JP5682400B2 - Printing device - Google Patents

Description

  The present invention relates to a printing apparatus.

  2. Description of the Related Art In recent years, a technique of applying predetermined information on a recording medium by applying the liquid on a recording medium using an ink jet method that discharges the functional liquid as droplets and solidifying the applied functional liquid has been adopted. Patent Document 1 below discloses a printing apparatus that uses an IC chip as a recording medium and prints predetermined information such as a manufacturing number and a manufacturing company on the IC chip.

  By the way, in the printing apparatus as described above, it is necessary to align the recording medium, the inkjet head, and the stage in order to land the functional liquid on the recording medium with high accuracy from the inkjet head. Therefore, an alignment mark is usually provided on the surface of the recording medium.

  For example, as shown in Patent Documents 2 and 3, alignment marks may be provided on both the front side and the back side of the recording medium. As described above, when the alignment marks are provided on both sides of the recording medium, or when the alignment marks are provided on either side of the recording medium, the alignment cameras are respectively arranged on both sides of the recording medium. Is desirable.

JP 2003-80687 A JP 2008-53624 A JP 2008-171873 A

  By the way, in general, the recording apparatus performs calibration related to the position of the stage prior to performing the printing process. In view of this, it is conceivable to calibrate the stage using the above-described alignment camera to image a reference mark (hereinafter also referred to as a calibration mark) provided on the front and back of the stage.

  However, when the calibration related to the position of the stage is performed as described above, the following problems may occur. If an error occurs between the coordinate system set on the stage by the alignment camera on the front side and the coordinate system set on the stage by the alignment camera on the back side, the reliability of calibration related to the stage decreases, and recording on the stage It may be difficult to print at an accurate position on the medium.

  The present invention has been made in view of such circumstances, and provides a printing apparatus capable of performing printing at an accurate position on a recording medium provided with an alignment mark on at least one of the front and back sides. With the goal.

  In order to solve the above problems, a printing apparatus according to the present invention includes a stage on which an alignment mark is provided on at least one of a front surface and a back surface, and a substrate on which a liquid droplet is discharged from a nozzle of a discharge head. A first alignment camera that images the alignment mark provided on the base material from the front surface side, and a second alignment camera that images the alignment mark provided on the base material from the back surface side. The stage is provided with a calibration mark used when the stage is calibrated, and the calibration mark is shared between the first alignment camera and the second alignment camera.

  According to the printing apparatus of the present invention, since the calibration mark is shared between the first alignment camera and the second alignment camera, the coordinates that are calibrated using the first alignment camera and set on the stage It is possible to prevent an error from occurring between the system and the coordinate system set on the stage after calibration using the second alignment camera. Therefore, since calibration on the stage can be performed with high reliability, even a substrate having an alignment mark on at least one of the front surface and the back surface can be accurately aligned on the stage. Therefore, printing can be performed at an accurate position of the substrate on the stage.

In the printing apparatus, it is preferable that an opening for facing the alignment mark provided on the back surface of the base material is formed in the mounting region of the base material of the stage.
According to this configuration, the second alignment camera can reliably image the alignment mark through the opening formed in the stage.

In the printing apparatus, it is preferable that the calibration mark includes a through hole formed in the stage.
The center of the through hole penetrating the stage is the same position on the front surface side and the back surface side of the stage in a plan view. Therefore, each of the first alignment camera and the second alignment camera can satisfactorily take an image using the through hole as a calibration mark from both sides of the stage.

In the printing apparatus, it is preferable that the calibration mark includes a mark printed on a translucent member embedded in the stage.
The mark printed on the translucent member can be imaged from both the front side and the back side of the stage. According to this configuration, each of the first alignment camera and the second alignment camera can satisfactorily image the mark printed on the translucent member from both sides of the stage as a calibration mark.

In the printing apparatus, it is preferable that a plurality of the calibration marks are provided on the stage so that two calibration marks are included in each of the imaging regions of the first alignment camera and the second alignment camera. .
According to this configuration, since two calibration marks are included in each of the imaging regions of the first alignment camera and the second alignment camera, a shift in the rotation direction of the stage can be detected during calibration.

(A) is a schematic plan view which shows a semiconductor substrate, (b) is a schematic plan view which shows a droplet discharge device. The schematic diagram which shows a supply part. The schematic perspective view which shows the structure of a pre-processing part. The schematic perspective view which shows the structure of an application part. Explanatory drawing of the calibration operation | movement of an alignment part. Explanatory drawing of calibration operation | movement when an alignment mark is provided in the back surface. The schematic side view which shows a carriage. (A) is a schematic plan view showing a head unit, and a schematic cross-sectional view of a main part for explaining the structure of a droplet discharge head. The schematic diagram which shows a storage part. The schematic perspective view which shows the structure of a conveyance part. 6 is a flowchart for illustrating a printing method. The figure which shows the structure which concerns on the modification of a calibration mark. The figure which shows the structure which concerns on the modification of a calibration mark.

Hereinafter, embodiments of a printing apparatus according to the present invention will be described with reference to the drawings.
The following embodiment shows one aspect of the present invention and does not limit the present invention, and can be arbitrarily changed within the scope of the technical idea of the present invention. Moreover, in the following drawings, in order to make each configuration easy to understand, the actual structure is different from the scale and number of each structure.

  In the present embodiment, a characteristic printing apparatus of the present invention and an example of a printing method for printing by discharging droplets using the printing apparatus will be described with reference to FIGS.

(Semiconductor substrate)
First, a semiconductor substrate which is an example of an object to be drawn (printed) using a printing apparatus will be described.
FIG. 1A is a schematic plan view showing a semiconductor substrate. As shown in FIG. 1A, a semiconductor substrate 1 as a base material includes a substrate 2. The substrate 2 only needs to have heat resistance so that the semiconductor device 3 can be mounted. As the substrate 2, a glass epoxy substrate, a paper phenol substrate, a paper epoxy substrate, or the like can be used.

  A semiconductor device 3 is mounted on the substrate 2. On the semiconductor device 3, marks (print pattern, predetermined pattern) such as a company name mark 4, a model code 5, and a production number 6 are drawn. These marks are drawn by the printing apparatus.

  The semiconductor substrate 1 is provided with an alignment mark M on one surface thereof, in this embodiment, on the surface 1a side. The alignment mark M is used in an alignment process for aligning the semiconductor substrate 1 with respect to a stage of a coating portion described later.

(Printer)
FIG. 1B is a schematic plan view showing the printing apparatus.
As shown in FIG. 1B, the printing apparatus 7 mainly includes a supply unit 8, a preprocessing unit 9, a coating unit (printing unit) 10, a cooling unit 11, a storage unit 12, a transport unit 13, and a control unit 14. Has been. The printing apparatus 7 is arranged in the order of the supply unit 8, the preprocessing unit 9, the application unit 10, the cooling unit 11, the storage unit 12, the control unit 14, and the input unit 19 in the clockwise direction with the conveyance unit 13 as the center. A supply unit 8 is arranged next to the control unit 14. A direction in which the supply unit 8, the control unit 14, and the storage unit 12 are arranged is an X direction. The direction orthogonal to the X direction is defined as the Y direction, and the coating unit 10, the transport unit 13, and the control unit 14 are arranged side by side in the Y direction. The vertical direction is the Z direction.

  The supply unit 8 includes a storage container in which a plurality of semiconductor substrates 1 are stored. The supply unit 8 includes a relay location 8a, and supplies the semiconductor substrate 1 from the storage container to the relay location 8a.

  The pretreatment unit 9 has a function of modifying the surface of the semiconductor device 3 while heating. The pretreatment unit 9 adjusts the spread of the ejected droplets and the adhesion of the marks to be printed. The pre-processing unit 9 includes a first relay location 9a and a second relay location 9b, and takes the semiconductor substrate 1 before processing from the first relay location 9a or the second relay location 9b to modify the surface. Thereafter, the preprocessing unit 9 moves the processed semiconductor substrate 1 to the first relay location 9a or the second relay location 9b, and makes the semiconductor substrate 1 stand by. The first relay location 9a and the second relay location 9b are collectively referred to as a relay location 9c. Then, when the pre-processing is performed inside the pre-processing unit 9, a place where the semiconductor substrate 1 is located is set as a processing place 9d.

  The cooling unit 11 has a function of cooling the semiconductor substrate 1 that has been heated and surface-modified in the pretreatment unit 9. The cooling unit 11 includes processing places 11 a and 11 b that hold and cool the semiconductor substrate 1. The processing places 11a and 11b are collectively referred to as a processing place 11c as appropriate.

  The application unit 10 has a function of drawing (printing) a mark by discharging droplets onto the semiconductor device 3 and solidifying or curing the drawn mark. The application unit 10 includes a relay location 10a, and performs drawing processing and curing processing by moving the semiconductor substrate 1 before drawing from the relay location 10a. Thereafter, the coating unit 10 moves the drawn semiconductor substrate 1 to the relay location 10a, and makes the semiconductor substrate 1 stand by.

  The storage unit 12 includes a storage container that can store a plurality of semiconductor substrates 1. The storage unit 12 includes a relay location 12a, and stores the semiconductor substrate 1 from the relay location 12a into the storage container. The operator carries out the storage container in which the semiconductor substrate 1 is stored from the printing apparatus 7.

  The input unit 19 is for a user to input printing conditions and the like (printed image quality, number of printed sheets, etc.) of the semiconductor substrate 1. For example, the user inputs desired information to the control unit 14 by touching the screen. Includes possible touch panel. In the present embodiment, the user can input information about the surface of the semiconductor substrate 1 on which the alignment mark M is provided via the input unit 19. The input unit 19 is electrically connected to the control unit 14 and transmits information input by the user to the control unit 14.

  A transport unit 13 is disposed at a central location of the printing apparatus 7. The transport unit 13 is a scalar robot having two arms. A grip portion 13 a that grips the semiconductor substrate 1 is provided at the tip of the arm portion. The relay locations 8a, 9c, 10a, 11c, and 12a are located within the movement range 13b of the grip portion 13a. Accordingly, the gripping portion 13a can move the semiconductor substrate 1 between the relay locations 8a, 9c, 10a, 11c, and 12a. The control unit 14 is a device that controls the overall operation of the printing apparatus 7 and manages the operation status of each unit of the printing apparatus 7. Then, an instruction signal for moving the semiconductor substrate 1 is output to the transport unit 13. Thereby, the semiconductor substrate 1 is drawn by passing through each part sequentially.

Details of each part will be described below.
(Supply section)
FIG. 2A is a schematic front view showing the supply unit, and FIGS. 2B and 2C are schematic side views showing the supply unit. As shown in FIGS. 2A and 2B, the supply unit 8 includes a base 15. An elevating device 16 is installed inside the base 15. The elevating device 16 includes a linear motion mechanism that operates in the Z direction. As this linear motion mechanism, a mechanism such as a combination of a ball screw and a rotary motor or a combination of a hydraulic cylinder and an oil pump can be used. In this embodiment, for example, a mechanism using a ball screw and a step motor is employed. An elevating plate 17 is connected to the elevating device 16 on the upper side of the base 15. The elevating plate 17 can be moved up and down by a predetermined moving amount by the elevating device 16.

  A rectangular parallelepiped storage container 18 is installed on the elevating plate 17, and a plurality of semiconductor substrates 1 are stored in the storage container 18. The storage container 18 has openings 18a on both sides in the Y direction, and the semiconductor substrate 1 can be taken in and out from the openings 18a. Convex rails 18c are formed inside the side surfaces 18b located on both sides in the X direction of the storage container 18, and the rails 18c are arranged extending in the Y direction. A plurality of rails 18c are arranged at equal intervals in the Z direction. By inserting the semiconductor substrate 1 along the rail 18c from the Y direction or from the -Y direction, the semiconductor substrate 1 is arranged and stored in the Z direction.

  On the Y direction side of the base 15, a substrate drawing portion 22 and a relay stand 23 are installed via a support member 21. A relay stand 23 is disposed on the substrate drawing portion 22 at a location on the Y direction side of the storage container 18. The substrate drawing portion 22 includes an arm portion 22a that expands and contracts in the Y direction and a linear motion mechanism that drives the arm portion 22a. This linear motion mechanism is not particularly limited as long as it is a mechanism that moves linearly. In this embodiment, for example, an air cylinder that operates with compressed air is employed. A claw portion 22b bent into a substantially rectangular shape is installed at one end of the arm portion 22a, and the tip of the claw portion 22b is formed in parallel with the arm portion 22a.

  The substrate pull-out portion 22 extends the arm portion 22 a, so that the arm portion 22 a penetrates the storage container 18. Then, the claw portion 22 b moves to the −Y direction side of the storage container 18. Next, after the elevating device 16 moves down the semiconductor substrate 1, the substrate drawing portion 22 contracts the arm portion 22a. At this time, the claw portion 22 b moves while pushing one end of the semiconductor substrate 1.

  As a result, as shown in FIG. 2C, the semiconductor substrate 1 is moved from the storage container 18 onto the relay stand 23. The relay base 23 is formed with a recess having a width substantially the same as the width of the semiconductor substrate 1 in the X direction, and the semiconductor substrate 1 moves along the recess. And the position of the X direction of the semiconductor substrate 1 is determined by this recessed part. The position of the semiconductor substrate 1 in the Y direction is determined by the location where the semiconductor substrate 1 is stopped by being pushed by the claw portion 22b. On the relay stand 23 is a relay place 8a, and the semiconductor substrate 1 stands by at a predetermined place of the relay place 8a. When the semiconductor substrate 1 is waiting at the relay location 8 a of the supply unit 8, the transport unit 13 moves the gripping unit 13 a to a location facing the semiconductor substrate 1 to grip and move the semiconductor substrate 1.

  After the semiconductor substrate 1 is moved from the relay table 23 by the transfer unit 13, the substrate drawing unit 22 extends the arm portion 22a. Next, the lifting device 16 lowers the storage container 18, and the substrate drawing portion 22 moves the semiconductor substrate 1 from the storage container 18 onto the relay stand 23. In this way, the supply unit 8 sequentially moves the semiconductor substrate 1 from the storage container 18 onto the relay stand 23. After all the semiconductor substrates 1 in the storage container 18 are moved onto the relay stand 23, the operator replaces the empty storage container 18 with the storage container 18 in which the semiconductor substrate 1 is stored. Thereby, the semiconductor substrate 1 can be supplied to the supply unit 8.

(Pre-processing section)
FIG. 3 is a schematic perspective view showing the configuration of the preprocessing unit. As shown in FIG. 3A, the pretreatment unit 9 includes a base 24, and a pair of first guide rails 25 and second guide rails 26 extending in the X direction are arranged on the base 24. is set up. A first stage 27 as a mounting table that reciprocates in the X direction along the first guide rail 25 is installed on the first guide rail 25, and along the second guide rail 26 on the second guide rail 26. A second stage 28 is placed as a mounting table that reciprocates in the X direction. The first stage 27 and the second stage 28 include a linear motion mechanism and can reciprocate. As this linear motion mechanism, for example, a mechanism similar to the linear motion mechanism included in the lifting device 16 can be used.

  A placement surface 27a is installed on the upper surface of the first stage 27, and a suction-type chuck mechanism is formed on the placement surface 27a. After the transport unit 13 places the semiconductor substrate 1 on the placement surface 27a, the pretreatment unit 9 can fix the semiconductor substrate 1 to the placement surface 27a by operating the chuck mechanism. Similarly, a mounting surface 28a is installed on the upper surface of the second stage 28, and a suction chuck mechanism is formed on the mounting surface 28a. After the transport unit 13 places the semiconductor substrate 1 on the placement surface 28a, the pretreatment unit 9 can fix the semiconductor substrate 1 to the placement surface 28a by operating the chuck mechanism.

  The first stage 27 has a built-in heating device 27 </ b> H, and heats the semiconductor substrate 1 placed on the placement surface 27 a to a predetermined temperature under the control of the control unit 14. Similarly, the second stage 28 includes a heating device 28 </ b> H, and heats the semiconductor substrate 1 placed on the placement surface 28 a to a predetermined temperature under the control of the control unit 14.

  The place of the placement surface 27a when the first stage 27 is located on the X direction side is the first relay place 9a, and the place of the placement surface 28a when the second stage 28 is located in the X direction is the first place. 2 relay place 9b. The relay location 9c, which is the first relay location 9a and the second relay location 9b, is located within the operating range of the grip portion 13a, and the placement surface 27a and the placement surface 28a are exposed at the relay location 9c. Accordingly, the transport unit 13 can easily place the semiconductor substrate 1 on the placement surface 27a and the placement surface 28a. After the pretreatment is performed on the semiconductor substrate 1, the semiconductor substrate 1 stands by on the placement surface 27a located at the first relay location 9a or the placement surface 28a located at the second relay location 9b. Therefore, the grip part 13a of the transport part 13 can easily grip the semiconductor substrate 1 and move it.

  A flat plate-like support portion 29 is erected in the −X direction of the base 24. A guide rail 30 extending in the Y direction is installed on the upper side of the surface of the support portion 29 on the X direction side. A carriage 31 that moves along the guide rail 30 is installed at a location facing the guide rail 30. The carriage 31 includes a linear motion mechanism and can reciprocate. As this linear motion mechanism, for example, a mechanism similar to the linear motion mechanism included in the lifting device 16 can be used.

  A processing unit 32 is installed on the base 24 side of the carriage 31. Examples of the processing unit 32 include a low-pressure mercury lamp that emits actinic rays, a hydrogen burner, an excimer laser, a plasma discharge unit, and a corona discharge unit. When a mercury lamp is used, the liquid repellency of the surface of the semiconductor substrate 1 can be modified by irradiating the semiconductor substrate 1 with ultraviolet rays. When a hydrogen burner is used, the surface can be roughened by partially reducing the oxidized surface of the semiconductor substrate 1, and when an excimer laser is used, the surface of the semiconductor substrate 1 is partially melted and solidified. When plasma discharge or corona discharge is used, the surface of the semiconductor substrate 1 can be roughened by mechanical cutting. In this embodiment, for example, a mercury lamp is employed. The pre-processing unit 9 reciprocates the carriage 31 while irradiating ultraviolet rays from the processing unit 32 while the semiconductor substrate 1 is heated by the heating devices 27H and 28H. As a result, the pretreatment unit 9 can irradiate ultraviolet rays over a wide area of the treatment place 9d.

  The pretreatment unit 9 is entirely covered by the exterior unit 33. Inside the exterior part 33, a door part 34 that can move up and down is installed. Then, as shown in FIG. 3B, after the first stage 27 or the second stage 28 has moved to a position facing the carriage 31, the door 34 is lowered. Thereby, the ultraviolet rays irradiated by the processing unit 32 are prevented from leaking out of the preprocessing unit 9.

  When the mounting surface 27a or the mounting surface 28a is located at the relay place 9c, the transport unit 13 supplies the semiconductor substrate 1 to the mounting surface 27a and the mounting surface 28a. The preprocessing unit 9 performs the preprocessing by moving the first stage 27 or the second stage 28 on which the semiconductor substrate 1 is placed to the processing place 9d. After the preprocessing is completed, the preprocessing unit 9 moves the first stage 27 or the second stage 28 to the relay location 9c. Subsequently, the transport unit 13 removes the semiconductor substrate 1 from the placement surface 27a or the placement surface 28a.

(Cooling section)
The cooling unit 11 includes cooling plates 110 a and 110 b such as heat sinks, which are provided at the processing locations 11 a and 11 b, respectively, and whose upper surfaces are suction holding surfaces of the semiconductor substrate 1.
The processing locations 11a and 11b (cooling plates 110a and 110b) are located within the operating range of the gripping portion 13a, and the cooling plates 110a and 110b are exposed at the processing locations 11a and 11b. Therefore, the transport unit 13 can easily place the semiconductor substrate 1 on the cooling plates 110a and 110b. After the semiconductor substrate 1 is cooled, the semiconductor substrate 1 stands by on the cooling plate 110a positioned at the processing location 11a or the cooling plate 110a positioned at the processing location 11b. Therefore, the gripping part 13a of the transport part 13 can easily grip and move the semiconductor substrate 1.

(Applying part)
Next, the application unit 10 that forms marks by discharging droplets onto the semiconductor substrate 1 will be described with reference to FIGS. There are various types of apparatuses for ejecting droplets, and an apparatus using an ink jet method is preferable. The ink jet method is suitable for microfabrication because it can discharge minute droplets.

  FIG. 4 is a schematic perspective view showing the configuration of the application unit. Liquid droplets are ejected onto the semiconductor substrate 1 by the application unit 10. As shown in FIG. 4, the application unit 10 includes a base 37 </ b> A formed in a rectangular parallelepiped shape. Here, the direction in which the droplet discharge head and the discharge target object move relative to each other when the base 37A discharges droplets is defined as a main scanning direction. The direction orthogonal to the main scanning direction is defined as the sub scanning direction. The sub-scanning direction is a direction in which the droplet discharge head and the discharge target are relatively moved when a line feed is made. In the present embodiment, the X direction is the main scanning direction, and the Y direction is the sub scanning direction.

  On the upper surface 37a of the base 37A, a pair of guide rails 38 extending in the Y direction is provided so as to protrude over the entire width in the Y direction. A stage 39 having a linear motion mechanism (not shown) corresponding to the pair of guide rails 38 is attached to the upper side of the base 37A. As the linear motion mechanism of the stage 39, a linear motor, a screw type linear motion mechanism, or the like can be used. In this embodiment, for example, a linear motor is employed. Then, it moves forward or backward along the Y direction at a predetermined speed. Repeating forward and backward movement is called scanning movement. Further, a sub-scanning position detection device 40 is disposed on the upper surface 37a of the base 37A in parallel with the guide rail 38, and the position of the stage 39 is detected by the sub-scanning position detection device 40.

  A placement surface 41 is formed on the upper surface of the stage 39, and a suction-type substrate chuck mechanism (not shown) is provided on the placement surface 41. After the semiconductor substrate 1 is placed on the placement surface 41, the semiconductor substrate 1 is fixed to the placement surface 41 by a substrate chuck mechanism. Further, the stage 39 is configured such that the dimension in the X direction is larger than that of the base 37A. That is, the stage 39 has a protruding portion 39a that protrudes to the side of the base 37A in the X direction. The overhanging portion 39a constitutes a part of the placement surface 41 on which the semiconductor substrate 1 is placed. In the stage 39, an opening 39b is formed in the projecting portion 39a.

  The place of the placement surface 41 when the stage 39 is positioned in the −Y direction is the relay place 10a. The placement surface 41 is installed so as to be exposed within the operating range of the gripping portion 13a. Therefore, the transport unit 13 can easily place the semiconductor substrate 1 on the placement surface 41. After application | coating is performed to the semiconductor substrate 1, the semiconductor substrate 1 waits on the mounting surface 41 which is the relay place 10a. Therefore, the grip part 13a of the transport part 13 can easily grip the semiconductor substrate 1 and move it.

  A pair of support bases 42 are erected on both sides in the X direction of the base 37 </ b> A, and a guide member 43 extending in the X direction is installed on the pair of support bases 42. A guide rail 44 extending in the X direction is provided below the guide member 43 so as to protrude over the entire width in the X direction. A carriage (moving means) 45 movably attached along the guide rail 44 is formed in a substantially rectangular parallelepiped shape. The carriage 45 includes a linear motion mechanism. As the linear motion mechanism, for example, a mechanism similar to the linear motion mechanism included in the stage 39 can be used. Then, the carriage 45 scans and moves along the X direction. A main scanning position detector 46 is disposed between the guide member 43 and the carriage 45, and the position of the carriage 45 is measured. A linear encoder is used as the main scanning position detection device 46. The main scanning position detection device 46 is electrically connected to the control unit 14 and transmits a measurement result to the control unit 14. A head unit 47 is installed on the lower side of the carriage 45, and a droplet discharge head (not shown) is projected on the surface of the head unit 47 on the stage 39 side.

  By the way, in order to eject droplets to the semiconductor substrate 1 with high accuracy, it is necessary to align the semiconductor substrate 1 itself with respect to the mounting surface 41 of the stage 39 with high accuracy. The printing apparatus 7 according to the present embodiment includes an alignment unit (camera position control mechanism) 65 so that the semiconductor substrate 1 can be accurately placed on the stage 39 by the alignment unit 65. In addition, the alignment part 65 is electrically connected to the control part 14, and the control is performed.

  The alignment unit 65 includes a guide member 62 extending in the X direction, a moving unit 63 that moves along the guide member 62, an alignment camera 61 that images the alignment mark M provided on the semiconductor substrate 1, and a moving unit 63. An installed shaft portion 67 and a rotating portion 68 that holds the alignment camera 61 in a state that allows rotation relative to the shaft portion 67 are provided.

  The shaft portion 67 is provided with a guide rail 67a extending in the Z direction, whereby the shaft portion 67 can be moved in the Z direction (vertical direction) with respect to the moving portion 63 by a drive mechanism (not shown). Yes. The guide member 62 is provided with a guide rail 62a extending in the X direction, whereby the moving part 63 can be moved in the X direction with respect to the guide member 62 by a drive mechanism (not shown).

  The alignment camera 61 has a first alignment camera 61a and a second alignment camera 61b. As shown in FIGS. 5A and 5B, the rotating unit 68 includes a first rotating unit 68a and a second rotating unit 68b. The first rotating unit 68a holds the first alignment camera 61a so as to be rotatable around the Z axis. The second rotating unit 68b holds the second alignment camera 61b so as to be rotatable around the Z axis. The first alignment camera 61a and the second alignment camera 61b are arranged at positions that overlap when viewed from the Z direction, that is, at the same position. The first rotating unit 68a and the second rotating unit 68b are driven in synchronization. Therefore, the coordinate values of the images captured by the first alignment camera 61a and the second alignment camera 61b are made to coincide with each other.

  Here, the first alignment camera 61 a is for imaging the alignment mark M provided on the surface 1 a side of the semiconductor substrate 1. The second alignment camera 61b is for imaging the alignment mark M provided on the back surface 1b side of the semiconductor substrate 1 through the opening 39b (see FIG. 5B).

  Based on such a configuration, the first alignment camera 61a and the second alignment camera 61b face the alignment mark M provided on the semiconductor substrate 1 so that the alignment mark M can be imaged satisfactorily. Yes. The guide member 62 is fixed to a pair of support bases 64 provided upright on both sides in the X direction of the base 37A.

  In the present embodiment, the control unit 14 drives the alignment unit 65 after recognizing that the alignment mark M is provided on the surface 1 a side of the semiconductor substrate 1 based on the input information from the input unit 19. It has become.

  By the way, in the printing apparatus 7, calibration (position correction) related to the position of the stage 39 is performed before the alignment of the semiconductor substrate 1 with respect to the stage 39. As a result, the control unit 14 sets a predetermined coordinate system on the stage 39, aligns the semiconductor substrate 1 placed on the placement surface 41 using the set coordinate system, and the head unit 47 with respect to the semiconductor substrate 1. The position control is performed. This is because if the calibration of the stage 39 is not performed, the head unit 47 cannot be accurately moved relative to the semiconductor substrate 1 on the stage 39. On the other hand, when calibration is performed satisfactorily, the coordinate systems of the head unit 47 and the stage 39 can be matched. Therefore, the relative movement amount of the head unit 47 with respect to the stage 39 can be accurately controlled.

  At both ends along the X direction of the stage 39 according to the present embodiment, through holes 35 penetrating both surfaces of the stage along the thickness direction (Z direction) are formed. The through hole 35 is used as a calibration mark KM when performing calibration on the stage 39.

  The calibration mark KM in the present embodiment is configured by an opening end 35 a on the front surface 1 a side and an opening end 35 b on the back surface side in the through hole 35 formed in the stage 39. The open ends 35a and 35b are arranged at positions where the stage 39 overlaps in plan view when viewed from the Z direction (that is, the same position in the XY plane). On the other hand, as described above, the first alignment camera 61a and the second alignment camera 61b are also arranged at positions that overlap in plan view when viewed from the Z direction, and the coordinate values of the images captured by the respective cameras match. It is like that.

  As described above, the calibration mark KM is provided on both surfaces (the front surface and the back surface) of the stage 39. In the present embodiment, the alignment camera 61 captures the calibration marks KM provided at both ends of the stage 39 in the X direction, so that the control unit 14 acquires the position information of the stage 39. Based on the position information of the stage 39 sent from the alignment camera 61, the control unit 14 performs calibration of the stage 39 (position correction of the stage 39).

  As described above, in this embodiment, the calibration mark KM is shared between the first alignment camera 61a and the second alignment camera 61b. Therefore, between the coordinate system set on the stage 39 by the calibration using the first alignment camera 61a and the coordinate system set on the stage 39 by the calibration using the second alignment camera 61b. This prevents errors from occurring. That is, the coordinate system that has been calibrated by one of the cameras and set on the stage 39 can be used without any problem by any of the alignment cameras 61a and 61b during alignment.

  FIG. 5 is a diagram for explaining the calibration operation by the alignment unit 65. Specifically, the calibration mark KM is imaged by the first alignment camera 61a from the surface 1a side of the semiconductor substrate 1, and the calibration of the stage 39 is performed. It shows the state when performing.

  As shown in FIG. 5, the alignment unit 65 positions the first alignment camera 61 a on the surface 1 a side of the semiconductor substrate 1, and a calibration mark provided on one end (end on the −X direction side) of the stage 39. KM (open end 35a on the surface 1a side in the through hole 35) is imaged. At this time, the position information of the opening end 35 a captured by the first alignment camera 61 a is sent to the control unit 14.

  Subsequently, the alignment unit 65 moves the moving unit 63 in the + X direction along the guide member 62, and the first alignment camera 61a is calibrated with a calibration mark KM (an end on the + X direction side) provided at the other end (the + X direction side end). The opening end 35a) on the surface 1a side in the through hole 35 is imaged. At this time, the position information of the opening end 35 a captured by the first alignment camera 61 a is sent to the control unit 14.

  Specifically, when the moving part 63 moves to the other end, the moving part 63 is retracted in one end, −X direction, and the shaft part 67 so that the second alignment camera 61 b does not contact the stage 39 and the semiconductor substrate 1. Is moved upward (+ Z direction), and then the moving unit 63 is moved in the + X direction. Further, the alignment unit 65 moves the moving unit 63 beyond the other end of the stage 39 so as not to contact the stage 39 and the semiconductor substrate 1 when the second alignment camera 61b is lowered as will be described later. . Then, the moving unit 63 drives the first rotating unit 68a and the second rotating unit 68b to rotate the directions of the first alignment camera 61a and the second alignment camera 61b about the Z axis by 180 degrees. Thereafter, the moving unit 63 moves the shaft 67 downward (−Z direction) to a predetermined position, and moves in the −X direction along the guide member 62, so that the first alignment camera 61 a is provided at the other end. It is possible to face the calibration mark KM (see the broken line in FIG. 5).

  The control unit 14 acquires the position information of the stage 39 from the position information of the calibration mark KM sent from the alignment unit 65. And the control part 14 can perform the calibration which correct | amends the position of the stage 39 to a predetermined position by driving the position adjustment mechanism of the stage 39 not shown.

  Subsequently, the alignment unit 65 positions the first alignment camera 61a on the surface 1a side of the semiconductor substrate 1, and the alignment mark provided at one end (end on the −X direction side) on the surface 1a side of the semiconductor substrate 1. Image M. At this time, the position information of the alignment mark M imaged by the first alignment camera 61 a is sent to the control unit 14.

  The alignment unit 65 moves the moving unit 63 in the + X direction along the guide member 62 and images the alignment mark M provided on the other end (the end on the + X direction side) of the first alignment camera 61a. . At this time, the position information of the alignment mark M imaged by the first alignment camera 61 a is sent to the control unit 14.

  The control unit 14 grasps the amount of positional deviation with respect to the mounting surface 41 of the stage 39 in the semiconductor substrate 1 from the position of the alignment mark M. And the control part 14 arrange | positions the semiconductor substrate 1 in a predetermined position with respect to the mounting surface 41 by finely adjusting the position of the holding part 13a of the conveyance part 13. FIG. Thereby, the alignment operation with respect to the stage 39 of the semiconductor substrate 1 is completed.

  In the above description, the alignment mark M is provided on the front surface 1a side of the semiconductor substrate 1. However, the alignment unit 65 can be well imaged even on the semiconductor substrate 1 provided with the alignment mark M on the back surface 1b side. .

  FIG. 6 is a diagram for specifically explaining the calibration operation by the alignment unit 65. As shown in FIG. 6, the alignment unit 65 positions the second alignment camera 61 b on one end (end on the −X direction side) of the back surface 1 b of the semiconductor substrate 1, and provides an alignment mark provided on the semiconductor substrate 1. M is imaged through the opening 39b. At this time, the position information of the alignment mark M imaged by the second alignment camera 61 b is sent to the control unit 14.

  The alignment unit 65 moves the moving unit 63 in the + X direction along the guide member 62, and positions the second alignment camera 61 b on the other end (the end on the + X direction side) on the back surface 1 b side of the semiconductor substrate 1. Then, the alignment mark M provided on the semiconductor substrate 1 is imaged through the opening 39b. At this time, the position information of the alignment mark M imaged by the second alignment camera 61 b is sent to the control unit 14.

  An image captured by the alignment camera 61 is sent to the control unit 14, and the control unit 14 finely adjusts the position of the gripping unit 13 a as described above to place the semiconductor substrate 1 at a predetermined position with respect to the mounting surface 41. Alignment is possible.

  As described above, according to the present embodiment, the calibration mark KM is shared between the first alignment camera 61a and the second alignment camera 61b. As a result, an error occurs between the coordinate system set on the stage 39 by calibration by the first alignment camera 61a and the coordinate system set on the stage 39 by calibration by the second alignment camera 61b. Can be prevented.

  Therefore, if the calibration is performed once using the first alignment camera 61a as described above, the same coordinate system is used even when the alignment of the semiconductor substrate 1 with respect to the stage 39 is performed by the second alignment camera 61b. it can. Therefore, the alignment of the semiconductor substrate 1 with respect to the stage 39 can be performed with high accuracy. Therefore, the mark can be printed with high accuracy at a desired position on the semiconductor substrate 1 in a printing process described later.

  FIG. 7 is a schematic side view showing the carriage. As shown in FIG. 7, a head unit 47 and a pair of curing units (irradiation units) 48 serving as irradiation units are disposed on the side of the semiconductor substrate 1 of the carriage 45. A liquid droplet ejection head (ejection head) 49 for ejecting liquid droplets is provided on the side of the semiconductor substrate 1 of the head unit 47.

  An irradiating device for irradiating ultraviolet rays that cure the discharged droplets is disposed inside the curing unit 48. The curing unit 48 is disposed on both sides of the head unit 47 in the main scanning direction (relative movement direction). The irradiation device includes a light emitting unit and a heat radiating plate. A number of LED (Light Emitting Diode) elements are arranged in the light emitting unit. This LED element is an element that emits ultraviolet light, which is ultraviolet light, upon receiving power.

  A storage tank 50 is arranged on the upper side of the carriage 45 in the drawing, and the functional liquid is stored in the storage tank 50. The droplet discharge head 49 and the storage tank 50 are connected by a tube (not shown), and the functional liquid in the storage tank 50 is supplied to the droplet discharge head 49 through the tube.

  The functional liquid mainly contains a resin material, a photopolymerization initiator as a curing agent, a solvent or a dispersion medium. A functional liquid having an inherent function can be formed by adding a coloring material such as a pigment or a dye or a functional material such as a lyophilic or liquid repellent surface modifying material to the main material. In this embodiment, for example, a white pigment is added. The functional liquid resin material is a material for forming a resin film. The resin material is not particularly limited as long as the material is liquid at normal temperature and becomes a polymer by polymerization. Furthermore, a resin material having a low viscosity is preferable, and it is preferably in the form of an oligomer. A monomer form is more preferable. The photopolymerization initiator is an additive that acts on a crosslinkable group of the polymer to advance the crosslinking reaction. For example, benzyldimethyl ketal or the like can be used as the photopolymerization initiator. The solvent or the dispersion medium adjusts the viscosity of the resin material. By setting the viscosity at which the functional liquid can be easily discharged from the droplet discharge head, the droplet discharge head can stably discharge the functional liquid.

  FIG. 8A is a schematic plan view showing the head unit. As shown in FIG. 8A, in the head unit 47, two liquid droplet ejection heads 49 constituting the first and second ejection heads are arranged at intervals in the sub-scanning direction. Nozzle plates 51 are arranged on the surface 49. A plurality of nozzles 52 are arranged in each nozzle plate 51. In the present embodiment, each nozzle plate 51 is provided with one nozzle row 60 in which 15 nozzles 52 are arranged along the sub-scanning direction. In addition, the two nozzle rows 60 are arranged in a straight line along the Y direction and at equal intervals with the curing units 48 on both sides in the X direction.

  In each droplet discharge head 49, the nozzle 52 located at both ends of the nozzle row 60 does not tend to be unstable in droplet discharge characteristics, and thus is not used for the droplet discharge process. That is, in this embodiment, the actual nozzle row 60 </ b> A that actually ejects droplets to the semiconductor substrate 1 is formed by the 13 nozzles 52 excluding the nozzles 52 at both ends.

Here, when the length of each actual nozzle row 60A in the sub-scanning direction is LN and the distance in the sub-scanning direction between the adjacent nozzle discharge heads 49 between the actual nozzle rows 60A is LH, the adjacent droplet discharge heads. 49 are arranged in a positional relationship satisfying the following expression.
LH = n × LN (n is a positive integer) (1)
In the present embodiment, two droplet discharge heads 49 are arranged along the Y direction with a positional relationship of n = 1, that is, LH = LN.

  An irradiation port 48 a is formed on the lower surface of the curing unit 48. The irradiation port 48 a is provided with an irradiation range having a length equal to or longer than the sum of the lengths of the ejection heads 49, 49 in the Y direction and the distance between the ejection heads 49, 49. Then, ultraviolet light emitted from the irradiation device is irradiated toward the semiconductor substrate 1 from the irradiation port 48a.

  FIG. 8B is a schematic cross-sectional view of a main part for explaining the structure of the droplet discharge head. As shown in FIG. 8B, the droplet discharge head 49 includes a nozzle plate 51, and a nozzle 52 is formed on the nozzle plate 51. A cavity 53 communicating with the nozzle 52 is formed at a position above the nozzle plate 51 and facing the nozzle 52. A functional liquid (liquid) 54 is supplied to the cavity 53 of the droplet discharge head 49.

  A vibration plate 55 that vibrates in the vertical direction and expands or contracts the volume in the cavity 53 is installed above the cavity 53. A piezoelectric element 56 that extends in the vertical direction and vibrates the vibration plate 55 is disposed at a location facing the cavity 53 on the upper side of the vibration plate 55. The piezoelectric element 56 expands and contracts in the vertical direction to pressurize and vibrate the diaphragm 55, and the diaphragm 55 pressurizes the cavity 53 by enlarging and reducing the volume in the cavity 53. As a result, the pressure in the cavity 53 varies, and the functional liquid 54 supplied into the cavity 53 is discharged through the nozzle 52.

  When the droplet discharge head 49 receives a nozzle drive signal for controlling and driving the piezoelectric element 56, the piezoelectric element 56 expands and the diaphragm 55 reduces the volume in the cavity 53. As a result, the functional liquid 54 corresponding to the reduced volume is discharged as droplets 57 from the nozzles 52 of the droplet discharge head 49. The semiconductor substrate 1 coated with the functional liquid 54 is irradiated with ultraviolet light from the irradiation port 48a so that the functional liquid 54 containing a curing agent is solidified or cured.

(Storage section)
FIG. 9A is a schematic front view showing the storage portion, and FIG. 9B and FIG. 9C are schematic side views showing the storage portion. As shown in FIGS. 9A and 9B, the storage unit 12 includes a base 74. An elevating device 75 is installed inside the base 74. As the lifting device 75, the same device as the lifting device 16 installed in the supply unit 8 can be used. A lifting plate 76 is connected to the lifting device 75 on the upper side of the base 74. The lifting plate 76 is lifted and lowered by the lifting device 75. A rectangular parallelepiped storage container 18 is installed on the lifting plate 76, and the semiconductor substrate 1 is stored in the storage container 18. The same container as the storage container 18 installed in the supply unit 8 is used as the storage container 18.

  A substrate extruding portion 78 and a relay stand 79 are installed on the Y direction side of the base 74 via a support member 77. A relay stand 79 is disposed on the substrate push-out portion 78 at a location on the Y direction side of the storage container 18. The board pushing part 78 includes an arm part 78a that moves in the Y direction and a linear motion mechanism that drives the arm part 78a. This linear motion mechanism is not particularly limited as long as it is a mechanism that moves linearly. In this embodiment, for example, an air cylinder that operates with compressed air is employed. The semiconductor substrate 1 is placed on the relay stand 79, and the arm portion 78 a can come into contact with the center of one end of the semiconductor substrate 1 on the Y direction side.

  The substrate pushing part 78 moves the arm part 78a in the -Y direction, so that the arm part 78a moves the semiconductor substrate 1 in the -Y direction. The relay stand 79 is formed with a recess having a width substantially the same as the width of the semiconductor substrate 1 in the X direction, and the semiconductor substrate 1 moves along the recess. And the position of the X direction of the semiconductor substrate 1 is determined by this recessed part. As a result, the semiconductor substrate 1 is moved into the storage container 18 as shown in FIG. A rail 18 c is formed in the storage container 18, and the rail 18 c is positioned on an extension line of a recess formed in the relay stand 79. Then, the semiconductor substrate 1 is moved along the rails 18 c by the substrate pushing part 78. Thereby, the semiconductor substrate 1 is stored in the storage container 18 with high quality.

  After the transport unit 13 moves the semiconductor substrate 1 onto the relay stand 79, the lifting device 75 raises the storage container 18. And the board | substrate extrusion part 78 drives the arm part 78a, and moves the semiconductor substrate 1 in the storage container 18. FIG. In this way, the storage unit 12 stores the semiconductor substrate 1 in the storage container 18. After the predetermined number of semiconductor substrates 1 are stored in the storage container 18, the operator replaces the storage container 18 in which the semiconductor substrate 1 is stored with the empty storage container 18. Thus, the operator can carry the plurality of semiconductor substrates 1 together to the next process.

  The storage unit 12 has a relay place 12a on which the semiconductor substrate 1 to be stored is placed. The transport unit 13 can store the semiconductor substrate 1 in the storage container 18 in cooperation with the storage unit 12 only by placing the semiconductor substrate 1 on the relay location 12a.

(Transport section)
Next, the conveyance part 13 which conveys the semiconductor substrate 1 is demonstrated according to FIG. FIG. 10 is a schematic perspective view illustrating the configuration of the transport unit. As shown in FIG. 10, the conveyance part 13 is provided with the base 82 formed in flat form. A support base 83 is disposed on the base 82. A cavity is formed inside the support base 83, and a rotation mechanism 83a including a motor, an angle detector, a speed reducer, and the like is installed in the cavity. The output shaft of the motor is connected to the speed reducer, and the output shaft of the speed reducer is connected to the first arm portion 84 disposed on the upper side of the support base 83. In addition, an angle detector is installed in connection with the motor output shaft, and the angle detector detects the rotation angle of the motor output shaft. Thereby, the rotation mechanism 83a can detect the rotation angle of the first arm portion 84 and rotate it to a desired angle.

  A rotation mechanism 85 is installed on the first arm portion 84 at the end opposite to the support base 83. The rotation mechanism 85 includes a motor, an angle detector, a speed reducer, and the like, and has the same function as the rotation mechanism installed in the support base 83. The output shaft of the rotation mechanism 85 is connected to the second arm portion 86. Accordingly, the rotation mechanism 85 can detect the rotation angle of the second arm portion 86 and rotate it to a desired angle.

  On the second arm portion 86, an elevating device 87 is disposed at the end opposite to the rotation mechanism 85. The elevating device 87 includes a linear motion mechanism and can be expanded and contracted by driving the linear motion mechanism. For this linear motion mechanism, for example, a mechanism similar to the lifting device 16 of the supply unit 8 can be used. A rotating device 88 is disposed below the lifting device 87.

  The rotation device 88 only needs to be able to control the rotation angle, and can be configured by combining various motors and a rotation angle sensor. In addition, a step motor capable of rotating at a predetermined rotation angle can be used. In this embodiment, for example, a step motor is employed. Further, a speed reducer may be arranged. It can be rotated at a finer angle.

  A gripping portion 13a is arranged on the lower side of the rotating device 88 in the drawing. The grip 13 a is connected to the rotation shaft of the rotation device 88. Therefore, the conveyance unit 13 can rotate the gripping unit 13 a by driving the rotating device 88. Furthermore, the conveyance part 13 can raise / lower the holding part 13a by driving the raising / lowering apparatus 87. FIG.

  The gripping portion 13a has four linear finger portions 13c, and a suction mechanism that sucks and sucks the semiconductor substrate 1 is formed at the tip of the finger portion 13c. And the holding part 13a can hold | grip the semiconductor substrate 1 by operating this adsorption | suction mechanism.

  A control device 89 is installed on the −Y direction side of the base 82. The control device 89 includes a central processing unit, a storage unit, an interface, an actuator drive circuit, an input device, a display device, and the like. The actuator drive circuit is a circuit that drives the rotation mechanism 83a, the rotation mechanism 85, the lifting device 87, the rotation device 88, and the suction mechanism of the grip portion 13a. These devices and circuits are connected to the central processing unit via an interface. In addition, an angle detector is connected to the central processing unit via an interface. The storage unit stores program software indicating operation procedures for controlling the transport unit 13 and data used for control. The central processing unit is a device that controls the transport unit 13 in accordance with program software. The control device 89 receives the output of the detector arranged in the transport unit 13 and detects the position and posture of the grip unit 13a. And the control apparatus 89 performs the control which drives the rotation mechanism 83a and the rotation mechanism 85, and moves the holding part 13a to a predetermined position.

(Printing method)
Next, a printing method using the above-described printing apparatus 7 will be described. FIG. 11 is a flowchart for illustrating a printing method.
As shown in the flowchart of FIG. 11, the printing method includes a carry-in process S <b> 1 for carrying in the semiconductor substrate 1 from the storage container 18; Cooling step S3 for cooling the semiconductor substrate 1 whose temperature has increased in step S2, printing step S4 for drawing and printing various marks on the cooled semiconductor substrate 1, and post-processing for the semiconductor substrate 1 printed with various marks The post-processing step S5 to be performed and the storage step S6 for storing the post-processed semiconductor substrate 1 in the storage container 18 are mainly configured.

Among the steps described above, the steps from the pretreatment step S2 to the printing step S4 are the characteristic portions of the present invention. Therefore, the characteristic portions will be described in the following description.
In the preprocessing step S2, in the preprocessing unit 9, one of the first stage 27 and the second stage 28 is located at the relay location 9c. The conveyance unit 13 moves the gripping unit 13a to a location facing the stage located at the relay location 9c. Subsequently, the transporting unit 13 lowers the gripping unit 13a and then releases the suction of the semiconductor substrate 1, thereby placing the semiconductor substrate 1 on the first stage 27 or the second stage 28 located at the relay location 9c. To do. As a result, the semiconductor substrate 1 is placed on the first stage 27 located at the relay location 9c (see FIG. 3B). Alternatively, the semiconductor substrate 1 is placed on the second stage 28 located at the relay location 9c (see FIG. 3A).

  The first stage 27 and the second stage 28 are preheated by the heating devices 27H and 28H, and the semiconductor substrate 1 placed on the first stage 27 or the second stage 28 is immediately heated to a predetermined temperature. The temperature for heating the semiconductor substrate 1 is preferably below the heat-resistant temperature of the semiconductor substrate 1 and can effectively modify the surface of the semiconductor substrate 1 or efficiently remove organic substances on the surface, as will be described later. In this embodiment, the semiconductor substrate 1 is heated to a temperature of, for example, 180 ° C. so as to have a temperature in the range of 150 ° C. to 200 ° C.

  Further, when the transfer unit 13 moves the semiconductor substrate 1 onto the first stage 27, the pretreatment of the semiconductor substrate 1 on the second stage 28 is performed at the processing place 9 d inside the pretreatment unit 9. Then, after the pretreatment of the semiconductor substrate 1 on the second stage 28 is completed, the second stage 28 moves the semiconductor substrate 1 to the second relay location 9b. Next, the preprocessing unit 9 drives the first stage 27 to move the semiconductor substrate 1 placed on the first relay location 9 a to the processing location 9 d facing the carriage 31. Thereby, the pretreatment of the semiconductor substrate 1 on the first stage 27 can be started immediately after the pretreatment of the semiconductor substrate 1 on the second stage 28 is completed.

  Subsequently, in the preprocessing unit 9, the semiconductor device 3 mounted on the semiconductor substrate 1 is irradiated with ultraviolet rays. Thereby, the chemical bond of the organic irradiation object in the surface layer of the semiconductor device 3 is cut, and the active oxygen separated from the ozone generated by the ultraviolet rays is bonded to the molecules of the cut surface layer, so that the hydrophilicity is high. It is converted into a functional group (for example, —OH, —CHO, —COOH), and the surface of the substrate 1 is modified and organic substances on the surface are removed. Here, as described above, since the semiconductor device 3 (semiconductor substrate 1) is irradiated with ultraviolet rays in a state of being heated to 180 ° C. in advance, the semiconductor substrate 1 is not damaged, and collisions of molecules on the surface layer occur. The surface can be effectively modified by increasing the speed, and organic substances on the surface can be efficiently removed. After pre-processing, the pre-processing unit 9 drives the first stage 27 to move the semiconductor substrate 1 to the first relay location 9a.

  Similarly, when the transfer unit 13 moves the semiconductor substrate 1 onto the second stage 28, the pretreatment of the semiconductor substrate 1 on the first stage 27 is performed at the processing location 9 d inside the pretreatment unit 9. . Then, after the pretreatment of the semiconductor substrate 1 on the first stage 27 is completed, the first stage 27 moves the semiconductor substrate 1 to the first relay location 9a. Next, the pretreatment unit 9 drives the second stage 28 to move the semiconductor substrate 1 placed on the second relay place 9 b to the treatment place 9 d facing the carriage 31. Thereby, the pretreatment of the semiconductor substrate 1 on the second stage 28 can be started immediately after the pretreatment of the semiconductor substrate 1 on the first stage 27 is completed. Subsequently, the preprocessing unit 9 irradiates the semiconductor device 3 mounted on the semiconductor substrate 1 with ultraviolet rays, so that the semiconductor substrate 1 is not damaged in the same manner as the semiconductor substrate 1 on the first stage 27. The surface can be effectively modified and organic substances on the surface can be efficiently removed. After performing the pretreatment, the pretreatment unit 9 drives the second stage 28 to move the semiconductor substrate 1 to the second relay location 9b.

  When the pretreatment of the semiconductor substrate 1 is completed in the pretreatment step S2 and the process proceeds to the cooling step S3, the transfer unit 13 transfers the semiconductor substrate 1 in the relay place 9c to the cooling plate 110a or 110b provided in the treatment places 11a and 11b. Place. Thus, the semiconductor substrate 1 heated in the pretreatment step S2 is cooled (temperature adjustment) for a predetermined time to an appropriate temperature (for example, room temperature) when the printing step S4 is performed.

  The semiconductor substrate 1 cooled in the cooling step S <b> 3 is transported onto the stage 39 located at the relay location 10 a of the coating unit 10 by the transport unit 13. The control unit 14 drives the alignment unit 65 and performs the calibration of the stage 39 as described above. After the calibration, the control unit 14 drives the alignment unit 65 and images the alignment mark M provided on the front surface 1a side of the semiconductor substrate 1 conveyed on the stage 39, so that the semiconductor substrate 1 and the stage Alignment with 39 is performed. Specifically, as shown in FIG. 6, the control unit 14 moves the first alignment camera 61 a along the stage 39, so that the semiconductor substrate placed on the placement surface 41 of the stage 39. The semiconductor substrate 1 can be placed at a predetermined position with respect to the mounting surface 41 by taking an image of one alignment mark M and finely adjusting the position of the gripping portion 13 a of the transport portion 13.

  In the printing step S <b> 4, the coating unit 10 operates the chuck mechanism to hold the semiconductor substrate 1 placed on the stage 39 on the stage 39. Then, the coating unit 10 ejects droplets 57 from the nozzles 52 formed in each droplet ejection head 49 while scanning (relatively moving) the carriage 45 with respect to the stage 39 in the + X direction, for example.

  Thereby, marks such as the company name mark 4, the model code 5, and the production number 6 are drawn on the surface of the semiconductor device 3. Then, the mark is irradiated with ultraviolet rays from the curing unit 48 installed on the −X side of the carriage 45 which is the rear side in the scanning movement direction. As a result, since the functional liquid 54 that forms the mark contains a photopolymerization initiator that starts polymerization by ultraviolet rays, the surface of the mark is immediately solidified or cured.

  At this time, the two droplet discharge heads 49 are arranged along the Y direction which is the sub-scanning direction, and the nozzle row 60 is also arranged linearly in the Y direction. The pinning time from the ejection to the curing by being irradiated with ultraviolet rays is the same without causing a difference between the two droplet ejection heads 49.

  When the scanning movement of the carriage 45 in the + X direction is completed, the stage 39 is fed by a distance LN (= LH) in the + Y direction, for example. While the carriage 45 is scanned and moved relative to the stage 39 in the −X direction (relative movement), the droplets 57 are ejected from the nozzles 52 formed on the droplet ejection heads 49, and the rear in the scanning direction. The mark is irradiated with ultraviolet rays from the curing unit 48 installed on the + X side of the carriage 45 which is the side.

  As a result, droplets are also ejected to the area between the two droplet ejection heads 49 where the droplets were not ejected by the first scanning movement. Also, in the droplet discharge by the second scanning movement, the pinning time from when the droplet 57 is discharged to the semiconductor device 3 until it is cured by being irradiated with ultraviolet rays is different between the two droplet discharge heads 49. It does not occur and is the same. Furthermore, since the distance in the X direction between the nozzle row 60 (actual nozzle row 60A) and the curing units 48 on both sides is the same, droplet ejection by the first scanning movement and droplet ejection by the second scanning movement are performed. The pinning time is the same.

  After printing on the semiconductor substrate 1, the coating unit 10 moves the stage 39 on which the semiconductor substrate 1 is placed to the relay location 10a. Thereby, the conveyance part 13 can make it easy to hold | grip the semiconductor substrate 1. FIG. Then, the application unit 10 stops the operation of the chuck mechanism and releases the holding of the semiconductor substrate 1.

  Thereafter, the semiconductor substrate 1 is transported to the storage unit 12 by the transport unit 13 and stored in the storage container 18 in the storage step S6.

  As described above, according to this embodiment, since the calibration mark KM is shared between the first alignment camera 61a and the second alignment camera 61b, calibration is performed using the first alignment camera 61a. Thus, it is possible to prevent an error from occurring between the coordinate system set on the stage 39 and the coordinate system set on the stage 39 by performing calibration using the second alignment camera 61b. Therefore, the stage 39 can be calibrated with high reliability. Thereby, even the semiconductor substrate 1 provided with the alignment mark M on either one of the front surface 1a and the back surface 1b can be accurately aligned on the stage 39, and the accurate position of the semiconductor substrate 1 on the stage 39 is determined. Can be printed.

  As described above, the preferred embodiments according to the present invention have been described with reference to the accompanying drawings, but the present invention is not limited to the examples. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

  For example, in the above embodiment, the case where the through-hole 35 formed in the stage 39 is used as the calibration mark KM has been described as an example. However, as shown in FIG. 12, a glass member (translucent member) 36 embedded in the stage 39 is used. Alternatively, a configuration in which a mark M1 (for example, + mark) is printed as the calibration mark KM may be used. The stage 39 is formed with an opening 36a that allows the glass member 36 to face the inside. According to this configuration, the first alignment camera 61a and the second alignment camera 61b can respectively image the mark M1 printed on the glass member 36 from both sides of the stage 39 as a calibration mark. That is, even in this configuration, the calibration mark KM is shared between the first alignment camera 61a and the second alignment camera 61b.

  In the above embodiment, the case where one calibration mark KM is included in each of the imaging regions of the first alignment camera 61a and the second alignment camera 61b has been described as an example. However, as shown in FIG. There may be a configuration in which a plurality of calibration marks KM are received on the stage 39 so that each of the imaging areas AR of the camera includes two calibration marks KM. FIG. 13 shows the through hole 35 as the calibration mark KM, and is a view of the stage 39 as viewed from the + Z direction.

  According to this configuration, since at least two calibration marks KM are included in each of the imaging regions AR of the first alignment camera 61a and the second alignment camera 61b, the amount of positional deviation in the rotational direction of the stage 39 during calibration. Can be detected. Therefore, the control unit 14 can eliminate the positional deviation in the rotation direction of the stage 39 by driving a rotation mechanism (not shown) provided on the stage 39. Thereby, cavitation with higher accuracy can be performed, and alignment of the semiconductor substrate 1 with respect to the stage 39 can be performed with high accuracy.

In the above embodiment, the ultraviolet curable ink is used as the UV ink. However, the present invention is not limited to this, and various active light curable inks that can use visible light and infrared light as the curable light are used. be able to.
Similarly, various active light sources that emit active light such as visible light can be used as the light source, that is, an active light irradiation unit can be used.

  Here, in the present invention, the “actinic ray” is not particularly limited as long as it can impart energy capable of generating a starting species in the ink by the irradiation, and is broadly divided into α rays, γ rays, X-rays, ultraviolet rays, visible rays, electron beams and the like are included. Among these, from the viewpoints of curing sensitivity and device availability, ultraviolet rays and electron beams are preferable, and ultraviolet rays are particularly preferable. Therefore, as the actinic ray curable ink, it is preferable to use an ultraviolet curable ink that can be cured by irradiating ultraviolet rays as in the present embodiment.

M ... alignment mark, KM ... calibration, M1 ... mark, AR ... imaging region, 1a ... front surface, 1b ... back surface, 1 ... semiconductor substrate (base material), 3 ... semiconductor device, 7 ... printing device, 14 ... control unit 35 ... through hole, 36 ... glass member (translucent member), 39 ... stage, 39b ... opening, 49 ... droplet discharge head (discharge head), 54 ... functional liquid (liquid), 57 ... droplet, 61a ... 1st alignment camera, 61b ... 2nd alignment camera

Claims (5)

A stage on which an alignment mark is provided on at least one of the front surface and the back surface, and a substrate on which a liquid droplet is discharged from the nozzle of the discharge head;
A first alignment camera that images the alignment mark provided on the substrate from the surface side;
A second alignment camera that images the alignment mark provided on the base material from the back side;
The stage is provided with a calibration mark used for calibration of the stage,
The printing apparatus, wherein the calibration mark is shared between the first alignment camera and the second alignment camera.   The printing apparatus according to claim 1, wherein an opening portion is formed in the placement area of the base material of the stage so that the alignment mark provided on the back surface of the base material faces the inside.   The printing apparatus according to claim 1, wherein the calibration mark includes a through hole formed in the stage.   The printing apparatus according to claim 1, wherein the calibration mark includes a mark printed on a translucent member embedded in the stage.   5. The stage according to claim 1, wherein a plurality of calibration marks are provided on the stage so that two calibration marks are included in each of the imaging areas of the first alignment camera and the second alignment camera. The printing apparatus as described in any one.

Images