JP6816283B2 - Wiring forming method and wiring forming device - Google Patents

Description

The present invention provides a wiring forming method for forming wiring by applying a metal-containing liquid containing metal fine particles on an insulating support or a substrate and firing the metal-containing liquid with laser light. Regarding the forming device.

In recent years, as described in the following patent documents, wiring is formed by applying a metal-containing liquid containing metal fine particles on an insulating support or a substrate and firing the metal-containing liquid. The technology is being developed.

Japanese Unexamined Patent Publication No. 2006-269557

In the above patent document, the metal ink is fired by irradiation with an infrared heater, but it is also possible to fire the metal ink and form a wiring by irradiating the metal ink with laser light. Therefore, it is an object of the present invention to appropriately fire metal ink by irradiation with laser light and to form wiring appropriately.

In order to solve the above problems, the present specification describes a coating step of applying a metal-containing liquid containing metal fine particles on an insulating support or a substrate, and firing the metal-containing liquid with laser light. Including the firing process step of forming the wiring, as the wiring formation data for forming the wiring, the data for forming the plurality of the wirings in a crossed state within the laser spot diameter of the laser beam is obtained. Disclosed is a wiring forming method in which the coating step and the firing processing step are repeatedly executed for each wiring when set.

Further, the present specification includes a coating device for applying a metal-containing liquid containing metal fine particles, an irradiation device for irradiating a laser beam, and a control device, and the control device is provided on an insulating support or a substrate. The metal-containing liquid is applied to the coating portion to be applied by the coating device, and the metal-containing liquid applied by the coating device is irradiated with the laser beam and the metal-containing liquid is fired to form a wiring. When data for forming the wiring in a state where a plurality of the wirings are crossed within the laser spot diameter of the laser beam is set as the wiring formation data including the firing portion and for forming the wiring. Disclosed is a wiring forming apparatus in which the processing by the coating portion and the processing by the firing portion are repeatedly executed for each of the wirings.

According to the present disclosure, when the data for forming a plurality of wirings within the laser spot diameter of the laser beam is set as the wiring formation data for forming the wirings, the coating step and the firing process step are performed. It is repeatedly executed for each wiring. That is, after the formation of one wiring is completed by the coating step and the firing treatment step, the coating step and the firing treatment step are executed, and the next one wiring is formed. As a result, it becomes possible to appropriately irradiate the metal-containing liquid applied according to one wiring with a laser beam, and it is possible to appropriately fire the metal ink and form the wiring appropriately.

It is a figure which shows the wiring formation apparatus. It is a block diagram which shows the control device of a wiring forming apparatus. It is sectional drawing which shows the circuit in the state which the resin laminate is formed. It is sectional drawing which shows the circuit in the state which the wiring is formed on the resin laminate. It is a top view which shows the circuit in the state which the metal ink was ejected on the resin laminate in the conventional wiring formation method. It is a top view which shows the circuit in the state which the metal ink shown in FIG. 5 is fired. It is a top view which shows the circuit in the state which the metal ink was ejected on the resin laminate in the conventional wiring formation method. It is a top view which shows the circuit in the state which the metal ink shown in FIG. 7 is fired. It is a top view which shows the circuit in the state which the metal ink shown in FIG. 7 is fired. It is a top view which shows the circuit in the state which the metal ink was ejected on the resin laminate in the conventional wiring formation method. It is a top view which shows the circuit in the state which the metal ink shown in FIG. 10 is fired. It is a top view which shows the circuit in the state which the metal ink shown in FIG. 10 is fired. It is a top view which shows the circuit in the state which the metal ink was ejected on the resin laminate in the wiring formation method of this invention. It is a top view which shows the circuit in the state which the metal ink shown in FIG. 13 is fired. It is a top view which shows the circuit in the state which the metal ink was ejected on the resin laminate in the wiring formation method of this invention. It is a top view which shows the circuit in the state which the metal ink shown in FIG. 15 is fired. It is a top view which shows the circuit in the state which the metal ink was ejected on the resin laminate in the wiring formation method of this invention. It is a top view which shows the circuit in the state which the metal ink shown in FIG. 17 is fired. It is a top view which shows the circuit in the state which the metal ink was ejected on the resin laminate in the wiring formation method of this invention. It is a top view which shows the circuit in the state which the metal ink shown in FIG. 19 is fired. It is a top view which shows the circuit formed by using the wiring formation method of this invention. It is a top view which shows the circuit formed by using the wiring formation method of this invention. It is a top view which shows the circuit formed by using the wiring formation method of this invention.

(A) Configuration of Circuit Forming Device FIG. 1 shows the circuit forming device 10. The circuit forming device 10 includes a transport device 20, a first modeling unit 22, a second modeling unit 24, and a control device (see FIG. 2) 26. The transfer device 20, the first modeling unit 22, and the second modeling unit 24 are arranged on the base 28 of the circuit forming device 10. The base 28 has a generally rectangular shape, and in the following description, the longitudinal direction of the base 28 is orthogonal to the X-axis direction, and the lateral direction of the base 28 is orthogonal to both the Y-axis direction, the X-axis direction, and the Y-axis direction. The direction will be described as the Z-axis direction.

The transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32. The X-axis slide mechanism 30 has an X-axis slide rail 34 and an X-axis slider 36. The X-axis slide rail 34 is arranged on the base 28 so as to extend in the X-axis direction. The X-axis slider 36 is slidably held in the X-axis direction by the X-axis slide rail 34. Further, the X-axis slide mechanism 30 has an electromagnetic motor (see FIG. 2) 38, and the X-axis slider 36 moves to an arbitrary position in the X-axis direction by driving the electromagnetic motor 38. Further, the Y-axis slide mechanism 32 has a Y-axis slide rail 50 and a stage 52. The Y-axis slide rail 50 is arranged on the base 28 so as to extend in the Y-axis direction, and is movable in the X-axis direction. Then, one end of the Y-axis slide rail 50 is connected to the X-axis slider 36. The stage 52 is slidably held in the Y-axis slide rail 50 in the Y-axis direction. Further, the Y-axis slide mechanism 32 has an electromagnetic motor (see FIG. 2) 56, and the stage 52 moves to an arbitrary position in the Y-axis direction by driving the electromagnetic motor 56. As a result, the stage 52 moves to an arbitrary position on the base 28 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.

The stage 52 has a base 60, a holding device 62, and an elevating device (see FIG. 2) 64. The base 60 is formed in a flat plate shape, and a substrate is placed on the upper surface thereof. The holding devices 62 are provided on both sides of the base 60 in the X-axis direction. Then, both edges of the substrate mounted on the base 60 in the X-axis direction are sandwiched by the holding device 62, so that the substrate is fixedly held. Further, the elevating device 64 is arranged below the base 60 and raises and lowers the base 60.

The first modeling unit 22 is a unit for modeling wiring on a substrate (see FIG. 3) 70 mounted on a base 60 of a stage 52, and has a first printing unit 72 and a firing unit 74. ing. The first printing unit 72 has an inkjet head (see FIG. 2) 76, and ejects metal ink linearly onto a substrate 70 mounted on a base 60. Metal ink is a metal ink in which fine particles of metal are dispersed in a solvent. The inkjet head 76 ejects a conductive material from a plurality of nozzles by, for example, a piezo method using a piezoelectric element.

The firing unit 74 has a laser irradiation device (see FIG. 2) 78. The laser irradiation device 78 is a device that irradiates the metal ink ejected on the substrate 70 with a laser, and the metal ink irradiated with the laser is fired to form wiring. In addition, firing of metal ink is a phenomenon in which the solvent is vaporized and the metal fine particle protective film is decomposed by applying energy, and the metal fine particles are brought into contact with each other or fused to increase the conductivity. is there. Then, the metal ink is fired to form a metal wiring.

Further, the second modeling unit 24 is a unit for modeling a resin layer on a substrate 70 mounted on a base 60 of a stage 52, and has a second printing unit 84 and a curing unit 86. .. The second printing unit 84 has an inkjet head (see FIG. 2) 88, and discharges an ultraviolet curable resin onto a substrate 70 mounted on a base 60. The inkjet head 88 may be, for example, a piezo method using a piezoelectric element, or a thermal method in which a resin is heated to generate bubbles and discharged from a nozzle.

The curing portion 86 includes a flattening device (see FIG. 2) 90 and an irradiation device (see FIG. 2) 92. The flattening device 90 flattens the upper surface of the ultraviolet curable resin ejected onto the substrate 70 by the inkjet head 88. For example, the surplus resin is applied by a roller or a roller while leveling the surface of the ultraviolet curable resin. By scraping with a blade, the thickness of the UV curable resin is made uniform. Further, the irradiation device 92 includes a mercury lamp or an LED as a light source, and irradiates the ultraviolet curable resin discharged on the substrate 70 with ultraviolet rays. As a result, the ultraviolet curable resin discharged onto the substrate 70 is cured, and the resin layer is formed.

Further, as shown in FIG. 2, the control device 26 includes a controller 120 and a plurality of drive circuits 122. The plurality of drive circuits 122 are connected to the electromagnetic motors 38 and 56, the holding device 62, the elevating device 64, the inkjet head 76, the laser irradiation device 78, the inkjet head 88, the flattening device 90, and the irradiation device 92. The controller 120 includes a CPU, ROM, RAM, etc., and is mainly a computer, and is connected to a plurality of drive circuits 122. As a result, the operation of the transfer device 20, the first modeling unit 22, and the second modeling unit 24 is controlled by the controller 120.

(B) Operation of Circuit Forming Device In the circuit forming device 10, a circuit pattern is formed on the substrate 70 by the above-described configuration. Specifically, the substrate 70 is set on the base 60 of the stage 52, and the stage 52 is moved below the second modeling unit 24. Then, in the second modeling unit 24, as shown in FIG. 3, the resin laminate 130 is formed on the substrate 70. The resin laminate 130 is formed by repeating the ejection of the ultraviolet curable resin from the inkjet head 88 and the irradiation of the ejected ultraviolet curable resin with ultraviolet rays by the irradiation device 92.

Specifically, in the second printing unit 84 of the second modeling unit 24, the inkjet head 88 ejects the ultraviolet curable resin into a thin film on the upper surface of the substrate 70. Subsequently, when the ultraviolet curable resin is discharged in the form of a thin film, the ultraviolet curable resin is flattened by the flattening device 90 so that the film thickness of the ultraviolet curable resin becomes uniform in the cured portion 86. Then, the irradiation device 92 irradiates the thin film ultraviolet curable resin with ultraviolet rays. As a result, a thin-film resin layer 132 is formed on the substrate 70.

Subsequently, the inkjet head 88 ejects the ultraviolet curable resin into a thin film on the thin film resin layer 132. Then, the thin-film ultraviolet-curable resin is flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet-curable resin discharged in the thin-film form with ultraviolet rays, thereby forming the thin-film ultraviolet-curable resin on the thin-film resin layer 132. The thin-film resin layer 132 is laminated. In this way, the ejection of the ultraviolet-curable resin onto the thin-film resin layer 132 and the irradiation of ultraviolet rays are repeated, and the plurality of resin layers 132 are laminated to form the resin laminate 130.

When the resin laminate 130 is formed by the procedure described above, the stage 52 is moved below the first modeling unit 22. Then, in the first printing unit 72, the inkjet head 76 linearly ejects the metal ink onto the upper surface of the resin laminate 130 according to the circuit pattern. The circuit pattern is stored in the controller 120 as wiring formation data for forming the wiring, and the inkjet head 76 is controlled based on the wiring formation data so that the metal ink can be supplied according to the circuit pattern. It is discharged.

Next, in the firing unit 74 of the first modeling unit 22, the laser irradiation device 78 irradiates the metal ink with a laser. As a result, the metal ink is fired, and as shown in FIG. 4, the wiring 136 is formed on the resin laminate 130. As described above, in the circuit forming apparatus 10, the resin laminate 130 is formed by the ultraviolet curable resin, and the wiring 136 is formed by the metal ions, so that the circuit pattern is formed on the substrate 70.

In the above description, the case where one wiring 136 is formed on the resin laminate 130 has been described, but the circuit pattern is usually composed of a plurality of wirings 136. Therefore, a plurality of wirings 136 are formed on the resin laminate 130, and there are cases where the planned formation positions of two or more wirings 136 among the plurality of wirings 136 are within a predetermined range and cases where they are not. Wiring 136 is formed by different methods.

Specifically, for example, when two wirings 136 are formed, the metal ink is usually ejected onto the resin laminate 130 by the inkjet head 76 based on the wiring formation data of the two wirings 136. Will be done. As a result, as shown in FIG. 5, the linear metal ink (hereinafter, referred to as “first linear ink”) 150a corresponding to the wiring formation data of one of the two wirings and the two wirings. 150b of linear metal ink (hereinafter, referred to as “second linear ink”) corresponding to the wiring formation data of the other is applied.

Then, each of the first linear ink 150a and the second linear ink 150b is irradiated with laser light by the laser irradiation device 78, so that two wirings 136 are formed as shown in FIG. Will be done. The wiring 136 formed by irradiating the first linear ink 150a with the laser beam is described as the first wiring 136a, and the wiring formed by irradiating the second linear ink 150b with the laser beam. 136 is described as the second wiring 136b. That is, in a normal wiring forming method, after the first linear ink 150a and the second linear ink 150b are applied to the resin laminate 130, the first linear ink 150a and the second linear ink 150a are applied. By irradiating the ink 150b with the laser beam, the first wiring 136a and the second wiring 136b are formed.

However, when the first wiring 136a and the second wiring 136b are formed in close proximity to each other, if the above-mentioned normal wiring forming method is used, there is a possibility that the wiring cannot be formed properly. Specifically, first, as shown in FIG. 7, the first linear ink 150a and the second linear ink 150b are applied to the resin laminate 130 in a state of being close to each other. In addition, in this specification, "proximity" means that two or more linear objects exist close to each other, but the two or more linear objects do not come into contact with each other.

Then, when the first linear ink 150a and the second linear ink 150b are applied to the resin laminate 130 in a state of being close to each other, for example, the first linear ink 150a is first irradiated with laser light. As a result, as shown in FIG. 8, the first wiring 136a is formed. At this time, the laser beam irradiated to the first linear ink 150a is also irradiated to a part of the second linear ink 150b applied in a state close to the first linear ink 150a. ..

The laser spot diameter of the laser beam is the outer diameter of the irradiation range of the laser beam when the upper surface of the resin laminate 130 is irradiated with the laser beam without moving the laser irradiation device 78, and is a circular dotted line 160. Is indicated by. Further, the outer edge of the irradiation range of the laser light when the first linear ink 150a is irradiated with the laser light is indicated by a linear dotted line 162.

As described above, when the first linear ink 150a is irradiated with the laser light, if a part of the second linear ink 150b is irradiated with the laser light, the second linear ink irradiated with the laser light is irradiated. Only a part of the surface of 150b is fired. Specifically, the laser beam has a local energy intensity distribution according to the beam profile. For example, in a laser beam having a Gaussian type energy intensity distribution, when the energy intensity at the center of the laser beam is 100%, the energy intensity at the outer edge of the laser beam, that is, the boundary area is 13.5%. Become. That is, the energy intensity of the laser beam is attenuated toward the outside from the center of the laser beam. Therefore, the first linear ink 150a irradiated with the central portion of the laser beam is appropriately fired. On the other hand, since the outer edge portion of the laser beam is irradiated to the second linear ink 150b, only the surface of the second linear ink 150b irradiated with the laser beam is fired, and the inside is not fired. Ingredients remain. That is, since the second linear ink 150b is irradiated with the laser beam having the attenuated energy intensity, it is not fired properly.

When the second linear ink 150b is irradiated with the laser beam in such a state, the second wiring 136b is formed as shown in FIG. 9, but in the second wiring 136b, the second wiring 136b is formed first. Cracks, swelling, etc. occur in the areas where only the surface is fired (black areas in the figure). This is because the remaining unfired components expand due to laser irradiation inside the portion where only the surface of the second linear ink 150b is fired, and the surface of the formed second wiring 136b is cracked. is there. As described above, when the first wiring 136a and the second wiring 136b are formed in close proximity to each other, if the above-mentioned normal wiring forming method is used, the wiring cannot be formed properly.

Further, even when the first wiring 136a and the second wiring 136b are formed in a crossed state, if a normal wiring forming method is used, there is a possibility that the wiring cannot be formed properly. Specifically, first, as shown in FIG. 10, the first linear ink 150a and the second linear ink 150b are applied to the resin laminate 130 in a state of intersecting each other.

In addition, in this specification, "intersection" means that two or more linear objects intersect, in other words, they come into contact with each other in part. For example, it means that between both ends of the first wiring 136a and between both ends of the second wiring 136b, that is, the two wirings 136 intersect in a cross shape. Further, for example, it means that between both ends of the first wiring 136a and the end of the second wiring 136b intersect, that is, the two wirings 136 intersect in a T shape. Further, for example, it means that the end of the first wiring 136a and the end of the second wiring 136b intersect, that is, the two wirings 136 intersect in an L shape. Incidentally, in FIG. 10, the first linear ink 150a and the second linear ink 150b are applied to the resin laminate 130 in a cross-shaped crossing state.

Then, when the first linear ink 150a and the second linear ink 150b are applied to the resin laminate 130 in a state where they intersect, for example, the first linear ink 150a is first irradiated with laser light. To. At this time, the central portion of the laser beam is irradiated to the first linear ink 150a, so that the first wiring 136a is formed as shown in FIG. However, the outer edge of the laser beam irradiated to the first linear ink 150a is irradiated to a part of the second linear ink 150b applied in a state of intersecting the first linear ink 150a. .. Therefore, in a part of the second linear ink 150b irradiated with the laser beam, only the surface is fired, and the unfired component remains inside.

Then, when the second linear ink 150b is irradiated with the laser beam in such a state, the second wiring 136b is formed as shown in FIG. 12, but in the second wiring 136b, the second wiring 136b is formed. Cracks, swelling, etc. occur in the parts where only the surface was fired first (black-painted parts in the figure). As described above, when the first wiring 136a and the second wiring 136b are formed in a crossed state, if the above-mentioned normal wiring forming method is used, the wiring cannot be formed properly.

In view of this, in the circuit forming apparatus 10, when the first wiring 136a and the second wiring 136b are formed in a state of being close to each other or in a state of being crossed with each other, the same as the above-mentioned usual forming method. Wiring is formed by different methods. Specifically, the cause of cracks, swelling, etc. in the wiring is that the outer edge portion of the laser beam is irradiated with the second linear ink 150b or the like. Therefore, the metal ink may be applied to the resin laminate 130 so that the plurality of linear inks 150 do not exist in the irradiation range of the laser beam, that is, the laser spot diameter of the laser beam.

Therefore, when a plurality of linear inks 150 are planned to be applied inside the laser spot diameter, that is, data for forming a plurality of wires within the laser spot diameter of the laser beam is set as the wiring formation data. If so, the metal ink coating process and the laser light irradiation process are repeatedly executed for each wiring. That is, every time the metal ink corresponding to one wiring is applied, the metal ink is irradiated with laser light to form one wiring.

Specifically, when data for forming the first wiring 136a and the second wiring 136b in a close state within the laser spot diameter of the laser beam is set as the wiring formation data, FIG. 13 As shown in the above, the first linear ink 150a is applied to the resin laminate 130. Then, the first linear ink 150a is irradiated with the laser beam. At this time, the central portion of the laser beam is irradiated to the first linear ink 150a, so that the first linear ink 150a is suitably fired, and as shown in FIG. 14, the first wiring 136a is formed. Will be done.

Next, when the first wiring 136a is formed, as shown in FIG. 15, the second linear ink 150b is applied to the resin laminate 130 in a state close to the first wiring 136a. Then, the second linear ink 150b is irradiated with the laser beam. At this time, when the central portion of the laser beam is irradiated to the second linear ink 150b, the second linear ink 150b is suitably fired, and as shown in FIG. 16, the second wiring 136b is formed. Will be done.

In this way, even when the two wires to be formed are close to each other, the metal ink coating process and the laser light irradiation process are repeatedly executed for each wire, so that the laser light laser is used. The first linear ink 150a and the second linear ink 150b do not exist inside the spot diameter. As a result, the outer edge portion of the laser beam is not irradiated to the second linear ink 150b or the like, and it is possible to appropriately form two wires in a close state.

Further, by using the above-mentioned method, it becomes possible to form a plurality of wirings in a state of being close to each other, and the degree of freedom in circuit design design is increased. That is, when the wiring is formed by using the conventional wiring forming method without using the wiring forming method in which the metal ink coating process and the laser light irradiation process are executed for each wiring, a plurality of wirings are formed. If the planned positions for forming the wiring are close to each other, the wiring cannot be formed properly. Therefore, when only the conventional wiring forming method is used, the circuit is designed so that a plurality of wirings are not located within the range of the laser spot diameter of the laser beam. On the other hand, by using a wiring forming method in which the metal ink coating process and the laser light irradiation process are executed for each wiring, it is possible to form a plurality of wirings in close proximity to each other. This makes it possible to design a circuit in which a plurality of wirings are located within the laser spot diameter of the laser beam, and the degree of freedom in circuit design design is increased.

Further, as the wiring formation data, when data for forming the first wiring 136a and the second wiring 136b in a crossed state within the laser spot diameter of the laser beam is set, as shown in FIG. In addition, the first linear ink 150a is applied to the resin laminate 130. Then, the first linear ink 150a is irradiated with the laser beam. At this time, by irradiating the central portion of the laser beam with the first linear ink 150a, the first linear ink 150a is suitably fired, and as shown in FIG. 18, the first wiring 136a is formed. Will be done.

Next, when the first wiring 136a is formed, as shown in FIG. 19, the second linear ink 150b is applied to the resin laminate 130 in a state of intersecting the first wiring 136a. Then, the second linear ink 150b is irradiated with the laser beam. At this time, when the central portion of the laser beam is irradiated to the second linear ink 150b, the second linear ink 150b is suitably fired, and as shown in FIG. 20, the second wiring 136b is formed. Will be done.

In this way, even when the two wires to be formed intersect, the laser light laser is obtained by repeatedly executing the metal ink coating process and the laser light irradiation process for each wire. The first linear ink 150a and the second linear ink 150b do not exist inside the spot diameter. As a result, the outer edge portion of the laser beam is not irradiated to the second linear ink 150b or the like, and it is possible to appropriately form the two wires in an intersecting state.

A method of forming a circuit by using the above-mentioned method will be described below. As shown in FIG. 21, the circuit 170 to be formed is composed of a resin laminate 130, a plurality of wirings 172 to 199, and an electronic component 212 having a plurality of electrodes 210.

When such a circuit 170 is formed, the resin laminate 130 is formed on the substrate 70. The resin laminate 130 is formed with a plurality of vias 216 and recesses 218 for arranging the electronic components 212. The depth dimension of the recess 218 is substantially the same as the height dimension of the electronic component 212, and the vertical and horizontal dimensions of the recess 218 are slightly larger than the vertical and horizontal dimensions of the electronic component 212. Then, the electronic component 212 is placed in the recess 218.

Subsequently, as shown in FIG. 22, a plurality of linear inks are applied based on the wiring formation data of the wirings 172, 174, 176, 178, 180, 182, 183, 185, 191, 192, 195, 197. , The plurality of linear inks are sequentially irradiated with laser light. As a result, wirings 172,174,176,178,180,182,183,185,191,192,195,197 are formed on the resin laminate 130.

Next, as shown in FIG. 23, a plurality of linear inks are applied based on the wiring formation data of the wirings 173,175,177,179,181,184,186,189,190,193,194,199. , The plurality of linear inks are sequentially irradiated with laser light. As a result, wirings 173,175,177,179,181,184,186,189,190,193,194,199 are formed on the resin laminate 130.

The wiring formation data of the wiring 173,175,177,179,184,189,199 is the wiring 172,174,176,178,180,182,183,185,191,192 within the range of the laser spot diameter. This is data for forming wiring in a state close to 195 and 197. Further, the wiring formation data of the wirings 181, 190, 193, 194 is data for forming the wiring in a state of being close to and intersecting with the wirings 180,182,191,192,195 within the range of the laser spot diameter. Further, the wiring formation data of the wiring 186 is data for forming the wiring in a state of intersecting the wiring 172 within the range of the laser spot diameter.

That is, as the wiring formation data of the wirings 173,175,177,179,181,184,186,189,190,193,194,199, at least one of the adjacent state and the intersecting state within the range of the laser spot diameter. Data for forming multiple wirings is set in the state of. Therefore, after the wirings 172,174,176,178,180,182,183,185,191,192,195,197 are formed, the wirings 173,175,177,179,181,184,186,189, 190,193,194,199 are formed.

Subsequently, as shown in FIG. 21, a plurality of linear inks are applied based on the wiring formation data of the wirings 187, 188, 196, 198, and the plurality of linear inks are sequentially irradiated with laser light. Ru. As a result, wirings 187, 188, 196, 198 are formed on the resin laminate 130.

The wiring formation data of the wiring 187 is data for forming the wiring in a state of being close to and intersecting the wirings 172 and 186 within the range of the laser spot diameter. The wiring formation data of the wirings 188, 196, 198 is data for forming the wiring in a state of intersecting the wirings 178, 183, 189, 195, 197, 199 within the range of the laser spot diameter.

That is, as the wiring formation data of the wirings 187, 188, 196, 198, data for forming a plurality of wirings in at least one state of the adjacent state and the intersecting state within the range of the laser spot diameter is set. There is. Therefore, after the wirings 172,178,183,186,189,195,197,199 are formed, the wirings 187,188,196,198 are formed.

In this way, even when two or more wires are close to each other or intersect in the circuit to be formed, the linear ink is applied and the linear ink is irradiated with laser light for each wiring. By repeatedly executing the processing, it becomes possible to form a circuit having appropriate wiring.

As shown in FIG. 2, the controller 120 has a coating unit 220 and a firing unit 222. The coating unit 220 is a functional unit for coating the metal ink on the resin laminate 130. The firing unit 222 is a functional unit for forming wiring by irradiating the metal ink with a laser beam and firing the metal ink.

By the way, in the above embodiment, the circuit forming apparatus 10 is an example of the wiring forming apparatus. The control device 26 is an example of the control device. The substrate 70 is an example of a substrate. The inkjet head 76 is an example of a coating device. The laser irradiation device 78 is an example of an irradiation device. The resin laminate 130 is an example of a support. Wiring 136, 172 to 199 is an example of wiring. The metal ink is an example of a metal-containing liquid. The coating unit 220 is an example of the coating unit. The firing unit 222 is an example of a firing unit. The step executed by the coating unit 220 is an example of the coating step. The step executed by the firing unit 222 is an example of a firing processing step.

The present invention is not limited to the above examples, and can be carried out in various embodiments with various modifications and improvements based on the knowledge of those skilled in the art. For example, in the above embodiment, the metal ink is applied on the resin laminate 130 to form the wiring, but the metal ink may be applied on the substrate 70 to form the wiring.

Further, in the above embodiment, the metal ink is applied by being ejected by the inkjet head 76, but the metal ink may be applied by printing with a squeegee or the like.

10: Circuit forming device (wiring forming device) 26: Control device 70: Substrate 76: Inkjet head (coating device) 78: Laser irradiation device (irradiation device) 130: Resin laminate (support) 136: Wiring 220: Coating part 222: Fired part

Claims (3)

A coating step of applying a metal-containing liquid containing metal fine particles onto an insulating support or substrate, and
Including a firing process step of forming wiring by firing the metal-containing liquid with laser light.
When the data for forming the wiring in a state where a plurality of the wirings are crossed within the laser spot diameter of the laser beam is set as the wiring formation data for forming the wiring, the coating step and the firing are performed. A wiring forming method in which a processing step is repeatedly executed for each wiring. The coating step
The metal-containing liquid is applied based on the wiring formation data of the first wiring.
The firing process step
The first wiring is formed by irradiating the metal-containing liquid applied based on the wiring formation data of the first wiring with the laser beam.
The coating step
After the first wiring is formed, the metal-containing liquid is applied based on the wiring formation data of the second wiring.
The firing process step
The wiring forming method according to claim 1, wherein the second wiring is formed by irradiating the metal-containing liquid applied based on the wiring formation data of the second wiring with the laser beam. A coating device that applies a metal-containing liquid containing metal fine particles,
An irradiation device that irradiates laser light and
Equipped with a control device
The control device
A coating portion for applying the metal-containing liquid onto an insulating support or a substrate by the coating device, and a coating portion.
The metal-containing liquid coated by the coating device is irradiated with the laser beam, and the metal-containing liquid is fired to form a firing portion.
When data for forming a plurality of the wirings in a crossed state within the laser spot diameter of the laser beam is set as the wiring formation data for forming the wirings, the processing by the coating portion is performed. A wiring forming device in which the processing by the firing unit is repeatedly executed for each wiring.

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