KR20200026563A - Transfer robot and Apparatus for treating substrate with the robot - Google Patents

Abstract

The present invention provides a substrate processing facility. The substrate processing facility of the present invention includes: an index part; a process processing part in which processing chambers performing substrate processing are stacked; and a buffer part arranged between the process processing part and the index part, wherein the buffer part can include: a buffer module; a cooling module; a heating module; and a buffer transfer robot having a first hand and a second hand arranged on a moving path approachable to the buffer module, the cooling module and the heating module and made of materials different from each other.

Description

Transfer robot and Apparatus for treating substrate with the robot}

The present invention relates to a substrate processing apparatus.

In general, a wafer is manufactured through a number of processes such as an ion implantation process, a film deposition process, a diffusion process, and a photolithography process. Among these processes, a photolithography process for forming a desired pattern on a wafer may be performed by etching or ion implantation. Forming a predetermined pattern on the wafer to selectively define the portion and the portion to be protected, the application process of dropping the photoresist on the wafer and rotating it at high speed to form a photoresist layer on the wafer at a predetermined thickness; After aligning the mask and the wafer on which the photoresist layer is formed, an exposure process for irradiating a photoresist layer on the wafer with a mask such as ultraviolet light to transfer the pattern of the mask or reticle onto the wafer; Develop the layer to pattern the desired photoresist It comprises a developing step of forming.

In addition, the photolithography process includes a baking process of baking the wafer at a predetermined temperature. The baking process includes a pre-baking step for removing moisture adsorbed on the wafer before the coating step is performed, and a soft baking step for drying the photoresist layer after applying the photoresist to adhere the photoresist layer to the surface of the wafer. And a post-exposure baiting step of heating the photoresist layer after the exposure process, and a hard baking process to firmly adhere the pattern formed by the developing process onto the wafer.

A large number of transfer robots are used in the facility which carries out such a photography process, and each transfer robot uses the same type of hand.

Korea Patent Publication 10-2015-0103316 (2015.09.09)

An object of the present invention is to provide a substrate transfer robot and substrate processing equipment that can use the hand of the advantageous material according to the use environment.

An object of the present invention is to provide a substrate transfer robot and a substrate processing facility having a hand composed of different materials having different advantages and disadvantages.

The problem to be solved by the present invention is not limited thereto, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

According to an aspect of the invention, the index unit; A process processor configured to stack process chambers performing substrate processing; A buffer unit disposed between the process processing unit and the index unit; The buffer unit includes a buffer carrying robot having a first hand and a second hand, which are disposed on a moving path accessible to the buffer module, the cooling module, the heating module, and the buffer module, the cooling module, and the heating module. Substrate processing equipment including may be provided.

In addition, the first hand may be made of aluminum, and the second hand may be made of ceramic.

In addition, the first hand and the second hand may be arranged in the vertical direction with each other.

In addition, the second hand may be disposed below the first hand.

In addition, a conveying control unit for controlling the conveying operation of the substrate conveying unit; The transfer control unit may control the substrate transfer unit to selectively use the first hand and the second hand according to whether the substrate is heated in the buffer module, the cooling module, and the heating module. .

In addition, the transfer control unit may be configured to carry in / out of a substrate from the heating module by the second hand and to carry in / out of a substrate from the cooling module by the first hand and to carry in / out of a substrate from the buffer module. May control the substrate transfer unit to be performed by one of the first hand and the second hand.

In addition, the first hand has a base having an inner diameter larger than the diameter of the substrate and having an annular ring shape bent a portion of the circumference; And a plurality of support protrusions extending inwardly from the base and supporting edge regions of the substrate.

In addition, the second hand may include a blade body in which a pair of finger parts are formed.

In addition, the buffer module may include a fixed type of substrate support pins, the heating module may include up / down type substrate support pins, and the cooling module may include a cooling plate on which the substrate is directly placed.

The buffer module may further include a first buffer module arranged to be used for transporting the substrate between the index unit and the buffer unit; And a first buffer module disposed to be used for transferring the substrate between the buffer unit and the process processor.

In addition, the buffer module may be disposed to be used for both substrate transfer between the index unit and the buffer unit and substrate transfer between the buffer unit and the process processor.

In addition, the processing unit is disposed in such a way that the coating unit for performing the coating process treatment, and the developing unit for performing the developing process treatment are stacked in layers, wherein the buffer module and the heating module are at the same height as the coating unit. The cooling module may be disposed at the same height as the developing part.

According to another aspect of the present invention, each of the first hand and the second hand which can be independently driven and selectively used according to the use environment, wherein the first hand and the second hand is a substrate conveyance composed of different materials Robots can be provided.

In addition, the first hand has a base having an inner diameter larger than the diameter of the substrate and having an annular ring shape bent a portion of the circumference; And a plurality of support protrusions extending inwardly from the base and supporting edge regions of the substrate, wherein the second hand may include a blade body having a pair of finger parts formed thereon.

The base may be made of aluminum, and the blade body may be made of ceramic.

In addition, the first hand may be used to transport the substrate in a room temperature state, and the second hand may be used to transport the substrate in a high temperature environment.

According to the embodiment of the present invention, even when the substrate is conveyed in the heating module using a second hand of ceramic material, even if the substrate is conveyed at a high temperature, the substrate can be conveyed without thermal deformation. Using the first hand has a special effect that can prevent accidents affecting other structures due to damage due to external impact.

The effects of the present invention are not limited to the above-described effects, and effects that are not mentioned will be clearly understood by those skilled in the art from the present specification and the accompanying drawings.

1 is a plan view illustrating a substrate processing apparatus according to an exemplary embodiment of the present invention.
FIG. 2 is a view of the substrate processing apparatus of FIG. 1 as viewed from the AA direction. FIG.
3 is a view of the substrate processing apparatus of FIG. 1 seen in the BB direction.
4 is a diagram for explaining a buffer unit.
5 is a view for explaining the heating module shown in FIG.
FIG. 6 is a diagram for describing the first buffer module illustrated in FIG. 4.
7 is a view for explaining the cooling module shown in FIG.
8 is a view showing the buffer carrier robot shown in FIG.
9 is a diagram for explaining a first hand.
10 is a diagram for explaining a second hand.
It is a figure for demonstrating a conveyance control part.
12 is a view showing a buffer unit according to a modification.

As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the written description. However, this is not intended to limit the present invention to specific embodiments, it should be understood to include all transformations, equivalents, and substitutes included in the spirit and scope of the present invention. In the following description of the present invention, if it is determined that the detailed description of the related known technology may obscure the gist of the present invention, the detailed description thereof will be omitted.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, components, or a combination thereof.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, and in describing the present invention with reference to the accompanying drawings, the same or corresponding elements are denoted by the same reference numerals regardless of the reference numerals, and duplicates thereof. The description will be omitted.

1 to 3 schematically show a substrate processing apparatus 1 according to an embodiment of the present invention. FIG. 1 is a top view of the substrate processing apparatus 1, and FIG. 2 is an apparatus of FIG. (1) is a view seen from the AA direction, and FIG. 3 is a view seen from the BB direction of the substrate processing apparatus 1 of FIG.

1 to 3, the substrate processing apparatus 1000 may include an index unit 10, a process processor 40, a buffer unit 30, and an interface unit 50.

The index unit 10, the buffer unit 30, the process processor 40, and the interface unit 50 may be arranged in a line. Hereinafter, the direction in which the index unit 10, the buffer unit 30, the process processing unit 40, and the interface unit 50 are arranged is referred to as a first direction, and when viewed from the top, the direction perpendicular to the first direction It is called a second direction, and the direction perpendicular to the plane including the first direction and the second direction is defined as the third direction.

The substrate W is moved in the state accommodated in the container 16. At this time, the container 16 has a structure that can be sealed from the outside. For example, the container 16 may be a front open unified pod (FOUP) having a front door.

Hereinafter, each configuration will be described in detail with reference to FIGS. 1 to 3.

(Index part)

The index unit 10 is disposed in front of the first direction of the substrate processing facility 1000. For example, the index unit 10 may include four load ports 12 and one index robot 13.

Four load ports 12 are disposed in front of the index portion 10 in the first direction. A plurality of load ports 12 are provided, which are arranged along the second direction. The number of load ports 12 may increase or decrease depending on the process efficiency and footprint conditions of the substrate processing facility 1000. In the load ports 12, a container W (eg, a cassette, a FOUP, etc.) in which a substrate W to be provided to a process and a substrate W on which a process is completed is accommodated is mounted.

The index robot 13 is disposed adjacent to the load port 12 in the first direction. The index robot 13 is installed between the load port 12 and the buffer unit 30. The index robot 13 transfers the substrate between the buffer unit 30 and the load port 12. The substrate W waiting in the buffer module of the buffer unit 30 is transferred to the container 16, or the substrate W waiting in the container 16 is transferred to the buffer module of the buffer unit 30.

(Process Processing Unit)

In the process processor 40, a process of applying a photoresist on the substrate W before the exposure process and a process of developing the substrate W after the exposure process may be performed.

The process processing unit 40 has a coating processing unit 401 and a developing processing unit 402. The coating processing unit 401 and the developing processing unit 402 may be arranged to partition each other into layers. According to an example, the coating processing unit 401 may be located above the developing processing unit 402. However, according to the type of the substrate on which the processing is performed and the processing process, the position of each processing unit and the type of the process module provided in each processing unit may be different.

The coating processing unit 401 includes a process of applying a photoresist such as a photoresist to the wafer W, and a heat treatment process such as heating and cooling of the wafer W before and after the resist application process. The coating processor 401 may include a resist coating chamber 410, a baking chamber 420, and a transfer chamber 430.

The resist application chamber 410, the transfer chamber 430, and the bake chamber 420 may be sequentially disposed along the second direction 14. Accordingly, the resist coating chamber 410 and the baking chamber 420 may be positioned to be spaced apart from each other in the second direction 14 with the transfer chamber 430 interposed therebetween. A plurality of resist coating chambers 410 may be provided, and a plurality of resist coating chambers 410 may be provided in the first direction 12 and the third direction 16, respectively. 9 shows an example in which nine resist coating chambers 410 are provided, but is not limited thereto. The baking chambers 420 may be provided in plural in the first direction 12 and the third direction 16, respectively. In the drawings, an example in which six bake chambers 420 are provided is not limited thereto.

The transfer chamber 430 is positioned in parallel with the first buffer 320 of the buffer unit 30 in the first direction 12. An applicator robot 432 and a guide rail 433 are positioned in the transfer chamber 430. The transfer chamber 430 has a generally rectangular shape. The applicator robot 432 includes the bake chambers 420, the resist application chambers 400, the first buffer 320 of the buffer part 300, and the first cooling chamber of the second buffer module 500 described later. The wafers W are transferred between the 520. The guide rail 433 is disposed such that its longitudinal direction is parallel to the first direction 12. The guide rail 433 guides the applicator robot 432 to move linearly in the first direction 12. The applicator robot 432 includes a hand 434, which may be of the same shape as the first hand of the buffer transfer robot.

The resist application chambers 410 all have the same structure. However, the types of photoresist used in each resist coating chamber 410 may be different from each other. As an example, a chemical amplification resist may be used as the photoresist. The resist coating chamber 410 applies photoresist on the wafer W. As shown in FIG. The resist application chamber 410 has a housing 411, a support plate 412, and a nozzle 413. The housing 411 has a cup shape with an open top. The support plate 412 is located in the housing 411 and supports the wafer W. As shown in FIG. The support plate 412 is provided to be rotatable. The nozzle 413 supplies the photoresist onto the wafer W placed on the support plate 412. The nozzle 413 has a circular tubular shape, and can supply the photoresist to the center of the wafer (W). Optionally, the nozzle 413 has a length corresponding to the diameter of the wafer W, and the discharge port of the nozzle 413 may be provided as a slit. In addition, the resist coating chamber 410 may further be provided with a nozzle 414 for supplying a cleaning liquid such as deionized water to clean the surface of the wafer W on which the photoresist is applied.

The bake chamber 420 heat-treats the wafer (W). For example, the bake chambers 420 may be a prebake process or a photoresist that heats the wafer W to a predetermined temperature and removes organic matter or moisture from the surface of the wafer W before applying the photoresist. A soft bake process or the like performed after coating on W) is performed, and a cooling process for cooling the wafer W after each heating process is performed. The bake chamber 420 has a cooling plate 421 or a heating plate 422. The cooling plate 421 is provided with cooling means 423, such as cooling water or thermoelectric elements. The heating plate 422 is also provided with heating means 424 such as hot wires or thermoelectric elements. The cooling plate 421 and the heating plate 422 may be provided in one bake chamber 420, respectively. Optionally, some of the baking chambers 420 may have only a cooling plate 421 and others may have only a heating plate 422.

The developing module 402 is a developing process for removing a part of the photoresist by supplying a developing solution to obtain a pattern on the wafer W, and a heat treatment process such as heating and cooling performed on the wafer W before and after the developing process. It includes. The developing module 402 has a developing chamber 460, a baking chamber 470, and a conveying chamber 480. The developing chamber 460, the baking chamber 470, and the conveying chamber 480 are sequentially disposed along the second direction 14. Therefore, the developing chamber 460 and the baking chamber 470 are positioned to be spaced apart from each other in the second direction 14 with the transfer chamber 480 therebetween. A plurality of developing chambers 460 may be provided, and a plurality of developing chambers 460 may be provided in the first direction 12 and the third direction 16, respectively. In the figure, an example in which six developing chambers 460 are provided is shown. A plurality of baking chambers 470 may be provided in the first direction 12 and the third direction 16, respectively. In the figure, an example in which six bake chambers 470 are provided is shown. Alternatively, however, the bake chamber 470 may be provided in larger numbers.

The transfer chamber 480 is positioned side by side in the first direction 12 with the second buffer 330 of the buffer unit 300. The developer robot 482 and the guide rail 483 are positioned in the transfer chamber 480. The transfer chamber 480 has a generally rectangular shape. The developing unit robot 482 may include the baking chambers 470, the developing chambers 460, the second buffer 330 and the cooling chamber 350 of the buffer unit 300, and the second buffer module 500. The wafer W is transferred between the two cooling chambers 540. The guide rail 483 is disposed so that its longitudinal direction is parallel to the first direction 12. The guide rail 483 guides the developing unit robot 482 to linearly move in the first direction 12. The developing unit robot 482 includes a hand 484. The hand 484 may have the same form as the first hand of the buffer transfer robot.

The developing chambers 460 all have the same structure. However, the types of the developer used in each of the developing chambers 460 may be different from each other. The developing chamber 460 removes the light irradiated region of the photoresist on the wafer W. At this time, the area irradiated with light in the protective film is also removed. Depending on the kind of photoresist that is optionally used, only the regions of the photoresist and the protective film where the light is not irradiated may be removed.

The developing chamber 460 has a housing 461, a support plate 462, and a nozzle 463. The housing 461 has a cup shape with an open top. The support plate 462 is located in the housing 461 and supports the wafer (W). The support plate 462 is rotatably provided. The nozzle 463 supplies the developer onto the wafer W placed on the support plate 462. The nozzle 463 has a circular tubular shape and can supply developer to the center of the wafer W. As shown in FIG. Optionally, the nozzle 463 has a length corresponding to the diameter of the wafer W, and the discharge port of the nozzle 463 may be provided as a slit. In addition, the developing chamber 460 may further be provided with a nozzle 464 for supplying a cleaning solution such as deionized water to clean the surface of the wafer W to which the developing solution is supplied.

The bake chamber 470 heat-treats the wafer (W). For example, the bake chambers 470 are heated after each baking process and a hard bake process for heating the wafer W after the developing process is performed, and a post bake process for heating the wafer W before the developing process is performed. And a cooling process for cooling the finished substrate. The bake chamber 470 has a cooling plate 471 or a heating plate 472. The cooling plate 471 is provided with cooling means 473, such as cooling water or thermoelectric elements. Alternatively, the heating plate 472 is provided with heating means 474 such as hot wires or thermoelectric elements. The cooling plate 471 and the heating plate 472 may each be provided in one bake chamber 470. Optionally, some of the baking chambers 470 may have only a cooling plate 471 and others may have only a heating plate 472.

As described above, the coating module 401 and the developing module 402 are provided to be separated from each other in the process processor 40. In addition, the application module 401 and the developing module 402 may have the same chamber arrangement when viewed from the top.

(Interface part)

The interface unit 50 transfers the substrate between the process processing unit 40 and the exposure apparatus 90. The interface unit 50 may be provided with the interface robot 510 and buffer modules 520 in which the substrate is temporarily waiting.

(Buffer section)

4 is a diagram for explaining a buffer unit.

1 to 4, the buffer unit 30 is positioned between the index unit 10 and the process processor 40. The buffer unit 30 may include a buffer module 310, a cooling module 320, a heating module 330, and a buffer transfer robot 340.

The buffer module 310 includes a first buffer module 310-1 disposed to be used to transport a substrate between the index unit 10 and the buffer unit 30, and a substrate transfer between the buffer unit 30 and the process processor 40. It may include a second buffer module 310-2 disposed to be used in.

The first buffer module 310-1 is disposed at a height (same height) accessible by the index robot 13 of the index unit 10, and the second buffer module 310-2 is a robot of the coating processor 401. The 432 may be disposed at an accessible height (same height), and the cooling module 320 may be disposed at a height (same height) accessible by the robot 482 of the developing processor.

5 is a view for explaining the heating module shown in FIG.

Referring to FIG. 5, the heating module 330 may include a heating plate 332 and up / down type substrate support pins 334. The substrate support pins 334 of the up / down type are lift pin assemblies generally used in the semiconductor field, and a detailed description thereof will be omitted. The heating module 330 may perform a baking process (eg, CLPH, PEB) to heat-treat the index unit 10 before the substrate is loaded into the process processing unit 40.

FIG. 6 is a diagram for describing the first buffer module illustrated in FIG. 4.

Referring to FIG. 6, the first buffer module 310-1 may include a base plate 312 and fixed type substrate support pins 314. The base plates 312 provided with the substrate support pins 314 may be stacked in multiple stages.

7 is a view for explaining the cooling module shown in FIG.

Referring to FIG. 7, the cooling module 320 may include a water-cooled cooling plate (WCP) 322. The substrate is placed directly on the cooling plate 322. The substrate W is placed on the cooling plate 322. The cooling plate 322 provides a cooling member (not shown) therein. The cooling member may include a cooling channel for cooling the substrate W placed on the cooling plate 322. The cooling plate 322 is provided in a circular shape when viewed from the top. The cooling plate 322 may be provided in a size corresponding to the substrate (W). Holes may be formed in the cooling plate 322. The holes may be provided for natural cooling through ventilation when the substrate W is placed on the cooling plate 322. The cooling plate 322 is provided in plurality. Each cooling plate 322 is stacked and spaced apart. Each cooling plate 322 is fixedly coupled to the support block 324. Each cooling plate 322 may be provided in the same size with each other. Each cooling plate 322 may be provided spaced apart from each other at the same height.

Although not shown, the second buffer module 310-2 may include a cooling plate and up / down type substrate support pins, and the substrate may be loaded and unloaded onto the cooling plate by up / down type substrate support pins. Can be.

FIG. 8 is a diagram illustrating a buffer carrier robot shown in FIG. 4, FIG. 9 is a diagram for describing a first hand, and FIG. 10 is a diagram for explaining a second hand.

8 to 10, the buffer transfer robot 340 includes a pedestal 342, a support shaft 344, a base 346, a first hand 350, a second hand 360, and a transfer control unit 370. ).

The pedestal 342 may be movable in one direction. The support shaft 344 is fixedly coupled to the pedestal 342. The base 346 is located on the top surface of the support shaft 344. Base 346 may be coupled to support shaft 344 to allow shaft rotation. The base 346 may be axially rotated about the support shaft 344 about the third direction 16. Base 346 is provided to have a generally cuboidal shape. The base 346 is provided such that its longitudinal direction is in the horizontal direction.

The first hand 350 and the second hand 360 are provided on the base 3460 to be movable in the forward or backward direction. The first hand 350 may be located above the second hand 360. The driving member (not shown) moves the first hand 350 and the second hand 360 forward or backward.

The first hand 350 and the second hand 360 may be made of different materials. For example, the first hand 350 is made of a material that is relatively easy to process and not easily damaged by external impact, and the second hand 360 is used in a relatively high temperature environment compared to the material of the first hand 350. This is possible and may include a material that can minimize the thickness of the hand. Preferably, the first hand 350 may include an aluminum material, and the second hand 360 may include a ceramic material.

As described above, the buffer transfer robot having two hands made of different materials conveys the substrate using the first hand in a general transfer environment. And in a special case, a board | substrate is conveyed using a 2nd hand. For example, when the buffer transfer robot is configured only with the second hand type, the substrate cannot be transferred to the plate-type buffer, and the buffer of the lift pin type must be disposed. However, since the cooling module has a plate-shaped buffer structure, there is a problem in that the cooling module needs to be changed to a lift pin type. (The cooling module is dramatically increased because the space for the lift pin needs to be secured.) The present invention is provided with different types of hands so that the most suitable type of hand can be selectively used as needed without changing the cooling module.

As shown in FIG. 9, the first hand 350 extends inward from the frame 352 and the frame 352 having an inner diameter larger than the diameter of the substrate and having an annular ring shape in which a portion of the circumference is bent. It may include a plurality of support protrusions 354 for supporting the edge area. The support protrusion 354 is provided with a vacuum suction pad 356. In the first hand type, not only the substrate can be transported in the module equipped with the lift pin, but also the cooling module can put the substrate directly on the plate as shown in FIG. 7. However, when the first hand is placed in a high temperature environment, aluminum deformation occurs and the substrate cannot be conveyed precisely. Therefore, a second hand of ceramic material may be used in a high temperature environment.

As shown in FIG. 10, the second hand 360 may include a blade body 364 having a pair of finger parts 362 formed therein. Three vacuum suction pads 366 may be installed on the top surface of the blade body 364. The second hand 360 is referred to as a blade type, and this blade type hand can only load / unload a substrate from a module equipped with a lift pin, and cannot carry a substrate from a cooling module as shown in FIG. 7. On the other hand, the second hand made of a ceramic material can process the thickness thinly and is suitable for conveyance of the substrate in the heating module because there is almost no deformation even in a high temperature environment.

The transfer control unit 370 controls the transfer operation of the substrate transfer unit 340. According to one embodiment, the transport control unit 370 controls the driving member (not shown). The transfer control unit 370 moves the first hand 350 and the second hand 360 in the home position to the set position when the first hand 350 and the second hand 360 pick up or place down the substrate. Move it back up to its home position.

Referring to FIG. 11, the transfer control unit 370 is configured to heat or not the substrate during the transfer of the substrate in the first and second buffer modules 310-1 and 310-2, the cooling module 320, and the heating module 330. Temperature), the substrate transfer unit 340 may be controlled to selectively use the first hand 350 and the second hand 360. Preferably, the transfer control unit 370 may control the loading and unloading of the substrate from the heating module 330 to be performed by the second hand 360 made of a ceramic material because it is exposed to a high temperature environment. In addition, the transport controller 370 may control the substrate to be carried out from the cooling module 320 by the first hand 350. In addition, the transfer control unit 370 may move the substrate transfer unit from the first and second buffer modules 310-1 and 310-2 to be performed by any one of the first hand 350 and the second hand 360. Although it can be controlled, it is preferable that the control is performed by the second hand when the substrate is returned to the heating module.

12 is a view showing a buffer unit according to a modification.

Referring to FIG. 12, the buffer unit 30a according to the modification includes a buffer module 310a, a cooling module (not shown for convenience of illustration), a heating module 330a, and a buffer transfer robot 340a, which are illustrated in FIG. 1. Since it is provided in a substantially similar configuration and function to the configuration of the buffer unit 30 shown in the following, the modification will be described below with a focus on the differences.

In the present modification, the buffer unit 30a may be provided in a form in which one buffer module 310a is disposed between the index unit 10 and the process processor 40. As such, the buffer unit 30a may change the position and number of the buffer module according to the type and processing process of the substrate.

The above description is merely illustrative of the technical idea of the present invention, and those skilled in the art may make various modifications and changes without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention but to describe the present invention, and the scope of the technical idea of the present invention is not limited thereto. The scope of protection of the present invention should be interpreted by the following claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

10: index portion 30: buffer portion
40 process processing unit 50 interface unit
310: buffer module 320: cooling module
330: heating module 340: buffer transport robot

Claims (16)

Index unit;
A process processor configured to stack process chambers performing substrate processing;
A buffer unit disposed between the process processing unit and the index unit;
The buffer unit
A substrate including a buffer module, a cooling module, a heating module, and a buffer transfer robot having a first hand and a second hand made of different materials and disposed on a moving passage accessible to the buffer module, the cooling module, and the heating module. Processing equipment. The method of claim 1,
The first hand is made of aluminum,
And the second hand is made of a ceramic material. The method of claim 2,
And the first hand and the second hand are arranged in a vertical direction with each other. The method of claim 2,
And the second hand is disposed below the first hand. The method of claim 2,
A conveying control unit controlling a conveying operation of the substrate conveying unit;
The conveying control unit
And a substrate transfer unit to control the substrate transfer unit to selectively use the first hand and the second hand depending on whether the substrate is heated in the buffer module, the cooling module, and the heating module. The method of claim 5, wherein
The conveying control unit
Substrate import / export from the heating module is performed by the second hand and substrate import / export from the cooling module is performed by the first hand and substrate import / export from the buffer module is performed with the first hand. A substrate processing apparatus for controlling the substrate transfer unit to be performed by any one of the second hands. The method of claim 5, wherein
The first hand
A base having an inner diameter larger than the diameter of the substrate and having an annular ring shape in which a portion of the circumference is bent; And
And a plurality of support protrusions extending inwardly from the base and supporting edge regions of the substrate. The method of claim 5, wherein
The second hand
Substrate processing equipment comprising a blade body formed with a pair of fingers. The method of claim 5, wherein
The buffer module includes a fixed type substrate support pins,
The heating module includes up / down type substrate support pins,
The cooling module includes a cooling plate on which the substrate is directly placed. The method of claim 5, wherein
The buffer module may include a first buffer module disposed to be used to transport a substrate between the index unit and the buffer unit; And
And a first buffer module arranged to be used for transferring the substrate between the buffer unit and the process unit. The method of claim 5, wherein
And the buffer module is arranged to be used for both substrate transfer between the index unit and the buffer unit and substrate transfer between the buffer unit and the process processor. The method of claim 5, wherein
The process processing unit is disposed in such a way that the coating unit for performing the coating process treatment and the developing unit for performing the developing process treatment are stacked so as to be divided into layers.
The buffer module and the heating module is disposed at the same height as the applicator,
And the cooling module is disposed at the same height as the developing part. A first hand and a second hand, each of which can be independently driven and can be selectively used according to the use environment,
And the first hand and the second hand are made of different materials. The method of claim 13,
The first hand
A base having an inner diameter larger than the diameter of the substrate and having an annular ring shape in which a portion of the circumference is bent; And
A plurality of support protrusions extending inwardly from the base and supporting edge regions of the substrate;
The second hand
A substrate transfer robot comprising a blade body formed with a pair of fingers. The method of claim 13,
The base is made of aluminum,
The blade body is a substrate transfer robot made of a ceramic material. The method of claim 13,
The first hand is used to convey the substrate in a room temperature state,
The said 2nd hand is a board | substrate conveyance robot used for conveying a board | substrate in a high temperature environment.

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