JPWO2018008113A1 - Circuit formation device - Google Patents

Abstract

In the circuit forming apparatus 10 of the present invention, a plurality of stages 20 on which a substrate is mounted are provided, and the plurality of stages are any of a plurality of units such as the resin printing unit 22 and the metal ink printing unit 26. Moved to unit 1 of. Thus, a plurality of stages can be simultaneously positioned in a plurality of units, and work can be performed in parallel on a plurality of substrates held by a plurality of stages. Also, for example, by preparing a unit or the like for storing the stage, the stage is left in that unit, and drying at a low temperature and natural drying are performed for a long time, while curing is performed in other units. It becomes possible to perform the printing process of the metal containing liquid etc. As a result, the circuit can be formed efficiently, and the practicability of the circuit forming apparatus is improved.

Description

  The present invention relates to a circuit forming apparatus that forms a circuit using a first discharge device that discharges a curable resin and a second discharge device that discharges a metal-containing liquid containing metal fine particles.

  In recent years, as described in the following patent documents, a technique for forming a three-dimensional structure from a curable resin that is cured by irradiation of ultraviolet light or the like has been developed. By using such a technique, a resin layer is formed of a curable resin, and a circuit is formed using the resin layer.

JP, 2015-168202, A

  When a circuit is formed using the technology described in the above patent documents, not only the resin layer is formed of the curable resin, but also the wiring is formed of the metal-containing liquid containing metal fine particles. . As described above, when a circuit is formed using a curable resin and a metal-containing liquid, a drying step of drying the curable resin and the metal ink may be required in some cases, and in the drying step, the drying temperature is low. Etc. may require a drying time of 1 hour or more. In such a case, other work is interrupted and the circuit formation efficiency is reduced. Further, in the conventional circuit forming apparatus, one stage for holding a substrate is sequentially moved between a plurality of units, such as a unit for printing a curable resin and a unit for printing a metal ink, Work is performed in each unit. At this time, in the unit in which the stage is not positioned, work can not be performed, and work efficiency is poor. As described above, there are various problems in an apparatus for forming a circuit using a curable resin and a metal-containing liquid, and solving the various problems is considered to improve the practicability of the circuit forming apparatus. . The present invention has been made in view of such circumstances, and an object of the present invention is to improve the practicability of a circuit forming device.

  In order to solve the above-mentioned subject, the circuit formation device of the present invention is a resin layer formation unit containing the 1st discharge device which discharges hardening resin, and the 2nd discharge device which discharges metal content liquid containing metal particulates. A plurality of units including at least a wiring forming unit, a plurality of stages on which a substrate is mounted, and a moving device for moving each of the plurality of stages to any one of the plurality of units. Forming a circuit including a resin layer formed by the discharge of the curable resin of the first discharge device, and a wiring formed by the discharge of the metal-containing liquid of the second discharge device on a substrate .

  In the circuit forming apparatus of the present invention, a plurality of stages on which the substrate is mounted are provided, and the plurality of stages are any one of a plurality of units such as a resin layer forming unit and a wiring forming unit. Moved to Thus, a plurality of stages can be simultaneously positioned in a plurality of units, and work can be performed in parallel on a plurality of substrates held by a plurality of stages. Also, for example, by preparing a unit or the like for storing the stage, the stage is left in that unit, and drying at a low temperature and natural drying are performed for a long time, while curing is performed in other units. It becomes possible to perform the printing process of the metal containing liquid etc. As a result, the circuit can be efficiently formed, and the practicability of the circuit forming apparatus is improved.

It is a top view showing a circuit formation device. It is a side view showing a storage unit. It is an enlarged view which shows a turntable and a resin printing unit. It is sectional drawing in AA line of FIG. It is the schematic which shows a linear motor. It is a block diagram showing a control device. It is sectional drawing which shows the circuit of the state in which the resin layer was formed. It is sectional drawing which shows the circuit of the state in which the electronic component was mounted | worn with the cavity of the resin layer. It is sectional drawing which shows the circuit of the state in which the resin layer was formed in the clearance gap of a cavity. It is sectional drawing which shows the circuit of the state in which the metal ink was discharged on the resin layer.

Configuration of Circuit Forming Device FIG. 1 shows a circuit forming device 10. The circuit forming apparatus 10 includes a plurality of stages 20, a resin printing unit 22, a resin curing unit 24, a metal ink printing unit 26, a baking unit 28, a mounting unit 30, a storage unit group 32, and a moving device. 34 and a control unit 36 (see FIG. 6). The resin printing unit 22, the resin curing unit 24, the metal ink printing unit 26, the baking unit 28, the mounting unit 30, the storage unit group 32, and the moving device 34 are of the base 38 of the circuit forming device 10. It is located on the top.

  Each stage 20 holds a substrate (see FIG. 7) 50, and includes a base 52, a holding device 54, and a stage lifting device 56. The base 52 is formed in a generally rectangular flat plate shape, and the substrate 50 is mounted on the upper surface. The holding devices 54 are provided on both sides of the base 52. Then, both edges of the substrate 50 placed on the base 52 are held by the holding device 54, whereby the substrate 50 is fixedly held. The stage lifting device 56 is disposed below the base 52 and lifts the base 52.

  The resin printing unit 22 is a unit for printing an ultraviolet curable resin in a thin film form on the substrate 50 placed on the base 52 of the stage 20, and includes an inkjet head (see FIG. 6) 60 and a flattening device (see FIG. 6) 62). The inkjet head 60 discharges the ultraviolet curable resin onto the substrate 50 placed on the base 52. The inkjet head 60 may be, for example, a piezo method using a piezoelectric element, or may be a thermal method in which a resin is heated to generate air bubbles and discharged from a nozzle. The planarizing device 62 planarizes the upper surface of the ultraviolet curable resin discharged onto the substrate 50 by the ink jet head 60. For example, the excessive amount of resin can be obtained by leveling the surface of the ultraviolet curable resin, The thickness of the ultraviolet curable resin is made uniform by scraping with a roller or a blade.

  The resin curing unit 24 is a unit for curing the ultraviolet curing resin discharged onto the substrate 50, and has an irradiation device 66 (see FIG. 6). The irradiation device 66 includes a mercury lamp or an LED as a light source, and irradiates the ultraviolet curing resin discharged on the substrate 50 with ultraviolet light. Thereby, the ultraviolet curing resin discharged onto the substrate 50 is cured, and the resin layer is shaped.

  The metal ink printing unit 26 is a unit for printing metal ink on the substrate 50 in accordance with the circuit pattern, and has an ink jet head (see FIG. 6) 68. The ink jet head 68 linearly discharges the metal ink onto the substrate 50 placed on the base 52. The metal ink is one in which fine particles of metal are dispersed in a solvent. The ink jet head 68 discharges metal ink from a plurality of nozzles by, for example, a piezo method using a piezoelectric element.

  The baking unit 28 is a unit for baking the metal ink discharged onto the substrate 50, and has a laser irradiation device (see FIG. 6) 70. The laser irradiation apparatus 70 is an apparatus for irradiating a laser onto the metal ink discharged onto the substrate 50, and the metal ink irradiated with the laser is fired to form a wiring. The baking of the metal ink is a phenomenon in which evaporation of the solvent, decomposition of the metal fine particle protective film, and the like are carried out by applying energy, and the metal fine particles contact or fuse to increase the conductivity. is there. Then, the metal ink is fired to form a metal wiring.

  The mounting unit 30 is a unit for mounting the electronic component (see FIG. 8) 72 on the substrate 50, and includes a tape feeder (see FIG. 6) 74, a mounting head (see FIG. 6) 76, and a moving device (FIG. 6). See also 78). The tape feeder 74 feeds the taped electronic components 72 one by one, and supplies the electronic components 72 at the supply position. The mounting head 76 has a suction nozzle (not shown) for holding the electronic component 72 by suction. The suction nozzle sucks and holds the electronic component 72 by suction of air by being supplied with negative pressure from a positive / negative pressure supply device (not shown). Then, the electronic component 72 is detached by supplying a slight positive pressure from the positive and negative pressure supply device. In addition, the moving device 78 moves the mounting head 76 between the supply position of the electronic component 72 by the tape feeder 74 and the substrate 50 placed on the base 52. Thus, in the mounting unit 30, the electronic component 72 supplied from the tape feeder 74 is held by the suction nozzle, and the electronic component 72 held by the suction nozzle is mounted on the substrate 50.

  As shown in FIG. 2, the storage unit group 32 has a rack 80, and the inside of the rack 80 is divided into three storage units 82, 84 and 86 for storing the stage 20. Specifically, the inside of the rack 80 is partitioned by the shelf plate 88 into three spaces spaced apart in the vertical direction. Each space is sized to accommodate the stage 20, and a part of the moving device 34 described later is disposed inside each space. Then, the stage 20 is accommodated in each space by the operation of the moving device 34. Therefore, the respective spaces function as storage units 82, 84, 86 for storing the stage 20.

  As shown in FIG. 1, the moving device 34 has a rotary table 100, a slide mechanism 102, a linear motor 104, and a rack lifting device (see FIG. 2) 106. The rotary table 100 has a disk shape, is rotatably disposed substantially at the center of the base 38, and is controllably rotated by the drive of a rotary motor (see FIG. 6). The resin printing unit 22, the resin curing unit 24, the metal ink printing unit 26, the baking unit 28, the mounting unit 30, and the storage unit group 32 rotate along the rotation direction of the rotary table 100. In a state of facing the outer peripheral edge of the table 100, it is disposed at six equally spaced positions.

  The slide mechanism 102 is disposed in each of a pair of table side guide rails 110 disposed on the rotary table 100 and each unit such as the resin printing unit 22 (in the storage unit group 32, the storage units 82, 84, 86). A pair of unit-side guide rails 112 provided and four sliders 114 provided on each stage 20 are provided. The pair of table-side guide rails 110 are disposed parallel to each other and on the upper surface of the rotary table 100 in a state of being separated by a predetermined size and symmetrically about the rotation center of the rotary table 100. Further, the pair of unit-side guide rails 112 are separated from each other by the same dimension as the pair of table-side guide rails 110 in a symmetrical manner with respect to an imaginary line extending in the radial direction of the rotary table 100 in parallel with each other. It is arrange | positioned by each unit of resin printing unit 22 grade | etc., In a state. Thus, when the rotary table 100 is rotated to a predetermined position, the pair of table-side guide rails 110 and the pair of unit-side guide rails 112 of any unit are linearly arranged. In FIG. 1, the circuit forming apparatus 10 in a state in which the pair of table-side guide rails 110 and the pair of unit-side guide rails 112 of the resin printing unit 22 and the baking unit 28 are linearly arranged is illustrated. There is. The table side guide rail 110 and the unit side guide rail 112 are disposed with a predetermined clearance so as to secure the rotation of the rotary table 100.

  In each stage 20, a pair of sliders 114 is fixed to both side surfaces on one end side in the longitudinal direction, and a pair of sliders 114 is fixed to both side surfaces on the other end side. That is, four sliders 114 are fixed to both side surfaces of the stage 20. Then, the pair of sliders 114 on one side of the both sides is slidably fitted to one of the pair of table side guide rails 110 or the pair of unit side guide rails 112, A pair of sliders 114 on the other side of them is slidably fitted to the other of the pair of table side guide rails 110 or the pair of unit side guide rails 112. The length dimension of each slider 114 is made longer than the clearance between the table side guide rail 110 and the unit side guide rail 112. Thereby, as shown in FIG. 3, when the table side guide rail 110 and the unit side guide rail 112 are arranged in a straight line, between the top of the rotary table 100 and each unit such as the resin printing unit 22 etc. , Each stage 20 slides.

  The slide mechanism 102 also has a power supply mechanism (see FIG. 4) 120 for supplying power from the base 38 to each stage 20. The power supply mechanism 120 is configured of a table-side power supply wire 122, a unit-side power supply wire 124, and a power receiving terminal (see FIG. 4) 126. The table side feed wiring 122 is disposed on the top surface of each of the pair of table side guide rails 110 along the extending direction of each table side guide rail 110. The unit-side power supply wiring 124 is disposed on the upper surface of each unit-side guide rail 112 of each unit such as the resin printing unit 22 along the extending direction of each unit-side guide rail 112. Then, power is supplied to the table-side power supply wiring 122 and the unit-side power supply wiring 124 from a power supply source (not shown) disposed on the base 38. Further, as shown in FIG. 4 which is a cross-sectional view taken along the line AA of FIG. 3, the power receiving terminal 126 is disposed exposed on the inner peripheral surface of the slider 114. The table side guide rail 110 or unit side With the slider 114 fitted in the guide rail 112, the slider 114 comes in contact with the table-side power supply wire 122 or the unit-side power supply wire 124.

  Thus, when the stage 20 is positioned on the rotary table 100, the power receiving terminal 126 contacts the table-side power supply line 122, and receives power from the table-side power supply line 122. In addition, when the stage 20 is located in each unit such as the resin printing unit 22, the power receiving terminal 126 contacts the unit-side power supply wiring 124, and receives power from the unit-side power supply wiring 124. Further, even when the stage 20 slides between the rotary table 100 and each unit, power reception by the power reception terminal 126 is secured.

  Specifically, when the slider 114 reaches the clearance between the table-side guide rail 110 and the unit-side guide rail 112 when the stage 20 slides between the rotary table 100 and each unit, the power reception terminal 126 receives the table-side power supply. It will be in the state which does not contact any of wiring 122 and unit side electric supply wiring 124. However, the power receiving terminal 126 is disposed on all four sliders 114 provided on the stage 20, and the pair of sliders 114 and the pair of sliders 114 are separated in the sliding direction of the stage 20. It is arranged in the state. That is, the power receiving terminal 126 is disposed in a state of being separated forward and backward in the sliding direction of the stage 20. For this reason, the power receiving terminal 126 disposed on one of the front and the rear in the sliding direction of the stage 20 reaches the clearance between the table side guide rail 110 and the unit side guide rail 112, and the table side feed wiring 122 and the unit Even when the power supply terminal 124 is not in contact with any of the side power supply lines 124, the power reception terminal 126 disposed on the other of the front and the back in the sliding direction of the stage 20 is the table side power supply line 122 and the unit side power supply wiring. Contact with any of 124. Thus, even when the stage 20 slides between the rotary table 100 and each unit, power reception by the power reception terminal 126 is secured.

  Further, as shown in FIG. 1, the linear motor 104 has a shaft-shaped table-side stator 130 disposed on the rotary table 100 and a shaft-shaped stator disposed in each unit such as the resin printing unit 22. A unit-side stator 132 and a cylindrical movable element (see FIG. 5) 134 disposed on each stage 20 are provided. Each of the table side stator 130 and the unit side stator 132 is comprised by the cylindrical pipe 140 and the some permanent magnet 142 arrange | positioned in the pipe 140, as shown in FIG. . Each of the plurality of permanent magnets 142 is generally cylindrical, with one end side being an N pole and the other end side being an S pole. The plurality of permanent magnets 142 are arranged to extend along one axis, and the facing ends of two adjacent permanent magnets 142 have the same magnetic pole. A spacer (not shown) made of nonmagnetic material is provided between two adjacent permanent magnets 142. The pipe 140 is provided so as to cover the plurality of permanent magnets 142 disposed to extend along one axis, and is formed of a nonmagnetic material.

  Further, the mover 134 is fixed to the lower surface side of the stage 20, and is constituted by a plurality of cylindrical coils 146. Each of the plurality of coils 146 is formed by winding a wire into a cylindrical shape, and the gap between the wires is filled with a resin. The plurality of coils 146 are provided concentrically at equal intervals, and an annular spacer (not shown) made of nonmagnetic material is provided between two adjacent coils 146. A plurality of coils 146 and spacers are fitted to the outer peripheral surface of the shaft-like table side stator 130 or the unit side stator 132 in a state of clearance. As a result, by supplying power to the coil 146 of the mover 134, the stage 20 controllably slides in the axial direction of the table-side stator 130 or the unit-side stator 132. The power supply to the mover 134 is performed via the power supply mechanism 120. That is, the power received by the power receiving terminal 126 from the table-side power supply wiring 122 or the unit-side power supply wiring 124 is supplied to the mover 134. Further, the length dimension of the mover 134 is made longer than the clearance between the table side stator 130 and the unit side stator 132. Thereby, when the table side stator 130 and the unit side stator 132 are linearly arranged, the linear motor 104 is driven between the top of the rotary table 100 and each unit such as the resin printing unit 22. , The stage 20 slides.

  Further, as shown in FIG. 2, the rack lifting and lowering device 106 is disposed below the rack 80 of the storage unit group 32 and lifts and lowers the rack 80. As a result, the unit-side guide rails 112 and the unit-side stator 132 disposed in each of the storage units 82, 84 and 86 are arranged on the rotary table 100, and the table-side guide rails 110 and the table-side stator are disposed. The rack 80 is raised and lowered so that the same height as 130 is obtained, and the table side guide rail 110 and the unit side guide rail 112 are linearly arranged, and the table side stator 130 and the unit side stator 132 are linear Each stage 20 is controllably slid by the drive of the linear motor 104 between the top of the rotary table 100 and each of the storage units 82, 84, 86 by rotating the rotary table 100 so as to be disposed in .

  Further, as shown in FIG. 6, the control device 36 includes a controller 150 and a plurality of drive circuits 152. The plurality of drive circuits 152 includes the holding device 54, the stage lifting device 56, the inkjet head 60, the flattening device 62, the irradiation device 66, the inkjet head 68, the laser irradiation device 70, the tape feeder 74, the mounting head 76, and the moving device 78. , The linear motor 104, the rack lifting device 106, and the rotary motor 108. The controller 150 includes a CPU, a ROM, a RAM and the like, is mainly composed of a computer, and is connected to a plurality of drive circuits 152. Thus, the controller 150 controls the operation of the stage 20, the resin printing unit 22, the resin curing unit 24, the metal ink printing unit 26, the baking unit 28, the mounting unit 30, and the storage unit group 32.

Operation of Circuit Forming Device In the circuit forming device 10, eight components of the resin printing unit 22, the resin curing unit 24, the metal ink printing unit 26, the baking unit 28, the mounting unit 30, and the storage units 82, 84 and 86 are provided. A plurality of stages 20 are sequentially moved between the units via the rotary table 100, and a task is performed in each unit to form a circuit. In the circuit forming device 10, the seven stages 20 are sequentially moved among the eight units by the operation of the moving device 34. Hereinafter, a method of forming a circuit on the substrate 50 by moving one of the seven stages 20 among the units will be described.

  Specifically, the substrate 50 is set on the base 52 of the stage 20, and the stage 20 is moved between the resin printing unit 22 and the resin curing unit 24. Then, in the resin printing unit 22 and the resin curing unit 24, as shown in FIG. 7, the resin layer 160 is formed on the substrate 50. The resin layer 160 has a cavity 162 for mounting the electronic component 72, and the discharge of the ultraviolet curable resin from the ink jet head 60 and the irradiation of the ultraviolet light by the irradiation device 66 to the discharged ultraviolet curable resin are It is formed by repeating.

  Specifically, in the resin printing unit 22, the inkjet head 60 discharges the ultraviolet curing resin in a thin film form on the upper surface of the substrate 50. At this time, the inkjet head 60 discharges the ultraviolet curable resin so that a predetermined portion of the upper surface of the substrate 50 is exposed in a generally rectangular shape. Subsequently, when the ultraviolet curable resin is discharged in the form of a thin film, the ultraviolet curable resin is flattened by the flattening device 62 so that the film thickness of the ultraviolet curable resin becomes uniform. Then, the stage 20 is moved from the resin printing unit 22 to the resin curing unit 24. In the resin curing unit 24, the irradiation device 66 irradiates the thin film ultraviolet curing resin with ultraviolet light. Thus, a thin resin layer is formed on the substrate 50.

  Subsequently, the stage 20 is moved from the resin curing unit 24 to the resin printing unit 22 again. Then, in the resin printing unit 22, the inkjet head 60 discharges the ultraviolet curing resin in a thin film form only on the portion on the thin film resin layer. That is, the inkjet head 60 discharges the ultraviolet curable resin in a thin film form on the thin film resin layer so that a predetermined portion of the upper surface of the substrate 50 is exposed in a generally rectangular shape. Then, the thin film ultraviolet curable resin is planarized by the planarizing device 62. Next, the stage 20 is moved again from the resin printing unit 22 to the resin curing unit 24, and in the resin curing unit 24, the irradiation device 66 irradiates the thin film ultraviolet curing resin with ultraviolet light. Thus, the thin film resin layer is laminated on the thin film resin layer. Thus, in the resin printing unit 22 and the resin curing unit 24, the discharge of the ultraviolet curing resin on the thin film resin layer, the flattening of the ultraviolet curing resin, and the irradiation of the ultraviolet radiation are repeated, A resin layer 160 having a cavity 162 is formed.

  When the resin layer 160 is formed by the above-described procedure, the stage 20 is moved to the mounting unit 30. In the mounting unit 30, the electronic component 72 is supplied by the tape feeder 74, and the electronic component 72 is held by the suction nozzle of the mounting head 76. Then, the mounting head 76 is moved by the moving device 78, and the electronic component 72 held by the suction nozzle is at the predetermined mounting position of the substrate 50 inside the cavity 162 of the resin layer 160, as shown in FIG. It is attached. The height dimension of the resin layer 160 and the height dimension of the electronic component 72 are substantially the same.

  When the electronic component 72 is attached to the substrate 50 inside the cavity 162, the gap between the cavities 162, that is, the inner wall surface that partitions the cavity 162, in the resin printing unit 22 and the resin curing unit 24, as shown in FIG. And the side wall surface of the electronic component 72, a resin layer 166 is formed. In addition, since the resin layer 166 is formed by the same method as the resin layer 160, the description of the method of forming the resin layer 166 is omitted. The height dimension of the resin layer 166 is substantially the same as the height dimension of the resin layer 160 and the electronic component 72. Thereby, the upper surface of the resin layer 160, the upper surface of the resin layer 166, and the upper surface of the electronic component 72 are flush with each other.

  Next, when the resin layer 166 is formed in the gap of the cavity 162, the stage 20 is moved to the metal ink printing unit 26. Then, in the metal ink printing unit 26, the metal ink is discharged linearly on the resin layers 160 and 166 in accordance with the circuit pattern by the ink jet head 68. At this time, as shown in FIG. 10, the metal ink 168 is discharged linearly so as to connect the electrode 170 of the electronic component 72 and another electrode (not shown). Subsequently, when the metal ink 168 is printed, the stage 20 is moved to the baking unit 28. Then, in the baking unit 28, the ejected metal ink 168 is irradiated with a laser by the laser irradiation device 70. Thereby, the metal ink 168 is fired to form a wiring connecting the electrodes.

  As described above, in the circuit forming apparatus 10, one stage 20 sequentially moves the resin printing unit 22, the resin curing unit 24, the mounting unit 30, the metal ink printing unit 26, and the baking unit 28 so as to be ultraviolet curable. A circuit is formed by performing a printing process of resin, a process of curing ultraviolet curing resin, a mounting process of electronic component 72, a printing process of metal ink, and a baking process of metal ink. Also, in a unit different from the unit working on the one stage (which may hereinafter be referred to as the “first stage”) 20, a stage different from the first stage 20 (hereinafter “the first stage”) By performing the operation on the stage 20 (which may be described as “the second stage”), it becomes possible to perform various processes in parallel in both the first stage and the second stage 20.

  Specifically, for example, while the first stage 20 is moved to the resin printing unit 22 and the resin printing unit 22 is working on the first stage 20, the second stage 20 is printed with metal ink. By moving to the unit 26, it is possible to work on the second stage 20 in the metal ink printing unit 26. That is, various operations are simultaneously performed on both the substrate 50 held by the first stage 20 and the substrate 50 held by the second stage 20. This makes it possible to create many circuits at the same time, and improves the circuit creation capability. In particular, in the circuit forming apparatus 10, seven stages 20 are movable between the units, so the resin printing unit 22, the resin curing unit 24, the mounting unit 30, the metal ink printing unit 26, and the baking unit 28 It becomes possible to work at the same time in the five units in the above, and the circuit creation ability is significantly improved.

  Further, by the improvement of the circuit forming ability, it is possible to reduce the number of replenishments of the metal ink to the ink jet head 68. Specifically, since metal particles are obtained by dispersing metal particles in a solvent, the metal ink has a high deterioration rate due to the precipitation of metal particles and the decrease in the dispersibility of metal particles. Therefore, the ink jet head 68 is replenished with an amount of metal ink used within a predetermined time. That is, when the number of formed circuits per unit time is small, only a small amount of metal ink can be replenished to the ink jet head 68, and the number of times of metal ink replenishment to the ink jet head 68 increases. On the other hand, in the circuit forming apparatus 10, since it is possible to work simultaneously in five units, the number of formed circuits per unit time is increased. Therefore, a large amount of metal ink can be replenished to the ink jet head 68, and the number of times of metal ink replenishment to the ink jet head 68 can be reduced.

  The metal ink and the ultraviolet curable resin contain volatile components such as a solvent, and depending on the type and amount of the volatile components, a drying step may be required. In detail, if the ultraviolet curable resin is not dried before being irradiated with the ultraviolet light, the ultraviolet curable resin may not be appropriately cured by the irradiation of the ultraviolet light. In addition, if the metal ink is not dried before the laser is irradiated to the printed metal ink, the metal ink may not be appropriately fired by the laser irradiation. Therefore, it may be necessary to dry the ultraviolet curable resin or the metal ink before the printed ultraviolet curable resin or the metal ink is irradiated with the ultraviolet light or the laser. And in this drying process, in order to prevent denaturation of the component by heating, natural drying may be preferable without performing heating etc. In natural drying, it may be left for 1 hour or more. As described above, when the stage 20 is left in the resin printing unit 22, the resin curing unit 24, the mounting unit 30, the metal ink printing unit 26, and the baking unit 28 for a long time, the working efficiency is lowered.

  For this reason, the storage unit group 32 is provided in the circuit forming apparatus 10, and natural drying is performed in the storage units 82, 84, 86 of the storage unit group 32. That is, when the UV curable resin or the metal ink is printed on the substrate 50 and the UV curable resin or the metal ink needs to be naturally dried, the stage 20 for holding the printed substrate 50 is accommodated. The units 82, 84 and 86 are accommodated. As a result, in the resin printing unit 22, the resin curing unit 24, the mounting unit 30, the metal ink printing unit 26, and the baking unit 28, the stage 20 is not left for a long time, and a reduction in work efficiency can be prevented. It becomes. In particular, in the storage unit group 32, three storage units 82, 84, 86 are provided, and it becomes possible to leave the three stages 20, and a natural drying process may be performed on many substrates 50. It becomes possible. In addition, the three storage units 82, 84, 86 are disposed vertically separated from one another, and by raising and lowering the rack 80 by the rack lifting device 106, the storage units 82, 84, It is possible to store the stage 20 in 86. As a result, it is possible to reduce the installation space of the storage units 82, 84, 86.

  Furthermore, in the circuit forming apparatus 10, seven stages 20 are movable among eight units, so that circuit formation can be performed most efficiently. Specifically, when the stage 20 is located in all eight units, the stage 20 can not be moved between the units. For this reason, in order to move the stage 20 between units, it is necessary that the stage 20 not be located in at least one unit. On the other hand, the larger the number of stages 20, the higher the form success rate of the circuit. For this reason, using the number of stages 20 smaller than the number of units, that is, using seven stages 20 in the circuit forming apparatus 10, enables circuit formation to be performed most efficiently.

  Further, in the circuit forming apparatus 10, the rotating table 100 is adopted as the moving device 34 for moving the stage 20, and units such as the resin printing unit 22 are arranged along the outer peripheral edge of the rotating table 100. There is. As a result, the moving distance of the stage 20 can be reduced, and circuit formation can be performed efficiently.

  Incidentally, in the above embodiment, the circuit forming device 10 is an example of the circuit forming device. The stage 20 is an example of a stage. The resin printing unit 22 is an example of a resin layer forming unit. The metal ink printing unit 26 is an example of a wiring forming unit. The moving device 34 is an example of a moving device. The inkjet head 60 is an example of a first discharge device. The inkjet head 68 is an example of a second discharge device. The rotary table 100 is an example of a rotary table. The rack lifting device 106 is an example of the lifting device. The table side guide rail 110 is an example of a table side guide rail. The unit side guide rail 112 is an example of a unit side guide rail. The slider 114 is an example of a slider. The table-side feed wiring 122 and the unit-side feed wiring 124 are examples of a feed terminal. The power receiving terminal 126 is an example of a power receiving terminal.

  The present invention is not limited to the above-described embodiments, and can be implemented in various modes in which various changes and improvements are made based on the knowledge of those skilled in the art. For example, in the above embodiment, eight units of the resin printing unit 22, the resin curing unit 24, the metal ink printing unit 26, the baking unit 28, the mounting unit 30, and the storage units 82, 84, 86 are employed. It is possible to employ any number of units. However, in the circuit forming apparatus 10, since the formation of the resin layer and the wiring is essential, the resin printing unit 22 and the metal ink printing unit 26 need to be adopted. On the other hand, since there are curable resins such as ultraviolet curable resins and metal inks, which cure by natural drying depending on the types, the resin curing unit 24 and the baking unit 28 may be adopted as needed. Also, the mounting unit 30 and the storage units 82, 84, 86 may be adopted as necessary. In addition to the above units, various units such as a unit for drying an ultraviolet curable resin with an infrared lamp or the like, a unit for baking a metal ink with an electric furnace or the like, and the like may be adopted.

  Further, in the above embodiment, the rotary table 100 is adopted as the moving device for moving the stage 20, but a moving device for moving the stage 20 in the XY direction may be adopted. When a moving device for moving the stage 20 in the X and Y directions is adopted, the plurality of units are arranged side by side in at least one of the X direction and the Y direction, so that the stages can be efficiently performed between the units. It becomes possible to move 20.

  10: circuit forming device 20: stage 22: resin printing unit (resin layer forming unit) 26: metal ink printing unit (wiring forming unit) 34: moving device 60: ink jet head (first discharge device) 68: ink jet head (first 2 Discharge device) 100: Rotary table 106: Rack lifting device (lifting device) 110: Table side guide rail 112: Unit side guide rail 114: Slider 122: Table side feed wiring (feed terminal) 124: Unit side feed wiring (feed) Terminal) 126: Power receiving terminal

Claims (6)

A plurality of units including at least a resin layer forming unit including a first discharge device discharging a curable resin, and a wiring formation unit including a second discharge device discharging a metal-containing liquid containing metal fine particles;
A plurality of stages on which the substrate is mounted;
A moving device for moving each of the plurality of stages to any one of the plurality of units, and a resin layer formed by the discharge of the curable resin of the first discharge device, and the second discharge The circuit formation apparatus which forms the circuit containing the wiring formed by discharge of the metal containing liquid of an apparatus on a board | substrate. The moving device
The circuit forming apparatus according to claim 1, further comprising a rotary table for rotating any one of the plurality of stages toward each of the plurality of units. The plurality of units are
The circuit forming apparatus according to claim 2, wherein the circuit forming apparatus is disposed along the rotation direction of the rotary table. The moving device
A table side guide rail provided on the rotary table;
Unit-side guide rails provided in each of the plurality of units;
Provided on each of the plurality of stages, and when each stage is rotated by the rotary table toward any one of the plurality of units, the unit-side guide rails of that one unit; A slider sliding across the table-side guide rail;
A feed terminal provided to extend along each of the table-side guide rail and the unit-side guide rail;
And a pair of power reception terminals provided on the slider and in sliding contact with the power supply terminal when the slider slides.
The circuit according to claim 2 or 3, wherein the pair of power reception terminals are disposed in a state of being separated in the extending direction of each of the table-side guide rail and the unit-side guide rail. Forming device.   The circuit formation device according to any one of claims 1 to 4, wherein the number of the plurality of stages is one less than the number of the plurality of units. Two or more units of the plurality of units are disposed in a state of being vertically separated from each other,
The moving device
In order to move each of the plurality of stages toward each of two or more units disposed in a state of being separated in the up and down direction, it has an elevation device for raising and lowering the stages. A circuit forming apparatus according to any one of the preceding claims.

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