WO2019123629A1 - Method and device for manufacturing additively manufactured electronic device - Google Patents

Abstract

This method for manufacturing an additively manufactured electronic device comprises: an additive manufacturing step which comprises a formation process for forming a single circuit wiring layer by discharging a conductive paste having, mixed therein, conductive particles , a UV-curable resin, and an organic solvent onto an insulating layer and a curing process for curing the single circuit wiring layer by irradiating ultraviolet radiation onto the single circuit wiring layer, and in which an additively manufactured article including at least one single circuit wiring layer is manufactured as a result of the lamination of the single circuit wiring layer onto the insulating layer through the formation process and curing process; and a heating step for forming an additively manufactured electronic device by heating the additively manufactured article after the additive manufacturing step has ended. The conductivity of the conductive paste is produced through the UV irradiation in the curing process and is enhanced through the heating in the heating step.

Description

Method and apparatus for manufacturing three-dimensional laminated electronic device

The present disclosure relates to a method and an apparatus for manufacturing a three-dimensional laminated electronic device using three-dimensional lamination molding.

Conventionally, various techniques have been proposed for three-dimensional additive manufacturing.

For example, a method of manufacturing a wiring board described in Patent Document 1 below is a method of forming at least one layer of a conductive pattern and an insulating pattern along a wiring pattern on an insulating base material, wherein the insulating base material and the insulating pattern At least one of them forms the conductive pattern on top in a semi-cured state to obtain a laminate, and heat treatment of the laminate to completely cure the insulating substrate or / and insulating pattern in the semi-cured state, conducting The pattern comprises baking.

Unexamined-Japanese-Patent No. 2007-158352

According to the method of manufacturing a wiring substrate described above, the conductive pattern is formed on the semi-cured insulating layer, and the semi-cured insulating layer is cured by simultaneous heat treatment of the semi-cured insulating layer and the conductive pattern. Since these are fired, it is possible to reduce the thermal load on the wiring substrate and shorten the production time. However, more preferably, reduction in heat load and reduction in production time are desired.

Then, this indication is made in view of the point mentioned above, and makes it a subject to provide a manufacturing method and a manufacturing device of a three-dimensional lamination electronic device which can reduce thermal load and shortening production time.

The present specification describes a forming process of forming a single layer of a circuit wiring by discharging a conductive paste in which a conductive particle, an ultraviolet curable resin, and an organic solvent are mixed on an insulating layer, and a circuit wiring single layer And curing the circuit wiring single layer by curing the single layer of the circuit wiring, and at least one circuit wiring single layer is included by laminating the circuit wiring single layer on the insulating layer by the forming process and the curing process. A conductive molding process comprising: a lamination molding process for forming a three-dimensional lamination molded article; and a heating process for manufacturing a three-dimensional laminated electronic device by heating the three-dimensional lamination molded article after the lamination molding process is completed. Disclosed is a method of manufacturing a three-dimensional laminated electronic device in which the property is developed by the irradiation of ultraviolet light in the curing treatment and is improved by the heating in the heating step.

According to the present disclosure, the method of manufacturing a three-dimensional laminated electronic device can reduce the heat load and shorten the production time.

It is a figure which shows a three-dimensional laminated electronic device manufacturing apparatus. It is a block diagram showing a control device. It is a figure which shows the relationship between the baking time of an electroconductive paste, and the change rate of volume resistance. It is a flowchart which shows the flow of the manufacturing process of a three-dimensional laminated electronic device. It is a perspective view which shows the three-dimensional laminated molded object modeled on the board | substrate. It is a perspective view which shows the three-dimensional laminated molded object modeled on the board | substrate. It is a perspective view which shows the three-dimensional laminated molded object modeled on the board | substrate. It is a perspective view which shows the three-dimensional laminated molded object modeled on the board | substrate. It is a perspective view showing a three-dimensional lamination electronic device. It is sectional drawing which shows the example of a change of the three-dimensional laminated three-dimensional object modeled on the board | substrate. It is sectional drawing which shows the example of a change of a three-dimensional laminated electronic device.

Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the drawings.

(A) Configuration of Three-Dimensional Multilayer Electronic Device Manufacturing Apparatus FIG. 1 shows a three-dimensional multilayer electronic device manufacturing apparatus 10. The three-dimensional laminated electronic device manufacturing apparatus 10 includes a transport device 20, a first modeling unit 22, a second modeling unit 24, a mounting unit 26, and a control device 27 (see FIG. 2). The transfer device 20, the first shaping unit 22, the second shaping unit 24, and the mounting unit 26 are disposed on the base 28 of the three-dimensional laminated electronic device manufacturing apparatus 10. Furthermore, the three-dimensional laminated electronic device manufacturing apparatus 10 includes a heating unit 200. The heating unit 200 is an electric furnace and is arranged in line with the base 28. The base 28 has a generally rectangular shape, and in the following description, the longitudinal direction of the base 28 is the X-axis direction, and the short direction of the base 28 is orthogonal to both the Y-axis direction, the X-axis direction and the Y-axis direction. The direction is referred to as the Z-axis direction.

The transfer device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32. The X-axis slide mechanism 30 has an X-axis slide rail 34 and an X-axis slider 36. The X-axis slide rail 34 is disposed on the base 28 so as to extend in the X-axis direction. The X-axis slider 36 is slidably held in the X-axis direction by the X-axis slide rail 34. Furthermore, the X-axis slide mechanism 30 includes an electromagnetic motor (see FIG. 2) 38. By driving the electromagnetic motor 38, the X-axis slider 36 is moved to an arbitrary position in the X-axis direction. The Y-axis slide mechanism 32 also has a Y-axis slide rail 50 and a stage 52. The Y-axis slide rail 50 is disposed on the base 28 so as to extend in the Y-axis direction. One end of the Y-axis slide rail 50 is connected to the X-axis slider 36. Therefore, the Y-axis slide rail 50 is movable in the X-axis direction. The stage 52 is slidably held in the Y-axis direction on the Y-axis slide rail 50. Furthermore, the Y-axis slide mechanism 32 has an electromagnetic motor (see FIG. 2) 56. By driving the electromagnetic motor 56, the stage 52 moves to any position in the Y-axis direction. Thereby, the stage 52 is moved to an arbitrary position on the base 28 by the drive of the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.

The stage 52 has a base 60, a holding device 62, and a lifting device 64. The base 60 is formed in a flat plate shape, and the substrate is placed on the upper surface. The holding devices 62 are provided on both sides in the X-axis direction of the base 60. Then, both edges in the X-axis direction of the substrate placed on the base 60 are held by the holding device 62, whereby the substrate is fixedly held. In addition, the lifting device 64 is disposed below the base 60, and lifts the base 60 in the Z-axis direction.

The first shaping unit 22 is a unit for shaping the circuit wiring on the substrate (see FIG. 5) 70 mounted on the base 60 of the stage 52, and has a discharge portion 72 and a first curing portion 74. ing. The discharge part 72 has a dispense head (see FIG. 2) 76 and discharges the conductive paste onto the substrate 70 placed on the base 60. The conductive paste is obtained by mixing metal fine particles such as silver, an organic solvent, a photoinitiator, and the like with a resin (that is, an ultraviolet curable resin) that is cured by irradiation of ultraviolet rays. In addition, the viscosity of the conductive paste is relatively high as compared with the ultraviolet curable resin constituting the following insulating layer. Therefore, the dispense head 76 discharges the conductive paste from one nozzle having a diameter larger than the diameter of the nozzle of the following ink jet head (see FIG. 2).

The first curing unit 74 has an irradiation device (see FIG. 2) 78. The irradiation device 78 includes a mercury lamp or an LED as a light source, and irradiates the conductive paste discharged on the substrate 70 with ultraviolet light. Thus, the conductive paste discharged onto the substrate 70 is cured to form a circuit wiring.

The second modeling unit 24 is a unit that models an insulating layer on the substrate 70 placed on the base 60 of the stage 52, and includes a printing unit 84 and a second curing unit 86. The printing unit 84 has an ink jet head 88 (see FIG. 2), and discharges the ultraviolet curing resin onto the substrate 70 placed on the base 60. An ultraviolet curable resin is a resin that is cured by irradiation of ultraviolet light. The inkjet head 88 may be, for example, a piezo method using a piezoelectric element, or may be a thermal method in which a resin is heated to generate air bubbles and discharged from a plurality of nozzles.

The second curing unit 86 includes a planarization device (see FIG. 2) 90 and an irradiation device (see FIG. 2) 92. The planarization apparatus 90 planarizes the upper surface of the ultraviolet curable resin discharged onto the substrate 70 by the ink jet head 88. For example, the excess resin may be a roller or an adhesive while the surface of the ultraviolet curable resin is smoothed. The thickness of the ultraviolet curable resin is made uniform by scraping with a blade. In addition, the irradiation device 92 includes a mercury lamp or an LED as a light source, and irradiates the ultraviolet curable resin discharged on the substrate 70 with ultraviolet light. Thereby, the ultraviolet curing resin discharged onto the substrate 70 is cured to form an insulating layer.

The mounting unit 26 is a unit for mounting the electronic component (see FIG. 7) 94 on the substrate 70 mounted on the base 60 of the stage 52, and has a supply unit 100 and a mounting unit 102. There is. The supply unit 100 has a plurality of tape feeders (see FIG. 2) 110 for feeding the taped electronic components 94 one by one, and supplies the electronic components 94 at the supply position. The supply unit 100 is not limited to the tape feeder 110, but may be a tray-type supply device that picks up and supplies the electronic component 94 from the tray. Further, the supply unit 100 may be configured to include both a tape type and a tray type or other supply devices.

The mounting unit 102 includes a mounting head (see FIG. 2) 112 and a moving device (see FIG. 2) 114. The mounting head 112 has a suction nozzle (see FIG. 7) 116 for holding the electronic component 94 by suction. The suction nozzle 116 sucks and holds the electronic component 94 by suction of air by being supplied with a negative pressure from a positive / negative pressure supply device (not shown). Then, the electronic component 94 is separated by supplying a slight positive pressure from the positive and negative pressure supply device. Further, the moving device 114 moves the mounting head 112 between the supply position of the electronic component 94 by the tape feeder 110 and the substrate 70 placed on the base 60. Thereby, in the mounting unit 102, the electronic component 94 supplied from the tape feeder 110 is held by the suction nozzle 116, and the electronic component 94 held by the suction nozzle 116 is mounted on the substrate 70.

Further, as shown in FIG. 2, the control device 27 includes a controller 120 and a plurality of drive circuits 122. The plurality of drive circuits 122 includes the electromagnetic motors 38 and 56, the holding device 62, the lifting device 64, the dispensing head 76, the irradiating device 78, the inkjet head 88, the flattening device 90, the irradiating device 92, the tape feeder 110, and the mounting head 112. , Mobile device 114 is connected. The controller 120 includes a CPU, a ROM, a RAM, and the like, is mainly composed of a computer, and is connected to a plurality of drive circuits 122. Thus, the controller 120 controls the operation of the transfer device 20, the first modeling unit 22, the second modeling unit 24, and the mounting unit 26.

(B) Conductivity of Conductive Paste Next, the conductivity of the conductive paste will be described. The conductive paste is, as described above, for forming a circuit wiring, and is a resin in which metal fine particles, an organic solvent, a photoinitiator, and the like are mixed with a resin that is cured by irradiation of ultraviolet light. In the conductive paste, the resin is cured and shrunk by the irradiation of ultraviolet rays, whereby the metal fine particles come into contact and the conductivity (of the circuit wiring) is developed. Furthermore, in the conductive paste, the contact area between the metal fine particles is increased by heating and firing, whereby the conductivity (of the circuit wiring) is improved.

Here, the improvement of the conductivity will be specifically described. For example, when the conductive paste in which the conductivity is expressed by ultraviolet irradiation is heated and baked at 80 ° C., the volume resistivity of the conductive paste before the heating and baking is set to 100%. In such a case, when the heating and firing time is about 50 minutes or more, as shown in FIG. 3, the volume resistivity of the conductive paste decreases to about 60%. That is, according to FIG. 3, the conductivity of the conductive paste is improved by about 1.6 times (= 100% / 60%) by heating and firing.

When the conductive paste is discharged onto the substrate 70, the organic solvent contained in the conductive paste is volatilized and released from the conductive paste to the atmosphere. Therefore, even if the conductive paste cured by ultraviolet irradiation is heated and fired, volumetric shrinkage of the conductive paste and generation of by-products do not occur, and problems such as peeling and voids do not occur (in the circuit wiring).

(C) Method of Manufacturing Three-Dimensional Laminated Electronic Device Next, a method of manufacturing a three-dimensional laminated electronic device will be described. As shown in FIG. 4, the manufacturing method 130 of the three-dimensional laminated electronic device includes a lamination molding process P10, a heating process P12, and a peeling process P14. In the layer forming process P10, the three-dimensional layered object 202 (see FIGS. 5 to 8) is formed on the substrate 70 set with respect to the base 60 by the three-dimensional layered electronic device manufacturing apparatus 10 . In the heating step P12, the three-dimensional laminated three-dimensional object 202 (see FIG. 8) is heated together with the substrate 70, whereby the three-dimensional laminated electronic device 204 (see FIG. 8) is manufactured. In the peeling step P14, the substrate 70 is peeled from the three-dimensional laminated electronic device 204.

(C-1) Layer Forming Process The layer forming step P10 is executed by the controller 120, and includes an insulating layer process S10, a conductive paste process S20, and a mounting process S30. In addition, the execution order of each said process S10, S20, S30 is determined by the laminated structure of the three-dimensional laminated three-dimensional object 202, etc. Therefore, the above-described processes S10, S20, and S30 are not repeated in the order of their description. In the following description, a lamination modeling process P10 when the three-dimensional lamination molded article 202 shown in FIGS. 5 to 8 is modeled will be described.

First, in the insulating layer process S10, as shown in FIG. 5, the first insulating layer 206 of the three-dimensional layered object 202 is formed on the substrate 70. For that purpose, resin laminated body formation process S12 and resin laminated body hardening process S14 are performed. In the resin laminate formation process S12, the stage 52 is moved to the lower side of the second modeling unit 24. Thereby, the substrate 70 set on the base 60 of the stage 52 is moved to the lower side of the second shaping unit 24. Furthermore, in the printing unit 84, the inkjet head 88 discharges the ultraviolet curable resin in a thin film form on the upper surface of the substrate 70. Subsequently, in the second curing unit 86, the flattening device 90 flattens the discharged ultraviolet curing resin so that the film thickness becomes uniform. Thereafter, in the resin laminate curing process S14, the irradiation device 92 irradiates the flattened ultraviolet-curing resin with ultraviolet radiation. Thereby, the ultraviolet curable resin is cured. Thereafter, the resin laminate forming process S12 and the resin laminate curing process S14 are repeated, whereby the first insulating layer 206 of the three-dimensional laminate model 202 is formed on the substrate 70.

In the conductive paste process S20, the circuit wiring 208 of the first layer of the three-dimensional laminated three-dimensional object 202 is formed on the substrate 70 and cured. For that purpose, circuit wiring formation processing S22 and circuit wiring hardening processing S24 are performed. In the circuit wiring formation process S22, the stage 52 is moved to the lower side of the first shaping unit 22. Furthermore, in the discharge part 72, the dispense head 76 discharges the conductive paste linearly on the upper surface of the insulating layer 206 of the three-dimensional layered object 202 according to the wiring circuit pattern. Thereby, on the upper surface of the insulating layer 206 of the three-dimensional laminated three-dimensional object 202, a plurality of circuit wirings 208 of the first layer are formed. Thereafter, in the circuit wiring curing process S24, in the first curing unit 74, the irradiation device 78 irradiates the conductive paste discharged in the form of a line with ultraviolet light. Thereby, the conductive paste is cured. In this manner, each circuit wiring 208 is cured on the upper surface of the insulating layer 206 of the three-dimensional layered object 202.

As mentioned above, each circuit wiring 208 is laminated on the insulating layer 206 of the three-dimensional laminated three-dimensional object 202. Furthermore, in each circuit wiring 208, the conductive paste (that is, each circuit wiring 208) that is the material thereof is cured by ultraviolet light, and thus the conductivity is expressed as described above. These points are the same also in the following circuit wirings 212, 220 and 226.

Thereafter, the insulating layer process S10 and the conductive paste process S20 are repeated. Thereby, as shown in FIG. 6, in the three-dimensional laminated three-dimensional object 202, the second insulating layer 210 is formed, and a plurality of second circuit wirings 212 are formed and cured.

However, in the insulating layer process S10, when the resin laminate formation process S12 and the resin laminate curing process S14 are repeated, the inkjet head 88 is a predetermined portion with respect to the upper surface of each circuit wiring 208 in the first layer. The UV curable resin is discharged so that the is generally circularly exposed. Thus, in the second insulating layer 210, a plurality of via holes 214 are formed. Each via hole 214 has a tapered shape from the upper surface of the second insulating layer 210 to the upper surface of the first circuit wiring 208. Further, the inkjet head 88 discharges the ultraviolet curing resin so that a predetermined portion is exposed in a generally rectangular shape with respect to the upper surface of the first insulating layer 206. Thus, in the second insulating layer 210, the space portion 216 is formed.

Further, in the conductive paste processing S20, in the circuit wiring formation processing S22, the conductive paste passes from the upper surface of the second insulating layer 210 to the respective circuit wirings in the first layer via the inclined surfaces of the via holes 214. It is discharged up to the upper surface of 208. Therefore, when the circuit wiring curing process S24 is performed, the circuit wiring 212 of the second layer is electrically connected to the circuit wiring 208 of the first layer via the inclined surface of each via hole 214.

Thereafter, the insulating layer process S10 and the conductive paste process S20 are repeated. As a result, as shown in FIG. 7, in the three-dimensional laminated three-dimensional object 202, the third insulating layer 218 is formed, and a plurality of third layer circuit wirings 220 are formed and cured. At this time, each via hole 214 in the second insulating layer 210 is filled with the cured ultraviolet curable resin. Further, in the third insulating layer 218, a plurality of via holes 222 and spaces 224 are formed in the same manner as the via holes 214 and the spaces 216 formed in the second insulating layer 210. Thus, the circuit wiring 220 of the third layer is electrically connected to the circuit wiring 212 of the second layer via the inclined surface of each via hole 222. In addition, the space portion 224 formed in the third insulating layer 218 is provided in a state of being vertically connected to the space portion 216 in the second insulating layer 210.

In FIG. 7, the circuit wiring 208 on the upper surface of the first insulating layer 206 and the via holes 214 and the space 216 formed in the second insulating layer 210 are omitted. These points are the same as in FIG. 8 and FIG.

Subsequently, the mounting process S30 is performed. In the mounting process S30, the stage 52 is moved to the lower side of the mounting unit 26. In the mounting unit 26, the electronic component 94 supplied by the tape feeder 110 is held by the suction nozzle 116 of the mounting head 112, as shown in FIG. The held electronic component 94 is mounted to the space portion 224 (and the space portion 216) as the mounting head 112 is moved by the moving device 114. At this time, each electrode 96 of the electronic component 94 faces upward.

Thereafter, the insulating layer process S10 and the conductive paste process S20 are repeated. As a result, as shown in FIG. 7, the via holes 222 in the third insulating layer 218 are filled with the cured ultraviolet curable resin. In addition, the space between the inner wall surface defining the space portion 224 (and the space portion 216) and the electronic component 94 is also filled with the cured ultraviolet curable resin. Further, the fourth layer circuit wiring 226 is formed and cured so as to connect a part of the third layer circuit wiring 220 and each electrode 96 of the electronic component 94. Thus, the electronic component 94 is electrically connected to each of the circuit wirings 208, 212, 220, and 226.

Thereafter, the insulating layer process S10 is performed. Thereby, as shown in FIG. 8, the fourth insulating layer 228 is formed.

In FIG. 8, the circuit wiring 212 on the upper surface of the second insulating layer 210 and the via holes 222 and spaces 224 formed in the third insulating layer 218 are omitted. These points are the same as in FIG.

(C-2) Heating Step In the heating step P12, after the substrate 70 is removed from the base 60 with the three-dimensional laminated three-dimensional object 202 shaped on its upper surface (that is, in the adhered state), It is set in the electric furnace of the heating unit 200. In the electric furnace, the three-dimensional laminate model 202 is heated together with the substrate 70 at 80 ° C. for 60 minutes.

Thereby, in the three-dimensional laminated three-dimensional object 202, the circuit wirings 208, 212, 220, 226 are heated and fired, thereby improving the conductivity of the circuit wirings 208, 212, 220, 226 as described above. Do. Thus, on the upper surface of the substrate 70, the three-dimensional laminated three-dimensional object 202 becomes the three-dimensional laminated electronic device 204. Thereby, the three-dimensional laminated electronic device 204 is manufactured.

(C-3) Peeling Step In the peeling step P14, the substrate 70 is taken out of the electric furnace of the heating unit 200 while the three-dimensional laminated electronic device 204 is manufactured (that is, attached) on the upper surface thereof. . Thereafter, as shown in FIG. 9, the three-dimensional laminated electronic device 204 is separated from the substrate 70 by a solvent or the like.

(D) Summary As described above in detail, in the method 130 for manufacturing a three-dimensional multilayer electronic device of the present embodiment, the heating step P12 is performed only once after the completion of the layer formation process P10. It is possible to reduce the heat load on the device 204 and shorten the production time.

Incidentally, in the present embodiment, the conductive fine metal particles are an example of the conductive particles. The three-dimensional laminated electronic device manufacturing apparatus 10 is an example of a manufacturing apparatus. Each of the circuit wirings 208, 212, 220, and 226 is an example of a circuit wiring single layer. The circuit wiring formation process S22 is an example of a formation process. The circuit wiring curing process S24 is an example of the curing process.

(E) Modified Example The present disclosure is not limited to the above embodiment, and various modifications can be made without departing from the scope of the present invention.
For example, although the three-dimensional laminated three-dimensional object 202 includes a total of four circuit wirings 208, 212, 220, and 226, the number of circuit wirings other than four may be included. Even in such a case, it is possible to cause the conductivity of the circuit wiring (that is, the conductive paste) to be expressed by ultraviolet light, and to improve the generated conductivity by heating and baking.

Further, in the first shaping unit 22, the circuit wirings 208, 212, 220, 226 may be formed by the transfer device transferring the conductive paste, or the like.

In addition, as shown in FIG. 10, a three-dimensional laminated three-dimensional object 232 including the support material 230 may be formed on the upper surface of the substrate 70. The support material 230 is made of a wax-based material (for example, a brazing material having a melting point of 60 ° C.) that melts in the heating step P12, and at the lowermost part of the three-dimensional laminated object 232, The insulating layer 234 is supported by being disposed between the insulating layers 234 of the layered object 232.

In such a case, when the heating step P12 is performed, as shown in FIG. 11, the three-dimensional laminated three-dimensional object 232 becomes the three-dimensional laminated electronic device 236 and the support material 230 is on the upper surface of the substrate 70. Dissolve. Thereafter, when the peeling process P14 is performed, the three-dimensional laminated electronic device 236 is separated from the substrate 70.

In the three-dimensional laminated three-dimensional object 232, the insulating layer 234 is composed of a plurality of layers. Furthermore, the three-dimensional laminated three-dimensional object 232 has a circuit wiring 238 composed of a plurality of layers, a plurality of via holes 240, a plurality of electronic components 242 and 244, and the like. However, since the three-dimensional laminated three-dimensional object 232 is formed by the manufacturing method 130 of the three-dimensional laminated electronic device in the same manner as the three-dimensional laminated three-dimensional object 202, the insulating layer 234 of the three-dimensional laminated three-dimensional object 232 The description of the circuit wiring 238, the via hole 240, the electronic components 242 and 244, and the like will be omitted. Each layer constituting the circuit wiring 238 is an example of a single layer of the circuit wiring.

10 Three-dimensional laminated electronic device manufacturing apparatus 130 Three-dimensional laminated electronic device manufacturing method 202, 232 Three-dimensional laminated molded object 204, 236 Three-dimensional laminated electronic device 206, 210, 218, 234 Insulating layer 208, 212, 220, 226, 238 Circuit Wiring 230 Support Material P10 Stacking Process P12 Heating Process S22 Circuit Wiring Formation Processing S24 Circuit Wiring Hardening Processing

Claims (3)

1. A process of forming a circuit wiring single layer by discharging a conductive paste in which a conductive particle, an ultraviolet curing resin, and an organic solvent are mixed on the insulating layer, and irradiating the circuit wiring single layer with ultraviolet light And curing the circuit wiring single layer, and laminating the circuit wiring single layer on the insulating layer in the forming process and the curing process to form at least one circuit wiring single layer. An additive manufacturing process for forming a three-dimensional laminated object to be contained;
   And a heating step of manufacturing a three-dimensional laminated electronic device by heating the three-dimensional laminated object after the lamination forming step is completed,
   The method for manufacturing a three-dimensional laminated electronic device, wherein the conductivity of the conductive paste is exhibited by irradiation of ultraviolet light in the curing treatment, and is improved by heating in the heating step.
2. The three-dimensional layered object is provided at the lowermost part of the three-dimensional layered object, and includes a support material that supports the three-dimensional layered object.
   The method for manufacturing a three-dimensional laminated electronic device according to claim 1, wherein the heating step melts the support material.
3. The manufacturing apparatus which manufactures a three-dimensional laminated electronic device by the manufacturing method of Claim 1 or Claim 2.

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