JP3818858B2 - Liquid processing equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a liquid processing apparatus used for a process of forming a predetermined coating film such as a resist film on a liquid crystal display (LCD) substrate or the like and removing the coating film on the peripheral edge of the substrate.
[0002]
[Prior art]
For example, in the manufacture of a liquid crystal display (LCD), a photoresist film is applied to a glass rectangular substrate to form a resist film, the resist film is exposed with a predetermined circuit pattern, and this is developed. A predetermined pattern is formed by a so-called photolithography technique.
[0003]
Such a circuit pattern is formed using a resist coating / development processing system in which a plurality of processing units are integrated. In such a system, the substrate is first subjected to surface modification / cleaning treatment by ultraviolet irradiation as necessary, and then subjected to brush cleaning and ultrasonic water cleaning by a cleaning unit. Thereafter, the substrate is subjected to a hydrophobic treatment (HMDS treatment) in an adhesion processing unit in order to increase the stability of the resist, and then the resist coating is performed in the resist coating processing unit. In this way, the substrate on which the resist film is formed is sequentially subjected to pre-baking by the heating unit, exposure of a predetermined pattern by the exposure apparatus, development processing by the development processing unit, and post-baking processing by the heating unit. A circuit pattern is formed.
[0004]
Here, the processing steps from resist application to pre-baking will be described in more detail. First, the hydrophobically treated substrate is sucked and held by a horizontally rotatable spin chuck, and the substrate is rotated after supplying the resist from the top of the substrate. Then, the resist solution is diffused by centrifugal force, and a resist film is formed on the substrate. The resist film formed by such a method has a uniform film thickness immediately after coating, but generally the surface of the substrate after the rotation of the substrate stops and the centrifugal force stops working or as time passes. Due to the influence of tension, the resist film is thickened so that it rises at the peripheral edge of the substrate, and when using such a rotating resist coating method, the resist solution shaken off from the substrate wraps around the back surface of the substrate. Adheres and solidifies.
[0005]
In this way, the film portion having a non-uniform thickness formed on the peripheral portion of the substrate and the resist adhering to the back surface cause generation of particles in the subsequent substrate transport process and the like, and also fouls the device for transporting the substrate. For this reason, conventionally, a process called edge removal is performed by discharging a processing solution such as thinner to the resist on the periphery and back surface of the substrate to dissolve and remove the resist, and the substrate is then subjected to a pre-bake process. It has been sent.
[0006]
[Problems to be solved by the invention]
In recent years, for the purpose of increasing the size and mass production of LCDs and reducing the thickness of LCDs, thinner and larger substrates have been used. Since such a thin and large substrate has a property of being easily bent, when the substrate on which the resist film is formed is moved to the edge removal position, the resist film is not affected by the bending of the substrate. Therefore, the holding means for holding the substrate during transport of the substrate is configured so that the held portion is not transferred to the substrate while securely holding the substrate. There is a need. Note that it is convenient if the holding means can be easily replaced in accordance with the size of the substrate.
[0007]
Also, since particles and the like are likely to be generated from the transport mechanism that transports the substrate by moving such holding means, be careful not to diffuse such particles toward the outside and adhere to the substrate. There is a need to. Further, at the position where the edge removal is performed, the substrate is required to be fixed with the peripheral portion being free in a state in which the substrate is less likely to be bent. It is necessary to prevent transcription from occurring.
[0008]
The present invention has been made in view of the above problems of the prior art, and provides a liquid processing apparatus provided with a transport mechanism that suppresses occurrence of transfer on a substrate while reliably holding the substrate during transport of the substrate. The purpose is to do. It is another object of the present invention to provide a liquid processing apparatus that suppresses generation of particles and the like from a substrate transport mechanism. Furthermore, an object of the present invention is to provide a liquid processing apparatus that suppresses the occurrence of transfer on a substrate while securely holding the substrate.
[0009]
[Means for Solving the Problems]
That is, according to the present invention, a liquid processing apparatus for performing predetermined liquid processing on a substrate,
A coating processing unit that includes a holding unit that holds the substrate substantially horizontally, and that forms a coating film by applying a predetermined coating solution on the surface of the substrate held by the holding unit;
A peripheral coating film removing unit that removes the coating film on the peripheral edge of the substrate on which the coating film is formed and the coating liquid adhering to the peripheral edge of the substrate;
A transport mechanism for transporting a substrate on which a coating film is formed between the coating processing unit and the peripheral coating film removing unit;
Comprising
The transport mechanism is
A suction arm for sucking and holding the substrate, and a transfer arm having a support pin for holding the substrate at the apex disposed on the top surface;
A drive mechanism for moving the transfer arm in a predetermined direction;
Have
The adsorption mechanism is
A suction pad for sucking the substrate;
Suction means for sucking so that the suction pad can suck the substrate;
A surrounding base provided with a foamable fluororesin sheet for suppressing the occurrence of transfer marks on the substrate on the upper part of a cylindrical base projecting on the upper surface of the transfer arm and surrounding the suction pad;
Have
The suction pad sinks into the enclosure by the weight of the substrate while holding the substrate when the substrate is held, and the substrate is held in contact with the foamable fluororesin sheet of the enclosure by sinking the suction pad, And the liquid processing apparatus characterized by the board | substrate being hold | maintained also in the vertex of the said support pin is provided.
[0010]
Further, according to the present invention, there is provided a liquid processing apparatus for performing predetermined liquid processing on a substrate,
A coating processing unit that coats a predetermined coating solution on the surface of the substrate to form a coating film;
A peripheral coating film removing unit that removes the coating film on the peripheral edge of the substrate on which the coating film is formed and the coating liquid adhering to the peripheral edge of the substrate;
The peripheral coating film removing unit is
A mounting plate provided with a plurality of support pins and a plurality of suction mechanisms at a predetermined position on the upper surface on which the substrate is mounted;
A removal head formed with a treatment liquid discharge nozzle for discharging a predetermined treatment liquid, a treatment liquid discharged from the treatment liquid discharge nozzle, and a treatment liquid suction nozzle for sucking a coating liquid dissolved by the treatment liquid;
Have
The adsorption mechanism is
A suction pad for sucking the substrate;
Suction means for sucking so that the suction pad can suck the substrate;
A surrounding base provided with an expandable fluororesin sheet for suppressing the occurrence of transfer marks on the substrate on the upper part of the cylindrical base that protrudes from the upper surface of the mounting plate and surrounds the suction pad;
Have
The suction pad sinks into the enclosure by the weight of the substrate while holding the substrate when the substrate is held, and the substrate is held in contact with the foamable fluororesin sheet of the enclosure by sinking the suction pad, And the liquid processing apparatus characterized by the board | substrate being hold | maintained also in the vertex of the said support pin is provided.
[ 0011 ]
According to these liquid processing apparatuses of the present invention, the transport mechanism for transporting the substrate can transport the substrate quickly because the substrate is securely held by the suction mechanism, and in part, the substrate and Since the substrate is held by the support pins having a small contact area, the occurrence of transfer on the substrate is suppressed and the quality of the substrate is kept high. In addition, when a cover and a local exhaust unit are provided in the transport mechanism that transports the substrate, particles generated by driving the transport mechanism are prevented from diffusing to the outside and contaminating the substrate, and the quality of the substrate is kept high. It becomes possible. Furthermore, when performing the process of removing the coating film on the peripheral edge of the substrate, the use of a suction mechanism and a support pin together can secure the substrate while suppressing the occurrence of transfer on the substrate, thereby improving the quality of the substrate. It can be kept high.
[ 0012 ]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the liquid processing apparatus of the present invention will be described with reference to the accompanying drawings. Here, the case where the present invention is applied to a resist coating / development processing system for an LCD substrate will be described.
[ 0013 ]
FIG. 1 is a plan view of a resist coating / development processing system 100. The resist coating / development processing system 100 includes a cassette station 1 on which a cassette C accommodating a plurality of substrates G is placed, A processing unit 2 having a plurality of processing units for performing a series of processing including development, and an interface unit 3 for transferring the substrate G to and from an exposure apparatus (not shown); A cassette station 1 and an interface unit 3 are arranged at both ends of the processing unit 2, respectively.
[ 0014 ]
The cassette station 1 includes a transport mechanism 10 for transporting the substrate G between the cassette C and the processing unit 2. Then, the cassette C is loaded and unloaded at the cassette station 1. Further, the transport mechanism 10 includes a transport arm 11 that can move on a transport path 10 a provided along the cassette arrangement direction, and the transport arm 11 can transport the substrate G between the cassette C and the processing unit 2. Done.
[ 0015 ]
The processing section 2 is divided into a front stage section 2a, a middle stage section 2b, and a rear stage section 2c. Each of the processing sections 2 has a transport path 12, 13, and 14 at the center, and each processing unit is disposed on both sides of the transport path. Yes. In addition, relay sections 15 and 16 are provided between them.
[ 0016 ]
The front stage portion 2a includes a main transport device 17 that can move along the transport path 12, and two cleaning processing units (SCRs) 21a and 21b are arranged on one side of the transport path 12, and the transport path 12, the processing block 25 in which the ultraviolet irradiation unit (UV) and the cooling unit (COL) are stacked in two stages, the processing block 26 in which the heating processing unit (HP) is stacked in two stages, and the cooling unit. A processing block 27 in which (COL) is stacked in two stages is arranged.
[ 0017 ]
Further, the middle stage 2 b includes a main transfer device 18 that can move along the transfer path 13, and a resist coating unit (CT) 22 is provided on one side of the transfer path 13. Next to the resist coating unit (CT) 22 is provided a peripheral resist removing unit (ER) 23 for removing the resist on the peripheral part of the substrate G after the resist film is formed in the resist coating unit (CT) 22. ing.
[ 0018 ]
A processing block 28 in which heat treatment units (HP) are stacked in two stages on the other side of the conveyance path 13; a processing block 29 in which a heat processing unit (HP) and a cooling processing unit (COL) are vertically stacked; In addition, a processing block 30 in which an adhesion processing unit (AD) and a cooling unit (COL) are vertically stacked is disposed.
[ 0019 ]
Further, the rear stage portion 2 c includes a main transport device 19 that can move along the transport path 14, and three development processing units (DEV) 24 a, 24 b, and 24 c are arranged on one side of the transport path 14. On the other side of the conveyance path 14, the heat treatment unit (HP) is stacked in two stages, and the heat treatment unit (HP) and the cooling processing unit (COL) are stacked vertically. Processing blocks 32 and 33 are arranged.
[ 0020 ]
The processing unit 2 has only spinner units such as a cleaning processing unit 21a, a resist coating processing unit (CT) 22 and a development processing unit (DEV) 24a on one side across the conveyance path. Only the heat treatment unit such as the heat treatment unit or the cooling treatment unit is arranged on the other side. Further, a chemical solution supply unit 34 is disposed at a portion of the relay units 15 and 16 on the side where the spinner system unit is disposed, and a space 35 is provided for maintenance of the main transfer device.
[ 0021 ]
Each of the main transport devices 17, 18, and 19 includes a two-direction X-axis drive mechanism, a Y-axis drive mechanism, and a vertical Z-axis drive mechanism in a horizontal plane, and further, a rotational drive that rotates about the Z-axis. It has a mechanism, and each has an arm for supporting the substrate G.
[ 0022 ]
The main transfer device 17 has a transfer arm 17a, transfers the substrate G to and from the transfer arm 11 of the transfer mechanism 10, and carries in / out the substrate G to / from each processing unit of the front stage 2a, and further relays 15 has a function of transferring the substrate G to and from 15. The main transfer device 18 includes a transfer arm 18a, transfers the substrate G to and from the relay unit 15, and loads / unloads the substrate G to / from each processing unit of the middle stage unit 2b. A function of delivering the substrate G between the two. Further, the main transfer device 19 has a transfer arm 19a, transfers the substrate G to and from the relay unit 16, and loads / unloads the substrate G to / from each processing unit of the rear stage unit 2c. A function of delivering the substrate G between the two. The relay parts 15 and 16 also function as cooling plates.
[ 0023 ]
The interface unit 3 includes an extension 36 that temporarily holds a substrate when the substrate is transferred to and from the processing unit 2, two buffer stages 37 that are provided on both sides of the substrate and that are provided with buffer cassettes, and these And a transfer mechanism 38 that carries in and out the substrate G between the exposure apparatus (not shown). The transport mechanism 38 includes a transport arm 39 that can move on a transport path 38 a provided along the arrangement direction of the extension 36 and the buffer stage 37. The transport arm 39 allows the substrate G to be transferred between the processing unit 2 and the exposure apparatus. Is carried out.
[ 0024 ]
By consolidating and integrating the processing units in this way, it is possible to save space and improve processing efficiency.
[ 0025 ]
In the resist coating / development processing system configured as described above, the substrate G in the cassette C is transported to the processing unit 2, and the processing unit 2 first uses the ultraviolet irradiation unit (UV) of the processing block 25 of the preceding stage 2 a. After surface modification / cleaning processing is performed and cooling is performed by the cooling processing unit (COL), scrubber cleaning is performed by the cleaning processing units (SCR) 21a and 21b, and any of the heating processing units (HP) of the processing block 26 is performed. ) And then cooled by any one of the cooling units (COL) in the processing block 27.
[ 0026 ]
Thereafter, the substrate G is transported to the middle stage 2b and subjected to a hydrophobic treatment (HMDS process) by an upper adhesion processing unit (AD) in the upper block of the processing block 30 in order to improve the resist fixing property, and then the lower cooling process. It is cooled by the unit (COL). Next, a resist is applied to the substrate G in a resist application processing unit (CT) 22.
[ 0027 ]
In this resist coating process, for example, before supplying the resist solution to the substrate G, a processing solution such as thinner is supplied while rotating the substrate G to improve the wettability of the surface of the substrate G to the resist solution. Then, the substrate G is temporarily stopped, the resist solution is supplied to the substrate G, and then the substrate G is rotated again to spread the resist solution over the entire surface of the substrate G, whereby a resist film is formed.
[ 0028 ]
After the processing in the resist coating unit (CT) 22 is completed, the substrate G is transferred to the peripheral resist removal unit (ER) 23, where the resist on the peripheral portion of the substrate G is removed (hereinafter, such processing is performed). "Edge remove") is performed. Edge remove refers to a process of removing the resist at the peripheral edge of the surface of the substrate G on which the resist film is formed and removing the resist adhering to the side surface of the substrate G and the back surface of the substrate G.
[ 0029 ]
Thereafter, the substrate G is pre-baked by one of the heat treatment units (HP) in the middle stage 2b and cooled by the lower cooling unit (COL) of the processing block 29 or 30. Next, the substrate G is transported from the relay section 16 to the exposure apparatus via the interface section 3 by the main transport apparatus 19, where a predetermined pattern is exposed. And the board | substrate G is again carried in via the interface part 3, and after performing a post-exposure baking process in the heat processing unit (HP) of the process blocks 31, 32, and 33 of the back | latter stage part 2c as needed, Development processing is performed in one of the development processing units (DEV) 24a, 24b, and 24c, and a predetermined circuit pattern is formed.
[ 0030 ]
The developed substrate G is subjected to a post-baking process in any one of the heat treatment units (HP) in the rear stage 2c, and is then cooled in any cooling unit (COL). 18 and 17 and the transport mechanism 10 are accommodated in a predetermined cassette C on the cassette station 1.
[ 0031 ]
In such a resist coating / development processing system 100, the adjacent resist coating processing unit (CT) 22 and the peripheral resist removal unit (ER) 23 do not provide a boundary wall between these units, It is possible to provide a continuous structure that can be moved from one unit to the other unit. In this case, a resist film is formed on the front surface in the resist coating unit (CT) 22 and the substrate G having a resist solution attached on the back surface is transported to the peripheral resist removal unit (ER) 23 using the transport arm 18a. Therefore, contamination of the transfer arm 18a by the resist solution adhering to the back surface of the substrate G can be prevented, and contamination of the transfer arm 18a can be prevented from further spreading to adjacent processing units.
[ 0032 ]
The plan view of FIG. 2 and the cross-sectional view of FIG. 3 show an embodiment in which a resist coating unit (CT) 22 and a peripheral resist removal unit (ER) 23 are connected in series. Hereinafter, the transfer mechanism 50 that transfers the substrate G between the resist coating unit (CT) 22 and the peripheral resist removing unit (ER) 23 and between the resist coating unit (CT) 22 and the peripheral resist removing unit (ER) 23. This will be described in detail.
[ 0033 ]
The resist coating processing unit (CT) 22 includes a spin chuck 41 that is configured to hold the substrate G substantially horizontally and is rotatable, an inner cup 42 a provided so as to surround the spin chuck 41, and an inner cup 42 a. An outer cup 42b provided so as to surround, a scattering prevention cover 42c provided so as to surround the outer cup 42b in order to prevent scattering of the resist solution, and the elevating and closing that opens and closes the upper surface opening of the inner cup 42a. An inner lid 43a that can be moved and an outer lid 43b that can be raised and lowered to open and close the upper surface opening of the outer cup 42b. The resist coating unit (CT) 22 rotates a head 44 provided with a resist solution supply nozzle for applying a resist solution to the substrate G held by the spin chuck 41 and a thinner supply nozzle for applying a thinner. Arm 45 is provided.
[ 0034 ]
The spin chuck 41 can be moved up and down by a lifting mechanism (not shown), and the spin chuck 41 transfers the substrate G to and from the transfer arm 18a of the main transfer device 18 at a position higher than the upper surface of the anti-scattering cover 42c. In addition, the substrate can be transferred to and from the transfer arm 51 of the transfer mechanism 50.
[ 0035 ]
The peripheral resist removing unit (ER) 23 includes a stage 93 for placing the substrate G, an unillustrated lifting mechanism for lifting the stage 93, and a stage 93 for positioning the substrate G placed on the stage 93. An alignment mechanism 91 provided at two corners; and a remover head 92 for removing the resist film formed on the peripheral edge of the substrate G and the resist adhering to the side and back surfaces of the substrate G from the substrate G. The remover head 92 is provided on each of the four sides of the substrate G.
[ 0036 ]
A plan view showing a more detailed structure of the stage 93 is shown in FIG. At predetermined positions on the surface of the stage 93, support pins 95 that abut the substrate G and hold the substrate G, and an adsorption mechanism 96 that adsorbs the substrate G and holds the substrate G are disposed. FIG. 5A shows a cross-sectional view showing an embodiment of the support pin 95, FIG. 5B shows a cross-sectional view showing an embodiment of the suction mechanism 96, and FIG. 6 shows the substrate G on the stage 93. The explanatory view showing the mode of operation of adsorption mechanism 96 at the time of mounting is shown.
[ 0037 ]
As shown in FIG. 5 (a), the support pin 95 is composed of an apex portion 95a, an upper step portion 95b, and a lower step portion 95c and has a step structure, and the outer diameter d2 (for example, 5 mmφ) of the lower step portion 95c. ) Larger than the outer diameter d1 (for example, 2 mmφ) of the upper stage portion 95b, sufficient mechanical strength for holding the substrate G is ensured. Further, by reducing the outer diameter d1 of the upper step portion 95b and forming the apex portion 95a in a substantially spherical shape, the contact area between the substrate G and the support pins 95 is reduced, and the support pins 95 come into contact with the substrate G. This suppresses the transfer from occurring on the substrate G.
[ 0038 ]
As a material constituting such a support pin 95, a predetermined mechanical strength is ensured, and the hardness of the apex portion 95a is smaller than that of the substrate G so that the substrate G is not damaged. Below, it is preferable to use a material whose physical properties such as thermal conductivity are close to those of the substrate G. For example, a composite material mainly composed of polybenzimidazole and carbon fiber can be used. Such a composite material molded body can be easily mass-produced by, for example, injection molding or the like, and therefore it is easy to reduce the apparatus cost.
[ 0039 ]
As shown in FIG. 5B, the suction mechanism 96 includes a suction pad 97 and a cylindrical body 98 disposed so as to surround the suction pad 97. The suction pad 97 includes a mortar-shaped suction portion 97a having a suction hole 97c for suction in the center, and a base portion 97b that holds the suction portion 97a. The suction hole 97c penetrates the base portion 97b. is doing. The cylindrical body 98 has a structure in which a sheet 98a is provided on the upper surface of the base 98b.
[ 0040 ]
As shown in FIG. 6, when the substrate G is transferred onto the stage 93, the substrate G first comes into contact with the upper surface of the suction portion 97 a of the suction pad 97. When suction is performed from the suction hole 97c using a suction means (not shown) in this state, the suction portion 97a firmly sucks the substrate G, and the boundary portion between the suction portion 97a and the base portion 97b is seated by its own weight. The upper surface position of the adsorption part 97a is lowered by bending. Thus, the substrate G abuts on the upper surface of the cylindrical body 98, that is, the sheet 98a, abuts on the apex of the support pin 95, and is held on the stage 93. Since the sheet 98a contacts the substrate G and holds the substrate G, for example, a resin material such as a foamable fluororesin sheet is preferably used.
[ 0041 ]
The reason why the support pin 95 and the suction mechanism 96 are mixed on the stage 93 is as follows. That is, the support pin 95 does not have a large force for fixing the substrate G in order to hold the substrate G only by the frictional force generated by the weight of the substrate G. For this reason, if the substrate G is held on the stage 93 only by the support pins 95, there is an advantage that transfer to the substrate G is difficult to occur. On the other hand, the substrate G moves during the edge removal, and the edge removal within a predetermined range. May not be able to be performed.
[ 0042 ]
On the other hand, since the suction mechanism 96 can hold the substrate G with a forced suction force, it is advantageous in that the force for fixing the substrate G is strong and edge removal within a predetermined range can be performed. Since the contact area between 97a and the substrate G is increased, there is a problem that transfer is easily generated on the substrate G. Therefore, by arranging the support pins 95 and the suction mechanism 96 together, the substrate G is fixed on the stage 93 with the minimum necessary force, and the generation of the transfer on the substrate G is suppressed, so that the quality of the substrate G is improved. Can be kept high.
[ 0043 ]
FIG. 7 is a plan view showing an example of the arrangement positions of the support pins 95 and the suction mechanism 96 when four panels are taken out from one substrate G as a product. As shown in FIG. 7, the suction mechanism 96 is arranged in the outside product area E of the substrate G (the region excluding the product areas P1 to P4 of the four panels from the entire substrate G), and the inside of the product regions P1 to P4 is arranged. When it is necessary to hold the support pins 95, the support pins 95 are disposed in the product regions P1 to P4. By arranging the support pins 95 and the suction mechanism 96 in this way, it is possible to suppress the generation of transfer marks and maintain the product quality high.
[ 0044 ]
On the other hand, when the space between the product regions P1 to P4 is narrow or when the space between the product regions P1 to P4 and the outer periphery of the substrate G is narrow, the suction mechanism 96 inevitably enters the product regions P1 to P4. The suction mechanism 96 is arranged so as to straddle two of the product regions P1 to P4 across the narrow product outer region E, or to be placed on the edge portion of the product regions P1 to P4. When it is necessary to hold the inside of P1 to P4, the support pins are arranged in the product areas P1 to P4.
[ 0045 ]
In this way, it is possible to prevent the transfer trace from being generated in the central portion of the product areas P1 to P4, and even if the transfer trace is generated by the suction mechanism 96, the product areas P1 to P4 are the peripheral portions of the product areas P1 to P4. As a result, it can be suppressed to a level that does not hinder use. In addition, in the part which the board | substrate G contact | abuts the sheet | seat 98a formed in the upper part of the cylindrical body 98 which comprises the outer periphery of the adsorption | suction mechanism 96, since it is suppressed that a transfer trace generate | occur | produces on the board | substrate G, product region P1- It is also possible to suppress the generation of the transfer trace into P4.
[ 0046 ]
As shown in the sectional view of FIG. 3, the remover head 92 has a substantially U-shaped cross section so as to sandwich the periphery of the substrate G. The remover head 92 dissolves the resist in the substrate G. A processing liquid, for example, a thinner discharge nozzle (not shown) for discharging thinner, and a thinner suction nozzle (not shown) for sucking thinner discharged from the thinner discharge nozzle are formed, and the remover head 92 is a substrate. It is configured to move along each of the four sides of G. In this way, when the remover head 92 is moved along each side of the substrate G, the four sides of the substrate G can be removed by sucking the discharged thinner and the dissolved resist while discharging the thinner. It can be done.
[ 0047 ]
Next, the structure of the transport mechanism 50 that transports the substrate G between the resist coating unit (CT) 22 and the peripheral resist removal unit (ER) 23 will be described. FIG. 8 is a plan view showing the structure of the transport mechanism 50. In FIG. 8, the resist coating unit (CT) 22 and the peripheral resist removing unit (ER) 23 are not shown. FIG. 9 is a schematic cross-sectional view of the transport mechanism 50 as seen from the transport direction of the substrate G.
[ 0048 ]
As shown in FIGS. 2, 3, 8, and 9, the transfer mechanism 50 includes transfer arms 51 a and 51 b that hold the substrate G, support columns 52 a and 52 b that hold the transfer arms 51 a and 51 b, and support columns, respectively. Guides 53a and 53b respectively fitted to 52a and 52b, a rotation drive motor 58 provided at one end in the moving direction of the transfer arms 51a and 51, a shaft 56a attached to the rotation drive motor 58, and a shaft 56a The pulleys 57a and 57b attached to the shaft, the shaft 56b provided at the other end in the moving direction of the transfer arms 51a and 51b, the pulleys 57c and 57d attached to the shaft 56b, and the pulleys 57a and 57c. A belt 55a, a belt 55b installed between the pulleys 57b and 57d, and a belt 55a; A connecting member 54a for connecting the pillars 52a, has a connecting member 54b for connecting the belt 55b and the strut 52 b, and a cover 59a · 59b, a.
[ 0049 ]
As shown in FIGS. 8 and 9, rails 75a and 75b are formed on the guides 53a and 53b, respectively, and the columns 52a and 52b are fitted to the rails 75a and 75b, respectively. However, the form of fitting of the columns 52a and 52b to the guides 53a and 53b is merely an example, and guides of other structures may be used as long as the columns 52a and 52b can be guided in a predetermined direction. .
[ 0050 ]
In the transport mechanism 50, the shaft 56b and the pulleys 57c and 57d are rotatable about the axis of the shaft 56b. When the rotary drive motor 58 is rotated in a predetermined direction, the shaft 56a and the pulleys 57a and 57b are rotated simultaneously. The belts 55a and 55b rotate. Here, since the support columns 52a and 52b are connected to the belts 55a and 55b by the connecting members 54a and 54b, respectively, when the belts 55a and 55b rotate, the support columns 52a and 52b simultaneously move in the same direction, and the transfer arms 51a and 52b move. 51b moves.
[ 0051 ]
When the rotary drive motor 58 is driven, the rotary drive motor 58 and the sliding portion between the belt 55a and the pulleys 57a and 57c, the sliding portion between the belt 55b and the pulleys 57b and 57d, and the shaft 56a Particles and the like are generated from the sliding portion holding 56b. In the drive mechanism 50, covers 59a and 59b are provided to prevent such diffusion of particles and the like to the outside, and local exhaust is performed directly from the vicinity of these sliding portions, thereby providing a predetermined exhaust path. After that, particles are collected and discarded. In this way, adhesion of particles or the like to the substrate G is prevented, and the quality of the substrate G can be kept high.
[ 0052 ]
The transport arm 51a is composed of a connecting portion 71a and a gripping portion 72a connected to the support column 52a, and the transport arm 51b is similarly composed of a connecting portion 71b and a gripping portion 72b. An adsorption mechanism 73 that adsorbs and holds the substrate G and a support pin 74 that abuts the substrate G and holds the substrate G are formed on the upper surfaces of the gripping portions 72a and 72b. Here, the suction mechanism 73 sucks and holds the substrate G at the end portion of the substrate G and holds the inner side of the substrate G by the support pins 74 so that transfer does not occur in the portion of the substrate G where the electrode pattern is formed. In addition, the positions of the suction mechanism 73 and the support pin 74 are preferably determined. Thus, by providing the suction mechanism 73 and the support pins 74 in the transport arms 51a and 51b, the substrate G can be firmly held and transported at a high speed to improve the throughput. Generation of transfer in G can be prevented.
[ 0053 ]
As the suction mechanism 73 and the support pin 74, those having the same structure as the suction mechanism 96 and the support pin 95 disposed on the stage 93 of the peripheral resist removal unit (ER) 23 can be used. However, when the transfer arms 51a and 51b receive the substrate G held by the spin chuck 41, the substrate G is in a substantially horizontal state. However, when the transfer arms 51a and 51b hold the substrate G, FIG. Therefore, when the suction mechanism 96 is used as the suction mechanism 73, the suction pad 97 can be tilted in accordance with the bending of the substrate G. Thus, it is also preferable to use one that does not have the cylindrical body 98.
[ 0054 ]
As shown in FIG. 9, the transfer arms 51 a and 51 b hold the substrate G more securely so that the tip ends of the gripping portions 72 a and 72 b do not contact the substrate G when the substrate G is bent. In order to do so, the substrate G is disposed in a state of being inclined so that the inner side faces downward by an angle θ according to the bending of the substrate G. Here, FIG. 9 shows a form in which the angles of the entire transport arms 51a and 51b are inclined, but a structure in which only the gripping portions 72a and 72b are inclined is also possible.
[ 0055 ]
In the transfer arm 51a, since the connecting portion 71a and the gripping portion 72a are detachable, a gripping portion having an appropriate size according to the size of the substrate G is attached or formed on the substrate G. A gripping part in which the suction mechanism 73 and the support pin 74 are arranged can be attached at an appropriate position according to the electrode pattern. The structure in which the connecting portion and the gripping portion are detachable is the same for the transfer arm 51b. In this way, while dealing quickly with differences in the size, electrode pattern, etc. of the substrate G handled by a single device, the reliability of the transfer of the substrate G is maintained, and the generation of transfer on the substrate G is prevented and the quality is improved. It becomes possible to hold.
[ 0056 ]
Note that, for example, the transport arm 51a may be configured to be detachable from the support column 52a as an integral structure in which the connecting portion 71a and the gripping portion 72a are not detachable without being detachable.
[ 0057 ]
As described above, in the resist coating processing step in the unit constituted by the resist coating processing unit (CT) 22, the peripheral resist removal unit (ER) 23, and the transport mechanism 50, for example, the spin chuck 41 is first raised to a predetermined position. Then, the substrate G is transferred from the transfer arm 18a to the spin chuck 41, and the spin chuck 41 is lowered to a predetermined position. Next, the spin chuck 41 is rotated with the upper surfaces of the inner cup 42a and the outer cup 42b open, and thinner is applied to the rotating substrate G to improve the wettability of the substrate G to the resist solution. The rotation of the spin chuck 41 is stopped and the resist solution is applied to the substrate G to rotate the substrate G, or the resist solution is applied to the substrate G while the spin chuck 41 is rotated at a predetermined number of rotations. After the film is formed, the resist film thickness is adjusted by rotating the substrate G with the upper surfaces of the inner cup 42a and the outer cup 42b closed by the inner lid 43a and the outer lid 43b, respectively.
[ 0058 ]
With the inner lid 43a and outer lid 43b retracted, the upper surfaces of the inner cup 42a and outer cup 42b are opened, and the spin chuck 41 is raised to a predetermined position, the transfer arms 51a and 51b are positioned below the substrate G. The transport mechanism 50 is operated as described above. When the spin chuck 41 is lowered in this state, the substrate G is naturally held by the transfer arms 51a and 51b. When the transfer arms 51 a and 51 b are slid to the peripheral resist removal unit (ER) 23 side and the stage 93 is raised from below the substrate G, the substrate G is transferred to the stage 93. The transfer arms 51a and 51b are retracted to lower the stage 93 to a predetermined position, the position of the substrate G is adjusted by the alignment mechanism 91, and the edge removal by the remover head 92 is performed. The substrate G that has been subjected to the edge removal is transferred to the transport arm 18a with the stage 93 raised to a predetermined height, and is transported, for example, to the heat treatment unit (HP) of the processing block 28 to perform pre-bake processing.
[ 0059 ]
As mentioned above, although embodiment of this invention has been described, this invention is not limited to the said embodiment. For example, the transport mechanism 50 is used for transporting the substrate between the resist coating unit (CT) 22 and the peripheral resist removal unit (ER) 23, but the transport mechanism 50 transports the substrate G to an adjacent unit. The mechanism can be applied without limitation. Further, the structure of the stage 93 in which the support pin 95 and the suction mechanism 96 are used together to place the substrate G is not only usable for the peripheral resist removal unit (ER) 23, but other units, for example, It can also be used for cleaning processing units (SCR) 21a and 21b. Furthermore, in the above-described embodiment, the LCD substrate has been described as the substrate, but other substrates such as a semiconductor wafer and a CD substrate may be used.
[ 0060 ]
【The invention's effect】
As described above, according to the liquid processing apparatus of the present invention, the transport mechanism for transporting the substrate can transport the substrate quickly because the substrate is securely held by the suction mechanism, and the throughput can be improved. There is an effect that becomes possible. In addition, since the transport mechanism partially holds the substrate with the support pins having a small contact area with the substrate, the transfer is suppressed from being generated on the substrate, so that the quality of the substrate is kept high. Further, when a cover and a local exhaust means are provided in the transport mechanism for transporting the substrate, particles generated by driving the transport mechanism are prevented from diffusing to the outside and contaminating the substrate, and the quality of the substrate is kept high. The effect that it can be obtained. Furthermore, by using a suction mechanism and support pins together on the stage where the substrate is placed, it is possible to maintain the substrate quality while suppressing the occurrence of transfer on the substrate while securely fixing the substrate. The effect which becomes.
[Brief description of the drawings]
FIG. 1 is a plan view showing a resist coating / developing system that is an embodiment of a liquid processing apparatus of the present invention.
FIG. 2 is a plan view showing a resist coating unit and a peripheral resist removing unit.
FIG. 3 is a cross-sectional view showing a resist coating unit and a peripheral resist removing unit.
FIG. 4 is a plan view showing a schematic structure of a stage of a peripheral resist removal unit.
FIG. 5 is a cross-sectional view showing a schematic structure of a support pin and a suction mechanism provided on the stage of the peripheral resist removal unit.
FIG. 6 is an explanatory diagram showing an operation mode of a suction mechanism provided on the stage of the peripheral resist removal unit.
FIG. 7 is a plan view showing an arrangement example of support pins and suction mechanisms with respect to a product region of a substrate.
FIG. 8 is a plan view showing a schematic structure of a transport mechanism for transporting a substrate between a resist coating unit and a peripheral resist removal unit.
FIG. 9 is a cross-sectional view showing a schematic structure of a transport mechanism for transporting a substrate between a resist coating unit and a peripheral resist removal unit.
[Explanation of symbols]
22: Resist coating unit
23: Peripheral resist removal unit
50; Transport mechanism
51a, 51b; Transfer arm
52a, 52b; support
53a, 53b; Guide
54a, 54b; connecting member
55a, 55b; belt
56a, 56b; shaft
57a-57d; pulley
58; Rotation drive motor
59a, 59b; cover
71a, 71b; connecting part
72a, 72b; gripping part
73; Adsorption mechanism
74; Support pin
95; Support pin
96; Adsorption mechanism
100; resist coating / development processing system
E: Out-of-product area
G: Substrate (LCD substrate)
P1 to P4: Product area

Claims (9)

A liquid processing apparatus for performing predetermined liquid processing on a substrate,
A coating processing unit that includes a holding unit that holds the substrate substantially horizontally, and that forms a coating film by applying a predetermined coating solution on the surface of the substrate held by the holding unit;
A peripheral coating film removing unit that removes the coating film on the peripheral edge of the substrate on which the coating film is formed and the coating liquid adhering to the peripheral edge of the substrate;
A transport mechanism for transporting a substrate on which a coating film is formed between the coating processing unit and the peripheral coating film removing unit;
Comprising
The transport mechanism is
A suction arm for sucking and holding the substrate, and a transfer arm having a support pin for holding the substrate at the apex disposed on the top surface;
A drive mechanism for moving the transfer arm in a predetermined direction;
Have
The adsorption mechanism is
A suction pad for sucking the substrate;
Suction means for sucking so that the suction pad can suck the substrate;
A surrounding base provided with a foamable fluororesin sheet for suppressing the occurrence of transfer marks on the substrate on the upper part of a cylindrical base projecting on the upper surface of the transfer arm and surrounding the suction pad;
Have
The suction pad sinks into the enclosure by the weight of the substrate while holding the substrate when the substrate is held, and the substrate is held in contact with the foamable fluororesin sheet of the enclosure by sinking the suction pad, The substrate is also held at the top of the support pin.   The suction mechanism is disposed so as to hold the substrate at a peripheral portion of the substrate, and the support pins are disposed so as to hold the substrate inside the substrate from a position where the suction mechanism holds the substrate. The liquid processing apparatus according to claim 1. The two transfer arms are arranged to face each other so as to support the substrate from both sides of the substrate and hold the substrate,
In accordance with the bending of the substrate that occurs so that the position of the center portion of the substrate is lowered when the two transfer arms hold the substrate, the two transfer arms have a low height on the center side of the substrate. The liquid processing apparatus according to claim 1, wherein the liquid processing apparatus is provided with an inclination so that the height on the peripheral side is increased. The transfer arm is
A connecting portion connected to the drive mechanism;
The connecting portion and a detachable gripping portion;
The liquid processing apparatus according to any one of claims 1 to 3, wherein gripping portions having different shapes and / or sizes corresponding to the size of a substrate to be handled are attached to the connecting portion. . A liquid processing apparatus for performing predetermined liquid processing on a substrate,
A coating processing unit that coats a predetermined coating solution on the surface of the substrate to form a coating film;
A peripheral coating film removing unit that removes the coating film on the peripheral edge of the substrate on which the coating film is formed and the coating liquid adhering to the peripheral edge of the substrate;
The peripheral coating film removing unit is
A mounting plate provided with a plurality of support pins and a plurality of suction mechanisms at a predetermined position on the upper surface on which the substrate is mounted;
A removal head formed with a treatment liquid discharge nozzle for discharging a predetermined treatment liquid, a treatment liquid discharged from the treatment liquid discharge nozzle, and a treatment liquid suction nozzle for sucking a coating liquid dissolved by the treatment liquid;
Have
The adsorption mechanism is
A suction pad for sucking the substrate;
Suction means for sucking so that the suction pad can suck the substrate;
A surrounding base provided with an expandable fluororesin sheet for suppressing the occurrence of transfer marks on the substrate on the upper part of the cylindrical base that protrudes from the upper surface of the mounting plate and surrounds the suction pad;
Have
The suction pad sinks into the enclosure by the weight of the substrate while holding the substrate when the substrate is held, and the substrate is held in contact with the foamable fluororesin sheet of the enclosure by sinking the suction pad, The substrate is also held at the top of the support pin. Furthermore, it comprises a transport mechanism for transporting the substrate on which the coating film is formed between the coating processing unit and the peripheral coating film removing unit,
The transport mechanism is
A suction arm for sucking and holding the substrate, and a transfer arm having a support pin for holding the substrate at the apex disposed on the top surface;
A drive mechanism for moving the transfer arm in a predetermined direction;
Have
The suction mechanism of the transfer arm is
A suction pad for sucking the substrate;
Suction means for sucking so that the suction pad can suck the substrate;
A surrounding base provided with a foamable fluororesin sheet for suppressing the occurrence of transfer marks on the substrate on the upper part of a cylindrical base projecting on the upper surface of the transfer arm and surrounding the suction pad;
Have
The suction pad sinks into the enclosure by the weight of the substrate while holding the substrate when the substrate is held, and the substrate is held in contact with the foamable fluororesin sheet of the enclosure by sinking the suction pad, The liquid processing apparatus according to claim 5, wherein the substrate is also held at the apex of the support pin. A dust cover that covers the drive mechanism so that particles generated in the drive mechanism do not diffuse outside;
A local dust collection mechanism for sucking particles generated in the drive mechanism;
The liquid processing apparatus according to any one of claims 1 to 6 , wherein the liquid processing apparatus includes: The drive mechanism is
A first pulley provided on the coating processing apparatus side;
A second pulley provided on the peripheral coating film removing device side;
A belt constructed between the first and second pulleys;
A rotation drive mechanism that rotates either the first pulley or the second pulley, and
The liquid processing apparatus according to claim 7 , wherein the local dust collection mechanism is provided in the vicinity of the first and second pulleys. Using a molded body of a composite material mainly composed of polybenzimidazole and carbon fiber as the support pin,
The support pin has a step structure composed of a lower portion with an outer diameter and an upper portion with a thin outer diameter so as to maintain a predetermined mechanical strength,
9. The liquid processing apparatus according to claim 1, wherein an apex portion at an upper portion of the support pin is formed in a substantially spherical shape so as to reduce a contact area with the substrate. .

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