JP2011176241A - Substrate chucking method and substrate chucking device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate chucking method and device, capable of preventing the occurrence of distortion in effective regions, regardless of substrates different in assembling of their effective regions. <P>SOLUTION: The method of chucking the substrate to a stage 101 by chucking the substrate having the effective region 501 through chucking holes 110, 120 plurally formed in the stage 101 includes the step of chucking the substrate by controlling chucking operations performed through the chucking holes 110, 120 independently of one another in units of groups of chucking holes 151-155, 161-165 each including at least one chucking hole 110, 120, keeping away from the effective region 501, to suck the substrate to the stage 101. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a substrate suction method and a substrate suction device, and more particularly to a substrate suction method and a substrate suction device that sucks a substrate having an effective area and sucks it on a stage.

  As a method for uniformly applying a chemical solution such as a photoresist to a substrate used in an organic electroluminescence (EL) display device, for example, there is a spin coating method. In a wet coating method such as a spin coating method, after a chemical solution is applied to a substrate, a drying process using a hot plate or the like is followed to evaporate a solvent contained in the chemical solution. In the drying process, since the substrate is placed on a hot plate or the like having a high temperature, a temperature gradient is generated in the substrate, which causes warpage of the substrate. In order to prevent this warpage, it is necessary to suck the substrate, suck it onto the hot plate, and fix it.

  When the substrate is sucked from the suction hole and sucked onto the hot plate, local distortion of the substrate occurs in the suction hole portion, causing uneven coating. For example, Patent Document 1 describes a method of arranging the positions of suction holes while avoiding an effective area of a pattern arranged in a substrate.

JP-A-10-81546

  In the method described in Patent Document 1, in order to avoid spot-like suction unevenness due to suction holes, suction holes are provided in the hot plate while avoiding the effective area in the substrate. However, with this method, each time the imposition of the effective area of the substrate changes, it is necessary to replace it with a stage (hot plate) having suction holes corresponding to the imposition. There was a problem that could not be handled.

  Further, not only the above-described uneven application of the chemical solution, but also when the substrate having the effective area is sucked from the suction hole to suck the substrate, distortion due to the suction may occur in the effective area.

  The present invention has been made in view of the above points, and provides a substrate suction method and a substrate suction device capable of suppressing the occurrence of distortion in an effective region even when substrates having different effective area impositions are provided. For the purpose.

  In order to achieve the above object, a substrate suction method according to a first aspect of the present invention is a method of sucking a substrate having an effective area from a suction hole provided in a stage and sucking the substrate onto the stage. In addition, for each of the suction hole groups of the stage in which a plurality of suction hole groups including at least one suction hole are formed, the suction operation from the suction holes is controlled independently of each other, thereby avoiding the effective area. And a suction step of sucking the substrate from the suction hole and sucking the substrate to the stage.

  In the substrate suction method, preferably, the suction holes are arranged in a matrix on the stage, and the suction hole group is formed for each row and column of the suction holes arranged in the matrix.

  In the substrate suction method, the substrate has a positioning mark formed in advance, and further includes a step of detecting a positioning mark of the substrate placed on the stage. In the suction step, the position of the positioning mark The suction hole group for sucking the substrate is specified based on the comparison with the position of the suction hole group set in advance, and the substrate is sucked from the suction hole of the specified suction hole group. Also good.

  In the substrate suction method, preferably, in the suction step, the suction hole group closest to the position of the positioning mark is specified, the substrate is sucked from the suction hole of the specified suction hole group, The substrate is not sucked from the suction holes of the suction hole group.

  In the substrate suction method, preferably, a valve that can be opened and closed independently is disposed in a pipe line that connects the suction means for sucking the substrate and the suction holes for each of the suction hole groups, In the suction process, the suction operation from the suction holes is controlled independently for each suction hole group by individually controlling the opening and closing of the valves.

  The substrate adsorption method may further include a step of heating the substrate at a contact surface between the plane of the stage and the substrate.

  In the substrate adsorption method, the substrate may be a mother substrate on which a plurality of organic EL display devices are formed.

  In order to achieve the above object, a substrate suction apparatus according to a second aspect of the present invention is an apparatus for sucking a substrate having an effective area, wherein a plurality of suction hole groups including at least one suction hole are formed. And a control means for independently controlling the suction operation from the suction holes for each of the suction hole groups so as to suck the substrate while avoiding the effective area of the substrate.

  In the substrate suction apparatus, preferably, the suction holes are arranged in a matrix on the stage, and the suction hole group is formed for each row and column of the suction holes arranged in the matrix.

  In the substrate suction apparatus, preferably, the substrate has a pre-formed positioning mark, and further includes a detecting unit that detects the positioning mark of the substrate placed on the stage, and the control unit includes: Based on a comparison between the position of the positioning mark detected by the detection means and the position of the suction hole group set in advance, the substrate is sucked so as to suck the substrate while avoiding the effective area. The suction hole group is specified, and the substrate is sucked from the suction hole of the specified suction hole group.

  In the substrate suction apparatus, preferably, the control means sucks the substrate from the suction hole of the suction hole group closest to the position of the positioning mark, and sucks from the suction holes of the other suction hole groups. do not do.

  Preferably, the substrate suction device is installed in the suction pipe and a suction pipe for connecting the suction hole and a suction means for sucking the substrate from the suction hole for each suction hole group, and is independently installed in the pipeline. A valve that can be opened and closed, and the control means controls the suction operation from the suction holes independently for each of the suction hole groups by individually controlling the opening and closing of the valves.

  The said board | substrate adsorption | suction apparatus WHEREIN: The said stage may be equipped with the heater which heats the contact surface of the said stage and the said board | substrate.

  In the substrate adsorption device, the substrate may be a mother substrate on which a plurality of organic EL display devices are formed.

  According to the substrate suction method and the substrate suction device of the present invention, the suction operation can be controlled independently for each suction hole group so as to suck the substrate while avoiding the effective area. Generation of distortion due to suction of the substrate from the hole can be suppressed.

It is a mimetic diagram showing the composition of the substrate adsorption device concerning a 1st embodiment of the present invention. It is a perspective schematic diagram of the stage part of the substrate adsorption device concerning a 1st embodiment of the present invention. It is the cross-sectional schematic which cut | disconnected the board | substrate adsorption | suction apparatus shown in FIG. 1 along the AA cutting line. It is a valve opening / closing control table of the substrate suction apparatus according to the first embodiment of the present invention. It is a flowchart which shows an example of the board | substrate attraction | suction adsorption | suction operation | movement in the board | substrate adsorption | suction method concerning 1st Embodiment of this invention. It is a mimetic diagram for explaining a substrate adsorption method concerning a 1st embodiment of the present invention. It is a mimetic diagram for explaining a substrate adsorption method concerning a 1st embodiment of the present invention. It is a schematic diagram which shows the structure of the board | substrate adsorption | suction apparatus which concerns on 2nd Embodiment of this invention. It is the side schematic diagram which shows the structure of the board | substrate adsorption | suction apparatus by which the board | substrate was mounted based on 2nd Embodiment of this invention. It is a schematic diagram for demonstrating the board | substrate adsorption | suction method concerning 2nd Embodiment of this invention. It is a flowchart which shows an example of the board | substrate attraction | suction adsorption | suction operation | movement in the board | substrate adsorption | suction method concerning 2nd Embodiment of this invention. It is a schematic diagram for demonstrating the board | substrate adsorption | suction method concerning 2nd Embodiment of this invention. It is a cross-sectional schematic diagram which shows the structure of the organic electroluminescence display which concerns on 3rd Embodiment of this invention. It is sectional drawing which shows the manufacturing process of the organic electroluminescence display which concerns on 3rd Embodiment of this invention. It is sectional drawing which shows the manufacturing process of the organic electroluminescence display which concerns on 3rd Embodiment of this invention. It is sectional drawing which shows the manufacturing process of the organic electroluminescence display which concerns on 3rd Embodiment of this invention. It is a figure which shows the electronic device with which the organic electroluminescence display which concerns on 3rd Embodiment of this invention is used.

  A substrate suction apparatus and a substrate suction method according to an embodiment of the present invention will be described with reference to the drawings. In the present embodiment, an apparatus and method for adsorbing a substrate on a hot plate in order to dry a chemical applied to a mother substrate (hereinafter referred to as a substrate) on which a plurality of device regions are formed on one sheet will be described. .

(First embodiment)
A substrate suction apparatus and a substrate suction method according to a first embodiment of the present invention will be described with reference to FIGS.

(Substrate adsorption device)
As schematically shown in FIG. 1, the substrate suction apparatus 10 according to the first embodiment includes a hot plate 101, pipe lines 131 to 135, 141 to 145, valves Vx1 to Vx5, Vy1 to Vy5, and a control unit. 180 and a suction device 190 are mainly provided.

  The hot plate 101 is made of an aluminum plate, and is formed with a matrix of suction holes 110 for suction and a matrix of suction holes 120. Although not shown, the hot plate 101 includes a plurality of cartridge heaters and temperature sensors. The temperature of the surface of the hot plate 101 is measured by the temperature sensor, and the temperature of the aluminum plate surface is controlled based on the difference between the current temperature and the target temperature.

  As shown in FIGS. 1 and 2, 5 × 5 suction holes 110 are arranged in a matrix on the plane of the hot plate 101. In FIG. 1, the suction holes 110 are indicated by “black circles” for distinction. Also, 5 × 5 suction holes 120 are arranged in a matrix on the plane of the hot plate 101. In FIG. 1, the suction holes 120 are indicated by “open circles” for distinction. The suction holes 110 and 120 are arranged adjacent to each other. Moreover, it is preferable that the suction holes 110 and 120 have a diameter of about 1 mm to 2 cm.

  The suction holes 110 in the same row are connected to each other by pipe lines 131 to 135, and are connected to the suction device 190 via valves Vx1 to Vx5. The suction holes 120 in the same row are connected to each other by pipe lines 141 to 145 and connected to the suction device 190 via valves Vy1 to Vy5. In FIG. 1, the pipelines 131 to 135 and 141 to 145 are indicated by broken lines in order to facilitate understanding. Further, here, the suction holes 110 in the same column are called suction hole columns (lines) 151 to 155 for each column, and the suction holes 120 in the same row are called suction hole rows (lines) 161 to 165 for each row. .

  The control unit 180 includes a processor or the like, supplies control signals to the valves Vx1 to Vx5 and Vy1 to Vy5, and individually controls the opening and closing of the valves Vx1 to Vx5 and Vy1 to Vy5. Further, the control unit 180 controls the suction operation of the suction device 190.

  The control unit 180 stores in advance a valve opening / closing control table 181 corresponding to the type of substrate as shown in FIG. Although details will be described later, the valve opening / closing control table 181 is set to suck the substrate while avoiding the effective area.

  The suction device 190 is composed of, for example, a vacuum pump, and sucks negative pressure from the suction holes 110 and 120 through the open valves Vx1 to Vx5, Vy1 to Vy5 and the pipe lines 131 to 135 and 141 to 145, thereby forming a substrate. Is adsorbed on the hot plate 101.

  Further, the suction hole line 151 will be described as an example. The suction hole 110 penetrates the aluminum plate as shown in FIG. The pipe line 131 is a surface facing the substrate mounting surface of the aluminum plate and is connected to the five suction holes 110 of the suction hole line 151. The pipe line 131 is connected to the suction device 190 via the valve Vx1. The other suction hole lines (columns and rows) 152 to 155 and 161 to 165 have the same configuration as the suction hole line 151.

(Substrate adsorption method)
Next, a substrate suction method according to the first embodiment of the present invention will be described with reference to FIGS.

  FIG. 5 is a flowchart showing the substrate suction and suction operation of the control unit 180 according to this embodiment. Hereinafter, the substrate suction suction operation will be described with reference to FIG.

  First, the substrate 11 is loaded onto the hot plate 101 by, for example, a robot arm and placed at a specified position. The controller 180 detects that the substrate 11 has been carried in by a sensor (not shown), and starts the flow of FIG.

The control unit 180 specifies the type of the substrate 11 placed (Step S11).
The control unit 180 refers to the valve opening / closing control table 181 shown in FIG. 4 and identifies the valve V to be opened according to the type of the substrate 11 identified in step S11 (step S12).
The control unit 180 transmits a control signal to the valve V, opens the valve V to be opened specified in step S12, and closes the other valves V (step S13).
The control unit 180 activates the suction device 190 and starts a suction operation (step S14). The substrate 11 is sucked from the suction holes 110 and 120 connected to the pipe lines 131 to 135 and 141 to 145 through the pipe lines 131 to 135 and 141 to 145 connected to the opened valve V, and is then on the hot plate 101. To be adsorbed. The hot plate 101 is heated in advance by a heater, and the chemical applied to the substrate is dried.

The control unit 180 determines whether or not a preset end condition is satisfied, for example, whether or not a predetermined processing time has elapsed. When it is determined that “the end condition is satisfied” (step S15; Yes), the control unit 180 proceeds to step S16. When it is determined that “the end condition is not satisfied” (step S15; No), the control unit 180 performs step S15 again, and repeatedly performs step S15 until it is determined that “the end condition is satisfied” (step S15).
When it is determined that “the end condition is satisfied”, the control unit 180 closes all the valves V and releases the negative pressure in the pipelines 131 to 135 and 141 to 145 to release the adsorption of the substrate 11 (step S16). ).
The substrate 11 that has been released from the suction is carried out by, for example, a robot arm, and the substrate suction and suction operation ends.
The above-described process is repeatedly performed by loading a new substrate.

  Next, the above process will be described based on a specific example. With reference to FIGS. 6 and 7, a case where two effective areas are impositioned on a substrate and a case where four effective areas are impositioned will be described. A board having two effective areas is designated as A11 in the valve opening / closing control table 181 in FIG. 4, and a board having four effective areas is designated as B11 in the valve opening / closing table 181 in FIG. In FIGS. 6 and 7, the effective areas 501 and 502 of the substrate are indicated by hatching for distinction.

  Here, the effective area refers to an area where it is desirable to suppress the occurrence of distortion, distortion, and unevenness in addition to an area where a device such as a display device is formed.

First, the case where the substrate A11 having two effective areas 501 is sucked onto the hot plate 101 will be described with reference to FIG.
In order to dry the chemical solution, the substrate A11 coated with the chemical solution in the previous process is loaded by a robot arm or the like and placed at a specified position on the hot plate 101. The hot plate 101 is preferably heated in advance by a heater. The time and temperature for placing the substrate A11 on the plane of the hot plate 101 are appropriately determined according to the applied chemical solution.

  When the substrate A11 is placed on the hot plate 101, the control unit 180 specifies the substrate type A11 (step S11), and in the valve opening / closing control table 181, the opening target stored in association with A11 is stored. The valves Vx1, Vx3, Vx5, Vy1, Vy5 are specified (step S12). The control unit 180 transmits control signals to the valves Vx1 to Vx5, Vy1 to Vy5, opens the specified valves Vx1, Vx3, Vx5, Vy1, and Vy5, and closes the other valves Vx2, Vx4, Vy2, Vy3, and Vy4. (Step S13). The type of the board may be specified by the user with respect to the control unit 180, or may be specified by determining with a sensor or the like.

  The controller 180 activates the suction device 190 and starts a suction operation (step S14). As a result, the suction holes of the suction hole lines 151, 153, 155, 161, 165 via the pipe lines 131, 133, 135, 141, 145 connected to the opened valves Vx1, Vx3, Vx5, Vy1, Vy5. Substrate A11 is sucked from 110 and 120.

  As shown in FIG. 6, the substrate A11 is a hot plate so that the suction hole lines 152, 154 in the column direction and the suction hole lines 162, 163, 164 in the row direction cross the effective area 501 of the substrate A11. 101. On the other hand, the suction hole lines 151, 153, 155, and 161, 165 pass only through the ineffective area of the substrate A11. Therefore, by opening and closing the valves Vx1 to Vx5 and Vy1 to Vy5 based on the valve opening / closing control table 181, the substrate A11 can be sucked only by the suction holes located on the ineffective area.

  Next, a case where the substrate B11 having four effective areas 502 is sucked onto the hot plate 101 will be described with reference to FIG.

  In order to dry the chemical solution, the substrate B11 coated with the chemical solution in the previous step is placed on the plane of the hot plate 101. The control unit 180 specifies the board type B11 (step S11), opens the valves Vx1, Vx3, Vx5, Vy1, Vy3, Vy5 based on the valve opening / closing control table 181 and other valves Vx2, Vx4, Vy2, and so on. Vy4 is closed (step S12, step S13).

  The controller 180 activates the suction device 190 and starts a suction operation (step S14). As a result, the suction hole lines 151, 153, 155, 161 via the pipes 131, 133, 135, 141, 143, 145 connected to the opened valves Vx1, Vx3, Vx5, Vy1, Vy3, Vy5. The substrate B11 is sucked from the suction holes 110 and 120 of 163 and 165.

  As shown in FIG. 7, the substrate B <b> 11 is arranged on the hot plate 101 so that the suction hole lines 152 and 154 in the column direction and the suction hole lines 162 and 164 in the row direction cross the effective area 502. . On the other hand, the suction hole lines 151, 153, 155, 161, 163, and 165 pass only through the ineffective area of the substrate B11. Therefore, by opening and closing the valves Vx1 to Vx5 and Vy1 to Vy5 based on the valve opening / closing control table 181, the substrate B11 can be sucked only by the suction holes located on the ineffective area.

  In this way, by providing a large number of suction hole lines (groups) arranged in the column and row directions, and appropriately selecting a group of suction holes for sucking the substrate, resists or the like can be used even on substrates with different impositions. The substrate can be adsorbed while avoiding the effective area where the chemical solution is applied. For this reason, even with substrates with different impositions, it is possible to prevent the occurrence of distortion such as coating unevenness in the effective area without exchanging the stage such as a hot plate. It is possible to respond immediately and easily.

(Second Embodiment)
In the substrate suction apparatus and the substrate suction method according to the first embodiment, the control unit 180 controls the opening / closing of the valve based on the type of the substrate and the valve opening / closing control table 181. Therefore, the user needs to store the valve opening / closing control table 181 in the control unit 180 in advance. On the other hand, in the substrate suction apparatus and the substrate suction method according to the second embodiment of the present invention, the valve opening / closing control table is not required, and the control unit can be used even if a substrate having any imposition effective area is carried in. Identifies a valve that automatically opens and closes. Below, the board | substrate adsorption | suction apparatus 20 and the board | substrate adsorption | suction method which concern on 2nd Embodiment of this invention are demonstrated, referring FIGS. 8-12.

A substrate suction apparatus 20 according to the second embodiment is shown in FIGS. In addition, the same code | symbol is attached | subjected to the same part as the board | substrate adsorption | suction apparatus 10 concerning 1st Embodiment.
A difference from the first embodiment is that, as shown in FIGS. 8 to 10, a CCD camera 270 arranged to face the substrate 12 is further provided as an imaging device (detection device). The CCD camera 270 is connected to the moving device 271. The control unit 180 is connected to the moving device 271 and the CCD camera 270, and controls the moving device 271 to move the CCD camera 270 relative to the substrate 12 while appropriately scanning the substrate 12 with the CCD camera 270. Take an image.

  Position information of suction hole lines (rows and columns) 151 to 155 and 161 to 165 with respect to the reference position is input to the control unit 180 in advance with the planned placement position of the substrate as the reference position.

  In the present embodiment, a scribe mark M is previously formed as a positioning mark on the substrate 12 placed on the plane of the hot plate 101. The scribe mark M is formed in the ineffective area by, for example, irradiating an electron beam or a laser beam.

  FIG. 11 is a flowchart showing the substrate suction and suction operation of the control unit 180 according to this embodiment. Hereinafter, the substrate suction suction operation will be described with reference to FIG.

  First, the substrate 12 is loaded onto the hot plate 101 by, for example, a robot arm and placed at a specified position. The control unit 180 detects that the substrate 12 has been carried in by a sensor (not shown), and starts the flow of FIG.

The control unit 180 scans the substrate surface in the x and y directions with the imaging device (CCD camera) 270 (step S21).
The control unit 180 extracts the scribe mark M formed on the substrate 12 based on the scanned image in step S21 (step S22).
The controller 180 identifies the suction hole line (column and row) closest to the scribe mark M extracted in step S22 (step S23).
The control unit 180 opens the valves V connected to the column and row suction holes identified in step S23, and closes the other valves V (step S24).
The control unit 180 activates the suction device 190 and starts a suction operation (step S25). The substrate 12 is sucked from the suction holes 110 and 120 connected to the pipe lines 131 to 135 and 141 to 145 through the pipe lines 131 to 135 and 141 to 145 connected to the opened valve V, and the hot plate 101 To be adsorbed. The hot plate 101 is heated in advance by a heater, and the chemical applied to the substrate is dried.

The control unit 180 determines whether or not a preset end condition is satisfied, for example, whether or not a predetermined processing time has elapsed. When it is determined that “the end condition is satisfied” (step S26; Yes), the process proceeds to step S27. When it is determined that “the end condition is not satisfied” (step S26; No), the control unit 180 performs step S26 again, and repeatedly performs step S26 until it is determined that “the end condition is satisfied” (step S26). .
When it is determined that “the end condition is satisfied”, the controller 180 closes all the valves V and releases the negative pressure in the pipe lines 131 to 135 and 141 to 145 to release the adsorption of the substrate 12 (step S27). ).
The substrate 12 that has been released from the suction is carried out by, for example, a robot arm, and the substrate suction and suction operation ends.
The above-described process is repeatedly performed by loading a new substrate.

  Next, the above process will be described based on a specific example. A case where the substrate C12 having four effective areas 503 is sucked onto the hot plate 101 will be described with reference to FIGS. In FIGS. 10 and 12, the effective area 503 of the substrate is indicated by hatching for distinction.

  In order to dry the chemical solution, the substrate C12 coated with the chemical solution in the previous process is loaded by a robot arm or the like and placed at a specified position on the hot plate 101. The hot plate 101 is preferably heated in advance by a heater. The time and temperature for placing the substrate C12 on the plane of the hot plate 101 are appropriately determined according to the applied chemical solution.

  When the substrate C12 is placed on the hot plate 101, the controller 180 sequentially moves the CCD camera 270 in the x and y directions of the substrate C12 as indicated by arrows in FIG. An image is acquired (step S21). In this way, the control unit 180 scans the substrate surface and extracts the scribe mark M (step S22). Next, the control unit 180 compares the position information of the scribe mark M with the position information of the suction hole lines 151 to 155 and 161 to 165 inputted in advance, and the line of the suction hole closest to each scribe mark M. (Row and column) are specified (step S23). In the example shown in FIG. 12, the suction hole lines 151 and 161 are specified as the suction hole lines closest to the scribe mark M11. Similarly, suction hole lines 153 and 161 for scribe mark M21, suction hole lines 155 and 161 for scribe mark M31, suction hole lines 155 and 163 for scribe mark M32, and scribe marks. For M33, suction hole lines 155 and 165 are specified. In this case, the control unit 180 opens the valves Vx1, Vx3, Vx5, Vy1, Vy3, Vy5 connected to the suction hole lines 151, 153, 155, 161, 163, 165, respectively, and the other valves Vx2, Vx4, Vy2, and Vy4 are closed (step S24). Accordingly, the substrate C12 can be sucked while avoiding the effective area 503.

  According to such a configuration, when the imposition of the substrate changes, the substrate is simply placed on the hot plate without resetting the valve opening / closing control table according to the imposition of the substrate. Thus, it is possible to identify and open the valve corresponding to the suction hole line that passes only through the ineffective area of the substrate. Accordingly, it is possible to automatically suck the substrate by avoiding the effective area and suck it onto the hot plate without setting the valve opening / closing control table by the user for each substrate with different imposition.

(Third embodiment)
The substrate suction device and the substrate suction method according to the present invention can be applied to, for example, the manufacture of a bottom emission type organic EL display device. The organic EL display device is manufactured by cutting out a plurality of organic EL display devices formed on a large mother substrate. Hereinafter, an organic EL display device and a method for manufacturing the organic EL display device will be described with reference to FIGS.

(Organic EL display device)
As shown in FIG. 13, the organic EL display device 600 includes a glass substrate 610a, a pixel electrode (anode) 620, a bank 630, an organic EL light emitting layer 640, a hole injection layer 690, and an interlayer insulating film 650. And an upper electrode (cathode) 660 and a sealing glass 670.

A gate layer 710 is provided over the glass substrate 610a. Further, an insulating layer 720 is also provided over the glass substrate 610 a so as to cover the gate layer 710. A pixel electrode 620 (anode) is provided over the insulating layer 720. The pixel electrode 620 is formed of a transparent conductive material such as doped indium oxide (ITO), zinc-doped indium oxide, or indium oxide (In ₂ O ₃ ).

  A semiconductor film 760 is provided over the insulating layer 720. On the semiconductor film 760, a source / drain 740 is provided with an insulating film 730 interposed therebetween. A drain line 750 is provided on the source / drain 740. An interlayer insulating film 650 is provided on the source / drain 740. The interlayer insulating film 650 electrically insulates adjacent pixel electrodes 620 from each other.

  A bank 630 functioning as a partition wall is provided on the interlayer insulating film 650. On the pixel electrode 620 in the opening surrounded by the interlayer insulating film 650 and the bank 630, a hole injection layer 690, an organic EL light emitting layer 640, and an upper electrode 660 (cathode) are laminated in this order.

  In order to facilitate electron injection, the upper electrode 660 can use, for example, a metal such as AlLi, FLi, MgIn, Li, Na, Mg, Ca alone or in an alloy.

  A passivation film 700 is provided on the upper electrode 660. An adhesive layer 680 is provided on the passivation film 700. A sealing glass 670 is provided on the adhesive layer 680.

(Method for manufacturing organic EL display device)
Next, a method for manufacturing the organic EL display device 600 will be described. In the present embodiment, an example in which a mother substrate (glass substrate) 610 on which four organic EL display devices are formed is adsorbed by the substrate adsorption device 10 and the substrate adsorption method according to the first embodiment is taken as an example. explain.

First, as shown in FIG. 14A, a gate layer 710 is provided on a glass substrate 610.
Next, as illustrated in FIG. 14B, an insulating layer 720 is provided over the glass substrate 610 so as to cover the gate layer 710, a semiconductor layer 761 is provided over the insulating layer 720, and the semiconductor layer 761 is overlaid. Is provided with an insulating film layer 731 to perform three-layer deposition.

Next, as illustrated in FIG. 14C, the insulating film layer 731 is etched to form an insulating film 730.
Next, as illustrated in FIG. 14D, the semiconductor layer 761 is etched to form a semiconductor film 760. Then, a source / drain 740 is provided on the semiconductor film 760.

  Next, an ITO film is formed on the insulating layer 720 by sputtering, vapor deposition, or the like with a uniform thickness. Then, the ITO film is formed using a phenol novolac resin or the like as a resist, and by photolithography, as shown in FIG. 14E, the pixel electrodes 620 are formed in stripes on the glass substrate 610 at predetermined intervals. Form. The pixel electrode 620 has a thickness of 30 nm to 100 nm. Note that the pixel electrode 620 can also be formed by performing wet etching treatment, dry etching treatment, or the like.

  Next, as shown in FIG. 15A, a drain line 750 is provided on the source / drain 740.

  Next, as shown in FIG. 15B, on the source / drain 740, for example, a polyimide solution is uniformly applied with a thickness of 0.8 μm by a spin coating method to form a polyimide film 650a. In order to dry the applied polyimide solution, the glass substrate 610 is placed on the hot plate 101 of the substrate suction apparatus 10 with the coating surface facing up. The glass substrate 610 is sucked by the substrate adsorption device 10 and heated to evaporate the solvent while adsorbing on the hot plate 101. The substrate suction device 10 and the substrate suction method are the same as the substrate suction device 10 and the substrate suction method described in the first embodiment.

  Then, the provided polyimide film 650a is cured by patterning so as to remove the portion where the pixel electrode 620 is located, as shown in FIG. In this way, an interlayer insulating film 650 is formed. The interlayer insulating film 650 is provided in a region between the pixel electrodes 620 and covers the peripheral edge of the pixel electrode 620, thereby preventing a short circuit between adjacent pixel electrodes 620. The interlayer insulating film 650 has a stitch shape having a plurality of openings and is formed of a film having a thickness of 650 nm to 300 nm. Interlayer insulating film 650 is formed of a silicon compound such as silicon nitride or silicon oxide, for example.

  Next, as shown in FIG. 15D, a bank 630 is formed on the interlayer insulating film 650. The bank 630 is formed by, for example, irradiating a negative photosensitive resin such as polystyrene with light through a photomask.

  Then, the pixel electrode 620 is made lyophilic by oxygen plasma treatment or UV ozone treatment. By performing this oxygen plasma treatment or UV ozone treatment, the hole injection layer forming coating solution for coating the pixel electrode 620 spreads over the entire pixel electrode 620, and a uniform film thickness can be formed.

  Next, a hole injection layer forming coating solution is applied onto the pixel electrode 620 surrounded by the bank 630 by a nozzle printing method. After the coating, the glass substrate 610 is placed on the hot plate 101 of the substrate adsorption device 10 with the coating surface facing up in order to dry the hole injection layer forming coating solution. The glass substrate 610 placed is sucked by the substrate suction device 10 and dried on a temperature condition of 100 ° C. or higher while being sucked on the hot plate 101. As a result, a hole injection layer 690 is formed as shown in FIG. The substrate suction device 10 and the substrate suction method are the same as the substrate suction device 10 and the substrate suction method described in the first embodiment.

  Next, the organic EL light emitting layer forming coating liquid according to the above-described embodiment is applied onto the formed hole injection layer 690. Application is continuously performed from a nozzle coater. The application is desirably performed in a nitrogen gas atmosphere. The organic EL light emitting material may change its characteristics when it comes into contact with oxygen, water vapor or the like. Therefore, it becomes possible to make the characteristic change of the organic EL light emitting material difficult to occur by applying in a nitrogen gas atmosphere.

  The viscosity of the organic EL light emitting layer forming coating solution is 4 mPa · s. The viscosity of the coating liquid for forming an organic EL light emitting layer is 1 to 20 mPa · s, preferably 2 to 8 mPa · s. When the viscosity is less than 1 mPa · s, not only is it difficult to control the discharge amount, but there is a possibility that a sufficient film thickness cannot be formed because the solid concentration is too low. On the other hand, if the viscosity of the coating liquid for forming the organic EL light emitting layer is larger than 20 mPa · s, there is a possibility that the nozzle coater cannot be smoothly discharged, and it may be necessary to change the specifications of the apparatus such as increasing the nozzle coater.

  After the organic EL light emitting layer forming coating solution is applied, the glass substrate 610 is placed on the hot plate 101 of the substrate suction device 10. The glass substrate 610 placed is sucked by the substrate suction device 10 and dried on the organic EL light emitting layer forming coating by heating in a nitrogen atmosphere while being sucked on the hot plate 101. The substrate suction device 10 and the substrate suction method are the same as the substrate suction device 10 and the substrate suction method described in the first embodiment. Thereby, as shown in FIG.16 (b), the organic electroluminescent light emitting layer 640 is formed. The coating liquid for forming the organic EL light emitting layer may be dried with a sheathed heater in a vacuum.

  Next, as illustrated in FIG. 16C, the upper electrode 660 having a thickness of, for example, 100 nm is provided on the organic EL light emitting layer 640. The upper electrode 660 can be formed using, for example, a resistance heating vapor deposition method, an electron beam vapor deposition method, a sputtering method, an ion plating method, or the like.

  Next, as illustrated in FIG. 16D, an insulating layer 720 is provided on the upper electrode 660. Then, an adhesive layer 680 is provided over the insulating layer 720, and a sealing glass 670 is formed over the adhesive layer 680. Specifically, an adhesive made of an epoxy ultraviolet curable resin is applied to one surface of the sealing glass 670 using a dispenser. Then, the surface of the sealing glass 670 on which the adhesive is applied and the surface on which the adhesive layer 680 is disposed are aligned and bonded together, and ultraviolet rays are irradiated to cure the adhesive. As a result, the sealing glass 670 and the surface on which the adhesive layer 680 is disposed are fixed. Further, by cutting out the organic EL display device from the glass substrate 610 sealed with the sealing glass 670, an organic EL display device 600 as shown in FIG. 13 is formed.

  In the step of drying the polyimide solution, the hole injection layer forming coating solution, and the organic EL light emitting layer forming coating solution, the substrate adsorption apparatus and method according to the second embodiment of the present invention may be applied. .

  In the step of drying each of the polyimide solution, the hole injection layer forming coating solution, and the organic EL light emitting layer forming coating solution, the substrate adsorption device and the substrate adsorption method according to the present invention are used to adsorb in the display area. It becomes possible to suppress the coating unevenness which may generate | occur | produce. Thereby, an interlayer insulating film, a hole injection layer, and an organic EL light emitting layer having uniformity can be formed.

  As described above, the organic EL display device manufactured using the substrate suction device and the substrate suction method according to the present invention is used as a display panel of various electronic devices. For example, the display panel 811 of the digital camera 810 shown in FIG. 17A, the display panel 821 of the personal computer 820 shown in FIG. 17B, or the display panel 831 of the mobile phone 830 shown in FIG. This organic EL display device can be applied.

  In the third embodiment, the substrate adsorption method and the substrate adsorption device according to the present invention are applied in the steps of drying the polyimide solution, the hole injection layer forming coating solution, and the organic EL light emitting layer forming coating solution. Although the case has been described, the substrate suction method and the substrate suction device according to the present invention may be applied to, for example, a photoresist coating process when performing photolithography.

  In the third embodiment, the mother substrate used in the organic EL display device has been described as an example. However, the substrate suction device and the substrate suction method according to the present invention include, for example, an organic transistor, a liquid crystal display, and various other electronic devices. It can be applied to a mother board.

  In the first to third embodiments, the description has been given of the case where 5 × 5 suction holes are arranged in a matrix. However, by providing more suction holes, the substrate has more different impositions. Can be applied to.

  Moreover, in the said 1st-3rd embodiment, although the case where the suction hole group was comprised for every column and row of the suction hole was demonstrated, the suction hole group may be comprised from one suction hole. Alternatively, the number of suction holes included in each group of suction holes may be different. Thereby, even when the effective area | region of a several different dimension is impositioned on the one board | substrate, a board | substrate can be attracted | sucked and avoided on an effective area.

  The suction holes and pipes in the first to third embodiments may be any ones that can perform negative pressure suction, and can be appropriately configured by known ones.

  In addition, the valves in the first to third embodiments may be appropriately selected from electromagnetic valves, pneumatic on-off valves, electric on-off valves, etc., as long as they can perform the opening / closing operation and adjustment of the opening degree of the valves. Can do.

  Moreover, each element which comprises the hotplate for the heat processing in the said 1st-3rd embodiment can be comprised by a well-known thing suitably.

  Moreover, in the said 1st-3rd embodiment, although the stage which adsorb | sucks a board | substrate demonstrated the case where it was a hot plate provided with a heater, the substrate adsorption | suction apparatus and substrate adsorption | suction method concerning this invention are equipped with a heating means. The present invention can also be applied to a case where a substrate is adsorbed on a stage that is not present.

  In the second embodiment, the case where the imaging device is a CCD camera has been described. However, a CMOS camera may be used.

  The embodiments of the substrate suction apparatus and the substrate suction method according to the present invention have been described in detail above with reference to the drawings. However, the technical scope of the present invention is not limited to these embodiments.

  DESCRIPTION OF SYMBOLS 10,20 ... Substrate adsorption apparatus, 101 ... Stage (hot plate), 110, 120 ... Adsorption hole, 131-135, 141-145 ... Pipe line, 151-155, 161-165 ... Group (line) of adsorption holes, 270 ... Imaging device (CCD camera), 271 ... Moving device, 180 ... Control unit, 181 ... Valve opening / closing control table, 190 ... Suction device, 11, A11, B11, 12, C12 ... Substrate, 501, 502, 503 ... Effective Area, M, M11, M21, M31, M32, M33 ... positioning mark (scribe mark), 600 ... organic EL display device, 610 ... mother substrate (glass substrate), 610a ... glass substrate, 620 ... pixel electrode (anode), 630 ... Bank, 640 ... Organic EL light emitting layer, 650 ... Interlayer insulating film, 660 ... Upper electrode (cathode), 670 ... Sealing glass, 80 ... adhesive layer, 690 ... hole injection layer, 700 ... passivation film, 710 ... gate layer, 720 ... insulating layer, 730 ... insulating film, 740 ... source / drain, 750 ... drain line, 760 ... semiconductor film, 810 ... Digital camera, 820 ... Personal computer, 830 ... Mobile phone, 811,821,831 ... Display panel, V, Vx1 to Vx5, Vy1 to Vy5 ... Valve

Claims (14)

A method of sucking a substrate having an effective area from a suction hole provided in a stage and sucking the substrate to the stage,
For each of the suction hole groups of the stage where a plurality of suction hole groups including at least one suction hole are formed, the suction operation from the suction holes is controlled independently of each other, thereby avoiding the effective area and A substrate suction method comprising: a suction step of sucking the substrate from a suction hole and sucking the substrate to the stage. The suction holes are arranged in a matrix on the stage, and the suction hole group is formed for each row and column of the suction holes arranged in the matrix.
The substrate adsorption method according to claim 1. The substrate has a pre-formed positioning mark,
Further comprising a step of detecting a positioning mark of the substrate placed on the stage,
In the suction step, the suction hole group for sucking the substrate is specified based on a comparison between the position of the positioning mark and the position of the suction hole group set in advance, and the specified suction hole group Sucking the substrate from the suction hole of
The substrate adsorption method according to claim 1 or 2, wherein In the suction step, the suction hole group closest to the position of the positioning mark is specified, the substrate is sucked from the suction hole of the specified suction hole group, and from the suction holes of the other suction hole groups Does not suck the substrate,
The substrate adsorption method according to claim 3. A valve that can be opened and closed independently is disposed in a pipe line that connects the suction means for sucking the substrate and the suction holes for each of the suction hole groups,
5. The suction process according to claim 1, wherein in the suction step, the suction operation from the suction holes is controlled independently for each of the suction hole groups by individually controlling the opening and closing of the valves. The substrate adsorption method according to any one of the preceding claims.   The substrate adsorption method according to claim 1, further comprising a step of heating the substrate at a contact surface between the plane of the stage and the substrate.   The substrate adsorption method according to claim 1, wherein the substrate is a mother substrate on which a plurality of organic EL display devices are formed. An apparatus for adsorbing a substrate having an effective area,
A stage in which a plurality of suction hole groups including at least one suction hole are formed;
Control means for independently controlling the suction operation from the suction holes for each suction hole group so as to suck the substrate while avoiding the effective area of the substrate;
A substrate suction apparatus comprising: The suction holes are arranged in a matrix on the stage,
The substrate suction apparatus according to claim 8, wherein the suction hole group is formed for each row and column of suction holes arranged in a matrix. The substrate has a pre-formed positioning mark,
Further comprising detection means for detecting the positioning mark of the substrate placed on the stage;
The control means sucks the substrate while avoiding the effective area based on a comparison between the position of the positioning mark detected by the detection means and the position of the suction hole group set in advance. Identifying the suction hole group for sucking the substrate, and sucking the substrate from the suction hole of the specified suction hole group;
The substrate adsorption apparatus according to claim 8 or 9, wherein The control means sucks the substrate from the suction hole of the suction hole group closest to the position of the positioning mark, and does not suck from the suction holes of the other suction hole group,
The substrate suction apparatus according to claim 10. A pipe that connects the suction hole and a suction means for sucking the substrate from the suction hole for each of the suction hole groups, and a valve that is installed in the pipe and can be opened and closed independently.
The said control means controls the suction operation from the said suction hole independently for every said suction hole group by controlling the opening and closing of the said valve | bulb separately, The any one of Claim 8 thru | or 11 characterized by the above-mentioned. The substrate suction apparatus according to claim 1.   The substrate suction apparatus according to claim 8, wherein the stage includes a heater that heats a contact surface between the stage and the substrate.   The substrate adsorption device according to claim 8, wherein the substrate is a mother substrate on which a plurality of organic EL display devices are formed.

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