可 第 和 第進 到所 蓮線 搬回 板返 基在 將行 第 和 之 進第 Μ 之 可用 , 使 室未 理線 處行 個往 各在 之 。 部理 理處 處之 段 貫 多連 線 行 往 在 含 包 被 RH 咅 311 理 處 段 多 是基 但 Μ , 所 線, 回室 返過 在通 含有 包具 被別 部分 理部 處理 因板 第 之第 用Lfo 使L 未 線 回 (請先閲讀背面之注意事項再填寫本頁) 段處第 多段等 I多該 •L1 迴 迂 的 第面 等平 該要 在需 部 里 Ϊ 處 段 多 態 形 施 實 之 第明 和發 室 過 通 該 過 通 Μ 可 態 形 施 實 11 第 之 置 裝 理 處 板 基 之 明 發 本 示 表 施 實 11 第 /1· 態 形 施 實 經濟部中央標準局員工消費合作社印製 一程a 一汀I1R 進印可 K 0 J>影貞 可 顯 從 位 、 單 G 光 理15曝 處 個 : 布 曝 多 塗 有 豸接® 接連ii 連、>L·抗 是 ί 到 淨 洗 之 前 膜 布 塗塗 。 之劑 )-理触 態處抗 形 貫之 機 光 曝 有 接 連 置 置裝 裝像 理顯 處/ 板 基 水機 脫題 , 標 單位 淨單 洗乾 ’ 烘 2 -I 卩預 咅 器 ο t-is3 分V , 葺 有布 備塗 .凑、 - 1J劑 置蝕 裝抗 m: 理 ,。處20 行板位 進 基單 的該乾 續 烘 #~6® 之 4 之 90人部 位器理 單機處 乾轉個 烘旋各 後在在 和,板 , 外基 80S當 位。· 單 像 顯人 , 器 ο I 7 機 位轉部 單旋受 光和授 曝,有 緣部設 邊理傍 ; 處近 60個之 器 揮 緩 和 本紙張尺度適用中國國家標準(CNS ) Λ4規格(210 X 297公釐) I 士农 —i— I In In - HI ......-5-r-5JIn--- I .......- .....Iri - L·—— -- i I--- - *-· 18 - 經濟部中央標準局員工消費合作社印製 A7 B7Printed by the Consumers' Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs A7 B7 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a substrate processing apparatus that uses K to transport substrates, and performs continuous processing on the substrates by M. [Xi. Known Technology] In the manufacturing process of plasma substrates (FPD substrates) and semiconductor wafers used in liquid crystal display devices or plasma display devices, a substrate processing device is required to form a resist film on the surface of the substrate , And exposing / developing it. The substrate processing device is a device (unit line) capable of performing a continuous process by connecting a plurality of processing units. For example, in a photocopying process, a film coater / developer device is formed. By connecting the exposure machine *, the process from washing before resist application to resist application, exposure, and development can be continuously performed. Such a substrate processing apparatus is disclosed in a project bulletin (Patent No. 2519960). The substrate processing apparatus includes processing units such as a rotary cleaning unit (rotary coater), a spin coating unit (rotary coater), a rotary developing unit (rotary developer), a heating unit, an exposure machine, and the like. There is a conveying rack (lotus transfer robot) for loading and unloading substrates in each processing unit. Among them, a small holder holding a substrate is mounted on a conveying rack, and the conveying rack is moved horizontally to move between the processing sections, and the clamp is used to carry the substrate out / into each processing section. That is, the functions performed by the conveyor include the function of carrying substrates in / out of each processing section and the function of transferring substrates from one processing section to another processing section. [Problems to be Solved by the Invention] In the above-mentioned substrate processing apparatus, the substrate is used from a stack of substrates by a conveyor to apply the Chinese National Standard (CNS) A4 specification (210 × 297 mm) — -4-1 ': > ”-1 ---- install ------ order ------- Φ-^ --- f ./— \. (Please read the notes on the back before filling this page ) A7 B7 Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs. 5. Description of the invention (2) The processing department is transported to another processing department. 0 Therefore, when the conveyor moves in the horizontal direction, the surrounding gas will be disturbed and wind will be generated. The disturbance of the gas (wind) produces particles 9 which can easily cause contamination of the substrate and the various processing units ----- ..-especially-its-is in the most-near-in the future-meeting-requirements -Lie--Min--Inch--Compared to--One-year-Base-Board--Examples--such as ------------------ Handle lm diagonal or Iffl diagonal The size of the glass substrate 9 on the M will be caused if the conveyor moves in the horizontal direction. Add 0 to the amount of particle generation. In addition, in the substrate processing apparatus of the above, m rotation brushing and rotating imager are used for cleaning and development processing. However, when the size of the substrate becomes larger, the substrate is rotated by M. The required power needs to be increased by 9. Therefore, the cost of motors and the like will increase, and the cost of turning the rotating energy using M will also increase. On the other hand, the handling robot that uses M for substrate handling will also become high. The price will increase the cost when the number of units is increased. Therefore, it is necessary to find the appropriate treatment of the characteristics of each processing section of the KK. The monthly method and handling method can also reduce the cost. It can suppress the occurrence of particles during substrate processing and reduce the cost of substrate processing. Of the 9 substrate processing apparatuses, since a space 9 for moving the conveying rack and a space for receiving and receiving the substrates are needed, the planar space required for the installation of the substrate processing apparatus becomes larger. The substrate processing apparatus must be installed in a limited space. The space of the clean room 9 therefore takes up space. The problem of the room becomes an important issue. 0 The invention of the invention is to make the substrate processing device become a small device on the plane. 0 The paper size is applicable to the Chinese National Standard (CNS) Α4 specification. (2 丨 0 × 297mm) Please read the notes before reading-out before filling in this note. A7 B7 Printed by the Employees' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs. 5. Description of Inventions (3) [Means for Solving Problems] The scope of patent application One item is a substrate processing apparatus for moving a substrate to be processed and performing a continuous process on the substrate to be processed. It includes a plurality of rotary robots and a plurality of processing units. The rotary robot has a trunk and an arm. The trunk can rotate and cannot move in the horizontal direction. The arms extend from the trunk and hold the substrate to be processed. Rotating robots are used in each processing section to carry in and out substrates to be processed. Among them, a plurality of rotary robots that do not move in the horizontal direction are used to carry in / out substrates to be processed from each processing unit. Therefore, it is possible to suppress the problem of particles generated when the conveyance rack holding the substrate to be processed is moved at a high speed in the horizontal direction by using the conventional method. The particle generation amount can be reduced. Treatment department pollution. The substrate processing apparatus of the scope of patent application No. 2 is the apparatus of the scope of patent application No. 1 so that the plurality of processing units are one or more stationary processing units and one or more vane processing units. . The stationary processing unit is a processing unit that performs processing without moving the substrate to be processed. The blade processing unit is a processing unit including a process for moving a substrate to be processed. Among them, the processing suitable for processing without moving the substrate to be processed is performed by a static processing unit, and the processing including the process of moving the substrate to be processed is performed by a K blade processing unit. For example, heating / cooling processing, etc. are performed in a stationary processing unit, washing, coating liquid application, development, etc., and the processing is performed by a blade processing unit. In this way, by combining the blade type processing sections obtained by including multiple processes in the static processing section, the number of processing sections can be reduced, and the number of rotating robots can also be reduced. (CNS) Α4 specification (210 X 297 mm) (Please read the precautions on the back before filling out this page) Packing-6 __ β _ A7 B7 Printed by the Staff Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs ) 1 1 1 Space for placing 0 1 1 1 Essentially 9 Will the spin coating 9 be processed under reduced pressure and end face cleaning 1 in 1? ί? Called the coating unit 8! Unit 0 The coating unit is equipped with: 1 person unit and carry-out unit; and conveyor belt or slider 9 from the W input unit to the rotary back coating unit > minus Μ Note 1 of the dry processing part and the cleaned side, the processing part is used to move the substrate to be processed to the unloading part. In this way, matters 1 I f 1 Λ 9 Concentrated in one processing section, M can be used for simple and filling (written book), and the running cost and equipment cost are very low, such as conveyor belts, such as page 1 I instead of M rotating Zenm To-be-processed substrate 〇 In addition, when compared with the rotary type I 1 1 coating decompression drying 3 and end-face cleaning as separate processing sections 9 when a rotary robot is arranged between 1 1 3 processing sections It can be reduced to occupy 1 subscription space. 0 1 1 In addition, it can be easily used for brush cleaning and spray imaging, etc. when the substrate to be processed is enlarged by adding a blade type processing section. 1 1 1 Rotary processing methods such as rotary brushing and rotary imagers (of which, due to the damage to the substrate and the splashing of water during water washing, the particles occur at a rate of 1 m Hki. High 9 and it will cause cleaning and development characteristics Deterioration: Using method I of the present invention 9 It is possible to increase the cost of ItfP without increasing the cost of the substrate to be processed 0 1 I The substrate processing device in the scope of patent application No. 3 is a device in the scope of patent application 1 1 No. 2 In the case, the stationary processing unit is the same as the entrance unit, and the carrying-out unit is the same. The blade processing unit is different from the carrying-in unit and the carrying-out unit. W range 1 1 Item 1.g 3 of the device »More equipped with a receiving and receiving unit 0 This receiving and receiving unit 1 is arranged between the rotating robots 9 for receiving and receiving the substrate to be processed 0 1 1 Each paper size Applicable to Chinese National Standard (CMS) A4 specification (2ίOX 297 mm) A7 B7 V. Description of the invention (5) Among them, because the receiving and receiving section is provided, all the substrates to be processed can be temporarily waited there. Allows the receiving and receiving of the substrate to be processed, and can perform various moving control. In this way, effective processing of the substrate to be processed can be obtained, and the overall processing speed can be improved. The substrate processing apparatus in the scope of the patent application No. 5 is the apparatus in the scope of the patent application No. 4 in which the receiving and receiving unit has a first loading unit, a second loading unit, and a moving mechanism. The first loading section can be used to load a substrate to be processed. The second loading section is located above the first loading section and can be used to load the substrate to be processed. The moving mechanism moves the substrate to be processed from one of the first loading section and the second loading section to the other. Among them, it is possible to suppress the occupied space on the plane of the receiving and receiving part and strengthen the function of the receiving part as a buffer. In this way, the time adjustment of the processing department before and after the processing department of the granting and receiving department can be easily controlled. Printed by the Consumers' Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs (please read the precautions on the back before filling this page) The substrate processing device for the scope of patent application No. 6 is the device for scope of patent application No. 5 for the first loading section It becomes the 1st support member which can move up and down. The second loading section is a second support member that is movable horizontally. The moving mechanism includes a vertical movement mechanism for moving the first support member up and down, and a horizontal movement mechanism for moving the second support member in the horizontal direction. Among them, the substrate to be processed first loaded in the first loading section is lifted by the up-and-down movement mechanism to the height of the second loading section. Next, the second support member is horizontally moved to a position below which the second support member can be used to support the substrate to be processed by a horizontal movement mechanism. Then, the first supporting member is lowered, and then the paper size that can be supported and transported to the first loading section is adapted to the Chinese National Standard (CNS) A4 specification (210 × _297 mm) _ 〇_ A7 B7 V. Description of the invention (6) Status of other substrates to be processed. The substrate processing apparatus of the scope of patent application No. 7 is the apparatus of any one of the scope of patent applications of No. 1 to 6, so that the arm can be flexed and extended and moved up and down. Among them, the flexion and extension movement of the arm portion and the up-and-down movement are used to carry the substrate to be processed into and from each processing portion. The substrate processing apparatus of the scope of patent application No. 8 is the apparatus of any one of the scope of patent applications of 1 to 7 such that the plurality of processing units include a cleaning unit and a heating unit. The cleaning unit is used to clean the substrate to be processed. The heating unit is used to heat the substrate to be processed. In the device covered by this patent, the substrate to be processed can be cleaned and the substrate to be wetted by cleaning can be dried and dehydrated. In addition, the pre-baking process and the post-baking process can be performed. Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling out this page) The substrate processing device for the scope of patent application No. 9 is the device for the scope of patent application No. 8 for the multiple processing The part further includes a coating unit, an exposure unit, and a development unit. The coating unit is used to apply the coating liquid to the substrate to be processed. The exposure unit is used for exposing at least a part of the substrate to be processed to which the coating liquid is applied. The development unit is used to develop the processed substrate after exposure. In the substrate processing apparatus within the scope of this patent application, the substrate to be processed can be subjected to a continuous process of cleaning, coating liquid coating, exposure and development. The substrate processing device of the scope of the patent application No. 10 is the device of the patent application scope No. 8 or 9 of which the cleaning unit is provided with a handling device for carrying the substrate to be processed by K. The cleaning unit is equipped with a loading and unloading department with different positions. The paper size is applicable to the Chinese National Standard (CNS) Λ4 specification (_ 210X297 mm) _ 〇_ ~ 'V. Description of the invention (7) A7 B7 Board basis It is made to be in phase. The processing source is moved, and the board is moved into the base. Move to the clean lotus wash type isolator. Rotate the slippery or normal belt with a delivery force to clean the single-leaf net. Washing ’place Chinese style and its leaves are inserted into the moving parts from the leaf board based on the basic use of quilt. After WHI > 3 = management. The clean place is cleaned and the serial department is on the go. The base that moved into the board is cleaned by the quilt. It can be entered to clean the oxygen smell line. For example, when compared with LU fc, the treatment is as follows: leaves 0 and) °. The addition of the heat of the net cleansing at the place is added to the structure, and the cleansing cleansing water 6 LT Wei Xi and the other one are The empty position of the flat surface and the thermal efficiency department with the same single-phase phase heat up the moving parts and the moving parts. It is used for moving in and out. The shape of the stopper M Fang Jingsuo Γ) L— Θ is, b banli am base has ch reasonably negligible place ne (provided in the section room Fan Li specially Φ is installed in 3E physics board base 0 of The space between the provinces and the province 11 Fan Fanli is also specially designed to be transported by the construction department. The item with the single image display and the single cloth coating is used to make the item 9 installed. In the same way, there is a plate foundation for the lotus installation (please read the precautions on the back before filling this page). Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs. The position of the turn-by-turn rotation of a single-leaf type · A single link is like a single-line display and a single-line cloth with a carry on it. You can match it, 'In the Chinese style til, this is a continuous pair of 1 travel board base. The items such as the coating and coating of the substrate P 2 0 1 are used to wash the end of the surface. If you are dry and dry, please use the room in the K section of the application. The transporter. The machine stack and the heavy part are directed to the management. In the lower section, there is a room for equipment, and a room for shipping. The management department has the following principles: The movement of the board and the base of the board is the opposite of the room and the board of the office. The room and the board of the board are moved or entered to move the board machine The paper size for entry into the room applies Chinese National Standard (CNS) A4 specifications (7 丨 0X297 mm) A7 B7 Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention (η 1 1 1 The place where substrates are carried in or out by Μ is located at the machine 1 1 | Near the robot> Use this place to carry substrates 〇1 I Please J In contrast, in the present invention 9 In the present invention, 9 uses Μ for substrates The moving room where the first reading place is moved in or out overlaps the processing room. That is, > By arranging the moving room and the reading room on the back side so that they overlap each other, it is used by the conventional technology. 1 Moving in or moving outNote 1 I Note 1 1 The place (space) near the robot can be used for other hundreds of uses or matters. 1 I then 1 plus M omitted. If the space is reduced, the function and performance will not deteriorate. F Can be filled in % 本,) Installed to obtain a device that reduces the plane of the substrate processing device. 0 Page 1 I Φ The substrate processing device of the item 13 in the patent scope is in the device of _ 鹄 '% 则 面 暖 1 1 Item 12 Make the multi-stage processing section have as many as 11 overlapping processing chambers in the up and down direction. 1 1 Ordering because the lotus chamber and multiple processing chambers overlap in the up and down direction. 1 I can further improve the space efficiency. ≫ λ further To reduce the footprint of the substrate 1 I processing device 〇1 I | The substrate processing device in the scope of patent application No. 14 is among the devices in the scope of patent application No. 12 1 The transfer room is provided with a transfer device for transferring substrates by K. 1 1 Among them, f can be moved to multiple stages by using a lotus transfer device. I} The processing unit 9 and the multi-stage processing unit are moved. 1 The substrate processing device of 15 items is in the device of Patent Application No. 1 Item 12 > The robot has a substrate holding arm. The substrate holding 1 arm can move in the up-down direction> and can enter and exit m He Chu 1 1 Physics Room 0 1 | 1 of this robot uses a substrate holding arm to hold the substrate 9 and move the base 1 I board between the handling room and the processing room. 0 1 1 This paper size applies to Chinese National Standards (CNS) A4 specification (210X297mm) -11-Μ B7 V. Description of the invention (9) The substrate processing device for the 16th patent application scope is equipped with an additional processing department in the device for the 12th patent scopeThe other processing unit is adjacent to the multi-stage processing unit and is located at a position M substantially at the same height as the transfer room. Among them, since the transfer room of the other processing section and the multi-stage processing section are located at approximately the same height, the substrate transfer between the other processing section and the multi-stage processing section can be smoothly performed. For example, when moving the substrate where the multi-stage processing section is completed to the transfer room, only the lotus transfer device (such as a belt conveyor lotus transfer device or a slider transfer device) must be used for the lotus transfer of the adjacent processing units. Just move the substrate in parallel. The substrate processing apparatus of the scope of patent application No. 17 is the apparatus of the scope of patent application No. 12 of the apparatus, so that the multi-stage apparatus has a plurality of the above-mentioned transfer chambers. Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling out this page) Among them * Because there are #multiple moving rooms in the multi-stage processing department, it can be set up separately and moved into a dedicated handling room and Move out of the dedicated lotus room. In this way, one substrate can be moved to the multi-stage processing unit before the other substrate is moved out. In addition, even if the transport path of the processing unit before the multi-stage processing unit and the transport path of the processing unit after the multi-stage processing unit differ At this time, it is also possible to make a dedicated transport room for carrying in correspond to the transport path of the pre-processing section, and a dedicated transport room for carrying out correspond to the transport path of the post-processing section. In addition, by arranging a plurality of transfer chambers in a plurality of stages, it is possible to suppress an increase in space on the plane of the multi-stage processing section. The substrate processing apparatus of the scope of application for patent No. 18 is a device for continuously processing substrates by using M, and includes a plurality of processing sections and a robot. This multi-stage processing unit has a buffer chamber and a processing chamber that are re-screwed in the up-down direction. The punch chamber is a chamber in which substrates are temporarily stored. The processing chamber is used to process the paper on the substrate. The paper size applies the Chinese National Standard (CNS) A4 specification (210 × 297 mm) -12-A7 B7 Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention (K)) 1 1 The chamber is used to move the substrate between the buffer chamber and the processing chamber. 1 1 I In the conventional technology 9 Set the place where the substrate is temporarily stored in the MEMS device 1 1 Use the place near the person to absorb the processing time of each processing unit. Please read the difference. Read the back 1 1 and In the present invention, a buffer chamber is provided in the present invention as a place for temporarily protecting the surface of the 1 1 tube substrate 9 so that it overlaps with the processing chamber. That is, the buffer chamber and the intention 1 1 processing chamber are arranged into Overlay 9 The temporary storage base used by the conventional technology is 4% and the 1 board is installed in the place (space) near the robot. It can be used for other uses or added. Omit 0. If the space is reduced, the function and No deterioration in performance > 1 1 A device for reducing the plane of a substrate processing device can be obtained. 0 I 1 The substrate processing device in the 19th scope of the patent application is in the patent application. 1 In the device according to item 18, the m multi-stage processing section has an overlap in the vertical direction 1 1 multiple processing chambers 0 1 Among them, since the transfer room and the multiple processing chambers overlap in the vertical direction, 1 1 can further improve the process The efficiency can be further reduced by the space occupied by the substrate 1 processing device. 1 The substrate processing device of item No. M is requested; the substrate processing device of item No. 1 is used in the device of item No. 18 of the patent scope factory. m device room has multiple loading devices for loading substrates 1 load device 0 1 where t is because multiple load devices are installed in the buffer room 9 where Yuan 1 punch room can store multiple substrates 0 1 1 | Application The substrate processing device of the scope of the patent No. 21 is to use the robot in the device of the scope of the patent No. 1 1 to No. 18 The substrate holding arm 〇 The substrate holding 1 1 arm can move in the up and down direction, by M to enter and exit the yuan punch room and place 1 1 This paper size applies to Chinese National Standard (CNS) A4 specifications (2 丨 0X297 mm ) A7 B7 V. Description of invention (11) Management room. Among them, the robot uses a substrate holding arm to hold the substrate and to move the substrate between the buffer chamber and the pre-processing chamber. The substrate processing device with the scope of application for patent No. 22 is composed of My Green and the return line. It is used to transport the substrates at the specified positions to each processing unit. After a continuous process, the substrates are forced to return to the specified positions. This substrate processing apparatus includes a first multi-stage processing unit and a robot. The first multi-stage processing section is included in the forward line or the return line, and has a passing chamber and a processing chamber overlapping in the vertical direction. The passing chamber is a chamber through which the substrate is passed. The processing chamber is a chamber for processing a substrate. The robot is used to move the substrate to the processing room of the first multi-stage processing section. Printed by the Consumers' Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs (please read the precautions on the back before filling this page) The substrate processing device has a forward line and a return line, which are used to return the substrate after the completion of the processing to the original place . In the case of such a device, in the arrangement or the relationship of related equipment collection of similar processing departments, the processing department used for processing to the line is arranged on the way back to the line, and The processing department used for processing the return line is arranged on the way. In such an arrangement, the moving substrate of the processing section can be avoided. This avoidance is performed using a combination of a rotary robot and a receiving and receiving unit, and a robot moving on a plane. In contrast, in the present invention, the first multi-stage processing unit is provided so that the passing chamber and the processing chamber overlap each other in the up-down direction. When processing the forward line, the substrate transferred on the return line does not need to avoid the first multi-stage processing section, and can pass through the passing chamber. In this way, it is used to avoid the application of the Chinese National Standard (CNS) A4 specification (210 × 297 mm) of this paper size. I ~~ " _ A7 B7 Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 12) 1 1 1 1 The steps related to the handling of the substrate in the multi-stage processing section can be saved 1¾, which can reduce the cost and handling time of the device. ^ 1 1 The patent processing device of the patent scope No. 23 is in Φ Please the patent scope please read Λ I. The equipment of No. 22 has a second multi-stage processing section. The second multi-stage processing section reads back 1 side I is included in the forward line or return line. It has a moving room and a processing room in the upper and lower direction 1 1 and 1 I overlap. The moving room is used to carry in or out the substrate. The chamber 0 processing box 1 and the chamber 1 are chambers for applying processing to the substrate. The robot is used for the first multi-stage processing.} Loading and processing the processing room of the second multi-stage processing department and the second multi-stage processing page. --- r 1 I Move the substrate between the lotus chambers. 1 1 I Among them, the user's access is used, and the 11 processing rooms of the multi-stage processing section 1 and 2 can be used to apply a consistent processing to the substrate. In addition, the first pass of the first paragraph 1 is the pass-through chamber of the ordering department. The pass-through chamber is only the pass-through of the substrate. 9 Can not be accessed by people. 0 1 1 The substrate processing device that is subject to the patent scope No. 2 is in the scope of patent application 1 I In the device of item 23, the second multi-stage processing unit is provided with a 1st carrying room for carrying out the substrate 1 using M and a second carrying room for carrying out the substrate carrying out using the substrate 0m λ The handler is used for processing in the first multistage The processing room of the second multi-stage processing section of the department is to move the substrate between the first transfer room of the second multi-stage processing section and the second transfer chamber of the second multi-stage processing section. m The robot will move the substrates that are moved into the first multi-stage processing section of the second multi-stage processing section. 1 Move the substrates in the first and second multi-stage processing sections to the processing chambers of the first and second multi-stage processing sections. Move to the second multi-stage section 1 1 The second moving room of the management department is moved out by C? 1 1 The scope of patent application is 25 The substrate processing device is the device for applying patent No. 1 1 item 23 or 24. The injection line m and the return line are arranged approximately parallel. 1 1 This paper size applies the Chinese National Standard (CNS) Λ4 specification (210X297). (%) '-15-A7 B7 Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention (13) 1 1 0 The first multi-stage processing section is included in one of the forward line and the E line. The second multi-stage 1 I processing unit is included on the other side of the forward line and the return line. The robot is installed 1 1 I adjacent to the first fl.] The second multi-stage processing unit 9 may be the first and second stages. For multiple sections, please first. Ί · * 1 Please read the processing room and the lotus room of the Department of Management for access. 0 Reading the surface t. For example, when the first section of the first section is placed on the return line and the first section is the second section. 1 I It means that the 1st stage processing section is arranged in the forward line 9 The use items can be carried out in the forward line 1 I The processing room of the first and second multistage processing section. Consecutive processing t In addition. The substrates on which the writing surface is transported on the return line do not need to return to the multi-stage processing section. Page 1 can pass through the passage of the first multi-stage processing section. In addition, because the 1 1 robot is arranged adjacent to the two processing sections of the first and second multi-stage processing sections, no K 1 is required. 1 The horizontal movement of the robot is required. F The robot can use rotation to order 1 The processing department performs access 0 A The substrate processing device of the 26th patent scope is the first and second multistage processing units of the 1st I to 23th to 25th of the patent scope 1 1 I The multi-stage furnace contains a heating chamber for heating the substrate. 0 ▲ Among them, the first and second multi-stage processing sections are multi-stage furnaces. If these are close to 1 The substrate processing device of item 27 in the patent application is further equipped with a cleaning processing section in the device of the scope of application for patents 1 I 1 2e > The processing of the cleaning processing section in the first and second multi-stage processing sections Murano Before the process 9 is used to apply 1 to the substrate including the cleaning process 0 1 | where > After applying the cleaning process to the substrate, a multi-stage furnace -y 1 1 | and the second multi-stage processing unit are used for heating, etc. Processing 〇1 1 1 The patent application scope of the substrate processing device is in the range of patent application 1 1 This paper size applies Chinese National Standard (CNS) Λ4 specifications (210X29? Mm), n 1 16-A7 B7 V. Description of the Invention (b. 1) In the device of item 27, the Yijing processing section becomes a processing section that continuously processes the substrate being transferred. In addition, at least one of the first and second multi-stage processing units has a buffer chamber. The yuan punch chamber is a chamber in which substrates are temporarily stored by M and overlaps with the processing chamber, the passing chamber, or the lotus chamber in the vertical direction. Among them, the substrate is continuously processed in the cleaning processing section. In order to ease the difficulty of control, the buffer chamber is provided in at least one of the first and second multi-stage processing sections. The buffer chamber is arranged to overlap the processing chamber, the passing chamber, or the transfer chamber in the up-down direction, and a new space for the buffer chamber is not required. In the substrate processing apparatus of the scope of patent application No. 29, in the substrate processing apparatus of the scope of patent application No. 25, the first multi-stage processing section and the second multi-stage processing section are arranged so as to face each other by the sandwich robot. The substrate processing apparatus is a substrate processing apparatus with a scope of application for patent No. 25, and includes a third multi-stage processing unit, a fourth multi-stage processing unit, and a second robot. The third multi-stage processing unit is a processing unit included in the same line as the first multi-stage processing unit in the forward and return lines, and is provided adjacent to the first multi-stage processing unit. The third multi-stage processing unit includes a first transfer chamber for carrying a substrate into K, a second transfer chamber for carrying a substrate through K, and a processing chamber for processing a substrate with M. It is printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs ( (Please read the notes on the back before filling out this page) The fourth multi-stage processing unit is a processing unit included in the same line as the second multi-stage processing unit in the forward line and the return line, and is disposed adjacent to the second multi-stage processing unit. The fourth multi-stage processing unit and the third multi-stage processing unit are arranged to face each other. The fourth multi-stage processing unit has a passing chamber for passing the substrate and a processing chamber for processing the substrate with K to form a top-to-bottom overlap. The second robot is a robot installed separately from the robot located between the first and second multi-stage processing units. The paper size set in the third and fourth multi-stage processing units is subject to the Chinese National Standard (CNS) Α4 specification (210 × 297). Mm),. -17-A7 B7 V. Description of the invention (U) and the trnl department of the processing department: The processing department has 4 more sections and 3 the second pair of human-machine machines 2 the ο the rent 2, the line is profitable, In the case of the case, the Ministry of Circulation will return to the section, and 15 sections will be taken for more than 3 packages. The depository will be transferred to the same place as the office. It will be moved to the first and the first room and the machine room. With a Ricoh, " > ** > 31t § Reasonable paragraphs of Duan Duolian fit 1 trip to Jin Hu Jin " lotus line moving board to the base of the pedestrian machine K machine But the first and second to the Soren line can be moved back to the board to return to the base. The first and second line of the line M can be used, so that the room has no line to go to the line. The sections of the Ministry of Management are connected to the RH 咅 311. The sections of the Ministry of Management are mostly Gdan M, So, and back to the room. Use Lfo to make L not return (please read the precautions on the back before filling this page) The first paragraph of the paragraph should be equal to the number of lines. • The first side of the L1 circuit should be equal to the polymorphism in the required section. The implementation of the implementation of the implementation of the implementation of the implementation of the pass through the modal can be implemented 11 implementation of the installation of the board of the Mingfa implementation of this display form 11 implementation of the implementation of the first / 1 / implementation of the Ministry of Economic Affairs Central Standards Bureau employees Consumption cooperative prints a ride a Yiting I1R into printing can be K 0 J > Yingzheng can show the position, single G optics 15 exposures: cloth exposure is mostly coated with 豸 接 ® Successive ii succession, > L · Yes ί Apply the film cloth before cleaning. Agent) -The machine is resistant to form and penetration at the tactile position. It has a series of installations, such as a physical display and a board-based water machine. The unit is cleaned and dried. Bake 2 -I 卩 prepare device ο t-is3 Divided into V, there is a cloth to apply. Make up,-1J agent corrosion resistance equipment m: treatment. The 20-board board enters the basic baking sheet for this continuous baking # ~ 6® of 4 of 90 people. The machine is stand-alone, and each of the baking sheets is turned on the baking sheet, and then it is placed on the board, and the outer base is 80S. · Single image display, device ο I 7 The single-rotation unit of the camera is exposed to light and exposure, and the edge part is set up. The number of devices near 60 is gentle and the paper standard is applicable to Chinese National Standard (CNS) Λ4 specification (210 X 297 mm) I Shi Nong—i— I In In-HI ......- 5-r-5JIn --- I .......- ..... Iri-L · — —-I I ----*-· 18-Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7

五、發明説明( IfJ 進行授受時作為授受場所或暫時之等待場所。基板處理裝 置1是單卡匣方式,從被裝載在分度器部2之卡匣3之中取 出要被處理之玻璃基板(Μ下簡稱為基板)將其送出到各個 處理部,完成各個處理工程後之基板被收納在相同之卡匣 3。從卡匣3取出和收納到卡匣3之進行是利用分度器機器 人2 a,具備有用Κ保持基板之可旋轉之臂可Μ沿著卡匣3 之列移動。 洗淨單位1 0是葉片式之處理部,由搬入部1 1,U V臭氧洗 淨部1 2,水洗部1 3,液滴除去部1 4,和搬出部1 5所構成。 從搬入部1 1到搬出部1 5利用輸送帶搬蓮基板藉Μ進行洗淨 。另外,該輸送帶採用與清潔室內對應之發塵性很小之滾 筒輸送帶。 ' 脫水烘乾單位20是葉片式處理部,由搬人部21,加熱部 2 2,密著強化處理部2 3,和冷卻部2 4所構成。從搬入部2 1 到冷卻部2 4具有多個手柄用來將基板順序的搬運到鄰接之 處理部,利用所謂之間歇移送裝置用來搬運基板。 抗蝕劑塗布單位3 0是葉片式處理部,由搬入部3 1旋轉塗 膜剖32,減壓乾燥部33,邊緣沖洗部34和搬出部35所構成 。從搬人部3 1到搬出部3 5,利用與脫水烘乾單位2 0同樣之 間歇移送裝置用來搬蓮基板。 預烘乾單位40是堆積有多段之靜止式處理部者*由多個 加熱部和冷卻部所構成。 顯像單位8 0是葉片式處理部,由搬入部8 1,顯像部82, 水洗乾燥部8 3,和搬出部8 4所構成。從搬入部8 1到搬出部 本紙張尺度適用中國國家標準(CNS ) Α4規格(210 X 297公釐) ^ ^ -19- (請先閲讀背面之注意事項再填寫本頁) ---、-裝--- ---—‘---Γ— A7 B7 五、發明説明(丨7) 84利用輸送帶用來搬運基板。 後烘乾單位9 0是葉片式處理部,由搬入部9 1,加熱部9 2 ,冷卻部93,和搬出部94所構成。從搬入部91到搬出部94 利用間散移送裝置用來搬蓮基板。 旋轉機器人4〜6是所謂之群集型之機器人,未具有利用 旋轉依水平方向移動之機構。該旋轉機器人4〜6分別具有 :軀幹部,被設置在地板,可Μ進行旋轉和升降;和2個 臂部,在從軀幹部延伸之前端部份,可Μ用來保持基板。 例如,旋轉機器人5具有軀幹部5 a和臂部5 b。另外,該2個 臂部可Μ獨立的伸屈和上下移動。旋轉機器人4〜6對於重 疊多段之各個處理部和授受部*進行面對之旋轉和升降之 動作,利用臂部之進退和上下移動用來進行基板之變換或 授之動作,藉Κ搬蓮基板。 下面將順序的說明利用基板處理裝置1之基板之處理。 經濟、部央標準局員工消費合作社印製 在分度器部2,將利用分度器機器人2a從卡匣3中取出之 基板搬移到洗淨單位1 0之搬入部11。基板從搬入部11被搬 運到ϋ V臭氧洗淨部1 2,在該處利用紫外線之照射用來使表 面之有機污染物氧化分解藉Μ將其除去。然後,對於利用 輸送帶搬運到水洗部1 3之基板,在水洗部1 3,對其進行利 用滾筒刷之刷洗洗淨,超音波噴霧洗淨,和利用高壓噴射 噴霧之純水之洗淨。另外,此處之洗淨亦可Μ使用鹼性洗 淨液等進行處理。然後,在液滴除去部1 4,利用空氣刀用 來使殘留在基板表面之純水之液滴飛散。 在洗淨單位1 0完成處理後被移送到搬出部1 5之基板,經 20 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ 297公釐) A7 B7 五、發明説明(丨8) 由輸送帶被搬運到脫水烘乾單位20之搬入部21,然後被間 歇移送裝置搬運到加熱部22,被熱板加熱,接受除去水分 之處理。其次利用間歇移送裝置將基板搬蓮到下一個之加 熱部2 2,對其施加相同之加熱處理。用來獲得充分之加熱 時間。其次,利用間歇移送裝置將基板搬運到密著強化處 理部2 3。在密著強化處理部2 3為著達到提高抗蝕劑膜和基 板之密著性之目的,對基板施加加熱,塗布蒸氣狀之HMDS (六甲撐二名t氨烷)。然後,再將基板搬運到冷郤部24,利 用冷板加Μ冷卻。利用這種方式,進行過抗蝕劑塗布處理 之前處理之脫水烘乾之基板,被搬蓮到抗蝕劑塗布單位30 之搬入部31 〇 經濟部中央標準局員工消費合作社印製 (請先鬩讀背面之注意事項再填寫本頁) 在抗蝕劑塗布單位30,苜先利用間歇移動裝置之滑動器 將基板搬運到旋轉塗膜部32,然後對基板進行抗蝕劑(塗 布液)之塗布。另外,該滑動器是指使基板之位置依一方 向滑動之裝置,例如利用矩形運動使基板之位置在某一個 方向滑動指定之距離。該旋轉塗膜部32由抗蝕劑供給糸統 ,旋轉馬達,杯物等所構成,使抗蝕劑滴下到水平之基板 上,利用基板之旋轉用來在基板上形成均一之抗蝕劑膜。 將形成有抗蝕劑膜之基板搬運到減壓乾燥部3 3,對其進行 減壓烘乾。其中,對裝人有基板之空間進行減壓,Μ低溫 進行烘乾用來抑制抗蝕劑膜之感度降低。然後,將基板移 動到邊緣沖洗部3 4。在該邊緣沖洗部3 4利用溶劑進行除去 基板表面之周邊和端面部份之抗蝕劑之處理,用來防止基 板端面之抗蝕劑膜之剝落和產生灰塵。完成該等與抗蝕劑 本纸張尺度適用中國國家標準(CNS ) Α4規格(21〇Χ297公釐) A7 B7 五、發明詳明(〗9) 塗布有關之各個處理後之基板,被搬蓮到搬出部3 5。 利用另外一個滑動器從搬出部35被搬運到與該搬出部35 鄰接之授受部7之基板,經由旋轉機器人4被移送到預烘乾 單位4 0。在該預烘乾單位4 0進行熱處理用來達成基板上之 抗蝕劑膜中之殘留溶劑之蒸發和強化基板之密著性之目的 。在此處,對於一室之各個加熱部和冷卻部,利用旋轉機 器人4用來順序的進行基板之搬入和搬出。如此一來,施 加過加熱處理和冷卻處理之基板,經由旋轉機器人5和6, 和接受部7,被移送到與旋轉機器人6鄰接之緩衝器8。 基板被旋轉機器人6從緩衝器8移送到曝光機50,和施加 曝光處理。實質上是對基板上之抗蝕劑施加感光(感測)原 圖上之圖型之處理。曝光後之墓板由旋轉機器人6従曝光 機50之中將其取出,將其從緩衝器8移送到旋轉機器人5、 6之間之授受部7。 經濟部中央標準局負工消費合作社印製 (請先閱讀背面之注意事項再填寫本頁) 其次,利用旋轉機器人5將基板移送到標題機6 0 邊緣 曝光單位7 0,分別進行印字燒附和邊緣曝光。邊緣曝光是 除了基板上之顯示部外,除去基板周邊之抗蝕劑之曝光處 理。此處是在該位置配置邊緣暘光部,但是亦可Μ依照需 要在該處配置背面曝光部。完成該等處理後之基板,從旋 轉機器人4、5之間之授受份7被移送到與該搬出部35鄰接之 授受部7,利用滑動器將其裝載在輸送帶7 9。然後,將基 板從輸送帶7 9搬運到顯像單位8 0之搬入部8 1。 在顯示單位8 0,利用輸送帶將基板從搬人部8 1搬運到搬 出部8 4。然後,在顯像部8 2利用噴嘴將噴霧狀之顯像液, 本紙張尺度適用中國國家標隼(CNS ) Α4規格(210Χ297公釐) -22 - A7 B7 五、發明説明(20) Μ噴流狀施加在基板表面藉Μ進行噴霧顯像。此處之顯像 之進行亦可Μ採用葉片顯像。在水洗乾燥部,對顯像後之 基板進行洗淨和乾燥。完成該等處理後之基板從搬出部8 4 被移送到烘乾單位9 0之搬入部9 1。 在後烘乾單位9 0經由蒸發除去殘留在基板上之抗蝕劑膜 中或表面之顯像液和沖洗液,進行熱處理用來達成抗蝕劑 之硬化和強化與基板之密著性之目的。實質上,利用加熱 部92之熱板對基板進行加熱,和利用冷卻部93之冷板對基 板進行冷卻。在此處亦可Κ將加熱部92和冷卻部93設置成 具有多個,用來獲得充分之加熱時間和冷卻時間。施加過 該等處理之基板被移送到搬出部94,利用分度器機器人2a 將其收容在原來之卡匣3。 在此處利用不依水平方向移動之多個旋轉機器人4〜6用 進行對各個處理部(單位)之基板之搬入/搬出。因此,不 會有如同習知方式之因為保持基板之搬運機器人依水平方 向Μ高速移動長距離而產生粒子,可K減少粒子之產生量 ,藉Μ減少基板和各個處理部之污染。 經濟部中央標準局員工消費合作社印製 (請先閎讀背面之注意事項再填寫本頁) 另外,在此處Μ靜止式之單位進行預烘乾處理(可Μ不 移動基板的進行處理),當包含使基板移動之工程時Μ葉 片式之單位進行其他之處理,經由在此種靜止式之單位, 組合包含多個處理之葉片式之單位,可Κ用來減少單位之 數目和旋轉機器人之數目。另外,經由裝入葉Η式之單位 ,不採用旋轉式之處理方法(此種方法在基板之大型化之 情況時會造成基板之破損,和會由於水洗時之水之飛濺使 本纸張又度適用中國國家標準(CNS ) Α4規格(210Χ 297公釐) -23 - 經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明(21) 產生粒子之機率變高,而且會使洗淨特性和顯像特性劣化 ),例如旋轉刷洗旋轉顯像,可Μ採用特性優良之刷子刷 洗或噴霧顯像,利用這種方式,基板處理裝置1可Μ因應 大型化之基板,例如對角1 hi Μ上之大型之玻璃基板。 下面將參照圖2〜圖4用來說明接受部7之構造。 授受部7是由上下梢(第1支持構件)7a,橫動梢(第2支持 構件)7b,圖中未顯示之上下移動機構和水平移動機構所 構成之單位構造,上下2段重疊的配置2組而形成。上下梢 7a是用Μ支持基板y之多個梢,利用上移動機構用來進行 上下移動。橫動梢7b是用Μ支持基板W之多個梢,利用水 平機構用來進行水平方尙之移動。 被搬運到授受部7之一方之單位構造之基板W,首先被裝 載在上下梢7a上(參照圖2)。在該處上下梢7a進行下降, 基板W位於授受部7之該單位構造之位置P 1。如圖2所示, 當基板W被裝載在上下梢7a上時,上下梢7a進行上升變成 如圖3所示之狀態。這時基板W位於橫動梢7b之上面之位置 P 2。然後,從該狀態使横動梢7 b移動到內側,在Μ横動梢 7b支持基板W之後,使上下梢7a下降到原來之位置(參照圖 4)。利用這種方式,授受部7之各個單位構造使基板W在位 置P 2等待,而且在位置P 1變成可以接受其他之棊板。亦即 ,授受部7經由將此種單位構造之2組配置成上下2段的重 疊,在基板之一片部份之平面空間,可Μ使4片基板成為 等待狀態。利用這種方式,例如鄰接搬出部3 5之授受部7 ,可Μ將各個單位構造分別分配給從搬出部3 5朝向預烘乾 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X297公釐) . 一 24 - (請先閲讀背面之注意事項再填寫本頁) :裝— ,1Τ vm m In tut ml 1©1_——L--- 經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明(,2 2) 單位40搬運之基板,和在曝光後從旋轉機器人4朝向輸送 帶79搬運之基板,可Μ分別保持2片之基板成為等待狀態 ,在基板處理裝置1可Μ很容易控制授受部7之前工程側之 處理部和後工程側處理部之時間之調整。 [第2實施形態] 圖5表示本發明之基板處理裝置之一實施形態(第2實施 形態)。基板處理裝置101是可Μ進行與第1實施形態之基 板處理裝置1大致相同之處理之裝置。另外,在Κ下之說 明中其與第1實施形態相同或同樣之部份附加相同之符號 。另外*與第1S施形態相同或同樣之部份之說明加以省 略。 基板處理裝置101具備有分度器部2,洗淨單位110,脫 水烘乾單位120,抗蝕劑塗布軍位130,預烘乾單位140, 標題機1 6 0,邊緣曝光單位17 0,顯像單位1 8 0和後烘乾單 位190之各個處理部,及旋轉機器人104〜108。另外,在 旋轉機器人104〜108之近傍配置有授受部7和緩衝器8。 洗淨單位1 1 0是葉片式之處理部,由搬入部111,水洗部 11 3,液滴除去部11 4,和搬出部11 5所構成。從搬入部111 到搬出部U 5利用輸送帶用來搬運基板。 脫水烘乾單位120是堆積多段之靜止式之處理部所形成 者,由多個加熱部,密著強化處理部,和冷卻部所構成。 抗蝕劑塗布單位1 3 0和預烘乾單位1 4 0與第1實施形態之 抗蝕劑塗布單位3 0和預烘乾單位4 0相同。 顯像單位1 8 0是葉片式之處理部,由搬入部1 δ 1,顯像部 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ 297公釐) -2 5 — (請先閎讀背面之注意事項再填寫本頁) 一裝. 訂 •I· A7 B7 經濟部中央標準局員工消費合作社印製 五、發明説明( 23) 1 δ 2,水洗部1 8 3,乾燥部1 8 4,和搬出部1 8 5所構成。從搬 入部1 8 1到搬出部1 8 5利用輸送帶用來搬運基板。 後烘乾單位1 90是堆積多段之靜止式之處理部所形成者 ,由多個加熱部和冷卻部所構成。 旋轉機器人104〜108與第1實施形態之旋轉機器人4〜6 相同。 下面將順序的說明利用基板處理裝置1 0 1之基板處理。 在分度器部2,利用分度器機器人2a從卡匣3中取出之基 板,被裝載在與分度器部2鄰接之授受部7,利用滑動器將 其移送到洗淨翬位11 0之搬入部1 11。基板從搬入部111被 搬蓮到水洗部11 3,在水洗部11 3,進行利用滾筒刷之刷洗 洗淨,超音波噴霧洗淨,和利用高壓噴射噴霧之純水之洗 淨。然後,在液滴除去部11 4利用空氣刀使殘留在基板表 面之純水之液滴飛散。另外,在此處不進行UV臭氧洗淨, 但是假如在與分度器部2鄰接之授受部7之位置配置UV臭氧 洗淨部時,則在分度器機器人2 a經由進行將基板搬運到ϋ V 臭氧洗淨部和從U V臭氧洗淨部搬蓮到搬入部111,可Μ用 來進行UV臭氧洗淨。 在洗淨單位11 0完成處理之被移送到搬出部1 1 5之基板, 被滑動器更進一步的移送到與搬出部11 5鄰接::Τ授爱部7, 利用旋轉機器人1 0 4,1 0 5搬入到脫水烘乾單位1 2 0。脫水 烘乾單位1 2 0之各個處理(加熱、密著強化、冷卻)分別採 用一室方式,1個處理完成後利用旋轉機器人1 0 5將基板移 送到下一個之處理。完成該等脫水烘乾後之基板,經由旋 本紙張尺度適用中_國國家標準(CNS ) A4規格(210X 297公釐) (請先鬩讀背面之注意事項再填寫本頁) -裝. 訂 .0 -26 - A7 B7 五、發明説明(24) 轉機器人105被移送到與抗蝕劑塗布單位130之搬入部131 鄰接之授受部7。從與搬人部1 3 1鄰接之授受部7到搬入部 13 1是利用滑動器用來搬蓮基板。在抗蝕劑塗布單位130對 基板進行與第1實施形態相同之有關抗蝕劑塗布之各種處 理。 利用滑動器從搬出部1 3 5被搬蓮到與該搬出部1 3 5鄰接之 授受部7之基板,被旋轉機器人106更進一步的移送到預烘 乾單泣1 40。完成預烘乾後之基板經由旋轉機器人1 06,旋 轉機器人107,和旋轉機器人108被移送到鄰接之緩衝器8 。然後,利用旋轉機器人108將基板従緩衝器δ移送到曝光 機50,對該基板晦加曝光處理。完成曝光處理後之基板, 由旋轉機器人108從曝光機50之中將其取出,和收納在緩 衝器8。然後移送到旋轉機器人107、10S之間之授受部7。 經濟部中央標準局員工消費合作社印製 (請先閱讀背面之注意事項再填寫本頁) 然後,完成標題機6 0和邊緣曝光單位7 0之處理之基板, 從旋轉機器人1 0 6、1 0 7之間之授受部7被移送到與搬出部 1 3 5鄰接之授受部7,利用滑動器移送到顯像單位1 8 0之搬 入部1 8 1。在顯像單位1 8 0,利用輸送帶將基板從搬入部 1 8 1搬運到搬出部1 8 5。在顯像部1 8 2,水洗部1 δ 3,和乾燥 部1 δ 4被施加過與顯像有關之各個處理之基板,被滑動器 將其從搬出部1 8 5移送到與搬出部1 8 5鄰接之授受部7。 被裝載在與搬出部1 8 5鄰接之授受部7之基板,經由授受 部7被旋轉機器人1 0 5、1 0 4搬入到後烘乾單位1 9 0。在該後 烘乾單位1 9 0完成熱處理後之基板,從與旋轉機器人1 0 4鄰 接之授受部7被移送到輸送帶1 9 9,搬運到可Μ利用分度器 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X 297公釐) A7 B7 五、發明説明(25) 機器人2 a取出之位置。然後,利用分度器機器人2 a使基板 被收容在原來之卡匣3。 在此處亦與第1實施形態之基板處理裝置1同樣的,利用 不會依水平方向移動之多個旋轉機器人104〜108用來進行 對各個處理部(單位)之基板搬入/搬出。因此,不會有如 同習知方式之因為保持基板之搬運機器人依水平方向K高 速移動長距離而產生粒子,可Μ減少粒子之產生量,藉Μ 減少基板和各個處理部之污染。 另外,在此處Κ靜止式之單位進行預烘乾處理(可Μ不 移動基板的進行處理),和對於脫水烘.乾處理和後烘乾處 理 > 亦Μ靜止式之單位進行。另外,脫水烘乾單位和後烘 乾單位成為多段構造,當與第1實施形態之基板處理裝置1 比較時,可Μ節省平面之空間。另外,例如在脫水烘乾單 位1 2 0和後烘乾單位1 9 0之間存在有空間,經由在此種場所 配置抗蝕劑液或沖洗疲之槽或控制裝置,可Κ有效的利用 空間。 [第3實施形態] 經濟部中央標準局員工消費合作社印製 (請先閲讀背面之注意事項再填寫本頁) 圖6表示本發明之基板處理裝置之一實施形態(第3實施 形態)。基板處理裝置201是去除第2實施形態之基板處理 裝置101中之標題機160和邊緣曝光單位170所形成之裝置 。除了省略該標題機1 6 0和邊緣曝光單位1 7 0所進行之處理 外,其他部份均與第2實施形態相同。 [第4實施形態] 圖7表示本發明之基板處理裝置之一簧施形態(第4實施 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ 297公釐) A7 B7 五、發明説明(2β) 形態)。基板處理装置3 0 1是變化第2實施形態中之基板處 理裝置1 0 1之沿著長度方向延伸之洗淨單位11 0 (參照圖5 ) 之配置所形成者。實質上,該基板處理裝置301是在基板 處理裝置1 0 1之配置有洗淨單位11 0,輸送帶1 99,和該等 之間之授受部7之場所,配置洗淨單位3 1 0使其沿署與裝置 之長度方向正交之方向延伸,將授受部7配置在洗淨單位 310之上部。利用這種方式使基板處理裝置301之長度方向 之尺寸比基板處理裝置101之長度方向之尺寸短。 該基板處理裝置3 0 1具備有分度器部2,洗淨單位3 1 0, 脫水烘乾單位3 2 0,抗蝕劑塗布單位3 3 0,預烘乾單位3 4 0 ,標題機360,邊緣曝光單位370,顯像單位380,和後供 乾單位390之各個處理部,及旋轉機器人304〜308。另外 ,在旋轉機器人304〜308之近傍設有授受部7和緩衝器8。 洗淨單位3 1 0是葉片式之處理部,沿著基板處理裝置3 0 1 之長度方向之正交方向延伸,由搬入部311,水洗部313, 和搬出部3 1 5所構成。從搬入部3 11到搬出部3 1 5,利用輸 送帶用來搬蓮基板。 經濟部中央標準局員工消費合作社印製 對於脫水烘乾單位320,抗蝕劑塗布單位3 3 0,預烘乾單 位3 40,顯像單位3 8 0,後烘乾單位390,旋轉機器人304〜 3 08,和授受部7,所具有之構造與第2實施形態之脫水烘 乾單位1 2 0,抗蝕劑塗布單位1 3 0,預烘乾單位1 4 0,顯像 單位1 8 0,後烘乾單位1 9 0,旋轉機器人].0 4〜1 0 8,和授受 部7之構造相同。 下面將順序的說明該基板處理裝置3 0 1所進行之基板之 29 (請先閣讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) Α4現格(2丨0 X 297公釐) A7 B7 五、發明説明(27) 處理。 在分度器部2,利用分度器機器人2a從卡匣3中取出之基 板,將其移送到洗淨單位3 1 0之搬入部3 11。基板從搬入部 3 11被搬運到水洗部31 3,在水洗部3 1 3進行洗淨和液滴除 去處理。完成洗淨單位3 1 0之處理後之被移送到搬出部3 1 5 之基板,更進一步的被分度器機器人23移送到洗淨單位 310之上部之授受部7,利用旋轉機器人304、305搬入到脫 水烘乾單位320。 從脫水烘乾單位320到後烘乾單位390之工程與第2實施 形態之從脫水烘乾單位1 2 0到後烘乾單位1 9 0之工程相同。 在後烘乾單位390完成熱處理後之基板,被旋轉機器人. 3 0 4移送到洗淨單位3 1 0之上部之授受部7。然後,利用分 度器機器人2a將基板收容在原來之卡匣3。 經濟部中央標準局員工消費合作社印製 (請先閱讀背面之注意事項再填寫本頁) 另外,在上述之實施形態中,預烘乾單位40、140、340 是3個加熱部,被設置成用來對1片之基板施加加熱處理, 藉Μ在每一片基板獲得充分之加熱時間。另外,對於加熱 後之基板,為著獲得充分之冷卻時間,所Μ設有2個冷卻 部用來對1片基板施加冷卻處理,Μ相之方式並行的進行 冷卻處理。在此處該預烘乾單位 4 0、1 4 0、3 4 0因為進行 加熱處理,所Μ周圍環境會有熱的影響。因此,在預烘乾 單位4 0、1 4 0、3 4 0,對於容易因熱影響而使處理特性變化 之抗蝕劑塗布單位3 0、1 3 0、3 3 0,Μ包夾旋轉機器人4、 1 0 6、3 0 6之方式,在遠側配置重鲞之3個加熱部,在近側 配置重疊之2個接近常溫之冷卻部,用來防止對塗布處理 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公釐) '~ -30 - A7 B7 經濟部中央標準局員工消費合作社印製 五、發明説明(28) 發生熱影響。 在脫水烘乾單位1 2 0、3 2 0亦同樣的,具備有2個之冷卻 部,2個之加熱部,和1個之密著強化處理部,除了冷卻部 外,均用來加熱,對.於抗蝕劑塗布單位1 3 0、3 3 0,Μ包夾 旋轉機器人1 0 6、3 0 6之方式,在遠側配置重疊之加熱部和 密著強化處理部,在近側配置重疊之冷卻部。 另外,後烘乾單位190、390因為需要比較長之加熱時間 ,所Μ具備4個之加熱部和2個之冷卻部。在此處最好是在 遠離抗蝕劑塗布單位130、330之側,配置重疊之4個加熱 部。但是,當與脫水烘乾單位120、3 2 0比較時,因為後烘 乾單位190、390被配置在遠離抗蝕劑塗布單位130、330之 位置,所Μ對抗蝕劑塗布單位i 3 0、3 3 0之熱影響亦變小* 但是由於裝置之高度,對地板之加重,和維護作業之易於 進行等之限制,所Μ很難使4個加熱部重疊,在這種情況 時可Μ將1個之加熱部和2個之冷卻部重疊的將其配置在抗 蝕劑塗布單位1 3 0、3 3 0之近側。 [第5實施形態] 圖8表示本發明之基板處理装置一實施形態(第5實施形 態)。基板處理裝置4 0 1是可以用來進行與第3實施形態之 基板處理装置2 0 1大致相同之處理之裝置。 該基板處理裝置4 0 1具備有分度器部4 1 0,脫水烘乾單位 4 2 0,抗蝕劑塗布單位4 3 0,預烘乾單位4 4 0,顯像單位4 8 0 ,和後烘乾單位4 9 0之各個處理部,與旋轉機器人4 0 4〜 40 7 -31 - (請先鬩讀背面之注意事項再填寫本頁) 、1Τ ----Φ. 本紙張尺度適用中國國家標準(CNS ) Α4規格(210 X 297公釐) 經濟部中央標準局員工消費合作社印製 A7 B7五、發明説明(29) 洗淨單位4 1 0是葉片式之處理部,沿著基板處理裝置>£;/ 之長度方向之正交方向延伸,由搬入部4 1 1,水洗部4 1 3, 和搬出部4 1 5所構成。從搬入部4 1 1到搬出部4 1 5,利用輸 送帶用來搬蓮基板。 脫水烘乾單位4 2 0由第1多段部4 2 1和第2多段部4 2 2所構 成。第1多段部421在下段配置有一室之密著強化處理部, 在中段和上段配置有一室之加熱部。第2多段部42 2在下段 配置有輸送帶連接到抗蝕劑塗布單位430,在中段和上段 配置有一室之冷卻部。 預烘乾單位440由第1多段部441和第2多段部442所構成 。第1多段部441在下段配置有輸送帶連接自抗蝕劑塗布單 位430,在中段和上段配置有一室之冷卻部。第2多段部 442,在下段,中段和上段分別配置有一室之加熱部。 抗蝕劑塗布單位4 3 0和顯像單位4 8 0與第1實施形態之抗 蝕劑塗布單位30和顯像單位80相同。 後烘乾單位490由第1多段部491和第2多段部492所構成 。第1多段部4 9 1在下段配置有輸送帶連接自顯像單位 ,在中段和上段配置有一室之冷卻部。第2多段部492在下 段,中段;和上段分別配置有一室之加熱部。 旋轉機器人404〜40 7之構造與第1實施形態之旋轉機器 人4〜6之構造相同。 下面將順序的說明該基板處理裝置4 0 1所進行之基板之 處理。 在分度器部2,利用分度器機器人2a從卡匣3中取出之基 (請先閱讀背面之注意事項再填寫本頁) _ ϋ 1— I n n n.^r— n ΙΓ I I I . 裝丨V. Description of the invention (IfJ is used as a place of acceptance or temporary waiting when receiving and receiving. The substrate processing device 1 is a single cassette method, and the glass substrate to be processed is taken out from the cassette 3 loaded in the indexer unit 2 (Μ The substrate is hereinafter referred to as the substrate), and the substrates are stored in the same cassette 3 after completing each processing process. The process of taking out and storing the cassette 3 to and from the cassette 3 is performed by using an indexer robot 2 a. The rotatable arm holding the substrate can be moved along the row of the cassette 3. The cleaning unit 10 is a blade-type processing unit, and the loading unit 11, the UV ozone cleaning unit 12, and the water washing unit 1 3 The liquid droplet removing section 14 and the carrying-out section 15 are configured. From the carrying-in section 11 to the carrying-out section 15, the substrate is cleaned by using a conveyor belt to carry out cleaning. In addition, the conveyor belt uses a hair dryer corresponding to a clean room. Dust-free roller conveyor belt. 'The dewatering and drying unit 20 is a vane type processing unit, which is composed of a moving unit 21, a heating unit 2 2, an intensive strengthening processing unit 2 3, and a cooling unit 24. Parts 2 1 to 2 2 have multiple handles for The plates are sequentially transferred to the adjacent processing unit, and the so-called intermittent transfer device is used to transfer the substrates. The resist coating unit 30 is a blade processing unit, and the coating section 32 is rotated by the loading unit 31, and the decompression drying unit 33 The edge washing part 34 and the carrying out part 35 are used. From the moving part 31 to the carrying out part 35, the same intermittent transfer device as the dehydration drying unit 20 is used to carry the lotus substrate. The pre-drying unit 40 is a stack A multi-stage stationary processing unit * is composed of a plurality of heating units and cooling units. The developing unit 80 is a blade processing unit, which is carried in 81, developing 82, washed and dried 8 3, and carried out. The size of the paper from the loading section 8 1 to the loading section applies the Chinese National Standard (CNS) A4 (210 X 297 mm) ^ ^ -19- (Please read the precautions on the back before filling in this page ) ---, -loading --- -----'--- Γ- A7 B7 V. Description of the invention (丨 7) 84 The conveyor belt is used to carry the substrate. The post-drying unit 90 is a blade type processing unit. It is composed of a carrying-in part 91, a heating part 92, a cooling part 93, and a carrying-out part 94. From the carrying-in part 91 to the carrying-out part 94 Rotating robots 4 to 6 are used to move lotus substrates. Rotating robots 4 to 6 are so-called cluster-type robots, and do not have a mechanism that moves in a horizontal direction by rotation. The rotating robots 4 to 6 each have a trunk portion and are provided at The floor can be rotated and lifted; and two arms can be used to hold the base plate before extending from the trunk. For example, the rotary robot 5 has a trunk 5 a and an arm 5 b. In addition, The two arms can be flexed, flexed, and moved up and down independently. Rotating robots 4 to 6 perform face-to-face rotations and elevations on each of the processing sections and the receiving and receiving sections * that overlap multiple sections. To carry out the transformation or teaching of the substrate, borrow K to move the substrate. The processing of the substrate by the substrate processing apparatus 1 will be sequentially described below. Printed by the Consumers' Cooperative of the Ministry of Economy and the Central Bureau of Standards. In the indexer section 2, the substrate taken out from the cassette 3 by the indexer robot 2a is moved to the carry-in section 11 of the cleaning unit 10. The substrate is transported from the carry-in section 11 to the 臭氧 V ozone cleaning section 12 where ultraviolet rays are used to oxidize and decompose organic pollutants on the surface and remove them. Then, the substrates conveyed to the water washing section 13 by a conveyor belt are cleaned in the water washing section 13 using a roller brush, ultrasonic spray cleaning, and pure water using high pressure spraying. In addition, the washing here may be performed using an alkaline washing solution or the like. Then, in the droplet removing portion 14, a droplet of pure water remaining on the surface of the substrate is scattered by an air knife. After the cleaning unit 10 completes the processing, it is transferred to the substrate of the carrying out section 15 and after 20 (please read the precautions on the back before filling this page) This paper size applies the Chinese National Standard (CNS) Α4 size (210 × 297 mm) (%) A7 B7 V. Description of the invention (丨 8) The conveyor belt is transported to the carry-in section 21 of the dewatering and drying unit 20, and then transferred to the heating section 22 by the intermittent transfer device, heated by the hot plate, and subjected to a process of removing moisture. Next, the substrate is transferred to the next heating section 22 using an intermittent transfer device, and the same heat treatment is applied to it. Used to obtain sufficient heating time. Next, the substrate is transferred to the adhesion-strengthening processing unit 23 by an intermittent transfer device. In the adhesion-strengthening treatment section 23, in order to improve the adhesion between the resist film and the substrate, heat is applied to the substrate to apply vaporous HMDS (hexamethylene diammonium). Then, the substrate is transferred to the cooling section 24, and cooled by adding M to the cold plate. In this way, the dehydrated and dried substrates that have been processed before the resist coating process are transferred to the transfer unit 31 of the resist coating unit 30 and printed by the staff consumer cooperative of the Central Standards Bureau of the Ministry of Economy Read the precautions on the back and fill in this page.) In the resist coating unit 30, the substrate is first transferred to the rotary coating unit 32 by the slider of the intermittent moving device, and then the substrate is coated with a resist (coating liquid). . In addition, the slider refers to a device that slides the position of the substrate in one direction. For example, a rectangular motion is used to slide the position of the substrate in a certain direction by a specified distance. The rotary coating film portion 32 is composed of a resist supply system, a rotary motor, a cup, and the like. The resist is dropped on a horizontal substrate, and the substrate is rotated to form a uniform resist film on the substrate. . The substrate on which the resist film has been formed is transported to a reduced-pressure drying section 33, and dried under reduced pressure. Among them, the space where the substrate is housed is decompressed, and the low temperature drying is performed to suppress the sensitivity of the resist film from decreasing. Then, the substrate is moved to the edge washing section 34. In the edge washing portion 34, a solvent is used to remove the resist on the periphery of the substrate surface and the end surface portion to prevent peeling of the resist film on the end surface of the substrate and generation of dust. Completion of the Chinese paper standard (CNS) A4 specifications (21 × 297 mm) A7 B7 related to the paper size of the resist The details of the invention (〖9) The substrates after each treatment related to the coating were moved to Moving out department 3 5. The substrate is transferred from the unloading unit 35 to the substrate of the receiving and receiving unit 7 adjacent to the unloading unit 35 by another slider, and is transferred to the pre-drying unit 40 via the rotary robot 4. Heat treatment is performed in the pre-baking unit 40 to achieve the purpose of evaporating the residual solvent in the resist film on the substrate and enhancing the adhesion of the substrate. Here, for each heating section and cooling section of a room, a rotary robot 4 is used to sequentially carry in and out substrates. In this way, the substrate subjected to the heat treatment and the cooling treatment is transferred to the buffer 8 adjacent to the rotary robot 6 via the rotary robots 5 and 6 and the receiving portion 7. The substrate is transferred from the buffer 8 to the exposure machine 50 by the rotary robot 6, and an exposure process is applied. It is essentially a process of applying a pattern on a resist (substrate) on a substrate to a photosensitive (sensing) original image. The tomb board after exposure is taken out by the rotary robot 6 従 exposure machine 50, and it is transferred from the buffer 8 to the receiving and receiving section 7 between the rotary robots 5,6. Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling out this page) Secondly, use the rotary robot 5 to transfer the substrate to the title machine 6 0 edge exposure unit 70, and print and attach the edges separately exposure. Edge exposure is an exposure process in which the resist on the periphery of the substrate is removed except for the display portion on the substrate. Here, the edge glazing section is arranged at this position, but a rear exposure section may be arranged there as needed. After the completion of these processes, the substrate 7 from the rotary robots 4 and 5 is transferred to the receiving portion 7 adjacent to the carrying-out portion 35 and is loaded on the conveyor belt 79 by the slider. Then, the substrate is transferred from the conveying belt 79 to the carrying unit 81 of the developing unit 80. In the display unit 80, the substrate is transferred from the human carrying section 81 to the carrying section 84 by a conveyor belt. Then, the developing solution is sprayed with a nozzle in the developing section 82. The size of this paper is applicable to China National Standard (CNS) A4 (210 × 297 mm) -22-A7 B7 V. Description of the invention (20) It is applied to the surface of the substrate in a shape of a substrate and spray-developed. The development here can also be performed by using a leaf image. In the water washing and drying section, the substrate after the development is washed and dried. After completion of these processes, the substrate is transferred from the carrying-out section 8 4 to the carrying-in section 91 of the drying unit 90. In the post-baking unit 90, the developing solution and rinse solution remaining on or on the surface of the resist film on the substrate are removed by evaporation, and heat treatment is performed to achieve the purpose of hardening the resist and strengthening the adhesion with the substrate. . Essentially, the substrate is heated by the hot plate of the heating portion 92, and the substrate is cooled by the cold plate of the cooling portion 93. Here, a plurality of heating sections 92 and cooling sections 93 may be provided to obtain sufficient heating time and cooling time. The substrate to which these processes have been applied is transferred to the carry-out section 94, and is housed in the original cassette 3 by the indexer robot 2a. Here, a plurality of rotary robots 4 to 6 that do not move in the horizontal direction are used to carry in and out substrates of each processing unit (unit). Therefore, there is no conventional method that generates particles by moving the robot holding the substrate at a high speed in the horizontal direction for a long time, which can reduce the amount of particles generated by the substrate and reduce the pollution of the substrate and each processing unit. Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling out this page) In addition, here the MU stationary unit is pre-baked (can be processed without moving the substrate), When the process of moving the substrate is included, the M-blade unit performs other processing. By combining such a stationary unit with a plurality of processed blade-type units, it can be used to reduce the number of units and the rotation of the robot. number. In addition, through the installation of the blade-type unit, a rotary processing method is not adopted (this method will cause damage to the substrate when the substrate is large, and will cause the paper to be damaged due to the splash of water during washing. Applicable to China National Standard (CNS) A4 specification (210 × 297 mm) -23-Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (21) The probability of generating particles becomes higher, and it will cause cleaning Characteristics and development characteristics are degraded), such as rotary brushing and rotary imaging, brushing or spraying with excellent characteristics can be used. In this way, the substrate processing apparatus 1 can respond to large substrates, such as diagonal 1 hi Large glass substrate on M. The structure of the receiving section 7 will be described below with reference to FIGS. 2 to 4. The receiving and receiving unit 7 is a unit structure composed of an upper and lower tip (first supporting member) 7a and a traversing tip (second supporting member) 7b. The upper and lower moving mechanism and the horizontal moving mechanism are not shown in the figure. Formed in two groups. The upper and lower pins 7a support a plurality of pins of the substrate y, and are moved up and down by an upward movement mechanism. The traverse tip 7b is a plurality of tips that support the substrate W with a horizontal mechanism for horizontal movement. The substrate W transferred to the unit structure of one of the receiving and receiving units 7 is first mounted on the upper and lower ends 7a (see FIG. 2). At this point, the upper and lower ends 7 a are lowered, and the substrate W is located at the position P 1 of the unit structure of the receiving section 7. As shown in Fig. 2, when the substrate W is mounted on the upper and lower ends 7a, the upper and lower ends 7a are raised to the state shown in Fig. 3. At this time, the substrate W is located at the position P 2 above the traverse tip 7b. Then, the traverse tip 7b is moved to the inside from this state, and after the M traverse tip 7b supports the substrate W, the upper and lower tips 7a are lowered to the original position (see FIG. 4). In this way, each unit structure of the receiving and receiving unit 7 causes the substrate W to wait at the position P 2, and it becomes possible to accept other plates at the position P 1. That is, the receiving and receiving unit 7 arranges two sets of such a unit structure to overlap two sections in the upper and lower sections, so that the four substrates can be put into a waiting state in the planar space of one part of the substrate. In this way, for example, the receiving and receiving section 7 adjacent to the carrying out section 35 can individually allocate each unit structure from the carrying out section 35 to the pre-drying. The paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm). ). 24-(Please read the notes on the back before filling out this page): Install —, 1T vm m In tut ml 1 © 1 _—— L --- Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7 Five 2. Description of the invention (, 2 2) The substrates transported by the unit 40 and the substrates transported from the rotary robot 4 to the conveyor belt 79 after exposure can keep the two substrates in a waiting state, respectively. It is easy to control the timing adjustment of the processing section before and after the granting and receiving section 7. [Second Embodiment] Fig. 5 shows an embodiment (second embodiment) of a substrate processing apparatus according to the present invention. The substrate processing apparatus 101 is an apparatus capable of performing substantially the same processing as that of the substrate processing apparatus 1 of the first embodiment. It should be noted that in the explanations under K, the same parts as those in the first embodiment are denoted by the same reference numerals. In addition, the description of the same or the same part as in the 1S application form will be omitted. The substrate processing apparatus 101 is provided with an indexer unit 2, a washing unit 110, a dehydration drying unit 120, a resist coating position 130, a pre-baking unit 140, a title machine 160, an edge exposure unit 170, and a developing unit. Each processing unit of 180 and post-drying unit 190, and rotary robots 104-108. In addition, the receiving and receiving unit 7 and the buffer 8 are arranged near the rotary robots 104 to 108. The washing unit 1 10 is a blade type processing unit, and is composed of a carrying-in unit 111, a water washing unit 113, a droplet removing unit 114, and a carrying-out unit 115. From the carrying-in part 111 to the carrying-out part U 5, a substrate is transported by a conveyor belt. The dehydration and drying unit 120 is formed by a plurality of stacked static processing units, and is composed of a plurality of heating units, an intensive strengthening processing unit, and a cooling unit. The resist coating unit 130 and the pre-baking unit 140 are the same as the resist coating unit 30 and the pre-baking unit 40 of the first embodiment. The development unit 1 80 is a blade-type processing unit. It is carried in by 1 δ 1. The paper size of the development unit is in accordance with the Chinese National Standard (CNS) A4 specification (210 × 297 mm) -2 5 — (Please read it first Note on the back, please fill out this page again) One pack. Ordered • I · A7 B7 Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention (23) 1 δ 2, Washing section 1 8 3, Drying section 1 8 4 , And the carry-out section 185. The substrate is carried by a conveyor belt from the carry-in portion 1 81 to the carry-out portion 1 8 5. The post-drying unit 1 90 is formed by a multi-stage static processing unit, which is composed of a plurality of heating units and cooling units. The rotary robots 104 to 108 are the same as the rotary robots 4 to 6 of the first embodiment. The substrate processing using the substrate processing apparatus 101 will be sequentially described below. In the indexer section 2, the substrate taken out from the cassette 3 by the indexer robot 2a is loaded on the receiving section 7 adjacent to the indexer section 2, and is transferred to the loading section 11 of the cleaning position 110 by a slider. The substrate is transferred from the carry-in section 111 to the water-washing section 113, and in the water-washing section 113, brush cleaning with a roller brush, ultrasonic spray cleaning, and pure water cleaning with high-pressure spraying are performed. Then, droplets of pure water remaining on the surface of the substrate are scattered in the droplet removing section 114 by an air knife. In addition, UV ozone cleaning is not performed here. However, if a UV ozone cleaning section is disposed at the receiving section 7 adjacent to the indexer section 2, the indexer robot 2a carries the substrate to the ϋV ozone cleaning. The cleaning section and the moving section from the UV ozone cleaning section to the carry-in section 111 can be used for UV ozone cleaning. The substrate that has been processed in the cleaning unit 110 is transferred to the substrate of the carrying-out unit 1 15 and is further transferred by the slider to the adjacent to the carrying-out unit 11 5 :: T awarded the love unit 7 using the rotary robot 1 0 4, 1 0 5 into the dehydration drying unit 1 2 0. Each process (heating, adhesion strengthening, and cooling) of the dehydration and drying unit 1 20 adopts a one-chamber method. After one process is completed, the rotary robot 105 is used to move the substrate to the next process. After the dewatering and drying of the substrates, the size of the spinner paper is applicable to China National Standard (CNS) A4 specifications (210X 297 mm) (Please read the precautions on the back before filling out this page)-Binding. Order .0 -26-A7 B7 V. Description of the Invention (24) The transfer robot 105 is moved to the receiving and receiving section 7 adjacent to the carrying-in section 131 of the resist coating unit 130. From the receiving section 7 adjacent to the carrying section 131 to the carrying section 131, a slider is used to carry the lotus substrate. In the resist coating unit 130, the substrate is subjected to various processes related to resist coating similar to those in the first embodiment. The slider is moved from the unloading section 1 35 to the substrate of the receiving and receiving section 7 adjacent to the unloading section 1 35, and is further transferred by the rotary robot 106 to the pre-drying unit 140. After the pre-baking is completed, the substrate is transferred to the adjacent buffer 8 via the rotary robot 106, the rotary robot 107, and the rotary robot 108. Then, the substrate robot buffer δ is transferred to the exposure machine 50 by the rotary robot 108, and the substrate is subjected to an exposure process. After the exposure process is completed, the substrate is taken out of the exposure machine 50 by the rotary robot 108 and stored in the buffer 8. Then it is transferred to the receiving and receiving unit 7 between the rotary robots 107 and 10S. Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling out this page). Then, complete the processing of the title machine 60 and the edge exposure unit 70, from the rotating robot 1 0 6, 1 0 The receiving and receiving unit 7 between 7 is transferred to the receiving and receiving unit 7 adjacent to the carrying-out unit 1 3 5 and is transferred to the carrying-in unit 1 81 of the developing unit 1 80 using a slider. In the development unit 180, the substrate is transferred from the carrying-in part 1 8 1 to the carrying-out part 1 8 5 by a conveyor belt. In the developing section 1 8 2, the washing section 1 δ 3, and the drying section 1 δ 4, the substrates having undergone various processes related to the development are transferred by the slider from the carrying section 1 8 5 to the carrying section 1 8 5 adjacent to the receiving and receiving department 7. The substrate loaded on the receiving and receiving unit 7 adjacent to the unloading unit 185 is transferred to the post-drying unit 19 0 through the receiving and receiving unit 7 by the rotary robots 105 and 104. After the post-drying unit 19 90 has completed the heat treatment, the substrate is transferred from the receiving and receiving section 7 adjacent to the rotary robot 104 to the conveying belt 199 and transported to the usable indexer. The paper size applies Chinese national standards ( CNS) A4 size (210X 297 mm) A7 B7 V. Description of the invention (25) The position where the robot 2 a is taken out. Then, the substrate is housed in the original cassette 3 by the indexer robot 2a. Here, similarly to the substrate processing apparatus 1 of the first embodiment, a plurality of rotary robots 104 to 108 that do not move in the horizontal direction are used to carry in and out substrates of each processing unit (unit). Therefore, there will be no particles generated by the handling robot holding the substrate at a high speed in the horizontal direction K for a long time as in the conventional method, which can reduce the amount of particles generated and reduce the pollution of the substrate and each processing unit. In addition, the K type stationary unit performs pre-baking processing (processing without moving the substrate), and the dehydration drying, drying processing and post-drying processing are also performed by the M type static unit. In addition, the dehydration drying unit and the post-drying unit have a multi-stage structure, and when compared with the substrate processing apparatus 1 of the first embodiment, it can save space on a flat surface. In addition, for example, there is a space between the dehydration drying unit 120 and the post-drying unit 190, and the space can be effectively used by disposing a resist solution or washing a tired tank or a control device in such a place. . [Third Embodiment] Printed by the Consumer Cooperatives of the Central Bureau of Standards, Ministry of Economic Affairs (please read the precautions on the back before filling out this page). Figure 6 shows one embodiment of the substrate processing apparatus of the present invention (third embodiment). The substrate processing apparatus 201 is a device formed by removing the header 160 and the edge exposure unit 170 in the substrate processing apparatus 101 of the second embodiment. Except for omitting the processing performed by the title machine 160 and the edge exposure unit 170, the other parts are the same as the second embodiment. [Fourth embodiment] Fig. 7 shows a spring application mode of a substrate processing apparatus of the present invention (the fourth implementation of this paper applies the Chinese National Standard (CNS) A4 specification (210 × 297 mm) A7 B7 V. Description of the invention (2β ) Form). The substrate processing apparatus 3 0 1 is formed by changing the arrangement of the cleaning unit 11 0 (refer to FIG. 5) of the substrate processing apparatus 1 0 1 extending in the longitudinal direction in the second embodiment. In essence, the substrate processing apparatus 301 is a place where a cleaning unit 11 0, a conveyor belt 1 99, and the receiving and receiving unit 7 are arranged in the substrate processing apparatus 101. It extends in a direction orthogonal to the length direction of the device, and the receiving and receiving unit 7 is arranged above the washing unit 310. In this way, the dimension in the longitudinal direction of the substrate processing apparatus 301 is made shorter than the dimension in the longitudinal direction of the substrate processing apparatus 101. This substrate processing apparatus 3 0 1 includes an indexer unit 2, a cleaning unit 3 1 0, a dehydration drying unit 3 2 0, a resist coating unit 3 3 0, a pre-drying unit 3 4 0, a title machine 360, and an edge. Each processing unit of the exposure unit 370, the development unit 380, and the rear supply unit 390, and the rotary robots 304 to 308. In addition, a receiving and receiving unit 7 and a buffer 8 are provided near the rotary robots 304 to 308. The cleaning unit 3 1 0 is a blade-type processing unit, which extends along the orthogonal direction of the length direction of the substrate processing apparatus 3 0 1, and is composed of a carrying-in part 311, a washing part 313, and a carrying-out part 3 1 5. From the carrying-in portion 3 11 to the carrying-out portion 3 1 5, a transfer belt is used to carry the lotus substrate. Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs for the dehydration drying unit 320, the resist coating unit 3 3 0, the pre-drying unit 3 40, the development unit 3 8 0, the post-drying unit 390, and the rotary robot 304 ~ 3 08, and the receiving unit 7, the structure and the second embodiment of the dehydration drying unit 1 2 0, the resist coating unit 1 3 0, the pre-baking unit 1 4 0, the development unit 1 8 0, The post-drying unit 190, the rotary robot] .0 4 to 108, has the same structure as the receiving and receiving unit 7. The following will sequentially explain the substrate 29 carried out by the substrate processing device 301 (please read the precautions on the back before filling out this page) This paper size is applicable to the Chinese National Standard (CNS) Α4 is now (2 丨 0 X 297 mm) A7 B7 V. Description of the invention (27) Treatment. In the indexer section 2, the substrate taken out of the cassette 3 by the indexer robot 2a is transferred to the carry-in section 3 11 of the cleaning unit 3 10. The substrate is transferred from the carry-in section 3 11 to the water washing section 31 3, and the water washing section 3 1 3 performs cleaning and droplet removal processing. After the processing of the cleaning unit 3 10 is completed, it is transferred to the substrate of the transfer unit 3 1 5 and further transferred by the indexer robot 23 to the receiving unit 7 above the cleaning unit 310. The rotary robots 304 and 305 are used to move the Dehydration drying unit 320. The process from the dehydration drying unit 320 to the post-drying unit 390 is the same as the process of the second embodiment from the dehydration drying unit 120 to the post-drying unit 190. The substrate after the heat treatment in the post-drying unit 390 is transferred by the rotary robot. 3 0 4 is transferred to the receiving unit 7 above the cleaning unit 3 1 0. Then, the substrate is housed in the original cassette 3 by the indexer robot 2a. Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling out this page). In the above embodiment, the pre-drying unit 40, 140, and 340 are three heating units and are set to It is used to apply heat treatment to one substrate, so as to obtain sufficient heating time on each substrate. In addition, for the substrate after heating, in order to obtain a sufficient cooling time, two cooling sections are provided for applying cooling treatment to one substrate, and cooling treatment is performed in parallel in the M phase. Here, the pre-drying units 40, 1, 40, and 3 40 have a heat effect due to the heat treatment. Therefore, in the pre-baking units 40, 1, 40, and 3 40, for the resist coating units 3, 1, 3, and 3, 3, which are prone to change in processing characteristics due to thermal influence, the MW encloses the rotary robot. In the method of 4, 10, 3, and 6, there are three heating sections on the far side and two near-temperature cooling sections on the near side to prevent the coating process from being applied to the Chinese country. Standard (CNS) Α4 specification (210 × 297 mm) '~ -30-A7 B7 Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs 5. Description of the invention (28) Thermal impact occurred. The same applies to the dehydration and drying units 1 2 0 and 3 2 0, which are provided with 2 cooling sections, 2 heating sections, and 1 dense strengthening processing section, except for the cooling section, which are used for heating. Regarding the resist coating unit 130, 330, the method of holding the rotary robot 106, 3, and 6 is arranged on the far side with an overlapping heating portion and an adhesion-reinforcing treatment portion, and on the near side. Overlapping cooling section. In addition, since the post-drying units 190 and 390 require a relatively long heating time, the M has four heating sections and two cooling sections. In this case, it is preferable to arrange four heating portions overlapping each other on the side far from the resist coating units 130 and 330. However, when compared with the dehydration and drying units 120 and 3 2 0, since the post-drying units 190 and 390 are disposed away from the resist coating units 130 and 330, the resist coating unit i 3 0, The thermal effect of 3 3 0 is also reduced * However, due to the restrictions of the height of the device, the increase of the floor, and the ease of maintenance, it is difficult to overlap the four heating parts. In this case, the One heating part and two cooling parts are overlapped, and they are arranged near the resist coating unit 130 and 330. [Fifth Embodiment] Fig. 8 shows an embodiment (a fifth embodiment) of a substrate processing apparatus according to the present invention. The substrate processing apparatus 401 is an apparatus that can perform substantially the same processing as the substrate processing apparatus 201 of the third embodiment. The substrate processing apparatus 4 0 1 includes an indexer section 4 1 0, a dehydration drying unit 4 2 0, a resist coating unit 4 3 0, a pre-baking unit 4 4 0, a developing unit 4 8 0, and a post-baking. Each processing unit of the dry unit 4 9 0, and the rotating robot 4 0 4 ~ 40 7 -31-(Please read the precautions on the back before filling this page), 1T ---- Φ. This paper size is applicable to China Standard (CNS) A4 size (210 X 297 mm) Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (29) The cleaning unit 4 1 0 is a blade type processing unit, along the substrate processing device >£; / extends in the orthogonal direction of the length direction, and is composed of a carrying-in section 4 1 1, a washing section 4 1 3, and a carrying-out section 4 1 5. From the carrying-in part 4 1 1 to the carrying-out part 4 1 5, a transfer belt is used to carry the lotus substrate. The dehydration and drying unit 4 2 0 is composed of a first multi-stage portion 4 2 1 and a second multi-stage portion 4 2 2. The first multi-stage section 421 is provided with a chamber dense strengthening processing section in the lower section and a chamber heating section in the middle section and the upper section. The second multi-stage section 422 is provided with a conveyor belt connected to the resist coating unit 430 in the lower section, and a room cooling section in the middle section and the upper section. The pre-drying unit 440 includes a first multi-stage portion 441 and a second multi-stage portion 442. The first multi-stage section 441 is provided with a conveyor belt connected to the resist coating unit 430 in the lower section, and a cooling section having a chamber in the middle section and the upper section. The second multi-stage section 442 is provided with a room heating section in the lower section, the middle section and the upper section, respectively. The resist coating unit 430 and the developing unit 480 are the same as the resist coating unit 30 and the developing unit 80 of the first embodiment. The post-drying unit 490 is composed of a first multi-stage section 491 and a second multi-stage section 492. The first multi-stage section 4 9 1 is equipped with a conveyor belt to connect the self-developing unit in the lower section, and a cooling section with a room in the middle section and the upper section. The second multi-stage section 492 is located at the lower section, the middle section, and the upper section, respectively, and is provided with a room heating section. The structures of the rotary robots 404 to 40 7 are the same as those of the rotary robots 4 to 6 of the first embodiment. The substrate processing performed by the substrate processing apparatus 401 will be sequentially described below. In the indexer section 2, use the indexer robot 2a to remove the base from the cassette 3 (please read the precautions on the back before filling this page) _ ϋ 1— I n n n. ^ R— n ΙΓ I I I.

、ST βτ. 本紙張尺度適用中國國家標準(CNS ) Α4規格(210 X 297公釐) 32 經濟部中央標準局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X297公釐) A7 B7 五、發明説明(:?i?) 板,被移送到洗淨單位4 1 0之搬入部4 1 1。基板從搬入部 4 11被搬蓮到水洗部41 3,在水洗部4 1 3進行U V臭氧洗淨, 刷洗洗淨,和液滴除去。 完成洗淨單位41 0之處理後之被移送到搬出部4 1 5之基板 ,被旋轉機器人404搬入到脸水烘乾單位420之密著強化處 理部。然後,依照順序在加熱部和冷卻部進行基板之處理 。脫水烘乾單位1 2 0之各個處理(密著強化、加熱、冷卻) 分別使用一室之方式,在1個處理完成之後,利用旋轉機 器人404將基板移送到下一個之處理部。完成該等脫水烘 乾之處理之基板,被移送到第2多段部之下段,利用輸送 帶將其搬運到抗蝕劑塗布單位4 3 0。 完成與抗蝕劑塗布有關之各涸處理後之基板,被輸送帶 搬蓮到預烘乾單位440之第1多段部441之下段。在該預烘 乾單位440利用旋轉機器人405將基板移送到各個加熱部和 冷卻邰,和進行各種處理。完成該等預烘乾之基板,依照 需要在媛衝器8等待v然後由旋轉機器人40 5轉交給旋轉機 器人4 0 6,將其移送到曝光機5 0。 完成曝光後之基板,利用旋轉機器人4 0 6從曝光機5 0之 中將其取出,裝載在旋轉機器人406和顯像單位480之間之 位置(緩衝器δ)。然後,利用旋轉機器人406將基板移送到 緩衝器δ之下段之輸送帶,利用輸送帶將其搬蓮到顯像單 位4 8 0。被施加過與顯像有關之各涸處理之基板,被輸送 帶搬運到後烘乾單位4 9 0之第1多段部4 9 1之下段。 在後烘乾單位4 9 0,利用旋轉機器人4 0 7將基板移送到各 -0 0 一 (請先閱讀背面之注意事項再填寫本頁) 裝--- 、1Τ1 — 經濟部中央標準局員工消費合作社印製 A7 五、發明説明(31) 個加熱部和冷卻部,和進行各種處理。完成該等後烘乾處 理後之基板,被旋轉機器人4 0 7搬運經過被配置在洗淨單 位41 0之上部之圖中未顯示之授受部,利用分度器機器人 2a將其收容在原來之卡匣3。 在此處是構建成在旋轉機器人404〜407可K將基板搬出 /搬入之位置,並排的設置一些處理部,例如,對於旋轉 機器人404,並排第1和第2多段部421、422,經由採用此 種構造可Μ有效的利用平面之空間,可Μ提高節省空間之 效果。利用這種方式,經由在靜止式之單位組合葉片式之 單位和群集式之旋轉機器人1,可Κ節省空間和提高各個處 理單位之處理能力。 [第6實施形態] 圖9表示本發明之基板處理裝置之一實施形態(第6實施 形態)。基板處理裝置5 0 1是連接多個處理單位之可進行一 貫處理之塗膜/顯像裝置,與曝光機5 0連接,在影印工程 中,從抗蝕劑塗布前之洗淨到抗蝕劑塗布、曝光、顯像可 Μ連績的進行。該基板處理裝置5 0 1是構成利用授受部連 結靜止式之各個處理部和旋轉機器人之裝置。另外,在Μ 下之說明中,在與第1實施形態相同或同樣之部份附加相 同之符號。另外,對於與第1實施形態相同或同樣之部份 ,省略其說明。 該基板處理裝置5 0 1具備有分度器部2,U V臭氧處理單位 5 1 2 *洗淨單位5 1 3,脫水烘乾加熱單位5 2 3,脫水烘乾冷 卻單位5 2 4,抗蝕劑塗布單位5 2 4,抗蝕劑塗布單位5 3 2, 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公釐) —3 4 _ (請先閱讀背面之注意事項再填寫本頁) *1 . 、1Τ ό. 經濟部中央標準局J工消費合作社印製 A7 B7 五、發明説明Ο) 預烘乾加熱單位5 4 1,預烘乾冷卻單位5 4 2,標題機5 6 0, 顯像單位5 8 0,和後烘乾單位5 9 0之各個處理部,及旋轉機 器人502〜509。另外,在分度器部2和旋轉機器人502之間 和旋轉機器人5 0 2〜5 0 9之間,設有授受部7,當各個處理 部之間進行基板之授受時*作為授受場所或是暫時之等待 場所。 洗淨單位5 1 3是一室之旋轉刷洗器,在該處當洗淨後利 用離心力用來進行旋轉乾燥。 抗蝕劑塗布單位5 3 2是一室之旋轉塗膜器。 顯像單位580是一室之單位,經由使基板旋轉用來進行 顯像、洗淨(沖洗),和乾燥。 後烘乾單位5 9 0是被配置成為多段之多個加熱部和冷卻 部所構成之單位。 ϋ V臭氧處理單位具有與第1實施形態之ϋ V臭氧洗淨部1 2 同樣之處理功能。脫水烘乾加熱單位5 2 3和脫水烘乾冷卻 單位5 2 4具有與第1實施形態之脫水烘乾單位2 0之加熱部2 2 和冷卻部2 4同樣之功能。另外,標題機5 6 0,旋轉機器人 5 0 2〜5 0 9,和授受部7亦分別具有與第1實施形態之標題機 6 0,旋轉機器人4〜6,和授受部7同樣之功態。 在分度器部2利用分度器機器人2a從卡匣3之中取出之基 板,被移送到與分度器部2鄰接之授受部7。其次,利用旋 轉機器人5 0 2將基板搬人到U V臭氧處理單位5 1 2。完成U V臭 氧處理之基板,利用旋轉機器人5 0 2從U V臭氧處理單位5 1 2 中搬出,然後將其搬入到洗淨單位5 1 3。同樣的,依照順 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) _ 〇 Γ _ (請先鬩讀背面之注意事項再填寫本頁) ----Ί/"衣— 訂 !©. 經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明(33) 序在脫水烘乾加熱單位523,脫水烘乾冷卻單位524,抗蝕 劑塗布單位5 3 2,預烘乾加熱單位5 41,和預烘乾冷卻單位 542,當完成處理之後就將基板移送到曝光機50。 曝光完成後之基板,在標題機560,顯像單位580,和後 烘乾罩位5 9 0於完成處理之後,利用旋轉機器人502〜506 和分度器機器人2a將其收容在原來之卡匣3。 在此處利用不會依水平方向移動之旋轉機器人502〜509 和授受部7,用來對各個處理部進行基板之搬人/搬出,和 進行各個處理部之間之基板之搬運。因此,不會有如同習 知方式之因為保持基板之搬蓮機器人依水平方向移動長距 離而產生粒子,可Μ減少粒子之產生量*藉Μ減少基板和 各個處理部之污染。 [第7實施形態] <構造> 圖10表示本發明之基板處理裝置之一實施形態(第7實施 形態)。該基板處理裝置是連接多個處理單位之可進行一 貫處理之塗膜/顯像裝置,連接曝光機50,標題機60,和 邊緣曝光機7 0,在影印工程中從抗触劑塗布前之洗淨到抗 蝕劑塗布,曝光,顯像可Μ連績的進行。 該基板處理裝置主要的具備有分度器部2,洗淨單位1 0 ,脫水烘乾單位2 0 a、2 0 b,抗蝕劑塗布單位3 0,預烘乾單 位40a、40b,顯像單位80,和後烘乾單位90a、90b,空調 單位9 9之各個處理部,及旋轉機器人4 a〜4_e。在從分度器 部2到曝光機5 0之注行線配置有洗淨單位1 0 *從烘乾單位 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) ~ -36- (請先閱讀背面之注意事項再填寫本頁), ST βτ. This paper size is applicable to the Chinese National Standard (CNS) Α4 size (210 X 297 mm) 32 Printed by the Staff Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs This paper size is applicable to the Chinese National Standard (CNS) A4 size (210X297 mm) ) A7 B7 5. Description of the invention (:? I?) The board was transferred to the moving part 4 1 1 of the washing unit 4 1 0. The substrate is transferred from the carrying-in section 4 11 to the water-washing section 41 3, and the UV-ozone cleaning, brush-washing, and droplet removal are performed in the water-washing section 4 1 3. After the processing of the washing unit 41 0 is completed, it is transferred to the substrate of the carrying-out unit 4 15, and is carried into the face-drying unit 420 by the rotary robot 404 into the adhesion-enhancing processing unit of the face-water drying unit 420. Then, the substrate is processed in the heating section and the cooling section in order. Each process (adhesive strengthening, heating, and cooling) of the dehydration and drying unit 1 20 uses a one-chamber method. After one process is completed, the substrate is transferred to the next processing unit by the rotary robot 404. The substrates that have undergone these dehydration and drying processes are transferred to the lower section of the second multi-stage, and are transported to the resist coating unit 4 3 0 by a conveyor belt. The substrates after completion of the various processes related to the resist application are transported to the lower stage of the first multi-stage section 441 of the pre-drying unit 440 by a conveyor belt. In the pre-drying unit 440, the substrate is transferred to various heating sections and cooling ridges by a rotary robot 405, and various processes are performed. After completing these pre-baking substrates, wait for v at the punch 8 as needed and then transfer it from the rotary robot 40 5 to the rotary robot 4 6 and transfer it to the exposure machine 50. After the exposure is completed, the substrate is taken out of the exposure machine 50 by the rotary robot 406 and loaded at a position (buffer δ) between the rotary robot 406 and the development unit 480. Then, the rotary robot 406 transfers the substrate to the conveyor belt at the lower stage of the buffer δ, and uses the conveyor belt to move it to the developing unit 480. The substrates that have been subjected to various processes related to development are conveyed to the lower section of the first multi-stage section 491 of the post-drying unit 490 by a conveyor belt. In the post-drying unit 4 9 0, the rotary robot 4 0 7 is used to transfer the substrates to each 0 0 1 (please read the precautions on the back before filling this page) Installation --- 、 1Τ1 — Employees of the Central Standards Bureau of the Ministry of Economic Affairs A7 was printed by the consumer cooperative. V. Invention Description (31) Heating and cooling sections, and various processing. The substrates after these post-baking processes are carried by the rotary robot 407 through the receiving and receiving section which is not shown in the figure arranged above the cleaning unit 41 0, and are stored in the original cassette by the indexer robot 2a. 3. Here, it is constructed such that the rotary robots 404 to 407 can carry the substrate out / in, and set some processing units side by side. For example, for the rotary robot 404, the first and second multi-stage sections 421 and 422 are arranged side by side. This structure can effectively use the space of the plane, and can improve the effect of saving space. In this way, by combining the vane-type unit and the cluster-type rotary robot 1 in a stationary unit, it is possible to save space and improve the processing capacity of each processing unit. [Sixth Embodiment] Fig. 9 shows an embodiment (sixth embodiment) of a substrate processing apparatus according to the present invention. The substrate processing device 501 is a coating film / developing device that can connect a plurality of processing units for consistent processing. It is connected to the exposure machine 501. In the photocopying process, from cleaning before resist coating to resist Coating, exposure, and development can be performed continuously. This substrate processing apparatus 501 is a device that connects each processing unit of a stationary type and a rotary robot by a receiving and receiving unit. In the description under M, the same reference numerals are assigned to the same or similar parts as those in the first embodiment. The description of the same or similar parts as those in the first embodiment will be omitted. This substrate processing apparatus 5 0 1 includes an indexer unit 2, a UV ozone processing unit 5 1 2 * a cleaning unit 5 1 3, a dehydration drying heating unit 5 2 3, a dehydration drying cooling unit 5 2 4, and a resist coating Unit 5 2 4, resist coating unit 5 3 2, This paper size applies Chinese National Standard (CNS) Α4 specification (210 × 297 mm) —3 4 _ (Please read the precautions on the back before filling this page) * 1 , 1Τ ό. Printed by AJ B7, J Industrial Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention 0) Pre-drying heating unit 5 4 1, pre-drying cooling unit 5 4 2, title machine 5 6 0, development Units 580, and post-drying units 590, each processing unit, and rotary robots 502 ~ 509. In addition, a receiving unit 7 is provided between the indexer unit 2 and the rotating robot 502 and between the rotating robot 502 to 509, and when receiving and receiving substrates between the processing units *, it is used as a receiving place or temporarily. Waiting place. The washing unit 5 1 3 is a one-room rotary scrubber. After washing, the centrifugal force is used for spin drying. The resist coating unit 5 3 2 is a one-chamber spin coater. The developing unit 580 is a one-room unit and is used for developing, washing (rinsing), and drying by rotating the substrate. The post-drying unit 590 is a unit composed of a plurality of heating sections and cooling sections arranged in a plurality of stages. The V ozone treatment unit has the same processing function as the V ozone cleaning unit 1 2 of the first embodiment. The dehydration drying heating unit 5 2 3 and the dehydration drying cooling unit 5 2 4 have the same functions as the heating unit 2 2 and the cooling unit 24 of the dehydration drying unit 20 of the first embodiment. In addition, the title machine 5 60, the rotary robot 5 2 to 5 0 9 and the receiving and receiving unit 7 respectively have the same functions as those of the title machine 60, the rotary robot 4 to 6 and the receiving and receiving unit 7 of the first embodiment. . The substrate taken out from the cassette 3 by the indexer robot 2a in the indexer section 2 is transferred to the receiving section 7 adjacent to the indexer section 2. Secondly, the substrate is transferred to the UV treatment unit 5 1 2 by the rotary robot 5 2. The substrate that has undergone the U V ozone treatment is removed from the U V ozone treatment unit 5 1 2 by a rotating robot 5 2 and then transferred to the cleaning unit 5 1 3. Similarly, the Chinese National Standard (CNS) A4 specification (210X297 mm) is applied in accordance with the paper size. _ 〇Γ _ (Please read the precautions on the back before filling this page) ---- Ί / " 衣 — Order! ©. Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (33) In the dehydration drying heating unit 523, the dehydration drying cooling unit 524, the resist coating unit 5 3 2, pre-baking The dry heating unit 5 41 and the pre-baking cooling unit 542 transfer the substrate to the exposure machine 50 after the processing is completed. After the exposure is completed, the substrate 560, the developing unit 580, and the post-drying cover 590 are processed in the original cassette 3 using the rotary robots 502 to 506 and the indexer robot 2a. Here, the rotary robots 502 to 509 and the receiving and receiving unit 7 that do not move in the horizontal direction are used to transfer / remove substrates to and from each processing unit, and to transfer substrates between the processing units. Therefore, there will be no particles generated by the moving robot holding the substrate in a horizontal direction as long as the conventional method moves the particles, which can reduce the amount of particles generated * By reducing the pollution of the substrate and each processing unit. [Seventh embodiment] < Structure > Fig. 10 shows an embodiment (seventh embodiment) of a substrate processing apparatus according to the present invention. The substrate processing device is a coating film / developing device that can connect a plurality of processing units for consistent processing, and is connected to an exposure machine 50, a title machine 60, and an edge exposure machine 70. Cleaning can be performed continuously until the resist is applied, exposed, and developed. The substrate processing apparatus mainly includes an indexer unit 2, a cleaning unit 10, a dehydration drying unit 20a, 2b, a resist coating unit 30, a pre-baking unit 40a, 40b, and a developing unit 80. , And each drying unit 90a, 90b, each processing unit of the air conditioning unit 99, and the rotary robot 4a ~ 4_e. Washing unit 1 0 is arranged on the line from the indexer section 2 to the exposure machine 50. * From the drying unit, the paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) ~ -36- (please first (Read the notes on the back and fill out this page)

經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明(3.1) 9 0 b,脫水烘乾單位2 0 a,抗蝕劑塗布單位3 0,預烘乾單位 40a等。在從曝光機50返回之返回線配置有預烘乾單位40b ,顯像單位80,脫水烘乾單位20b,後烘乾單位90a,空調 單位99等。另外,在旋轉機器人4e之近傍設有緩衝器部8a 〜8c,當對曝光機50進行基板之授受時,作為授受場所或 暫時之等待場所。該基板處理裝置是單位卡匣方式者,從 被裝載在分度器部2之卡匣3之中取出玻璃基板下稱為 基板),將其送出到各個處理部,和將完成各個處理工程 後之基板收納在相同之卡匣3。從卡匣3之中取出基板和將 基板收納到卡匣3之進行是使用分度器機器人2a,該分度 器機器人23具備有用Μ保持基板之可旋轉之臂,和可Μ沿 著卡匣3之列移動。 洗淨單位1 0是連續葉片式之處理部,由搬入部1 2,洗淨 部1 3,液滴除去部1 4,和搬出部1 5所構成。另外,在搬入 部1 2之上部設有U V臭氧洗淨室1 1。亦即,ϋ V臭氧洗淨室11 重疊在洗淨單位1 0之上。從ϋ V臭氧洗淨室1 1到搬入部1 2, 利用分度器機器人2a用來搬運基板。從搬人部12到搬出部 1 5,利用輸送帶用來搬運基板,和進行洗淨和液滴除去等 之處理。在洗淨部1 3,使用純水或藥液,Μ刷子、超音波 、高壓噴露等進行洗淨。另外,輸送帶亦可Μ採用與清潔 室内對應之發塵量很少之滾茼輸送帶。 脫水烘乾單位2 0 a、20 b是使靜止式之處理室,輸送帶室 (搬運室),和通過室重疊成多段之單位。圖12表示脫水烘 乾單位2 0 a、2 0 b之構造。脫水烘乾單位2 0 a從下面起依照 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 71 (請先閱讀背面之注意事項再填寫本頁) '裝丨 經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明( 順序重疊有冷卻室(C P ) 2 5 a,搬入用輸送帶室(I N C/V) 21 ,搬出用輸送帶室(OUT C/V)26,冷卻室(CP)25C,和密著 強化室UP) 24,形成多段之單位。脫水烘乾單位20bM包 夾旋轉機器人4 b之方式被配置在脫水烘乾單位2 0 a之相反 側之返回線,從下面起依照順序重疊有冷卻室(C P ) 2 5 b, 通過室(THROUGH C/V)27,緩衝器室(BF)22,和2個之加熱 室(HP)23a、23b,形成多段之單位。在緩衝器室22内,設 有多個裝載部223可Μ用來保管多個基板。在搬入用輸送 帶室21,搬出用輸送帶室26,和通過室27分別配備有輸送 帶。脫水烘乾單位20a之搬入用輸送帶室21之高度位準, 與洗淨單位10之搬出部15之高度位準相同。 抗蝕劑塗布單位30是葉片式之處理部,由搬入部31,旋 轉塗膜器部32 *調位處理部33,邊緣沖洗部34,和搬出部 3 5所構成。搬人部3 1之高度位準與脫水烘乾單位2 0 a之搬 出用輸送帶室2 6之高度位準相同。從搬入部3 1到搬出部3 5 ,利用滑動器5 a〜5 d將基板順序的搬蓮到與基板鄰接之處 理部。滑動器5 a〜5 d將於後面進行詳细之說明。 預烘乾單位40 a、40 b是使靜止式之處理室和搬蓮室堆積 成多段者。圖13表示預烘乾單位40a、40b之構造。預烘乾 室40a從下面起依照順序堆積有冷卻室(CP) 43a,空室,搬 入用輸送帶室(I N C / V ) 4 1,冷卻室(C P ) 4 3 b,和加熱室 (Η P ) 4 2 a,形成多段之單位。預烘乾單位4 0 b以包夾旋轉機 器人4 c之方式被配置在預烘乾單位4 0 a之相反側之返回線 ,從下面起依照順序重疊有冷卻室(C P ) 4 3 c,通過室 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) ~ -3 8 - (請先閣讀背面之注意事項再填寫本頁) 袭-- 訂 A 7 B7 五、發明説明(36) (THROUGH C/V)44’ 空室’和 2個之加熱室(HP)42b’ 42c’ 彤成多段之單位。在搬人用輸送帶室41和通過室44分別配 備有輸送帶。預烘乾單位40a之搬入用輸送帶室41之高度 位準與抗蝕劑塗布簞位30之搬出部35之高度位準相同。 顯像單位80是連續葉片式之處理部,由搬入部81 ’顯像 部82,水洗部83,乾燥部84 ’和搬出部85所構成。從搬人 部81到搬出部85,利用輸送帶用來沿著水平方向搬蓮基板 。搬入部81之高度位準與預烘乾單位40a之通過室44之高 度位準相同。 後烘乾單位9〇a、90b是使靜止式之處理室,搬蓮室’和 通過室重叠成多段之單位。圖14表不後乾燥單位90a、90b 之構造。後烘乾單位9〇a從下面起依照順序重疊有冷卻室 (CP)94b,搬入用輸送帶室(IN C/V)91,搬出用輸送帶室 (OUT C/V)95,和2個之加熱室(HP)93b、93c,形成多段之 單位。後烘乾單位90bM包夾旋轉機器人4a之方式被配置 在相反側之往行線,從下面起依照順序重疊有冷卻室(C P ) 94a,通過室(THROUGH C/V)96,緩衝器室(BF)92,空室, 經濟部中央標準局員工消費合作社印製 (請先閲讀背面之注意事項再填寫本頁) 和加熱室(HP)93a,形成多段之單位。在緩衝器室92内設 有多個之装載部9 2 a可K用來保管多個基板。在搬入用輸 送帶室9 1,搬出用輸送帶室9 5,和通過室9 6分別配備有輸 送帶。後烘乾單位9 0 a之搬入用輸送帶室9 1之高度位準’ 與脫水烘乾單位2 0 b之通過室27,顯像單位8 0之搬運部8 5 和後烘乾單位4 0 b之通過室4 4之高度位準相同。另夕卜,後 烘乾單位9 0 a之搬出用輸送帶室9 5之高度位準,與空冷單 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) _ 3 g 1 五、發明説明(37) A7 B7 經濟部.中央標準局3工消'*<合呤.杜印衷 位99之高度位準相同。 旋轉機器人4a〜4e是未具有能夠Μ旋轉用來產生水平方 向之移動之機構之群集型之機器人。該旋轉機器人4a〜4e ,如圖11所示,分別具有:軀幹部101,可Μ進行旋轉和 升降;臂部1 0 2,從軀幹部1 0 1延伸;和保持部1 0 3,用來 保持被装在臂部102之前端之基板。旋轉機器人4a〜4e, 對於重疊成為多段之各個處理室,輸送帶室,和通過室, 進行旋轉和升降之動作,利用臂部102之進退和軀幹部101 之上下動作,用來替換基板或進行授受之動作,藉Μ移動 基板。例如,被配置在脫水烘乾單位2 0 a、20b之間之旋轉 機器人4b,可K如圔11中之實線和虛線所示的變換態樣。 滑動器5 a〜5 d利用矩形蓮動使基板之位置沿著一個方向 滑動指定之距離,被設在抗蝕劑塗布單位3 0之各個部之間 。例如,被配置搬入部3 1和旋轉塗膜部3 2之間之滑動器5 a ,移動到圔1 5之虛線所示之位置使兩臂張開用來従搬入部 3 1將基板提上。然後,水平移動到旋轉塗膜部3 2,使基板 下降。 <基板處理> 下面將順序的說明利用基板處理装置進行基板之處理。 在分度器部2,利用分度器機器人2a從卡匣3中取出之基 板,首先被搬蓮到ϋ V臭氧洗淨室11,利用紫外線之照射用 來使表面之有機污染物產生氧化分離。完成該處理後之基 板被分度器機器人2 a移送到搬入部1 2。基板從搬入部1 2被 搬運到洗淨部1 3 *進行利用滾茼刷之刷洗洗淨,超音波噴 (請先閲讀背面之注意事項再填寫本頁) 裝_ 訂 本紙張尺度適用中國國家標準(CNS ; Λ.:規洛 -4 0 經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明(3S) 霧洗淨,和利用高壓噴射噴霧之純水洗淨。此處之洗淨亦 可Μ使用鹼性洗淨液等進行處理。然後,在液滴除去部1 4 ,利用空氣刀使殘留在基板表面之純水之液滴進行飛散。 完成洗淨單位1 0之處理後被移送到搬出部1 5^基板,經 由輸出帶被搬運通過後烘乾單位9 0 b之通過室9 6,進入到 脫水烘乾單位20a之搬入用輸送帶室2 1。在脫水烘乾單位 20a、2 0b,利用旋轉機器人4a將基板搬運到各個處理室。 搬蓮到搬人用輸送帶室21之基板,這時被搬蓮到加熱室 23a、23 b中之空的室。在該處利用熱板對基板加熱用來去 除水分。這時,當在後段之曝光機50進行罩幕變更和旋轉 塗膜部3 2之裝置洗淨等之時,基板被暫時的保管在適當之 緩衝室2 2,然後被搬運到加熱室2 3 a、2 3 b。其次將基板搬 運到密著強化室24。在密著強化室24為眷達成提高抗蝕劑 膜和基板之密著性之目的,對基板實施加熱,Μ蒸氣狀塗 布HMDS(六甲撐二泠t氨烷)。然後,再將基板搬蓮到冷卻室 2 5 a、2 5 b、2 5 c中之任何一個,利用冷板加K冷卻。依照 這種方式進行過抗蝕劑塗布處理之前處理之脫水烘乾之基 板,被搬運到搬出用輸送帶室26,從該處Μ輸送帶將基板 搬運到抗蝕劑塗布單位3 0之搬入部3 1。 在抗蝕劑塗布單位3 0,首先利用滑動器5 a將基板搬蓮到 旋轉塗膜部3 2,對基板進行抗蝕劑(塗布液)之塗布。該旋 轉塗膜部3 2由抗蝕劑供給糸統,旋轉馬達,和切割器等所 構成,使抗鈾劑滴下到水平之基板上,利用基板之旋轉用 來在基板上形成均一之抗蝕劑膜。形成有抗鈾劑膜之基板 本紙張尺度適用中國國家標準(CNS ) A4規格(210'乂29*7公釐) —^m 1 —^^1· ^ϋϋ ϋ^ϋ mu 4] //' m^i ... 一 / / (請先閱讀背面之注意事項再填寫本頁) 訂 -41 經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明(39) ,被滑動器5 b搬運到調位處理部3 3,用來進行抗蝕劑膜之 調位和乾燥處理。然後,利用滑動器5 c將基板移送到邊緣 沖洗部34。在該邊緣沖洗部34,為著防止基板端面之抗蝕 劑膜之剝離而產生灰塵,所Μ利用溶劑對基板表面之周邊 和端面部份之抗蝕劑進行去除之處理。完成該等與抗蝕劑 塗布有關之各個處理後之基板,被滑動器5 d搬運到搬出部 35 〇 從搬出部35被搬蓮到與搬出部35鄰接之預烘乾單位40a 之搬入用輸送帶室41之基板,被旋轉機器人4c轉移到加熱 室42 a、42 b、42 c的其中之一。在該處為著達成使基板上 之抗蝕劑膜中之殘留溶劑蒸發和強化基板之密著性之目的 ,所Μ進行加熱處理。在冷卻室43a、43b、43c的其中之 一,使基板冷卻,利用旋轉機器人4c將其搬蓮到多段授受 部9。 然後,利用旋轉機器人4d、4e將基棱移送到曝光機5 0, 對其施加曝光處理。實質上是對基板上之抗蝕劑,施加感 光原圖上之圖型之處理。利用旋轉機器人4e從曝光機5 0中 取出被曝光之基板 > 經由緩衝器部8 c,將其保持在旋轉機 器人4d。另外,當對曝光機50進行搬人/搬出時,如有需 要可Μ將基板暫時保管在緩衝器部8 a、8 b、8 c。 其次,將基板從旋轉機器人4d移動到標題機6 0和邊緣曝 光機7 0,分別進行印字燒附和邊緣曝光。在邊緣曝光時, 除了基板上之顯示部份外,對所欲除去之基板周邊之抗蝕 劑進行曝光處理。在此處是邊緣曝光機配置在該位置,但 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) " -42 - (請先閣讀背面之注意事項再填寫本頁)Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (3.1) 9 0 b, dehydration drying unit 20 a, resist coating unit 30, pre-drying unit 40 a, etc. The return line from the exposure machine 50 is provided with a pre-drying unit 40b, a developing unit 80, a dehydration drying unit 20b, a post-drying unit 90a, an air-conditioning unit 99, and the like. In addition, buffer units 8a to 8c are provided near the rotary robot 4e. When the exposure machine 50 receives and receives substrates, it serves as a place for receiving and receiving or a temporary waiting place. This substrate processing device is a unit cassette method. The glass substrate is taken out of the cassette 3 loaded in the indexer unit 2 (hereinafter referred to as the substrate), and it is sent to each processing unit, and the substrate after completion of each processing process Stored in the same cassette 3. The removal of the substrate from the cassette 3 and the storage of the substrate in the cassette 3 are performed using an indexer robot 2a. The indexer robot 23 includes a rotatable arm that holds the substrate and can move along the column of the cassette 3. . The cleaning unit 10 is a continuous blade type processing unit, and is composed of a carry-in unit 12, a washing unit 13, a droplet removal unit 14, and a carry-out unit 15. In addition, a UV ozone cleaning chamber 11 is provided above the carry-in section 12. That is, the ϋV ozone cleaning chamber 11 is superimposed on the cleaning unit 10. From the ϋV ozone cleaning chamber 11 to the carry-in section 12, the indexer robot 2 a is used to carry the substrate. From the carrying section 12 to the carrying section 15, a conveyor belt is used to carry the substrate, and processes such as cleaning and droplet removal are performed. In the cleaning section 1, 3, pure water or a chemical solution, M brushes, ultrasonic waves, high-pressure spraying, and the like are used for washing. In addition, the conveyor belt can also use a roll conveyor belt with a small amount of dust corresponding to the clean room. The dewatering and drying units 20 a and 20 b are units in which a stationary processing chamber, a conveyor belt chamber (conveying chamber), and a passing chamber are overlapped into a plurality of sections. Fig. 12 shows the structure of the dehydration and drying units 20a and 20b. Dewatering and drying unit 2 a From the bottom, the Chinese National Standard (CNS) A4 specifications (210X297 mm) are applied according to the paper size. 71 (Please read the precautions on the back before filling this page) 'Installation 丨 Central Standards Bureau of the Ministry of Economic Affairs Printed by employee consumer cooperative A7 B7 V. Description of the invention (Cooling chamber (CP) 2 5 a is superimposed in sequence, conveyor belt chamber (INC / V) 21 for carrying in, conveyor belt room (OUT C / V) 26 for carrying out, cooling The chamber (CP) 25C and the adhesion-enhancing chamber UP) 24 form a multi-stage unit. The dehydration and drying unit 20bM is sandwiched with the rotary robot 4 b, and the return line on the opposite side of the dehydration and drying unit 2 0 a is arranged, and the cooling chamber (CP) 2 5 b is superimposed in order from the bottom. The passing chamber (THROUGH C / V) 27, buffer chamber (BF) 22, and two heating chambers (HP) 23a, 23b, forming a multi-stage unit. In the buffer chamber 22, a plurality of loading sections 223 are provided to store a plurality of substrates. Conveyor belts are provided in the carrying-in belt chamber 21, the carrying-out belt chamber 26, and the passing chamber 27, respectively. The height level of the conveying belt chamber 21 of the dewatering and drying unit 20a is the same as the height level of the conveying unit 15 of the washing unit 10. The resist coating unit 30 is a blade-type processing unit, and is composed of a carry-in unit 31, a rotary coater unit 32 * position processing unit 33, an edge processing unit 34, and a carry-out unit 35. The height level of the moving part 31 is the same as the height level of the conveyor belt room 26 for the dewatering and drying unit 20 a. From the carrying-in portion 31 to the carrying-out portion 3 5, the substrates are sequentially transferred to the processing portion adjacent to the substrate by the sliders 5 a to 5 d. The sliders 5 a to 5 d will be described in detail later. The pre-drying units 40 a and 40 b are those in which the static processing chamber and the lotus transfer chamber are stacked into a plurality of sections. FIG. 13 shows the structure of the pre-drying units 40a and 40b. The pre-drying chamber 40a has a cooling chamber (CP) 43a, an empty chamber, a conveyor belt chamber (INC / V) 4 1, a cooling chamber (CP) 4 3 b, and a heating chamber (Η P ) 4 2 a, forming a multi-segment unit. The pre-drying unit 4 0 b is arranged on the return line on the opposite side of the pre-drying unit 4 0 a in a way that the rotary robot 4 c is sandwiched. The cooling chamber (CP) 4 3 c is superimposed in order from the bottom. The size of the paper in the room applies to the Chinese National Standard (CNS) A4 (210X297 mm) ~ -3 8-(please read the precautions on the back before filling this page).-Order A 7 B7 V. Description of the invention (36 ) (THROUGH C / V) 44 'empty room' and 2 heating rooms (HP) 42b '42c' are multi-stage units. Conveyor belts are respectively provided in the conveyer belt room 41 and the passing room 44. The height level of the conveying belt chamber 41 of the pre-baking unit 40a is the same as the height level of the conveying portion 35 of the resist coating position 30. The developing unit 80 is a continuous blade type processing unit, and is composed of a carrying-in unit 81 'developing unit 82, a washing unit 83, a drying unit 84', and a carrying-out unit 85. From the carrying section 81 to the carrying section 85, a conveyor belt is used to carry the lotus substrate in the horizontal direction. The height level of the carry-in portion 81 is the same as the height level of the passing chamber 44 of the pre-drying unit 40a. The post-drying units 90a and 90b are units in which a stationary processing chamber, a lotus transfer chamber 'and a passing chamber are overlapped into a plurality of sections. Figure 14 shows the structure of the post-drying units 90a, 90b. The post-drying unit 90a overlaps the cooling chamber (CP) 94b, the conveyor belt chamber (IN C / V) 91, the conveyor belt chamber (OUT C / V) 95, and 2 in order from the bottom. The heating chambers (HP) 93b and 93c form a multi-stage unit. The post-drying unit 90bM wraps the rotary robot 4a on the opposite line. From the bottom, the cooling chamber (CP) 94a, the passing chamber (THROUGH C / V) 96, and the buffer chamber ( BF) 92, empty room, printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs (please read the precautions on the back before filling out this page) and heating room (HP) 93a, forming a multi-level unit. A plurality of loading sections 9 2 a are provided in the buffer chamber 92 to store a plurality of substrates. Conveyor belts are provided in the carry-in conveyor belt chamber 91, the carry-out conveyor belt chamber 95, and the passing chamber 96. Post-drying unit 9 0 a's conveying belt chamber 9 1's height level 'and dewatering drying unit 2 0 b's pass-through chamber 27, development unit 8 0's conveying section 8 5 and post-drying unit 4 0 The heights of the passing chambers 4 and 4 are the same. In addition, the height level of the conveyor belt room 95 of the after-drying unit 90 a and the paper size of the air-cooled single book are applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) _ 3 g 1 5. Description of the invention (37) A7 B7 Ministry of Economic Affairs, Central Bureau of Standards, 3 Industrial Consumption '* &#; Horin. Du Yin's level of 99 is the same. The rotary robots 4a to 4e are cluster-type robots which do not have a mechanism capable of rotating in the horizontal direction by M rotation. The rotary robots 4a to 4e, as shown in FIG. 11, each have: a trunk portion 101 that can be rotated and lifted; an arm portion 102 that extends from the trunk portion 101; and a holding portion 103 that is used to The substrate mounted on the front end of the arm portion 102 is held. Rotating robots 4a to 4e rotate and lift the processing chambers, conveyor belt chambers, and passing chambers that are superimposed into multiple sections, using the advancement and retreat of the arm 102 and the upward and downward movement of the trunk 101 to replace the substrate or perform The action of giving and receiving moves the substrate by M. For example, the rotating robot 4b arranged between the dehydration and drying units 20a and 20b can be transformed as shown by the solid line and the broken line in 圔 11. The sliders 5 a to 5 d use rectangular motion to slide the position of the substrate in a direction by a specified distance, and are provided between the parts of the resist coating unit 30. For example, the slider 5 a disposed between the carrying-in part 31 and the rotary coating part 32 is moved to a position shown by a dotted line of 圔 1 5 so that both arms are opened for the carrying-in part 31 to lift the substrate up. . Then, the substrate is moved horizontally to the spin coating portion 32, and the substrate is lowered. < Substrate processing > The following will sequentially describe the processing of a substrate by a substrate processing apparatus. In the indexer section 2, the substrate taken out from the cassette 3 by the indexer robot 2a is first transferred to the ozone cleaning chamber 11 and is used to oxidize and separate organic pollutants on the surface by irradiation with ultraviolet rays. After the processing is completed, the substrate is moved to the loading section 12 by the indexer robot 2a. The substrate is transferred from the loading section 1 2 to the cleaning section 1 3 * Wash and wash with a roller brush and ultrasonic spray (please read the precautions on the back before filling this page) Standards (CNS; Λ.: Ruo-4 0 Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (3S) Mist washing, and pure water washing using high pressure spray spray. Wash here It can also be treated with an alkaline cleaning solution, etc. Then, in the droplet removal section 1 4, the droplets of pure water remaining on the surface of the substrate are scattered with an air knife. After completing the treatment of the cleaning unit 10 It is transferred to the 15 ^ substrate of the unloading section, and is transported through the output belt 9 through the pass-through chamber 9 0 b of the drying unit 9 into the conveying belt chamber 21 of the dewatering and drying unit 20 a. In the dewatering and drying unit 20a and 20b, the substrate is transferred to each processing chamber by the rotary robot 4a. The lotus is transferred to the substrate of the conveyer belt chamber 21, and is then transferred to the empty chamber in the heating chambers 23a and 23b. Here The substrate is heated by a hot plate to remove moisture. At this time, when the When the exposure machine 50 of the stage performs the mask change and the cleaning of the device of the rotary coating section 32, the substrate is temporarily stored in an appropriate buffer chamber 2 2 and then transferred to the heating chamber 2 3 a, 2 3 b Next, the substrate is transferred to the adhesion-strengthening chamber 24. The adhesion-strengthening chamber 24 is used to achieve the purpose of improving the adhesion between the resist film and the substrate. taminoalkane). Then, the substrate is moved to any of the cooling chambers 2 5 a, 2 5 b, and 2 5 c, and cooled with a cold plate plus K. Before the resist coating process is performed in this way The processed dehydrated and dried substrates are conveyed to the conveying belt chamber 26, and from there, the substrates are conveyed to the carrying-in portion 31 of the resist coating unit 30. At the resist coating unit 30, First, the substrate is transferred to the spin coating portion 32 using a slider 5 a to apply a resist (coating liquid) to the substrate. The spin coating portion 32 is supplied by a resist system, a rotary motor, and The cutter and other components make the anti-uranium agent drip on the horizontal substrate, and use the rotation of the substrate It is used to form a uniform resist film on the substrate. The substrate on which the uranium resist film is formed The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 '乂 29 * 7 mm) — ^ m 1 — ^^ 1 · ^ ϋϋ ϋ ^ ϋ mu 4] // 'm ^ i ... I / / (Please read the precautions on the back before filling out this page) Order -41 Printed by A7 B7, Consumer Cooperatives, Central Standards Bureau, Ministry of Economic Affairs 5. Description of the invention (39), the slider 5 b is transported to the adjustment processing section 33 for positioning and drying of the resist film. Then, the substrate is transferred to the edge processing section by the slider 5 c. 34. In the edge washing portion 34, in order to prevent the peeling of the resist film on the end surface of the substrate to generate dust, a solvent is used to remove the resist on the periphery of the substrate surface and the end surface portion. After completion of the various processes related to the application of the resist, the substrate is carried by the slider 5 d to the carrying-out section 35. The carrying-out section 35 is moved to the pre-drying unit 40 a adjacent to the carrying-out section 35 for carrying in. The substrate of the belt chamber 41 is transferred to one of the heating chambers 42 a, 42 b, and 42 c by the rotary robot 4 c. Here, in order to evaporate the residual solvent in the resist film on the substrate and enhance the adhesion of the substrate, heat treatment is performed. The substrate is cooled in one of the cooling chambers 43a, 43b, and 43c, and is transferred to the multi-stage receiving and receiving unit 9 by the rotary robot 4c. Then, the basal edges are transferred to the exposure machine 50 by the rotary robots 4d and 4e, and an exposure process is applied to them. Essentially, the resist on the substrate is treated with a pattern on the photo-sensitive original image. Take out the exposed substrate from the exposure machine 50 using the rotating robot 4e > Hold it to the rotating robot 4d via the buffer portion 8c. When the exposure machine 50 is moved / unloaded, the substrate can be temporarily stored in the buffer sections 8a, 8b, 8c if necessary. Next, the substrate is moved from the rotary robot 4d to the title machine 60 and the edge exposure machine 70, and is subjected to printing and edge exposure, respectively. During the edge exposure, in addition to the display portion on the substrate, the resist on the periphery of the substrate to be removed is exposed. Here the edge exposure machine is configured in this position, but this paper size applies the Chinese National Standard (CNS) A4 specification (210X 297 mm) " -42-(Please read the precautions on the back before filling this page)

一 Ϊ » I I - I - I iJ-r _ I Ϋ— I '裝--- 訂 經濟部中央標準爲員工消費合作社印製 A7 B7 五、發明説明(4〇) 是也可Μ依照需要在該處配置背面曝光單位。另外,亦可 Μ配置背面曝光單位用來代替標題機60。完成該處理後之 基板,被旋轉機器人4d移送到多段授受部9,利用圖中未 顯示之滑動器將基板装載在輸送帶部79。然後,使基板從 輸送帶部79通過預烘乾單位40b之通過室44之後被搬運到 顯像單位8 0之搬入部8 1。 在顯像單位80,利用輸送帶基板從搬入部81搬運到搬出 部δ 5。然後,在顯像部8 2利用噴嘴將噴霧狀之現像液,Μ 噴流狀施加到基板表面藉Μ進行噴霧顯像,或是在基板上 形成顯像液積存,藉Μ進行葉片顯像。在水洗部83和乾燥 部8 4,對顯像後之基板進行洗淨和乾燥。完成該等處理後 之基板,從搬出部85通過預烘乾單位20b之通過室27後被 輸送帶搬蓮到後烘乾單位9〇a之搬入用輸送滯室91。 在後烘乾單位9 0 a、9 0 b,Μ蒸發方式除去基板上之抗蝕 劑膜中或殘留在表面之顯像液或沖洗液,為著達成抗蝕劑 之硬化和強化與基板之密著性之目的,所Μ進行熱處理。 實質上,利用加熱室9 3 a、9 3 b、9 3 c之任何一個之熱板, 用來對基板進行加熱,利用冷卻室9 4 a、9 4 b之任何一個之 冷板,用來對基板進行冷卻。在此處因為加熱室和冷卻室 設置有多個,所K可獲得充分之加熱時間和冷卻時間。另 夕h狗4收考時的保管在適當之緩衝器室92。施加過該等處理 之基板被移送到搬出用輸送帶室9 5,然後被搬運到空氣冷 卻單位99。然後,利用分度器機器人2a將被空氣冷卻單位 99空氣>4釕i基板收容在原來之卡匣3。 本紙張尺度適用中國國家標举(CNS ) A4規格(210X297公釐) -4 3 — (請先閱讀背面之注意事項再填寫本頁) -裝— 訂 經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明(41) <裝置之特徵> 首先,在多段爐之脫水烘乾單位20a、20b,預烘乾單位 40a、40b,和後烘乾單位90a、90b,組合搬入用和搬出用 輸送帶室21、26、41、91、95和緩衝器室22、92。因此, 在用以將基板搬入或搬出之機器人近傍之空間,可Μ不需 要設置習知技術之授受部和用Μ暫時保管基板之緩衝器部 。經由節省該等空間,可Μ使本基板處理裝置之設置所需 要之地板面積減小。 另外,在多段爐之脫水烘乾單位20b,預烘乾單位40b, 和後烘乾單位90b,組合用Μ讓基板通過之通過室27、44 、96。該基板處理裝置具有被配置成大概互相平行之往行 線和返回線。另外,在布置上,在返回線之途中配置有往 行線之脫水烘乾處理所使用之脫水烘乾單位20b,在往行 線之途中配置有返回線之後烘乾處理所使用之後烘乾單位 9 0 b。但是,依照上述之方式,因為在該等單位2 0 b,9 0 b 組合有通過室2 7、9 6,所Μ在平面上可Μ回避該等單位 2 0 b、9 0 b,不需要搬蓮基板,因此可Μ抑制裝置之成本和 搬運時間。另外,因為在往行線和返回線之互相面對之位 置配置有用Κ進行相同之處理之多段爐之2個單位(例如, 脫水單位2 0 a、2 0 b ),所以用Μ進行1個處理(例如,脫水 烘乾)之機器人可Μ只配置1個能夠在該2個單位之間進行 旋轉者,不一定要具有水平移動之功能。 另外,在使搬入用輸送帶室和輸出用輸送帶室分開之脫 水烘乾單位2 0 at中,搬人用輸送帶室2 1和搬出用輸送帶室 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) (請先閱讀背面之注意事項再填寫本頁) -裝— '1Τ—ί 1 . 44 經濟部中央標準局員工消費合作社印製 A7 B7五、發明説明(!2) 2 6分開的設置成多段,其中使洗淨單位1 0之基板搬運中心 媒和抗蝕劑塗布單位3 0之基板搬運中心線互相偏移藉Μ因 應。另外,配合洗淨單位1 0之控制的軀動搬入用輸送帶室 2 1之輸送帶,和配合抗蝕劑塗布單位3 0之控制的驅動搬出 用輸送帶室21之輸送帶。利用這種方式,即使前工程之洗 淨與後工程之抗蝕劑塗布之控制未鍵結時,因為搬入用輸 送帶室21和搬出用輸送帶室26分開設置,所Κ可Κ吸收控 制之偏移。 另外,與搬入用輸送帶室或搬出用輸送帶室鄰接之單位 之搬運基板之位置具有相同之高度。例如,洗淨單位1 0之 基板搬蓮之高度位置與脫水烘乾單位2 0 a之搬入用輸送帶 室26之高度位置一致。因此,單位間之基板之搬蓮可Μ在 短時間内順利的進行。 [第8實施形態] 圖1 6表示本發明之基板處理装置之一實施形態(第8實施 形態)。該基板處理裝置是用Μ進行曝光之前處理之裝置 ,用來進行從抗蝕劑塗布前之洗劑到抗蝕劑塗布止之處理。 在該基板處理裝置中,將分度器部2,洗淨單位1 0,脫 水烘乾單位2 0 a、2 0 b,抗蝕劑塗布單位3 0,預烘乾單位 4 0a、4 0 b之各個處理部,和旋轉機器人4 b、4 c配置成為如 圖1 6所示。其中,其與第7實施形態相同或同樣者之符號 使用相同之符號,各個處理部因為與第7實施形態相同或 同樣,故其說明加Μ省略。 在圖16所示之布置之基板處理裝置中,因為在脫水烘乾 (請先閱讀背面之注意事項再填寫本頁) -裝--- 、1Τ -ml -- I- -- -- i 1—li HI— nfn 本紙張尺度適用中國國家標準.(CNS ) A4規格(210X297公釐) 45 經濟部中央標準局員工消費合作社印製 A7 B7五、發明説明(45 ) ,經由裝入葉片式處理部可κ很容易變成不使用旋轉式之 處理方法,而是採用刷子刷洗和噴霧顯像等,可κ以低成 本因應被處理基板之大型化。 在申請專利範圍第1 2〜2 9項之本發明中,因為採用多段 處理郜,將搬運室和處理室配置成上下重疊,所Μ基板處 理裝置在平面上可Μ變小。 [附圖之簡單說明] 圔1是本發明之第1實施形態之基板處理裝置之平面圖。 圖2是授受部之狀態圖。 圖3是授受部之狀態圖。 --一一. 一 ,广圖4是授受部之狀態疆。 圖5是本發明之第2實施形態之基肩奏理裝置之平面圖。 層6是本發j且之第3實施I-態m處-:理裝_„置之平面圖。 圖7是本發明之第4實施.形_態> 之基板處理裝置之平面圖。 -V---------------------------------------------------- 圖δ是本發明之第5實施形態—之-基.板處理裝置平面圖。 圖-9.是本發明之第6實施形態.之UL處J里裝置之平面圖。 圖10是本發明之_第_ . 7實施形態之-基板處理裝置之平面圖。 〜圖1 1是旋轉_器,人之概路圖.一―。 —...... 圖1 2是脫水烘乾單位之橫斷面圖。 ........-................................ 圖U是預烘乾單位之橫斷—面圖。 凰.14是後烘乾.單位之.+横斷面圖。 ί 圖1 5是滑動器之.動作圖。 圖1 6是本發明之第8實施形態之基板處理裝置之平面圖。 圖1 7是本發明之第9實施形,態之基板處理裝置之平面圖。 本紙張尺度適用中國國家標隼(CNS ) Α4規格(210Χ297公釐) _ A S - (讀先閱讀背面之注意事項再填寫本頁) 袭. 、^1 A7 B7 經濟部中央標準局員工消費合作社印製 五、發明説明(扣). 圖18是本發明之第丄α實施形態之基板處理裝置之平面圖。 ..... · :———»— ——-冊+ [符號之說明] 1,101,201,301,401,501....基板處理裝置 4〜6,104〜108,304〜308,404〜407,502〜509.… 旋轉機器人 5 a.....軀幹部 5 b .....臂部 7......授受部 7 a.....上下梢(第1支持構件) 7b.....横動梢(第2支持構件) 1 0,11 0,3 1 0,41 0......洗淨單位 20 * 1 20 > 320 « 420 ......脫水烘乾單位(加熱單位) 30,130,330,430,532......抗蝕劑塗布單位(塗布 早) 40,140,340,440 .....預烘乾單位(加熱單位) 50.....曝光機 80,180,380,480,580.....顯像單位 9 0,1 9 0,3 9 0,4 9 0 ......後烘乾單位(加熱單位) 4 a〜4 e......旋轉機器人 10 ......洗淨單位(其他處理部、) 2 0 a,2 0 b ....脫水烘乾單位(第1,第2多段處理部或第3 ,第4多段處理部) 21 .....搬入用輸送帶室(搬蓮室) 22 .....媛衝器室 -4 9 - (請先閱讀背面之注意事項再填寫本頁) !裝--I »»-II-I-I iJ-r _ I Ϋ— I 'install --- Order the central standard of the Ministry of Economic Affairs to print A7 B7 for the employee consumer cooperatives V. Description of the invention (4〇) Yes, as required. Place the back exposure unit everywhere. Alternatively, a rear exposure unit may be provided instead of the title machine 60. After completion of the processing, the substrate is transferred to the multi-stage receiving and receiving section 9 by the rotary robot 4d, and the substrate is loaded on the conveyor belt section 79 using a slider not shown in the figure. Then, the substrate is conveyed from the conveyor belt portion 79 through the passing chamber 44 of the pre-baking unit 40b, and then transferred to the carrying-in portion 81 of the developing unit 80. In the developing unit 80, the substrate is carried from the carrying-in part 81 to the carrying-out part δ 5 by a conveyor belt substrate. Then, in the developing section 82, the sprayed liquid image liquid M is applied to the surface of the substrate in the form of a spray, and the spray image is developed by M, or a developing liquid reservoir is formed on the substrate, and the blade is imaged by M. In the water washing section 83 and the drying section 84, the developed substrate is washed and dried. After the completion of these processes, the substrate is transferred from the unloading section 85 to the pre-drying unit 20b through the passage chamber 27 and then conveyed to the post-drying unit 90a by the conveying stagnation chamber 91. In the post-baking unit 90 a, 90 b, the M evaporation method removes the developing solution or washing solution remaining on the surface of the resist film on the substrate or in order to achieve the hardening and strengthening of the resist and the substrate. For the purpose of adhesion, all heat treatments are performed. In essence, a hot plate using any one of the heating chambers 9 3 a, 9 3 b, 9 3 c is used to heat the substrate, and a cold plate using any one of the cooling chambers 9 4 a, 9 4 b is used to The substrate is cooled. Since there are multiple heating and cooling chambers, sufficient heating time and cooling time can be obtained. In addition, the dog 4 is kept in a suitable buffer room 92 at the time of admission. The substrates to which these processes have been applied are transferred to the carrying-out conveyor chamber 95, and then transferred to the air-cooling unit 99. Then, the indexer robot 2a accommodates the air-cooled unit 99 air> 4 ruthenium i substrate in the original cassette 3. This paper size applies to China National Standards (CNS) A4 specification (210X297 mm) -4 3 — (Please read the precautions on the back before filling out this page)-Installation — Order printed by the Consumers Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs B7 V. Description of the invention (41) < Features of the device > First, the dehydration and drying units 20a, 20b, the pre-drying units 40a, 40b, and the post-drying units 90a, 90b in the multi-stage furnace are combined for use in Conveyor belt chambers 21, 26, 41, 91, 95 and buffer chambers 22, 92. Therefore, in the space near the robot used to carry the substrate in or out, it is not necessary to provide a receiving and receiving unit of the conventional technology and a buffer unit for temporarily storing the substrate. By saving these spaces, the floor area required for the installation of the substrate processing apparatus can be reduced. In addition, the dehydration drying unit 20b, the pre-drying unit 40b, and the post-drying unit 90b of the multi-stage furnace are used in combination to pass the substrate through the chambers 27, 44, and 96. This substrate processing apparatus has a forward line and a return line arranged approximately parallel to each other. In addition, in the layout, the dehydration and drying unit 20b used for the dewatering and drying process on the line is arranged on the way to the return line, and the post-drying unit used for the drying process after the return line is arranged on the way to the line. 9 0 b. However, according to the above-mentioned method, because the units 2 0 b and 9 0 b are combined with the passage chambers 2 and 7 6, the units 2 can avoid the units 2 b and 9 0 b on the plane, and do not need Since the substrate is moved, the cost and transportation time of the device can be suppressed. In addition, since two units of a multi-stage furnace (for example, dehydration units 20a, 20b) with the same treatment are arranged at the positions where the forward line and the return line face each other, one is performed with Μ. The processing (for example, dehydration and drying) robot can be configured with only one person capable of rotating between the two units, and does not necessarily have the function of horizontal movement. In addition, in the dewatering and drying unit 20 at which the conveying belt chamber for conveyance is separated from the conveying belt chamber for conveyance, the conveying belt chamber 21 for conveying people and the conveying belt chamber for conveying are applicable to the Chinese national standard (CNS). A4 specification (210X297 mm) (Please read the notes on the back before filling out this page) -Installation — '1Τ—ί 1. 44 A7 B7 printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention (! 2) 26 is divided into a plurality of sections, in which the substrate transfer center medium of the cleaning unit 10 and the substrate transfer center line of the resist coating unit 30 are offset from each other to respond. In addition, a conveyor belt in accordance with the control of the washing unit 10 and a conveyor belt chamber 21 for driving in and a conveyor belt chamber 21 in accordance with the control of the resist coating unit 30 for driving out. In this way, even when the cleaning of the front process and the control of the resist coating of the rear process are not bonded, since the conveyor belt chamber 21 for carrying in and the conveyor belt chamber 26 for carrying out are provided separately, the absorption can be controlled. Offset. In addition, the positions of the transported substrates of the units adjacent to the carrying-in belt chamber or the carrying-out belt chamber have the same height. For example, the height position of the substrate transfer lotus in the cleaning unit 10 is the same as the height position of the conveyor belt chamber 26 in the dewatering and drying unit 20 a. Therefore, the transfer of the substrate between the units can be smoothly performed in a short time. [Eighth Embodiment] Fig. 16 shows an embodiment (eighth embodiment) of a substrate processing apparatus according to the present invention. This substrate processing device is a device for performing pre-exposure processing by using M to perform processing from a lotion before the resist application to a resist application. In this substrate processing apparatus, each of the indexer unit 2, the washing unit 10, the dehydration drying unit 20a, 2b, the resist coating unit 30, and the pre-baking unit 40a, 40b The processing unit and the rotary robots 4 b and 4 c are arranged as shown in FIG. 16. Here, the same reference numerals are used for the same or the same symbols as those in the seventh embodiment, and the description of each processing unit is omitted because they are the same as or similar to the seventh embodiment. In the substrate processing apparatus arranged as shown in FIG. 16, because it is being dehydrated and dried (please read the precautions on the back before filling this page) -install ---, 1T -ml-I---i 1 —Li HI— nfn This paper size applies to Chinese national standards. (CNS) A4 size (210X297 mm) 45 Printed by the Consumers Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (45), processed by blade loading The part κ can easily be changed to a processing method that does not use a rotary type, but brush cleaning and spray development are used. Κ can respond to the increase in size of the substrate to be processed at a low cost. In the invention of claims Nos. 12 to 29 in the scope of patent application, because a multi-stage processing chamber is used, the transfer chamber and the processing chamber are arranged to overlap each other, so that the substrate processing apparatus can be reduced in size on a plane. [Brief Description of the Drawings] 圔 1 is a plan view of a substrate processing apparatus according to a first embodiment of the present invention. Fig. 2 is a state diagram of the receiving and receiving unit. FIG. 3 is a state diagram of the receiving and receiving unit. --One, one, one, Figure 4 is the state of the Ministry of Grant. Fig. 5 is a plan view of a base shoulder playing apparatus according to a second embodiment of the present invention. Layer 6 is a plan view of the third embodiment I-state m-: physical installation__setup of the present invention. FIG. 7 is a plan view of the substrate processing apparatus of the fourth embodiment of the present invention. Form_state. -V -------------------------------------------------- -Figure δ is a plan view of the fifth embodiment of the present invention-the base plate processing device. Figure -9 is a plan view of the UL location J device in the sixth embodiment of the present invention. Figure 10 is a plan view of the invention. _ 第 _. 7th embodiment-a plan view of the substrate processing device. ~ Figure 11 is a schematic diagram of a rotary device, a person... ............. Figure 12 is a horizontal view of the dehydration and drying unit. Section view .............................. U Cross-section view of dry unit. Phoenix.14 is the post-drying unit and cross-section view of unit. Ί Figure 15 is the operation diagram of the slider. Figure 16 is the eighth embodiment of the present invention. Plan view of the substrate processing device. Figure 17 is a plan view of the substrate processing device of the ninth embodiment of the present invention. This paper size applies to the Chinese National Standard (CNS) A4 specification (210 × 297 mm) _ AS-(read first (Read the notes on the back and fill out this page). ^ 1 A7 B7 Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention (deduction). Figure 18 is a plan view of the substrate processing device of the 丄 α embodiment of the present invention ..... — »— ——- Book + [Description of Symbols] 1, 101, 201, 301, 401, 501, ... substrate processing equipment 4 to 6, 104 to 108, 304 to 308, 404 to 407, 502 to 509 ... Rotating robot 5 a ... Trunk part 5 b ..... Arm part 7... Receiving part 7 a .. .. Upper and lower ends (first support member) 7 b ... ..Traverse tip (second support member) 1 0,11 0,3 1 0,41 0 ...... Washing unit 20 * 1 20 > 320 «420 ... dehydration and drying Unit (heating unit) 30, 130, 330, 430, 532 ... resist coating unit (early coating) 40, 140, 340, 440 ..... pre-baking unit (heating unit) 50 ..... exposure machine 80, 180, 380, 480, 580 ..... development unit 9 0, 1 9 0, 3 9 0, 4 9 0 ...... post-drying unit (heating Units) 4 a ~ 4 e ...... Rotating robot 10 ...... Washing units (other processing units, etc.) 2 0 a, 2 0 b .... Dehydration drying unit (No. 1, Multi-stage processing department or 3, 4th multi-stage processing section) 21 ..... Conveyor belt room for transfer (lotus transfer room) 22 ..... Yuan Chongji room-4 9-(Please read the precautions on the back before filling this page )! Install-

、1T !φ 本紙張尺度適用中國國家標準(CNS ) Α4規格(210 X 297公釐) 經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明(,ρ) 2 2 a ....裝載部(裝載裝置) 23a * 23b.....加熱室(處理室) 24.....密著強化室(處理室) 25a,25b .....冷卻室(處理室) 26 .....搬出用輸送帶室(搬蓮室) 27 .....通過室 30.....抗蝕劑塗布單位(其他處理部) 40a > 40b.....預烘乾單位(第1,第2多段處理部或第3 、第4多段處理部) 80.....顯像單位(其他處理部) 9 0 a,90b.....後烘乾單位(第1,第2多段處理部) 101 ....軀幹部 102 ____臂部(基板保持臂) 1 0 3 ....保持部 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) 一 5 0 - (請先閱讀背面之注意事項再填寫本頁)、 1T! Φ This paper size is applicable to Chinese National Standard (CNS) Α4 size (210 X 297 mm) Printed by A7 B7, Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention (, ρ) 2 2 a .... Loading section (loading device) 23a * 23b ..... heating chamber (processing chamber) 24 ..... adhesion strengthening chamber (processing chamber) 25a, 25b ..... cooling chamber (processing chamber) 26. .... Conveyor belt room for carrying out (Lianlian room) 27 ..... Passage room 30 ..... Resist coating unit (other processing unit) 40a > 40b ... Pre-drying Unit (1st, 2nd multi-stage processing unit or 3rd, 4th multi-stage processing unit) 80 ..... Development unit (other processing unit) 9 0 a, 90b ... 1, the second multi-stage processing section) 101 .... torso section 102 ____ arm section (substrate holding arm) 1 0 3 .... holding section This paper size applies Chinese National Standard (CNS) A4 specification (210X 297 male) PCT) One 5 0-(Please read the notes on the back before filling this page)

Claims (1)

s?1 188 39 B8 D8 六、申請專利範圍 .:_1...一種基__貧1_理_1__裝.置,用來搬運被崖.理.基板和對上述之 被處·怪基.板進-行一-連貫之處理,其特徵是具備有: --------- ... 多個旋轉機器人,具有:軀幹部,可Μ旋轉和不能依水 平方向移動;和臂部,從上述之軀幹部延伸,用來保持上 述之被處理基板;和 多個處理部,利用上述之旋轉機器人用來進行被處理基 板-之搬人/搬出。 ...2 .如申請專利範圍:第1項之基板-處裝..置,其中上述之 多#藏 >理部是:1個或多個之靜〜如式:處.肩部,不使上述被 處理基板移動的進行處理;和1個或多個之葉片式處理部 ,包含有使上述被1惠理基一板移動之工程。 3 .如申請專利範圍第2項之基板處理裝置,其中 上述之靜止式處理部是搬入部和搬出部相同;和 上述之葉片式處理部是搬入部和搬出部不同。 4 .;如.申請專利,.範圍第1至 3項之任-何一項之、基板處理裝置 ,其中更具備有授受部,被配置在上述之旋轉機器人之間 ,用來進行上述被處理基板之授受。 經濟部中央標準局員工消費合作社印製 (請先閱讀背面之注意事項再填寫本頁) 5 ,如申請雩利範圍第4項之基板處理裝置,其中上述之 授受部具有:第1裝載部,可Μ用來裝載上述之被處理基 板;第2裝載部,位於上述之第1裝載部之上部;和移動機 構,用來I吏上述之被處理基板從上述之第1裝載部和上述 之第2裝載-部之一方移動到另外一方^ 6 .如申請專利範圍第5項之基板處理裝置,其中 上述之第1裝載部具有可上下移動之第1支持構件; 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X297公釐) _ ! _ 經濟部中央標準局員工消費合作社印製 A8 B8 C8 D8々、申請專利範圍 上述之第2裝—載具二有„_服_冰平移應之第2支持構件; ,上撼之移i農農具有:上王移i機構,甩來使上逑之第 1支持構件上二Ei 1動;.和水平移動機構,用來使上述之第2 ------ ·,,. % .... 爱持構件依水平方向移動。 7 .如申請專JLI範圍第6項之基板處理裝置,其中上述之 臂部可Μ屈伸和上下移動。 8%妞审1青專利範圍第7翁-之里裝置,其中上述之 多涸處理部包含有:洗-淨〜單—位_,_败來對±述之被處理基板 進行洗淨;和加熱單^位1用來對上述之被處理基板進行加熱。 9 J如申請复歷麗+圍」第i項〜之一基板—處――—理裝置,其中上述之 多麗處—理部更包含有之塗,5來將塗布液塗布在上 述之被處理基板,曝光單位,用來使塗布有上~述之塗布液 之上述被處理基板之至-在-之二iL份進行曝光;和顯像罩位 ',用來使曝光後之上-述被.處理--基板進行顯像。 10 .如申請專利範圍第9項之基板.處理裝置,其中 上述之洗淨單位具有用Μ搬蓮上述之被處理基板之搬蓮 裝置,設有位置不同之搬入部和搬出部; 一 上述加熱—單位具有根同:tJi人|复澳出部,不使上述被 處理基板移動的對上述被處理基板進行處理。 11 .如申請專利範圍第9項之基板處理裝置,其中上述之 塗布單位和上述之顯像―單位具有用搬運上述被處理基板 之搬運裝置*設^有位置不同之搬人部和搬出部。 1 2 . —種基板處理裝置,用來對基板進行一連貫之處理 (請先閲讀背面之注意事項再填寫本頁) '裝· 訂 .@1. 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 2 經濟部中央標準局員工消費合作社印製 A8 B8 C8 D8 六、申請專利範圍 ,其特徵是具備有: 多段處理部,具有用Μ進行基板之搬入或搬出之搬運室 和用μ對基板施加龜m_i里室形成依上下方向重疊;和 機器人,用來在上座_之」1-蓮室--和士述-之處理室之間進行 ,墓:板之移動。 13,如申請專利範圍第12項之基板處理裝置,其中上述 之多段處理部具有依上下方向重疊之多個處理室。 1 4 .如申請專利範匾第1 2項之基板處理裝置,其中上述 '之搬蓮室具有用Μ搬—運上述基板之搬運裝置。 15 .如申1請專利範—麗第丄2項之基板—處1鬼置,其中上述 之機器人具有基板保持臂,可Μ依上下古一向-移動藉Μ進入 或退、出上述之搬蓮室和上述之處理_室。 jj .如申請專利範圍第1.2頂之基板處理裝置,其中更具 備有另外之處理部,鄰接上述之多.段處J里_部,和位於與上 述之、搬馨室方致相同高度之位置。 :.17..如宙—請專麗範圍...第.12—項—之棊板處:理裝Ϊ..,其中上述 之多段處理部具有多個上述之搬運室。 -....... ... ......... .........................., 18. —種基板處理裝置,用來對基板進行一連貫之處理 ,其特徵是具備有: 多段處理部,具有基板之暫時保管用之緩衝器室和對基 板施加處理之處理室,依上下方向重疊;和 機器人,用來在上述之媛衝器室和上述之處理室.之間進 *· r 行蓮板之移動。 19. 如申請專利範圍第18項之基板處理裝置,其中上述 本紙張尺度逋用中國國家標準(CNS ) A4規格(210X297公釐) _ 9 _ (請先聞讀背面之注意事項再填寫本頁) '、裝· 訂 參 六、申請專利範圍 之…多_段…處-都-具一有-依~吐-干方-尚一重-疊-之~多._.—:個處._理室。 2 〇 .如申請專里-之-基-板一處一SL裝置,其中上述 之緩衝室具直裝置用來裝載上述之基板。 21 .如申請專乱屬圖第18項-怎基^ …理—裝置,其中上述 之機器人-具有基板保持臂,可Μ依上―本―方商移_ BL藉、Μ進入 和退出上述之鎮衝器室和上逑之處理…塞,。 2 2,· 一種基-板處理裝置,虫.往線邊返回嚴厕構成,用來 將指定位置之*板搬運到各個處理部,在準行一連貫之處 里之後,使基板返回到上述之指定位置,其特徽是具備有 第1多段處理部,被包含在上述之往行線或上述之返回 線,具有用Κ讓_棊„扳通」&„之_通_過室和用Μ對基板施加處理 j.- — ........ .......·· ........ -- ........ 之處理室,依上下方向重疊;和 機器人,用來使基板移動到上述之第1慶_段處理部之處 理室。 經濟部中央標準局員工消費合作社印策 2 3 .如申_請„_1赳.範疆第2 2項之-基板處理裝.置、,其中 更具1直12多殺處理部,被包含在-土一逑-之或上 筚.之_嚴_迴線,具有用从進行基板士搬入或-搬出之.撒運室和 用Μ對_基板施加處理之處理室,依上下方向重疊;和 上述之機器人用來在上述第1多段藏理部之處理室,上 .................... ......... ...... —- — ./.·,’>· ί 一 - 逑〜第2皇處理部之處理_室*和上述第2多段處理部之搬運 室>之_間,進行基板之移動。 24_如申請專利範圍第23項-之-基板處理嚴置 上述之第2多段處理部具有用Μ進行基板之搬人之第1搬 4 (請先閎讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) Α4規格(21〇Χ:297公釐) 經濟部中央標準局員工消費合作社印製 A8 B8 C8 D8 申請專利範園 蓮室和用Μ-進』搬出之第2搬運室;和 上述之機器认-用〜1^__上逑第1多段處理部之處理室,上 述第2多段.處j里部之處理室,上述第2多段處理部之第1搬 蓮室,和上-述第2 m理部之第2搬蓮室之間,谁行基板 i ' . . ------- 之移動'。 25 .如申請專利範圍''第2 3或24項之基板處理裝置,其中 ‘上逑.之往行線和上述之返回線被配置成大致平行; >二.. 上述之第1多段處理一部一被-包一含-在-i:一逑――之一注行線和上述之 返回線之一方; 上述之赛2多段處理--部-被-包―含—在…上.述之、往行線和上述之 返回镍之——方;-和 上逑之掇_器^--被酱置成,-接-士趙第t ,可Μ對上述之第J JO第2多殿處-理』L之處理室和搬運室進 .行..存....取。 26 .如申請專利範圍第25項艺義里寧理里零,其中上述 冬-第-4和…第—2多一段_處—里』1是多爐,包含有加熱室用來對基 板進行加熱。 27 .如申請專利範歷1.16嚴之蓋.板...處J里裝置 '其中更具 備有洗淨處理部,在上述H_ LSLUlii盧理部之處理室 之„處ί里之前,用來對基梅ι施Λ包含洗淨處瑪之處理。 2 S .郊申請專利範圍第2 7項之基板_處4里裝置,其中 上之洗淨處理部是連績對被搬運--έ-基板進―行,.處、埋之處 理部;和 (·----- 上述之第_1和第2多段處理部之至在.之一方具有媛衝室, 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公釐) (請先閲讀背面之注意事項再填寫本頁) 裝. 訂 -5 - 經濟部中央標準局員工消費合作社印製 A8 B8 C8 D8々、申請專利範園 與上述之處理室,土〜述_之„通」^蓳_」_或_上_述之搬運室依上下 方向重疊,用來暫時的保管基板。 2分v如一申.請—暮J1範圍第25項板處理裝置,其中 上-據.名第1多段處理部和上述之第2多段處理部被配置成 / |夾述機器人的互相面對; .....-·-....... 1 具備有: 第3多段處理部,被包含在上述之佳 <行_線和_上述之返回 線、_m」:i述第1多段處理部祖H U,被設置成鄰接上 述之f 1多段處理部,具...直J—M—搬入基板:之第1搬運室,用 > Μ搬出__基板之第2:搬蓮室,和用Μ對基板施加-處理之處理 , --------------—— 室,二上_下方向重疊; 第4多..段.處理部,被包...食_1丄.屋毛里里UL.ii述之返回 Zm —2多趙囿之線,被設置成鄰接上 述第muiii. ..的輿上述之第3多堤處理、部互相面對,具 有用Μ讓基板通過之^通過室,和用Μ對基板施加處理之處 " 、 ~ ------------------------------一_—-—~ 1室,依上下方向重疊;和 '-------· ^上逑機器人不同之第2-微-器-人一被 4多段處里^之間,可κ對上m _3-和.第Α多段處理部之 i理室和各-每搬運室進行存取。 Γ (請先閱讀背面之注意事項再填寫本頁) '裝. 訂 L© 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐)s? 1 188 39 B8 D8 6. Scope of patent application: _1 ... a kind of basic __ poor 1_ 理 _1__ equipment. It is used to transport the substrates, substrates, and substrates to the above. The base-board advance-line one-continuous processing is characterized by: --------- ... multiple rotating robots, with: a torso, which can rotate and cannot move in the horizontal direction; And the arm portion extending from the trunk portion to hold the substrate to be processed; and a plurality of processing portions to use the above-mentioned rotary robot to carry out / remove the substrate to be processed. ... 2. If the scope of the patent application: the substrate of the first item-the installation of the device, where as many as above # 藏> The management department is: 1 or more of the quiet ~ formula: Office. Shoulder, The processing is performed without moving the substrate to be processed; and one or more blade-type processing units include a process for moving the substrate to be processed by one of Value Partners. 3. If the substrate processing device of the second scope of the patent application, the above-mentioned stationary processing section is the same as the carrying-in section and the carrying-out section; and the blade-type processing section is the same as the carrying-in section and the carrying-out section. 4; For example, applying for a patent, any one of the scope of items 1 to 3, a substrate processing device, which further includes a receiving and receiving unit, which is arranged between the above-mentioned rotary robots to perform the above-mentioned processed Acceptance of substrates. Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling out this page) 5. If you apply for a substrate processing device in the fourth item of the profit scope, the above-mentioned receiving and receiving department has: the first loading department It can be used to load the substrate to be processed; a second loading section located above the first loading section; and a moving mechanism for moving the substrate to be processed from the first loading section and the first loading section. 2 One of the loading-parts moves to the other ^ 6. For the substrate processing device of the scope of application for patent No. 5, wherein the above-mentioned first loading part has a first supporting member that can be moved up and down; This paper size applies Chinese national standards ( CNS) Α4 specifications (210X297 mm) _! _ Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A8 B8 C8 D8々, the second scope of the patent application scope mentioned above—vehicle two 2 supporting members;, the swaying i farmer has: the upper king moves the i mechanism, and shakes the first supporting member of the upper shaft to move the second two Ei 1; and the horizontal moving mechanism is used to make the second- ----- · ,,.% .... Love The pieces move in the horizontal direction. 7. If you apply for the substrate processing device of item 6 of the JLI range, the arms can be flexed and stretched and moved up and down. 8% Niu 1 Qing patent range 7 Weng-Zili device, of which The above-mentioned multiple processing units include: washing-cleaning ~ single-bit _, _ to clean the processing substrate described above; and a heating unit 1 for heating the processing substrate described above. 9 "If you want to apply for reviewing Li + Surrounding" item i ~ one of the substrates—locations—-processing devices, in which the above-mentioned multi-division processing-processing department further includes coating, 5 to apply the coating solution to the above-mentioned processed Substrate, exposure unit, used for exposing up to -2-iL parts of the substrate to be treated with the coating solution described above; and imaging masks', used to make the above-mentioned substrates after exposure Processing-the substrate is developed. 10. The substrate and processing device according to item 9 of the scope of patent application, wherein the above-mentioned cleaning unit has a lotus-moving device for moving the substrate to be processed with M, and is provided with a moving-in section and a moving-out section at different positions; -The unit has the same root: tJi person | Fu Ao Department, which does not move the substrate to be processed, and processes the substrate to be processed. 11. The substrate processing apparatus according to item 9 of the scope of patent application, wherein the above-mentioned coating unit and the above-mentioned imaging-unit have a conveying device for conveying the substrate to be processed *, and have a moving part and a moving part with different positions. 1 2. — A kind of substrate processing device for continuous processing of substrates (please read the precautions on the back before filling out this page) 'Binding · Binding. @ 1. This paper size applies to China National Standard (CNS) A4 Specifications (210X297 mm) 2 Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs A8 B8 C8 D8 6. The scope of the patent application is characterized by: a multi-stage processing section with a handling room for moving substrates in or out with M and Use the μ to apply the tortoise m_i to the substrate to form an overlap in the vertical direction; and a robot for performing between the processing room of the upper seat 1-lotus chamber-and Shi Shu-, tomb: plate movement. 13. The substrate processing apparatus according to item 12 of the application, wherein the above-mentioned multi-stage processing section has a plurality of processing chambers overlapping in the up-down direction. 14. The substrate processing device according to item 12 of the patent application plaque, in which the above-mentioned “moving lotus chamber” has a carrying device for carrying the substrate with M. 15. If you apply for a patent, please apply for the patent—the substrate of item No. 2—Ghost 1 where the above-mentioned robot has a substrate holding arm, which can move in and out of the above-mentioned moving lotus in accordance with the previous and the last. Chamber and the aforementioned processing chamber. jj. If the substrate processing device of the 1.2th scope of the application for a patent, there is another processing section, which is adjacent to the above. The section J is __, and is located at the same height as the moving room. . : .17 .. such as Zhou-please specialize in the scope ... Item .12--the fascia board: organize equipment .. Among them, the above-mentioned multi-stage processing section has multiple above-mentioned transfer rooms. -....... ..............................................., 18. — A substrate processing apparatus for performing a continuous processing of a substrate, comprising: a multi-stage processing section, a buffer chamber for temporary storage of the substrate, and a processing chamber for processing the substrate, overlapping each other in the up-down direction; and The robot is used to move * · r between the above-mentioned punching chamber and the above-mentioned processing chamber. 19. For the substrate processing device with the scope of patent application No. 18, in which the above paper size adopts the Chinese National Standard (CNS) A4 specification (210X297 mm) _ 9 _ (Please read the precautions on the back before filling this page ) ', Binding and ordering VI. The scope of the patent application ... multiple_segments ... places-all-with-one-to-spit-dry side-shangyizhong-fold-to-multiple ._.--: a place._ Management room. 2. If you apply for SL-base-board one SL device, the above buffer chamber is equipped with a straight device for loading the above substrate. 21. If you apply for the chaotic map, please refer to item 18-How-to ^…-Device, where the above-mentioned robot-has a substrate holding arm, you can follow the above-"this-party"-BL borrow, M enter and exit the above Handling of ballast chambers and upper shafts ... plugs. 2 2 ·· A substrate-plate processing device, consisting of a worm and a closet returned to the line, is used to transfer the specified plate to each processing unit, and return the substrate to the above after a consistent place is allowed. In the designated position, the special emblem is equipped with the first multi-stage processing unit, which is included in the above line or the above return line, and has _ 让 „ Use M to apply processing to the substrate j.- — ............... It overlaps with the up and down direction; and the robot is used to move the substrate to the processing room of the above-mentioned 1st stage processing section. Employees of the Central Standards Bureau of the Ministry of Economic Affairs, Consumer Cooperatives Co., Ltd. 2 3 .Rushen_Please „_1 赳. 范 江 第2 of 2-the substrate processing equipment. Among them, there are more than 1 straight and 12 killing processing units, which are included in the-soil one 逑-or 筚 之 _ strict_ return line, with the substrate from the substrate Or-moved out. The delivery room and the processing room where the substrate is processed by M overlap in the up and down direction; and the above robot is used in the processing room of the first multi-stage Tibetan management department, above ... ......... .. ......... ...... —- — ./.·,'>· ί 1-逑 ~ Processing_room * of the 2nd emperor processing department * and the above-mentioned multi-stage processing The transfer chamber of the unit is used to move the substrate. 24_If the scope of application for the patent is # 23-of-the substrate processing is strictly set, the above-mentioned second multi-stage processing section has the first transfer of 4 to move the substrate with M (please read the precautions on the back before filling this page) This paper size applies to Chinese National Standard (CNS) A4 specifications (21 ×: 297 mm) Printed by A8 B8 C8 D8 for patent application Fan Yuan lotus room and used M-in. 2 transfer room; and the above-mentioned machine identification-use ~ 1 ^ __ upper processing section of the first multi-stage processing section, the second section of the multi-stage processing section, the first multi-section processing section of the first move Between the lotus chamber and the second moving lotus chamber of the 2nd management department mentioned above, who will carry the substrate i '.. ------- the movement'. 25. For the substrate processing device according to the scope of the patent application No. 23 or 24, in which the upper line and the return line are configured to be substantially parallel; > two: the first multi-stage processing One by one-envelope-contain-contain-in-i: 一 逑 ——one of the betting line and one of the return lines mentioned above; the above-mentioned match has more than two stages of processing-the-envelope-envelope-contained-on ... Said, forward line and the above-mentioned return to nickel-square;-and 逑 器 _ _ ^-is put into sauce,-connected-Shi Zhaodi t, can be M to the above J JO 2 Enter the processing room and the transfer room of the multi-room office-management. 26. If the scope of the application for patent No. 25 Yiyi Lining Lili is zero, where the above winter-the -4th and ... the -2 more paragraph _ place-li "1 is a multi-furnace, including a heating chamber for the substrate heating. 27. If the patent application calendar is 1.16, the cover is strict. The plate is equipped with a cleaning unit, which is equipped with a cleaning processing unit. It is used to align the processing unit in the processing room of the above-mentioned H_LSLUlii Luli Department. The application of the substrate includes the processing of cleaning the substrate. 2 S. Suburban application patent scope No. 27 of the substrate _ place 4 mile device, in which the cleaning processing department is a succession to be transported --- substrate Go ahead, go to the processing department of buried and buried; and (· ----- one of the above mentioned _1 and 2 multi-stage processing department has a Yuan Chong room, this paper size applies Chinese national standards ( CNS) Α4 specification (210 × 297 mm) (Please read the precautions on the back before filling this page) Pack. Book-5-Printed by the Consumer Standards Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A8 B8 C8 D8々, patent application park and the above In the processing room, the above-mentioned "through" ^ 蓳 _ "_ or _above_ mentioned transfer rooms overlap in the up-down direction to temporarily store the substrate. 2 points v as one application. Please-Twilight J1 range 25th Item board processing device, in which the first-stage multi-stage processing unit and the second-stage multi-stage processing unit are configured as: Facing; .....- · -....... 1 With: The third multi-stage processing unit, which is included in the above-mentioned < line_line and _the above-mentioned return line, _m '': i The first multi-stage processing unit HU described above is arranged adjacent to the f 1 multi-stage processing unit described above, with a straight J—M—into the substrate: the first transfer room, with the> M out __ the second substrate : Move the lotus chamber, and apply and treat the substrate with M, ------------------ chamber, the two upper and lower directions overlap; the 4th .. section. Processing section It is covered ... 食 _1 丄. 屋 毛 里 里 UL.ii The return of Zm — 2 lines of Zhao 囿, is set to be adjacent to the third muti .. Facing each other, there is a passing chamber through which the substrate passes, and a place where the substrate is treated with M ", ~ ---------------------- -------- 一 _----- ~ 1 room, overlapping in the up and down direction; and '------- · ^ The second 2-micro-device-human one is different from the upper robot 4 segments You can access the upper m _3- and the multi-stage processing section of the multi-stage processing department and each and every handling room. Γ (Please read the precautions on the back before filling this page) Order L © This paper size applies to China National Standard (CNS) A4 specification (210X297 mm)
TW087118839A 1997-11-14 1998-11-13 Wafer processor TW396490B (en)

Applications Claiming Priority (2)

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JP31296397A JP4044994B2 (en) 1997-11-14 1997-11-14 Substrate processing equipment
JP07932198A JP4045008B2 (en) 1998-03-26 1998-03-26 Substrate processing equipment

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Cited By (2)

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CN104597716A (en) * 2013-10-31 2015-05-06 上海和辉光电有限公司 Exposure and development apparatus, and exposure and development method
TWI661505B (en) * 2010-02-17 2019-06-01 日商尼康股份有限公司 Transfer device, transfer method, exposure device, and component manufacturing method

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KR100387418B1 (en) * 2001-05-23 2003-06-18 한국디엔에스 주식회사 A spinner system in use the process of fabricating semiconductor device
JP5154007B2 (en) 2004-12-06 2013-02-27 株式会社Sokudo Substrate processing equipment
KR101186516B1 (en) 2005-12-07 2012-10-08 티이씨 주식회사 Apparatus for drying glass and method of fabricating liquid crystal display device using the same
KR100768560B1 (en) * 2006-09-15 2007-10-19 세메스 주식회사 Apparatus of processing glass substrate

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US5259881A (en) * 1991-05-17 1993-11-09 Materials Research Corporation Wafer processing cluster tool batch preheating and degassing apparatus

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Publication number Priority date Publication date Assignee Title
TWI661505B (en) * 2010-02-17 2019-06-01 日商尼康股份有限公司 Transfer device, transfer method, exposure device, and component manufacturing method
CN104597716A (en) * 2013-10-31 2015-05-06 上海和辉光电有限公司 Exposure and development apparatus, and exposure and development method

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