TWI511794B - A film pattern forming apparatus, a film pattern forming method, and a device adjusting method - Google Patents

Description

Thin film pattern forming device, thin film pattern forming method and apparatus adjusting method

The present invention relates to an apparatus for forming a thin film pattern by ejecting droplets of a film material from a nozzle toward a substrate, a method of forming a thin film pattern, and a method of adjusting the apparatus.

A conventional method of forming a solder resist pattern on a printed wiring board will be described. First, a photosensitive solder resist is applied to the entire surface of a printed wiring board having a circuit pattern formed on its surface. The solder resist film is exposed and developed using a predetermined mask pattern, thereby forming a solder resist resist pattern.

A technique in which a solder resist resist is dropletized so that droplets adhere only to a desired region of a printed wiring board and is cured, whereby a technique of forming a solder resist pattern is attracting attention. The droplets of the solder resist are discharged from a plurality of nozzles toward the printed wiring board. The droplets can be solidified by irradiating the droplets attached to the surface of the printed wiring board with ultraviolet rays.

(previous technical literature) (Patent Literature)

Patent Document 1: Japanese Patent Laid-Open Publication No. 2004-104104

There is a problem that clogging occurs in the nozzle hole due to a liquid material such as a solder resist. If a problem such as clogging of the nozzle hole occurs, the device in operation must be stopped and the nozzle replaced. A technique for reducing the operation stop time of the device is desired. Further, a technique for promptly performing a defect recovery process (repair process) of the nozzle holes is desired.

According to one aspect of the present invention, there is provided a thin film pattern forming apparatus comprising: a stage holding a substrate; and a nozzle unit having a plurality of nozzle holes opposed to the substrate and provided with droplets of the film material discharged to the substrate a moving mechanism that moves the substrate in an in-plane direction of the substrate with respect to the nozzle unit; a first imaging device detects a film pattern formed of a film material applied to the substrate; and a control device that controls the film The liquid droplets of the material are ejected from the nozzle unit to the substrate, and an inspection pattern is formed by the film material adhered to the substrate, and image data of the inspection pattern imaged by the first imaging device is acquired, and the acquired image is analyzed. The data is used to determine whether the nozzle holes of the nozzle unit are good.

According to another aspect of the present invention, there is provided a film pattern forming apparatus comprising: a process of forming a test pattern composed of a film material on a substrate by discharging a film material from a nozzle unit having a plurality of nozzle holes; a process for determining whether the nozzle hole is good by observing the inspection pattern; and discharging the film material from the normal nozzle hole in a state where the film material is discharged from the nozzle hole determined to be defective, thereby being on the substrate A process for forming a target film pattern.

According to still another aspect of the present invention, there is provided a method of adjusting a thin film forming apparatus, wherein the thin film forming apparatus has a stage that holds a substrate on a holding surface, and a plurality of heads that are paired with a substrate held on the stage a plurality of nozzle holes for discharging liquid droplets of the film material toward the substrate; and a moving mechanism for moving one of the stage and the head in a direction parallel to the holding surface in the other direction; and an imaging device The movable nozzle is movable to a position capable of capturing the nozzle hole, and the adjustment method includes: moving the imaging device to a position at which the head can be imaged, and photographing at least two of the nozzles; And the process of adjusting the relative positions of the plurality of the aforementioned nozzles according to the image of the nozzle.

It is possible to prevent the film pattern defect caused by the defective nozzle hole from being generated by controlling the nozzle hole which is determined to be defective without discharging the film material. Further, even in a state in which a defective nozzle hole is generated, it is possible to suppress a decrease in the operating rate of the device by forming a thin film pattern.

The relative position of the head can be easily adjusted by taking at least two of the aforementioned nozzles.

[Example 1]

Fig. 1 is a schematic view showing a thin film forming apparatus according to the first embodiment. The stage 25 is held by the moving mechanism 21 on the flat plate 20. The moving mechanism 21 includes an X moving mechanism 22, a Y moving mechanism 23, and an θ rotating mechanism 24. The XYZ orthogonal coordinate system in which the horizontal plane is the XY plane and the vertical direction is the Z axis is defined. The X moving mechanism 22 moves the Y moving mechanism 23 in the X-axis direction. The Y moving mechanism 23 moves the θ rotation mechanism 24 in the Y direction. The θ rotation mechanism 24 changes the posture of the rotation direction of the stage 25 with the axis parallel to the Z axis as the center of rotation. The stage 25 holds a substrate (for example, a printed wiring board) 50 as a film formation target. A vacuum chuck is used, for example, on the stage 25.

A beam 31 is supported by the support 30 above the flat plate 20. A nozzle unit support mechanism 65 and an imaging device 32 are attached to the beam 31. A plurality of nozzle units 40 are supported on the nozzle unit support mechanism 65. Details of the structure and arrangement of the nozzle unit 40 will be described later. The imaging device 32 and the nozzle unit 40 are opposed to the substrate 50 held on the stage 25. The imaging device 32 captures a wiring pattern formed on the surface of the substrate 50, an alignment mark, a thin film pattern formed on the substrate 50, and the like. The image data obtained by the shooting is input to the control device 33. Each of the nozzle units 40 discharges an ultraviolet curable resin such as a solder resist or the like from a plurality of nozzle holes toward the substrate 50 in a droplet form. The discharged film material adheres to the surface of the substrate 50.

The repairing device 37 moves below the nozzle unit 40 and repairs a temporary failure of the nozzle unit 40, such as a nozzle hole clogging or the like. Examples of the method of repairing the nozzle hole clogging include purification, suction, wiping, and the like. Purification refers to the treatment of applying a positive pressure to the space within the nozzle containing the film material. Attraction refers to the treatment of applying a negative pressure to the space outside the nozzle. Wiping means using a brush The process of wiping off the surface of the nozzle hole opening of the nozzle unit 40. When a film is formed on the substrate 50, the repairing device 37 retreats from the space between the nozzle unit 40 and the substrate 50.

The control device 33 controls the X moving mechanism 22, the Y moving mechanism 23, the θ rotation mechanism 24, the stage 25, the nozzle unit 40, and the repairing device 37. The control device 33 includes a memory device 34. Image data or the like of the film pattern to be drawn is stored in the memory device 34.

The operator inputs various commands (command) or numerical data required for control to the control device 33 via the input device 35. The input device 35 uses, for example, a keyboard, a touch panel, or the like. The control device 33 outputs various kinds of information such as an alarm to the operator from the output device 36. The output device 36 uses a liquid crystal display, a sounding device, or the like.

In the first drawing, the stage 25 is fixed to the flat plate 20, and the stage 25 is placed so that the stage 25 moves. Alternatively, the stage 25 can be fixed to the flat plate 20, and the nozzle unit can be fixed. 40 moves relative to the stage 25. Alternatively, the nozzle unit 40 may be moved in the X direction and the stage 25 may be moved in the Y direction. In any case, it is only necessary to move one of the nozzle unit 40 and the stage 25 relative to the other.

A perspective view of each nozzle unit 40 is shown in Fig. 2A. Four nozzles 42A to 42D are attached to the bottom surface of the nozzle holder (support member) 41. The heads 42A to 42D are arranged in this order in the negative direction toward the X axis. Each of the heads 42A to 42D is formed with a plurality of nozzle holes 45. The light source 43 is disposed outside the head 42A and outside the head 42D. Light source 43 The plate 50 (Fig. 1) is irradiated with ultraviolet rays. The ultraviolet rays cure the ultraviolet curable film material adhering to the substrate 50. Further, when the film material uses a material which is cured by light in a wavelength range other than ultraviolet rays, a light source which emits light in a wavelength range capable of curing the film material is used as the light source 43.

A bottom view of the heads 42A to 42D and the light source 43 is shown in Fig. 2B. The bottom surface of the shower head 42A (the surface facing the substrate 50) is formed with two nozzle rows 46a and a nozzle row 46b. Each of the nozzle rows 46a and the nozzle rows 46b is composed of a plurality of nozzle holes 45 arranged at a pitch (period) 8P in the Y-axis direction. The nozzle row 46b is offset from the nozzle row 46a in the negative direction of the X-axis, and is shifted from the negative direction of the Y-axis by only the pitch 4P. That is, the nozzle holes 45 of the head 42A are distributed at equal intervals of the pitch 4P in the Y direction. The pitch 4P is equivalent to, for example, a resolution of 300 dpi.

The structures of the heads 42B to 42D are the same as those of the head 42A. The head 42B, the head 42C, and the head 42D are mechanically positioned to be displaced from the head 42A by only 2P, P, and 3P in the negative direction of the Y-axis, and are attached to the head holder 41 (Fig. 2A). The light source 43 is disposed outside the head 42A and outside the head 42D.

As shown in Fig. 3, the images 55A to 55D of the nozzle holes 45 of the vertical projection heads 42A to 42D perpendicular to the X-axis are arranged at equal intervals in the Y direction at a resolution corresponding to 1200 dpi. Therefore, the thin film pattern can be formed at a resolution of 1200 dpi in the Y-axis direction by discharging the liquid material from the four heads 42A to 42D.

FIG. 4 shows an example of a thin film pattern (solder resist) to be formed on the surface of the substrate 50. Multi-printing on a single substrate 50 Brush the wiring board. A plurality of thin film patterns 53 having the same shape corresponding to the printed wiring board are arranged in a matrix in the X direction and the Y direction. Each of the film patterns 53 has an opening for soldering the electronic components. A conductive film of copper or a copper alloy or the like is exposed in the opening.

An annular unused region 52 in which the film pattern 53 is not disposed is defined near the edge of the substrate 50. The thin film pattern 53 is formed in the target pattern region 51 surrounded by the unused region 52.

A bottom view of the nozzle unit 40 and the nozzle unit support mechanism 65 is shown in Fig. 5A. Four nozzle units 40 are detachably mounted on the nozzle unit support mechanism 65. Each of the nozzle units 40 includes a head 42A to 42D and a nozzle holder 41. The relative positions of the nozzle units 40 are adjusted such that the images of the nozzle holes of the four nozzle units are vertically projected on the imaginary plane perpendicular to the X-axis at equal intervals in the Y-axis direction.

The control device 33 sends a discharge command of the liquid film material to the driver 67. The driver 67 sends a discharge signal to a predetermined nozzle hole 45 (Fig. 2A, Fig. 2B) at an appropriate timing in accordance with the received discharge command. By moving the substrate 50 in the X direction while moving the substrate 50 in the X direction in accordance with the image data stored in the memory device 34 (Fig. 1), a liquid material can be discharged from a predetermined nozzle hole at an appropriate timing, whereby a film pattern can be formed on the surface of the substrate 50. 53 (Fig. 4).

When the substrate 50 is moved in the positive direction of the X-axis, the nozzle unit 40 moves in the negative direction of the X-axis with respect to the substrate 50. Moving the substrate 50 in the X-axis direction is equivalent to moving the nozzle unit 40 in the opposite direction to the X-axis with respect to the substrate 50. In the present specification, the action of moving the substrate 50 in the X direction is called The nozzle unit 40 scans the substrate 50.

A sensor 66 is mounted on the nozzle unit support mechanism 65 corresponding to the nozzle unit 40. The sensor 66 detects the loading and unloading state of the nozzle unit 40. The detection result of the sensor 66 is input to the control device 33. The sensor 66 can use a sensor that mechanically detects the presence or absence of a nozzle unit, a sensor that optically detects the presence or absence of a nozzle unit, and the like. Instead of using the sensor 66 to detect the detachment state of the nozzle unit 40, the operator can input the detached state of the nozzle unit 40 from the input device 35 (Fig. 1).

An example of the scanning order (scanning sequence) based on the surface of the substrate 50 of the nozzle unit 40 is shown in FIG. A region in which one nozzle unit 40 can be attached to the film material by one scanning is referred to as a unit scanning region 70. The thin film pattern was formed at a resolution of 1200 dpi in the Y direction by one scan. Further, when the half pitch of the nozzle holes is moved in the Y direction and the reciprocal scanning is performed, the film pattern can be formed with a resolution of 2400 dpi. At this time, one reciprocal scan is referred to as "one scan".

By the four nozzle units 40, the film material can be attached to the four unit scanning regions 70a arranged in the Y direction in the first scanning. When the nozzle unit 40 is deflected in the Y direction and the second scanning is performed, the film material can be adhered to the four unit scanning regions 70b adjacent to the four unit scanning regions 70a of the liquid material applied in the first scanning. . A region defined by a plurality of unit scanning regions capable of attaching a film material by one scanning is referred to as a "pass region 71". When the one-way scanning is performed, as shown by the arrow in FIG. 5B, the scanning directions of the nozzle units 40 when the adjacent adjacent Pass regions 71 are scanned are opposite to each other.

When the target pattern region 51 (Fig. 4) of the substrate 50 can be covered by the eight unit scanning regions 70, the thin film pattern can be formed in the entire region of the target pattern region 51 by two scanning operations.

FIG. 6A is a bottom view showing the nozzle unit supporting mechanism 65 and the nozzle unit 40 in a state in which one of the four nozzle units 40 is removed. The disassembled nozzle unit 40 is shown by a broken line. The state in which the nozzle unit 40 located at the end in the Y direction is removed is shown in Fig. 6A. The "disassembly state" is notified from the sensor 66 corresponding to the disassembled nozzle unit 40 to the control device 33.

An example of the scanning sequence when one nozzle unit 40 is removed is shown in FIG. 6B. If the control device 33 (Fig. 6A) detects that the at least one nozzle unit 40 has been detached in response to the notification from the sensor 66 (Fig. 6A), the detached nozzle unit 40 is not used and the scanning sequence for forming the thin film pattern is calculated. . Since only three nozzle units 40 can be used in the state shown in FIG. 6A, one Pass region 71 is composed of three unit scanning regions 70. In the example shown in Fig. 5B, the entire area of the target pattern area 51 can be scanned by two scans. However, in the example shown in Fig. 6B, the scanning of the entire area has to be performed three times.

The three unit scanning regions 70a to which the film material adheres in the first scanning, the three unit scanning regions 70b to which the film material adheres in the second scanning, and the two unit scanning regions 70c to which the film material adheres in the third scanning The entire area of the target pattern area 51 (Fig. 4) is covered.

A flowchart based on the control sequence of the control device 33 (Fig. 1) is shown in Fig. 7A.

In step S1, an inspection pattern is formed. An example of the inspection pattern 60 is shown in Fig. 8A. The inspection pattern 60 is set such that the liquid materials discharged from the respective nozzle holes 45 (second FIG. 2, FIG. 2B) are not continuous with each other on the surface of the substrate 50. As an example, a pattern of liquid materials discharged from a plurality of nozzle rows 46a and nozzle rows 46b (second FIG. B) is formed at different positions in the substrate 50 in the X direction. Further, the pattern of the film material formed by each nozzle hole 45 is a straight line pattern that is long in the X direction. The inspection pattern 60 is formed on the unused region 52 of the substrate 50 (Fig. 4).

In step S2 of Fig. 7A, the formed inspection pattern is imaged by the imaging device 32 (Fig. 1). The obtained image data is input to the control device 33 (Fig. 1). An example of the inspection pattern 61 formed is shown in Fig. 8B. The position 61a where the straight line pattern should be formed is not formed with a straight line pattern. Further, the linear pattern 61b becomes shorter than the original length. Since the straight line pattern corresponds to the nozzle hole 1 to 1, the defective nozzle hole can be detected by image analysis of the formed inspection pattern 61. When the control device 33 (Fig. 1) detects a defective nozzle hole, the nozzle identification number for identifying the defective nozzle hole is stored in the memory device 34 (Fig. 1).

Next, in step S3 shown in Fig. 7A, it is determined whether or not there is a nozzle unit that is not suitable for use. When the number of defective nozzle holes is totaled for each nozzle unit 40, and the number of defective nozzle holes exceeds an allowable value, the nozzle unit 40 is determined to be a nozzle unit (faulty nozzle unit) that is not suitable for use. This allowable value is stored in the memory device 34 (Fig. 1). The operator inputs an allowable value from the input device 35 (Fig. 1). If an allowable value is input, the control device 33 rewrites the allowable value stored in the memory device 34.

When a part of the nozzle unit has been removed, an inspection pattern corresponding to the nozzle unit is not formed. Therefore, regarding the disassembled nozzle unit, the determination as to whether or not it is suitable for use is not performed.

When the nozzle unit 40 which is not suitable for use is not inspected, a film pattern is formed in step S4.

A detailed flowchart of step S4 is shown in Fig. 7B. In step SA1, a determination is made as to whether or not at least one nozzle unit has been removed. When all of the nozzle units 40 are mounted, a film pattern is formed in the usual scanning sequence (S-B) in step SA2. Here, the "normal scanning sequence" refers to a scanning sequence when no nozzle is determined to be defective.

Before forming the thin film pattern, the control device 33 reads the nozzle identification number of the defective nozzle hole from the memory device 34. The control device 33 sends a command to the driver 67 so that the discharge signal of the liquid material is not sent to the defective nozzle hole, and only the discharge signal is transmitted to the normal nozzle hole. Thereby, when the film pattern is formed, the film material is not discharged from the defective nozzle hole. The film material does not land at a position corresponding to the defective nozzle hole, but the film material that is placed around it expands in the in-plane direction, thereby avoiding coating leakage.

For example, when the target thin film pattern includes a thin linear pattern formed by one nozzle hole, a defective nozzle hole causes a fatal defect to the thin film pattern. In this case, in step S3 (Fig. 7A), the allowable value of the number of defective nozzle holes may be set to 0.

After the film pattern is formed, it returns to step S5 of Fig. 7A.

In step SA1, when it is checked that at least one nozzle unit has been removed, the step SA3 is made to form the nozzle unit 40 only for mounting. The scanning sequence of the standard film pattern (for example, Figure 6B). Further, all combinations of the nozzle units 40 that can be used can be prepared in advance in a scan sequence and stored in the memory device 34 (Fig. 1).

In step SA4, a thin film pattern is formed with the scan sequence at the time of the failure obtained in step SA3. After the film pattern is formed, it returns to step S5 of Fig. 7A.

In step S5 of Fig. 7A, it is determined whether or not there is a temporary stop request. The operator inputs the temporary stop request to the control device 33 through the input device 35 (Fig. 1). The memory device 34 is provided with a temporary stop request flag, and when a temporary stop request is input, the flag is in a "requested" state. For example, when a new nozzle unit 40 is to be installed at a portion where the nozzle unit 40 has been removed, the operator inputs a temporary stop request.

When the request is not temporarily stopped, it is determined in step S6 whether or not the operation is ended. When the thin film pattern is formed on the other substrate 50, the process returns to step S1, and an inspection pattern is formed in the unused region 52 (Fig. 4) of the substrate 50 on which the thin film pattern should be newly formed. After the processing of all the substrates 50 is completed, the operation is ended.

In step S3, when it is determined that there is a nozzle unit that is not suitable for use, the nozzle unit that is determined to be unsuitable for use in step S7 is a temporary failure or a fixed failure. For example, even if a predetermined number of times, for example, five repair processes are performed, and the failure is not restored, it is determined to be a fixed failure. When the number of repair processes is four or less, it is determined to be a temporary failure.

When it is determined that it is a temporary failure, the repair processing is performed in step S9. This repair process is performed by the repair device 37 (Fig. 1). Repair device 37 For example, a rubber brush is used to wipe the nozzle surface or to attract a resin that is clogged in the nozzle hole. If the repair process ends, the process returns to step S1.

When it is determined in step S7 that it is a fixed failure, a failure alarm is issued from the output device 36 in step S10. After the failure alarm is issued, the restart wait state is reached in step S11. When it is determined in step S5 that there is a temporary stop request, the step S11 also becomes a restart wait state. If it is a restart wait, the temporary stop request flag of the memory device 34 is set to the "no request" state.

A flowchart of the sequence of step S11 is shown in Fig. 7C. In addition, this sequence is not performed by the control device 33 (Fig. 1), but is performed by the operator. In step SB1, the nozzle unit 40 determined to be a fixed failure is detached or a new nozzle unit 40 is attached to the portion where the nozzle unit 40 has been detached. The new nozzle unit 40 may be a nozzle unit 40 that is temporarily determined to be a fixed failure, or may be an unused nozzle unit 40.

When the disassembly of the nozzle unit 40 determined to be a fixed failure or the installation of the new nozzle unit 40 is completed, the operator instructs the control device 33 to restart from the input device 35 (Fig. 1) in step SB2. Further, both the detachment of the nozzle unit 40 determined to be a fixed failure and the installation of the new nozzle unit 40 can be performed.

When the restart is instructed, the process returns to step S1 shown in Fig. 7 to start the formation of the inspection pattern. Further, when a portion of the unused region 52 of the substrate 50 has been formed with the inspection pattern, the inspection pattern is newly formed in the region where the inspection pattern has not been formed.

Next, a modification of the first embodiment will be described. In the first embodiment described above, after the failure alarm is issued in step S10 (Fig. 7A), the restart waits. If it becomes a restart wait, the intervention of the operator is required. In the modified example, after the failure alarm is issued, the nozzle unit 40 determined to be a fixed failure is set to the unusable state, and the process returns to step S1. When the inspection pattern is formed in step S1 and the film formation in step S4 is performed, the discharge signal is not transmitted to the nozzle unit 40 that is in an unusable state. That is, the operator can continue the film formation process without intervening. When the nozzle unit 40 determined to be a fixed failure is disassembled, the operator inputs a temporary stop request from the input device 35.

Next, the effect of the above embodiment 1 will be described.

A portion of the film pattern to be formed is shown in Fig. 9A. An opening 76 is disposed in the region 75 where the film material adheres. A conductive film of copper or the like is exposed in the opening 76. An electronic component is soldered on the conductive film.

FIG. 9B shows an example of a thin film pattern formed by transmitting a discharge signal to a defective nozzle hole in the presence of a defective nozzle hole. An insulating film called a saddle 77 is attached to the opening 76. The auxiliary body 77 is formed by adhering a film material discharged from an abnormal nozzle hole at an abnormal time or to a film material discharged in a direction different from the normal direction. The opening 76 in which the auxiliary body 77 is formed is liable to cause welding failure due to difficulty in fusion welding.

In the first embodiment, since the discharge signal is not transmitted to the defective nozzle hole, the auxiliary body 77 can be prevented from being generated. When there is a defective nozzle hole, since the discharge of the film material is continued, it is also possible to suppress a decrease in the operation rate of the device.

Further, a defect such as a film material falling from the nozzle hole may occur in a state where the discharge signal is not input. If such a problem occurs, the auxiliary body 77 can be formed even if the discharge signal is not sent to the defective nozzle hole. Thus, a defect such as a drooping of the film material can be determined by the shape of the inspection pattern. When it is determined that the shape of the inspection pattern has occurred, such as a failure to form an auxiliary body even if the ejection signal is not transmitted, it is determined that the number of defective nozzle holes is unsuitable irrespective of the number of defective nozzle holes in step S3 (Fig. 7A). The nozzle unit is used, and the processing of step S7 is performed.

Further, in the first embodiment, the remaining nozzle unit 40 can continue to discharge the film material even in a state in which a part of the nozzle unit 40 is detached. Therefore, the operation rate of the thin film pattern forming apparatus can be improved.

In the above-described Embodiment 1, an inspection pattern is formed for each substrate 50 on which the thin film pattern is formed and it is checked whether the nozzle is good. It is also possible to check whether the nozzle holes are good for the inspection pattern of the rolls of each of the substrates 50, instead of checking whether the nozzle holes are good for each of the substrates 50.

[Embodiment 2]

Fig. 10 is a schematic view showing a film forming apparatus based on Example 2. An imaging device 80 is mounted on the stage 25. By moving the stage 25 and disposing the imaging device 80 directly under the nozzle unit 40, a part of the plurality of nozzle holes of the nozzle unit 40 can be imaged by the imaging device 80. The other structure is the same as that of the film forming apparatus according to the first embodiment shown in Fig. 1. Further, in the first embodiment, a plurality of nozzle units 40 are attached to the nozzle unit supporting mechanism 65. Description of Embodiment 2 In the example, an example in which one nozzle unit 40 is attached to the nozzle unit support mechanism 65 will be described. Further, in the second embodiment, as in the first embodiment, a plurality of nozzle units 40 can be attached to the nozzle unit supporting mechanism 65. Hereinafter, the same configurations as those of the first embodiment will be omitted.

Fig. 11 is a perspective view showing the stage 25, the nozzle unit 40, and the nozzle unit supporting mechanism 65 of the film forming apparatus of the second embodiment. The substrate 50 is held on the holding surface of the stage 25. A nozzle unit 40 is supported above the substrate 50. The nozzle unit 40 includes a nozzle holder 41 and a plurality of heads 42 fixed to the nozzle holder 41. A plurality of nozzle holes are provided on the surface of the head 42 opposite to the substrate 50.

The nozzle unit support mechanism 65 includes a goniometer 47 and a lifting mechanism 48. The goniometer 47 is capable of rotating the nozzle unit 40 as a center of rotation with an axis parallel to the Z axis within a certain angular range. The lifting mechanism 48 moves the nozzle unit 40 in the Z direction.

An imaging device 80 is attached to the edge of the stage 25. The imaging device 80 uses, for example, a CCD camera or the like. The stage 25 is moved and the imaging device 80 is disposed directly under the nozzle unit 40, whereby a part of the nozzle holes can be captured. The photographing device 80 is controlled by the control device 33, and the photographed image data is input to the control device 33. In addition, as the imaging device 80, a line sensor can be used. When the line sensor is used, the control device 33 acquires a plurality of one-dimensional images while moving the stage 25. A plurality of acquired one-dimensional images can be synthesized to generate a two-dimensional image.

The illumination device 81 illuminates the nozzle holes in the shooting range. As the illumination method, for example, coaxial epi-illumination can be employed. Illumination light only contains no liquid thin The wavelength domain in which the film material cures, without the wavelength of the ultraviolet region that cures the film material.

A repairing device 37 is further mounted on the stage 25. The repairing device 37 is moved below the nozzle unit 40, thereby clogging the nozzle holes and the like. The repairing device 37 is controlled by the control device 33. Examples of the method of recovering the nozzle hole clogging include purification, suction, wiping, and the like.

When purifying, the liquid film material flows out from the nozzle holes. The repairing device 37 is provided with a tray that receives the film material flowing out of the nozzle holes. The repairing device 37 houses a suction device that applies a negative pressure to the nozzle hole. Further, the repairing device 37 is provided with a brush for wiping the head 42.

A plan view of the thin film pattern 53 formed on the substrate 50 is shown in Fig. 12A. For example, the thin film pattern 53 is composed of a plurality of congruent patterns arranged in a matrix. The image data of the formed thin film pattern 53 is stored in the control device 33 (Fig. 10). When a problem occurs such as clogging of the nozzle hole in a part of the nozzle holes 45 (Fig. 2A and Fig. 2B), as shown in Fig. 12B, a linear defective portion 38 parallel to the X direction appears.

Fig. 13 is a flow chart showing a repair method of the thin film forming apparatus of the second embodiment. As shown in Fig. 12B, when the defective portion 38 appears in the formed thin film pattern 53, the Y of the nozzle hole 45 (Fig. 2, Fig. 2B) which is considered to be defective is estimated from the position of the defective portion 38 in step SC1. The position of the direction. However, although the position of the nozzle hole which is considered to be defective can be restricted to a certain area only by the position of the defective portion 38, it is difficult to specify the nozzle hole 45 (poor nozzle hole) which is defective. The area inferred to have a defective nozzle hole is referred to as a "suspicious area". Suspicious area contains plural Nozzle holes. Further, it is also difficult to specify the head 42 to which the defective nozzle hole 45 belongs, so that a suspicious area is defined for each head 42.

In step SC2, the suspicious area of each of the heads 42 is imaged by the imaging device 80 (Fig. 10, Fig. 11). Specifically, the operator inputs the position information in the Y direction of the suspicious area from the input device 35 (Fig. 10). The position information may be position information based on the head 42 shown in FIG. 2B, or may be position information based on the substrate 50 shown in FIG. 12B. When the position information based on the substrate 50 is input, the control device 33 (Fig. 10) converts the position information based on the substrate 50 into position information based on the head 42. As shown in Fig. 14, the control device 33 moves the stage 25 and moves the imaging device 80 directly below the suspicious area of each of the heads 42.

In addition, the method of automatically detecting the position of the suspicious area may be used instead of the operator inputting the location information of the suspicious area. Next, a method of automatically detecting the position of the suspicious area will be described. First, after the thin film pattern 53 (Fig. 12A) is formed on the substrate 50, the thin film pattern 53 is imaged by the imaging device 32 (Fig. 10). Whether or not the defective portion 38 is present is determined by automatically analyzing the captured image (Fig. 12B). When the defective portion 38 is detected, the position of the suspicious region is calculated based on the position of the defective portion 38.

Fig. 15 shows the positional relationship between the nozzle hole 45 and the imaging range 82 of the imaging device 80 (Fig. 14). For example, three to four nozzle holes 45 belonging to one head 42 are accommodated in the imaging range 82. By moving the stage 25 (Fig. 14) in the X direction, the suspicious regions of the four heads 42 can be sequentially accommodated in the imaging range 82 and imaged. Control device 33 is The output device 36 displays the captured image.

In step SC3, the operator specifies the defective nozzle hole and the head 42 having the defective nozzle hole by observing the image displayed on the output device 36. In step S4, the operator determines whether or not the defective nozzle hole 45 is recoverable. For example, when the air bubbles remain in the defective nozzle hole 45 and the minute foreign matter remains in the defective nozzle hole 45, it is determined that the defective nozzle hole 45 can be recovered. When the film material is solidified in the defective nozzle hole 45, the defective nozzle hole 45 is deformed, or the like, it is determined that the defective nozzle hole cannot be recovered.

When it is determined that the defective nozzle hole 45 can be restored, the head 42 to which the defective nozzle hole 45 belongs is replaced with a new head in step SC9. When it is determined in step SC4 that the recovery is impossible, the operator inputs the information of the specific defective nozzle hole 45 and the instruction to execute the repair process from the input device 35 in step SC5. The information for the particular defective nozzle aperture 45 includes information for the particular nozzle 42 and information for the nozzle aperture 45 within the particular nozzle 42.

In step SC6, the control device 33 (Fig. 10) performs a repair process on the defective nozzle hole 45. Specifically, the repairing device 37 (Fig. 11) is moved directly below the defective nozzle hole 45. After that, suction, wiping, purification, and the like are performed. The suction is performed only on the defective nozzle hole 45 or the nozzle hole in the vicinity thereof. Wiping and purging is performed on the head 42 to which the defective nozzle hole 45 belongs.

When the repair process is completed, the nozzle hole 45 after the repair process is imaged by the image pickup device 80 (Fig. 14) in step SC7. The control device 33 displays the acquired image on the output device 36 (Fig. 10). In step SC8, the operator determines whether or not the defect of the nozzle hole 45 has been restored by observing the image displayed on the output device 36. End the repair when the judgment is recovered deal with. When it is determined that the failure is not restored, in step S9, the head 42 including the defective nozzle hole 45 is replaced with a new head.

In the second embodiment described above, the nozzle hole 45 (Fig. 15) can be observed by the imaging device 80 (Fig. 10, Fig. 11) without removing the head 42 from the nozzle jig 41. Therefore, when the defective portion 38 (Fig. 12B) appears in the film pattern 53, the state and position of the defective nozzle hole can be easily specified. Thereby, the time for the repair process can be shortened.

Further, the wiping performed in step SC6 (Fig. 13) may restore the defective nozzle hole 45, but conversely, it may be a cause of clogging the normal nozzle hole 45. In the second embodiment, only the head 42 to which the defective nozzle hole 45 belongs is wiped, and the normal head 42 is not wiped. Therefore, it is possible to prevent the occurrence of defects due to wiping.

In the above-described second embodiment, the operator in step SC3 (Fig. 13) specifies the nozzle hole 45 which is defective by observing the image of the nozzle hole. It is also possible to perform automatic image analysis by the control device 33 (Fig. 10) without specifying an operator's intervention to specify a defective nozzle hole 45 and determine whether or not it is possible to recover. Automatic analysis of images can be performed by accumulating image data of various defective nozzle holes and information on whether or not it is possible to recover.

Further, in the second embodiment described above, the imaging device 80 (Fig. 10, Fig. 11) is used to specify the nozzle hole 45 in which the defect has occurred. The observation of the wider surface of the head 42 can be achieved by setting the camera 80 to a lower magnification. Thereby, the state of contamination of the surface of the head 42 can be observed.

In the second embodiment described above, as shown in FIG. 11, the imaging device 80 and the repairing device 37 are mounted on the stage 50 for the substrate 50, except for the base. In addition to the stage 25 for the board 50, the stage for the imaging device 80 and the repairing device 37 may be disposed. Thereby, the weight of the stage 25 for the substrate 50 can be reduced. Further, the imaging device 80 and the repairing device 37 may be fixed to the flat plate 20 (first drawing), and the nozzle unit 40 may be moved above the imaging device 80 or the repairing device 37.

Next, a method of adjusting the film forming apparatus according to the modification of the second embodiment will be described with reference to Fig. 16. In this adjustment method, a plurality of heads 42 are attached to the nozzle holder 41 shown in Fig. 11, and the relative positions of the plurality of heads 42 are adjusted.

As shown in FIG. 16, the imaging device 80 is moved and the image is acquired such that the nozzle hole (hereinafter referred to as "reference nozzle hole") 55r serving as the reference of the one head 42 is included in the imaging range 82 of the imaging device 80. Similarly, the reference nozzle hole 45r of the other head 42 is taken.

The relative positional relationship of the reference nozzle holes 45r of the plurality of heads 42 is obtained by analyzing the captured images. According to the calculation result, the relative position of the head 42 is adjusted so that the reference nozzle hole 45r is disposed at the target position. The fine adjustment of the position of the head 42 can be performed by fine-tuning a bolt or the like.

As shown in Fig. 17, the edges of the two heads 42 adjacent to each other can be placed in the image captureable range 52, and the edge of the head 42 can be photographed. The edge of the head 42 can be detected by analyzing the captured image, and the relative positional relationship of the plurality of heads 42 can be determined.

[Example 3]

Figure 18 shows a thin film including a droplet discharge device based on Embodiment 3. A schematic view of the film forming apparatus 171. The film forming apparatus 171 includes an alignment station 102 disposed inside the casing 118, an inspection film formation station 103, a substrate reversing station 104, an alignment station 105, an inspection film formation station 106, an ultraviolet irradiation device 108, and lifters 111 to 114. . Further, the casing 118 of the film forming apparatus 171 is provided with a substrate transfer port 101 and a substrate transfer port 107. The film forming apparatus 171 is used to form a film pattern such as a solder resist on the front and back surfaces of the substrates 121 to 127 which are, for example, rectangular printed wiring boards. The film forming apparatus 171 includes a conveyor belt 115, a conveyor belt 116, and a control device 120. The movement of the substrates 121 to 127 from the outside to the inside of the casing 118 is performed by the conveyor belt 115. The conveyance of the substrates 121 to 127 in the inside of the casing 118 is performed by the lifters 111 to 114. The conveyor belt 116 carries the substrates 121 to 127 from the inside of the casing 118 to the outside of the casing 118. The operation of the various devices inside the casing 118 and the operation of the conveyor belt 115 and the conveyor belt 116 are controlled by the control device 120. Control device 120 includes a memory device 120a. The surfaces of the substrates 121 to 127 which are conveyed to the inside of the casing 118 are directed in the upward direction of the drawing (the positive direction of the Z-axis).

In the present specification, the orthogonal coordinate system of the right-handed system in which the vertical direction is the Z-axis positive direction is divided. In the following description, the five stations from the alignment station 102 to the inspection film formation station 106 are sequentially arranged in the positive direction of the Y-axis, and the substrates 121 to 127 carried in the casing 118 through the substrate transfer inlet 101 are passed through the respective stations 102 to 106. The conveyance is carried in the positive direction of the Y-axis, and is carried out to the outside of the casing 118 through the substrate discharge port 107.

In the thin film forming apparatus 171, each of the alignment station 102, the inspection film formation station 103, the substrate inversion station 104, the alignment station 105, and the inspection film formation station 106 The stations process in parallel. Therefore, it is possible to achieve an increase in production efficiency.

The alignment station 102 will be described with reference to Figs. 19A to 19C. Figure 19A shows an overview of the alignment device stored at the alignment station 102. The alignment device includes an X stage 132, a θ stage 133, and a chuck plate 134 which are disposed on the base (base) 131 in this order from the base 131 side. The chuck plate 134 is adsorbed and held by the lifter 111 to the substrate 122 of the alignment station 102.

The X stage 132 is capable of moving the held substrate 122 in the X-axis direction. The θ stage 133 is capable of rotating the held substrate 122 around the rotation axis parallel to the Z axis in a plane parallel to the XY plane. The X stage 132, the θ stage 133, and the chuck plate 134 constitute a moving stage that holds the substrate 122 and moves inside the alignment station 102. The adsorption of the substrate 122 based on the chuck plate 134 and the movement of the substrate 122 based on the X stage 132 and the θ stage 133 are controlled by the control device 120.

Also, the alignment device includes CCD cameras 135 to 138. The CCD cameras 135 to 138 take an alignment mark formed on the substrate 122 held on the chuck plate 134. The shooting based on the CCD cameras 135 to 138 is controlled by the control device 120. Further, the image data (detection result) obtained by the CCD cameras 135 to 138 is transmitted to the control device 120.

FIG. 19B shows a plan view of the substrate 122 transported to the alignment station 102 and adsorbed and held on the chuck plate 134. For example, alignment marks 122a to 122d are formed at four corners of the surface of the substrate 122.

The substrate 122 placed on the chuck plate 134 by the lifter 111 is driven by the X stage 132 while being adsorbed and held by the chuck plate 134. Moving in the positive direction of the X-axis within the alignment station 102. The substrate 122 after the movement is shown in parentheses in Fig. 19B.

The CCD cameras 135 to 138 are disposed above the chuck plate 134 after moving in the positive X-axis direction. Each of the CCD cameras 135 to 138 is disposed at a position where the alignment marks 122a to 122d can be photographed. The substrate 122 is moved below the CCD cameras 135 to 138 by the X stage 132, and the CCD cameras 135 to 138 image the alignment marks 122a to 122d formed on the substrate 122. The captured image data is sent to the control device 120.

The control device 120 processes the image data acquired by the CCD cameras 135 to 138, and grasps the position of the substrate 122 and the posture (direction) in the XY plane (in-plane direction of the substrate 122). Thereafter, for example, the posture of the substrate 122 in the XY plane direction ( θ correction) is corrected (changed).

FIG. 19B shows an example in which the position is shifted from the angle α in the counterclockwise direction in the XY plane of the substrate 122 as an example. At this time, for example, the apex of the alignment mark 122a and the apex of the alignment mark 122d are connected to each other, and the apex of the latter is inclined by the angle α from the positive direction of the Y-axis to the counterclockwise direction. The control device 120 grasps the positional deviation based on the image data acquired by the CCD cameras 135 to 138. The control device 120 corrects the positional deviation by rotating the θ stage 133 only by the angle α in the clockwise direction. As a result of the correction, each side of the rectangular substrate 122 is parallel to the X-axis or the Y-axis.

As shown in FIG. 19C, after the θ correction of the substrate 122 is performed, the control device 120 drives the X stage 132 and moves the substrate 122 in the negative direction of the X-axis. The moving distance of the substrate 122 is equal to the distance of the substrate 122 moving in the positive direction of the X-axis, for example, in the process shown in FIG. 19B.

The substrate 122 after moving in the negative direction of the X-axis is shown in parentheses in Fig. 19C. The substrate 122 subjected to the θ correction is transported to the inspection film forming station 103 by the lifter 111. The lifter 111 conveys the direction of the substrate 122 in the direction in which the surface of the substrate is changed by the rotation of the θ stage 133 to the stage of the inspection film formation station 103.

Since the θ correction has been completed at the alignment station 102, it is not necessary to form the film pattern on the surface of the substrate 122 without performing the positional correction of the substrate 122 in the inspection film formation station 103. For example, compared with the case where the thin film pattern is formed after the θ correction is performed by the film forming station 103, the processing time in the film forming station 103 can be shortened, and even the interval time can be shortened and the production efficiency can be improved.

Further, elongation strain is generally generated on the substrate 122, and the size of the substrate 122 is different from the design value at the time of forming the thin film pattern. The control device 120 measures the size of the substrate 122 in accordance with the image data acquired by the alignment station 102 using the CCD cameras 135 to 138. When the formation of the thin film pattern is performed on the substrate 122 in the inspection film formation station 103, image data of a raster format for forming a thin film pattern is generated in accordance with the measured size. The generated image data is stored in the memory device 120a of the control device 120. This sequence will be described in detail in the following description of the film formation station 103.

20A and 20B show schematic views of a part of the droplet discharge device 170 stored in the inspection film formation station 103. As shown in FIG. 20A, the droplet discharge device 170 includes a base 141 provided in a plane parallel to the XY plane (horizontal plane) and arranged in order from the base 141 side. Y stage 143, X stage 144, and chuck plate 145 on 141. The chuck plate 145 is adsorbed and held by the lifter 111 to the substrate 123 of the inspection film forming station 103.

The Y stage 143 can move the held substrate 123 in the Y-axis direction. The X stage 144 is capable of moving the held substrate 123 in the X-axis direction. The Y stage 143, the X stage 144, and the chuck plate 145 constitute a moving stage disposed on the base 141, holding the substrate 123, and moving the substrate 123 in the inspection film formation station 103. The substrate 123 is carried out based on the adsorption of the chuck plate 145 and the substrate 123 is commanded by the movement control device 120 based on the movement of the Y stage 143 and the X stage 144.

Further, the Y stage 143, the X stage 144, and the chuck plate 145 may be arranged in the vertical direction in this order, and the function of the Y stage 143, the X stage 144, and the chuck plate 145 may be used. A high-performance stage for moving the stage.

The nozzle units 147a to 147f may be disposed above the chuck plate 145. The nozzle units 147a to 147f are fixed to the base 141 by a frame 142. The frame 142 includes a pillar 142a fixed to the base 141, a pillar 142b, and a beam 142c supported by the pillar 142a and the pillar 142b.

The nozzle units 147a to 147f are held by the connecting member 146 on the beam 142c of the frame 142. The nozzle units 147a-147f respectively include a plurality of nozzles and an ultraviolet light source. The head discharges, for example, droplets of the ultraviolet curable film material toward the surface of the substrate 123 held on the moving stage. The film material is discharged while moving the substrate 123 in the X-axis direction. Forming a thin film pattern on the surface of the substrate 123 by the discharged film material, For example, a pattern of a solder resist. The film pattern formed on the surface of the substrate 123 is cured (temporarily cured) by ultraviolet rays emitted from an ultraviolet light source.

The image data (Gerber data) of the thin film pattern formed on the substrate 123 or the display substrate 123 is stored in the memory device 120a of the control device 120 based on the amount of movement of the moving stage and the discharge time of the film material from the head. (spit timing) information. These are the design data (initial values). The control device 120 generates image data (control data) in a raster format from the image data of the substrate 123 photographed by the alignment station 102 from these data. For example, the control device 120 calculates the elongation strain in the X direction and the Y direction of the substrate 123 from the image data captured by the alignment station 102. The coordinates of the position of the droplets of the falling film material (correction of the Gerber data) are corrected in the Y direction according to the elongation strain in the Y direction of the substrate 123. In the X direction, the elongation strain correction substrate 123 in the X direction of the substrate 123 is based on the relationship between the amount of movement of the X stage 144 and the discharge timing of the film material from the head (discharge timing). Thus, the control data obtained by correcting the data previously stored in the memory device 120a is stored in the memory device 120a. Further, the coordinates of the position of the falling film material are corrected in the X direction of the substrate 123 instead of the discharge timing (correction of the Gerber data).

An example of the correction of the Gerber data will be described with reference to FIGS. 28A and 28B. Fig. 28A and Fig. 28B show image data of a raster format composed of a plurality of pixels arranged in a row direction and a column direction. In both figures, the pixels of the area where the solder resist should be applied are blacked out for display.

Fig. 28A shows the design value (initial value) of the position of the landing film material. The pixel on the outer side of the circle depicted by the solid line is used as the film material to be coated The area is memorized in the memory device 20a.

For example, assume the X-direction length L _X, Y longitudinal direction is the X-direction elongation L of the rectangular substrate 123 of the _Y △ X, Y-direction elongation of △ Y. When the elongation is uniformly generated over the entire substrate 123, the elongation per unit length in the X direction and the Y direction is ΔX/l _X and ΔY/l _Y . The circumference and the inside of the Fig. 28A (the area of the uncoated film material) are expanded in accordance with the variables. That is, on the substrate 123, since the position of the film material to be coated changes, the control device 120 corrects the coordinates (pixels) of the position at which the film material should be applied.

The image data of the corrected raster format is shown in Fig. 28B. For example, the pixel on the outer side of the circumference, which is depicted by a solid line in Fig. 28B, becomes the region of the film material to be coated after correction. The circle drawn by the solid line in Fig. 28A is shown by a broken line in Fig. 28B as a reference. For example, the image data shown in Fig. 28B is re-stored in the memory device 120a as control data at the time of film pattern formation.

The control device 120 controls the film material to be ejected from the nozzle units 147a to 147f and the substrate 123 to move based on the moving stage in accordance with the control data stored in the memory device 120a, so that the film material is applied to a predetermined region on the substrate 123. The substrate 123 is coated with a film material vertically below the nozzle units 147a to 147f (in the Z-axis negative direction) while moving in the X-axis direction.

The vicinity of the nozzle units 147a to 147f of the droplet discharge device 170 is shown in Fig. 20B. The nozzle units 147a to 147f are, for example, nozzle units having the same configuration, and are fixed to the coupling member 146 at equal intervals in the Y-axis direction. The joint member 146 is movably attached to the frame 142 in the Z-axis direction. On the beam 142c. In this manner, the nozzle units 147a to 147f are held by the frame 142 so as to be able to adjust the distance from the substrate 123. The nozzle units 147a to 147f are controlled by the control device 120 to move in the Z-axis direction based on the joint member 146. Further, the nozzle units 147a to 147f can be directly fixed to the beam 142c of the frame 142 without passing through the joint member 146.

A schematic view of the nozzle unit 147a is shown in Fig. 21A. The nozzle unit 147a includes nozzles 147a ₁ to 147a ₄ and ultraviolet light sources 147a ₅ to 147a ₉ which are alternately assembled in the X-axis direction on the nozzle holder 47a _c . Each of the heads 147a ₁ to 147a ₄ includes two rows of nozzle rows arranged at intervals in the X-axis direction. Each nozzle row includes a plurality of, for example, 192 nozzle holes arranged in the Y-axis direction. The length of each nozzle row in the Y-axis direction is, for example, about 30 mm. Droplets of the ultraviolet curable film material are discharged from the respective nozzle holes.

The ultraviolet light sources 147a ₅ to 147a _{9 are,} for example, composed of a light emitting diode (LED), and emit light of a wavelength in the ultraviolet region. The ultraviolet curable film material discharged from the nozzle holes of the heads 147a ₁ to 147a ₄ to the substrate 123 is cured (temporarily cured) by light emitted from the ultraviolet light sources 147a ₅ to 147a ₉ . The ultraviolet light is emitted from the ultraviolet light sources 147a ₅ to 147a ₉ by the control device 120.

Fig. 21B shows a bottom view of the droplet discharge surface of the nozzle unit 147a (heads 147a ₁ to 147a ₄ ). The description of the ultraviolet light sources 147a ₅ to 147a ₉ is omitted in Fig. 21B. The heads 147a ₁ to 147a _{4 are} disposed opposite to each other on the moving stage.

The nozzle holes of one nozzle row of the heads 147a ₁ to 147a ₄ are arranged in a period of 160 μm in the Y-axis direction. In each of the heads 147a ₁ to 147a ₄ , the nozzle row on the positive side of the X-axis is formed such that the position of the nozzle hole is shifted by 80 μm in the positive direction of the Y-axis with respect to the nozzle row on the negative side of the X-axis. Therefore, each of the heads 147a ₁ to 147a ₄ includes 384 nozzle holes staggered at intervals of 80 μm in the Y-axis direction, and has a resolution of about 300 dpi with respect to the Y-axis direction. Each nozzle hole is composed of a piezoelectric element, and the film material is discharged by applying a voltage. The command of the control device 120 receives the discharge of the film material (addition of voltage). Further, in the third embodiment, the number of nozzle rows is two, but the number of nozzle rows may be one or three or more.

The heads 147a ₁ to 147a ₄ are arranged in the X-axis direction as a whole while being sequentially displaced from the relative position in the positive direction of the Y-axis. The head 147a _{2 is} disposed to be offset from the head 147a _{1 by} only 20 μm toward the positive side of the Y-axis. By the same token, the head 147a ₃ and the head 147a _{4 are} disposed to be offset from the head 147a ₂ and the head 147a ₃ by only 20 μm toward the positive side of the Y-axis. As a result, the nozzle unit 147a is provided with nozzle holes arranged at intervals of 20 μm (high resolution of about 1200 dpi) in the Y-axis direction.

A schematic plan view of the nozzle units 147a to 147f is shown in Fig. 21C. As described above, each of the nozzle units 147a to 147f can cause the liquid droplets to land in a range of about 30 mm in the Y-axis direction. Further, they are arranged at equal intervals along the Y-axis direction. The distance between adjacent nozzle units 147a to 147f is, for example, about 60 mm.

In the inspection film formation station 103, after the substrate 123 conveyed by the lifter 111 is held on the moving stage (chuck plate 145), for example, while moving in the positive direction of the X-axis, it faces the respective nozzle units 147a. Odd columns of pixels along the X-axis below 147f (attached in Figure 21C) The discharge target position (the target position of the solder resist formation) in the pixel of the circular mark is discharged, and the film material is discharged from the nozzle units 147a to 147f. When the Y-substrate 143 is moved to the target position of the odd-numbered column, the substrate 123 is moved by 10 μm in the positive direction of the Y-axis, and then the substrate 123 is moved in the positive direction of the X-axis. The discharge target position in the even-numbered column elements (the pixels in which the cross-shaped symbols are added in FIG. 21C) in the X-axis direction below the nozzle units 147a to 147f discharges the film material from the nozzle units 147a to 147f. It is possible to discharge a droplet at a target position of an odd column pixel and an even column pixel on the path and the loop in the X-axis direction, thereby realizing rendering at a high resolution of about 2400 dpi.

After the discharge of the droplets to the even-numbered column elements is completed, the Y stage 143 is driven to move the substrate 123 in the positive direction of the Y-axis by about 30 mm. Thereafter, the substrate 123 is reciprocated in the X-axis direction by the X stage 144, and the thin film material is deposited on the outward path and the loop to the odd column pixels and the even column pixels, respectively.

Further, the same processing is performed again, and the formation of the thin film pattern on the surface of the substrate 123 is completed by a total of three round trips in the X-axis direction.

The droplet discharge device according to the third embodiment shown in Figs. 20A to 21C has six nozzle units 147a to 147f. The number of nozzle units is not limited to six. The number of nozzle units may be, for example, one.

A schematic view of the substrate inverting device 150 and the ultraviolet irradiation device (solder resist resist curing device) 160 housed in the substrate inversion station 104 is shown in FIGS. 22A to 22D. As shown in FIG. 22A, the substrate inverting device 150 includes a substrate holder 151 and a support member 152. The substrate holder 151 has a shape in which three sides of one short side are removed along the outer circumference of the rectangle . The substrates 121 to 127 which are transported to the substrate inversion station 104 by the lifter 112 (Fig. 18) are held by the substrate holder 151. The rod-shaped support member 152 supports the substrate holder 151. The support member 152 is disposed in the same plane as the plane in which the substrate holder 151 is divided, and extends in a direction parallel to the extending direction of the two arm portions of the substrate holder 151. The substrate holder 151 is rotatable about the support member 152 as a center of rotation. The substrate holder 151 is controlled by the control device 120 based on the rotation of the support member 152.

The ultraviolet irradiation device 160 includes a support member 161 and an ultraviolet light source 162. The support member 161 extends, for example, in a direction parallel to the extending direction of the support member 152 of the substrate inverting device 150. The ultraviolet light source 162 is composed of, for example, a lamp or an LED and emits light of a wavelength in the ultraviolet region. The ultraviolet light source 162 can emit ultraviolet light at an output higher than the ultraviolet light sources 147a ₅ to 147a ₉ (Fig. 21A) included in the nozzle unit 147a (Fig. 21A). The wavelength of the ultraviolet light may be set to be equal to or different from the wavelength of the ultraviolet light emitted from the ultraviolet light sources 147a ₅ to 147a _{9 of the} nozzle unit.

The ultraviolet light source 162 is supported by the support member 161 in such a manner as to be movable in the extending direction thereof. The ultraviolet light from the ultraviolet light source 162 and the ultraviolet light source 162 are controlled to move along the support member 161 by the control device 120.

As shown in Fig. 22B, in the inspection film formation station 103 (Fig. 18), the substrate 124 on which the film pattern is formed on the surface is transported to the substrate inversion station 104 by the lifter 112. The substrate 124 is directly placed on the substrate holder 151 by the lifter 112 so that, for example, the surface of the substrate 124 (the surface on which the thin film pattern is formed) faces upward (the positive direction of the Z axis). The substrate holder 151 fixes the holding substrate 124 by suction, pressing, clamping, or the like. That is, the substrate The 124 is held so as not to move relative to the substrate holder 151. The substrate 124 is controlled by the control device 120 based on the fixed holding of the substrate holder 151 and its release.

As shown in Fig. 22C, the ultraviolet light source 162 is moved along the support member 161 while emitting ultraviolet light from the ultraviolet light source 162. The substrate inverting device 150 and the ultraviolet irradiation device 160 are disposed such that when the ultraviolet light source 162 is moved along the supporting member 161, the ultraviolet light source 162 is held by the substrate 124 of the substrate holder 151, and the ultraviolet light emitted from the ultraviolet light source 162 is at least A thin film pattern forming region, such as the entire surface of the substrate 124, is irradiated onto the substrate 124. The ultraviolet light emitted from the ultraviolet light source 162 is irradiated onto the entire surface of the substrate 124, for example, at an energy density of 1000 mJ/cm ² . The solidification of the film pattern formed on the surface of the substrate 124 is performed by irradiation of ultraviolet light. The film pattern of the surface of the substrate 124 is cured to its inside by formal curing. In the formal curing, the ultraviolet light is irradiated onto the substrate 124 with a stronger energy density in the temporary curing. Further, the surface layer portion of the film pattern was cured by the temporary curing performed in the inspection film formation station 103, but the inside of the film pattern was not cured. The film material can be prevented from expanding in the in-plane direction by curing the surface layer portion.

As shown in FIG. 22D, after the ultraviolet light is irradiated to formally cure the film pattern on the surface of the substrate 124, the substrate holder 151 is rotated by 180° with the support member 152 as a center of rotation. Thereby, the front and back of the substrate 124 held by the substrate holder 151 are reversed. The substrate 124 which is reversed in the table is directly conveyed to the alignment station 105 by the lifter 113 in a state where the surface is reversed, and then transported to the inspection film forming station 106. In the delivery based on the lifter 113 Before, the release substrate 124 is held based on the substrate holder 151.

The structure of the substrate holder 151 will be described with reference to FIGS. 23A to 23F. 23A, 23C, and 23E show a schematic plan view of the substrate holder 151, and FIG. 23B, FIG. 23D, and FIG. 23F show a schematic front view of the substrate holder 151.

In the configuration example shown in FIGS. 23A and 23B, the substrate holder 151 is provided with a vacuum suction pad 153 on the surface of the two arms. FIGS. 23A and 23B show an example in which a plurality of vacuum suction pads 153 are formed on the surfaces of the two arms. The lifter 112 (Fig. 18) transports the substrate 124 and is placed on the surface on which the vacuum adsorption pad 153 is formed. The substrate 124 is adsorbed and held by the substrate holder 151 by the attraction force from the vacuum adsorption pad 153.

In the configuration example shown in FIGS. 23C and 23D, the substrate holder 151 has the pressing roller 154 disposed along each of the two arms. After the lifter 112 places the substrate 124 on the substrate holder 151, the pressing roller 154 moves toward the edge of the substrate 124. The substrate 124 is held by the substrate holder 151 by the edge of the substrate 124 being pressed by the pressing roller 154.

In the configuration example shown in FIGS. 23E and 23F, the substrate holder 151 is provided with a jig mechanism 155. The jig mechanism 155 shown in Figs. 23A and 23F has a erected portion along the longitudinal direction of the two arm portions of the substrate holder 151. The end portion of the substrate 124 placed on the substrate holder 151 is fixed by a portion (the jig head) of the erected portion being inverted to the inner side (for example, bent by 90).

The substrate holder 151 shown in FIGS. 23A to 23D is sucked by suction A portion of the substrate 124 in which the thin film pattern is not formed is attached, pressed, and sandwiched to fix the holding substrate 124.

In the above example, after the ultraviolet light is used to form the thin film pattern on the surface of the substrate 124, the substrate holder 151 is rotated and the front and back of the substrate 124 are reversed. In the other order, after the front and back of the substrate 124 are reversed, the surface of the substrate 124 is irradiated with ultraviolet light from the negative side of the Z-axis to be formally cured. Further, the main curing by the ultraviolet light irradiation and the front and back rotation of the substrate 124 based on the rotation of the substrate holder 151 can be simultaneously performed in parallel. At this time, for example, in order to irradiate the surface of the rotating substrate 124 with ultraviolet light having a predetermined intensity, the ultraviolet light source 162 is rotated in synchronization with the rotation of the substrate 124. The processing time in the substrate inversion station 104 can be shortened by performing the main curing during the inversion table.

The substrate 124 on which the film pattern of the surface is completely cured and the front surface is reversed is transported to the alignment station 105 by the lifter 113 (Fig. 18).

The alignment station 105 has the same structure and function as the alignment station 102. The alignment mark formed on the back surface of the substrate 124 is detected by a CCD camera and θ correction is performed. Further, the size of the substrate 124 on which the thin film pattern is formed on the surface is measured from the image data, and control information for re-forming the thin film pattern on the back surface of the substrate 124 is generated.

The lifter 113 conveys the direction of the substrate 124 in the direction in which the substrate is in the in-plane direction by the rotation of the θ stage included in the alignment station 105, and transports it to the stage of the inspection film formation station 106.

The inspection film formation station 106 has the same structure and function as the inspection film formation station 103. Checking the control data for the back surface of the film forming station 106 on the substrate 124 The back side forms a film pattern.

In addition, the control data for the back surface can be created based on the image data acquired in the alignment station 102. At this time, the image data acquired in the alignment station 105 is used, for example, only for θ correction.

Since the θ correction of the substrate 124 is performed at the alignment station 105, it is not necessary to perform θ correction in the inspection film formation station 106. Therefore, it is not necessary to form a thin film pattern on the back surface with respect to the alignment with the substrate 124 transported to the inspection film forming station 106. Therefore, it is possible to shorten the processing time in the inspection film forming station 106, and it is even possible to shorten the intermittent time and improve the production efficiency.

The substrates 121 to 127 are formed on the back surface and then transported to the conveyor belt 116 by the lifter 114 (Fig. 18). Thereafter, the substrates 121 to 127 are carried out from the outlet 107 to the outside of the casing 118 by the conveyor belt 116. In the state of being placed on the conveyor belt 116, the entire back surface of the substrates 121 to 127 is irradiated with ultraviolet rays by the ultraviolet irradiation device 108, and the film pattern formed on the back surfaces of the substrates 121 to 127 is completely cured. The ultraviolet irradiation device 108 can move in the casing 118 so as to be placed above the substrates 121 to 127 placed on the conveyor belt 116. The ultraviolet irradiation device 108 irradiates the back surfaces of the substrates 121 to 127 with ultraviolet rays while passing over the substrates 121 to 127. Alternatively, the ultraviolet irradiation device 108 may be fixedly disposed in the casing 118, and for example, the substrates 121 to 127 may be moved below the ultraviolet irradiation device 108 by the conveyor belt 116. When the substrates 121 to 127 pass under the ultraviolet irradiation device 108, ultraviolet irradiation to the substrates 121 to 127 is performed. The ultraviolet irradiation to the substrates 121 to 127 is controlled by the control device 120.

In the film forming apparatus 171, the film formation apparatus 171 finishes the formation of the thin film pattern on the surface of the substrate 124 in the inspection film formation station 103 until the substrate 124 is placed on the stage of the inspection film formation station 106, in the substrate inversion station 104. The film pattern formed on the surface of the substrate 124 is formally cured. The film pattern formed on the surface of the substrate 124 in the film forming station 103 is inspected and solidified at the substrate inversion station 104 without coming into contact with any portion.

Since the substrate 124 which has not been substantially cured does not completely cure the inner region of the film pattern, adhesiveness (stickiness) is generated. When the thin film pattern on the back surface of the substrate 124 is formed in a state where the thin film pattern on the surface of the substrate 124 is not formed, the thin film pattern is formed on the back surface of the substrate 124, for example, when the substrate 124 is processed based on the lifter 113 or in the inspection film forming station 106. At the time, there are sometimes scratches and the like on the film pattern of the surface. Further, there are cases where defects occur in various processes due to adhesion.

After the film pattern is formed on the surface of the substrate 124 and the substrate 124 is placed on the stage of the inspection film formation station 106, the film pattern formed on the surface of the substrate 124 is completely cured, whereby the surface of the substrate 124 can be prevented. There are scratches on the film pattern. Therefore, a high quality film pattern can be formed.

Further, since the film pattern on the back surface of the substrate 124 is completely cured by the ultraviolet rays radiated from the ultraviolet irradiation device 108, it is possible to prevent the film pattern from being left on the back surface of the substrate 124 after being carried out to the outside of the casing 118.

Referring to Figs. 24A to 24G, the inspection function of the droplet discharge device 170 disposed at the inspection film formation station 103 and the inspection film formation station 106 is performed. Line description. The droplet discharge device 170 according to the third embodiment has not only a film forming function but also an inspection function for checking whether or not the discharge of droplets from the nozzle holes is appropriately performed.

A perspective view of a portion of the droplet discharge device 170 according to the third embodiment is shown in Fig. 24A. The droplet discharge device 170 according to the third embodiment includes a discharge portion 180 that discharges droplets of the film material toward the substrates 121 to 127, and an inspection portion 181 that is disposed on the positive side of the X-axis of the discharge portion 180. The inspection unit 181 includes, for example, a frame 182 having the same structure as the frame 142 of the discharge unit 180. That is, the frame 182 is composed of two pillars that are fixed to the base 141 in the Z-axis direction and a beam that is spanned between the two pillars along the Y-axis direction. The wire sensor 167 is supported on the beam of the frame 182, for example, in opposition to the moving stage. The line sensor 167 can be guided in the Y-axis direction by the guide and moved in the Y-axis direction by the linear motor.

The line sensor 167 includes 7500 light emitting diodes arranged in a direction, for example, 35 mm. The substrates 121 to 127 held by the light-emitting diode 145 are photographed (detected) by the line sensor 167. In the line sensor 167, the arrangement direction of the light emitting diodes is parallel to the X-axis direction. The line sensor 167 is controlled by the control device 120. Therefore, the shooting based on the line sensor 167 or the movement of the line sensor 167 is accepted by the instruction of the control device 120.

After the film material is applied to the substrates 121 to 127 by the discharge unit 180, the substrates 121 to 127 are moved to the inspection unit 181 by the X stage 144 while being held by the chuck plate 145. The positions of the discharge unit 180 and the inspection unit 181, for example, the nozzle units 147a to 147f and the line sexy The position of the detector 167 in the X-axis direction is stored in the memory device 120a, and the control device 120 moves the substrates 121 to 127 to the inspection unit 181 in accordance with the position data of the inspection unit 181 stored in the memory device 120a. FIG. 24A shows a substrate 123 that is moved to the lower side of the frame 182 of the inspection portion 181 by moving the stage.

When the substrate 123 moves to the inspection portion 181, the discharge result (landing mark) of the film material in the discharge portion 180 is inspected. When the inspection of the discharge result is, for example, the occurrence of clogging in the nozzle hole and the occurrence of a defect in the coating hole, it is necessary to repair the substrate 123 and store the missing portion of the substrate 123 in the memory device 120a. Further, the control device 120 notifies the operator of the film forming device that the nozzle hole is blocked. Thereby, it is possible to perform maintenance for eliminating clogging of the nozzle holes before applying the film material to the substrate 122 to be processed.

As an example, the line sensor 167 picks up a thin film pattern (coating result) formed on the substrate 123 while moving over the substrate 123 in the Y-axis direction, and transmits the captured image data to the control device 120. The control device 120 detects, for example, the edge of the circular pattern or the line missing without applying the coating of the film material, and memorizes the detection result in the memory device 120a. The quality of the thin film pattern formed on the substrate 123 can be determined by the memory data (qualification determination), and the data can be used later when the repair process is performed.

[Example 4]

Next, the fourth embodiment will be described. The following does not correspond to the embodiment 3 The same points will be described, and the description of the same structures will be omitted. The result of the formation of the thin film pattern on the substrates 121 to 127 can be detected as in the above-described third embodiment, but there is also a method of detecting the clogging of the nozzle holes. In the fourth embodiment, for example, whether or not the discharge of the liquid droplets from the nozzle holes is appropriately performed is performed by the inspection plate.

A plan view of the inspection plate 128 is shown in Fig. 24B. The inspection plate 128 includes, for example, an epoxy resin film and a copper foil formed on the surface thereof, and has a planar shape that is long in one direction. The length of the inspection plate 128 in the longitudinal direction is, for example, about 550 mm, and the width is, for example, ten or more mm. It is also possible to form the inspection sheet 128 only from the copper foil without using an epoxy resin film.

The inspection sheet 128 is adsorbed and held by the chuck plate 145 such that the copper foil forming surface faces upward (the Z-axis positive direction), for example, so that the longitudinal direction is parallel to the Y-axis direction. The position of the holding inspection plate 128 on the stage is below the nozzle units 147a to 147f.

The control device 120 drives the X stage 144, and simultaneously ejects all the nozzle holes from the nozzle units 147a to 147f toward the inspection plate 128 while moving the inspection plate 128 in the X-axis direction, for example, in the negative direction of the X-axis (checking Use the instructions to spit out the film material. The film material is continuously discharged while, for example, the inspection plate 128 is moved by 1 mm in the negative direction of the X-axis.

In Fig. 24B, the pattern (landing mark) of the film material attached to the inspection plate 128 is indicated by a short solid line. The left side of the drawing is a trace of the film material discharged from the nozzle hole of the nozzle unit 147a, and the right side of the drawing is a trace of the film material discharged from the nozzle hole of the nozzle unit 147f. Omission is made in the middle and is discharged from the nozzle holes of the nozzle units 147b to 147e A description of the traces of the film material.

A linear landing mark having a length of 1 mm in the X-axis direction is formed by, for example, a film material discharged from a normal nozzle hole blocked by a nozzle hole. The landing marks are distributed corresponding to the arrangement of the nozzle holes shown in FIG. 21B. In other words, each of the nozzle units 147a to 147f is formed with eight columns in which the landing marks of the plurality of landing marks are arranged at equal intervals in the Y-axis direction. The eight columns of the landing marks are arranged in the X-axis direction.

A plan view of the inspection plate 128 adsorbed and held on the chuck plate 145 is shown in Fig. 24C. The inspection plate 128 having the falling marks is moved in the negative direction of the X-axis in the inspection film formation station 103 and the inspection film formation station 106 by the driving of the X stage 144 while being adsorbed and held by the chuck plate 145. Inspection unit 181. The moving inspection plate 128 is shown in parentheses in Fig. 24C.

The inspection plate 128 is aligned with the line sensor 167 with respect to the X-axis direction. The inspection plate 128 is disposed below the position at which the line sensor 167 can be moved by the X stage 144.

As shown in Fig. 24D, the line sensor 167 is in the Y-axis direction and the negative direction of the Y-axis in the example shown in the figure, including one end from the longitudinal direction of the inspection plate 128 to the other. The surface of the copper foil of the inspection plate 128 is photographed while moving at a constant speed within the range of one end. Thereby, image data including the traces of the film material is obtained.

As shown in Fig. 24E, the line sensor 167 photographs the entire surface of the copper foil which can form at least the range of the inspection landing mark, for example, the inspection plate 128. All traces along the Y-axis are scanned by 1 sweep Describe unified detection.

Further, the inspection plate 128 does not have to be kept so that its longitudinal direction is accurately parallel to the Y-axis direction, and it is not necessary to keep the moving direction of the line-shaped sensor 167 accurately parallel to the Y-axis direction. However, it is preferable that the longitudinal direction of each of the linear landing marks is orthogonal to the moving direction of the line sensor 167. This makes it possible to shorten the width (35 mm in this example) that can be taken based on the line sensor 167. Further, even when more than the nozzle unit of the third embodiment is mounted, regardless of the number of nozzle units, the landing trace can be imaged by one scan of the one line sensor 167.

Further, in this example, the wire sensor 167 is moved in the negative direction of the Y-axis, but the inspection plate 128 may be moved in the positive direction of the Y-axis by the Y stage 143. The line sensor 167 may be moved relative to the inspection plate 128 (or the stage holding the inspection plate 128) so as to be capable of capturing a range of the inspection plate 128 capable of forming a linear landing mark having a length of 1 mm.

Further, in this example, the wire sensor 167 is disposed on the positive side of the X-axis of the frame 142, but the wire sensor 167 can be held on the frame 142 so as to be movable in the Y-axis direction.

The image data taken by the line sensor 167 is sent to the control device 120.

The control device 120 determines whether or not the droplets are appropriately ejected from the nozzle holes of the nozzle units 147a to 147f based on the image data (detection result) acquired by the line sensor 167, specifically, the landing marks on the inspection plate 128. Spit (for example, detecting poor discharge). As an example, the test is not in response The position where the landing mark is formed detects the presence of the landing mark (the omission of the landing mark) or the case where the landing mark passes (there is no sufficient landing mark). A nozzle hole that is considered to be defective by detecting these defective positions. The control device 120 notifies the user that the nozzle hole for discharging the liquid droplet is not properly performed. As a cause of poor discharge, for example, it is considered that the nozzle holes are clogged.

The user who receives the notification can perform measures such as improving the nozzle hole clogging according to the notification content or the user side.

In this example, the stage is not moved in the Y-axis direction (the relative position of the head and the stage is not changed in the Y-axis direction), and only a film material of a predetermined length is continuously applied in the X-axis direction, for example, only 1 mm is applied. . In the Y-axis direction, since the landing marks from the plurality of nozzle holes are not overlapped with each other and are disposed at a certain distance from each other, the clogging of the nozzle holes can be detected with high accuracy. For example, when the nozzle hole is clogged, since 1 mm of the landing mark is not formed, it is possible to easily clarify which nozzle hole is clogged.

Further, the film material is not applied in a line shape, but may be applied so that the landing marks are in a dot shape. However, the thickness of the wire can be detected by linear coating. When the landing mark is thinner than the normal width, it can be determined that the nozzle hole is not completely blocked, but partial clogging occurs, and the discharge amount of the film material is reduced. The control device 120 can determine, for example, that the discharge defect is compared with the threshold value and is smaller than the threshold value.

When n adjacent, for example, two or three nozzle holes are defective, a thin film pattern is formed on the substrates 121 to 127 without improving the nozzle hole clogging, and since the pixels of the film material are not connected, the first 24, shown in Figure F, results in the formation of grooves in the film pattern. Such a substrate 121~127 It can also be set as a specification without satisfying the quality of the product. Further, when two or more adjacent nozzle holes are defective, a notification method based on the control device 120 can be specifically set.

On the premise of the control by the control device 120, the inspection of the fourth embodiment is performed every time the processing for forming a thin film pattern on a 100-piece substrate, for example, is completed. It may be carried out in batches or before starting the process of forming a film pattern on one substrate.

According to the determination result of the inspection method according to the fourth embodiment, it is possible to take measures for appropriately discharging the liquid droplets from the respective nozzle holes. Therefore, according to the droplet discharge device of the fourth embodiment, it is possible to check whether or not the droplet discharge is good with high efficiency with a simple configuration, and to perform high-quality film pattern formation.

[Example 5]

Next, the fifth embodiment will be described. Hereinafter, differences from the fourth embodiment will be described, and the description of the same configurations will be omitted. In the fourth embodiment, it is determined whether or not the discharge of the liquid droplets from the nozzle holes is good by the inspection plate 128. However, the inspection of the nozzle hole clogging may be performed by the substrate on which the thin film pattern is formed.

As shown in Fig. 24G, the thin film pattern forming region 129a and the inspection region 129b are provided on the substrate 129 on which the thin film pattern is formed. The thin film pattern is formed in the thin film pattern formation region 129a. In the example shown in Fig. 24G, 20 thin film pattern formation regions 129a are divided in five rows and four columns on the substrate 129. The length of each of the thin film pattern formation regions 129a in the Y-axis direction is, for example, about 30 mm. The inspection region 129b is divided into the X-axis direction of the substrate 129 The end. The planar shape of the inspection region 129b is, for example, a rectangle, and the dimensions in the Y-axis direction and the X-axis direction are ten mm and about 30 mm, respectively.

In the film pattern forming region 129a shown in FIG. 24, for example, the number of nozzle units is not six, but one, and the droplet discharge device having only the nozzle unit 147a as an example forms a thin film pattern. The substrate 129 is retracted once in the X-axis direction, and the thin film material is discharged toward the substrate 129, and a thin film pattern is formed in the five thin film pattern forming regions 129a in the left end row. After the substrate 129 is moved about 30 mm in the positive direction of the Y-axis, the substrate 129 is retracted once in the X-axis direction, and the film material is discharged toward the substrate 129 to form a thin film pattern in the thin film pattern formation region 129a from the left second column. By repeating these operations, a film pattern is formed in all of the film pattern forming regions 129a.

Before the film material is applied to the film pattern forming region 129a, the film material is discharged from the nozzle holes of the nozzle unit 147a to the inspection region 129b. When the substrate is moved in the X-axis direction, the film material is discharged, and the same landing marks as the landing marks formed in the fourth embodiment shown in Fig. 24B are formed. Thereafter, in the same manner as in the fourth embodiment, it is determined whether or not the discharge of the liquid droplets from the nozzle holes is good by one scan of the line sensor 167 in the Y-axis direction.

Alternatively, after the film material is discharged into the inspection region 129b, the film pattern can be formed in the film pattern formation region 129a without performing inspection for whether or not the droplet discharge is good. At this time, the film material discharged to the inspection region 129b is used for history management of each substrate. That is, the landing traces can be detected by the line sensor 167 as needed, and used for thinning of the substrate 129. Evaluation of the film pattern.

When the inspection region 129b is provided on the substrate 129 and the landing marks in the inspection region 129b are detected, the position of the inspection region 129b on the substrate 129 is memorized in the memory device 120a. The control device 120 controls the substrate 129 to discharge the film material in the inspection region 129b based on the movement of the moving stage and the discharge of the film material from the head according to the position data stored in the inspection area 129b of the memory device 120a. Thereafter, the substrate 129 is moved below the line sensor 167, and the landing marks of the film material formed in the inspection region 129b are detected.

Since the inspection region 129b is provided on the surface of the substrate 129 on which the thin film pattern is formed, the inspection plate 128 is not required. Therefore, the cost performance can be improved.

In addition, the line sensor 167 can be provided in a range in which the stage of the thin film pattern is formed in the thin film pattern forming region 129a in the X-axis direction. At this time, the inspection portion 181 (FIG. 24A) is not required, and the installation area (coverage area) of the film forming apparatus can be reduced. Further, since the time for inspection by moving the substrate 129 to the inspection unit 181 can be reduced, the production efficiency can be further improved.

In the fifth embodiment, the droplet discharge device having the number of nozzle units is one. However, even when the droplet discharge device having six nozzle units is used, the inspection can be performed in the same order.

[Embodiment 6]

Next, the sixth embodiment will be described. Hereinafter, differences from the third embodiment will be described, and the description of the same configurations will be omitted. Also able to get from the nozzle The holes eject the film material and detect the marks of the formation that are formed to correct the relative position between the nozzles or between the nozzle units.

Fig. 25A is a schematic view showing a landing mark (#1) and a landing mark (#2) of the film material discharged from the nozzle holes of the head #1 and the head #2. Inside each of the rectangles drawn by the broken lines, the two rows of landing marks extend in the Y-axis direction. In Fig. 25B, the landing trace (#1) and the landing trace (#2) of the film material from the head #1 and the head #2 are shown enlarged. The landing marks of the respective film materials have, for example, a linear shape having a length of 1 mm in the X-axis direction. The landing trace (#1) and the landing trace (#2) of the film material from the head #1 and the head #2 are detected by, for example, one scan of the line sensor 167 in the Y-axis direction.

The control device 120 calculates, for example, the left upper landing mark of the landing mark (#1) from the image data acquired by the line sensor 167 (the landing mark of the film material on the negative side of the Y-axis which is the most positive side of the X-axis) The distance in the X-axis direction from the left upper landing mark of the landing mark (#2). Then, the distance in the X-axis direction between the right lower landing mark of the landing mark (#1) and the right lower landing mark of the landing mark (#2) is calculated. Calculate the average value of these distances l _ΔX .

In the manufacture of the nozzle unit, for example, the head #1 and the head #2 are assembled to the nozzle holder so that the distance (arrangement interval) between them in the X-axis direction is 20 μm. During assembly, the staff carefully adjusts the position while measuring the distance between the assembly position of the nozzle and the plurality of nozzles. Therefore, it takes a long working time.

In the sixth embodiment, after assembling the head #1 and the head #2, the edge X between the head #1 and the head #2 can be obtained from the average value l _ΔX and the size of the head #1 and the head #2 in the X-axis direction. Distance in the direction of the axis (configuration interval). Therefore, it is possible to correct the deviation between the head #1 and the head #2 in accordance with the discharge result without actually measuring the distance between the head #1 and the head #2. Therefore, for example, the time for assembling the head can be shortened.

The positional deviation in the Y-axis direction can also be corrected in the same manner. The head #1 and the head #2 are assembled to the nozzle holder, for example, so as to be shifted by only 20 μm in the Y-axis direction. Thereby, the distance in the Y-axis direction between the upper left point of the landing mark (#1) and the upper left point of the landing mark (#2) and the lower right point and the landing mark (#2) of the landing mark (#1) are calculated. The distance along the Y-axis between the lower right points. Calculate the average value of these distances l _ΔY . As an example, when the average value l _ΔY is 21 μm, the assembly deviation in the Y-axis direction between the head #1 and the head #2 may be reduced by only 1 μm.

Further, with respect to the deviation in the X-axis direction, the assembly position of the head can be adjusted, but it is also possible to correct the amount of deviation by controlling the discharge timing of the film material from the nozzle holes. Therefore, for example, the calculated average value l _ΔX or the distance (arrangement interval) in the X-axis direction between the head #1 and the head #2 can be memorized in the memory device 120a.

[Embodiment 7]

Next, a description will be given of the seventh embodiment. Differences from the sixth embodiment will be described below, and the description of the same configurations will be omitted.

The coating result of the film material is shown in Fig. 25C. In Figure 25, the solid line shows the trace of the film material from the nozzle hole, with a dotted line The reference position of the landing of the film material is displayed. The landing marks of the film material (in this case, for example, the discharge start points from the respective nozzle holes) are detected by one scan of the line sensor 167 in the Y-axis direction.

By detecting, for example, the deviation from the reference position of the landing marks of the plurality of film materials (deviation ΔX in the X-axis direction, deviation ΔY in the Y-axis direction), it is possible to detect the deviation in the θ direction in the assembly of the head ( △ θ ).

Further, a plurality of nozzle holes are formed in the head before being assembled in the nozzle holder, but in the manufacturing process of forming the nozzle holes in the head, slight deviation may occur at the position at which the nozzle holes are formed. At this time, the overall average value is calculated from the coating result with respect to, for example, N landing marks. The assembly of the correction head is rotated in the θ direction to minimize the average value. Alternatively, it is possible to control the discharge timing of the film material from the nozzle holes to obtain the same effect.

It is also possible to correct the deviation of the relative position in the θ direction between the heads.

[Embodiment 8]

Fig. 26 is a schematic view showing a film forming apparatus 172 according to the eighth embodiment. Hereinafter, differences from the third embodiment will be described, and the description of the same configurations will be omitted. In the film forming apparatus 172, the alignment station 102 and the alignment station 105 do not include an alignment device that performs θ correction, and the film deposition station 103 and the droplet discharge device that inspects the film formation station 106 include the θ stage 149 and the CCD. Cameras 163~166.

The alignment station 102 of the film forming apparatus 172 and the alignment station 105 are disposed as a temporary placement stage 148 as an alignment means for performing simple alignment without θ correction. The substrates 121 to 127 are placed on the temporary positioning table 148 of the alignment station 102 and the alignment station 105 by the lifter 111 and the lifter 113, and are simply aligned with the pressing force of the fixing pin, etc., and then transported to the inspection. The membrane station 103 checks the film formation station 106.

The droplet discharge device that inspects the film formation station 103 and inspects the film formation station 106 includes, for example, a θ stage 149 between the X stage 144 and the chuck plate 145. The θ stage 149 is rotatable and held by the substrates 121 to 127 of the chuck plate 145 around the rotation axis parallel to the Z axis in a plane parallel to the XY plane. Further, the droplet discharge device includes CCD cameras 163 to 166 that detect alignment marks formed on the front surface of the substrates 121 to 127.

The substrates 121 to 127 which are transported to the inspection film formation station 103 and the inspection film formation station 106 are adsorbed and held by the chuck plate 145, and the alignment marks on the inside of the watch are detected by the CCD cameras 163 to 166. The detection result (photographed image data) is sent to the control device 120.

The control device 120 processes the detection result, and calculates the position of the substrates 121 to 127 and the posture (direction) in the in-plane direction of the substrate. Thereafter, the posture of the substrates 121 to 127 in the in-plane direction of the substrate is corrected ( θ- corrected) by, for example, driving the θ stage 149. Further, the control device 120 calculates the sizes of the substrates 121 to 127 based on the detection results of the CCD cameras 163 to 166. Control data for forming the film material is generated based on the calculated dimensions.

A thin film forming apparatus 172, 102 is not in alignment station, an alignment station 105 for correcting θ substrate 121 to 127, but 103, forming station 106 checks θ stage 149 using the substrate 121 to 127 for forming the inspection station θ correction. Thereafter, a thin film pattern is formed on the substrates 121 to 127 in accordance with the generated control data.

Further, in the eighth embodiment, for example, after the completion of the substrate processing of the predetermined number of sheets, the line sensor 167 can be used to check whether or not the discharge of the liquid droplets from the nozzle holes of the nozzle units 147a to 147f is appropriately performed.

In the eighth embodiment, after the film formation station 103 is formed on the substrates 121 to 127, the substrate is reversed during the inspection of the substrate 121 to 127 in which the substrate of the film formation station 106 is inverted. In the transfer station 104, the film patterns formed on the surfaces of the substrates 121 to 127 are formally cured. Thereby, it is possible to prevent the film pattern in which the scratches are attached to the surfaces of the substrates 121 to 127. Therefore, a high quality film pattern can be formed.

Further, since the thin film pattern on the back surfaces of the substrates 121 to 127 is completely cured by the ultraviolet rays emitted from the ultraviolet irradiation device 108, it is possible to prevent the scratches from being attached to the outer surface of the casing 118, and the flaws are attached to the back surface film patterns of the substrates 121 to 127.

Further, in the film forming apparatus according to the eighth embodiment, as in the third embodiment, it is possible to effectively check whether or not the discharge of the liquid droplets from the nozzle holes of the nozzle units 147a to 147f has been appropriately performed with a simple structure, and to form a high quality. Film pattern.

[Embodiment 9]

Fig. 27 is a schematic view showing a film forming apparatus 173 based on Embodiment 9. Differences from the third embodiment will be described below, and the description of the same configurations will be omitted. The thin film forming device 173 does not include the substrate inversion station 104 The alignment station 105, the film formation station 106, the lifter 112, and the lifter 113 are different from the film forming apparatus 171 according to the third embodiment. The thin film forming apparatus 171 and the thin film forming apparatus 172 of the third embodiment and the eighth embodiment can form a thin film pattern on both surfaces of the substrates 121 to 127. However, the thin film forming apparatus 173 according to the ninth embodiment has only one side of the substrates 121 to 124. For example, the surface forms a thin film pattern.

In the film forming apparatus 173 based on Embodiment 9, processing is performed in parallel in the alignment station 102 and the inspection film forming station 103. That is, the alignment mark 102 performs the detection of the alignment mark formed on the surface of the substrate 122 and the alignment of the substrate 122. During this period, the film formation station 103 is inspected to form a thin film pattern on the surface of the substrate 123. During this period, for example, the conveyor belt 115 carries the substrate 121 on which the thin film pattern is not formed into the casing 118. The substrate 124 on which the film pattern formation of the surface is completed is transported to the conveyor belt 116 by the lifter 114. In a state where the substrate 124 is placed on the conveyor belt 116, the film pattern formed on the surface of the substrate 124 is officially cured by the ultraviolet rays emitted from the ultraviolet irradiation device 108. Thereafter, the substrate 124 of the conveyor belt 116 is carried out from the delivery port 107 to the outside of the casing 118.

In the ninth embodiment, the liquid droplet discharging device accommodated in the inspection film forming station 103 can effectively check whether or not the discharge of the liquid droplets from the nozzle holes of the nozzle units 147a to 147f is appropriately performed with a simple configuration, and the formation is high. Quality film pattern.

The invention has been described above by way of examples, but the invention is not limited to the embodiments. It will be understood by those skilled in the art that various modifications, improvements, combinations, etc. can be made.

For example, in the embodiment, the movement of the substrate relative to the nozzle unit (movement in the XY plane) is performed only by the stage. As another configuration example, for example, the frame can be moved in the X-axis direction, and the nozzle unit can be moved in the Y-axis direction and the Z-axis direction with respect to the frame. The nozzle unit may be moved relative to the substrate. However, the structure in which only the substrate is moved in the XY plane can form a thin film pattern with higher precision than the structure in which the nozzle unit is moved in the XY plane direction.

Further, in the embodiment, the thin film pattern composed of the solder resist is formed on the printed wiring board, but the thin film forming apparatus according to the above embodiment can be utilized for forming an insulating film on the glass substrate in the manufacture of, for example, a touch panel. In use.

Further, in the embodiment, the detection of the landing marks of the film material is performed using one line sensor, but a plurality of line sensors may be arranged along the X-axis direction and detected so that the arrangement direction of the light-emitting diodes becomes X-axis direction. By using a plurality of line sensors, even when the landing marks are long in the X-axis direction, the detection can be performed in one scan.

20‧‧‧ tablet

21‧‧‧Mobile agencies

22‧‧‧X mobile agency

23‧‧‧Y mobile agency

24‧‧‧θ rotating mechanism

25‧‧‧stage

30‧‧‧ pillar

31‧‧‧ beams

32‧‧‧Photographing device

33‧‧‧Control device

34‧‧‧ memory device

35‧‧‧ Input device

36‧‧‧Output device

37‧‧‧Repair device

38‧‧‧Poor parts

40‧‧‧Nozzle unit

41‧‧‧Nozzle fixture (support member)

42, 42A~42D‧‧‧ nozzle

43‧‧‧Light source

45‧‧‧Nozzle hole

45r‧‧‧The nozzle hole to be the reference

46, 46a, 46b‧‧‧ nozzle column

47‧‧‧Gyrometer

48‧‧‧ Lifting mechanism

50‧‧‧Substrate

51‧‧‧Target pattern area

52‧‧‧Unused area

53‧‧‧film pattern

Image of 55A~55D‧‧‧ nozzle hole

56‧‧‧Imaginary plane perpendicular to the X-axis

60‧‧‧ Design inspection pattern

61‧‧‧Inspected pattern formed

65‧‧‧Nozzle unit support mechanism

66‧‧‧Sensor

67‧‧‧ drive

70‧‧‧ unit scanning area

71‧‧‧Pass area

75‧‧‧A region coated with liquid material

76‧‧‧ openings

77‧‧‧Auxiliary

80‧‧‧Photographing device

81‧‧‧Lighting device

82‧‧‧ Shooting range

101‧‧‧Substrate entrance

102‧‧‧Alignment station

103‧‧‧Check film formation station

104‧‧‧Substrate reversal station

105‧‧‧Alignment station

106‧‧‧Check film formation station

107‧‧‧Substrate removal

111~114‧‧‧ Lifter

115, 116‧‧‧ conveyor belt

118‧‧‧ frame

120‧‧‧Control device

120a‧‧‧ memory device

121~127‧‧‧Substrate

122a~122d‧‧‧ alignment mark

128‧‧‧Check board

129‧‧‧Substrate

129a‧‧‧Film pattern forming area

129b‧‧‧ inspection area

131‧‧‧Base (base)

132‧‧‧X stage

133‧‧‧θ stage

134‧‧‧ chuck plate

135~138‧‧‧CCD camera

141‧‧‧Base

142‧‧‧Frame

142a, 142b‧‧ ‧ pillar

142c‧‧‧beam

143‧‧‧Y stage

144‧‧‧X stage

145‧‧‧ chuck plate

146‧‧‧Connected components

147a~147f‧‧‧Nozzle unit

147a ₁ ~147a ₄ ‧‧‧Spray

147a ₅ ~147a ₉ ‧‧‧UV source

148‧‧‧ Temporary placement

149‧‧‧θ stage

150‧‧‧Substrate reversal device

151‧‧‧Substrate holder

152‧‧‧Support members

153‧‧‧Vacuum suction pad

154‧‧‧Squeeze roller

155‧‧‧Clamping mechanism

160‧‧‧UV irradiation device

161‧‧‧Support members

162‧‧‧UV source

163~166‧‧‧CCD camera

167‧‧‧Line sensor

170‧‧‧Drop ejection device

171, 172, 173‧‧‧ film forming device

180‧‧‧ spit out

181‧‧ ‧ Inspection Department

182‧‧‧Frame

Fig. 1 is a schematic view of a drawing device based on the first embodiment.

Fig. 2A is a perspective view of the nozzle unit, and Fig. 2B is a bottom view of the nozzle unit.

Fig. 3 is a view showing the positional relationship between the nozzle and the nozzle image.

Fig. 4 is a plan view of a substrate on which a thin film pattern is formed.

Fig. 5A is a bottom view of the nozzle unit and the nozzle unit supporting mechanism, and Fig. 5B is a view showing a scanning order of the substrate surface.

Fig. 6A is a bottom view of the nozzle unit and the nozzle unit supporting mechanism in a state in which one nozzle unit is removed, and Fig. 6B is a view showing a scanning sequence of the surface of the substrate in a state in which one nozzle unit is removed.

Fig. 7A is a flow chart of a film pattern forming method based on Example 1.

Fig. 7B is a detailed flowchart of step S4 of Fig. 7A.

Fig. 7C is a detailed flowchart of step S8 of Fig. 7A.

Fig. 8A is a view showing a design inspection pattern, and Fig. 8B is a view showing an example of an inspection pattern actually formed.

Fig. 9A is a plan view of a portion of a normal film pattern, and Fig. 9B is a plan view of a portion of a film pattern which produces a defect.

Fig. 10 is a schematic view showing a film forming apparatus based on Example 2.

Fig. 11 is a perspective view of a stage, an image pickup device, a repairing device, and a head unit of the film forming apparatus of the second embodiment.

Fig. 12A is a plan view of a thin film pattern formed on a substrate, and Fig. 12B is a plan view of a thin film pattern including a defective portion formed on a substrate.

Fig. 13 is a flow chart showing a repair method of the film forming apparatus of the second embodiment.

Figure 14 is a cross-sectional view of the head unit and the photographing device.

Fig. 15 is a view showing the positional relationship of the head unit and the photographing range of the photographing device.

Fig. 16 is a view for explaining a positional relationship between the display nozzle unit and the imaging range of the imaging device based on the adjustment method of the thin film forming apparatus of the other embodiment.

FIG. 17 is a view for explaining a positional relationship between the display nozzle unit and the imaging range of the imaging device based on the adjustment method of the thin film forming apparatus according to the modification of the other embodiment.

Fig. 18 is a schematic view showing a film forming apparatus including a droplet discharge device based on Embodiment 3.

Fig. 19A is a schematic view of an alignment device included in an alignment station, and Fig. 19B and Fig. 19C are plan views of a substrate in an alignment station.

20A and 20B are schematic views of a part of the liquid droplet discharging device included in the film forming station.

Fig. 21A is a schematic view showing a nozzle unit, Fig. 21B is a plan view showing a droplet discharge surface of the nozzle unit, and Fig. 21C is a schematic plan view showing the arrangement of the nozzle unit.

22A to 22D are schematic views of a substrate inverting device and an ultraviolet irradiation device included in a substrate inversion station.

23A, 23C, and 23E are schematic plan views of the substrate holder, and FIG. 23B, FIG. 23D, and FIG. 23F are schematic side views of the substrate holder.

Fig. 24 is a view for explaining an inspection function of the droplet discharge device according to the third embodiment, and Fig. 24B and Fig. 24C are diagrams for explaining an inspection function of the droplet discharge device according to the fourth embodiment. .

Figure 24 to Figure 24F show the ejection of droplets based on Example 4. FIG. 24G is a view for explaining an inspection function of the droplet discharge device according to the fifth embodiment.

Fig. 25A and Fig. 25B are views showing an example of the coating result of the film material of Example 6, and Fig. 25C is a view showing an example of the coating result of the film material of Example 7.

Fig. 26 is a schematic view showing a film forming apparatus based on Example 8.

Fig. 27 is a schematic view showing a film forming apparatus based on Example 9.

Fig. 28A and Fig. 28B are diagrams for explaining an example of the Gerber data correction.

35‧‧‧ Input device

36‧‧‧Output device

33‧‧‧Control device

34‧‧‧ memory device

37‧‧‧Repair device

65‧‧‧Nozzle unit support mechanism

40‧‧‧Nozzle unit

32‧‧‧Photographing device

31‧‧‧ beams

30‧‧‧ pillar

50‧‧‧Substrate

25‧‧‧ Keeping institutions

24‧‧‧ θ rotating mechanism

23‧‧‧Y mobile agency

22‧‧‧X mobile agency

21‧‧‧Mobile agencies

20‧‧‧ tablet

Claims (25)

A film pattern forming apparatus comprising: a carrier, a holding substrate; a nozzle unit, a nozzle hole facing the substrate and provided with a plurality of droplets for discharging a film material to the substrate; and a moving mechanism relative to the nozzle unit Moving the substrate in the in-plane direction of the substrate; the first imaging device detects a thin film pattern formed of a thin film material applied to the substrate; and a control device that causes droplets of the thin film material to pass from the nozzle unit The substrate is ejected, an inspection pattern is formed by a film material adhered to the substrate, image data of the inspection pattern imaged by the first imaging device is acquired, and nozzle holes of the nozzle unit are determined by analyzing the acquired image data. It is preferable that the control device performs control for preventing the nozzle hole which is determined to be defective from ejecting the film material, and discharges the film material from the nozzle hole which is determined to be good, thereby forming a film pattern on the substrate. The thin film pattern forming apparatus according to claim 1, wherein when the thin film pattern is formed on the substrate, the control device moves the substrate so as to be a scan sequence when a nozzle hole that is not determined to be defective is formed. The same scan sequence. A film pattern forming apparatus comprising: a carrier, a holding substrate; a nozzle unit, a nozzle hole facing the substrate and provided with a plurality of droplets for discharging a film material to the substrate; and a moving mechanism relative to the nozzle unit Moving the substrate in the in-plane direction of the substrate; the first imaging device detects a thin film pattern formed of a thin film material applied to the substrate; and a control device that causes droplets of the thin film material to pass from the nozzle unit The substrate is ejected, an inspection pattern is formed by a film material adhered to the substrate, image data of the inspection pattern imaged by the first imaging device is acquired, and nozzle holes of the nozzle unit are determined by analyzing the acquired image data. Whether it is good or not, further comprising: at least one other nozzle unit having the same configuration except the nozzle unit; and a nozzle unit supporting mechanism detachably supporting the plurality of nozzle units, wherein the control device controls the nozzle unit and the moving mechanism In order to use only the spray attached to the aforementioned nozzle unit support mechanism Means the front A target film pattern is formed on the substrate. The film pattern forming apparatus according to claim 3, wherein the moving mechanism has a stroke in which a target film pattern can be formed over the entire area of the substrate by using any one of the plurality of nozzle units. The film pattern forming apparatus according to the third aspect of the invention, wherein the film pattern forming apparatus further includes a repairing device that performs a recovery process of the defective nozzle, and if the number of defective nozzle holes of each of the nozzle units exceeds an allowable value, The control device determines that the nozzle unit is a temporary failure, performs a recovery process using the repair device on the nozzle unit determined to be a temporary failure, and performs the above-described inspection using all of the nozzle units including the nozzle unit after the recovery process. The processing of the pattern further performs processing for acquiring the image data and determining whether the nozzle unit is good or not. The thin film pattern forming apparatus according to the third aspect of the invention, wherein the thin film pattern forming apparatus further includes an input device for inputting an instruction by an operator, wherein the control device includes a memory device for storing the allowable value, and the input device is The allowable value of the input is written to the aforementioned memory device. The film pattern forming device as described in item 3 of the patent application scope In the above-described control device, the number of times of the temporary failure is determined for each of the nozzle units, and if it is determined that the number of temporary failures exceeds the upper limit of the number of failures, an alarm is issued from the output device. A film pattern forming apparatus comprising: a carrier, a holding substrate; a nozzle unit, a nozzle hole facing the substrate and provided with a plurality of droplets for discharging a film material to the substrate; and a moving mechanism relative to the nozzle unit Moving the substrate in the in-plane direction of the substrate; the first imaging device detects a thin film pattern formed of a thin film material applied to the substrate; and a control device that causes droplets of the thin film material to pass from the nozzle unit The substrate is ejected, an inspection pattern is formed by a film material adhered to the substrate, image data of the inspection pattern imaged by the first imaging device is acquired, and nozzle holes of the nozzle unit are determined by analyzing the acquired image data. Whether the surface of the substrate is defined with a target pattern region in which a target thin film pattern is to be formed, and an unused region in which a target thin film pattern is not formed is defined around the target pattern region, and the control device forms the inspection pattern in the unused region. . The film pattern forming apparatus according to the first aspect of the invention, wherein the control device forms the inspection pattern while moving the substrate with respect to the nozzle unit when the inspection pattern is formed. The thin film pattern forming apparatus according to the first aspect of the invention, wherein the thin film pattern forming apparatus further includes a second imaging device that is movable relative to the head and configured to be movable to a position at which the nozzle hole can be imaged . The film pattern forming apparatus according to claim 10, wherein the second imaging device is attached to the stage. The film pattern forming apparatus according to claim 10, wherein the control device controls the movement of the second imaging device, and moves the second imaging device to a position where a suspicious region estimated to have a defective nozzle hole can be captured. . The film pattern forming apparatus according to claim 10, wherein the film pattern forming apparatus further includes an input device operated by an operator, and the operator inputs the position information of the suspicious area from the input device, thereby thereby suspiciously The location information of the area is provided to the aforementioned control device. The film pattern forming device as described in claim 10 of the patent application scope Further, the thin film pattern forming apparatus further includes an output device that displays an image captured by the second imaging device, and the control device displays an image captured by the second imaging device on the output device. The film pattern forming apparatus according to claim 10, wherein the film pattern forming apparatus further includes a repairing device that receives control from the control device and performs a recovery process of the nozzle hole, and inputs the repair from the input device. When the command to execute and the information of the specific defective nozzle hole are processed, the control device controls the repair device to perform the recovery process of the defective nozzle hole. The film pattern forming apparatus according to claim 10, further comprising a repairing device that receives control from the control device and performs a recovery process of a defective nozzle hole, wherein the control device causes the (2) The imaging device moves to a position capable of capturing the suspicious area input from the input device, and performs image analysis of the captured image, and controls the repair device to perform a specific defect according to the image analysis result specific defective nozzle hole Recovery process of nozzle holes. A film pattern forming device comprising: a carrier, a holding substrate; and a nozzle unit, wherein the plurality of nozzle holes are disposed opposite to the substrate and a plurality of droplets of the film material are discharged to the substrate; a moving mechanism that moves the substrate in an in-plane direction of the substrate with respect to the nozzle unit; a first imaging device detects a thin film pattern formed of a thin film material applied to the substrate; and a control device that controls the thin film material The liquid droplets are ejected from the nozzle unit to the substrate, and an inspection pattern is formed by a film material adhered to the substrate, and image data of the inspection pattern imaged by the first imaging device is acquired, and the acquired image data is analyzed. When it is determined whether the nozzle hole of the nozzle unit is good, the control device discharges the droplet of the film material from the nozzle hole while moving the stage in the uniaxial direction, thereby forming the inspection pattern and When the uniaxial direction is orthogonal to the first imaging device, the image data of the inspection pattern is acquired. A film pattern forming method comprising: a process of forming a test pattern composed of a film material on a substrate by discharging a droplet of a film material from a nozzle unit having a plurality of nozzle holes; and determining the nozzle hole by observing the inspection pattern Whether a good process is performed; and when the film material is discharged from the nozzle hole determined to be defective, the film material is discharged from the normal nozzle hole, thereby being on the substrate A process for forming a target film pattern. The method for forming a thin film pattern according to the above aspect of the invention, wherein, in the process of forming the thin film pattern, the thin film pattern is formed while moving the substrate to form a scan sequence when the nozzle hole is not determined to be defective. The same scan sequence. The method for forming a thin film pattern according to the invention of claim 18, wherein, in the process of determining whether the nozzle hole is good, if it is determined that the number of nozzle holes determined to be defective exceeds the allowable value, The nozzle unit is determined to be a temporary failure, and the recovery process of the nozzle unit determined to be a temporary failure is performed, and after the recovery process, the process returns to the process of forming the inspection pattern to form the inspection pattern. The method for forming a thin film pattern according to claim 20, wherein the nozzle unit and at least one other nozzle unit having the same configuration are attached to the nozzle unit supporting mechanism, and in determining whether the nozzle hole is good or not, determining whether or not The nozzle unit that determines that the number of temporary failures exceeds a predetermined value, and when there is a nozzle unit that temporarily recovers a number of times exceeding a predetermined value, the nozzle unit is detached from the nozzle unit support mechanism as a fixed failure nozzle unit. In the process of forming the aforementioned thin film pattern, in the nozzle unit In a state where the fixing mechanism is detached from the fixed failure nozzle unit, a liquid material is discharged from the nozzle hole of the nozzle unit attached to the nozzle unit supporting mechanism to form a target film pattern on the substrate. The method of forming a thin film pattern according to the above aspect of the invention, wherein, in the process of forming the inspection pattern, the substrate is moved in a direction perpendicular to the uniaxial direction while moving the substrate in a uniaxial direction. In the nozzle hole, droplets of the film material are ejected to form the inspection pattern, and in the process of observing the inspection pattern, the inspection pattern is detected while moving the first imaging device relatively in a direction orthogonal to the uniaxial direction. The film pattern forming method according to claim 18, wherein when at least one of the nozzle holes is determined to be defective, the position of the suspicious region including the nozzle hole determined to be defective is estimated, and the second imaging device is moved to a process capable of photographing the position of the suspicious area; a process of photographing the suspicious area by the second imaging device; and a process of specifying a defective nozzle hole according to the captured image. The method for forming a thin film pattern according to claim 23, further comprising: a process of performing the recovery process of the defective nozzle hole or the process of replacing the nozzle according to the image determination. A method of adjusting a thin film forming apparatus, wherein the thin film forming apparatus has: a stage holding a substrate on a holding surface; a plurality of nozzles opposed to a substrate held on the stage and having a plurality of nozzle holes for discharging droplets of the film material toward the substrate; and a moving mechanism One of the stage and the head is moved in a direction parallel to the holding surface with respect to the other, and the imaging device is movable relative to the head and configured to be movable to a position at which the nozzle hole can be imaged. The adjustment method includes: a process of moving the imaging device to a position capable of capturing the position of the head, and capturing at least two of the nozzles; and a process of adjusting a relative position of the plurality of nozzles by capturing an image of the nozzle.