JP7428470B2 - Circuit formation method - Google Patents

Description

The present invention relates to a method for forming a circuit including an insulating layer formed of a curable resin.

The following patent document describes a technique related to a circuit including an insulating layer formed of a curable resin.

Japanese Patent Application Publication No. 2007-027454

An object of this specification is to suitably form a circuit including an insulating layer formed of a curable resin.

In order to solve the above-mentioned problems, the present specification provides spaced-apart wires on the base , including at least a portion of two or more wires formed on the base and between adjacent wires of the two or more wires. a first resin curing step of curing the curable resin applied to a plurality of locations in the state; and a second resin curing step of curing the curable resin applied to areas other than the curable resin cured in the first resin curing step. The distance between two adjacent wires of the two or more wires is longer than the outer dimension of the curable resin applied in the second resin curing step, and the first resin curing step Disclosed is a method for forming a circuit including an insulating layer formed of a resin cured in the step and the second resin curing step. The present specification also includes a first resin curing step of curing a curable resin applied at a plurality of spaced locations on at least a portion of two or more wirings formed on a base; and a second resin curing step of curing the curable resin applied on the surface other than the curable resin cured in the first resin curing step, between two adjacent wirings of the two or more wirings. The distance is longer than the outer dimension of the curable resin applied in the second resin curing step, and the circuit includes an insulating layer formed of the resin cured in the first resin curing step and the second resin curing step. The present invention discloses a circuit forming method in which the first resin curing step and the second resin curing step semi-cure the curable resin without completely curing it.

According to the present disclosure, after the curable resin applied on at least a portion of the wiring is cured, the curable resin applied on areas other than the cured curable resin is cured. An insulating layer is formed from the resin. Therefore, for example, even if organic residue spreads from the wiring to the curable resin, the organic residue is sealed in the curable resin applied first, and the organic residue spreads throughout the insulating layer. can be prevented. Thereby, a circuit including an insulating layer formed of a curable resin can be suitably formed.

FIG. 1 is a diagram showing a wiring forming apparatus. FIG. 2 is a block diagram showing a control device of the wiring forming apparatus. FIG. 3 is a cross-sectional view showing a circuit with a resin laminate formed thereon. FIG. 2 is a cross-sectional view showing a circuit in which wiring is formed on a resin laminate. FIG. 2 is a cross-sectional view showing a circuit in which a resin laminate covering wiring is formed. FIG. 2 is a plan view showing a circuit in which ultraviolet curable resin is discharged at a predetermined pitch onto a resin laminate and wiring. 7 is a sectional view taken along line AA in FIG. 6. FIG. FIG. 2 is a cross-sectional view showing a circuit in which ultraviolet curable resin is discharged at a predetermined pitch onto a resin laminate and wiring. FIG. 3 is a cross-sectional view showing a circuit in a state where the ultraviolet curable resin is discharged so as to fill the spaces between the cured ultraviolet curable resins. FIG. 3 is a cross-sectional view showing a circuit in a state where ultraviolet curing resin is discharged onto a first resin layer. FIG. 2 is a cross-sectional view showing a circuit in which a resin laminate is formed to cover the entire wiring. FIG. 2 is a cross-sectional view showing a circuit in which a resin laminate is formed at a location other than the resin laminate that covers the entire wiring.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Examples of the present invention will be described below in detail as modes for carrying out the present invention with reference to the drawings.

A circuit forming apparatus 10 is shown in FIG. The circuit forming apparatus 10 includes a transport device 20, a first modeling unit 22, a second modeling unit 24, and a control device (see FIG. 2) 26. The transport device 20, the first modeling unit 22, and the second modeling unit 24 are arranged on the base 28 of the circuit forming apparatus 10. The base 28 has a generally rectangular shape, and in the following description, the longitudinal direction of the base 28 is the X-axis direction, the short direction of the base 28 is the Y-axis direction, and it is perpendicular to both the X-axis direction and the Y-axis direction. The direction will be described as the Z-axis direction.

The transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32. The X-axis slide mechanism 30 includes an X-axis slide rail 34 and an X-axis slider 36. The X-axis slide rail 34 is arranged on the base 28 so as to extend in the X-axis direction. The X-axis slider 36 is held by the X-axis slide rail 34 so as to be slidable in the X-axis direction. Further, the X-axis slide mechanism 30 includes an electromagnetic motor (see FIG. 2) 38, and the X-axis slider 36 is moved to any position in the X-axis direction by driving the electromagnetic motor 38. Further, the Y-axis slide mechanism 32 includes a Y-axis slide rail 50 and a stage 52. The Y-axis slide rail 50 is disposed on the base 28 so as to extend in the Y-axis direction, and is movable in the X-axis direction. One end of the Y-axis slide rail 50 is connected to the X-axis slider 36. A stage 52 is held on the Y-axis slide rail 50 so as to be slidable in the Y-axis direction. Further, the Y-axis slide mechanism 32 includes an electromagnetic motor (see FIG. 2) 56, and the stage 52 is moved to an arbitrary position in the Y-axis direction by driving the electromagnetic motor 56. Thereby, the stage 52 is moved to an arbitrary position on the base 28 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.

The stage 52 includes a base 60, a holding device 62, and a lifting device (see FIG. 2) 64. The base 60 is formed into a flat plate shape, and a substrate is placed on the top surface. The holding device 62 is provided on both sides of the base 60 in the X-axis direction. Then, both edges of the substrate placed on the base 60 in the X-axis direction are held between the holding devices 62, so that the substrate is fixedly held. Further, the lifting device 64 is disposed below the base 60 and raises and lowers the base 60.

The first modeling unit 22 is a unit that models wiring on a substrate (see FIG. 3) placed on a base 60 of the stage 52, and includes a first printing section 72 and a baking section 74. ing. The first printing unit 72 has an inkjet head (see FIG. 2) 76, and discharges metal ink in a linear manner onto the substrate 70 placed on the base 60. Metal ink is made by dispersing fine metal particles in a solvent. Note that the inkjet head 76 ejects the conductive material from a plurality of nozzles using, for example, a piezo system using piezoelectric elements.

The baking section 74 has a laser irradiation device (see FIG. 2) 78. The laser irradiation device 78 is a device that irradiates the metal ink discharged onto the substrate 70 with a laser, and the metal ink irradiated with the laser is fired to form wiring. Incidentally, firing metal ink is a phenomenon in which the application of energy causes the solvent to vaporize and the metal particle protective film to decompose, and the metal particles to contact or fuse together, increasing the electrical conductivity. be. Then, metal wiring is formed by firing the metal ink.

Further, the second modeling unit 24 is a unit that models a resin layer on the substrate 70 placed on the base 60 of the stage 52, and includes a second printing section 84 and a curing section 86. . The second printing section 84 has an inkjet head (see FIG. 2) 88, and discharges ultraviolet curing resin onto the substrate 70 placed on the base 60. Note that the inkjet head 88 may be of a piezo type using a piezoelectric element, for example, or a thermal type of heating resin to generate bubbles and ejecting the bubbles from a nozzle.

The curing section 86 includes a flattening device (see FIG. 2) 90 and an irradiation device (see FIG. 2) 92. The flattening device 90 flattens the upper surface of the ultraviolet curable resin discharged onto the substrate 70 by the inkjet head 88. For example, while smoothing the surface of the ultraviolet curable resin, the excess resin is removed by a roller or a roller. By scraping with a blade, the thickness of the ultraviolet curing resin is made uniform. Further, the irradiation device 92 includes a mercury lamp or an LED as a light source, and irradiates the ultraviolet curing resin discharged onto the substrate 70 with ultraviolet rays. As a result, the ultraviolet curing resin discharged onto the substrate 70 is cured, and a resin layer is formed.

Further, the control device 26 includes a controller 120 and a plurality of drive circuits 122, as shown in FIG. The plurality of drive circuits 122 are connected to the electromagnetic motors 38 and 56, the holding device 62, the lifting device 64, the inkjet head 76, the laser irradiation device 78, the inkjet head 88, the flattening device 90, and the irradiation device 92. The controller 120 is mainly a computer, including a CPU, ROM, RAM, etc., and is connected to a plurality of drive circuits 122. Thereby, the operations of the transport device 20, the first modeling unit 22, and the second modeling unit 24 are controlled by the controller 120.

In the circuit forming apparatus 10, a circuit pattern is formed on the substrate 70 with the above-described configuration. Specifically, the substrate 70 is set on the base 60 of the stage 52, and the stage 52 is moved below the second modeling unit 24. Then, in the second modeling unit 24, a resin laminate 130 is formed on the substrate 70, as shown in FIG. The resin laminate 130 is formed by repeatedly ejecting the ultraviolet curable resin from the inkjet head 88 and irradiating the ejected ultraviolet curable resin with ultraviolet rays by the irradiation device 92.

Specifically, in the second printing section 84 of the second modeling unit 24, the inkjet head 88 discharges a thin film of ultraviolet curing resin onto the upper surface of the substrate 70. Subsequently, when the ultraviolet curable resin is discharged in the form of a thin film, the ultraviolet curable resin is flattened by a flattening device 90 in the curing section 86 so that the thickness of the ultraviolet curable resin becomes uniform. Then, the irradiation device 92 irradiates the thin film of ultraviolet curing resin with ultraviolet rays. As a result, a thin film-like resin layer 132 is formed on the substrate 70.

Subsequently, the inkjet head 88 discharges a thin film of ultraviolet curing resin onto the thin film resin layer 132. Then, the thin film-like ultraviolet curable resin is planarized by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet rays onto the thin film-like ultraviolet curable resin, thereby forming a layer on the thin film-like resin layer 132. A thin film-like resin layer 132 is laminated. In this way, the resin laminate 130 is formed by repeating the discharging of the ultraviolet curable resin onto the thin film-like resin layer 132 and the irradiation of the ultraviolet rays, and by stacking a plurality of resin layers 132.

After the resin laminate 130 is formed by the above-described procedure, the stage 52 is moved below the first modeling unit 22. Then, in the first printing section 72, as shown in FIG. 4, the inkjet head 76 discharges the metal ink 134 linearly onto the upper surface of the resin laminate 130 according to the circuit pattern. Next, in the firing section 74 of the first modeling unit 22, the laser irradiation device 78 irradiates the metal ink 134 with a laser beam. As a result, the metal ink 134 is fired, and the wiring 136 is formed on the resin laminate 130.

Subsequently, when the wiring 136 is formed on the resin laminate 130, the stage 52 is moved below the second modeling unit 24. Then, in the second modeling unit 24, as shown in FIG. 5, a resin laminate 140 is formed on the resin laminate 130 so as to cover the wiring 136. Note that since the resin laminate 140 is created by the same method as the resin laminate 130, a description of the method for creating the resin laminate 140 will be omitted. In this manner, in the circuit forming apparatus 10, the resin laminate 130 is formed using an ultraviolet curing resin, and the wiring 136 is formed on the resin laminate 130 using metal ions. Then, a circuit pattern is formed on the substrate 70 by forming the resin laminate 140 on the resin laminate 130 so as to cover the wiring 136.

However, the metal ink 134 that is the material of the wiring 136 contains organic substances such as surfactants and polarity adjusters, and some of the organic substances remain inside the wiring 136 even after the metal ink 134 is fired. remains. Therefore, as shown in FIG. 5, there is a possibility that organic residue 146 may diffuse from the wiring 136 into the resin laminate 140 formed to cover the wiring 136. If the organic residue 146 diffuses into the resin laminate 140, there is a possibility that curing of the ultraviolet curable resin, inhibition of insulation in the resin laminate 140, ion migration to the resin laminate 140, etc. may occur.

Note that since the wiring 136 is formed on the resin laminate 130, that is, on the cured ultraviolet curing resin, the organic residue 146 contained in the wiring 136 does not diffuse into the resin laminate 130. On the other hand, when forming the resin laminate 140, an ultraviolet curable resin is discharged so as to cover the wiring 136, and then the ultraviolet curable resin is cured by irradiation with ultraviolet rays. Therefore, the ultraviolet curable resin is discharged onto the wiring 136, and before the ultraviolet curable resin is cured, the organic residue 146 contained in the wiring 136 is diffused into the ultraviolet curable resin before being cured.

In view of this, in the circuit forming apparatus 10, an ultraviolet curing resin is discharged onto at least a portion of the wiring 136, and after the ejected ultraviolet curing resin is cured, other than the cured ultraviolet curing resin is The resin laminate 140 is formed by discharging the ultraviolet curable resin on top again and curing the discharged ultraviolet curable resin. A method for forming the resin laminate 140 will be described below with reference to FIGS. 6 to 10. In the following description, two wires 136 are formed on the resin laminate 130, as shown in FIGS. 6 to 10, and these two wires 136 are generally parallel. .

First, when the wiring 136 of the resin laminate 130 is formed, the stage 52 is moved below the second modeling unit 24, and in the second modeling unit 24, the inkjet head 88 sprays a plurality of ultraviolet curable resins at a predetermined pitch. Spit out twice. As a result, as shown in FIG. 6, a plurality of ultraviolet curing resins 150 land on the resin laminate 130 and the wiring 136 at a predetermined pitch. At this time, the operation of the inkjet head 88 and the like is controlled so that the landing diameter x of the ultraviolet curable resin 150, that is, the outer dimension of the ultraviolet curable resin 150 that has landed, is less than the landing pitch p of the ultraviolet curable resin 150. As a result, the plurality of ultraviolet curing resins 150 that have landed on the resin laminate 130 and the wiring 136 are separated from each other. In other words, two adjacent ultraviolet curing resins 150 are separated from each other without contacting each other. Note that the landing pitch of the ultraviolet curable resins 150 is the distance between the center of one ultraviolet curable resin 150 and the center of the other ultraviolet curable resin 150 in two adjacent ultraviolet curable resins 150 .

Further, the operation of the inkjet head 88 and the like is controlled so that the landing diameter x of the ultraviolet curable resin 150 is less than the distance a between the two wires 136 formed on the resin laminate 130. This prevents the ultraviolet curing resin 150 from being discharged across the two wirings 136. That is, on the upper surface of the resin laminate 130, the two wirings 136 are not connected by the ultraviolet curing resin 150.

Further, as shown in FIG. 7, after the resin laminate 140 is formed on the resin laminate 130, the wiring 160 may be formed on the resin laminate 140. In such a case, the ultraviolet curing resin 150 is used to prevent the wiring 136 formed on the resin laminate 130 and the wiring 160 formed on the resin laminate 140 from being connected by the ultraviolet curing resin 150. The landing thickness t is adjusted. Specifically, FIG. 7 is a cross-sectional view taken along line AA in FIG. 6, and in the cross-sectional view, a planned formation diagram of the resin laminate 140 and the wiring 160 is shown by dotted lines. Then, the landing thickness t of the ultraviolet curing resin 150 is set to be less than the distance b in the vertical direction between the wiring 136 formed on the resin laminate 130 and the wiring 160 formed on the resin laminate 140. Then, the operation of the inkjet head 88 and the like is controlled. Thereby, the wiring 136 formed on the resin laminate 130 and the wiring 160 formed on the resin laminate 140 are not connected by the ultraviolet curing resin 150.

In this way, when a plurality of UV curable resins 150 are discharged onto the resin laminate 130 and the wiring 136 at a predetermined pitch, as shown in FIG. At 150, organic residue 146 diffuses from the wiring 136. However, naturally, the organic residue 146 does not diffuse into the parts other than the wiring 136, that is, into the ultraviolet curing resin 150 discharged onto the resin laminate 130. When the discharge of the ultraviolet curable resin 150 at a predetermined pitch is completed, the irradiation device 92 irradiates the ultraviolet rays. At this time, the amount of ultraviolet rays irradiated to the ultraviolet curable resin 150 is set smaller than the amount of irradiation required to completely cure the ultraviolet curable resin 150. Specifically, for example, the amount of radiation required to completely cure the ultraviolet curable resin 150 is about 10%. Therefore, the ultraviolet curable resin 150 discharged at a predetermined pitch is not completely cured but remains in a semi-cured state. As a result, the organic residue 146 that has spread inside the ultraviolet curable resin 150 is sealed inside the semi-cured ultraviolet curable resin 150.

Next, when the ultraviolet curing resin 150 is semi-cured, the inkjet head 88, as shown in FIG. Then, the ultraviolet curing resin 152 is discharged. That is, the inkjet head 88 discharges the ultraviolet curing resin 152 onto the resin laminate 130 and the wiring 136 so as to fill the spaces between the semi-cured ultraviolet curing resins 150 . At this time, organic residue 146 from the wiring 136 is diffused into the ultraviolet curing resin 152 discharged onto the wiring 136. However, since the organic residue 146 is sealed inside the ultraviolet curing resin 150 that is discharged first, that is, the semi-cured ultraviolet curing resin 150, the ultraviolet curing resin 152 that is discharged later is not semi-cured. Even if it comes into contact with the ultraviolet curing resin 150 , the organic residue 146 does not diffuse from the ultraviolet curing resin 150 to the ultraviolet curing resin 152 . Note that organic residue 146 is naturally not diffused into the ultraviolet curing resin 152 discharged to locations other than the wiring 136.

Then, when the ultraviolet curable resin 152 is discharged so as to fill the spaces between the semi-cured ultraviolet curable resins 150, the irradiation device 92 irradiates the resin with ultraviolet rays. At this time, the amount of ultraviolet rays irradiated to the ultraviolet curable resin 150 is smaller than the amount of irradiation required to completely cure the ultraviolet curable resin 150, and the ultraviolet curable resin 152 is also used in the same manner as the ultraviolet curable resin 150. It will be in a semi-hardened state. As a result, the organic residue 146 that has diffused inside the ultraviolet curing resin 152 is sealed inside the semi-cured ultraviolet curing resin 152.

Next, when the ultraviolet curable resin 150 and the ultraviolet curable resin 152 are semi-cured, the amount of ultraviolet rays necessary to completely cure the semi-cured ultraviolet curable resin 150 and the ultraviolet curable resin 152 is irradiated. As a result, the ultraviolet curing resin 150 and the ultraviolet curing resin 152 are completely cured, and a first resin layer 156 covering the resin laminate 130 and the wiring 136 is formed. In this way, in the first resin layer 156, first, the ultraviolet curable resin 150 is discharged at a predetermined pitch, and after the ultraviolet curable resin 150 is cured, the space between the ultraviolet curable resin 150 is filled. The ultraviolet curing resin 150 is discharged, and the ultraviolet curing resin 152 is cured. That is, in the first resin layer 156, the ejection process and the curing process are performed separately.

Subsequently, when the first resin layer 156 is formed, as shown in FIG. be done. At this time, in the first resin layer 156, since the organic residue 146 is sealed inside the resin layer 156, even if the ultraviolet curing resin 158 is discharged onto the resin layer 156, the resin layer 156 The organic residue 146 does not diffuse into the ultraviolet curing resin 158.

Then, when the ultraviolet curing resin 158 is discharged onto the resin layer 156 so as to cover the entire resin layer 156, the ultraviolet curing resin 158 is irradiated with ultraviolet light by the irradiation device 92. At this time, the amount of ultraviolet rays irradiated to the ultraviolet curable resin 158 is set to be the amount necessary to completely cure the ultraviolet curable resin 150. As a result, the ultraviolet curing resin 158 is completely cured, and a second resin layer 156 covering the first resin layer 156 is formed. That is, in the second resin layer 156, the discharge process and the curing process are performed all at once over the entire area. Then, the third and subsequent resin layers 156 are formed by the same method as the second resin layer 156, and the resin laminate 140 is formed by laminating the plurality of resin layers 156.

In this way, in the resin laminate 140, when the ultraviolet curing resin 150 is ejected at a predetermined pitch in the first resin layer 156, the ultraviolet curing resin 150 ejected onto the wiring 136 has a Although organic residue 146 diffuses from the wiring 136, the residue 146 is sealed inside the ultraviolet curing resin 150 due to the semi-curing of the ultraviolet curing resin 150. When the ultraviolet curable resin 152 is discharged so as to fill the spaces between the ultraviolet curable resins 150, even if the ultraviolet curable resin 152 comes into contact with the ultraviolet curable resin 150 containing the organic residue 146, the ultraviolet curable resin 152 The organic residue 146 does not diffuse into the ultraviolet curing resin 152. However, when the ultraviolet curing resin 152 is discharged, organic residue 146 from the wiring 136 is diffused into the ultraviolet curing resin 152 discharged onto the wiring 136, but due to the semi-curing of the ultraviolet curing resin 152, the residue is 146 is sealed inside the ultraviolet curing resin 152. That is, in the resin laminate 140, in the first resin layer 156, the organic residue 146 is diffused only in the ultraviolet curing resin discharged onto the wiring 136.

Further, in the resin laminate 140, in the second resin layer 156, an ultraviolet curing resin 158 is discharged onto the first resin layer 156 so as to cover the entire first resin layer 156. However, in the first resin layer 156, the organic residue 146 is sealed inside due to the hardening of the resin layer 156. Therefore, even if the ultraviolet curing resin 158 is discharged onto the first resin layer 156, the organic residue 146 does not diffuse from the resin layer 156 to the ultraviolet curing resin 158. This can prevent the organic residue 146 from diffusing into the resin layer 156 above the first resin layer 156. In this way, in the resin laminate 140, the diffusion of the organic residue 146 is suppressed only by the ultraviolet curing resin discharged onto the wiring 136 in the first resin layer 156, resulting in curing inhibition and insulation inhibition. occurrences such as these are prevented.

Further, in the resin laminate 140, when the ultraviolet rays are irradiated to the ultraviolet curable resin 150 and the ultraviolet curable resin 152, the amount of irradiation of the ultraviolet rays is less than the amount of irradiation required to completely cure the ultraviolet curable resin. The ultraviolet curing resin 150 and the ultraviolet curing resin 152 are in a semi-cured state. As a result, ultraviolet curing resin 150 and ultraviolet curing resin 1
52, and the resin layer 156 can be suitably formed.

Furthermore, when forming the first resin layer 156, when the ultraviolet curable resin 150 is discharged at a predetermined pitch, the landing diameter x of the ultraviolet curable resin 150 is less than the landing pitch p of the ultraviolet curable resin 150. It is said that As a result, the two adjacent ultraviolet curing resins 150 are separated from each other without contacting each other, so that the organic residue 146 can be prevented from spreading between the two adjacent ultraviolet curing resins 150.

Furthermore, the landing diameter x of the ultraviolet curing resin 150 is less than the distance a between the two wirings 136 formed on the resin laminate 130. Further, the landing thickness t of the ultraviolet curing resin 150 is less than the distance b in the vertical direction between the wiring 136 formed on the resin laminate 130 and the wiring 160 formed on the resin laminate 140. There is. Therefore, the two wires are not connected by the ultraviolet curing resin 150 in the vertical direction and the horizontal direction. In other words, even if the organic matter residue 146 is diffused from the wiring into the ultraviolet curing resin 150 and the organic matter residue 146 is included in the ultraviolet curing resin 150, the ultraviolet curing resin 150 containing the organic matter residue 146 will , the two wires are not connected. Thereby, even if ion migration occurs in the ultraviolet curing resin 150 containing the organic residue 146, short circuit between the two wirings can be prevented.

Furthermore, diffusion of the organic residue 146 in the resin laminate 140 can be suppressed by a method different from the above method. Specifically, once the wiring 136 of the resin laminate 130 is formed, the stage 52 is moved below the second modeling unit 24. Then, in the second modeling unit 24, as shown in FIG. 11, a resin laminate 170 is formed on the resin laminate 130 so as to cover all of the wiring 136. Note that the resin laminate 170 is formed by the same method as the resin laminate 130. That is, the ultraviolet curing resin is discharged onto the resin laminate 130 so as to cover all of the wiring 136. At this time, organic residue 146 from the wiring 136 is diffused into the ultraviolet curing resin. Then, the ultraviolet curing resin is irradiated with ultraviolet light. At this time, the irradiation amount of ultraviolet rays is set to be the irradiation amount necessary to completely cure the ultraviolet curable resin. As a result, the ultraviolet curing resin discharged so as to cover all of the wiring 136 is cured, and the first resin layer of the resin laminate 170 is formed. Then, the second and subsequent resin layers are formed by the same method as the first resin layer. Thereby, the resin laminate 170 is formed by laminating a plurality of resin layers. At this time, the organic residue 146 is diffused into the first resin layer of the resin laminate 170, but due to the curing of the first resin layer, the organic residue 146 is spread inside the first resin layer. be contained in. Therefore, in the resin laminate 170, the organic residue 146 is prevented from diffusing into the second and subsequent resin layers. That is, in the resin laminate 170, the organic residue 146 is diffused only in the first resin layer 156.

Next, when a resin laminate 170 is formed to cover the wiring 136, a resin laminate 180 is formed at a location other than the resin laminate 170, as shown in FIG. Note that the height of the resin laminate 180 is the same as that of the resin laminate 170, and since the resin laminate 180 is integrally configured with the resin laminate 170, the resin laminate 140 is formed. That is, the resin laminate 140 is formed by forming the resin laminate 180 adjacent to and integral with the resin laminate 170.

Therefore, since the wiring 136 is covered by the resin laminate 170, the ultraviolet curing resin discharged when the resin laminate 180 is formed does not come into contact with the wiring 136, and the resin laminate 180 is formed. The organic residue 146 from the wiring 136 does not diffuse into the ultraviolet curable resin discharged during the process. Further, the ultraviolet curing resin discharged when the resin laminate 180 is formed comes into contact with the resin laminate 170 that covers the wiring 136, but in the resin laminate 170, organic substances may be present inside the first resin layer. Remnant 146 is contained. Therefore, the resin laminate 18
The organic residue 146 from the resin laminate 170 does not diffuse into the ultraviolet curing resin that is discharged when the 0 is formed. In this way, in the resin laminate 140 composed of the resin laminate 170 and the resin laminate 180, the diffusion of the organic residue 146 is suppressed only to the first resin layer of the resin laminate 170, The occurrence of curing inhibition, insulation inhibition, etc. is prevented.

Note that, as shown in FIG. 2, the controller 120 includes a wiring forming section 200, a first resin curing section 202, and a second resin curing section 204. The wiring forming section 200 is a functional section for forming the wiring 136 on the resin laminate 130. The first resin curing section 202 is a functional section that discharges the ultraviolet curable resin 150 onto the resin laminate 130 and the wiring 136 at a predetermined pitch and semi-cures the ultraviolet curable resin 150. The second resin curing section 204 is a functional section that discharges the ultraviolet curing resin 152 so as to fill the spaces between the semi-cured ultraviolet curing resins 150 and semi-curing the ultraviolet curing resin 152. Further, the first resin curing section 202 is a functional section for forming the resin laminate 170 so as to cover all of the wiring 136. The second resin curing section 204 is a functional section for forming the resin laminate 180 so as to be adjacent to the resin laminate 170 and integrated with the resin laminate 170 .

Incidentally, in the above embodiment, the resin laminate 130 is an example of the base. The wiring 136 is an example of wiring. The resin laminate 140 is an example of an insulating layer. Further, the wiring forming section 200 is an example of a wiring forming process. The first resin curing section 202 is an example of a first resin curing step. The second resin curing section 204 is an example of a second resin curing step.

It should be noted that the present invention is not limited to the above embodiments, but can be implemented in various forms with various changes and improvements based on the knowledge of those skilled in the art. For example, in the above embodiment, the wiring 136 is formed on the resin laminate 130, but the wiring 136 may be formed on the substrate 70.

Further, in the above embodiment, the ultraviolet curable resin 152 is discharged after the ultraviolet curable resin 150 is semi-cured, but the ultraviolet curable resin 152 may be discharged after the ultraviolet curable resin 150 is completely cured. good. On the other hand, in the above embodiment, the resin laminate 180 is formed after the ultraviolet curing resin discharged when forming the resin laminate 170 is completely cured. The resin laminate 180 may be formed after the cured resin is semi-cured.

Further, in the above embodiment, when forming the resin laminate 140, the second and subsequent resin layers 156 are formed by a different method from the first resin layer 156, but the first resin layer 156 It may be formed by the same method as . In other words, in the second and subsequent resin layers 156, the ultraviolet curable resin 150 is also discharged at a predetermined pitch, and after the ultraviolet curable resin 150 is cured, the ultraviolet curable resin 152 is discharged at locations other than the ultraviolet curable resin 150. The ultraviolet curing resin 152 may be cured.

In addition, in the above example, an ultraviolet curable resin that is cured by irradiation with ultraviolet rays is used as the curable resin, but various curable resins such as a resin that cures by heating or a resin that cures with the passage of time may be used. can do.

130: Resin laminate (base) 136: Wiring 140: Resin laminate (insulating layer)
200: Wiring forming section 202: First resin curing section 204: Second resin curing section

Claims (4)

Curing a curable resin applied at a plurality of spaced locations on the base , including at least a portion of two or more wires formed on the base and between adjacent wires of the two or more wires. a first resin curing step,
a second resin curing step of curing a curable resin applied on a surface other than the curable resin cured in the first resin curing step;
The distance between two adjacent wires of the two or more wires is longer than the outer dimension of the curable resin applied in the second resin curing step,
A method for forming a circuit including an insulating layer formed of resin cured in the first resin curing step and the second resin curing step. A plurality of separated wires are placed on at least a portion of two or more wires formed on the base.
a first resin curing step of curing the curable resin applied to the area;
The curable resin applied on other than the curable resin cured in the first resin curing step
a second resin curing step for curing;
including;
The distance between two adjacent wires among the two or more wires is determined in the second resin curing step.
longer than the outside dimension of the curable resin to be applied,
formed from resin cured in the first resin curing step and the second resin curing step.
A method for forming a circuit including an insulating layer comprising:
In the circuit forming method, the first resin curing step and the second resin curing step semi-cure the curable resin without completely curing it. The first resin curing step includes:
Curing the curable resin applied to multiple locations at a predetermined distance,
3. The circuit forming method according to claim 1 , wherein the predetermined distance is longer than an outer dimension of the curable resin applied to a plurality of locations. The circuit forming method includes:
A wiring forming step of forming the two or more wirings by applying a metal-containing liquid containing fine metal particles onto the base and firing the metal-containing liquid,
The first resin curing step includes:
A curable resin is applied onto at least a portion of the two or more wirings formed in the wiring forming step, and the applied curable resin is cured. The circuit formation method described in section .

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