JP3686241B2 - Processing method and processing apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a processing method and a processing apparatus for applying a processing liquid such as a developer to the surface of a substrate such as an LCD substrate or a semiconductor wafer.
[0002]
[Prior art]
Generally, in the manufacturing process of a liquid crystal display (LCD) device, photolithography similar to that used in a semiconductor manufacturing process to form, for example, an ITO (Indium Tin Oxide) thin film or an electrode pattern on an LCD substrate. Using a technique, a circuit pattern or the like is exposed to a photoresist on the surface of the LCD substrate, and then a series of processes for developing the LCD substrate is performed.
[0003]
Here, the developing device that performs the development processing of the LCD substrate is one of the devices that require the strictest control in a series of processing. That is, when developing, the developer is supplied to the surface of the exposed LCD substrate placed on the spin chuck to form a developer layer having a predetermined thickness over the entire surface of the LCD substrate. It is important to uniformly develop the surface of the LCD substrate for a predetermined time. As a method for supplying a developing solution to the surface of the LCD substrate, a paddle method, a dip method, a spray method, and the like are conventionally known.
[0004]
Among these, in particular, the paddle method scans the surface of the LCD substrate placed horizontally on the spin chuck with a developer supply nozzle having a large number of discharge ports, and supplies the developer to the entire surface of the LCD substrate as a puddle. This method is widely used because the developer can be reliably supplied to every corner of the entire surface of the LCD substrate.
[0005]
[Problems to be solved by the invention]
By the way, in recent years, the LCD substrate tends to increase in size in order to improve productivity. However, in the conventional developing device as shown in FIG. 11, the placement area of the spin chuck 100 becomes relatively small with respect to the enlarged LCD substrate G, and when the enlarged LCD substrate G is placed. The horizontal posture of the LCD substrate G becomes unstable. That is, due to the weight of the peripheral edge of the LCD substrate G that cannot be fully placed on the top surface of the spin chuck 100, the LCD substrate G itself bends and tilts. For this reason, after supplying the developing solution, the developing solution moves to the bent portion of the LCD substrate G, and a non-uniform liquid layer of the developing solution is formed on the surface of the LCD substrate G. In particular, processing failure may occur in a thin portion of the liquid layer generated by the bias of the developing solution.
[0006]
Here, it is considered that the above-mentioned problem can be solved if the mounting area of the spin chuck 100 is widened. However, the larger the size of the spin chuck 100, the higher the manufacturing cost. In the spin chuck 100 placed on the substrate, the air suction amount increases. Further, in order to clean the developer that has come around the back surface of the LCD substrate G from below, an area where the spin chuck is not in contact with the back surface of the LCD substrate G is necessary. Accordingly, the possibility of particles adhering to the LCD substrate G is increased, which is not practical.
[0007]
The present invention has been made in view of the above points, and even if the horizontal posture of the substrate to be processed is unstable or the peripheral edge is bent, the thickness required for the processing with respect to the surface is reduced. It is an object of the present invention to provide a processing method capable of forming a liquid layer of a processing liquid having a liquid crystal and a processing apparatus capable of suitably carrying out the processing method to solve the above problems.
[0008]
[Means for Solving the Problems]
To achieve the above object, the invention of claim 1 is a method of holding a substrate horizontally in a method of supplying a treatment liquid to the surface of a horizontally held substrate and performing a predetermined treatment on the substrate. When, at least the peripheral portion of the surface of the substrate, at a position not in contact with the surface of the substrate, placing at predetermined intervals a processing solution holding means of the frame that are hollow central portion on the substrate, wherein And a step of supplying the processing liquid to the surface of the substrate to a thickness at least contacting with the processing liquid holding means after the processing liquid holding means is disposed . According to this processing method, the processing liquid is held by the processing liquid holding means due to the surface tension of the processing liquid. Therefore, the processing liquid does not move to the bent portion of the surface of the substrate, and a liquid layer of the processing liquid having a thickness necessary for the processing can be formed over the entire surface of the substrate. Accordingly, it is possible to prevent processing defects due to movement or bias of the processing liquid.
[0009]
According to a second aspect of the present invention, in a method of supplying a processing liquid to the surface of a horizontally held substrate and performing a predetermined treatment on the substrate, the step of holding the substrate horizontally, and the substrate A process liquid holding means having a substantially U-shaped side surface covering the peripheral edge of the substrate at a position that does not contact the surface of the substrate at least at the peripheral edge of the surface of the substrate ; A step of supplying the processing liquid to the surface of the substrate to a thickness at least contacting the processing liquid holding means after the processing liquid holding means is arranged may be provided.
[0011]
The invention of claim 3 is a processing apparatus comprising holding means for holding the substrate horizontally and supply means for supplying a processing liquid to the surface of the substrate held by the holding means,
In at least the peripheral surfaces of the substrate, at a position not in contact with the surface of the substrate, and which is movable to a position in contact with the processing liquid supplied to the surface of the substrate, comprising a treatment liquid holding means, said processing liquid retaining The means provides a processing apparatus characterized in that it has a frame shape in which a central portion is cut out .
[0012]
In this case, as described in claim 4 , if the processing liquid holding means is suspended above the surface of the substrate, the processing liquid holding means can easily come into contact with the processing liquid supplied to the surface of the substrate. Can be placed at
[0013]
According to claim 5, there is provided a processing apparatus comprising holding means for horizontally holding a substrate and supply means for supplying a processing liquid to the surface of the substrate held by the holding means, wherein at least the surface of the substrate A treatment liquid holding means which is movable to a position at a peripheral edge where the substrate does not contact the surface of the substrate and a position which comes into contact with the processing liquid supplied to the surface of the substrate; A processing apparatus is provided in which a side surface covering the portion is substantially U-shaped.
Further, as described in claim 6, the supporting means for supporting the peripheral edge of the substrate from below may be provided, and at least the substrate may be disposed at a position facing the supporting means with the substrate interposed therebetween. As described in Item 7, it is more preferable that the treatment liquid holding means is supported by the support means. In any configuration, by adding not only the treatment liquid holding means but also the support means, the substrate itself can be prevented from being bent and the formation of a uniform treatment liquid layer can be promoted.
[0014]
If the processing liquid holding means has a mesh shape, as described above, the liquid layer of the processing liquid can be effectively held with minimal contact.
[0015]
Further, the processing liquid holding means may be provided with a nozzle mechanism for supplying the processing liquid to the surface of the substrate. According to such a configuration, the supply of the processing liquid and the maintenance of the thickness of the liquid layer of the processing liquid can be performed by one means. Therefore, the processing device can be simplified and the processing time can be shortened.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a perspective view of a coating and developing processing system that incorporates a developing device 18 as a processing device according to the present embodiment and performs a series of photolithography processes on an LCD substrate G.
[0017]
The coating and developing processing system 1 includes, for example, a loader unit 2 that carries in and out a rectangular LCD substrate G, a first processing unit 3 that processes the LCD substrate G, and the first processing unit 3 and the interface unit 4. And an interface unit 7 for transferring the LCD substrate G between the second processing unit 5 and, for example, the exposure apparatus 6 or the like.
[0018]
The loader unit 2 is provided with a cassette station 10. The cassette station 10 includes a plurality of cassettes 11 for storing unprocessed LCD substrates G and a plurality of cassettes 12 for storing processed LCD substrates G. It can be placed freely. In addition, the loader unit 2 is provided with a sub-transport arm 13 for loading or unloading an unprocessed LCD substrate G. The sub transfer arm 13 is configured to be movable in the Y and Z directions and to be rotated in the θ direction.
[0019]
In the first processing unit 3, various processing apparatuses that perform predetermined processing on the LCD substrate G are arranged on both sides of the transport path 16 of the main transport arm 15. A brush cleaning device 17 and a developing device 18 for cleaning the LCD substrate G taken out from the cassette 11 are arranged side by side on one side of the transport path 16, and on the opposite side of the transport path 16, the LCD substrate G The adhering device 19, the heating device 20, and the cooling devices 21 for cooling the LCD substrate G to a predetermined temperature are appropriately arranged in multiple stages.
[0020]
In the second processing unit 5, the coating / peripheral part removing device 24 according to the present embodiment is arranged on one side of the conveyance path 23 of the main conveyance arm 22, and on the opposite side across the conveyance path 22. The heating device 20 and the cooling device 21 are appropriately arranged in multiple stages.
[0021]
The interface unit 7 is provided with a cassette 25 for temporarily holding the LCD substrate G, a sub-transport arm 26 for taking the LCD substrate G in and out of the cassette 25, and a delivery table 27 for the LCD substrate G. ing. The configurations of the first processing unit 3 and the second processing unit 5, the arrangement of various devices, and the like can be changed as appropriate.
[0022]
Next, the configuration of the developing device 18 incorporated in the coating and developing treatment system 1 will be described. FIG. 2 is a schematic cross-sectional view for explaining the configuration of the developing device 18, and FIG. 3 is a plan view thereof.
[0023]
In the casing 18a, the developing device 18 includes a spin chuck 30 for horizontally mounting the LCD substrate G, and a cylindrical processing with an open top surface disposed so as to surround the spin chuck 30 and the LCD substrate G. A container 31, a developer supply nozzle 32 for supplying a developer as a processing liquid to the surface of the LCD substrate G, and a rinse liquid for supplying a rinse liquid such as deionized water or pure water after the development processing to the surface of the LCD substrate G A supply nozzle 33, a dry gas supply nozzle 34 that is movable above the surface of the LCD substrate G that supplies an inert gas such as N ₂ gas to the surface of the LCD substrate G, and a developer supplied to the surface of the LCD substrate G Developer holding means 35 for holding the developer.
[0024]
An air suction unit (not shown) is provided on the top surface of the spin chuck 30. By suction of the air suction unit (not shown), the spin chuck 30 sucks the back surface of the LCD substrate G and places it horizontally on the top surface of the base. It is configured. Further, the lower surface of the spin chuck 30 is fixed to the upper surface of a support column 37 connected to an elevating and rotating mechanism 36 provided below the processing container 31, and the spin chuck 30 is moved up and down by the operation of the elevating and rotating mechanism 36. It is configured to move and rotate freely.
[0025]
A processing container 31 that surrounds the spin chuck 30 and the LCD substrate G is a cylindrical container having a container lower portion 40 on the bottom surface and a circumferential groove 41a that is disposed so as to surround the outer periphery of the container lower portion 40 and has an inclined bottom surface. A circular cylindrical shape having a base 41 and an inclined surface 42a which is disposed along the inner periphery of the peripheral groove 41a of the container base 41 and which is inclined upward from the upper end toward the back side of the LCD substrate G held by the spin chuck 30. The inner container 42 and a circular cylindrical outer container 43 that is arranged on the outer peripheral side of the inner container 42 and can be moved up and down by an elevating means (not shown) and can protrude from the peripheral groove 41a.
[0026]
When performing development processing on the LCD substrate G, the outer container 43 is moved up to the position of the outer container 43 ′ shown by the two-dot oblique line in FIG. 2 so that the developer does not scatter outside the processing container 31. It is configured. In this case, the processing liquid splashed into the processing container 31 is drained through the drain pipe 45 connected to the bottom surface on the lowermost side of the circumferential groove 41 a of the container base 41. Further, the atmosphere in the processing container 31 is exhausted through an exhaust pipe 44 connected to the container lower part 40.
[0027]
A plurality of, for example, four support pins 46 are arranged at the four corners of the LCD substrate G on the inclined surface 42 a of the inner container 42. The support pin 46 has a spherical upper end so as not to damage the back surface of the LCD substrate G, and is made of, for example, resin, rubber, soft metal (brass, aluminum, or the like). When the LCD substrate G is placed on the spin chuck 30, the support pins 46 support the peripheral portion of the LCD substrate G that is not fully placed on the top surface of the spin chuck 30, and the LCD substrate G is placed horizontally. It has a function of being placed on the spin chuck 30. A back surface cleaning nozzle 47 that supplies pure water to clean the back surface of the LCD substrate G is disposed below the LCD substrate G on which the spin chuck 30 is placed.
[0028]
As shown in FIG. 3, the developer supply nozzle 32 is disposed above the processing container 31, and the width in the long side direction is set to be longer than one side (short side) of the LCD substrate G. . Further, a developer supply tube 50 for supplying the developer into the developer supply nozzle 32 is connected to the upper portion of the developer supply nozzle 32. Further, as shown in FIG. 4, a large number of developer outlets 51 are provided in a densely arranged state on the lower surface of the developer supply nozzle 32 over the entire width, and the developer supply tube 50 supplies the developer. The developer supplied into the nozzle 32 is discharged from the discharge ports 51 onto the surface of the LCD substrate G in the form of a film without a gap.
[0029]
As shown in FIG. 3, a bracket 52 is connected to one end of the developer supply nozzle 32, and the bracket 52 is engaged with a ball screw shaft 54 that rotates forward and backward by switching the rotation of the motor 53. Therefore, the developer supply nozzle 32 is slidable above the LCD substrate G along the long side direction of the LCD substrate G by the rotational operation of the motor 53. Then, if the developer supply nozzle 32 is moved across the processing container 31 with the developer discharged from the discharge port 51, the developer is applied to the entire surface of the LCD substrate G as shown in FIG. The liquid layer 55 can be formed by supplying evenly.
[0030]
As shown in FIG. 3, the rinsing liquid supply nozzle 33 is disposed above the processing container 31, a rinsing liquid supply circuit 56 is connected to the upper part, and nozzles 57 are provided at two positions on the back surface. . Further, the rinsing liquid supply nozzle 33 is configured to slide above the LCD substrate G along the long side direction of the LCD substrate G by a drive mechanism (not shown).
[0031]
As shown in FIG. 2, a suspension member 60 made of a wire is connected to the upper surface of the developer holding means 35, and this suspension member 60 is connected to a power mechanism (not shown). The suspension member 60 is pulled up and pulled down by the operation of the power mechanism (not shown). That is, when the suspending member 60 is pulled up, the developer holding means 35 moves upward and moves away from the surface of the LCD substrate G. When the suspending member 60 is pulled down, the developer holding unit 35 is held. The means 35 is configured to move downward and approach the surface of the LCD substrate G.
[0032]
After the developer liquid layer 55 is formed on the surface of the LCD substrate G by the developer supply nozzle 32, the suspension member 60 is pulled down so as not to contact the surface of the LCD substrate G, as shown in FIGS. At this position, the developer holding means 35 is lowered to a position where it contacts the liquid layer 55 of the developer supplied to the surface of the LCD substrate G. That is, as shown in FIG. 6, the developer liquid layer 55 is sandwiched between the surface of the LCD substrate G and the lower surface of the developer holding means 35, and the developer having a thickness necessary for development is obtained. The liquid layer 55 can be stably maintained.
[0033]
Further, as shown in FIG. 5, the developer holding means 35 is formed in a rectangular shape like the LCD substrate G. The upper surface and the lower surface of the developer holding means 35 have a mesh shape in which gaps 62 communicating with the external atmosphere are arranged over the entire surface like a mesh, and a frame of the gap 62 is formed on the lower surface of the developer holding means 35. The portion comes into contact with the developer liquid layer 55.
[0034]
Further, the lower surface of the developer holding means 35 that is in contact with the developer liquid layer 55 has a configuration that can overlap at least a position facing the support pin 46 that supports the back surface of the LCD substrate G. As a result, the developer holding means 35 is configured to substantially cover from the center of the LCD substrate G to the peripheral portion of the LCD substrate G that could not be placed on the top surface of the spin chuck 30. Therefore, when the developer holding means 35 is brought into contact with the processing liquid of the developer, the developer holding means 35 can hold the developer liquid layer 55 over the entire surface of the LCD substrate G without leakage. ing.
[0035]
Next, processing steps in the processing system including the developing device 18 according to this embodiment configured as described above will be described.
[0036]
First, the unprocessed LCD substrate G accommodated in the cassette 11 is taken out by the sub-transport arm 13 of the loader unit 2 and then transferred to the main transport arm 15 of the first processing unit 3 and then subjected to brush cleaning. It is conveyed into the device 17. The LCD substrate G brush-cleaned in the brush cleaning device 17 is then subjected to a hydrophobizing process in the adhesion device 19 and cooled in the cooling device 21, and then applied to the coating / peripheral edge removing device 24. It is brought in. Then, the LCD substrate G carried out from the coating / periphery removing device 24 is carried into the heating device 20 and subjected to a baking process on the resist film, and then a predetermined pattern is exposed by the exposure device 6. Is done. Then, the exposed LCD substrate G is conveyed into the developing device 18, developed with the developing solution, and then rinsed with the rinsing solution to complete the developing process.
[0037]
Here, processing steps in the developing device 18 will be described with reference to a flowchart shown in FIG.
[0038]
First, the main transfer arm 15 enters the developing device 18, and the LCD substrate G is carried into the developing device 18 (S1). Then, the LCD substrate G is sucked and held on the upper surface of the raised spin chuck 30. After delivering the LCD substrate G to the spin chuck 30, the main transfer arm 15 moves out of the developing device 18.
[0039]
Next, the spin chuck 30 is lowered. At this time, as shown in FIG. 2, the peripheral portion of the LCD substrate G that could not be placed on the top surface of the spin chuck 30 is supported by the support pins 46 (S2). As described above, even when the top surface of the spin chuck 30 is relatively small with respect to the LCD substrate G, the LCD substrate G is stored in the processing container 31 in a horizontal state.
[0040]
Next, the developer supply nozzle 32 starts to move from one edge of the LCD substrate G toward the other edge along the long side direction of the LCD substrate G. During the movement, the developer is supplied from the developer supply nozzle 32 and applied to the surface of the LCD substrate G. Then, the developer supply nozzle 32 moves to the position of the other edge of the LCD substrate G, whereby the developer is supplied to the entire surface of the LCD substrate G (S3). Thereafter, the developer supply nozzle 32 is retracted to a predetermined position.
[0041]
Next, the developer holding means 35 descends from above the processing container 31 and stops when it contacts the developer liquid layer 55 formed on the surface of the LCD substrate G. In this manner, the developer holding means 35 disposed at a position in contact with the developer liquid layer 55 holds the developer liquid layer 55 (S4). That is, the developer is held between the LCD substrate G and the lower surface of the developer holding means 35 by the surface tension of the developer. Therefore, on the LCD substrate G, the developer exists with a uniform thickness.
[0042]
Further, since the developer holding means 35 is formed in a mesh shape, it can be held effectively while minimizing the contact area of the developer liquid layer 55. Further, even if a slight deflection or inclination occurs on the LCD substrate G during development, a thin developer liquid layer 55 is not generated on the surface of the LCD substrate G. Therefore, if it is left for a predetermined time, the development processing of the surface of the LCD substrate G is stably performed (S5).
[0043]
When the predetermined time elapses and the development process is completed, the developer holding means 35 moves up and moves away from the surface of the LCD substrate G. Thereafter, the rinsing liquid supply nozzle 33 is moved above the surface of the LCD substrate G to supply pure water to clean the surface of the LCD substrate G, while supplying pure water from the back surface cleaning nozzle 47 to clean the back surface of the LCD substrate G. Perform (S6). Thus, the developer is washed away from the LCD substrate G, and the supply of pure water from the rinse liquid supply nozzle 33 and the back surface cleaning nozzle 47 is stopped. Then, the dry gas supply nozzle 34 is moved above the LCD substrate G while rotating the LCD substrate G, and an inert gas such as N ₂ gas is blown onto the surface of the LCD substrate G. Thus, the pure water is shaken off from the LCD substrate G and the drying process is performed (S7). Thereafter, the rotation of the LCD substrate G is stopped, and the supply of N ₂ gas from the dry gas supply nozzle 34 is stopped (S8).
[0044]
After the above processing is completed, the main transport arm 15 enters the developing device 18. Then, the LCD substrate G placed on the spin chuck 30 is transferred to the main transport arm 15, the main transport arm 15 moves out of the developing device 18, and the LCD substrate G is unloaded from the developing device 18 (S 9). ).
[0045]
Thus, according to the present embodiment, the developer liquid layer 55 is held by the developer holding means 35, whereby the developer liquid having a thickness necessary for processing over the entire surface of the LCD substrate G is obtained. Layer 55 can be formed. Therefore, it is possible to prevent development failure due to bias of the developer and the like, and stable development processing can be performed.
[0046]
In the processing step of the developing device 18 according to the present embodiment, after the step S3 of supplying the developer from the developer supply nozzle 32, the step S4 in which the developer holding means 35 holds the liquid layer 55 of the developer is performed. Although the case where it is performed has been described, the developer holding means 35 may be arranged on the LCD substrate G with a predetermined interval first, and then the developer may be supplied from the developer supply nozzle 32.
[0047]
Although an example of the embodiment of the present invention has been described, the present invention is not limited to this example, and can take various forms. For example, as shown in FIG. 8, the developer holding means 70 may include a nozzle mechanism that supplies the developer to the surface of the LCD substrate G. That is, the developer holding means 70 is configured such that a discharge port 71 serving as a nozzle mechanism for discharging the developer is provided between the gaps 62 and a large number of discharge ports 71 are arranged over the entire lower surface. According to this configuration, the supply of the developer and the maintenance of the thickness of the developer liquid layer 55 can be performed by one means. Accordingly, the development device 18 can be simplified and the development time can be shortened.
[0048]
Even if the entire surface of the substrate is not covered, it is formed in a frame shape with the central portion cut out like the developer holding means 72 shown in FIG. The liquid layer 55 of the developer supplied to the surface of the LCD substrate G may be held at a position not in contact with the surface of the LCD substrate G. According to this configuration, the developer holding means 72 can be simplified and the weight can be reduced.
[0049]
Further, when supporting the developer holding means, the developer holding means 75 is supported by the lower part of the peripheral portion of the LCD substrate G as shown in FIG. The support pin 46 may be supported by a substantially U-shaped support member 76 fixed to the support pin 46. According to such a configuration, a hanging mechanism or the like above the LCD substrate G is not necessary, and it is easy to carry the LCD substrate G into and out of the container.
[0050]
Further, the substrate is not limited to the LCD substrate G, and may be a semiconductor wafer, a glass substrate, a CD substrate, a photomask, a printed substrate, a ceramic substrate, or the like.
[0051]
【The invention's effect】
According to the present invention, a liquid layer of a processing liquid having a thickness necessary for processing can be formed over the entire surface of the substrate even if the horizontal posture is unstable. . Therefore, even a large substrate can be processed appropriately, and the yield can be improved. In addition, the liquid layer of the processing liquid can be effectively retained with minimal contact.
[0052]
In particular, according to the fourth aspect of the present invention, in the processing apparatus of the third aspect , the processing liquid holding means can be easily disposed at a position in contact with the processing liquid supplied to the surface of the substrate.
[Brief description of the drawings]
FIG. 1 is a perspective view of a processing system including a developing device according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view of the developing device according to the embodiment of the present invention.
FIG. 3 is a plan view of the developing device according to the embodiment of the present invention.
FIG. 4 is a perspective view of the developer supply nozzle as viewed from below.
FIG. 5 is a perspective view showing a state in which the developer holding means is disposed at a position not in contact with the surface of the LCD substrate and at a position in contact with the liquid layer of the developer supplied to the surface of the LCD substrate.
FIG. 6 is an explanatory view showing a side view of the state in which the developer holding means is arranged at a position not in contact with the surface of the LCD substrate and at a position in contact with the liquid layer of the developer supplied to the surface of the LCD substrate. is there.
FIG. 7 is a flowchart showing processing steps according to the embodiment of the present invention.
FIG. 8 is an explanatory view seen from the bottom when a nozzle mechanism is provided in the developer holding means.
FIG. 9 is a perspective view showing another example of the shape of the developer holding unit.
FIG. 10 is an explanatory view seen from the side when the developer holding means is supported by a support pin.
FIG. 11 is an explanatory diagram showing a problem of a conventional developing device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Application | coating development processing system 18 Development apparatus 30 Spin chuck 31 Processing container 32 Developer supply nozzle 35 Developer supply means 46 Support pin 55 Liquid layer 60 Suspension member G LCD substrate

Claims (7)

In a method of supplying a treatment liquid to the surface of a substrate held horizontally and performing a predetermined treatment on the substrate,
A step of holding the substrate horizontally;
A step of disposing a frame-shaped processing liquid holding means in which a central portion is hollowed out at a predetermined interval at a position that does not contact the surface of the substrate at least at a peripheral portion of the surface of the substrate ;
And a step of supplying the processing liquid to the surface of the substrate up to a thickness contacting with the processing liquid holding means after the processing liquid holding means is arranged . In a method of supplying a treatment liquid to the surface of a substrate held horizontally and performing a predetermined treatment on the substrate,
A step of holding the substrate horizontally;
A process liquid holding means having a substantially U-shaped side surface covering the peripheral edge of the substrate at a position that is not in contact with the surface of the substrate at least at the peripheral edge of the surface of the substrate. When,
And a step of supplying the processing liquid to the surface of the substrate up to a thickness contacting with the processing liquid holding means after the processing liquid holding means is arranged. A processing apparatus comprising holding means for horizontally holding a substrate and supply means for supplying a processing liquid to the surface of the substrate held by the holding means,
  A treatment liquid holding means that is movable at a position that does not contact the surface of the substrate at least at a peripheral edge of the surface of the substrate and that contacts a treatment liquid supplied to the surface of the substrate;
The processing apparatus according to claim 1, wherein the processing liquid holding means has a frame shape in which a central portion is cut out. The processing apparatus according to claim 3, wherein the processing liquid holding unit is suspended above the surface of the substrate. A processing apparatus comprising holding means for horizontally holding a substrate and supply means for supplying a processing liquid to the surface of the substrate held by the holding means,
A treatment liquid holding means that is movable at a position that does not contact the surface of the substrate at least at a peripheral edge of the surface of the substrate and that contacts a treatment liquid supplied to the surface of the substrate;
The processing apparatus is characterized in that the processing liquid holding means has a substantially U-shaped side surface covering the peripheral edge of the substrate . 6. The processing apparatus according to claim 5 , further comprising support means for supporting the peripheral edge of the substrate from below, wherein the processing liquid holding means can be disposed at a position facing at least the support means with the substrate interposed therebetween. .   The processing apparatus according to claim 6, wherein the processing liquid holding unit is supported by the supporting unit.

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