JP2002233808A - Liquid treatment apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid treatment apparatus provided with a transportation mechanism, in which a substrate is surely held in transporting the substrate and the generation of transfer in the substrate is suppressed. SOLUTION: A resist coating/development system 100, which is one of operation forms of the liquid treatment apparatus, possesses a resist coating system (CT) for forming a resist film on the substrate G 22, a peripheral resist removing unit (ER) 23 for removing the resist in the peripheral part of the substrate G and a transporting structure 50 for transporting the substrate G between 2 units. A suction structure 73 and a supporting pin 74 are arranged in transporting arms 51a and 51b constituting the transporting structure 50 to hold the substrate G.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to, for example, a liquid treatment used for forming a predetermined coating film such as a resist film on a liquid crystal display (LCD) substrate or the like and removing the coating film on the peripheral portion of the substrate. Related to the device.

[0002]

2. Description of the Related Art For example, in the manufacture of a liquid crystal display (LCD), a photoresist liquid is applied to a rectangular substrate made of glass to form a resist film, and the resist film is exposed in a predetermined circuit pattern. Developing
A predetermined pattern is formed by a so-called photolithography technique.

The formation of such a circuit pattern is performed using a resist coating / developing processing system in which a plurality of processing units are integrated. In such a system, first, the surface of the substrate is subjected to surface modification / cleaning treatment by ultraviolet irradiation as necessary, and then the cleaning unit performs brush cleaning and ultrasonic water cleaning. Thereafter, the substrate is subjected to a hydrophobic treatment (HMDS treatment) in an adhesion processing unit in order to enhance the stability of the resist, and subsequently, a resist coating is performed in a resist coating processing unit. Thus, the substrate on which the resist film is formed is subjected to pre-baking by a heating unit, exposure of a predetermined pattern by an exposure device, development processing by a development processing unit,
Post bake processing is sequentially performed in the heating unit, and a predetermined circuit pattern is formed on the substrate.

Here, the processing steps from the application of the resist to before the pre-bake will be described in more detail.
When the substrate subjected to the hydrophobic treatment is suction-held on a horizontally rotatable spin chuck and the resist is supplied from above the substrate and then rotated, the resist liquid is diffused by centrifugal force to form a resist film on the substrate. . The resist film formed by such a method has a uniform film thickness immediately after coating, but in general, after the rotation of the substrate stops and centrifugal force stops working, or with the passage of time, Due to the effect of the tension, the resist film becomes thicker so that the resist film rises at the peripheral portion of the substrate, and when such a rotating resist coating method is used, the resist solution shaken off from the substrate flows around to the back surface of the substrate. To adhere and solidify.

In this manner, the resist adhering to the film portion having an uneven thickness formed on the peripheral portion of the substrate and the back surface thereof,
Conventionally, a processing liquid such as a thinner is discharged to the resist on the peripheral edge and the back surface of the substrate, because the generation of particles may be caused in a subsequent process of transporting the substrate and the like, and may also cause a stain on an apparatus for transporting the substrate. Then, a process called edge remove that dissolves and removes the resist is performed,
The substrate is then sent to a pre-bake process.

[0006]

In recent years, thinner and larger substrates have been used as substrates for the purpose of increasing the size and mass production of LCDs and reducing the thickness of LCDs. Since such a thin and large-sized substrate has a property of easily bending, when the substrate on which the resist film is formed is moved to a position where edge removal is performed, the effect of the bending of the substrate remains on the resist film. As a result, the holding means for holding the substrate during the transfer of the substrate is configured such that the held portion is not transferred to the substrate while holding the substrate reliably. There is a need. It is convenient if the holding means can be easily replaced in accordance with the size of the substrate.

Further, since particles and the like are easily generated from the transfer mechanism for transferring the substrate by moving the holding means, such particles do not diffuse outward and adhere to the substrate. You need to be careful. Further, at the position where the edge removal is performed, the substrate needs to be less bent and the peripheral portion must be securely fixed in a free state. At this time, the substrate is held by the holding means for holding the substrate. It is necessary to prevent transfer from occurring.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems in the prior art, and has a liquid processing apparatus provided with a transport mechanism which suppresses the occurrence of transfer on a substrate while securely holding the substrate during the transport of the substrate. It is intended to provide a device. Another object of the present invention is to provide a liquid processing apparatus that suppresses generation of particles and the like from a substrate transfer mechanism. Still another object of the present invention is to provide a liquid processing apparatus in which transfer of a substrate is suppressed while the substrate is securely held.

[0009]

That is, according to the present invention, there is provided a liquid processing apparatus for performing a predetermined liquid processing on a substrate, comprising a holding means for holding the substrate substantially horizontally, and holding the substrate by the holding means. A coating processing unit for applying a predetermined coating liquid to the surface of the substrate to form a coating film, and a coating film at a peripheral portion of the substrate on which the coating film is formed and a coating liquid adhered to the peripheral portion of the substrate. A peripheral coating film removing unit to be removed, and a transport mechanism for transporting the substrate on which the coating film is formed between the coating processing unit and the peripheral coating film removing unit, wherein the transport mechanism adsorbs the substrate. A liquid processing apparatus, comprising: a transfer arm having a suction mechanism for holding and a support pin for holding a substrate at a vertex disposed on an upper surface; and a drive mechanism for moving the transfer arm in a predetermined direction. Be done

Further, according to the present invention, there is provided a liquid processing apparatus for performing a predetermined liquid processing on a substrate, the coating processing unit forming a coating film by applying a predetermined coating liquid on the surface of the substrate, and a coating film unit. And a peripheral coating film removing unit that removes a coating film attached to the peripheral portion of the substrate and a coating liquid attached to the peripheral portion of the substrate, wherein the peripheral coating film removing unit has a predetermined upper surface on which the substrate is placed. A mounting plate provided with a plurality of support pins and a plurality of suction mechanisms at positions, a processing liquid discharge nozzle for discharging a predetermined processing liquid, and a processing liquid discharged from the processing liquid discharge nozzle and dissolved by the processing liquid A liquid processing apparatus, comprising: a removal head having a processing liquid suction nozzle configured to suction a coating liquid.

Furthermore, according to the present invention, there is provided a liquid processing apparatus for performing a predetermined liquid processing on a substrate, comprising a holding means for holding the substrate substantially horizontally, wherein the holding means holds the substrate substantially horizontally. A coating processing apparatus for forming a coating film by applying a predetermined coating liquid, and a peripheral coating film removal for removing the coating film on the peripheral portion of the substrate on which the coating film is formed and the coating solution attached to the peripheral portion of the substrate Device, and a transport mechanism for transporting a substrate on which a coating film is formed between the coating processing device and the peripheral edge coating film removing device, the transport mechanism comprising: a transport arm for holding a substrate; and A drive mechanism for moving a transfer arm between the coating apparatus and the peripheral coating film removing apparatus, a dust cover for covering the drive mechanism so that particles generated in the drive mechanism do not diffuse outside, and the drive mechanism Liquid processing apparatus characterized by comprising: a local dust mechanism for sucking the particles produced fraud and mitigating risk, is provided.

According to the liquid processing apparatus of the present invention, the transport mechanism for transporting the substrate can transport the substrate quickly because the substrate is securely held by the suction mechanism.
In addition, since the substrate is partially held by the support pins having a small contact area with the substrate, the occurrence of transfer on the substrate is suppressed, and the quality of the substrate is kept high. In addition, since the transport mechanism for transporting the substrate is provided with the cover and the local exhaust means, particles generated by driving the transport mechanism are prevented from diffusing to the outside and contaminating the substrate, thereby improving the quality of the substrate. It is possible to hold. Furthermore, in performing the process of removing the coating film on the peripheral portion of the substrate, the use of the suction mechanism and the support pins together securely fixes the substrate, while suppressing the occurrence of transfer on the substrate and improving the quality of the substrate. It can be kept high.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the liquid processing apparatus of the present invention will be described with reference to the accompanying drawings. Here, a case where the present invention is applied to a resist coating and developing processing system for an LCD substrate will be described.

FIG. 1 shows a resist coating and developing system 1.
00 is a plan view of the resist coating / developing processing system 100 for mounting a cassette C containing a plurality of substrates G thereon and a series of processes including resist coating and developing on the substrates G. A processing unit 2 having a plurality of processing units, and an interface unit 3 for transferring a substrate G to and from an exposure apparatus (not shown). 1 and an interface unit 3 are arranged.

The cassette station 1 has a transport mechanism 1 for transporting the substrate G between the cassette C and the processing section 2.
0 is provided. Then, the cassette C is loaded and unloaded at the cassette station 1. Also, the transport mechanism 1
0 is a transport path 10 provided along the cassette arrangement direction.
A transfer arm 11 is provided which is movable on the substrate a. The transfer arm 11 transfers the substrate G between the cassette C and the processing unit 2.

The processing section 2 is divided into a front section 2a, a middle section 2b, and a rear section 2c.
13 and 14. Each processing unit is arranged on both sides of these transport paths. The relay sections 15 and 16 are provided between them.

The front section 2a is provided with a main transfer device 17 movable along the transfer path 12, and two cleaning processing units (SCR) 21a and 21b are provided on one side of the transfer path 12.
Is disposed on the other side of the transport path 12, a processing block 25 in which an ultraviolet irradiation unit (UV) and a cooling unit (COL) are stacked in two stages, and a heat processing unit (H).
A processing block 26 in which P) is stacked in two stages and a processing block 27 in which cooling units (COL) are stacked in two stages are arranged.

The middle section 2b is provided with a main transfer device 18 movable along the transfer path 13, and a resist coating unit (CT) 22 is provided on one side of the transfer path 13. Resist coating unit (CT) 22
Is provided with a peripheral resist removing unit (ER) 23 for removing the resist on the peripheral portion of the substrate G after the resist film is formed in the resist coating unit (CT) 22.

On the other side of the transport path 13, a processing block 28 in which heating processing units (HP) are stacked in two stages, a heating processing unit (HP) and a cooling processing unit (COL)
, An adhesion processing unit (AD) and a cooling unit (CO)
L) are disposed on top of each other.

Further, the rear section 2c is provided with a main transport device 19 movable along the transport path 14,
Is provided with three development processing units (DEV) 24a
24b and 24c are arranged, and on the other side of the transport path 14, a processing block 31 in which a heating processing unit (HP) is stacked in two stages, and both a heating processing unit (HP) and a cooling processing unit (COL) ) Are disposed on top of each other.

The processing section 2 has only a spinner system unit such as a cleaning processing unit 21a, a resist coating processing unit (CT) 22, and a developing processing unit (DEV) 24a disposed on one side of the transport path. On the other side, only a thermal processing unit such as a heating processing unit or a cooling processing unit is arranged. Further, a chemical solution supply unit 34 is disposed at a portion of the relay units 15 and 16 on the side where the spinner system unit is disposed, and a space 35 for performing maintenance of the main transport device is provided.

Each of the main transfer devices 17, 18, and 19 has an X-axis drive mechanism, a Y-axis drive mechanism, and a vertical Z-axis drive mechanism in two directions in a horizontal plane, and further rotates about the Z axis. , And each has an arm for supporting the substrate G.

The main transfer device 17 has a transfer arm 17a, transfers the substrate G to and from the transfer arm 11 of the transfer mechanism 10, and loads and unloads the substrate G to and from each processing unit in the front section 2a. Has a function of transferring the substrate G to and from the relay unit 15. Further, the main transfer device 18 has a transfer arm 18a, transfers the substrate G to and from the relay unit 15, and loads and unloads the substrate G to and from each processing unit in the middle unit 2b. And a function of transferring the substrate G during the transfer. Further, the main transfer device 19 has a transfer arm 19a, transfers the substrate G to and from the relay unit 16, loads and unloads the substrate G to and from the respective processing units in the rear-stage unit 2c, and further connects to the interface unit 3. And a function of transferring the substrate G during the transfer. The relay unit 1
5 and 16 also function as cooling plates.

The interface section 3 includes an extension 36 for temporarily holding the substrate when transferring the substrate to and from the processing section 2, and two buffer stages 37 provided on both sides thereof for disposing a buffer cassette.
And a transport mechanism 38 for loading and unloading the substrate G between these and an exposure apparatus (not shown). Transport mechanism 38
Is provided with a transfer arm 39 movable along a transfer path 38a provided along the direction in which the extension 36 and the buffer stage 37 are arranged. The transfer arm 39 allows the transfer of the substrate G between the processing unit 2 and the exposure apparatus. Done.

By integrating and integrating the processing units in this manner, space can be saved and processing efficiency can be improved.

In the resist coating / developing processing system configured as described above, the substrate G in the cassette C is transported to the processing section 2, and the processing section 2 firstly performs the ultraviolet irradiation unit (in the processing block 25 of the former stage 2 a). UV) to perform surface modification and cleaning processing, and after cooling in the cooling processing unit (COL), cleaning processing units (SCR) 21a and 21
After the scrubber cleaning is performed in b and heated and dried in one of the heat treatment units (HP) of the processing block 26,
Any cooling unit (COL) of the processing block 27
Cooled by.

Thereafter, the substrate G is transported to the middle section 2b,
In order to improve the fixability of the resist, the treatment block 30 is subjected to a hydrophobic treatment (HMDS treatment) in the upper adhesion processing unit (AD), and then cooled in the lower cooling processing unit (COL). Next, in the resist coating unit (CT) 22, a resist is coated on the substrate G.

In this resist coating step, for example, before supplying the resist liquid to the substrate G, a processing liquid such as a thinner is supplied while rotating the substrate G to improve the wettability of the surface of the substrate G with respect to the resist liquid. Thereafter, the substrate G is once stopped, the resist solution is supplied to the substrate G, and then the substrate G is rotated again to spread the resist solution over the entire surface of the substrate G, thereby forming a resist film.

The resist coating unit (C)
After completion of the processing in T) 22, the substrate G is transported to the peripheral resist removing unit (ER) 23, and the resist on the peripheral edge of the substrate G is removed (hereinafter, such processing is referred to as “edge removal”). Will be Edge remove is for board G
Of removing the resist on the peripheral portion of the surface on which the resist film is formed, and removing the resist attached to the side surface of the substrate G and the back surface of the substrate G.

Thereafter, the substrate G is pre-baked in one of the heating units (HP) in the middle section 2b, and the lower cooling unit (CO) in the processing block 29 or 30 is processed.
L). Next, the substrate G is transported from the relay section 16 to the exposure apparatus via the interface section 3 by the main transport apparatus 19, where a predetermined pattern is exposed. Then, the substrate G is again carried in via the interface unit 3 and, if necessary, the processing blocks 31.3 of the subsequent stage 2c.
After performing post-exposure bake processing in any one of the heat processing units (HP) 2 and 33, development processing is performed in any of the development processing units (DEV) 24a, 24b, and 24c to form a predetermined circuit pattern. .

The developed substrate G is subjected to a post-baking process in one of the heat treatment units (HP) in the post-stage 2c, and then cooled in one of the cooling units (COL) to carry out the main transfer. The sheets are stored in a predetermined cassette C on the cassette station 1 by the devices 19, 18, and 17 and the transport mechanism 10.

In such a resist coating and developing system 100, the adjacent resist coating unit (CT) 22 and the peripheral resist removing unit (ER) 2
3 is a substrate G without providing a boundary wall between these units.
Can be connected to each other so as to be able to be moved from one unit to the other unit. In this case, a resist film is formed on the front surface in the resist coating unit (CT) 22, and the substrate G having the resist liquid adhered to the back surface is transported to the peripheral resist removing unit (ER) 23 using the transport arm 18a. In order to avoid this, the transfer arm 18a due to the resist solution adhering to the back surface of the substrate G
Is prevented, and the contamination of the transfer arm 18a can be prevented from spreading to various adjacent processing units.

The plan view of FIG. 2 and the cross-sectional view of FIG. 3 show an embodiment in which a resist coating unit (CT) 22 and a peripheral resist removing unit (ER) 23 are connected. Hereinafter, the resist coating unit (CT) 22 and the peripheral resist removing unit (ER) 23 and the transport mechanism 50 for transporting the substrate G between the resist coating unit (CT) 22 and the peripheral resist removing unit (ER) 23 will be described. This will be described in detail.

Resist coating unit (CT) 22
A spin chuck 41 configured to hold the substrate G substantially horizontally and to be rotatable; an inner cup 42a provided to surround the spin chuck 41; and an inner cup 42a.
, An anti-scattering cover 42c provided to surround the outer cup 42b to prevent the resist liquid and the like from scattering, and an upper opening of the inner cup 42a is opened and closed. Liftable inner lid 4
3a and a liftable outer lid 43b for opening and closing the upper opening of the outer cup 42b. The resist coating unit (CT) 22 includes a spin chuck 41.
A resist liquid supply nozzle for applying a resist liquid to the substrate G held in the substrate G, and an arm 45 for rotating a head 44 provided with a thinner supply nozzle for applying a thinner.

The spin chuck 41 can be moved up and down by an elevating mechanism (not shown). The spin chuck 41 is positioned higher than the upper surface of the scattering prevention cover 42c to transfer the substrate G between itself and the transfer arm 18a of the main transfer device 18. The transfer is performed, and the transfer of the substrate to and from the transfer arm 51 of the transfer mechanism 50 can be performed.

Peripheral resist removal unit (ER) 23
A stage 93 for mounting the substrate G, an elevating mechanism (not shown) for elevating the stage 93,
Stage 93 for positioning the substrate G placed on the
Alignment mechanism 91 provided at two corners
And a remover head 92 for removing, from the substrate G, a resist film formed on the peripheral portion of the substrate G and a resist adhered to the side and back surfaces of the substrate G. It is provided on each of the four sides.

FIG. 4 is a plan view showing a more detailed structure of the stage 93. At a predetermined position on the surface of the stage 93,
A support pin 95 that contacts the substrate G and holds the substrate G, and a suction mechanism 96 that suctions the substrate G and holds the substrate G are provided. FIG. 5A is a cross-sectional view illustrating an embodiment of the support pin 95, and FIG. 5B is a cross-sectional view illustrating an embodiment of the suction mechanism 96. FIG.
FIG. 4 is an explanatory diagram showing a state of an operation of the suction mechanism 96 when the device is placed on the apparatus 3;

As shown in FIG. 5A, the support pins 9
5 has a step structure composed of an apex portion 95a, an upper portion 95b, and a lower portion 95c, and has an outer diameter d2 (for example, 5 mmφ) of the lower portion 95c and an outer diameter d1 of the upper portion 95b.
By forming it larger than (for example, 2 mmφ), sufficient mechanical strength to hold the substrate G is secured. Further, the contact area between the substrate G and the support pins 95 is reduced by reducing the outer diameter d1 of the upper step portion 95b and forming the apex portion 95a in a substantially spherical shape.
The occurrence of transfer on the substrate G due to the contact of 5 is suppressed.

The material constituting the support pins 95 has a predetermined mechanical strength, and the hardness of the apex portion 95a is set so that the substrate G is not damaged.
Under the condition that the substrate G is smaller than the substrate G, it is preferable to use a substrate G having properties similar to those of the substrate G, such as thermal conductivity. For example, a composite material containing polybenzimidazole and carbon fiber as main components is preferably used. Can be used.
The molded body of such a composite material can be easily mass-produced by, for example, injection molding or the like, and therefore, it is easy to reduce the apparatus cost.

As shown in FIG. 5B, the suction mechanism 9
6 has a suction pad 97 and a cylindrical body 98 arranged so as to surround the suction pad 97. The suction pad 97 includes a mortar-shaped suction portion 97a having a suction hole 97c for suction formed in the center portion, and a base portion 97b holding the suction portion 97a. The suction hole 97c passes through the base portion 97b. are doing. In addition, the cylindrical body 98 has a base 98b.
Has a structure in which a sheet 98a is provided on the upper surface of the.

As shown in FIG. 6, the substrate G is
When transported upward, the substrate G first contacts the upper surface of the suction portion 97a of the suction pad 97. In this state, when suction is performed from the suction hole 97c using suction means (not shown), the suction portion 97a firmly sucks the substrate G, and the suction portion 97a and the base portion 97b are owed to the weight of the substrate G.
Is buckled and the upper surface position of the suction portion 97a is lowered. Thus, the substrate G comes into contact with the upper surface of the cylindrical body 98, that is, the sheet 98a, and also contacts the apex of the support pin 95, and is held on the stage 93. Since the sheet 98a contacts the substrate G and holds the substrate G, for example, a resin material such as an expandable fluororesin sheet is preferably used.

The reason why the support pins 95 and the suction mechanism 96 are mixed on the stage 93 is as follows. That is, since the support pins 95 hold the substrate G only by the frictional force generated by the weight of the substrate G, the force for fixing the substrate G is not large. Therefore, when the substrate G is held on the stage 93 only by the support pins 95, the substrate G
On the other hand, there is an advantage that the transfer is less likely to occur, while the substrate G moves during edge removal, and there is a possibility that the edge removal in a predetermined range cannot be performed.

On the other hand, since the suction mechanism 96 can hold the substrate G by the forcible suction force, it is advantageous in that the force for fixing the substrate G is strong and the edge removal in a predetermined range can be performed. In addition, since the contact area between the suction portion 97a and the substrate G is increased, there is a problem that transfer to the substrate G is likely to occur. Therefore, by arranging the support pins 95 and the suction mechanism 96 in a mixed manner, the substrate G can be fixed on the stage 93 with a minimum necessary force while the substrate G
, And the quality of the substrate G can be maintained at a high level.

FIG. 7 shows a support pin 95 and a suction mechanism 96 when four panels are taken out from one substrate G as a product.
FIG. 5 is a plan view showing an example of the arrangement position of the. As shown in FIG. 7, the suction mechanism 96 is attached to the non-product area E of the substrate G (the area excluding the product areas P1 to P4 of the four panels from the entire substrate G).
When it is necessary to hold the inside of the product areas P1 to P4, the support pins 95 are arranged in the product areas P1 to P4. By arranging the support pins 95 and the suction mechanism 96 in this way, it is possible to suppress the occurrence of transfer marks and to maintain high product quality.

On the other hand, when the space between the product regions P1 to P4 is narrow or when the space between the product regions P1 to P4 and the outer periphery of the substrate G is narrow, the suction mechanism 96 inevitably enters the product regions P1 to P4. In such a case, the suction mechanism 96 is disposed so as to straddle two of the product regions P1 to P4 with the narrow outer product region E therebetween, or to hang over the edge portion of the product regions P1 to P4. When it is necessary to hold the inside of the product areas P1 to P4, the support pins are changed to the product areas P1 to P4.
Place in P4.

In this manner, transfer marks are prevented from being generated at the center of the product areas P1 to P4. Even if transfer marks are generated by the suction mechanism 96, the product areas P1 to P4
Because of the peripheral portion, the level can be suppressed to a level that does not hinder use as a product. In a portion where the substrate G comes into contact with the sheet 98a formed on the upper part of the cylindrical body 98 constituting the outer periphery of the suction mechanism 96, the occurrence of transfer traces on the substrate G is suppressed.
It is also possible to suppress the occurrence of transfer marks in P4.

As shown in the sectional view of FIG. 3, the remover head 92 has a substantially U-shaped cross section so as to sandwich the periphery of the substrate G. A thinner discharge nozzle (not shown) for discharging a thinner, and a thinner suction nozzle (not shown) for sucking the thinner discharged from the thinner discharge nozzle. Reference numeral 92 is configured to move along four sides of the substrate G, respectively. Thus, the remover head 9
When the substrate 2 is moved along each side of the substrate G, the thinner discharged and the dissolved resist are sucked while discharging the thinner, so that the four sides of the substrate G can be edge-removed. ing.

Subsequently, a resist coating unit (C
The structure of the transport mechanism 50 that transports the substrate G between the T) 22 and the peripheral edge resist removal unit (ER) 23 will be described. FIG. 8 is a plan view showing the structure of the transport mechanism 50. In FIG. 8, a resist coating unit (CT) is shown.
The reference numeral 22 and the peripheral resist removal unit (ER) 23 are not shown. FIG. 9 is a schematic sectional view of the transfer mechanism 50 as viewed from the transfer direction of the substrate G.

As shown in FIGS. 2 and 3 and FIGS. 8 and 9, the transfer mechanism 50 includes transfer arms 51a and 51b for holding the substrate G and transfer arms 51a and 51b.
52a and 52b that respectively hold the
Guides 53a and 53b respectively fitted with 52b
A rotary drive motor 58 provided at one end of the transfer arms 51a and 51 in the movement direction, a shaft 56a mounted on the rotary drive motor 58, pulleys 57a and 57b mounted on the shaft 56a, and a transfer arm 51a.
A shaft 56b provided at the other end in the moving direction of 51b
And a pulley 57c attached to the shaft 56b.
57d, a belt 55a provided between the pulleys 57a and 57c, a belt 55b provided between the pulleys 57b and 57d, a connecting member 54a for connecting the belt 55a and the support 52a, and a belt 55b and the support 52b. It has a connecting member 54b to be connected, and covers 59a and 59b.

As shown in FIG. 8 and FIG.
The rails 75a and 75b are formed on the rails 75a and 75b, respectively.
b. However, such support columns 52a and 52
The mode of fitting b to the guides 53a and 53b is merely an example, and a guide having another structure may be used as long as the columns 52a and 52b can be guided in a predetermined direction.

In the transport mechanism 50, the shaft 56b and the pulleys 57c and 57d are rotatable around the axis of the shaft 56b. When the rotation drive motor 58 is rotated in a predetermined direction, the shaft 56a and the pulleys 57a and 5d are rotated.
The belts 55a and 55b rotate by the simultaneous rotation of 7b. Here, the columns 52a and 52b are connected to the connecting members 54a.
Since the belts 55a and 55b are connected to the belts 55a and 55b, respectively, when the belts 55a and 55b rotate, the columns 52a and 52b simultaneously move in the same direction, and the transfer arms 51a and 51b move.

When the rotation drive motor 58 is driven, the rotation drive motor 58, the belt 55a and the pulleys 57a
7c, the belt 55b and the pulleys 57b and 57
d at the lower portion of the guide 53a.
Particles and the like are generated from the sliding portion that holds 6a and 56b. The drive mechanism 50 includes a cover 59a and a cover 59a to prevent such particles and the like from diffusing to the outside.
59b is provided, and local exhaust is performed directly from the vicinity of these sliding portions, so that particles and the like are collected and discarded through a predetermined exhaust path. In this way, particles and the like are prevented from adhering to the substrate G, and the quality of the substrate G can be kept high.

The transfer arm 51a is composed of a connecting portion 71a and a grip portion 72a connected to the support 52a, and the transport arm 51b is also composed of a connecting portion 71b and a grip portion 72b. On the upper surfaces of the grips 72a and 72b,
An adsorbing mechanism 73 that adsorbs and holds the substrate G and a support pin 74 that contacts and holds the substrate G are formed.
Here, the suction mechanism 73 sucks and holds the substrate G at the end of the substrate G and holds the inside of the substrate G with the support pins 74 so that transfer does not occur on the portion of the substrate G where the electrode pattern is formed. Preferably, the positions of the suction mechanism 73 and the support pins 74 are determined. As described above, by providing the suction mechanism 73 and the support pins 74 on the transfer arms 51a and 51b in parallel, the substrate G can be firmly held, the substrate G can be transferred at a high speed, and the throughput can be improved. It is possible to prevent transfer from occurring in G.

As the suction mechanism 73 and the support pins 74, those having the same structure as the suction mechanism 96 and the support pins 95 provided on the stage 93 of the peripheral resist removal unit (ER) 23 can be used. However, the transfer arm 5
Substrate G in which 1a and 51b are held by spin chuck 41
Is received, the substrate G is in a substantially horizontal state, but when the transfer arms 51a and 51b grip the substrate G, the height of the central portion of the substrate G is lowered as shown in FIG. When the suction mechanism 96 is used as the suction mechanism 73 for bending, it is also preferable to use one that does not have the tubular body 98 so that the suction pad 97 can be inclined in accordance with such bending of the substrate G. .

As shown in FIG. 9, when the substrate G is bent, the transfer arms 51a and 51b
In order to prevent the tip of 72b from coming into contact with the substrate G, and to hold the substrate G more reliably, it is disposed in such a manner that the inside faces downward by an angle θ in accordance with the deflection of the substrate G. ing. Here, in FIG. 9, the transfer arm 51a
-Although the form in which the angle of the entire 51b is inclined is shown,
It is also possible to adopt a structure in which only the grip portions 72a and 72b are inclined.

In the transfer arm 51a, the connecting portion 71
a and the holding portion 72a are detachable,
A grip portion having an appropriate size is attached according to the size of the substrate G, or a grip portion on which the suction mechanism 73 and the support pins 74 are arranged at an appropriate position according to an electrode pattern formed on the substrate G. And so on. Such a structure in which the connecting part and the gripping part can be detached and attached is the transfer arm 5
The same applies to 1b. In this way, the reliability of the transfer of the substrate G is maintained while quickly responding to differences in the size and electrode pattern of the substrate G handled by one device,
In addition, it is possible to prevent the occurrence of transfer on the substrate G and to maintain high quality.

It is to be noted that, for example, the transfer arm 51a may have a structure in which the connecting portion 71a and the gripping portion 72a are not detachable without being detachable, and may be an integral structure that cannot be separated from the support arm 52a. .

As described above, the resist coating unit (C)
T), a resist coating process in a unit including the peripheral resist removal unit (ER) 23 and the transport mechanism 50 is performed, for example, by first raising the spin chuck 41 to a predetermined position and moving the substrate G from the transport arm 18a. Transfer to the spin chuck 41 and lower the spin chuck 41 to a predetermined position. Next, the spin chuck 41 is rotated while the upper surfaces of the inner cup 42a and the outer cup 42b are open, and a thinner is applied to the rotating substrate G to improve the wettability of the substrate G with respect to the resist solution. The rotation of the spin chuck 41 is stopped and the resist liquid is applied to the substrate G to rotate the substrate G, or the resist liquid is applied to the substrate G while the spin chuck 41 is rotated at a predetermined number of rotations and the resist is applied. After forming a film, the upper surfaces of the inner cup 42a and the outer cup 42b are respectively
3a. The resist film thickness is adjusted by rotating the substrate G in a state of being closed by the outer lid 43b.

With the inner lid 43a and the outer lid 43b retracted to open the upper surfaces of the inner cup 42a and the outer cup 42b, and with the spin chuck 41 raised to a predetermined position, the transfer arm 51a The transport mechanism 50 is operated so that 51b is located. When the spin chuck 41 is lowered in this state, the substrate G naturally
a and 51b. When the transfer arms 51a and 51b are slid to the side of the peripheral resist removal unit (ER) 23 and the stage 93 is lifted from below the substrate G, the substrate G is transferred to the stage 93. The transfer arms 51 a and 51 b are retracted, the stage 93 is lowered to a predetermined position, the position of the substrate G is adjusted by the alignment mechanism 91, and edge removal is performed by the remover head 92. The substrate G on which the edge removal has been completed is transferred to the transfer arm 18 with the stage 93 raised to a predetermined height.
a, and is conveyed to the heat processing unit (HP) of the processing block 28 to perform, for example, a pre-bake process.

The embodiments of the present invention have been described above, but the present invention is not limited to the above embodiments. For example, the transport mechanism 50 includes a resist coating unit (CT) 22 and a peripheral resist removing unit (ER).
23, the transfer mechanism 50 is used.
Can be applied without limitation to a transport mechanism for transporting the substrate G to an adjacent unit. Further, the structure of the stage 93 in which the support pin 95 and the suction mechanism 96 are used in combination for mounting the substrate G can be used not only for the peripheral edge resist removal unit (ER) 23 but also for other units, for example, for example. , Cleaning unit (SC
R) 21a, 21b, etc. Further, in the above embodiment, the LCD substrate has been described as the substrate, but other substrates such as a semiconductor wafer and a CD substrate may be used.

[0061]

As described above, according to the liquid processing apparatus of the present invention, the transport mechanism for transporting the substrate can transport the substrate quickly because the substrate is securely held by the suction mechanism. There is an effect that the throughput can be improved. In addition, since the transfer mechanism partially holds the substrate with the support pins having a small contact area with the substrate, it is possible to suppress the occurrence of transfer on the substrate and to maintain the quality of the substrate at a high level. Further, since the transport mechanism for transporting the substrate is provided with the cover and the local exhaust means, particles generated by driving the transport mechanism are prevented from diffusing to the outside and contaminating the substrate, thereby improving the quality of the substrate. The effect of being able to hold is obtained. Furthermore, by using the suction mechanism and the support pins together on the stage on which the substrate is placed, the occurrence of transfer on the substrate can be suppressed while the substrate is securely fixed, and the quality of the substrate can be maintained at a high level. It has the following effects.

[Brief description of the drawings]

FIG. 1 is a plan view showing a resist coating / developing processing system as one embodiment of a liquid processing apparatus of the present invention.

FIG. 2 is a plan view showing a resist coating unit and a peripheral resist removing unit.

FIG. 3 is a sectional view showing a resist coating processing unit and a peripheral resist removing unit.

FIG. 4 is a plan view showing a schematic structure of a stage of a peripheral resist removing unit.

FIG. 5 is a cross-sectional view illustrating a schematic structure of a support pin and a suction mechanism provided on a stage of a peripheral resist removing unit.

FIG. 6 is an explanatory diagram showing an operation mode of a suction mechanism provided on a stage of a peripheral resist removing unit.

FIG. 7 is a plan view showing an example of the arrangement of support pins and suction mechanisms with respect to a product region of a substrate.

FIG. 8 is a plan view showing a schematic structure of a transport mechanism for transporting a substrate between a resist coating processing unit and a peripheral edge resist removing unit.

FIG. 9 is a cross-sectional view illustrating a schematic structure of a transport mechanism that transports a substrate between a resist coating processing unit and a peripheral edge resist removing unit.

[Explanation of symbols]

 22; resist coating processing unit 23; peripheral resist removing unit 50; transport mechanism 51a / 51b; transport arm 52a / 52b; support column 53a / 53b; guide 54a / 54b; 57d; pulley 58; rotary drive motor 59a / 59b; cover 71a / 71b; connecting portion 72a / 72b; gripping portion 73; suction mechanism 74; support pin 95; support pin 96; suction mechanism 100; ; Out-of-product area G; Substrate (LCD substrate) P1 to P4; Product area

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) G03F 7/16 502 G03F 7/16 502 H01L 21/027 H01L 21/68 A 21/68 21/30 502J 564C 577 (72) Inventor Tatsuya Iwasaki 5-3-6 Akasaka, Minato-ku, Tokyo TBS Release Center Tokyo Electron Limited (72) Inventor Takeshi Tsukamoto 5-36 Akasaka, Minato-ku, Tokyo TBS Release Center Tokyo Electron Limited F term (reference) 2H025 AB20 DA19 DA20 EA05 EA10 4D075 AC01 AC73 AC78 AC79 AC82 AC84 BB65Z BB69Z CA47 DA06 DB13 DC18 EA05 EA45 4F042 AA02 AA06 AA27 CC03 CC04 CC09 DD19 DE02 DF07 DF09 DF09 DF07 DF09 DF07 DF09 EB24 5F031 CA05 FA02 FA11 FA12 FA15 GA24 HA09 HA13 LA07 LA13 MA23 MA24 MA26 MA27 NA14 PA13 P A18 PA26 5F046 CD01 CD05 JA04 JA22

Claims (9)

[Claims] 1. A liquid processing apparatus for performing predetermined liquid processing on a substrate, comprising a holding means for holding the substrate substantially horizontally, and applying a predetermined coating liquid to a surface of the substrate held by the holding means. A coating processing unit that forms a coating film by performing the coating process; a peripheral coating film removing unit that removes a coating film at a peripheral portion of the substrate on which the coating film is formed and a coating liquid attached to the peripheral portion of the substrate; And a transport mechanism for transporting the substrate on which the coating film is formed between the unit and the peripheral coating film removing unit. The transport mechanism comprises: a suction mechanism for sucking and holding the substrate; and a support for holding the substrate at the top. A liquid processing apparatus, comprising: a transfer arm having pins disposed on an upper surface; and a drive mechanism for moving the transfer arm in a predetermined direction. 2. The suction mechanism is arranged so as to hold the substrate at a peripheral portion of the substrate, and the support pin is arranged so as to hold the substrate inside the substrate from a position where the suction mechanism holds the substrate. The liquid processing apparatus according to claim 1, wherein: 3. The two transfer arms are opposed to each other so as to support the substrate while supporting the substrate from both sides of the substrate, and the center of the substrate when the two transfer arms hold the substrate. In accordance with the deflection of the substrate that occurs as the position of the part goes down,
3. The apparatus according to claim 1, wherein the two transfer arms are disposed so as to be inclined such that the height of the center side of the substrate is low and the height of the peripheral side of the substrate is high. A liquid processing apparatus according to claim 1. 4. The transfer arm has a connecting part connected to the driving mechanism, and a grip part detachable from the connecting part, and has a shape and / or size corresponding to a size of a substrate to be handled. The liquid processing apparatus according to any one of claims 1 to 3, wherein grip portions having different lengths are used by being attached to the connecting portion. 5. A liquid processing apparatus for performing predetermined liquid processing on a substrate, comprising: a coating processing unit configured to apply a predetermined coating liquid to a surface of the substrate to form a coating film; A peripheral coating film removing unit that removes the coating film at the peripheral portion and a coating liquid attached to the peripheral portion of the substrate, wherein the peripheral coating film removing unit includes a plurality of support pins at predetermined positions on an upper surface on which the substrate is placed; A mounting plate provided with a plurality of suction mechanisms, a processing liquid discharge nozzle for discharging a predetermined processing liquid, and a processing for sucking the processing liquid discharged from the processing liquid discharge nozzle and the coating liquid dissolved by the processing liquid A liquid processing apparatus, comprising: a removing head having a liquid suction nozzle formed therein. 6. The suction mechanism includes: a suction pad for sucking a substrate; suction means for sucking the suction pad so as to be able to suck the substrate; and an upper surface formed of a foamable fluororesin sheet and surrounding the suction pad. And an enclosing base provided so that the suction pad sinks into the enclosing base by the weight of the substrate while holding the substrate when the substrate is sucked, and the substrate is settled by the sinking of the suction pad. The liquid processing apparatus according to claim 1, wherein the substrate is held in contact with an upper surface of the enclosure, and the substrate is also held at a vertex of the support pin. 7. A molded article of a composite material containing polybenzimidazole and carbon fiber as main components is used as the support pin, and the support pin has a lower outer diameter and an outer diameter so as to maintain a predetermined mechanical strength. A step structure comprising a thin upper portion, and a vertex at an upper portion of the support pin is formed in a substantially spherical shape so as to reduce a contact area with a substrate. 7. The liquid processing apparatus according to any one of 6. 8. A liquid processing apparatus for performing predetermined liquid processing on a substrate, comprising a holding means for holding the substrate substantially horizontally, and applying a predetermined coating liquid to a surface of the substrate held by the holding means. A coating processing apparatus for forming a coating film by forming a coating film; a peripheral coating film removing apparatus for removing a coating film on a peripheral portion of the substrate on which the coating film is formed and a coating liquid attached to the peripheral portion of the substrate; And a transport mechanism for transporting the substrate on which the coating film is formed between the apparatus and the peripheral coating film removing device. The transport mechanism comprises: a transport arm for holding the substrate; and A driving mechanism for moving the apparatus between the apparatus and the peripheral coating film removing apparatus; a dustproof cover for covering the driving mechanism so that particles generated in the driving mechanism do not diffuse to the outside; And a local dust collecting mechanism for sucking the particles. 9. A driving mechanism comprising: a first pulley provided on the coating processing device side; a second pulley provided on the peripheral coating film removing device side; and the first and second pulleys. A belt installed between the first pulley and the second pulley, and a rotation drive mechanism configured to rotate one of the first pulley and the second pulley. The liquid processing apparatus according to claim 8, wherein the liquid processing apparatus is provided in the vicinity.