CN107966886B - Heating device and photoetching equipment - Google Patents
Heating device and photoetching equipment Download PDFInfo
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- CN107966886B CN107966886B CN201810056859.2A CN201810056859A CN107966886B CN 107966886 B CN107966886 B CN 107966886B CN 201810056859 A CN201810056859 A CN 201810056859A CN 107966886 B CN107966886 B CN 107966886B
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/38—Treatment before imagewise removal, e.g. prebaking
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
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- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The embodiment of the application provides a heating device and a photoetching device, relates to the technical field of display, and is used for solving the problem that a glass substrate and a heating plate are not easy to separate after a pre-baking or post-baking process is finished. The heating device comprises a heating disc; the heating plate includes a plurality of sub-heating parts; the adjacent sub heating parts are connected through movable connecting pieces, and the two adjacent sub heating parts are folded or unfolded through the movable connecting pieces; the heating device further comprises a plurality of positioning parts, the positioning parts are located at the positions where the two adjacent sub-heating parts are connected, and the positioning parts are used for limiting the included angle between the adjacent sub-heating parts. The heating device is used for heating the substrate base plate.
Description
Technical Field
The invention relates to the technical field of display, in particular to a heating device and a photoetching device.
Background
As a flat panel Display device, a TFT-L CD (Thin Film Transistor-liquid Crystal Display L) is increasingly used in the field of high performance Display because of its features of small size, low power consumption, no radiation, relatively low manufacturing cost, etc.
In the TFT-L CD, a photolithography process is performed on a thin film layer to form a predetermined thin film pattern, wherein, in the photolithography process, after a photoresist is coated on a glass substrate, a pre-Bake (softbaker), exposure, development, and post-Bake (Hard baker) processes are performed on the photoresist.
In the prior art, a heating plate is used for heating a glass substrate so as to perform pre-baking or post-baking on a photoresist. However, since the adsorption force between the glass substrate and the heating plate is large, after the current baking or the post-baking process is finished, the glass substrate needs to be separated from the heating plate by using a large force, so that the glass substrate is easily broken, and the product quality is reduced.
Disclosure of Invention
The embodiment of the invention provides a heating device and photoetching equipment, which are used for solving the problem that a glass substrate and a heating plate are not easy to separate after a pre-baking process or a post-baking process is finished.
In order to achieve the above purpose, the embodiment of the invention adopts the following technical scheme:
in one aspect of the embodiments of the present application, there is provided a heating apparatus including a heating pan; the heating pan includes a plurality of sub-heating parts; the adjacent sub heating parts are connected through a movable connecting piece, and the two adjacent sub heating parts are folded or unfolded through the movable connecting piece; the heating device further comprises a plurality of positioning parts, the positioning parts are located at the positions where the two adjacent sub heating parts are connected, and the positioning parts are used for limiting the included angle between the adjacent sub heating parts.
Optionally, the positioning part is arranged on one side opposite to the bearing surface of the heating plate; the heating device also comprises a first lifting mechanism connected with one end of the positioning part, which is far away from the heating plate; the first lifting mechanism is used for driving the positioning part to move along the direction vertical to the heating disc bearing surface.
Optionally, the heating device further comprises a plurality of support columns; the sub heating part is provided with a via hole used for penetrating the supporting column.
Optionally, the heating device further comprises a second lifting mechanism connected to one end of the supporting column away from the heating plate; the second lifting mechanism is used for driving the supporting column to move along the direction vertical to the heating disc bearing surface.
Optionally, the movable connector is a hinge.
Optionally, the sub-heating portions are strip-shaped, and the sub-heating portions are arranged side by side.
Optionally, the sub-heating part is provided with a vacuum adsorption hole; the heating device further comprises a vacuum adsorption device, and the position of an air suction opening of the vacuum adsorption device corresponds to the position of the vacuum adsorption hole.
Optionally, water pipes are arranged inside the sub-heating portions.
Optionally, the plurality of support columns are uniformly distributed.
In a further aspect of an embodiment of the present application, there is provided a lithographic apparatus including a heating device as described above.
The embodiment of the application provides a heating device and a lithography apparatus, after a current baking or postbaking process is finished, a heating plate in the heating device does not need to heat photoresist on a substrate, and at the moment, each sub-heating part in the heating plate is under the limiting action of a positioning part, is under the action of gravity, cannot keep a horizontal state, and is inclined. Therefore, a larger gap is formed between the bearing surface of the heating plate and the substrate base plate, and surrounding air enters the gap, so that the adsorption force between the heating plate and the substrate base plate can be reduced, at the moment, the substrate base plate can be separated from the heating plate by using smaller force, the probability of breakage of the substrate base plate can be reduced, and the product quality is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a heating plate according to an embodiment of the present application;
FIG. 2 is a schematic view of another state of the heating plate shown in FIG. 1;
FIG. 3 is a schematic structural diagram of another heating plate provided in the embodiments of the present application;
fig. 4 is a schematic view showing a state of each sub-heating section in the heating pan shown in fig. 3;
fig. 5 is a schematic view showing another state of each sub-heating section in the heating pan shown in fig. 3;
fig. 6 is a schematic structural diagram of a positioning portion for defining two adjacent sub-heating portions in the heating plate shown in fig. 3;
FIG. 7 is a schematic structural view of the heating plate shown in FIG. 3 with vias disposed thereon;
fig. 8 is a schematic view showing still another state of each sub-heating section in the heating plate shown in fig. 3.
Reference numerals:
01-substrate base plate; 10-heating the plate; 101-sub heating section; 102-a movable connection; 20-a positioning section; 201-a hook; 202-a pin; 21-a first lifting mechanism; 30-a support column; 31-a via; 32-a second lifting mechanism; 40-vacuum adsorption holes.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The embodiment of the present application provides a heating device, as shown in fig. 1, including a heating plate 10. Wherein the heating plate 10 includes a plurality of sub-heating parts 101.
The adjacent sub heating portions 101 are connected by a movable connection member 102. Alternatively, the articulating member 102 may be an articulating member. In this case, the adjacent two sub-heating parts 101 may relatively move by the movable connection member 102, thereby achieving folding or unfolding of the adjacent two sub-heating parts 101.
In this case, the included angle α (shown in fig. 2) between two adjacent sub-heating sections 101 may be varied within a range of 0 ° to 180 °.
The plurality of sub-heating units 101 may be block-shaped as shown in fig. 1, and the heating plate 10 may be formed by splicing a plurality of block-shaped sub-heating units 101.
Alternatively, as shown in fig. 3, the sub-heating part 101 may be in a strip shape, in which case, a plurality of strip-shaped sub-heating parts 101 are arranged side by side to splice the heating plate 10.
It should be noted that, when an included angle α between any one sub-heating part 101 in the heating plate 10 and the adjacent sub-heating part 101 is 180 ° as shown in fig. 4, the shape of the heating plate 10 spliced by the sub-heating parts 101 may be identical to the shape of the substrate 01 for carrying the photoresist to be dried, and in addition, optionally, the area of the heating plate 10 is larger than the area of the substrate, so that when each sub-heating part 101 is in a horizontal state, as shown in fig. 4, the substrate 01 may be supported, and the photoresist on the substrate 01 may be subjected to a pre-baking or post-baking process.
The substrate for bearing the photoresist may be made of glass or resin, which is not limited in this application.
Based on this, in order to perform pre-baking or post-baking of the photoresist formed on the substrate 01 by the heating plate 10 composed of the plurality of sub-heating parts 101, water pipes may be alternatively arranged inside the sub-heating parts 101. In this case, the water pipe in each sub-heating part 101 is connected to a water supply device, so that hot water in the water supply device is supplied into the water pipe, thereby drying the photoresist.
Of course, a resistance wire may be disposed inside the sub-heating portion 101, and the resistance wire is powered on to generate heat to dry the photoresist.
In this case, since the heating plate 10 provided in the embodiment of the present application is composed of the plurality of sub-heating portions 101, and the arrangement path of the water pipe or the resistance wire in each sub-heating portion 101 is short, the amount of heat provided by each sub-heating portion 101 to the substrate base plate 01 is substantially the same, so that each part of the entire substrate base plate 01 is uniformly heated, thereby avoiding the longer arrangement path superior to the water pipe or the resistance wire, which leads to a loss of heat in the transmission process, and making the heat of the part of the heating plate 10 farther from the heat source (for example, a water supply device) smaller than the part closer to the heat source.
Based on this, in order to further improve the uniformity of the heating heat of the heating plate 10, optionally, the shape and the size of each sub-heating part 101 in the heating plate 10 are the same.
On this basis, in order to enable each sub-heating part 101 in the heating plate 10 provided by the present application to maintain a horizontal state when the heating plate 10 heats the photoresist on the substrate 01, as shown in fig. 4, the heating apparatus may further include a plurality of positioning parts 20, where the positioning parts 20 are located at positions where two adjacent sub-heating parts 10 meet, and the positioning parts 20 are used to define an included angle α between the adjacent sub-heating parts 10.
Specifically, as shown in fig. 5, the positioning part 20 may be provided on a side opposite to the carrying surface of the heating plate 10.
The carrying surface of the heating plate 10 is the surface of the heating plate 10 contacting with the substrate base plate 01.
On this basis, the heating device further comprises a first lifting mechanism 21 connected with one end of the positioning part 20 departing from the heating plate 10. The first elevating mechanism 21 is used to drive the positioning part 20 to move in a direction perpendicular to the loading surface of the heating pan 10 (the direction indicated by the arrow in fig. 5).
In this case, in a natural state, each sub-heating part 10 of the heating plate 10 is displaced by the movable connection member 102 between two adjacent sub-heating parts 10 under the action of gravity to be in an inclined state, and an included angle α between two adjacent sub-heating parts 10 is smaller than 180 ° and is in a folded state of each sub-heating part 10.
When the heating plate 10 needs to heat the photoresist on the substrate 01, the first lifting mechanism 21 drives each positioning portion 20 to move upwards, and since the positioning portions 20 are disposed at the positions where two adjacent sub-heating portions 10 meet, the positioning portions 20 can support the positions where two adjacent sub-heating portions 10 meet, so that the included angle α between two adjacent sub-heating portions 10 is increased to 180 °, and at this time, each sub-heating portion 10 is kept horizontal, so that the substrate 01 can be supported.
Accordingly, after the pre-baking or post-baking process is finished, the heating plate 10 does not need to heat the photoresist on the substrate base 01, and at this time, the first lifting mechanism 21 drives the respective positioning portions 20 to move downward, and at this time, the respective sub-heating portions 10 in the heating plate 10 are not supported by the positioning portions 20, and cannot be maintained in a horizontal state due to the gravity, and are inclined. Therefore, a larger gap is formed between the bearing surface of the heating plate 10 and the substrate base plate 01, and surrounding air enters the gap, so that the adsorption force between the heating plate 10 and the substrate base plate 01 can be reduced, at the moment, the substrate base plate 01 can be separated from the heating plate 10 by using smaller force, the probability of cracking of the substrate base plate can be reduced, and the product quality is improved.
In addition, as shown in fig. 6, the positioning portion 20 may be still disposed at a position where two adjacent sub-heating portions 10 meet, and the positioning portion 20 is located on a side surface of the heating plate 10. Wherein, the side of the heating plate 10 is perpendicular to the bearing surface of the heating plate 10.
In this case, the positioning part 20 includes a hook 201 fixedly installed on one sub-heating part 10 of the two adjacent sub-heating parts 10, and a pin 202 fixedly installed on the other sub-heating part 10, when the hook 201 is engaged with the pin 202, an included angle α between the two adjacent sub-heating parts 10 is defined at 180 °, so that each sub-heating part 10 maintains a horizontal state to heat the substrate 01.
Based on this, after the current baking or post-baking process is finished, the hook 201 is detached from the pin 202. At this time, the sub-heating part 10 is inclined by gravity after losing the supporting function of the positioning part 20, so that the gap between the supporting surface of the heating plate 10 and the substrate base plate 01 is increased, and the substrate base plate 01 is easily separated from the heating plate 10.
On this basis, in order to separate the substrate base plate 01 from the heating plate 10 after the end of the current baking or post-baking process, the heating apparatus may further include a plurality of support columns 30, as shown in fig. 3.
As shown in fig. 7, the sub heating part 101 is provided with a through hole 31 for passing through the support column 30.
The via hole 31 may be provided at the center of the sub-heating unit 101, or may be provided at a position where two adjacent sub-heating units 10 meet, which is not limited in the present application.
On this basis, as shown in fig. 8, the heating device further includes a second lifting mechanism 32 connected to an end of the supporting column 30 facing away from the heating plate 101.
The second elevating mechanism 32 is used to drive the supporting column 30 to move in a direction perpendicular to the carrying surface of the heating pan 10 (the direction indicated by the arrow in fig. 8).
In this case, when the heating plate 10 needs to heat the photoresist on the substrate base 01, the second elevating mechanism 32 drives the respective support columns 30 to move downward so that the respective support columns 30 are located below the heating plate 10.
After the pre-baking or post-baking process is finished, the heating plate 10 does not need to heat the photoresist on the substrate 01, and at this time, each sub-heating part 10 in the heating plate 10 is folded by the positioning part 20. In this case, the second elevating mechanism 32 drives the respective supporting columns 30 to move upward so that the respective supporting columns 30 pass through the respective via holes 31 on the sub-heating part 10 and come into contact with the substrate base 01. Since each sub-heating part 10 of the heating plate 10 is folded, a large gap is formed between the supporting surface of the heating plate 10 and the substrate base plate 01, and air is filled in the gap, so that the adsorption force between the supporting surface of the heating plate 10 and the substrate base plate 01 is small, and in this case, the substrate base plate 01 can be easily lifted up by each supporting column 30 passing through the through hole 31, thereby achieving the purpose of separating the substrate base plate 01 from the heating plate 10.
Based on this, in order to make the substrate base plate 01 uniformly stressed in the process of being lifted up, optionally, the plurality of support columns 10 may be uniformly distributed.
The first lifting mechanism 21 and the second lifting mechanism 32 may be hydraulic devices including a plurality of hydraulic rods. With the first elevating mechanism 21, each hydraulic rod is connected to the positioning portion 20. For the second elevating mechanism 32, each hydraulic rod is connected to the support column 10.
In addition, in the process of heating the photoresist on the substrate 01 by the heating plate 10, in order to prevent the substrate 01 from being displaced, as shown in fig. 3, a vacuum adsorption hole 40 may be optionally provided on the sub-heating part 101.
The vacuum suction hole 40 may be disposed at a central position of the sub-heating portions 101, or the vacuum suction hole 40 may be disposed at a position where two adjacent sub-heating portions 101 are connected, which is not limited in the present application.
On this basis, the heating device further comprises a vacuum suction device (not shown), and the position of the air suction opening of the vacuum suction device corresponds to the position of the vacuum suction hole 40. In this case, when each sub-heating part 101 of the heating plate 10 is in a horizontal state, the vacuum adsorption device is turned on, and the vacuum adsorption device extracts air from the vacuum adsorption hole 40 through the air suction opening thereof, so that the space between the substrate 01 and the carrying surface of the heating plate 10 is in a vacuum state, thereby achieving the purpose of vacuum-adsorbing the substrate 01, and thus preventing the substrate 01 from being displaced during the process of performing the pre-baking or post-baking process.
Hereinafter, a process of heating the photoresist on the substrate base 01 using the heating apparatus provided in the embodiments of the present application will be described in detail.
First, as shown in fig. 5, each of the positioning parts 20 is driven to move upward by the first elevating mechanism 21, and the sub-heating part 101 in a naturally drooping state is gradually rotated to a horizontal state by the pushing action of the positioning part 20, at which time the entire carrying surface of the heating pan 10 is spread.
Next, the position of the air suction opening of the vacuum adsorption device corresponds to the position of the vacuum adsorption hole 40, and the vacuum adsorption device is turned on to draw air between the substrate base plate 01 and the bearing surface of the heating plate 10, so that the substrate base plate 01 is tightly attached to the bearing surface of the heating plate 10.
Next, hot water is supplied to the water pipe in each sub-heating part 101 through a water supply device so that the sub-heating part 101 transfers heat to the photoresist on the substrate base plate 01, thereby performing a pre-baking or post-baking process on the photoresist.
Wherein the temperature of the hot water supplied from the water supply device can be adjusted as required by those skilled in the art.
Next, after the pre-baking or the post-baking process is finished, each positioning part 20 is driven to move downward by the first elevating mechanism 21, and the heating plate 10 is in a contracted state when each sub-heating part 101 hangs down at one end by gravity and is in an inclined state.
In this case, a large gap is formed between the substrate base plate 01 and the bearing surface of the heating plate 10, and ambient air enters the gap, so that a vacuum state between the substrate base plate 01 and the bearing surface of the heating plate 10 is broken, and an adsorption force between the substrate base plate 01 and the bearing surface of the heating plate 10 is reduced.
Next, each supporting column 30 is moved upward by the second elevating mechanism 32, and passes through the via hole on the sub-heating part 101 to be in contact with the substrate base plate 01. On this basis, each supporting column 30 continues to move upward by further driving of the second elevating mechanism 32, so that the substrate base plate 01 is completely detached from the carrying surface of the heating plate 10.
At this time, the photoresist on the substrate base plate 01 completes the pre-baking or post-baking process, and the substrate base plate 01 may be moved to the next process equipment by a robot or an adsorption structure.
As described above, before the supporting pillars 30 lift the substrate base 01, since the adsorption force between the substrate base 01 and the carrying surface of the heating plate 10 is greatly reduced, the substrate base 01 can be completely separated from the carrying surface of the heating plate 10 with a small force, thereby preventing the substrate base 01 from being damaged and improving the product quality.
Embodiments of the present application provide a lithographic apparatus comprising any one of the heating devices described above.
The lithographic apparatus has the same technical effects as the heating device provided in the previous embodiment, and the details are not repeated herein.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. A heating device is applied to a photoetching equipment, and the heating device comprises a heating plate; the heating pan includes a plurality of sub-heating parts;
the adjacent sub heating parts are connected through a movable connecting piece, and the two adjacent sub heating parts are folded or unfolded through the movable connecting piece;
the heating device also comprises a plurality of positioning parts, and the positioning parts are positioned at the positions where two adjacent sub heating parts are connected;
when the heating plate works, the positioning part supports the position where two adjacent sub heating parts are connected, so that each sub heating part is kept in a horizontal state; when the heating plate does not work, each sub-heating part in the heating plate can be inclined under the action of gravity under the condition that the positioning part is not used for supporting.
2. The heating device according to claim 1, wherein the positioning portion is provided on a side opposite to a carrying surface of the heating pan;
the heating device also comprises a first lifting mechanism connected with one end of the positioning part, which is far away from the heating plate; the first lifting mechanism is used for driving the positioning part to move along the direction vertical to the heating disc bearing surface.
3. The heating device of claim 1, further comprising a plurality of support posts; the sub heating part is provided with a via hole used for penetrating the supporting column.
4. The heating device of claim 3, further comprising a second lifting mechanism coupled to an end of the support column facing away from the heating pan; the second lifting mechanism is used for driving the supporting column to move along the direction vertical to the heating disc bearing surface.
5. The heating device of claim 1, wherein the articulating member is a hinge.
6. The heating device according to claim 1, wherein the sub-heating part has a strip shape, and a plurality of the sub-heating parts are arranged side by side.
7. The heating device according to claim 1, wherein the sub-heating portion is provided with a vacuum adsorption hole;
the heating device further comprises a vacuum adsorption device, and the position of an air suction opening of the vacuum adsorption device corresponds to the position of the vacuum adsorption hole.
8. The heating apparatus according to claim 1, wherein a water pipe is arranged inside the sub-heating part.
9. The heating device of claim 3, wherein the plurality of support posts are evenly distributed.
10. A lithographic apparatus comprising a heating device according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810056859.2A CN107966886B (en) | 2018-01-19 | 2018-01-19 | Heating device and photoetching equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810056859.2A CN107966886B (en) | 2018-01-19 | 2018-01-19 | Heating device and photoetching equipment |
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| CN107966886A CN107966886A (en) | 2018-04-27 |
| CN107966886B true CN107966886B (en) | 2020-07-14 |
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| CN201810056859.2A Active CN107966886B (en) | 2018-01-19 | 2018-01-19 | Heating device and photoetching equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111315058B (en) * | 2020-03-26 | 2024-09-03 | 佛山市纪元高频设备有限公司 | Angular dressing electrode |
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| JP2002313700A (en) * | 2001-04-16 | 2002-10-25 | Canon Inc | Heating device and cooling device |
| KR20050067716A (en) * | 2003-12-29 | 2005-07-05 | 엘지.필립스 엘시디 주식회사 | Photo-resist coating apparatus |
| CN103466927A (en) * | 2013-09-09 | 2013-12-25 | 深圳市华星光电技术有限公司 | Device and method for baking substrate |
| CN103760753A (en) * | 2013-12-31 | 2014-04-30 | 深圳市华星光电技术有限公司 | Substrate roasting device and temperature adjustment method thereof |
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| JP3933765B2 (en) * | 1997-08-27 | 2007-06-20 | 大日本スクリーン製造株式会社 | Substrate heat treatment method and apparatus |
| CN102339780B (en) * | 2011-09-30 | 2013-07-17 | 格科微电子（上海）有限公司 | Adsorbing and supporting device of wafer and substrate and semiconductor processing equipment of wafer |
| CN103274604B (en) * | 2013-04-23 | 2015-05-06 | 北京京东方光电科技有限公司 | Substrate heating equipment |
| CN106175302A (en) * | 2016-07-12 | 2016-12-07 | 佛山杰致信息科技有限公司 | A kind of heating screen |
| CN106054541B (en) * | 2016-08-12 | 2019-09-20 | 武汉华星光电技术有限公司 | Prebake conditions equipment |
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| JP2002313700A (en) * | 2001-04-16 | 2002-10-25 | Canon Inc | Heating device and cooling device |
| KR20050067716A (en) * | 2003-12-29 | 2005-07-05 | 엘지.필립스 엘시디 주식회사 | Photo-resist coating apparatus |
| CN103466927A (en) * | 2013-09-09 | 2013-12-25 | 深圳市华星光电技术有限公司 | Device and method for baking substrate |
| CN103760753A (en) * | 2013-12-31 | 2014-04-30 | 深圳市华星光电技术有限公司 | Substrate roasting device and temperature adjustment method thereof |
| CN104864452A (en) * | 2015-06-01 | 2015-08-26 | 鞍山市阁瑞节能科技有限公司 | Folding type clothes drying heater and installation method thereof |
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| CN107966886A (en) | 2018-04-27 |
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