JP4665037B2 - Substrate processing system - Google Patents

Description

  The present invention relates to a processing system for a substrate such as a semiconductor wafer.

  For example, in a photolithography process in a semiconductor device manufacturing process, for example, a resist coating process for applying a resist solution on a semiconductor wafer (hereinafter referred to as “wafer”) to form a resist film, and exposure for exposing a predetermined pattern on the resist film Various kinds of processing such as processing and development processing for developing the exposed resist film are performed.

  A series of these processes is usually performed using a coating and developing processing system. For example, the coating and developing processing system includes a cassette station for loading and unloading wafers in units of cassettes, a processing station in which a plurality of processing apparatuses for performing various processes are arranged, and a wafer between an adjacent exposure apparatus and processing station. It has an interface station for delivery.

  The processing station includes a transport device that transports the substrate and a processing device group that is provided around the transport device and in which a plurality of processing devices are arranged in multiple stages in the vertical direction. The transfer apparatus is provided with one wafer transfer body that holds and transfers the wafer, and the wafer transfer body is configured to be movable in the vertical direction and the horizontal direction and to be rotatable. And the wafer conveyance body can convey a wafer to each processing apparatus (patent document 1).

JP 2001-189368 A

  Incidentally, when a series of processing is performed on a wafer using this coating and developing processing system, it is required to efficiently transport the wafer to each processing apparatus in order to improve the throughput of the wafer processing.

  However, when a transfer apparatus having only one wafer transfer body is used as in the prior art, the transfer efficiency of wafers to each processing apparatus may be poor. For example, when processing of a wafer is simultaneously completed by a plurality of processing apparatuses, the processing apparatus must wait for the wafer to be carried out by the transfer apparatus. Further, for example, while the transfer device is transferring a wafer to one processing device, the other processing device must wait for the wafer to be loaded even if the other processing device is ready to process the wafer. In addition, there is a technical limit to speeding up the operation of the wafer carrier. Therefore, the throughput of wafer processing has not been improved.

  SUMMARY An advantage of some aspects of the invention is that it efficiently transports a substrate and improves the throughput of substrate processing.

  To achieve the above object, the present invention places a plurality of substrates in multiple stages in the vertical direction, performs a predetermined process on the substrates, and a plurality of buffer units that move on a circumference centered on the substrate transport apparatus. A plurality of processing apparatus groups provided in multiple stages in the vertical direction and arranged outside the circumference, the substrate transport apparatus transports a substrate between the buffer units, and the processing apparatus And a substrate transport mechanism for transporting the substrate between the processing apparatus and the buffer unit.

  According to the present invention, since each processing apparatus has a substrate transport mechanism for transporting a substrate, the substrate can be carried into and out of the processing apparatus at a timing required in each processing apparatus. That is, when the substrate can be processed by the processing apparatus, the substrate can be quickly carried into the apparatus by the substrate transfer mechanism of the processing apparatus. Further, when the processing of the substrate is completed in the processing apparatus, the substrate can be quickly unloaded from the apparatus by the substrate transfer mechanism of the processing apparatus. As a result, the substrate can be transported efficiently without waiting for the transport of the substrate in the processing apparatus as in the prior art.

  Further, since each buffer unit can move on the circumference centering on the substrate transfer apparatus, a plurality of substrates can be transferred at a time from one processing apparatus group to another processing apparatus group that performs subsequent processing.

  Furthermore, since the substrate in the buffer unit can be moved to a predetermined position (vertical position) by the substrate transfer device, the transfer mechanism of each processing apparatus transfers the predetermined substrate from the buffer unit into the processing apparatus. Can do.

  As described above, according to the present invention, the substrate transfer efficiency can be significantly improved. In addition, since the substrate processing system has a plurality of buffer units, it is possible to process a large number of substrates in the system. Therefore, the throughput of substrate processing can be improved.

  The buffer unit may include a buffer unit transport mechanism that moves on the circumference. That is, each buffer unit may be configured to be self-propelled.

  The plurality of buffer units may be arranged on the circumference on a rotary table, and the rotary table may be rotatable around the substrate transfer device.

  The buffer unit may have a buffer unit moving mechanism that moves in the vertical direction.

  The buffer unit moving mechanism may rotate the buffer unit around a central axis in the vertical direction of the buffer unit.

  The substrate transfer device may be configured to hold a plurality of substrates.

  The substrate processing system includes a cassette mounting unit that is mounted when a cassette that accommodates a plurality of substrates is carried into and out of the substrate processing system, and the cassette mounting unit and the cassette mounting unit on the cassette mounting unit side. You may have the other board | substrate conveyance apparatus which conveys a board | substrate between buffer parts.

  The other substrate transfer device may be configured to be able to hold a plurality of substrates.

  The plurality of processing apparatus groups include a liquid processing apparatus group in which liquid processing apparatuses that perform processing by supplying a predetermined liquid to a substrate are arranged in multiple stages, and a heat processing apparatus that performs heat processing on the substrate at a predetermined temperature. A heat treatment apparatus group arranged in multiple stages in the vertical direction.

  The plurality of processing apparatus groups include a processing apparatus group in which a liquid processing apparatus that supplies a predetermined liquid to a substrate and performs processing and a heat processing apparatus that performs heat processing on the substrate at a predetermined temperature are arranged in multiple stages in the vertical direction. You may have.

  In one processing apparatus group, processing apparatus layers including the liquid processing apparatus and the heat treatment apparatus may be arranged in multiple stages in the vertical direction.

  The buffer unit may include a frame for storing the substrate therein, and a plurality of holding members that are provided at predetermined intervals in the vertical direction in the frame and hold the substrate.

  The buffer unit includes a frame for storing a substrate therein, a plurality of flat members provided at predetermined intervals in the vertical direction in the frame, and a plurality of flat members that divide the inside of the frame into a plurality of members, and an upper surface of the flat member. And a holding member that holds the substrate.

  The frame may have a cylindrical shape with open side surfaces, or may have a rectangular parallelepiped shape with open side surfaces.

  The buffer unit may include a support member extending in a vertical direction and a holding member that is provided at a predetermined interval in the vertical direction in the support member and holds a substrate.

  The substrate transfer mechanism adjusts the interval between the pair of arm portions, a transfer arm provided on the arm portion and a holding portion for holding the substrate, and the pair of arm portions. And an arm moving mechanism for moving in the direction.

  The substrate transfer mechanism includes a transfer arm provided with an arm portion having a shape that fits an outer periphery of the substrate, a holding portion that is provided on the arm portion and holds the substrate, and moves the transfer arm in a horizontal direction. And an arm moving mechanism.

  The arm moving mechanism may move the transfer arm in a vertical direction.

  The substrate transport mechanism includes a transport arm that holds and transports a substrate, and the transport arm is provided in a plurality of flexibly connected arm portions and the arm portion at the tip, and holds the substrate. And may have a part.

  The substrate transfer mechanism may include an arm moving mechanism that moves the transfer arm in a vertical direction.

  The substrate transfer mechanism may have a plurality of transfer arms.

  According to the present invention, it is possible to efficiently transport a substrate and improve the throughput of substrate processing.

It is a top view which shows the outline of the internal structure of the coating and developing treatment system concerning this Embodiment. It is a side view which shows the outline of the internal structure of the coating and developing treatment system concerning this Embodiment. It is a side view which shows the outline of the internal structure of the coating and developing treatment system concerning this Embodiment. It is a side view which shows the outline of a structure of a wafer conveyance apparatus. It is a top view which shows the outline of a structure of a wafer conveyance apparatus. It is a side view which shows the outline of a structure of a 1st buffer apparatus. It is a cross-sectional view which shows the outline of a structure of a 1st buffer apparatus. It is explanatory drawing which shows arrangement | positioning of a wafer conveyance apparatus, a 1st buffer apparatus, and a 1st processing apparatus group. It is a cross-sectional view which shows the outline of a structure of a resist coating apparatus. It is a longitudinal cross-sectional view which shows the outline of a structure of a resist coating device. It is explanatory drawing which shows a mode that the wafer conveyance mechanism of a resist coating apparatus conveys a wafer. It is a cross-sectional view which shows the outline of a structure of the heat processing apparatus. It is a longitudinal cross-sectional view which shows the outline of a structure of the heat processing apparatus. It is explanatory drawing which shows arrangement | positioning of the heat processing apparatus of a 3rd processing apparatus group. It is explanatory drawing which shows arrangement | positioning of the heat processing apparatus of a 3rd processing apparatus group. It is the flowchart which showed each process of wafer processing. It is a side view which shows the outline of a structure of the 1st buffer apparatus concerning other embodiment. It is a cross-sectional view which shows the outline of a structure of the 1st buffer apparatus concerning other embodiment. It is a cross-sectional view which shows the outline of a structure of the 1st buffer apparatus concerning other embodiment. It is a side view which shows the outline of a structure of the 1st buffer apparatus concerning other embodiment. It is a cross-sectional view which shows the outline of a structure of the 1st buffer apparatus concerning other embodiment. It is a side view which shows the outline of a structure of the 1st buffer apparatus concerning other embodiment. It is explanatory drawing which shows the outline of a structure of the wafer conveyance apparatus periphery concerning other embodiment. It is a longitudinal cross-sectional view which shows the outline of a structure of the heat processing apparatus concerning other embodiment. It is a cross-sectional view which shows the outline of a structure of the resist coating apparatus concerning other embodiment. It is a longitudinal cross-sectional view which shows the outline of a structure of the resist coating apparatus concerning other embodiment. It is a side view which shows the outline of the internal structure of the coating and developing treatment system concerning other embodiment. It is a side view which shows the outline of the internal structure of the coating and developing treatment system concerning other embodiment. It is explanatory drawing which shows arrangement | positioning of the processing apparatus of the 2nd processing apparatus group concerning other embodiment. It is a top view which shows the outline of the internal structure of the coating and developing treatment system concerning other embodiment. It is a top view which shows the outline of the internal structure of the coating and developing treatment system concerning other embodiment.

  Embodiments of the present invention will be described below. FIG. 1 is a plan view showing an outline of the internal configuration of a coating and developing treatment system 1 as a substrate processing system according to the present embodiment. 2 and 3 are side views showing an outline of the internal configuration of the coating and developing treatment system 1. FIG.

  As shown in FIG. 1, the coating and developing processing system 1 includes, for example, a cassette station 10 in which a cassette C is carried in and out from the outside, and a plurality of various processing apparatuses that perform predetermined processing in a single wafer type during photolithography processing. And an interface station 13 for transferring the wafer W between the exposure station 12 adjacent to the processing station 11 and the processing station 11 are integrally connected.

  The cassette station 10 is provided with a cassette mounting table 20 as a cassette mounting unit. A plurality of, for example, five cassette mounting plates 21 are provided on the cassette mounting table 20. The cassette mounting plates 21 are arranged in a line in the horizontal X direction (vertical direction in FIG. 1). The cassette C can be placed on these cassette placement plates 21 when the cassette is carried in and out of the coating and developing treatment system 1.

  The cassette station 10 is provided with a wafer transfer device 31 as another substrate transfer device that can move on a transfer path 30 extending in the X direction. The wafer transfer device 31 is also movable in the vertical direction, the horizontal direction, and the vertical axis, and between the cassette C on each cassette mounting plate 21 and a first buffer device 41 of the processing station 11 described later. The wafer W can be transferred via the transfer device 52.

  A wafer transfer device 40 as a substrate transfer device is provided at the center of the processing station 11. The wafer transfer device 40 is movable in the vertical direction, the horizontal direction, and the vertical axis, and can transfer the wafer W between buffer devices 41 to 44 described later.

  Around the wafer conveyance device 40, for example, four buffer devices 41 to 44 for temporarily storing the wafer W are provided. The first to fourth buffer devices 41 to 44 are movable on a rail 45 provided in an annular shape around the wafer transfer device 40.

  Around the wafer conveyance device 40, a plurality of, for example, four processing device groups G1 to G4 including various processing devices are further provided. The first processing unit group G1 is disposed on the cassette station 10 side (the Y direction negative direction side in FIG. 1) of the processing station 11, and the second processing unit group G2 is disposed on the front side of the processing station 11 (in FIG. 1). The third processing unit group G3 is arranged on the interface station 13 side (the Y direction positive direction side in FIG. 1) of the processing station 11, and the fourth processing unit group G4 is arranged on the negative side in the X direction. It is arranged on the back side (the X direction positive direction side in FIG. 1) of the processing station 11. The first to fourth processing device groups G1 to G4 are outside the first to fourth buffer devices 41 to 44, and as will be described later, the wafer transfer mechanisms 150 and 190 of the processing devices are the first ones. The wafers W are arranged so as to be transferred between the first to fourth buffer devices 41 to 44.

  In the first processing unit group G1, as shown in FIG. 2, adhesion devices 50 and 51 for hydrophobizing the wafer W, a transfer device 52 for transferring a plurality of wafers W, and a predetermined liquid on the wafer W Liquid processing apparatus that supplies and processes, for example, lower antireflection film forming apparatuses 53 to 55 that form an antireflection film (hereinafter referred to as “lower antireflection film”) below the resist film of the wafer W, and heat treatment of the wafer W The heat treatment apparatuses 56 to 58 for performing the above are arranged in nine stages in order from the bottom. A chemical chamber 59 for supplying a processing liquid to the above-described lower antireflection film forming apparatuses 53 to 55 is provided at the lowermost stage of the first processing apparatus group G1.

  The second processing unit group G2 includes liquid processing units, for example, resist coating units 60 to 65 that apply a resist solution to the wafer W to form a resist film, and thermal processing units 66 to 68 that perform thermal processing of the wafer W from below. They are arranged in 9 stages in order. A chemical chamber 69 for supplying a processing solution to the resist coating apparatuses 60 to 65 described above is provided at the lowermost stage of the second processing apparatus group G2.

  The third processing apparatus group G3 includes liquid processing apparatuses, for example, upper antireflection film forming apparatuses 70 to 73 that form an antireflection film (hereinafter referred to as “upper antireflection film”) on the resist film of the wafer W, Heat treatment apparatuses 74 to 78 for performing heat treatment of the wafer W are arranged in nine stages in order from the bottom. A chemical chamber 79 for supplying a processing liquid to the above-described upper antireflection film forming apparatuses 70 to 73 is provided at the lowermost stage of the third processing apparatus group G3.

  In the fourth processing unit group G4, as shown in FIG. 3, a liquid processing unit, for example, development processing units 80 to 84 for supplying a developing solution to the wafer W to perform development processing, and thermal processing units 85 to 85 for performing thermal processing of the wafer W are provided. 88 are arranged in nine steps in order from the bottom. A chemical chamber 89 for supplying a processing solution to the development processing apparatuses 80 to 84 described above is provided at the lowermost stage of the fourth processing apparatus group G4.

  As shown in FIG. 1, the interface station 13 is provided with a wafer transfer device 90, a transfer device 91, and a peripheral exposure device 92 that exposes the outer periphery of the wafer W. The wafer transfer device 90 has a transfer arm that can move around the vertical direction, the horizontal direction, and the vertical axis. The wafer transfer device 90 supports, for example, the wafer W on the transfer arm, and the wafer W between the exposure device 12 adjacent to the interface station 13, the transfer device 91, the peripheral exposure device 92, and the third processing device group G3. Can be transported.

  Next, the configuration of the wafer transfer device 31 of the cassette station 10 and the wafer transfer device 40 of the processing station 11 will be described. FIG. 4 is a side view showing the outline of the configuration of the wafer transfer apparatus 31, and FIG. 5 is a plan view showing the outline of the configuration of the wafer transfer apparatus 31.

  As shown in FIG. 4, the wafer transfer device 31 has a plurality of, for example, six arm bodies 110 that hold and transfer the wafer W. As shown in FIG. 5, the arm body 110 has its distal end branched into two distal end portions 110 a and 110 a. Each tip 110a is provided with a suction pad 111 for sucking and holding the back surface of the wafer W horizontally. With such a configuration, the wafer transfer device 31 can transfer a plurality of wafers W at a time. The number of arm bodies 110 is not limited to the number of the present embodiment, and can be arbitrarily selected.

  The arm body 110 is supported by a support member 112 as shown in FIG. On the lower surface of the support member 112, for example, a drive mechanism 114 incorporating a motor (not shown) or the like is provided via a shaft 113. By this drive mechanism 114, the arm body 110 can move in the vertical direction and the horizontal direction, and can rotate. The drive mechanism 114 is attached to the transfer path 30 shown in FIG. 1, and the wafer transfer apparatus 31 is movable on the transfer path 30.

  The configuration of the wafer transfer device 40 in the processing station 11 is the same as the configuration of the wafer transfer device 31 described above, and thus the description thereof is omitted. Also in such a wafer transfer device 40, the number of arm bodies 110 can be arbitrarily selected, and an arbitrary number of wafers W can be transferred.

  Next, the configuration of the first to fourth buffer devices 41 to 44 will be described. FIG. 6 is a side view showing an outline of the configuration of the first buffer device 41, and FIG. 7 is a cross-sectional view showing an outline of the configuration of the first buffer device 41.

  As shown in FIG. 6, the first buffer device 41 has a buffer unit 120 that holds and stores a plurality of wafers W in multiple stages in the vertical direction. The buffer unit 120 has a cylindrical frame 121 whose side surface is open. The frame 121 includes a disk-shaped top plate 121a, a disk-shaped bottom plate 121b, and a frame member 121c provided between the top plate 121a and the bottom plate 121b and extending in the vertical direction. For example, as shown in FIG. 7, three frame members 121c are provided at equal intervals on a concentric circle with the top plate 121a and the bottom plate 121b. Each frame member 121c is provided with a plurality of holding members 122 for holding the wafer W at predetermined intervals in the vertical direction. With such a configuration, the buffer unit 120 can carry the wafer W in and out of the opening portion on the side surface of the frame 121 and store it.

  Below the buffer unit 120, as shown in FIG. 6, a buffer unit transport mechanism 123 incorporating a motor (not shown) and the like is provided. The buffer unit transport mechanism 123 is attached to the rail 45 shown in FIG. The buffer unit 120 is transported on the rail 45 by the buffer unit transport mechanism 123 and is disposed at a position facing the first to fourth processing device groups G1 to G4.

  The wafer W stored in the buffer unit 120 is moved to a predetermined position by the wafer transfer device 40 as shown in FIG. As a result, wafer transfer mechanisms 150 and 190 of each processing apparatus described later in the first processing apparatus group G1 can access all the wafers W in the buffer unit 120.

  Note that the configurations of the second to fourth buffer devices 42 to 44 are the same as the configuration of the first buffer device 41 described above, and a description thereof will be omitted.

  Next, the structure of the resist coating apparatuses 60 to 65 will be described. FIG. 9 is a cross-sectional view showing an outline of the configuration of the resist coating apparatus 60, and FIG. 10 is a longitudinal cross-sectional view showing an outline of the configuration of the resist coating apparatus 60.

  As shown in FIG. 9, the resist coating apparatus 60 has a processing container 130 whose inside can be closed. A loading / unloading port 131 for the wafer W is formed on a side surface of the processing container 130 facing the first buffer device 41 (second to fourth buffer devices 42 to 44).

  A spin chuck 132 for holding and rotating the wafer W is provided at the center of the processing container 130 as shown in FIG. The spin chuck 132 has a horizontal upper surface, and a suction port (not shown) for sucking, for example, the wafer W is provided on the upper surface. By suction from the suction port, the wafer W can be sucked and held on the spin chuck 132.

  The spin chuck 132 has a drive mechanism 133 with a built-in motor (not shown), for example, and can be rotated at a predetermined speed by the drive mechanism 133. Further, the drive mechanism 133 is provided with an elevating drive source such as a cylinder, and the spin chuck 132 can move up and down.

  Around the spin chuck 132, there is provided a cup 134 that receives and collects the liquid scattered or dropped from the wafer W. A lower surface of the cup 132 is connected to a discharge pipe 135 that discharges the collected liquid and an exhaust pipe 136 that exhausts the atmosphere in the cup 132.

  As shown in FIG. 9, a rail 140 extending along the Y direction (left and right direction in FIG. 9) is formed on the X direction negative direction (downward direction in FIG. 9) side of the cup 134. The rail 140 is formed, for example, from the outside of the cup 134 in the Y direction negative direction (left direction in FIG. 9) to the outside in the Y direction positive direction (right direction in FIG. 9). An arm 141 is attached to the rail 140.

  A coating nozzle 142 that discharges a resist solution is supported on the arm 141. The arm 141 is movable on the rail 140 by the nozzle driving unit 143. The arm 141 can be moved up and down by a nozzle driving unit 143, and the height of the application nozzle 142 can be adjusted.

  A wafer transfer mechanism 150 as a substrate transfer mechanism is provided above the spin chuck 132 in the processing container 130 as shown in FIG. The wafer transfer mechanism 150 has a transfer arm 151 that holds and transfers the wafer W. As shown in FIG. 9, the transfer arm 151 supports a pair of arm portions 152, 152 extending in the transfer direction D (X direction in FIG. 9) of the wafer W and the arm portions 152, and the transfer direction of the wafer W. And a support portion 153 extending in the direction perpendicular to D (the Y direction in FIG. 9). On the upper surface of each arm portion 152, a suction pad 154 is provided as a holding portion that sucks and horizontally holds the back surface of the wafer W.

  As shown in FIG. 10, the transfer arm 151 is provided with an arm moving mechanism 155 incorporating a motor (not shown), for example. The arm moving mechanism 155 can adjust the distance between the pair of arm portions 152 and 152 by moving the support portion 153 in a direction perpendicular to the transfer direction D of the wafer W. The arm moving mechanism 155 can also move the transfer arm 151 in the vertical direction. As the transfer arm 151 moves up and down in this way, the transfer arm 151 can deliver the wafer W to the spin chuck 132 and receive the wafer W from the spin chuck 132.

  A pair of rails 156 and 156 extending in the transfer direction D of the wafer W are provided on the inner surface of the processing container 130 as shown in FIG. As shown in FIG. 10, the arm moving mechanism 155 is attached to the rail 156 and can move along the rail 156. The arm moving mechanism 155 allows the transfer arm 151 to transfer the wafer W between the first buffer device 41 and the resist coating device 60 while holding the wafer W as shown in FIG. .

  In addition, about the structure of the resist coating apparatuses 61-65, since it is the same as that of the resist coating apparatus 60 mentioned above, description is abbreviate | omitted.

  The lower antireflection film forming devices 53 to 55, the upper antireflection film forming devices 70 to 73, and the development processing devices 80 to 84 also have the same configuration as the resist coating devices 60 to 65 described above, and the wafer transfer mechanism 150. It has. Further, the adhesion devices 50 and 51 are similarly provided with a wafer transfer mechanism 150.

  Next, the structure of the heat processing apparatus 56-58, 66-68, 74-78, 85-88 mentioned above is demonstrated. FIG. 12 is a cross-sectional view schematically showing the configuration of the heat treatment apparatus 56, and FIG. 13 is a vertical cross-sectional view showing the outline of the configuration of the heat treatment apparatus 56.

  The heat processing apparatus 56 has the processing container 160 which can close an inside, as shown in FIG. A loading / unloading port 161 for the wafer W is formed on a side surface of the processing container 130 that faces the first buffer device 41 (second to fourth buffer devices 42 to 44). As shown in FIG. 13, the heat treatment apparatus 56 includes a heating unit 162 that heat-processes the wafer W and a cooling unit 163 that cools the wafer W in the processing container 160.

  The heating unit 162 is provided with a hot plate 170 for placing and heating the wafer W. The hot plate 170 has a substantially disk shape with a large thickness. The heat plate 170 has a horizontal upper surface, and a suction port (not shown) for sucking the wafer W, for example, is provided on the upper surface. By suction from the suction port, the wafer W can be sucked and held on the hot plate 170.

  Inside the hot plate 170, a heater 171 that generates heat by power feeding is attached. The heat plate 170 can be adjusted to a predetermined set temperature by the heat generated by the heater 171.

  A plurality of through holes 172 penetrating in the vertical direction are formed in the hot plate 170. A lift pin 173 is provided in the through hole 172. The lift pins 173 can be moved up and down by a lift drive mechanism 174 such as a cylinder. The elevating pins 173 are inserted through the through holes 172 and protrude from the upper surface of the hot plate 170 so that the elevating pins 173 can move up and down while supporting the wafer W.

  The heating plate 170 is provided with an annular holding member 175 that holds the outer peripheral portion of the heating plate 170. The holding member 175 is provided with a cylindrical support ring 176 that surrounds the outer periphery of the holding member 175 and accommodates the lifting pins 173.

  The cooling unit 163 adjacent to the heating unit 162 is provided with a cooling plate 180 for mounting and cooling the wafer W. The cooling plate 180 has a thick substantially disk shape. The cooling plate 180 has a horizontal upper surface, and a suction port (not shown) for sucking the wafer W, for example, is provided on the upper surface. The wafer W can be sucked and held on the cooling plate 180 by suction from the suction port.

  A cooling member (not shown) such as a Peltier element is built in the cooling plate 180, and the cooling plate 180 can be adjusted to a predetermined set temperature.

  Other configurations of the cooling unit 163 have the same configuration as the heating unit 162. That is, the cooling plate 180 is formed with a plurality of through holes 181 penetrating in the vertical direction. A lift pin 182 is provided in the through hole 181. The lift pins 182 can be moved up and down by a lift drive mechanism 183 such as a cylinder. The elevating pins 182 are inserted through the through holes 181 and protrude from the upper surface of the cooling plate 180, and can move up and down while supporting the wafer W.

  The cooling plate 180 is provided with an annular holding member 184 that holds the outer periphery of the cooling plate 180. The holding member 184 is provided with a cylindrical support ring 185 that surrounds the outer periphery of the holding member 184 and accommodates the lifting pins 182.

  Above the hot plate 170 and the cooling plate 180, a wafer transfer mechanism 190 as a substrate transfer mechanism is provided. The wafer transfer mechanism 190 has a transfer arm 191 that holds and transfers the outer periphery of the wafer W as shown in FIG. The transfer arm 191 has a shape that fits the outer periphery of the wafer W, for example, an arm portion 192 that is formed in an approximately 3/4 annular shape, and a support that is formed integrally with the arm portion 192 and supports the arm portion 192. Part 193. In the arm part 192, for example, three holding parts 194 that directly support the outer peripheral part of the wafer W are provided. The holding portions 194 are provided at equal intervals on the inner circumference of the arm portion 192, and project inside the arm portion 192.

  As shown in FIG. 13, the transfer arm 191 is provided with an arm moving mechanism 195 containing a motor (not shown), for example. The arm moving mechanism 195 supports the transfer arm 191 and supports the vertical moving unit 196 extending in the vertical direction and the vertical moving unit 196 in the direction perpendicular to the transfer direction D of the wafer W (Y direction in FIG. 12). And a horizontally moving portion 197 that extends. The vertical movement unit 196 allows the transfer arm 191 to move in the vertical direction. As the transfer arm 191 moves up and down in this way, the transfer arm 191 can deliver the wafer W to the lift pins 173 and 182 and receive the wafer W from the lift pins 173 and 182.

  As shown in FIG. 12, a pair of rails 198 and 198 extending in the transfer direction D (X direction in FIG. 12) of the wafer W are provided on the inner surface of the processing container 160. The horizontal moving unit 197 of the arm moving mechanism 195 is attached to the rail 198 and can move along the rail 198. By this arm moving mechanism 195, the transfer arm 191 can transfer the wafer W between the heating unit 162 and the cooling unit 163. Further, the transfer arm 191 can transfer the wafer W between the first buffer device 41 and the heat treatment device 56 while holding the wafer W.

  In addition, about the structure of the heat processing apparatus 57, 58, 66-68, 85-88, since it is the same as that of the heat processing apparatus 56 mentioned above, description is abbreviate | omitted.

  In addition to the configuration of the heat treatment apparatus 56 described above, the heat treatment apparatuses 74 to 78 have a wafer W loading / unloading port 199 formed on the side surface facing the loading / unloading window 161 of the processing container 160 as shown in FIGS. 14 and 15. Has been.

  For example, as shown in FIG. 14, the heat treatment apparatus 74 performs heat treatment on the wafer W transferred from the first buffer apparatus 41 (second to fourth buffer apparatuses 42 to 44) side to the wafer transfer apparatus 90 side. . In such a case, the heating unit 162 of the heat treatment apparatus 74 is disposed on the wafer transfer apparatus 90 side, and the cooling unit 163 is disposed on the first buffer apparatus 41 side. The heat treatment apparatuses 75 and 76 are also arranged in the same manner as the heat treatment apparatus 74.

  Further, for example, the heat treatment apparatus 77 heat-treats the wafer W transferred from the wafer transfer apparatus 90 side to the first buffer apparatus 41 (second to fourth buffer apparatuses 42 to 44) side as shown in FIG. I do. In such a case, the heating unit 162 of the heat treatment device 77 is disposed on the first buffer device 41 side, and the cooling unit 163 is disposed on the wafer transfer device 90 side. The heat treatment apparatus 78 is arranged in the same manner as the heat treatment apparatus 77.

  Therefore, in the heat treatment apparatuses 74 to 78, the temperature of the wafer W transferred into the processing container 160 is first adjusted in the cooling unit 163 and then heated in the heating unit 162.

  The coating and developing treatment system 1 according to the present embodiment is configured as described above. Next, processing of the wafer W performed in the coating processing system 1 will be described. FIG. 16 is a flowchart showing the main steps of such wafer processing.

  First, a cassette C containing a plurality of wafers W in one lot is placed on a predetermined cassette placement plate 21 of the cassette station 10. At this time, in the processing station 11, the first buffer device 41 is arranged to face the first processing device group G1. Thereafter, the wafer W in the cassette C is taken out by the wafer transfer device 31 and transferred to the first buffer device 41 via the transfer device 52 of the processing station 11. The plurality of wafers W are temporarily stored in the first buffer device 41.

  Next, the wafer W stored in the first buffer device 41 is transferred to the heat treatment apparatus 58 by the wafer transfer mechanism 190 of the heat treatment apparatus 58, and the temperature is adjusted (step S1 in FIG. 16). After the temperature adjustment, the wafer W is returned to the first buffer device 41 by the wafer transfer mechanism 190.

  Thereafter, the wafer W is transferred to the lower antireflection film forming apparatus 55 by the wafer transfer mechanism 150 of the lower antireflection film forming apparatus 55, and a lower antireflection film is formed on the wafer W (step S2 in FIG. 16). . After forming the lower antireflection film, the wafer W is returned to the first buffer device 41 by the wafer transfer mechanism 150.

  Thereafter, the wafer W is transferred to the heat treatment apparatus 57 by the wafer transfer mechanism 190 of the heat treatment apparatus 57, and the temperature is adjusted. After the temperature adjustment, the wafer W is returned to the first buffer device 41 by the wafer transfer mechanism 190.

  Thereafter, the wafer W is transferred to the adhesion device 51 by the wafer transfer mechanism 150 of the adhesion device 51 and subjected to a hydrophobic treatment (step S3 in FIG. 16). After the hydrophobic treatment, the wafer W is returned to the first buffer device 41 by the wafer transfer mechanism 150.

  Next, the first buffer device 41 is moved on the rail 45 by the buffer unit transport mechanism 123 and is disposed to face the second processing device group G2.

  Thereafter, the wafer W is transported to the resist coating device 65 by the wafer transport mechanism 150 of the resist coating device 65, and a resist film is formed on the wafer W (step S4 in FIG. 16). After the resist film is formed, the wafer W is returned to the first buffer device 41 by the wafer transfer mechanism 150.

  Thereafter, the wafer W is transferred to the heat treatment apparatus 68 by the transfer mechanism 190 of the heat treatment apparatus 68, and is pre-baked (step S5 in FIG. 16). After the pre-baking process, the wafer W is returned to the first buffer device 41 by the wafer transfer mechanism 190.

  Next, the first buffer device 41 is moved on the rail 45 by the buffer unit transport mechanism 123 and is disposed to face the third processing device group G3.

  Thereafter, the wafer W is transferred to the upper antireflection film forming apparatus 73 by the wafer transfer mechanism 150 of the upper antireflection film forming apparatus 73, and an upper antireflection film is formed on the wafer W (step S6 in FIG. 16). . After the upper antireflection film, the wafer W is returned to the first buffer device 41 by the wafer transfer mechanism 150.

  Thereafter, the wafer W is transferred to the heat treatment apparatus 74 by the wafer transfer mechanism 190 of the heat treatment apparatus 74 and the temperature is adjusted. After the temperature adjustment, the wafer is transferred from the heat treatment apparatus 74 to the peripheral exposure apparatus 92 by the wafer transfer apparatus 90 and subjected to the peripheral exposure process (step S7 in FIG. 16).

  Thereafter, the wafer W is transferred to the exposure apparatus 12 by the wafer transfer apparatus 90 and subjected to exposure processing (step S8 in FIG. 16).

  Thereafter, the wafer W is transferred from the exposure apparatus 12 to the heat treatment apparatus 77 by the wafer transfer apparatus 90 and subjected to post-exposure baking (step S9 in FIG. 16). The post-exposure bake process and the wafer W are transferred to the first buffer device 41 by the wafer transfer mechanism 190 of the heat treatment device 77.

  Next, the first buffer device 41 is moved on the rail 45 by the buffer unit transport mechanism 123 and is disposed to face the fourth processing device group G4.

  Thereafter, the wafer W is transferred to the development processing apparatus 84 by the wafer transfer mechanism 150 of the development processing apparatus 84 and developed (step S10 in FIG. 16). After the development processing, the wafer W is returned to the first buffer device 41 by the wafer transfer mechanism 150.

  Thereafter, the wafer W is transferred to the heat treatment apparatus 88 by the transfer mechanism 190 of the heat treatment apparatus 88 and subjected to post-bake processing (step S11 in FIG. 16). After the post-baking process, the wafer W is returned to the first buffer device 41 by the wafer transfer mechanism 190.

  Next, the first buffer device 41 is moved on the rail 45 by the buffer unit transport mechanism 123 and is disposed to face the first processing device group G1. Thereafter, the wafer W is transferred to the wafer transfer device 31 via the delivery device 52. Thereafter, the wafer W is transferred to the cassette C of the predetermined cassette mounting plate 21 by the wafer transfer device 31. Thus, a series of photolithography steps is completed.

  According to the above embodiment, each processing apparatus of the first to fourth processing apparatus groups G1 to G4 has the transport mechanisms 150 and 190 for transporting the wafer W, and thus is required in each processing apparatus. At the timing, the wafer W can be carried in and out of the processing apparatus. That is, when the wafer W can be processed by the processing apparatus, the wafer W can be quickly loaded into the apparatus by the transfer mechanisms 150 and 190 of the processing apparatus. Further, when the processing of the wafer W is completed in the processing apparatus, the wafer W can be quickly unloaded from the apparatus by the transfer mechanisms 150 and 190 of the processing apparatus. As a result, the substrate can be transported efficiently without waiting for the transport of the substrate in the processing apparatus as in the prior art.

  Further, since the buffer unit 120 can be transported to a position facing the first to fourth processing device groups G1 to G4 by the buffer unit transporting mechanism 123, a plurality of processing units can be transferred from one processing device group to another processing device group that performs subsequent processing. The wafers W can be transferred at once.

  Further, since the wafer W in the buffer unit 120 can be moved to a predetermined position (vertical position) by the wafer transfer device 40, the transfer mechanisms 150 and 190 of each processing apparatus transfer the predetermined wafer W to the buffer unit. It can be conveyed from 120 into the processing apparatus.

  Further, the wafer transfer apparatuses 31 and 40 can hold a plurality of wafers W and can transfer a plurality of wafers W at a time.

  Thus, according to the present embodiment, the transfer efficiency of the wafer W can be remarkably improved. In addition, since the coating and developing treatment system 1 has the plurality of first to fourth buffer devices 41 to 44, it is possible to perform processing on a large number of wafers W in the coating and developing treatment system 1. Therefore, the throughput of wafer processing can be improved.

  The first buffer device 41 of the above embodiment may include a buffer unit 210 having another configuration as shown in FIGS. 17 and 18. The buffer unit 210 includes a frame 211 having a cylindrical shape with an open side surface. The frame 211 has a disk-shaped top plate 211a, a disk-shaped bottom plate 211b, and a frame member 211c provided between the top plate 211a and the bottom plate 211b and extending in the vertical direction. ing. For example, three frame members 211c are provided at equal intervals on a concentric circle with the top plate 211a and the bottom plate 211b. The frame member 211c is provided with a plurality of flat plate-like members 212 that divide the inside of the frame 211 into a plurality at predetermined intervals in the vertical direction. For example, three holding pins 213 as holding members for holding the wafer W are provided at the center of the upper surface of the flat plate member 212. With such a configuration, the buffer unit 210 can carry the wafer W in and out of the opening portion on the side surface of the frame 211 and store it. In such a case, the buffer unit 210 can hold and store a plurality of wafers W in multiple stages in the vertical direction. Note that the buffer unit transport mechanism 123 described above is provided below the buffer unit 210.

  Note that the second to fourth buffer devices 42 to 44 may also include the buffer unit 210 described above.

  The frame 121 of the buffer unit 120 of the above embodiment may have a rectangular parallelepiped shape whose side surface is open as shown in FIG. In such a case, the top plate 121a and the bottom plate 121b are formed in a square shape, and the frame member 121c is provided at, for example, the four corners of the top plate 121a and the bottom plate 121b. Each frame member 121c is provided with a plurality of holding members 122 for holding the wafer W at predetermined intervals. With such a configuration, the buffer unit 120 can carry the wafer W in and out of the opening portion on the side surface of the frame 121 and store it. Similarly, the buffer unit 210 may have a rectangular parallelepiped frame 211.

  Further, the first buffer device 41 of the above embodiment may include a buffer unit 220 having another configuration as shown in FIGS. The buffer unit 220 includes a support member 221 that extends in the vertical direction. The support member 221 is supported by a disk-shaped bottom plate 222, for example. The support member 221 is provided with a plurality of support plates 224 at predetermined intervals in the vertical direction via the member 223. At the center of the upper surface of each support plate 224, for example, three holding pins 225 as holding members for holding the wafer W are provided. In such a case, the buffer unit 220 can hold and store a plurality of wafers W in multiple stages in the vertical direction. Note that the buffer unit moving mechanism 123 described above is provided below the buffer unit 220.

  Note that the second to fourth buffer devices 42 to 44 may also include the buffer unit 220 described above.

  In the first buffer device 41 of the above embodiment, the buffer unit 120 may be moved in the vertical direction and rotated around the central axis in the vertical direction. In such a case, a shaft 230 is provided between the buffer unit 120 and the buffer unit transport mechanism 123 as shown in FIG. The buffer unit transport mechanism 123 has a function of transporting the buffer unit 120 on the rail 45 as described above, moves the buffer unit 120 in the vertical direction using the shaft 230, and rotates around the central axis in the vertical direction. It also has a function as a buffer unit moving mechanism that rotates the motor.

  Since the buffer unit 120 is configured to be movable in the vertical direction in this way, the wafer transfer mechanisms 150 and 190 of the processing apparatuses of the first to fourth processing apparatus groups G1 to G4 are all in the buffer unit 120. The wafer W can be accessed. Accordingly, the transfer mechanisms 150 and 190 can transfer a predetermined wafer W to the processing apparatus regardless of the position in the buffer unit 120 where the wafer W is stored.

  In addition, since the buffer unit 120 is configured to be rotatable, when the transfer mechanisms 150 and 190 of each processing apparatus and the wafer transfer device 40 access the buffer unit 120, interference with the frame member 121c of the buffer unit 120 is avoided. Thus, the wafer W can be smoothly transferred.

  Note that the second to fourth buffer devices 42 to 44 may also include the shaft 230 and the buffer unit transport mechanism 123 described above. Similarly, the buffer units 210 and 220 may have the shaft 230 and the buffer unit transport mechanism 123 described above.

  In the above embodiment, the buffer unit 120 of the first to fourth buffer devices 41 to 44 is moved on the rail 45 by the buffer unit transport mechanism 123. However, as shown in FIG. It may be used to move the buffer unit 120. The four buffer units 120 are fixedly provided on the rotary table 240. The buffer unit 120 is arranged on the concentric circle with the rotary table 240 (on the circumference centered on the wafer transfer apparatus 40) at equal intervals, and is arranged so as to be opposed to the first to fourth processing apparatus groups G1 to G4. ing. A wafer transfer device 40 is disposed at the center of the turntable 240, and the drive mechanism 114 of the wafer transfer device 40 is fixed in the turntable 240. A drive mechanism 242 including a motor (not shown), for example, is provided on the lower surface of the rotary table 240 via a shaft 241. By this drive mechanism 242, the rotary table 241 rotates around the wafer transfer device 40, and the buffer unit 120 can be moved.

  Although the heat treatment apparatus 56 of the above embodiment has one wafer transfer mechanism 190, it may have a plurality of wafer transfer mechanisms 190. For example, as shown in FIG. 24, two wafer transfer mechanisms 190, 190 are provided side by side in the vertical direction. In this case, for example, after the heat treatment is performed on the wafer W transferred by one transfer mechanism 190, the heat treatment can be performed on the wafer W transferred by another transfer mechanism 190 immediately. Therefore, the throughput of wafer processing can be further improved.

  Similarly, the resist coating apparatus 60 may have a plurality of wafer conveyance mechanisms 150.

  The resist coating apparatus 60 of the above embodiment may have a wafer transport mechanism 250 having another configuration as shown in FIGS. The wafer transfer mechanism 250 has, for example, two articulated transfer arms 251 that hold and transfer the wafer W. Each transfer arm 251 has a plurality of, for example, four arm portions 252. The four arm portions 252 are connected such that one arm portion 252 is flexibly connected to another arm portion 252 at an end portion thereof. Power is transmitted between the arm portions 252 so that the transfer arm 251 can bend and stretch. The front arm portion 252a is provided with a suction pad 253 as a holding portion that sucks and horizontally holds the back surface of the wafer W.

  An arm moving mechanism 254 is provided on the lower surface of the base arm portion 252b. The arm moving mechanism 254 includes a shaft 255 that supports the arm portion 252b, and a drive mechanism 256 that is provided below the shaft 255 and incorporates, for example, a motor (not shown). With this arm moving mechanism 254, the transfer arm 251 can move in the vertical direction. The transfer arm 251 can transfer the wafer W between the first buffer device 41 and the resist coating device 60 while holding the wafer W.

  Note that the number of transfer arms 251 is not limited to the present embodiment and can be arbitrarily selected.

  In the above embodiment, the wafer transfer mechanisms 150 and 250 are provided in the liquid processing apparatus such as the resist coating apparatus 60, and the wafer transfer mechanism 190 is provided in the heat treatment apparatus such as the heat treatment apparatus 56. A mechanism 190 may be provided, and the wafer transfer mechanisms 150 and 250 may be provided in the heat treatment apparatus.

  In the first to fourth processing device groups G1 to G4 of the above embodiments, the arrangement of the processing devices can be arbitrarily selected.

  For example, only the liquid processing apparatus may be disposed in one processing apparatus group, and only the heat treatment apparatus may be disposed in another processing apparatus group. For example, as shown in FIGS. 27 and 28, in the first processing device group G1, the adhesion devices 50 and 51, the delivery device 52, and the heat treatment devices 56 to 58 and 66 to 68 are arranged in nine stages in order from the bottom. Has been. In the second processing apparatus group G2, resist coating apparatuses 60 to 65 and lower antireflection film forming apparatuses 53 to 55 are arranged in nine stages in order from the bottom. In the third treatment device group G3, heat treatment devices 74 to 78 and 85 to 88 are arranged in nine stages in order from the bottom. In the fourth processing unit group G4, development processing units 80 to 84 and upper antireflection film forming units 70 to 73 are arranged in nine stages in order from the bottom. Even in such a case, the first to fourth buffer devices 41 to 44 can be moved to positions facing the first to fourth processing device groups G1 to G4 to perform a series of wafer processing.

  Moreover, the processing apparatus layer provided with the liquid processing apparatus and the heat processing apparatus may be arrange | positioned at one stage at multiple stages in one processing apparatus group. For example, as shown in FIG. 29, in the second processing unit group G2, processing unit layers L1 to L3 are arranged in three stages in order from the top. In the processing apparatus layer L1, a heat treatment apparatus 66, a lower antireflection film forming apparatus 53, and a resist coating apparatus 60 are arranged in this order from the top. In the processing apparatus layer L2, a heat treatment apparatus 67, a lower antireflection film forming apparatus 54, and a resist coating apparatus 61 are arranged in order from the top. In the processing apparatus layer L3, a heat treatment apparatus 68, a lower antireflection film forming apparatus 55, and a resist coating apparatus 62 are arranged in this order from the top. In such a case, the wafer transfer device 40 moves the buffer unit 120 of the first buffer device 41 in the vertical direction by the height of the processing device layers L1 to L3, so that the lower antireflection film and the resist film are formed on the wafer W. The process to form can be performed. Thereby, since the moving distance in the buffer unit 120 by the wafer transfer device 40 can be shortened, the transfer efficiency of the wafer W can be further improved, and the throughput of the wafer processing can be further improved. Similarly, for other processing device groups G1, G3, and G4, processing device layers including a liquid processing device and a heat treatment device may be arranged in multiple stages in the vertical direction.

  In the above embodiment, the transfer device 52 is provided in the first processing device group G1. However, the transfer device 52 is replaced with another processing device such as a liquid processing device or a heat treatment device, and the wafer transfer device 31 is replaced. A plurality of wafers W may be directly transferred from the first to the first buffer device 41. In such a case, the wafer W can be more efficiently transferred.

  In the above embodiment, the lower antireflection film forming devices 70 to 73 and the heat treatment devices 74 to 78 are arranged in the fourth processing device group G4. However, the first to fourth buffer devices 41 to 44 and A delivery device for delivering the wafer W to and from the wafer transfer device 90 may be provided. In such a case, for example, the heat treatment apparatus 74 is provided in the interface station 13. Then, after forming the upper antireflection film on the wafer W, the wafer W is transferred to the heat treatment device 74 of the interface station 13 via the transfer device, and the temperature of the wafer W before the peripheral exposure processing is adjusted.

  Further, the peripheral exposure device 92 provided in the interface station 13 may be provided in the fourth processing device group G4.

  In the above embodiment, the first to fourth buffer devices 41 to 44 are configured to be movable. However, they may be fixedly arranged in the processing station 11 as shown in FIG. Around the wafer conveyance device 40, first to fourth buffer devices 41 to 44 are arranged at equal intervals on a circumference centered on the wafer conveyance device 40. The first buffer device 41 is disposed on the cassette station 10 side (Y direction negative direction side in FIG. 30) of the processing station 11, and the second buffer device 42 is on the front side of the processing station 11 (X direction in FIG. 1). The third buffer device 43 is disposed on the interface station 13 side (the Y direction positive direction side in FIG. 1) of the processing station 11, and the fourth buffer device 44 is disposed on the processing station 11. It arrange | positions at the back side (X direction positive direction side of FIG. 1). First to fourth processing device groups G1 to G4 are arranged at positions facing the first to fourth buffer devices 41 to 44, respectively. The wafer W is transferred between the first to fourth buffer devices 41 to 44 by the wafer transfer device 44. In this case, the first to fourth buffer devices 41 to 44 and the first to fourth processing device groups G1 to G4 can be densely arranged in the processing station 11, and the area occupied by the entire coating and developing processing system 1 Can be reduced.

  In the above embodiment, as shown in FIG. 31, other processing device groups G5 and G6 having a liquid processing device and a heat treatment device at positions facing the second buffer device 42 and the fourth buffer device 44, respectively. May be arranged respectively. For example, the fifth processing device group G5 includes processing devices similar to the second processing device group 2, and the sixth processing device group G6 includes processing devices similar to the fourth processing device group G4. ing. In such a case, a larger number of wafers W can be processed in the coating and developing processing system 1, and the throughput of the wafer processing can be further improved.

  The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to such examples. It is obvious for those skilled in the art that various modifications or modifications can be conceived within the scope of the idea described in the claims, and these naturally belong to the technical scope of the present invention. It is understood. The present invention is not limited to this example and can take various forms. The present invention can also be applied to a case where the substrate is another substrate such as an FPD (flat panel display) other than a wafer or a mask reticle for a photomask.

  The present invention is useful for a processing system for a substrate such as a semiconductor wafer.

DESCRIPTION OF SYMBOLS 1 Coating | development processing system 10 Cassette station 11 Processing station 13 Interface station 20 Cassette mounting base 31 Wafer transfer apparatus 40 Wafer transfer apparatus 41 1st buffer apparatus 42 2nd buffer apparatus 43 3rd buffer apparatus 44 4th buffer apparatus 45 Rail 50, 51 Adhesion device 53-55 Lower antireflection film forming device 56-58, 66-68, 74-78, 85-88 Heat treatment device 60-65 Resist coating device 70-73 Upper antireflection film forming device 80- 84 Development processing device 120 Buffer unit 121 Frame 122 Holding member 123 Buffer unit transfer mechanism 150 Wafer transfer mechanism 151 Transfer arm 152 Arm unit 154 Suction pad 155 Arm moving mechanism 190 Wafer transfer mechanism 191 Arm 192 Arm portion 194 holding section 195 arm moving mechanism C cassette G1~G4 first to fourth processing unit group W wafer

Claims (22)

A substrate processing system,
A plurality of substrates placed in multiple stages in the vertical direction, and a plurality of buffer units that move on a circumference centered on the substrate transfer device;
A plurality of processing apparatus groups provided in multiple stages in the vertical direction with processing apparatuses for performing predetermined processing on the substrate, and disposed outside the circumference,
The substrate transport device transports a substrate between the buffer units,
The substrate processing system, wherein the processing apparatus includes a substrate transport mechanism for transporting a substrate between the processing apparatus and the buffer unit. The substrate processing system according to claim 1, wherein the buffer unit has a buffer unit transport mechanism that moves on the circumference. The plurality of buffer units are arranged on the circumference on a rotary table,
The substrate processing system according to claim 1, wherein the turntable is rotatable about the substrate transfer device. The substrate processing system according to claim 1, wherein the buffer unit includes a buffer unit moving mechanism that moves the buffer unit in a vertical direction. The substrate processing system according to claim 4, wherein the buffer unit moving mechanism rotates the buffer unit around a central axis in a vertical direction of the buffer unit. The substrate processing system according to claim 1, wherein the substrate transfer apparatus can hold a plurality of substrates. A cassette placement unit for placing a cassette containing a plurality of substrates when carrying in and out of the substrate processing system;
The substrate according to claim 1, further comprising: another substrate transport device that transports a substrate between the cassette mounting unit and the buffer unit on the cassette mounting unit side. Processing system. The substrate processing system according to claim 7, wherein the other substrate transfer apparatus is capable of holding a plurality of substrates. The plurality of processing apparatus groups include a liquid processing apparatus group in which liquid processing apparatuses that perform processing by supplying a predetermined liquid to a substrate are arranged in multiple stages, and a heat processing apparatus that performs heat processing on the substrate at a predetermined temperature. The substrate processing system according to claim 1, comprising a group of heat treatment apparatuses arranged in multiple stages in the vertical direction. The plurality of processing apparatus groups include a processing apparatus group in which a liquid processing apparatus that supplies a predetermined liquid to a substrate and performs processing and a heat processing apparatus that performs heat processing on the substrate at a predetermined temperature are arranged in multiple stages in the vertical direction. The substrate processing system according to claim 1, wherein the substrate processing system is provided. 11. The substrate processing system according to claim 10, wherein in one processing apparatus group, processing apparatus layers including the liquid processing apparatus and the heat treatment apparatus are arranged in multiple stages in a vertical direction. The said buffer part has a frame which stores a board | substrate inside, and the holding member which is provided with two or more by predetermined spacing in the perpendicular direction in the said frame, and hold | maintains a board | substrate of Claim 1-11 characterized by the above-mentioned. The substrate processing system according to any one of the above. The buffer unit includes a frame for storing a substrate therein, a plurality of flat members provided at predetermined intervals in the vertical direction in the frame, and a plurality of flat members that divide the inside of the frame into a plurality of members, and an upper surface of the flat member. The substrate processing system according to claim 1, further comprising a holding member that holds the substrate. The substrate processing system according to claim 12, wherein the frame has a cylindrical shape with an open side surface. The substrate processing system according to claim 12, wherein the frame has a rectangular parallelepiped shape with side surfaces opened. The said buffer part has the supporting member extended | stretched to a perpendicular direction, and the holding member which is provided in the said supporting member at the predetermined | prescribed space | interval in the perpendicular direction, and hold | maintains a board | substrate characterized by the above-mentioned. The substrate processing system according to any one of the above. The substrate transfer mechanism adjusts the interval between the pair of arm portions, a transfer arm provided on the arm portion and a holding portion for holding the substrate, and the pair of arm portions. The substrate processing system according to claim 1, further comprising an arm moving mechanism that moves in a direction. The substrate transfer mechanism includes a transfer arm provided with an arm portion having a shape that fits an outer periphery of the substrate, a holding portion that is provided on the arm portion and holds the substrate, and moves the transfer arm in a horizontal direction. The substrate processing system according to claim 1, further comprising an arm moving mechanism. 19. The substrate processing system according to claim 17, wherein the arm moving mechanism moves the transfer arm in a vertical direction. The substrate transport mechanism includes a transport arm that holds and transports a substrate, and the transport arm is provided in a plurality of flexibly connected arm portions and the arm portion at the tip, and holds the substrate. The substrate processing system according to claim 1, wherein the substrate processing system includes a unit. 21. The substrate processing system according to claim 20, wherein the substrate transport mechanism includes an arm moving mechanism that moves the transport arm in a vertical direction. The substrate processing system according to claim 17, wherein the substrate transfer mechanism includes a plurality of transfer arms.

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