TWI227034B - Substrate processing apparatus and method - Google Patents

Abstract

Processing apparatus 100 for applying a predetermined process to a substrate G comprises a first process unit group 2a having a plurality of process units for applying a first process, a second process unit group 2b having a plurality of process units for applying a second process, and common transfer means 42, 44, 46, 48, 50 for transferring the substrate to each process unit of the first and second process unit groups 2a and 2b.

Description

1227034 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention ([Purpose of the invention] [Technical field to which the invention belongs and its known technology] The present invention is related to substrates such as LCD glass substrates Apparatuses and methods for applying anti-repellent agent coating, exposure, and development processing, etc. [Known Technology] When manufacturing a liquid crystal display device LCD, for a substrate, ie, the LCD glass substrate, a given film is formed. , Coating a photoresist to form a resist film, exposing the resist film to light corresponding to a circuit pattern, and developing it, etc., in other words, the circuit pattern is formed by a so-called photolithography technique According to this photolithography technology, the object to be processed, namely the LCD substrate, is subjected to one of the following processes: adhesion (hydrophobization) treatment-resist coating-pre-baking-exposure-development-post-baking, etc. The etching layer forms a given circuit pattern. In the past, this type of processing used the processing units for each processing to be arranged on both sides of the transportation path in the form of a conscious processing flow. Carrying of substrates on the road by a transporting device • It is moved out of the processing boxes of each unit, and a plurality of processing systems are arranged to form a processing system, and processing is performed by the processing system. This processing system is used to transport substrates along Conveyor roads are equipped with a liquid processing system unit for cleaning processing, resist coating processing, and development processing, and a thermal processing system unit for heating, cooling, or adhesion processing. However, recently, The LCD substrate is strongly required to be large, so that one side is as large as lm. Due to the processing system with the general planar configuration as described above, the coverage area (f00tprint) becomes extremely large. This paper size applies the Chinese national standard (CNS ) A4 size (210 X 297 mm) --- ^ ----- ^ ------- (Please read the precautions on the back before this page) II Clothing Line 4 1227034 A7 Intellectual Property Bureau, Ministry of Economic Affairs Printed by employee consumer cooperatives-------------- ----_ Melon __ V. Description of the invention (2) To make efficient use of per unit area of manufacturing. Maintenance management costs are extremely high From the viewpoint of the clean room, It is strongly demanded that the coverage area be reduced. Also, as shown recently, the circuit is highly integrated. The requirements for miniaturization have risen, the engineering has become complicated, and the number of units has increased. For this reason, the coverage area of the processing system is also increasing. However, according to the conventional structure of each unit simply set up along the conveying path, when the coverage area is to be reduced, the increase in the number of units is limited. On the one hand, when the number of units is increased in order to increase productivity, the coverage area becomes larger. That is to say, although the increase in the number of units and the reduction in the coverage area can satisfy the opposite two conditions at the same time, they can fully meet the requirements for highly complicated substrate processing, and strongly hope to leave that device. [Technical problem to be achieved by the invention] The present invention has been made in view of such a matter, and the purpose is to provide a substrate processing apparatus which can reduce a coverage area and is provided with a plurality of processing units, and Its substrate processing method. Still another object is to provide a substrate processing apparatus that can increase the number of units while suppressing a low coverage area. According to a first aspect of the present invention, there is provided a substrate processing apparatus for applying a given processor to a substrate, including: a first processing unit group, which is provided for performing a series of A plurality of processing units for one process; a group of first processing orders, which are provided with a plurality of processing units for performing a series of second processes made by a majority of projects; and a transportation means for performing the same The aforementioned first and second ---.----- order ------- (Please read the precautions on the back before ^! ^ This page)-clothing line

227034

Description of the invention The substrates of each processing unit of the processing unit group printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs are transported. Used for 1;:, the second aspect of the invention, to provide a substrate processing device that allows a sub-substrate to be given to a given processor, including: ^ a processing unit group, which is equipped with a silk-manipulation number engineering institute 4, and A plurality of processing units for one process; a virgin unit group provided with a plurality of processing units for performing a series of second processes performed by the majority of engineering institutes 4; The substrate transport of each processing unit of the first and second processing unit groups; and, and the pick 4 are used to select the first processing unit group and the second < processing unit group. To process the aforementioned substrate. According to a third aspect of the present invention, a substrate processing apparatus is provided, which is used to give a given processor to a substrate, and includes: a first processing unit group, which is used to execute a series of first A plurality of processing units for one processing; a second processing unit group provided with a plurality of processing units for performing a series of second processing performed by a majority of projects; a common transportation means for performing the first and Substrate transportation of each processing unit of the second processing unit group; and the aforementioned first and second processing unit groups are provided with: a horizontal processing block which is horizontally arranged with a plurality of processing units; and a vertical processing block , It is the configuration of the majority of processing units to push up the cliff; this paper rule money 0 standard (CNS) A4 specifications ⑵ 0 X 297 public director) (Please read the precautions on the back before --- 〔 Book again on this page-line

6 1227034 A7 V. Description of the invention (4) The above-mentioned conveying means are provided with: a horizontal-direction conveying device which is movably arranged in a horizontal direction so as to transfer substrates to the aforementioned horizontal processing frame; and a vertical-direction conveying device It is movably arranged in the vertical direction so as to transfer the substrates to the aforementioned vertical processing frame. According to a fourth aspect of the present invention, a substrate processing method is provided, which is a method for performing a given process on a substrate by using a substrate processing apparatus, that is, for each substrate, a first processing unit group and a second processing unit group are selected for use. Each substrate is processed by the processing unit group of the selected one. The substrate processing device includes: a first processing unit group, which is used to execute a series of processes formed by most processes; The plurality of processing units of the first processing; the second processing unit group is provided with a plurality of processing units for performing a series of second processing formed by a plurality of processes; and the common transportation means is used to perform the above-mentioned first processing. The substrates of the first and second processing unit groups are transported. According to the first to fourth aspects of the present invention described above, since a common transportation means is provided for the first and second processing unit groups (which are used to perform an independent series of processes), the substrate transportation is performed, so it is set more than each system. The conventional structure of the transportation means can reduce the transportation means, and at the same time, can reduce the coverage area of the device. At this time, if a selection means is selected to select which of the first processing unit group and the second processing unit should be used for processing the substrate, the Chinese National Standard (CNS) A4 specification (2) is applied to each basic paper size (2) 0 X 297 mm) (Please read the precautions on the back before — — — — — — — — — — ——————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————— Please read the notes on the back of the page.

Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs

Board, select one of the first processing group and the second processing group, and then use the processing unit group of the selected one for each substrate. The first processing unit group can be used for the substrate independently. And = two processing unit groups perform the given processing. According to a fifth aspect of the present invention, there is provided a processing device for processing a substrate by applying a coating solution on a substrate to form a thin film, and simultaneously developing the aforementioned thin film that is opposite to a circuit pattern = ground dew, including Y-. Most rotating system units are used to rotate the substrate for processing. Most heat treatment system units are used to heat and cool without rotating the substrate. It is moved out and moved into each of the aforementioned units; and a conveying path, which forms the moving path of the aforementioned device; wherein: the rotating system units are arranged along the conveying path; the f processing system units are stacked into A plurality of sections constitute a thermal processing unit block and a physical unit block, most of which are arranged around a given part of the aforementioned transportation path or its extension line. According to a sixth aspect of the present invention, there is provided a substrate processing device, which is a processing device that applies a coating solution to a substrate to form a thin film, and simultaneously develops the aforementioned thin film exposed in correspondence with a circuit pattern, including: There are: several liquid processing system units that supply a given liquid to the substrate for processing; several thermal processing system units that perform thermal processing on the substrate;

The size of this paper is standard (CNS) A4 size (g X 297). Ί Please read the precautions on the back first. 丨 丨 ^^ This page) L ----- ^ ---- ----- ^

8 1227034 A7 ^ ----- 2Z____ — V. Description of the invention (6) Transport I set, which is used to transport the substrate and move it out and into the aforementioned units; and the transport path, which forms the movement of the aforementioned device Pathway: Among them: the aforementioned liquid processing system units are juxtaposed along the aforementioned conveying path; the aforementioned heat treatment system units are stacked into a plurality of sections to form a thermal processing unit block: the aforementioned thermal processing unit block is a majority configuration Around a given part of the aforementioned transportation path or its extension. According to a seventh aspect of the present invention, there is provided a substrate processing apparatus that applies a series of processing apparatuses including a plurality of liquid processes and a heat treatment accompanying the liquid process to a substrate, and includes: a plurality of liquids The processing system unit is used to perform liquid processing on the substrate; most of the liquid processing system units are used to perform the heat treatment accompanying the above-mentioned most liquid processing on the substrate; the transport device is used to transport the substrate and carry it out and in Each of the aforementioned units; and a conveying path forming a moving path of the aforementioned device; wherein: the aforementioned liquid processing system units are juxtaposed along the aforementioned conveying path; the aforementioned heat treatment system units are stacked into a plurality of sections to constitute a heat treatment unit Box; The above-mentioned thermal processing unit block is mostly arranged around a given part of the aforementioned transportation path or its extension line. As shown in the fifth to seventh viewpoints, since the rotation system unit and the liquid processing system unit are provided along the conveying path, the heat treatment system unit is stacked into a plurality of sections to form a thermal system processing unit block, so that this thermal system unit Most of the boxes are arranged around a given part of the transportation road or its extension line, so the Chinese paper standard (CNS) A4 can be applied to this paper size ------ (Please read the precautions on the back before this page) I # clothing re-ordering --------- Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 9 1227034 A7 B7 V. Description of the invention (7 While reducing the coverage area, the number of units is increased. According to the invention According to an eighth aspect, a substrate processing apparatus is provided, which is a processing apparatus for processing a substrate to be processed by a plurality of processes including liquid processing and heat treatment, and includes: a first processing section configured with A plurality of liquid processing system processing units that perform liquid processing on a substrate to be processed along a horizontal conveying path extending horizontally and by moving the first conveying device on the horizontal conveying path, Each processing unit provided along the aforementioned horizontal transport path transports the substrate to be processed; and the second processing section is provided with a plurality of heat-treatments for the substrate to be processed along the vertical transport path extending vertically in one direction and upward and downward. The heat treatment unit 'also transports the substrate to be processed by each of the processing units provided along the vertical conveyance path by the second conveying device moved along the vertical conveyance path. A first processing unit that is provided with a plurality of processing units and that transports a substrate to be processed for each processing unit provided along the horizontal transport path by a first transport device that moves on a horizontal transport path; and horizontal transport Multiple processing units are arranged along the path, and the second substrate is moved along the vertical conveying path, and the processing substrates are conveyed along the vertical conveying path. Therefore, the processing can be superposed without interfering with each other. The unit is arranged in the second processing section, thereby reducing the coverage area, and, as the first conveying device moves along the horizontal conveying path, The horizontal movement and vertical movement of the second conveying device along the vertical conveying path can achieve the separation of the functions of the conveying device. Therefore, this paper size applies the Chinese National Standard (CNS) A4 specification (2) 0 X 297 mm. (Please (Please read the notes on the back first, then this page) -L ----- Order --------- Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 10 [227034 A7 B7 Employee Consumption of the Intellectual Property Bureau of the Ministry of Economic Affairs Cooperative prints 5. Description of the invention (11) Etchant coating processing unit (CT) 24b, where the resist solution is applied, and then the sub-arm (not shown) in the block 27b is processed by the resist Then, it is transported to a reduced-pressure drying unit (VD) 25b for reduced-pressure drying, and carried to a peripheral resist removal unit (ER) 26b by a sub-arm, where excess etchants on the periphery of the substrate G are removed, and thereafter borrowed The substrate G is carried out from the resist processing block 27b by the vertical conveyance device 46. The processing block 33 is provided between the vertical conveying paths 43 and 45, and transfers the substrate G between the vertical conveying devices 44 and 46 in order from the bottom, and piles up extended cooling units (EXT · COL) for cooling the substrate G. It is formed by two hot plate units (HP) for heating and processing the substrate G, and an attachment processing unit (AD) that performs a hydrophobic treatment on the substrate G. Between the first processing region 36 and the second processing region 37, there is disposed a processing block 32 formed by stacking four common thermal processing units on the first and second processing unit groups 2a and 2b. The processing block 32 transfers the substrate G ′ between the horizontal conveying device 42 and the vertical conveying device 44 in order from the bottom, and stacks an extension cooling unit (EXT · COL) for cooling G, and two hot plate units (HP). And attached processing unit (ad). The processing block 28a of the first processing unit 2a and the processing block 28b of the second processing unit group 2b are installed facing each other, and a vertical transport path 47 is formed along the vertical direction between them. A movable vertical conveying device 48 is provided along the vertical conveying path 47, thereby constituting a third processing area 38. The third processing area 38 is arranged so that the two processing blocks 34 and 35 that are common to the first and second processing unit groups 2a and 2b are in a direction facing the processing blocks 28a and 28b. Orthogonal direction, sandwich vertical transport -------- Order --------- (Please read the precautions on the back before this page)

14 1227034 A7 B7 V. Description of the Invention (l2) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. The processing blocks 28a and 28b are formed by stacking four hot plate units (HP) for heat-treating the substrate. In addition, processing blocks 34 and 35 are formed by stacking an extension cooling unit (EXTCOL), a cooling unit (COL), and two hot plate units (Hp) in this order. The extension and cooling unit (Exτ · col) in processing block 34 transfers the substrate g between the vertical conveying devices 46 and 48, and the extension and cooling unit (EXT · COL) in processing block 35. ), The substrate G is transferred between the vertical transfer device 48 and a horizontal transfer device 50 described later. The development processing units (DEV) 29a, 30a, 31 & and the second processing unit group 21) of the first processing unit group 2a (£ ^ ¥) 296, 3 仳, and 3 lb. It is installed on the ground, and a horizontal conveyance path 49 is formed between them in the horizontal direction, and a movable horizontal conveyance device 50 is provided along this horizontal conveyance 49, thereby forming a fourth processing area 39. The horizontal transport device 50 is provided so that the substrate G can be transferred to and from the interface station 3. As shown in Fig. 1, the transportation system including the transportation path and the transportation device is formed in a straight line; the first processing unit group 2a and the second processing unit group 2b are arranged in exactly the same unit in the same order and are not straight. The transport system is shaped symmetrically. Therefore, the first processing unit group 2a and the second processing unit group 2b can use a common processing unit to perform processing within the same unit. Needless to say, different contents can be processed. In addition, as shown in FIG. 2, each processing unit is provided with a carry-out / inlet 10, which is taken out and put in by a transport device of each processing box. The carry-in / outlet 10 can be borrowed (not shown). Light shutter to open and close. Handling (Please read the precautions on the back ---- < then 55 |: this page) Order --------- line

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V. Description of the invention (i3 printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, Chu- Γ, each processing unit of processing station 2 'first processing unit group 2', each processing unit of the early 7L group 2b, by the common The processing blocks formed by the processing units 32, 33, 34, and S # w⑽ each processing of the J5 (common processing unit group 2C) and the transportation devices 42, 44, 46, 48, and% are as follows As shown in Figure 3, '被 沉 成 #' is controlled by the controller. This controller 70 serves as a selection means, and is used to select which one of the first processing unit group and the second group should be borrowed. Process substrate G. The horizontal transport devices 42 and 50 have the same structure, and as shown in FIG. 4, they include a device body 71 that can be moved along the transport path; The base member 72 that rotates and two substrate supporting structures 73a that are independently movable above and below the base member 72 in the horizontal direction. Further, the central portion of the base member 72 and the device body 71 are borrowed. It is connected by the connection part 74. By the drive source built in the apparatus main body 71 (For example, a motor), the base member 72 is rotated back and forth through the connecting portion 74. In this mechanism, the horizontal movement and rotation of the substrate G can be performed at two speeds. The base member 72 is also provided. It can be moved in the vertical direction by a drive source (such as a motor) built in the device body 71, and fine adjustment can be made in the up and down direction of the transport position. The vertical transport devices 44, 46, and 48 have the same structure. As shown in FIG. 5, it includes: a cylindrical support 81 that extends in the vertical direction, and has vertical walls 81 a and 8 lb and side openings 81 c therebetween; and a wafer transfer portion 82 It is provided along the cylindrical support 81 in a vertical direction and is provided on the inside thereof. The cylindrical support 81 is rotatable under the driving force of a driving source 83 such as a motor, and rotates with it. And one (Please read the precautions on the back before ^ || ^ this page) IIIII Order 1111111- * ^

This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) 16 1227034 A7 B7 5. Description of the invention (Η) Rotating wafer transfer unit 82 in bulk. The wafer transfer unit 82 includes a transfer base 90 and two wafer holding arms 91 and 92 that can be moved rearwardly along the transfer base σ 90. These arms 91, 92 'have a size capable of passing through the side opening portion 81e of the cylindrical support body 81.' The wafer transfer portion 82 is driven by a motor 84 to drive the belt 85, thereby raising and lowering. In addition, reference numeral 86 denotes a driving pulley; 87 denotes driven sliding. The vertical movement and rotation of the substrate G can be performed by such a mechanism 'at a south speed. Next, the processing operation in the resist coating development processing apparatus 100 configured as described above will be described. When the same processing is performed in the first processing unit group 2a and the second processing unit group 2b, for example, as shown in FIG. 6, first, the substrate G is loaded into the processing station 2 from the cassette station (step S1). Next, one of the transportable substrates G is detected among the first processing unit group 2a and the second processing unit group 2b, and the horizontal transport device 42 is controlled by the controller 70, which works as a selection means, to detect based on this As a result, the substrate G is carried into a processing unit group that can be transported, and thereafter, a series of processing is performed by the selected processing unit group. Specifically, it is determined whether the first processing unit group is allowed to carry in the substrate G (step S2); if the loading is allowed, the substrate G is carried in the first processing unit group 2a (vstep 83) 'in the first processing unit group 2 & Processing of substrate 0 (step μ). On the one hand, if the first processing unit group 2a is not available and the substrate α is not allowed to be carried in, it is determined whether the holes of the second processing unit group allow the substrate G to be carried in (step S5); if the loading is allowed, the substrate is moved in the second processing In the unit group (step), the substrate G is processed in the first processing unit group 2b (step §7). If you do not use this paper size in the first processing unit group 2a and the second processing unit group 2b: ㈣National Standard (CNS) A4 size⑵Qx 297 public love) (Please read the precautions on the back before this page) Order --- ------line

Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 17 V. Invention Description (! 5) When processing the valley, for example, it is marked on the substrate G in advance with the content of the processing, and it is checked out to select the processing unit to be moved in. For example, as in step 撃: 'First', the substrate G is transferred from the cassette station to the processing station 2 (step sn). Next, the label of the substrate G is detected (step S12). Determine whether the detected label corresponds to the first processing unit group (step S13); if it corresponds to the first processing, the group 'moves the substrate G to the first processing unit group & (step si4), The cell group 2a performs processing of the substrate g (step S15). On the one hand, if the labeling does not correspond to the first processing unit group 2a, it is determined whether the labeling corresponds to the second processing unit group 21) (step ；); when it corresponds to the second processing unit group 2b, the substrate G is moved to The second processing unit group (the step is called, the substrate G is processed in the second processing unit group hole (step M). After doing so, in order to perform a series of processing in any processing unit group, the controller 70 is used to control each Transport the device so that a series of processing can be performed in the processing unit that was initially put in. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. Second, the specific processing example will be described with reference to FIG. Process 2a. First, the substrate G of the cassette C is taken out by the conveying mechanism 11 in the cassette station 1, and transferred to the horizontal conveying device 42, and then carried into the first processing area 36 (step S21). The processing area 36 is firstly subjected to surface modification and cleaning treatment by the ultraviolet irradiation unit (Uv) 21a (step S22); secondly, the scrubbing and cleaning unit (SCR) 22a and 23a is used to perform scrubbing and cleaning ( Step S23). Thereafter, the substrate G is conveyed to the expansion / cooling unit (Exτ · COL) of the processing block 32 by the horizontal conveyance device 42, and then conveyed to the vertical conveyance device 44 of the second processing area 37. Processing box 32 or processing this paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 18 1227034 A7 B7 V. Description of the invention (16) Printed in box 33 of the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs The hot plate unit (HP) is subjected to dehydration baking (step S24); the extension / cooling unit (EXT · COL) of the processing block 32 or processing block 33 is cooled to a given temperature (step S25). Then, the substrate G The substrate G is transferred to the attachment processing unit (AD) in the processing block 32 or the processing block 33, and a hydrophobic treatment (HMOS treatment) is performed to improve the fixation of the resist (step S26). Thereafter, the substrate G is transferred to The expansion / cooling unit (E × ΊΓ · col) is cooled to a predetermined temperature (step S27); then, it is transported to the resist processing block 27a by the vertical transfer device 44. In the resist processing block 27a, first, Coating by anti-surname agent (CT) 24a, the substrate G is coated with a resist solution, and then is transported to a vacuum drying unit (VD) 25a by a sub-arm (not shown) in the anti-insectant processing block 27a. It is pressure-dried, and then transported from the sub-arm to the peripheral anti-resistance removing unit (ER) 26a to remove excess resist on the periphery of the substrate G (step S28). After the removal of the peripheral resist is completed, the device 46 is transported in a vertical direction. The substrate G ° is carried out from the resist processing block 27a. The reason why the vacuum drying unit (VD) 25a is provided behind the resist coating processing unit (CT) 24a is as follows: After the substrate is coated with a resist and after the baking process after the development process, the shape of the lifting pin, the fixing pin, etc. is sometimes copied to the substrate G, but if this is not the case, a reduced pressure dry pressing unit (VD) is used. To heat and directly dry under reduced pressure ', so that when the solvent in the resist is slowly released, it does not cause the rapid drying as in heating and drying, and it can be used without adversely affecting the resist. Promote the drying of the resist, which can effectively prevent Therefore, replication of a board. After finishing the coating process in this way, the paper is transported in a vertical direction by 46 pieces of paper. Applicable to the Chinese National Standard (CNS) A4 (21 × 297 mm). 19 Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperatives. 1227034 A7 B7 7. Description of the Invention (17), the substrate G is transported to the extended cooling unit (EXT · COL) of the processing block 34 in the third processing area 38. The substrate G disposed in the extension / cooling unit (EXT · COL) is transported to the hot plate unit (HP) of the processing block 28a or the processing blocks 34 and 35 by the vertical conveying device 48 and pre-baked. Processing (step S29); thereafter, it is transported to one of the cooling units (COL) in the processing blocks 34 and 35, and is cooled to a predetermined temperature (step S30). Thereafter, the substrate G is transported to the expansion / cooling unit (Exτ · COL) of the processing block 35 by the vertical transport device 48. The substrate G arranged in the extension cooling unit (EXT · COL) is transported to the interface station 3 by the horizontal transfer device 50 in the fourth processing area 39, and is arranged on the extension stage 61. Then, the substrate G on the expansion stage 61 is transported to the light-emitting device 200 by the transport mechanism 64 (step S31), and a predetermined pattern is exposed there. After the exposure is finished, the substrate G is returned to the interface station 3 again by the transport mechanism 64 (step S32), and then it is carried into the processing station 2 by the transport mechanism 64. Specifically, the substrate g is received from the extension stage 61 of the interface station 3 by the horizontal-direction conveying device 50 of the fourth processing area 39. Then, the substrate g is transported to any of the development processing units (DEV) 29a, 30a, and 3a by the horizontal transport device 50, and development processing is performed there to form a predetermined circuit pattern (step S33). ). The developed substrates 0 are conveyed by the horizontal conveying device 50 to the extension / cooling unit (EXT · COL) of the processing block 35 in the third processing area 38, and are conveyed to the vertical conveying device 48 to After the processing block 28a or the processing block 28a or any of the hot plate units (HP) in the processing blocks 34 and 35, a post-baking process is performed (step S34); thereafter, it is transported to

-20-1227034 A7 B7 V. Description of the invention (18) Any cooling sheet s (c0L) in boxes 34 and 35, cooled to a given temperature (step S35). After that, the substrate G passes through the processing block. Expansion and Cooling Unit of 34 (Ex • Γ • COL) 'After processing the expansion and cooling unit of Box 33 (Exτ · c0l and processing box 32 of the Expansion and Cooling Unit (Exτ · c0L), it is first The horizontal direction conveying device 42 of the processing block 36 conveys to the cassette Mi, and the transport mechanism 11 carries it out of a given cassette accommodated in the cassette station 丨 (step S36). About the second processing unit group The processing may be performed in exactly the same manner as the processing of the first processing unit group 2a. However, a part of the processing is omitted, and a processing different from the processing performed by the first processing unit group 2 & may be performed. In this embodiment described above, since the first and second processing unit groups 2a and 2b that perform a series of processes independently are provided, common transport devices 42 and 44 for transporting substrates () to these processing units are provided. , 46, 48, 50, so compared to each system The structure of a conventional device equipped with a conveying device can further reduce the number of conveying devices, thereby reducing the coverage area of the resist coating developing processing device. If the system of this embodiment is considered as a system, There are many units of the liquid processing system, and the productivity can be significantly improved. Also, since the controller 70, which functions as a selection means, is created, one of the holes of the first processing unit group 2a and the second processing unit group should be selected. The substrate G is processed, and a processing unit group selected by the processing unit is used to process each substrate. Therefore, the first processing unit group and the second processing unit group 2b can be used to separately apply a resist to the substrate G. Coated imaging This paper is sized for China National Standard (CNS) A4 (210 X 297 mm)

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2. Description of invention (19) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. Straight line: The conveying system of the conveying path and the conveying system is 4 4 Γ 2 Γ The path is simple and can be processed with high productivity. Since the first processing unit group 2a and the second ::: are arranged in exactly the same unit, and are set to form a straight line sandwiched by = to form a symmetry, the second processing single 70 'of the first processing single group domain can be used in parallel and high. The yield is used for the same-content treatment. In addition, the first processing unit group 2a and the second processing unit group 2b are used to perform different internal and external processes, and at the same time, highly variable processes can be realized. m According to the above example, although the same processing units are arranged in the same order in the first processing unit group 2a and the second processing early 70 group 2b, the types of processing units may be different, and the order of arrangement may be different. . The first processing unit group 2a and the second processing unit group 2b are separately arranged on both sides of the transport system, but they may be arranged in a mixed state. Furthermore, according to the above example #, when the processing contents of the first processing unit group 2a and the second processing unit group ^ are the same, it is detected that the processing contents of the first processing unit group 23 and the second processing unit group 2b are the same. At the time, one of the first processing unit group 2a and the second processing unit group capable of transporting the substrate G is detected, and the substrate G is moved into the transportable processing unit group according to the detection result, and the first processing unit & and When the processing in the second processing unit group 2b is different, the substrate G is labeled in advance with the content of the processing, and then the processing to be carried in by checking out the label is early, but it is not limited to this. There is a card £ c for the substrate G borrowed by the first processing unit group 2a, and a cassette c 'containing only the substrate G borrowed by the second processing unit group 2b is set separately. From this time on, this paper standard applies Chinese national standards (CNS) A4 specifications (210 X 297 public love) -------- t --------- ^ (Please read the precautions on the back before this page)

22 1227034 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 V. Description of Invention (20) Alternately, substrate G can be moved to processing station 2. (Second Embodiment) Next, a third embodiment of the present invention will be described. FIG. 9 is a plan view showing a [CD substrate resist coating development processing apparatus according to a second embodiment of the present invention. This resist-coating development processing device 300 is that after applying a resist solution to an LCD substrate, once it is handed over to the exposure device 400, it receives the substrate processed by the exposure device 400 and performs development processing. . In order to perform such a series of processing, the resist coating development processing apparatus 300 includes a loading / unloading unit 103 for loading / unloading (loading / unloading) the rLcd substrate G into the substrate. A liquid processing system processing unit 104 is configured to rotate the substrate g for cleaning processing; a first thermal processing system processing unit 105 is configured to perform heat treatment such as heating and cooling processing on the substrate G; a second liquid processing system The processing unit 〇〇6 is for the substrate G to be rotated, while the resist solution is applied (coating), reduced pressure drying and peripheral resist removal treatment, and while the substrate 0 is rotated, the display is developed. Image processing; the second heat treatment system processing unit 〇07, which is to heat and cool the substrate; and the mesial surface (1 bottom) 108, which is the transfer of the substrate G with the exposure device. The loading / unloading unit 103 includes a cassette mounting table 110 and a transport unit (CS) 111. On the cassette mounting table 11, two kinds of cassettes ei and. For example, the substrate G before processing is stored in the first cassette C1, and the substrate g after processing is stored in the second card HC2. In addition, the conveying section ill is provided with a first sub-arm mechanism 113, and the paper size of this arm 113 is applicable to the Zhongguanjia Standard (CNS) A4 specification ⑵Q χ 297 public love) (Please read the precautions on the back before this page) I .----- Order --------- Line

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Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the Invention (21) An arm 114 capable of holding the substrate is provided, and the arm 114 is rotated, moved forward and backward, and moved up and down to remove the first cassette c. The substrate is transferred to the processing unit 104 side of the first liquid processing system. Another substrate that has completed all processing, that is, the first sub-arm mechanism 3, for example, from the first liquid processing system processing unit 104 side, is stored in the second cassette c2. The processing unit 104 of the first liquid processing system is provided with a first main arm mechanism 115 which receives the substrate 0 from the first sub-arm mechanism 113. This main arm mechanism 115 includes a base 117 'which travels on a first central transport path 116 extending along the γ direction; and an arm 118 which rotates, advances and retreats on the base U7, and drives up and down. On one side of the first main arm mechanism 115, there are provided two cleaning units (8 (: 11) 119 and SCR) for transporting 116 'along the center, for example, scrubbing and washing with a brush. 119. The first main arm mechanism 115 is to carry the substrate G received from the carrying-in and carrying-out section ι3 into any one of the processing units 112 and 119, and take out the substrate to which the necessary processing is performed from any of the processing units 112 and 119. At the same time, the taken-out substrate G is carried into another external processing unit, or is transported to the first heat treatment system processing unit 105. The first heat treatment system processing unit 105 is arranged in series with the first central transport path 116 (on the central transport path The extension line of 116). In the first heat treatment system processing section 105 ', a second sub-arm mechanism 113A is provided. The second sub-arm mechanism 113A is provided with an arm 114 for holding the substrate.' The arm 114 is rotated back, forward, and backward. Move to transfer the substrate to the given device of the surrounding processing unit. (Please read the precautions on the back first.

The paper size of the table applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm). 24 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Around it, there are a first thermal processing unit block 120, a second thermal processing unit block 121, a third thermal processing unit block 122, and a fourth thermal processing unit block 123 to surround the first Second child 'agency 113A. Among these, the first thermal processing unit block 120 includes: an expansion and cooling unit (Exτ · c0L), which is in order from the bottom, and in the first liquid processing system processing unit 104 and At the first heat treatment system | When the substrate G is transferred between the cores 105, the function as a relay section and the substrate cooling function are prepared; and two dehydration baking units (Hp) are used to dehydrate the substrate after heating it Baking treatment. And these units are piled up. The second | second thermal system physical unit box 丨 2 will expand the cooling unit (EXT.c0l), cooling unit (EXT · C0L), cooling unit c0L, and the attachment treatment for hydrophobic treatment The unit (AD) is a stack of three sections; the extended cooling unit ^ (Εχτ · COL) is set to sandwich the second sub-arm mechanism U3A and face the first thermal system processing unit box 120 in the direction of Y, and When the substrate G is transferred between the first liquid processing system processing unit 106 and the first heat treatment system processing unit 105 in this order from below, it has both the function of a relay unit and the cooling function of the substrate. In addition, the third and fourth thermal processing unit blocks 122 and 123 are formed by stacking three post-baking processing hot plate units (p0ST) in three stages; this second unit is provided as The second sub-arm mechanism U3A faces each other in the X direction. The first thermal processing unit block 120 is connected to the first central conveyance path 116 of the first liquid processing system processing unit 104, and the first thermal processing unit block 121 is used for the second liquid processing. The system processing unit 106 is a second central transport path 124 described later. The second sub-arm mechanism U3A is composed of the first liquid processing system (please read the precautions on the back before this page) -I n order -------- line

This paper size applies the Chinese National Standard (CNS) A4 specification (21 × χ297 mm) 25 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 1227034 A7 _B7 V. Description of the invention (23) The first main arm mechanism of the management department 104 115 to receive the substrate G of the extension / cooling unit (EXT · COL) transferred to the first thermal processing unit block 120, and move it into the first to fourth thermal processing unit blocks 12 to 123 around it Each of the units is simultaneously taken out from each of the first to fourth thermal processing unit blocks 12 to 123, and the substrate G to which the necessary processing is applied is sequentially transported to the first to fourth thermal processing unit block 12 〇 ~ 123 additional processing unit or the third thermal processing unit block 122 extension · cooling unit (Eχτ · COL) 'or vice versa. Also illustrated in FIG. 10 are: a first thermal system unit block arranged to face each other in the γ direction with a second sub-arm mechanism 113 A interposed therebetween; Stacked state; and sub-arm mechanism 113A. On the other hand, the second liquid processing system processing unit 106 is provided with a second main arm mechanism 125 which travels along the second central transport path 124 extending along the γ direction. The second main arm mechanism 125 includes a base 126 and an arm 127, which are configured in the same manner as the first main arm mechanism 115. On one side of the second main arm mechanism 125, a resist processing block 130 is provided. The anti-money agent processing block 13 includes: an anti-surrogate agent liquid coating processing unit (CT), which is used to coat the anti-agent liquid on the substrate; and a vacuum drying process as early as 70 (VD), which is It is used to dry-process the substrate coated with the resist solution; and the edge remover is used to remove the unnecessary anti-remainder on the periphery of the substrate after drying. These are integrated with each other and are aligned along the second central transport path m. On the other side of the second main arm mechanism 125, there is a first central transport path 124, and a paper sheet for image processing and exposure is provided. This paper uses the Chinese National Standard (cks) A4 specification. X 297 --- ^ ----- Order --------- line (Please read the precautions on the back before ^^ this page)

26

1227034 V. Description of the invention (24) Three development processing units (DvD) of the LCD substrate 3] 1. The second main arm mechanism 125 is used to carry in the substrate G received from the processing unit 105 of the first heat treatment system in the resist processing block 13 and then take out the processed substrate from the anti-agent processing block 130, It is transported to the processing system processing unit 107 side. In addition, the substrate received from the second heat treatment system processing unit 107 is carried into the development processing unit 131, and the processed substrate is taken out from the development processing unit 131 and transported to the first heat treatment system processing unit 105 side. The first heat treatment system processing unit 107 'is arranged in series with the second central transport path 124. The second heat treatment system processing unit 007 is provided with a second sub-arm mechanism 113B. The third sub-arm mechanism 113B is similar to the second sub-arm mechanism 113A, and has an arm 114 for holding the substrate G, so that the arm 4 can be rotated, retracted, and moved up and down, so that the substrate can be transferred to the surrounding processing described later. The given device of the unit. Around the third sub-arm mechanism 113B, a fifth thermal processing unit block 132, a sixth thermal processing unit block 133, and a seventh thermal processing unit block 134 are provided to surround the third sub-arm mechanism. 113B. Among these thermal processing unit blocks, the fifth thermal processing unit block 132 stacks the extension unit (EXT) and two pre-baking units (PRE) for pre-baking processing. It is formed in three stages, and is connected to the second central conveying path 124 of the processing unit 106 of the second liquid processing system. At the same time, it is arranged to sandwich the third sub-arm mechanism 113B with the interface portion (1F) 108 at Y. The directions are opposite; the extension unit (EXT) is in order from below, when the substrate G is exchanged between the third liquid processing system processing unit and the second heat processing system processing unit 107, the paper size applies the Chinese national standard (CNS) A4 specification (210 X 297 public love) -------- Order --------- line (Please read the precautions on the back before this page) Printed by the Bureau ’s Consumer Cooperatives 27 1227034 V. Description of the invention (25 functions as a relay department. It ’s also the sixth and seventh thermal processing unit box 133 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs The lower valence skin; ~ 丄 dried frame 133 but the unit (COU ΓΓ will be used to cool the substrate 0 Let's do two pre-baking treatments .... Then, this " Six and Two ::: Early Wood Boxes 133 and 134, with the distribution of 忐 Shi Park is enough to face each other in the X direction. The three sub-arm mechanisms are mutually connected. The third sub-arm mechanism 113B is the second main arm mechanism 125 of the second liquid processing and processing unit 106 to receive and transfer the expansion of the fourth thermal processing unit block 132. The substrate G of the unit (EXT) is moved into the surrounding fifth to seventh thermal processing unit blocks 132 to 134, and at the same time, from the fifth to seventh thermal processing unit blocks 132 to 134. Each processing unit takes out a substrate G that has been yoke-treated, and transfers it to the mesial surface (I_F.) 108 on the exposure side of the device 400. Furthermore, the third sub-arm mechanism U3B is driven from the mesial surface (IF) 108 from The exposure device 400 receives the exposed substrate G and transports it to the second liquid processing system processing section 106. The interface 108 (IF ·) is formed by the transportation and standby section 137 and the transfer section 138. Transportation The standby unit 137 includes an extension and cooling unit (EXT · COL) stage 136, which is located at the second heat treatment system. When the substrate G is transferred between the unit 107 and the interface surface (IF) 108, it has both the function of the relay unit and the cooling function of the substrate; the buffer cassette (BUT) 135; and the fourth (not shown) Sub-arm mechanism. Also, the transfer unit 138 is provided with a transfer table (not shown) for transferring substrates between the aforementioned fourth sub-arm mechanism and the exposure apparatus 400. Next, refer to the plan view of FIG. 11 and Figure 12 is a side view illustrating

(Please read the notes on the back before this page)

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This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) 28 1227034 A7 B7 V. Description of the invention (26) Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5 〇5, 107 structure of the second and third sub-arm mechanism 113A, 113B. The second and third sub-arm mechanisms U3A, U3B are horizontal calibration robots with the same structure, and as shown in Figures 11 and 12, they include: a return plate 14o, which is not wrapped around The rotation axis shown in the figure rotates and moves up and down; and the two upper and lower hands 142 and 144 are used to hold the substrate and move forward and backward. On both sides of the base end portion of the upper hand 142, a pair of first arms 152, 152 are provided, which are provided with supporting shafts ⑼, 150, which can be reversibly connected to these supporting shafts. 150, 15〇; and a pair of second arms i56, 156, which are reversibly connected to these first arms 152, 152 through the support shafts 157, 157. The first arms 152 and 152 are disposed below the second arms 156 and 156, and the hand 142 is suspended and supported by the first arms 152 and 152. A pair of second arms 156, 156 are rotatably connected to a pair of first rotating shafts 155, 155 extending upward from the swing plate 14o. On the one hand, on both sides of the base end portion of the lower hand 144, a pair of third arms 162, 162 are provided, which are provided with supporting shafts 16 and 16 facing downward, and can be reversibly connected thereto. The equal support shafts 160, 160; and a pair of fourth arms 166, 166 are rotatably connected to the third arms 162, 162 through the support shafts 167, 167. The third arms 162, 162 are provided on the upper side of the fourth arm 166, 166; that is, the third arm 162, 162 supports the hand 144 from the lower side. A pair of fourth arms 166 and 166 are rotatably connected to a pair of second rotary drive shafts 16 5 and 16 5 extending in a direction extending from the swivel plate 140. As shown in the figure, the first rotation driving shaft 155 and the second rotation driving shaft 165 are coaxially arranged; among them, the first rotation driving shaft 155 rotates toward the second rotation. The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) Please first-Read the back · Notes · Thread

29 1227034 V. Description of the invention (27) The drive shaft 165 extends above. In addition, these rotary drive shafts 155 and 165 are provided inside the turning radius of the sub-arm mechanisms 113A and 113B and outside the hands 142 and 144. A pulley (not shown) is attached to each of the rotary drive shafts 155 and 165, and the arms 152, 156, 162, and 166 are revolved by a timing belt hanging on the pulley. Next, an example of the processing steps of the coating and developing processing system 300 configured as described above will be described with reference to the flowchart of FIG. 13. First, the unprocessed substrate G stored in the first cassette C1r on the mounting table 110 is transferred from the carry-in and carry-out section 103 through the conveying section (cs) lu to the first master of the first liquid processing system processing section 104. The arm mechanism 115 (step S41). Next, the substrate G organic matter is cleaned by the exciter unit 112 (step S42); thereafter, the extension of the early element block 120 is processed by, for example, the first thermal processing system processing unit 105 and the first thermal system. The cooling unit (ext · cOL) performs a cooling process (step S43). Next, the substrate G that has undergone the cooling treatment is scrubbed and cleaned by means of a scrubbing and cleaning unit (SCR) 119 (step S44); after the processing is completed, it is removed by the second sub-arm mechanism 113A • In the loading operation, the hot plate unit (HP) of the first thermal processing unit block 120 of the first thermal processing system processing unit 105 is used to perform the dehydration baking process (step S45); then, the second thermal processing is performed The cooling unit (COL) of the unit block 121 performs a cooling process (step S46). Thereafter, in order to improve the fixability of the resist, the surface of the substrate is hydrophobized by an attachment processing unit (AD) (step S47); the extension and cooling unit (EXT) of the second thermal processing unit block 121 is used. · COL) to cool to a given temperature (step S48). This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm). Please read it first, note the following.

Item I Page I

Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 30 1227034

Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention (28) Next, the substrate after the hydrophobization treatment is introduced into the processing unit 106 of the second liquid processing system through the second main arm mechanism 125, and The resist liquid coating processing unit (CT), the reduced pressure drying processing unit (VD), and the edge remover (ER) of the resist processing block 130 sequentially perform the resist coating, the reduced pressure drying processing, and the substrate. Removal of unnecessary resist liquid on the periphery (step S49). In this way, through the extension unit (EXT) of the fourth thermal processing unit block 132, the third sub-arm mechanism 113B is used to introduce the resist-processed substrate g into the second heat treatment system processing unit. Any of the fifth and seventh heat treatment system unit blocks 32, 133, and 134 of the second heat treatment system processing unit 107 performs a pre-bake process (step S50). Thereby, the solvent contained in the resist liquid applied on the board | substrate g is volatilized. Next, the substrate G is cooled to a room temperature by using one of the sixth or seventh thermal processing unit blocks 133 and 134 of the second thermal processing system processing unit 107 (step S51). Thereafter, the third sub-arm mechanism ii3B is used to carry the substrate G into the extension and cooling stage (EXT · COL) 136 of the mesial portion 108, and transfer it to the exposure device 400 through the mesal portion 108 (step S52); Dew there is given the pattern. The substrate G subjected to the exposure processing is inserted into a titler (Titler) 139 to perform a title processing (step S53). Thereafter, the substrate G is introduced into the second liquid processing system processing unit 106 through the mesial portion 108 and the second heat treatment system processing unit 107, and further subjected to development processing using a given development processing unit (DEV) 131 (step S54). Here, the development processing unit 131 supplies the development liquid to the substrate in a state of rotating the substrate to perform development. The developing solution was washed away with a rinsing solution, and then dried. This paper size applies to China National Standard (CNS) A4 specification (210 X 297 mm) -------- Order --------- line (Please read the precautions on the back before this page)

31 1227034 A7 ___B7 V. Description of the invention (29) The substrate G after the development process is introduced into the first heat treatment system process # 105, and the second or fourth heat system processing unit is used to frame the baking unit (POST). Perform post-baking treatment (step S55); then use the cooling unit (c0l) of the second thermal processing unit block 121 or the expansion / cooling unit (120 or 121 of the first or second thermal processing unit) Eχτ · COL) is cooled or given a temperature (step S56). The substrate G, which has been completely processed as described above, is transferred from the second sub-arm mechanism 113A to the first sub-arm mechanism 113 provided in the transport section Ul (c / S) through the first main arm mechanism 115, and further, The first sub-arm mechanism 113 is housed in the second cassette C2 placed in the carry-in / out unit 103 (step S57). As shown above, the coating development processing system 300 in this embodiment includes a resist liquid, which is a scrubbing and washing unit (SCR) 19, which is a larger rotating system unit, and a resist processing block 130. The coating processing unit (CT) 'and the development processing unit (dev) 131 are liquid processing system units, which are arranged along the central transportation path 116, 124, and are smaller than these units, which is a heat treatment system unit, that is, Dehydration baking unit, pre-baking unit, post-baking unit (HP, PRE, POST), cooling unit (c0L), attachment unit (AD), etc., are arranged in the extension of the central conveying path 116, 124 Around the sub-arm mechanisms 113A and 113B on the line, three sections are piled up. In this way, as long as the units of the convergent heat treatment system are integrated, space saving and processing efficiency can be achieved, and a large number of units can be arranged at the same time. That is, it is possible to increase the number of cells while suppressing the coverage area. In addition, if the units of the heat treatment system are integrated and integrated, the electric wiring and piping can be concentrated here, so that various circuits can be arranged in a small size. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before this page) Co-operative printed 32 1227034

V. Description of the invention (30) In addition, according to this implementation, the liquid processing system processing section with the rotating system unit as the main constituent element, and the heat treatment system processing section formed by the heat treatment system unit are through the central transportation path. They are connected in series so as to be distinguished from each other. Therefore, the thermal influence of the self-heat treatment system unit to the liquid treatment system unit can be minimized. In addition, since the liquid processing system processing units 104 and 106 are provided, a plurality of liquid processing systems for performing liquid processing on the substrate G are arranged along the central conveyance paths 116 and 124 extending horizontally. A unit that transports substrates ^ to the processing units provided along the central transport path 116, 124 by the main arm mechanisms 115, 125 for moving on the central transport path 116, 124; and a thermal system processing unit 1 〇5, 107 are a plurality of thermal processing units laminated along the vertical conveying path extending vertically, and the sub-arm mechanisms 113A and 113B for moving the vertical conveying path are used for the vertical conveying path. The ground-based thermal processing units carry the substrate G. Moreover, since the thermal processing units that do not hinder the upper and lower layers are heavy and heavy, at the same time, the heat of the processing unit is arranged around the sub-arm mechanisms 113A and 113B. It is a processing unit block; therefore, it can significantly reduce the coverage area. At the same time, the processing unit of the liquid processing system that is obstructed by the top and bottom can be arranged horizontally and transported by the main arm mechanism 115, 125. High-speed quasi-horizontal movers are used as main arm mechanisms 115 and 125, and high-speed traversers can be used as high-speed movers as sub-arm mechanisms 113A and 113B, thereby achieving functional separation of the transport device and maintaining it. High productivity. In addition, in this embodiment, as the paper size set in the heat treatment system processing department, this paper applies the Chinese National Standard (CNS) A4 specification (2) × 297 mm (please read the precautions on the back first --- ------line

Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 33 1227034

V. Description of the invention (31 The second and third sub-arm mechanisms ⑴A and U3B for the substrate conveying device printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs and the Ministry of Economic Affairs printed 05 107, because the two arms 152, i52 and arm μ], M] Supports the two hands 142 and 144 for holding the substrate G from both sides, and can support it at high speed and stability, with high difficulty, large and rectangular cymbals. Also, the first rotary drive shaft 155 and the second The rotation drive shaft 165 is arranged coaxially with each other, and is located inside the rotation radius of the sub-arm mechanism 丨 丨 3A, 丨 丨 3B and outside the hands 142, 144, so while preventing the hands 142, 144 and the rotation drive shaft 155, The interference of 165 can make the arm mechanism water-type. The sub-arm mechanisms 113A and U3B for substrate transportation with this structure are based on the anti-residue-coating imaging processing device 3 as in this example. 〇, which is particularly beneficial. That is, as described above, the resist coating development processing apparatus 300 according to this embodiment integrates the units of the thermal system as described above, thereby achieving space-saving and processing efficiency ( While pushing down the coverage area, The number of elements increases). Therefore, if the sub-arm mechanisms 113A and 113B can be miniaturized by the special structure shown in Figures 丨 丨 and 12, the coating development processing system with the aforementioned structure can be further promoted The reduction of the coverage area of 300 'can be transported at high speed with the high rigidity of the sub-arm mechanisms 113A and 113B. In this way, the resist coating development processing apparatus 300 which makes it possible to increase the number of units becomes even more Promote productivity improvement. Fig. 14 shows modified examples of the second and third sub-arm mechanisms ι3A and 113B. In this modified example, the second rotary drive shafts 165 and 165 are used to move the lower hand 144. Offset to the front side (position shifted in the X direction or the Y direction) of the first rotary drive shafts 155 and 155 for moving the upper hand 142 and the outer sides of the first rotary drive shafts 15 5 and 15 5 (For the size of this paper, the Chinese National Standard (CNS) A4 (210 X 297 mm) applies) (Please read the precautions on the back before this page)) 1227034 A7 Printing of clothing by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Explanation of the invention (32) The center of the stage 140, the outer side in the diameter direction). The other structures are the same as those in FIG. 11 and FIG. 12, so the same symbols are used and the description is omitted. The structure of the example is the same as that of the nth and twelfth figures, and the second rotary drive shafts 165 and 165 are offset from the outer sides of the first rotary drive shafts 155 and 155. It is possible to more surely prevent the effects of the hands 142, 144 and the rotary drive shafts 155, 165, etc. Fig. 15 is a side view showing a modified example of the second embodiment of the present invention. In Fig. 15, the same parts as those in Fig. 9 are assigned the same symbols. The resist coating development processing apparatus 300A of the present modification includes a loading / unloading unit 103 for loading / unloading (loading and unloading) the first liquid processing system of the LCD substrate 0. The processing unit 104 rotates the substrate G for cleaning processing; the first heat treatment system processing unit 105 A is mainly used for heating and cooling processing; the second liquid processing system processing unit 106A is The substrate G is rotated to perform coating of the resist solution and removal of peripheral anti-reagent. The second heat treatment system processing unit 107A is used to perform heating and cooling treatments and liquid treatment systems. / The heat treatment system processing unit 109; and the mesial surface (I · ρ ·) 1 08, which is used to transfer the substrate 0 to the exposure apparatus 400. In addition, the liquid processing system / the heat treatment system also serves as the processing unit. 1 009 includes a third heat treatment system 109A for heating and cooling processing, and a third liquid processing system processing unit 109B for rotating the substrate for development processing. Also, this Waiting in, moving in / out 1〇3, the first liquid treatment The size of this paper is applicable to the Chinese National Standard (CNS) A4 specification (2) 〇χ 297 mm (please read the precautions on the back 1 ^^ I: Order on this page ----- ---- Information -35 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, Printed Agriculture 1227034 A7 ~ ^ --- V. Description of the invention (33) The system processing unit 104, the face (LF.) 108 structure, The system is completely the same as the example in FIG. 9, so its description is omitted. The first heat treatment system processing unit 105A is provided with a second sub-arm mechanism U3A, which is arranged in series with the first central transport path 116 (in the central transport path 116 on the extension line). Around the second sub-arm mechanism 113a, a first thermal processing unit block 170, a second thermal processing unit block 171, and a third thermal processing unit block 172 are provided. The outer part surrounds the second sub-arm mechanism U3A. Among them, the first thermal processing unit block 17 () is the dehydration and cooling unit (EXT · C0L) in order from the bottom to perform two dehydration and dehydration processes. The baking unit (HP) and the adhesion treatment unit (AD) for dehydration are stacked in four stages, of which the extension The cooling unit (EXT · COL) also has the function of acting as a relay unit when transferring the substrate G between the first liquid processing system processing unit 104 and the first heat processing system processing unit; and the substrate cooling function. The second heat treatment unit block 171 is formed by stacking three cooling units (c0L) and the attachment treatment unit (AD) for cooling the substrate in order. The third heat treatment unit block 172 , It is formed by stacking four sections of the extension · cooling unit (EXT · C0L), the cooling unit (c0L), and the two pre-baking units (PRE) for pre-baking treatment. (EXT · COL) Combines the function of acting as a relay when transferring the substrate G between the first heat treatment system processing unit 105A and the second heat treatment system processing unit 107A; and the substrate cooling function. The first thermal processing unit block 170 is connected to the first central transport path 116 of the processing unit 104 of the first liquid processing system, and is provided to be in the Y direction and third to sandwich the second sub-arm mechanism 113A. The thermal processing units 172 face each other. This paper size applies to China National Standard (CNS) A4 specification (210 X 297 mm) -------- Order --------- line (Please read the precautions on the back before this page)

36 1227034 A7-B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (34) The first heat treatment and treatment unit 107A is configured to be used with the liquid treatment system 丨 the heat treatment system and the treatment unit 109. Road 124 eight serial (on the extension line of the central transport road 124A), and equipped with a third sub-arm mechanism 113B 〇 Around the third sub-arm mechanism 113B, there is a third thermal processing unit block 172, the fourth The thermal processing unit block 173 and the fifth thermal processing unit block 174 surround the third sub-arm mechanism 113B from the outside. That is, the third thermal processing unit block 172 is disposed between the second sub-arm mechanism ι13A and the third sub-arm mechanism 113B, and the first thermal processing system processing unit 105a and the second thermal processing system processing unit 107A It was dual-use. The fourth thermal processing unit block 173 is formed by stacking four pre-baking units (PRE) for pre-baking processing in four stages. In addition, the fifth thermal processing unit block 174 is an extension / cooling unit (EXT · COL), a cooling unit (COL), and a post-baking unit (post-bake unit) for performing post-baking processing. ) Stacked up and down three sections, where the extension and cooling unit (EXT · COL) also has: when the transfer of the substrate G between the second heat treatment system processing unit 107A and the liquid processing system / heat treatment system combined processing unit 10 9 Function as a relay; and substrate cooling function. The fifth thermal processing unit block 174 is connected to the liquid processing system / heat processing system combined processing unit 109 and the second central transport path 124A described later, and is provided to sandwich the third sub-arm mechanism 113B. In the Y direction, the third thermal processing unit block 172 faces. The second liquid processing system processing unit 106A is formed by the anti-insectant processing block 130, and along the second and third sub-arm mechanisms ii3A, 113B, and the third thermal processing unit block 172 therebetween Set in parallel so that this paper size applies the Chinese National Standard (CNS) A4 specification (2) 0 X 297 mm (Please read the precautions on the back first: this page)

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37 [227034 A7 B7 V. Description of the invention (36) The description is printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. As described above, the resist coating development processing apparatus 300A of this example includes a large-scale rotating system unit, namely a scrubbing and cleaning unit (SCR) 119, and a resist processing block 130. The liquid processing system units including the agent liquid coating processing unit (ct) and the development processing unit (DEV) 131 are also provided in parallel along the central conveying paths 116 and 12A, and the thermal processing unit (HP (, Pre, pST, COL, AD) are located around the sub-arm mechanisms 113A, 113B on the extension lines of the central transport path 116, 124A, and are configured to be stacked in multiple sections, so it can be obtained as shown in Figure 9 The same effect is obtained in the embodiment. Fig. 16 is a plan view showing another embodiment of the second embodiment of the present invention. In Fig. 16, the same components as in Fig. 9 are denoted by the same reference numerals. The resist coating development processing apparatus 300B of this example includes a loading / unloading unit 103 for loading / unloading (loading and unloading) the LCD substrate G; a first liquid processing system The processing section 104A rotates the substrate G for cleaning processing; the first thermal processing system processing section 105B is mainly used for heating and cooling processing; the second liquid processing system processing section 106B is The substrate G is rotated for resist liquid coating and peripheral resist removal processing, etc., and the third heat treatment system processing department is responsible for the third liquid treatment of the heating and cooling places. The system processing unit is 10%, which rotates the substrate for processing of the "", image processing, and η face (IF) 108. It transfers the substrate G between the substrate and the exposure device paste. , Moving in and out of the department 103 and the second part of the interface (please read the precautions on the back first and then this page) il clothes re-order ----- order --------- line 39 1227034 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs V. Composition of Invention (37) (IF) 108 The system is completely the same as the example in FIG. 9, so its description is omitted. The first liquid processing system processing unit 104A is provided with a first main arm mechanism 115 that receives a substrate from a first sub-arm mechanism 113. One side of the main arm mechanism 115 is provided in parallel along the central transport path 1 丨 6A: for example, a cleaning unit (SCR) i 19 formed by a brush scrubber; and an exciter unit for cleaning organic matter (Excimer) 112. The first heat treatment system processing unit 105 is arranged in series with the first central transportation path 116A (on the extension line of the central transportation path 16). The first heat treatment system processing unit 105B is provided with The second sub-arm mechanism 113A. This second sub-arm mechanism 113A is basically configured in the same manner as that shown in FIG. 9 and has an arm 114 that can hold the substrate G, that is, the arm can be rotated, moved forward and backward, and moved up and down. In this way, the substrate can be transferred to a given position of a processing unit around the later described. Around the second sub-arm mechanism 113A, a first thermal processing unit square 177, a second thermal processing unit block 178, and Box 179 of the third thermal processing unit, which is enclosed from the outside Two-arm mechanism U3A. Among them, the first thermal processing unit block 177 is an extension · cooling unit (EXT · COL) in order from the bottom, and two dehydration bakes for dehydration bake processing. The baking unit (HP) is formed by stacking three sections, and the extension and cooling unit (EXT · COL) has both: substrate G is performed between the first liquid processing system processing unit 104A and the first heat processing system processing unit 105B. The function of acting as a relay part during the handover; and the cooling function of the substrate. The second thermal processing unit block 178 'the two cooling units used to cool the substrate in order below the energy can be used in accordance with Chinese National Standards (CNS) A4 size ⑵Q x 29 < 7 mm) (Please read the precautions on the back-^ 衣 _ 丨 卜 on this page) ------ Order --------- Line

40 1227034 A7 B7 V. Description of the invention (38 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs (COL) and attached to the processing unit (AD) for hydrophobic treatment. The second thermal processing unit Box 179 is formed by stacking two extension and cooling units (EXT · C0L) and the attachment processing unit (AD) in three stages. 'The extension and cooling unit _ττ · coL) has both: in the first heat treatment The function of the system processing unit 105B and the second liquid processing system processing unit 106B as the relay unit when transferring the substrate G; and the substrate cooling function. The first thermal processing unit block 177 is connected to the first central transport path 116A of the first liquid processing system processing unit 104A; the third thermal processing unit block 179 is connected to the second liquid processing system processing unit 1 〇6B is the second central transport path 124B. These first and third thermal processing unit blocks 177, 179 are arranged to face each other in the γ direction with the second sub-arm mechanism U3a interposed therebetween. On the one hand, the second liquid processing system is equipped with a second main arm mechanism 125 for processing 10 criminals, and it travels on a second central transport path 124B extending along the γ direction. This second main arm mechanism 125 is configured in the same manner as the first main arm mechanism 115, and has a base 126 and an arm 127 having basically the same configuration as that shown in FIG. On one side of the second main arm mechanism 125, a resist processing block 130 is provided. The second heat treatment system processing unit 107B is arranged in series with the second central transport path 124B (on the extension line of the central transport path 24). The second heat treatment system processing unit 107B is provided with a third sub-arm mechanism 113B. The third sub-arm mechanism 113B is configured in the same manner as the second sub-arm mechanism U3A, and has an arm 114 that can hold the substrate G. The arm 114 can be rotated back, forward and backward, and moved up and down, so that the substrate can be transferred to the later described. The surrounding processing unit is given first-read the back-the top notes

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Device. A fourth thermal processing unit block 180, a fifth thermal processing unit block 181, a sixth thermal processing unit block 182 ', and a seventh thermal processing unit are provided around the second child arm mechanism 113B. The frame 183 surrounds the third sub-arm mechanism i 13B in an arc shape from the outside. The fourth thermal processing unit block 180 is a stack of three expansion and cooling units (Exτ · c0L) and two pre-baking units (PRE) used for pre-baking in order from below. The expansion and cooling unit (PRE) also has the function of acting as a relay unit when transferring the substrate G between the second liquid processing system processing unit 106B and the second thermal processing system processing unit 07B; and the substrate Cooling function. The fifth thermal processing unit block 181 is formed by stacking three pre-baking units (PRE) for pre-baking processing in three stages. The sixth heat processing unit block 182 is a stack of three post-baking units (POST) used for post-baking processing. The seventh thermal system processing unit, box 1 83, stacks the expansion and cooling unit (Exτ · c0L) and the two post-baking units (p〇ST) for post-baking in order. It consists of two sections, where the expansion / cooling unit (Exτ · c〇L) * prepared ·· acts as a relay when the substrate G is transferred between the second heat treatment system processing unit 107B and the third liquid treatment system processing unit 109C. External function; and substrate cooling function. In addition, the fourth thermal processing unit block 180 is connected to the second central conveyance path 124B of the second liquid processing system processing unit 106B; the seventh "," system processing | yuan 183 series is connected to the third liquid department Wangli The system processing unit 109C will describe the second central transport path 191 later; the fourth and seventh thermal processing unit blocks 180 and 183 are arranged so as to sandwich the third sub-arm mechanism ιΐ3Β on the γ side (please first Read the notes on the back before turning: ------ ^ --------- line

This paper is a medium-sized standard (CNS) A4 specification ⑵0 X 297 public love 42 printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 1227034 Λ7 '---------------- 4l) The second heat treatment system processing unit 107B between the frame 130 and the development processing unit (DEV) 131 can shorten the substrate transportation time from the pre-baking process through the exposure process to the post-baking process. The present invention is not limited to the foregoing embodiments, and various modifications can be made without departing from the scope of the present invention. For example, according to the above-mentioned embodiment, an example in which the present invention is applied to a resist development processing device for an LCD substrate has been exemplified, but it is not limited to this, and may be applied to coating of other substrates such as color filters. It can also be applied to substrate processing equipment other than resist coating development processing equipment. Also, in the first embodiment described above, similarly to the second embodiment, the heat processing unit block is formed by stacking the heat treatment system units in a plurality of stages, and a plurality of heat treatment unit blocks are arranged around a given section of the transport path extension line. Structure, it can play the same effect as the second embodiment. [Effects of the Invention] As described above, according to the present invention, since a common transporting means for transporting substrates to the first and first processing unit groups (for each independent series of processes) is provided, it is less than each system. The structure of the conventional known devices can reduce the transportation means and make the device's coverage area (f00tprint) smaller. According to another aspect of the present invention, since a rotating system unit or a liquid processing system unit is provided along the conveying path, and the thermal processing unit is stacked in multiples to form a thermal processing unit block, and this heat Most of the processing unit blocks are arranged around a given part of the transportation path or its extension line, so the coverage area can be reduced while the number of units can be increased. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before this page) Order --------- line

44 1227034 A7 B7 V. Description of the invention (42 [Simplified description of the drawing] Please-Read the back and side notes first. Figure 1 is a plan view showing the anti-residue coating of the LCD substrate of the first embodiment of the present invention. Development processing device. FIG. 2 is a side view showing the inside of the [CD substrate resist coating development processing device of the first embodiment of the present invention. FIG. 3 is a block diagram showing the present invention. The control system of the processing table in the anti-residue coating development processing device for the CD substrate of the first embodiment. Fig. 4 is a side view showing the schematic configuration of the horizontal conveying device. II Order 5 is a The cross-sectional view 'shows a schematic configuration of the horizontal transport device. FIG. 6 is a flowchart showing a selective substrate loading operation in the resist coating development processing device of the LCD substrate according to the first embodiment of the present invention. Example 0 Figure 7 is a flowchart showing the LCD of the first embodiment of the present invention.

Another example of the selective substrate carrying-in operation in the case where the anti-agent of the substrate is applied to the development processing device. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. FIG. 8 is a flowchart showing an example of the processing operation of the [CD substrate resist coating development processing device] according to the first embodiment of the present invention. FIG. 9 is a plan view showing an anti-residue coating development processing device for an lcd substrate according to a second embodiment of the present invention. Fig. 10 is a side view showing a part of the resist coating developing processing apparatus of Fig. 9; Figure 11 is a plan view showing the size of the resist coated paper suitable for Figure 9 and the applicable Chinese National Standard (CNS) A4 specification (210 X 297 cm) 45 1227034 A7 _B7_ V. Description of the invention (43) Substrate transfer device for cloth development processing device. Fig. 12 is a front view showing a substrate transfer apparatus suitable for the resist coating developing processing apparatus of Fig. 9; Fig. 13 is a flowchart showing a processing process to which the resist coating developing apparatus of Fig. 9 is applied. Fig. 14 is a flowchart showing a modified example of the substrate transfer apparatus shown in Figs. 11 and 12; Fig. 15 is a plan view showing a modified example of a resist coating development processing apparatus for an LCD substrate according to a second embodiment of the present invention. FIG. 16 is a plan view showing another modified example of the resist coating development processing apparatus for the LCD substrate according to the second embodiment of the present invention. (Please read the notes on the back before this page) ----- Order --------- Line

Printed by the Employees' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, the paper size is applicable to the Chinese National Standard (CNS) A4 (210 X 297 mm) 46 1227034 A7 B7 V. Description of the invention (44) Component label comparison 1 ... Cassette station 2 ... Processing station 2a ... First processing unit group 2b ... Second processing unit group 3 ... Interface stations 21a, 21b ... Ultraviolet irradiation units (UV) 22a, 22b, 23a, 23b ... Scrubbing and washing unit (SCR) 24a , 24b ... resist coating processing units 27a, 27b ... resist processing blocks 28a, 28b, 32, 33, 34, 35 ... processing blocks 29a, 29b, 30a, 30b, 31a, 31b ... development processing Units 42,44,46,48,50… Transportation devices (transportation means) 70… Controllers (selection means) 100,300,300A, 300B… Resist coating development processing devices 104, 106, 106A, 106B, 109B, 109C ··· liquid processing system processing sections 105, 105A, 105B, 107, 107A, 107B, 109A ... heat treatment system processing sections 113, 113A, 113B ... sub-arm mechanisms 115, 125, 190 ... main arms mechanisms 116, 124, 191 ... Central transportation path (transportation path) G ... Please read the back of LCD substrate, Item

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Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper is sized to the Chinese National Standard (CNS) A4 (210 X 297 mm) 47

Claims (1)

1227034 6. Various types of substrate processing devices for patent application, which are applied to a substrate. A given processor 'includes: a first processing unit group, which is prepared to perform a majority of the processing-material first-processed by most projects. 70 processing units; a first processing order of 70 groups, which are provided with a plurality of processing units for performing a series of second processing performed by a majority of projects; and a common transportation means for performing the first processing And the substrates of each processing unit of the second processing unit group. If applied for a patent | The substrate processing apparatus according to the item, wherein the processing contents are performed by the first processing unit group and the second processing unit group, are the same. tj 3. The substrate processing apparatus according to item 2 of the scope of patent application, wherein the first and second processing unit groups are arranged symmetrically with a transport means interposed therebetween. 4. The substrate processing apparatus according to item 丨 of the scope of the patent application, wherein the processing center " is performed by using the first processing unit group and the second processing unit group, which are different from each other. 5. The substrate processing apparatus according to item 1 of the scope of the patent application, wherein the aforementioned transport means includes: a horizontal transport path extending in a horizontal direction; and a horizontal transport mechanism 'which moves along the horizontal transport path, and The substrates are transferred between the processing units. 6. The substrate processing apparatus according to item 1 of the scope of patent application, wherein the aforementioned conveying means includes: a vertical conveying path extending in a vertical direction; and a vertical conveying mechanism that moves along the vertical conveying path, and The paper size applies to the Chinese National Standard (CNS) A4 specification (21Q x 297 Gongfa 48 processing unit transfer substrates. 1227034, patent application scope I as described in the patent application scope of the substrate processing device, which is more spare XY A storage container placement ^ on which a substrate storage container capable of storing a substrate is placed, and a carry-in and carry-out section for carrying in / out of a substrate. I A substrate processing apparatus for applying a given processor to a substrate 'Contains: The first processing unit group is provided with a plurality of processing units for performing a series of first processes formed by a plurality of processes; the second processing unit group is provided for performing a plurality of processes with a plurality of processes. A plurality of units of a series of second processing; and a transportation means for performing processing on each processing unit of the first and second processing unit groups The transportation of the substrate; and the selection hand, which is used to select which one of the first processing unit group and the second processing unit group should be used to process the substrate. 9. If the scope of application for patent No. 8 The substrate processing apparatus described in the above item, wherein the processing contents are performed by using the aforementioned first processing unit group and the second processing unit group. 10. The substrate processing device according to item 9 in the scope of patent application, wherein the aforementioned selection Means are used to detect one of the substrates that can be transported in the first processing unit and the second processing order 7L group, and control the it transporter according to the detection result, so that the substrate can be transported into the transportable processing unit 11 · The substrate processing device as described in item 8 of the application scope of the patent, which uses the (210 X 297 mm) intention page group. Former 49 Printed by the Consumer Property Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 1227034 Factory C8 ^ $ 帛 4 理The contents of the single 70 group and the second processing unit group to perform processing are different from each other. 12. The basic processing device described in item η of the patent scope, in which the first 4 selection means are used to judge The board should perform one of the first I processing unit group and the second processing unit group, and control the aforementioned transportation means according to the knot, so as to move the substrate into the identified processing unit group. The substrate processing apparatus described in Item 8 of the π patent scope is further reserved. A storage container for placing a substrate storage container that can store a substrate | a loading and unloading unit for loading and unloading a substrate. A substrate processing apparatus for applying a given processor to a substrate includes: a first processing unit group provided with a plurality of processing units for performing a series of first processes performed by a plurality of projects; a second A processing unit group is provided with a plurality of processing units for performing a series of first processing performed by a majority of projects; and a common transportation means is used for performing the processing on the first and first processing unit groups. The substrates of each processing unit are transported; the first and second processing unit groups are provided with: a horizontal processing box, which is configured with a plurality of processes horizontally Element; vertical processing block and which system the processing unit is configured a plurality of piled up in a vertical direction; suitable for the present scale paper China National Standard (CNS) A4 size (210 X 297 mm) : 丨 丨 ： ----------- Order -------- (Please read the precautions on the back before this page) Line 50 1227034 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs The conveying means includes: a horizontal conveying device which is movably installed in the horizontal direction so as to transfer the substrates to the horizontal processing frame; a vertical conveying device which is movably installed in the vertical direction. In order to transfer the substrate to the aforementioned vertical processing block. 15. The substrate processing apparatus according to item 14 of the scope of patent application, wherein: the horizontal processing block has a plurality of liquid processing units for applying liquid processing to the substrate; and the vertical processing block has a thermal processing for applying the substrate. Most heat treatment units. 16. The substrate processing apparatus according to item 14 of the scope of application for a patent, wherein: the horizontal processing box is provided in a plurality, and the transportation path corresponding to the horizontal direction transportation device is arranged in a straight line. 17. The substrate processing apparatus according to item 14 of the scope of application for a patent, which is a substrate processing apparatus that performs resist coating on a substrate and develops an image after exposure; wherein the horizontal processing box has: A resist coating processing unit for an anti-corrosive agent; and / or a developing processing unit for developing processing. 18. The substrate processing apparatus according to item 17 of the scope of patent application, wherein the horizontal processing block further includes a cleaning processing unit for cleaning the substrate. 19. The substrate processing apparatus according to item 17 or 18 of the scope of application for a patent, which further has a mesial portion, which is a substrate that is transferred between the substrate and the exposure apparatus for performing exposure treatment after the resist is applied to the substrate. . 20 · The substrate processing device as described in item 14 of the scope of patent application, wherein the paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm). Order --------- line (please Read the precautions on the back before ^ this page) y Printed 1227034 / printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, the scope of the patent application has a storage container placement section for placing substrate storage containers that can store substrates; And a loading / unloading unit for loading / unloading the substrate. 21 · A substrate processing method, which is a method for performing a given processing on a substrate by a substrate processing device, is: for each substrate, select which one of the first processing unit group and the second processing unit group should be used for processing, each The substrate is processed by the processing unit group selected by the one; the substrate processing device includes: a first processing unit group equipped with a plurality of processing units for performing a series of first processing by a plurality of projects; The second processing unit group is provided with a plurality of processing units for performing a series of second processing by a plurality of processes; and a common transportation means is used for carrying out the substrates for the first and second processing unit groups. Its shipping. 22. A substrate processing device, which is a processing device that applies a coating liquid to a substrate to form a thin film, and simultaneously develops the aforementioned thin film exposed in correspondence with a circuit pattern, including: a plurality of rotating system units, It is used to rotate the substrate for processing; many heat treatment system units are heated and cooled without rotating the substrate; and a transport device is used to transport the substrate and carry it out and into the aforementioned units; And ^ paper size applies the home standard (CNS) A4 specification (210 X 297 mm) 52 --- ^ ----- order --------- line (please read the precautions on the back before 9 (This page) too 1227034 The transportation path in the scope of the six claims of the Shenshen patent, which forms the movement path of the aforementioned device; the consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs printed the aforementioned rotating system unit, which is arranged in parallel along the aforementioned transportation path; The heat treatment system units are stacked into a plurality of sections to form a heat treatment unit block; the heat treatment unit blocks are mostly arranged around a given part of the transportation path or an extension line thereof. • The substrate processing device as described in Item 22 of the patent scope, which includes a rotating system processing section formed by a rotating system unit and a thermal processing system processing section formed by a thermal processing system unit; the aforementioned rotating system processing The heat treatment system and the heat treatment system treatment unit are connected in series through a transportation path, thereby being distinguished from each other. 24. The substrate processing apparatus according to item 22 of the scope of the patent application, wherein the aforementioned rotation system unit includes at least: a thin film forming unit that applies a coating liquid to the substrate to form a thin film; and a development processing unit, It is used to develop the aforementioned thin film with the circuit pattern exposed; and the aforementioned heat treatment system unit includes a plurality of baking treatments ^ which are used for baking the substrate before and after the development processing 25. The substrate processing apparatus according to item 24, wherein the plurality of baking processing units are collectively provided between the thin film forming unit and the developing processing unit. 26. The substrate processing device according to item 22 of the scope of the patent application, wherein the aforementioned rotation system unit includes at least: a cleaning processing device 'which is used for cleaning the substrate; a thin film forming unit, which is intended to support Reason 丨 X 297 mm) 53 ^ 227034 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs (Please read the back; ^ Matters before _ this page) * / n I §8S A '_Please turn the patent ^ — the coating liquid is applied to the substrate to form a thin film; and the development processing unit, which is used for The aforementioned film exposed in correspondence with the circuit pattern of the development image · The aforementioned heat treatment system unit includes at least a plurality of baking processing units, which are respectively baked after the cleaning process and before and after the development process Processing; cooling processing unit, which performs cooling processing on the Z substrate; and attachment unit, which performs adhesion processing on the substrate. 27. The substrate processing apparatus according to item 22 of the scope of application for a patent, wherein the above-mentioned red transfer system is only provided on the side of the transportation path. 28_ The substrate processing apparatus according to item 22 of the scope of Shenying's patent, wherein the given part is provided with a sub-arm mechanism, which is used to take out the substrate for each unit of the aforementioned plurality of thermal processing unit blocks And 29. A substrate processing apparatus, which is a substrate processing apparatus that applies a coating liquid to a substrate to form a thin film, and simultaneously develops the aforementioned thin film exposed in correspondence with a circuit pattern, including: Most of the liquid processing system units supply a given liquid to the substrate for processing; most of the heat treatment system units perform heat treatment of the substrate; and the transport device is used to transport the substrate and carry it out and into the aforementioned area. Each unit; and a conveying path, which forms the moving path of the aforementioned device; of which: this paper size applies to China National Standard (CNS) A4 (210 X 297 public love) 54 1227034 A8 B8 C8 D8 VI. Patent Application Scope Printed by the Intellectual Property Bureau Employee Consumer Cooperative of the Ministry of Economic Affairs, printed month, J liquid processing system units are installed in parallel along the aforementioned transport path; the aforementioned heat treatment system units are stacked into multiple sections The thermal system unit = unit box is formed; most of the thermal system processing unit boxes are arranged around a given part of the transportation path just described or on its extension line. 30. The substrate processing apparatus according to item 29 of the declared patent scope, wherein a sub-arm mechanism is arranged in the given portion, and the substrate is taken out and placed by each unit of the aforementioned plurality of thermal processing unit blocks. 〇31 · -A kind of substrate processing device is a substrate processing device that performs a series of processing on the substrate including a large number of liquid processing and heat treatment accompanying the liquid processing, including: a plurality of liquid processing system unit management The heat treatment transport device of the plurality of heat treatment system units in the aforementioned majority of liquid treatment is used to transport the substrate and carry it out and into the aforementioned units; and the transport path is to form the movement path of the aforementioned device; of which: The liquid processing system units are installed in parallel along the transportation path; the heat treatment system units are stacked into multiple sections to form a thermal processing unit block; most of the thermal processing unit blocks are arranged in the description Around a given part of a transport road or its extension. 32 · —A kind of substrate processing device, which executes the liquid treatment of the substrate for the substrate to be processed, and it accompanies the substrate (please read the precautions on the back first, then 1 ^ | this page) l Order- ------- The line size of the paper is applicable to the Chinese National Standard (CNS) A4 (210 X 297 mm) 55 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 1227034 __ C8 VI. Scope of Patent Application Those who process substrates processed by most processes, including heat treatment, include: ^ The first processing section is configured with a horizontal transport path extending horizontally along one direction, and performs liquid processing on the substrate to be processed Most of the liquid processing units include a first processing unit, and a substrate to be processed for each processing unit provided along the horizontal transportation by the first transportation device moved on the horizontal transportation path; and a second processing unit. , Which is provided with a plurality of heat treatment units that perform heat treatment on the substrate to be processed in the up and down directions along a vertical extending vertical transport | transport 4 path, and is moved by the aforementioned vertical transport path The first conveying device conveys the substrate to be processed to each processing unit provided along the vertical conveying path. ^ ----- Order --------- Line (Please read the precautions on the back before this page) This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 56