KR20030068773A - The hot plate structure for dehydrate and pre bake of LCD glass - Google Patents
The hot plate structure for dehydrate and pre bake of LCD glass Download PDFInfo
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- KR20030068773A KR20030068773A KR1020020008385A KR20020008385A KR20030068773A KR 20030068773 A KR20030068773 A KR 20030068773A KR 1020020008385 A KR1020020008385 A KR 1020020008385A KR 20020008385 A KR20020008385 A KR 20020008385A KR 20030068773 A KR20030068773 A KR 20030068773A
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- 239000011521 glass Substances 0.000 title claims abstract description 62
- 238000001035 drying Methods 0.000 claims abstract description 21
- 238000010438 heat treatment Methods 0.000 claims abstract description 12
- 238000004140 cleaning Methods 0.000 claims abstract description 9
- 238000000576 coating method Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 229920002120 photoresistant polymer Polymers 0.000 claims description 4
- 230000003028 elevating effect Effects 0.000 claims description 3
- 230000005611 electricity Effects 0.000 abstract description 7
- 230000003068 static effect Effects 0.000 abstract description 7
- 239000004973 liquid crystal related substance Substances 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000011109 contamination Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000013872 defecation Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B29/00—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins
- C03B29/04—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins in a continuous way
- C03B29/06—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins in a continuous way with horizontal displacement of the products
- C03B29/08—Glass sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/22—Antistatic materials or arrangements
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Nonlinear Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Drying Of Solid Materials (AREA)
Abstract
Description
본 발명은 엘씨디 글라스 건조용 가열장치의 구조에 관한 것으로, 더욱 상세하게는 엘씨디 글라스(Glass) 표면에 감광막(Photo-Resist) 코팅을 위해 세정 후 수분 제거를 위한 가열 건조(Dehydrate 및 Pre bake) 공정 수행 시, 글라스와 가열장치(Plate)이 점접촉 된 상태에서 가열 건조가 이루어지도록 하여 정전기 발생에 의한 미끄럼짐(Slip)을 방지하며, 대면적 글라스에 민감한 얼룩의 발생을 방지함으로써, 엘씨디 글라스의 수율이 향상되도록 하는 엘씨디 글라스 건조용 가열장치의 구조에 관한 것이다.The present invention relates to a structure of a heating apparatus for drying an LCD glass, and more particularly, a heat drying (Dehydrate and Pre bake) process for removing water after cleaning for coating a photo-resist on a glass surface of an LCD. When performing, the glass and the heating device (Plate) to be heated and dried to prevent the slip (Slip) caused by the generation of static electricity to prevent the occurrence of stains sensitive to the large area of the glass, It relates to a structure of a heating device for drying the LCD glass for improving the yield.
일반적으로 엘씨디 패널은 액정표시장치라고도 하며, 이는 인가전압에 따른 액정의 투과도의 변화를 이용하여 각종 장치에서 발생되는 여러가지 전기적인 정보를 시각정보로 변화시켜 전달하는 전자 출력 소자로서, 최근 엘씨디 산업은 대면적 5세대 글라스(1100mm X 1300mm X 0.7t) 사용과 광시야각 구현을 위해 IPS(횡전계) 모드를 적용하여 모니터 패널을 생산하기에 이르렀다.In general, an LCD panel is also referred to as a liquid crystal display, and is an electronic output device that transmits various electrical information generated by various devices to visual information by using a change in transmittance of the liquid crystal according to an applied voltage. In order to use large-area 5th generation glass (1100mm x 1300mm x 0.7t) and wide viewing angle, IPS (lateral electric field) mode was applied to produce monitor panels.
이와 같은 엘씨디 패널 제조 공정 중, 엘씨디 글라스에 감광막을 코팅하는 공정 전 단계에서 엘씨디 글라스를 세정 후, 수분을 제거하도록 하는 가열 건조 과정에서 종래의 가열 건조 장치에 구비된 핫플레이트는 엘씨디 글라스와 면접촉이 이루어지는 구조로 되어 있어, 이로 인해 발생되는 정전기가 엘씨디 글라스에 악영향을 끼치게 되며, 특히, 핫플레이트 상에서 미끄러지는 등 파손의 위험성이 있는것이었다.During the LCD panel manufacturing process, the hot plate provided in the conventional heating and drying apparatus in the heat drying process to remove moisture after cleaning the LCD glass in the step before coating the photosensitive film on the LCD glass, the surface contact with the LCD glass This structure has a structure, the static electricity generated thereby adversely affects the LCD glass, in particular, there was a risk of damage, such as slipping on the hot plate.
또한, 건조 시에 얼룩, 배변 오염 등이 발생하여 엘씨디 패널의 생산 수율 저하와 빈번한 장비 세정에 의한 생산 효율이 감소되는 문제점이 있는 것이다.In addition, staining, defecation contamination, etc. occurs during drying, there is a problem that the production efficiency of the LCD panel production yield decrease and frequent equipment cleaning is reduced.
상기 얼룩, 배변 오염 등은 후 공정인 감광막 코팅 공정에서 엘씨디 글라스에 고른 감광막 코팅이 이루어지지 않으며, 특히 배면에 감광액이 뭉치게 되는 문제점이 있는 것이었다.The stain, bowel contamination, and the like, the photoresist coating is not evenly made on the LCD in the photoresist coating process, which is a post process, in particular, there is a problem that the photoresist is agglomerated on the back surface.
본 발명은 상기와 같은 문제점을 고려하여 안출한 것으로, 본 발명은 엘씨디 글라스(Glass) 표면에 감광막(Photo-Resist) 코팅을 위해 세정 후 수분 제거를 위한 가열 건조(Dehydrate 및 Pre bake) 공정 수행 시, 글라스와 핫플레이트(Hot-Plate)가 점접촉 된 상태에서 가열 건조가 이루어지도록 하여 정전기 발생에 의한 미끄럼짐(Slip)을 방지하며, 대면적 글라스에 민감한 얼룩의 발생을 방지함으로써, 엘씨디 글라스의 수율이 향상되도록 하는 엘씨디 글라스 건조용 가열장치의 구조를 제공함을 기술적 과제로 삼는다.The present invention has been made in view of the above problems, the present invention is carried out when performing a heat-drying (Dehydrate and Pre bake) process for water removal after cleaning for the photo-resist coating on the surface of the LCD glass (Glass) The heat-drying is performed in the state where the glass and the hot plate are in point contact to prevent slippage due to static electricity generation and to prevent the occurrence of stains sensitive to the large-area glass. It is a technical problem to provide a structure of an LCD glass drying heater for improving the yield.
상기와 같은 과제를 달성하기 위한 본 발명은 엘씨디 글라스 표면에 감광막 코팅을 위해 세정 후, 수분 제거를 위한 건조 장치에 구비된 가열장치에 있어서, 안착되는 엘씨디 글라스를 승강시키도록 하는 승강핀과, 승강핀에 안착되어 하강하는 엘씨디 글라스를 정위치로 유도하는 다수개의 가이더와, 가이더를 타고 하강하는 엘씨디 글라스의 저면에 점접촉하여 핫플레이트와 소정의 간격으로 이격지도록 핫플레이트 상부면에 돌출된 다수개의 지지핀으로 구성됨을 특징으로 한다.The present invention for achieving the above object is in the heating device provided in the drying apparatus for removing water after cleaning for coating the photosensitive film on the LCD glass, lifting pins to lift and lift the seated LCD glass, A plurality of guiders that guide the descending LCD glass in position and pinned to the bottom surface of the descending LCD glass riding on the pins and a plurality of protrusions protruding from the upper surface of the hot plate to be spaced at a predetermined interval from the hot plate Characterized in that composed of a support pin.
도 1은 본 발명의 구성을 보인 사시도1 is a perspective view showing the configuration of the present invention
도 2는 본 발명의 각부 구성을 보인 분해 사시도Figure 2 is an exploded perspective view showing the configuration of each part of the present invention
도 3은 본 발명의 구성을 보인 정 단면도3 is a cross-sectional view showing the configuration of the present invention
도 4a,b는 본 발명에 엘씨디 글라스가 안착되는 상태를 단계적으로 보인 동작 상태도Figure 4a, b is an operation state diagram showing a state in which the LCD is seated in the present invention step by step
도 5는 본 발명의 다른 실시예를 보인 정 단면도5 is a cross-sectional view showing another embodiment of the present invention
도 6은 본 발명의 또 다른 실시예를 보인 정 단면도Figure 6 is a cross-sectional view showing another embodiment of the present invention
<도면의 주요부분에 대한 부호 설명><Description of Signs of Major Parts of Drawings>
100 : 가열장치 100' : 핫플레이트100: heating device 100 ': hot plate
10 : 승강핀 11 : 안착편10: lift pin 11: seating
12 : 승강편 20 : 가이더12: getting on and off 20: guider
21 : 고정 구멍 22 : 경사면21: fixing hole 22: inclined surface
30 : 지지핀 31 : 접촉편30: support pin 31: contact piece
32 : 고정편 33 : 끼움홈32: fixing piece 33: fitting groove
34 : 지지부재 1 : 엘씨디 글라스34: support member 1: LCD glass
첨부도면 도 1은 본 발명의 구성을 보인 사시도이고, 도 2는 본 발명의 각부 구성을 보인 분해 사시도이고, 도 3은 본 발명의 구성을 보인 정 단면도이고, 도 4 a,b는 본 발명에 엘씨디 글라스가 안착되는 상태를 단계적으로 보인 동작 상태도이고, 도 5는 본 발명의 다른 실시예를 보인 정 단면도이며, 도 6은 본 발명의 또 다른 실시예를 보인 정 단면도로서 이 중 도면부호 100은 본 발명인 가열장치이다.1 is a perspective view showing the configuration of the present invention, Figure 2 is an exploded perspective view showing the configuration of each part of the present invention, Figure 3 is a front sectional view showing a configuration of the present invention, Figure 4 a, b is a present invention An operation state diagram showing the state in which the LCD is seated step by step, Figure 5 is a cross-sectional view showing a further embodiment of the present invention, Figure 6 is a cross-sectional view showing a further embodiment of the present invention, wherein reference numeral 100 is The present invention is a heating device.
본 발명인 가열장치(100)는 첨부 도면 도 1 내지 도 3에서 보는 바와 같이, 엘씨디 글라스(1) 표면에 감광막(P) 코팅을 위해 세정 후, 수분 제거를 위한 건조 장치에 구비된 가열장치(100)에 있어서, 안착되는 엘씨디 글라스(1)를 승강시키도록 하는 승강핀(10)과, 승강핀(10)에 안착되어 하강하는 엘씨디 글라스(1)를 정위치로 유도하는 다수개의 가이더(20)와, 가이더(20)를 타고 하강하는 엘씨디 글라스(1)의 저면에 점접촉하여 핫플레이트(100')와 소정의 간격으로 이격지도록 핫플레이트(100') 상부면에 돌출된 다수개의 지지핀(30)으로 이루어져 있다.The heating device 100 of the present invention is a heating device 100 provided in the drying device for removing water after cleaning for coating the photosensitive film (P) on the surface of the LCD glass 1, as shown in Figure 1 to Figure 3 ), A plurality of guiders 20 for elevating the lifted glass 10 to elevate the LCD glass 1 to be seated, and the LCD glass 1 seated on the lift pin 10 to descend to the home position. And a plurality of support pins protruding from the top surface of the hot plate 100 'to be spaced apart from the hot plate 100' at predetermined intervals by being in point contact with the bottom surface of the LCD glass 1 descending on the guider 20 ( 30).
상기, 승강핀(10)은 핫플레이트(100') 상부면으로 돌출되는 안착편(11)과, 핫플레이트(100')의 승강 구멍(100'-1)에 삽입되는 승강편(12)으로 구분되어, 핫플레이트(100') 하부의 승강 작동 수단(13)에 의해 승강되도록 이루어져 있다.The lifting pins 10 are seating pieces 11 protruding to the upper surface of the hot plate 100 'and lifting pieces 12 inserted into the lifting holes 100'-1 of the hot plate 100'. Separately, it is made to be elevated by the lifting operation means 13 below the hot plate (100 ').
가이더(20)는 소정의 두께를 갖는 사각 판체 형상으로 이루어지되, 길이 방향의 일측 단부에 핫플레이트(100') 상부면과 나사 결합되어 고정되도록 하는 고정 구멍(21)이 형성되고, 길이 방향의 타측 단부에는 상부에서 하부로 경사진 경사면(22)이 형성되어 하강하는 엘씨디 글라스(1)가 미끄러지며 정위치로 이동하도록 이루어져 있다.The guider 20 is formed in a rectangular plate shape having a predetermined thickness, and a fixing hole 21 is formed at one end of the longitudinal direction to be screwed and fixed to the upper surface of the hot plate 100 ′, The other end is formed with an inclined surface 22 inclined from the top to the bottom is formed so that the descending LCD glass 1 slides and moves to the correct position.
지지핀(30)은 상광하협의 다단으로 이루어진 핀 형상으로 되면서, 상부 꼭지점이 120도 이하의 둔각으로 이루어져 엘씨디 글라스와 점접촉되는 접촉편(31)과, 접촉편(31)과 일체로 형성되면서 직하부로 연장되어 핫플레이트(100')의 상부면에 삽입고정되는 고정편(32)으로 이루어져 있다.The support pin 30 is a pin shape consisting of a multi-stage of the ordinary light lower narrow, while the upper vertex is formed at an obtuse angle of 120 degrees or less, being formed integrally with the contact piece 31 and the contact piece 31 in point contact with the LCD glass It consists of a fixing piece 32 extending directly below and inserted into the upper surface of the hot plate 100 '.
이와 같은 구조로 이루어진 본 발명은 첨부 도면 도 4의 a,b에서 보는 바와 같이, 세정된 엘씨디 글라스(1)가 핫플레이트(100')의 상부면에 설치된 승간핀(10)의 안착편(11)에 안착된 후, 승강핀(10) 하부에 구비된 승강 작동 수단(13)이 동작하여 승강핀(10)이 하강하면, 승강핀(10)의 안착편(11)에 안착된 엘씨디 글라스(1)가 하강하여, 가이더(20)의 경사면(22)을 타고 하방에 위치한 지지핀(30)의 접촉편(31)의 정위치로 유도되어 안착되게 된다.According to the present invention having such a structure, as shown in FIGS. 4A and 4B, the seated piece 11 of the gantry pin 10 having the cleaned LCD glass 1 installed on the upper surface of the hot plate 100 ′ is mounted. After being seated on), when the lifting pin 10 is lowered by the lifting operation means 13 provided below the lifting pin 10, the LCD glass seated on the mounting piece 11 of the lifting pin 10 ( 1) is lowered, and guided to the correct position of the contact piece 31 of the support pin 30 located below the inclined surface 22 of the guider 20 to be seated.
이와 같이, 지지핀(30)의 접촉편(31)에 엘씨디 글라스(1)가 안착된 상태에서 핫플레이트(100')의 열에 의해 세정액을 증발시키게 되므로, 안착 당시 핫플레이트(100')와 엘씨디 글라스(1) 간의 정전기 발생을 방지하며, 직접 가열에 따른 열전도를 최소화하여 급작스런 온도 변화에 의해 엘씨디 글라스(1)에 미세 균열이 발생하거나, 얼룩이 지는 것을 방지하게 된다.As such, since the liquid is evaporated by the heat of the hot plate 100 'in the state in which the LCD glass 1 is seated on the contact piece 31 of the support pin 30, the hot plate 100' and the CD at the time of mounting are evaporated. It prevents the generation of static electricity between the glass (1), and minimizes the heat conduction due to direct heating to prevent the occurrence of minute cracks or stains in the LCD glass 1 by a sudden temperature change.
첨부 도면 도 5에서 보는 바와 같이, 지지핀(30)의 접촉편(31) 상부면 내측으로 다단의 끼움홈(33)을 형성하고, 끼움홈(33)에 삽입되는 지지핀(30) 형상의 지지부재(34)가 상부로 부분 돌출되도록 구성하여, 핫플레이트(100')의 열이 엘씨디 글라스(1)로 전달되는 것을 최소화하고, 핫플레이트(100')와 엘씨디 글라스(1)의간격을 조절할 수도 있는 것이다.As shown in FIG. 5, a multi-stage fitting groove 33 is formed inside the upper surface of the contact piece 31 of the supporting pin 30, and the support pin 30 is inserted into the fitting groove 33. The support member 34 is configured to partially protrude upward, thereby minimizing the transfer of heat from the hot plate 100 'to the LCD glass 1, and reducing the gap between the hot plate 100' and the LCD glass 1 It can also be adjusted.
또한, 첨부 도면 도 6에서 보는 바와 같이, 지지핀(30)의 접촉편(31)을 반구 형상으로 하여 하강하는 엘씨디 글라스의 하중에 의해 엘씨디 글라스가 파손될 수 있는 경우의 수를 최소화는 것도 바람직한 것이다.In addition, as shown in FIG. 6, it is also desirable to minimize the number of cases where the LCD glass can be damaged by the load of the descending LCD glass by making the contact piece 31 of the support pin 30 into a hemispherical shape. .
본 발명의 승강핀(10)과 지지핀(30)에는 엘씨디 글라스(1) 안착 시, 충격을 흡수하도록 하는 완충부재를 구비하는 것도 바람직한 것이다.Lift pin 10 and the support pin 30 of the present invention is also preferably provided with a cushioning member to absorb the shock when seating the LCD glass (1).
이와 같이 되는 본 발명은 엘씨디 글라스 표면에 감광막 코팅을 위해 세정 후 수분 제거를 위한 가열 건조 공정 수행 시, 글라스와 핫플레이트가 점접촉 된 상태에서 가열 건조가 이루어지도록 하여 정전기 발생에 의한 미끄럼짐을 방지하며, 대면적 글라스에 민감한 얼룩의 발생을 방지함으로써, 엘씨디 글라스의 수율이 향상되도록 하는 불량률 감소와 생산성이 향상되는 효과를 갖는다.The present invention as described above is to prevent the sliding caused by the generation of static electricity by performing the heat drying in the contact state of the glass and the hot plate in the point contact when performing the heat drying process for removing moisture after cleaning for the photosensitive film coating on the LCD glass surface By preventing the occurrence of stains sensitive to the large area glass, it has the effect of reducing the defect rate and productivity to improve the yield of the LCD glass.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020020008385A KR20030068773A (en) | 2002-02-18 | 2002-02-18 | The hot plate structure for dehydrate and pre bake of LCD glass |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020020008385A KR20030068773A (en) | 2002-02-18 | 2002-02-18 | The hot plate structure for dehydrate and pre bake of LCD glass |
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| Publication Number | Publication Date |
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| KR20030068773A true KR20030068773A (en) | 2003-08-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| KR1020020008385A KR20030068773A (en) | 2002-02-18 | 2002-02-18 | The hot plate structure for dehydrate and pre bake of LCD glass |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100940185B1 (en) * | 2008-06-04 | 2010-02-10 | (주)에스티아이 | Apparatus for drying substrate |
| KR101410283B1 (en) * | 2013-04-23 | 2014-06-20 | (주)거성 | Support pin assembly for baking apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH08124818A (en) * | 1994-10-26 | 1996-05-17 | Tokyo Electron Ltd | Heat treatment device |
| KR19980080626A (en) * | 1997-03-25 | 1998-11-25 | 히가시테쯔로우 | Treatment device and treatment method |
| JPH11354618A (en) * | 1998-06-05 | 1999-12-24 | Tokyo Electron Ltd | Processor |
| JP2000353653A (en) * | 1999-06-10 | 2000-12-19 | Tokyo Electron Ltd | Substrate placement device |
| KR20010058812A (en) * | 1999-12-30 | 2001-07-06 | 박종섭 | Wafer bake apparatus for semiconductor bake system |
| JP2001267217A (en) * | 2000-03-17 | 2001-09-28 | Tokyo Electron Ltd | Heating treatment equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08124818A (en) * | 1994-10-26 | 1996-05-17 | Tokyo Electron Ltd | Heat treatment device |
| KR19980080626A (en) * | 1997-03-25 | 1998-11-25 | 히가시테쯔로우 | Treatment device and treatment method |
| JPH11354618A (en) * | 1998-06-05 | 1999-12-24 | Tokyo Electron Ltd | Processor |
| JP2000353653A (en) * | 1999-06-10 | 2000-12-19 | Tokyo Electron Ltd | Substrate placement device |
| KR20010058812A (en) * | 1999-12-30 | 2001-07-06 | 박종섭 | Wafer bake apparatus for semiconductor bake system |
| JP2001267217A (en) * | 2000-03-17 | 2001-09-28 | Tokyo Electron Ltd | Heating treatment equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100940185B1 (en) * | 2008-06-04 | 2010-02-10 | (주)에스티아이 | Apparatus for drying substrate |
| KR101410283B1 (en) * | 2013-04-23 | 2014-06-20 | (주)거성 | Support pin assembly for baking apparatus |
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