JP3504822B2 - Substrate processing apparatus and substrate processing exposure apparatus - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus for heat-treating an exposed substrate and then developing the substrate, and an exposure apparatus for exposing the substrate, and more particularly to an exposure process such as a chemically amplified resist. The present invention relates to a substrate processing apparatus for processing a substrate such as a semiconductor substrate by a photolithography process using a resist in which a reaction is accelerated by heating the processed substrate, and an exposure apparatus for processing a substrate for exposing the substrate. .

[0002]

2. Description of the Related Art In recent years, there has been a demand for a technique for making a circuit pattern highly precise as semiconductor devices become highly integrated.
In order to meet this demand, chemical amplification resist is used in the manufacturing process of semiconductor devices. In this chemically amplified resist, the photo-acid generator contained in the resist generates an acid by exposing the substrate coated with the resist to a desired pattern, and then the substrate is subjected to a heat treatment to produce a catalytic action. Is activated, and the crosslinking reaction (in the case of negative type) or the decomposition reaction (in the case of positive type) in the exposed portion of the resist is promoted. Then, after the heat treatment, the substrate is cooled to stop the reaction of the resist, and then the substrate is developed so that the unreacted portion (in the case of a negative type) or the reaction portion (in the case of a positive type) of the resist is a developing solution. Is dissolved and removed by
A desired resist film can be obtained.

FIG. 6 shows a schematic configuration example of a conventional apparatus for processing a substrate using a chemically amplified resist. In this example, the substrate processing apparatus 1 and the exposure apparatus ST constitute the entire apparatus. In the substrate processing apparatus 1, a cassette (not shown) that can store a plurality of substrates is placed, the substrates to be processed are taken out one by one from the cassette, and the processed substrates are all processed. The indexer unit (cassette stage) ID for receiving each one by one and storing it again in the cassette, the transport unit TR provided with the self-propelled substrate transport robot (not shown) having the substrate transfer arm, and the substrate On the other hand, a substrate processing area 2 having a plurality of substrate processing units for respectively performing a predetermined process, and an interface unit IF for transferring a substrate to and from the exposure apparatus ST.
It consists of In this example, the plurality of substrate processing units in the substrate processing area 2 are a coating processing unit SC equipped with a spin coater (not shown), and HMDS (hexamethyldisilazane) for improving the adhesion between the substrate surface and the resist. ), An adhesion part AH for heat-treating the substrate, and four heat-treating parts HP1, HP2, HP3, HP4, and hot plates (not shown) each equipped with a hot plate (not shown) are exposed to light. A heat treatment unit (hereinafter, referred to as a "bake unit") PEB that heat-treats (post-exposure bake) the substrate after being heated, four cooling treatment units CP1, CP2, and CP3 each including a cool plate (not shown), CP4 and two development processing sections SD1 and SD2 each equipped with a spin developer (not shown). Further, the exposure apparatus ST has an exposure processing unit (not shown) including a stepper for performing exposure processing on the substrate.
have. In addition, in FIG. 6, although a plurality of substrate processing units are depicted as being arranged in a plane, the adhesion unit AH, the heat treatment units HP1 to HP4, the baking unit PEB, and the cooling processing units CP1 to CP4 are appropriately arranged. Are arranged in the vertical direction (the same applies to FIGS. 1 and 8).

FIG. 7 shows an example of a substrate processing flow in the substrate processing apparatus 1 and the exposure apparatus ST shown in FIG.
The substrate processing procedure will be briefly described based on FIG. 7. First, the unprocessed substrates stored in the cassette are supplied to the transport unit TR one by one from the indexer ID.
The substrate transfer robot includes an adhesion unit AH, a cooling processing unit CP1, a coating processing unit SC, and a heating processing unit HP.
1, while moving to the HP2 and the cooling processing unit CP2 in order, in each of the substrate processing units, the substrate that has been contained in the substrate is taken out and the substrate to be processed is loaded, and the substrate processing unit applies the substrate to the substrate. Required processing is performed. As a result, a resist film is applied and formed on the surface of the substrate. Next, the substrate having the resist film formed on its surface is transferred from the transport unit TR to the interface unit IF and carried into the exposure apparatus ST through the interface unit IF. Then, the substrate is subjected to the exposure processing in the exposure processing section of the exposure apparatus ST, and the substrate subjected to the exposure processing is returned from the exposure apparatus ST to the interface section IF and transferred to the transport unit TR through the interface section IF.

The exposed substrate returned to the transport unit TR is transported to the bake unit PEB by the substrate transport robot and heat-treated by the bake unit PEB. By this heat treatment, the chemical reaction in the exposed portion of the chemically amplified resist is promoted as described above. Then, the substrate transfer robot transfers the substrate from the baking unit PEB to the cooling processing unit CP3, and the cooling processing unit CP3 performs the cooling process on the substrate. This cooling process stops the reaction in the exposed portion of the chemically amplified resist. After this, the substrate transfer robot moves from the cooling processing unit CP3 to the development processing unit SD1.
SD2, heat treatment parts HP3 and HP4, and cooling treatment part CP
While sequentially moving to 4, each substrate processing unit takes out the previously placed substrate and inputs the substrate to be processed, and each substrate processing unit performs the required processing on the substrate. It This allows
A resist film having a desired pattern is formed on the surface of the substrate. Then, the substrate on the surface of which the resist film having the desired pattern is formed is transferred from the transport unit TR to the indexer section ID and is stored in the cassette on the indexer section ID.

Further, for example, in Japanese Unexamined Patent Publication No. 6-151293, the baking unit PEB and the cooling processing unit CP3 are not arranged in the substrate processing area 4 of the substrate processing apparatus 3 as shown in the schematic block diagram of FIG. Discloses a configuration in which the bake unit PEB and the cooling processing unit CP3 are arranged in the interface unit IF. In the apparatus having such a configuration, the exposure apparatus S
The substrate subjected to the exposure processing by the exposure processing unit of T is the exposure apparatus ST.
To the interface unit IF, the baking unit PEB heats the substrate in the interface unit IF to accelerate the chemical reaction of the chemically amplified resist, and the cooling processing unit CP3 cools the substrate to stop the reaction of the resist. To be After this, the substrate is placed in the interface unit I.
It is returned from F to the transport unit TR and is developed in the development processing sections SD1 and SD2 arranged in the substrate processing area 4.

[0007]

By the way, as described above, the chemically amplified resist is one in which an acid is generated inside the resist by the exposure treatment and the chemical reaction of the resist by the catalytic action of the acid is promoted by the heat treatment. . Therefore, when the alkaline substance is present in the atmosphere, the acid generated inside the resist is neutralized, the catalytic action of the acid is deactivated, and the chemical reaction of the resist is hindered. Therefore,
In the substrate processing apparatuses 1 and 3, a chemical adsorption filter is installed on a clean bench arranged so as to cover the entire upper part thereof to remove an alkaline substance from the atmosphere. However, it is difficult to completely remove the alkaline substance in the atmosphere. Therefore, in order to suppress the neutralization reaction between the acid and the alkaline substance in the resist as much as possible, it is necessary to shorten the time from the exposure process to the heating process in the baking part PEB as short as possible.

However, in the conventional apparatus as shown in FIG. 6, the exposed substrate is once passed from the exposure apparatus ST to the interface section IF, is transported in the interface section IF, and is transported from the interface section IF. It is transferred to the unit TR, and the baking unit PEB is transferred by the transport unit TR.
Be transported to. As described above, since the substrate transfer process in the interface unit IF is involved in the process of transporting the substrate after the exposure processing to the baking unit PEB, it takes time from the exposure processing to the heating processing in the baking unit PEB. Become. As a result, there is a problem in that the catalytic action of the acid during the heat treatment is reduced and the chemical reaction of the resist becomes insufficient, and when the development treatment is performed, the shape of the resist pattern is irregular and the yield of the product is reduced. is there.

Further, the substrate processing and the substrate transfer in the substrate processing apparatus 1 are time-controlled so as to be performed in a fixed time, but in the exposure apparatus ST, the time for the substrate alignment and the like are different for each substrate. Unlike, it is not time-managed. Therefore, the timing at which the substrate carried into the exposure apparatus ST is subjected to the exposure processing by the exposure processing unit and returned to the substrate transfer position with the interface unit IF is not constant. On the other hand, in the interface unit IF, the substrate transfer robot receives the substrate from the transfer unit TR, transfers the substrate to the exposure apparatus ST, receives the substrate after the exposure processing from the exposure apparatus ST, and transfers the substrate. Unit T
I am trying to hand over to R. Therefore, if the timing at which the exposed substrate is returned to the substrate transfer position with the interface unit IF is not constant, even if the substrate transfer robot moves to the substrate transfer position to receive the substrate from the exposure apparatus ST, There may be a case where the substrate cannot be received because there is no substrate at the substrate transfer position. Further, there is a case where the substrate transfer robot has not yet arrived at the substrate transfer position even if the substrate after the exposure processing is returned to the substrate transfer position. As a result, the time from the end of the exposure process to the delivery of the substrate to the interface unit IF differs depending on the substrate, and thus the time from the end of the exposure process to the transfer of the substrate to the bake unit PEB is the substrate. Each will be different.

Exposure processing section and bake section PE of the exposure apparatus ST
If there is variation in the transfer time of the substrate between B and
Due to the influence of the alkaline substance in the atmosphere, the progress of the crosslinking reaction or the decomposition reaction in the exposed portion of the resist varies. As a result, there has been a problem that the line width of the pattern on the resist film after the development process varies and the product yield is greatly reduced.

Even if the substrate after the exposure process is returned to the substrate transfer position, if the interface unit IF does not match the transfer timing with the substrate transfer robot, the substrate is baked after the exposure process is completed. There is also an inconvenience that it takes a long time to be transported to the section PEB.

Further, in the apparatus having the structure in which the baking section PEB and the cooling processing section CP3 are arranged in the interface section IF as shown in FIG. 8, as compared with the apparatus shown in FIG. Even if the time until the heat treatment in the PEB is shortened to some extent, the exposed substrate is once transported from the exposure apparatus ST to the bake unit PEB in the interface unit IF, and therefore, it takes time accordingly. In the apparatus shown in FIG. 8 also, the exposure apparatus ST
The transfer of the substrate from the interface unit IF to the bake unit PEB of the interface unit IF is performed by the substrate transfer robot arranged in the interface unit IF in the same manner as the apparatus shown in FIG.
Similarly, the substrate transfer time varies between the exposure processing unit of the exposure apparatus ST and the bake unit PEB of the interface unit IF, and the interface unit I is applied to the substrate that has finished the exposure process and returned to the substrate transfer position.
If the transfer timing of the substrate F with the substrate transfer robot does not match, the substrate is transferred to the bake unit P after the exposure processing is completed.
The disadvantage that it takes a long time to be transported to the EB similarly occurs. Therefore, problems such as abnormal shape of the resist pattern after the development process and variation of the line width of the pattern on the resist film, resulting in a decrease in product yield, are still unsolved.

The present invention has been made in view of the above circumstances, and shortens the time until a heat treatment is performed on a substrate that has been subjected to an exposure process, and performs the heat treatment after the substrate has been exposed. To provide a substrate processing apparatus capable of eliminating the variation in the time until being processed between the substrates, preventing the deterioration of the development processing quality and achieving uniform development processing quality, and improving the product yield, and Shortens the time to heat-treat the exposed substrate, and
It is possible to improve the product yield by eliminating the variation in the time from the end of the exposure processing of the substrate to the heat treatment between the substrates, preventing the deterioration of the development processing quality and making the development processing quality uniform. It is an object of the present invention to provide an exposure apparatus that can be used.

[0014]

The invention according to claim 1 is
In a substrate processing apparatus including an interface unit for delivering and receiving a substrate and at least a substrate processing unit having a developing means for developing the exposed substrate, a heat treatment unit for heat-treating the exposed substrate Heat treatment
Cooling unit that cools the substrate that has been heat-treated by the unit
Thermal processing unit that is composed of a, the heating treatment of the heat treatment unit
First substrate transfer means dedicated for conveying the substrate exposed process to management unit, and, in the heating section of the heat treatment unit
When the substrate that has been subjected to reheating treatment is transported to the cooling processing unit,
The heat treatment unit for transporting the substrate, which has been cooled by the cooling processing unit, to the interface unit, and the first substrate transportation unit.
Immediately after the end of the exposure processing of the heat treatment section of the heat treatment section
Transport time required to transport the substrate, and the second substrate
From the heat treatment section to the cooling treatment section by the plate conveying means
Transfer time required to transfer the substrate, and the heating process
Each processing time of the substrate in the processing section and the cooling processing section
And a control means for controlling so that each of the substrates is kept constant , the exposed substrate is conveyed to the interface unit via the heat treatment unit, and transferred from the interface unit to the substrate processing unit. It is characterized in that the substrate is developed by the developing means.

[0015]

[0016]

[0017]

[0018]

[0019] The invention according to claim 2, the exposure processing section for exposure processing of the substrate, the exposure apparatus and a substrate transport means for transporting the substrate to the exposure processing unit, to heat treatment exposure treated substrate The heat treatment section and this heat treatment section
From the cooling processing unit that cools the heat-treated substrate
And configured heat treated portion, the first substrate transfer means dedicated for conveying the substrate that has been exposed process to heat treatment section of the heat treatment unit from the exposure processing section, said heating treatment of the heat treatment unit
The substrate heated by the processing unit is transferred to the cooling unit.
And second substrate transfer means for unloading the substrate which is cooled process to the outside by the cooling unit as well as the first
1. The heat treatment section of the heat treatment section by the first substrate transfer means.
Transfer time required to transfer the substrate immediately after the exposure process to
And the heat treatment section by the second substrate transfer means.
From the transfer time required to transfer the substrate from the cooling processing unit,
In addition, in the heat treatment section and the cooling treatment section,
The substrate processing time is controlled so that it is kept constant.
A control means for controlling is provided.

[0020]

[0021]

[0022]

In the substrate processing apparatus according to the first aspect of the present invention, the substrate that has been subjected to the exposure processing is loaded into the thermal processing unit, and is transferred to the heat processing section of the thermal processing section by the first substrate transfer means and heated. Heat treatment is performed by the processing unit . In this case, the first substrate carrying means is used only for carrying the substrate to the heat treatment section in the heat treatment unit . For this reason, the first substrate transfer means that has loaded the substrate into the heat treatment section immediately moves to the delivery position of the exposed substrate, and is always in a standby state for receiving the exposed substrate. Therefore, when the exposed substrate is conveyed to the substrate transfer position, the substrate is directly conveyed to the heat treatment section of the heat treatment section by the first substrate conveyance means without being put on standby. Therefore, the time until the heat treatment of the exposed substrate is shortened, and the time from the completion of the exposure treatment of the substrate to the heat treatment is not varied among the substrates. Therefore, when the chemically amplified resist is used, the influence of the alkaline substance in the atmosphere is reduced and becomes uniform, the chemical reaction of the resist is not hindered, and the progress of the chemical reaction is reduced. There is no variation between them. Transport of the substrate which has been heat treated by the heat treatment section of the heat treatment unit, the heating unit by the second substrate transfer means to the cooling processing unit
Then, the cooling processing unit performs cooling processing. And control hand
The exposure process to the heat treatment part of the heat treatment part is controlled by the step.
The transfer time required to transfer the board immediately after
During transfer required to transfer the substrate from the heat treatment section to the cooling section
In other words, in other words, after the heat treatment of the substrate is completed, the cooling treatment is performed.
When the processing starts and the chemical reaction of the resist stops
Between the heat treatment part and the cooling treatment part.
Since each plate processing time is kept constant,
The history of heat treatment in
It becomes easier and the processing quality between the substrates becomes more uniform.
The substrate cooled by the cooling processing unit of the heat treatment unit is
The second substrate carrying means carries out the cooling processing section to the interface section, transfers it from the interface section to the substrate processing section, and develops it by the developing processing section.

[0024]

[0025]

[0026]

[0027]

In the exposure apparatus according to the second aspect of the present invention, the substrate carried into the apparatus is transferred to the exposure processing section by the substrate transfer means and is subjected to the exposure processing by the exposure processing section. Exposed substrate processed is conveyed to the heating unit of the thermal processing unit by the first substrate transport means, it is heated by the heating unit. In this case, the first substrate carrying means is used only for carrying the substrate to the heat treatment section of the heat treatment section in the exposure apparatus. For this reason, the first substrate transfer means that has loaded the substrate into the heat treatment section of the heat treatment section immediately moves to the delivery position of the substrate subjected to the exposure treatment, and always stands by to receive the substrate subjected to the exposure treatment. It is in. Therefore, when the exposed substrate is conveyed to the substrate transfer position, the substrate is not put on standby, and the first substrate is transferred.
The substrate is directly transferred to the heat treatment section of the heat treatment section . Therefore, the time until the heat treatment of the exposed substrate is shortened, and the time from the completion of the exposure treatment of the substrate to the heat treatment is not varied among the substrates. Therefore, when the chemically amplified resist is used, the influence of the alkaline substance in the atmosphere is reduced and becomes uniform, the chemical reaction of the resist is not hindered, and the progress of the chemical reaction is reduced. There is no variation between them. By the heat treatment section of the heat treatment section
Substrate heated treatment is heated by the second substrate transfer means
It is transferred from the processing unit to the cooling processing unit and cooled by the cooling processing unit.
Will be rejected. Then, by the control by the control means, the heat
Transfer of the substrate immediately after the exposure processing to the heat processing section of the processing section
Transport time required for heating and cooling
Transfer time required to transfer the board to
After the heating process is finished, the cooling process is started and the resist
Time to stop the chemical reaction and heat treatment
Processing time of each substrate in the cooling unit and the cooling unit
Since it is kept constant, the history of heat treatment between substrates is uniform.
And the process quality can be controlled easily,
The processing quality of is more uniform. For the cooling treatment section of the heat treatment section
The substrate that has been further cooled is processed by the second substrate transfer means.
The substrate is transferred from the cooling processing unit to the substrate transfer position with the outside of the apparatus.

[0029]

[0030]

[0031]

[0032]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to FIGS.

FIG. 1 is a schematic configuration diagram of an entire apparatus in which an exposure apparatus is connected to a substrate processing apparatus according to the present invention. The substrate processing apparatus 10 is similar to the substrate processing apparatuses 1 and 3 shown in FIGS.
R, a substrate processing area 12 having a plurality of substrate processing units, and an interface unit IF.
In the substrate processing area 12, the substrate processing apparatus 3 shown in FIG.
Similarly, the coating processing unit SC, the adhesion unit AH, the four heating processing units HP1 to HP4, the three cooling processing units CP1, CP2, CP4, and the two developing processing units SD1 and SD2 are arranged. Then, in the substrate processing apparatus 10, instead of disposing the baking unit PEB and the cooling processing unit CP3 in the substrate processing area 12 and the interface IF, the heat treatment unit 14 is provided in the substrate processing apparatus 10.
And the baking unit PEB and the cooling processing unit CP3 are arranged in the heat treatment unit 14. This heat treatment unit 1
4 is arranged at the end of the substrate processing apparatus 10 facing the exposure apparatus ST so as to be interposed between the interface IF and the exposure apparatus ST.

An example of the structure of the interface unit IF and the heat treatment unit 14 will be described with reference to the schematic plan view shown in FIG. First, the interface unit IF is provided with a substrate transfer unit P that transfers a substrate W to and from the transport unit TR at a position facing one end of the transport unit TR (see FIG. 1). A plurality of, for example, three support pins 16 are implanted in the substrate transfer part P. Then, the pre-exposure substrate W transferred by the substrate transfer robot (not shown) of the transfer unit TR is transferred and supported on the support pins 16, and the support pins 16 are exposed. Substrate W is supported, and the substrate transport robot of the transport unit TR receives the substrate W from above the support pins 16. A substrate transfer robot 18 having an arm 20 for transferring a substrate is arranged at a position facing the one end of the transport unit TR across the substrate transfer part P. The substrate transfer robot 18 moves up and down with its arm 20 and expands and contracts in its longitudinal direction.
0 is configured to rotate within an angle range of 180 ° in the horizontal plane.

Further, a substrate unloading table 22 for delivering the substrate W before the exposure processing to the exposure apparatus ST is arranged at a position facing the substrate transfer section P with the substrate transfer robot 18 interposed therebetween. In addition, a substrate loading table 30 for receiving the exposed substrate from the processing unit 14 is provided at a position facing the substrate transfer robot 18 and forming an angle of 90 ° with the substrate transfer part P and the substrate unloading table 22, respectively. It is arranged. A plurality of, for example, three support pins 26, 32 are planted in the substrate unloading table 22 and the substrate unloading table 30, respectively, and the substrate W is supported on these support pins 26, 32. A pair of substrate unloading table 22 and substrate unloading table 30 are arranged so as to face both sides of support pins 26 and 32, respectively, and are movably supported so as to be spaced apart from and approach each other. Guide plates 28a, 28b; 3
A substrate centering mechanism composed of 3a and 33b is provided. Each guide plate 28a, 28b; 33a, 3
3b is formed in a circular arc shape so that the opposite edges thereof match the outer peripheral edge shape of the substrate W, and when the pair of guide plates 28a, 28b; 33a, 33b approach each other, the guide plates 28a, 28b; 33a and 33b are brought into contact with the outer peripheral edge of the substrate W so that the substrate W is aligned and positioned with respect to the substrate carry-out table 22 and the substrate carry-in table 30. There is.

Next, the heat treatment unit 14 is provided with a bake portion PEB and a cooling treatment portion CP3. The baking unit PEB and the cooling processing unit CP3 are arranged one above the other as shown in the schematic front view of FIG. A hot plate 34 is provided in the upper baking unit PEB, and a plurality of, for example, three support pins that move vertically through a through hole (not shown) formed in the hot plate 34. 36 are provided. And the bake part PEB is
The substrate W is received while the support pins 36 are raised, and then the support pins 36 are lowered to bring the substrates W into contact with or close to the upper surface of the hot plate 34 as indicated by the chain double-dashed line. The substrate W is heat-treated. After the heat treatment, the support pins 36 are lifted to separate the substrate W from the upper surface of the hot plate 34, and in this state, the substrate W is taken out from the bake portion PEB. In addition, the cooling plate CP3 in the lower stage has a cool plate 38
Although not shown, the baking part PE is provided.
Similar to B, a plurality of, for example, three support pins that vertically move through the through holes formed in the cool plate 38 are provided. Then, the cooling processing unit CP3
The substrate W is received with the support pins raised, and then the support pins are lowered to bring the substrate W into contact with or close to the upper surface of the cool plate 38, cool the substrate W in that state, and after the cooling process, support the substrate W. The pins are raised to separate the substrate W from the upper surface of the cool plate 38, and the substrate W is taken out in this state. The baking unit PEB and the cooling processing unit C
P3 and P3 may not be arranged vertically but may be arranged in the horizontal direction. Further, instead of separately providing the baking unit PEB and the cooling processing unit CP3, it is possible to use a Peltier element or the like as a heat treatment unit including a plate having both functions of a hot plate and a cool plate.

A substrate transfer unit 40 is provided in the heat treatment unit 14, and the substrate transfer unit 4 is provided.
At 0, two substrate transfer robots 42 and 46 equipped with substrate transfer arms 44 and 48 are arranged. Arms 44 and 48 of each substrate transfer robot 42 and 46
Each move up and down and expand and contract in the longitudinal direction,
Furthermore, it rotates in a horizontal plane. Further, one of the substrate transfer robots 42 has a moving mechanism that linearly reciprocates between a position facing the substrate unloading position of the exposure apparatus ST and a front position of the baking unit PEB (cooling processing unit CP3 ). And the other substrate transfer robot 46 uses the cooling processing unit CP3.
Front position of (bake part PEB) and interface part IF
It has a moving mechanism that linearly reciprocates between the position facing the substrate loading table 30 and the position. Then, the substrate transport robot 42 receives the substrate W after the exposure processing from the exposure device ST and puts the substrate W into the baking unit PEB. In addition, the substrate transfer robot 46 uses the baking unit PEB.
The heat-treated substrate W is removed from the baking unit PEB, was charged with the substrate W to the cooling unit CP3, also takes out the substrate W that is cooled processed by the cooling unit CP3 from the cooling unit CP3, interface Department IF
The substrate carrying table 30 is carried. The substrate transport robot 42 transports the substrate W immediately after the exposure processing to the bake unit PEB, the heat treatment time of the substrate W in the bake unit PEB, the substrate transport robot 4
Substrate W from bake part PEB to cooling process part CP3 by 6
And a processing time for cooling the substrate W in the cooling processing unit CP3 are controlled by a controller (not shown) so as to be kept constant.

The operation of the interface unit IF and the heat treatment unit 14 shown in FIG. 3 will be described. The pre-exposure substrate W having a resist film formed on its surface is transferred from the transfer unit TR to the substrate transfer unit P of the interface unit IF. When the substrate W is supported on the support pins 16, the substrate W is transferred onto the support pins 26 of the substrate unloading table 22 by the substrate transfer robot 18, and positioned by the pair of guide plates 28a and 28b. And
The substrate W is transferred from the support pins 26 to the exposure device ST by a substrate transport mechanism (not shown) of the exposure device ST, and is input to the exposure processing unit (not shown) of the exposure device ST. When the exposure processing by the exposure processing unit is completed, the substrate W after the exposure processing is transferred to the substrate unloading position of the exposure apparatus ST by the substrate transfer mechanism of the exposure apparatus ST, and the substrate transfer robot 42 of the thermal processing unit 14 causes the exposure apparatus ST to be exposed. From the substrate unloading position to the baking unit PEB. Then, the substrate W after the exposure processing is heat-treated by the baking unit PEB, and then transferred from the baking unit PEB to the cooling processing unit CP3 by the substrate transfer robot 46, and the substrate W after the heating processing is cooled. Exposure to heating and cooling processed substrates W, the cooling unit C by the substrate transfer robot 46
From P3 to the board loading table 30 of the interface unit IF
And is supported on the support pins 32. Then, the substrate W that has been subjected to the exposure processing has a pair of guide plates 33a and 33b
After being positioned by the substrate transfer robot 18, the support pins 1 of the substrate transfer part P are moved from above the support pins 32 by the substrate transfer robot 18.
6, and is carried out from the interface section IF by the substrate carrying robot (not shown) of the carrying unit TR and carried to the developing processing sections SD1 and SD2 (see FIG. 1).

FIG. 2 shows a substrate processing flow in the substrate processing apparatus 10 and the exposure apparatus ST shown in FIG. The substrate processing procedure will be described with reference to FIG. 2. First, the unprocessed substrates stored in the cassette are supplied to the transport unit TR one by one from the indexer ID. The substrate supplied to the transport unit TR is required by each substrate processing unit while being sequentially transported to the adhesion unit AH, the cooling processing unit CP2, the coating processing unit SC, the heating processing units HP1 and HP2, and the cooling processing unit CP2. Is processed. As a result, a resist film is applied and formed on the surface of the substrate. Next, the substrate having the resist film formed on its surface is transferred from the transport unit TR to the interface section IF, and is carried into the exposure apparatus ST through the interface section IF by the above-described operation. Then, the exposure apparatus S
The substrate is subjected to the exposure processing in the exposure processing unit of T, and the substrate subjected to the exposure processing is transferred from the exposure apparatus ST to the heat treatment unit 1
It is carried to 4. The substrate after the exposure processing carried into the heat treatment unit 14 is heat-treated by the baking unit PEB and then cooled by the cooling treatment unit CP3 by the above-described operation, and then returned to the interface unit IF. It is delivered to the transport unit TR through the interface unit IF. The exposed substrate that has been returned to the transport unit TR is subjected to the development processing sections SD1 and SD2 and the heat processing sections HP3 and H.
While being sequentially transported to P4 and the cooling processing unit CP4, a required processing is performed by each substrate processing unit. As a result, a resist film having a desired pattern is formed on the surface of the substrate, and the substrate having the resist film having the desired pattern formed on the surface is transferred from the transport unit TR to the indexer unit I.
It is transferred to D and stored in the cassette on the indexer ID.

Next, the exposure apparatus according to the present invention will be described with reference to FIG. FIG. 5 shows a first embodiment of the present invention.
It is a schematic plan view of the exposure apparatus which shows an example.

The exposure apparatus 50 is provided with a baking unit PEB and a cooling processing unit CP3, and is used by being connected to a substrate processing apparatus that is not provided with the baking unit PEB and the cooling processing unit CP3. The exposure device 50 includes a stepper (not shown) in the exposure device 50.
2, and the substrate transfer unit 54 including the substrate transfer robot 56 that receives the substrate W before the exposure processing from the interface unit IF of the substrate processing apparatus and inputs the substrate W into the exposure processing unit 52, and also transfers the substrate. Mounting arm 6
Two substrate transfer robots 58 and 62 having 0 and 64 are provided. The arms 60 and 64 of the respective substrate transfer robots 58 and 62 move up and down, expand and contract in the longitudinal direction, and further rotate in the horizontal plane. Also,
The substrate transfer robot 58 on one side transfers the substrate to the exposure processing unit 52 and the baking unit PEB (cooling processing unit CP3 ).
Of the cooling processing unit.
It has a moving mechanism that linearly reciprocates between a front position of CP3 (baking unit PEB) and a substrate unloading position for unloading the substrate W to the interface unit IF. Then, the substrate transfer robot 58 immediately receives the substrate W after the exposure processing taken out from the exposure processing unit, and puts the substrate W into the baking unit PEB. In addition, the substrate transfer robot 62
Retrieves a substrate W which has been heat treated by baking unit PEB from baking unit PEB, the cooling processing unit C of the substrate W
And poured into P3, also takes out the substrate W cooling treatment by the cooling unit CP3 from the cooling unit CP3, transported to the substrate carry-out position is a boundary position between the interface unit IF of the substrate processing apparatus. Then, the substrate transfer robot 58
The transfer time for transferring the substrate W immediately after being taken out from the exposure processing section 52 to the bake section PEB by the processing, the processing time for heating the substrate W in the bake section PEB, and the baking section PEB to the cooling processing section CP3 by the substrate transfer robot 62. The transfer time for transferring the substrate W and the cooling processing unit CP3
In, the processing time for cooling the substrate W is controlled by a controller (not shown) so as to be kept constant.

In the exposure apparatus 50 shown in FIG. 5, the substrate transfer robot 58 is used only to transfer the substrate W exposed by the exposure processing unit 52 to the baking unit PEB. Therefore, the substrate transfer robot 58 immediately puts the substrate W into the baking unit PEB, and immediately thereafter, the exposure processing unit 52.
The substrate is moved to the substrate transfer position with the exposure processing unit 52.
It waits for the next substrate W to be taken out from.
Therefore, when the substrate W subjected to the exposure processing by the exposure processing unit 52 is transported to the substrate delivery position, the substrate W is directly transported to the baking unit PEB by the substrate transportation robot 58 without being put on standby. Therefore, the time from the end of the exposure processing of the substrate W by the exposure processing unit 52 to the heating processing of the substrate W by the baking unit PEB is extremely shortened, and the transfer time during that time varies between the substrates. Disappears.

In the exposure apparatus of the above embodiment, an example is shown in which the substrate W after the exposure processing is taken out from the exposure processing section and the substrate W is transferred to the bake section PEB by another substrate transfer means. However, this may be realized by one substrate transfer means. In this case as well, the time from the end of the exposure processing to the heating processing of the substrate W by the baking unit PEB can be shortened as compared with the conventional case.

[0044]

When the substrate processing apparatus according to the first aspect of the present invention is used, the time taken to heat-treat an exposed substrate is shortened, and the substrate is heat-treated after the exposure process is completed. Since there is no variation between the substrates in the time until, the influence of the alkaline substance in the atmosphere is reduced and becomes uniform when the chemically amplified resist is used, and the chemical reaction of the resist is hindered. , The progress of chemical reaction does not vary between substrates. Therefore, it is possible to prevent the deterioration of the development processing quality and to make the development processing quality uniform, and as a result, the product yield is improved. And the heat treatment between the substrates
Equalization of history facilitates management of processing quality
As a result, the processing quality between the substrates becomes more uniform.

[0045]

[0046]

[0047]

[0048]

When the exposure apparatus according to the second aspect of the present invention is used, the time from receiving the exposed substrate from the exposure processing unit to performing the heat treatment is extremely shortened, and after the substrate exposure processing is completed. Since there is no variation between substrates in the time until heat treatment, when using a chemically amplified resist, the effect of the alkaline substance in the atmosphere is reduced and becomes uniform, and the chemical reaction of the resist Is prevented, and the progress of chemical reaction does not vary between substrates. Therefore, it is possible to prevent the deterioration of the development processing quality and to make the development processing quality uniform, and as a result, the product yield is improved. Then, the history of the heat treatment is made uniform among the substrates, the management of the processing quality is facilitated, and the processing quality is made uniform between the substrates. In addition, it is possible to make the history of heat treatment uniform between substrates.
This makes it easier to control the processing quality and allows processing between substrates.
Quality becomes more uniform.

[0050]

[0051]

[0052]

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram of an entire apparatus in which an exposure apparatus is connected to a substrate processing apparatus according to the present invention.

FIG. 2 is a diagram showing a substrate processing flow in the substrate processing apparatus and the exposure apparatus shown in FIG .

3 is a schematic plan view showing an example of a configuration of an interface unit and a heat treatment unit of the substrate processing apparatus shown in FIG.

4 is a schematic front view showing an example of the configurations of a bake unit and a cooling treatment unit in the heat treatment unit of the substrate processing apparatus shown in FIG.

FIG. 5 is a schematic plan view showing an embodiment of the exposure apparatus according to the present invention.

FIG. 6 is a schematic configuration diagram showing an example of a conventional substrate processing apparatus.

7 is a diagram showing a substrate processing flow in the substrate processing apparatus and the exposure apparatus shown in FIG .

FIG. 8 is a schematic configuration diagram showing another example of a conventional substrate processing apparatus.

[Explanation of symbols]

10 Substrate Processing Apparatus 12 Substrate Processing Area 14 Heat Treatment Unit 18 Substrate Transfer Robot 22 Substrate Loading Table 30 Substrate Loading Table 40 Substrate Transfer Units 42, 46, 56, 58, 62 Substrate Transfer Robot 50 Exposure Device 52 Exposure Processing Section 54 Substrate transport unit ID Indexer unit TR Transport unit IF interface unit SC Coating unit AH Adhesion unit HP1 to HP4 Heat treatment unit CP1 to CP4 Cooling unit PEB Heat treatment unit (bake unit) SD1 and SD2 for heating the substrate after exposure processing Development processing unit ST Exposure device P Substrate transfer unit

Front page continuation (72) Inventor Yasuo Imanishi 322 Hazashishi Furukawa-cho, Fushimi-ku, Kyoto Dai Nippon Screen Mfg. Co., Ltd.Rakusai Plant (72) Inventor Yuki Iwami 322 Hazushi-Furukawa-cho, Fushimi-ku, Kyoto Dai Nippon Screen Mfg. Co., Ltd. Inside the Rakusai Plant (72) Inventor, Jouichi Nishimura 322, Hazushi, Furukawa-cho, Fushimi-ku, Kyoto Dai Nippon Screen Mfg. Co., Ltd. Inside the Rakusai Plant (72), Akihiko Morita, 322, Hazushi, Furukawa-cho, Fushimi-ku, Kyoto Nippon Screen Mfg. Co., Ltd. Rakusai Plant (72) Inventor Takanori Kawamoto 322, Fukumi-ku, Fushimi-ku, Kyoto Large Futagawa-cho 322, Nippon Screen Mfg. Co., Ltd. Rakusai Plant (56) ) JP-A-6-151293 (JP, A) JP-A-8-255750 (JP, A) JP-A-8-316130 (JP, A) JP-A-7-153662 (JP, A) (58) Field (Int.Cl. ⁷ , DB name) H01L 21/027 H01L 21/68

Claims (2)

(57) [Claims] And 1. A interface unit for transferring the substrate, at least the heat treatment in the substrate processing apparatus and a substrate processing unit having a developing means for developing the exposed treated substrate, exposed treated substrate Heat treatment part and
Cooling that cools the substrate that has been heat-treated by the heat treatment unit
A heat treatment section composed of a treatment section, and the heat treatment section described above.
Dedicated first for carrying the exposed substrate to the heat treatment section
Substrate transfer means, and the heat treatment of the heat treatment section
The substrate that has been heat-treated by the processing section to the cooling processing section
And a heat treatment unit including second substrate transfer means for carrying out the substrate cooled by the cooling processing part to the interface part, and the heating of the heat treatment part by the first substrate transfer means.
Transport required for transporting the substrate immediately after the exposure process to the processing unit
Time and the heating by the second substrate transfer means
Transfer required to transfer the substrate from the processing unit to the cooling processing unit
Time, and the heat treatment unit and the cooling treatment unit
The processing time for each substrate in
A control means for controlling the substrate is provided, and the exposed substrate is conveyed to the interface section through the heat treatment unit, and is transferred from the interface section to the substrate processing section, and the substrate is developed by the developing section. A substrate processing apparatus characterized in that Bei 2. A exposure processing unit for exposure processing of the substrate, and a substrate conveying means for conveying the substrate to the exposure processing unit, the
In this exposure apparatus, a heat treatment unit that heat-treats the exposed substrate and this
Cooling that cools the substrate that has been heat-treated by the heat treatment unit
A heat treatment section including a treatment section; and the exposure treatment section exposing the heat treatment section of the heat treatment section.
Dedicated first substrate transfer means for transferring the optically processed substrate
And a substrate heat-treated by the heat treatment unit of the heat treatment unit.
The plate is conveyed to the cooling processing unit and the cooling processing unit
Second for carrying out the substrate cooled by
Substrate transfer means and the heating of the heat treatment section by the first substrate transfer means.
Transport required for transporting the substrate immediately after the exposure process to the processing unit
Time and the heating by the second substrate transfer means
Transfer required to transfer the substrate from the processing unit to the cooling processing unit
Time, and the heat treatment unit and the cooling treatment unit
The processing time for each substrate in
And a control means for controlling
Exposure equipment for processing .