JP2013243301A - Injection device and injection method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an injection device and an injection method which allow for accurate injection of a high viscosity material, as an injected material, toward an object.SOLUTION: When a pressure generation member 42, corresponding to an irradiation object injection hole, is irradiated with laser light from a laser light irradiation unit 60 while passing through a substrate 41, the pressure generation member 42 containing a sublimable material absorbs the laser light and the temperature of which rises in a short time to generate a pressure wave by rapid volume expansion. Since the center position of laser light irradiation region is biased from the center of an irradiation object injection hole, a strong pressure wave is generated starting from a position deviated from the center of an irradiation object injection hole. As a result, injection direction of a metal paste 43 is corrected reversely from the bias direction of laser light irradiation position. Since the metal paste 43 is injected vertically upward, the metal paste 43 of high viscosity material can be injected accurately toward a substrate W.

Description

  The present invention relates to an injection apparatus and an injection method for injecting a material to be injected toward an object.

  Conventionally, as a method of forming metal wiring (electrical wiring) on a substrate such as a semiconductor wafer or a glass substrate for a flat panel display (FPD), a pattern is formed by forming a photoresist film (photosensitive resin film) on the substrate. A so-called photolithography technique has been widely used in which exposure and development processes are performed and a metal layer serving as a wiring material such as copper is formed in that state (for example, Patent Document 1).

  Further, in recent years, development of metal wiring formation using an ink jet technique in which a predetermined wiring pattern is formed by discharging droplets containing metal from an ink jet nozzle has been promoted (for example, Patent Document 2).

JP 2001-135168 A JP-A-2005-93702

  However, when metal wiring is formed using photolithography technology, it takes a long time for processing because it requires many steps such as photoresist coating, exposure, development, etching, and metal layer deposition. It becomes. In addition, since these processes are performed by dedicated processing units, a large number of processing units are required, which increases the cost required for wiring formation.

  On the other hand, when metal wiring is formed using an ink jet technique, a droplet containing metal has a low viscosity (usually 0.01 Pa · s (Pascal second) or less), so that it wets and spreads on the substrate after landing. As a result, it was difficult to form a fine wiring pattern. In order to solve this problem, a method of performing hydrophilic treatment (or water repellency treatment) along the circuit pattern on the substrate to suppress the wetting and spreading of the droplets can be considered. Therefore, it has not been put into practical use.

  For this reason, Patent Document 2 discloses a technique in which a region where liquid droplets are to be deposited is surrounded by a convex bank, and droplets containing metal are ejected from the inkjet nozzles to the enclosed region to prevent wetting and spreading. Has been proposed. However, even if such a technique is adopted, the same problem as described above arises because the photolithography technique is used for the formation of the bank.

  In addition, since highly viscous liquid droplets cannot be ejected from the ink jet nozzle, multiple coatings are required particularly when a thick electric wiring is formed, and the processing time is further increased.

  In order to solve these problems, if a higher viscosity material (for example, metal paste) can be discharged directly, thick wiring can be achieved while suppressing wetting and spreading. Did not exist.

  The present invention has been made in view of the above problems, and an object thereof is to provide an injection apparatus and an injection method capable of accurately injecting a high-viscosity material as an injection target toward an object.

  In order to solve the above-mentioned problems, an invention according to claim 1 is directed to an injection device comprising: a supporting means for supporting a base material having a pressure generating member that generates pressure when heated; The pressure generating member is expanded by irradiating and heating an injection plate having a plurality of injection holes, which are provided in contact with each other and loaded with a material to be injected, and radiating laser light toward the pressure generating member. A laser beam irradiating means for injecting the material to be ejected toward an object disposed opposite to the ejection plate, and a center position in the laser beam irradiation area among the plurality of ejection holes. Irradiation position biasing means for biasing with respect to the center of the irradiation target injection hole to be irradiated with the laser beam.

  In the invention of claim 2, the injection device is provided in contact with the support means for supporting the base material and the surface of the base material, and the inside is heated in the order from the base material in order to reduce the pressure. An injection plate having a plurality of injection holes loaded with a generated pressure generating member and an injection target material, and heating the pressure generating member by irradiating laser light toward the pressure generating member. A laser beam irradiating means for injecting the material to be injected toward an object disposed opposite to the injection plate by generating pressure, and a laser beam among the plurality of injection holes at a center position in the laser beam irradiation region; Irradiation position biasing means for biasing with respect to the center of the irradiation target injection hole to be irradiated with light.

  The invention according to claim 3 is the injection apparatus according to claim 1 or 2, wherein the irradiation position biasing means has a center position in the irradiation region of the laser beam within the range of the irradiation target injection hole. And biased.

  According to a fourth aspect of the present invention, in the injection apparatus according to any one of the first to third aspects of the present invention, storage means for storing injection direction information indicating a tendency of the injection direction for each of the plurality of injection holes is provided. In addition, the irradiation position biasing means biases the center position in the irradiation region of the laser light by a biasing direction and a biasing amount based on the emission direction information.

  The invention according to claim 5 is the injection apparatus according to any one of claims 1 to 4, further comprising an imaging unit that images the plurality of injection holes of the injection plate, and the irradiation position biasing unit. Is characterized in that the center position in the irradiation region of the laser beam is biased by the biasing direction and the biasing amount based on the imaging result by the imaging means.

  The invention according to claim 6 is the injection apparatus according to any one of claims 1 to 3, wherein the irradiation position biasing means is configured such that an injection direction of the material to be injected from the irradiation target injection hole is the injection direction. The center position in the irradiation region of the laser beam is biased so as to be inclined from the normal direction of the plate.

  The invention according to claim 7 is the injection apparatus according to any one of claims 1 to 6, wherein the pressure generating member includes a camphor that causes volume expansion by sublimation when heated. And

  The invention of claim 8 is the injection apparatus according to any one of claims 1 to 7, wherein the material to be injected is a high-viscosity material having a viscosity of 0.1 Pa · s to 1000 Pa · s. It is characterized by including.

  According to a ninth aspect of the present invention, there is provided an injection plate having a plurality of injection holes loaded with a material to be injected, wherein a pressure generating member that generates pressure by being heated on the surface of the substrate is laminated on the injection method. Abutting on the pressure generating member, irradiating the pressure generating member with a laser beam and heating it, thereby generating pressure due to volume expansion on the pressure generating member, and placing the material to be injected facing the injection plate A step of irradiating the target object with the laser beam, and a center position in the laser beam irradiation area is biased with respect to a center of the target irradiation hole to be irradiated with the laser beam among the plurality of the injection holes. An irradiation position biasing step to be performed.

  According to a tenth aspect of the present invention, in the injection method, an injection plate having a plurality of injection holes loaded with a pressure generating member that generates pressure when heated and an injection target material is brought into contact with the surface of the substrate. By irradiating the pressure generating member with laser light and heating it, the pressure generating member is caused to generate a pressure due to volume expansion, and the material to be injected is directed toward an object disposed opposite to the injection plate. A laser beam irradiation step of emitting, and an irradiation position biasing step of biasing a center position in the laser light irradiation region with respect to a center of an irradiation target injection hole to be irradiated with laser light among the plurality of injection holes; It is characterized by providing.

  The invention according to claim 11 is the injection method according to claim 9 or claim 10, wherein, in the irradiation position biasing step, the center position in the irradiation region of the laser light is within the range of the irradiation target injection hole. And biased.

  The invention of claim 12 is the injection method according to any one of claims 9 to 11, further comprising a measuring step of measuring a tendency of the injection direction for each of the plurality of injection holes, and the irradiation position. In the biasing process, the center position in the irradiation region of the laser beam is biased by the biasing direction and the biasing amount based on the measurement result in the measuring process.

  The invention of claim 13 is the injection method according to any one of claims 9 to 12, further comprising an imaging step of imaging the plurality of injection holes of the injection plate, wherein the irradiation position biasing step Then, the center position in the irradiation region of the laser light is biased by the biasing direction and the biasing amount based on the imaging result in the imaging step.

  The invention according to claim 14 is the injection method according to any one of claims 9 to 11, wherein the injection direction of the material to be injected from the irradiation target injection hole is the injection direction in the irradiation position biasing step. The center position in the irradiation region of the laser beam is biased so as to be inclined from the normal direction of the plate.

  The invention of claim 15 is the injection method according to any one of claims 9 to 14, wherein the pressure generating member includes a camphor that produces volume expansion by sublimation when heated. And

  The invention of claim 16 is the injection method according to any one of claims 9 to 15, wherein the material to be injected is a high-viscosity material having a viscosity of 0.1 Pa · s to 1000 Pa · s. It is characterized by including.

  According to the first to eighth aspects of the present invention, the center position in the laser light irradiation region is biased with respect to the center of the irradiation target injection hole to be irradiated with the laser light. The correction is made in the direction opposite to the bias direction, and a highly viscous material can be injected as a material to be injected toward the object with high accuracy.

  Particularly, according to the invention of claim 3, the pressure generating member generates pressure outside the range of the irradiation target injection hole in order to bias the center position in the irradiation region of the laser light within the range of the irradiation target injection hole. It is possible to prevent problems caused by the above.

  In particular, according to the invention of claim 6, the center position in the irradiation region of the laser beam is biased so that the injection direction of the injection target material from the irradiation target injection hole is inclined from the normal direction of the injection plate. Variations in the material injection area can be expanded.

  According to the inventions of claims 9 to 16, in order to deviate the center position in the laser light irradiation region from the center of the irradiation target injection hole to be irradiated with the laser light, the injection direction of the injection target material Is corrected in the direction opposite to the bias direction, and a highly viscous material as the material to be injected can be accurately injected toward the object.

  In particular, according to the invention of claim 11, the pressure generating member generates pressure outside the range of the irradiation target injection hole in order to bias the center position in the irradiation region of the laser light within the range of the irradiation target injection hole. It is possible to prevent problems caused by the above.

  In particular, according to the invention of claim 14, the center position in the irradiation region of the laser beam is biased so that the injection direction of the injection target material from the irradiation target injection hole is inclined from the normal direction of the injection plate. Variations in the material injection area can be expanded.

It is a perspective view which shows schematic structure of the pattern formation apparatus containing the injection apparatus which concerns on this invention. It is a front view of the pattern formation apparatus of FIG. It is the top view which looked at the layered product of a 1st embodiment from the upper surface. It is sectional drawing which shows the AA cut surface of the laminated body of FIG. It is a block diagram which shows the structure of the control part of 1st Embodiment. It is a flowchart which shows the correction | amendment procedure of the injection direction in 1st Embodiment. It is a figure which shows intensity distribution of the laser beam irradiated from a laser beam irradiation part. It is a figure explaining the deviation direction and deviation amount of a laser beam irradiation position. It is a figure explaining correction | amendment of the injection direction in 1st Embodiment. It is a front view of the pattern formation apparatus of 2nd Embodiment. It is sectional drawing of the laminated body of 2nd Embodiment. It is a block diagram which shows the structure of the control part of 2nd Embodiment. It is a flowchart which shows the correction | amendment procedure of the injection direction in 2nd Embodiment. It is a figure explaining correction | amendment of the injection direction in 2nd Embodiment. It is a figure explaining the example which inclines the injection direction.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

<First Embodiment>
FIG. 1 is a perspective view showing a schematic configuration of a pattern forming apparatus 1 including an injection apparatus 5 according to the present invention. FIG. 2 is a front view of the pattern forming apparatus 1 of FIG. In addition, in FIG. 1 and each subsequent figure, in order to clarify those directional relationships, an XYZ orthogonal coordinate system in which the Z direction is the vertical direction and the XY plane is the horizontal plane is appropriately attached. Further, in FIG. 1 and the subsequent drawings, the dimensions and numbers of the respective parts are exaggerated or simplified as necessary for easy understanding.

  The pattern forming apparatus 1 is an apparatus for forming a metal wiring pattern on a substrate W by injecting a highly viscous metal paste toward the substrate W. The pattern forming apparatus 1 includes a stage 10 that holds a substrate W, a stage moving mechanism 20 that moves the stage 10 along the X direction, and an injection device 5 that injects a metal paste toward the substrate W held on the stage 10. And comprising. The injection device 5 includes a support transport mechanism 50 that transports while supporting a laminate S formed by laminating a pressure generating member on the surface of a base material and further adhering a nozzle plate thereon, and a laser on the pressure generating member. And a laser beam irradiation unit 60 that heats by irradiation with light. In addition, the pattern forming apparatus 1 includes an imaging camera 80 that images a plurality of injection holes formed in the nozzle plate, a control unit 3 that controls each of the above-described units including the injection apparatus 5, and executes a pattern forming process. Is provided.

  The stage 10 is provided above the injection device 5 and holds the substrate W on the lower surface thereof. The injection device 5 injects a metal paste toward the substrate W held on the lower surface of the stage 10. As a mechanism for holding the substrate W on the lower surface of the stage 10, for example, a clamp mechanism that mechanically holds an edge portion of the substrate W or an adsorption mechanism that vacuum-sucks the back surface of the substrate W (both not shown) is provided on the stage 10. It should be prepared.

  In the pattern forming apparatus 1 of the first embodiment, the substrate W to be subjected to pattern formation is a semiconductor wafer, a glass substrate for a flat panel display including a liquid crystal display device (LCD) or a plasma display device (PDP), a resin or Various known substrates that are the targets for forming electrical wiring, such as ceramic printed boards, can be used. The shape of the substrate W is not particularly limited, and may be circular like a semiconductor wafer or rectangular like a glass substrate. The substrate W is held on the lower surface of the stage 10 with the surface facing downward. In this specification, the surface of the substrate W is a surface on which pattern formation is performed, and the back surface is a surface on the opposite side.

  The stage moving mechanism 20 is configured by attaching a motor 22, a ball screw 23 and a guide shaft 24 to the lower side of a fixed base 21. The ball screw 23 and the guide shaft 24 are extended along the X direction. The ball screw 23 is connected to the rotation shaft of the motor 22 and is rotated by the motor 22. The slide block 12 fixed to the upper side of the stage 10 is screwed to the ball screw 23 and is slidably fitted to the guide shaft 24. When the motor 22 rotates the ball screw 23, the stage 10 is guided along the guide shaft 24 together with the slide block 12 screwed to the ball screw 23, and moves smoothly along the X direction.

  The injection device 5 is provided below the stage 10 and injects a metal paste upward. The injection device 5 includes a support conveyance mechanism 50 and a laser beam irradiation unit 60. The support conveyance mechanism 50 includes a main driving roller 51 and a driven roller 52. The main driving roller 51 and the driven roller 52 are provided in parallel with each other at a predetermined interval so that the rotation axis is along the Y direction. The maximum height positions of the peripheral surfaces of the main driving roller 51 and the driven roller 52 are the same. A driving motor (not shown) is connected to at least the main driving roller 51 of the two rollers. The driving motor 51 causes the main driving roller 51 to rotate clockwise about the rotation axis along the Y direction as viewed from the upper surface of the paper surface of FIG. One driven roller 52 is rotatable about a rotation axis along the Y direction. The driven roller 52 may be provided with a separate driving motor, or the driven roller 52 may be rotated in conjunction with the main driving roller 51 by a link mechanism or the like.

  A sheet-like laminate S is stretched between the two rollers 51 and 52. FIG. 3 is a plan view of the laminate S as viewed from above. FIG. 4 is a cross-sectional view showing an AA cut surface of the laminate S of FIG. The laminated body S of the first embodiment forms a layer of the pressure generating member 42 that generates pressure by being heated on the surface of the transparent base material 41, and a plurality of injections are formed on the layer of the pressure generating member 42. The nozzle plate 45 having the holes 46 formed therein is in contact therewith. A metal paste 43 is loaded in each of the plurality of injection holes 46. As the base material 41, a resin film that is flexible and transparent to the laser light emitted from the laser light irradiation unit 60 is used. For example, a polyimide film can be used. The thickness of the base material 41 is several tens of μm.

Further, the pressure generating member 42 includes a sublimable material that undergoes volume expansion by sublimation when heated, and as such a sublimable material, for example, camphor (camphor: C ₁₀ H ₁₆ O) is used. be able to. The camphor has a sublimation property that undergoes a phase transition from a solid to a gas without passing through a liquid. When heated, the camphor quickly vaporizes and expands in volume by 600 to 1000 times. The pressure generating member 42 includes glycerin (C ₃ H ₅ (OH) ₃ ) and carbon powder in addition to camphor as a sublimable material. The thickness of the layer of the pressure generating member 42 formed on the surface of the base material 41 is not particularly limited, but is about 10 μm in this embodiment.

  The nozzle plate 45 is an injection plate in which a plurality of injection holes 46 are formed in a sheet-like member configured using a resin film (in this embodiment, a polyimide film similar to the base material 41). A plurality of injection holes 46 are formed in a lattice shape (more precisely, a square lattice shape) in a sheet-like polyimide film, thereby forming a nozzle plate 45. In the first embodiment, the shape of the injection holes 46 is a circle having a hole diameter of 50 μm, and the interval (arrangement pitch) between the adjacent injection holes 46 is 100 μm. Further, the thickness of the nozzle plate 45 is set to several tens of μm. Note that the shape, size, and arrangement interval of the injection holes 46 of the first embodiment are merely examples, and these are not particularly limited, and may be appropriately set according to the accuracy (resolution) required for pattern formation. Can be. If the interval between the plurality of injection holes 46 is shortened and the arrangement density is increased, a highly accurate pattern can be formed. Conversely, if the interval between the holes is increased and the arrangement density is lowered, the pattern formation accuracy is not lowered. I do not get.

  Such a nozzle plate 45 is bonded onto the layer of the pressure generating member 42, and the metal paste 43 is loaded into the plurality of injection holes 46 of the nozzle plate 45. The metal paste 43 is a high-viscosity material in which metal particles as a main component are pasted with an organic solvent or the like. A metal paste 43 containing appropriate metal particles can be selected according to the type of metal wiring to be formed on the substrate W. For example, when a copper wiring is formed on the substrate W, a copper paste can be used, and when an aluminum wiring is formed, an aluminum paste can be used. The viscosity of the metal paste 43 as a high-viscosity material is 0.1 Pa · s (Pascal second) or more and 1000 Pa · s or less.

  The thickness of the metal paste 43 loaded in the injection hole 46 is about 10 μm, and a gap 47 is formed between the loaded metal paste 43 and the pressure generating member 42. That is, the nozzle plate 45 is bonded onto the layer of the pressure generating member 42, and the lower end opening of the injection hole 46 is closed by the pressure generating member 42. On the other hand, the metal paste 43 is not loaded at the lower end of the injection hole 46, and a gap 47 is formed between the metal paste 43 and the pressure generating member 42. For this reason, in the laminated body S, the metal paste 43 and the pressure generation member 42 are non-contact.

  As shown in FIG. 4, the laminate S includes a pressure generating member 42 between a base material 41 formed of a polyimide film having flexibility and a nozzle plate 45 formed of a polyimide film. Is sandwiched between layers so that it can be freely deformed. For this reason, the laminated body S spanned between the two rollers 51 and 52 is deformed along the cylindrical surface of each roller. When the main driving roller 51 rotates in a state where the laminate S is stretched, a weak tension acts on the laminate S between the rollers 51 and 52, and the laminate S is stretched along the XY plane (horizontal plane). It becomes a state. Further, when the main driving roller 51 rotates, the laminated body S moves and deforms with it, and the driven roller 52 also rotates. Specifically, the laminated body S on the upstream side of the driven roller 52 is raised, the laminated body S on the downstream side of the main driving roller 51 is lowered, and the laminated body S between the rollers 51 and 52 is along the X direction. Move.

  The substrate W is held by the stage 10 immediately above the stacked body S stretched along the horizontal plane between the rollers 51 and 52, that is, at a position facing the nozzle plate 45 of the stretched stacked body S. The pattern forming apparatus 1 is configured such that the distance between the stacked body S stretched between the rollers 51 and 52 and the surface of the substrate W held on the stage 10 is several hundred μm.

  Returning to FIGS. 1 and 2, a laser beam irradiation unit 60 is provided below the stacked body S stretched along the horizontal plane between the rollers 51 and 52. The laser light irradiation unit 60 includes a laser light source 61. In addition, an emission hole 62 is formed on the upper surface of the laser beam irradiation unit 60. The laser light output from the laser light source 61 is emitted upward (in the (+ Z) direction) from the emission hole 62 in the vertical direction.

  The laser beam irradiation unit 60 is reciprocated along the Y direction by the laser beam scanning mechanism 65. The laser beam scanning mechanism 65 includes a motor 68, a ball screw 66, and a guide shaft 67. The ball screw 66 and the guide shaft 67 are extended along the Y direction. The ball screw 66 is connected to the rotation shaft of the motor 68 and is rotated by the motor 68. The laser beam irradiation unit 60 is screwed to the ball screw 66 and is slidably fitted to the guide shaft 67. For this reason, when the motor 68 rotates the ball screw 66, the laser light irradiation unit 60 screwed to the motor is guided by the guide shaft 67 and moves smoothly along the Y direction.

  The laser beam irradiation unit 60 is provided below the laminate S between the rollers 51 and 52, and the laser light emitted upward from the laser beam irradiation unit 60 is applied to the laminate S from the back surface of the base material 41. Irradiated. Since the substrate 41 is transparent, the irradiated laser light passes through the substrate 41 and is absorbed by the pressure generating member 42. As a result, the pressure generating member 42 is heated by the laser light irradiation from the laser light irradiation unit 60.

  The imaging camera 80 is provided above the stacked body S between the rollers 51 and 52 and at a position that does not interfere with the stage 10 that moves along the X direction. The imaging camera 80 is configured by, for example, a CCD camera, and images a plurality of injection holes 46 formed in the nozzle plate 45 of the stacked body S that is transported by the support transport mechanism 50. The imaging camera 80 has at least one row along the width direction (Y direction) of the nozzle plate 45 at the position where the laser light is irradiated from the laser light irradiation unit 60 or upstream ((−X) side) of the position. The injection hole 46 is imaged. For this reason, the imaging camera 80 may include a plurality of CCD cameras provided along the width direction of the nozzle plate 45. Data of an image captured by the imaging camera 80 is transmitted to the control unit 3.

  The control unit 3 controls the various operation mechanisms provided in the pattern forming apparatus 1. FIG. 5 is a block diagram illustrating a configuration of the control unit 3. The configuration of the control unit 3 as hardware is the same as that of a general computer. That is, the control unit 3 stores a CPU 31 that performs various arithmetic processes, a ROM 32 that is a read-only memory that stores basic programs, a RAM 33 that is a readable and writable memory that stores various information, and control programs and data. The magnetic disk 34 to be placed is connected to a bus line 39.

  The bus line 39 includes a stage moving mechanism 20 that moves the substrate W held on the stage 10 along the X direction, a support transport mechanism 50 that moves the substrate S along the X direction while supporting the stacked body S, and a laser beam. The laser beam scanning mechanism 65 that scans the irradiation unit 60 along the Y direction, the laser beam irradiation unit 60 that irradiates and heats the pressure generating member 42 of the stacked body S, and the plurality of injection holes 46 are imaged. An imaging camera 80 or the like is electrically connected. The CPU 31 of the control unit 3 executes a control program stored on the magnetic disk 34 to control each of these operation mechanisms to form a metal wiring having a predetermined pattern on the substrate W.

  Further, the display unit 35 and the input unit 36 are electrically connected to the bus line 39. The display unit 35 is configured by using, for example, a liquid crystal display and displays various information such as processing results and recipe contents. The input unit 36 is configured using, for example, a keyboard, a mouse, and the like, and receives input of commands, parameters, and the like. The operator of the apparatus can input commands and parameters from the input unit 36 while confirming the contents displayed on the display unit 35. The display unit 35 and the input unit 36 may be integrated to form a touch panel.

  The pattern forming apparatus 1 includes a position sensor for detecting the positions of the substrate W, the stacked body S, and the laser beam irradiation unit 60 (all of which are not shown), in addition to the above-described main configuration. As the position sensor, an optical sensor that directly detects the position of the substrate W or the like, an encoder that detects from the rotation amount of the motor, or the like can be used. Further, the pattern forming apparatus 1 includes a feed mechanism that sends out the unprocessed stacked body S and a recovery mechanism that recovers the used stacked body S. Further, the pattern forming apparatus 1 may be provided with a mechanism for adjusting the ambient atmosphere around the substrate W and the stacked body S.

  Next, a procedure for injecting a metal paste from the injection device 5 toward the substrate W will be described. Since the laminated body S is formed prior to the injection of the metal paste, the procedure for forming the laminated body S will be briefly described below.

  First, a long sheet-like (band-like) transparent base material 41 is prepared, and a pressure generating member 42 is laminated on the surface thereof. In the first embodiment, a polyimide film is used as the base material 41. The layer of the pressure generating member 42 is formed with a uniform thickness on the entire surface of the substrate 41 formed by processing a transparent polyimide film into a long sheet. The pressure generating member 42 before being formed as a layer is a slurry-like material produced by mixing camphor and carbon powder, which are sublimable materials, with glycerin, and is applied to the surface of the base material 41 by a coating method. Is possible.

  As such an application method, various known methods can be used. For example, in the first embodiment, the pressure generating member 42 is applied to the surface of the substrate 41 by the doctor blade method. The doctor blade method is an application method in which the slurry of the pressure generating member 42 is supplied to the surface of the substrate 41 and the slurry is leveled by the blade to form a layer of the pressure generating member 42 having a uniform thickness. is there.

  After the slurry of the pressure generating member 42 is uniformly applied to the surface of the base material 41, the layer of the pressure generating member 42 having a thickness of about 10 μm is uniformly formed on the entire surface of the base material 41 by performing a drying process. It is formed with a thickness. The pressure generating member 42 after the drying process is a solid phase. In addition, as a coating method for laminating the pressure generating member 42 on the surface of the base material 41, any coating method can be used as long as it can be applied to the surface of the base material 41 with a uniform thickness. In addition to the doctor blade method, A bar coat method or the like may be used.

  A plurality of injection holes 46 are formed in the nozzle plate 45. In the first embodiment, a polyimide film is also used as the nozzle plate 45. A plurality of injection holes 46 are formed in a lattice shape in the polyimide film by, for example, drilling with an excimer laser using a metal mask. Note that either the lamination of the pressure generating member 42 or the hole machining of the nozzle plate 45 may be performed in advance or in parallel.

  Next, an adhesive is applied to the surface of the pressure generating member 42 laminated on the base material 41. As the adhesive applied to the pressure generating member 42, a silicone-based adhesive or a polyimide-based adhesive can be employed. At this time, since the pressure generating member 42 is dried and becomes a solid phase, there is no problem in applying the adhesive.

  Subsequently, the nozzle plate 45 having a plurality of injection holes 46 formed thereon is pressure-bonded to the pressure generating member 42 to which the adhesive is applied. Thereby, the nozzle plate 45 having a plurality of injection holes 46 is adhered to the pressure generating member 42, and the laminated body is laminated so that the layer of the pressure generating member 42 is sandwiched between the nozzle plate 45 and the base material 41. S is formed.

  Thereafter, the metal paste 43 as the material to be injected is loaded into the plurality of injection holes 46 of the nozzle plate 45. The metal paste 43 is a high-viscosity material containing metal particles, and can be loaded into the plurality of injection holes 46 by a coating method in the same manner as the pressure generating member 42 described above. As a coating method for loading the metal paste 43 into the injection hole 46, various known methods can be used. In the first embodiment, a doctor blade method is used. That is, the nozzle that continuously discharges the metal paste 43 relatively moves in parallel with the nozzle plate 45, and the blade attached to the nozzle moves relatively with its lower end in contact with the upper surface of the nozzle plate 45. As a result, the metal paste 43 is pushed into the plurality of injection holes 46, and the metal paste 43 is scraped off by the blade in a region other than the injection holes 46. In this way, the metal paste 43 is loaded into the plurality of injection holes 46 of the nozzle plate 45. It should be noted that the metal paste 43 may remain slightly in a region other than the injection hole 46 on the upper surface of the nozzle plate 45.

  As described above, the laminate S having the structure shown in FIG. 4 is manufactured. By the way, when the metal paste 43 is loaded into the injection hole 46, the lower opening of the injection hole 46 is closed by the pressure generating member 42. For this reason, when the highly viscous metal paste 43 is pushed in from the upper opening of the injection hole 46, the air remaining in the injection hole 46 is confined between the metal paste 43 and the pressure generating member 42 as it is. It becomes. As a result, the metal paste 43 does not enter the bottom of the injection hole 46 due to residual air, and a gap 47 is formed between the loaded metal paste 43 and the pressure generating member 42 (see FIG. 4).

  Then, the process in which the injection apparatus 5 inject | emits a metal paste using the laminated body S is demonstrated. The laminate S manufactured as described above is bridged between the main driving roller 51 and the driven roller 52. The laminated body S is set so that the nozzle plate 45 faces upward between the rollers 51 and 52. Therefore, between the rollers 51 and 52, the forming direction of the plurality of injection holes 46 faces the vertical direction.

  On the other hand, the substrate W to be processed is held on the lower surface of the stage 10. The substrate W is held on the stage 10 at a position facing the nozzle plate 45 of the stacked body S between the rollers 51 and 52 with the surface on which pattern formation is performed facing downward. That is, the substrate W is disposed above the stacked body S so as to face the nozzle plate 45.

  Then, the stage moving mechanism 20 and the laser beam scanning mechanism 65 are respectively controlled by the control unit 3 so that the relative positional relationship between the substrate W and the laser beam irradiation unit 60 becomes the initial position for pattern formation. The light irradiation unit 60 is moved. Specifically, the X-direction adjustment of the relative positional relationship is performed by the stage moving mechanism 20 moving the substrate W, and the Y-direction adjustment is performed by the laser light scanning mechanism 65 moving the laser light irradiation unit 60. Done. Further, the stacked body S is also moved to the initial position by the support conveyance mechanism 50. The interval between the stacked body S between the rollers 51 and 52 and the surface of the substrate W is set to several hundreds μm.

  After the initial arrangement of the substrate W, the laser beam irradiation unit 60, and the laminate S is completed, the control unit 3 starts controlling the laser beam irradiation by the laser beam irradiation unit 60. At the same time, the control unit 3 starts relative movement of the laser beam irradiation unit 60. Specifically, the control unit 3 controls the laser beam scanning mechanism 65 to scan the laser beam irradiation unit 60 in the Y direction while stopping the substrate W and the stacked body S.

  Data on the pattern of the metal wiring to be formed on the substrate W is stored in advance in the storage unit (RAM 33 or magnetic disk 34) of the control unit 3. The control unit 3 performs on / off control of the laser light source 61 while scanning the laser light irradiation unit 60 in the Y direction according to the stored pattern data. That is, when the laser beam irradiation unit 60 is scanning along the Y direction at a predetermined X direction position on the substrate W, the emission hole 46 (that is, the laser beam) existing at the Y direction position to be patterned. The control unit 3 causes the laser light source 61 to emit laser light when the laser light irradiation unit 60 arrives directly below the irradiation target emission hole). Note that the pattern data is created so that the laser light source 61 is turned on when the laser light irradiation unit 60 is located immediately below the injection hole 46 of the nozzle plate 45. Therefore, when the laser beam irradiation unit 60 reaches just below the region where the injection hole 46 of the nozzle plate 45 does not exist, the laser beam irradiation from the laser light source 61 is stopped.

  Laser light emitted upward from the laser light source 61 of the laser light irradiation unit 60 in the vertical direction is incident from the back side of the laminate S. Since the base material 41 constituting the lowermost layer of the laminate S is transparent, the laser light emitted from the laser light irradiation unit 60 passes through the base material 41 and reaches the pressure generating member 42 and is absorbed. As a result, a rapid temperature rise occurs in the region of the pressure generating member 42 that has been irradiated with the laser beam. That is, the laser beam irradiation unit 60 irradiates the laser beam from the back surface of the base material 41 and heats the pressure generating member 42 located immediately below the irradiation target injection hole among the plurality of injection holes 46. Thereby, the pressure generating member 42 corresponding to the irradiation target injection hole absorbs the laser beam and raises the temperature to 150 ° C. or higher in a short time. In particular, since the pressure generating member 42 contains black carbon powder, the temperature is increased by efficiently absorbing laser light. The size of the laser light irradiation region is not particularly limited, and may be a circle having a diameter of about 50 μm, for example, the same as the diameter of the injection hole 46.

  When the temperature of the pressure generating member 42 rises, the camphor, which is a sublimable material contained in the pressure generating member 42, rapidly vaporizes and expands in volume by 600 to 1000 times. As a result, in a part of the pressure generating member 42 heated by the laser light irradiation, a pressure wave is generated due to a rapid volume expansion resulting from sublimation of camphor. Then, the pressure wave generated suddenly increases the pressure of the gap 47 in the injection hole 46 located immediately above the laser light irradiation region, and the metal paste 43 loaded in the injection hole 46 is directed upward, that is, The light is emitted toward the substrate W arranged to face the nozzle plate 45.

  Thus, in 1st Embodiment, the laser beam irradiation part 60 irradiates a laser beam from the back surface of the base material 41 of the laminated body S, and the pressure generation corresponding to the irradiation object injection hole of the some injection holes 46 is carried out. By heating the member 42, a pressure due to rapid volume expansion is generated in the pressure generating member 42. And the metal paste 43 which is the material to be injected loaded in the irradiation target injection hole is injected toward the substrate W held on the stage 10 by the pressure. Since the pressure generated by rapid volume expansion when heating the camphor that is a sublimable material is used, even the metal paste 43 that is a high-viscosity material of 0.1 Pa · s to 1000 Pa · s is used for the substrate W. Can be injected towards In addition, camphor does not generate harmful gases and pollutants when sublimated.

  The metal paste 43 injected upward reaches the surface of the substrate W and adheres to the surface of the substrate W at that position. In this way, the metal paste 43 for forming the metal wiring is supplied to the substrate W. The metal paste 43 adheres from the lower side of the substrate W. However, since the metal paste 43 is a high-viscosity material having a viscosity of 0.1 Pa · s to 1000 Pa · s, In addition, the spread of wetting along the surface of the substrate W is prevented.

  The injection process for performing on / off control of the laser light source 61 while scanning the laser light irradiation unit 60 in the Y direction is performed until the laser light irradiation unit 60 reaches the scanning end position. Then, when the laser beam irradiation unit 60 reaches the scanning end position, the processing for one line at the predetermined position in the X direction on the substrate W is completed. When the processing for one line is completed, the substrate W and the stacked body S are stepped along the X direction. That is, the control unit 3 controls the stage moving mechanism 20 to move the substrate W by a predetermined distance along the X direction. As a result, the laser beam irradiation unit 60 moves relative to the substrate W in the X direction, and the laser beam irradiation unit 60 can be scanned at a new position in the X direction on the substrate W. Moreover, the control part 3 controls the support conveyance mechanism 50, and moves the laminated body S only a predetermined distance along the X direction. Thereby, the laser beam irradiation unit 60 also moves relative to the stacked body S in the X direction. The reason for this is that if the stacked body S is not moved in the X direction, the laser beam may be irradiated again to the exit hole 46 of the stacked body S that has already been used by irradiating the laser light. Because there is.

  After the step feeding of the substrate W and the stacked body S is completed, the control unit 3 performs on / off control of the laser light source 61 while scanning the laser light irradiation unit 60 in the Y direction again. Thereafter, the same procedure as above is repeated until the pattern forming process is completed. As a result, the control unit 3 heats the pressure generating member 42 corresponding to the irradiation target injection hole by irradiating the laminate S with the laser beam from the laser beam irradiation unit 60 along the pattern data stored in the storage unit in advance. Then, the metal paste 43 is ejected upward from the nozzle plate 45 along the pattern and adheres to the surface of the substrate W to form a metal wiring pattern.

  By the way, when injecting the metal paste 43 from the injection hole 46 as described above, the metal paste 43 may fly from the normal direction of the nozzle plate 45 instead of directly above the vertical direction. This is because the injection angle from the injection hole 46 is affected by the processing accuracy of the injection hole 46 (processing tolerance, burrs remaining on the edge, etc.), dirt, and the filling direction of the metal paste 43. Therefore, the injection direction of the metal paste 43 is slightly different for each of the plurality of injection holes 46 formed in the nozzle plate 45, which may reduce the accuracy of pattern formation.

  For this reason, in the first embodiment, the injection direction of the metal paste 43 is corrected as follows. FIG. 6 is a flowchart showing a procedure for correcting the injection direction in the first embodiment. First, the plurality of injection holes 46 of the nozzle plate 45 are imaged by the imaging camera 80 (step S11). The imaging camera 80 images at least one row of the injection holes 46 along the width direction (Y direction) of the nozzle plate 45. The imaging camera 80 may perform imaging immediately after the injection hole array to be imaged is moved above the laser light irradiation unit 60 by step feed of the laminate S (that is, immediately before receiving the laser light irradiation). In addition, when the injection hole array is located on the upstream side of the laser light irradiation unit 60, the image may be taken in advance with a time margin. Data of the image captured by the imaging camera 80 (imaging data) is transmitted to the control unit 3 and stored in the storage unit (RAM 33 or magnetic disk 34) of the control unit 3.

  The control unit 3 analyzes the imaging result by performing predetermined image processing on the imaging data transmitted from the imaging camera 80 (step S12). Specifically, the control unit 3 determines the shape of the hole, the presence / absence of a burr, and the like for each of the plurality of injection holes 46 from the imaging data, and estimates the injection direction of the injection hole 46 based on the result. Such processing is performed, for example, by storing in the magnetic disk 34 a database in which the correlation between the shape of the injection hole 46 and the injection direction is obtained in advance through experiments and simulations, and collating the imaging results with the database. The injection direction may be estimated by performing image processing.

  Next, the control unit 3 calculates the deviation direction and the deviation amount of the laser light irradiation position based on the analysis result obtained in step S12 (step S13). FIG. 7 is a diagram showing the intensity distribution of the laser light emitted from the laser light irradiation unit 60. Generally, the intensity distribution of laser light is a Gaussian distribution (normal distribution). That is, in the laser light irradiation region irradiated on the horizontal plane immediately above the laser light irradiation unit 60, the intensity of the laser light is strongest at the center position CL of the irradiation region, and becomes smaller as it approaches the periphery of the irradiation region. . The intensity distribution as shown in FIG. 7 also appears in the irradiation region of the laser beam irradiated from the laser beam irradiation unit 60 to the pressure generating member 42. The deviation of the laser light irradiation position means that the center position CL in the laser light irradiation region is biased with respect to the center of the irradiation target injection hole.

  FIG. 8 is a diagram for explaining the deviation direction and the deviation amount of the laser light irradiation position. As a result of the analysis of the imaging data in step S12, when the emission direction of the irradiation target injection hole 46 is inclined from the vertical upper direction to the direction indicated by the arrow AR8 in FIG. 8, the center position of the laser light irradiation region CL is deviated from the center CH of the irradiation target injection hole 46 in the direction of the arrow AR8. That is, the deviation direction of the laser light irradiation position is the direction in which the emission direction of the irradiation target injection hole 46 obtained from the analysis result of the imaging data is inclined from the vertically upper side, and is the direction of the arrow AR8 in the example of FIG. Further, the amount of deviation of the laser light irradiation position is determined by the angle at which the emission direction of the irradiation target injection hole 46 is inclined from the vertically upper side (that is, the emission angle), and corresponds to the length of the arrow AR8 in the example of FIG. The control unit 3 obtains the deviation direction of the laser light irradiation position from the direction in which the emission direction of the irradiation target injection hole 46 is inclined from vertically above, and calculates the deviation amount of the laser light irradiation position from the angle at which the emission direction is inclined from vertically above. It is.

  And the control part 3 controls the injection apparatus 5 so that the center position CL of a laser beam irradiation area | region deviates from the center CH of the irradiation object injection hole 46 to the target position DH based on said calculation result. Here, in the injection device 5 of the first embodiment, the laser light irradiation unit 60 is moved in the Y direction by the laser light scanning mechanism 65, and the stacked body S is moved in the X direction by the support conveyance mechanism 50. That is, the laser beam irradiation unit 60 is moved biaxially with respect to the irradiation target injection hole 46. Accordingly, the deviation direction and the deviation amount of the laser beam irradiation position are decomposed into the X-axis component and the Y-axis component, and the X-axis deviation is corrected by the position correction of the laminate S (step S14), and the Y-axis deviation is irradiated with the laser beam. This is preferably realized by correcting the timing of laser light irradiation when the unit 60 is scanned in the Y direction (step S15).

  For example, in the example of FIG. 8, the deviation direction and the deviation amount of the laser light irradiation position indicated by the arrow AR8 are decomposed into an X-axis component DX and a Y-axis component DY. The control unit 3 moves the stacked body S by controlling the support transport mechanism 50 so that the center position CL of the laser light irradiation region is deviated from the center CH of the irradiation target injection hole 46 by the X-axis component DX. Although the laser beam irradiation unit 60 is scanned at a constant speed along the Y direction, the control unit 3 determines that the center position CL of the laser beam irradiation region is only the Y-axis component DY from the center CH of the irradiation target injection hole 46. The timing of laser light irradiation is corrected (delayed or advanced) so as to deviate. As a result, the center position CL of the laser light irradiation region is biased from the center CH of the irradiation target injection hole 46 to the target position DH. As described above, step S14 and step S15 in FIG. 6 are processes executed in parallel.

  FIG. 9 is a view for explaining correction of the injection direction in the first embodiment. When the laser beam is irradiated from the laser beam irradiation unit 60 to the pressure generating member 42 corresponding to the irradiation target injection hole 46 through the base material 41, the pressure generating member 42 absorbs the laser beam for a short time. The temperature rises to At this time, the center position CL of the laser light irradiation region is biased from the center CH of the irradiation target injection hole 46 to the target position DH. As shown in FIG. 7, the intensity distribution of the laser light is a Gaussian distribution, and the intensity at the center position CL of the laser light irradiation area is the strongest. Therefore, as shown in FIG. 9A, a strong pressure wave is generated starting from a position (target position DH) that is shifted from the center CH of the irradiation target injection hole 46. As a result, the injection direction of the metal paste 43 is corrected in the direction opposite to the deviation direction of the center position CL of the laser light irradiation region. Further, the emission angle of the metal paste 43 is defined by the amount of deviation of the center position CL of the laser light irradiation region.

  If the center position CL of the laser light irradiation region is deviated from the center CH of the irradiation target injection hole 46 by the X-axis component DX and the Y-axis component DY, as shown in FIG. When the center position CL coincides with the center CH of the irradiation target injection hole 46, the metal paste 43 is injected with an inclination as shown by the dotted line in the figure, as shown by the solid line in the figure. The injection direction is corrected so that the metal paste 43 is injected upward in the vertical direction. In addition, by deviating the center position CL of the laser light irradiation region by about 10 μm, the injection angle of the metal paste 43 from the irradiation target injection hole 46 can be corrected by about 10 °.

  However, the maximum deviation amount of the laser light irradiation position is the radius of a circle that is a cross section of the irradiation target injection hole 46. That is, the center position CL in the laser light irradiation region is deviated within the range of the irradiation target injection hole 46. This is because if the center position CL in the laser light irradiation region deviates beyond the range of the irradiation target injection hole 46, a pressure wave is generated below the region where the injection hole 46 of the nozzle plate 45 is not formed. This is because it causes the nozzle plate 45 to peel off from the base material 41.

  The injection device 5 of the first embodiment heats the pressure generating member 42 including the camphor that rapidly expands when the temperature rises by laser light irradiation, and causes the pressure generating member 42 to generate pressure due to the rapid volume expansion, The metal paste 43 that is the material to be injected loaded in the injection hole 46 is injected toward the substrate W using the pressure. Since the pressure generated by rapid volume expansion when heating the camphor that is a sublimable material is used, even the metal paste 43 that is a high-viscosity material of 0.1 Pa · s to 1000 Pa · s is used for the substrate W. Can be injected towards

  In particular, since the center position CL of the laser light irradiation region is biased with respect to the center CH of the irradiation target injection hole 46 based on the imaging result of the imaging camera 80, the emission direction of the irradiation target injection hole 46 is corrected, The metal paste 43 is accurately injected upward in the vertical direction from the irradiation target injection hole 46. For this reason, the metal paste 43 which is a high-viscosity material as an injection target material can be accurately injected toward the substrate W.

  Moreover, since the space | gap 47 is formed between the loaded metal paste 43 and the pressure generation member 42, both are not contacting. For this reason, it is possible to prevent the pressure generating member 42 from adhering to the injected metal paste 43 and becoming a contamination source of the substrate W.

  Further, since the pressure generating member 42 contains black carbon powder, the sublimation material contained in the pressure generating member 42 is generated by efficiently absorbing the laser light emitted from the laser light irradiation unit 60 and generating heat. Can effectively heat the camphor. The camphor, which is a sublimable material contained in the pressure generating member 42, easily transmits light. In other words, it is difficult to absorb light, so it is difficult to directly heat the camphor itself with light. In addition, since glycerin contained in the pressure generating member 42 also easily transmits light, that is, does not easily absorb light, it is difficult to heat glycerin by light irradiation. Therefore, the camphor is heated by including black particles such as carbon powder in the pressure generating member 42 and absorbing the black particles so that the black particles absorb light and generate heat. is there.

Second Embodiment
Next, a second embodiment of the present invention will be described. FIG. 10 is a front view of the pattern forming apparatus 1a of the second embodiment. In FIG. 10 and subsequent figures, the same reference numerals are given to the same elements as those in the first embodiment.

  The stage 10 that holds the substrate W and the stage moving mechanism 20 that moves the stage 10 are exactly the same as in the first embodiment. The laser beam irradiation unit 60 and the laser beam scanning mechanism 65 of the injection device 5 are the same as those in the first embodiment. The second embodiment is different from the first embodiment in the configuration of the stacked body S and a support transport mechanism 150 that supports and transports the stacked body S. The support transport mechanism 50 of the first embodiment employs a roller transport system that transports the flexible laminated body S by two rollers, but the support transport mechanism 150 of the second embodiment places the multilayer body S on the stage. It adopts a stage conveyance system that supports and conveys to the surface.

  The stage moving mechanism 20 is also based on the stage conveying method, and the support conveying mechanism 150 of the second embodiment has a configuration similar to the stage moving mechanism 20. That is, the support conveyance mechanism 150 is configured by screwing the stage 151 into the ball screw 153 connected to the rotation shaft of the motor 152. When the motor 152 rotates the ball screw 153, the stage 151 screwed to it moves along the X direction. As with the stage moving mechanism 20, a guide shaft that guides the stage 151 along the X direction may be provided.

  The stage 151 of the support transport mechanism 150 is configured in an annular shape, and holds the peripheral edge of the stacked body S so that the substrate W and the stacked body S are arranged to face each other. Since the inside of the annular portion of the stage 151 is hollow, the stage 151 does not become an obstacle to laser light irradiation. When the stage 151 is formed of a material transparent to laser light (for example, quartz glass), the entire surface of the stacked body S may be placed and held on the plate-like stage 151. good.

  FIG. 11 is a cross-sectional view of the stacked body S of the second embodiment. In the first embodiment, since the laminate S needs to be bent along the two rollers 51 and 52, a resin film is used as the base material 41. However, in the second embodiment, the laminate S is not flexible. Since it is unnecessary, the base material 41 may be any material that is transparent to the laser light emitted from the laser light irradiation unit 60, and for example, a glass substrate or the like can be used.

  The laminate S of the second embodiment is configured by directly abutting the nozzle plate 45 on the surface of the transparent substrate 41. Since the nozzle plate 45 does not need flexibility, for example, a metal plate such as stainless steel can be used. A plurality of injection holes 46 are formed in the nozzle plate 45, and each of the plurality of injection holes 46 is loaded with a pressure generating member 42 and a metal paste 43 that generate pressure when heated. That is, the nozzle plate 45 of the second embodiment is also an injection plate in which a plurality of injection holes 46 are formed in a metal plate. The shape, size, and arrangement interval of the plurality of injection holes 46 are the same as in the first embodiment. The materials of the pressure generating member 42 and the metal paste 43 are also exactly the same as in the first embodiment.

  In the second embodiment, a nozzle plate 45 having a plurality of injection holes 46 is bonded to the surface of the base material 41, and the pressure generating member 42 and the material to be injected are arranged inside the plurality of injection holes 46 in order from the base material 41. The metal paste 43 is loaded. Further, a gap 47 is formed between the loaded metal paste 43 and the pressure generating member 42. That is, the lower end opening of the injection hole 46 is closed by being loaded with the pressure generating member 42, and the upper end opening is closed by being loaded with the metal paste 43, and a gap 47 is formed therebetween. For this reason, in the laminated body S, the metal paste 43 and the pressure generation member 42 are non-contact.

  FIG. 12 is a block diagram illustrating a configuration of the control unit 3 according to the second embodiment. The hardware configuration of the control unit 3 of the second embodiment is a general computer system similar to that of the first embodiment (FIG. 5), but the imaging camera 80 is not provided in the second embodiment. The ejection direction information 341 is stored in the magnetic disk 34 of the second embodiment, which will be described later. The remaining configuration of the pattern forming apparatus 1a of the second embodiment is the same as that of the first embodiment.

  Next, a procedure for forming the laminate S having a structure as shown in FIG. 11 will be briefly described. First, for example, an etching process is performed on a stainless steel plate by using a photolithography technique, so that a plurality of injection holes 46 are formed in a lattice shape to prepare a nozzle plate 45. Then, the pressure generating member 42 is loaded into the plurality of injection holes 46 of the nozzle plate 45. The pressure generating member 42 when loading the injection hole 46 in the second embodiment is also a slurry that is generated by mixing camphor and carbon powder with glycerin, but the surface of the base material 41 in the first embodiment. The slurry of the pressure generating member 42 to be applied is diluted about 10 times with a solvent, and its viscosity is low.

  The slurry of the pressure generating member 42 of the second embodiment is also loaded into the plurality of injection holes 46 by a coating method. As a coating method for loading the slurry of the pressure generating member 42 into the injection hole 46, various known methods can be used, but in the second embodiment, a doctor blade method is used. That is, the nozzle that continuously discharges the slurry of the pressure generating member 42 relatively moves in parallel with the nozzle plate 45, and the blade attached to the nozzle makes a relative movement while the lower end thereof is in contact with the upper surface of the nozzle plate 45. By moving, the slurry of the pressure generating member 42 is pushed into the plurality of injection holes 46, and the slurry is scraped off by a blade in a region other than the injection holes 46. In this way, the pressure generating member 42 is loaded into the plurality of injection holes 46 of the nozzle plate 45.

  In the second embodiment, the slurry of the pressure generating member 42 is loaded in a state where the lower end opening of the injection hole 46 is opened, and the viscosity of the slurry is lower than that of the first embodiment. It is discharged outside when the slurry is loaded. As a result, the slurry of the pressure generating member 42 is loaded (that is, filled) so as to fill the entire injection hole 46.

  Next, a base material 41 such as a glass substrate is bonded to the lower surface of the nozzle plate 45 in which the slurry of the pressure generating member 42 is loaded in the plurality of injection holes 46. As an adhesive for this purpose, for example, a synthetic rubber adhesive may be used. By bonding the base material 41, a stacked body S in which the nozzle plate 45 having a plurality of injection holes 46 loaded with the slurry of the pressure generating member 42 and the base material 41 are stacked is formed.

  After the base material 41 is bonded, the slurry of the pressure generating member 42 is dried to volatilize the solvent component to reduce the volume, and the lower end of the injection hole 46 (the end on the side to which the base material 41 is bonded). Part) is formed with a layer of the pressure generating member 42. As a result, the nozzle plate 45 having a plurality of injection holes 46 in which the layer of the pressure generating member 42 is formed at the lower end and the base material 41 are laminated.

  And the metal paste 43 as a to-be-injected material is loaded into the some injection hole 46 of the nozzle plate 45 from the opposite side to the base material 41. FIG. The loading of the metal paste 43 into the plurality of injection holes 46 is the same as in the first embodiment, and is performed using the doctor blade method as the coating method. That is, the nozzle that continuously discharges the metal paste 43 relatively moves in parallel with the nozzle plate 45, and the blade attached to the nozzle moves relatively with its lower end in contact with the upper surface of the nozzle plate 45. As a result, the metal paste 43 is pushed into the plurality of injection holes 46, and the metal paste 43 is scraped off by the blade in a region other than the injection holes 46. In this way, the metal paste 43 is loaded into the plurality of injection holes 46 of the nozzle plate 45.

  As in the first embodiment, the high-viscosity metal paste 43 is pushed in from the upper opening (that is, from the side opposite to the base material 41) with the lower opening of the injection hole 46 closed by the pressure generating member 42. As a result, the air remaining inside the injection hole 46 is confined between the metal paste 43 and the pressure generating member 42 as it is. As a result, the metal paste 43 does not enter the interior of the injection hole 46 due to residual air, and a gap 47 is formed between the loaded metal paste 43 and the pressure generating member 42 (see FIG. 11).

  Then, the process in which the injection apparatus 5 inject | emits a metal paste using the laminated body S is demonstrated. A stacked body S having a structure as shown in FIG. 11 is held on the stage 151 of the support transport mechanism 150. The stacked body S is held on the stage 151 with the nozzle plate 45 facing upward. On the other hand, the substrate W to be processed is held on the lower surface of the stage 10. The substrate W is held on the stage 10 at a position facing the nozzle plate 45 of the stacked body S with the surface on which pattern formation is performed facing downward. That is, the substrate W is disposed above the stacked body S so as to face the nozzle plate 45.

  Then, the stage moving mechanism 20 and the laser beam scanning mechanism 65 are respectively controlled by the control unit 3 so that the relative positional relationship between the substrate W and the laser beam irradiation unit 60 becomes the initial position for pattern formation. The light irradiation unit 60 is moved. Specifically, the X-direction adjustment of the relative positional relationship is performed by the stage moving mechanism 20 moving the substrate W, and the Y-direction adjustment is performed by the laser light scanning mechanism 65 moving the laser light irradiation unit 60. Done. Further, the stacked body S is also moved to the initial position by the support conveyance mechanism 150.

  After the initial arrangement of the substrate W, the laser beam irradiation unit 60, and the laminate S is completed, the control unit 3 starts controlling the laser beam irradiation by the laser beam irradiation unit 60. At the same time, the control unit 3 starts relative movement of the laser beam irradiation unit 60. Specifically, the control unit 3 controls the laser beam scanning mechanism 65 to scan the laser beam irradiation unit 60 in the Y direction while stopping the substrate W and the stacked body S. Similarly to the first embodiment, the control unit 3 performs on / off control of the laser light source 61 while scanning the laser light irradiation unit 60 in the Y direction according to the pattern data stored in the storage unit. That is, when the laser beam irradiation unit 60 is scanning along the Y direction at a predetermined X direction position on the substrate W, the injection hole 46 (irradiation target injection) existing at the Y direction position where the pattern is to be formed. When the laser beam irradiating unit 60 reaches just below the hole), the control unit 3 emits the laser beam from the laser light source 61.

  Laser light emitted upward from the laser light source 61 of the laser light irradiation unit 60 in the vertical direction is incident from the back side of the laminate S. Since the base material 41 constituting the lowermost layer of the laminate S is transparent, the laser light emitted from the laser light irradiation unit 60 passes through the base material 41 and is loaded into the irradiation target injection hole 46. To be absorbed. As a result, a rapid temperature rise occurs in the pressure generating member 42 that has been irradiated with the laser beam. That is, the laser beam irradiation unit 60 irradiates the laser beam from the back surface of the base material 41 and heats the pressure generating member 42 loaded in the irradiation target injection hole 46 among the plurality of injection holes 46. Thereby, the pressure generating member 42 loaded in the irradiation target injection hole 46 absorbs the laser beam and raises the temperature to 150 ° C. or more in a short time.

  When the temperature of the pressure generating member 42 rises, the camphor, which is a sublimable material contained in the pressure generating member 42, rapidly vaporizes and expands in volume by 600 to 1000 times. As a result, in the pressure generating member 42 heated by the laser light irradiation, a pressure wave is generated due to a rapid volume expansion resulting from sublimation of camphor. Then, the generated pressure wave rapidly increases the pressure of the gap 47 in the irradiation target injection hole 46, and the metal paste 43 loaded in the injection hole 46 is directed upward, that is, opposed to the nozzle plate 45. Injected toward the substrate W.

  Thus, in 2nd Embodiment, the laser beam irradiation part 60 irradiated the laser beam from the back surface of the base material 41 of the laminated body S, and was loaded in the irradiation object injection hole 46 among the several injection holes 46. By heating the pressure generating member 42, pressure due to rapid volume expansion is generated in the pressure generating member 42. Then, the metal paste 43 that is the material to be injected loaded in the irradiation target injection hole 46 is injected toward the substrate W held on the stage 10 by the pressure. The metal paste 43 injected upward reaches the surface of the substrate W and adheres to the surface of the substrate W at that position. In this way, the metal paste 43 for forming the metal wiring is supplied to the substrate W.

  The injection process for performing on / off control of the laser light source 61 while scanning the laser light irradiation unit 60 in the Y direction is performed until the laser light irradiation unit 60 reaches the scanning end position. Then, when the laser beam irradiation unit 60 reaches the scanning end position, the processing for one line at the predetermined position in the X direction on the substrate W is completed. Similar to the first embodiment, when the processing for one line is completed, the substrate W and the stacked body S are stepped along the X direction. That is, the control unit 3 controls the stage moving mechanism 20 to move the substrate W by a predetermined distance along the X direction. As a result, the laser beam irradiation unit 60 moves relative to the substrate W in the X direction, and the laser beam irradiation unit 60 can be scanned at a new position in the X direction on the substrate W. Further, the control unit 3 controls the support conveyance mechanism 150 to move the stacked body S by a predetermined distance along the X direction. Thereby, the laser beam irradiation unit 60 also moves relative to the stacked body S in the X direction.

  After the step feeding of the substrate W and the stacked body S is completed, the control unit 3 performs on / off control of the laser light source 61 while scanning the laser light irradiation unit 60 in the Y direction again. Thereafter, the same procedure as above is repeated until the pattern forming process is completed. As a result, the control unit 3 heats the pressure generating member 42 loaded in the irradiation target injection hole 46 by irradiating the laminate S with the laser beam from the laser beam irradiation unit 60 according to the pattern data stored in the storage unit in advance. Thus, the metal paste 43 is injected upward from the nozzle plate 45 along the pattern and adheres to the surface of the substrate W to form a metal wiring pattern.

  Also in the second embodiment, individual differences occur in the injection angle from the injection hole 46 due to the influence of the processing accuracy of the injection hole 46, dirt, the filling direction of the metal paste 43, and the like. When the nozzle 43 is ejected, the metal paste 43 may fly from the normal direction of the nozzle plate 45 instead of directly above. Therefore, in the second embodiment, the injection direction of the metal paste 43 is corrected as follows.

  FIG. 13 is a flowchart showing a procedure for correcting the injection direction in the second embodiment. First, prior to the actual pattern forming process by injecting the metal paste as described above, the tendency of the injection direction is measured for each of the plurality of injection holes 46 of the nozzle plate 45 (step S21). That is, prior to actual processing, the pressure generating member 42 loaded in each of the plurality of injection holes 46 of the nozzle plate 45 is heated to inject the metal paste 43 from each injection hole 46 on a trial basis. The tendency of the injection direction of the metal paste 43 is measured in advance. In this measurement, it is not necessary to arrange the substrate W.

  The tendency of the injection direction of the metal paste 43 for each injection hole 46 measured in step S21 is stored in the magnetic disk 34 of the control unit 3 as injection direction information 341 (step S22). The injection direction information 341 is a database in which the tendency of the injection direction of the metal paste 43 for each injection hole 46 is associated with the position of the injection hole 46 in the nozzle plate 45.

  Next, the control unit 3 calculates the deviation direction and the deviation amount of the laser light irradiation position based on the emission direction information 341 (step S23). The deviation of the laser light irradiation position is the same as that of the first embodiment, and is the deviation of the center position CL in the laser light irradiation area with respect to the center CH of the irradiation target injection hole 46.

  The calculation of the deviation direction and the deviation amount of the laser light irradiation position is also substantially the same as in the first embodiment. For example, in the emission direction information 341, when the emission direction of the irradiation target injection hole 46 is inclined in the direction indicated by the arrow AR8 in FIG. 8 from vertically above, the center position CL of the laser light irradiation region is set as the irradiation target. It is biased from the center CH of the injection hole 46 in the direction of the arrow AR8. The control unit 3 obtains the deviation direction of the laser light irradiation position from the direction in which the emission direction of the irradiation target injection hole 46 is inclined from vertically above, and calculates the deviation amount of the laser light irradiation position from the angle at which the emission direction is inclined from vertically above. .

  And the control part 3 controls the injection apparatus 5 so that the center position CL of a laser beam irradiation area | region deviates from the center CH of the irradiation object injection hole 46 to the target position DH based on said calculation result. Also in the injection device 5 of the second embodiment, the laser light irradiation unit 60 is moved in two directions, the X axis direction and the Y axis direction, with respect to the irradiation target injection hole 46. Therefore, as in the first embodiment, the deviation direction and the deviation amount of the laser light irradiation position are decomposed into the X-axis component and the Y-axis component, and the X-axis deviation is corrected by the position correction of the stacked body S (step S24). It is preferable to realize the deviation of the Y axis by correcting the timing of laser light irradiation when the laser light irradiation unit 60 is scanned in the Y direction (step S25).

  For example, in the example of FIG. 8, the control unit 3 controls the support conveyance mechanism 150 so that the center position CL of the laser light irradiation region is offset from the center CH of the irradiation target injection hole 46 by the X-axis component DX. The body S is moved. Although the laser beam irradiation unit 60 is scanned at a constant speed along the Y direction, the control unit 3 determines that the center position CL of the laser beam irradiation region is only the Y-axis component DY from the center CH of the irradiation target injection hole 46. The timing of laser light irradiation is corrected so as to deviate. As a result, the center position CL of the laser light irradiation region is biased from the center CH of the irradiation target injection hole 46 to the target position DH.

  FIG. 14 is a diagram for explaining the correction of the injection direction in the second embodiment. When the laser light is irradiated to the pressure generating member 42 that has passed through the base material 41 from the laser light irradiation unit 60 and is loaded in the irradiation target injection hole 46, the pressure generating member 42 absorbs the laser light and absorbs a short time. The temperature rises. At this time, the center position CL of the laser light irradiation region is biased from the center CH of the irradiation target injection hole 46 to the target position DH. As shown in FIG. 7, the intensity distribution of the laser beam is a Gaussian distribution, and the intensity at the center position CL of the laser beam irradiation region is the strongest. Therefore, as shown in FIG. 14A, a strong pressure wave is generated starting from a position (target position DH) shifted from the center CH of the irradiation target injection hole 46. As a result, the injection direction of the metal paste 43 is corrected in the direction opposite to the deviation direction of the center position CL of the laser light irradiation region. Further, the emission angle of the metal paste 43 is defined by the amount of deviation of the center position CL of the laser light irradiation region.

  If the center position CL of the laser light irradiation region is deviated from the center CH of the irradiation target injection hole 46 by the X-axis component DX and the Y-axis component DY, as shown in FIG. When the center position CL coincides with the center CH of the irradiation target injection hole 46, the metal paste 43 is injected with an inclination as shown by the dotted line in the figure, as shown by the solid line in the figure. The injection direction is corrected so that the metal paste 43 is injected upward in the vertical direction.

  However, the maximum deviation amount of the laser light irradiation position is the radius of a circle that is a cross section of the irradiation target injection hole 46. That is, the center position CL in the laser light irradiation region is deviated within the range of the irradiation target injection hole 46.

  The injection device 5 of the second embodiment heats the pressure generating member 42 including the camphor that rapidly expands when the temperature rises by laser light irradiation, and causes the pressure generating member 42 to generate pressure due to the rapid volume expansion. The metal paste 43 that is the material to be injected loaded in the injection hole 46 is injected toward the substrate W using the pressure. Since the pressure generated by rapid volume expansion when heating the camphor that is a sublimable material is used, even the metal paste 43 that is a high-viscosity material of 0.1 Pa · s to 1000 Pa · s is used for the substrate W. Can be injected towards

  In particular, in the second embodiment, the metal nozzle plate 45 is not disposable, but is repeatedly loaded with the pressure generating member 42 and the metal paste 43 repeatedly. Therefore, if the tendency of the injection direction is measured in advance for each of the plurality of injection holes 46 of the nozzle plate 45 and held as the injection direction information 341, based on the injection direction information 341, as in the first embodiment, The center position CL of the laser light irradiation region can be deviated from the center CH of the irradiation target injection hole 46, and the emission direction of the irradiation target injection hole 46 can be corrected. As a result, the metal paste 43 is accurately injected from the irradiation target injection hole 46 upward in the vertical direction, and the metal paste 43, which is a high-viscosity material as an injection target, is accurately injected toward the substrate W. be able to.

<Modification>
While the embodiments of the present invention have been described above, the present invention can be modified in various ways other than those described above without departing from the spirit of the present invention. For example, in each of the above-described embodiments, the injection direction of the metal paste 43 from the irradiation target injection hole 46 is corrected so as to be upward in the vertical direction. You may make it incline.

  FIG. 15 is a diagram illustrating an example in which the injection direction is inclined. In this example, it is assumed that when the center position CL of the laser light irradiation region coincides with the center CH of the irradiation target injection hole 46, the metal paste 43 is accurately ejected upward in the vertical direction. When the center position CL of the laser light irradiation region is deviated from the center CH of the irradiation target injection hole 46, a strong pressure wave is generated in the pressure generating member 42 at a position shifted from the center CH. As a result, as shown in FIG. 15, the injection direction of the metal paste 43 from the irradiation target injection hole 46 is deviated from the normal direction (vertical direction in this example) of the nozzle plate 45 to the center position CL of the laser light irradiation region. It will be inclined in the direction opposite to the direction. The injection angle of the metal paste 43 is defined by the amount of deviation of the center position CL of the laser light irradiation region from the center CH of the irradiation target injection hole 46.

  Such a technique for intentionally inclining the injection direction of the metal paste 43 is suitable when the regularity of the pattern of the landing positions on the substrate W is desired to be disturbed. In addition, by intentionally inclining the injection direction of the metal paste 43, it is possible to widen variations of metal wiring on the substrate W and increase the resolution of the wiring pattern.

  In each of the above embodiments, the laser beam irradiation position deviation amount and deviation amount are decomposed into the X-axis component DX and the Y-axis component DY, and the laser beam is corrected by correcting the position of the laminate S and the timing of laser beam irradiation. Although the center position CL of the irradiation region is biased to a predetermined position, the method of biasing the laser light irradiation position is not limited to this. For example, the laser beam irradiation unit 60 may be provided with an optical system that can move the laser beam irradiation position so that the center position CL of the laser beam irradiation region is offset from the center CH of the irradiation target injection hole 46. good.

  In the first embodiment, the positional deviation of the stacked body S itself may be corrected from the imaging result of the imaging camera 80. For example, when the stacked body S itself transported by the support transport mechanism 50 is displaced from a predetermined position, the direction and amount of the displacement are determined from the imaging result of the imaging camera 80, and the laser light irradiation position is accordingly determined. May be biased.

  Further, the imaging camera 80 of the first embodiment may be provided in the pattern forming apparatus 1a of the second embodiment. In this way, in addition to the injection direction information 341 indicating the tendency of the injection direction for each of the injection holes 46, the center position CL of the laser light irradiation region is determined based on the imaging result by the imaging camera 80. Since the center CH is deviated, the injection direction of the metal paste 43 can be corrected with higher accuracy.

  Further, the laminate S having the structure of the second embodiment and the support transport mechanism 150 that supports the stacked body S may be applied to the first embodiment provided with the imaging camera 80. However, for the flexible laminate S as in the first embodiment, since the nozzle plate 45 is disposable, this is applied to the second embodiment in which the tendency in the injection direction is measured in advance. It is not possible.

  In each of the above embodiments, the pressure generating member 42 is provided with a camphor as a sublimable material so as to provide a pressure generating function. You may make it provide. For example, the pressure generating member 42 may include dry ice as a sublimable material. Even when other sublimable materials are used, volume expansion occurs due to sublimation when heated, so that the same processing as in the above embodiments can be performed.

  Further, the pressure generating member 42 is not limited to one including a sublimable material, and may be any member that generates pressure by heating. For example, the pressure generating member 42 may be configured to include explosives. Further, a gas storage material may be used as the pressure generating member 42.

  In each of the above embodiments, carbon powder is included in the pressure generating member 42 in order to increase the absorption efficiency of laser light. However, the present invention is not limited to this, and includes black particles other than carbon powder. You may make it. In short, the pressure generating member 42 may include a material that easily absorbs light, in other words, a material that hardly reflects or transmits light. If the sublimation material itself is a material that easily absorbs light, for example, a black sublimation material, black particles such as carbon powder may not be included in the pressure generating member 42.

  In each of the above embodiments, the substrate W is moved in the X direction and the laser light irradiation unit 60 is moved in the Y direction. However, the relative movement is not limited to this. Various configurations in which the irradiation unit 60 is moved relative to the substrate W held on the stage 10 in the X direction and the Y direction can be employed. For example, the substrate W may be held at a fixed position without being moved, and only the laser light irradiation unit 60 may be moved in the X direction and the Y direction.

  Further, instead of the metal paste 43, an adhesive (for example, an epoxy resin adhesive) having a viscosity of 0.1 Pa · s or more and 1000 Pa · s or less may be used as an injection target material. The adhesive can be injected by pressure caused by the volume expansion of the heated pressure generating member 42 and can be applied to a minute region such as a joint between the sensor and the semiconductor element. According to the technique according to the present invention, it is possible to apply a necessary amount of an expensive adhesive to such a minute region, and it is possible to suppress wasteful use of the adhesive.

  Further, instead of the metal paste 43, metal particles may be injected. Specifically, in each of the above embodiments, the injection hole 46 is loaded with a high-viscosity material in which a plurality of metal particles are dispersed instead of the metal paste 43. The material and particle size of the metal particles are not particularly limited, and may be metal powder. Further, the high viscosity material has a viscosity of 0.1 Pa · s to 1000 Pa · s, and for example, an adhesive can be used. When performing a pattern formation process, the laminated body S and the board | substrate W with which the high-viscosity material containing many metal particles was loaded in the some injection hole 46 are arrange | positioned facing each other. When the pressure generating member 42 is heated along a predetermined pattern, a pressure due to volume expansion is generated, and a high-viscosity material including metal particles as an injection target material is injected. The injected high viscosity material adheres to the surface of the substrate W, and a pattern of metal particles is formed on the surface. Instead of dispersing the metal particles in the high-viscosity material, the metal particles may be directly dispersed on the layer of the pressure generating member 42 and injected from the injection hole 46.

  Furthermore, the metal paste 43 may be injected from the injection sheet S according to the present invention into a pattern connected to the inner lead of the semiconductor element, and the outer lead may be formed by the metal paste 43. That is, wire bonding of a semiconductor device can be performed using the technique according to the present invention.

  The present invention can be suitably applied to a technique for forming various electric wiring patterns on a substrate, and is particularly suitable for performing pattern formation using a high-viscosity material. The present invention can also be suitably applied to application of an adhesive to a fine region and wire bonding of a semiconductor device.

DESCRIPTION OF SYMBOLS 1,1a Pattern formation apparatus 3 Control part 5 Injection | emission apparatus 10 Stage 20 Stage moving mechanism 34 Magnetic disk 41 Base material 42 Pressure generating member 43 Metal paste 45 Nozzle plate 46 Injection hole 50,150 Support conveyance mechanism 60 Laser beam irradiation part 65 Laser Optical scanning mechanism 80 Imaging camera 341 Ejection direction information S Laminate W Substrate

Claims (16)

A supporting means for supporting a base material on which a pressure generating member that generates pressure when heated is laminated;
An injection plate provided in contact with the pressure generating member and having a plurality of injection holes in which an injection target material is loaded;
By irradiating the pressure generating member with laser light and heating, the pressure generating member generates a pressure due to volume expansion and injects the material to be injected toward an object disposed opposite to the injection plate. Laser light irradiation means for causing,
Irradiation position biasing means for biasing the center position in the laser light irradiation region with respect to the center of the irradiation target injection hole to be irradiated with laser light among the plurality of injection holes;
An injection apparatus comprising: A support means for supporting the substrate;
An injection plate that is provided in contact with the surface of the base material and has a plurality of injection holes in which a pressure generating member that generates pressure by being heated in the order from the base material and an injection target material are loaded. When,
By irradiating the pressure generating member with laser light and heating, the pressure generating member generates a pressure due to volume expansion and injects the material to be injected toward an object disposed opposite to the injection plate. Laser light irradiation means for causing,
Irradiation position biasing means for biasing the center position in the laser light irradiation region with respect to the center of the irradiation target injection hole to be irradiated with laser light among the plurality of injection holes;
An injection apparatus comprising: The injection apparatus according to claim 1 or 2,
The irradiation position biasing means biases the center position in the laser light irradiation region within the range of the irradiation target injection hole. In the injection device according to any one of claims 1 to 3,
Further comprising storage means for storing injection direction information indicating a tendency of the injection direction for each of the plurality of injection holes,
The irradiation position biasing means biases the center position in the irradiation region of the laser light by a biasing direction and a biasing amount based on the emitting direction information. In the injection device according to any one of claims 1 to 4,
It further comprises imaging means for imaging the plurality of injection holes of the injection plate,
The irradiation apparatus according to claim 1, wherein the irradiation position biasing means biases a center position in an irradiation region of the laser light by a biasing direction and a biasing amount based on an imaging result by the imaging means. In the injection device according to any one of claims 1 to 3,
The irradiation position biasing means biases the center position in the laser light irradiation region so that the injection direction of the material to be injected from the irradiation target injection hole is inclined from the normal direction of the injection plate. Injection device. The injection apparatus according to any one of claims 1 to 6,
The injection apparatus according to claim 1, wherein the pressure generating member includes a camphor that causes volume expansion by sublimation when heated. The injection apparatus according to any one of claims 1 to 7,
The said injection material contains the highly viscous material whose viscosity is 0.1 Pa.s or more and 1000 Pa.s or less, The injection apparatus characterized by the above-mentioned. A pressure generating member that generates pressure by being heated on the surface of the substrate is laminated, an injection plate having a plurality of injection holes loaded with an injection target material is brought into contact with the pressure generating member, and the pressure generating member A laser light irradiation step in which a pressure due to volume expansion is generated in the pressure generating member and the target material is injected toward an object disposed opposite to the injection plate by irradiating the laser beam toward the target and heating. When,
An irradiation position biasing step of biasing the center position in the laser light irradiation region with respect to the center of the irradiation target injection hole to be irradiated with laser light among the plurality of injection holes;
An injection method comprising: An injection plate having a plurality of injection holes loaded with a pressure generating member that generates pressure when heated and a material to be injected is brought into contact with the surface of the substrate, and laser light is irradiated toward the pressure generating member. A laser beam irradiation step of causing the pressure generating member to generate a pressure due to volume expansion and injecting the material to be injected toward an object disposed opposite to the injection plate,
An irradiation position biasing step of biasing the center position in the laser light irradiation region with respect to the center of the irradiation target injection hole to be irradiated with laser light among the plurality of injection holes;
An injection method comprising: The injection method according to claim 9 or 10,
In the irradiation position biasing step, the center position in the laser light irradiation region is biased within the range of the irradiation target injection hole. The injection method according to any one of claims 9 to 11,
Further comprising a measuring step of measuring a tendency of the injection direction for each of the plurality of injection holes,
In the irradiation position biasing step, the center position in the laser light irradiation region is biased by a biasing direction and a biasing amount based on a measurement result in the measuring step. The injection method according to any one of claims 9 to 12,
Further comprising an imaging step of imaging the plurality of injection holes of the injection plate;
In the irradiation position biasing step, the center position in the laser light irradiation region is biased by a biasing direction and a biasing amount based on an imaging result in the imaging step. The injection method according to any one of claims 9 to 11,
In the irradiation position biasing step, the center position in the laser light irradiation region is biased so that the injection direction of the material to be injected from the irradiation target injection hole is inclined from the normal direction of the injection plate. Injection method. The injection method according to any one of claims 9 to 14,
The injection method according to claim 1, wherein the pressure generating member includes a camphor that causes volume expansion by sublimation when heated. The injection method according to any one of claims 9 to 15,
The said injection material contains the high viscosity material whose viscosity is 0.1 Pa.s or more and 1000 Pa.s or less, The injection method characterized by the above-mentioned.

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