JP2013030571A - Droplet discharge apparatus and droplet discharge method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform lithography with high accuracy.SOLUTION: A droplet discharge apparatus includes: a stage holding a substrate and moving the substrate in a horizontal plane direction; a discharge head disposed facing the substrate and discharging an insulation material to the substrate; a pressing part pressing a position of a part of the substrate; and a control device performing controlling so that the pressing part presses positions on the substrate where the insulation material is not discharged by the discharge head.

Description

  The present invention relates to a droplet discharge apparatus and a droplet discharge method for discharging a droplet to form an insulating film on a substrate.

  Technology for forming (drawing) a material layer on a substrate by discharging a liquid material (ink) containing a pattern forming material as droplets from a discharge head (inkjet head) onto a pattern forming surface such as a printed wiring board It has been known.

  For example, a solder resist pattern is formed by the material layer drawn on the substrate. The solder resist is formed on the wiring board so that the necessary conductor parts are exposed and the parts that do not need to be soldered are not soldered for the soldering of printed wiring boards with conductor wiring formed on the base material. This is an insulating film.

  An invention of a liquid resin ejecting apparatus that forms a pattern by spraying a liquid resin directly on a substrate based on image information of computer graphics is disclosed (for example, see Patent Document 1). According to the invention described in Patent Literature 1, a highly accurate pattern can be easily formed. Further, the process can be shortened and the production cost can be reduced as compared with the case where pattern formation is performed by photolithography.

  The substrate is usually warped. When ink is ejected from a inkjet head onto a warped substrate, the distance between the ink ejection position and the substrate varies with the movement of the substrate.

  11A to 11C are photographs showing ink landed on the substrate. 11A shows a case where the distance between the ink ejection position and the substrate is 0.5 mm, FIG. 11B shows a case where the distance is 1.0 mm, and FIG. 11C shows a case where the distance is 1.5 mm. When the distance between the ink ejection position and the substrate is 0.5 mm, the ink lands on a substantially circular shape. However, when the distance between the two becomes as large as 1.0 mm and 1.5 mm, the ink shows a broken circular landing track. If ink landing is disturbed, drawing may not be performed with high accuracy. For this reason, it is desirable that the distance between the ink ejection position and the substrate is kept constant, for example, 0.5 mm.

Japanese Patent No. 3544543

  An object of the present invention is to provide a droplet discharge apparatus and a droplet discharge method capable of drawing with high accuracy.

  According to one aspect of the present invention, a stage that holds a substrate and moves it in a horizontal plane, a discharge head that is disposed opposite to the substrate and discharges an insulating material toward the substrate, and a stage on the substrate. Provided is a droplet discharge device having a pressing portion that presses the position of the portion, and a control device that controls the pressing portion to press the position on the substrate where the insulating material is not discharged by the discharge head Is done.

  According to another aspect of the present invention, (a) a step of holding the substrate, and (b) an insulating material toward the substrate while moving the held substrate along a uniaxial direction in a horizontal plane direction. A step of forming an insulating film on the substrate with the discharged insulating material, and in the step (b), a part of the substrate on which the insulating material is not discharged is pressed. However, a droplet discharge method for discharging an insulating material toward the substrate is provided.

  According to the present invention, it is possible to provide a droplet discharge apparatus and a droplet discharge method capable of drawing with high accuracy.

It is the schematic which shows the 1st drawing apparatus containing the droplet discharge apparatus by an Example. 2A is a schematic view showing an alignment apparatus included in the alignment station 2, and FIGS. 2B and 2C are plan views showing a substrate 22 in the alignment station 2. FIG. 3A to 3C are schematic views showing a droplet discharge device 80 according to the embodiment. 4A is a schematic view showing the inkjet head unit 47a, FIG. 4B is a plan view showing a droplet discharge surface of the inkjet head unit 47a, and FIG. 4C is a schematic showing the arrangement of the inkjet head units 47a to 47f. FIG. 5A and 5C are schematic plan views showing a substrate on which drawing is performed by the droplet discharge device according to the embodiment, and FIGS. 5B and 5D are schematic cross-sectional views. 6A and 6B are schematic diagrams illustrating a droplet discharge method using a droplet discharge apparatus according to a modification. 7A to 7D are schematic views showing the substrate reversing device 50 and the ultraviolet irradiation device (solder resist solidifying device) 60 included in the substrate reversing station 4. 8A, 8C, and 8E are schematic plan views showing the substrate holder 51, and FIGS. 8B, 8D, and 8F are schematic side views showing the substrate holder 51. FIG. It is the schematic which shows a 2nd drawing apparatus. It is the schematic which shows a 3rd drawing apparatus. 11A to 11C are photographs showing ink landed on the substrate.

  FIG. 1 is a schematic diagram illustrating a first drawing device including a droplet discharge device according to an embodiment. The first drawing apparatus includes an alignment station 2, a drawing station 3, a substrate reversing station 4, an alignment station 5, a drawing station 6, an ultraviolet irradiation device 8, and lifters 11 to 14, which are arranged inside the housing 18. Consists of including. The housing 18 of the first drawing apparatus is provided with a substrate carry-in port 1 and a substrate carry-out port 7. The first drawing apparatus is used to form solder resist patterns on the front and back surfaces of substrates 21 to 27, which are rectangular printed wiring boards, for example. The first drawing device includes conveyors 15 and 16 and a control device 20. The movement of the substrates 21 to 27 to the inside of the housing 18 is performed by the conveyor 15. The transfer of the substrates 21 to 27 in the housing 18 is performed using the lifters 11 to 14. The conveyor 16 carries the substrates 21 to 27 out of the housing 18. The operation within the housing 18 and the operations of the conveyors 15 and 16 are controlled by the control device 20. The control device 20 includes a storage device 20a that is, for example, a memory.

  The substrates 21 to 27 are transported by the conveyor 15 and introduced into the housing 18 from the carry-in entrance 1. At this time, for example, the surfaces of the substrates 21 to 27 are directed upward (Z-axis positive direction) in the figure.

  In the present specification, a right-handed orthogonal coordinate system having a vertically upward direction in the Z-axis positive direction is defined. In the following description, five stations from the alignment station 2 to the drawing station 6 are sequentially arranged from the X-axis negative direction to the X-axis positive direction, and the substrate 21 carried into the housing 18 from the substrate carry-in port 1. -27 are transported in the positive direction of the X-axis as a whole via the stations 2-6, and are carried out of the housing 18 from the substrate carry-out port 7.

  The substrates 21 to 27 introduced into the housing 18 are transported to the alignment station 2 by the lifter 11. In the alignment station 2, alignment marks formed on the surfaces of the substrates 21 to 27 are detected, and alignment (positioning) of the substrates 21 to 27 is performed based on the detection result.

  The substrates 21 to 27 that have been aligned are transported to the drawing station 3 by the lifter 11. The drawing station 3 includes a droplet discharge device according to the embodiment. In the drawing station 3, solder resist patterns are formed (drawn) on the surfaces of the substrates 21 to 27, for example, with ultraviolet curable ink (insulating material).

  The substrates 21 to 27 having the solder resist pattern formed on the surface are conveyed to the substrate reversing station 4 by the lifter 12. In the substrate reversing station 4, the front and back of the substrates 21 to 27 are reversed. As a result, the back surfaces of the substrates 21 to 27 face the positive direction of the Z axis. Further, in the substrate inversion station 4, the surfaces of the substrates 21 to 27 are irradiated with ultraviolet rays, and the main curing of the solder resist formed on the surfaces of the substrates 21 to 27 is performed.

  The substrates 21 to 27 subjected to the main curing and the reverse of the front and back are conveyed to the alignment station 5 by the lifter 13. In the alignment station 5, the alignment marks formed on the back surfaces of the substrates 21 to 27 are detected, and the substrates 21 to 27 are aligned based on the detection result.

  The substrates 21 to 27 are transported to the drawing station 6 by the lifter 13. The drawing station 6 also includes a droplet discharge device according to the embodiment. In the drawing station 6, a solder resist pattern is formed on the back surfaces of the substrates 21 to 27 with ultraviolet curable ink.

  After the solder resist pattern is formed on the back surface of the substrates 21 to 27, the substrates 21 to 27 are transported to the conveyor 16 by the lifter 14, and are carried out of the housing 18 from the carry-out port 7 by the conveyor 16. While placed on the conveyor 16, the ultraviolet irradiation device 8 irradiates the entire back surfaces of the substrates 21 to 27 with ultraviolet rays, and the solder resist formed on the back surfaces of the substrates 21 to 27 is fully cured. The ultraviolet irradiation device 8 is movable in the housing 18 so as to pass over the substrates 21 to 27 placed on the conveyor 16, and while passing over the substrates 21 to 27, for example, at a constant speed, Ultraviolet rays are irradiated on the back surfaces of the substrates 21 to 27. Alternatively, the ultraviolet irradiation device 8 is fixedly disposed in the housing 18, and the substrates 21 to 27 are moved by the conveyor 16 at a constant speed below the ultraviolet irradiation device 8, for example. You may perform the irradiation of the ultraviolet-ray to 21-27. Irradiation of ultraviolet rays onto the substrates 21 to 27 is controlled by the control device 20.

  In the first drawing apparatus, processing is performed in parallel at each of the alignment station 2, the drawing station 3, the substrate inversion station 4, the alignment station 5, and the drawing station 6. That is, a solder resist pattern is formed on the surface of the substrate 23 in the drawing station 3 while the alignment station 2 detects the alignment mark formed on the surface of the substrate 22 and the alignment of the substrate 22 is performed. The During this time, in the substrate reversal station 4, the main curing of the solder resist formed on the surface of the substrate 24 and the reversal of the front and back of the substrate 24 are performed. In the alignment station 5, the alignment mark formed on the back surface of the substrate 25 is detected. And alignment of the board | substrate 25 is performed. In the drawing station 6, a solder resist pattern is formed on the back surface of the substrate 26. During this time, for example, the conveyor 15 carries the substrate 21 in which the solder resist is not formed into the housing 18. The substrate 27 on the conveyor 16 is irradiated with ultraviolet rays by the ultraviolet irradiation device 8, and the conveyor 16 carries out the substrate 27 having the solder resist pattern formed on the front and back from the housing 18. For this reason, improvement in production efficiency can be realized.

  The alignment station 2 will be described with reference to FIGS. 2A to 2C. FIG. 2A is a schematic diagram showing an alignment apparatus included in the alignment station 2. The alignment apparatus includes a Y stage 32, a θ stage 33, and a chuck plate 34 that are arranged in this order from the base 31 side on a base (base) 31. The chuck plate 34 sucks and holds the substrate 22 transported to the alignment station 2 by the lifter 11.

  The Y stage 32 can move the held substrate 22 in the Y-axis direction. The θ stage 33 can rotate the held substrate 22 around a rotation axis parallel to the Z axis in a plane parallel to the XY plane. The Y stage 32, the θ stage 33, and the chuck plate 34 constitute a moving stage that holds the substrate 22 and moves it within the alignment station 2. Adsorption of the substrate 22 by the chuck plate 34 and movement of the substrate 22 by the Y stage 32 and the θ stage 33 are controlled by the control device 20.

  The alignment apparatus includes CCD cameras 35-38. The CCD cameras 35 to 38 are detectors that can image (detect) an alignment mark formed on the substrate 22 held by the chuck plate 34. Imaging by the CCD cameras 35 to 38 is controlled by the control device 20. Further, image data (detection result) obtained by the CCD cameras 35 to 38 is transmitted to the control device 20.

  FIG. 2B is a plan view showing the substrate 22 conveyed to the alignment station 2 and sucked and held by the chuck plate 34. For example, alignment marks 22 a to 22 d are formed on the substrate 22 at four corners of the surface.

  The substrate 22 transported and placed on the chuck plate 34 by the lifter 11 is moved in the negative direction of the Y axis in the alignment station 2 by driving the Y stage 32 while being sucked and held by the chuck plate 34. In FIG. 2B, the substrate 22 after being moved is shown in parentheses.

  The CCD cameras 35 to 38 are configured so that the CCD cameras 35 to 38 can image the alignment marks 22 a to 22 d on the Y axis negative direction side of the position where the lifter 11 places the substrate 22 on the chuck plate 34. Has been placed. The substrate 22 is moved below the position where the CCD cameras 35 to 38 are disposed by the Y stage 32, and the CCD cameras 35 to 38 photograph the surface of the substrate 22 (alignment marks 22 a to 22 d). The captured image data is transmitted to the control device 20.

  The control device 20 processes the image data acquired by the CCD cameras 35 to 38 and grasps the position of the substrate 22 and the posture (orientation) in the XY plane (in the substrate 22 plane) direction. For example, the posture of the substrate 22 in the XY plane direction is corrected (changed) (θ correction).

  FIG. 2B shows, as an example, a case where the substrate 22 is displaced by an angle α counterclockwise in the XY plane. In this case, for example, the side connecting the apex on which the alignment mark 22a is formed and the apex on which the alignment mark 22d is formed is inclined by an angle α counterclockwise from the positive direction of the X axis with respect to the latter apex. Will be. This positional deviation is grasped by the control device 20 based on the image data acquired by the CCD cameras 35 to 38. The control device 20 corrects this positional deviation by rotating the θ stage 33 clockwise by an angle α. As a result of the correction, each side of the rectangular substrate 22 is parallel to the X axis or the Y axis.

  Refer to FIG. 2C. After the alignment marks 22a to 22d on the surface of the substrate 22 are detected by the CCD cameras 35 to 38 and the θ correction of the substrate 22 is performed based on the detection result, the control device 20 drives the Y stage 32 to drive the substrate 22. Is moved in the positive direction of the Y-axis. The driving distance of the Y stage 32 is determined when the substrate 22 is moved to the installation area of the CCD cameras 35 to 38 in order to detect the alignment marks 22a to 22d in the process shown in FIG. 2B, for example. Is equal to the distance driven in the negative Y-axis direction.

  The substrate 22 after being moved in the positive Y-axis direction is shown in parentheses in FIG. 2C. The substrate 22 subjected to the θ correction is transferred to the drawing station 3 by the lifter 11. The lifter 11 transports the substrate 22 whose orientation in the in-plane direction of the substrate is changed by the rotation of the θ stage 33 onto the stage of the drawing station 3 while maintaining the orientation.

  Since θ correction is completed at the alignment station 2, the drawing station 3 can start forming a solder resist pattern on the surface of the substrate 22 without correcting the position of the substrate 22. For example, compared with the case where θ correction is performed at the drawing station 3 and then a solder resist pattern is formed, the processing time at the drawing station 3 can be shortened, and thus the tact time can be shortened and the production efficiency can be improved. Is possible.

  It should be noted that the size of the substrate 22 is different from the design value when normal drawing occurs and drawing is performed. For this reason, the control device 20 grasps the size of the substrate 22 on the basis of the image data acquired using the CCD cameras 35 to 38 in the alignment station 2, and in the drawing station 3 according to the grasped size, Inkjet control data (bitmap) used when drawing the substrate 22 is generated. The generated inkjet control data is stored in the storage device 20a of the control device 20. This will be described in detail in the description of the drawing station 3 below.

  3A to 3C are schematic views showing a droplet discharge device 80 according to the embodiment included in the drawing station 3. FIG. Refer to FIG. 3A. The droplet discharge device 80 according to the embodiment includes a base (base) 41 installed in a plane parallel to the XY plane (horizontal plane), and an X stage 43 sequentially disposed on the base 41 from the base 41 side. A Y stage 44 and a chuck plate 45 are included. The chuck plate 45 sucks and holds the substrate 23 transported to the drawing station 3 by the lifter 11.

  The X stage 43 can move the held substrate 23 in the X-axis direction. The Y stage 44 can move the held substrate 23 in the Y-axis direction. The X stage 43, the Y stage 44, and the chuck plate 45 are disposed on the base 41, and constitute a moving stage that holds the substrate 23 and moves it within the drawing station 3. Adsorption of the substrate 23 by the chuck plate 45 and movement of the substrate 23 by the X stage 43 and the Y stage 44 are controlled by the control device 20.

  The X stage 43, the Y stage 44, and the chuck plate 45 may be arranged in the vertical direction as described above, or a high-function stage having the functions of the X stage 43, the Y stage 44, and the chuck plate 45 may be used. It may be used to realize a moving stage.

  Further, the droplet discharge device 80 according to the embodiment is fixed to the base 41 and surrounds the moving stage (X stage 43, Y stage 44, and chuck plate 45) in a gate shape when viewed along the Y-axis direction. And the inkjet head units 47 a to 47 f held by the frame 42.

  The frame 42 includes two struts 42a and 42b and a beam 42c. The support columns 42 a and 42 b are erected at the approximate center of the base 41 in the Y-axis direction. The beam 42c is supported by the columns 42a and 42b so as to be along the X-axis direction.

  The inkjet head units 47 a to 47 f are held on the surface on the Y axis negative direction side of the beam 42 c of the frame 42 via the first connecting member 46. Each of the inkjet head units 47a to 47f includes a plurality of inkjet heads and an ultraviolet light source. The inkjet head is disposed, for example, facing the substrate 23 held on the moving stage, and discharges (drops) ultraviolet curable ink (insulating material) as droplets toward the surface of the substrate 23 held on the moving stage. To do. Ink is discharged while moving the substrate 23 in the Y-axis direction. A material layer of a predetermined pattern, for example, a solder resist pattern is formed (drawn) on the surface of the substrate 23 by the ejected ink. The formed solder resist pattern is cured (temporarily cured) by the ultraviolet rays emitted from the ultraviolet light source.

  The storage device 20a of the control device 20 includes data (gerber data) indicating a region on which the solder resist is to be formed (region where the ink is to be applied) on the substrate 23, the amount of movement of the substrate 23 by the moving stage, and the inkjet head. Data indicating the relationship (discharge timing) with the ink discharge timing is stored. However, since this is a design value (initial value), the control device 20 generates ink jet control data from these data based on the image data of the substrate 23 imaged by the alignment station 2. For example, the control device 20 grasps the X and Y directions of the substrate 23 from the image data. For the X direction, the coordinates of the position where the ink is to be applied on the substrate 23 are corrected according to the X direction of the substrate 23 (correction of Gerber data). For the Y direction, the relationship (ejection timing) between the amount of movement of the substrate 23 by the Y stage 44 and the timing of ink ejection from the inkjet head is corrected according to the Y direction of the substrate 23. Thus, the inkjet control data obtained by correcting the data stored in advance in the storage device 20a is stored in the storage device 20a. For the Y direction of the substrate 23, the coordinates of the position where the ink should be applied on the substrate 23 may be corrected instead of the ejection timing (correction of Gerber data).

  Based on the inkjet control data stored in the storage device 20a, the control device 20 discharges ink from the inkjet head units 47a to 47f and uses a moving stage so that ink is applied to a predetermined area on the substrate 23. The movement of the substrate 23 is controlled. While the substrate 23 is moved along the Y-axis direction, the ink is applied vertically below the inkjet head units 47a to 47f (Z-axis negative direction).

  Refer to FIG. 3B. The droplet discharge device 80 according to the embodiment further includes a second connecting member 70, third connecting members 71a to 71d, and partial pressing rollers 72a to 72d. The second connecting member 70 is held on the surface on the Y axis positive direction side of the beam 42c of the frame 42 so as to be movable in the Z axis direction. The third connecting members 71a to 71d are held by the second connecting member 70 so as to be independently movable in the X-axis direction. Partial pressing rollers 72a to 72d are attached to the connecting members 71a to 71d. For this reason, the partial pressing rollers 72a to 72d are held on the surface of the beam 42c on the Y axis positive direction side so as to be movable in the Z axis direction and further independently movable in the X axis direction. . The partial pressing rollers 72 a to 72 d can press the substrate 23 held by the chuck plate 45.

  In order to ensure the visibility of the drawing, in FIG. 3A, the description of the connecting members 70, 71a to 71d and the partial pressing rollers 72a to 72d arranged on the Y axis positive direction side of the beam 42c is omitted. In FIG. 3B, the description of the first connecting member 46 and the inkjet head units 47a to 47f disposed on the Y axis negative direction side of the beam 42c is omitted.

  FIG. 3C shows the vicinity of the inkjet head units 47a to 47f and the partial pressing rollers 72a to 72d of the droplet discharge device 80 according to the embodiment.

  The inkjet head units 47a to 47f are, for example, inkjet head units having the same configuration, and are fixed to the first connecting member 46 at equal intervals along the X-axis direction. The first connecting member 46 is attached to the frame beam 42c so as to be movable in the Z-axis direction. In this way, the inkjet head units 47a to 47f are held by the frame so that the distance from the substrate 23 can be adjusted. The movement of the inkjet head units 47 a to 47 f in the Z-axis direction by the first connecting member 46 is controlled by the control device 20. The ink jet head units 47a to 47f may be directly fixed to the beam 42c of the frame without the first connecting member 46 interposed therebetween.

  The substrate 23 is pressed by the partial pressing rollers 72a to 72d so as to be movable in the Y-axis direction. By pressing the partial pressing rollers 72a to 72d attached to the third connecting members 71a to 71d in the Z-axis direction by the second connecting member 70, the substrate 23 can be pressed and released. Further, by moving the partial pressing rollers 72a to 72d along the X-axis direction by the third connecting members 71a to 71d, the pressing positions of the partial pressing rollers 72a to 72d along the X-axis direction are changed. be able to. When the pressing position is changed, the partial pressing rollers 72a to 72d are moved in the positive direction of the Z axis by the second connecting member 70 to release the pressing, and then each partial pressing by the third connecting members 71a to 71d. The rollers 72a to 72d are moved by a desired distance along the X-axis direction. Then, at the desired position, the second connecting member 70 moves the partial pressing rollers 72a to 72d in the negative Z-axis direction to start pressing.

  The movement of the partial pressing rollers 72a to 72d in the Z-axis direction by the second connecting member 70 and the movement of the partial pressing rollers 72a to 72d in the X-axis direction by the third connecting members 71a to 71d are performed by the control device 20. Controlled by.

FIG. 4A is a schematic view showing the inkjet head unit 47a. Jet head unit 47a includes a carriage 47a _c, the ink jet head _47a 1 _{~47a 4} assembled alternately along the Y-axis direction, and the ultraviolet light source _47a 5 _{~47a 9.} Each of the inkjet heads 47a _{1 to} 47a ₄ includes two nozzle rows arranged along the Y-axis direction. Each nozzle row includes a plurality of, for example, 192 inkjet nozzles (ink ejection holes) arranged along the X-axis direction. The length along the X-axis direction of each nozzle row is, for example, about 30 mm. Therefore, the length along the X-axis direction of the inkjet head unit 47a is also about 30 mm. UV curable ink is ejected from each inkjet nozzle.

The ultraviolet light sources 47a _{5 to} 47a ₉ include, for example, light emitting diodes (LEDs), and emit light having a wavelength in the ultraviolet region. The ultraviolet curable ink discharged from the inkjet nozzles of the inkjet heads 47a _{1 to} 47a ₄ to the substrate 23 is cured (temporarily cured) by the light emitted from the ultraviolet light sources 47a _{5 to} 47a ₉ . The emission of ultraviolet light from the ultraviolet light sources 47 a _{5 to} 47 a ₉ is controlled by the control measure 20.

FIG. 4B is a plan view showing a droplet discharge surface of the inkjet head unit 47a (inkjet heads 47a _{1 to} 47a ₄ ). In this view, the description of the ultraviolet light source _47a 5 _{~47a 9} are omitted.

The nozzles in the same nozzle row of the inkjet heads 47a _{1 to} 47a ₄ are arranged at intervals of 160 μm along the X-axis direction. In each of the inkjet heads 47a _{1 to} 47a ₄ , the nozzle array on the Y axis positive direction side is formed such that the nozzle arrangement position is shifted by 80 μm in the X axis positive direction with respect to the nozzle array on the Y axis negative direction side. . For this reason, each of the inkjet heads 47a _{1 to} 47a ₄ includes 384 inkjet nozzles arranged in a staggered manner at intervals of 80 μm in the X-axis direction, and has a resolution of about 300 dpi. Each inkjet nozzle is configured to include a piezo element, and ejects ink in response to voltage application. Ink ejection (voltage application) is controlled by the control device 20. In the embodiment, there are two nozzle rows, but it may be one row or three or more rows.

The inkjet heads 47a _{1 to} 47a ₄ are arranged along the Y-axis direction as a whole while their relative positions are sequentially shifted in the X-axis positive direction. That is, the inkjet head 47a ₂ is disposed on the X axis positive direction side by 20 μm with respect to the inkjet head 47a ₁ . Similarly, the inkjet heads 47a ₃ and a ₄ are arranged on the X axis positive direction side by 20 μm with respect to the inkjet heads 47a ₂ and a ₃ , respectively. As a result, the inkjet head unit 47a includes nozzles arranged at intervals of 20 μm (high resolution of about 1200 dpi) in the X-axis direction.

  FIG. 4C is a schematic plan view showing the arrangement of the inkjet head units 47a to 47f. As described above, each of the inkjet head units 47a to 47f has a droplet discharge capability in a range of about 30 mm along the X-axis direction. Moreover, it arrange | positions at equal intervals along a X-axis direction. The distance between the adjacent inkjet head units 47a to 47f is, for example, about 60 mm.

  In the drawing station 3, after the substrate 23 transported by the lifter 11 is held on the moving stage (chuck plate 45), the Y-axis below each inkjet head unit 47a to 47f is moved, for example, in the Y-axis positive direction. Ink is ejected from the inkjet head units 47a to 47f toward the ejection target position (solder resist formation target position) in the odd-numbered row area (the area marked with a circle in FIG. 4C) along the direction. When the ejection to the target position in the odd-numbered row region is completed, the substrate 23 is moved in the X-axis positive direction by, for example, 10 μm by the X stage 43, and then each substrate 23 is moved in the Y-axis negative direction. Ink is ejected from the inkjet head units 47a to 47f toward the ejection target position in an even-numbered row region (region marked with a cross in FIG. 4C) along the Y-axis direction below the inkjet head units 47a to 47f. By discharging droplets toward the target positions in the odd-numbered row area and the even-numbered row area on the forward path and the return path along the Y-axis direction, drawing with a high resolution of about 2400 dpi can be realized.

  After the droplet discharge to the even-numbered row region is completed, the X stage 43 is driven, and the substrate 23 is moved about 30 mm in the positive direction of the X axis. Then, the substrate 23 is reciprocated in the Y-axis direction by the Y stage 44, and the odd-numbered row region and the even-numbered row region are drawn on the forward path and the return path, respectively.

  Further, the same processing is performed once again, and drawing on the surface of the substrate 23 is completed in a total of three reciprocations along the Y-axis direction.

  The droplet discharge device 80 according to the embodiment shown in FIGS. 3A to 4C includes six inkjet head units 47a to 47f. The number of inkjet head units is not limited to six. In addition, the droplet discharge device 80 according to the embodiment includes four partial pressing rollers 72a to 72d, but is not limited to four. As an example, a configuration (a droplet discharge device according to a modification) including one inkjet head unit and two partial pressing rollers can be employed.

  With reference to FIGS. 5A to 5D, the pressing of the substrate by the partial pressing rollers 72a to 72d will be described. 5A and 5C are schematic plan views showing a substrate on which drawing is performed by the droplet discharge device according to the embodiment, and FIGS. 5B and 5D are schematic cross-sectional views.

  5A and 5B show a case where drawing is performed on the surface of the substrate 23A. On the substrate surface, a region where drawing is performed (drawing region) and a region where drawing is not performed (non-drawing region) are defined. 5A and 5B, the drawing area 23a and the non-drawing area 23b are attached to the surface of the substrate 23A. Ink from the inkjet head units 47a to 47f is not ejected to the non-drawing region 23b. It is applied to a predetermined position in the drawing area 23a. The drawing area 23a is rectangular, for example. In the example shown in this figure, 20 drawing regions 23a are defined in 4 rows and 5 columns on the surface of the substrate 23A. A region other than the drawing region 23a on the surface of the substrate 23A is a non-drawing region 23b. 5A and 5B, the ink is ejected toward the target position in the odd-numbered region along the Y-axis direction below the inkjet head units 47a to 47f after being moved in the Y-axis positive direction, and then in the Y-axis negative direction. The substrate 23A on which ink is being ejected toward the target position in the even-numbered row area along the Y-axis direction below the inkjet head units 47a to 47f is shown.

  The partial pressing rollers 72a to 72d press the surface of the substrate 23A in the non-drawing area 23b during the reciprocation along the Y-axis direction. For example, the partial pressing roller 72a moves the substrate 23A in the Y-axis direction in the non-drawing area 23b between the drawing area 23a in the leftmost (X-axis positive direction side) row and the drawing area 23a in the second row from the left. Press to move. The partial pressing rollers 72b and 72c are respectively a non-drawing area 23b between a drawing area 23a in the second row from the left and a drawing area 23a in the third row from the left, and a drawing area in the third row from the left. In the non-drawing area 23b between the drawing area 23a in the fourth row from the left and 23a, the substrate 23A is pressed so as to be movable in the Y-axis direction. The partial pressing roller 72d moves the substrate 23A in the Y-axis direction in the non-drawing area 23b between the drawing area 23a in the rightmost (X-axis negative direction side) row and the drawing area 23a in the second row from the right. Press to move. In FIG. 5A, the pressing positions of the partial pressing rollers 72a to 72d on the surface of the substrate 23A are indicated by dotted lines.

  Even if the substrate 23A is warped by moving the substrate 23A along the Y-axis direction while being pressed by the partial pressing rollers 72a to 72d and discharging the ink toward the substrate 23A, the inkjet head The distance from the droplet discharge surface (inkjet nozzle) of the units 47a to 47d to the surface of the substrate 23A can be kept constant, for example, 0.5 mm. For this reason, highly accurate drawing can be performed. In this regard, the same effect can be obtained by using, for example, a rod-shaped roller that presses the entire surface of the substrate 23A instead of the partial pressing rollers 72a to 72d.

  The partial pressing rollers 72a to 72d press not a whole surface of the substrate 23A but a part thereof, for example, the non-drawing region 23b. For this reason, for example, the control device 20 positions the partial pressing rollers 72a to 72d along the X-axis direction (the third connecting member 71a so that the rollers 72a to 72d press only the non-drawing area 23b on the surface of the substrate 23A. Even if the substrate 23A is reciprocated in the Y-axis direction to perform drawing, the solder resist that is only temporarily cured adheres to the rollers 72a to 72d. The solder resist pattern is not damaged. Also in this respect, it is possible to perform highly accurate drawing. In addition, temporary hardening is a process which solidifies the surface area | region of a solder resist, for example, prevents a spreading | diffusion, and the internal area | region of a solder resist is not completely solidified by temporary hardening. Further, for example, when a rod-like roller that presses the entire surface of the substrate 23A is used, such an effect is not achieved.

  When the X stage 43 is driven and the substrate 23A is moved about 30 mm in the X-axis positive direction after the droplet discharge to the even-numbered region (one reciprocation in the Y-axis direction) is completed, the second connecting member 70 The partial pressing rollers 72a to 72d are moved in the positive direction of the Z axis to release the pressure on the substrate 23A. Moreover, the partial pressing rollers 72a to 72d are moved about 30 mm in the positive X-axis direction by the third connecting members 71a to 71d. Under the control of the control device 20, the partial pressing rollers 72a to 72d are moved in the moving direction of the substrate 23A by an amount equal to the moving amount of the substrate 23A. The same position (non-drawing area 23b) on the substrate 23A can be pressed.

  Further, after the end of one reciprocation in the Y-axis direction, when the X stage 43 is driven and the substrate 23A is moved about 30 mm in the X-axis positive direction, the substrate is pressed by the partial pressing rollers 72a to 72d without releasing the pressing. The movement of the partial pressing rollers 72a to 72d and the movement of the substrate 23A by the X stage 43 are synchronized so that the partial pressing rollers 72a to 72d are moved about 30 mm in the positive X-axis direction so that the position on 23A does not change. May be.

  When the substrate 23A is moved in the positive direction of the X axis by, for example, 10 μm between the movement in the positive direction of the Y axis and the movement in the negative direction of the Y axis (one reciprocation in the Y axis direction), Cancellation may or may not be performed. When the release of pressing is not performed, the partial pressing rollers 72 a to 72 d may not be moved or may be moved in synchronization with the X stage 43. When releasing the pressing, the partial pressing rollers 72a to 72d are also moved by 10 μm in the X-axis positive direction. Even when the pressing is released, it is possible not to move the partial pressing rollers 72a to 72d in the X-axis direction.

  In this example, the non-drawing area 23b of the substrate 23A is pressed by the partial pressing rollers 72a to 72d. However, even in the drawing area 23a, no solder resist is formed at the time of pressing (ink is ejected (applied)). It is also possible to press a position that is not). The pressing of the substrate 23A by the partial pressing rollers 72a to 72d may be controlled by the control device 20 so that each of the rollers 72a to 72d presses a position where the solder resist is not formed on the surface of the substrate 23A.

  5C and 5D show the case where drawing is performed on the surface of the substrate 23B different from the substrate 23A. A drawing region 23c and a non-drawing region 23d are also defined on the surface of the substrate 23B. Ink from the inkjet head units 47a to 47f is not applied to the non-drawing area 23d, but is applied to a predetermined position in the drawing area 23c. The drawing area 23c has, for example, a rectangular shape having a different size in the X-axis direction from the drawing area 23a of the substrate 23A. Twenty drawing regions 23c are defined in 4 rows and 5 columns on the surface of the substrate 23B, and regions other than the drawing region 23c on the surface of the substrate 23B are non-drawing regions 23d.

  Since the drawing area 23c of the substrate 23B has a different size in the X-axis direction from the drawing area 23a of the substrate 23A, when the drawing of the substrate 23A is finished and the drawing of the substrate 23B is started, the partial pressing rollers 72a to 72d are Under the control of the control device 20, it is moved to a position for pressing the non-drawing area 23d of the substrate 23B.

  5C and 5D show the substrate 23B after drawing has started. In both figures, the ink is moved in the positive direction of the Y-axis, and after ink is ejected toward the target position in the odd-numbered row region along the Y-axis direction below the inkjet head units 47a to 47f, it is moved in the negative direction of the Y-axis. However, the substrate 23B on which the ink is ejected toward the target position in the even-numbered row region along the Y-axis direction below the inkjet head units 47a to 47f is shown.

  In drawing on the substrate 23B, the partial pressing rollers 72a to 72d press the surface of the substrate 23B in the non-drawing region 23d, similarly to the substrate 23A. For example, regardless of the movement of the substrate 23B in the X-axis direction, each of the four partial pressing rollers 72a to 72d presses each non-drawing area 23d between the five rows of drawing areas 23c. In FIG. 5C, the pressing positions of the partial pressing rollers 72a to 72d on the surface of the substrate 23B are indicated by dotted lines.

  6A and 6B are schematic diagrams illustrating a droplet discharge method using a droplet discharge apparatus according to a modification. As described above, the droplet discharge device according to the modification is different from the droplet discharge device according to the embodiment in that it includes one inkjet head unit 47g and two partial pressing rollers 72e and 72f.

  The inkjet head unit 47g is held by a beam 42c of the frame 42 so as to be movable in the Z-axis direction via the first connecting member 46. The partial pressing rollers 72e and 72f are attached to the third connecting members 71e and 71f, respectively, and the third connecting members 71e and 71f are respectively held by the second connecting member 70 so as to be movable in the X-axis direction. Has been. For this reason, the partial pressing rollers 72e and 72f are held by the beam 42c of the frame 42 so as to be movable in the Z-axis direction and independently movable in the X-axis direction. In FIGS. 6A and 6B, a portion different from the embodiment of the droplet discharge device according to the modified example is simply shown corresponding to FIG. 5B, for example.

Refer to FIG. 6A. The non-drawing area 23f defined on the substrate 23C is pressed by the partial pressing rollers 72e and 72f, and the substrate 23C is reciprocated in the Y-axis direction while ejecting ink from the ink jet head unit 47g. Drawing is performed in the drawing area 23e1 in the _first column along the Y-axis direction. The partial pressing rollers 72e and 72f press the non-drawing regions 23f on both sides of the drawing region 23e1 in the _first row along the Y-axis direction. Between the movement of the substrate in the positive Y-axis direction and the movement of the substrate in the negative Y-axis direction, a substrate movement of 10 μm is performed in the positive X-axis direction. When the substrate is moved, the pressing by the partial pressing rollers 72e and 72f may or may not be released. When the release of the pressing is not performed, the partial pressing rollers 72e and 72f may not be moved, or the partial pressing rollers 72e and 72f may be moved 10 μm in the X axis positive direction in synchronization with the X stage 43. Good. When releasing the pressure, the partial pressing rollers 72e and 72f are also moved by 10 μm in the positive X-axis direction after the release. Even when the pressing is released, it is possible not to move the partial pressing rollers 72e and 72f in the X-axis direction.

  Next, the substrate 23C is moved about 30 mm in the X-axis positive direction by the X stage 43. In this substrate movement, the partial pressing rollers 72e and 72f are moved in the positive direction of the Z axis to release the pressure, and after the substrate movement is completed, the pressing is started by moving in the negative direction of the Z axis. The partial pressing rollers 72e and 72f are not moved in the X-axis direction.

Reference is made to FIG. 6B. Thereafter, drawing is performed in the drawing region 23e2 in the _second column along the Y-axis direction. The width of the drawing area 23e ₂ along the X-axis direction is, for example, equal to that of the drawing area 23e ₁ . Drawing for drawing area 23e ₂ is carried out in the same manner as drawing to the drawing area 23e _1.

  This is repeated, and drawing is performed on all drawing regions defined on the substrate 23C.

  In the example shown in FIGS. 6A and 6B, when the substrate 23C is moved about 30 mm in the X-axis positive direction, the partial pressing rollers 72e and 72f are not moved in the X-axis direction. For this reason, when the substrate movement of 10 μm in the positive direction of the X axis is performed between the movement of the substrate in the positive direction of the Y axis and the movement of the substrate in the negative direction of the Y axis, When not moving 10 μm in the forward direction, the partial pressing rollers 72e and 72f may be held by the beam 42c of the frame 42 so as to be movable in the Z-axis direction. There is no need to be held movably in the X-axis direction.

When the drawing area 23e ₁ and the drawing area 23e ₂ have different widths along the X-axis direction, at least one of the partial pressing rollers 72e and 72f after drawing of the drawing area 23e ₁ and before drawing of the drawing area 23e ₂ is started. In accordance with the width of the drawing area 23e ₂ along the X-axis direction, the partial pressing rollers 72e and 72f press the non-drawing areas 23f on both sides of the second row of the drawing area 23e ₂ along the Y-axis direction. Move in the X-axis direction.

  7A to 7D are schematic views showing the substrate reversing device 50 and the ultraviolet irradiation device (solder resist solidifying device) 60 included in the substrate reversing station 4. Refer to FIG. 7A. The substrate reversing device 50 is fixed to a U-shaped substrate holder 51 that holds the substrates 21 to 27 transferred to the substrate reversing station 4 and a bar shape that is fixed to the U-shaped vertical bar and supports the substrate holder 51. The support member 52 is configured. The support member 52 is disposed in a plane equal to the plane defined by the U-shape of the substrate holder 51, and the extending direction thereof is parallel to the extending direction of the two U-shaped horizontal bars. The support member 52 supports the substrate holder 51 rotatably around the support member 52 with the support member 52 as a rotation axis. The rotation of the substrate holder 51 by the support member 52 is controlled by the control device 20.

  The ultraviolet irradiation device 60 includes a support member 61 and an ultraviolet light source 62. The support member 61 extends, for example, in a direction parallel to the extending direction of the support member 52 of the substrate reversing device 50. The ultraviolet light source 62 includes, for example, a lamp or an LED, and emits light having a wavelength in the ultraviolet region. The ultraviolet light source 62 can emit ultraviolet light at a higher output than the ultraviolet light source included in the inkjet head unit. The wavelength of the ultraviolet light may be the same as or different from the wavelength of the ultraviolet light emitted from the ultraviolet light source of the inkjet head unit.

  The ultraviolet light source 62 is supported by the support member 61 so as to be movable in the extending direction. The control device 20 controls the emission of the ultraviolet light from the ultraviolet light source 62 and the movement of the ultraviolet light source 62 along the support member 61.

  Refer to FIG. 7B. The substrates 21 to 27 having the solder resist pattern formed on the surface thereof at the drawing station 3, for example, the substrate 24, are transported to the substrate inversion station 4 by the lifter 12. The substrate 24 is mounted directly on the U-shaped surface of the substrate holder 51 by the lifter 12 so that, for example, the surface of the substrate 24 (surface on which the solder resist is formed) is directed upward (Z-axis positive direction). Placed. The substrate holder 51 holds the substrate 24 in a fixed manner by suction, pressing, clamping, or the like. That is, the substrate 24 is held so as not to move relative to the substrate holder 51. The control device 20 controls the fixed holding and release of the substrate 24 by the substrate holder 51.

Refer to FIG. 7C. The ultraviolet light source 62 is moved along the support member 61 while emitting ultraviolet light from the ultraviolet light source 62. When the substrate reversing device 50 and the ultraviolet irradiation device 60 move the ultraviolet light source 62 along the support member 61, the ultraviolet light source 62 passes above the substrate 24 held by the substrate holder 51 and is emitted from the ultraviolet light source 62. It arrange | positions so that the irradiated ultraviolet light may be irradiated to the solder resist pattern formation area of the board | substrate 24, for example, the whole surface of the board | substrate 24 at least. The ultraviolet light emitted from the ultraviolet light source 62 is irradiated on the entire surface of the substrate 24 with an energy density of, for example, 1000 mJ / cm ² . The main curing of the solder resist formed on the surface of the substrate 24 is performed by irradiation with ultraviolet light. By the main curing, the solder resist on the surface of the substrate 24 is solidified to the inside. In the main curing, the substrate 24 is irradiated with ultraviolet light at a higher energy density than in the temporary curing.

  Refer to FIG. 7D. After the ultraviolet light is irradiated and the solder resist on the surface of the substrate 24 is fully cured, the substrate holder 51 is rotated by 180 ° with the support member 52 as the rotation axis. Thereby, the front and back of the substrate 24 held by the substrate holder 51 are reversed. The substrate 24 with the front and back reversed is conveyed by the lifter 13 to the alignment station 5 and subsequently to the drawing station 6 with the front and back reversed. Before the transfer by the lifter 13 is performed, the holding of the substrate 24 by the substrate holder 51 is released.

  The substrate holding structure of the substrate holder 51 will be described with reference to FIGS. 8A to 8F. 8A, 8C, and 8E are schematic plan views showing the substrate holder 51, and FIGS. 8B, 8D, and 8F are schematic side views showing the substrate holder 51. FIG.

  As shown in FIGS. 8A and 8B, the substrate holder 51 includes a vacuum suction pad 53 on, for example, a U-shaped surface. Both figures show an example in which a plurality of vacuum suction pads 53 are formed on two U-shaped horizontal bars. The substrate 24 is placed on the U-shaped surface of the substrate holder 51 including the vacuum suction pad 53 by the lifter 12, and is sucked and held by the substrate holder 51 by the suction force from the vacuum suction pad 53.

  As shown in FIGS. 8C and 8D, the substrate holder 51 may include a pressing roller 54 that extends in the extending direction of the horizontal bar, for example, on two U-shaped horizontal bars. The presser roller 54 is moved by the lifter 12 onto the end portion of the substrate 24 placed on the U-shaped surface of the substrate holder 51. The substrate 24 is fixedly held by the substrate holder 51 by being pressed by the pressing roller 54.

  As shown in FIGS. 8E and 8F, a configuration in which the substrate holder 51 includes a clamp mechanism 55 can be employed. The clamp mechanism 55 shown in both figures has a rising portion extending in the extending direction of the two U-shaped horizontal bars, and inward, for example, 90 ° so that a part thereof (clamping tip) falls down. By bending, the end portion of the substrate 24 placed on the substrate holder 51 is sandwiched and held.

  The substrate holder 51 shown in FIGS. 8A to 8F holds the portion of the substrate 24 where the solder resist is not formed in a fixed manner by suction, pressing, and sandwiching.

  In the above example, after irradiating with ultraviolet light and main-curing the solder resist on the surface of the substrate 24, the substrate holder 51 is rotated to reverse the front and back of the substrate 24. Then, the main curing may be performed by irradiating the surface of the substrate 24 with ultraviolet light from the Z-axis negative direction side. Further, the main curing by the irradiation of ultraviolet light and the reverse of the substrate 24 by the rotation of the substrate holder 51 may be performed simultaneously. In this case, for example, a configuration is adopted in which the ultraviolet light source 62 is rotated in synchronization with the rotation of the substrate 24 so that the surface of the rotating substrate 24 is irradiated with ultraviolet light having a predetermined intensity. By performing the main curing during the period of reversing the front and back, the processing time at the substrate reversing station 4 can be shortened.

  The substrate 24 that has been subjected to the main curing of the solder resist on the front surface and the reverse of the front and back is conveyed to the alignment station 5 by the lifter 13.

  The alignment station 5 has the same configuration and function as the alignment station 2. An alignment mark formed on the back surface of the substrate 24 is detected by a CCD camera, and θ correction is performed. In addition, from the image data, the size of the substrate 24 on which the front surface drawing has been completed is grasped, and ink jet control data used when newly drawing the back surface of the substrate 24 is generated.

  The lifter 13 transports the substrate 24 whose orientation in the in-plane direction of the substrate is changed by the rotation of the θ stage included in the alignment station 5 onto the stage of the drawing station 6 while maintaining the orientation.

  The drawing station 6 has the same configuration and function as the drawing station 3. That is, the drawing station 6 is also provided with the droplet discharge device according to the embodiment. In the drawing station 6, a solder resist pattern is formed on the back surface of the substrate 24 based on the inkjet control data on the back surface.

  Note that the inkjet control data on the back surface can also be created based on the image data acquired by the alignment station 2. In this case, the image data obtained by the alignment station 5 is used only for θ correction, for example.

  Since the θ correction of the substrate 24 is performed by the alignment station 5, there is no need for the θ correction in the drawing station 6. For this reason, the formation of the solder resist pattern on the back surface can be started without aligning the substrate 24 conveyed to the drawing station 6. Therefore, the processing time in the drawing station 6 can be shortened, and as a result, the tact time can be shortened and the production efficiency can be improved.

  The substrate 24 on which drawing on the back surface has been completed is transferred to the conveyor 16 by the lifter 14 and placed on the conveyor 16, and the solder resist formed on the back surface by the ultraviolet rays emitted from the ultraviolet irradiation device 8. Main curing is performed. Then, it is carried out from the carry-out port 7 to the outside of the housing 18 by the conveyor 16.

  In the first drawing apparatus, during the period from the end of drawing on the surface of the substrate 24 at the drawing station 3 to the placement of the substrate 24 on the stage of the drawing station 6, specifically, the substrate 24 at the substrate inversion station 4. The solder resist formed on the surface is fully cured. The solder resist formed on the surface of the substrate 24 at the drawing station 3 is fully cured at the substrate reversing station 4 without coming into contact therewith.

  The substrate 24 which has not been fully cured is tacky (sticky) because the inner region of the solder resist is not completely solidified. If the solder resist pattern is formed on the back surface of the substrate 24 without performing the main curing of the solder resist on the surface of the substrate 24, for example, when the substrate 24 is handled by the lifter 13 or when the back surface of the substrate 24 is drawn at the drawing station 6, The solder resist may be scratched or marked. In addition, there may be a problem in processing due to tack.

  The solder resist formed on the surface of the substrate 24 is fully cured between the end of the drawing on the surface of the substrate 24 and the placement of the substrate 24 on the stage of the drawing station 6, so that the solder resist on the surface of the substrate 24 is cured. It is possible to prevent scratches and marks on the surface. Therefore, high quality drawing can be performed.

  Moreover, since the main curing of the solder resist on the back surface of the substrate 24 is performed by the ultraviolet light emitted from the ultraviolet irradiation device 8, the solder resist on the back surface of the substrate 24 is scratched or marked after being transported to the outside of the housing 18. Can be prevented.

  FIG. 9 is a schematic diagram showing a second drawing apparatus. The second drawing apparatus does not include an alignment apparatus in which the alignment stations 2 and 5 perform θ correction, and the droplet discharge device (droplet discharge device according to a modification) of the drawing stations 3 and 6 includes the θ stage 49 and It differs from the first drawing apparatus in that it includes CCD cameras 63-66.

  In the alignment stations 2 and 5 of the second drawing apparatus, a temporary stage 48 which is an alignment apparatus that performs simple alignment without θ correction is disposed. After the substrates 21 to 27 are placed on the temporary placement stage 48 of the alignment stations 2 and 5 by the lifters 11 and 13 and subjected to simple alignment such as pressing against fixed pins, the drawing station 3 and 6 is conveyed.

  The droplet discharge device according to the modification includes, for example, a θ stage 49 between the Y stage 44 and the chuck plate 45. The θ stage 49 can rotate the substrates 21 to 27 held by the chuck plate 45 around a rotation axis parallel to the Z axis in a plane parallel to the XY plane. In addition, the droplet discharge device according to the modification includes CCD cameras 63 to 66 that detect alignment marks formed on the front and back surfaces of the substrates 21 to 27. These points are different from the droplet discharge device according to the embodiment.

  The substrates 21 to 27 conveyed to the drawing stations 3 and 6 are sucked and held by the chuck plate 45, and the alignment marks on the front and back surfaces are detected by the CCD cameras 63 to 66. The detection result (captured image data) is transmitted to the control device 20.

  The control device 20 processes the detection results, grasps the positions and orientations (directions) of the substrates 21 to 27 in the in-plane direction of the substrate, and drives the θ stage 49, for example. The posture in the inward direction is corrected (θ correction). Moreover, the control apparatus 20 grasps | ascertains the size of the board | substrates 21-27 based on the detection result of CCD camera 63-66, and produces | generates inkjet control data according to the grasped size.

  In the second drawing apparatus, the θ correction of the substrates 21 to 27 is not performed in the alignment stations 2 and 5, and the θ stage 49 is used in the drawing stations 3 and 6 (droplet discharge apparatus according to a modification) to After performing the θ correction of 27, the substrates 21 to 27 are drawn based on the generated inkjet control data.

  The droplet discharge device according to the modification also performs drawing while pressing only the solder resist non-formation region of the substrates 21 to 27, for example, only the non-drawing region with the partial pressing roller. By pressing the substrates 21 to 27, the distance from the droplet discharge surface of the inkjet head unit to the substrates 21 to 27 can be kept constant, and high-precision drawing can be realized. Further, the pre-cured solder resist is prevented from adhering to the roller and the solder resist pattern is prevented from being damaged, thereby enabling high-precision drawing.

  FIG. 10 is a schematic view showing a third drawing apparatus. The third drawing apparatus is different from the first drawing apparatus in that it does not include the substrate inversion station 4, the alignment station 5, the drawing station 6, and the lifters 12 and 13. The first drawing apparatus is a drawing apparatus that performs drawing on both sides of the substrates 21 to 27, but the third drawing apparatus is a drawing apparatus that performs drawing only on one side, for example, the surface of the substrates 21 to 24. In the third drawing apparatus, the main curing of the solder resist formed on the surface is performed by the ultraviolet rays emitted from the ultraviolet irradiation device 8.

  In the drawing station 3 of the third drawing apparatus, for example, a droplet discharge device according to the embodiment is arranged. Also in the third drawing apparatus, drawing is performed while pressing only the solder resist non-formation regions, for example, only the non-drawing regions, of the substrates 21 to 24 with the partial pressing rollers. For this reason, highly accurate drawing can be performed.

  Although the present invention has been described with reference to the embodiments and the modifications, the present invention is not limited to these.

  For example, in the embodiment and the modification, the substrate is moved relative to the inkjet head unit (moving in the XY plane) only by the stage. For example, the frame is movable in the Y-axis direction, and the inkjet head unit is moved to the frame. As a configuration that is movably mounted in the X-axis direction and the Z-axis direction, the substrate may be moved in the XY plane direction with respect to the inkjet head unit using both the configuration and the stage. What is necessary is just to move an inkjet head unit and a board | substrate relatively. However, the configuration of the embodiment and the modified example in which only the substrate is moved in the XY plane can perform drawing with higher accuracy than the configuration in which the inkjet head unit is also moved in the XY plane direction.

  Further, in the embodiment and the modification, an insulating film (solder resist) is formed on the printed wiring board. However, in the manufacture of the touch panel, for example, the droplet discharge device according to the embodiment and the modification is an insulating film on the glass substrate. It can also be used for the purpose of forming.

  Furthermore, in the embodiment and the modification, a roller is used as the pressing portion, but the pressing portion is not limited to the roller. At the time of ink application, the stage moves in a state where the pressing portion presses the substrate, and accordingly, the inkjet head and the substrate relatively move in the Y-axis direction. At this time, it is sufficient that the frictional force is not generated so as to hinder the movement of the substrate in the Y-axis direction due to the pressing. In other words, the pressing portion does not necessarily have to rotate, and can be implemented by using a member having a small friction coefficient with respect to the substrate to such an extent that a frictional force that becomes an obstacle is not generated. The frictional force between the substrate and the pressing portion depends on the force pressing the substrate by the pressing portion. For example, in order to suppress warpage in the Z-axis direction on the order of mm, the pressing force in the Z-axis direction is used. Can be quite weak.

  The roller in the embodiment and the modified example rotates in the Y-axis direction. For this reason, when the stage and the roller are relatively moved in the X-axis direction, for example, the roller and the stage are moved synchronously, or the roller is moved in the Z-axis direction. When the pressing portion is configured using a member having a small coefficient of friction with respect to the substrate, the movement in the X-axis direction as performed by the roller becomes unnecessary, so that the production efficiency can be increased.

  In addition, since it is possible not to generate | occur | produce the frictional force which becomes obstruction | occlusion regarding a horizontal direction also by using a spherical press part, you may comprise a press part spherically.

  It will be apparent to those skilled in the art that other various modifications, improvements, combinations, and the like are possible.

  It can be widely used for forming an insulating film on a substrate.

DESCRIPTION OF SYMBOLS 1 Carrying-in entrance 2 Alignment station 3 Drawing station 4 Substrate inversion station 5 Alignment station 6 Drawing station 7 Carrying-out exit 8 Ultraviolet irradiation apparatus 11-14 Lifter 15, 16 Conveyor 18 Case 20 Control apparatus 20a Storage apparatus 21-27 Substrate 22a-22d alignment marks 23A, 23B, 23C substrate _{23a, 23c, 23e 1, 23e} 2 drawing area 23b, 23d, 23f non-imaging region 31 base 32 Y stage 33 theta stage 34 chuck plate 35 to 38 CCD camera 41 base 42 frame 42a, 42b post 42c beams 43 X stage 44 Y stage 45 chuck plate 46 first connecting member 47a~47g inkjet head unit _47a 1 _{~47a 4} inkjet heads _47a 5 ~ 7a ₉ ultraviolet light source 47a _c carriage 48 temporary location stage 49 theta stage 50 substrate reversing device 51 substrate holder 52 supporting member 53 vacuum suction pad 54 pressing rollers 55 clamping mechanism 60 ultraviolet irradiation device 61 supporting member 62 an ultraviolet light source 63 to 66 CCD camera 70 Second connecting members 71a to 71f Third connecting members 72a to 72f Partial pressing roller 80 Droplet discharge device

Claims (8)

A stage that holds the substrate and moves it in the horizontal plane;
An ejection head disposed opposite to the substrate and ejecting an insulating material toward the substrate;
A pressing portion for pressing a part of the position on the substrate;
A droplet discharge device comprising: a control device that controls the pressing portion to press a position on the substrate where the insulating material is not discharged by the discharge head.   2. The droplet discharge device according to claim 1, wherein the control device discharges an insulating material from the discharge head toward the substrate while reciprocating the substrate along a uniaxial direction in a horizontal plane with the stage.   The droplet discharge device according to claim 2, wherein the pressing portion is held on a frame fixed to a base so as to be movable in a vertical direction.   4. The droplet discharge device according to claim 3, wherein the pressing portion is held by the frame so as to be movable in a direction parallel to the uniaxial direction in a horizontal plane direction. On the substrate, a drawing region where an insulating material is discharged from the discharge head and a non-drawing region where an insulating material is not discharged from the discharge head are defined,
(I) The controller discharges an insulating material from the discharge head while pressing the non-drawing area on both sides of the first drawing area to the first drawing area along the uniaxial direction from the discharge head. (Ii) The pressing portion is moved in the vertical direction to release the pressing of the substrate, and the substrate is moved in the horizontal plane direction in a direction perpendicular to the uniaxial direction by the stage (iii) Non-drawing on both sides of the second drawing area on the pressing portion in the second drawing area along the uniaxial direction from the ejection head, which is adjacent to the first drawing area. The droplet discharge device according to claim 4, wherein the insulating material is discharged while pressing the region. The first drawing area and the second drawing area have different widths along a direction perpendicular to the uniaxial direction in a horizontal plane direction,
In the step (ii), the control device further moves the pressing portion in a direction parallel to the direction orthogonal to the uniaxial direction in the horizontal plane direction according to the width of the second drawing region. Item 6. The droplet discharge device according to Item 5. (A) holding the substrate;
(B) A step of discharging an insulating material toward the substrate while moving the held substrate along a uniaxial direction in a horizontal plane, and forming an insulating film on the substrate by the discharged insulating material. And
In the step (b), a droplet discharge method of discharging an insulating material toward the substrate while pressing a part of the substrate on which the insulating material is not discharged.   8. The droplet discharge method according to claim 7, wherein in the step (b), an insulating material is discharged toward the substrate while reciprocating the held substrate along the uniaxial direction.