JP7282906B2 - Component mounting method and component mounting device - Google Patents

Description

TECHNICAL FIELD The present invention relates to a component mounting method and a component mounting apparatus for mounting an electronic component, which is composed of a component body and electrodes, on a substrate.

The following patent document describes a technique for mounting an electronic component composed of a component body and electrodes on a substrate.

JP-A-2000-200953

Some electronic components are composed of a component body and electrodes extending downward from the bottom surface of the component body. An object of the present invention is to appropriately mount such an electronic component on a substrate.

In order to solve the above problems, the present specification provides a method for mounting an electronic component on a substrate, which is composed of a component body and an electrode extending downward from the bottom surface of the component body, comprising: a forming step of forming a stepped portion on the upper surface of the stepped portion, a coating step of applying a conductive adhesive to the upper surface and the lower surface of the stepped portion, and a conductive adhesive applied to the upper surface of the stepped portion a placing step of placing the electronic component on the upper surface of the base material so that the component body is in close contact with the adhesive and the electrode is in close contact with the conductive adhesive applied to the lower surface of the stepped portion; wherein the forming step has the height dimension according to at least one of the viscosity of the conductive adhesive and the dimensional accuracy of the electronic component in addition to the height difference between the bottom surface of the component body and the tip of the electrode. Disclosed is a component mounting method that forms a stepped portion.

Further, the present specification includes a holding device for holding an electronic component composed of a component body and electrodes extending downward from the bottom surface of the component body, and a forming device for forming a stepped portion on the top surface of the base material. and an applicator for applying a conductive adhesive to the upper surface and the lower surface of the stepped portion, wherein the forming device applies a conductive adhesive in addition to the height difference between the bottom surface of the component body and the tip of the electrode. The stepped portion having a height dimension corresponding to at least one of the viscosity of a conductive adhesive and the dimensional accuracy of the electronic component is formed, and the holding device includes a conductive adhesive applied to the upper surface of the stepped portion. a component mounting device for placing the electronic component on the upper surface of the base material so that the component body is in close contact with the base material and the electrode is in close contact with the conductive adhesive applied to the lower surface of the stepped portion. do.

According to the present disclosure, a stepped portion is formed on the top surface of the substrate, and a conductive adhesive is applied to the upper and lower surfaces of the stepped portion. Then, the electronic component is placed on the base such that the component main body adheres to the conductive adhesive applied to the upper surface of the stepped portion, and the electrode adheres to the conductive adhesive applied to the lower surface of the stepped portion. It is placed on top of the material. Thereby, the electronic component can be appropriately mounted on the base material.

It is a figure which shows a circuit formation apparatus. It is a block diagram which shows a control apparatus. FIG. 4 is a cross-sectional view showing a circuit in which a resin laminate is formed; FIG. 4 is a cross-sectional view showing a circuit in which wiring is formed on a resin laminate; FIG. 4 is a cross-sectional view showing a circuit in which a conductive resin paste is applied on wiring; FIG. 4 is a cross-sectional view showing a circuit with electronic components mounted thereon; 1A and 1B are a side view and a top view of an electronic component; FIG. FIG. 4 is a cross-sectional view showing a circuit in a state in which a conductive resin paste is applied to a planned mounting position of a component body and a planned mounting position of an electrode; FIG. 4 is a cross-sectional view showing a circuit with electronic components mounted thereon; FIG. 4 is a cross-sectional view showing a circuit in which a convex portion is formed on the upper surface of a resin laminate; FIG. 4 is a cross-sectional view showing a circuit in a state in which a conductive resin paste is applied to the upper surface of the protrusion and the upper surface of the resin laminate; FIG. 4 is a top view showing a convex portion on which a plurality of conductive resin pastes are applied in a grid pattern; FIG. 4 is a top view showing convex portions on which a plurality of conductive resin pastes are applied in a triangular lattice pattern; FIG. 4 is a cross-sectional view showing a circuit with electronic components mounted thereon;

A circuit forming apparatus 10 is shown in FIG. The circuit forming apparatus 10 includes a conveying device 20 , a first shaping unit 22 , a second shaping unit 24 , a third shaping unit 26 , a mounting unit 27 and a control device (see FIG. 2) 28 . The conveying device 20 , the first shaping unit 22 , the second shaping unit 24 , the third shaping unit 26 and the mounting unit 27 are arranged on the base 29 of the circuit forming device 10 . The base 29 has a generally rectangular shape, and in the following description, the longitudinal direction of the base 29 is the X-axis direction, the lateral direction of the base 29 is the Y-axis direction, and both the X-axis direction and the Y-axis direction are perpendicular to each other. The direction will be referred to as the Z-axis direction for description.

The transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32 . The X-axis slide mechanism 30 has an X-axis slide rail 34 and an X-axis slider 36 . The X-axis slide rail 34 is arranged on the base 29 so as to extend in the X-axis direction. The X-axis slider 36 is held by an X-axis slide rail 34 so as to be slidable in the X-axis direction. Further, the X-axis slide mechanism 30 has an electromagnetic motor (see FIG. 2) 38, and by driving the electromagnetic motor 38, the X-axis slider 36 moves to any position in the X-axis direction. Also, the Y-axis slide mechanism 32 has a Y-axis slide rail 50 and a stage 52 . The Y-axis slide rail 50 is arranged on the base 29 so as to extend in the Y-axis direction, and is movable in the X-axis direction. One end of the Y-axis slide rail 50 is connected to the X-axis slider 36 . A stage 52 is held on the Y-axis slide rail 50 so as to be slidable in the Y-axis direction. Furthermore, the Y-axis slide mechanism 32 has an electromagnetic motor (see FIG. 2) 56, and by driving the electromagnetic motor 56, the stage 52 moves to any position in the Y-axis direction. As a result, the stage 52 is moved to an arbitrary position on the base 29 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32 .

The stage 52 has a base 60 , a holding device 62 and an elevating device 64 . The base 60 is formed in a flat plate shape, and a substrate is placed on the upper surface thereof. The holding devices 62 are provided on both sides of the base 60 in the X-axis direction. Both edges of the substrate placed on the base 60 in the X-axis direction are sandwiched by the holding device 62, so that the substrate is fixedly held. The lifting device 64 is arranged below the base 60 and lifts the base 60 up and down.

The first shaping unit 22 is a unit that shapes wiring on the substrate placed on the base 60 of the stage 52 , and has a first printing section 72 and a baking section 74 . The first printing unit 72 has an inkjet head (see FIG. 2) 76, and the inkjet head 76 linearly ejects the metal ink. The metal ink is a dispersion of nanometer-sized metal particles in a solvent. The surfaces of the fine metal particles are coated with a dispersant to prevent aggregation in the solvent. In addition, the inkjet head 76 ejects metal ink from a plurality of nozzles by, for example, a piezo method using piezoelectric elements.

The baking section 74 has an infrared irradiation device (see FIG. 2) 78 . The infrared irradiation device 78 is a device for irradiating the ejected metal ink with infrared rays, and the metal ink irradiated with the infrared rays is baked to form wiring. Baking metal ink means that the solvent is vaporized and the protective film of the metal fine particles, that is, the dispersing agent is decomposed, by applying energy, and the metal fine particles come into contact or fuse to become conductive. This is a phenomenon in which the rate increases. Then, by baking the metal ink, a metal wiring is formed.

The second modeling unit 24 is a unit that models a resin layer on the substrate placed on the base 60 of the stage 52 , and has a second printing section 84 and a curing section 86 . The second printing unit 84 has an inkjet head (see FIG. 2) 88, and the inkjet head 88 ejects ultraviolet curable resin. An ultraviolet curable resin is a resin that is cured by irradiation with ultraviolet rays. The inkjet head 88 may be, for example, a piezo system using piezoelectric elements, or a thermal system in which resin is heated to generate bubbles and ejected from a plurality of nozzles.

The curing section 86 has a flattening device (see FIG. 2) 90 and an irradiation device (see FIG. 2) 92 . The flattening device 90 flattens the upper surface of the ultraviolet curable resin ejected by the inkjet head 88. For example, the surface of the ultraviolet curable resin is leveled and the surplus resin is scraped off with a roller or a blade. to make the thickness of the UV curable resin uniform. Further, the irradiation device 92 has a mercury lamp or an LED as a light source, and irradiates the discharged ultraviolet curable resin with ultraviolet rays. As a result, the discharged ultraviolet curable resin is cured to form a resin layer.

The third molding unit 26 is a unit for molding a connection portion between an electrode and a wiring of an electronic component on the substrate placed on the base 60 of the stage 52. The third printing unit 100 and the heating unit 102 have. The third printing unit 100 has a dispenser (see FIG. 2) 106, and the dispenser 106 ejects a conductive resin paste. The conductive resin paste is made by dispersing micrometer-sized metal particles in a resin that hardens when heated at a relatively low temperature. Incidentally, the metal particles are in the form of flakes, and the viscosity of the conductive resin paste is relatively higher than that of the metal ink. The discharge amount of the conductive resin paste by the dispenser 106 is controlled by the discharge time.

The heating unit 102 has a heater (see FIG. 2) 108 . The heater 108 is a device for heating the discharged conductive resin paste, and the resin in the heated conductive resin paste is cured. At this time, in the conductive resin paste, the hardened resin shrinks, and the flake-like metal particles dispersed in the resin come into contact with each other. Thereby, the conductive resin paste exhibits conductivity. Moreover, the resin of the conductive resin paste is an organic adhesive, and exerts its adhesive strength by being hardened by heating.

The mounting unit 27 is a unit for mounting electronic components on the substrate placed on the base 60 of the stage 52 , and has a supply section 110 and a mounting section 112 . The supply unit 110 has a plurality of tape feeders (see FIG. 2) 114 that feed taped electronic components one by one, and supplies the electronic components at the supply position. Note that the supply unit 110 is not limited to the tape feeder 114, and may be a tray-type supply device that picks up and supplies electronic components from a tray. Moreover, the supply unit 110 may be configured to include both a tape type and a tray type, or other types of supply devices.

The mounting section 112 has a mounting head (see FIG. 2) 116 and a moving device (see FIG. 2) 118 . The mounting head 116 has a suction nozzle (not shown) for sucking and holding the electronic component. The suction nozzle is supplied with negative pressure from a positive/negative pressure supply device (not shown), and sucks and holds the electronic component by sucking air. Then, the electronic component is released by supplying a slight positive pressure from the positive/negative pressure supply device. Further, the moving device 118 moves the mounting head 116 between the position where the electronic components are supplied by the tape feeder 114 and the substrate placed on the base 60 . Thus, in the mounting section 112, the electronic component supplied from the tape feeder 114 is held by the suction nozzle, and the electronic component held by the suction nozzle is mounted on the board.

The control device 28 also includes a controller 120 and a plurality of drive circuits 122, as shown in FIG. The plurality of drive circuits 122 includes the electromagnetic motors 38 and 56, the holding device 62, the lifting device 64, the inkjet head 76, the infrared irradiation device 78, the inkjet head 88, the flattening device 90, the irradiation device 92, the dispenser 106, the heater 108, It is connected to a tape feeder 114 , a mounting head 116 and a moving device 118 . The controller 120 includes a CPU, ROM, RAM, etc., is mainly a computer, and is connected to a plurality of drive circuits 122 . Accordingly, the controller 120 controls the operations of the conveying device 20 , the first shaping unit 22 , the second shaping unit 24 , the third shaping unit 26 , and the mounting unit 27 .

In the circuit forming apparatus 10, the resin layered body is formed on the substrate (see FIG. 3) 70, and the wiring is formed on the upper surface of the resin layered body. Then, the electrodes of the electronic component are electrically connected to the wiring via the conductive resin paste. At this time, the electronic component is fixed to the substrate 70 by the adhesive force of the conductive resin paste.

Specifically, the substrate 70 is set on the base 60 of the stage 52 , and the stage 52 is moved below the second modeling unit 24 . Then, in the second modeling unit 24, the resin laminate 130 is formed on the substrate 70, as shown in FIG. The resin layered body 130 is formed by repeating the ejection of the ultraviolet curable resin from the inkjet head 88 and the irradiation of the ultraviolet ray by the irradiation device 92 to the ejected ultraviolet curable resin.

Specifically, in the second printing section 84 of the second modeling unit 24 , the inkjet head 88 ejects the ultraviolet curable resin onto the upper surface of the substrate 70 in the form of a thin film. Subsequently, when the ultraviolet curable resin is discharged in the form of a thin film, the ultraviolet curable resin is flattened by the flattening device 90 in the curing section 86 so that the film thickness of the ultraviolet curable resin becomes uniform. Then, the irradiation device 92 irradiates the thin film-like ultraviolet curable resin with ultraviolet rays. Thereby, a thin resin layer 132 is formed on the substrate 70 .

Subsequently, the inkjet head 88 ejects a thin film of ultraviolet curable resin onto the thin resin layer 132 . Then, the flattening device 90 flattens the thin film of ultraviolet curable resin, and the irradiation device 92 irradiates the ultraviolet curable resin discharged in the thin film with ultraviolet rays, thereby forming a thin film on the resin layer 132 . A thin film resin layer 132 is laminated. In this way, the resin layered body 130 is formed by repeating the ejection of the ultraviolet curable resin onto the thin resin layer 132 and the irradiation of the ultraviolet rays to laminate a plurality of resin layers 132 .

After the resin laminate 130 is formed by the procedure described above, the stage 52 is moved below the first modeling unit 22 . Then, in the first printing unit 72 of the first modeling unit 22, the inkjet head 76 linearly ejects the metal ink 134 onto the upper surface of the resin laminate 130 according to the circuit pattern, as shown in FIG. Subsequently, the infrared irradiation device 78 irradiates the metal ink 134 ejected according to the circuit pattern with infrared rays in the baking section 74 of the first modeling unit 22 . Thereby, the metal ink 134 is baked, and the wiring 136 is formed on the resin laminate 130 .

Subsequently, when the wiring 136 is formed on the resin laminate 130 , the stage 52 is moved below the third modeling unit 26 . Then, in the third printing section 100 of the third modeling unit 26, the dispenser 106 dispenses the conductive resin paste 137 onto the ends of the wirings 136, as shown in FIG. Thus, when the conductive resin paste 137 is discharged to the end of the wiring 136 , the stage 52 is moved below the mounting unit 27 . In the mounting unit 27 , an electronic component (see FIG. 7) 138 is supplied by the tape feeder 114 and the electronic component 138 is held by the suction nozzle of the mounting head 116 . The electronic component 138 is composed of a component body 139 and a plurality of electrodes 140, as shown in FIG. The electronic component 138 is a QFP (Quad Flat Package), and electrodes 140 extend from four side surfaces of the component body 139 . The tip of the electrode 140 extends downward beyond the bottom surface of the component body 139 , and there is a height difference between the bottom end of the electrode 140 and the bottom surface of the component body 139 . The height difference between the lower end of the electrode 140 and the bottom surface of the component body 139 is set to 100±50 μm including the tolerance.

The electronic component 138 having such structure is held in the component body 139 by the suction nozzle of the mounting head 116 . Then, the mounting head 116 is moved by the moving device 118, and the electronic component 138 held by the suction nozzle is mounted on the upper surface of the resin laminate 130, as shown in FIG. At this time, the electronic component 138 is mounted on the upper surface of the resin laminate 130 so that the electrodes 140 of the electronic component 138 are in contact with the conductive resin paste 137 discharged onto the wiring 136 .

When the electronic component 138 is mounted on the resin laminate 130 in this way, the stage 52 is moved below the third modeling unit 26 . Then, the conductive resin paste 137 is heated by the heater 108 in the heating section 102 of the third modeling unit 26 . As a result, the conductive resin paste 137 exhibits conductivity, and the electrode 140 is electrically connected to the wiring 136 via the conductive resin paste 137, thereby forming a circuit. Further, the adhesive force of the conductive resin paste 137 allows the electronic component 138 to adhere to the wiring 136 , thereby fixing it to the resin laminate 130 .

However, in the above method, since the electronic component 138 is fixed to the wiring 136 by the conductive resin paste 137, the connection strength is low compared to solder mounting, and the electronic component 138 may be separated from the resin laminate 130. be. In other words, during solder mounting, the solder melts and forms an alloy with the electrode 140 and the wiring 136, resulting in an interface-less structure between the solder and the electrode 140 and the wiring 136. FIG. On the other hand, when the electrode 140 is fixed to the wiring 136 with the conductive resin paste 137 , an interface remains between the electrode 140 , the conductive resin paste 137 and the wiring 136 . Therefore, when the electronic component 138 is fixed to the wiring 136 by the conductive resin paste 137, the connection strength is lower than that of solder mounting. For this reason, it is desirable to attach the electronic component 138 to the resin laminate 130 by soldering. Therefore, when the electronic component 138 is attached to the resin laminate 130 , not only the electrodes 140 but also the component body 139 may be fixed to the resin laminate 130 with the conductive resin paste 137 .

Specifically, when the conductive resin paste 137 is discharged onto the resin laminate 130, as shown in FIG. While the paste 137a is being discharged, the conductive resin paste 137b is also being discharged to the position where the component body 139 is to be mounted. However, as described above, there is a height difference of 100±50 μm between the bottom surface of the component body 139 and the lower end of the electrode 140 . Therefore, it is necessary to change the discharge condition of the conductive resin paste 137a to the mounting position of the electrode 140 and the discharge condition of the conductive resin paste 137b to the mounting position of the component body 139. FIG.

For example, it is necessary to make the ejection time of the conductive resin paste 137b to the intended mounting position of the component body 139 longer than the ejection time of the conductive resin paste 137a to the intended mounting position of the electrode 140 . Further, for example, the viscosity of the conductive resin paste 137b that is discharged onto the planned mounting position of the component body 139 needs to be higher than the viscosity of the conductive resin paste 137a that is discharged onto the planned mounting position of the electrode 140 . In such a case, two dispensers are required to discharge the conductive resin paste 137 with different viscosities. Further, for example, using two dispensers with different nozzle diameters, the dispenser with a large nozzle diameter discharges the conductive resin paste 137b to the mounting position of the component body 139, and the dispenser with a small nozzle diameter discharges the electrode 140. It is necessary to discharge the conductive resin paste 137a to the intended mounting position.

In this manner, by changing the discharge conditions of the conductive resin paste 137a and the discharge conditions of the conductive resin paste 137b, the height dimension of the conductive resin paste 137b can be changed to that of the conductive resin paste as shown in FIG. It can be higher than the height dimension of 137a. The height difference between the conductive resin paste 137b and the conductive resin paste 137a must be greater than or approximately equal to the height difference between the component body 139 and the electrode 140. FIG.

Then, as shown in FIG. 9, the electronic component 138 is formed into the resin laminate so that the tip of the electrode 140 is in contact with the conductive resin paste 137a and the bottom surface of the component body 139 is in contact with the conductive resin paste 137b. It is mounted on 130. As a result, the conductive resin paste 137 a adheres to the tip of the electrode 140 , and the conductive resin paste 137 b adheres to the bottom surface of the component body 139 . By heating the conductive resin paste 137 , the electrode 140 is electrically connected to the wiring 136 via the conductive resin paste 137 . The electrode 140 is fixed to the wiring 136 by the adhesive strength of the conductive resin paste 137a, and the component body 139 is fixed to the resin laminate 130 by the adhesive strength of the conductive resin paste 137b. That is, the electronic component 138 is fixed to the resin laminate 130 by the conductive resin paste 137 not only at the electrodes 140 but also at the component body 139 . Thereby, the electronic component 138 can be firmly fixed to the resin laminate 130 .

However, in such a method, as described above, the condition for discharging the conductive resin paste 137a to the planned mounting position of the electrode 140 and the condition for discharging the conductive resin paste 137b to the planned mounting position for the component body 139 are set. need to change. For example, if the ejection time is changed to change the ejection conditions, the control of the dispenser becomes complicated, and there is a possibility that the tact time will become longer. In addition, in order to change the viscosity of the conductive resin paste 137 and change the diameter of the nozzle for discharging the conductive resin paste 137 as changes in the discharge conditions, it is necessary to increase the number of dispensers, which is preferable from the viewpoint of cost. do not have.

In view of this, in the circuit forming apparatus 10, a convex portion is formed at the mounting position of the component body 139, and the component body 139 is fixed by the conductive resin paste 137 to the convex portion. Specifically, when the resin layered body 130 is formed on the substrate 70 and the wiring 136 is formed on the resin layered body 130, the electronic component is formed in the second molding unit 24 as shown in FIG. A protruding portion 150 is formed at a planned mounting position of the component body 139 of 138 . Since the protrusion 150 is formed by laminating the resin layers 132 in the same manner as the resin layered body 130, a detailed description of the method for forming the protrusion 150 is omitted. In addition, the length dimension in the X direction and the Y direction of the convex portion 150 is approximately the same as the length dimension of the component body 139 . Also, the length dimension in the Z direction of the projection 150 , that is, the height dimension is set according to the height difference between the component body 139 of the electronic component 138 and the electrode 140 . The height dimension of the convex portion 150 will be described later in detail.

Then, when the projected portion 150 is formed at the planned mounting position of the component main body 139, in the third molding unit 26, as shown in FIG. While the conductive resin paste 137 a is discharged, the conductive resin paste 137 b is also discharged onto the planned mounting position of the component body 139 , that is, the upper surface of the convex portion 150 . At this time, since the convex portion 150 is formed at the planned mounting position of the component body 139, the discharge condition of the conductive resin paste 137a to the planned mounting position of the electrode 140 and the conductivity of the conductive resin paste 137a to the planned mounting position of the component body 139 are determined. The ejection conditions are the same as those for the resin paste 137b. That is, the same kind of conductive resin paste 137 is discharged from one dispenser 106 to the planned mounting position of the electrode 140 and the planned mounting position of the component body 139 . The discharge time of the conductive resin paste 137a to the planned mounting position of the electrode 140 and the discharge time of the conductive resin paste 137b to the planned mounting position of the component body 139 are the same. Therefore, the discharge amount of the conductive resin paste 137a discharged at one time from the dispenser 106 to the planned mounting position of the electrode 140 and the conductive resin paste discharged at one time from the dispenser 106 to the planned mounting position of the component body 139 137b is substantially the same. As a result, the height dimension of the conductive resin paste 137a ejected to the intended mounting position of the electrode 140 and the height dimension of the conductive resin paste 137b ejected to the intended mounting position of the component body 139 are substantially the same. .

Moreover, the conductive resin paste 137b discharged to the mounting position of the component main body 139 is discharged onto the upper surface of the convex portion 150 in a point-like manner so as not to come into contact with each other. That is, for example, as shown in FIG. 12, a plurality of conductive resin pastes 137b are discharged onto the upper surfaces of the convex portions 150, and two dots of the conductive resin paste adjacent to each other on the plurality of convex portions 150 at that time are discharged. The distance between the pastes 137b is made larger than the landing diameter of the conductive resin paste 137b, that is, the diameter of the conductive resin paste 137b ejected in a generally circular shape. Accordingly, the plurality of conductive resin pastes 137b discharged onto the upper surface of the convex portion 150 do not contact each other. The plurality of conductive resin pastes 137b ejected onto the upper surface of the convex portion 150 may be arranged in a grid pattern as shown in FIG. They may be arranged in a grid pattern.

In this manner, the conductive resin paste 137b is discharged onto the planned mounting position of the component body 139, that is, the upper surface of the projection 150, and the conductive resin paste is discharged onto the planned mounting position of the electrode 140, that is, the end of the wiring 136. A paste 137a is discharged. That is, as shown in FIG. 11 , by forming the convex portion 150 on the upper surface of the resin laminate 130 , the convex portion 150 becomes a step portion, and the lower surface of the step portion, that is, the upper surface of the resin laminate 130 A wire 136 is located. Then, the upper surface of the resin laminate 130 where the end of the wiring 136 is located becomes the intended mounting position of the electrode 140 , and the conductive resin paste 137 a is discharged onto the upper surface of the resin laminate 130 . On the other hand, the upper surface of the stepped portion, that is, the upper surface of the convex portion 150 is the planned mounting position of the component body 139 , and the conductive resin paste 137 b is discharged onto the upper surface of the convex portion 150 .

Then, when the conductive resin paste 137 is discharged to the positions where the electrodes 140 and the component body 139 are to be mounted, as shown in FIG. Electronic component 138 is mounted on resin laminate 130 so that the bottom surface of component body 139 contacts 137b. As a result, the conductive resin paste 137 a adheres to the tip of the electrode 140 , and the conductive resin paste 137 b adheres to the bottom surface of the component body 139 . By heating the conductive resin paste 137 , the electrode 140 is electrically connected to the wiring 136 via the conductive resin paste 137 . The electrode 140 is fixed to the wiring 136 by the adhesive strength of the conductive resin paste 137a, and the component body 139 is fixed to the resin laminate 130 by the adhesive strength of the conductive resin paste 137b. That is, the electronic component 138 is fixed to the resin laminate 130 by the conductive resin paste 137 not only at the electrodes 140 but also at the component body 139 . Thereby, the electronic component 138 can be firmly fixed to the resin laminate 130 .

Further, by forming the convex portion 150 on the upper surface of the resin laminate 130 , the planned mounting position of the component body 139 is raised by the convex portion 150 . As a result, the height difference between the bottom surface of the component body 139 and the lower end of the electrode 140 is offset by the protrusion 150 , and the distance between the top surface of the protrusion 150 and the bottom surface of the component body 139 and the tip of the electrode 140 and the distance between the top surface of the wiring 136 is reduced. For this reason, it is possible to set the conditions for discharging the conductive resin paste 137 to the predetermined mounting position of the component body 139 and the predetermined mounting position of the electrode 140 to be the same. This makes it possible to fix not only the electrode 140 but also the component body 139 of the electronic component 138 to the resin laminate 130 using one type of conductive resin paste 137 without adding a dispenser. In addition, the time for one discharge of the conductive resin paste by the dispenser to the planned mounting position of the component body 139 is the same as the time for one discharge of the conductive resin paste by the dispenser to the planned mounting position of the component body 139. , and the control of the dispenser can be simplified.

In addition, the conductive resin paste 137b is discharged in the shape of dots at the planned mounting position of the component body 139, that is, on the upper surface of the convex portion 150 so as not to come into contact with each other. In other words, there are gaps to some extent between the plurality of dot-like conductive resin pastes 137b ejected onto the upper surface of the convex portion 150 . Therefore, even if the component body 139 adheres to the conductive resin paste 137b discharged onto the upper surface of the convex portion 150, the conductive resin paste 137b stays on the upper surface of the convex portion 150 and is Do not stick out. As a result, contact between the conductive resin paste 137a discharged onto the end of the wiring 136 and the conductive resin paste 137b discharged onto the upper surface of the projection 150 is suppressed. A short circuit of the electronic component 138 can be preferably prevented.

The height dimension of the projection 150 is determined according to the height difference between the component body 139 of the electronic component 138 and the electrode 140, as described above. Here, the height difference between the component body 139 and the electrode 140 is set to 100±50 μm including the tolerance. Therefore, for example, by setting the height dimension of the protrusion 150 to 100 μm, the distance between the bottom surface of the component body 139 and the top surface of the protrusion 150 and the distance between the tip of the electrode 140 and the top surface of the resin laminate 130 are reduced. The difference between the distances between the two can be reduced on average. On the other hand, when the height dimension of the projection 150 is 100 μm, if the height difference between the component body 139 and the electrode 140 is 50 μm, the distance between the tip of the electrode 140 and the upper surface of the resin laminate 130 is The thickness is 50 μm, and the electrode 140 and the wiring 136 may not be connected through the conductive resin paste 137a. Therefore, in order to prioritize the connection between the electrode 140 and the wiring 136, it is preferable to set the height dimension of the projection 150 to 50 to 100 μm. However, when the viscosity of the conductive resin paste 137 is high and the height dimension of the conductive resin paste 137 can be increased, the connection between the electrode 140 and the wiring 136 via the conductive resin paste 137 is ensured. It is also possible to set the height dimension of the convex portion 150 to 100 to 150 μm. Therefore, considering the viscosity of the conductive resin paste 137, the dimensional accuracy of the electronic component 138, the design concept of the circuit, etc., the height dimension of the projection 150 should be determined according to the distance between the component body 139 of the electronic component 138 and the electrode 140. It is sized according to the height difference.

2, the controller 120 of the control device 28 has a formation section 160, an application section 162, and a placement section 164. As shown in FIG. Forming part 160 is a functional part for forming convex part 150 on the upper surface of resin laminate 130 . The application part 162 is a functional part for applying the conductive resin paste 137 to the upper surface of the convex part 150 and the upper surface of the resin laminate 130 . The mounting portion 164 is arranged so that the component body 139 contacts the conductive resin paste 137b applied on the upper surface of the convex portion 150 and the electrode 140 contacts the conductive resin paste 137a applied on the upper surface of the resin laminate 130. Second, it is a functional portion for placing the electronic component 138 on the resin laminate 130 .

In addition, in the above embodiment, the circuit forming apparatus 10 is an example of a component mounting apparatus. The second modeling unit 24 is an example of a forming device. The third modeling unit 26 is an example of a coating device. The mounting unit 27 is an example of a holding device. The resin laminate 130 is an example of a base material. The resin layer 132 is an example of a resin layer. The conductive resin paste 137 is an example of a conductive adhesive. Electronic component 138 is an example of an electronic component. The component body 139 is an example of a component body. Electrode 140 is an example of an electrode. The convex portion 150 is an example of a stepped portion. The process performed by the forming unit 160 is an example of the forming process. The process executed by the coating section 162 is an example of the coating process. The process executed by the placing section 164 is an example of the placing process.

It should be noted that the present invention is not limited to the above embodiments, and can be implemented in various modes with various modifications and improvements based on the knowledge of those skilled in the art. For example, in the above-described embodiment, the convex portion 150 is formed on the upper surface of the resin laminate 130 so that the convex portion 150 serves as a stepped portion. The concave portion may be used as a stepped portion. When a recess is formed in this way, wiring is formed on the bottom surface of the recess, and the electrode 140 is connected to the wiring via the conductive resin paste 137 . Further, a component body 139 is connected via a conductive resin paste 137 to the upper surface of the resin laminate 130 where the recess is not formed. That is, the component body 139 is fixed to the upper surface of the recess by the conductive resin paste 137, and the electrode 140 is fixed to the lower surface of the recess by the conductive resin paste 137.

Further, in the above embodiment, the electrode 140 is connected to the wiring 136 via the conductive resin paste 137. However, if the electrode 140 is energized, the electrode 140 is connected to the pad via the conductive resin paste 137. , land or the like.

Also, in the above embodiment, the resin laminate 130 is made of an ultraviolet curable resin, but may be made of a thermosetting resin, a two-liquid mixing type curable resin, a thermoplastic resin, or the like.

Also, in the above embodiment, the conductive resin paste 137 is discharged by the dispenser 106, but may be transferred by a transfer device or the like. Alternatively, the conductive resin paste 137 may be printed by screen printing.

10: Circuit forming device (component mounting device) 24: Second shaping unit (forming device) 26: Third shaping unit (coating device) 27: Mounting unit (holding device) 130: Resin laminate (base material) 132: Resin Layer 137: Conductive resin paste (conductive adhesive) 138: Electronic component 139: Component body 140: Electrode 150: Convex part (stepped part) 160: Forming part 160 (formation process) 162: Application part (application process) 164 : Mounting section (mounting process)

Claims (5)

A method for mounting an electronic component on a substrate, the electronic component comprising a component body and an electrode extending downward from the bottom surface of the component body, comprising:
a forming step of forming a stepped portion on the upper surface of the base;
an application step of applying a conductive adhesive to the upper surface and the lower surface of the stepped portion;
The electronic components are arranged such that the component body is in close contact with the conductive adhesive applied to the upper surface of the step portion, and the electrode is in close contact with the conductive adhesive applied to the lower surface of the step portion. a placing step of placing the component on the upper surface of the substrate;
The forming step includes
A component mounting method for forming the stepped portion having a height dimension corresponding to at least one of the viscosity of the conductive adhesive and the dimensional accuracy of the electronic component in addition to the height difference between the bottom surface of the component body and the tip of the electrode. . The coating step includes
2. The component mounting method according to claim 1, wherein when the conductive adhesive is applied to the upper surface of the stepped portion, the conductive adhesive is applied in the form of dots so as not to come into contact with each other. The coating step includes
3. The component mounting method according to claim 1, wherein the conductive adhesive is applied to the upper surface and the lower surface of the step portion under the same application conditions. The forming step includes
4. The component mounting method according to any one of claims 1 to 3, wherein a resin layer is formed by applying a curable resin in the form of a thin film, and the stepped portion is formed by stacking the resin layers. . a holding device for holding an electronic component composed of a component body and an electrode extending downward from the bottom surface of the component body;
a forming device for forming a stepped portion on the upper surface of the substrate;
a coating device that applies a conductive adhesive to the upper surface and the lower surface of the stepped portion,
The forming device is
forming the stepped portion having a height dimension corresponding to at least one of the viscosity of the conductive adhesive and the dimensional accuracy of the electronic component in addition to the height difference between the bottom surface of the component body and the tip of the electrode;
The holding device is
The electronic device is arranged such that the component body is in close contact with the conductive adhesive applied to the upper surface of the step portion, and the electrode is in close contact with the conductive adhesive applied to the lower surface of the step portion. A component mounting device that mounts a component on the upper surface of a base material.

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