KR101410283B1 - Support pin assembly for baking apparatus - Google Patents

Support pin assembly for baking apparatus Download PDF

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Publication number
KR101410283B1
KR101410283B1 KR1020130044646A KR20130044646A KR101410283B1 KR 101410283 B1 KR101410283 B1 KR 101410283B1 KR 1020130044646 A KR1020130044646 A KR 1020130044646A KR 20130044646 A KR20130044646 A KR 20130044646A KR 101410283 B1 KR101410283 B1 KR 101410283B1
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KR
South Korea
Prior art keywords
support
hole
pin assembly
fixing
support portion
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KR1020130044646A
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Korean (ko)
Inventor
김춘
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(주)거성
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Priority to KR1020130044646A priority Critical patent/KR101410283B1/en
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Publication of KR101410283B1 publication Critical patent/KR101410283B1/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H01L21/3247—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering for altering the shape, e.g. smoothing the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Disclosed is a support pin assembly for a baking apparatus. According to the present invention, the support pin assembly for a baking apparatus includes a support portion used in a baking process of semiconductors and supporting the base of a substrate from the bottom; a fixing portion coupled to the bottom of the support portion; and a joining portion for mutually connecting the support portion and fixing portion. According to the present invention, the support pin assembly is not an integrated body, and the support portion and fixing portion are made of different material while being coupled by the joining portion. Therefore, when an impact occurs during the baking process, a lower part of the support portion is damaged first, thus effectively preventing the substrate from being damaged by an upper end part of the support portion.

Description

Technical Field [0001] The present invention relates to a support pin assembly for a baking apparatus,

The present invention relates to a support pin assembly, and more particularly, to a support pin assembly for a baking apparatus that supports a wafer substrate in a baking process during semiconductor manufacturing.

Photolithography is a technique for transferring a shadow produced by irradiating light onto a mask substrate having a circuit pattern formed thereon and transferring the shadow onto a wafer, and is a process for forming a pattern designed on a wafer in a semiconductor manufacturing process.

Materials used in semiconductor devices are not exposed to light, and their characteristics are not changed. In order to transfer the circuit design of the mask master plate to the wafer through an exposure process, a medium is required. The medium is called a photoresist (PR). A photoresist refers to a material that receives light of a specific wavelength and can selectively remove a light-receiving portion and a non-light-receiving portion during a subsequent development process by using a property that the solubility of the developer is changed.

Photolithography processes include coating, soft bake, exposure and post exposure, development, and hard bake processes.

Here, the soft bake process is performed at a low temperature to remove the organic solvent remaining in the photoresist after the coating process, to prevent the exposure facility and the mask contamination due to the residual solvent, and to maintain the photoresist reaction characteristic constant. By heating to about 110 ° C, the solvent is removed and the density of the photosensitizer is increased to reduce the sensitivity to environmental changes.

After the soft bake process, the wafer and the mask are precisely aligned and the exposure process proceeds. After the exposure, the wafer is baked again. The post exposure bake (PEB) is a very important process for pattern formation through the diffusion of the photoresist. In particular, in the case of ArF PR using 193 nm wavelength, a chemical amplified resist (CAR) is often used. In this case, since the chemical amplification reaction occurs through the PEB process, the influence of the PEB temperature on the sensitivity of the photosensitizer very big.

When the development is complete, remove the developer and finally perform a hard bake as necessary. First, the photosensitive agent is thoroughly rinsed with DI water to remove the remaining photosensitive agent, followed by drying. Then, the photosensitive agent is baked at a temperature slightly higher than the glass transition temperature of the photosensitive agent so that the photosensitive agent is not deformed.

Korean Patent Publication No. 2002-0080593 discloses a "baking apparatus for semiconductor device manufacturing" in connection with the baking process for manufacturing such a semiconductor, and specifically, it is installed at each corner inside the chamber for performing the baking process A heater that heats the inside of the chamber, a temperature sensor that is installed at each corner of the chamber to detect the temperature inside the chamber, and a power supply to the heater by analyzing the temperature inside the chamber by the temperature sensing signal of the temperature sensor And three tapered pins for supporting the wafer in the lower part of the chamber. In this baking apparatus, the wafer is heated by convection of air by providing a heater at each corner inside the cubic chamber, Uneven heating of the wafer, which can occur when a bake plate is used, The risk of contamination of the image and the operator due to the contact failure of the bake plate and wafer on the baking process, discloses that it is possible to prevent that.

Korean Patent Laid-Open Publication No. 2006-0053044 discloses a " wafer baking apparatus ", which specifically includes a hot plate for heating a wafer, and a hot plate formed at an edge of the upper surface of the hot plate, A support plate for supporting the wafer; a rotation driving means for rotating the support pins, the support plate being rotatably mounted on the inner surface of the support plate, The radiant heat transmitted from the hot plate is uniformly transmitted to each region within the wafer even if the temperature distribution on the hot plate is not uniform, Which is caused by the unevenness in the temperature distribution of the wafer It describes a pattern with no defect is not generated.

In this way, in the baking process, a support pin, which is generally pointed upward and supports the wafer substrate, is usually made of carbon, and wear and particles are generated at the top end portion and the bottom fixing portion, There is a problem that the wafer substrate is damaged and defective.

Particularly, when a shock occurs due to malfunction of the manufacturing apparatus during the baking process, the sharp upper end of the support pin applies a strong impact to the wafer substrate, thereby causing a problem that the substrate is broken or damaged. There has been a problem that the pin is deformed, leaving a mark on the wafer substrate.

(0001) Korean Patent Publication No. 2002-0080593 (Published on October 26, 2002) (0002) Korean Patent Publication No. 2006-0053044 (public date: May 19, 2006)

SUMMARY OF THE INVENTION It is an object of the present invention to provide a semiconductor device manufacturing method and a semiconductor device manufacturing method in which a support pin for supporting a wafer substrate in a bake process during a semiconductor manufacturing process is formed, Which is capable of preventing damage to the support pins of the baking apparatus.

The above object can be attained by a semiconductor device comprising: a support for supporting a bottom surface of a substrate on a lower side of a substrate, A fixing part coupled to a lower side of the supporting part; And a fastening portion connecting the support portion and the fixing portion to each other.

The support portion and the fixing portion may be made of different materials.

Further, the support portion may have a lower strength than the fixing portion and the fastening portion.

Further, the supporting portion may be made of engineering plastic, and the fixing portion may be made of stainless steel.

In the support pin assembly for a baking apparatus according to the present invention, the support portion may include a tip portion whose diameter decreases toward the upper side; And a coupling protrusion protruding from the lower end of the tip portion, wherein the fixing portion includes: a seating portion formed with an engagement groove for inserting the coupling protrusion; And an insertion portion protruding from the lower side of the seating portion.

Here, a first through-hole is formed in the coupling protrusion, a second through-hole is formed in the seating portion, and the coupling portion includes an engaging pin inserted into the first through hole and the second through hole. have.

The engaging pins may be formed in a cylindrical shape, and the incision lines may be formed on one side along the axial direction.

The depth of the coupling groove may be longer than the coupling projection.

Also, a thread may be formed in the insertion portion.

According to the present invention, the supporting pin assembly is not integrally formed, but the supporting portion and the fixing portion are made of different materials and are coupled to each other by the fastening portion, so that when the impact occurs during the baking process, the lower portion of the supporting portion is broken, The upper end can significantly mitigate damage to the substrate.

1 is a perspective view showing a support pin assembly for a baking apparatus according to an embodiment of the present invention,
Fig. 2 is an exploded perspective view showing the support pin assembly for the baking apparatus shown in Fig. 1,
3 is a cross-sectional view of the support pin assembly for the baking apparatus shown in FIG. 1,
4 is a use state view showing the support pin assembly for the baking apparatus shown in Fig.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description of the present invention, the well-known functions or constructions are not described in order to simplify the gist of the present invention.

FIG. 1 is a perspective view showing a support pin assembly 1 for a baking apparatus according to an embodiment of the present invention, FIG. 2 is an exploded perspective view showing a support pin assembly 1 for the baking apparatus shown in FIG. 1, Fig. 3 is a cross-sectional view showing the support pin assembly 1 for the baking apparatus shown in Fig. 1, and Fig. 4 is a use state view showing the support pin assembly 1 for the baking apparatus shown in Fig.

The support pin assembly 1 for a baking apparatus according to the present invention is used in a semiconductor manufacturing process, particularly for supporting a substrate in a baking process for forming a designed pattern on a wafer substrate, and is used with a baking apparatus. That is, the support pin assembly 1 for a baking apparatus according to the present invention is used together with a baking apparatus including a chamber (oven) in which a wafer substrate is accommodated, a heating means for heating the substrate, And means for moving the support pin assembly 1, and the like.

The support pin assembly 1 for such a baking apparatus is used in a plurality of units for supporting the substrate, and at least three or more are used. The number and arrangement of the support pin assemblies 1 may vary depending on the shape of the semiconductor to be manufactured.

A support pin assembly (1) for a baking apparatus according to the present invention comprises a support portion (10), a fixing portion (20) and a fastening portion (30).

The support portion 10 is configured to support the bottom surface of the wafer substrate on the lower side of the wafer substrate. The supporting portion 10 is preferably made of engineering plastics and is particularly preferably made of engineering plastics and is particularly suitable for use in the manufacture of a flexible polyimide resin product made by DuPont Inc. of Beppel, which is excellent in heat resistance, abrasion resistance, self-lubricating property, creep resistance, VESPEL).

As described above, the supporting portion 10 for supporting the wafer substrate is formed of engineering plastic, so that the supporting pin can be formed to reliably support the substrate during the baking process and to eliminate the generation of particles due to abrasion.

The support portion 10 includes a tip portion 11 and a coupling protrusion 12.

The tip portion 11 is an upper portion of the support portion 10, which is tapered so as to decrease its diameter toward the upper side, and a generally pointed upper end thereof contacts the bottom surface of the wafer substrate to support the substrate. However, the top end of the tip portion 11 is not formed in a sharp shape, but a surface in contact with the wafer substrate forms a spherical surface, as shown in Figs. 1 and 2.

The coupling protrusion 12 has a diameter smaller than the diameter of the lower end of the tip portion 11 and is formed in a generally cylindrical shape and protrudes downward from the lower end of the tip portion 11. [ The coupling protrusion 12 is provided with a first through hole 13 formed in a direction intersecting with the forming direction of the coupling protrusion 12 (vertical direction).

It is preferable that the fixing portion 20 is made of a material different from that of the supporting portion 10 and is made of stainless steel as a material having a higher strength than the supporting portion 10. The fastening portion 30 described below may also be made of stainless steel.

The fixing part 20 is divided into a seating part 21 and an insertion part 22.

The seating portion 21 is formed in a generally cylindrical shape, and a coupling groove 24 is formed in the center upper portion into which the coupling projection 12 is inserted. The diameter of the coupling groove 24 is equal to the diameter of the coupling projection 12 so that the coupling projection 12 is not separated from the holding portion 10 and the fixing portion 20 when the coupling projection 12 is inserted into the coupling groove 24.

The depth of the coupling groove 24 is longer than that of the coupling protrusion 12 so that a slight gap is formed below the coupling protrusion 12 when the coupling protrusion 12 is inserted into the coupling groove 24. This prevents an impact from being generated at the lower end of the engaging protrusion 12 when the impact occurs and enables an intensive load to be applied to the first through hole 13 of the engaging protrusion 12.

The second through hole 23 formed in the seating portion 21 so as to penetrate in a direction intersecting with the forming direction (up and down direction) of the engaging groove 24 is formed. In particular, the second through hole 23 is formed in the first through hole 13). That is, when the engaging protrusion 12 is inserted into the engaging groove 24, the first through hole 13 and the second through hole 23 are formed so as to be completely connected to each other.

The shape of the first through hole 13 and the second through hole 23 may correspond to the shape of the coupling part 30 inserted into the first through hole 13 and the second through hole 23 and may be circular, elliptical, polygonal, or the like.

The insertion portion 22 protrudes downward from the lower side of the seating portion 21 and may have a generally cylindrical shape. The inserting portion 22 is a portion for securing the support pin assembly 1 for a baking apparatus according to the present invention stably during the baking process and is inserted and fixed on the upper side of a separate panel P or the like. A screw thread may be formed in the insertion portion 22 and thus screwed into the panel P or the like.

The fastening part 30 may be formed in various forms as a means for connecting the supporting part 10 and the fixing part 20 to each other. However, as shown in FIGS. 1 and 2, The first through hole 13 and the second through hole 23, respectively.

The fastening portion 30 may be formed in the shape of a generally circular rod. The fastening portion 30 may be formed in a cylindrical shape, and a cutting line 31 may be formed at one side of the fastening portion 30 (coupling pin) along the axial direction (longitudinal direction). The incision line 31 may be straight or otherwise zigzag.

The fastening portion 30 made of a coupling pin is made of a metal material having elasticity and the diameter thereof can be formed to have a diameter slightly larger than the first through hole 13 and the second through hole 23, The support portion 10 and the fixing portion 20 can be fastened to each other in such a form that the first and second through holes 13 and 23 are tightly and tightly inserted into the through hole 13 and the second through hole 23, respectively. At this time, it is needless to say that the width of the incision line 31 is reduced by the compression of the engaging pin.

 According to the support pin assembly 1 for a baking apparatus of the present invention, when an impact is generated due to malfunction or the like in the baking process, the supporting portion 10 and the fixing portion 20 are separated from each other, A strong load acts on the support portion 10 due to a load acting on the support portion 10 having a relatively low strength, so that breakage occurs in the connection portion of the support portion 10 (load is absorbed). Particularly, since the first through-hole 13 is formed at the joint portion 12 connected to the fixing portion 20, a strong load is generated at the portion where the first through-hole 13 is formed, .

Such breakage at the joint protruding portion 12 relaxes the load transmitted to the tip end portion 11 and alleviates the load applied to the wafer substrate by the tip portion 11 of the support portion 10, It is possible to mitigate significantly. At this time, since the coupling protrusion 12 is inserted into the coupling groove 24, the coupling between the supporting portion 10 and the fixing portion 20 can be stably maintained. After the support 10 is broken, only the support 10 can be replaced to form a new support pin assembly 1.

As described above, according to the support pin assembly 1 for a baking apparatus according to the present invention, the support pin assembly 1 is not formed integrally but the support portion 10 and the fixing portion 20 are made of different materials The lower portion of the support portion 10 is broken when the impact is generated during the baking process so as to be used as the shock absorbing means so that the upper end of the support portion 10 can be prevented from damaging the substrate can do.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It is obvious to those who have. Accordingly, it should be understood that such modifications or alterations should not be understood individually from the technical spirit and viewpoint of the present invention, and that modified embodiments fall within the scope of the claims of the present invention.

1: Support pin assembly for baking apparatus 10: Support
11: leading edge portion 12:
13: first through hole 20:
21: seat part 22:
23: second through hole 24: engaging groove
30: fastening part 31: incision line

Claims (9)

It is used in the semiconductor baking process,
A support for supporting a bottom surface of the substrate below the substrate;
A fixing part coupled to a lower side of the supporting part; And
And a fastening portion connecting the support portion and the fixing portion to each other,
The support portion
A tip portion whose diameter decreases toward the upper side; And
And a coupling protrusion protruding from the lower portion of the tip portion,
The fixing unit includes:
A seating part formed with an engaging groove for inserting the engaging protrusion; And
And an insertion portion protruding from a lower side of the seat portion,
And the depth of the engagement groove is longer than the engagement protrusion. The method according to claim 1,
Wherein the support portion and the fixing portion are made of different materials. 3. The method of claim 2,
Wherein the support portion is weaker in strength than the fixing portion and the fastening portion. 3. The method of claim 2,
Wherein the support portion is made of engineering plastic and the fixing portion is made of stainless steel. delete The method according to claim 1,
The coupling protrusion has a first through-hole formed therethrough,
A second through hole formed through the seating portion,
Wherein the fastening portion comprises an engaging pin inserted into the first through hole and the second through hole. The method according to claim 6,
Wherein the engaging pin is cylindrical and has a cutting line formed at one side along an axial direction to form a cutting line. delete The method according to claim 1,
Wherein a thread is formed in the insert.
KR1020130044646A 2013-04-23 2013-04-23 Support pin assembly for baking apparatus KR101410283B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3714484A4 (en) * 2017-11-21 2021-07-14 BOE Technology Group Co., Ltd. Proximity pin, substrate processing apparatus, and method of processing substrate in substrate processing apparatus

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08279548A (en) * 1993-12-28 1996-10-22 Sharp Corp Pin used for hot plate type proximity bake furnace and furnace using it
KR20030068773A (en) * 2002-02-18 2003-08-25 태화일렉트론(주) The hot plate structure for dehydrate and pre bake of LCD glass
KR20070047634A (en) * 2005-11-02 2007-05-07 삼성전자주식회사 Wafer tray of thermal processing equipment
KR20090115308A (en) * 2008-05-01 2009-11-05 엘지디스플레이 주식회사 Apparatus for drying alignment layer of liquid crystal display

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08279548A (en) * 1993-12-28 1996-10-22 Sharp Corp Pin used for hot plate type proximity bake furnace and furnace using it
KR20030068773A (en) * 2002-02-18 2003-08-25 태화일렉트론(주) The hot plate structure for dehydrate and pre bake of LCD glass
KR20070047634A (en) * 2005-11-02 2007-05-07 삼성전자주식회사 Wafer tray of thermal processing equipment
KR20090115308A (en) * 2008-05-01 2009-11-05 엘지디스플레이 주식회사 Apparatus for drying alignment layer of liquid crystal display

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3714484A4 (en) * 2017-11-21 2021-07-14 BOE Technology Group Co., Ltd. Proximity pin, substrate processing apparatus, and method of processing substrate in substrate processing apparatus

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