JP2000200953A - Mounting structure and mounting method of electronic components - Google Patents

Abstract

PROBLEM TO BE SOLVED: To effectively suppress cracks from occurring due to conductive adhesive via which a surface-mounting type electronic component having an insulation material-made shell, and terminal electrodes exposed on the surface of the shell is mounted on board electrodes disposed on board made of an insulation material. SOLUTION: A laminated ceramic chip capacitor 11 has a pair of terminal electrodes 13 on the facing side faces of a body chip 12. A board 14 has a pair of board electrodes 15 with an area set relatively small. The laminated ceramic capacitor 11 is mounted at a specified load and time condition on an Ag paste 16 printed with center at the board electrodes 15 on the board 14, the Ag paste 16 is heated to harden so that in its hardened state the terminal electrodes 13 are electrically connected to the board electrodes 15 through this paste 16, and the periphery of the paste 16 periphery is bonded to the body chip 12 and the board 14 in the surface contact state.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure and a mounting method for a surface mount electronic component having an outer shell member made of an insulating material and a terminal electrode exposed on the surface of the outer shell member.
More particularly, the present invention relates to a mounting structure and a mounting method of a surface mount electronic component in which a conductive adhesive is used for mounting.

[0002]

2. Description of the Related Art In recent years, in an electronic circuit device such as an HIC (hybrid integrated circuit), when mounting a surface-mounted electronic component on a substrate, Pb-free or de-fluorocarbon (a flux residue cleaning step becomes unnecessary). For the purpose of (1), many mounting structures using a conductive adhesive such as Ag paste have been adopted in place of the well-known mounting structure by reflow soldering. An example of such a mounting structure is shown. The example of FIG.
Substrate 1 made of an insulating material such as ceramic or resin
1 shows a state in which a multilayer ceramic chip capacitor 2 for surface mounting provided with a pair of terminal electrodes 2 a is mounted, and at the time of mounting, screen printing is performed on a pair of substrate electrodes 3 formed on the substrate 1. Then, the Ag paste 4 is transferred, and the multilayer ceramic chip capacitor 2 is mounted on the Ag paste 4 under predetermined load and time conditions, and then the Ag paste 4 is cured.

[0003]

A high-temperature test (for example, one sample) is performed on a plurality of samples having the above-described mounting structure.
(At 50 ° C. for 1000 hours).
It was found that there was a sample in which cracks occurred and the bondability between the two deteriorated. It is considered that such cracks are generated due to the following reasons.

That is, in the mounting structure by reflow soldering, the flux component in the solder paste removes oxides and organic contaminants on the terminal electrode and the substrate electrode on the electronic component side, and the like. Since the solder and the electrode material are metal-bonded in accordance with the reflow heating, there is a characteristic that the joining state is less dependent on the electrode material. On the other hand, in the case of a mounting structure as shown in FIG. 19 using an Ag paste, the binder resin of the Ag paste 4 is independently present in the Ag paste 4 as the binder resin cures and contracts. The Ag filler is connected (connected) in a chain shape and at the same time is in a state of being joined to the terminal electrode 2 a and the substrate electrode 3. For this reason,
Due to the fact that it is easily affected by the physical properties of the electrode material (especially the physical properties of the surface), the bonding strength between the terminal electrode 2a and the substrate electrode 3 and the Ag paste 4 is not reduced as compared with the case of soldering. This is considered to cause the above-mentioned cracks.

[0005] The inventors of the present invention have examined in detail where cracks occur in the Ag paste 4 at the time of conducting the high temperature test as described above.
As a result, it was found that cracks in the Ag paste 4 mainly occurred near the joints between the terminal electrode 2 a and the substrate electrode 3. That is, it is considered that a crack is generated at a joint portion between the terminal electrode 2 a and the substrate electrode 3 having a small joining force according to the heat shrinkage of the Ag paste 4 at a high temperature. On the other hand, the Ag paste 4 is used for a ceramic (for example, alumina) as a material of a shell member of the substrate 3 or the multilayer ceramic chip capacitor 2 or an insulating material (resin or ceramic) constituting the substrate 3. There is a situation that the bondability is better than that of a metal material.

The present invention has been made in view of the above circumstances, and has as its object to provide a surface member having an outer shell member made of an insulating material and a terminal electrode exposed on the surface of the outer shell member. When mounting electronic components on a substrate electrode placed on a substrate made of insulating material via a conductive adhesive, cracks can be effectively suppressed by the conductive adhesive and mounted. An object of the present invention is to provide a mounting structure and a mounting method of an electronic component that can realize improvement in reliability.

[0007]

In order to achieve the above object, the electronic component mounting structure described in claim 1 can be adopted. According to this mounting structure, when mounting a surface-mounted electronic component, the surface-mounted electronic component is mounted on a substrate electrode arranged on a substrate via a conductive adhesive, and then the conductive adhesive is mounted. To cure. In the state where the conductive adhesive has been cured in this way, the conductive adhesive has a portion joined to the outer shell member of the surface mount electronic component. In this case, the outer shell member of the surface mount electronic component is made of an insulating material (generally, ceramic or resin).
There is a situation that the bondability with the conductive adhesive becomes better than that of the metal material. Therefore, as described above, in the case where the conductive adhesive has a structure that is joined to the outer shell member of the surface-mounted electronic component, the strength at the joint is higher than that of the conventional structure (see FIG. 19). Will improve. As a result, even when the structure having the mounting structure as described above is placed in a high-temperature atmosphere, cracks can be effectively prevented from being generated in the conductive adhesive, and as a result, the mounting reliability is improved. Improvements can be realized.

According to the electronic component mounting structure of the present invention, when the conductive adhesive is hardened after the surface-mounted electronic component is mounted via the conductive adhesive, the conductive adhesive is applied to the electronic component. There is a portion bonded to a region other than the substrate electrode on the substrate. In this case, since the substrate is made of an insulating material (generally, a ceramic or a resin), there is a situation that the bondability with the conductive adhesive is improved as compared with the metal material. Therefore, as described above, in the case where the conductive adhesive has a structure in which a portion to be bonded to a region other than the substrate electrode on the substrate exists, the strength at the bonded portion is higher than that of the conventional structure (see FIG. 19). Will improve. Thereby, even when a structure having the above mounting structure is placed in a high-temperature atmosphere,
The generation of cracks in the conductive adhesive can be effectively suppressed, and as a result, the mounting reliability can be improved.

According to the electronic component mounting structure of the third aspect, when the conductive adhesive is cured after the surface-mounted electronic component is mounted via the conductive adhesive, the conductive adhesive is applied to the electronic component. There are portions joined to both the outer shell member of the surface mount electronic component and the region other than the substrate electrode on the substrate of the surface mount electronic component. Therefore, the strength at the joining portion is sufficiently improved as compared with the conventional structure (see FIG. 19), and even when the structure having the mounting structure as described above is placed in a high-temperature atmosphere. In addition, the occurrence of cracks in the conductive adhesive can be more effectively suppressed, and as a result, the mounting reliability can be improved.

According to the electronic component mounting structure of the present invention, even if the area of the substrate electrode is relatively small,
Since the strength of the joining portion by the conductive adhesive can be increased, the arrangement pitch of the substrate electrodes can be narrowed.

According to the electronic component mounting structure of the present invention, the substrate and the outer shell member are joined by an adhesive other than the conductive adhesive for connecting the substrate electrode and the terminal electrode. Accordingly, the overall bonding strength between the substrate and the outer shell member is improved, and the electrical connection between the substrate electrode and the terminal electrode is favorably affected.

According to an eleventh aspect of the present invention, there is provided a mounting structure for an electronic component, wherein the adhesive in the mounting structure according to the ninth aspect is a conductive adhesive applied in advance to the substrate side for mounting a surface mount electronic component. Can be applied in the same process, so that the procedure for component mounting does not have to be troublesome.

According to the electronic component mounting method of the twelfth aspect, by controlling the load applied to the electronic component in the mounting step of the surface-mounted electronic component, the conductive adhesive is cured in a state where the conductive adhesive is cured. There is a portion bonded to the outer shell member of the surface mount electronic component in the conductive adhesive.
For this reason, only by controlling the load in the mounting process, the bonding strength between the conductive adhesive and the outer shell member is improved, and the structure after the surface-mounted electronic component is mounted as described above. Even when placed in a high temperature atmosphere,
Cracks in the conductive adhesive can be effectively suppressed, and as a result, the mounting reliability can be improved.

According to the electronic component mounting method of the present invention, by controlling the load applied to the electronic component in the step of mounting the surface-mounted electronic component, the conductive adhesive is cured in a state where the conductive adhesive is cured. The portion bonded to the area other than the substrate electrode on the substrate exists in the adhesive. For this reason, only by controlling the load in the mounting process, the bonding strength between the conductive adhesive and the substrate is improved, and the structure after the above-described surface-mounted electronic components are mounted is exposed to a high-temperature atmosphere. Even when the substrate is placed, cracks in the conductive adhesive can be effectively suppressed, and as a result, the mounting reliability can be improved.

According to the electronic component mounting method of the present invention, by controlling the load applied to the electronic component in the mounting step of the surface-mounted electronic component, the conductive adhesive is cured in a state where the conductive adhesive is cured. There are portions bonded to both the outer shell member of the surface mount electronic component and the region other than the substrate electrode on the substrate in the conductive adhesive. For this reason, only by controlling the load in the mounting process, the bonding strength between the conductive adhesive and the substrate is sufficiently improved, and the structure after the surface-mounted electronic component is mounted as described above. Even in the case of being placed in a high-temperature atmosphere, the occurrence of cracks in the conductive adhesive can be more effectively suppressed, and as a result, the mounting reliability can be improved.

According to the electronic component mounting method of the present invention, in the printing step performed prior to the mounting step, the conductive adhesive has a relatively large thickness in the region including the substrate electrode on the substrate. Will be printed.
For this reason, only by controlling the load applied to the electronic component in the mounting process, the conductive adhesive can be spread and its area can be enlarged, and the conductive adhesive can be used as the outer shell member of the surface mount electronic component and Bonding to one or both of the regions other than the substrate electrode on the substrate can be ensured.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) A first embodiment of the present invention will be described below with reference to FIGS. In FIG. 1, a multilayer ceramic chip capacitor 11 for surface mounting (corresponding to a surface mounting electronic component in the present invention) is a so-called 3216 type, and is a hexahedron (3.2 mm long × 1 mm wide) made of a ceramic dielectric. A plurality of inner layer electrodes made of, for example, an Ag-Pd alloy are alternately laminated inside a main body chip 12 (corresponding to an outer shell member in the present invention) having a height of 6 mm and a height of, for example, 1.25 mm. And a pair of film-shaped terminal electrodes 13 that are electrically connected to the inner layer electrodes are formed on the opposite side surfaces (side surfaces where the inner layer electrodes are exposed) of the main body chip 12 in an exposed state. In this case, the size of the ground plane (lower projection plane) of the terminal electrode 13 is set to, for example, 0.5 mm × 1.6 mm as shown in FIG.

The substrate 14 for mounting the multilayer ceramic chip capacitor 11 having the above structure is made of, for example, a 96% alumina substrate, and a pair of substrate electrodes 15 are formed on the upper surface thereof by, for example, Cu plating. Have been. In this case, each substrate electrode 15 is set to a state (for example, about 1/4 area) whose area is smaller than the ground area of the terminal electrode 13 on the side of the multilayer ceramic chip capacitor 11, as shown in FIG. 0.2mm ×
The size is set to 1.0 mm. Although the wiring drawn from the substrate electrode 15 is not shown, the wiring may be formed on the wiring pattern formed on the substrate 14 or on the substrate 14.
Can be constituted by the through-hole wiring formed in the substrate.

The above multilayer ceramic chip capacitor 11
Is mounted on the substrate 14 using an Ag paste 16 (corresponding to a conductive adhesive in the present invention). Specifically, before this mounting, the Ag paste 16
Screen printing with a thickness of, for example, 70 ± 20 μm is performed at each position around the pair of substrate electrodes 15 on the substrate 14, and the printing size is 0.35 mm × 1 as shown in FIG. It is set to about 4 mm. The Ag paste 16 uses an amine-curable epoxy resin as a binder, and the mixing ratio of the Ag filler and the epoxy resin is set to 80:20 (Wt%).

Then, the multilayer ceramic chip capacitor 11 is placed on the Ag paste 16 with a load of 1%.
(N), mounting is performed under the condition that the time is 0.5 (second).
Then, as shown in FIG. 1, the Ag paste 16 is spread out between the multilayer ceramic chip capacitor 11 and the substrate 14, so that the ground area is increased. By performing the heat treatment under predetermined conditions, the Ag paste 16 is cured,
Thus, the terminal electrode 13 and the substrate electrode 15 are electrically connected by the Ag filler in the Ag paste 16. Then, when the Ag paste 16 is cured as described above, the peripheral edge of the Ag paste 16 is joined to each of the main body chip 12 and the substrate 14 of the multilayer ceramic chip capacitor 11 in a surface contact state. . When mounting the multilayer ceramic chip capacitor 11, the chip capacitor 11
Alternatively, the shape of the Ag paste 16 can be controlled by vibrating the substrate 14.

In this case, since the main chip 12 and the substrate 14 of the multilayer ceramic chip capacitor 11 are each made of ceramic, the Ag paste 1
There is a situation that the bondability with No. 6 is better than that of a metal material. Therefore, when the peripheral portion of the Ag paste 16 is joined to the main body chip 12 and the substrate 14 in a surface contact state as in the above-described embodiment, the strength at the joint portion is obtained. Is improved as compared with the conventional structure (see FIG. 19). Accordingly, even when the Ag paste 16 contracts due to a temperature rise or the like, it is possible to effectively suppress the occurrence of cracks in the Ag paste 16 and increase the adhesive strength of the multilayer ceramic chip capacitor 11. As a result, the mounting reliability can be improved. Moreover,
In the present embodiment, the area of the substrate electrode 15 is made relatively small. However, even with such a configuration, the strength of the bonding portion formed by the Ag paste 16 can be increased as described above. There is an advantage that the arrangement pitch can be reduced.

In order to demonstrate the effect of improving the adhesive strength as described above, a plurality of samples of the structure on which the multilayer ceramic chip capacitor 11 is mounted in the mounting structure according to the present embodiment, and the conventional mounting structure are used. FIG. 3 shows the results of actually measuring the adhesive strength of the capacitor 11 for a plurality of samples of the structure on which the ceramic chip capacitor 11 was mounted.

In the first embodiment, the periphery of the Ag paste 16 is bonded to both the main body chip 12 and the substrate 14. However, the Ag paste 16 is bonded to at least one of the main body chip 12 and the substrate 14. If a mounting structure is used, the intended purpose can be achieved.

In the first embodiment, the multilayer ceramic chip capacitor 11 has been described as an example of the surface mount electronic component. However, an electronic component having a terminal structure similar to this (for example, a square chip resistor) may be used. The present invention can be applied to, for example, surface mount electronic components as shown in FIGS. 4, 5, and 6, respectively. That is, a tantalum chip electrolytic capacitor 101 having a pair of terminal electrodes 101a having a shape as shown in FIG. 4 and a main body chip 101b (outer shell member) made of a molded resin may be mounted. Further, a surface-mounted electronic component having a terminal structure similar to that of the chip / tantalum electrolytic capacitor 101, such as a small surface-mounted type diode or a Zener diode, can be used. As shown in FIG. 5, a pair of terminal electrodes 1 are formed on the lower surface of a ceramic substrate 102a (an outer shell member) on which a surface-mounting quartz oscillator 102 (not shown) is mounted.
02b, and the upper surface is covered with a resin case 102c), or a surface-mounted electronic component having a terminal structure equivalent to this may be the mounting target. An SOP or Q having a package 103a and a gull-wing-shaped lead electrode 103b (terminal electrode) group as shown in FIG.
FP type surface mount electronic component 103 (for example, IC chip,
For example, a collective resistor for surface mounting) may be mounted.

(Second Embodiment) In the first embodiment, the area of the substrate electrode 15 itself is set to be relatively small. However, it is sufficient if the exposed area is set to be relatively small. It is. FIG. 4 shows a second embodiment of the present invention adopting such a configuration, and only the portions different from the first embodiment will be described below.

In FIG. 7, a pair of substrate electrodes 17 having a larger area than the substrate electrodes 14 in the first embodiment is formed at the mounting position of the multilayer ceramic chip capacitor 11 on the substrate 14 by, for example, Cu plating. An insulating material such as glass or resin is formed on the upper surface of the substrate 14 so as to cover the substrate electrode 17 in a partially exposed state (for example, in a state where only the area of 0.2 mm × 1.0 mm is exposed). A protection film 18 is formed.

Also, in this embodiment, when the multilayer ceramic chip capacitor 11 is mounted, A is placed on each position of the pair of substrate electrodes 17 on the substrate 14.
The g paste 16 is screen-printed to the same size as in the first embodiment, and the multilayer ceramic chip capacitor 11 is placed on the Ag paste 16 with a load of 1%.
(N) After mounting under the condition that the time is 0.5 (second), heat treatment is performed under predetermined conditions to cure the Ag paste 16. In the state where the Ag paste 16 is thus hardened, the terminal electrode 13 and the substrate electrode 17 are electrically connected by the Ag filler in the Ag paste 16, and the periphery of the Ag paste 16 is The main body chip 12 and the protective film 18 on the substrate 14 are joined in a surface contact state.

Therefore, the second embodiment having such a configuration can provide the same effects as those of the first embodiment. In particular, according to the present embodiment, there is an advantage that restrictions on the shape of the substrate electrode 17 are reduced.

(Third Embodiment) FIG. 8 shows a third embodiment of the present invention having the same effects as those of the first embodiment. Only the parts which differ from the first embodiment will be described below. explain. That is, in FIG. 8, the surface mount electronic component to be mounted in the present embodiment is the surface mount aluminum electrolytic capacitor 1.
9, which has a structure in which a base part 21 (corresponding to an outer shell member in the present invention) made of resin is provided at the base part of the capacitor body 20, and a pair of terminal electrodes is provided on the lower surface of the base part 21. 22 is provided in an exposed state.

Such a surface mount aluminum electrolytic capacitor 1
9 is mounted on the substrate 14, the capacitor 19
Is mounted on the Ag paste 16 printed on the substrate electrode 15 on the substrate 14 under predetermined conditions, and then the Ag paste 16 is cured. In a state where the Ag paste 16 is thus hardened, the terminal electrode 22 and the substrate electrode 15 are electrically connected by the Ag filler in the Ag paste 16 and the periphery of the Ag paste 16 is connected to the surface mount aluminum electrolytic capacitor. The base member 21 and the substrate 19 are joined in surface contact with each other. In this case, since the base portion 21 is made of resin and the substrate 14 is made of ceramic, there is a situation that the bondability with the Ag paste 16 is better than that of a metal material. Therefore, as described above,
The periphery of the Ag paste 16 is the base portion 21 and the substrate 1
4 are joined in a surface contact state, the strength at the joint is the conventional structure (FIG. 1).
9).

(Fourth Embodiment) FIG. 9 shows a fourth embodiment of the present invention. Only the portions different from the first embodiment will be described below. In the fourth embodiment,
A slit 13a (corresponding to an exposure window in the present invention) is formed in the terminal electrode 13, and the main body chip 12 is partially exposed through the slit 13a.
For this reason, in a state where the terminal electrode 13 and the substrate electrode 15 are electrically connected by the Ag paste 16, the Ag paste 16 can be connected to the main chip 12 through the slit 13 a.
Are joined in a surface contact state.

As described above, the slit 13 a is formed in the terminal electrode 13.
The same effect as that of the first embodiment can be obtained also in the case where the structure is formed. The slits 13a may be formed at a plurality of locations on the terminal electrode 13. In the example of FIG. 9, the substrate electrode 15 is formed to have a larger area than that of the first embodiment, and the periphery of the Ag paste 16 disposed on the substrate electrode 15 terminates in the substrate electrode 15. However, by printing the Ag paste 16 so as to protrude from the substrate electrode 15 or by setting the substrate electrode 15 to a state smaller than the ground area of the terminal electrode 13 as in the first embodiment, The mounting structure may be such that the peripheral portion of the paste 16 is joined to the substrate 14 in a surface contact state.

(Fifth Embodiment) FIG. 10 shows a fifth embodiment of the present invention.
Only parts different from the embodiment will be described. In the fifth embodiment, the substrate electrode 15 is formed to have a larger area than that of the first embodiment, and a slit 15a (corresponding to an exposure window in the present invention) is formed in the substrate electrode 15.
The substrate 14 is partially exposed through a. Thereby, the terminal electrode 13 is formed by the Ag paste 16.
In a state where the substrate paste and the substrate electrode 15 are electrically connected, the Ag paste 16 is applied to the substrate 14 through the slit 15a.
Are joined in a surface contact state.

As described above, the slit 15a is formed in the substrate electrode 15.
The same effect as that of the first embodiment can be obtained also in the case where the structure is formed. The slits 15a may be formed at a plurality of locations on the substrate electrode 15. In the example of FIG. 10, the substrate electrode 15 is formed to have a larger area than that of the first embodiment, and the peripheral portion of the Ag paste 16 disposed on the substrate electrode 15 terminates in the substrate electrode 15. Is shown, the Ag paste 16 is printed so as to protrude from the substrate electrode 15, or the area of the substrate electrode 15 is set smaller than the example of FIG.
6 may be a mounting structure that is joined to the substrate 14 in a surface contact state at the peripheral edge thereof.

(Sixth Embodiment) FIG. 11 shows a sixth embodiment of the present invention.
Only parts different from the embodiment will be described. In the sixth embodiment, the substrate electrode 15 and the terminal electrode 1 are connected between the substrate 14 and the main chip 12 of the multilayer ceramic chip capacitor 11.
The third embodiment is characterized in that an Ag paste 16a (corresponding to an adhesive in the present invention) which is bonded independently of the third embodiment is provided. Specifically, the Ag paste 16 a is used to mount the multilayer ceramic chip capacitor 11 at a position between the pair of substrate electrodes 15 on the substrate 14.
Is applied at the time of screen printing.

According to this embodiment having such a configuration,
Since the substrate 14 and the main chip 12 are joined by the Ag paste 16a in addition to the Ag paste 16 for connecting the substrate electrode 15 and the terminal electrode 13, the substrate 14 and the main chip 12 are connected. As a result, the overall bonding strength between the substrate electrode 15 and the terminal electrode 13 is positively affected. In addition, since the Ag paste 16a can be applied in the same process as the Ag paste 16 which is originally required, there is no risk of complicating the procedure for mounting components.

In the sixth embodiment, the Ag paste 1
Although 6a is applied to the substrate 14 in advance, it may be applied to the body chip 12 in advance by dispensing. In addition, although the Ag paste 16a having conductivity is used as the adhesive, a normal adhesive having no conductivity may be used.

(Seventh Embodiment) FIGS. 12 and 13 show a seventh embodiment for explaining a method of mounting an electronic component according to the present invention, which will be described below.
In FIG. 12, which shows a state before the multilayer ceramic chip capacitor 11 is mounted on the substrate 14, a pair of substrate electrodes 23 formed on the substrate 14 are substantially the same as the substrate electrode 3 in the conventional configuration shown in FIG. (For example, 0.8 mm (dimension indicated by W in the figure) × 1.0 mm). Prior to the mounting step of the multilayer ceramic chip capacitor 11, the Ag paste 16 is coated on the upper surface of the substrate electrode 23 with a predetermined thickness (for example, 70 ± 20).
screen printing (print width D is, for example, 0.6 μm).
mm). Thereafter, in the mounting step of the multilayer ceramic chip capacitor 11, the load applied to the chip capacitor 11 is controlled to a value larger than the load in the conventional mounting step, for example, 1 (N). Accordingly, the Ag paste 16 is pushed and spread between the multilayer ceramic chip capacitor 11 and the substrate 14, and thereafter, a step for curing the Ag paste 16 is performed, so that a mounting state as shown in FIG. 13 is obtained. Thus, the Ag paste 16
In the lower surface of the multilayer ceramic chip capacitor 11, the main chip 1 of the chip capacitor 11
2 and the substrate 14 in a surface contact state. In this case, the bonding width S1 of the Ag paste 16 to the main chip 12 can be secured to about 0.3 mm or more, and the bonding width S2 to the substrate 14 can be secured to about 0.1 mm or more. In the mounting step, the shape of the Ag paste 16 can be controlled by performing the mounting operation of the chip capacitor 11 while vibrating the multilayer ceramic chip capacitor 11 or the substrate 14.

According to the electronic component mounting method of this embodiment, the load applied to the chip capacitor 11 in the mounting step of the multilayer ceramic chip capacitor 11 is controlled so that the Ag paste 16 is hardened afterwards. There is a portion of the Ag paste 16 that is bonded to each of the main body chip 12 and the substrate 14 in surface contact. Therefore, only by controlling the load in the mounting step, the bonding strength between the Ag paste 16 and both the main body chip 12 and the substrate 14 is improved. Thereby, even when the substrate 14 on which the multilayer ceramic capacitor 11 is mounted is placed in a high-temperature atmosphere, cracks in the Ag paste 16 can be effectively suppressed, and as a result, the The mounting reliability can be improved by a simple method that only controls the load applied to the ceramic chip capacitor 11.

In the seventh embodiment, the periphery of the Ag paste 16 is joined to both the main body chip 12 and the substrate 14 according to the load control in the mounting step. Accordingly, if the Ag paste 16 is in a state of being bonded to at least one of the main body chip 12 and the substrate 14, the intended purpose can be achieved.

(Eighth Embodiment) FIGS. 14 and 15 show an eighth embodiment of the present invention in which the component mounting method of the seventh embodiment is modified. I will explain only. That is, in the eighth embodiment, in the printing step, as shown in FIG. 14, the Ag paste 16 is coated on the upper surface of the substrate electrode 23 with a relatively large thickness (for example, 200 ± 200 mm).
Screen printing with a printing width D of 7
Equivalent to Example). Thereafter, in the mounting step of the multilayer ceramic chip capacitor 11, the load applied to the chip capacitor 11 is controlled to a smaller load (for example, about 0.1 (N)) than in the seventh embodiment, so that A
g paste 16 to the multilayer ceramic chip capacitor 11
And the substrate 14 is spread out.
By performing the step of curing the, the mounting state as shown in FIG. 15 is obtained.

The mounting method according to the present embodiment having such a structure also has the same effect as that of the seventh embodiment. In particular, according to the present embodiment, the mounting of the multilayer ceramic chip capacitor 11 in the mounting step is performed. By changing the magnitude of the applied load, there is an advantage that the contact area between the Ag paste 16 and the main chip 12 and the substrate 14 can be controlled within a certain range. Also in the present embodiment, if the Ag paste 16 is bonded to at least one of the main body chip 12 and the substrate 14 according to the load control in the mounting step, the intended purpose can be achieved. .

(Ninth Embodiment) FIGS. 16 and 17 show a ninth embodiment of the present invention in which the component mounting method of the seventh embodiment is different from that of the eighth embodiment. Therefore, only the differences will be described below.

That is, in the ninth embodiment, in the printing step, the Ag paste 16 is applied to the region including the substrate electrode 23 on the substrate 14 as shown in FIG.
Screen printing is performed so as to have an area larger than the size of No. 3. Specifically, the Ag paste 16 is, for example, the seventh paste.
It is printed with the same film thickness (about 70 ± 20 μm) as that of the embodiment, and is printed so as to protrude from each substrate electrode 23 by a dimension ΔD (for example, about 0.2 mm) in a direction approaching each other. Thereafter, in the mounting step of the multilayer ceramic chip capacitor 11, the load applied to the chip capacitor 11 is controlled to a smaller load (for example, about 0.1 (N)) than in the seventh embodiment, so that the Ag paste 16 is By pushing and spreading between the multilayer ceramic chip capacitor 11 and the substrate 14 and thereafter performing a process for curing the Ag paste 16, a mounting state as shown in FIG. 17 is obtained.

In this embodiment having such a structure, the same effect as that of the seventh embodiment can be obtained. In particular, according to the present embodiment, the Ag paste 16 is applied from the substrate electrode 23 to the substrate in the printing step. Since the printing is performed so as to protrude, the bonding between the Ag paste 16 and the substrate 14 can be reliably performed.

In the ninth embodiment, the dimensions of the substrate electrode 23 can be reduced as shown in FIG. 18 which is partially modified. According to this configuration, the Ag paste 16 and the substrate 14 can be enlarged, and the bonding state between the two can be further strengthened.

(Other Embodiments) The present invention is not limited to the above embodiments, and the following modifications or extensions are possible. The surface mount electronic components to be mounted include the multilayer ceramic chip capacitor 11 and the tantalum chip electrolytic capacitor 10 described in each of the above embodiments.
1. Applicable to mounting structures and mounting methods of various types of electronic components such as surface mounting capacitors and surface mounting coils in place of the surface mounting crystal unit 102, the surface mounting aluminum electrolytic capacitor 19, etc. It is. In this case, the material of the outer shell member of the surface mount electronic component is alumina, glass ceramic, glass, barium titanate, epoxy resin, etc.
You can choose from a variety of materials.

As the conductive adhesive, an Ag paste in which an Ag filler is filled in an epoxy resin as a binder is used, but the material of the binder and the type of the conductive filler can be appropriately selected. Specifically, Ag, Au, AgPd, AgPt, Ni, Cu, I
r, or a filler containing at least one of them may be filled in a resin such as epoxy, phenol, acrylic, polyester, or polyimide.

As a material of the substrate 14, a 96% alumina substrate was taken as an example. However, low-temperature fired substrates such as alumina substrates, glass ceramic substrates, and glass substrates having different component ratios, epoxy, glass epoxy, paper phenol, Resin substrate such as polyimide or metal-based A
An 1N substrate or the like can also be used.

[Brief description of the drawings]

FIG. 1 is a schematic longitudinal sectional view showing a first embodiment of the present invention.

FIG. 2 is a schematic diagram for explaining an arrangement relationship of main parts.

FIG. 3 is a diagram showing a measurement result of adhesive strength.

FIG. 4 is a view showing a first modified example and corresponding to FIG. 1;

FIG. 5 is a view showing a second modified example, which corresponds to FIG. 1;

FIG. 6 is a view corresponding to FIG. 1, showing a third modification;

FIG. 7 is a view corresponding to FIG. 1, showing a second embodiment of the present invention;

FIG. 8 is a schematic longitudinal sectional view showing a third embodiment of the present invention and a transverse sectional view of a main part.

FIG. 9 is a view corresponding to FIG. 1, showing a fourth embodiment of the present invention.

FIG. 10 is a view corresponding to FIG. 1, showing a fifth embodiment of the present invention;

FIG. 11 is a view corresponding to FIG. 1, showing a sixth embodiment of the present invention.

FIG. 12 is a schematic longitudinal sectional view showing a seventh embodiment of the present invention in a state before component mounting.

FIG. 13 is a schematic vertical cross-sectional view in a state after component mounting.

FIG. 14 is a view corresponding to FIG. 12, showing an eighth embodiment of the present invention;

FIG. 15 is a diagram corresponding to FIG. 13;

FIG. 16 is a view corresponding to FIG. 12, showing a ninth embodiment of the present invention;

FIG. 17 is a diagram corresponding to FIG. 13;

FIG. 18 is a view showing a modification and corresponding to FIG. 12;

FIG. 19 is a schematic longitudinal sectional view for explaining a conventional example.

[Explanation of symbols]

11 is a multilayer ceramic chip capacitor (surface mount electronic component), 12 is a main body chip (outer shell member), 13 is a terminal electrode, 14 is a substrate, 15 is a substrate electrode, 16 is an Ag paste (conductive adhesive), and 16a is Ag paste (adhesive),
17 is a substrate electrode, 18 is a protective film, 19 is a surface mount aluminum electrolytic capacitor (surface mount electronic component), 21 is a base portion (outer shell member), 22 is a terminal electrode, 23 is a substrate electrode, 101 is a tantalum chip electrolytic capacitor. (Surface mount electronic components), 1
01a is a terminal electrode, 101b is an outer shell member, 102 is a surface mount crystal oscillator (surface mount electronic component), 102a is a ceramic substrate (outer shell member), 102b is a terminal electrode, 103 is a surface mount electronic component, and 103b is 3 shows a lead electrode (terminal electrode).

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Takashi Nagasaka 1-1-1 Showa-cho, Kariya-shi, Aichi F-term in DENSO Corporation (reference) 5E319 AA03 AA07 AA08 AB01 AB05 AC04 AC11 BB05 BB08 BB12 CC61 CD16 GG11 5E336 AA04 BB01 BB02 BB18 BC34 CC02 CC32 CC53 EE08 GG30

Claims (17)

[Claims] 1. A surface-mounted electronic component having an outer shell member made of an insulating material and a terminal electrode exposed on the surface of the outer shell member is electrically conductive on a substrate electrode disposed on a substrate made of an insulating material. In a mounting structure of an electronic component in which the conductive adhesive is cured after mounting via the conductive adhesive, the surface-mounted electronic component is mounted on the conductive adhesive in a state where the conductive adhesive is cured. A mounting structure for an electronic component, characterized in that a part to be joined to the outer shell member is provided. 2. A surface-mounted electronic component having an outer shell member made of an insulating material and a terminal electrode exposed on the surface of the outer shell member is electrically conductive on a substrate electrode disposed on a substrate made of an insulating material. In a mounting structure of an electronic component in which the conductive adhesive is cured after mounting via the conductive adhesive, the conductive adhesive is cured and the conductive adhesive is mounted on the substrate. An electronic component mounting structure, characterized in that a part to be joined exists in a region other than a substrate electrode. 3. A surface mount electronic component having an outer shell member made of an insulating material and a terminal electrode exposed on the surface of the outer shell member is electrically connected to a substrate electrode provided on a substrate made of an insulating material. In a mounting structure of an electronic component in which the conductive adhesive is cured after mounting via the conductive adhesive, the surface-mounted electronic component is mounted on the conductive adhesive in a state where the conductive adhesive is cured. Wherein the outer shell member and the region on the substrate other than the substrate electrode are provided with portions to be joined. 4. The mounting structure for an electronic component according to claim 2, wherein a contact area between the conductive adhesive and the substrate is relatively reduced by making an exposed area of the substrate electrode relatively small. A mounting structure for an electronic component, characterized in that the mounting structure is configured so as to expand in a horizontal direction. 5. The electronic component mounting structure according to claim 4, wherein the area of the substrate electrode itself is set to be relatively small. 6. The mounting structure for an electronic component according to claim 1, wherein the substrate is formed so as to cover the upper surface of the electronic component while partially exposing the substrate electrode. A mounting structure for an electronic component, comprising: a protective film formed of a conductive adhesive; and a peripheral edge of the conductive adhesive is bonded to the protective film in a surface contact state. 7. The mounting structure for an electronic component according to claim 1, wherein the terminal electrode has at least one exposure window for exposing the outer shell member, and the terminal electrode has an opening through the exposure window. An electronic component mounting structure, wherein a conductive adhesive is bonded to the outer shell member. 8. The electronic component mounting structure according to claim 2, wherein at least one exposure window for exposing the substrate is formed in the substrate electrode, and the conductive window is formed through the exposure window. An electronic component mounting structure, wherein an adhesive is bonded to the substrate. 9. The mounting structure for an electronic component according to claim 1, wherein an adhesive is provided for joining the substrate and the outer shell member independently of the substrate electrode and the terminal electrode. A mounting structure for an electronic component, wherein 10. The electronic component mounting structure according to claim 9, wherein the adhesive is applied in advance to the outer shell member side. 11. The electronic component mounting structure according to claim 9, wherein the adhesive is a conductive adhesive applied to the substrate in advance. 12. A surface mount electronic component having an outer shell member made of an insulating material and a terminal electrode exposed on the surface of the outer shell member is electrically connected to a substrate electrode disposed on a substrate made of an insulating material. After mounting via the conductive adhesive, in the mounting method of the electronic component so as to cure the conductive adhesive, by controlling the load applied to the electronic component in the mounting process of the surface-mounted electronic component, Wherein the conductive adhesive is cured so that the conductive adhesive has a portion to be joined to an outer shell member of the surface-mounted electronic component. 13. A surface-mount electronic component having an outer shell member made of an insulating material and a terminal electrode exposed on the surface of the outer shell member is electrically connected to a substrate electrode disposed on a substrate made of an insulating material. After mounting via the conductive adhesive, in the mounting method of the electronic component so as to cure the conductive adhesive, by controlling the load applied to the electronic component in the mounting process of the surface-mounted electronic component, Wherein the conductive adhesive is cured so that the conductive adhesive has a portion to be joined to a region other than the substrate electrode on the substrate. 14. A surface-mount electronic component having an outer shell member made of an insulating material and a terminal electrode exposed on the surface of the outer shell member is electrically conductive on a substrate electrode disposed on a substrate made of an insulating material. After mounting via the conductive adhesive, in the mounting method of the electronic component so as to cure the conductive adhesive, by controlling the load applied to the electronic component in the mounting process of the surface-mounted electronic component, In a state where the conductive adhesive is cured, the conductive adhesive has a portion to be joined to each of the outer shell member of the surface mount electronic component and a region other than the substrate electrode on the substrate. Characteristic electronic component mounting method. 15. The method for mounting an electronic component according to claim 12, wherein the conductive adhesive is printed with a relatively large film thickness on the substrate electrode prior to the mounting step. And a method for mounting an electronic component. 16. The method for mounting an electronic component according to claim 12, wherein the conductive adhesive is applied to a region including the substrate electrode on the substrate in an area larger than the size of the substrate electrode. And a mounting step of positioning and mounting the surface-mounted electronic component so that its terminal electrode is in contact with the substrate electrode via the conductive adhesive. Component mounting method. 17. The electronic component mounting method according to claim 12, wherein in the mounting step, the electronic component is mounted while vibrating the substrate or the surface-mounted electronic component. Characteristic electronic component mounting method.