TW201314741A - Thin-film forming method and thin-film forming apparatus - Google Patents

Abstract

The present invention provides a thin-film forming method, which is able to cure the thin-film material deposited on the substrate without incurring the throughput reduction. The thin-film forming method of the present invention comprises the following steps: holding the substrate in the carrier stage; discharging droplets of the photo-curable thin-film material from the nozzle, and landing the thin-film material droplets on the surface of the substrate; irradiating light from the temporary-curing light source on the thin-film material landed on the substrate in order to cure the surface layer portion of the thin-film material; after the droplets landing process and the process of curing the surface layer portion of the thin-film material, moving the substrate out of the carrier stage. The present invention also provides a thin-film forming apparatus having: a nozzle provided with a plurality of droplet orifices for discharging droplets of thin-film material; a carrier stage for holding the substrate at the position opposite to the aforementioned nozzle, so that the substrate can be moved with respect to the aforementioned nozzle in a direction parallel to the substrate surface; a temporary-curing light source is opposed to the substrate held by the carrier stage, so as to irradiate lights on the thin-film material landed on the substrate to thereby cure the surface layer portion of the thin-film material, a transport device to transport the substrate held by the carrier stage to the formal-curing portion; as well as a formal-curing light source to irradiate light on the thin-film material on the surface of the substrate in the formal-curing portion.

Description

Film forming method and film forming device

The present invention relates to a film forming method and a film forming apparatus which discharge droplets of a film material toward a substrate and irradiate and cure the film material adhering to the substrate.

A technique of forming a thin film material, for example, a droplet of a solder resist on a pattern forming surface of a substrate such as a printed wiring board, has been attracting attention. While moving the substrate relative to the head, the droplets are placed on the surface of the printed wiring board in accordance with the image data of the formed thin film pattern. Thereby, a film having a desired pattern can be formed. The manufacturing cost can be reduced as compared with when a thin film pattern is formed by photolithography.

(previous technical literature) (Patent Literature)

Patent Document 1: Japanese Patent Laid-Open Publication No. 2004-104104

When droplets of the photocurable (ultraviolet curable) liquid film material are dropped on the substrate, the droplets are intended to spread in the in-plane direction on the substrate. The penetration caused by the expansion of the droplets causes the positional accuracy of the film pattern to decrease. In order to suppress the expansion of the droplets, it is preferable to rapidly irradiate the light (ultraviolet rays) and cure them. Thereby, it is possible to prevent the substrate from being moved to the next process area The droplets expand during the period. However, if the film material on the substrate is to be completely cured before the substrate is transported, the idle time (time of non-operation) of the head becomes long, resulting in a decrease in the throughput of the entire device.

An object of the present invention is to provide a film forming method and a film forming apparatus capable of curing a film material adhering to a substrate without causing a decrease in throughput.

According to one aspect of the present invention, there is provided a film forming method comprising: holding a substrate on a stage, discharging a droplet of the photocurable film material from the head, and causing the droplet of the film material to land thereon a process for the surface of the substrate; a process for irradiating the film material falling on the substrate with a light source for temporary curing to cure the surface layer portion of the film material; and a process for depositing the droplets and a surface portion of the film material After the curing process, the process of removing the substrate from the stage is performed.

According to another aspect of the present invention, there is provided a film forming apparatus comprising: a head having a plurality of nozzle holes for discharging droplets of a film material; and a stage for holding the substrate opposite to the head Positioning the substrate so as to move parallel to the substrate surface with respect to the head; the temporary curing light source faces the substrate held on the stage, and irradiates the film material on the substrate The light of the strength of the surface layer of the material is solidified; the conveying device transports the substrate held on the stage to the main curing portion; and the light for the main curing In the source forming unit, the film material on the surface of the substrate is irradiated with light having a strength higher than that of the light source emitted from the temporary curing light source.

It is possible to carry out the process of dropping the droplets of the film material independently from the main curing process by performing the temporary curing and the main curing separately. Thereby, it is possible to suppress a decrease in throughput.

[Example 1]

Fig. 1 is a schematic view showing a thin film forming apparatus according to the first embodiment. The film forming apparatus according to the first embodiment is divided into a loading station 21, a first alignment station 22, a first film material discharge station 23, a substrate inversion station 24, a second alignment station 25, and a second film material discharge station 26, and Move out of station 27. Each station is housed in the casing 20.

The linear guide 30 and the four lifters 31 to 34 supported by the linear guide 30 constitute a conveying device. The conveyor transports the substrate 40 from the front end station to the rear station. The substrate 40 is, for example, a printed wiring board in which wiring patterns are formed on both surfaces. The control device 50 moves the lifters 31 to 34 and controls the stations. The xyz orthogonal coordinate system in which the transport direction of the substrate 40 is the positive direction of the x-axis and the vertical upper side is the positive direction of the z-axis is defined.

The loading conveyor 35 carries the substrate 40 into the loading station 21 from the outside of the casing 20 through the loading port 36. The substrate 40 carried in the loading station 21 is The lifter 31 is transported to the first alignment station 22. The alignment mark formed on the upper surface of the substrate 40 is detected in the first alignment station 22, and the posture and strain of the substrate 40 are sensed. The surface facing upward at the time of transport to the first alignment station 22 is referred to as a "first surface", and the surface facing downward is referred to as a "second surface". The substrate 40 that senses the posture and the strain is transported to the first film material discharge station 23 by the lifter 31.

The image material of the thin film pattern formed in the first film material discharge station 23 is caused to land on the first surface of the substrate 40 in accordance with the image data of the thin film pattern formed. Thereby, a film made of a film material is formed on the first surface of the substrate 40. The substrate 40 on which the thin film is formed is transported to the reversing station 24 by the lifter 32.

In the inversion station 24, the film is cured by irradiating ultraviolet rays to the film formed on the surface of the substrate 40. Further, the upper and lower sides of the substrate 40 are reversed. That is, the first surface on which the thin film is formed faces downward, and the second surface on which the thin film is not formed faces upward.

The substrate 40 that is vertically inverted is transported to the second alignment station 25 by the lifter 33. The posture and strain of the substrate 40 are sensed by detecting the alignment mark formed on the second surface of the substrate 40 in the second alignment station 25. The substrate 40 that senses the posture and strain is transported to the second film material discharge station 26 by the lifter 33.

The image material of the thin film pattern formed in the second film material discharge station 26 is caused to land on the second surface of the substrate 40 in accordance with the image data of the thin film pattern formed. Thereby, a thin film made of a thin film material is formed on the second surface of the substrate 40. The substrate 40 on which the thin film is formed on the second surface is transported to the carry-out station 27 by the lifter 34. The carry-out conveyor 37 passes through the carry-out port 38 from the carry-out station 27 to the casing The outside of the 20 is carried out of the substrate 40. While the substrate 40 is being transported by the carry-out conveyor 37, the second surface of the substrate 40 is irradiated with ultraviolet rays from the main curing light source 51. Thereby, the film of the film material formed on the second surface of the substrate 40 is cured.

Fig. 2 is a plan view showing the first alignment station 22, the first film material discharge station 23, and the reversing station 24 of the thin film forming apparatus of the first embodiment. The lifter 31 and the lifter 32 are guided to the linear guide 30 to move in the x direction. The stage 55 is accommodated in the first film material discharge station 23. The stage 55 is guided to the linear guide 56 to move in a direction (y direction) crossing the x direction. The lifter 31 holds the substrate 40 and moves into the first film material discharge station 23, and the substrate 40 is placed on the stage 55. The stage 55 adsorbs the substrate 40.

A head unit 57 is disposed above the path on which the stage 55 moves. The head unit 57 is supported by a support member 58 that passes under the head unit 57. When the stage 55 passes through the lower portion of the head unit 57, droplets of the film material are ejected from the plurality of nozzle holes of the head unit 57 toward the substrate 40 in accordance with the image data of the formed film pattern.

The lifter 32 holds the substrate 40 on which the thin film is formed, and moves from the first film material discharge station 23 to the reversing station 24. The reversing station 60 and the main curing light source 61 are housed in the reversing station 24. The lifter 32 that has moved into the reversing station 24 causes the substrate 40 to be carried on the reversing table 60. The film formed on the substrate 40 is completely cured by irradiating the first surface of the substrate 40 with ultraviolet rays radiated from the main curing light source 61. Thereafter, the vertical rotation of the substrate 40 is reversed by rotating the reversing table 60 by 180°. In the state of upside down, base The plate 40 is conveyed to the second alignment station 25 (Fig. 1) by the lifter 33 (Fig. 1).

A cross-sectional view along the dotted line 3A-3A of Fig. 2 is shown in Fig. 3A. A cross-sectional view taken along the dashed line 3B-3B of Fig. 3A is shown in Fig. 3B. The Y stage 71 is supported on the base 70 by a linear guide 56. The Y stage 71 can be guided to the linear guide 56 to move in the y direction. The stage 55 is supported by the Y stage 71 so as to be movable in the x direction. The substrate 40 is held on the upper surface of the stage 55. The movement of the Y stage 71 in the y direction and the movement of the stage 55 in the x direction are controlled by the control device 50 (Fig. 1).

The head unit 57 is supported above the stage 55 by a support member 58. The head unit 57 faces the substrate 40 held on the stage 55 with a gap therebetween. The nozzle elevating mechanism 59 raises and lowers the head unit 57 with respect to the stage 55. The nozzle elevating mechanism 59 is controlled by a control device 50 (Fig. 1).

A schematic perspective view of the head unit 57 is shown in Fig. 4A. A plurality of (for example, two) heads 65 are assembled to the nozzle holder 64. A plurality of nozzle holes 66 arranged in the x direction are disposed on the head 65, respectively. The control from the control device 50 (Fig. 1) is received, and droplets of the ultraviolet curable thin film material are discharged from the nozzle holes 66. A plurality of heads 65 are arranged in the y direction. In the y direction, a temporary curing light source 68 is disposed on each of both sides of the head 65. The temporary curing light source 68 includes a plurality of light emitting diodes arranged in the x direction, and the substrate 40 is irradiated with ultraviolet rays.

Further, as the film material, a photocurable material which is cured by light in a wavelength range other than the ultraviolet region may be used. At this time, the temporary curing light source 68. The main curing light source 51 emits light including a wavelength component capable of curing the film material.

4A shows a bottom view of the head 65 and the temporary curing light source 68. The heads 65 each include two rows of nozzle rows 67 which are arranged at intervals in the x direction. The nozzle rows 67 each include a plurality of nozzle holes 66 arranged in the y direction. In each of the nozzle rows 67, the nozzle holes 66 are arranged at a pitch 2P. The nozzle hole 66 of one of the nozzle rows 67 is offset from the nozzle hole 66 of the other nozzle row 67 by only P in the y direction. If one head 65 is focused, the pitch of the plurality of nozzle holes 66 in the y direction is equal to P. The pitch P corresponds, for example, to a resolution of 300 dpi.

One of the heads 65 is assembled to the nozzle holder 64 (FIG. 4A) with respect to the other head 65 in the y direction with only a deviation of P/2. Therefore, one head unit 57 (Fig. 4A) includes a plurality of nozzle holes 66 arranged in the y direction at a pitch P/2. The pitch P/2 is equivalent to, for example, a resolution of 600 dpi.

The positional relationship between the plurality of heads 65 and the substrate 40 is shown in Fig. 4C. For example, ten nozzles 65 are mounted on the nozzle holder 64. The head 65 is arranged in a matrix in which two rows are arranged in the y direction and five rows and five columns are arranged in the x direction. The droplets of the film material can be landed on the region of the width W in the x direction by the two heads 65 arranged in the y direction. The nozzles arranged in a row and column have a pitch of 2 W in the x direction.

By moving the substrate 40 in the y direction, droplets of the film material are discharged from the two heads 65, whereby droplets of the film material can be dropped at a resolution of 600 dpi in the x direction. Offset the substrate every P/8 in the y direction 40, the scanning in the x direction is performed four times (two reciprocations), whereby the resolution in the x direction can be improved to 2400 dpi. By moving the substrate 40 only in the y direction and performing the same x-direction scanning, droplets of the thin film material can be landed on substantially the entire area of the substrate 40. The resolution in the y direction is determined in accordance with the moving speed of the substrate 40 in the y direction and the period of the droplets of the discharged film material. The timing of discharging the droplets of the film material by each of the nozzle holes 66 is controlled in accordance with the image data of the formed film pattern, whereby a film of a desired pattern can be formed.

The film material adhering to the substrate 40 is temporarily cured by ultraviolet rays radiated from the temporary curing light source 68, and the temporary curing light source is disposed on the downstream side of the head 57 in the moving direction of the substrate 40. Among them, "temporary curing" means that only the surface layer portion is cured, and not all film materials are cured. Since the droplets of the film material are deposited on the substrate 40 and then temporarily cured, it is possible to suppress the expansion of the film material.

A method of transporting the substrate 40 from the first film material discharge station 23 to the reversing station 24 will be described with reference to FIGS. 5A to 5D and 6A to 6C.

As shown in FIG. 5A, the lifter 32 is supported by the linear guide 30 so as to be movable in the x direction. Further, the lifter 32 can be moved up and down with respect to the stage 55. The lifter 32 includes a lift plate 70, a plurality of lift pins 71, an adsorption pad 72, and a partial curing light source 73. The lift pin 71 is attached to the lift plate 70 and extends downward from the lift plate 70. Adsorption pads 72 are attached to the lower ends of the lift pins 71. The adsorption pad 72 is in contact with the upper surface of the substrate 40 to adsorb the substrate 40, whereby the lifter 32 can hold the substrate 40.

A local curing light source 73 is disposed in the vicinity of each of the lift pins 71. The partial curing light source 73 irradiates the ultraviolet ray to the region (the gasket contact region) where the adsorption pad 72 is in contact with the upper surface of the substrate 40. When the substrate 40 is carried out from the stage 55, the lifter 32 is first moved to the upper side of the stage 55.

The plane positional relationship of the lift plate 70, the lift pins 71, and the partial curing light source 73 is shown in Fig. 6A. As an example, the substrate 40 has a rectangular planar shape, and the lift pins 71 are disposed slightly inside the four corners of the substrate 40. A partial curing light source 73 is disposed slightly outside the lift pin 71. The local curing light source 73 emits ultraviolet rays toward the inside of the substrate 40. Thereby, the contact area of the spacer which the adsorption pad 72 (FIG. 5A) contacts can be irradiated with ultraviolet rays.

As shown in FIG. 5B, the lifter 32 is lowered, and the substrate 40 is irradiated with ultraviolet rays from the partial curing light source 73. The intensity of the ultraviolet light emitted from the local curing light source 73 is higher than the intensity of the ultraviolet light emitted from the temporary curing light source 68 (Fig. 4A, Fig. 4B).

FIG. 6B is a cross-sectional view showing the substrate 40 before the ultraviolet rays are irradiated from the partial curing light source 73. A film 80 made of a film material is formed on the upper surface of the substrate 40. The surface layer portion 81 of the film 80 is cured by ultraviolet irradiation from the temporary curing light source 68 (Fig. 4A, Fig. 4B). However, the inside of the film 80 is in an uncured state.

A cross-sectional view of the substrate 40 after the ultraviolet light is irradiated by the partial curing light source 73 is shown in Fig. 6C. The film 83 in the gasket contact region 82 where the adsorption pad 72 is in contact is cured to the inside thereof. The process of curing to the inside of the film is referred to as "formal curing." The film 80 in the other region is in a state in which only the surface layer portion 81 is cured. As an example, in order to formally cure the film material, it is necessary to irradiate ultraviolet rays having an energy density of about 1 J/cm ² . When the power density of the ultraviolet light emitted from the partial curing light source 73 is 1 W/cm ² on the surface of the substrate 40, the film can be formally cured by irradiation for about 1 second.

As shown in Fig. 5C, the lifter 32 is further lowered to bring the suction pad 72 into contact with the upper surface of the substrate 40. As shown in Fig. 6C, since the film material 83 in the pad contact region 82 is solidified to the inside, even if the adsorption pad 72 is in contact with the film 83, deformation of the film 83 or reflow of the film material does not occur. A suction flow path 84 is formed inside the lift pin 71 and the suction pad 72. After the adsorption pad 72 comes into contact with the film 83, the substrate 40 is sucked through the suction flow path 84, whereby the substrate 40 is adsorbed to the adsorption pad 72.

As shown in Fig. 5D, the lifter 32 is raised. The substrate 40 is adsorbed to the adsorption pad 72 and rises together with the lifter 32. Thereafter, the lifter 32 is moved to the inversion station 23 (Fig. 1).

The reverse operation in the inversion station 23 will be described with reference to FIGS. 7A to 7F. A reversing table 60 is fixed to the front end of the rotating shaft 62. The reversing table 60 includes a coupling portion 60x and two arm portions 60y. The connecting portion 60x is long in the x direction, and is connected to the rotating shaft 62 at a midpoint thereof. The two arm portions 60y extend in the y direction from both ends of the coupling portion 60x. A main curing light source 61 that is long in the x direction is disposed in the vicinity of the reversing table 60. For the main curing light source 61, for example, a mercury lamp, a metal halide lamp, or the like is used.

As shown in FIG. 7B, the substrate 40 is transferred from the lifter 32 (Fig. 1 and Fig. 2) to the reversing table 60. The three edges of the substrate 40 are supported by the connecting portion 60x and the arm portion 60y, respectively. A plurality of suction holes are provided on the upper surfaces of the connecting portion 60x and the arm portion 60y, and the substrate 40 is adsorbed to the reversing table 60. In addition, a mechanism for holding the vicinity of the edge of the substrate 40 to hold the suction hole may be employed. For example, the substrate 40 may be pressed by a roller, or the substrate 40 may be pressed by a clamp mechanism.

As shown in FIG. 7C, the surface of the substrate 40 is irradiated with ultraviolet rays while moving the main curing light source 61 in the y direction. Thereby, the film 80 (FIG. 6C) formed on the upper surface (first surface) of the substrate 40 is cured (formally cured) to the inside. In the present specification, the inversion station 24 may be referred to as a "formal curing portion". The energy density of the ultraviolet rays supplied to the surface of the substrate 40 is larger than the energy density of the ultraviolet rays supplied to the surface of the substrate 40 by the temporary curing light source 68 (Fig. 4A, Fig. 4B), for example, about 100 times. As an example, the energy density of the ultraviolet rays supplied to the surface of the substrate 40 by the temporary curing light source 68 and the main curing light source 61 is 10 mW/cm ² and 1 W/cm ^{2 , respectively} . In order to increase the energy density of the ultraviolet ray irradiated by the main curing portion by the energy density of the ultraviolet ray irradiated during the temporary curing, the irradiation time of the ultraviolet ray in the main curing portion may be lengthened, and the light intensity of the ultraviolet ray irradiated by the main curing portion may be increased ( Power density).

As shown in Fig. 7D, the rotating shaft 62 is rotated by 180°. Thereby, the upper and lower sides of the substrate 40 are reversed, and the surface (second surface) on which the film is not adhered faces upward. As shown in Fig. 7E, the lifter 33 is lowered. The lifter 33 includes a lift pin and an adsorption pad 74 in the same manner as the lifter 32 (Fig. 5A). The adsorption pad 74 is brought into contact with the second surface of the substrate 40. Thereafter, the substrate 40 is adsorbed by the adsorption pad 74. As shown in Fig. 7F, the reversing table 60 is extracted from the lifter 33 and the substrate 40 (Fig. 7E). Thereafter, the lifter 33 is raised and moved to the second alignment station 25 (Fig. 1).

The processing in the second alignment station 25 and the second thin film material discharge station 26 shown in Fig. 1 is the same as the processing in the first alignment station 22 and the first thin film material discharge station 23. Thereby, a thin film can also be formed on the second surface of the substrate 40. When the film formed on the second surface is transported by the carry-out conveyor 37, the ultraviolet light emitted from the main curing light source 51 is solidified.

In the first embodiment, one of the steps shown in FIG. 4C moves the substrate 40 in the y direction while the droplets of the thin film material are dropped, and only the surface layer portion of the thin film formed on the substrate 40 is cured (temporarily cured). Thereby, it is possible to suppress the film material adhering to the surface of the substrate 40 from spreading in the in-plane direction. If the film is to be formally cured immediately after the drop is dropped, it is necessary to delay the moving speed of the substrate 40 in order to secure the sufficient energy density supplied to the film. In the first embodiment, since only the surface layer portion of the film is cured, the moving speed of the substrate 40 can be increased. Thereby, it is possible to achieve an improvement in throughput.

When the adsorption pad 72 (Fig. 6C) is brought into contact with the temporarily cured film, the cured surface layer portion may be broken and the uncured film material may flow out. In the first embodiment, since the film in the gasket contact region 82 is solidified to the inside before the adsorption pad 72 is brought into contact with the film, it is possible to prevent the film material from flowing out or being deformed. In the second film material discharge station 26 (first drawing), the film is applied to the entire surface of the first surface in the main curing portion (reverse station) 24 before the film material is adhered to the second surface of the substrate 40. Cured (formally cured) to its interior. When the droplets of the film material are dropped on the substrate 40 in the first film material discharge station 23, the moving speed of the substrate 40 can be set to an optimum value independently of the main curing process in the main curing portion 24.

In the first embodiment, immediately after the droplets of the film material are dropped on the substrate 40 on the stage 55, the film material is irradiated with ultraviolet rays from the temporary curing light source 68, but it is not necessarily required to be temporarily cured immediately after landing. The film material may be temporarily cured before the substrate material is carried out from the stage 55 after the film material is landed on the substrate. At this time, it is not necessary to fix the temporary curing light source 68 to the nozzle holder 64 to which the head 65 is attached. The temporary curing light source 68 may be disposed above the stage 55.

It is possible to suppress the infiltration of the liquid droplets of the film material by temporarily curing before carrying out, as compared with the case where the film material is temporarily cured without being temporarily cured, and the substrate 40 is unloaded from the stage 55. Further, as in the first embodiment, the structure in which the film material is irradiated with ultraviolet rays slightly on the downstream side from the landing position of the film material while moving the substrate can shorten the time from the landing of the film material to the temporary curing.

Next, a modification of the first embodiment will be described. In the first embodiment, the film is completely cured in the substrate inversion station 24. In this modification, the independent station for performing the main curing is disposed between the first film material discharge station 23 and the substrate inverting station 24 instead of the substrate reversing station 24 having the structure of the main solidified portion. The station that performs the main curing can be, for example, the conveyor belt for transporting the substrate and the officially disposed above it, similarly to the carry-out conveyor 37 and the main curing light source 51 shown in Fig. 1 . It is composed of a light source for curing.

In the main curing station, the energy density of the light of the film material which is supplied onto the substrate 40 by the light from the light source for the main curing becomes a size which can be cured to the inside of the film material. The light energy density is greater than the energy density of light on the stage 55 that is applied to the film material by the light from the temporary curing light source 68 onto the substrate 40. In order to increase the light energy density, the power of the light source can be increased, and the light irradiation time can be lengthened. The irradiation time of the main curing light can be adjusted by adjusting the speed at which the substrate is conveyed on the conveyor belt for the station for performing the final curing.

[Embodiment 2]

Fig. 8 is a plan view showing a first film material discharge station of the film forming apparatus of the second embodiment. The differences from the first embodiment will be described below, and the description of the same configurations will be omitted. The partial curing light source 73 (Fig. 5A) of the first embodiment is attached to the lifter 32, but the partial curing light source 90 of the second embodiment is attached to the support member 58. That is, the partial curing light source 90 is disposed above the stage 55 and faces the substrate 40. When the substrate 40 is moved in the y direction, the position of the partial curing light source 90 in the x direction is adjusted so that the pad contact region 82 divided on the surface of the substrate 40 passes through the path of the ultraviolet rays radiated from the partial curing light source 90. Inside.

Next, a method of forming the film in the gasket contact region 82 to be completely cured will be described with reference to FIGS. 9A to 9D.

As shown in FIG. 9A, after the film is formed over the entire area of the first surface of the substrate 40, the substrate 40 is moved in the y direction. As shown in FIG. 9B, when the spacer contact region 82 (Fig. 8) is disposed directly under the partial curing light source 90, the film in the spacer contact region 82 is irradiated with ultraviolet rays from the partial curing light source 90. For example, when the power density of the ultraviolet light emitted from the partial curing light source 90 is 1 W/cm ² on the surface of the substrate 40, the film can be formally cured by ultraviolet irradiation for about 1 second.

As shown in FIG. 9C, when the substrate 40 is further moved in the y direction and the other pad contact region 82 is disposed directly under the partial curing light source 90, the film in the pad contact region is irradiated from the partial curing light source 90. Ultraviolet light. As shown in Fig. 9D, the substrate 40 is moved to a position where it can be transferred to the lifter 32 (Fig. 2). At this point in time, the film in the gasket contact region 82 is completely cured.

Since only the film in the pad contact region 82 is completely cured, the time required for the main curing can be shortened compared to when the film of the entire region of the substrate 40 is completely cured. Therefore, the time during which the substrate 40 stays in the first film material discharge station 23 can be shortened. Thereby, it is possible to suppress a decrease in throughput due to the main curing process.

When the power of the partial curing light source 90 is increased, even when the substrate 40 is moved below the partial curing light source 90 at a moving speed when the film material is landed on the substrate 40, the energy density of the sufficient ultraviolet light can be supplied. In the film. At this time, it is possible to perform the main curing by irradiating ultraviolet rays from the partial curing light source 90 when the droplets of the film material are dropped. At this time, the area to be formally cured may be set only as the pad contact area 82, or may be set to include the pad. A strip-shaped region of the sheet contact region 82 that is parallel to the y-direction.

[Example 3]

A film forming apparatus and a film forming method according to Example 3 will be described with reference to FIGS. 10A and 10B. Hereinafter, differences from the first embodiment will be described, and the description of the same configurations will be omitted.

Fig. 10A is a plan view showing a substrate to be formed into a film and a film pattern formed by the method according to the third embodiment. The film in Example 1 was formed on substantially the entire area of the surface of the substrate 40. In the third embodiment, a plurality of printed wiring regions 41 are defined in the substrate 40, and a film is formed inside the printed wiring region 41. A film is not formed in a region other than the printed wiring region 41. The plurality of printed wiring regions 41 are arranged, for example, in a row direction in which the x direction is the row direction and the y direction is the column direction. A section 42 in which no film is formed is secured between the two printed wiring regions 41 adjacent to the x direction and the y direction and between the printed wiring region 41 and the edge of the substrate 40. The shim contact area 82 is disposed inside the section 42.

A cross-sectional view taken along the dotted line 10B-10B of Fig. 10A is shown in Fig. 10B. FIG. 10B shows a state in which the suction pad 74 of the lifter 33 is brought into contact with the substrate 40. A film 80 is formed in the printed wiring region 41 of the first surface of the substrate 40. At this point in time, the film 80 is temporarily cured without being formally cured. A film 80 is not formed in the section 42.

The suction pad 74 of the lifter 33 is in contact with the pad contact area 82 (Fig. 10A) in the section 42. Since the adsorption pad 74 is not in contact with the film 80, even if the film 80 is temporarily cured, it can be lifted. The drop device 33 transports the substrate 40.

[Example 4]

A film forming apparatus and a film forming method according to Example 4 will be described with reference to FIGS. 11A and 11B. Hereinafter, differences from the first embodiment will be described, and the description of the same configurations will be omitted.

As shown in FIG. 11A, the substrate 40 is held on the stage 55. A film 80 in a temporarily cured state is formed on the upper surface (first surface) of the substrate 40. The lifter 33 has a plurality of retaining pins 75 extending downward. The holding pin 75 is opened and closed around the fulcrum. When the holding pin 75 is opened, the front end of the holding pin 75 is located outside the outer peripheral line of the substrate 40 in a plan view.

As shown in FIG. 11B, the lifter 33 is lowered to a position where the front end of the holding pin 75 is located at the same height as the end surface of the substrate 40. The holding pin 75 is closed so that its front end comes into contact with the end surface of the substrate 40. The substrate 40 is held by the lifter 33 by the front end of the holding pin 75 being in contact with the end surface of the substrate 40. Since the film 80 is not formed on the end surface of the substrate 40, the substrate 40 can be held and transported by the lifter 33 even if the film 80 is temporarily cured.

[Example 5]

A film forming apparatus and a film forming method based on Example 5 will be described with reference to FIGS. 12A and 12D. Hereinafter, differences from the first embodiment will be described, and the description of the same configurations will be omitted.

As shown in Fig. 12A, the substrate 40 is held on the stage 55. A film 80 in a temporarily cured state is formed on the first surface of the substrate 40. The stage 55 is provided with a lift pin 77. In a state where the substrate 40 is held on the stage 55, the tip end of the lift pin 77 is retracted to a position lower than the upper surface (substrate holding surface) of the stage 55.

As shown in Fig. 12B, the lift pins 77 are raised. The lifting and lowering of the lift pins 77 is controlled by the control device 50 (Fig. 1). The substrate 40 is lifted at the tip end of the lift pin 77, and a cavity is formed between the stage 55 and the substrate 40.

As shown in Fig. 12C, a robot arm 78 is inserted into the cavity between the stage 55 and the substrate 40. As shown in Fig. 12D, the lift pins 77 are lowered and the substrate 40 is supported by the robot arm 78. Thereafter, the robot arm 78 is operated to transport the substrate 40 to the reversing station 24 (Fig. 1).

In the fifth embodiment, the substrate 40 is supported by the lower surface thereof when the substrate 40 is transported. Therefore, even if the film 80 is in a temporarily cured state, the substrate 40 can be held and conveyed.

[Embodiment 6]

An example in which the main curing and the surface inversion are simultaneously performed side by side in the film forming apparatus according to the embodiment 6 is shown in FIGS. 13A to 13E. Hereinafter, differences from the first embodiment will be described, and the description of the same configurations will be omitted. As shown in Fig. 13A, a pair of semicircular guide members 106 are disposed on both sides of the ultraviolet light source 102. The ultraviolet light source 102 is movable along the guides 106 on both sides. The movement of the ultraviolet light source 102 is controlled by the control device 50 system. The ultraviolet light emitted from the ultraviolet light source 102 is irradiated onto the surface of the substrate 40 that holds the surface in the positive direction of the Z-axis on the inversion stage 60. Further, in the example shown in Figs. 13A to 13D, the ultraviolet light source 102 emits ultraviolet light which is scattered.

As shown in FIGS. 13B to 13D, the control device 50 rotates the substrate 40 at a constant angular velocity with the rotation shaft 62 as a rotation center. In synchronization with the rotation of the substrate 40, the ultraviolet light source 102 is moved at a constant speed along the guide 106 to illuminate the surface of the rotating substrate 40 with ultraviolet light of a predetermined intensity or higher. For example, as shown in FIG. 13E, when the back surface of the substrate 40 faces the positive direction of the Z-axis, the irradiation of the ultraviolet light is ended.

In Example 6, the inversion of the substrate 40 and the final curing of the film based on the ultraviolet irradiation were simultaneously performed. Therefore, the entire processing time can be shortened.

[Embodiment 7]

An example in which the main curing and the front-back reversal are simultaneously performed side by side in the film forming apparatus according to the seventh embodiment is shown in FIGS. 14A to 14D. Hereinafter, differences from the first embodiment will be described, and the description of the same configurations will be omitted. In the example shown in Figs. 14A to 14D, the ultraviolet light source 102 emits focused ultraviolet light. As shown in Fig. 14A, a pair of guides 106 are provided at both ends of the support member 101. The support member 101 is movable along the guides 106 at both ends. The movement of the support member 101 is controlled by the control device 50.

As shown in FIGS. 14A to 14D, the control device 50 rotates the substrate 40 at a constant angular velocity with the rotation shaft 62 as a rotation center. Base The rotation of the plate 40 is synchronized, and the support member 101 is moved at a constant speed along the guide 106. In addition, the ultraviolet light source 102 is moved at a constant speed along the support member 101. Fig. 14A shows a state in which the surface of the substrate 40 faces the positive direction of the Z-axis, and Fig. 14D shows a state in which the back surface of the substrate 40 is gradually oriented in the positive direction of the Z-axis. In the state shown in FIG. 14A, the ultraviolet light source 102 is at a position where the ultraviolet light is irradiated to the end portion of the substrate 40 in the positive Y-axis direction, as shown in FIGS. 14A to 14D, as the substrate 40 rotates. It moves to a position where the end portion of the substrate 40 in the negative direction of the Y-axis is irradiated with ultraviolet light. The ultraviolet light is started to be irradiated when the surface of the substrate 40 faces the positive direction of the Z-axis, and the ultraviolet light is irradiated when the back surface of the substrate 40 faces the positive direction of the Z-axis.

In the seventh embodiment, the inversion of the substrate 40 and the final curing of the film based on the ultraviolet irradiation were simultaneously performed in the same manner as in the sixth embodiment. Therefore, the entire processing time can be shortened.

[Embodiment 8]

Fig. 15 is a schematic view showing a film forming apparatus based on Example 8. A holding mechanism 125 is held by the moving mechanism 121 on the flat plate 120. The moving mechanism 121 includes a Y stage 122, an X stage 123, and a θ stage 124. The XYZ orthogonal coordinate system in which the horizontal plane is the XY plane and the vertical direction is the Z axis is defined. The Y stage 122 moves the X stage 123 in the Y-axis direction. The X stage 123 moves the θ stage 124 in the X direction. The θ stage 124 changes the posture of the rotation direction of the holding mechanism 125 with the axis parallel to the Z axis as the center of rotation. The holding mechanism 125 holds the printed substrate 40 as a film formation target (drawing target). Holding mechanism 125 For example, a vacuum chuck is used. Further, when the positioning of the printed substrate 40 in the θ direction is completed in advance before the printed substrate 40 is held by the holding mechanism 125, the θ stage 124 is not required.

The beam 131 is supported by the pillars 130 above the flat plate 120. A head unit 57 and an image pickup device 132 are attached to the beam 131. The imaging device 132 and the head unit 57 are opposed to the printed substrate 40 held by the holding mechanism 125. The imaging device 132 images the wiring pattern formed on the surface of the printed substrate 40. The imaging result is input to the control device 133. The head unit 57 discharges an ultraviolet curable resin such as a droplet of a solder resist from a plurality of nozzles toward the printed substrate 40. The discharged droplets adhere to the surface of the printed substrate 40.

The control device 133 controls the Y stage 122, the X stage 123, the θ stage 124, the holding mechanism 125, and the head unit 57.

The head unit 57 is fixed relative to the flat plate 120 in Fig. 15, but does not necessarily have to be fixed. It is also possible to movably support the head unit 57 with respect to the flat plate 120.

A perspective view of the head unit 57 is shown in Fig. 16A. Four nozzles 65A to 65D are attached to the bottom surface of the nozzle holder 64 so as to be aligned in the Y direction. The heads 65A to 65D are arranged in the negative direction of the Y-axis in this order. A plurality of nozzle holes 66 are formed in the nozzles 65A to 65D, respectively.

A temporary curing light source 68 is disposed between the head 65A and the head 65B, between the head 65B and the head 65C, and between the head 65C and the head 65D. Further, a temporary curing light source 68 is disposed on the Y-axis positive side region of the head 65A and the Y-axis negative side region than the head 65D. Temporary curing The printed circuit board 40 (Fig. 15) is irradiated with ultraviolet light by the light source 68.

A bottom view of the heads 65A to 65D and the temporary curing light source 68 is shown in Fig. 16B. The bottom surface of the shower head 65A (the surface facing the printed circuit board 40) is formed with two nozzle rows 67a and a nozzle row 67b. Each of the nozzle row 67a and the nozzle row 67b is composed of a plurality of nozzle holes 66 arranged at a pitch (period) 2P in the X-axis direction. The nozzle row 67b is offset from the nozzle row 67a in the positive direction of the Y-axis, and is shifted from the negative direction of the X-axis by only the pitch P. That is, the nozzle holes 66 of the head 65A are distributed at equal intervals in the X direction at a pitch P. The pitch P is, for example, about 80 μm.

The structures of the heads 65B to 65D are the same as those of the head 65A. The head 65B, the head 65C, and the head 65D are respectively shifted by 2P/4, P/4, and 3P/4 in the negative direction of the X-axis with respect to the head 65A, and are attached to the nozzle holder 64 (Fig. 16A). A temporary curing light source 68 is disposed between the heads 65A to 65D and outside the outermost head 65A and the head 65D.

As shown in Fig. 17, the images 155A to 155D of the nozzle holes 66 of the vertical projection heads 65A to 65D perpendicular to the imaginary plane 156 perpendicular to the Y-axis are arranged at equal intervals in the X direction at a pitch P/4. A serial number is added to the heads 65A to 65D, and the serial numbers of the corresponding heads 65A to 65D are added to the images 155A to 155D of the nozzle holes 66. At this time, the images 155A to 155D of the nozzle holes 66 are not arranged in the order of the serial numbers in the X direction. Specifically, when the serial numbers 1 to 4 are attached to the heads 65A to 65D, the serial numbers 1, 2, 3, and 4 are added to the image 155A, the image 155B, the image 155C, and the image 155D of the nozzle hole 66, respectively. The image of the nozzle hole 66 is arranged in the order of serial numbers 1, 3, 2, and 4 in the X direction.

Fig. 18A shows the relationship between the X coordinate of the landing point of the liquid droplets discharged from each nozzle hole 66 and the discharge timing. The horizontal axis of Fig. 18 shows the elapsed time, and the vertical axis shows the position in the X-axis direction. The droplets are ejected from the nozzle holes 66 while moving the holding mechanism 125 (Fig. 15) in the positive direction of the Y-axis.

At the time tAa and tAb, droplets are discharged from the nozzle row 67a and the nozzle row 67b of the head 65A, respectively. Thereby, the droplets land on the landing point 147Aa and the landing point 147Ab. Then, at time tBa and tBb, droplets are ejected from the nozzle row 67a and the nozzle row 67b of the head 65B, and droplets are ejected from the nozzle row 67a and the nozzle row 67b of the head 65C at times tCa and tCb, respectively, at times tDa and tDb. At this time, droplets are ejected from the nozzle row 67a and the nozzle row 67b of the head 65D, respectively. Thereby, the droplets land on the landing point 147Ba, the landing point 147Bb, the landing point 147Ca, the landing point 147Cb, the landing point 147Da, and the landing point 147Db.

By controlling the moving speed of the holding mechanism 125 (Fig. 15) and the ejection timing from each of the nozzle rows 67a and the nozzle rows 67b, the landing points 147Aa to 147Db can be placed on one imaginary straight line on the surface of the printed substrate 40.

Fig. 18B shows a state in which the landing points 147Aa to 147Db are arranged on one imaginary straight line. The landing point 147Aa and the landing point 147Ab of the liquid droplet discharged from the nozzle hole 66 of the head 65A are arranged at a pitch P in the X direction. By the same token, the landing points of the liquid droplets discharged from the respective nozzle holes 66 of the other heads 65B to 65D are also arranged at a pitch P in the X direction.

The landing point 147Ba is located at the end point of the positive direction of the X-axis. Point 147Aa sets the end point in the negative direction to the midpoint of the line segment of the falling point 147Ab. The landing point 147Ca is located at the midpoint of the line segment where the landing point 147Aa and the landing point 147Ba are both ends. The landing point 147Da is located at the midpoint of the line segment where the landing point 147Ba and the landing point 147Ab are both ends.

By the same token, the end point in the positive direction of the X-axis is defined as the landing point 147Ab, and the line segment in which the end point in the negative direction is the landing point 147Aa is arranged in line with the nozzle hole 66 of the nozzle row 67b of each of the heads 65B to 65D. Landing point.

The landing points of the liquid droplets discharged from the nozzles adjacent to each other are not adjacent to the X direction. The landing point of the droplets ejected from the other nozzles must be arranged between the two. For example, the landing point 147Aa of the liquid droplets discharged from the nozzles 65A and 65B adjacent to each other and the landing point 147Ba are not adjacent to each other, and the landing point 147Ca of the liquid droplet discharged from the head 65C is disposed therebetween.

The circle shown in Fig. 18B indicates that the center of the landing position coincides with the center of the circle, and does not show the area where the droplet spreads. The area where the droplet is landed at the landing point 147Aa is actually wider than the circular area shown in Fig. 18B.

Fig. 19 is a schematic view showing the head unit 57 and the printed circuit board 40 viewed in a line of sight parallel to the X-axis. The heads 65A to 65D and the temporary curing light source 68 are attached to the bottom surface of the nozzle holder 64. The printed substrate 40 faces the heads 65A to 65D.

The temporary curing light source 68 mounted between the head 65A and the head 65B illuminates a region between the region 148A of the surface of the printed substrate 40 facing the head 65A and the region 148B opposed to the head 65B. same The region between the region 148B opposed to the head 65B, the region 148C opposed to the head 65C, and the region 148D opposed to the head 65D is also irradiated by the temporary curing light source 68 mounted between the corresponding heads. Light.

The temporary curing light source 68 mounted on the outer side (the negative side of the Y-axis) of the head 65A is irradiated with light in a region closer to the Y-axis negative side than the region 148A. The temporary curing light source 68 mounted on the outer side (the positive side of the Y-axis) of the head 65D is irradiated with light in a region closer to the positive side of the Y-axis than the region 148D.

A case where the liquid droplets are ejected from the heads 65A to 65D while moving the printed circuit board 40 in the positive direction of the Y-axis to form a film (drawing) will be described. The liquid droplets ejected from the heads 65A to 65D and attached to the printed circuit board 40 are temporarily solidified by irradiating light from a light source that is further forward (positive direction of the Y axis) than the position of the liquid droplet at the time of landing.

Since the temporary curing light source 68 is disposed in front of each of the heads 65A to 65D, the liquid droplets can be solidified in a short time after the droplets adhere to the printed substrate 40. In addition, since the temporary curing light source 68 is disposed on the negative side of the Y-axis of each of the heads 65A to 65D, the adhesion of the liquid droplets can be shortened even when the printed circuit board 40 is moved in the negative direction of the Y-axis. The time until curing.

A schematic view of the temporary curing light source 68 is shown in Fig. 19B. Each of the temporary curing light sources 68 includes a plurality of light emitting diodes 160 arranged in a direction parallel to the X axis and a cylindrical lens 161 which is long in the X direction. The ultraviolet rays radiated from the light emitting diode 160 are on the ZX plane by the cylindrical lens 161 The inside is focused and incident on the printed substrate 40. When the angle of incidence on the printed circuit board 40 in the ZX plane is increased, ultraviolet rays reflected by the printed circuit board 40 may enter the nozzle holes 66 of the adjacent heads 65A to 65D (FIG. 16A). When the ultraviolet rays are incident on the nozzle holes 66, the ultraviolet curable resin is solidified in the nozzle holes 66, and the risk of clogging the nozzle holes 66 is increased.

The cylindrical lens 161 reduces the angle at which the printed substrate 40 is incident to prevent the reflected light from entering the nozzle hole 66. For example, it is preferred to inject ultraviolet rays substantially vertically in the ZX plane.

Next, a film forming method will be described with reference to Figs. 18A and 18B. An example in which a straight line parallel to the X-axis is formed on the printed circuit board 40 (Fig. 15 and Fig. 19) will be described. When the straight line is arranged in the Y direction, the liquid droplets can be applied in the two-dimensional surface. The nozzle holes 66 (Fig. 16A, Fig. 16B) for discharging the droplets are selected in accordance with the bitmap data of the formed film, whereby various patterns can be formed.

At the time tAa, the liquid droplets are discharged from the nozzle row 67a of the head 65A. Thereafter, at time tAb, droplets are discharged from the nozzle row 67b of the head 65A. Thereby, the droplet adheres to the landing point 147Aa and the landing point 147Ab shown in Fig. 18B. When the region to which the droplet adheres passes through a region opposed to the temporary curing light source 68 between the head 65A and the head 65B, the droplet is temporarily solidified by light irradiation. At the time tBa and tBb, droplets are discharged from the nozzle row 67a and the nozzle row 67b of the head 65B, respectively. Thereby, the droplet adheres to the landing point 147Ba and the landing point 147Bb on the first line segment which is the both ends of the landing point 147Aa and the landing point 147Ab. When the area to which the droplet adheres passes through the temporary curing light source 68 between the head 65B and the head 65C. In the region, the droplets are temporarily cured by light irradiation.

At the time tCa, the liquid droplets are discharged from the nozzle row 67a of the head 65C. Thereby, the droplet adheres to the first line segment, that is, the landing point 147Ca on the line segment closer to the first side (the positive side of the X-axis) than the falling point 147Ba. At the time tCb, the liquid droplets are discharged from the nozzle row 67b of the head 65C. Thereby, the droplet adheres to the first line segment, that is, the landing point 147Cb on the line segment closer to the first side (the positive side of the X-axis) than the falling point 147Bb. When the region to which the droplet adheres passes through a region opposed to the temporary curing light source 68 between the head 65C and the head 65D, the droplet is temporarily cured by light irradiation.

At the time tDa, the liquid droplets are discharged from the nozzle row 67a of the head 65D. Thereby, the droplet adheres to the landing point 147Da on the line segment in which one of the two line segments obtained by dividing the first line segment into two equal parts by the landing point 147Ba is not disposed with one of the falling points 147Ca. At the time tDb, the liquid droplets are discharged from the nozzle row 67b of the head 65D. Thereby, the droplet adheres to the landing point 147Db on the line segment in which one of the two line segments obtained by dividing the first line segment into two equal parts by the landing point 147Bb is not disposed with one of the falling points 147Cb. When the region to which the droplet adheres passes through a region opposed to the temporary curing light source 68 disposed outside the head 65D, the droplet is temporarily cured by light irradiation.

20A to 20D show temporal changes in the shape of the liquid droplets from the discharge of the liquid droplets to the adhesion to the printed circuit board. As shown in Fig. 20A, the droplet 151 is substantially spherical immediately before landing on the printed substrate 40. As shown in FIG. 20B, when the liquid droplet 151 landed on the printed substrate 40, the liquid droplet 151 slightly expands in the in-plane direction.

As shown in Fig. 20C, if the time elapses from the landing time, the droplet The expansion of 151 becomes larger and infiltrates 152. As shown in Fig. 20D, if the elapsed time, the expansion of the infiltration 152 becomes large.

In the above-described eighth embodiment, since the time until the liquid droplet 151 comes into contact with the printed substrate 40 until the temporary curing is shortened, the expansion of the penetration can be suppressed. Thereby, a fine pattern can be formed with high precision.

In the eighth embodiment, the temporary curing light source 68 is disposed in all areas between the adjacent heads of the heads 65A to 65D. Depending on the allowable penetration size, it is not necessary to configure the light source in all areas. The light source may be disposed in only a portion of the area between the mutually adjacent nozzles. For example, in FIGS. 16A and 16B, the temporary curing light source 68 may be disposed between the head 65A and the head 65B and between the head 65C and the head 65D.

In the eighth embodiment, the temporary curing light source 68 is disposed on the outer side of the head 65A and the head 65D on both sides. However, when the film is formed while moving the printed circuit board 40 in only one direction, the light source is disposed only on one side. can. For example, in FIG. 16 and FIG. 16B, when a film is formed while moving the printed circuit board 40 only in the positive direction of the Y-axis, it is not necessary to arrange the temporary curing for the rear side (the negative side of the Y-axis) of the head 65A. Light source 68.

Fig. 21A shows a plan view of a droplet landing on a straight line parallel to the X-axis, and Fig. 21B shows a cross-sectional view taken along a dotted line 21B-21B of Fig. 21A. Droplet 149Aa and droplet 149Ab discharged from the nozzle row 67a of the head 65A and the nozzle row 67b are attached to the lowermost portion. Droplets 149Ba and 149Bb discharged from the nozzle row 67a of the head 65B and the nozzle row 67b are attached between the droplet 149Aa and the droplet 149Ab. In from The droplets ejected from the nozzles of the head 65B are placed before the printed circuit board 40 (Fig. 19A), and the liquid droplets 149Aa and 149Ab are temporarily solidified. Therefore, the droplets 149Ba and 149Bb are not mixed with the droplets 149Aa and 149Ab. Thereby, the vicinity of the outer periphery of the droplet 149Ba and the droplet 149Bb overlaps with the droplet 149Aa and the droplet 149Ab.

Further, the droplet 149Ca discharged from the nozzle row 67a of the head 65C overlaps with the boundary line of the droplet 149Aa and the droplet 149Ba, and the boundary between the droplet 149Cb and the droplet 149Ab and the droplet 149Bb discharged from the nozzle row 67b of the head 65C is discharged. overlapping. Further, the droplet 149Da discharged from the nozzle row 67a of the head 65D overlaps with the boundary line of the droplet 149Ab and the droplet 149Ba, and the boundary between the droplet 149Db discharged from the nozzle row 67b of the head 65D and the droplet 149Aa and the droplet 149Bb overlapping.

The arrangement of the heads 65A to 65D based on the comparative example is shown in Fig. 22A. In the comparative example, the heads 65B to 65D are respectively shifted by P/4, 2P/4, and 3P/4 in the negative direction of the X-axis with respect to the head 65A. Similarly to the case of the eighth embodiment shown in Fig. 16B, the nozzles 65A to 65D are formed with two rows of nozzle rows 67a and nozzle rows 67b.

Fig. 22B is a linear cross-sectional view showing the use of the heads 65A to 65D based on the configuration of the comparative example. Droplets 149Aa discharged from the nozzle row 67a of the head 65A, droplets 149Ba discharged from the nozzle row 67a of the head 65B, droplets 149Ca discharged from the nozzle row 67a of the head 65C, and droplets discharged from the nozzle row 67a of the head 65D The 149Da is arranged in this order toward the positive direction of the X-axis. The droplets on the positive side of the X-axis overlap the droplets on the negative side.

The height of the apex of the droplet is increased each time the droplet that is subsequently ejected is superimposed on the temporarily solidified droplet. Therefore, the height difference of the straight line formed by the droplets becomes large in the longitudinal direction.

In the case of the eighth embodiment, as shown in Fig. 21B, after the droplet 149Ba is landed, the droplet 149Ca is landed on the negative side of the X-axis than the droplet 149Ba, and then landed on the positive side of the X-axis than the droplet 149Ba. Droplet 149Da. That is, as time passes, the landing position does not move only in the positive direction of the X-axis, but in both the positive and negative directions. Therefore, it is possible to reduce the height difference of the straight line formed by the liquid droplets.

[Embodiment 9]

Fig. 23 is a view showing the structure and arrangement of a head according to the film forming apparatus of the ninth embodiment. Hereinafter, differences from the eighth embodiment will be described, and the description of the same configurations will be omitted.

In the eighth embodiment, the nozzles 65A to 65D are formed with two rows of nozzle rows 67a and nozzle rows 67b. However, in the ninth embodiment, one row of nozzle rows 67 is formed. The nozzle row 67 is composed of a plurality of nozzle holes 66 arranged in the X direction at a pitch P. In the eighth embodiment, as shown in Fig. 18A, at the time tAa, the liquid droplets are discharged from the nozzle row 67a, and at the time tAb, the liquid droplets are discharged from the nozzle row 67b, whereby the liquid droplets are adhered to one straight line. In the ninth embodiment, droplets can be simultaneously ejected from one nozzle row 67 to adhere the droplets to one straight line.

Similarly to the eighth embodiment, the head 65B, the head 65C, and the head 65D are respectively shifted by 2P/4, P/4 in the negative direction of the X-axis with respect to the head 65A. 3P/4 configuration. Further, a temporary curing light source 68 is disposed at the same position as in the eighth embodiment. Therefore, in the ninth embodiment, the fine pattern can be formed with high precision, and the height difference of the straight line formed by the liquid droplets can be reduced.

[Embodiment 10]

The configuration of the head according to the film forming apparatus of Example 10 is shown in Fig. 24. Hereinafter, differences from the eighth embodiment will be described, and the description of the same configurations will be omitted.

In the eighth embodiment, as shown in Fig. 16B, the head 65C and the head 65D are respectively shifted by P/4 and 3P/4 in the negative direction of the X-axis with respect to the head 65A. In the tenth embodiment, the amounts of deviation between the head 65C and the head 65D are replaced with the amounts of deviation between the head 65D and the head 65C of the eighth embodiment, respectively. The respective structures of the heads 65A to 65D are the same as those of the head 65A of the eighth embodiment.

Serial numbers 1 to 4 are attached to the nozzles 65A to 65D. Serial numbers 1, 2, 3, and 4 are also attached to the images of the nozzle holes 66 of the vertical projection heads 65A to 65D perpendicular to the imaginary plane perpendicular to the Y-axis. At this time, the serial number of the image attached to the nozzle hole 66 is arranged in the order of 1, 4, 2, and 3 in the X direction.

In the tenth embodiment, as in the case of the eighth embodiment, the images of the nozzle holes 66 are not arranged in the order of the serial numbers in the X direction. Therefore, it is possible to reduce the height difference of the straight line formed by the liquid droplets.

[Example 11]

The configuration of the head according to the thin film forming apparatus of Example 11 is shown in Fig. 25. Hereinafter, differences from the eighth embodiment will be described, and the description of the same configurations will be omitted.

In the eighth embodiment, four heads 65A to 65D are arranged in the Y direction. However, in the eleventh embodiment, six heads 65A to 65F are arranged in the Y direction. The respective structures of the heads 65A to 65F are the same as those of the head 65A of the eighth embodiment. The heads 65B to 65F are respectively shifted by 2P/6, 4P/6, P/6, 3P/6, and 5P/6 in the negative direction of the X-axis with respect to the head 65A.

The images of the nozzle holes 66 of the vertical projection heads 65A to 65F perpendicular to the imaginary plane perpendicular to the Y-axis are arranged at a pitch P/6 in the X direction. Therefore, it is possible to form a pattern having a higher resolution than the film forming apparatus according to the eighth embodiment.

In the same manner as in the eighth embodiment, serial numbers 1 to 6 are attached to the heads 65A to 65F, respectively. Serial numbers 1, 2, 3, 4, 5, and 6 are also attached to the images of the nozzle holes 66 of the vertical projection heads 65A to 65F perpendicular to the imaginary plane perpendicular to the Y-axis. At this time, the images of the nozzle holes 66 of the serial numbers 1, 4, 2, 5, 3, and 6 are arranged in the X direction in the order listed. Since the images of the nozzle holes 66 are not arranged in the order of the serial numbers in the X direction, the height difference of the straight line formed by the liquid droplets can be reduced.

The printed circuit board is exemplified as the film formation target, but a film may be formed on another substrate such as a flexible substrate or a touch panel.

The present invention has been described based on the above examples, but the present invention is not limited to these examples. It will be understood by those skilled in the art that various modifications, improvements, combinations, etc. can be made.

20‧‧‧ housing

21‧‧‧ moving into the station

22‧‧‧1st alignment station

23‧‧‧1st film material discharge station

24‧‧‧Substrate reversing station (formal curing department)

25‧‧‧2nd alignment station

26‧‧‧Second film material discharge station

27‧‧‧ Move out of the station

30‧‧‧Line guides

31~34‧‧‧ Lifter

35‧‧‧ moving into the conveyor belt

36‧‧‧ Move in

37‧‧‧Removing conveyor belt

38‧‧‧Moving out

40‧‧‧Substrate (printed substrate, object to be drawn)

41‧‧‧Printed wiring area

Section 42‧‧‧

50‧‧‧Control device

51‧‧‧Formal curing light source

55‧‧‧stage

56‧‧‧Line guides

57‧‧‧Spray unit

58‧‧‧Support members

59‧‧‧Nozzle lifting mechanism

60‧‧‧Reversal table

60x‧‧‧Link Department

60y‧‧‧arms

61‧‧‧Formal curing light source

62‧‧‧Rotary axis

64‧‧‧Nozzle fixture

65, 65A, 65B, 65C, 65D‧‧‧ nozzle

66‧‧‧Nozzle hole

67, 67a, 67b‧‧‧ nozzle column

68‧‧‧ Temporary curing light source

70‧‧‧ lifting plate

71‧‧‧lifting pin

72‧‧‧Adsorption gasket

73‧‧‧Local curing light source

74‧‧‧Adsorption gasket

75‧‧‧ Keep selling

77‧‧‧lifting pin

78‧‧‧ Robotic arm

80‧‧‧ film

81‧‧‧Surface

82‧‧‧shield contact area

83‧‧‧film material in the contact area of the gasket

84‧‧‧Attracting the flow path

90‧‧‧Local curing light source

101‧‧‧Support members

102‧‧‧UV source

106‧‧‧Guide

120‧‧‧ tablet

121‧‧‧Mobile agencies

122‧‧‧Y stage

123‧‧‧X stage

124‧‧‧θ stage

125‧‧‧ Keeping institutions

130‧‧‧ pillar

131‧‧‧ beams

132‧‧‧ camera

133‧‧‧Control device

147Aa, 147Ab, 147Ba, 147Bb, 147Ca, 147Cb, 147Da, 147Db‧‧‧ landing points

148A, 148B, 148C, 148D‧‧‧ areas opposite the nozzle

149Aa, 149Ab, 149Ba, 149Bb, 149Ca, 149Cb, 149Da, 149Db‧‧‧ droplets

151‧‧‧ droplets

152‧‧‧Infiltration

155A, 155B, 155C, 155D‧‧‧ nozzle image

156‧‧‧imaginary plane

160‧‧‧Light-emitting diodes

161‧‧‧ cylindrical lens

Fig. 1 is a schematic view showing a film forming apparatus based on Example 1.

Fig. 2 is a plan view showing a first alignment station, a first film material discharge station, and a reversing station of the film forming apparatus of the first embodiment.

Fig. 3A is a cross-sectional view taken along a dashed line 3A-3A of Fig. 2, and Fig. 3B is a cross-sectional view taken along a dashed line 3B-3B of Fig. 3A.

Fig. 4A is a perspective view of a head unit of the film forming apparatus of the first embodiment, Fig. 4B is a bottom view of the head and the light source for temporary curing, and Fig. 4C is a plan view of the head and the board.

5A to 5D are side views of the stage and the conveying device when the substrate is received from the stage by the film forming apparatus of the first embodiment.

Fig. 6A is a plan view showing the positional relationship between the substrate, the lift pins, and the light source for temporary curing, and Fig. 6B is a cross-sectional view of the substrate and the temporarily cured film, and Fig. 6C is a substrate and a partially cured film. Sectional view.

In Fig. 7-1, Fig. 7A and Fig. 7B are perspective views of the inversion stage of the inversion station and the light source for main curing.

In Fig. 7-2, Fig. 7C and Fig. 7D are perspective views of the inversion stage of the inversion station and the light source for main curing.

In Fig. 7-3, Fig. 7E and Fig. 7F are perspective views of the inversion stage of the inversion station and the light source for main curing.

Fig. 8 is a plan view showing a first film material discharge station based on the film forming apparatus of the second embodiment.

9A to 9D are plan views of the first film material discharge station when the film is partially cured by the film forming apparatus of the second embodiment.

Fig. 10A is a plan view of a substrate and a film produced by the film forming method of Example 3, and Fig. 10B is a cross-sectional view taken along a dashed line 10B-10B of Fig. 10A.

11A and 11B are cross-sectional views of a transport device, a substrate, and a stage based on the thin film forming apparatus of the fourth embodiment.

12A to 12D are cross-sectional views of a substrate, a stage, and a transport apparatus when a substrate is transferred from a stage to a transport apparatus by the thin film forming apparatus of the fifth embodiment.

Fig. 13 to Fig. 13 to Fig. E are views showing the order of simultaneous solidification and in-situ reversal by side-by-side with the film forming apparatus of Example 6.

Fig. 14 to Fig. 14D are diagrams showing an example in which the film forming apparatus according to the seventh embodiment is used for simultaneous solidification and surface inversion at the same time.

Fig. 15 is a schematic view showing a film forming apparatus (drawing device) based on Example 8.

Fig. 16A is a perspective view of a nozzle unit based on the film forming apparatus of the eighth embodiment, and Fig. 16B is a bottom view of the nozzle unit.

Figure 17 is a diagram showing the relationship between the nozzle and the image of the nozzle.

Fig. 18 is a view showing the relationship between the X coordinate of the landing point of the liquid droplet discharged from the nozzle and the discharge timing, and Fig. 18B is a view showing the position of the landing point on the printed substrate.

Figure 19A is a front view of the nozzle unit and the printed circuit board, 19th Figure B is a schematic view of a light source.

Fig. 20A to Fig. 20D are diagrams showing temporal changes in the shape of the discharged droplets.

Fig. 21A is a plan view of a straight line formed by droplets landing on a printed substrate, and Fig. 21B is a cross-sectional view taken along a dotted line 21B-21B of Fig. 21A.

Fig. 22A is a bottom view of a nozzle unit based on a comparative example, and Fig. 22B is a (cross-sectional view) line view formed by a nozzle unit based on a comparative example.

Fig. 23 is a bottom view of the nozzle unit of the film forming apparatus of Example 9.

Fig. 24 is a bottom view of a nozzle unit based on the film forming apparatus of Example 10.

Fig. 25 is a bottom view of the nozzle unit of the film forming apparatus of Example 11.

24‧‧‧Substrate reversing station (formal curing department)

23‧‧‧1st film material discharge station

56‧‧‧Line guides

57‧‧‧Spray unit

58‧‧‧Support members

22‧‧‧1st alignment station

30‧‧‧Line guides

60‧‧‧Reversal table

61‧‧‧Formal curing light source

40‧‧‧Substrate (printed substrate, object to be drawn)

32‧‧‧ Lifter

55‧‧‧stage

31‧‧‧ Lifter

Claims (19)

A method for forming a film, comprising: holding a substrate on a stage, discharging droplets of the photocurable film material from the head, and causing droplets of the film material to land on the surface of the substrate; a process of irradiating the film material on the substrate to cure the surface layer portion of the film material, and a process of depositing the liquid droplets and curing the surface layer portion of the film material, and then moving the substrate from the carrier The process of the substrate. A method for forming a thin film, comprising the steps of: performing a process of dropping the droplets and curing a surface layer portion of the film material while moving a landing position of the liquid droplet on a surface of the substrate, from the stage After the substrate is carried out, the film material cured by the surface layer portion is irradiated with light from the main curing light source, and the film made of the film material is cured to the inside thereof. The method for forming a film according to the second aspect of the invention, wherein the substrate formed by the film material is cured in the process, and the substrate is transported by a conveyor belt while being formed on the substrate The film composed of the film material is irradiated with light for the final curing. The method for forming a film according to the second aspect of the invention, wherein the film formed of the film material is cured to the inside thereof The energy density of the light irradiated to the film composed of the film material is greater than the energy density of the light irradiated to the film material in the process of curing the surface layer portion of the film material. The method for forming a film according to claim 1, wherein the process of landing the droplets and the process of curing the surface layer portion of the film material comprises: depositing droplets of the film material at a plurality of intervals a first point, and a process of curing the surface layer portion; and curing the surface layer portion of the film material falling on the first point, and then landing the droplet of the film material at the second point between the first points, And the process of curing the surface layer portion. The method for forming a film according to claim 5, wherein the process of landing the droplets and the process of curing the surface layer portion of the film material further comprises: curing the surface layer portion of the film material landing on the second point Thereafter, a droplet of the film material is landed on the third point, and the surface layer portion is cured; and the surface layer portion of the film material that has landed on the third point is solidified, and the droplet of the film material is caused to land on the fourth layer. In the process of solidifying the surface layer portion, the first to fourth points are arranged in the order of the first point, the third point, the second point, and the fourth point. The method for forming a film according to the first aspect of the invention, wherein the step of dropping the droplets on the surface of the substrate while moving the landing position of the droplets and the surface layer portion of the film material After the curing process, before the light is irradiated from the light source for the main curing, the film material is irradiated with light from the partial curing light source to the film contact region which is a part of the surface of the substrate, and the pad is provided. a process of curing the film in the sheet contact area to the inside thereof; and after curing the film in the contact area of the pad to the inside thereof, the adsorption pad is brought into contact with the surface of the film in the contact area of the pad, and The process of transporting the substrate to a region where the light of the light source for formal curing is irradiated is irradiated. The method for forming a film according to the first aspect of the invention, wherein the step of dropping the droplets on the surface of the substrate while moving the landing position of the droplets and the surface layer portion of the film material After the curing process, the light source is irradiated with light from the surface of the substrate or the lower surface of the substrate to support the substrate, and is transported from the stage to the light source for the main curing source. The process of irradiating the area. The method for forming a thin film according to the first aspect of the invention, which has the following process, The process of moving the droplets on the surface of the substrate and the process of curing the surface layer portion of the film material is performed in a plurality of times, and the droplets of the film material are not dropped. The non-formed regions of the droplets of the film material are not landed on the surface of the substrate, but the droplets of the film material are dropped by the image data of the film pattern in other regions, and are in contact with the non-formed regions of the substrate to support The substrate is transported from the stage to a region where the light of the main curing light source is irradiated. A film forming apparatus comprising: a head having a plurality of nozzle holes for discharging droplets of a film material; and a stage for holding the substrate at a position opposed to the head so that the substrate faces the substrate with respect to the head Moving in a parallel direction; the light source for temporary curing faces the substrate held on the stage, and irradiates the film material that is placed on the substrate with light having a strength that cures the surface layer portion of the film material; and the conveying device The substrate held by the stage is transported to the main curing portion, and the light source for main curing, and the film material on the surface of the substrate is irradiated with light in the main curing portion. The film forming apparatus according to claim 10, wherein the light emitted from the light source for the main curing light is irradiated onto the surface of the substrate to have a light intensity greater than that emitted from the light source for temporary curing. The intensity of light on the surface of the aforementioned substrate. The film forming apparatus according to claim 10, wherein the temporary curing light source is fixed to a nozzle jig to which the head is attached. The film forming apparatus according to claim 10, wherein the film forming apparatus further includes a substrate inversion station that reverses the vertical direction of the substrate, and the transport device transports the substrate to the substrate inversion station The substrate in which the light from the light source for the main curing is irradiated is applied to the portion. The thin film forming apparatus according to claim 10, wherein an energy density of light applied to the thin film material by the light from the main curing light source in the main solidified portion is larger than that in the stage The energy density of light that is applied to the thin film material on the substrate by light from the temporary curing light source. The film forming apparatus according to claim 10, wherein the mounting table relatively moves the substrate in a first direction with respect to the head, and at least four of the heads are arranged in the first direction, and the heads respectively include a plurality of the nozzle holes, wherein the nozzle holes are equally spaced in a second direction orthogonal to the first direction, When the plurality of nozzle holes are vertically projected onto the imaginary plane perpendicular to the first direction, the images of the nozzle holes are arranged at equal intervals in the second direction, and a serial number is added to the head in the order of arrangement of the heads. When the serial number of the corresponding head is added to the image of the nozzle hole, the nozzle hole of the head is arranged so that the image of the nozzle hole is arranged in the order of the serial number in the second direction, and the temporary curing is performed. At least one of a region of the light source holding at least one of a region between the regions where the nozzles are opposed to each other on the surface of the substrate of the stage and an area outside the region where the outermost nozzle is opposed The area illuminates the light. The film forming apparatus according to claim 15, wherein the heads each include a plurality of nozzle rows arranged at different positions in the first direction, and the nozzle rows are arranged at equal intervals in the second direction. a plurality of the aforementioned nozzle holes. The film forming apparatus according to claim 10, wherein the conveying device includes a lifter, and the lifter is provided with an adsorption pad that is in contact with a portion of the upper surface of the substrate, that is, a contact area of the gasket. And the film forming apparatus further includes a partial curing light source, wherein the partial curing light source is held in the state of the stage, and is attached to the front side The film material in the pad contact region of the substrate is irradiated with light having a strength greater than that of the light radiated from the temporary curing light source. The film forming apparatus according to claim 17, wherein the partial curing light source is supported by the lifter, and the lifter is placed above the substrate held by the stage, and the substrate is The aforementioned pad contact area illuminates light. The film forming apparatus according to claim 17, wherein when the substrate is moved by the stage, the spacer contact region passes through a path of light emitted from the local curing light source. The aforementioned partial curing light source is disposed.