JP2008203485A - Method for manufacturing liquid crystal device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a liquid crystal device, with which a sealing material is prevented from being dissolved in a liquid crystal material without lowering an adhesive force of the sealing material. <P>SOLUTION: In the method for manufacturing the liquid crystal device, based on sticking a pair of substrates to each other via the sealing material, the method is provided with: a sealing material drawing step to draw the sealing material which defines a liquid crystal material arranging region inside on at least one substrate of the pair of substrates; a sealing material dissolution preventive processing step to partly harden the sealing material, at least of the boundary portion side adjacent to the liquid crystal material arranging region, out of the drawn sealing material; a liquid crystal material placing step to place the liquid crystal material on a position corresponding to the liquid crystal material arranging region on either one substrate of the pair of substrates; a substrate joining step to join the pair of substrates to each other; and a sealing material hardening step to harden the sealing material. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a liquid crystal device, and more particularly to a method for manufacturing a liquid crystal device in which a distance between a sealing material for bonding a pair of substrates and a display region is short, such as a medium-sized or small-sized liquid crystal device.

  Conventionally, there is a sealing-less (ODF: One Drop Fill) method as one of methods for bonding a pair of substrates constituting a liquid crystal device. This sealing-less method draws a sealing material on one of the upper and lower substrates and then forms a liquid crystal layer on the area surrounded by the sealing material when the upper and lower substrates are bonded together. In a state where a predetermined amount of liquid crystal material is arranged, the upper and lower substrates are bonded together via a sealing material, and the sealing material portion is cured by ultraviolet irradiation or the like.

  In such a sealing-less method, if the upper and lower substrates are bonded together with as much liquid crystal material as possible with respect to the cell volume, the pressure applied by the excess liquid crystal material is applied to the sealing material from the inside of the cell. Entering phenomenon occurs. Since it is difficult to control the amount of this liquid crystal material without any error, as a countermeasure against this voiding phenomenon, the sealing material is cured to some extent by ultraviolet irradiation etc. before the upper and lower substrates are bonded together. There is a method of pre-curing (pre-curing) (for example, see Patent Document 1).

JP 4-107523 A (full text)

However, as in Patent Document 1, the method of pre-curing the sealing material with ultraviolet irradiation before the upper and lower substrates are bonded together makes it difficult to control the amount of ultraviolet irradiation for curing the sealing material to the extent that it is not too hard. When the sealing material is hardened too much, there is a problem that the adhesive strength is lowered. This may cause the same problem even when pre-cured by heating.
On the other hand, even when an appropriate amount of liquid crystal material corresponding to the cell volume is disposed, there is a problem that when the sealing material has a low viscosity, the sealing material in contact with the liquid crystal material is eluted into the liquid crystal material. Since liquid crystal materials have significant changes in characteristics due to impurities, especially in order to reduce the size of the liquid crystal device, the distance between the sealing material and the display area can be reduced, and the peripheral parting width is narrow. In this case, the components of the sealing material may elute into the liquid crystal material in the display area, which may reduce the display quality.

Therefore, the inventors of the present invention have made diligent efforts to solve such a problem by partially curing a portion of the sealing material adjacent to the liquid crystal material arrangement region before arranging the liquid crystal material. And the present invention has been completed.
That is, an object of the present invention is to provide a method for manufacturing a liquid crystal device that prevents the sealing material from eluting into the liquid crystal material without reducing the adhesive force of the sealing material.

According to the present invention, there is provided a method for manufacturing a liquid crystal device in which a pair of substrates is bonded via a sealing material, and the sealing material that defines a liquid crystal material arrangement region on the inside is attached to at least one of the pair of substrates. Of the pair of substrates, a sealing material drawing step for drawing, a sealing material elution preventing treatment step for partially curing at least the sealing material on the boundary portion side adjacent to the liquid crystal material arrangement region among the drawn sealing materials, A liquid crystal material disposing step of disposing a liquid crystal material at a position corresponding to a liquid crystal material disposing region on any one of the substrates; a substrate bonding step of bonding a pair of substrates; and a sealing material curing step of curing the sealing material. A method of manufacturing a liquid crystal device characterized by the above is provided, and the above-described problems can be solved.
That is, after drawing the sealing material, before the liquid crystal material is arranged in the liquid crystal material arrangement region of the sealing material, the portion including at least the boundary portion side with the liquid crystal material arrangement region in the sealing material is partially cured. Thus, elution of the sealing material into the liquid crystal material can be reduced while preventing the adhesive force from being lowered before the main curing. Accordingly, it is possible to prevent display quality from being deteriorated due to elution of the sealing material.

In carrying out the method for producing a liquid crystal device of the present invention, it is preferable that the sealing material contains an ultraviolet curable resin, and the sealing material elution prevention treatment step is performed by ultraviolet flash exposure or ultraviolet laser irradiation.
By carrying out in this way, when an ultraviolet curable sealing material is used, the sealing material elution prevention treatment of the sealing material can be performed in a short time or by specifying an area. The adhesive strength is not reduced.

Further, in carrying out the manufacturing method of the liquid crystal device of the present invention, when performing the sealing material elution prevention treatment step, a partial exposure mask is used or only the boundary portion side with the liquid crystal material arrangement region is cured by laser irradiation. It is preferable to make it.
By carrying out in this way, when an ultraviolet curable sealing material is used, only the boundary portion side with the liquid crystal material arrangement region can be partially cured, so that the adhesive strength of the sealing material is ensured. However, the elution of the sealing material into the liquid crystal material can be prevented.

In carrying out the method for producing a liquid crystal device of the present invention, it is preferable that the sealing material contains a thermosetting resin, and the sealing material elution prevention treatment step is performed by spraying warm air or irradiating with infrared laser.
By carrying out in this way, when a thermosetting sealing material is used, the sealing material elution prevention treatment of the sealing material can be performed in a short time or by specifying an area. The adhesive strength is not reduced.

Further, when carrying out the manufacturing method of the liquid crystal device of the present invention, when performing the sealing material elution prevention treatment step, a pattern mask is used or only the boundary portion side with the liquid crystal material arrangement region is cured by laser irradiation. It is preferable.
By implementing in this way, when a thermosetting sealing material is used, only the boundary portion side with the liquid crystal material arrangement region can be partially cured, so that the adhesive strength of the sealing material is ensured. However, the elution of the sealing material into the liquid crystal material can be prevented.

In carrying out the method for manufacturing a liquid crystal device of the present invention, it is preferable to perform the sealing material elution prevention treatment step in a deoxygenated atmosphere.
By carrying out in this way, impurities present in the sealing material are removed, and adverse effects such as oxidation on the sealing material and the liquid crystal material can be reduced.

A method for manufacturing a liquid crystal device according to an embodiment of the present invention will be described below with reference to the drawings. However, this embodiment shows one aspect of the present invention and does not limit the present invention, and can be arbitrarily changed within the scope of the present invention.
In each drawing used in the following description, the scale is different for each layer and each member so that each layer and each member can be recognized on the drawing.

1. Liquid Crystal Device First, a liquid crystal device obtained by the method for manufacturing a liquid crystal device of this embodiment will be described.
FIG. 1 is a perspective view of the liquid crystal device 10. The liquid crystal device 10 includes a sealing material 23 in which an element substrate 60 and a counter substrate 30 facing each other include an ultraviolet curable resin and a thermosetting resin as sealing materials. Are pasted together. The sealing material 23 has a partitioned liquid crystal material arrangement region 23a on the inside, and a liquid crystal material (not shown) is enclosed and held in the liquid crystal material arrangement region 23a. The sealing material 23 in the liquid crystal device 10 of FIG. 1 is formed in a frame shape (annular shape) closed in a region within the substrate surface, and does not include a liquid crystal injection port.

A peripheral parting 53 made of a light-shielding material is formed in a region inside the region where the sealing material 23 is formed, and a display region A is partitioned to prevent light leakage from outside a specific area. The width of the peripheral parting 53 varies depending on the size of the external shape of the liquid crystal device 10, but is formed with a relatively small width in order to reduce the external shape of the liquid crystal device 10.
Further, the element substrate 60 constituting the liquid crystal device 10 has a substrate overhanging portion 60 </ b> T that projects outward from the outer shape of the counter substrate 30. A connection terminal (not shown) is formed on the surface of the substrate extension 60T that holds the liquid crystal material, and the semiconductor element 91 and the flexible circuit board 93 are connected to the connection terminal. Yes.

Depending on the type of liquid crystal material used, that is, the operation mode such as TN (Twisted Nematic) mode and STN (Super Twisted Nematic) mode, and the normally white mode / normally black mode, the phase difference plate and polarization Although a board etc. are arrange | positioned in the predetermined direction, illustration is abbreviate | omitted here.
Further, in the display region of the liquid crystal device 10 having such a structure, a plurality of pixels are configured in a matrix, and each of these pixels includes a pixel switching TFT (Thin Film Transistor) or TFD. Although switching elements such as (Thin Film Diode) may be formed, these are also omitted from illustration. Furthermore, the method for manufacturing a liquid crystal device of the present invention can be applied to a passive matrix substrate in addition to an active matrix substrate.

  2 and 3 are cross-sectional views schematically showing the liquid crystal device 10 according to the present embodiment. 2 shows a state after the liquid crystal material arranging step and before the substrate bonding step, and FIG. 3 shows a state after the substrate bonding step. The capacity of the liquid crystal device 10, that is, after the two substrates 30 and 60 are bonded together as shown in FIG. 3, the space formed by the sealing material 23 and both the substrates 30 and 60 is (area within the seal) × ( The liquid crystal material 21 having a gap control material diameter) is accommodated.

As shown in FIGS. 2 and 3, in the liquid crystal device 10, the sealing material 23 is disposed around the element substrate 60, and the liquid crystal material 21 is disposed in a region 23 a surrounded by the sealing material 23 on the element substrate 60. Is placed, the element substrate 60 and the counter substrate 30 are bonded together. In the element substrate 60 and the counter substrate 30, TFT elements, peripheral parting, and the like are omitted.
2 and 3, the gap control material is omitted. The gap control material is for controlling the thickness of the liquid crystal cell. For example, it is not included in the substantially spherical spacer having the same diameter as the size of the cell gap mixed with the sealing material, or the sealing material, and from the substrate. Various things, such as a columnar spacer formed protruding in a columnar shape, can be used.

2. Next, a method for manufacturing the liquid crystal device of the present embodiment will be described.
FIG. 4 is a flowchart showing a part of the manufacturing method of the liquid crystal device of the present embodiment. As shown in FIG. 4, the manufacturing method of the liquid crystal device of the present embodiment includes a sealing material drawing step of drawing a sealing material defining a liquid crystal material arrangement region on the element substrate on the element substrate, and among the drawn sealing materials, A sealing material elution prevention treatment step for partially curing the sealing material on the boundary portion side adjacent to at least the liquid crystal material arrangement region, and a position corresponding to the liquid crystal material arrangement region on either the element substrate or the counter substrate A liquid crystal material disposing step of disposing a liquid crystal material, a substrate bonding step of bonding the element substrate and the counter substrate, and a sealing material curing step of curing the sealing material.
In addition, an alignment process is performed in a timely manner in which an alignment mark is formed so that a sealing material or a liquid crystal material can be drawn and applied at a predetermined position, and the substrate is positioned according to the alignment mark. The description about is omitted.

(1) Seal material drawing process The element substrate and the counter substrate are substrates having a glass substrate or the like as a base. In this embodiment, first, a sealing material is drawn on the element substrate. The sealing material may be drawn not on the element substrate but on the counter substrate, or at positions corresponding to each other of the element substrate and the counter substrate and integrated when the two substrates are bonded together. You can also draw at each position.

  In order to draw the sealing material on the element substrate, drawing is performed while patterning the sealing material on the surface in contact with the inside of the cell when the two substrates are bonded together by various dispensing methods. For example, drawing is performed at a predetermined position around the element substrate with a width of 0.1 to 0.4 mm and a thickness of 0.01 to 0.04 mm. At this time, when the drawing is performed with a distance from the display area close, the outer shape of the manufactured liquid crystal device can be reduced in size.

  As the sealing material, a viscous epoxy resin or acrylic resin is used. This sealing material includes an ultraviolet and thermosetting sealant that is cured by using a combination of an ultraviolet curing process and a thermal curing process, an ultraviolet curing sealant that is cured only by the UV curing process, or by heat. Although there is a thermosetting sealing material that cures only by the curing process, in this embodiment, ultraviolet rays and a thermosetting sealing material are used. However, in the present invention, any of the above types of sealing materials can be used.

(2) Sealing material elution prevention treatment step Next, after drawing the sealing material, a sealing material elution prevention treatment step of partially curing at least the sealing material on the boundary portion side adjacent to the liquid crystal material arrangement region among the sealing materials. Do.
In the present embodiment, ultraviolet and thermosetting sealing materials are used, and examples of a method for partially curing the sealing material in a predetermined region include various modes described later.

  Moreover, when performing this sealing material elution prevention treatment process, it is preferable to implement in a deoxygenated atmosphere. By carrying out in this way, impurities such as water, oxygen, acidic compounds such as nitrogen oxide and sulfur oxide, and molecules such as solvent gas are removed from the sealing material, and the sealing material and liquid crystal material are obtained. It is possible to reduce adverse effects such as oxidation. In addition, when the sealing material elution prevention treatment is performed by ultraviolet irradiation, generation of ozone and absorption of ultraviolet rays can be prevented.

  For example, a deoxygenated atmosphere can be formed by reducing the working area with a generally used vacuum device or decompression device. Alternatively, a deoxygenation atmosphere can be formed by filling an inert gas with a generally used gas replacement device. The inert gas can be appropriately selected according to the purpose, and examples thereof include nitrogen gas, helium gas, argon gas, and neon gas, and nitrogen gas is more preferable. These inert gases are preferably as pure as possible.

  In addition, this sealing material elution prevention treatment process is a process different from the sealing material pre-curing process for adjusting the viscosity of the sealing material, which is usually performed. That is, in the sealing material pre-curing step, the entire sealing material is heat-treated at a lower temperature than the sealing material curing step for a predetermined time to adjust the viscosity of the sealing material. In contrast, in this process, at least the sealing material on the side of the boundary portion adjacent to the liquid crystal material arrangement region of the sealing material is partially cured, or at the same temperature and light amount as the sealing material curing process. It is performed in order to prevent the sealing material from eluting into the liquid crystal material even if the liquid crystal material comes into contact with the sealing material by processing in a shorter time than the heating time or exposure time in the curing process. is there.

(2) -1 Ultraviolet Flash Exposure To perform the sealing material elution prevention treatment process by ultraviolet flash exposure, as shown in FIG. 5 under conditions shorter than the curing time required when the sealing material curing process is performed by ultraviolet irradiation. Then, at least a sealing material 23A on the side of the boundary adjacent to the liquid crystal material arrangement region 23a is cured. For example, in the case of a sealing material in which the sealing material curing step by ultraviolet irradiation is performed at 2,000 to 10,000 mj for 20 to 40 seconds using an ultraviolet lamp, this step is performed without changing the light amount. Perform under conditions of ~ 5 seconds. By performing ultraviolet flash exposure under such conditions, only the surface layer portion of the seal material 23A of the portion irradiated with ultraviolet rays including the boundary portion adjacent to the liquid crystal material arrangement region 23a is cured. Therefore, even if the liquid crystal material comes into contact with the sealing material 23, the sealing material 23 does not elute into the liquid crystal material. On the other hand, when the surface layer portion is once softened in the sealing material curing step, the internal sealing material appears on the surface layer. Since it hardens | cures after that, the adhesive force for bonding two board | substrates can be ensured.

(2) -2 Mask exposure In addition, in order to perform the sealing material elution prevention treatment process by mask exposure, as shown in FIG. 6, ultraviolet rays are irradiated only on the boundary portion side adjacent to the liquid crystal material arrangement region 23a in the sealing material 23. Ultraviolet rays are irradiated through the pattern mask 101 provided with a transmitting region, and only the sealing material 23A on the boundary portion side is cured. Since the sealing material 23A on the boundary portion side is cured by masking and irradiating with ultraviolet rays in this way, the sealing material remains in the liquid crystal material even when the liquid crystal material comes into contact with the sealing material. On the other hand, since the other sealing materials are not cured, the adhesive force for bonding the two substrates can be secured.
When performing this mask exposure method, as described above, flash exposure in a short time may be used in combination, or may be performed under the same conditions as normal sealing material curing conditions. In order not to reduce the adhesive force at the time of bonding, it is preferable to perform flash exposure while masking.

(2) -3 Ultraviolet Laser Irradiation Moreover, in order to perform the sealing material elution prevention treatment process by ultraviolet laser irradiation, as shown in FIG. 7, only the boundary portion side adjacent to the liquid crystal material arrangement region 23a in the sealing material 23 is used. On the other hand, the ultraviolet laser L can be irradiated to cure only the sealing material 23A on the boundary portion side. In this way, the sealing material on the boundary portion side is cured by irradiating the ultraviolet laser only in a predetermined place, so that the sealing material is the liquid crystal material even when the liquid crystal material contacts the sealing material. On the other hand, since the other sealing materials are not cured, the adhesive strength can be ensured.

(2) -4 Infrared laser irradiation Similarly to the ultraviolet laser irradiation, only the boundary portion adjacent to the liquid crystal material arrangement region of the sealing material is irradiated with the infrared laser, and only the sealing material on the boundary portion side is irradiated. It can also be cured. Whereas an ultraviolet laser uses photocuring properties, by irradiating an infrared laser, it is possible to cure a sealing material at a predetermined location using thermosetting properties. Therefore, it is possible to ensure the adhesive force while preventing the sealing material from eluting into the liquid crystal material.

(2) -5 Short-time heat treatment Further, in order to perform the sealing material elution prevention treatment process by short-time heat treatment, the condition is shorter than the curing time required when the sealing material curing process is performed by heat treatment. By heating as shown in FIG. 8, at least the sealing material 23A on the boundary portion side adjacent to the liquid crystal material arrangement region 23a is cured. For example, in the case of a sealing material in which the sealing material curing step by heat treatment is performed at 120 to 130 ° C. for 2 to 3 minutes using a heating device, this step is performed at a heating temperature of 5 to 10 as it is. It is performed under the condition of seconds. By performing the heat treatment under such conditions, only the surface layer portion of the heated sealing material 23A including the boundary portion adjacent to the liquid crystal material arrangement region 23a is cured. Therefore, even if the liquid crystal material comes into contact with the sealing material 23, the sealing material 23 does not elute into the liquid crystal material. On the other hand, when the surface layer portion is once softened in the sealing material curing step, the internal sealing material appears on the surface layer. Since it hardens | cures after that, the adhesive force for bonding two board | substrates can be ensured.
Even when a 100% ultraviolet curable sealing material is used, the sealing material elution prevention treatment by hot air blowing can be performed.

(2) -6 Hot air partial spraying Further, in order to perform the sealing material elution prevention process step by hot air partial spraying, as shown in FIG. It is also possible to cure the seal material 23A at a location including the boundary portion side adjacent to the liquid crystal material arrangement region 23a in the seal material 23. For example, a hot hot air of 120 to 130 ° C. that can cure the sealing material is blown for a relatively short time of 5 to 10 seconds. By blowing warm air under such conditions, only the surface layer portion of the seal material where the warm air is blown can be cured. Accordingly, even when the liquid crystal material comes into contact with the sealing material, the sealing material does not elute. On the other hand, in the sealing material curing step, the inner sealing material appears on the surface layer once the surface layer portion is softened. Adhesive strength can be ensured.

(3) Sealing material viscosity adjustment process Before or after performing the above-described sealing material elution prevention treatment process, a sealing material viscosity adjustment process of the sealing material for adjusting the viscosity of the sealing material may be performed.
In this sealing material viscosity adjusting step, various heating means such as a hot plate are used. For example, the entire sealing material is heated for 15 to 60 seconds at a temperature of 80 to 120 ° C. similar to the temperature at which the sealing material is fully cured. Although the sealing material can be cured also by ultraviolet irradiation, in the sealing material viscosity adjusting step, the sealing material needs to be appropriately cured while maintaining elasticity and adhesiveness. It is preferable to heat in the sealing material viscosity adjusting step because the fine adjustment to the degree of curing of the sealing material is more effective when the sealing material is cured by heating.
In addition, this invention does not need to be provided with this sealing material viscosity adjustment process.

(4) Liquid Crystal Material Arrangement Step Next, a liquid crystal material arrangement step is performed in which the liquid crystal material is arranged at a position corresponding to the liquid crystal material arrangement region on either the element substrate or the counter substrate.
As the liquid crystal material, a desired liquid crystal material such as a TN type or an STN type can be used. Using a known technique such as a droplet discharge method, an appropriate amount of such a liquid crystal material is dropped on a liquid crystal material placement region surrounded by a sealing material on the element substrate or a position on the counter substrate corresponding to the liquid crystal material placement region. To do.

(5) Substrate Bonding Step Next, both substrates are bonded so that the counter substrate is in contact with the sealing material on the element substrate. The pressure applied at the time of joining is, for example, about 10 ⁵ Pa. In the sealing material elution prevention treatment process described above, the sealing material on the side of the boundary portion with the liquid crystal material arrangement region is partially cured, so even if the liquid crystal material and the sealing material come into contact with each other, the sealing material The material does not elute into the liquid crystal material. In addition, since the sealing material other than the boundary portion side is kept in a state where it is not excessively cured, the adhesive force is not reduced, so that the element substrate and the counter substrate can be securely bonded together. It has become.

(6) Sealing material curing step After joining the element substrate and the counter substrate, a sealing material curing step is performed. In this sealing material curing step, a method using various devices such as an ultraviolet lamp, a heating device, and a visible light irradiation device can be used. In this embodiment, the sealing material is temporarily applied by ultraviolet irradiation using an ultraviolet lamp. After curing, main curing is performed using a heating device. Temporary hardening can be performed on 2000-10000 mJ / cm < ² > and ultraviolet irradiation conditions of about 20-40 seconds, for example. Moreover, this hardening can be performed on the heating conditions of about 120-130 degreeC and about 2-3 minutes, for example.

  In the liquid crystal device thus obtained, since the sealing material does not elute into the liquid crystal material, the peripheral parting width is narrow, that is, the display region and the position of the sealing material are close to each other. Even if it exists, display quality is not lowered by elution of the sealing material. Therefore, it is possible to easily reduce the outer shape of the substrate while keeping the size of the display area as it is.

  The preferred embodiment according to the present invention has been described above, but the present invention is not limited to this embodiment, and can be appropriately changed to such an extent that the gist of the present invention is not impaired. For example, the time lapse of each step should be determined as appropriate according to conditions such as a sealing material, a liquid crystal material, and a cell thickness, and is not limited to this embodiment.

It is the top view which showed the structure of the liquid crystal device which concerns on this embodiment. It is sectional drawing which showed the liquid crystal cell before a board | substrate joining process. It is sectional drawing which showed the liquid crystal cell after a board | substrate joining process. It is the flowchart which showed the process of the manufacturing method of the liquid crystal device of this embodiment. It is a figure for demonstrating the sealing material elution prevention process by ultraviolet flash exposure. It is a figure for demonstrating the sealing material elution prevention process by mask exposure. It is a figure for demonstrating the sealing material elution prevention process by ultraviolet laser irradiation. It is a figure for demonstrating the sealing material elution prevention process by short time heat processing. It is a figure for demonstrating the sealing material elution prevention process by warm air partial spraying.

Explanation of symbols

10: liquid crystal device, 21: liquid crystal material, 23: sealing material, 23a: liquid crystal material arrangement region, 30: counter substrate, 60: element substrate, 101: pattern mask

Claims (6)

In a method for manufacturing a liquid crystal device in which a pair of substrates is bonded via a sealing material,
A sealing material drawing step of drawing a sealing material defining a liquid crystal material arrangement region on at least one of the pair of substrates;
Among the drawn seal materials, at least a seal material elution prevention treatment step for partially curing the seal material on the boundary portion side adjacent to the liquid crystal material arrangement region;
A liquid crystal material disposing step of disposing a liquid crystal material at a position corresponding to the liquid crystal material disposing region in any one of the pair of substrates;
A substrate bonding step of bonding the pair of substrates;
A sealing material curing step for curing the sealing material;
A method of manufacturing a liquid crystal device, comprising:   The method for manufacturing a liquid crystal device according to claim 1, wherein the sealing material includes an ultraviolet curable resin, and the sealing material elution prevention treatment step is performed by ultraviolet flash exposure or ultraviolet laser irradiation.   3. The liquid crystal according to claim 2, wherein when performing the sealing material elution prevention treatment step, only a boundary portion side with the liquid crystal material arrangement region is cured by using a partial exposure mask or by laser irradiation. Device manufacturing method.   The method for manufacturing a liquid crystal device according to claim 1, wherein the sealing material includes a thermosetting resin, and the sealing material elution preventing treatment step is performed by partial blowing of warm air or infrared laser irradiation.   5. The liquid crystal device according to claim 4, wherein when performing the sealing material elution preventing treatment step, only a boundary portion side with the liquid crystal material arrangement region is cured by using a pattern mask or by laser irradiation. Manufacturing method.   The method for manufacturing a liquid crystal device according to claim 1, wherein the sealing material elution prevention treatment step is performed in a deoxygenated atmosphere.

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