JP3822752B2 - Processing equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a processing apparatus that heats a substrate such as an LCD substrate or a semiconductor wafer on a mounting table.
[0002]
[Prior art]
In general, in the manufacturing process of a liquid crystal display device (LCD), in order to form, for example, an ITO (Indium Tin Oxide) thin film or an electrode pattern on the surface of an LCD substrate, a photolithography technique is used as in the semiconductor manufacturing process. It is used. This photolithography technology includes a resist coating process for applying a resist solution to the surface of an LCD substrate, an exposure processing process for exposing a circuit pattern to the formed resist film, and a development for supplying a developer to the LCD substrate after the exposure process. And processing steps.
[0003]
Among these processing steps, a heat treatment step is performed between the resist coating step and the exposure processing step to evaporate the residual solvent in the resist film and improve the adhesion between the LCD substrate and the resist film. Yes. The heat treatment apparatus used in such a process is provided with a heating table that can heat the LCD substrate to a predetermined temperature. Usually, the heating table has a proximity pin that supports the LCD substrate. It is attached.
[0004]
As shown in FIG. 10, the proximity pin 100 has a support portion 101 that supports the back surface of the LCD substrate G, and the support portion 101 is formed in a spherical shape and a conical shape with a smooth tip portion. When the proximity pin 100 supports the LCD substrate G, a gap of about 0.2 to 0.3 mm, for example, is formed between the LCD substrate G and the heating table 103 as shown in FIG. . And the predetermined heat processing with respect to the LCD board | substrate G has been performed by the radiant heat from the heating mounting base 103 transmitted through this clearance gap.
[0005]
[Problems to be solved by the invention]
However, conventionally, a fixing member such as a flange for fixing the support portion may be required, and the support member may be enlarged and complicated. Further, the radiant heat may be blocked by the shape of the support portion 101, and the radiant heat may not be uniformly transmitted to the entire surface of the LCD substrate G as indicated by the arrows in FIG. As a result, the transfer trace of the support portion 101 remains on the LCD substrate G, which may cause a decrease in yield.
[0006]
The present invention has been made in view of this point, and provides a processing apparatus that does not require a fixing member such as a flange for fixing a support portion. Another object of the present invention is to provide a new processing apparatus capable of performing uniform heat treatment on a substrate.
[0007]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, a processing apparatus according to claim 1 is a processing apparatus for heat-treating a substrate by radiant heat from the mounting table in a state where the substrate is supported by a support member provided on the mounting table. The support member is composed of a support part for supporting the substrate and a base part for attaching the support part to the mounting table, and the base part is located substantially at the center of the base part. A fixing hole to which the support portion can be attached and a guide groove for guiding the support portion to the fixing hole are provided .
[0008]
According to such a configuration, the support portion can be firmly fixed to the fixing hole by fitting the support portion into the fixing hole. Therefore, a fixing member such as a flange for fixing the support portion is not necessary, and it is possible to prevent the support member from becoming enlarged and complicated.
At this time, in order to make it difficult to prevent the propagation of radiant heat from the mounting table to the substrate, it is preferable to form the support portion in a column shape having a diameter of 1 mm or less, as in claim 2.
[0009]
According to a third aspect of the present invention, in the processing apparatus according to the first or second aspect, the support portion is formed of a material having low thermal conductivity.
According to this configuration, since the heat conductivity of the support portion is low, it is possible to suppress the heat of the mounting table from being transmitted to the substrate through the support portion. Accordingly, since heat is not excessively supplied to the contact portion between the substrate and the support portion, the substrate can be subjected to more uniform heat treatment. As a result, it is possible to more reliably suppress the transfer trace of the support portion from remaining on the substrate.
[0010]
According to a fourth aspect of the present invention, in the processing apparatus according to the first, second, or third aspect, the base portion is formed of the same material as the mounting table.
According to such a configuration, the amount of radiant heat from the mounting table is more equal to the amount of radiant heat from the base. Accordingly, the radiant heat can be more evenly distributed over the entire surface of the substrate. As a result, a more uniform heat treatment can be performed on the substrate.
[0011]
According to a fifth aspect of the present invention, in the processing apparatus according to the first, second, third, or fourth aspect, the surface of the base portion is formed to have the same color as the surface of the mounting table. .
According to such a configuration, the amounts of heat generated from the mounting table and the base unit become more equal, so that the radiant heat can be more evenly distributed over the entire surface of the substrate.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. This embodiment is embodied as a heat treatment apparatus incorporated in a coating and developing treatment apparatus. 1 is a perspective view of the coating and developing treatment apparatus, and FIG. 2 is a plan view of the coating and developing treatment apparatus.
[0014]
As shown in FIGS. 1 and 2, the coating and developing treatment apparatus 1 includes, for example, a loader unit 2 that carries in and out a rectangular LCD substrate G, a first processing unit 3 that processes the LCD substrate G, and the first processing. A second processing unit 5 connected via the unit 3 and the interface unit 4; and for transferring the LCD substrate G between the second processing unit 5 and an exposure apparatus (not shown), for example. The interface unit 7 is configured.
[0015]
The loader unit 2 is provided with a cassette mounting table 10. The cassette mounting table 10 includes, for example, cassettes 11 and 11 for storing unprocessed LCD substrates G, and a cassette for storing processed LCD substrates G. 12 and 12 can be placed in a line with the entrance / exit of the LCD substrate G facing the first processing unit 3 side. Further, the loader unit 2 is provided with a sub-transport device 13 that can transport the LCD substrate.
[0016]
The sub-transport device 13 is movable in the direction along the transport rail 13a (Y direction), the storage direction of the LCD substrate G in each cassette 11 and 12 (Z direction), and is also rotatable in the θ direction. It is configured as follows. The sub-carrier device 13 is configured to be accessible to the transfer table 14 on which the LCD substrate G can be placed.
[0017]
In the first processing unit 3, various processing devices that perform predetermined processing on the LCD substrate G are arranged on both sides of the transport rail 16 of the main transport device 15. That is, on one side of the transport rail 16, a scrubber cleaning device 17 that cleans the LCD substrate G taken out from each cassette 11, 11 and a development processing device 18 that performs development processing on the LCD substrate G are arranged. An ultraviolet ozone cleaning device 19, cooling processing devices 20 and 21 that cool the LCD substrate G, and a heat processing device 22 that heats the LCD substrate G are arranged in multiple stages on the other side of the transport rail 16. Has been. Loading and unloading of the LCD substrate G into and from these various processing apparatuses is performed by a transfer arm 15 a equipped in the main transfer apparatus 15. The interface unit 4 formed between the first processing unit 3 and the second processing unit 5 described later is provided with a delivery table 23 on which the LCD substrate G can be placed.
[0018]
In the second processing unit 5, a coating / peripheral part removing device 27 is disposed on one side of the main transport device 25 across the transport rail 26, and the LCD substrate G is disposed on the other side of the transport rail 26. The hydrophobizing apparatus 28 for performing the hydrophobizing process, the cooling apparatus 29 for cooling the LCD substrate G, and the heat processing apparatus 30 according to the embodiment of the present invention are arranged in multiple stages. The main transfer device 25 is equipped with a transfer arm 25a for loading and unloading the LCD substrate G to and from various processing devices belonging to the second processing unit 5.
[0019]
In order to adjust the tact between the coating and developing treatment apparatus 1 and the exposure apparatus (not shown), the interface unit 7 is provided with cassettes 31 and 31 for temporarily storing and waiting for the LCD substrate G, and the LCD substrate G. A placeable delivery table 32, each cassette 31, 31, delivery table 32, and an auxiliary transport device 33 capable of transporting the LCD substrate G to the exposure device (not shown) are provided.
[0020]
The coating and developing treatment apparatus 1 is configured as described above. Next, the heat treatment apparatus 30 incorporated in the coating and developing treatment apparatus 1 will be described.
[0021]
As shown in FIG. 3, the heat treatment apparatus 30 is formed with a treatment chamber 40 for heat-treating the LCD substrate G carried by the transfer arm 25 a of the main transfer apparatus 25. The processing chamber 40 is provided with a rectangular heating mounting table 42 having a heating element 41 for heating the LCD substrate G. The heating table 42 is formed of a material such as aluminum, and a shutter 43 that surrounds the periphery of the heating table 42 is provided on the outer peripheral side of the heating table 42.
[0022]
The shutter 43 can be moved up and down by the operation of the elevating cylinder 44. When the shutter 43 is lifted, the shutter 43 and a stopper 47 suspended from a cover 46 having an exhaust port 45 at the upper center come into contact with each other, and the processing chamber. The inside of 40 is configured to be kept airtight. The stopper 47 is provided with an air supply port (not shown), and the air flowing into the processing chamber 40 from the air supply port (not shown) is exhausted from the exhaust port 45. Has been. The air flowing in from the air supply port (not shown) does not directly touch the LCD substrate G in the processing chamber 40, so that the LCD substrate G can be heated at a predetermined processing temperature. Has been.
[0023]
In the processing chamber 40, lifting pins 48 that can support the LCD substrate G are provided. The elevating pins 48 are formed so as to be movable up and down by driving a motor 49, and are formed so that the LCD substrate G can be supported at a position indicated by a two-dot chain line. Further, when the elevating pin 48 is lowered from this state, the LCD substrate G is placed on the heating placement table 42 as indicated by a solid line. At this time, the LCD substrate G is supported on the proximity pins 51.
[0024]
As shown in FIGS. 4 and 5, the proximity pin 51 includes a support portion 52 that supports the back surface of the LCD substrate G, and an annular base portion 53 that can fix the support portion 52.
[0025]
The support portion 52 is formed in a column shape having a diameter of 1 mm or less, for example, and is made of a material having low thermal conductivity such as a fluororesin. And the upper end of the support part 52 is formed in the smooth curved surface, and it is comprised so that the contact area of the support part 52 and the LCD substrate G may become the smallest.
[0026]
The base 53 is made of the same material as the heating mounting table 42 and is attached to a recess (not shown) provided on the heating mounting table 42. The surfaces of the heating table 42 and the base 53 are formed to have the same color, and the amount of radiant heat generated from the heating table 42 and the amount of radiant heat generated from the base 53 are equal. It is formed to become.
[0027]
Further, as shown in FIG. 6, the base portion 53 has a circular fixing hole 54 to which the base end portion of the support portion 52 can be attached, and a guide groove 55 for guiding the support portion 52 to the fixing hole 54. Is formed. The fixing hole 54 is provided at a substantially central portion of the base portion 53, and the diameter of the fixing hole 54 is formed to be equal to the diameter of the support portion 52.
[0028]
When the LCD substrate G is supported by the support portion 52, a gap of 0.2 to 0.3 mm, for example, a so-called proximity gap is formed between the LCD substrate G and the heating mounting table 42. It is configured.
[0029]
The heat treatment apparatus 30 according to the embodiment of the present invention is configured as described above. Next, the operation and effect of the heat treatment apparatus 30 will be described.
[0030]
When the cassette 11 storing the unprocessed LCD substrate G is placed on the cassette mounting table 10, the sub-transport device 13 accesses the cassette 11 and extracts one LCD substrate G. Next, the sub-transport device 13 transports the LCD substrate G to the transfer table 14 provided in the loader unit 2 and transfers the LCD substrate G onto the transfer table 14.
[0031]
Next, the LCD substrate G is transported to the ultraviolet ozone cleaning device 19 while being held by the transport arm 15a of the main transport device 15, and organic contaminants attached to the LCD substrate G are removed. After that, after the ozone cleaning is finished, the LCD substrate G is transported to the scrubber cleaning device 17 by the main transport device 15 and subjected to the scrub cleaning process, and then transported to the delivery table 23 while being supported by the transport arm 15a again. The
[0032]
The LCD substrate G transferred to the transfer table 23 is transferred to the hydrophobic treatment device 28 while being held by the transfer arm 25a of the main transfer device 25. Then, the LCD substrate G that has been subjected to the hydrophobic treatment is transported to the coating / peripheral edge removing device 27 while being held by the transport arm 25a again.
[0033]
A resist film is formed on the surface by the coating / peripheral part removing device 27 and unnecessary resist film on the peripheral part is removed. Thereafter, the LCD substrate G is transported to the heat treatment apparatus 30 while being held by the transport arm 25a.
[0034]
At this time, as shown in FIG. 7, the LCD substrate G enters the processing chamber 40 together with the transfer arm 25 a from above the lowered shutter 43 and is supported on the lift pins 48 that are lifted by a one-dot chain line. Then, after the transfer arm 25a is withdrawn from the processing chamber 40, the shutter 43 is raised to make the inside of the processing chamber 40 airtight. Thereafter, the LCD board G is lowered from the position indicated by the one-dot chain line in FIG. 8 together with the lift pins 48 to the position of the solid line, and the LCD board G is supported on the proximity pin 51. The LCD substrate G supported on the proximity pins 51 is heat-treated with the radiant heat from the heating mounting table 42 and the base unit 53.
[0035]
After the heat treatment is finished, the elevating pin 48 is raised and the shutter 43 is lowered. Next, the transfer arm 25 a that has entered the processing chamber 40 receives the LCD substrate G from the lift pins 48, and then leaves the processing chamber 40 together with the LCD substrate G.
[0036]
Thereafter, the LCD substrate G is transported to the delivery table 32 while being held by the transport arm 25a, and delivered to the delivery table 32. Then, after the LCD substrate G on the delivery table 32 is transported to the exposure device (not shown) by the sub-transport device 33, a predetermined exposure process is performed.
[0037]
In the heat treatment apparatus 30 according to the embodiment of the present invention, the shape of the support portion 52 of the proximity pin 51 is formed thinner than the conventional one. Therefore, of the radiant heat given to the LCD substrate G, the radiant heat blocked by the support portion 52 is reduced. As a result, the radiant heat spreads evenly on the LCD substrate G as shown by the arrows in FIG. 9, so that it is possible to suppress the transfer trace of the support portion 52 from remaining on the LCD substrate G as compared with the conventional case. Become.
[0038]
The base 53 is made of the same material as the heating table 42, and the surface of the heating table 42 and the surface of the base 53 are formed in the same color. Accordingly, since the heat quantity of the radiant heat from the heating stage 42 and the heat quantity of the radiant heat from the base 53 are equal, uniform radiant heat can be applied to the LCD substrate G. As a result, a uniform heat treatment for the LCD substrate G is possible.
[0039]
Further, since the support portion 52 is formed of a material having low thermal conductivity such as a fluororesin, the heat of the base portion 53 is suppressed from being transmitted to the LCD substrate G through the support portion 52. As a result, since excessive heat is not supplied to the contact portion between the LCD substrate G and the support portion 52, the LCD substrate G can be uniformly heated.
[0040]
Since the support portion 52 and the fixing hole 54 are formed to have the same diameter, the support portion 52 is firmly attached to the base portion 53 when the support portion 52 is fitted into the fixing hole 54. Fixed. Therefore, a separate fixing hole material such as a flange is not necessary for the fixing hole 54, and it is possible to prevent the proximity pin 51 from becoming complicated and enlarged.
[0041]
In the above-described embodiment, the heat treatment apparatus 22 has been described as an example. However, the present invention is not limited to such an example, and other treatment apparatuses including proximity pins, such as a hydrophobic treatment apparatus, etc. Is also applicable. Further, the substrate to be used is not limited to the LCD substrate G, and the present invention can be applied to a CD substrate, a semiconductor wafer, and the like.
[0042]
【The invention's effect】
According to the present invention, since the support portion is fixed in a state of being fitted in the fixing hole, a fixing member such as a flange for fixing the support portion is not necessary. Therefore, it is possible to prevent the support member from becoming complicated and enlarged . In addition, since the radiant heat blocked by the support portion is less than that of the prior art, uniform radiant heat can be applied to the substrate. Therefore, uniform heat treatment can be performed on the substrate, and as a result, it is possible to suppress the transfer trace of the support portion from remaining on the substrate.
[0043]
In particular, according to the third aspect, since excessive heat is not supplied to the contact portion between the support portion and the substrate, the substrate can be subjected to more uniform heat treatment.
[0044]
In particular, according to claims 4 and 5, since the amount of radiant heat from the base and the amount of radiant heat from the mounting table become more equal, more uniform radiant heat can be applied to the substrate. .
[Brief description of the drawings]
FIG. 1 is a perspective view showing an external appearance of a coating and developing treatment apparatus having a heat treatment apparatus according to an embodiment of the present invention.
FIG. 2 is a plan view of the coating and developing treatment apparatus of FIG.
FIG. 3 is a cross-sectional view of a heat treatment apparatus according to an embodiment of the present invention.
4 is a perspective view showing an appearance of a proximity pin provided in the heat treatment apparatus of FIG. 3. FIG.
5 is a cross-sectional view showing a state in which an LCD substrate is supported on the proximity pins of FIG. 4;
6 is a perspective view showing a guide groove and a fixing hole provided in the base portion of the proximity pin of FIG. 4; FIG.
7 is a cross-sectional view showing a state in which an LCD substrate is carried into the heat treatment apparatus of FIG. 3;
8 is a cross-sectional view showing a state in which the LCD substrate of FIG. 7 is placed on a heating placement table.
9 is a cross-sectional view showing how radiant heat is transmitted to the LCD substrate of FIG. 8;
FIG. 10 is an explanatory view showing the appearance of a conventional proximity pin.
FIG. 11 is a cross-sectional view showing a state in which an LCD substrate is supported on a conventional proximity pin.
12 is a cross-sectional view showing a state in which radiant heat is transmitted to the LCD substrate of FIG. 11. FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Coating / development processing apparatuses 15 and 25 Main conveyance apparatus 30 Heat processing apparatus 42 Heating mounting base 51 Proximity pin 52 Support part 53 Base part 54 Fixing hole 55 Guide groove

Claims (5)

In a processing apparatus for heat-treating a substrate by radiant heat from the mounting table in a state where the substrate is supported by a support member provided on the mounting table,
The support member includes a support portion that supports the substrate and a base portion that attaches the support portion to the mounting table.
The base portion is provided with a fixing hole positioned substantially at the center of the base portion and to which the supporting portion can be attached, and a guide groove for guiding the supporting portion to the fixing hole. A processing device.   The processing apparatus according to claim 1, wherein the support portion has a column shape with a diameter of 1 mm or less.   The processing apparatus according to claim 1, wherein the support portion is made of a material having low thermal conductivity.   The processing apparatus according to claim 1, wherein the base portion is formed of the same material as the mounting table.   The processing apparatus according to claim 1, 2, 3, or 4, wherein the surface of the base portion is formed to have the same color as the surface of the mounting table.

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