經濟部智慧財產局員工消費合作社印製 480549 A7 B7___ 五、發明說明（1 ) 〔發明之背景〕 本發明係有關以塗敷抗蝕液等之塗敷液於液晶顯示器 (L C D )基板等之基板來形成塗敷膜，而後要進行端面 去除處理的基板處理裝置及基板處理方法。 在製造液晶顯示器（L C D )時，以塗敷光致（光阻 )抗蝕劑於玻璃製之矩形L C D基板來形成抗蝕膜，並以 對應於電路圖案來曝光抗蝕膜且實施其顯像處理之所謂光 刻（照相平版印刷）技術來形成電路圖案。 在於該塗敷抗蝕液之過程，爲了要增進抗蝕劑之固定 性，將會在黏著處理單元進行疏水化處理（Η M D S處理 )，並在冷卻單元予以冷卻後，搬入於抗蝕劑塗敷單元。 而在抗蝕劑塗敷單元，將以保持矩形之基板於旋轉夾 盤（卡盤）上之狀態下來旋轉之同時，從配設於該上方之 噴嘴供抗蝕液於基板表面中心部，並由基板之轉動所產生 之離心力來擴散抗蝕液，由而可塗敷抗蝕膜於基板表面整 體。 該塗敷有抗鈾液之基板，將由周緣部處理單元來去除 周緣之多餘之抗蝕劑。而後，被搬入於加熱處理裝置來進 行預烘乾處理，且在冷卻處理裝置被冷卻後，搬運至曝光 裝置並在該處曝光所定之圖案。而後，以顯像處理單元來 進行顯像處理，進而由加熱處理裝置來實施後烘烤處理， 而形成所定之抗蝕劑圖案。 於上述之L C D基板的光刻過程中，周緣部處理單元 ，將從沿著基板之各邊移動之頭部吐出稀釋劑之同時，去 ------%—*—m^--------訂---------. (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -4- 480549 A7 B7 五、發明說明（2 ) 除附著於基板四邊之周邊部的多餘之抗蝕劑。 而要搬入於該周緣部處理單元之基板，因已在抗蝕劑 塗敷處理單元由伺服馬達（電動機）被對準位置，因而， 該伺服馬達之精度爲高時，並不需要在被搬入於周緣部處 理單元之（載置）台之時刻，予以進行對準基板之位置。 然而，伴隨著近年來之大型化’基板之尺寸（大小） 也變爲大，使得基板從抗鈾劑塗敷處理單元搬運至周緣部 處理單元之載置台時，有形成基板並不一定正確地對準位 置於載置台之所定位置之情事。 另一方面，在於上述之塗敷·顯像處理中，會在塗敷 有抗蝕劑之基板被實施預烘乾處理等之後，或基板被曝光 而完成顯像處理後，有可能轉印上述之加熱處理單元之升 降銷、固定銷、或真空溝等之形狀於基板之情事產生。爲 了防止產生如此之轉印，本發明人等在先前揭示有，在塗 敷抗蝕劑於基板之後，以減壓狀態來烘乾基板之情事（日 本國特願平10 — 233596號）。爲此，配置了減壓 烘乾單元於抗蝕劑塗敷處理單元和周緣部處理單元之間。 然而，當以如此地以減壓狀態來烘乾時，基板之對準 位置並不一定成爲良好的精度，使得搬運基板至周緣部處 理單元時，有可能產生偏位之情事。 〔發明之槪要〕 爲了解決上述之課題，依據本發明之第1觀點，乃在 於一種基板處理裝置，其係具備：以塗敷所定之塗敷液於 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) Z--------訂— 經濟部智慧財產局員工消費合作社印製 -5- 經濟部智慧財產局員工消費合作社印製 480549 A7 __B7__ 五、發明說明（3 ) 基板來形成塗敷膜的塗敷處理單元；實施端面處理於塗敷 處理後之基板的端面處理單元；及搬運基板於該等塗敷處 理單元及周緣部處理單元間的搬運機構，其特徵爲： 前述周緣部處理單元具備有：要載置基板用的載置台 ;及用以對準由前述搬運機構搬入於前述載置台上之基板 的位置用之對準位置機構。 以如上述，由於要搬入於周緣部處理單元之載置台上 之基板，可由對準位置機構來對準位置，因而，甚至伴隨 著近年來之要求基板的大型化而基板尺寸變爲大之狀況， 也可配置基板於正確的位置。 又依據本發明之第2觀點，係一種基板處理裝置，具 備有：以塗敷所定之塗敷液於基板來形成塗敷膜的塗敷處 理單元；實施烘乾處理於塗敷處理後之基板的烘乾（弄乾 )處理單元；烘乾處理後要對於基板實施周緣部處理的周 緣部處理單元；及要搬運基板於該等塗敷處理單元、烘乾 處理單元及周緣部處理單元之間的搬運機構，其特徵爲： 前述周緣部處理單元具備有：要載置基板用的載置台 ;及用以對準由前述搬運機構搬入於前述載置台上之基板 的位置用之對準位置機構。 當使用減壓處理單元於塗敷處理單元和周緣部處理單 元之間時，雖有可能在減壓處理單元並無法充分地實施對 準位置，但由於如此地配設會在周緣部處理單元之載置台 上進行對準位置的對準位置機構，使得可配置基板於正確 的位置。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -6 - ------·---.-----------訂--------- (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 480549 A7 B7____ 五、發明說明（4 ) 本發明之第3觀點，係一種基板處理裝置，具備有： 以塗敷所定之塗敷液於基板來形成塗敷膜的塗敷處理單元 ;處堙塗敷處理後之基板周緣部的周緣部處理單元；及搬 運基板於該等塗敷處理單元及周緣部處理單元間的搬運機 構，其特徵爲： 前述周緣部處理單元具備有：載置基板的載置台；可 沿著被載置於前述載置台上之基板各片移動，而要處理前 述基板周緣部用之頭部；要沿著前述基板各邊移動前述各 頭部用之第1移動機構；及以朝向各邊來移動各頭部而使 前述各頭部抵接於基板各邊，以令基板對準位置用之第2 移動機構。 又本發明之第4觀點，係一種基板處理裝置，具備有 :以塗敷所定之塗敷液於基板來形成塗敷膜的塗敷處理單 元i實施烘乾（弄乾）處理於塗敷處理後之基板的弄乾處 理單元·，弄乾處理後要處理基板周緣部用之周緣部處理單 元；及要搬運基板於該等塗敷處理單元，及弄乾處理單元 以及周緣部處理單元之間的搬運機構，其特徵爲： 前述周緣部處理單元具備有：載置基板的載置台；可 沿著被載置於前述載置台上之基板各Θ移動，而要處理前 述基板周緣部用之頭部；要沿著前述基板各邊移動前述各 頭部用之第1移動機構；及以朝向各邊來移動各頭部而使 前述各頭部抵接於基板各邊，以令基板對準位置用之第2 移動機構。 該等發明，並不需要使用特別之定位構件之下，就可 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ---------4---^ -------^---------. (請先閱讀背面之注咅？事項再填寫本頁) 480549 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（5 ) 定位基板於載置台上之所定位置。 例如前述對準位置機構乃可構成爲具有：前端部被形 成爲Y字形狀之臂；被安裝於該臂之Y字形狀的前端部且 可抵接於基板角隅部之一對滾軸；及用以升降前述臂且成 略水平來移動，以令一對滾軸抵接於基板角隅部來對準基 板之位置用之移動機構。以如此，由於抵接滾軸於基板角 隅部來使基板對準位置，因而，可定位基板於正確的位置 〇 再者，於如此構造之對準位置機構，可構成爲具有在 於降下前述臂時，用以洗淨前述滾軸用之洗淨箱者。在於 周緣部處理單元，當要處理基板周緣部時，雖具有附著塗 敷液於滾軸之虞，然而在對準位置後，以如上述，由洗淨 箱來洗淨滾軸時，就在以後之對準位置時，並不會具有附 著不需要之塗敷液於基板之虞。 再者，前述洗淨箱可構成爲具有：要吐出洗淨液於由 前述臂所降下之滾軸來洗淨滾軸用之洗淨液噴嘴；噴出惰 性氣體於該滾軸以弄乾滾軸用之惰氣噴嘴；及要從前述洗 淨箱排出該等洗淨液和惰氣之排液及排氣用之排出機構的 構造。以如上述，當要由洗淨箱來洗淨滾軸之時，以洗淨 液洗淨滾軸後，予以噴出惰氣來弄乾滾軸，因而，可確實 地進行洗淨滾軸。 本發明之第5觀點係具備有：（a)以塗敷所定之塗 敷液於基板來形成塗敷膜之過程；（b)載置前述塗敷處 理後之基板於載置台之過程；（c )定位前述所載置之基 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -8- --------------------訂---------. (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 480549 A7 B7__ 五、發明說明（6 ) 板於載置台上之所定位置用之過程；及（d )對於前述所 定位之基板周緣部進行處理之過程’爲其特徵。 〔發明之實施形態〕 以下，將參照所附上之圖式來詳細的說明本發明之實 施形態。 圖1係顯示要適用本發明之L C D基板之抗蝕劑塗敷 •顯像處理系統的平面圖。 該塗敷·顯像處理系統乃具備有：要載置收容有複數 基板G用之卡匣C的卡匣站1 ;具有要對於基板實施包括 抗蝕劑塗敷及顯像之一連串的處理用之複數處理單元的處 理部2 ;及要在與曝光裝置（未圖示）之間進行基板G之 授受用之接口（ Interface )部3，而處理部2之兩端各配 設有卡匣站1及接口部3。 卡匣站1具備有，要進行搬運L CD基板於卡匣C和 處理部2間用之搬運機構1 0。而在卡匣站1，將實施卡 匣C的搬出搬入。又搬運機構1 〇乃具備可沿著卡匣之排 列方向所設之搬運道1 0 a上移動之搬運臂1 1，而由該 搬運臂1 1來搬運基板G於卡匣C和處理部2之間。 處理部2係分成前段部2 a和中段部2 b及後段部2 c，並各具有搬運道12、 13、 14，而配設各處理單 元於該等搬運道兩側。而且在於該等之間，配設有中繼（ 轉接）部1 5、16。 前端部2 a具有可沿著搬運道1 2移動之主搬運裝置 ----— — — — — — — - — — — In— ^ ·1111111» . (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210x297公釐) -Q - 549 A7 五、發明說明（7 ) 1 7 ’而搬運道1 2之一方側則配置有2部之洗淨單元 s C R ) 2 1 有由重疊紫外 成上下所形成 疊之2部加熱 2 6，及成上 冷卻單元2 7 又中段部 運裝置1 8， 元（C T ) 2 2、減壓烘乾（弄乾 4 0及要去除基板g周緣部之抗蝕 )2 3成一體’而構成爲塗敷系處 敷系處理單元群係形成在抗蝕劑塗 敷抗蝕劑於基板G之後，搬運基板 (VD)40來進行烘乾處理，而 )2 3來進行周緣部抗蝕劑去除處 側乃配置有成上下重疊2部之加熱 加熱處理單元2 8，和成上下重疊 卻處理裝置（C 0 L )所形成之加 ，及成上下疊層黏著處理裝置（A C〇L )所形成之黏著處理/冷卻 再者，後段部2 c乃具備有， 之主搬運裝置19，而在搬運道1 之顯像處理單元（D E V ) 2 4 a 經濟部智慧財產局員工消費合作社印製 a、2 1 b，搬運道 線照射裝置（U V ) 之紫外線照射/冷卻 處理裝置（Η P )所 下重疊之2部冷卻裝 〇 2 b乃具備有可沿著 而在搬運道一方側乃 1 2之另一方側乃配置 及冷卻裝置（C〇L ) 單元2 5，和成上下重 形成之加熱處理單元 置（C〇L )所形成之 搬運道1 3移動之主搬 配設抗蝕劑塗敷處理單 )處理單元（V D ) 劑用之去除緣部（E R 理單元群100。該塗 敷處理單元（C T )塗 G至減壓烘乾處理單元 後，由去除緣部（E R 理。搬運道13之另一 裝置（Η P )所形成之 加熱裝置（Η Ρ )和冷 熱處理/冷卻單元2 9 D )和冷卻裝置（ 單元3 0。 可沿著搬運道14移動 4之一方側配置有3部 2 4b、 24 在 ------.—-—--------訂---------. (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -10- 480549 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（8 ) 於各搬運道1 4之另一方側則配置有，成上下重疊之加熱 處理裝置（HP )所形成之加熱處理單元3 1 ，及成上下 疊層加熱處理裝置（Η P )和冷卻裝置（C〇L )所形成 的2部之加熱處理/冷卻單元32、 33。 上述主搬運裝置17、 18、 19乃各具備有，水平 面內之2方向的X軸驅動機構、Υ軸驅動機構，及垂直方 向之Ζ軸驅動機構，並再具有以Ζ軸爲中心旋轉之旋轉驅 動機構，且各具有支撑基板G用之臂1 7 a、18a、 1 9 a ° 再者，處理部2乃構成爲，在挾持搬運道之一方側僅 配置如洗淨單元2 1 a、抗蝕劑塗敷處理單元2 2、顯像 處理單元2 4 a之旋轉系單元而已，而在另一方側則僅配 置加熱處理單元或冷卻處理單元等之熱系處理單元而已之 構造。 又在中繼部1 5、1 6之旋轉系單元配置側之部分乃 配置有藥液供應單元3 4，且更配設有可維護之空間3 5 〇 接口部3乃具備有：在與處理部2之間進行授受基板 時，可暫時性地保持基板用之擴展（部）3 6 ;配設於其 兩側之要配置緩衝（用）卡匣之2個緩衝台3 7 ;及要進 行搬入搬出基板G於該等和曝光裝置（未圖示）之間用的 搬運機構3 8。搬運機構3 8乃具備有可朝沿著擴展部 3 6及緩衝台3 7之排列方向所配設之搬運道3 8 a上移 動之搬運臂3 9，而由該搬運臂3 9來進行搬運基板G於 (請先閱讀背面之注意事項再填寫本頁) --------訂--- -l· · 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -11 - 經濟部智慧財產局員工消費合作社印製 480549 Α7 _____ Β7 五、發明說明（9 ) 處理部2和曝光裝置之間。 以如上述匯集各處理單元來成爲一體化時，就可意圖 省空間化及處理的有效率化。 而以如此所構成之抗蝕塗敷及顯像系統中，將搬運卡 匣C內之基板G至處理部2，並在處理部2，首先，會在 前端部2 a之紫外線照射/冷卻單元2 5之紫外線照射裝 置（U V )予以.實施表面重整（改性）.洗淨處理，而後 在該單元之冷卻裝置（COL)予以冷卻後，在洗淨單元 (SCR)21a、 21b實施擦洗洗淨，且在配置於前 段部2 a之加熱處理裝置（Η P )中之一，予以加熱烘乾 之後，在冷卻單元2 7之任一之冷卻裝置（C 0 L )加以 冷卻。 本發明係鑑於如此之情事而發明者，其目的係擬提供 一種從塗敷處理單元搬入至周緣部處理單元之基板，可配 置於正確的位置之基板處理裝置者。 接著，基板G被搬運至中段部2 b，而爲了增進抗蝕 劑之固定性，將在單元3 0之上層黏著處理裝置（A D ) 實施疏水化處理（Η M D S處理），且在下層之冷卻裝置 (C 0 L )冷卻後，搬入於塗敷系處理單元群1 〇 〇。在 於該塗敷系處理單元群1 0 0，將在塗敷單元（C Τ ) 2 2塗敷抗蝕劑，而由減壓烘乾處理單元（V D ) 4 0來 進行烘乾處理，且在去除緣部（E R ) 2 3來去除基板G 周緣部之多餘的抗蝕劑。而後，基板G將在被配置於中段 部2 b之加熱處理裝置（Η Ρ )中之一被實施預烘乾處理 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -12- ··---*--^一^ 裝--------訂--------- (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 480549 A7 B7____ 五、發明說明（10 ) ，而在單元2 9或3 0之下層的冷卻裝置（COL )被冷 卻。 然後’基板G將從中繼部1 6以主搬運裝置1 9且藉 接口部3來搬運至曝光裝置，並在該處被曝光成所定之圖 案。而後，基板G再藉接口部3被搬入，並因應於所需而 在後段部2 c之某一加熱處理裝置（Η P )進行後曝光烘 乾處理後，在顯像處理單元（D Ε V ) 2 4 a、24b、 2 4 c之任一處實施顯像處理，而形成所定之電路圖案。 被實施顯像處理之基板G將在後段部2 c之任一之加熱處 理裝置（Η P )被實施後烘乾處理後，在冷卻裝置（ COL)被冷卻，而由主搬運裝置19、 18、 17及搬 運機構1 0來被收容於卡匣站1上之所定卡匣。 接著，說明有關由要安裝於有關本實施形態之L C D 基板的塗敷·顯像處理系統之抗蝕劑塗敷處理單元（C 丁 )、減壓烘乾處理單元（V D )、及去除緣部（E R )所 形成之塗敷系處理單元群1 0 0。圖2及圖3係顯示塗敷 系處理單元群1 0 0的槪略平面圖及槪略側面圖。 如圖2及圖3所示，該等抗蝕劑塗敷處理單元（C Τ )2 2、減壓烘乾處理單元（V D ) 4 0，及去除緣部（ E R ) 2 3係被排列成一體於同一台上。並形成在抗蝕劑 塗敷處理單元（C Τ )被塗敷抗蝕劑之基板G，將由一對 搬運臂4 1搬運至減壓烘乾處理單元（VD) 40，而在 該減壓烘乾處理單元（V D )實施烘乾處理之基板G，乃 由一對搬運臂42搬運至去除緣部（ER) 23。 -----------4^^--------訂---------. (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -13- 480549 A7 B7 五、發明說明（11) 該抗蝕劑塗敷處理單元（c T ) 2 2乃具有：要吸著 保持基板G且可成水平旋轉之旋轉夾盤5 1 ;圍繞該旋轉 夾盤5 1上端部且包圍被吸著保持於該旋轉夾盤5 1之基 板G而上端部成開口之有底開口圓筒形狀之旋轉杯（狀物 )5 2 ;要覆蓋於該旋轉杯5 2之上端開口的蓋體（未圖 示）：及被固定配置成包圍著旋轉杯5 2外周的排洩杯（ 狀物）5 3。由而可成爲，在於後述之滴下抗蝕液時，蓋 體（未圖示）成打開狀態而基板G乃由旋轉夾盤5 1而被 旋轉，而當在抗蝕液之擴散時，基板G可由旋轉夾盤5 1 所旋轉之同時，會旋轉關閉蓋體狀態之旋轉杯5 2也形成 旋轉。再者，排洩杯5 3外周乃配設有外側蓋5 4。 又抗蝕劑塗敷處理單元（C T ) 2 2具有要吐出抗蝕 液於玻璃製之矩形L C D基板G用之抗蝕劑吐出噴嘴臂 5 5。該抗蝕劑吐出噴嘴臂5 5在滴下抗蝕液時，會移動 至基板G之中心。而抗蝕劑吐出噴嘴臂5 5前端配設有抗 蝕液之吐出（用）噴嘴5 6和稀釋劑吐出噴嘴5 7，並藉 抗鈾劑供應管（未圖示）被連接於抗蝕劑供應部（未圖示 )° 減壓烘乾處理單元（VD) 4 0具有下室6 1 ，及配 設成覆蓋下室上面並維持該內部之處理空間成氣密之上室 6 2。下室6 1設有要載置基板G用之台6 3，而在下室 6 1之各角隅配設有4個排氣口 6 4，並使連通於該排氣 口 6 4之排氣管6 5 (參照圖3 )連接於渦輪分子排氣泵 (未圖示）。而構成爲下室61和上室62形成密閉之狀 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) ----訂--- 經濟部智慧財產局員工消費合作社印製 -14 - 480549 A7 B7 五、發明說明（12) 態下來排氣其中之處理空間，就可減壓成所定之真空度。 (請先閱讀背面之注意事項再填寫本頁) 去除緣部（E R ) 2 3乃設有要載置基板G用之台 7 1 ’而在該台7 1上之2個角隅部，配設有要定位基板 G用之2個對準機構7 2。有關該對準機構7 2，將在以 後詳細地加以說明。 在該基板G四邊，各別配設有要從基板G四邊之邊緣 去除多餘的抗蝕劑用之四個去除器頭7 3。各去除器頭 7 3形成具有剖面略成U字狀以從內部可吐出稀釋劑，並 由移動機構（未圖示）來可沿著基板G四邊移動。由而， 各去除器頭7 3可沿著各邊移動之同時，吐出稀釋劑來去 除附著於基板G四個邊緣之多餘抗蝕劑。 在於構成爲如此之塗敷系處理單元群1 0 〇，基板G 係以如下之狀態被處理。 經濟部智慧財產局員工消費合作社印製 首先，將在抗蝕劑塗敷處理單元（C T ) 2 2，由旋 轉夾盤5 1旋轉基板G，而轉動抗蝕劑吐出噴嘴臂5 5至 基板G中心，當稀釋劑吐出噴嘴5 7到達基板G中心時， 就供應稀釋劑於基板G表面，接著抗蝕劑之吐出噴嘴5 6 會到達旋轉夾盤5 1之中心（基板G中心），而滴下抗蝕 液於基板G中心，並由旋轉基板G而由離心力來使抗蝕液 從基板G中心朝其周圍整個區域均勻地擴展，而後再由蓋 體密閉杯（狀物）內之狀態下，進一步旋轉基板G以調整 膜厚。 該塗敷有抗蝕劑之基板G，而後由搬運臂4 1來搬運 至減壓烘乾處理單元（VD) 40，並排氣下室6 1和上 -15- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 480549 A7Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 480549 A7 B7___ V. Description of the Invention (1) [Background of the Invention] The present invention relates to a substrate such as a liquid crystal display (LCD) substrate by applying a coating solution such as a resist solution. A substrate processing apparatus and a substrate processing method for forming a coating film and then performing an end surface removal process. When manufacturing a liquid crystal display (LCD), a photoresist is applied to a rectangular LCD substrate made of glass to form a resist film, and the resist film is exposed and developed in accordance with a circuit pattern. The process is called photolithography (photolithography) to form circuit patterns. In the process of applying the resist solution, in order to improve the fixability of the resist, a hydrophobization treatment (处理 MDS treatment) is performed in an adhesion processing unit, and after the cooling unit is cooled, it is transferred to the resist coating. Apply unit. In the resist coating unit, while the rectangular substrate is rotated on a rotating chuck (chuck), the resist liquid is supplied from a nozzle disposed above the center portion of the substrate surface, and The resist solution is diffused by the centrifugal force generated by the rotation of the substrate, so that the resist film can be applied to the entire surface of the substrate. On the substrate coated with the uranium-resistant liquid, the peripheral edge processing unit will remove the excess resist on the peripheral edge. Then, it is carried into a heat treatment device for pre-baking treatment, and after the cooling treatment device is cooled, it is conveyed to an exposure device and a predetermined pattern is exposed there. Then, development processing is performed by a development processing unit, and a post-baking treatment is performed by a heat treatment device to form a predetermined resist pattern. During the above-mentioned lithography process of the LCD substrate, the peripheral processing unit will simultaneously eject the diluent from the head moving along each side of the substrate, and ------%-*-m ^ --- ----- Order ---------. (Please read the notes on the back before filling out this page) This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) -4 -480549 A7 B7 V. Description of the Invention (2) Except for the extra resist attached to the peripheral parts of the four sides of the substrate. The substrate to be carried in the peripheral processing unit is aligned with the servo motor (motor) in the resist coating processing unit. Therefore, when the accuracy of the servo motor is high, it does not need to be carried in. The position of the substrate is aligned at the timing of the (mounting) stage of the peripheral processing unit. However, in recent years, the size (size) of the substrate has become larger, so that the substrate may not be formed correctly when the substrate is transferred from the uranium resist coating processing unit to the mounting table of the peripheral processing unit. When the alignment position is at the predetermined position of the mounting table. On the other hand, in the coating and developing process described above, after the substrate coated with the resist is subjected to a pre-baking process or the like, or after the substrate is exposed to complete the developing process, the above may be transferred The shape of the lifting pin, the fixing pin, or the vacuum groove of the heating processing unit is generated on the substrate. In order to prevent such a transfer, the present inventors have previously disclosed that after a resist is applied to a substrate, the substrate is dried under reduced pressure (Japanese Patent Application No. 10-233596). To this end, a reduced-pressure drying unit is arranged between the resist coating processing unit and the peripheral portion processing unit. However, when the substrate is dried in a decompressed state as described above, the alignment position of the substrate does not necessarily have good accuracy, so that the substrate may be misaligned when the substrate is transferred to the peripheral processing unit. [Summary of the Invention] In order to solve the above-mentioned problems, according to the first aspect of the present invention, a substrate processing apparatus is provided, which includes: applying a predetermined coating liquid to the paper standard and applying the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling out this page) Z -------- Order—Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, Consumer Cooperatives -5- Intellectual Property of the Ministry of Economic Affairs Bureau ’s consumer cooperative prints 480549 A7 __B7__ V. Description of the invention (3) A coating processing unit for forming a coating film on a substrate; an end surface processing unit that performs end processing on the substrate after the coating process; The transfer mechanism between the application processing unit and the peripheral edge processing unit is characterized in that the peripheral edge processing unit is provided with: a mounting table for mounting a substrate; and a positioning device for aligning the substrate transported on the mounting table by the transportation mechanism. The position of the substrate is used for the alignment mechanism. As described above, since the substrate to be carried on the mounting table of the peripheral processing unit can be aligned by the alignment mechanism, the size of the substrate becomes large even with the recent increase in the size of the substrate. You can also configure the substrate at the correct position. According to a second aspect of the present invention, there is provided a substrate processing apparatus including: a coating processing unit for forming a coating film by applying a predetermined coating liquid to a substrate; and performing a drying treatment on the substrate after the coating processing Drying (drying) processing unit; peripheral processing unit to perform peripheral processing on the substrate after drying processing; and substrates to be transported between the coating processing unit, drying processing unit, and peripheral processing unit The carrying mechanism is characterized in that the peripheral edge processing unit is provided with: a mounting table for mounting a substrate; and an alignment position mechanism for aligning a position of a substrate carried on the mounting table by the transportation mechanism. . When a reduced-pressure processing unit is used between the coating processing unit and the peripheral processing unit, although the alignment position may not be fully implemented in the reduced-pressure processing unit, it is disposed in the peripheral processing unit. The alignment position mechanism for performing the alignment position on the mounting table enables the substrate to be arranged at the correct position. This paper size applies to China National Standard (CNS) A4 specification (210 X 297 mm) -6------- · ---.----------- Order ----- ---- (Please read the notes on the back before filling this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 480549 A7 B7____ V. Description of the invention (4) The third aspect of the present invention is a substrate processing device. There are: a coating processing unit for forming a coating film by applying a predetermined coating liquid to a substrate; a peripheral edge processing unit for processing a peripheral portion of the substrate after the coating processing; and a substrate to be transferred to these coating processing units A transport mechanism between the peripheral processing unit and the peripheral processing unit is characterized in that the peripheral processing unit is provided with: a mounting table on which the substrate is placed; and can be moved along each of the substrates placed on the mounting table to process the foregoing. A head for a peripheral edge portion of the substrate; a first moving mechanism for moving the heads along the sides of the substrate; and moving the heads toward the sides so that the heads abut the sides of the substrate, A second moving mechanism for aligning the substrate. A fourth aspect of the present invention is a substrate processing apparatus including a coating processing unit i that applies a predetermined coating liquid to a substrate to form a coating film, and performs drying (drying) processing on the coating processing. Drying processing unit of the subsequent substrate, peripheral processing unit for processing the peripheral portion of the substrate after drying processing; and transferring the substrate between the coating processing unit, drying processing unit, and peripheral processing unit The carrying mechanism is characterized in that: the peripheral edge processing unit is provided with: a mounting table on which the substrate is placed; and a head for processing the peripheral portion of the substrate, which can be moved along each Θ of the substrate placed on the mounting table. A first moving mechanism for moving the heads along the sides of the substrate; and moving the heads toward the sides so that the heads abut the sides of the substrate so that the substrates are aligned Used the second moving mechanism. These inventions do not require the use of a special positioning member to apply the Chinese National Standard (CNS) A4 specification (210 X 297 mm) to this paper size. --------- 4 --- ^ ------- ^ ---------. (Please read the note on the back? Matters before filling out this page) 480549 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (5) Position the substrate at a predetermined position on the mounting table. For example, the aforementioned alignment position mechanism may be configured to have: a Y-shaped arm with a front end portion; a pair of rollers mounted on the Y-shaped front end portion of the arm and abutting against a corner portion of the substrate; And a moving mechanism for raising and lowering the aforementioned arm and moving it slightly horizontally so that a pair of rollers abut against the corner of the substrate to align the position of the substrate. In this way, the substrate is aligned at the corner of the substrate by abutting the roller, so that the substrate can be positioned at the correct position. Furthermore, the alignment position mechanism configured in this way can be configured to have the aforementioned arm lowered. At the time, it is used to clean the cleaning box for the roller. In the peripheral edge processing unit, when the substrate peripheral portion is to be processed, the coating liquid may adhere to the roller. However, after the alignment position, the roller is cleaned by the cleaning box as described above. In subsequent alignment positions, there is no risk of attaching an unnecessary coating liquid to the substrate. Furthermore, the cleaning tank may be configured to include: a cleaning liquid nozzle for cleaning the rollers by discharging the cleaning liquid on a roller lowered by the arm; and spraying an inert gas on the rollers to dry the rollers The inert gas nozzle used; and the structure of the discharge mechanism for discharging the cleaning liquid and the inert gas from the aforementioned cleaning tank and the exhaust. As described above, when the rollers are to be cleaned by the cleaning tank, the rollers are washed with a cleaning solution, and then the inert gas is sprayed to dry the rollers. Therefore, the rollers can be cleaned reliably. The fifth aspect of the present invention includes: (a) a process of forming a coating film by applying a predetermined coating liquid on a substrate; (b) a process of placing the substrate after the coating process on a mounting table; c) Positioning the basic paper size mentioned above is applicable to China National Standard (CNS) A4 (210 X 297 mm) -8- -------------------- Order ---------. (Please read the notes on the back before filling this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 480549 A7 B7__ 5. Description of the invention (6) The board is placed on the mounting table. And (d) the process of processing the peripheral edge portion of the substrate positioned as described above is its feature. [Embodiments of the invention] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a plan view showing a resist application and development processing system of an LCD substrate to which the present invention is applied. This coating and development processing system is provided with a cassette station 1 on which cassettes C for storing a plurality of substrates G are housed, and a series of processing including resist coating and development for substrates. The processing unit 2 of the plurality of processing units; and the interface unit 3 for receiving and receiving the substrate G between the exposure unit (not shown), and the cassette unit is provided at each end of the processing unit 2 1 and the interface section 3. The cassette station 1 is provided with a transport mechanism 10 for transporting the L CD substrate between the cassette C and the processing section 2. On the other hand, in the cassette station 1, the cassette C is unloaded and unloaded. In addition, the conveying mechanism 10 is provided with a conveying arm 11 capable of moving on a conveying path 10 a provided along the arrangement direction of the cassettes, and the conveying arm 11 conveys the substrate G to the cassette C and the processing unit 2 between. The processing section 2 is divided into a front section 2a, a middle section 2b, and a rear section 2c, and each has a conveying path 12, 13, 14, and each processing unit is arranged on both sides of the conveying path. Between these, relay (transfer) sections 15 and 16 are provided. The front part 2 a has a main conveying device that can move along the conveying path 1 2 ----—— — — — — — — — — — — In— ^ · 1111111 ». (Please read the precautions on the back before filling in this (Page) This paper size is in accordance with China National Standard (CNS) A4 (210x297 mm) -Q-549 A7 V. Description of the invention (7) 1 7 'and one side of the conveying path 1 2 is equipped with 2 cleanings Unit s CR) 2 1 There are two heating layers 2 6 formed by overlapping ultraviolet rays to form an upper and lower cooling unit 2 7 and a middle section transportation device 1 8 yuan (CT) 2 2. Decompression drying Dry 40 and resist on the peripheral edge of the substrate g) 2 and 3 are integrated to form a coating system. The processing unit group is formed after the resist is applied to the substrate G and the substrate is transferred ( (VD) 40 for the drying process, and 2) 3 for the peripheral edge resist removal. The heating and heating processing unit 2 8 is arranged to overlap 2 vertically, and the processing device (C 0 L is overlapped and vertically overlapped). ), And the adhesive treatment / cooling formed by the upper and lower laminated adhesive treatment devices (AC0L). 2 c is provided with the main conveying device 19, and the imaging processing unit (DEV) 2 4 a in the conveying lane 1 printed a and 2 1 b by the consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, and the conveying line line irradiation device ( UV) UV cooling / cooling treatment device (Η P) is superimposed on the two cooling devices 〇 2 b is equipped with a configuration and cooling device (C 〇L) Units 2 and 5, and the heat transfer unit (C0L) formed by the heating and processing units (C0L) formed by the transport path 1 3 to move the main installation is equipped with a resist coating treatment sheet) processing unit (VD) agent The removal edge portion (ER processing unit group 100. The coating treatment unit (CT) is coated with G to a reduced pressure drying treatment unit, and then is removed by the removal edge portion (ER treatment. Another device (ΗP) of the conveying path 13) The formed heating device (HP) and the cold heat treatment / cooling unit 2 9 D) and the cooling device (unit 30. The three sides 2 4b, 24 can be arranged along one side of the moving 4 along the conveying path 14 at ---- --.—----------- Order ---------. (Please read the precautions on the back before filling this page) This paper ruler Applicable to China National Standard (CNS) A4 specification (210 X 297 mm) -10- 480549 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (8) On the other side of each transport lane 14 The heat treatment unit 3 1 is formed by a heat treatment device (HP) stacked on top and bottom, and the two heat treatments are formed by a heat treatment device (ΗP) and a cooling device (COL) stacked on top and bottom. / Cooling units 32, 33. The above-mentioned main conveying devices 17, 18, 19 are each provided with an X-axis drive mechanism, a y-axis drive mechanism in two directions in a horizontal plane, and a Z-axis drive mechanism in a vertical direction. The driving mechanisms each have arms 17 a, 18a, and 19 a for supporting the substrate G. Furthermore, the processing unit 2 is configured such that only one cleaning unit 2 1 a, anti- Etching coating processing unit 2 2, development processing unit 2 4 a is only a rotating system unit, and on the other side, only a thermal processing unit such as a heating processing unit or a cooling processing unit is configured. In addition, on the side of the rotation system unit configuration of the relay section 15 and 16, a medicinal solution supply unit 34 is arranged, and a maintainable space 3 5 is provided. The interface section 3 is provided with: When receiving and receiving substrates between the sections 2, the extensions (sections) 36 for the substrates can be temporarily held; the two buffer tables 3 7 for buffer (use) cassettes arranged on both sides of the substrates; and The conveyance mechanism 38 for carrying in and taking out the substrate G between these and an exposure device (not shown). The conveying mechanism 38 is provided with a conveying arm 3 9 that can be moved along the conveying path 3 8 a arranged along the arrangement direction of the extension 36 and the buffer table 37, and the conveying arm 3 9 carries the conveying arm 3 9. Substrate G (Please read the precautions on the back before filling in this page) -------- Order --- -l · · This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) ) -11-Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 480549 Α7 _____ B7 V. Description of the invention (9) Between the processing unit 2 and the exposure device. When the processing units are integrated as described above to achieve integration, it is possible to save space and improve processing efficiency. In the resist coating and developing system thus constructed, the substrate G in the cassette C is transported to the processing section 2, and in the processing section 2, first, the ultraviolet irradiation / cooling unit at the front end section 2a 25 UV irradiation device (UV) is applied. Surface reforming (modification) is performed. Washing treatment is performed, and then the cooling device (COL) of the unit is cooled, and scrubbing is performed in the cleaning unit (SCR) 21a, 21b. After being washed, one of the heat treatment devices (ΗP) arranged in the front section 2a is heated and dried, and then cooled in any of the cooling devices (C0L) of the cooling unit 27. The present invention was invented in view of such circumstances, and an object thereof is to provide a substrate processing apparatus that can be moved from a coating processing unit to a peripheral processing unit and can be placed at a correct position. Next, the substrate G is transported to the middle section 2 b. In order to improve the fixability of the resist, a hydrophobization treatment (Η MDS treatment) is performed on the upper layer adhesion processing device (AD) of the unit 30, and the lower layer is cooled. After the apparatus (C 0 L) was cooled, it was carried into the coating system processing unit group 1000. In the coating system processing unit group 1 0 0, a resist is applied to the coating unit (C T) 2 2, and a drying process is performed by a reduced pressure drying processing unit (VD) 4 0, and The edge portion (ER) 2 3 is removed to remove excess resist on the peripheral edge portion of the substrate G. Then, the substrate G will be pre-dried in one of the heat treatment devices (HP) arranged in the middle section 2b. The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm)- 12- ·· --- *-^ 一 ^ Install -------- Order --------- (Please read the notes on the back before filling this page) Intellectual Property Bureau of the Ministry of Economic Affairs Printed by the employee consumer cooperative 480549 A7 B7____ 5. Description of the invention (10), and the cooling device (COL) below the unit 29 or 30 is cooled. The substrate G is then transferred from the relay section 16 to the exposure device by the main transfer device 19 and the interface section 3, and is exposed to a predetermined pattern there. After that, the substrate G is carried in by the interface unit 3, and is subjected to a post-exposure drying process in a heating processing device (ΗP) of the rear section 2c as needed, and then is developed in a development processing unit (D E V ) Any of 2 4 a, 24 b, and 2 4 c is subjected to development processing to form a predetermined circuit pattern. The substrate G subjected to the development processing is subjected to a post-baking treatment in a heating processing device (Η P) in any of the subsequent sections 2 c, and then cooled in a cooling device (COL), and the main transfer device 19, 18 , 17 and the transport mechanism 10 are accommodated in a predetermined cassette on the cassette station 1. Next, a description will be given of a resist coating processing unit (C), a vacuum drying processing unit (VD), and a removal edge portion to be mounted on the coating and developing processing system of the LCD substrate according to this embodiment. (ER) is a coating system processing unit group 100. 2 and 3 are a schematic plan view and a side view showing a coating system processing unit group 100. As shown in FIG. 2 and FIG. 3, the resist coating processing unit (CT) 2 2, the decompression drying processing unit (VD) 4 0, and the removal edge portion (ER) 2 3 are arranged All in one unit. A resist G coated substrate G is formed in the resist coating processing unit (CT), and is transported by a pair of transfer arms 41 to a vacuum drying processing unit (VD) 40, and is dried at the reduced pressure. The substrate G subjected to the drying process by the dry processing unit (VD) is carried to the removal edge portion (ER) 23 by a pair of transfer arms 42. ----------- 4 ^^ -------- Order ---------. (Please read the precautions on the back before filling this page) This paper size applies China National Standard (CNS) A4 specification (210 X 297 mm) -13- 480549 A7 B7 V. Description of the invention (11) The resist coating processing unit (c T) 2 2 has: to hold the substrate by suction G and a horizontally rotatable rotary chuck 5 1; a bottomed open cylindrical shape surrounding the upper end of the rotary chuck 5 1 and surrounding the substrate G held by the rotary chuck 51 while being held open. A rotating cup (object) 5 2; a cover (not shown) to cover the opening at the upper end of the rotating cup 5 2: and a drain cup (object) 5 fixedly arranged to surround the outer periphery of the rotating cup 5 2 3. Therefore, when the resist solution is dripped later, the cover (not shown) is opened and the substrate G is rotated by the spin chuck 51, and when the resist solution diffuses, the substrate G is rotated. While being rotated by the rotating chuck 5 1, the rotating cup 5 2 which is in a closed state is also rotated. Furthermore, an outer lid 54 is provided on the outer periphery of the excretion cup 53. The resist coating processing unit (C T) 2 2 has a resist discharge nozzle arm 5 5 for discharging a resist solution onto a rectangular L C D substrate G made of glass. When the resist discharge nozzle arm 55 drops the resist solution, it moves to the center of the substrate G. A resist discharge nozzle arm 5 5 and a thinner discharge nozzle 57 are provided at the front end of the resist discharge nozzle arm 5 5, and are connected to the resist through an anti-uranium supply pipe (not shown). The supply unit (not shown) ° decompression drying processing unit (VD) 40 has a lower chamber 6 1, and is disposed to cover the upper surface of the lower chamber and maintain the inner processing space as an airtight upper chamber 62. The lower chamber 6 1 is provided with a stage 6 3 for mounting the substrate G. Four corners of the lower chamber 6 1 are provided with four exhaust ports 6 4, and the exhausts communicating with the exhaust ports 6 4 are provided. The tube 6 5 (see FIG. 3) is connected to a turbo molecular exhaust pump (not shown). The lower chamber 61 and the upper chamber 62 form a closed state. The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling this page) ---- Order --- Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs -14-480549 A7 B7 V. Description of the invention (12) The treatment space exhausted in the state can be decompressed to a predetermined vacuum degree. (Please read the precautions on the back before filling in this page.) The removal edge (ER) 2 3 is provided with a table 7 1 ′ for mounting the substrate G and two corner sections on the table 7 1. Two alignment mechanisms 72 are provided for positioning the substrate G. The alignment mechanism 72 will be described in detail later. On the four sides of the substrate G, four remover heads 73 for removing excess resist from the edges of the four sides of the substrate G are provided. Each of the remover heads 73 is formed to have a U-shaped cross section so that the diluent can be discharged from the inside, and is movable along four sides of the substrate G by a moving mechanism (not shown). As a result, while each remover head 73 can move along each side, the thinner is discharged to remove excess resist attached to the four edges of the substrate G. In the coating system processing unit group 100 configured as described above, the substrate G is processed in the following state. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs First, the substrate G is rotated by the spin chuck 51 in the resist coating processing unit (CT) 2 2 and the nozzle arm 5 5 is rotated to discharge the resist to the substrate G Center, when the thinner discharge nozzle 57 reaches the center of the substrate G, the thinner is supplied on the surface of the substrate G, and then the resist discharge nozzle 5 6 will reach the center of the rotary chuck 51 (the center of the substrate G) and drip The resist is in the center of the substrate G, and the substrate G is rotated by the centrifugal force to spread the resist uniformly from the center of the substrate G toward the entire area around the substrate G, and then the lid is closed in the cup (object). The substrate G is further rotated to adjust the film thickness. The resist-coated substrate G is then transported to a vacuum drying processing unit (VD) 40 by a transfer arm 41 and exhausted from the lower chamber 6 1 and the upper -15. This paper size applies to Chinese national standards (CNS) A4 size (210 X 297 mm) 480549 A7
經濟部智慧財產局員工消費合作社印製 五、發明說明（13 ) 室6 2間之處理室內之氣體，以減壓成所定之真空度，以 令抗鈾劑中之稀釋劑等之溶劑形成被蒸發某一程度，且逐 漸放出抗鈾液中之溶劑，就可在不賦予不良影響於抗蝕劑 下來促進抗蝕劑之弄乾，使得可有效地防止產生轉印於基 板G上。 該弄乾之基板G，將由搬運臂4 2搬運至去除緣部（ E R ) 2 3而被載置於台7 1，該時，將如以後所詳述， 由一對之對準機構7 2來對準位位置。而沿著基板G之各 邊移動4個去除器頭7 3，並由所吐出之稀釋劑來去除附 著於基板四邊之周緣部的多餘抗蝕劑。然後，塗敷有抗蝕 劑之基板G，以如上述被實施曝光及顯像處理。 接著，將參照圖4至圖6來詳細說明有關去除緣部（ E R ) 2 3之校準機構7 2。圖4係包括去除緣部（E R )之對準機構的部分剖面之側面圖，圖5係包括圖4所示 之對準機構的部分剖面之正面圖，圖6係圖4所示之對準 機構的平面圖。 如圖4所示，在於對準機構7 2 (對準位置機構）， 大致上配設有：以抵接於基板G角隅部來對準基板G之位 置有的一對滾軸8 1 ;隔者所疋間隔支撑該等滾軸8 1用 之臂8 2 ;用以升降該臂8 2用之升降機構8 3 ;用以略 朝水平方向移動該臂8 2用之水平方向移動機構8 4 ;及 洗淨對準位置後之滾軸用之洗淨箱8 5。 於水平方向移動機構8 4 ’固定導軌8 7於底座8 6 ，並配設引導構件8 8於該導軌8 7成滑動自如。在配設 --------1--------- (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -16- 480549 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（14) 於該引導構件8 8之支撑構件8 9，安裝氣缸9 0，並使 該氣缸9 0之桿9 0 a藉連結構件9 1來被固定於底座 86。再者，水平方向移動機構84設有蓋（體）92， 並將該蓋體9 2和支撑構件8 9連結於升降機構8 3側。 由於形成如此之構造，當伸縮氣缸9 0之桿9 0 a時 ，引構件8 8，支撑構件8 9、氣缸9 0及蓋體9 2會對 於固定側之底座8 6及導軌9 7略朝水平方向被移動，使 得升降機構8 3略朝水平方向被移動。 於升降機構8 3配設有被固定於水平方向移動機構 84之支撑構件89及蓋體92之支（撑）柱93，並配 設引導構件9 5成滑動自如於安裝在該支柱9 3之導軌 9 4。上述臂8 2乃被固定於該引導構件9 5，而在該臂 8 2相反側安裝有氣缸9 6，且藉連結構件9 7來連結該 氣缸96之桿96a於支柱93。 由於形成如此之構造，當伸縮氣缸9 6之桿9 6 a時 ，引導構件9 5，臂8 2及氣缸9 6會對於固定側之支柱 9 3及導軌9 4升降，而使臂8 2升降至所定之高度。 再者，如圖6所示，臂8 2前端部被形成爲Y字狀， 而一對滾軸8 1係被安裝於該Y字狀前端部。以如此地一 對滾軸8 1被安裝於Y字狀部分，使得對準位置時，該一 對滾軸8 1會抵接於基板G之角隅部來推壓（擠壓）。 再者，洗淨箱8 5係如圖6所示，配設有會吐出洗淨 液（例如稀釋劑）於一對滾軸8 1來洗淨一對滾軸用之一 對洗淨液噴嘴9 8，及對於該一對滾軸8 1噴出惰（性） 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -17- -------：——-—•凌--------訂--------- (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 480549 A7 B7___ 五、發明說明（15 ) 氣（體）（例如N 2 )來弄乾一對滾軸用之一對惰氣噴嘴 9 9。在於該洗淨箱8 5下部配設有要從前述洗淨箱排出 該等洗淨液和惰氣之排液及排氣用之排出管，並被連接於 未圖示之排出機構。 又由臂8 2被降下之滾軸8 1係如圖4及圖5所示， 形成可自動地安裝於洗淨箱8 5上部。再者，設有封閉構 件103於滾軸81之支（撐）軸102，並構成爲在安 裝滾軸8 1至洗淨箱8 5時，可密閉洗淨箱8 5內部。- 以如此，安裝滾軸8 1於洗淨箱8 5，並吐出洗淨液 於滾軸8 1來洗淨一對滾軸8 1，而後，噴出惰氣於滾軸 8 1來弄乾一對滾軸8 1。因此，去除緣部（E R ) 2 3 ，雖由滾軸8 1之每一次對準位置而有附著抗蝕劑於滾軸 8 1之虞，但在對準位置後，以如上述予以洗淨滾軸8 1 ，使得可確實地實施洗淨滾軸8 1，因而，在以後之對準 位置時，並不會產生附著不必要之抗蝕劑於基板G。 其次，對於對準機構7 2之動作加以說明。 首先，由減壓烘乾（弄乾）處理單元（VD)所弄乾 之基板G，將由搬運臂4 2搬運至去除緣部（E R ) 2 3 ，而被載置於台7 1並由吸著機構（未圖示）所吸著，然 後降低該台7 1直至處理位置。 接著，將在降下至該處理位置之台，予以停止由吸著 機構（未圖示）之對於基板G的吸著之同時，由升降機構 8 3以如圖4之虛線所示，上升臂8 2至所定之高度。 接著，由水平方向移動機構8 4以如圖4之虛線所示 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ~\〇Ζ —----------------^--------- (請先閲讀背面之注意事項再填寫本頁) 480549 A7 B7 五、發明說明（16) (請先閱讀背面之注意事項再填寫本頁) ，朝水平方向移動臂8 2，以令配設於臂8 2之Y字狀前 端部的一對滾軸8 1形成如圖4或圖2所示’抵接於基板 G角隅部來推壓f由而’基板G因可從其對角線之雙方向 推壓，使得在台7 1上’可正確地對準位置於所定位置° 而後，基板G會由吸著機構（未圖示）所吸著，並實施上 述之基板周緣部的抗飩劑去除處理。 當完成該對準位置時，臂8 2會朝水平方向回行而被 降下。當降下臂8 2至所定位置時，臂8 2前端之滾軸 8 1係如圖4及圖5所示，會自動地被安裝於洗淨箱8 5 上部，而洗淨箱8 5內部，將由封閉構件1 0 3而形成密 閉。 而後，開始洗淨動作，將從洗淨液噴嘴9 8吐出洗淨 液（稀釋劑）至滾軸8 1而洗淨滾軸8 1，接著，從惰氣 噴嘴9 9噴出惰氣（N 2 )給予滾軸8 1而弄乾滾軸8 1。 因此，由滾軸8 1之每一次的對準位置，就可確實地洗淨 滾軸8 1，使得在其後之對準位置時，對於基板G不會附 著不必要之抗蝕劑。 經濟部智慧財產局員工消費合作社印製 以如上述，要搬入於去除緣部（E R ) 2 3之台7 1 之基板G，因可由對準（位置）機構7 2被對準位置，因 而可配置基板G於正確位置。 亦即，在減壓狀態下，由減壓處理（弄乾）單元（ V D ) 4 0來弄乾基板G係如上述，以減壓弄乾剛完成塗 敷抗蝕劑後之基板G，來防止會引起轉印痕跡而實施者。 因此，在減壓（弄乾）處理單元（VD) 4 0並未設置真 -19- 本紙張尺度適用中國國家標準（CNS)A4規格（210 x 297公釐） 480549 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（17) 空吸著等之吸著機構，而在從減壓弄乾處理單元（V D ) 搬運基板G至去除緣部（E R ) 2 3之時候，雖會引起基 板G之偏位爲多，但在本實施形態，因如上述令基板G由 對準（位置）機構7 2來對準位置於去除緣部（E R ) 2 3之台7 1上，因可配置基板G於正確的位置。 接著，說明有關本發明之其他實施形態。 該實施形態係如圖7及圖8所示，做爲對準位置機構 之對準機構1 1 〇配設有：抵接於基板G之各邊來對準位 置用之一對X 4組之滾軸1 1 1〜1 1 8 ;要隔著所定間 隔支撐該等之各對滾軸1 1 1〜1 1 8用之臂1 1 9〜 1 2 2 ;要升降該等臂1 1 9〜1 2 2用之升降機構 1 2 3 ;要朝略水平方向移動該等臂1 1 9〜1 2 2用之 水平方向移動機構1 2 4 ;及要洗淨對準位置後之滾軸 1 1 1〜1 1 8用之洗淨箱1 2 5。有關升降機構1 2 3 、水平方向移動機構1 2 4及洗淨箱1 2 5之結構及動作 係與最初所示之實施形態的結構及動作形成同樣之狀態。 如圖9所示，各滾軸1 1 1〜1 1 8係在反L字狀之 臂1 1 9〜1 2 2下面，配置成旋轉自如於由螺釘1 2 6 所固定之軸1 27。該等滾軸係由PCTFE或PTF I 等之材料所形成，構成爲儘可能地不會附著污物。 在於本實施形態，也可與上述之實施形態同樣來配置 基板G於去除緣部（ER) 2 3之台7 1上之正確位置。 接著，對於本發明之再另一實施形態加以說明。 該實施形態係如圖1 0所示，做爲對準位置機構之對 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -20- -------------------訂---------» (請先閱讀背面之注意事項再填寫本頁) 480549 A7 B7 五、發明說明（18) (請先閱讀背面之注意事項再填寫本頁) 準機構1 3 0，以對應於基板G各邊來配設’而具有：對 於各邊可形成接觸或分離之可旋轉的一對x 4組之臂 1 3 1〜1 38 ·，及轉動各對之臂1 3 1〜1 38來使各 對之臂1 3 1〜1 3 8抵接於基板G各邊’以對準基板G 之位置用之轉動機構1 3 9。 在於本實施形態，亦與上述之實施例同樣，以同樣之 時序來進行對準位置，以令基板G可配置於去除緣部（ ER) 2 3之台7 1上的正確位置。尤其在本實施形態可 簡化對準位置用之驅動系列之結構。 接著，說明有關本發明之再另一實施形態。 該實施形態係由去除器頭7 3來實現對準基板G之位 置於台7 1上者。 經濟部智慧財產局員工消費合作社印製 去除器頭7 3係如圖1 1及圖1 2所示，沿著基板G 之周緣部設置複數之朝向基板G表背面之各周緣部吐出稀 釋劑用之吐出孔1 4 2於剖面爲〕字狀之頭本體1 4 1之 上部及下部。又在與該基板G成對向之壁部，配設有排氣 孔1 4 3。再者，配置有定位用之支柱1 4 4於頭本體 1 4 1之上部及下部之間。並構成爲如圖1 1所示，當各 去除器頭7 3位於基板G之大致中央位置時，可由未圖示 之驅動機構來使各去除器頭7 3朝向基板G端部G移動， 而由於定位用之各支柱1 4 4會抵接於基板G之各端部， 使得可定位基板G之位置。 尤其，在於本實施形態，並不需要特別配設定位用構 件之下，就可配置基板G於去除緣部（E R ) 2 3之台 -21 - 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 480549 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（19 ) 7 1上的正確位置。 再者，本發明並不限定於上述實施形態而已，可實施 種種之變形。例如在上述實施形態，雖說明了對於塗敷處 理系單元群1 0 0配設減壓弄乾處理單元（V D ) 4 0之 狀態者，但並不一定需要具有減壓弄乾處理單元，甚至如 此地未具有減壓弄乾處理單元之狀態下，也由於伴隨著近 年來之基板大型化而具有基板會產生偏位之掛念，因而， 本發明確極有效。又上述實施形態係對於抗餽劑塗敷及顯 像處理系統適用本發明之狀態來說明，但並不限定於此而 已，只要爲塗敷了塗敷液後要進行基板之周緣部處理的處 理裝置就可適用。又做爲基板也並不一定限定於L C D基 板，也可適用於L C D用之彩色濾色器，或半導晶圓等之 其他基板。 如上所說明，依據本發明，要搬入於周緣部處理單元 之（載置）台的基板，因可由對準位置機構來對準位置， 使得伴隨著近年來之基板的大型化而基板之尺寸變大，也 可配置基板於正確的位置。 又在塗敷處理單元和周緣部處理單元之間，使用減壓 處理單元時，具有無法充分地實施對準位置於減壓處理單 元之虞，但由於配設有要實施對準位置於周緣部處理單元 的（載置）台上用的對準（位置）機構，因而，可配置基 板於正確的位置。 〔圖式之簡單說明〕 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱） -22- ^----—Αν Μ--------tr--------- (請先閱讀背面之注意事項再填寫本頁) 480549 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（2〇) 圖1係顯示要適用本發明之L C D基板之塗敷.顯像 處理系統的平面圖。 圖2係顯示由抗蝕劑塗敷處理單元（c T )、減壓烘 乾（弄乾）處理單元（V D )及去除緣部（e R )所形成 之塗敷系處理單元群的槪略平面圖。 圖3係顯示由抗蝕劑塗敷處理單元（c T )、減壓弄 乾處理單元（V D )及去除緣部（E R )所形成之塗敷系 處理單元群的槪略側面圖。 圖4係包括去除緣部（E R )之對準機構的部分剖面 之側面圖。 圖5係包括圖4所示之對準機構的部分剖面之正面圖 〇 圖6係圖4所示之對準機構的平面圖。 圖7係有關本發明之其他實施形態的對準機構之平面 圖。 圖8係包括圖7之對準機構的部分剖面之正面圖。 圖9係顯示圖7及圖8所示之滾軸結構的剖面圖。 圖1 〇係有關本發明之再另一實施形態的對準機構之 斜視（立體）圖。 圖1 1係有關本發明之又另一實施形態的去除緣部（ E R )之槪略平面圖。 圖1 2係圖1 1所示之去除器頭之剖面圖。 〔符號說明〕 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -23- ·—•歧--------tr---------. (請先閱讀背面之注意事項再填寫本頁) 480549 A7 _B7_ 五、發明說明（21 ) 2 2 :抗蝕劑塗敷處理單元（C T ) 2 3 :去除緣部（E R ) 4 0 :減壓烘乾（弄乾）處理單元 71:(載置）台 7 2 :對準機構（對準位置機構） 8 1 :滾軸 8 2 :臂 8 3 :升降機構 8 4 :水平方向移動機構 8 5 :洗淨箱 9 8 :洗淨液噴嘴 9 9 :惰（性）氣（體）噴嘴 1 0 0 :塗敷系處理單元群 G :基板 ---------i-----------訂--------- (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -24-Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention (13) The gas in the processing room 6 and 2 is decompressed to a predetermined degree of vacuum, so that the solvents such as the diluent in the uranium-resistant agent are formed. Evaporating to a certain degree and gradually releasing the solvent in the anti-uranium solution can promote the drying of the resist without giving a bad influence to the resist, so that the transfer on the substrate G can be effectively prevented. The dried substrate G is carried by the transfer arm 4 2 to the removal edge (ER) 2 3 and placed on the stage 7 1. At this time, as will be described in detail later, a pair of alignment mechanisms 7 2 To align the position. On the other hand, the four remover heads 7 3 are moved along each side of the substrate G, and the discharged thinner is used to remove excess resist attached to the peripheral portions of the four sides of the substrate. Then, the substrate G coated with the resist is exposed and developed as described above. Next, the calibration mechanism 7 2 for removing the edge portion (ER) 2 3 will be described in detail with reference to FIGS. 4 to 6. FIG. 4 is a side view of a partial cross-section of an alignment mechanism including an edge (ER) removed, FIG. 5 is a front view of a partial cross-section including an alignment mechanism shown in FIG. 4, and FIG. 6 is an alignment shown in FIG. Plan of the agency. As shown in FIG. 4, the alignment mechanism 7 2 (alignment position mechanism) is generally provided with: a pair of rollers 8 1 having a position to align the substrate G to abut the corner of the substrate G; The arm 8 2 for supporting the rollers 8 1 at intervals, the lifting mechanism 8 3 for lifting the arm 8 2, and the horizontal moving mechanism 8 for moving the arm 8 2 slightly horizontally 4; and the cleaning box 8 5 for cleaning the rollers after the alignment position. The moving mechanism 8 4 ′ fixes the guide rail 8 7 to the base 8 6 in the horizontal direction, and a guide member 8 8 is provided on the guide rail 8 7 to slide freely. In the configuration -------- 1 --------- (Please read the precautions on the back before filling this page) This paper size is applicable to China National Standard (CNS) A4 (210 X 297) -16- 480549 A7 B7 printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (14) Install the supporting member 8 9 on the guide member 8 8 and install the cylinder 9 0 and The rod 90a is fixed to the base 86 by the connection member 91. Further, the horizontal movement mechanism 84 is provided with a cover (body) 92, and the cover 92 and the support member 89 are connected to the elevating mechanism 83 side. Due to such a structure, when the rod 90 of the telescopic cylinder 90 is extended, the lead member 88, the support member 89, the cylinder 90, and the cover 92 will slightly face the base 86 and the guide rail 9 of the fixed side. The horizontal direction is moved so that the lifting mechanism 83 is moved slightly in the horizontal direction. The lifting mechanism 8 3 is provided with a support member 89 fixed to the horizontal direction moving mechanism 84 and a support (support) post 93 of the cover 92, and a guide member 95 is provided to be slidably installed on the support 9 3 Guide 9 4. The arm 82 is fixed to the guide member 95, and an air cylinder 96 is mounted on the opposite side of the arm 82, and a rod 96a of the air cylinder 96 is connected to the pillar 93 by a connecting member 97. Due to such a structure, when the rod 9 6 a of the telescopic air cylinder 9 6 is extended, the guide member 9 5, the arm 8 2 and the air cylinder 96 are moved up and down with respect to the pillar 9 3 and the guide rail 9 4 on the fixed side, and the arm 8 2 is moved up and down. To a predetermined height. Further, as shown in FIG. 6, the front end portion of the arm 82 is formed in a Y-shape, and a pair of rollers 81 are attached to the Y-shaped front end portion. The pair of rollers 81 are mounted on the Y-shaped portion so that the pair of rollers 81 are pressed (pressed) against the corners of the substrate G when they are aligned. Furthermore, as shown in FIG. 6, the cleaning tank 8 5 is provided with a pair of cleaning liquid nozzles for discharging a cleaning liquid (such as a diluent) on the pair of rollers 81 to clean the pair of rollers. 9 8, and for the pair of rollers 8 1 ejection inertia (sexual) This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) -17- -------: --- — • LING -------- Order --------- (Please read the notes on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 480549 A7 B7___ V. Invention Note (15) gas (body) (such as N 2) to dry a pair of rollers with one pair of inert gas nozzles 9 9. A drain pipe for discharging the cleaning liquid, inert gas, and exhaust gas from the aforementioned cleaning tank is arranged at the lower part of the cleaning tank 85, and is connected to a discharge mechanism (not shown). The roller 8 1 lowered by the arm 8 2 is shown in FIGS. 4 and 5, and is formed to be automatically mounted on the upper part of the cleaning box 85. Furthermore, a support (support) shaft 102 of the roller 81 is provided with a sealing member 103, and is configured to seal the inside of the cleaning box 85 when the roller 81 to the cleaning box 85 are installed. -In this way, install the roller 8 1 in the cleaning box 8 5 and spit out the cleaning liquid on the roller 8 1 to clean the pair of rollers 8 1. Then, spray inert gas on the rollers 8 1 to dry one. On the roller 8 1. Therefore, although the edge portion (ER) 2 3 is removed, the resist may adhere to the roller 81 from each alignment position of the roller 81, but after the alignment position, it is washed as described above. The roller 8 1 allows the cleaning roller 8 1 to be reliably cleaned. Therefore, unnecessary resist is not adhered to the substrate G at the subsequent alignment position. Next, the operation of the alignment mechanism 72 will be described. First, the substrate G dried by the vacuum drying (drying) processing unit (VD) is transferred by the transfer arm 4 2 to the removal edge portion (ER) 2 3, and is placed on the stage 7 1 and sucked by suction. Holding by a mechanism (not shown), the stage 7 1 is lowered to the processing position. Next, when the stage lowered to the processing position is stopped, the suction of the substrate G by the suction mechanism (not shown) is stopped, and the lifting mechanism 8 3 is shown by the dotted line in FIG. 2 to the set height. Next, the paper size is applied to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) by the horizontal movement mechanism 84 as indicated by the dashed line in Fig. 4 ~ \ 〇Z ----------- ------- ^ --------- (Please read the notes on the back before filling out this page) 480549 A7 B7 V. Invention Description (16) (Please read the notes on the back before filling in (This page), move the arm 8 2 horizontally so that a pair of rollers 8 1 arranged at the Y-shaped front end portion of the arm 8 2 is formed as shown in FIG. 4 or FIG. Since the substrate G can be pushed from both directions of its diagonal line, the substrate G can be correctly aligned at a predetermined position °. Then, the substrate G will be held by the suction mechanism ( (Not shown), and perform the anti-repellent removal treatment on the peripheral portion of the substrate as described above. When the alignment position is completed, the arm 82 is returned in the horizontal direction and lowered. When the arm 8 2 is lowered to a predetermined position, the roller 8 1 at the front end of the arm 8 2 is automatically installed on the upper part of the cleaning box 8 5 as shown in FIGS. 4 and 5, and the inside of the cleaning box 8 5. A seal will be formed by the closure member 103. Then, the cleaning operation is started, and the cleaning liquid (thinner) is discharged from the cleaning liquid nozzle 9 8 to the roller 8 1 and the roller 8 1 is cleaned. Then, the inert gas (N 2) is sprayed from the inert gas nozzle 9 9. ) Give the roller 81 and dry the roller 81. Therefore, the roller 81 can be reliably cleaned from each of the alignment positions of the roller 81, so that at the subsequent alignment position, unnecessary resist is not attached to the substrate G. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs as described above, the substrate G to be moved to the stage 7 1 of the removal margin (ER) 2 3 can be aligned by the alignment (position) mechanism 7 2 Place the substrate G in the correct position. That is, in a reduced pressure state, the substrate G is dried by the reduced pressure processing (drying) unit (VD) 40 as described above, and the substrate G immediately after the completion of the application of the resist is dried under reduced pressure. Prevent those who may cause transfer marks. Therefore, the decompression (drying) processing unit (VD) 4 0 is not set to true -19- This paper size applies the Chinese National Standard (CNS) A4 specification (210 x 297 mm) 480549 Employees of the Intellectual Property Bureau of the Ministry of Economic Affairs Cooperative prints A7 B7 V. Description of the invention (17) The suction mechanism such as vacuum suction, and when the substrate G is transferred from the vacuum drying processing unit (VD) to the removal of the edge (ER) 2 3, it will There are many deviations of the substrate G, but in this embodiment, because the substrate G is aligned by the alignment (position) mechanism 72 as described above on the stage 71 of the removal edge (ER) 2 3, The substrate G can be arranged at the correct position. Next, another embodiment of the present invention will be described. This embodiment is shown in FIG. 7 and FIG. 8. The alignment mechanism 1 10 as the alignment position mechanism is provided with: abutting on each side of the substrate G to align the position with one pair of X 4 groups. Roller 1 1 1 ~ 1 1 8; To support each pair of rollers 1 1 1 ~ 1 1 8 at a predetermined interval 1 1 9 ~ 1 2 2; To lift the arms 1 1 9 ~ 1 2 2 Lifting mechanism 1 2 3; Move the arms 1 1 9 to 1 2 2 in a horizontal direction; Move the mechanism 1 2 4 in a horizontal direction; and Roller 1 1 after cleaning the alignment position 1 ~ 1 1 8 for the cleaning box 1 2 5. The structures and operations of the lifting mechanism 1 2 3, the horizontal moving mechanism 1 2 4, and the cleaning tank 1 2 5 are the same as those of the structure and operation of the first embodiment. As shown in FIG. 9, each of the rollers 1 1 1 to 1 1 8 is located below the inverse L-shaped arm 1 1 9 to 1 2 2 and is arranged to rotate freely on the shaft 1 27 fixed by screws 1 2 6. These rollers are made of materials such as PCTFE or PTF I, and are constructed so as to be free from dirt. In this embodiment, the substrate G can be arranged at the correct position on the stage 71 of the removal edge portion (ER) 2 3 in the same manner as the above-mentioned embodiment. Next, another embodiment of the present invention will be described. This embodiment is shown in Figure 10. As the alignment mechanism, the Chinese national standard (CNS) A4 specification (210 X 297 mm) is applied to this paper size. -20- ---------- --------- Order --------- »(Please read the notes on the back before filling this page) 480549 A7 B7 V. Description of the invention (18) (Please read the notes on the back first Please fill in this page again) The quasi-mechanism 1 3 0 is provided corresponding to each side of the substrate G and has: a pair of rotatable x 4 arms that can be contacted or separated for each side 1 3 1 ~ 1 38, and a rotating mechanism 1 3 9 for turning the arms of each pair 1 3 1 to 1 38 so that the arms of each pair 1 3 1 to 1 3 8 abut on each side of the substrate G to align the position of the substrate G . In this embodiment, as in the above-mentioned embodiment, the alignment position is performed at the same timing, so that the substrate G can be arranged at the correct position on the stage 71 of the removal edge (ER) 2 3. In particular, in this embodiment, the structure of the driving series for aligning positions can be simplified. Next, another embodiment of the present invention will be described. In this embodiment, the position of the substrate G is aligned on the stage 71 by the remover head 73. The remover head 7 3 printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs is shown in Figs. 1 1 and 12 and a plurality of peripheral parts are provided along the peripheral part of the substrate G toward the peripheral part of the surface of the substrate G. The ejection holes 1 4 2 are formed on the upper part and the lower part of the head body 1 4 1 having a cross-section. Also, a wall portion facing the substrate G is provided with exhaust holes 1 4 3. Furthermore, a positioning post 1 4 4 is arranged between the upper part and the lower part of the head body 1 4 1. As shown in FIG. 11, when each of the remover heads 73 is located at a substantially central position of the substrate G, each of the remover heads 73 can be moved toward the end G of the substrate G by a driving mechanism (not shown), and Since the pillars 1 4 4 for positioning will abut against the ends of the substrate G, the position of the substrate G can be positioned. In particular, in this embodiment, the substrate G can be disposed on the edge of the removal edge (ER) 2-3 without the need for a special positioning member. 21-This paper size applies the Chinese National Standard (CNS) A4 (210 X 297 mm) 480549 A7 B7 printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. The correct position on the description of the invention (19) 71. The present invention is not limited to the above-mentioned embodiments, and various modifications can be made. For example, in the above-mentioned embodiment, although it has been described that the reduced pressure drying processing unit (VD) 40 is provided for the coating processing unit group 100, it is not necessary to have a reduced pressure drying processing unit, and even In the state without a dry processing unit under reduced pressure, the present invention is extremely effective because there is an anxiety that the substrate may be misaligned as the substrate is enlarged in recent years. The above-mentioned embodiment is described in a state where the present invention is applied to an anti-feedback coating and development processing system, but is not limited to this, as long as the peripheral processing of the substrate is performed after the coating liquid is applied The device is applicable. The substrate is not necessarily limited to the LCD substrate. It can also be applied to color filters for LCD or other substrates such as semiconductor wafers. As described above, according to the present invention, the substrate to be carried in the (mounting) stage of the peripheral processing unit can be aligned by the alignment mechanism, so that the size of the substrate changes with the recent increase in substrate size. Large, you can also arrange the substrate in the correct position. When the decompression processing unit is used between the coating processing unit and the peripheral processing unit, there is a possibility that the alignment position cannot be fully implemented in the decompression processing unit. The alignment (position) mechanism on the (mounting) table of the processing unit allows the substrate to be placed at the correct position. [Simplified description of the drawing] This paper size applies to the Chinese National Standard (CNS) A4 specification (210 X 297 public love) -22- ^ ----— Αν Μ -------- tr ---- ----- (Please read the precautions on the back before filling out this page) 480549 Printed by the Consumer Property Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (20) Figure 1 shows the LCD substrate to which the present invention is applicable The coating. The plan view of the imaging processing system. FIG. 2 is a schematic diagram showing a coating system processing unit group formed by a resist coating processing unit (c T), a reduced-pressure drying (drying) processing unit (VD), and an edge removal (e R). Floor plan. FIG. 3 is a schematic side view showing a coating system processing unit group formed by a resist coating processing unit (c T), a reduced-pressure drying processing unit (V D), and an edge removal (ER). Fig. 4 is a side view showing a partial cross section of an alignment mechanism including an edge portion (ER). 5 is a front view including a partial cross-section of the alignment mechanism shown in FIG. 4. FIG. 6 is a plan view of the alignment mechanism shown in FIG. 4. Fig. 7 is a plan view of an alignment mechanism according to another embodiment of the present invention. FIG. 8 is a front view including a partial cross-section of the alignment mechanism of FIG. 7. FIG. FIG. 9 is a cross-sectional view showing the roller structure shown in FIGS. 7 and 8. FIG. 10 is a perspective (stereoscopic) view of an alignment mechanism according to still another embodiment of the present invention. FIG. 11 is a schematic plan view of a removed edge portion (ER) according to still another embodiment of the present invention. Fig. 12 is a sectional view of the remover head shown in Fig. 11. [Notation] This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) -23- ·-• qi -------- tr ---------. ( Please read the precautions on the back before filling this page) 480549 A7 _B7_ V. Description of the invention (21) 2 2: Resist coating treatment unit (CT) 2 3: Remove edge (ER) 4 0: Decompression drying Drying (drying) processing unit 71: (mounting) table 7 2: Alignment mechanism (alignment position mechanism) 8 1: Roller 8 2: Arm 8 3: Lifting mechanism 8 4: Horizontal movement mechanism 8 5: Cleaning box 9 8: cleaning liquid nozzle 9 9: inert (gas) gas (body) nozzle 1 0 0: coating system processing unit group G: substrate --------- i ----- ------ Order --------- (Please read the notes on the back before filling out this page) Printed by the Consumers' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper is applicable to Chinese National Standard (CNS) A4 Specifications (210 X 297 mm) -24-