JPWO2021075051A1 - - Google Patents

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Publication number
JPWO2021075051A1
JPWO2021075051A1 JP2021552079A JP2021552079A JPWO2021075051A1 JP WO2021075051 A1 JPWO2021075051 A1 JP WO2021075051A1 JP 2021552079 A JP2021552079 A JP 2021552079A JP 2021552079 A JP2021552079 A JP 2021552079A JP WO2021075051 A1 JPWO2021075051 A1 JP WO2021075051A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021552079A
Other languages
Japanese (ja)
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JP7282906B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of JPWO2021075051A1 publication Critical patent/JPWO2021075051A1/ja
Application granted granted Critical
Publication of JP7282906B2 publication Critical patent/JP7282906B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2021552079A 2019-10-18 2019-10-18 Component mounting method and component mounting device Active JP7282906B2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/041125 WO2021075051A1 (en) 2019-10-18 2019-10-18 Component mounting method and component mounting device

Publications (2)

Publication Number Publication Date
JPWO2021075051A1 true JPWO2021075051A1 (en) 2021-04-22
JP7282906B2 JP7282906B2 (en) 2023-05-29

Family

ID=75537809

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021552079A Active JP7282906B2 (en) 2019-10-18 2019-10-18 Component mounting method and component mounting device

Country Status (2)

Country Link
JP (1) JP7282906B2 (en)
WO (1) WO2021075051A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023119469A1 (en) * 2021-12-22 2023-06-29 株式会社Fuji Electrical circuit forming method and electrical circuit forming apparatus

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59123291A (en) * 1982-12-28 1984-07-17 松下電器産業株式会社 Circuit board for electronic device
JPH01253295A (en) * 1988-04-01 1989-10-09 Hitachi Ltd Application of adhesive onto wiring substrate
JPH04134872U (en) * 1991-06-07 1992-12-15 沖電気工業株式会社 Surface component mounting structure
JP2000200953A (en) * 1998-10-27 2000-07-18 Denso Corp Mounting structure and mounting method of electronic components

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59123291A (en) * 1982-12-28 1984-07-17 松下電器産業株式会社 Circuit board for electronic device
JPH01253295A (en) * 1988-04-01 1989-10-09 Hitachi Ltd Application of adhesive onto wiring substrate
JPH04134872U (en) * 1991-06-07 1992-12-15 沖電気工業株式会社 Surface component mounting structure
JP2000200953A (en) * 1998-10-27 2000-07-18 Denso Corp Mounting structure and mounting method of electronic components

Also Published As

Publication number Publication date
JP7282906B2 (en) 2023-05-29
WO2021075051A1 (en) 2021-04-22

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