JP6967138B2 - How to form a cavity - Google Patents

Description

The present disclosure relates to a method of forming a cavity in three-dimensional laminated modeling of an electronic device.

In recent years, various techniques for forming a cavity in which an electronic component is housed in an insulating resin layer have been proposed for three-dimensional laminated modeling of an electronic device.

For example, in the technique described in Patent Document 1 below, a stereolithography resin layer is laminated by a stereolithography process to form a stereolithography resin, and insert parts such as a semiconductor element, a resistor, and a capacitor are integrally formed in the stereolithography resin. It is a method for manufacturing an electronic product that is built-in and has a wiring formed in the stereolithography resin layer and the insert component is electrically connected by the wiring. The insert component is mounted on the resin layer, then the stereolithography resin layer is laminated on the resin layer to form the insert component, and the insert component is incorporated in the stereolithography resin.

Further, the technique described in Patent Document 1 below is characterized in that a storage recess for accommodating the insert component is formed in the stereolithography resin layer, and then the insert component is mounted in the storage recess.

JP-A-2002-93989

In the technique described in Patent Document 1, when the insert component is housed in the storage recess, if the gap between the insert component and the storage recess is too narrow, the speed of embedding the gap with the stereolithography resin may be slowed down. The upper surface of the embedded stereolithography resin becomes difficult to flatten, which may affect the wiring formed on the upper surface.

Therefore, the present disclosure has been made in view of the above-mentioned points, and a cavity in which an electronic component is housed in an insulating resin layer of an electronic device that is three-dimensionally laminated and formed including an electronic component and a circuit wiring layer. It is an object of the present invention to provide a method for forming a cavity in which the manufacturing throughput of an electronic device is improved and the quality of a circuit wiring layer is stabilized.

In the present specification, when forming a cavity in which an electronic component is housed in an insulating resin layer of an electronic device that is three-dimensionally laminated and formed including an electronic component and a circuit wiring layer, the cavity is formed from the upper end edge of the electronic component. On the interval to the opening edge, the nozzles that discharge the insulating resin for embedding the cavity should be lined up in a predetermined number or more according to the required value of the speed at which the insulating resin is embedded in the gap between the inner wall surface that divides the cavity and the electronic component. Discloses a method of forming a cavity comprising a first adjusting step of adjusting the opening dimension of the cavity.

According to the present disclosure, the method for forming a cavity is to form a cavity in which an electronic component is housed in an insulating resin layer of an electronic device that is three-dimensionally laminated and formed including an electronic component and a circuit wiring layer. It is possible to improve the manufacturing throughput of electronic devices and stabilize the quality of the circuit wiring layer.

It is a figure which shows the 3D laminated electronic device manufacturing apparatus. It is a block diagram which shows the control device. It is a perspective view which shows the 3D laminated object which was formed on the substrate. It is a figure which shows the nozzle of the inkjet head used in the 2nd printing part. It is a perspective view which shows the 3D laminated object which was formed on the substrate. It is a perspective view which shows the 3D laminated object which was formed on the substrate. It is a perspective view which shows the 3D laminated object which was formed on the substrate. It is a perspective view which shows the 3D laminated object which was formed on the substrate. It is a perspective view which shows the substrate and the 3D laminated electronic device. It is a flowchart which shows the flow of the cavity formation method. It is a figure which shows the cavity of the 3D laminated model which was modeled on the substrate. It is a figure which shows the cavity of the 3D laminated model which was modeled on the substrate. It is a figure which shows the cross section which cut the 3D laminated object by the line AA of FIG. It is a figure which shows the cavity of the 3D laminated model which was modeled on the substrate. It is a figure which shows the cavity of the 3D laminated model which was modeled on the substrate. It is a figure which shows the cavity of the 3D laminated model which was modeled on the substrate. It is a figure which shows the cavity of the 3D laminated model which was modeled on the substrate.

Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the drawings.

FIG. 1 shows a three-dimensional laminated electronic device manufacturing apparatus 10. The three-dimensional laminated electronic device manufacturing apparatus 10 includes a transport device 20, a first modeling unit 22, a second modeling unit 24, a mounting unit 26, and a control device (see FIG. 2) 27. The transfer device 20, the first modeling unit 22, the second modeling unit 24, and the mounting unit 26 are arranged on the base 28 of the three-dimensional laminated electronic device manufacturing apparatus 10. The base 28 has a generally rectangular shape, and in the following description, the longitudinal direction of the base 28 is orthogonal to the X-axis direction, and the lateral direction of the base 28 is orthogonal to both the Y-axis direction, the X-axis direction, and the Y-axis direction. The direction will be referred to as a Z-axis direction.

The transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32. The X-axis slide mechanism 30 has an X-axis slide rail 34 and an X-axis slider 36. The X-axis slide rail 34 is arranged on the base 28 so as to extend in the X-axis direction. The X-axis slider 36 is slidably held in the X-axis direction by the X-axis slide rail 34. Further, the X-axis slide mechanism 30 has an electromagnetic motor (see FIG. 2) 38, and the X-axis slider 36 moves to an arbitrary position in the X-axis direction by driving the electromagnetic motor 38. Further, the Y-axis slide mechanism 32 has a Y-axis slide rail 50 and a stage 52. The Y-axis slide rail 50 is arranged on the base 28 so as to extend in the Y-axis direction. One end of the Y-axis slide rail 50 is connected to the X-axis slider 36. Therefore, the Y-axis slide rail 50 is movable in the X-axis direction. The stage 52 is slidably held in the Y-axis slide rail 50 in the Y-axis direction. Further, the Y-axis slide mechanism 32 has an electromagnetic motor (see FIG. 2) 56, and the stage 52 is moved to an arbitrary position in the Y-axis direction by driving the electromagnetic motor 56. As a result, the stage 52 moves to an arbitrary position on the base 28 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.

The stage 52 has a base 60, a holding device 62, and an elevating device 64. The base 60 is formed in a flat plate shape, and a substrate is placed on the upper surface. The holding devices 62 are provided on both sides of the base 60 in the X-axis direction. Then, both edges of the substrate mounted on the base 60 in the X-axis direction are sandwiched by the holding device 62, so that the substrate is fixedly held. Further, the elevating device 64 is arranged below the base 60, and raises and lowers the base 60 in the Z-axis direction.

The first modeling unit 22 is a unit for modeling a circuit wiring layer on a substrate (see FIG. 3) 70 mounted on a base 60 of a stage 52, and has a first printing unit 72 and a firing unit 74. Have. The first printing unit 72 has an inkjet head (see FIG. 2) 76, and ejects metal ink linearly onto a substrate 70 mounted on a base 60. Metal ink is a metal ink in which fine particles of metal are dispersed in a solvent. The inkjet head 76 ejects metal ink from a plurality of nozzles by, for example, a piezo method using a piezoelectric element.

The firing unit 74 has a laser irradiation device (see FIG. 2) 78. The laser irradiation device 78 is a device that irradiates the metal ink ejected on the substrate 70 with a laser, and the metal ink irradiated with the laser is fired to form a circuit wiring layer. In addition, firing of metal ink is a phenomenon in which the solvent is vaporized and the metal fine particle protective film is decomposed by applying energy, and the metal fine particles are brought into contact with each other or fused to increase the conductivity. be. Then, the metal ink is fired to form a metal circuit wiring layer.

Further, the second modeling unit 24 is a unit for modeling an insulating layer on the substrate 70 mounted on the base 60 of the stage 52, and has a second printing unit 84 and a curing unit 86. The second printing unit 84 has an inkjet head (see FIG. 2) 88, and discharges the ultraviolet curable resin onto the substrate 70 mounted on the base 60. The ultraviolet curable resin is a resin that is cured by irradiation with ultraviolet rays. The inkjet head 88 may be, for example, a piezo method in which the resin is discharged from a plurality of nozzles by deformation of the piezoelectric element, or a thermal method in which the resin is heated to generate bubbles and discharged from the plurality of nozzles.

The cured portion 86 has a flattening device (see FIG. 2) 90 and an irradiation device (see FIG. 2) 92. The flattening device 90 flattens the upper surface of the ultraviolet curable resin ejected onto the substrate 70 by the inkjet head 88. For example, the surplus resin is rolled or rolled while the surface of the ultraviolet curable resin is leveled. By scraping with a blade, the thickness of the UV curable resin is made uniform. Further, the irradiation device 92 includes a mercury lamp or an LED as a light source, and irradiates the ultraviolet curable resin discharged on the substrate 70 with ultraviolet rays. As a result, the ultraviolet curable resin discharged onto the substrate 70 is cured, and an insulating layer is formed.

Further, the mounting unit 26 is a unit for mounting an electronic component (see FIG. 7) 94 on a substrate 70 mounted on a base 60 of a stage 52, and has a supply unit 100 and a mounting unit 102. There is. The supply unit 100 has a plurality of tape feeders (see FIG. 2) 110 that send out the taped electronic components 94 one by one, and supplies the electronic components 94 at the supply position. The supply unit 100 is not limited to the tape feeder 110, and may be a tray-type supply device that picks up and supplies the electronic component 94 from the tray. Further, the supply unit 100 may be configured to include both a tape type and a tray type, or other supply devices.

The mounting unit 102 has a mounting head (see FIG. 2) 112 and a moving device (see FIG. 2) 114. The mounting head 112 has a suction nozzle (see FIG. 7) 116 for sucking and holding the electronic component 94. The suction nozzle 116 sucks and holds the electronic component 94 by sucking air by supplying negative pressure from a positive / negative pressure supply device (not shown). Then, when a slight positive pressure is supplied from the positive / negative pressure supply device, the electronic component 94 is separated. Further, the moving device 114 moves the mounting head 112 between the supply position of the electronic component 94 by the tape feeder 110 and the substrate 70 mounted on the base 60. As a result, in the mounting portion 102, the electronic component 94 supplied from the tape feeder 110 is held by the suction nozzle 116, and the electronic component 94 held by the suction nozzle 116 is mounted on the substrate 70.

Further, as shown in FIG. 2, the control device 27 includes a controller 120 and a plurality of drive circuits 122. The plurality of drive circuits 122 include the electromagnetic motors 38 and 56, a holding device 62, an elevating device 64, an inkjet head 76, a laser irradiation device 78, an inkjet head 88, a flattening device 90, an irradiation device 92, a tape feeder 110, and a mounting head. 112, connected to the mobile device 114. The controller 120 includes a CPU, ROM, RAM, etc., and is mainly a computer, and is connected to a plurality of drive circuits 122. As a result, the operation of the transfer device 20, the first modeling unit 22, the second modeling unit 24, and the mounting unit 26 is controlled by the controller 120.

Next, a method for manufacturing a three-dimensional laminated electronic device will be described.

First, as shown in FIG. 3, the first insulating layer 206 of the three-dimensional laminated model 202 is formed on the substrate 70. For that purpose, the stage 52 is moved below the second modeling unit 24. As a result, the substrate 70 set with respect to the base 60 of the stage 52 is moved below the second modeling unit 24. Further, in the second printing unit 84, the inkjet head 88 ejects the ultraviolet curable resin into a thin film on the upper surface of the substrate 70. Subsequently, in the curing portion 86, the flattening device 90 flattens the discharged ultraviolet curable resin so that the film thickness becomes uniform. After that, the irradiation device 92 irradiates the flattened ultraviolet curable resin with ultraviolet rays. This cures the UV curable resin. After that, by repeating the process in the second modeling unit 24 described above (that is, the process of the second printing unit 84 and the process of the curing unit 86), the first layer of the three-dimensional laminated modeled product 202 is placed on the substrate 70. Insulation layer 206 is formed.

As shown in FIG. 4, the inkjet head 88 used in the second printing unit 84 is provided with a first nozzle row 130 and a second nozzle row 132. The first nozzle row 130 and the second nozzle row 132 are provided along the longitudinal direction of the inkjet head 88. In the first nozzle row 130 and the second nozzle row 132, a plurality of nozzles 134 are arranged at a predetermined pitch. Further, each nozzle 134 of the first nozzle row 130 is provided at a position deviated by half of a predetermined pitch in the longitudinal direction of the inkjet head 88 with respect to each nozzle 134 of the second nozzle row 132. That is, in the inkjet head 88, the nozzles 134 are arranged in a staggered pattern.

In the first nozzle row 130 and the second nozzle row 132, the ultraviolet curable resin is discharged from each nozzle 134. The controller 120 can select the nozzle 134 for discharging the ultraviolet curable resin according to the manufacturing status of the three-dimensional laminated model 202.

The inkjet head 88 is not limited to the one provided with two nozzle rows 130 and 132, and may be provided with one or three or more nozzle rows. Further, the inkjet head 88 is not limited to the one in which the nozzles 134 are arranged in a staggered pattern, and the inkjet head 88 may be one in which the nozzles 134 are arranged in a grid pattern. Further, the inkjet head 88 is not limited to those in which the nozzles 134 are arranged at a predetermined pitch, for example, the pitch of the nozzles 134 gradually changes, or the nozzles 134 are arranged irregularly. May be good.

Next, the first circuit wiring layer 208 of the three-dimensional laminated model 202 is formed on the substrate 70 and cured. For that purpose, the stage 52 is moved below the first modeling unit 22. Further, as shown in FIG. 5, in the first printing unit 72, the inkjet head 76 linearly ejects metal ink to the upper surface of the insulating layer 206 of the three-dimensional laminated model 202 according to the wiring circuit pattern. do. As a result, a plurality of first-layer circuit wiring layers 208 are formed on the upper surface of the insulating layer 206 of the three-dimensional laminated model 202. After that, in the firing unit 74, the laser irradiation device 78 irradiates the metal ink ejected linearly with the laser. This cures the metal ink. In this way, each circuit wiring layer 208 is cured on the upper surface of the insulating layer 206 of the three-dimensional laminated model 202.

After that, the process in the second modeling unit 24 and the process in the first modeling unit 22 are repeated. As a result, as shown in FIG. 6, in the three-dimensional laminated model 202, the second insulating layer 210 is formed, and a plurality of the second circuit wiring layers 212 are formed and cured.

However, in the process of the second modeling unit 24, when the process of the second printing unit 84 and the process of the curing unit 86 are repeated, the inkjet head 88 refers to the upper surface of each circuit wiring layer 208 of the first layer with respect to the upper surface. The UV curable resin is discharged so that the predetermined portion is exposed in a generally circular shape. As a result, a plurality of via holes 214 are formed in the second insulating layer 210. Each via hole 214 has a shape that tapers from the upper surface of the second layer insulating layer 210 toward the upper surface of the first layer circuit wiring layer 208. Further, the inkjet head 88 ejects the ultraviolet curable resin with respect to the upper surface of the first insulating layer 206 so that a predetermined portion is generally exposed in a rectangular shape. As a result, the cavity 216 is formed in the second insulating layer 210.

Further, in the process of the first modeling unit 22, in the process of the first printing unit 72, the metal ink is applied from the upper surface of the second layer insulating layer 210 to the first layer via the inclined surface of each via hole 214. It is discharged to the upper surface of each circuit wiring layer 208. Therefore, when the step of the firing unit 74 is executed, the second layer circuit wiring layer 212 is electrically connected to each circuit wiring layer 208 of the first layer via the inclined surface of each via hole 214. ..

After that, the process in the second modeling unit 24 and the process in the first modeling unit 22 are repeated. As a result, as shown in FIG. 7, in the three-dimensional laminated model 202, the third-layer insulating layer 218 is formed, and a plurality of third-layer circuit wiring layers 220 are formed and cured. At that time, each via hole 214 in the second insulating layer 210 is filled with the cured ultraviolet curable resin. Further, in the third insulating layer 218, a plurality of via holes 222 and cavities 224 are formed in the same manner as the via holes 214 and cavities 216 formed in the second insulating layer 210. As a result, the circuit wiring layer 220 of the third layer is electrically connected to each circuit wiring layer 212 of the second layer via the inclined surface of each via hole 222. Further, the cavity 224 formed in the third layer insulating layer 218 is provided in a state of being vertically connected to the cavity 216 in the second layer insulating layer 210.

In the following description, when the cavities 216 and 224 are generically referred to without distinction, they are referred to as cavities 224. The method of forming the cavity 224 will be described later. Further, in FIG. 7, each circuit wiring layer 208 on the upper surface of the first insulating layer 206 and each via hole 214 and the cavity 216 formed in the second insulating layer 210 are omitted.

Subsequently, the stage 52 is moved below the mounting unit 26. In the mounting unit 26, the electronic component 94 supplied by the tape feeder 110 is held by the suction nozzle 116 of the mounting head 112, as shown in FIG. 7. The held electronic component 94 is mounted in the cavity 224 as the mounting head 112 moves in the moving device 114. At that time, each electrode 96 of the electronic component 94 faces upward. Further, the upper surface of each electrode 96 of the electronic component 94 and the upper surface of the third insulating layer 218 are located on the same plane.

After that, the process in the second modeling unit 24 (that is, the process of the second printing unit 84 and the process of the curing unit 86) is repeated. As a result, as shown in FIG. 7, each via hole 222 in the third insulating layer 218 is filled with the cured ultraviolet curable resin. Further, the gap between the inner wall surface that partitions the cavity 224 and the electronic component 94 is also filled with the cured ultraviolet curable resin. Further, the process in the first modeling unit 22 is performed. As a result, the circuit wiring layer 226 of the fourth layer is formed so as to connect a part of the circuit wiring layer 220 of the third layer and each electrode 96 of the electronic component 94, and is cured. As a result, the electronic component 94 is electrically connected to each circuit wiring layer 208, 212, 220, 226.

After that, the process in the second modeling unit 24 (that is, the process of the second printing unit 84 and the process of the curing unit 86) is repeated. As a result, as shown in FIG. 8, the fourth insulating layer 227 is formed.

In FIG. 8, each circuit wiring layer 212 on the upper surface of the second layer insulating layer 210 and each via hole 222 and the cavity 224 formed in the third layer insulating layer 218 are omitted. These points are the same in FIG.

Subsequently, as shown in FIG. 9, the three-dimensional laminated model 202 is separated from the substrate 70 by a solvent or the like to become a three-dimensional laminated electronic device 204.

Next, a method of forming the cavity will be described. In the following description, the detailed description of the three-dimensional laminated electronic device in which the cavity is formed is omitted by assigning the same reference numerals to the portions substantially in common with the above-mentioned three-dimensional laminated electronic device 204. ..

As shown in FIG. 10, the cavity forming method 300 includes a first adjusting step P10, a second adjusting step P20, and a third adjusting step P30. The cavity forming method 300 is performed by the controller 120 when the three-dimensional laminated electronic device 204 is manufactured.

In the first adjustment step P10, the opening size of the cavity 224 is adjusted. Specifically, as shown in FIG. 11, the opening dimension D1 of the cavity 224 in the lateral direction of the electronic component 94 is an ultraviolet ray on the distance G1 from the upper end edge 95 of the electronic component 94 to the opening edge 225 of the cavity 224. The length is adjusted so that at least a predetermined number of nozzles 134 (of the inkjet head 88) for ejecting the cured resin can be lined up.

This point is the same for the opening dimension D2 of the cavity 224 in the longitudinal direction of the electronic component 94, as shown in FIG. That is, the opening dimension D2 is such that at least a predetermined number of nozzles 134 (of the inkjet head 88) for discharging the ultraviolet curable resin are lined up on the gap G2 from the upper end edge 95 of the electronic component 94 to the opening edge 225 of the cavity 224. Adjusted to the possible length.

As shown in FIG. 13, the cross section of the cavity 224 (and the cavity 216) is open from the bottom surface 230 of the cavity 224 (and the cavity 216) between the inclined surfaces 228 which are the inner peripheral surfaces of the cavity 224 (and the cavity 216). It has a shape that expands toward 232. The cross section of the cavity 224 (and the cavity 216) shown in FIG. 13 is a cross section along the lateral direction of the electronic component 94, but the cross section of the electronic component 94 along the longitudinal direction also has a similar shape. ing. In addition, in FIGS. 11 and 12, the boundary line between the bottom surface 230 and the inclined surface 228 and the boundary line between the adjacent inclined surfaces 228 are omitted.

The above predetermined number depends on the required value of the speed at which the ultraviolet curable resin is embedded in the gap between the inner wall surface (that is, the inclined surface 228 and the bottom surface 230) and the electronic component 94 that partition the cavity 224, or in the gap thereof. By flattening the upper surface of the embedded ultraviolet curable resin with the flattening device 90, it is possible to be flush with the upper surface of the third insulating layer 218 (and the upper surface of each electrode 96 of the electronic component 94). Determined in terms of minimum spacing.

In the second adjusting step P20, the cavities 224 arranged adjacent to each other are integrated when a predetermined condition is satisfied. Hereinafter, a specific description will be given. For example, as shown in FIG. 14, it is assumed that two cavities 224A and 224B are arranged adjacent to each other. In such a case, when the thickness 234t of the partition wall 234 separating the two adjacent cavities 224A and 224B is less than a predetermined distance, the partition wall 234 is omitted as shown in FIG. The cavities 224A and 224B are combined into one cavity 224 (hereinafter referred to as an integrated cavity 224).

The above-mentioned predetermined distance may be determined from the viewpoint of preventing the substrate 70 from becoming large, or may be determined from the viewpoint of the minimum thickness at which the partition wall 234 can be formed.

In the second adjustment step P20, the integrated cavity is in the direction in which the opening edge 225 of the integrated cavity 224 faces the partition wall 234, that is, in the lateral direction of the electronic component 94 in FIG. The opening dimension D3 of 224 may be narrowed to the opening dimension D4 shown in FIG. Here, the opening dimension D4 in FIG. 16 means a dimension smaller than the opening dimension D3 in FIG. 15 by the thickness of the partition wall 234 by 234 tons.

In the third adjustment step P30, the interval G1 is widened in the direction in which the electronic component 94 is wired. Hereinafter, a specific description will be given. For example, as shown in FIG. 17, the opening of the cavity 224 from the upper end edge 95 of the electronic component 94 in the direction in which the electrode 96 of the electronic component 94 and the circuit wiring layer 226 are connected, that is, in the lateral direction of the electronic component 94. The distance to the edge 225 is extended from the interval G1 to the interval G3. As a result, the opening dimension D3 of the integrated cavity 224 is expanded to the opening dimension D5.

As described in detail above, in the cavity forming method 300 of the present embodiment, when the first adjustment step P10 is executed, the opening dimensions D1 and D2 of the cavity 224 are changed from the upper end edge 95 of the electronic component 94 to the cavity 224. On the intervals G1 and G2 up to the opening edge 225, the length is adjusted so that at least a predetermined number of nozzles 134 (of the inkjet head 88) for ejecting the ultraviolet curable resin can be lined up.

In this regard, the above-mentioned predetermined number is determined according to the required value of the speed at which the ultraviolet curable resin is embedded in the gap between the inner wall surface (that is, the inclined surface 228 and the bottom surface 230) and the electronic component 94 that partition the cavity 224, or. The upper surface of the ultraviolet curable resin embedded in the gap is flattened by the flattening device 90 so as to be flush with the upper surface of the third insulating layer 218 (and the upper surface of each electrode 96 of the electronic component 94). Is determined in terms of the minimum possible interval.

When the upper surface of the ultraviolet curable resin embedded in the gap is flush with the upper surface of the insulating layer 218 (and the upper surface of each electrode 96 of the electronic component 94), the insulating layer 218 is formed from the upper surface of the electrode 96 of the electronic component 94. There is no step in the circuit wiring layer 226 formed over the upper surface of the circuit wiring layer 226.

Therefore, in the cavity forming method 300 of the present embodiment, the insulating layer 210 of the three-dimensional laminated electronic device 204, which is three-dimensionally laminated and formed in a state including the electronic component 94 and the circuit wiring layers 208, 212, 220, 226, When forming the cavity 224 in which the electronic component 94 is housed in 218, it is possible to improve the manufacturing throughput of the three-dimensional laminated electronic device 204 and stabilize the quality of the circuit wiring layer 226.

Incidentally, in the present embodiment, the three-dimensional laminated electronic device 204 is an example of an electronic device. Each of the insulating layers 210 and 218 is an example of an insulating resin layer. The inclined surfaces 228 of the cavities 216 and 224 are examples of the facing wall surfaces of the cavities. The bottom surface 230 of the cavities 216 and 224 is an example of the bottom of the cavity. The ultraviolet curable resin is an example of an insulating resin. The lateral direction of the electronic component 94 is an example of the direction in which the electronic component and the circuit wiring layer are wired.

The present disclosure is not limited to the above embodiment, and various changes can be made without departing from the spirit of the present invention.

For example, the controller 120 may independently execute the first adjustment step P10, the second adjustment step P20, and the third adjustment step P30.

Further, the cross section of the cavity 224 (and the cavity 216) is different from the shape shown in FIG. 13, and has a shape in which the inner peripheral surface of the cavity 224 (and the cavity 216) is provided perpendicular to the bottom surface 230. You may have.

94 Electronic components 95 Top edge of electronic components 134 Nozzle 204 Three-dimensional laminated electronic device 206,210,218 Insulation layer 208,212,220,226 Circuit wiring layer 216 Cavity 224 (one) Cavity 224A, 224B Adjacent cavity 225 Cavity Opening edge 228 Cavity inclined surface 230 Cavity bottom surface 232 Cavity opening 234 Partition wall 234t Partition wall thickness 300 Cavity forming method D1, D2, D3, D4, D5 Cavity opening dimensions G1, G2, G3 Spacing P10 1st adjustment process P20 2nd adjustment process P30 3rd adjustment process

Claims (5)

When forming a cavity in which an electronic component is housed in an insulating resin layer of an electronic device that is three-dimensionally laminated and formed including an electronic component and a circuit wiring layer, the opening edge of the cavity is formed from the upper end edge of the electronic component. A predetermined number or more according to the required value of the speed at which the insulating resin is embedded in the gap between the inner wall surface that divides the cavity and the electronic component by the nozzle that discharges the insulating resin for embedding the cavity. A method for forming a cavity, comprising a first adjusting step of adjusting the opening dimension of the cavity so as to be lined up. When the cavities are arranged adjacent to each other and the thickness of the partition wall separating the adjacent cavities is less than a predetermined distance, the adjacent cavities are made into one cavity by omitting the partition wall. The method for forming a cavity according to claim 1, further comprising a second adjusting step. The second adjusting step is the cavity according to claim 2, wherein the opening dimension of the one cavity is narrowed by the thickness of the partition wall in the direction in which the opening edge of the one cavity faces the partition wall. Forming method. The method for forming a cavity according to any one of claims 1 to 3, further comprising a third adjusting step of widening the distance in the direction in which the electronic component and the circuit wiring layer are wired. The method for forming a cavity according to any one of claims 1 to 4, wherein the cavity has a shape in which the space between the facing wall surfaces expands from the bottom toward the opening.

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