WO2018008113A1

WO2018008113A1 - Circuit forming device

Info

Publication number: WO2018008113A1
Application number: PCT/JP2016/070032
Authority: WO
Inventors: 克明牧原; 政利藤田; 良崇橋本; 明宏川尻; 謙磁塚田; 雅登鈴木
Original assignee: 富士機械製造株式会社
Priority date: 2016-07-06
Filing date: 2016-07-06
Publication date: 2018-01-11
Also published as: JPWO2018008113A1; JP6785310B2

Abstract

A circuit forming device 10 of the present invention has a plurality of stages 20 on which substrates are mounted, wherein the plurality of stages are moved to an arbitrary one of a plurality of units including a resin print unit 22 and a metal ink print unit 26. In this way, the plurality of stages can be positioned at the plurality of units simultaneously, making it possible to perform operations in parallel with respect to the plurality of substrates held on the plurality of stages. Further, by preparing a unit and the like for storing the stages, it becomes possible to leave the stages in the unit to be dried at low temperature or naturally dried for a long time, while performing a printing step using a curable resin, a metal-containing liquid or the like in the other units. In this way, a circuit can be efficiently formed, and the practicality of the circuit forming device is improved.

Description

Circuit forming device

The present invention relates to a circuit forming apparatus that forms a circuit using a first discharge device that discharges a curable resin and a second discharge device that discharges a metal-containing liquid containing metal fine particles.

In recent years, as described in the following patent documents, a technique for forming a three-dimensional structure using a curable resin that is cured by irradiation with ultraviolet rays or the like has been developed. Using such a technique, a resin layer is formed from a curable resin, and a circuit is formed using the resin layer.

JP 2015-168202 A

When a circuit is formed using the technique described in the above-mentioned patent document, not only a resin layer is formed by a curable resin, but also a wiring is formed by a metal-containing liquid containing metal fine particles. . Thus, when a circuit is formed using a curable resin and a metal-containing liquid, a drying step for drying the curable resin and the metal ink may be required, and the drying temperature is low in the drying step. In some cases, drying time of 1 hour or more is required. In such a case, other operations are interrupted and the circuit formation efficiency is reduced. In addition, in a conventional circuit forming apparatus, one stage for holding a substrate sequentially moves between a plurality of units such as a unit for printing a curable resin and a unit for printing metal ink, Work is done in each unit. At this time, the unit in which the stage is not positioned cannot perform the work, and the work efficiency is poor. Thus, there are various problems in an apparatus for forming a circuit using a curable resin and a metal-containing liquid, and it is considered that the practicality of the circuit forming apparatus is improved by solving these various problems. . The present invention has been made in view of such circumstances, and an object of the present invention is to improve the practicality of a circuit forming apparatus.

In order to solve the above problems, a circuit forming apparatus of the present invention includes a resin layer forming unit including a first discharging device that discharges a curable resin, and a second discharging device that discharges a metal-containing liquid containing metal fine particles. A plurality of units including at least a wiring forming unit, a plurality of stages on which a substrate is placed, and a moving device that moves each of the plurality of stages to any one of the plurality of units. A circuit including a resin layer formed by discharging a curable resin of the first discharge device and a wiring formed by discharging a metal-containing liquid of the second discharge device is formed on a substrate. .

In the circuit forming apparatus of the present invention, a plurality of stages on which a substrate is placed are provided, and the plurality of stages are any one unit among a plurality of units such as a resin layer forming unit and a wiring forming unit. Moved to. Thereby, a plurality of stages can be simultaneously positioned on a plurality of units, and work can be performed in parallel on a plurality of substrates held on the plurality of stages. Also, for example, by preparing a unit or the like for storing the stage, the stage is left in the unit, and the curable resin, It becomes possible to perform a printing process of a metal-containing liquid or the like. Thereby, it becomes possible to form a circuit efficiently, and the practicality of a circuit formation apparatus improves.

It is a top view which shows a circuit formation apparatus. It is a side view which shows a storage unit. It is an enlarged view which shows a rotary table and a resin printing unit. It is sectional drawing in the AA line of FIG. It is the schematic which shows a linear motor. It is a block diagram which shows a control apparatus. It is sectional drawing which shows the circuit of the state in which the resin layer was formed. It is sectional drawing which shows the circuit of the state by which the electronic component was mounted | worn in the cavity of the resin layer. It is sectional drawing which shows the circuit of the state in which the resin layer was formed in the clearance gap between cavities. It is sectional drawing which shows the circuit of the state by which the metal ink was discharged on the resin layer.

Configuration of Circuit Forming Device FIG. 1 shows a circuit forming device 10. The circuit forming apparatus 10 includes a plurality of stages 20, a resin printing unit 22, a resin curing unit 24, a metal ink printing unit 26, a baking unit 28, a mounting unit 30, a storage unit group 32, and a moving device. 34 and a control device (see FIG. 6) 36. The resin printing unit 22, the resin curing unit 24, the metal ink printing unit 26, the baking unit 28, the mounting unit 30, the storage unit group 32, and the moving device 34 are included in the base 38 of the circuit forming device 10. Is placed on top.

Each stage 20 holds a substrate (see FIG. 7) 50, and includes a base 52, a holding device 54, and a stage lifting device 56. The base 52 is formed in a generally rectangular flat plate shape, and the substrate 50 is placed on the upper surface. The holding device 54 is provided on both sides of the base 52. And the both edges of the board | substrate 50 mounted in the base 52 are pinched | interposed by the holding | maintenance apparatus 54, and the board | substrate 50 is fixedly hold | maintained. The stage elevating device 56 is disposed below the base 52 and moves the base 52 up and down.

The resin printing unit 22 is a unit that prints an ultraviolet curable resin in a thin film on the substrate 50 placed on the base 52 of the stage 20, and includes an ink jet head (see FIG. 6) 60 and a flattening device (see FIG. 6). 6) 62). The inkjet head 60 discharges an ultraviolet curable resin onto the substrate 50 placed on the base 52. The inkjet head 60 may be, for example, a piezo method using a piezoelectric element, or a thermal method in which a resin is heated to generate bubbles and ejected from a nozzle. Further, the flattening device 62 flattens the upper surface of the ultraviolet curable resin discharged onto the substrate 50 by the inkjet head 60. By scraping with a roller or a blade, the thickness of the UV curable resin is made uniform.

The resin curing unit 24 is a unit that cures the ultraviolet curable resin discharged onto the substrate 50, and has an irradiation device (see FIG. 6) 66. The irradiation device 66 includes a mercury lamp or an LED as a light source, and irradiates the ultraviolet curable resin discharged on the substrate 50 with ultraviolet rays. Thereby, the ultraviolet curable resin discharged on the board | substrate 50 hardens | cures, and a resin layer is modeled.

The metal ink printing unit 26 is a unit that prints metal ink on the substrate 50 according to the circuit pattern, and has an inkjet head (see FIG. 6) 68. The ink jet head 68 ejects metal ink in a linear manner onto the substrate 50 placed on the base 52. The metal ink is obtained by dispersing metal fine particles in a solvent. The inkjet head 68 ejects metal ink from a plurality of nozzles by, for example, a piezo method using a piezoelectric element.

The firing unit 28 is a unit for firing the metal ink discharged onto the substrate 50, and has a laser irradiation device (see FIG. 6) 70. The laser irradiation device 70 is a device that irradiates a metal ink discharged onto the substrate 50 with a laser, and the metal ink irradiated with the laser is baked to form a wiring. The firing of the metal ink is a phenomenon in which, by applying energy, the solvent is vaporized, the metal particulate protective film is decomposed, etc., and the metal particulates are brought into contact with or fused to increase the conductivity. is there. And metal wiring is formed by baking metal ink.

The mounting unit 30 is a unit for mounting an electronic component (see FIG. 8) 72 on the substrate 50, and includes a tape feeder (see FIG. 6) 74, a mounting head (see FIG. 6) 76, and a moving device (FIG. 6). 78). The tape feeder 74 feeds the taped electronic components 72 one by one, and supplies the electronic components 72 at the supply position. The mounting head 76 has a suction nozzle (not shown) for holding the electronic component 72 by suction. The suction nozzle sucks and holds the electronic component 72 by sucking air when negative pressure is supplied from a positive / negative pressure supply device (not shown). Then, the electronic component 72 is detached by supplying a slight positive pressure from the positive / negative pressure supply device. The moving device 78 moves the mounting head 76 between the supply position of the electronic component 72 by the tape feeder 74 and the substrate 50 placed on the base 52. Thus, in the mounting unit 30, the electronic component 72 supplied from the tape feeder 74 is held by the suction nozzle, and the electronic component 72 held by the suction nozzle is mounted on the substrate 50.

As shown in FIG. 2, the storage unit group 32 has a rack 80, and the inside of the rack 80 is partitioned into three

storage units

82, 84, 86 for storing the stage 20. Specifically, the inside of the rack 80 is partitioned into three spaces separated by the shelf plate 88 in the vertical direction. Each space has a dimension capable of accommodating the stage 20, and a part of a moving device 34 described later is disposed inside each space. Then, the stage 20 is accommodated in each space by the operation of the moving device 34. For this reason, each space functions as a

storage unit

82, 84, 86 for storing the stage 20.

As shown in FIG. 1, the moving device 34 includes a rotary table 100, a slide mechanism 102, a linear motor 104, and a rack lifting device (see FIG. 2) 106. The rotary table 100 has a disk shape and is rotatably arranged at a substantially central portion of the base 38, and rotates in a controllable manner by driving a rotary motor (see FIG. 6). The resin printing unit 22, the resin curing unit 24, the metal ink printing unit 26, the baking unit 28, the mounting unit 30, and the storage unit group 32 are rotated along the rotation direction of the rotary table 100. In a state facing the outer peripheral edge of the table 100, the table 100 is arranged at six equal positions.

The slide mechanism 102 is arranged on a pair of table-side guide rails 110 disposed on the rotary table 100 and each unit (the

storage units

82, 84, 86 in the storage unit group 32) such as the resin printing unit 22. A pair of unit-side guide rails 112 provided and four sliders 114 disposed on each stage 20 are provided. The pair of table-side guide rails 110 are arranged on the upper surface of the turntable 100 in parallel with each other, symmetrically about the rotation center of the turntable 100 and spaced apart by a predetermined size. In addition, the pair of unit side guide rails 112 are separated from each other by the same dimension as the separation dimension of the pair of table side guide rails 110 symmetrically about a virtual line extending in the radial direction of the rotary table 100 and parallel to each other. In the state, it is disposed in each unit such as the resin printing unit 22. Thereby, when the rotary table 100 rotates to a predetermined position, the pair of table-side guide rails 110 and the pair of unit-side guide rails 112 of an arbitrary unit are arranged linearly. FIG. 1 illustrates the circuit forming apparatus 10 in a state in which a pair of table side guide rails 110 and a pair of unit side guide rails 112 of the resin printing unit 22 and the baking unit 28 are linearly arranged. Yes. The table-side guide rail 110 and the unit-side guide rail 112 are arranged with a predetermined clearance so as to ensure the rotation of the turntable 100.

Each stage 20 has a pair of sliders 114 fixed to both side surfaces on one end side in the longitudinal direction, and a pair of sliders 114 fixed to both side surfaces on the other end side. That is, four sliders 114 are fixed to both side surfaces of the stage 20. A pair of sliders 114 on one side surface of both side surfaces is slidably fitted to one of the pair of table side guide rails 110 or the pair of unit side guide rails 112. A pair of sliders 114 on the other side surface of the pair is slidably fitted to the other of the pair of table side guide rails 110 or the pair of unit side guide rails 112. The length of each slider 114 is longer than the clearance between the table side guide rail 110 and the unit side guide rail 112. As a result, as shown in FIG. 3, when the table side guide rail 110 and the unit side guide rail 112 are arranged linearly, between the top of the rotary table 100 and each unit such as the resin printing unit 22. Each stage 20 slides.

Also, the slide mechanism 102 has a power supply mechanism (see FIG. 4) 120 for supplying power from the base 38 to each stage 20. The power supply mechanism 120 includes a table-side power supply wiring 122, a unit-side power supply wiring 124, and a power reception terminal (see FIG. 4) 126. The table-side power supply wiring 122 is disposed on the upper surface of each of the pair of table-side guide rails 110 along the extending direction of each table-side guide rail 110. The unit-side power supply wiring 124 is disposed on the upper surface of each pair of unit-side guide rails 112 of each unit such as the resin printing unit 22 along the direction in which each unit-side guide rail 112 extends. Electric power is supplied to the table-side power supply wiring 122 and the unit-side power supply wiring 124 from a power supply source (not shown) disposed in the base 38. Further, as shown in FIG. 4 which is a cross-sectional view taken along the line AA in FIG. 3, the power receiving terminal 126 is arranged in a state of being exposed on the inner peripheral surface of the slider 114, and the table side guide rail 110 or the unit side. With the slider 114 fitted to the guide rail 112, the slider 114 contacts the table-side power supply wiring 122 or the unit-side power supply wiring 124.

Thereby, when the stage 20 is positioned on the rotary table 100, the power receiving terminal 126 comes into contact with the table side power supply wiring 122 and receives power from the table side power supply wiring 122. When the stage 20 is located in each unit such as the resin printing unit 22, the power receiving terminal 126 is in contact with the unit side power supply wiring 124 and receives power from the unit side power supply wiring 124. Also, when the stage 20 slides between the rotary table 100 and each unit, the power reception by the power reception terminal 126 is ensured.

Specifically, when the stage 20 slides between the rotary table 100 and each unit, when the slider 114 reaches the clearance between the table side guide rail 110 and the unit side guide rail 112, the power receiving terminal 126 causes the table side power supply. The wiring 122 and the unit-side power supply wiring 124 are not in contact with each other. However, the power receiving terminal 126 is disposed on all four sliders 114 provided on the stage 20, and the pair of sliders 114 and the pair of sliders 114 are separated in the sliding direction of the stage 20. It is arranged in a state. That is, the power receiving terminal 126 is disposed in a state of being separated from the front and the rear in the sliding direction of the stage 20. For this reason, the power receiving terminal 126 disposed on one of the front side and the rear side in the sliding direction of the stage 20 leads to a clearance between the table side guide rail 110 and the unit side guide rail 112, and the table side power supply wiring 122 and the unit. The power receiving terminals 126 arranged on the other side of the front and rear in the sliding direction of the stage 20 are connected to the table-side power supply wiring 122 and the unit-side power supply wiring even when they are not in contact with any of the side power supply wirings 124. 124 is in contact with any one of them. Thereby, even when the stage 20 slides between the rotary table 100 and each unit, the power reception by the power reception terminal 126 is ensured.

Further, as shown in FIG. 1, the linear motor 104 includes a shaft-shaped table-side stator 130 disposed on the rotary table 100 and a shaft-shaped stator disposed in each unit such as the resin printing unit 22. A unit-side stator 132 and a cylindrical mover (see FIG. 5) 134 disposed on each stage 20 are provided. As shown in FIG. 5, each of the table side stator 130 and the unit side stator 132 includes a cylindrical pipe 140 and a plurality of permanent magnets 142 arranged in the pipe 140. . Each of the plurality of permanent magnets 142 is generally cylindrical, and one end side is an N pole and the other end side is an S pole. The plurality of permanent magnets 142 are arranged so as to extend on one axis, and opposite end portions of two adjacent permanent magnets 142 have the same magnetic pole. A spacer (not shown) made of a nonmagnetic material is provided between two adjacent permanent magnets 142. The pipe 140 is provided so as to cover a plurality of permanent magnets 142 disposed so as to extend on one axis, and is formed of a nonmagnetic material.

Further, the mover 134 is fixed to the lower surface side of the stage 20 and includes a plurality of cylindrical coils 146. Each of the plurality of coils 146 is formed in a cylindrical shape by winding a wire, and a gap between the wires is filled with resin. The plurality of coils 146 are concentrically provided at equal intervals, and an annular spacer (not shown) made of a nonmagnetic material is provided between two adjacent coils 146. A plurality of coils 146 and spacers are fitted to the outer peripheral surface of the shaft-like table-side stator 130 or the unit-side stator 132 with a clearance. As a result, electric power is supplied to the coil 146 of the mover 134, so that the stage 20 slides in a controllable manner in the axial direction of the table side stator 130 or the unit side stator 132. Note that power is supplied to the movable element 134 through the power supply mechanism 120. That is, the power received by the power receiving terminal 126 from the table side power supply wiring 122 or the unit side power supply wiring 124 is supplied to the movable element 134. The length dimension of the movable element 134 is longer than the clearance between the table-side stator 130 and the unit-side stator 132. Thereby, when the table side stator 130 and the unit side stator 132 are linearly arranged, the linear motor 104 is driven between the rotary table 100 and each unit such as the resin printing unit 22. As a result, the stage 20 slides.

Further, as shown in FIG. 2, the rack elevating device 106 is disposed below the rack 80 of the storage unit group 32 and elevates the rack 80. Thereby, the unit side guide rail 112 and the unit side stator 132 disposed in each of the

storage units

82, 84, 86 are replaced with the table side guide rail 110 and the table side stator disposed in the rotary table 100. The rack 80 is moved up and down so that it is at the same height as 130, the table side guide rail 110 and the unit side guide rail 112 are linearly arranged, and the table side stator 130 and the unit side stator 132 are linear. As the rotary table 100 is rotated, the stage 20 slides between the rotary table 100 and the

storage units

82, 84, 86 in a controllable manner by driving the linear motor 104. .

Further, as shown in FIG. 6, the control device 36 includes a controller 150 and a plurality of drive circuits 152. The plurality of driving circuits 152 include the holding device 54, the stage lifting device 56, the inkjet head 60, the flattening device 62, the irradiation device 66, the inkjet head 68, the laser irradiation device 70, the tape feeder 74, the mounting head 76, and the moving device 78. The linear motor 104, the rack lifting device 106, and the rotary motor 108 are connected. The controller 150 includes a CPU, a ROM, a RAM, and the like, mainly a computer, and is connected to a plurality of drive circuits 152. Thereby, the operation of the stage 20, the resin printing unit 22, the resin curing unit 24, the metal ink printing unit 26, the baking unit 28, the mounting unit 30, and the storage unit group 32 is controlled by the controller 150.

Operation of the Circuit Forming Device In the circuit forming device 10, the resin printing unit 22, the resin curing unit 24, the metal ink printing unit 26, the firing unit 28, the mounting unit 30, and the

storage units

82, 84, 86 are configured according to the above-described configuration. A plurality of stages 20 are sequentially moved between the units via the rotary table 100, and a circuit is formed by performing operations in each unit. In the circuit forming apparatus 10, the seven stages 20 can be sequentially moved between the eight units by the operation of the moving device 34. Hereinafter, a method of forming a circuit on the substrate 50 by moving one stage 20 of the seven stages 20 between the units will be described.

Specifically, the substrate 50 is set on the base 52 of the stage 20, and the stage 20 is moved between the resin printing unit 22 and the resin curing unit 24. In the resin printing unit 22 and the resin curing unit 24, a resin layer 160 is formed on the substrate 50 as shown in FIG. The resin layer 160 has a cavity 162 for mounting the electronic component 72, and discharge of the ultraviolet curable resin from the inkjet head 60 and irradiation of ultraviolet rays by the irradiation device 66 to the discharged ultraviolet curable resin are performed. It is formed by being repeated.

Specifically, in the resin printing unit 22, the inkjet head 60 discharges an ultraviolet curable resin onto the upper surface of the substrate 50 in a thin film shape. At this time, the inkjet head 60 discharges the ultraviolet curable resin so that a predetermined portion of the upper surface of the substrate 50 is exposed in a generally rectangular shape. Subsequently, when the ultraviolet curable resin is discharged in a thin film shape, the ultraviolet curable resin is flattened by the flattening device 62 so that the film thickness of the ultraviolet curable resin becomes uniform. Then, the stage 20 is moved from the resin printing unit 22 to the resin curing unit 24. In the resin curing unit 24, the irradiation device 66 irradiates the thin-film ultraviolet curable resin with ultraviolet rays. As a result, a thin resin layer is formed on the substrate 50.

Subsequently, the stage 20 is moved again from the resin curing unit 24 to the resin printing unit 22. In the resin printing unit 22, the inkjet head 60 discharges the ultraviolet curable resin in a thin film shape only on the portion above the thin resin layer. That is, the inkjet head 60 discharges the ultraviolet curable resin in a thin film shape onto the thin resin layer so that a predetermined portion of the upper surface of the substrate 50 is exposed in a generally rectangular shape. Then, the flattening device 62 flattens the thin film ultraviolet curable resin. Next, the stage 20 is moved again from the resin printing unit 22 to the resin curing unit 24. In the resin curing unit 24, the irradiation device 66 irradiates the thin-film ultraviolet curable resin with ultraviolet rays. Thereby, a thin resin layer is laminated on the thin resin layer. As described above, in the resin printing unit 22 and the resin curing unit 24, the discharge of the ultraviolet curable resin onto the thin resin layer, the flattening of the ultraviolet curable resin, and the irradiation of the ultraviolet rays are repeated. A resin layer 160 having a cavity 162 is formed.

When the resin layer 160 is formed by the procedure described above, the stage 20 is moved to the mounting unit 30. In the mounting unit 30, the electronic component 72 is supplied by the tape feeder 74, and the electronic component 72 is held by the suction nozzle of the mounting head 76. Then, the mounting head 76 is moved by the moving device 78, and the electronic component 72 held by the suction nozzle is placed at a predetermined mounting position of the substrate 50 inside the cavity 162 of the resin layer 160 as shown in FIG. Installed. In addition, the height dimension of the resin layer 160 and the height dimension of the electronic component 72 are substantially the same.

When the electronic component 72 is mounted on the substrate 50 inside the cavity 162, in the resin printing unit 22 and the resin curing unit 24, as shown in FIG. 9, the gap between the cavities 162, that is, the inner wall surface defining the cavity 162 And a resin layer 166 is formed between the side wall surface of the electronic component 72. In addition, since the resin layer 166 is formed by the same method as the resin layer 160, description of the formation method of the resin layer 166 is omitted. The height dimension of the resin layer 166 is substantially the same as the height dimension of the resin layer 160 and the electronic component 72. Thereby, the upper surface of the resin layer 160, the upper surface of the resin layer 166, and the upper surface of the electronic component 72 are flush with each other.

Next, when the resin layer 166 is formed in the gap of the cavity 162, the stage 20 is moved to the metal ink printing unit 26. In the metal ink printing unit 26, the metal ink is ejected linearly on the resin layers 160 and 166 according to the circuit pattern by the inkjet head 68. At this time, as shown in FIG. 10, the metal ink 168 is ejected linearly so as to connect the electrode 170 of the electronic component 72 and another electrode (not shown). Subsequently, when the metal ink 168 is printed, the stage 20 is moved to the baking unit 28. Then, in the firing unit 28, the laser is irradiated to the discharged metal ink 168 by the laser irradiation device 70. As a result, the metal ink 168 is baked, and a wiring connecting the electrodes is formed.

As described above, in the circuit forming apparatus 10, one stage 20 sequentially moves the resin printing unit 22, the resin curing unit 24, the mounting unit 30, the metal ink printing unit 26, and the baking unit 28, and UV curable. A circuit is formed by performing a resin printing step, a step of curing an ultraviolet curable resin, a mounting step of the electronic component 72, a metal ink printing step, and a metal ink baking step. Further, in a unit different from the unit working on the one stage (hereinafter may be referred to as “first stage”) 20, a stage different from the first stage 20 (hereinafter referred to as “first stage”). By performing the operation on the second stage 20), it is possible to perform various processes in parallel on both the first stage and the second stage 20.

Specifically, for example, the first stage 20 moves to the resin printing unit 22 and the second stage 20 is printed with metal ink while the resin printing unit 22 is working on the first stage 20. By moving the unit 26 to the unit 26, it is possible to work on the second stage 20 in the metal ink printing unit 26. That is, various operations are simultaneously performed on both the substrate 50 held on the first stage 20 and the substrate 50 held on the second stage 20. As a result, many circuits can be created at the same time, and the circuit creation capability is improved. In particular, in the circuit forming apparatus 10, since seven stages 20 are movable between the units, the resin printing unit 22, the resin curing unit 24, the mounting unit 30, the metal ink printing unit 26, and the baking unit 28 In these five units, it becomes possible to work simultaneously, and the circuit creation ability is remarkably improved.

Further, the improvement in circuit creation capability makes it possible to reduce the number of times of refilling the ink jet head 68 with metal ink. Specifically, since the metal ink is obtained by dispersing metal fine particles in a solvent, the deterioration rate is high due to precipitation of the metal fine particles, a decrease in dispersibility of the metal fine particles, and the like. For this reason, the ink jet head 68 is replenished with an amount of metal ink used within a predetermined time. That is, when the number of circuits formed per unit time is small, only a small amount of metal ink can be replenished to the ink jet head 68, and the number of times of replenishment of metal ink to the ink jet head 68 increases. On the other hand, since the circuit forming apparatus 10 can perform work simultaneously in five units, the number of circuits formed per unit time increases. Therefore, a large amount of metal ink can be replenished to the inkjet head 68, and the number of times of replenishment of metal ink to the inkjet head 68 can be reduced.

Also, the metal ink and the ultraviolet curable resin contain a volatile component such as a solvent, and a drying process may be required depending on the type and amount of the volatile component. Specifically, if the ultraviolet curable resin is not dried before the printed ultraviolet curable resin is irradiated with ultraviolet rays, the ultraviolet curable resin may not be properly cured by irradiation with ultraviolet rays. Further, if the metal ink is not dried before the printed metal ink is irradiated with the laser, the metal ink may not be appropriately fired by the laser irradiation. For this reason, a step of drying the ultraviolet curable resin or the metal ink may be required before the printed ultraviolet curable resin or the metal ink is irradiated with the ultraviolet ray or the laser. And in this drying process, in order to prevent the modification | denaturation of the component by heating, natural drying may be preferable without performing a heating etc., and natural drying may be left for 1 hour or more. As described above, if the stage 20 is left in the resin printing unit 22, the resin curing unit 24, the mounting unit 30, the metal ink printing unit 26, and the baking unit 28 for a long time, the working efficiency is lowered.

For this reason, the storage unit group 32 is provided in the circuit forming apparatus 10, and natural drying is performed in the

storage units

82, 84, 86 of the storage unit group 32. That is, when ultraviolet curing resin or metal ink is printed on the substrate 50 and natural drying of the ultraviolet curing resin or metal ink is necessary, the stage 20 holding the printed substrate 50 is stored. Housed in

units

82, 84, 86. Thereby, in the resin printing unit 22, the resin curing unit 24, the mounting unit 30, the metal ink printing unit 26, and the baking unit 28, the stage 20 is not left unattended for a long time, and it is possible to prevent a reduction in work efficiency. It becomes. In particular, the storage unit group 32 is provided with three

storage units

82, 84, and 86, so that the three stages 20 can be left unattended, and a natural drying process can be performed on many substrates 50. It becomes possible. Further, the three

storage units

82, 84, 86 are arranged in a state of being separated in the vertical direction, and the rack 80 is moved up and down by the rack lifting / lowering device 106, whereby each

storage unit

82, 84, It is possible to store the stage 20 in 86. Thereby, the arrangement space of the

storage units

82, 84, 86 can be reduced.

Furthermore, in the circuit forming apparatus 10, since seven stages 20 can be moved between eight units, circuit formation can be performed most efficiently. Specifically, when the stage 20 is located in all eight units, the stage 20 cannot be moved between the units. For this reason, in order to move the stage 20 between units, it is necessary that the stage 20 is not located in at least one unit. On the other hand, the greater the number of stages 20, the higher the success rate of the circuit shape. For this reason, using the number of stages 20 that is one less than the number of units, that is, using the seven stages 20 in the circuit forming apparatus 10 enables the most efficient circuit formation.

Further, in the circuit forming apparatus 10, the rotary table 100 is adopted as the moving device 34 for moving the stage 20, and each unit such as the resin printing unit 22 is arranged along the outer peripheral edge of the rotary table 100. Yes. Thereby, the moving distance of the stage 20 can be reduced, and the circuit can be formed efficiently.

Incidentally, in the above embodiment, the circuit forming apparatus 10 is an example of a circuit forming apparatus. The stage 20 is an example of a stage. The resin printing unit 22 is an example of a resin layer forming unit. The metal ink printing unit 26 is an example of a wiring forming unit. The moving device 34 is an example of a moving device. The inkjet head 60 is an example of a first discharge device. The inkjet head 68 is an example of a second ejection device. The turntable 100 is an example of a turntable. The rack lifting device 106 is an example of a lifting device. The table side guide rail 110 is an example of a table side guide rail. The unit side guide rail 112 is an example of a unit side guide rail. The slider 114 is an example of a slider. The table side power supply wiring 122 and the unit side power supply wiring 124 are examples of power supply terminals. The power receiving terminal 126 is an example of a power receiving terminal.

In addition, this invention is not limited to the said Example, It is possible to implement in the various aspect which gave various change and improvement based on the knowledge of those skilled in the art. For example, in the above embodiment, eight units of the resin printing unit 22, the resin curing unit 24, the metal ink printing unit 26, the baking unit 28, the mounting unit 30, and the

storage units

82, 84, 86 are employed. Any number of units can be employed. However, in the circuit forming apparatus 10, since the formation of the resin layer and the wiring is indispensable, the resin printing unit 22 and the metal ink printing unit 26 must be employed. On the other hand, some curable resins such as ultraviolet curable resins and metal inks are cured by natural drying depending on the type. Therefore, the resin curing unit 24 and the firing unit 28 may be employed as necessary. Also, the mounting unit 30 and the

storage units

82, 84, 86 may be employed as necessary. In addition to the above units, various units such as a unit for drying an ultraviolet curable resin with an infrared lamp or the like, a unit for firing metal ink with an electric furnace, etc. may be adopted.

In the above embodiment, the rotary table 100 is adopted as the moving device for moving the stage 20, but a moving device for moving the stage 20 in the XY directions may be used. When a moving device that moves the stage 20 in the XY direction is adopted, a plurality of units are arranged side by side in at least one of the X direction and the Y direction, so that the stage can be efficiently moved between the units. 20 can be moved.

10: Circuit forming device 20: Stage 22: Resin printing unit (resin layer forming unit) 26: Metal ink printing unit (wiring forming unit) 34: Moving device 60: Inkjet head (first ejection device) 68: Inkjet head (No. 1) 2 discharge device) 100: rotating table 106: rack lifting device (lifting device) 110: table side guide rail 112: unit side guide rail 114: slider 122: table side power supply wiring (power supply terminal) 124: unit side power supply wiring (power supply) Terminal) 126: Power receiving terminal

Claims

A plurality of units including at least a resin layer forming unit including a first discharging device that discharges a curable resin, and a wiring forming unit including a second discharging device that discharges a metal-containing liquid containing metal fine particles;
A plurality of stages on which the substrate is placed;
A moving device that moves each of the plurality of stages to any one of the plurality of units, a resin layer formed by discharging a curable resin of the first discharge device, and the second discharge A circuit forming apparatus for forming a circuit including a wiring formed by discharging a metal-containing liquid of the apparatus on a substrate.
The mobile device is
2. The circuit forming apparatus according to claim 1, further comprising: a rotary table for rotating any one of the plurality of stages toward each of the plurality of units.
The plurality of units are
The circuit forming apparatus according to claim 2, wherein the circuit forming apparatus is disposed along a rotation direction of the rotary table.
The mobile device is
A table-side guide rail provided on the rotary table;
A unit-side guide rail provided in each of the plurality of units;
Provided on each of the plurality of stages, and when each stage is rotated by the rotary table toward any one of the plurality of units, the unit-side guide rail of the one unit; A slider that slides across the table-side guide rail;
A power supply terminal provided to extend along each of the table side guide rail and the unit side guide rail;
A pair of power receiving terminals provided on the slider and in sliding contact with the power feeding terminal when the slider slides;
4. The circuit according to claim 2, wherein the pair of power receiving terminals are arranged in a state of being separated from each other in the extending direction of the table side guide rail and the unit side guide rail. 5. Forming equipment.
5. The circuit forming apparatus according to claim 1, wherein the number of the plurality of stages is one less than the number of the plurality of units.
Two or more units of the plurality of units are disposed in a state of being separated in the vertical direction,
The mobile device is
2. An elevating device that elevates and lowers the stage in order to move each of the plurality of stages toward each of two or more units arranged in a vertically spaced state. The circuit formation apparatus as described in any one of Claim 5 thru | or 5.