JP2013038177A - Droplet discharge device and inspection method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To check the quality of droplet discharge with high efficiency.SOLUTION: A droplet discharge device comprises a stage which can hold and move a substrate in an in-horizontal-plane direction, a plurality of nozzles for discharging an insulation material, a discharge head arranged to face the stage, a sensor which detects a landing mark of the insulation material discharged from the nozzle, and a control device which controls the stage, the discharge head, and the sensor. In the droplet discharge device, the stage can move the substrate at least in the uniaxial direction, and the plurality of nozzles of the discharge head are arranged along the direction orthogonal to the uniaxial direction in the horizontal plane, and the sensor is arranged to face the stage to be relatively movable with respect to the stage in the direction orthogonal the uniaxial direction in the horizontal plane. The control device has a function of controlling the stage and the discharge head and discharging the insulation material on the substrate so as to perform drawing and a function of controlling the stage and the sensor and detecting a landing mark of the discharged insulation material, and the control device moves the sensor relatively with respect to the stage in the direction orthogonal to the uniaxial direction in the horizontal plane at the time of detecting the landing mark of the discharged insulation material.

Description

  The present invention relates to a droplet discharge device and an inspection method for discharging an insulating material.

  A technology is known in which an insulating layer is formed (drawn) on a substrate by discharging a liquid material (ink) containing an insulating material as droplets from a discharge head (inkjet head) onto a pattern forming surface such as a printed wiring board. It has been.

  An example of the insulating material is a solder resist. The solder resist is a material that is applied to insulate necessary portions of the printed wiring board.

  An invention of a liquid resin injection device that sprays a liquid resin directly on a substrate to form a pattern is disclosed (for example, see Patent Document 1). According to the invention described in Patent Literature 1, a highly accurate pattern can be easily formed.

Japanese Patent No. 3544543

  An object of the present invention is to provide a droplet discharge apparatus and an inspection method capable of inspecting the quality of droplet discharge with high efficiency.

  According to one aspect of the present invention, the apparatus includes a substrate holding stage that can hold a substrate and move the held substrate in a horizontal plane direction, and a plurality of discharge nozzles that can discharge an insulating material. A discharge head, a sensor for detecting landing marks of the insulating material discharged from the plurality of discharge nozzles, the stage, the discharge head, and a control device for controlling the sensor, the stage being held The substrate can be moved in at least one axis direction, and the plurality of discharge nozzles of the discharge head are arranged along a direction perpendicular to the one axis direction in a horizontal plane, and the sensor is in a horizontal plane with respect to the stage. The control device is arranged to face the stage so as to be relatively movable in a direction orthogonal to the uniaxial direction. A drawing function for performing drawing by discharging an insulating material onto a substrate held on the stage, and an inspection function for controlling the stage and the sensor to detect a landing mark of the discharged insulating material; And the controller is configured to move the sensor relative to the stage in a direction perpendicular to the uniaxial direction within a horizontal plane when detecting a landing mark of the discharged insulating material. A dispensing device is provided.

  A substrate is mounted on a stage that can move in the horizontal direction, and a discharge head including a plurality of discharge nozzles is disposed to face the substrate. Further, a control device for controlling the movement of the stage and the ejection head is provided, and the movement of the stage and the control of the nozzle are performed based on the drawing data on the substrate stored in the control device. The stage moves in the main scanning direction (Y-axis direction) and the sub-scanning direction (X-axis direction) orthogonal thereto, and a plurality of nozzles are arranged along the sub-scanning direction. In addition, a sensor for detecting a discharge result is provided. This sensor is linearly movable in the direction along the sub-scanning direction, and the discharge result corresponding to each nozzle discharged from the nozzles arranged along the sub-scanning direction. Are collectively detected by the sensor along the sub-scanning direction.

  According to the present invention, it is possible to provide a droplet discharge device and an inspection method capable of inspecting the quality of droplet discharge with high efficiency.

It is the schematic which shows the 1st drawing apparatus 71 containing the droplet discharge apparatus by an Example. 2A is a schematic view showing an alignment apparatus included in the alignment station 2, and FIGS. 2B and 2C are plan views showing a substrate 22 in the alignment station 2. FIG. 3A and 3B are schematic views showing a part of a droplet discharge device 70 included in the inspection / drawing station 3 according to the embodiment. 4A is a schematic view showing the inkjet head unit 47a, FIG. 4B is a plan view showing a droplet discharge surface of the inkjet head unit 47a, and FIG. 4C is a schematic showing the arrangement of the inkjet head units 47a to 47f. FIG. 5A to 5D are schematic views showing the substrate reversing device 50 and the ultraviolet irradiation device (solder resist solidifying device) 60 included in the substrate reversing station 4. 6A, 6C, and 6E are schematic plan views showing the substrate holder 51, and FIGS. 6B, 6D, and 6F are schematic side views showing the substrate holder 51. FIG. 7A to 7C are diagrams illustrating the inspection function of the droplet discharge device 70 according to the embodiment. 7D to 7G are diagrams for explaining the inspection function of the droplet discharge device 70 according to the embodiment. 8A to 8C are diagrams illustrating examples of ink application results. FIG. 6 is a schematic diagram showing a second drawing device 72. FIG. 10 is a schematic diagram showing a third drawing device 73. 11A and 11B are diagrams for explaining an example of correction of Gerber data.

  FIG. 1 is a schematic diagram illustrating a first drawing device 71 including a droplet discharge device according to an embodiment. The first drawing device 71 is disposed inside the housing 18, and includes an alignment station 2, an inspection / drawing station 3, a substrate inversion station 4, an alignment station 5, an inspection / drawing station 6, an ultraviolet irradiation device 8, and It is comprised including the lifters 11-14. The housing 18 of the first drawing apparatus 71 is provided with a substrate carry-in port 1 and a substrate carry-out port 7. The first drawing device 71 is used for forming a solder resist pattern on the front and back surfaces of the substrates 21 to 27, which are rectangular printed wiring boards, for example. The first drawing device includes conveyors 15 and 16 and a control device 20. The movement of the substrates 21 to 27 to the inside of the housing 18 is performed by the conveyor 15. The transfer of the substrates 21 to 27 in the housing 18 is performed using the lifters 11 to 14. The conveyor 16 carries the substrates 21 to 27 out of the housing 18. The operation within the housing 18 and the operations of the conveyors 15 and 16 are controlled by the control device 20. The control device 20 includes a storage device 20a that is, for example, a memory. The surfaces of the substrates 21 to 27 transferred to the inside of the housing 18 face upward in the figure (Z-axis positive direction).

  In the present specification, a right-handed orthogonal coordinate system having a vertically upward direction in the Z-axis positive direction is defined. In the following description, five stations from the alignment station 2 to the inspection / drawing station 6 are sequentially arranged from the X-axis negative direction to the X-axis positive direction, and are carried into the housing 18 from the substrate carry-in entrance 1. The substrates 21 to 27 are transported in the positive X-axis direction as a whole via the stations 2 to 6 and are carried out of the housing 18 from the substrate carry-out port 7.

  In the first drawing apparatus 71, processing is performed in parallel at each of the alignment station 2, the inspection / drawing station 3, the substrate inversion station 4, the alignment station 5, and the inspection / drawing station 6. For this reason, improvement in production efficiency can be realized.

  The alignment station 2 will be described with reference to FIGS. 2A to 2C. FIG. 2A is a schematic diagram showing an alignment apparatus included in the alignment station 2. The alignment apparatus includes a Y stage 32, a θ stage 33, and a chuck plate 34 that are arranged in this order from the base 31 side on a base (base) 31. The chuck plate 34 sucks and holds the substrate 22 transported to the alignment station 2 by the lifter 11.

  The Y stage 32 can move the held substrate 22 in the Y-axis direction. The θ stage 33 can rotate the held substrate 22 around a rotation axis parallel to the Z axis in a plane parallel to the XY plane. The Y stage 32, the θ stage 33, and the chuck plate 34 constitute a moving stage that holds the substrate 22 and moves it within the alignment station 2. Adsorption of the substrate 22 by the chuck plate 34 and movement of the substrate 22 by the Y stage 32 and the θ stage 33 are controlled by the control device 20.

  The alignment apparatus includes CCD cameras 35-38. The CCD cameras 35 to 38 are detectors that can image (detect) an alignment mark formed on the substrate 22 held by the chuck plate 34. Imaging by the CCD cameras 35 to 38 is controlled by the control device 20. Further, image data (detection result) obtained by the CCD cameras 35 to 38 is transmitted to the control device 20.

  FIG. 2B is a plan view showing the substrate 22 conveyed to the alignment station 2 and sucked and held by the chuck plate 34. For example, alignment marks 22 a to 22 d are formed on the substrate 22 at four corners of the surface.

  The substrate 22 transported and placed on the chuck plate 34 by the lifter 11 is moved in the negative direction of the Y axis in the alignment station 2 by driving the Y stage 32 while being sucked and held by the chuck plate 34. In FIG. 2B, the substrate 22 after being moved is shown in parentheses.

  The CCD cameras 35 to 38 are configured so that the CCD cameras 35 to 38 can image the alignment marks 22 a to 22 d on the Y axis negative direction side of the position where the lifter 11 places the substrate 22 on the chuck plate 34. Has been placed. The substrate 22 is moved below the position where the CCD cameras 35 to 38 are disposed by the Y stage 32, and the CCD cameras 35 to 38 photograph the surface of the substrate 22 (alignment marks 22 a to 22 d). The captured image data is transmitted to the control device 20.

  The control device 20 processes the image data acquired by the CCD cameras 35 to 38 and grasps the position of the substrate 22 and the posture (orientation) in the XY plane (in the substrate 22 plane) direction. For example, the posture of the substrate 22 in the XY plane direction is corrected (changed) (θ correction).

  FIG. 2B shows, as an example, a case where the substrate 22 is displaced by an angle α counterclockwise in the XY plane. In this case, for example, the side connecting the apex on which the alignment mark 22a is formed and the apex on which the alignment mark 22d is formed is inclined by an angle α counterclockwise from the positive direction of the X axis with respect to the latter apex. Will be. This positional deviation is grasped by the control device 20 based on the image data acquired by the CCD cameras 35 to 38. The control device 20 corrects this positional deviation by rotating the θ stage 33 clockwise by an angle α. As a result of the correction, each side of the rectangular substrate 22 is parallel to the X axis or the Y axis.

  Refer to FIG. 2C. After the alignment marks 22a to 22d on the surface of the substrate 22 are detected by the CCD cameras 35 to 38 and the θ correction of the substrate 22 is performed based on the detection result, the control device 20 drives the Y stage 32 to drive the substrate 22. Is moved in the positive direction of the Y-axis. The driving distance of the Y stage 32 is determined when the substrate 22 is moved to the installation area of the CCD cameras 35 to 38 in order to detect the alignment marks 22a to 22d in the process shown in FIG. 2B, for example. Is equal to the distance driven in the negative Y-axis direction.

  The substrate 22 after being moved in the positive Y-axis direction is shown in parentheses in FIG. 2C. The substrate 22 subjected to θ correction is transferred to the inspection / drawing station 3 by the lifter 11. The lifter 11 transports the substrate 22 whose orientation in the in-plane direction of the substrate is changed by the rotation of the θ stage 33 onto the stage of the inspection / drawing station 3 while maintaining the orientation.

  Since the θ correction is completed in the alignment station 2, the inspection / drawing station 3 can start forming the solder resist pattern on the surface of the substrate 22 without correcting the position of the substrate 22. For example, the processing time at the inspection / drawing station 3 can be shortened as compared with the case where θ correction is performed at the inspection / drawing station 3 and then the solder resist pattern is formed, thereby reducing the tact time and the production efficiency. Improvement can be realized.

  It should be noted that the size of the substrate 22 is different from the design value when normal drawing occurs and drawing is performed. For this reason, the control device 20 grasps the size of the substrate 22 on the basis of the image data acquired using the CCD cameras 35 to 38 in the alignment station 2, and the inspection / drawing station 3 according to the grasped size. Thus, inkjet control data (bitmap) used when drawing the substrate 22 is generated. The generated inkjet control data is stored in the storage device 20a of the control device 20. This will be described in detail in the description of the inspection / drawing station 3 below.

  3A and 3B are schematic views showing a part of a droplet discharge device 70 included in the inspection / drawing station 3 according to the embodiment. Refer to FIG. 3A. The droplet discharge device 70 includes a base 41 installed in a plane parallel to the XY plane (horizontal plane), and an X stage 43, a Y stage 44, and a chuck plate 45 arranged on the base 41 in this order from the base 41 side. including. The chuck plate 45 sucks and holds the substrate 23 conveyed to the inspection / drawing station 3 by the lifter 11.

  The X stage 43 can move the held substrate 23 in the X-axis direction. The Y stage 44 can move the held substrate 23 in the Y-axis direction. The X stage 43, the Y stage 44, and the chuck plate 45 are arranged on the base 41 and constitute a moving stage that holds the substrate 23 and moves it in the inspection / drawing station 3. The suction of the substrate 23 by the chuck plate 45 and the movement of the substrate 23 by the X stage 43 and the Y stage 44 are performed in response to a command from the control device 20.

  The X stage 43, the Y stage 44, and the chuck plate 45 may be arranged in the vertical direction as described above, or a high-function stage having the functions of the X stage 43, the Y stage 44, and the chuck plate 45 may be used. It may be used to realize a moving stage.

  The inspection / drawing station 3 is fixed to the base 41 and arranged so as to surround the movable stage (X stage 43, Y stage 44, and chuck plate 45) in a gate shape when viewed along the Y-axis direction. Frame 42 and inkjet head units 47a to 47f held by the frame 42.

  The frame 42 includes two struts 42a and 42b and a beam 42c. The beam 42c is supported by the columns 42a and 42b so as to be along the X-axis direction.

  The inkjet head units 47 a to 47 f are held by the beam 42 c of the frame 42 through the connecting member 46. Each of the inkjet head units 47a to 47f includes a plurality of inkjet heads and an ultraviolet light source. The inkjet head discharges (drops), for example, ultraviolet curable ink (insulating material) as droplets toward the surface of the substrate 23 held on the moving stage. Ink is discharged while moving the substrate 23 in the Y-axis direction. A material layer of a predetermined pattern, for example, a solder resist pattern is formed (drawn) on the surface of the substrate 23 by the ejected ink. The formed solder resist pattern is cured (temporarily cured) by the ultraviolet rays emitted from the ultraviolet light source.

  The storage device 20a of the control device 20 includes data (gerber data) indicating a region on which the solder resist is to be formed (region where the ink is to be applied) on the substrate 23, the amount of movement of the substrate 23 by the moving stage, and the inkjet head. Data indicating the relationship (discharge timing) with the ink discharge timing is stored. However, since this is a design value (initial value), the control device 20 generates ink jet control data from these data based on the image data of the substrate 23 imaged by the alignment station 2. For example, the control device 20 grasps the X and Y directions of the substrate 23 from the image data. For the X direction, the coordinates of the position where the ink is to be applied on the substrate 23 are corrected according to the X direction of the substrate 23 (correction of Gerber data). For the Y direction, the relationship (ejection timing) between the amount of movement of the substrate 23 by the Y stage 44 and the timing of ink ejection from the inkjet head is corrected according to the Y direction of the substrate 23. Thus, the inkjet control data obtained by correcting the data stored in advance in the storage device 20a is stored in the storage device 20a. For the Y direction of the substrate 23, the coordinates of the position where the ink should be applied on the substrate 23 may be corrected instead of the ejection timing (correction of Gerber data).

  An example of Gerber data correction will be described with reference to FIGS. 11A and 11B. FIG. 11A and FIG. 11B show bitmaps composed of a plurality of pixels arranged in the row direction and the column direction. In both figures, the pixels in the area where the solder resist is to be applied are shown in black.

  FIG. 11A shows the design value (initial value) of the solder resist application region. Pixels that do not go around and inside the circle drawn with a solid line are stored in the storage device 20a as areas to be coated with solder resist.

For example length l _X in the X _direction, the X direction of elongation ΔX in the Y direction length is l _Y rectangular substrate 23, a Y-direction elongation was [Delta] Y, and was recognized from the image data . Assuming that the spread occurs uniformly over the entire substrate 23, the spread per unit length in the X and Y directions is ΔX / l _X and ΔY / l _Y. The circumference and the inside of the circle in FIG. 11A (area where the solder resist is not applied) are enlarged according to the size. That is, since the position where the ink is to be applied on the substrate 23 changes, the control device 20 corrects the coordinates (pixels) of the position where the ink is to be applied.

  FIG. 11B shows the corrected bitmap. For example, in FIG. 11B, pixels that do not cover the circumference and inside of a circle drawn with a solid line are areas to which the solder resist after correction is to be applied. The circle drawn with a solid line in FIG. 11A is shown with a broken line in this figure for reference. For example, the bitmap data shown in the figure is newly stored in the storage device 20a as inkjet control data.

  Based on the inkjet control data stored in the storage device 20a, the control device 20 discharges ink from the inkjet head units 47a to 47f and uses a moving stage so that ink is applied to a predetermined area on the substrate 23. The movement of the substrate 23 is controlled. While the substrate 23 is moved along the Y-axis direction, the ink is applied vertically below the inkjet head units 47a to 47f (Z-axis negative direction).

  FIG. 3B shows the vicinity of the inkjet head units 47 a to 47 f of the droplet discharge device 70. The inkjet head units 47a to 47f are, for example, the inkjet head units having the same configuration, and are fixed to the connecting member 46 at equal intervals along the X-axis direction. The connecting member 46 is attached to the beam 42c of the frame so as to be movable in the Z-axis direction. In this way, the inkjet head units 47a to 47f are held by the frame so that the distance from the substrate 23 can be adjusted. The movement of the inkjet head units 47 a to 47 f in the Z-axis direction by the connecting member 46 is controlled by the control device 20. The ink jet head units 47a to 47f may be directly fixed to the beam 42c of the frame without using the connecting member 46.

FIG. 4A is a schematic view showing the inkjet head unit 47a. Jet head unit 47a includes a carriage 47a _c, the ink jet head _47a 1 _{~47a 4} assembled alternately along the Y-axis direction, and the ultraviolet light source _47a 5 _{~47a 9.} Each of the inkjet heads 47a _{1 to} 47a ₄ includes two nozzle rows arranged along the Y-axis direction. Each nozzle row includes a plurality of, for example, 192 inkjet nozzles (ejection nozzles, ink ejection holes) arranged along the X-axis direction. The length along the X-axis direction of each nozzle row is, for example, about 30 mm. Therefore, the length along the X-axis direction of the inkjet head unit 47a is also about 30 mm. UV curable ink is ejected from each inkjet nozzle.

The ultraviolet light sources 47a _{5 to} 47a ₉ include, for example, light emitting diodes (LEDs), and emit light having a wavelength in the ultraviolet region. The ultraviolet curable ink discharged from the inkjet nozzles of the inkjet heads 47a _{1 to} 47a ₄ to the substrate 23 is cured (temporarily cured) by the light emitted from the ultraviolet light sources 47a _{5 to} 47a ₉ . The emission of ultraviolet light from the ultraviolet light sources 47 a _{5 to} 47 a ₉ is controlled by the control measure 20.

FIG. 4B is a plan view showing a droplet discharge surface of the inkjet head unit 47a (inkjet heads 47a _{1 to} 47a ₄ ). In this view, the description of the ultraviolet light source _47a 5 _{~47a 9} are omitted. The ink jet heads 47a _{1 to} 47a ₄ are arranged to face the moving stage.

The nozzles in the same nozzle row of the inkjet heads 47a _{1 to} 47a ₄ are arranged at intervals of 160 μm along the X-axis direction. In each of the inkjet heads 47a _{1 to} 47a ₄ , the nozzle array on the Y axis positive direction side is formed such that the nozzle arrangement position is shifted by 80 μm in the X axis positive direction with respect to the nozzle array on the Y axis negative direction side. . For this reason, each of the inkjet heads 47a _{1 to} 47a ₄ includes 384 inkjet nozzles arranged in a staggered manner at intervals of 80 μm in the X-axis direction, and has a resolution of about 300 dpi. Each inkjet nozzle is configured to include a piezo element, and ejects ink in response to voltage application. Ink ejection (voltage application) is performed in response to a command from the control device 20. In the embodiment, there are two nozzle rows, but it may be one row or three or more rows.

The inkjet heads 47a _{1 to} 47a ₄ are arranged along the Y-axis direction as a whole while their relative positions are sequentially shifted in the X-axis positive direction. That is, the inkjet head 47a ₂ is disposed on the X axis positive direction side by 20 μm with respect to the inkjet head 47a ₁ . Similarly, the inkjet heads 47a ₃ and a ₄ are arranged on the X axis positive direction side by 20 μm with respect to the inkjet heads 47a ₂ and a ₃ , respectively. As a result, the inkjet head unit 47a includes nozzles arranged at intervals of 20 μm (high resolution of about 1200 dpi) in the X-axis direction.

  FIG. 4C is a schematic plan view showing the arrangement of the inkjet head units 47a to 47f. As described above, each of the inkjet head units 47a to 47f has a droplet discharge capability in a range of about 30 mm along the X-axis direction. Moreover, it arrange | positions at equal intervals along a X-axis direction. The distance between the adjacent inkjet head units 47a to 47f is, for example, about 60 mm.

  In the inspection / drawing station 3, the substrate 23 transported by the lifter 11 is held on the moving stage (chuck plate 45), and then moved in the negative direction of the Y axis, for example, below the inkjet head units 47 a to 47 f. Ink is ejected from the inkjet head units 47a to 47f toward the ejection target position (solder resist formation target position) in the odd-numbered row area (circled area in FIG. 4C) along the Y-axis direction. After the discharge to the target position in the odd-numbered row region is completed, the substrate 23 is moved in the X-axis positive direction, for example, 10 nm by the X stage 43, and then each substrate 23 is moved in the Y-axis positive direction. Ink is ejected from the inkjet head units 47a to 47f toward the ejection target position in an even-numbered row region (region marked with a cross in FIG. 4C) along the Y-axis direction below the inkjet head units 47a to 47f. By discharging droplets toward the target positions in the odd-numbered row area and the even-numbered row area on the forward path and the return path along the Y-axis direction, drawing with a high resolution of about 2400 dpi can be realized.

  After the droplet discharge to the even-numbered row region is completed, the X stage 43 is driven, and the substrate 23 is moved about 30 mm in the positive direction of the X axis. Then, the substrate 23 is reciprocated in the Y-axis direction by the Y stage 44, and the odd-numbered row region and the even-numbered row region are drawn on the forward path and the return path, respectively.

  Further, the same processing is performed once again, and drawing on the surface of the substrate 23 is completed in a total of three reciprocations along the Y-axis direction.

  The droplet discharge device according to the embodiment shown in FIGS. 3A to 4C includes six inkjet head units 47a to 47f. The number of inkjet head units is not limited to six. For example, one may be used.

  5A to 5D are schematic views showing the substrate reversing device 50 and the ultraviolet irradiation device (solder resist solidifying device) 60 included in the substrate reversing station 4. Refer to FIG. 5A. The substrate reversing device 50 is fixed to a U-shaped substrate holder 51 that holds the substrates 21 to 27 transported to the substrate reversing station 4 by the lifter 12 and a U-shaped vertical bar. A bar-shaped support member 52 to be supported is included. The support member 52 is disposed in a plane equal to the plane defined by the U-shape of the substrate holder 51, and the extending direction thereof is parallel to the extending direction of the two U-shaped horizontal bars. The support member 52 supports the substrate holder 51 rotatably around the support member 52 with the support member 52 as a rotation axis. The rotation of the substrate holder 51 by the support member 52 is controlled by the control device 20.

  The ultraviolet irradiation device 60 includes a support member 61 and an ultraviolet light source 62. The support member 61 extends, for example, in a direction parallel to the extending direction of the support member 52 of the substrate reversing device 50. The ultraviolet light source 62 includes, for example, a lamp or an LED, and emits light having a wavelength in the ultraviolet region. The ultraviolet light source 62 can emit ultraviolet light at a higher output than the ultraviolet light source included in the inkjet head unit. The wavelength of the ultraviolet light may be the same as or different from the wavelength of the ultraviolet light emitted from the ultraviolet light source of the inkjet head unit.

  The ultraviolet light source 62 is supported by the support member 61 so as to be movable in the extending direction. The control device 20 controls the emission of the ultraviolet light from the ultraviolet light source 62 and the movement of the ultraviolet light source 62 along the support member 61.

  Refer to FIG. 5B. The substrates 21 to 27 having the solder resist pattern formed on the surface thereof at the inspection / drawing station 3, for example, the substrate 24, are transported to the substrate inversion station 4 by the lifter 12. The substrate 24 is mounted directly on the U-shaped surface of the substrate holder 51 by the lifter 12 so that, for example, the surface of the substrate 24 (surface on which the solder resist is formed) is directed upward (Z-axis positive direction). Placed. The substrate holder 51 holds the substrate 24 in a fixed manner by suction, pressing, clamping, or the like. That is, the substrate 24 is held so as not to move relative to the substrate holder 51. The control device 20 controls the fixed holding and release of the substrate 24 by the substrate holder 51.

Refer to FIG. 5C. The ultraviolet light source 62 is moved along the support member 61 while emitting ultraviolet light from the ultraviolet light source 62. When the substrate reversing device 50 and the ultraviolet irradiation device 60 move the ultraviolet light source 62 along the support member 61, the ultraviolet light source 62 passes above the substrate 24 held by the substrate holder 51 and is emitted from the ultraviolet light source 62. It arrange | positions so that the irradiated ultraviolet light may be irradiated to the solder resist pattern formation area of the board | substrate 24, for example, the whole surface of the board | substrate 24 at least. The ultraviolet light emitted from the ultraviolet light source 62 is irradiated on the entire surface of the substrate 24 with an energy density of, for example, 1000 mJ / cm ² . The main curing of the solder resist formed on the surface of the substrate 24 is performed by irradiation with ultraviolet light. By the main curing, the solder resist on the surface of the substrate 24 is solidified to the inside. In the main curing, the substrate 24 is irradiated with ultraviolet light at a higher energy density than in the temporary curing. The temporary curing performed in the inspection / drawing station 3 is a process for solidifying the surface area of the solder resist, for example, preventing diffusion, and the internal area of the solder resist is not completely solidified by the temporary curing.

  Refer to FIG. 5D. After the ultraviolet light is irradiated and the solder resist on the surface of the substrate 24 is fully cured, the substrate holder 51 is rotated by 180 ° with the support member 52 as the rotation axis. Thereby, the front and back of the substrate 24 held by the substrate holder 51 are reversed. The substrate 24 with the front and back reversed is conveyed by the lifter 13 to the alignment station 5 and subsequently to the inspection / drawing station 6 with the front and back reversed. Before the transfer by the lifter 13 is performed, the holding of the substrate 24 by the substrate holder 51 is released.

  The substrate holding structure of the substrate holder 51 will be described with reference to FIGS. 6A to 6F. 6A, 6C, and 6E are schematic plan views showing the substrate holder 51, and FIGS. 6B, 6D, and 6F are schematic side views showing the substrate holder 51. FIG.

  As shown in FIGS. 6A and 6B, the substrate holder 51 includes a vacuum suction pad 53 on, for example, a U-shaped surface. Both figures show an example in which a plurality of vacuum suction pads 53 are formed on two U-shaped horizontal bars. The substrate 24 is placed on the U-shaped surface of the substrate holder 51 including the vacuum suction pad 53 by the lifter 12, and is sucked and held by the substrate holder 51 by the suction force from the vacuum suction pad 53.

  As shown in FIGS. 6C and 6D, the substrate holder 51 may include a pressing roller 54 that extends in the extending direction of the horizontal bar, for example, on two U-shaped horizontal bars. The presser roller 54 is moved by the lifter 12 onto the end portion of the substrate 24 placed on the U-shaped surface of the substrate holder 51. The substrate 24 is fixedly held by the substrate holder 51 by being pressed by the pressing roller 54.

  As shown in FIGS. 6E and 6F, a configuration in which the substrate holder 51 includes a clamp mechanism 55 can be employed. The clamp mechanism 55 shown in both figures has a rising portion extending in the extending direction of the two U-shaped horizontal bars, and inward, for example, 90 ° so that a part thereof (clamping tip) falls down. By bending, the end portion of the substrate 24 placed on the substrate holder 51 is sandwiched and held.

  The substrate holder 51 shown in FIGS. 6A to 6F holds the portion of the substrate 24 where the solder resist is not formed in a fixed manner by suction, pressing, and sandwiching.

  In the above example, after irradiating with ultraviolet light and main-curing the solder resist on the surface of the substrate 24, the substrate holder 51 is rotated to reverse the front and back of the substrate 24. Then, the main curing may be performed by irradiating the surface of the substrate 24 with ultraviolet light from the Z-axis negative direction side. Further, the main curing by the irradiation of ultraviolet light and the reverse of the substrate 24 by the rotation of the substrate holder 51 may be performed simultaneously. In this case, for example, a configuration is adopted in which the ultraviolet light source 62 is rotated in synchronization with the rotation of the substrate 24 so that the surface of the rotating substrate 24 is irradiated with ultraviolet light having a predetermined intensity. By performing the main curing during the period of reversing the front and back, the processing time at the substrate reversing station 4 can be shortened.

  The substrate 24 that has been subjected to the main curing of the solder resist on the front surface and the reverse of the front and back is conveyed to the alignment station 5 by the lifter 13.

  The alignment station 5 has the same configuration and function as the alignment station 2. An alignment mark formed on the back surface of the substrate 24 is detected by a CCD camera, and θ correction is performed. In addition, from the image data, the size of the substrate 24 on which the front surface drawing has been completed is grasped, and ink jet control data used when newly drawing the back surface of the substrate 24 is generated.

  The lifter 13 transports the substrate 24 whose orientation in the in-plane direction of the substrate is changed by the rotation of the θ stage included in the alignment station 5 onto the stage of the inspection / drawing station 6 while maintaining the orientation.

  The inspection / drawing station 6 has the same configuration and function as the inspection / drawing station 3. In the inspection / drawing station 6, a solder resist pattern is formed on the back surface of the substrate 24 based on the inkjet control data on the back surface.

  Note that the inkjet control data on the back surface can also be created based on the image data acquired by the alignment station 2. In this case, the image data obtained by the alignment station 5 is used only for θ correction, for example.

  Since the θ correction of the substrate 24 is performed by the alignment station 5, there is no need for the θ correction in the inspection / drawing station 6. For this reason, the formation of the solder resist pattern on the back surface can be started without aligning the substrate 24 transferred to the inspection / drawing station 6. Therefore, the processing time at the inspection / drawing station 6 can be shortened, and as a result, the tact time can be shortened and the production efficiency can be improved.

  After the solder resist pattern is formed on the back surface of the substrates 21 to 27, the substrates 21 to 27 are transported to the conveyor 16 by the lifter 14, and are carried out of the housing 18 from the carry-out port 7 by the conveyor 16. While placed on the conveyor 16, the ultraviolet irradiation device 8 irradiates the entire back surfaces of the substrates 21 to 27 with ultraviolet rays, and the solder resist formed on the back surfaces of the substrates 21 to 27 is fully cured. The ultraviolet irradiation device 8 is movable in the housing 18 so as to pass over the substrates 21 to 27 placed on the conveyor 16, and while passing over the substrates 21 to 27, the back surfaces of the substrates 21 to 27. Irradiate with UV light. Alternatively, the ultraviolet irradiation device 8 is fixedly disposed in the housing 18, and the substrates 21 to 27 by the ultraviolet irradiation device 8 are moved, for example, by moving the substrates 21 to 27 below the ultraviolet irradiation device 8 by the conveyor 16. Irradiation with ultraviolet rays may be performed. Irradiation of ultraviolet rays onto the substrates 21 to 27 is controlled by the control device 20.

  In the first drawing apparatus 71, the substrate inversion station, specifically, from the end of drawing on the surface of the substrate 24 in the inspection / drawing station 3 to the placement of the substrate 24 on the stage of the inspection / drawing station 6. 4, the solder resist formed on the surface of the substrate 24 is fully cured. The solder resist formed on the surface of the substrate 24 at the inspection / drawing station 3 is finally cured at the substrate reversing station 4 without coming into contact with anywhere.

  The substrate 24 which has not been fully cured is tacky (sticky) because the inner region of the solder resist is not completely solidified. When the solder resist pattern is formed on the back surface of the substrate 24 without performing the main curing of the solder resist on the surface of the substrate 24, for example, when the substrate 24 is handled by the lifter 13 or when the back surface of the substrate 24 is drawn at the inspection / drawing station 6, There may be scratches or marks on the solder resist on the surface. In addition, there may be a problem in processing due to tack.

  The solder resist formed on the surface of the substrate 24 is fully cured between the end of drawing on the surface of the substrate 24 and the placement of the substrate 24 on the stage of the inspection / drawing station 6. It is possible to prevent the solder resist from being scratched or marked. Therefore, high quality drawing can be performed.

  Moreover, since the main curing of the solder resist on the back surface of the substrate 24 is performed by the ultraviolet light emitted from the ultraviolet irradiation device 8, the solder resist on the back surface of the substrate 24 is scratched or marked after being transported to the outside of the housing 18. Can be prevented.

  With reference to FIGS. 7A to 7G, the inspection function of the droplet discharge device 70 according to the embodiment disposed in the inspection / drawing stations 3 and 6 will be described. The droplet discharge device 70 according to the embodiment has not only a drawing function but also an inspection function for inspecting whether or not the discharge of droplets from the inkjet nozzle is performed properly.

(First embodiment)
FIG. 7A shows a part of a droplet discharge device 70 according to the embodiment. In the droplet discharge device 70 according to the embodiment, an inspection unit 81 is provided on the Y axis negative direction side of the discharge unit 80 that discharges ink toward the substrates 21 to 27. The inspection unit 81 includes a frame 82 having the same configuration as the frame 42 of the discharge unit 80, for example. That is, the frame 82 is composed of two pillars erected in the Z-axis direction and a beam passed along the X-axis direction between them, and when viewed along the Y-axis direction, the frame 82 is a gate. Enclose in a mold. On the beam of the frame 82, for example, a line sensor 67 is held so as to be movable in the X-axis direction by a linear motor via a guide so as to face the moving stage.

  The line sensor 67 includes 7500 photodiodes arranged in one direction, for example, in a range of 35 mm, and is a detector that can image (detect) the substrates 21 to 27 held on the chuck plate 45. The line sensor 67 is arranged so that the arrangement direction of the photodiodes is parallel to the Y-axis direction. The line sensor 67 is controlled by the control device 20. For this reason, imaging by the line sensor 67 and movement of the line sensor 67 are performed in response to a command from the control device 20.

  For example, after the ink is applied to the substrates 21 to 27 by the ejection unit 80, the substrates 21 to 27 are moved to the inspection unit 81 by driving the Y stage 44 while being sucked and held by the chuck plate 45. The positions of the discharge unit 80 and the inspection unit 81, for example, the arrangement positions of the inkjet head units 47a to 47f and the line sensor 67 in the Y-axis direction are stored in the storage device 20a, and the control device is stored in the storage device 20a. Based on the position data of the inspection unit 81, the substrates 21 to 27 are moved to the inspection unit 81. FIG. 7A schematically shows the substrate 23 moved below the frame 82 of the inspection unit 81 by the moving stage.

  When the substrate 23 is moved to the inspection unit 81, the ink ejection result (landing trace) in the ejection unit 80 is inspected. If it becomes clear from the inspection of the discharge result that, for example, the inkjet nozzle is clogged and the coating is missing to the extent that it is considered defective, the substrate 23 needs to be repaired, and the substrate 23 The location where the omission occurs is stored in the storage device 20a. In addition, the control device 20 notifies the drawing device operator that the inkjet nozzle is clogged. Thus, maintenance for eliminating nozzle clogging can be performed before ink is applied to the substrate 22.

  As an example, the line sensor 67 images the application result of the substrate while moving over the substrate 23 along the X-axis direction, and transmits the image data to the control device 20. The control device 20 detects the application result, for example, the edge of the circular pattern or the line where ink is not applied and is missing, and stores it in the storage device 20a. The stored data may be used to determine whether or not ink is applied to the substrate 23 (pass / fail determination), or the data may be used when repairing later.

(Second embodiment)
The ink application results on the substrates 21 to 27 can be detected as described above, but there are other methods for detecting clogging of the inkjet nozzles. Here, an embodiment will be described in which, for example, an inspection plate is used to inspect whether or not liquid droplets are properly ejected from the inkjet nozzle.

  Refer to FIG. 7B. The inspection plate 28 is an inspection substrate that is long in one direction, for example, in which a copper foil is formed on an epoxy resin. The length in the longitudinal direction of the inspection plate 28 is, for example, about 550 mm, and the width is, for example, several tens of millimeters. It is also possible to form only copper foil without using an epoxy resin.

  The inspection substrate 28 is sucked and held on the chuck plate 45 with the copper foil forming surface facing upward (Z-axis positive direction), for example, so that the longitudinal direction is parallel to the X-axis direction. The position on the stage for holding the inspection substrate 28 is below the inkjet head units 47a to 47f.

  The control device 20 drives the Y stage 44 and inspects ink from all the ink jet nozzles of the ink jet head units 47a to 47f while moving the inspection substrate 28 in the Y axis direction, for example, the Y axis negative direction. A command to discharge (inspection discharge) toward the substrate 28 is issued. For example, the ink is continuously discharged for a period in which the inspection substrate 28 is moved 1 mm in the negative Y-axis direction.

  The control device 20 controls the moving stage, moves the inspection plate 28 (ink discharge region) below the ink jet head, and discharges ink according to the position of the nozzle formed on the ink jet head.

  FIG. 7B is a plan view of the inspection substrate 28 after ink ejection. In this figure, the landed ink trace (ejection trace) is shown by a solid line. The left side of the drawing is the landing track of ink ejected from the inkjet nozzles of the inkjet head unit 47a, and the right side of the drawing is the landing track of ink discharged from the inkjet nozzles of the inkjet head unit 47f. The description of the landing spot of the ink ejected from the inkjet nozzles of the inkjet head units 47b to 47e in the middle is omitted.

  For example, a linear landing track having a length of 1 mm in the Y-axis direction is formed by ink ejected from each normal inkjet nozzle having no nozzle clogging. For this reason, corresponding to the arrangement of the inkjet nozzles shown in FIG. 4B, for each of the inkjet head units 47a to 47f, eight landing rows along the longitudinal direction of the inspection substrate 28 are formed in the width direction of the inspection substrate 28. The

  FIG. 7C is a plan view showing the inspection substrate 28 sucked and held on the chuck plate 45. The inspection substrate 28 that has been subjected to the inspection discharge is moved to the inspection unit 81 in the negative direction of the Y axis in the inspection / drawing stations 3 and 6 by driving the Y stage 44 while being sucked and held by the chuck plate 45. Is done. In FIG. 7C, the inspection substrate 28 after being moved is shown in parentheses.

  The inspection substrate 28 (landing trace) and the line sensor 67 are aligned with respect to the Y-axis direction. The inspection substrate 28 is moved below the movable position of the line sensor 67 by the Y stage 44.

  Refer to FIG. 7D. In the example shown in the drawing, the line sensor 67 moves in a range including, for example, a constant speed from one end to the other end in the longitudinal direction of the test substrate 28 in the X-axis negative direction. Meanwhile, the copper foil surface of the inspection substrate 28 is photographed (ink discharge traces due to inspection discharge are detected).

  As shown in FIG. 7E, the line sensor 67 images at least a range in which ink can be ejected by inspection ejection, for example, the entire copper foil surface of the inspection substrate 28. All landing traces along the X-axis direction are collectively detected by one scan.

  In this example, the substrate 28 for inspection is held so that the longitudinal direction is parallel to the X-axis direction, and the line sensor 67 is moved to the X-axis in a range where a linear landing track having a length of 1 mm can be formed in the Y-axis direction. Move in the negative direction and shoot with one scan. The line sensor 67 only needs to be arranged so that it can be photographed by moving in one direction the range on the inspection substrate 28 where a linear landing track having a length of 1 mm can be formed. Therefore, for example, the inspection substrate 28 may not be held so that the longitudinal direction is exactly parallel to the X-axis direction, and the moving direction of the line sensor 67 is not exactly parallel to the X-axis direction. May be. However, it is desirable that the extending direction of the linear landing trace and the moving direction of the line sensor 67 are orthogonal to each other. By doing so, the detection width (35 mm in this example) of the line sensor 67 can be shortened. Further, even when a larger number of ink jet head units than those in the embodiment are mounted, the landing track can be imaged by one scan of one line sensor 67 regardless of the number of ink jet head units.

Further, in this example, the line sensor 67 is moved in the negative direction of the X axis.
3, the inspection substrate 28 may be moved in the positive direction of the X axis. The line sensor 67 and the inspection substrate 28 (the stage that holds the inspection substrate 28) are relatively positioned so that a range on the inspection substrate 28 where a linear landing track having a length of 1 mm can be formed can be photographed. Move it.

  In addition, this example employs a configuration in which the line sensor 67 is disposed on the Y axis negative direction side of the position where the frame 42 is disposed. For example, the line sensor 67 is held by the frame 42 so as to be movable in the X axis direction. It may be.

  Image data of the copper foil surface of the inspection substrate 28 taken by the line sensor 67 is transmitted to the control device 20.

  The control device 20 discharges droplets from the nozzles of the inkjet head units 47a to 47f based on the image data (detection result) acquired by the line sensor 67, specifically, the landing trace on the inspection substrate 28. Is determined properly, for example, a discharge failure is detected. As an example, a position where a landing track is not formed (missing landing track) or a position where the landing track is blurred (insufficient landing track) is detected, and ink should be discharged normally at that position. Identify inkjet nozzles. Then, the control device 20 notifies the nozzles that are not ejected properly and that are not ejected properly. As a cause of ejection failure, for example, nozzle clogging can be considered.

  The user who has received the notification can take measures such as improving nozzle clogging, for example, according to the notification contents and the circumstances on the user side.

  In this example, the stage is not moved in the X-axis direction (the relative position of the inkjet head and the stage is not changed in the X-axis direction), and is continuously a predetermined length only in the Y-axis direction, for example, only 1 mm. Apply ink. With respect to the X-axis direction, the nozzles are discharged at a certain distance without being covered with the discharge results of the respective nozzles, so that nozzle clogging can be detected with high accuracy. For example, when a nozzle is clogged, a 1 mm landing track is not formed, and therefore it is possible to easily identify which nozzle is clogged.

  Note that the ink may be applied so that the landing mark becomes a dot shape without being applied linearly. However, since the thickness of the line can also be detected by applying it in a linear form, the nozzle is not completely clogged, but it is detected even when, for example, about half clogging occurs and the ink discharge is poor. be able to. For example, the control device 20 compares the line width with a threshold value, and determines that the discharge is defective when the width is less than the threshold value.

  When adjacent n nozzles, for example, two or three nozzles, are continuously defective, if a solder resist pattern is formed on the substrates 21 to 27 without taking measures to improve nozzle clogging, lines where ink is not ejected are continuous. Therefore, as shown in FIG. 7F, shapes like grooves are formed on the substrates 21-27. Such a board | substrate 21-27 can also be made out of a specification not satisfy | filling the quality as a product. In addition, when two or more adjacent nozzles are continuously defective, the mode of notification by the control device 20 may be made special.

  The inspection of the second embodiment is performed every time drawing on a predetermined number of substrates, for example, 100 substrates, is completed under the control of the control device 20. It may be performed for each rod or may be performed before drawing on one substrate is started.

The droplet discharge device according to the embodiment further determines whether or not droplets are discharged from a plurality of inkjet heads, for example, the inkjet nozzles 47a _{1 to} 47a ₄ of the inkjet head unit 47a, every time a predetermined number of substrates are processed. Recognizes whether or not droplets are ejected from each of the inkjet nozzles of a plurality of inkjet head units, for example, the inkjet head units 47 a to 47 f, based on image data acquired by one scan of one line sensor 67. The user can take measures so that the liquid droplets are appropriately discharged from each nozzle according to the grasped result. For this reason, according to the droplet discharge device according to the embodiment, it is possible to perform high-quality drawing by inspecting the quality of the droplet discharge with high efficiency using a simple configuration.

(Third embodiment)
In the second embodiment, the inspection substrate 28 is used to determine whether or not the liquid droplets are ejected from the ink jet nozzles. However, a nozzle clogging inspection may be performed using a substrate on which a solder resist is formed.

  As shown in FIG. 7G, a drawing region 29a and an inspection region 29b are provided on a substrate 29 on which a solder resist is to be formed. In forming the solder resist pattern, ink is applied to a predetermined position in the drawing area 29a. In the example shown in this figure, 20 drawing regions 29 a are defined on the substrate 29 in 5 rows and 4 columns. The length of each drawing region 29a along the X-axis direction is, for example, about 30 mm. The inspection region 29b is a rectangular region defined at the end of the substrate 29 in the Y-axis direction, and has a size of, for example, about 30 mm in the X-axis direction and tens of mm in the Y-axis direction.

  In the drawing area 29a shown in the drawing, drawing is performed using, for example, a droplet discharge device that includes only one inkjet head unit 47a instead of six inkjet head units. Ink is ejected toward the substrate 29 while reciprocating in the Y-axis direction, and drawing is performed in the five drawing regions 29a in the leftmost column. After the substrate 29 is moved about 30 mm in the X-axis positive direction, the ink is ejected toward the substrate 29 while reciprocating once in the Y-axis direction, thereby drawing in the drawing region 29a in the second column from the left. . By repeating this, a solder resist is formed in all the drawing regions 29a.

  Prior to application of ink to the drawing area 29a, ink is simultaneously ejected from the inkjet nozzles of the inkjet head unit 47a to the inspection area 29b. Ink is ejected while moving the substrate in the Y-axis direction, for example, to form a landing track indicated by reference numeral 47a in FIG. 7B. In the same manner as in the second embodiment, the quality of droplet discharge from the ink jet nozzle is grasped by one scan of the line sensor 67 in the X-axis direction.

  Alternatively, after ink ejection to the inspection area 29b, drawing may be performed in the drawing area 29a without performing the inspection of the quality of the liquid droplet ejection. In this case, the ink ejected to the inspection area 29b is used for history management for each substrate. That is, if necessary, the landing trace can be detected later by the line sensor 67 and used for the evaluation of the solder resist formation on the substrate 29.

  When the inspection area 29b is provided on the substrate 29 and a landing track in the inspection area 29b is detected, the position of the inspection area 29b on the substrate 29 is stored in the storage device 20a. The control device 20 controls the movement of the substrate 29 by the moving stage and the ejection of ink from the ink jet head based on the position data of the inspection region 29b stored in the storage device 20a, and supplies ink to the inspection region 29b. Discharge. Then, the substrate 29 is moved below the position where the line sensor 67 is disposed, and the ink landing trace formed in the inspection region 29b is detected.

  By providing the inspection region 29b on the substrate 29 on which the solder resist is to be formed, the inspection plate 28 becomes unnecessary. For this reason, cost performance can be improved.

  It should be noted that the line sensor 67 may be installed within the stage reciprocating motion range in the Y-axis direction when drawing in the drawing area 29a. In this case, the inspection unit 81 is not necessary, and the footprint can be reduced. In addition, since the tact for the inspection by moving the stage of the substrate 29 to the inspection unit 81 can be suppressed, the production efficiency can be further increased.

  In the description of the third embodiment, the droplet discharge device having one inkjet head unit is used. However, the same can be performed by using a droplet discharge device having six inkjet head units.

(Fourth embodiment)
It is also possible to eject ink from the inkjet nozzles, detect the ejection result (application result), and use it for relative position correction between inkjet heads or between inkjet head units.

  FIG. 8A is a schematic diagram showing landing spots (# 1) and (# 2) of ink ejected from the nozzles of inkjet heads # 1 and # 2. Inside each rectangle drawn by a broken line, two landing tracks extend in the X-axis direction. FIG. 8B shows enlarged ink landing marks (# 1) and (# 2) from the ink jet heads # 1 and # 2. The landing track of each ink shows a linear shape having a length of 1 mm in the Y-axis direction, for example. The ink landing traces (# 1) and (# 2) from the inkjet heads # 1 and # 2 are detected by one scan along the X-axis direction of the line sensor 67, for example.

From the image data acquired by the line sensor 67, for example, the control device 20 determines, for example, the ink landing trace on the upper left side of the landing trace (# 1) (the ink landing on the most X axis negative direction side in the Y axis positive direction column). The distance along the Y-axis direction between the track) and the landing track (# 2) is ascertained. Further, the distance along the Y-axis direction between the lower right ink landing track in the landing track (# 1) and that in the landing track (# 2) is grasped. Then, an average value _lΔY of these distances is calculated.

  In the manufacture of the ink jet head unit, for example, the ink jet head # 1 and the ink jet head # 2 are assembled to the carriage so that the distance (arrangement interval) between them along the Y-axis direction is 20 μm. At the time of assembly, an operator carefully adjusts the position while measuring the assembly position of the inkjet head and the distance between the plurality of inkjet heads. For this reason, much work time is required.

However, after assembling the inkjet heads # 1 and # 2, the distance along the Y-axis direction between the ink landing marks ejected from the nozzles of the inkjet heads # 1 and # 2 is measured, and the average value _lΔY is calculated. Since the distance along the Y-axis direction between the inkjet heads # 1 and # 2 (arrangement interval) can be obtained from this and the size along the Y-axis direction of the inkjet heads # 1 and # 2, the inkjet head # 1. The distance between the ink jet heads # 1 and # 2 can be corrected from the ejection results without actually measuring the distance between # 2 and # 2 in the Y-axis direction. For this reason, for example, it is possible to shorten the time for assembling the inkjet head.

The positional deviation in the X-axis direction can be similarly corrected. Inkjet heads # 1 and # 2 are assembled to the carriage so as to be displaced by, for example, 20 μm in the X-axis direction. Therefore, the distance along the X-axis direction between the upper left ink landing track in the landing track (# 1) and the landing track (# 2), and the lower right ink landing track in the landing track (# 1) Then, the distance along the X-axis direction between it and the landing track (# 2) is grasped. Then, an average value _lΔX of these distances is calculated. As an example, if the average value _lΔX is 21 μm, the assembly displacement along the X-axis direction between the inkjet heads # 1 and # 2 may be reduced by 1 μm.

As for the deviation in the Y-axis direction, the assembly position of the inkjet head can be adjusted, but the deviation can be corrected by controlling the ejection timing of the ink from the inkjet nozzle. Therefore, for example, the calculated average value l _ΔY or the distance (arrangement interval) along the Y-axis direction between the inkjet heads # 1 and # 2 may be stored in the storage device 20a.

(5th Example)
FIG. 8C shows another example of the application result. In FIG. 8C, the ink landing trace from the inkjet nozzle is shown by a solid line, and the ink landing reference position is shown by a broken line. The ink landing trace (in this case, for example, the discharge start point of each nozzle) is detected by one scan along the X-axis direction of the line sensor 67.

  For example, by detecting deviations from a reference position (a deviation ΔX in the X-axis direction and a deviation ΔY in the Y-axis direction) of a plurality of ink landing traces, there is a deviation in the θ direction (Δθ) in the assembly of the inkjet head. Can be detected.

  In addition, a plurality of nozzles are formed in the ink-jet head before being assembled to the carriage, but there may be a slight shift in the formation position during the manufacturing process of forming the nozzles in the ink-jet head. In that case, for example, ΔY is detected for N landing tracks from the application result, and the average value of the whole is calculated. The ink jet timing from the ink jet nozzles can be controlled so that the assembly of the ink jet head is rotationally corrected in the θ direction so that the average value is minimized, or an equivalent effect can be obtained.

  It is also possible to correct a relative positional shift in the θ direction between the inkjet heads.

  FIG. 9 is a schematic diagram showing the second drawing device 72. The second drawing device 72 does not include an alignment device in which the alignment stations 2 and 5 perform θ correction, and a droplet discharge device (a droplet discharge device according to a modification) of the inspection / drawing stations 3 and 6 is θ. The first drawing apparatus 71 is different from the first drawing apparatus 71 in that it includes a stage 49 and CCD cameras 63 to 66.

  The alignment stations 2 and 5 of the second drawing apparatus 72 are provided with a temporary stage 48 which is an alignment apparatus that performs simple alignment without θ correction. The substrates 21 to 27 are placed on the temporary placement stage 48 of the alignment stations 2 and 5 by the lifters 11 and 13 and subjected to simple alignment such as pressing against the fixed pins, and then the inspection / drawing station. 3 and 6 are conveyed.

  The droplet discharge device according to the modification includes, for example, a θ stage 49 between the Y stage 44 and the chuck plate 45. The θ stage 49 can rotate the substrates 21 to 27 held by the chuck plate 45 around a rotation axis parallel to the Z axis in a plane parallel to the XY plane. In addition, the droplet discharge device according to the modification includes CCD cameras 63 to 66 that detect alignment marks formed on the front and back surfaces of the substrates 21 to 27.

  The substrates 21 to 27 conveyed to the inspection / drawing stations 3 and 6 are sucked and held by the chuck plate 45, and the alignment marks on the front and back surfaces are detected by the CCD cameras 63 to 66. The detection result (captured image data) is transmitted to the control device 20.

  The control device 20 processes the detection results, grasps the positions and orientations (directions) of the substrates 21 to 27 in the in-plane direction of the substrate, and drives the θ stage 49, for example. The posture in the inward direction is corrected (θ correction). Moreover, the control apparatus 20 grasps | ascertains the size of the board | substrates 21-27 based on the detection result of CCD camera 63-66, and produces | generates inkjet control data according to the grasped size.

  In the second drawing device 72, the θ correction of the substrates 21 to 27 is not performed in the alignment stations 2 and 5, and the θ stage 49 is used in the inspection / drawing stations 3 and 6 (droplet discharge device according to a modified example). After performing θ correction of the substrates 21 to 27, the substrates 21 to 27 are drawn based on the generated ink jet control data.

  Also in the droplet discharge device according to the modification, for example, when processing of a specified number of substrates is completed, the line sensor 67 is used to properly discharge droplets from the nozzles of the inkjet head units 47a to 47f. Whether it is present or not.

  Also in the second drawing device 72, the substrates 21 to 27 whose front and back are reversed are placed on the stage of the inspection / drawing station 6 from the end of drawing on the surfaces of the substrates 21 to 27 in the inspection / drawing station 3. Specifically, in the substrate inversion station 4, the solder resist formed on the surfaces of the substrates 21 to 27 is fully cured. Thereby, it is possible to prevent the solder resist on the surfaces of the substrates 21 to 27 from being scratched or marked. Therefore, high quality drawing can be performed.

  Moreover, since the main curing of the solder resists on the back surfaces of the substrates 21 to 27 is performed by the ultraviolet rays emitted from the ultraviolet irradiation device 8, the solder resists on the back surfaces of the substrates 21 to 27 are not damaged after being carried out of the casing 18. It is possible to prevent marking.

  Further, the droplet discharge device according to the modified example is also highly efficient by using a simple configuration as to whether or not droplets are appropriately discharged from the nozzles of the inkjet head units 47a to 47f, as in the embodiment. Can be used for high quality drawing.

  FIG. 10 is a schematic diagram showing the third drawing device 73. The third drawing apparatus 73 is different from the first drawing apparatus 71 in that it does not include the substrate inversion station 4, the alignment station 5, the inspection / drawing station 6, and the lifters 12 and 13. The first and second drawing devices 71 and 72 are drawing devices that draw on both surfaces of the substrates 21 to 27, but the third drawing device 73 draws only on one surface, for example, the surface of the substrates 21 to 24. Is a drawing device that performs.

  In the third drawing apparatus 73, the alignment station 2 and the inspection / drawing station 3 perform processing in parallel. That is, during the detection of the alignment mark formed on the surface of the substrate 22 and the alignment of the substrate 22 at the alignment station 2, the solder resist pattern is formed on the surface of the substrate 23 at the inspection / drawing station 3. It is formed. During this time, for example, the conveyor 15 carries the substrate 21 in which the solder resist is not formed into the housing 18. The substrate 24 on which drawing on the surface has been completed is transported to the conveyor 16 by the lifter 14 and placed on the conveyor 16, and the solder resist formed on the surface by the ultraviolet rays emitted from the ultraviolet irradiation device 8. Main curing is performed. Then, it is carried out from the carry-out port 7 to the outside of the housing 18 by the conveyor 16.

  Also in the third drawing device 73, the droplet discharge device according to the embodiment included in the inspection / drawing station 3 is whether or not the droplet discharge from each nozzle of the inkjet head units 47a to 47f is appropriately performed. Can be inspected with high efficiency using a simple configuration, and high-quality drawing can be performed.

    Although the present invention has been described with reference to the embodiments and the modifications, the present invention is not limited to these.

  For example, in the embodiment and the modification, the substrate is moved relative to the inkjet head unit (moving in the XY plane) only by the stage. For example, the frame is movable in the Y-axis direction, and the inkjet head unit is moved to the frame. As a configuration that is movably mounted in the X-axis direction and the Z-axis direction, the substrate may be moved in the XY plane direction with respect to the inkjet head unit using both the configuration and the stage. What is necessary is just to move an inkjet head unit and a board | substrate relatively. However, the configuration of the embodiment and the modified example in which only the substrate is moved in the XY plane can perform drawing with higher accuracy than the configuration in which the inkjet head unit is also moved in the XY plane direction.

  Moreover, although the insulating film (solder resist) was formed on the printed wiring board in the examples and the modified examples, it can be used for the purpose of forming the insulating film on the glass substrate in, for example, manufacturing a touch panel.

  Further, in the embodiment and the modification, the ink landing trace is detected using one line sensor, but the plurality of line sensors are arranged in the Y-axis direction so that the arrangement direction of the photodiodes is the Y-axis direction. May be detected along the lines. By using a plurality of line sensors, even if a landing track is long in the Y-axis direction, it can be detected by one scan.

  It will be apparent to those skilled in the art that other various modifications, improvements, combinations, and the like are possible.

  It can be widely used for forming an insulating film on a substrate.

DESCRIPTION OF SYMBOLS 1 Carry-in entrance 2 Alignment station 3 Inspection / drawing station 4 Substrate inversion station 5 Alignment station 6 Inspection / drawing station 7 Carry-out port 8 Ultraviolet irradiation devices 11-14 Lifters 15, 16 Conveyor 18 Housing 20 Controller 20a Storage devices 21-27 Substrate 22a-22d Alignment mark 28 Inspection plate 29 Substrate 29a Drawing area 29b Inspection area 31 Base 32 Y stage 33 θ stage 34 Chuck plate 35-38 CCD camera 41 Base 42 Frame 42a, 42b Post 42c Beam 43 X stage 44 Y stage 45 chuck plate 46 connecting member 47a~47f inkjet head unit _47a 1 _{~47a 4} inkjet heads _47a 5 _{~47a 9} ultraviolet light source 47a _c carriage 48 temporary Placement stage 49 θ stage 50 Substrate reversing device 51 Substrate holder 52 Support member 53 Vacuum suction pad 54 Press roller 55 Clamp mechanism 60 Ultraviolet irradiation device 61 Support member 62 Ultraviolet light source 63 to 66 CCD camera 67 Line sensor 70 Droplet ejection device 71 First drawing device 72 Second drawing device 73 Third drawing device 80 Discharge unit 81 Inspection unit 82 Frame

Claims (8)

A substrate holding stage capable of holding the substrate and moving the held substrate in a horizontal plane direction;
A plurality of discharge nozzles capable of discharging an insulating material, and a discharge head disposed to face the stage;
A sensor for detecting a landing mark of the insulating material discharged from the plurality of discharge nozzles;
A control device for controlling the stage, the ejection head, and the sensor;
The stage can move the held substrate in at least one axial direction,
The plurality of discharge nozzles of the discharge head are arranged along a direction orthogonal to the uniaxial direction in a horizontal plane,
The sensor is disposed opposite to the stage so as to be movable relative to the stage in a direction perpendicular to the uniaxial direction in a horizontal plane.
The control device controls the stage and the ejection head, and controls the stage and the sensor to perform ejection by ejecting an insulating material onto the substrate held on the stage, thereby performing ejection. It has an inspection function to detect the impact mark of the insulating material,
The control device is a droplet discharge device that moves the sensor relative to the stage in a direction perpendicular to the uniaxial direction within a horizontal plane when detecting the landing trace of the discharged insulating material.   The droplet discharge apparatus according to claim 1, wherein a plurality of discharge nozzles of the discharge head are also arranged in the uniaxial direction, and a plurality of sensors are arranged along the uniaxial direction. The stage holds a substrate in which an area to be coated with an insulating material and an inspection area are defined,
The control device stores data indicating a region where the insulating material is to be applied, and data on the position of the inspection region, and based on the stored data on the position of the inspection region, the stage and the The discharge head is controlled to discharge an insulating material to the inspection region, and the stage and the sensor are controlled to detect a landing mark of the insulating material discharged to the inspection region. Droplet discharge device. Including an ejection unit in which the ejection head is disposed, and an inspection unit in which the sensor is disposed,
The control device stores position data of the inspection unit, moves the substrate held on the stage to the inspection unit based on the stored position data of the inspection unit, and discharges the substrate to the substrate The droplet discharge device according to any one of claims 1 to 3, wherein a landing mark of the insulating material is detected.   The control device controls the stage to move a substrate held on the stage below the discharge head and discharge an insulating material corresponding to the position of the discharge nozzle formed on the discharge head. The droplet discharge device according to any one of claims 1 to 4.   The controller discharges an insulating material while moving the substrate held by the stage in the uniaxial direction without moving the substrate relative to the discharge head in a direction perpendicular to the uniaxial direction in a horizontal plane. The droplet discharge device according to claim 5. (A) An insulating material is discharged from a discharge head including a plurality of discharge nozzles arranged along a direction orthogonal to the uniaxial direction in a horizontal plane on a substrate held movably in a uniaxial direction in a horizontal plane. A process of forming a landing track;
(B) An inspection method including a step of detecting the landing track by moving a sensor relative to the substrate in a direction perpendicular to the uniaxial direction within a horizontal plane.   The inspection method according to claim 7, wherein a plurality of discharge nozzles of the discharge head are arranged in the uniaxial direction, and a plurality of sensors are arranged along the uniaxial direction.

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