JP7394626B2 - Manufacturing method and manufacturing apparatus for three-dimensional laminated electronic device - Google Patents

Description

The present disclosure relates to a method and apparatus for manufacturing a three-dimensional laminated electronic device using three-dimensional laminated manufacturing.

Conventionally, various techniques have been proposed regarding three-dimensional additive manufacturing.

For example, a method for manufacturing a wiring board described in Patent Document 1 below is a method of forming at least one layer of a conductive pattern and an insulating pattern along a wiring pattern on an insulating base material, the method comprising forming at least one layer of a conductive pattern and an insulating pattern along a wiring pattern on an insulating base material, The conductive pattern is formed on at least one of the conductive patterns in a semi-cured state to obtain a laminate, and the laminate is heat-treated to completely cure the semi-cured insulating base material and/or the insulating pattern. The pattern comprises firing.

Japanese Patent Application Publication No. 2007-158352

According to the above method for manufacturing a wiring board, a conductive pattern is formed on a semi-cured insulating layer, and the semi-cured insulating layer is cured by simultaneous heat treatment of the semi-cured insulating layer and the conductive pattern, and the conductive pattern is Since it is fired, it is possible to reduce the heat load on the wiring board and shorten production time. However, it is desired to further suitably reduce the heat load and shorten the production time.

Therefore, the present disclosure has been made in view of the above-mentioned points, and an object of the present disclosure is to provide a method and apparatus for manufacturing a three-dimensionally laminated electronic device that can reduce heat load and shorten production time.

This specification describes a formation process for forming a single layer of circuit wiring by discharging a conductive paste containing a mixture of conductive particles, an ultraviolet curable resin, and an organic solvent onto an insulating layer, and a process for forming a single layer of circuit wiring on an insulating layer. a curing process of curing the single layer of circuit wiring by irradiating the layer with ultraviolet rays, and forming a laminate by laminating the single layer of circuit wiring on the insulating layer in the forming process and the curing process, A laminate manufacturing step of further laminating a plurality of the laminates to form a three-dimensional laminate manufactured object in which the plurality of laminates are laminated; a heating step of manufacturing a three-dimensional laminated electronic device by heating the three-dimensional laminated product at 80 degrees , the conductivity of the conductive paste is developed by irradiation with ultraviolet rays in the curing treatment, A method for manufacturing a three-dimensional laminated electronic device that is improved by heating in a heating step, wherein the three-dimensional laminated article is provided with a support material that is located at the lowest part of the three-dimensional laminated article and supports the three-dimensional laminated article. The support material is formed of a material having a melting point that melts in the heating step, and the heating step improves the conductivity of the conductive paste by heating the three-dimensional laminate model, and A method for manufacturing a three-dimensionally stacked electronic device is disclosed in which the support material is also heated to melt the support material .

According to the present disclosure, the method for manufacturing a three-dimensionally stacked electronic device can reduce heat load and shorten production time.

FIG. 1 is a diagram showing a three-dimensional stacked electronic device manufacturing apparatus. FIG. 2 is a block diagram showing a control device. FIG. 3 is a diagram showing the relationship between the firing time of a conductive paste and the rate of change in volume resistivity. It is a flowchart showing the flow of the manufacturing process of a three-dimensional laminated electronic device. FIG. 2 is a perspective view showing a three-dimensional layered product formed on a substrate. FIG. 2 is a perspective view showing a three-dimensional layered product formed on a substrate. FIG. 2 is a perspective view showing a three-dimensional layered product formed on a substrate. FIG. 2 is a perspective view showing a three-dimensional layered product formed on a substrate. FIG. 1 is a perspective view showing a three-dimensional stacked electronic device. It is a sectional view showing a modification of a three-dimensional layered product formed on a substrate. FIG. 7 is a cross-sectional view showing a modified example of a three-dimensional stacked electronic device.

Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the drawings.

(A) Configuration of three-dimensional laminated electronic device manufacturing apparatus FIG. 1 shows a three-dimensional laminated electronic device manufacturing apparatus 10. The three-dimensional laminated electronic device manufacturing apparatus 10 includes a transport device 20, a first modeling unit 22, a second modeling unit 24, a mounting unit 26, and a control device 27 (see FIG. 2). The transport device 20, the first modeling unit 22, the second modeling unit 24, and the mounting unit 26 are arranged on the base 28 of the three-dimensional laminated electronic device manufacturing apparatus 10. Furthermore, the three-dimensional laminated electronic device manufacturing apparatus 10 includes a heating section 200. The heating unit 200 is an electric furnace, and is arranged in line with the base 28. The base 28 has a generally rectangular shape, and in the following description, the longitudinal direction of the base 28 is the X-axis direction, the short direction of the base 28 is the Y-axis direction, and it is perpendicular to both the X-axis direction and the Y-axis direction. The direction will be described as the Z-axis direction.

The transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32. The X-axis slide mechanism 30 includes an X-axis slide rail 34 and an X-axis slider 36. The X-axis slide rail 34 is arranged on the base 28 so as to extend in the X-axis direction. The X-axis slider 36 is held by the X-axis slide rail 34 so as to be slidable in the X-axis direction. Further, the X-axis slide mechanism 30 includes an electromagnetic motor (see FIG. 2) 38, and the X-axis slider 36 is moved to any position in the X-axis direction by driving the electromagnetic motor 38. Further, the Y-axis slide mechanism 32 includes a Y-axis slide rail 50 and a stage 52. The Y-axis slide rail 50 is arranged on the base 28 so as to extend in the Y-axis direction. One end of the Y-axis slide rail 50 is connected to the X-axis slider 36. Therefore, the Y-axis slide rail 50 is movable in the X-axis direction. A stage 52 is held on the Y-axis slide rail 50 so as to be slidable in the Y-axis direction. Further, the Y-axis slide mechanism 32 includes an electromagnetic motor (see FIG. 2) 56, and the stage 52 is moved to an arbitrary position in the Y-axis direction by driving the electromagnetic motor 56. Thereby, the stage 52 is moved to an arbitrary position on the base 28 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.

The stage 52 includes a base 60, a holding device 62, and a lifting device 64. The base 60 is formed into a flat plate shape, and a substrate is placed on the top surface. The holding device 62 is provided on both sides of the base 60 in the X-axis direction. Then, both edges of the substrate placed on the base 60 in the X-axis direction are held between the holding devices 62, so that the substrate is fixedly held. Further, the lifting device 64 is disposed below the base 60 and raises and lowers the base 60 in the Z-axis direction.

The first modeling unit 22 is a unit that models circuit wiring on a substrate (see FIG. 5) placed on a base 60 of the stage 52, and includes a discharge section 72 and a first hardening section 74. ing. The discharge unit 72 has a dispense head (see FIG. 2) 76, and discharges the conductive paste onto the substrate 70 placed on the base 60. The conductive paste is a mixture of a resin that hardens upon irradiation with ultraviolet light (that is, an ultraviolet curing resin), fine metal particles such as silver, an organic solvent, a photoinitiator, and the like. Note that the viscosity of the conductive paste is relatively high compared to the ultraviolet curing resin that constitutes the insulating layer described below. Therefore, the dispense head 76 discharges the conductive paste from one nozzle having a diameter larger than that of the nozzle of an inkjet head 88 (see FIG. 2) described below.

The first curing section 74 has an irradiation device (see FIG. 2) 78. The irradiation device 78 includes a mercury lamp or an LED as a light source, and irradiates the conductive paste discharged onto the substrate 70 with ultraviolet rays. As a result, the conductive paste discharged onto the substrate 70 is cured, and circuit wiring is formed.

Further, the second modeling unit 24 is a unit that models an insulating layer on the substrate 70 placed on the base 60 of the stage 52, and includes a printing section 84 and a second curing section 86. The printing unit 84 has an inkjet head 88 (see FIG. 2), and discharges ultraviolet curing resin onto the substrate 70 placed on the base 60. Ultraviolet curable resin is a resin that is cured by irradiation with ultraviolet rays. Note that the inkjet head 88 may be of a piezo type using a piezoelectric element, for example, or may be a thermal type of heating resin to generate bubbles and ejecting the bubbles from a plurality of nozzles.

The second curing section 86 includes a flattening device (see FIG. 2) 90 and an irradiation device (see FIG. 2) 92. The flattening device 90 flattens the upper surface of the ultraviolet curable resin discharged onto the substrate 70 by the inkjet head 88. For example, while smoothing the surface of the ultraviolet curable resin, the excess resin is removed by a roller or a roller. By scraping with a blade, the thickness of the ultraviolet curing resin is made uniform. Further, the irradiation device 92 includes a mercury lamp or an LED as a light source, and irradiates the ultraviolet curing resin discharged onto the substrate 70 with ultraviolet rays. As a result, the ultraviolet curing resin discharged onto the substrate 70 is cured, and an insulating layer is formed.

Further, the mounting unit 26 is a unit that mounts an electronic component (see FIG. 7) 94 onto a substrate 70 placed on a base 60 of the stage 52, and includes a supply section 100 and a mounting section 102. There is. The supply unit 100 has a plurality of tape feeders (see FIG. 2) 110 that feed out taped electronic components 94 one by one, and supplies the electronic components 94 at a supply position. Note that the supply unit 100 is not limited to the tape feeder 110, and may be a tray-type supply device that picks up and supplies the electronic components 94 from a tray. Further, the supply unit 100 may be configured to include both a tape type and a tray type, or other types of supply devices.

The mounting section 102 includes a mounting head (see FIG. 2) 112 and a moving device (see FIG. 2) 114. The mounting head 112 has a suction nozzle (see FIG. 7) 116 for suctioning and holding the electronic component 94. The suction nozzle 116 is supplied with negative pressure from a positive and negative pressure supply device (not shown) and suctions and holds the electronic component 94 by suctioning air. Then, by supplying a slight positive pressure from the positive and negative pressure supply device, the electronic component 94 is detached. Further, the moving device 114 moves the mounting head 112 between the position where the electronic component 94 is supplied by the tape feeder 110 and the substrate 70 placed on the base 60. As a result, in the mounting section 102 , the electronic component 94 supplied from the tape feeder 110 is held by the suction nozzle 116 , and the electronic component 94 held by the suction nozzle 116 is mounted onto the substrate 70 .

Further, the control device 27 includes a controller 120 and a plurality of drive circuits 122, as shown in FIG. The plurality of drive circuits 122 include the electromagnetic motors 38 and 56, the holding device 62, the lifting device 64, the dispensing head 76, the irradiation device 78, the inkjet head 88, the flattening device 90, the irradiation device 92, the tape feeder 110, and the mounting head 112. , connected to the mobile device 114. The controller 120 is mainly a computer, including a CPU, ROM, RAM, etc., and is connected to a plurality of drive circuits 122. As a result, the operations of the transport device 20 , the first modeling unit 22 , the second modeling unit 24 , and the mounting unit 26 are controlled by the controller 120 .

(B) Conductivity of conductive paste Next, the conductivity of the conductive paste will be explained. As described above, the conductive paste is used to form circuit wiring, and is a mixture of a resin that hardens upon irradiation with ultraviolet rays, metal fine particles, an organic solvent, a photoinitiator, and the like. In a conductive paste, the resin hardens and contracts when irradiated with ultraviolet rays, causing metal particles to come into contact with each other and exhibit conductivity (of the circuit wiring). Furthermore, in the conductive paste, heating and baking increases the contact area between the metal fine particles, thereby improving the conductivity (of the circuit wiring).

Here, improvement in conductivity will be specifically explained. For example, when a conductive paste that has developed conductivity through ultraviolet irradiation is heated and baked at 80° C., the volume resistivity of the conductive paste before heating and baking is assumed to be 100%. In such a case, when the heating and baking time is about 50 minutes or more, the volume resistivity of the conductive paste decreases to about 60%, as shown in FIG. 3. That is, according to FIG. 3, the conductivity of the conductive paste is improved by about 1.6 times (=100%/60%) by heating and baking.

Note that the organic solvent contained in the conductive paste evaporates when the conductive paste is discharged onto the substrate 70 and is released from the conductive paste into the atmosphere. Therefore, even when the conductive paste hardened by ultraviolet irradiation is heated and fired, the conductive paste does not shrink in volume or generate by-products, so problems such as peeling and voids (in the circuit wiring) do not occur.

(C) Method for manufacturing a three-dimensional stacked electronic device Next, a method for manufacturing a three-dimensional stacked electronic device will be described. As shown in FIG. 4, the method 130 for manufacturing a three-dimensional laminated electronic device includes a layered manufacturing process P10, a heating process P12, and a peeling process P14. In the layered manufacturing process P10, a three-dimensional layered product 202 (see FIGS. 5 to 8) is formed on the substrate 70 set on the base 60 by the three-dimensional layered electronic device manufacturing apparatus 10. . In the heating step P12, the three-dimensional layered electronic device 204 (see FIG. 8) is manufactured by heating the three-dimensional layered product 202 (see FIG. 8) together with the substrate 70. In the peeling step P14, the substrate 70 is peeled off from the three-dimensionally laminated electronic device 204.

(C-1) Laminated Manufacturing Process The layered manufacturing process P10 is executed by the controller 120 and includes an insulating layer process S10, a conductive paste process S20, and a mounting process S30. Note that the execution order of each of the above processes S10, S20, and S30 is determined by the layered structure of the three-dimensional layered object 202, etc. Therefore, the above-mentioned processes S10, S20, and S30 are not repeated in the order in which they are written. In the following description, the layered manufacturing process P10 when the three-dimensional layered object 202 shown in FIGS. 5 to 8 is manufactured will be described.

First, in insulating layer processing S10, as shown in FIG. 5, the first insulating layer 206 of the three-dimensional layered product 202 is formed on the substrate 70. For this purpose, a resin laminate forming process S12 and a resin laminate curing process S14 are performed. In the resin laminate forming process S12, the stage 52 is moved below the second modeling unit 24. As a result, the substrate 70 set on the base 60 of the stage 52 is moved below the second modeling unit 24. Furthermore, in the printing section 84, an inkjet head 88 discharges a thin film of ultraviolet curing resin onto the upper surface of the substrate 70. Subsequently, in the second curing section 86, a flattening device 90 flattens the discharged ultraviolet curable resin so that the film thickness becomes uniform. After that, in the resin laminate curing process S14, the irradiation device 92 irradiates the flattened ultraviolet curing resin with ultraviolet rays. This cures the ultraviolet curable resin. Thereafter, by repeating the resin laminate forming process S12 and the resin laminate curing process S14, the first insulating layer 206 of the three-dimensional laminate-molded article 202 is formed on the substrate 70.

In the conductive paste process S20, the first layer of circuit wiring 208 of the three-dimensional layered product 202 is formed on the substrate 70 and hardened. For this purpose, a circuit wiring forming process S22 and a circuit wiring hardening process S24 are performed. In the circuit wiring forming process S22, the stage 52 is moved below the first modeling unit 22. Further, in the discharge section 72, the dispense head 76 discharges the conductive paste linearly onto the upper surface of the insulating layer 206 of the three-dimensional laminate-molded object 202 according to the wiring circuit pattern. As a result, a plurality of first-layer circuit wirings 208 are formed on the upper surface of the insulating layer 206 of the three-dimensional layered product 202. Thereafter, in the circuit wiring curing process S24, in the first curing section 74, the irradiation device 78 irradiates the linearly discharged conductive paste with ultraviolet rays. This causes the conductive paste to harden. In this way, each circuit wiring 208 is hardened on the upper surface of the insulating layer 206 of the three-dimensional layered product 202.

As described above, each circuit wiring 208 is laminated on the insulating layer 206 of the three-dimensional layered product 202. Further, in each circuit wiring 208, the conductive paste (that is, each circuit wiring 208) that is the material thereof is cured by ultraviolet rays, thereby developing conductivity as described above. These points also apply to the circuit wirings 212, 220, and 226 described below.

Thereafter, the insulating layer treatment S10 and the conductive paste treatment S20 are repeated. As a result, as shown in FIG. 6, in the three-dimensional layered product 202, a second layer insulating layer 210 is formed, a plurality of second layer circuit wirings 212 are formed, and then hardened.

However, in the insulating layer process S10, when the resin laminate forming process S12 and the resin laminate curing process S14 are repeated, the inkjet head 88 attaches a predetermined portion to the top surface of each circuit wiring 208 in the first layer. The ultraviolet curable resin is discharged so that a generally circular shape is exposed. As a result, a plurality of via holes 214 are formed in the second insulating layer 210. Each via hole 214 has a shape that tapers from the top surface of the second layer insulating layer 210 toward the top surface of the first layer circuit wiring 208. Further, the inkjet head 88 discharges the ultraviolet curing resin onto the upper surface of the first insulating layer 206 so that a predetermined portion is exposed in a generally rectangular shape. As a result, a space 216 is formed in the second insulating layer 210.

Further, in the conductive paste process S20, in the circuit wiring forming process S22, the conductive paste is applied from the top surface of the second layer insulating layer 210 to each of the first layer circuit wirings via the inclined surface of each via hole 214. The liquid is discharged until it reaches the upper surface of 208. Therefore, when the circuit wiring hardening process S24 is executed, the second layer circuit wiring 212 is electrically connected to each first layer circuit wiring 208 via the inclined surface of each via hole 214.

Thereafter, the insulating layer treatment S10 and the conductive paste treatment S20 are repeated. As a result, as shown in FIG. 7, in the three-dimensional layered product 202, a third insulating layer 218 is formed, and a plurality of third layer circuit wirings 220 are formed and hardened. At this time, each via hole 214 in the second insulating layer 210 is filled with the cured ultraviolet curing resin. Further, in the third insulating layer 218, a plurality of via holes 222 and spaces 224 are formed in the same manner as the via holes 214 and spaces 216 formed in the second insulating layer 210. Thereby, the third layer circuit wiring 220 is electrically connected to each second layer circuit wiring 212 via the inclined surface of each via hole 222. Furthermore, the space 224 formed in the third insulating layer 218 is provided in a vertically continuous manner with the space 216 in the second insulating layer 210.

Note that in FIG. 7, each circuit wiring 208 on the upper surface of the first insulating layer 206 and each via hole 214 and space 216 formed in the second insulating layer 210 are omitted. These points also apply to FIGS. 8 and 9.

Subsequently, a mounting process S30 is executed. In the mounting process S30, the stage 52 is moved below the mounting unit 26. In the mounting unit 26, the electronic component 94 supplied by the tape feeder 110 is held by the suction nozzle 116 of the mounting head 112, as shown in FIG. The held electronic component 94 is mounted in the space 224 (and space 216) as the mounting head 112 moves by the moving device 114. At this time, each electrode 96 of the electronic component 94 faces upward.

Thereafter, the insulating layer treatment S10 and the conductive paste treatment S20 are repeated. As a result, as shown in FIG. 7, each via hole 222 in the third insulating layer 218 is filled with the cured ultraviolet curing resin. Moreover, the space between the inner wall surface that partitions the space 224 (and the space 216) and the electronic component 94 is also filled with the cured ultraviolet curing resin. Further, a fourth layer of circuit wiring 226 is formed so as to connect a portion of the third layer of circuit wiring 220 and each electrode 96 of the electronic component 94, and is hardened. Thereby, the electronic component 94 is electrically connected to each circuit wiring 208, 212, 220, 226.

After that, the insulating layer treatment S10 is performed. Thereby, as shown in FIG. 8, a fourth insulating layer 228 is formed.

Note that, in FIG. 8, each circuit wiring 212 on the upper surface of the second insulating layer 210 and each via hole 222 and space 224 formed in the third insulating layer 218 are omitted. These points are the same in FIG. 9 as well.

(C-2) Heating process In the heating process P12, after the substrate 70 is removed from the base 60 with the three-dimensional layered product 202 formed on its upper surface (that is, attached), It is set in the electric furnace of the heating section 200. In the electric furnace, the three-dimensional layered product 202 is heated together with the substrate 70 at 80° C. for 60 minutes.

As a result, in the three-dimensional layered product 202, each circuit wiring 208, 212, 220, 226 is heated and fired, thereby improving the conductivity of each circuit wiring 208, 212, 220, 226 as described above. do. In this way, the three-dimensional layered product 202 becomes a three-dimensional layered electronic device 204 on the upper surface of the substrate 70. As a result, a three-dimensional stacked electronic device 204 is manufactured.

(C-3) Peeling process In the peeling process P14, the substrate 70 is taken out of the electric furnace of the heating section 200 with the three-dimensionally laminated electronic device 204 manufactured on its top surface (that is, in a state where it is attached). . Thereafter, as shown in FIG. 9, the three-dimensionally stacked electronic device 204 is separated from the substrate 70 using a solvent or the like.

(D) Summary As explained in detail above, in the method 130 for manufacturing a three-dimensionally laminated electronic device of the present embodiment, the heating step P12 is executed only once after the end of the additive manufacturing step P10. It is possible to reduce the heat load on the device 204 and shorten production time.

Incidentally, in this embodiment, the metal fine particles of the conductive paste are an example of conductive particles. The three-dimensional laminated electronic device manufacturing apparatus 10 is an example of a manufacturing apparatus. Each circuit wiring 208, 212, 220, 226 is an example of a single layer of circuit wiring. The circuit wiring forming process S22 is an example of a forming process. The circuit wiring hardening process S24 is an example of a hardening process.

(E) Modification Examples The present disclosure is not limited to the above embodiments, and various modifications can be made without departing from the spirit thereof.
For example, the three-dimensional layered product 202 includes a total of four layers of circuit wiring 208, 212, 220, and 226, but may include circuit wiring with a number of layers other than four. Even in such a case, it is possible to develop the conductivity of the circuit wiring (that is, the conductive paste) using ultraviolet rays, and to improve the developed conductivity by heating and baking.

Further, in the first modeling unit 22, the circuit wirings 208, 212, 220, and 226 may be formed by, for example, transferring a conductive paste using a transfer device.

Further, as shown in FIG. 10, a three-dimensional layered product 232 including a support material 230 may be formed on the upper surface of the substrate 70. The support material 230 is made of a wax-based material (for example, a brazing material with a melting point of 60° C.) that melts in the heating step P12, and is connected to the substrate 70 at the bottom of the three-dimensional laminate model 232. The insulating layer 234 is supported by being disposed between the insulating layers 234 of the laminate-molded article 232 .

In such a case, when the heating step P12 is executed, the three-dimensional layered product 232 becomes a three-dimensional layered electronic device 236 on the upper surface of the substrate 70, and the support material 230 is turned into a three-dimensional layered electronic device 236, as shown in FIG. dissolve. After that, when a peeling step P14 is performed, the three-dimensionally laminated electronic device 236 is separated from the substrate 70.

In the three-dimensional layered product 232, the insulating layer 234 is composed of multiple layers. Further, the three-dimensional layered product 232 includes circuit wiring 238 made up of multiple layers, multiple via holes 240, multiple electronic components 242, 244, and the like. However, since the three-dimensional layered product 232 is manufactured by the three-dimensional layered electronic device manufacturing method 130 in the same manner as the three-dimensional layered product 202, the insulating layer 234 that the three-dimensional layered product 232 has, , the circuit wiring 238, the via hole 240, the electronic components 242, 244, etc. will not be described. Note that each layer constituting the circuit wiring 238 is an example of a single layer of circuit wiring.

10 Three-dimensional laminated electronic device manufacturing apparatus 130 Three-dimensional laminated electronic device manufacturing method 202, 232 Three-dimensional laminated product 204, 236 Three-dimensional laminated electronic device 206, 210, 218, 234 Insulating layer 208, 212, 220, 226, 238 Circuit wiring 230 Support material P10 Laminated manufacturing process P12 Heating process S22 Circuit wiring forming process S24 Circuit wiring hardening process

Claims (2)

A formation process of forming a single layer of circuit wiring by discharging a conductive paste containing a mixture of conductive particles, an ultraviolet curing resin, and an organic solvent onto the insulating layer, and irradiating the single layer of circuit wiring with ultraviolet rays. and curing the single layer of circuit wiring, and forming a laminate by laminating the single layer of circuit wiring on the insulating layer in the forming treatment and the curing treatment, and further forming a laminate by laminating the single layer of circuit wiring on the insulating layer, and a layered manufacturing step of building a three-dimensional layered object in which the plurality of layered bodies are layered by layering the bodies;
and a heating step of manufacturing a three-dimensional laminated electronic device by heating the three-dimensional laminated product in which the plurality of laminates are laminated at 80 degrees after the laminated manufacturing step is completed,
A method for manufacturing a three-dimensionally laminated electronic device in which the conductivity of the conductive paste is developed by irradiation with ultraviolet rays in the curing treatment and improved by heating in the heating step ,
The three-dimensional layered product includes a support material that is located at the bottom of the three-dimensional layered product and supports the three-dimensional layered product,
The support material is molded from a material having a melting point that melts in the heating step,
In the heating step, the three-dimensional layered electronic device is heated to improve the conductivity of the conductive paste, and the support material is also heated to melt the support material. A manufacturing apparatus for manufacturing a three-dimensional laminated electronic device by the manufacturing method according to claim 1 .

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