JP2003249429A - Coating processing device and substrate treatment device using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a coating processing device and a substrate treatment device using the same, capable of processing coating of substrates precisely and of processing substrate jointly with external devices efficiently. <P>SOLUTION: An application dedicated unit 16 applies a coating to the top surface of a substrate W and a cleaning dedicated unit 17 cleans the rear surface of the substrate W and removes the stain of the applied liquid (photoresist liquid) from the same in a cleaning process (back cleaning process). Since the spinning chuck for the cleaning dedicated unit 17 is smaller is diameter than that for the application dedicated unit 16, stain removing capability is enhanced because the area sucked and held by the cleaning dedicated unit 17 is smaller than that sucked and held by the application dedicated unit 16. As the result, liquid application to the substrate W is performed with enhanced precision. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coating processing apparatus for supplying a coating liquid such as a photoresist liquid onto a substrate such as a semiconductor wafer or a glass substrate for a liquid crystal display, and coating the substrate. And a substrate processing apparatus using the same.

[0002]

2. Description of the Related Art Conventionally, as a coating processing apparatus for supplying a coating liquid such as a photoresist liquid onto a substrate and coating the substrate, for example, the coating liquid is once coated and formed on a coating sheet. After that, the coating liquid is supplied onto the substrate by pasting the sheet onto the substrate, and the sheet and the substrate which have been pasted are heat-treated and then the sheet is peeled from the substrate to form the coating film formed on the sheet onto the substrate. A thermal transfer type coating processing device for transferring, a scanning type coating processing device for discharging the coating liquid while the slit nozzle scans (scans) the stationary substrate to supply it onto the substrate, and rotating the substrate at high speed. There is a coating processing apparatus (spin coater) that supplies a coating liquid near the center of the substrate and forms a thin film of the coating liquid over the entire surface from the center of the substrate by the centrifugal force of the substrate.

Taking a photolithography process as an example in which the coating liquid is a photoresist liquid, the photolithography process supplies the photoresist liquid onto the substrate to form a photoresist film on the substrate (coating treatment). )
Then, the substrate formed by coating is subjected to an exposure process, and the substrate after the exposure process is further developed (developing process).

Usually, the coating process and the developing process are performed by the same substrate processing apparatus using the coating processing apparatus, and the exposure processing is performed by an exposure apparatus which is an external processing apparatus connected to the substrate processing apparatus. Done. Further, the transfer of the substrate between the substrate processing apparatus and the exposure processing apparatus described above is
This is performed via an interface provided on the substrate processing apparatus side.

[0005]

However, the conventional example having such a structure has the following problems. That is, there is a problem that exposure failure (defocus) occurs when the exposure apparatus performs the exposure processing on the substrate on which the coating processing is performed.

That is, when the height from the lens of the exposure apparatus to the surface of the substrate varies depending on the position of the substrate,
The height may change and the focus may be blurred beyond the depth of focus of the lens. As a result, exposure failure occurs, which adversely affects the uniformity of the line width of the pattern obtained by the exposure process. Conventionally, such exposure failure is considered to be caused by particles adhering to the surface of the substrate and non-uniformity of the photoresist film formed by coating on the substrate. Therefore, the surface of the substrate is washed before the coating process, or in the case of a spin coater, the rotation speed of the substrate is adjusted to make the photoresist film uniform. However, the exposure failure was not fundamentally solved even by performing only the surface cleaning as described above.

The present invention has been made in view of the above circumstances, and a coating processing apparatus for accurately performing substrate coating processing and efficiently performing substrate processing with an external processing apparatus. An object is to provide a substrate processing apparatus used.

[0008]

Means for Solving the Problems The inventors of the present invention have earnestly studied in order to solve the above problems, and have obtained the following findings. In other words, it has been considered that the cause of the exposure failure of the substrate is only the front surface of the substrate, but the idea is changed to assume that the back surface of the substrate also causes the exposure failure. Experiments were conducted. As a result, on the back surface of the substrate, unnecessary coating liquid that spilled over to the back surface of the substrate when supplying the coating liquid to the front surface of the substrate, or a vacuum chuck that sucks the back surface of the substrate in the pre-process of the exposure process, etc. It was confirmed that the marks of holding at the time of holding or stains such as particles adhered, and exposure defects are reduced by cleaning and removing these stains. As a known technique for cleaning and removing the dirt adhering to the back surface of the substrate, there is, for example, a back rinse that cleans and removes the dirt on the back surface of the substrate by discharging a cleaning liquid from a nozzle on the back surface side. However, the coating process and the cleaning process such as the back rinse described above are performed in series, and there is a limit to cleaning and removing stains on the back surface of the substrate in such a series of processes. In addition, dirt attached to the previously processed substrate
In some cases, the dirt adheres to the mounting table on which the substrate is mounted and the dirt adheres to the substrate to be processed later. On the other hand,
It may be possible to improve the ability to remove dirt adhering to the back surface of the substrate by periodically cleaning the mounting table of the substrate processing apparatus, especially the coating processing apparatus, but it may take time to move peripheral equipment. I will end up. Therefore, in order to reduce the exposure failure in the subsequent exposure process, it is preferable to separately perform the coating process and the cleaning process for cleaning and removing the stain on the back surface of the substrate. The present invention based on such knowledge has the following configurations.

That is, according to the first aspect of the present invention, the first processing unit that supplies the coating liquid onto the substrate and the second processing unit that supplies the cleaning liquid to the substrate processed by the first processing unit. A coating processing apparatus comprising:
A first substrate holding means for holding the substrate in a horizontal posture while supporting the back surface of the substrate in the first support area, and a coating solution for supplying a coating liquid to the front surface of the substrate held by the first substrate holding means. A liquid supply unit, and the second processing unit includes the first processing unit.
The second substrate holding means for holding the substrate in a horizontal posture while supporting the second support area different from the second support area and the back surface of the substrate held by the second substrate holding means. And a cleaning liquid supply means for supplying a cleaning liquid so as to clean a part or the whole of the support region.

[Operation / Effect] According to the invention as set forth in claim 1, a coating process for supplying the coating liquid from the coating liquid supply means to the surface of the substrate to perform the coating process on the surface of the substrate, and the substrate The cleaning process of supplying the cleaning liquid from the cleaning liquid supply means to the back surface of the substrate in order to clean and remove the dirt attached to the back surface of the substrate is divided into the first and second processing units, and the coating process is applied to the first processing unit. , The second processing section is made to perform the cleaning processing, respectively. Furthermore, a first substrate holding unit that holds the substrate in a horizontal posture while supporting the back surface of the substrate in the first support region is provided on the first processing unit side with a second substrate different from the first support region. A second substrate holding unit that holds the substrate in a horizontal posture while supporting the support region is provided on the second processing unit side, respectively. Then, since the cleaning liquid is supplied to the back surface of the substrate held by the second substrate holding means so as to clean a part or the whole of the first support region, the ability to remove dirt adhering to the back surface of the substrate. Can be improved. As a result, the substrate coating process can be performed accurately.

As a method for the second substrate holding means to support the second supporting area different from the first supporting area, for example, the first substrate holding means is supported near the center of the back surface of the substrate. Is configured to hold the substrate in a horizontal posture, and the second substrate holding means is configured to hold the substrate in a horizontal posture by supporting an edge of the substrate (the invention of claim 2). ) Method or the first substrate holding means is configured to hold the substrate by supporting the first substrate holding means in the first supporting area including the vicinity of the center of the back surface of the substrate, and the second substrate holding means is configured to hold the substrate. Second including the vicinity of the center of the back surface
There is a method of supporting the substrate by supporting it in the supporting region (invention according to claim 3).

Further, in order to support the vicinity of the center of the back surface of the substrate, specifically, a vacuum for holding the substrate in a horizontal posture by sucking and supporting the vicinity of the center of the back surface of the substrate by the first substrate holding means. It may be constituted by a chuck (the invention according to claim 4).

As the latter method (the invention according to claim 3), for example, the first and second processing units support the second supporting region different from the first supporting region. While the support regions both include the vicinity of the center of the back surface of the substrate, the support regions may be offset from each other, or, for example, the first support region may have a smaller area than the first support region. And a method for forming the second substrate holding means (the invention according to claim 5).

In a fifth aspect of the present invention, specifically, the first and second substrate holding means are vacuum chucks that hold the substrate in a horizontal position by adsorbing and supporting the vicinity of the center of the back surface of the substrate. The diameter of the vacuum chuck constituting each of the second substrate holding means is smaller than the diameter of the vacuum chuck constituting the first substrate holding means (the invention according to claim 6). .

As another method (the invention according to claim 1), for example, a plurality of places (for example, three places) near the center and other than the edge are used as the first or second support regions, and the first or second support region is formed. The substrate holding means is provided with a method of supporting the plurality of locations, or, for example, a transfer means for reversing the substrate between the first and second processing units and remounting the substrate is provided, and the substrate is reversed by the transfer means. The second substrate holding means holds the substrate in a horizontal posture while supporting the second supporting area different from the first supporting area (the invention according to claim 7). Can be mentioned.

It should be noted that the stains adhering to the substrate are washed and removed not only on the back surface described above, but, for example, when the stains adhering to the edge of the front surface of the substrate are washed away or on the edge of the back surface of the substrate. There is an edge cleaning process (for example, edge rinse) for cleaning and removing the edge of the substrate as in the case of cleaning and removing the adhered dirt. In the coating processing apparatus according to the present invention,
These edge cleaning processes may be performed by the first processing unit or the second processing unit. For example, the edge cleaning means for cleaning the edge of the substrate may be the first processing section or the second processing section.
At least one of the processing units is provided (the invention according to claim 8).

In the case of the invention described in claim 8 described above, it is preferable to configure as follows. That is, the first cleaning unit is provided with the edge cleaning unit and supports the edge of the substrate to transfer the substrate between the first processing unit and the second processing unit. The first processing unit performs the coating process on the surface of the substrate, performs the edge cleaning process for cleaning the edge of the substrate, and then performs the coating process and the edge cleaning process on the substrate. One substrate is transferred from the first processing unit to the second processing unit by the first transfer unit, and one of the first support regions on the back surface of the substrate is transferred by the second processing unit with respect to the substrate transferred by the first transfer unit. A cleaning process for cleaning a part or the whole is performed (the invention according to claim 9).

According to the invention described in claim 9, a carrier such as a first carrier means for supporting the edge of the substrate and carrying the substrate between the first processing section and the second processing section. It is useful in the case of means. That is, since the first processing unit performs the coating process on the surface of the substrate and the edge cleaning process for cleaning the edge of the substrate first, the first transfer unit cleans the edge of the substrate. At the stage of supporting and transporting to the second processing unit, the edge of the substrate is not contaminated. Therefore, when the edge cleaning process for cleaning and removing the dirt adhering to the edge of the substrate is carried to the second processing section without performing the cleaning in the first processing section, the dirt adhering to the edge of the substrate is The first transport means not only adheres to the first transport means but also adversely affects the second processing section through the first transport means. However, in the case of the invention of claim 9, the first transport means Contamination of the means and adverse effects on the second processing unit can be reduced.

A substrate processing apparatus can also be constructed using the coating processing apparatus according to the present invention. The substrate processing apparatus according to claim 10 has the following configuration. That is, the invention according to claim 10 is from claim 1 to claim 9.
A substrate processing apparatus using the coating processing apparatus according to any one of claims 1 to 4, wherein a first processing unit that supplies the coating liquid onto the substrate,
A second processing unit that supplies a cleaning liquid to the substrate processed by the first processing unit; and the first and second processing units,
A second transporting unit that transports the substrate between the plurality of processing units that respectively perform the substrate processing is provided, and the first processing unit supports the back surface of the substrate in the first supporting region while maintaining the horizontal posture. And a coating liquid supply unit configured to supply a coating liquid to the surface of the substrate held by the first substrate holding unit, and the second processing unit may include:
A second substrate holding means for holding the substrate in a horizontal posture while supporting a second supporting area different from the first supporting area, and a back surface of the substrate held by the second substrate holding means, A cleaning liquid supply means for supplying a cleaning liquid so as to clean a part or all of the first support region is provided.

[Operation / Effect] According to the tenth aspect of the invention, the second transfer for transferring the substrate between the plurality of processing units for respectively performing the substrate processing including the first and second processing units Since the means is provided, it is possible to efficiently perform a series of substrate processing including coating processing and cleaning processing for cleaning and removing dirt adhering to the back surface of the substrate.

Further, the substrate processing apparatus according to the eleventh aspect has the following configuration. That is, the invention according to claim 11 is a substrate processing apparatus using the coating processing apparatus according to any one of claims 1 to 9, wherein the first processing unit supplies a coating liquid onto the substrate. And a second processing unit that supplies a cleaning liquid to the substrate processed by the first processing unit, and a plurality of processing units that perform the substrate processing, including the first and second processing units, respectively. A second transfer means for transferring the substrate, an external processing device connected to the substrate processing device, and an interface for relaying the transfer of the substrate between the processing unit and the external processing device, and the first processing And a first substrate holding means for holding the substrate in a horizontal posture while supporting the back surface of the substrate in the first support region, and the first portion.
Coating solution supplying means for supplying a coating solution to the surface of the substrate held by the substrate holding means of the above, and the second processing section supports a second supporting area different from the first supporting area. And a second substrate holding means for holding the substrate in a horizontal posture,
On the back surface of the substrate held by the second substrate holding means, there is provided a cleaning liquid supply means for supplying a cleaning liquid so as to clean a part or all of the first support region. .

[Operation / Effect] According to the eleventh aspect of the present invention, it is provided with an external processing apparatus provided in series with the substrate processing apparatus, and an interface for relaying substrate transfer between the processing unit and the external processing apparatus. As a result, the substrate on which the coating process has been performed accurately in the coating processing apparatus can be transported to the external processing apparatus via the interface. As a result, since the substrate coating process is performed accurately,
Substrate processing can be efficiently performed with an external processing apparatus.

When the above-mentioned external processing apparatus is an exposure apparatus that performs exposure processing on a substrate that has been subjected to coating processing (the invention according to claim 12), the following effects can be obtained. That is, since the coating process of the substrate is accurately performed in the coating processing apparatus by improving the removal ability of the coating liquid on the back surface of the substrate, the exposure failure due to the dirt attached to the back surface of the substrate is compared with the conventional one. Can be reduced.

The present specification discloses a coating treatment apparatus different from the present invention, which is created based on the above knowledge in order to efficiently remove the dirt attached to the end surface of the substrate.

(1) A coating processing apparatus comprising a third processing unit for supplying a coating liquid onto a substrate and a second processing unit for supplying a cleaning liquid to the substrate processed by the third processing unit. The third processing unit supports the end surface of the substrate and holds the substrate in a horizontal posture, and a coating liquid on the surface of the substrate held by the third substrate holding unit. A second processing unit that holds the substrate in a horizontal posture while supporting a region different from the end surface of the substrate supported by the third substrate holding unit, and a coating liquid supply unit that supplies the substrate. Substrate holding means and cleaning liquid supply means for supplying a cleaning liquid so as to at least clean the end surface of the substrate supported by the third substrate holding means on the substrate held by the second substrate holding means. A coating treatment apparatus characterized by the above.

[Operation / Effect] In the case of the present invention (the invention according to claim 1 to claim 9), the dirt adhered to the back surface of the substrate can be removed by washing, but the cleaning liquid can remove the stain on the substrate. There is a possibility that only the back surface will not reach the end surface, and the stains adhering to the end surface of the substrate cannot be washed and removed. Therefore, in the present invention, if the back surface of the substrate is replaced with the end surface of the substrate, that is, if it is configured as in the above invention, it is possible to clean and remove the dirt attached to the end surface of the substrate. In the present specification, "the end surface of the substrate" means a vertical surface that extends across the front surface and the back surface that are horizontal surfaces, that is, the side surface of the substrate, and "the edge of the substrate" includes the end surface of the substrate, and the surface of the substrate. And the edge of the back surface.

[0027]

DESCRIPTION OF THE PREFERRED EMBODIMENTS [First Embodiment] A first embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a plan block diagram of a main part of a substrate processing apparatus using the coating processing apparatus according to the first embodiment, FIG. 2 is a schematic side view of a dedicated coating unit of the coating processing apparatus, and FIG. FIG. 3 is a schematic side view of a rinse-dedicated unit of the coating processing apparatus. Further, in the first embodiment and the second and third embodiments described later, in the photolithography process, the coating liquid is supplied to the vicinity of the center of the substrate while rotating the substrate at a high speed, and the entire surface is removed from the center of the substrate by the centrifugal force of the substrate. A substrate processing apparatus using a spin coater for forming a thin film of a coating liquid will be described as an example.

As shown in FIG. 1, the substrate processing apparatus according to the first embodiment comprises a cassette mounting table 1, an indexer 2, a processing block 3 and an interface 4.
The interface 4 is configured to connect the substrate processing apparatus according to the first embodiment and a separate apparatus. First
In the case of the embodiment, the interface 4 is configured to connect the substrate processing apparatus that performs the coating process and the developing process to the exposure device that performs the exposure process of the substrate (for example, a stepper that performs step exposure). There is. The exposure device (not shown) corresponds to the external processing device in the present invention.

The cassette mounting table 1 is, as shown in FIG.
It includes a loading unit 5 for loading a cassette (not shown) containing a plurality of unprocessed substrates W (for example, 25), and a dispensing unit 6 for dispensing a cassette containing the processed substrates W. The loading section 5 is provided with loading platforms 5a and 5b for loading a cassette, and the dispensing section 6 is provided with dispensing platforms 6a and 6b for loading a cassette, respectively.

The indexer 2 (hereinafter abbreviated as “ID” as appropriate) is provided with an ID transfer mechanism 7 for transferring the substrate W along the longitudinal direction of the indexer 2. The ID transport mechanism 7 is configured to be rotatable in the direction of arrow RA in FIG. 1 and movable in the direction of arrow RB, and extendable / contractible in the direction of arrow RC, which is the radial direction of rotation. And the arm 7b. The arm 7b is configured to convey the substrate W by supporting the back surface of the substrate W. Further, the base 7a is configured to be able to move up and down. The ID transport mechanism 7 configured in this way is
The substrate W is transported between the loading unit 5 and the dispensing unit 6 of the cassette mounting table 1 and the processing block 3.

As shown in FIG. 1, the processing block 3 includes a processing transport path 8, two coating heat treatment sections 9, a coating treatment section 10, two developing treatment heat treatment sections 11, and a developing treatment section 12. , Processing transport mechanism 13, coating transport path 14,
And a coating transport mechanism 15. Two heat treatment parts 9 for coating treatment, sandwiching the processing conveyance path 8,
The coating processing section 10 is arranged on one side of the processing conveyance path 8, and two thermal processing sections 11 and 12 for development processing are arranged on the other side of the processing conveyance path 8. Further, of the two heat treatment parts 9 for coating treatment, one heat treatment part 9 is arranged on the indexer 2 side, and
The other heat treatment section 9 is arranged on the interface 4 side. Similarly, of the two heat treatment sections 11 for development processing,
One heat treatment unit 11 is arranged on the indexer 2 side, and the other heat treatment unit 11 is arranged on the interface 4 side. The coating processing unit 10 corresponds to the coating processing apparatus in the present invention.

The processing transport mechanism 13 is the ID transport mechanism 7.
1 is rotatable in the direction of arrow RD in FIG.
The base 13a is configured to be movable in the direction E, and the arm 13b is configured to be expandable / contractible in the direction of the arrow RF, which is the radial direction of rotation. This arm 13b
Is configured to convey the substrate W by supporting the edge of the substrate W. Further, the base 13a is configured to be able to move up and down. The processing transport mechanism 13 configured as described above includes two thermal processing sections 9 for coating processing, a coating processing section 10, two thermal processing sections 11 for developing processing, along the longitudinal direction of the processing transport path 8. Then, the substrate W is transported between the development processing section 12. The processing transfer mechanism 13 corresponds to the second transfer unit in the present invention.

The coating transport mechanism 15 includes a coating transport path 1
The substrate W is transported between the dedicated coating unit 16 and the dedicated rinse unit 17 of the coating processing unit 10 along the longitudinal direction of 4. Since the coating transport mechanism 15 has the same configuration as the processing transport mechanism 13, the description of the specific configuration is omitted. The coating transport mechanism 15 corresponds to the first transport means in the present invention, and the coating dedicated unit 16 corresponds to the first transport unit in the present invention.
The rinsing dedicated unit 17 corresponds to the second processing unit of the present invention.

Interface 4 (hereinafter referred to as "IF" as appropriate)
(Hereinafter abbreviated), an IF transfer mechanism 18 that transfers the substrate W is provided along the longitudinal direction of the interface 4. The IF transport mechanism 18 transports the substrate W between the processing block 3 and the exposure apparatus. IF transport mechanism 18
Has the same configuration as that of the ID transport mechanism 7, the description of the specific configuration will be omitted.

A Pass which is placed to transfer the substrate W between the heat treatment unit 9 for coating and the indexer 2.
On the interface 4 side, a Pass is mounted on the heat treatment unit 9 disposed on the indexer 2 side for transferring the substrate W between the heat treatment unit 9 for coating processing and the interface 4. The heat treatment section 9 is provided with each. Further, HP (not shown) for heating the substrate W to perform a baking process (hereinafter, referred to as “HP”), and cooling the heated substrate to maintain the room temperature (hereinafter, referred to as “CP”). CPs (not shown) for performing the above) are laminated in the order of Pass, HP, CP from the top. Similarly to the heat treatment unit 9 for coating treatment, the heat treatment unit 11 for development treatment is
CP and HP are stacked in order from the top, and
Each Pass is provided in the heat treatment unit 11 on the indexer 2 side and the interface 4 side, respectively. In addition to the above HP and CP, an adhesion process (Adhesi) for improving the adhesion between the substrate W and the photoresist film.
on) (hereinafter referred to as “AHL”) may be provided.

Next, the specific structure of the coating-only unit 16 will be described with reference to the side view of FIG. As shown in FIG. 2, the coating-only unit 16 holds the substrate W in a horizontal position by sucking and supporting the vicinity of the center of the substrate W to hold the substrate W in a horizontal position and discharging the photoresist liquid P. A coating nozzle 20 for supplying the photoresist liquid P to the surface of the substrate W, and an edge rinse nozzle for discharging the rinse liquid R as a cleaning liquid and discharging the rinse liquid R to supply the rinse liquid R to the edge of the substrate W. 21, a splash prevention cup 22 that prevents the supplied photoresist liquid P and rinse liquid R from scattering, a cup rinse nozzle 23 that cleans the splash prevention cup 22, and the supplied photoresist liquid P and The rectifying plate 24 is configured to discharge the rinse liquid R. Spin chuck 19
Is the first substrate holding means (and further,
Vacuum chuck), the coating nozzle 20 is the coating liquid supply means of the present invention, and the edge rinse nozzle 21.
Correspond to the edge cleaning means in the present invention.
Regarding the edge removal processing for cleaning and removing the edge of the substrate W, the case of cleaning and removing the dirt attached to the edge of the front surface of the substrate W and the case of cleaning and removing the dirt attached to the edge of the back surface of the substrate W. There are two ways to do it.

Further, the spin chuck 19 has a function of holding the substrate W by adsorbing and supporting it, and also a function of rotating the substrate W in a horizontal plane. Further, the dedicated coating unit 16 has a function of performing a coating process on the surface of the substrate W.

Next, the specific structure of the rinse-only unit 17 will be described with reference to the side view of FIG. The rinsing dedicated unit 17 is composed of a scattering prevention cup 22 and a rectifying plate 24 similar to the coating dedicated unit 16, and supplies the rinse liquid R to the spin chuck 25 and the back surface of the substrate W held in a horizontal posture. It is composed of a back rinse nozzle 26. Spin chuck 2
Reference numeral 5 denotes a back rinse nozzle 26 for the second substrate holding means (and further vacuum chuck) in the present invention.
Correspond to the cleaning liquid supply means in the present invention.

The spin chuck 25 of the dedicated rinse unit 17 rotates the substrate W at a lower speed than the rotation of the substrate W by the spin chuck 19 of the dedicated coating unit 16. In addition, the rinse-only unit 17 has a trace of holding when the substrate W is held by the spin chuck 19 of the photoresist liquid P or the coating-only unit 16 attached to the back surface of the substrate W,
Alternatively, it has a function of cleaning and removing dirt such as particles.

Spin chuck 1 of coating unit 16
9 diameter (diameter) and 2 · r _1, rinsed special unit 1
When 7 in the diameter of the spin chuck 25 (diameter) and 2 · r _2, size 2 · r ₂ of the spin chuck 25 in the rinsing special unit 17, the spin chuck 1 of coating special unit 16
9 is smaller than the diameter 2 · r ₁ . Also, as a result, the spin chuck 25 of the rinse-only unit 17 is
The area S ₂ (= π × r ₂ ² ) that is adsorbed and supported by is smaller than the area S ₁ (= π × r ₁ ² ) that is adsorbed and supported by the spin chuck 19 of the dedicated coating unit 16. The area S ₁ adsorbed and supported by the spin chuck 19 corresponds to the first support area of the present invention, and the area S ₂ adsorbed and supported by the spin chuck 25 corresponds to the second support area of the present invention.

Spin chuck of the dedicated rinse unit 17
The area adsorbed and supported by 25 (area S ₂Part) is applied
Adsorbed and supported by the spin chuck 19 of the dedicated unit 16.
Area (area S₁It is smaller than the
All of which are supported by suction on the spin chuck 19 of the unit 16.
Back rinse of rinse-only unit 17
The nozzle 26 can remove the photoresist liquid P.
Spin chuck of coating unit 16
The area (S
₁-S₂)) To remove the photoresist liquid P only
You can

The size of the diameter 2 · r ₂ of the spin chuck 25 is not particularly limited, but as long as the spin chuck 25 does not interfere with the substrate holding ability and the substrate rotating ability, the photoresist in a wider area can be used. It is preferable to reduce the diameter 2 · r ₂ so that the liquid P can be removed. In the first embodiment, since the spin chuck 25 rotates the substrate W at a lower speed than the rotation of the substrate W by the spin chuck 19, as described above, the diameter 2 · r ₂ of the dedicated rinse unit 17 is set to be dedicated to coating. Diameter of unit 16 2
There is no problem even if it is smaller than r ₁ . Further, when the back rinse nozzle 26 scans the substrate W without rotating the substrate W during the back rinse, the diameter 2 · r ₂ can be made smaller.

Next, a series of substrate processing will be described with reference to the flowchart of FIG.

(Step S1) A cassette (not shown) accommodating a plurality of unprocessed substrates W in the indexer is placed and placed on the mounting table 5a or 5b of the loading section 5 of the cassette mounting table 1. . 1 from the inserted cassette
In order to take out one substrate W, the base 7a of the ID transport mechanism 7 is moved to the position of the cassette, and the arm 7b is advanced in the direction of arrow RC. The substrate W is held by supporting the back surface of one substrate W in the cassette by the advanced arm 7b. After that, the arm 7b is retracted in the direction of the arrow RC while holding the substrate W.

(Step S2) In order to transfer the substrate W to the heat treatment section 9 for the transfer coating process in the Pass, the substrate W is placed on the Pass of the heat treatment section 9 arranged on the indexer 2 side. More specifically, the base 7a of the ID transport mechanism 7 is set to Pas along the longitudinal direction of the indexer 2.
Move to position s. Then, the arm 8e is moved forward to mount the substrate W thereon.

The substrate W placed on the Pass is transferred to the HP or CP stacked under the Pass via the ID transfer mechanism 7 or the processing transfer mechanism 13 as required.
HP (baking) treatment for heating the substrate W or CP treatment for cooling the heated substrate W at room temperature. In the first embodiment, HP
And the CP processing is not performed, and the processing is carried to the coating dedicated unit 16 of the coating processing unit 10 via the processing transport mechanism 13. In addition, in order to improve the adhesion between the substrate W and the photoresist film, AHL processing may be performed before the coating processing.

(Step S3) In order for the processing transport mechanism 13 to transport the substrate W placed on the coating process Pass to the dedicated coating unit 16, the base 13a of the processing transport mechanism 13 is moved to the Pass position. The arm 13b is moved to advance in the direction of arrow RF. The advanced arm 13b supports the edge of the placed substrate W to hold the substrate W. After that, the arm 13b is retracted in the direction of the arrow RF while holding the substrate W. Then, the base 13a of the processing transport mechanism 13 is moved to the position of the dedicated coating unit 16 along the longitudinal direction of the processing transport path 8. And the arm 13 together with the base 13a
The substrate W is placed on the spin chuck 19 of the coating unit 16 by lowering b.

The spin chuck 19 holds the substrate W in a horizontal posture by adsorbing and supporting the vicinity of the center of the substrate W, and the arm 13b releases the holding of the substrate W while holding the substrate W in the horizontal posture. Then, the substrate W is rotated in the horizontal plane. With the substrate W rotated, the coating nozzle 20 discharges the photoresist liquid P and supplies the photoresist liquid P to the vicinity of the center of the surface of the substrate W. Then, the photoresist liquid P is spread over the entire surface from the center of the substrate W by the centrifugal force of the substrate W.
Is formed into a thin film. Further, in order to clean and remove the dirt attached to the edge of the substrate W, the edge rinse nozzle 21 discharges the rinse liquid R and supplies the rinse liquid R to the edge of the substrate W. Further, the cup rinse nozzle 23 discharges the rinse liquid R in order to wash the scattering prevention cup 22.

(Step S4) When the photoresist film of the photoresist liquid P is formed on the surface of the transfer substrate W of the coating transfer mechanism, and the dirt adhering to the edge of the substrate W is washed and removed, the spin chuck 12 is moved. The rotation of the substrate W in the horizontal plane is stopped. On the other hand, the base 15a of the coating transport mechanism 15 is moved to the position of the dedicated coating unit 16 and the arm 15b is lowered together with the base 15a. The substrate W is held by supporting the edge of the substrate W stopped on the spin chuck 12 of the dedicated coating unit 16 by the lowered arm 15b. Then, the spin chuck 19 releases the suction support of the substrate W while the arm 15b holds the substrate W. Then, the arm 15b is raised together with the base 15a, and the base 15a of the coating transport mechanism 15 is moved along the longitudinal direction of the coating transport path 14 so that the rinsing unit 17 is provided.
Move to the position. Then, the arm 15b is lowered together with the base 15a, and the substrate W is placed on the spin chuck 25 of the rinse-only unit 17.

(Step S5) The back rinse process spin chuck 25 holds the substrate W in a horizontal posture by adsorbing and supporting the vicinity of the center of the substrate W, and the arm 15b holds the substrate W in the horizontal posture. Release the hold. Then, the substrate W is rotated in the horizontal plane. In step S5, the rotation speed is lower than that in step S4. With the substrate W rotated, the back rinse nozzle 26 discharges the rinse liquid R and supplies the rinse liquid R to the back surface of the substrate W. Then, the dirt adhering to the back surface of the substrate W is rinsed with the rinse liquid R.
Are removed by washing.

(Step S6) When the dirt adhering to the back surface of the HP-processed substrate W is removed by washing, the spin chuck 25 stops the rotation of the substrate W in the horizontal plane. On the other hand, the base 13a of the processing transport mechanism 13 is moved to the position of the rinse-only unit 17, and the base 1 is moved.
The substrate W is held by supporting the edge of the substrate W stopped on the spin chuck 25 of the rinse unit 17 that lowers the arm 13b together with the arm 3b by the lowered arm 13b. Then, the spin chuck 25 releases the suction support of the substrate W while the arm 13b holds the substrate W.
Then, the arm 13b is raised together with the base 13a, and the processing transfer mechanism 1 is provided along the longitudinal direction of the processing transfer path 8.
The base 13a of No. 3 is moved to the position of HP of the heat treatment section 9 for coating processing arranged on the interface 4 side. Then, the arm 13b is moved forward to place the substrate on the HP of the heat treatment section 9. An HP (baking) process for heating the substrate W is performed on the substrate W placed on the HP.

(Step S7) CP processing When the HP processing is completed, the substrate W placed on the HP is lowered to the position of the CP stacked under the HP via the processing transfer mechanism 13. , CP processing is performed to cool the substrate W heated by the HP processing and keep it at room temperature.

(Step S8) When the transfer CP processing in Pass is completed, the substrate W is placed on the Pass laminated on the CP in order to transfer the substrate W to the interface 4. More specifically, the processing transport mechanism 1
When the base 13a of No. 3 is moved to the position of CP, the arm 13b is moved forward. The advanced arm 13b supports the edge of the placed substrate W to hold the substrate W. After that, the arm 13b is retracted while holding the substrate W. The arm 13b together with the base 13a is raised to the position of Pass, and the arm 13b is moved forward. Then, the substrate W is placed on the Pass.

In the first embodiment, after CP processing, P
The substrate W was transferred between the heat treatment section 9 for coating processing and the interface 4 after being placed on the ass. The heat treatment for coating processing was performed via the CP of the heat treatment section 9 for coating processing. Substrate W between section 9 and interface 4
May be handed over.

(Step S9) The substrate W placed on the transfer Pass at the interface is transferred to the IF transfer mechanism 18
However, in order to relay to the exposure apparatus (not shown) which is an external processing apparatus through the interface 4, the base 18a of the IF transport mechanism 18 is moved to the position of Pass and the arm 18b is moved forward. Let Placed substrate W
The substrate 18 is held by supporting the back side of the arm 18b that has been moved forward, and then the arm 18b is moved backward while holding the substrate W. The base 18a is moved to the carry-in port of the exposure apparatus along the longitudinal direction of the interface 4.

(Step S10) Exposure Process Then, the arm 18b is moved forward so that the exposure device receives the substrate W.
To bring in. With respect to the substrate W carried into the exposure apparatus,
The exposure processing of the substrate W is performed.

(Step S11) When the transport exposure processing in the interface is completed, in order to carry out the substrate W from the exposure apparatus, the base 18a of the IF transport mechanism 18 is moved to the carry-out port of the exposure apparatus, and the arm is moved. 18b is advanced.
The substrate W is held by being supported by the advanced arm 18b on the back surface of the substrate W at the carry-out port. After that, the arm 18b is retracted while holding the substrate W.

(Step S12) Pa in the heat treatment section 11 arranged on the interface 4 side in order to pass the substrate W to the heat treatment section 11 for transfer development in Pass.
The substrate W is placed on ss. More specifically, the IF transfer mechanism 18 is provided along the longitudinal direction of the interface 4.
The base 18a of is moved to the position of Pass. Then, the arm 18e is moved forward to mount the substrate W thereon. Before the development processing described later, if necessary, Pass
Substrate W up to the position of HP or CP stacked on
May be conveyed and HP or CP processing may be performed.

(Step S13) In order for the processing transfer mechanism 13 to transfer the substrate W placed on the development processing Pass to the development processing section 12, the processing transfer mechanism 13 is used.
The base 13a is moved to the position of Pass and the arm 13b is moved forward. The advanced arm 13b supports the edge of the placed substrate W to hold the substrate W. After that, the arm 13b is retracted while holding the substrate W. Then, along the longitudinal direction of the processing transport path 8, the base 13a of the processing transport mechanism 13 is moved to the development processing section 12.
Move to the position. Then, the arm 13d is lowered together with the base 13a, and the substrate W is placed on the spin chuck (not shown) of the development processing unit 12.

Similar to the coating process of step S3, the developing solution is supplied to the surface of the substrate W to be developed while the substrate W is attracted and supported by the spin chuck in a horizontal posture and rotated in a horizontal plane.

(Step S14) When the transfer development processing in Pass is completed, the substrate W is placed on the Pass of the thermal processing section 11 arranged on the indexer 2 side in order to transfer the substrate W to the indexer 2. More specifically, the processing transport mechanism 1 is provided along the longitudinal direction of the processing transport path 8.
The base 13a of No. 3 is moved to the position of Pass. Then, the arm 13e is moved forward to mount the substrate W thereon.

(Step S15) In order to transfer the substrate W placed on the transfer Pass in the indexer to the mounting table 6a or 6b of the payout unit 6 of the cassette mounting table 1, the ID transfer is performed. Pass the base 7a of the mechanism 7
And the arm 7b is moved forward. By supporting the back surface of the placed substrate W by the advanced arm 7b, the substrate W is held, and then the arm 7b is retracted while holding the substrate W. Then, along the longitudinal direction of the indexer 2, the base 7a of the ID transport mechanism 7 is moved to the position of the cassette, and the arm 7b is moved forward. After storing the processed substrate W in the cassette, the arm 7b is retracted. When a predetermined number of processed substrates W are stored in the cassette, the cassette is dispensed from the dispensing unit 6, and a series of substrate processing is completed.

The substrate processing apparatus having the above-mentioned structure according to the first embodiment has the following effects. That is, in step S3, the photoresist liquid P, which is a coating liquid, is supplied from the coating nozzle 20 to the front surface of the substrate W to perform the coating processing on the front surface of the substrate W, and the back surface of the substrate W is adhered. In order to clean and remove the dirt, the back rinse process of supplying the rinse liquid R which is the cleaning liquid from the back rinse nozzle 26 to the back surface of the substrate W in step S5 is divided into the dedicated coating unit 16 and the dedicated rinse unit 17, and the coating is performed. The dedicated unit 16 is made to perform a coating process, and the dedicated rinse unit 17 is made to perform a back rinse process. Further, a spin chuck 19 for holding the substrate W in a horizontal posture by adsorbing and supporting the vicinity of the center of the back surface of the substrate W is provided on the coating dedicated unit 16 side.
6, the spin chuck 25 holds the substrate W in a horizontal posture by suctioning and supporting the vicinity of the center of the back surface of the substrate W.
Are provided on the rinse-dedicated unit 17 side, respectively.
Further, the spin chuck 25 supports an area S ₂ different from the area S ₁ supported by the spin chuck 16. Then, on the back surface of the substrate W held by the spin chuck 25, the rinse liquid R is supplied so as to clean the area (S ₁ -S ₂ ) which is a part of the area S ₁ where the spin chuck 19 supports the substrate W. Therefore, it is possible to improve the ability to remove the dirt attached to the back surface of the substrate W. As a result, the coating process of the substrate W can be performed accurately.

Further, the spin chuck 25 is
Area S supported by the rack 16 ₁Area S different from₂
In the first embodiment, in order to support the
Diameter of spin chuck 25 of 17 is 2 · r₂For application
Diameter of spin chuck 19 of knit 16 2 · r₁Less than
Make up.

[0065] Thus, the area S ₁ area S ₂ which is sucked and supported by the spin chuck ^{_{25 (= π × r 2 2}} ) is to be sucked and supported by the spin chuck 19 of coating special unit 16
It is smaller than (= π × r ₁ ² ). Therefore, the area (portion of area S ₂ ) sucked and supported by the spin chuck 25 of the rinse unit 17 is smaller than the area (portion of area S ₁ ) sucked and supported by the spin chuck 19 of the coating unit 16. , The back rinse nozzle 26 of the unit 17 dedicated to rinsing, with respect to the entire region that is suction-supported by the spin chuck 19 of the unit 16 dedicated to coating,
Although the dirt cannot be removed, the dirt can be removed only in the area (S ₁ -S ₂ ), which is a part of the area of the coating-only unit 16 that is suction-supported by the spin chuck 19.

Further, in the first embodiment, the edge rinse nozzle 21 for supplying the rinse liquid R to the edge of the substrate W to remove the dirt adhering to the edge of the substrate is provided in the dedicated coating unit 16
In addition, the substrate W is supported between the dedicated coating unit 16 and the rinsing unit 17 while supporting the edge of the substrate W.
The coating transport mechanism 15 for transporting the substrate W is provided, and in step S3, the dedicated coating unit 16 performs the coating process on the surface of the substrate W, and the edge rinse process for cleaning and removing the dirt attached to the edge of the substrate W. , The coating process and the back rinse process are performed on the substrate W in step S
In step 4, the substrate W is transported from the dedicated coating unit 16 to the dedicated rinse unit 17 by the coating transport mechanism 15, and the substrate W transported by the coating transport mechanism 15 is attached to the back surface of the substrate W by the dedicated rinse unit 17 in step S5. A back rinse treatment is performed to wash away.

Accordingly, in step S3, the coating unit 16 performs the coating process on the surface of the substrate W, and the edge rinse process for cleaning and removing the dirt attached to the edge of the substrate W is performed first. In the step S4 in which the coating transport mechanism 15 supports the edge of the substrate W and transports it to the dedicated rinse unit 17, the substrate W
There is no dirt on the edges of the. Therefore, the rinsing dedicated unit 17 does not have to perform the edge rinsing process for cleaning and removing the dirt attached to the edge of the substrate W.
In the case of transporting to the substrate W, dirt attached to the edge of the substrate W not only adheres to the coating transport mechanism 15, but also has a bad influence on the rinse unit 17 via the coating transport mechanism 15. In the case of the first embodiment, the contamination and rinsing unit 17 for the coating transport mechanism 15 is used.
Can be reduced adversely.

According to the substrate processing apparatus using the coating processing unit 10 having the coating dedicated unit 16 and the rinse dedicated unit 17, the plurality of substrate processings including the coating dedicated unit 16 and the rinse dedicated unit 17 are respectively performed. Since the processing transport mechanism 13 that transports the substrate W is provided between the processing units (heat treatment units 9 and 11, the coating processing unit 10, and the development processing unit 12), the coating process and the stains attached to the back surface of the substrate W are removed. It is possible to efficiently perform a series of substrate processes including a cleaning process for cleaning and removing.

Further, in the first embodiment, the interface 4 for relaying the transfer of the substrate W between the above-mentioned processing section and the exposure apparatus corresponding to the external processing apparatus of the present invention, which is provided continuously with the substrate processing apparatus. By including the above, the substrate W, which has been subjected to accurate coating processing in the coating processing section 10, can be transported to the exposure apparatus in step S9 via the interface 4. As a result, since the coating process of the substrate W is performed accurately, the substrate process can be efficiently performed with the exposure device. Further, the exposure failure due to the photoresist liquid P attached to the back surface of the substrate W can be reduced as compared with the conventional case.

[Second Embodiment] Next, a second embodiment of the present invention will be described. The same parts as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted. The substrate processing apparatus according to the second embodiment is the same as the first embodiment apparatus shown in the plan block diagram of FIG. 1, and the coating only unit 16 according to the second embodiment is a side surface showing the specific configuration of FIG. This is the same as the coating only unit 16 according to the first embodiment shown in the drawing. The spin chuck 19 of the coating-only unit 16 according to the second embodiment corresponds to the first substrate holding means of the present invention.

Next, the specific structure of the rinse unit 17 will be described with reference to the side view of FIG. The rinsing dedicated unit 17 is composed of a splash prevention cup 22 and a back rinse nozzle 26 similar to those in the first embodiment, and supports a plurality of edge portions of the substrate W to hold the substrate W in a horizontal posture. The mechanical chuck 27, the rotary table 28 for standing the mechanical chuck 27 upright to rotate the substrate W supported by the mechanical chuck 27 in a horizontal plane, and the back surface of the substrate W by scrub cleaning while directly contacting the back surface of the substrate W. It is composed of a brush 29 for removing the adhered photoresist liquid P. Further, the two back rinse nozzles 26 are arranged around the brush 29, respectively. The mechanical chuck 27 corresponds to the second substrate holding means in the present invention.

In the case of the second embodiment, unlike the first embodiment, the spin chuck 19 of the dedicated coating unit 16 sucks and supports the vicinity of the center of the back surface of the substrate W, and the mechanical chuck 27 of the dedicated rinse unit 17 is provided. Supports the edge of the substrate W. Therefore, the spin chuck 1 of the dedicated coating unit 16
9 is different from the area supported by the mechanical chuck 27 (the edge portion) of the rinse-only unit 17 and the area supported by the spin chuck 19 (the area S ₁ ). With respect to the area S ₁ ), the back rinse nozzle 26 and the brush 29 of the dedicated rinse unit 17 can remove the dirt attached to the back surface of the substrate W.

Since a series of substrate processing is the same as that of the first embodiment, its explanation is omitted.

[Third Embodiment] Next, a third embodiment of the present invention will be described. The same parts as those of the first and second embodiments are designated by the same reference numerals, and the description thereof will be omitted. The coating dedicated unit 16 is also used as the rinse dedicated unit 17 according to the second embodiment, and instead of the coating transport mechanism 15, the substrate W is turned upside down to transfer the substrate W.
The substrate processing apparatus according to the third embodiment is the same as the apparatus for the first and second embodiments shown in the plan block diagram of FIG. The transfer mechanism 30 corresponds to the transfer means in the present invention.

Next, the specific configurations of the rinse-only unit 17 and the transfer mechanism 30 will be described with reference to the side view of FIG. The rinse-only unit 17 includes the splash prevention cup 22 and the back rinse nozzle 2 similar to those in the second embodiment.
6, a plurality of mechanical chucks 27, a rotary base 28, and a brush 29. Rinsing unit 17
A transfer mechanism 30 is disposed above the. In addition, a coating nozzle 20 (not shown) is provided in the third embodiment, and the coating process is performed by this coating nozzle 20.

The transfer mechanism 30 holds the substrate W by gripping the edges of the arm 30a and the substrate W, and two holding shafts 30b and an arm 30a for rotating the substrate W in the directions of the arrows RG around the axis. Is composed of an arm support shaft 30c that rotates the shaft in the direction of arrow RH around the axis and moves up and down in the direction of arrow RI. Of the two holding shafts 30b, one holding shaft 30b is disposed on one of both arms of the arm 30a, and the other holding shaft 30b is the arm 30a.
It is arranged on the other of both arms of a. Further, the holding shafts 30b are configured so that the rotations of the respective holding shafts 30b around the axis center are performed in the same direction and at the same time.

The manner in which the substrate W is turned upside down and the substrate W is replaced when the back rinse process is performed immediately after the coating process will be described with reference to FIGS. 7 to 10. When the coating process is completed in step S3 as described in the first embodiment, as shown in FIG. 7, the arm support shaft 30c of the transfer mechanism 30 is lowered in the direction of the arrow RI, and the arm 30a and the holding shaft 30b are moved. Lower it. At this time, the mechanical chuck 27 and each holding shaft 30b are prevented from colliding. After each holding shaft 30b is moved right and left so as to grip the edge of the substrate W, the holding of the substrate W by the mechanical chuck 27 is released.

After release, as shown in FIG. 8, the transfer mechanism 30
The arm support shaft 30c is raised in the direction of the arrow RI, and the substrate W held by holding the edge of the substrate W by the arm 30a, the holding shaft 30b, and the holding shaft 30b is raised.

After raising the substrate W to a predetermined height, as shown in FIG. 9, the two holding shafts 30b are simultaneously rotated by 180 ° in the direction of the arrow RG and the arm support shaft 3 is rotated.
0c is rotated by a predetermined angle in the direction of arrow RH. The front and back of the substrate W are inverted by the 180 ° rotation of the holding shaft 30b.

After reversing the front and back, as shown in FIG. 10, the arm support shaft 30c of the transfer mechanism 30 is lowered in the direction of the arrow RI, and the arm 30a, the holding shaft 30b, and the substrate W are lowered. The mechanical chuck 27 again supports the lowered edge of the substrate W to hold the substrate W. After holding the substrate W by the mechanical chuck 27, each holding shaft 30b is moved to the left and right to release the holding of the substrate W. After release, back rinse processing is started.

By the rotation of the arm support shaft 30c and the front and back rotation of the substrate W by the holding shaft 30b, the mechanical chuck 27 during the coating process supports a region different from the region supported by the mechanical chuck 27 during the back rinse process. Will be done. As a result, the region supported by the mechanical chuck 27 during the coating process is different from the region supported by the mechanical chuck 27 during the back rinse process. Therefore, as in the second embodiment, the mechanical chuck 27 is sucked and supported by the mechanical chuck 27 during the coating process. The dirt can be removed by the back rinse nozzle 26 and the brush 29 of the dedicated rinse unit 17 in the entire area.

In order to reduce the contamination of the coating transport mechanism 15 and the adverse effect on the rinse-only unit 17, the rinse-only unit 17 is provided with an edge rinse nozzle 21 for removing dirt attached to the edge of the substrate. Good.
In addition, the rinse-exclusive unit 17 is provided with a scattering prevention cup 22.
A cup rinse nozzle 23 for cleaning the above may be provided.

In the third embodiment, the dedicated coating unit 16 is also used as the rinse dedicated unit 17 according to the second embodiment. However, the dedicated coating unit 16 and the rinse dedicated unit 17 are combined as in the first embodiment. The coating transport mechanism 15 according to the first embodiment may be separately provided with a function of reversing the front and back of the substrate W, or the rinse unit 17 may be replaced with the coating unit 16 according to the first embodiment. The transfer mechanism 30 is disposed above the coating-only unit 16 so as to serve also as the transfer mechanism 3 when the back rinse process is performed immediately after the coating process.
The front and back of the substrate W may be reversed at 0. That is, the processing by the first and second processing units in the present invention may be performed in the same unit (chamber), or may be divided into individual units, and each unit may perform the processing by the first and second processing units. Processing may be performed.

The present invention is not limited to the above embodiment, but can be modified as follows.

(1) In the above-described first to third embodiments, the photoresist liquid is used as an example of the coating liquid, but the present invention can also be applied to the coating of polyimide resin, SOG (spin on glass) or the like. You can Further, the development processing unit 12 according to the first embodiment can also be applied to application such as development.
May be divided into development coating only and rinse only, and development coating only may be applied to the coating dedicated unit 16 according to the first embodiment and rinse only to the rinse dedicated unit 17 according to the first embodiment.

(2) In the above-described first to third embodiments, the substrate processing apparatus is connected via the interface 4 to the exposure apparatus (not shown) corresponding to the external processing apparatus of the present invention. The external processing apparatus is not limited to the exposure apparatus as long as it is an external processing apparatus provided in series with the substrate processing apparatus. Further, the present invention can be applied to only a substrate processing apparatus using a coating processing apparatus without providing an external processing apparatus in series.

(3) In the above-described first to third embodiments, the substrate is rotated to form a thin film on the substrate and the coating process is performed on the substrate. For example, a slit nozzle is placed on a stationary substrate. The coating treatment may be carried out by scanning or the like, or after the coating liquid is once applied and formed on the coating sheet, the sheet is attached to the substrate so that the coating liquid is supplied onto the substrate to be attached. The sheet and the substrate may be heat-treated, and then the sheet may be peeled off from the substrate to transfer the coating film formed on the sheet to the substrate to perform the coating process.

(4) In the above-described first to third embodiments, the photoresist liquid P attached to the edge of the substrate W, the traces of holding when holding the substrate W, or the coating liquid such as particles is removed. The edge rinse nozzle 21 is provided in the coating-only unit 16, but the edge rinse nozzle 21 may be provided in the rinse-only unit 17, and the edge rinse nozzle 21 is either the coating-only unit 16 or the rinse-only unit 17. You may be prepared for. However, considering the adverse effect on the coating transport mechanism 15 that transports between the dedicated coating unit 16 and the rinse dedicated unit 17, it is preferable that the dedicated coating unit 16 to be processed first includes at least the edge rinse nozzle 21. Although the edge rinse nozzle 21 is not necessarily provided, the edge rinse nozzle 21 is preferably provided in view of adverse effects on the coating transport mechanism 15 and the dedicated rinse unit 17 due to dirt.

(5) In the above-described first to third embodiments, the first and second substrate holding means of the present invention for holding the substrate in the horizontal posture are spins for supporting the vicinity of the center of the back surface of the substrate W. Although it is a chuck or a mechanical chuck that supports the edge of the substrate W, it is not limited to a spin chuck or a mechanical chuck. For example, the first and second substrate holding means may be configured to support a plurality of places (for example, three places) other than the vicinity of the center and the edge. Further, either one of the first and second substrate holding means is configured to support a plurality of locations other than the vicinity of the center and the edge, and the other means is configured by the spin chuck or the mechanical chuck described above. You may. However, in the case of forming a thin film of the coating liquid on the substrate by rotating the substrate, it is a normal method to rotate the substrate at a high speed, so that the first substrate holding means (for example, the first substrate holding means that can withstand the high speed rotation of the substrate) In the case of the first embodiment, the spin chuck 19) is preferably used.

(6) In the above-described first and second embodiments, the vacuum chuck of the present invention is constituted by the spin chuck 19 that rotates the substrate W in the horizontal plane while adsorbing and supporting the vicinity of the center of the substrate W. The means for sucking and supporting the vicinity of the center of the substrate W is not limited to the spin chuck, and the substrate W
It also includes a vacuum chuck that sucks and supports the vicinity of the center of the substrate W while keeping it stationary without rotating in the horizontal plane. The stationary substrate W as described in the modification (2)
A vacuum chuck that does not rotate the substrate W in a horizontal plane is particularly useful in the case of a scanning type coating processing apparatus in which a slit nozzle or the like is scanned.

(7) In the above-described first embodiment, the diameter of the spin chuck 25 of the dedicated rinse unit 17 is set to be smaller than the diameter of the spin chuck 19 of the dedicated coating unit 16, so that the substrate can be treated during the back rinse process. The area on which the substrate is supported is set to be smaller than the area on which the substrate is supported during the coating process. For example, the coating dedicated unit 16 and the rinse dedicated unit 17 are each provided with a mechanical chuck, and the mechanical chuck of the rinse dedicated unit 17 is provided. The area of the substrate supported by is smaller than the area of the substrate supported by the mechanical chuck of the dedicated coating unit 16, so that the area supported by the substrate during the back rinse processing is supported by the substrate during the coating processing. It may be smaller than the area.

(8) In the first embodiment described above, the spin
Area S adsorbed and supported by the back 25 ₂(= Π × r₂ ²)
(Second support region in the present invention) is a unit for exclusive use of coating.
Area S adsorbed and supported by the spin chuck 19 of the belt 16₁
(= Π × r₁ ²) (First support region in the present invention)
By making the second substrate holding hand smaller in the present invention.
The stepped spin chuck 25 is the first step in the present invention.
It is supported by a spin chuck 19 which is a substrate holding means.
First support area S₁A second support area S different from₂To
Each of the first and second substrate holding means for supporting
However, the first and second support regions are on the backside of the substrate W.
Center of the back surface of the substrate W, including the vicinity of the center of the surface
Including the vicinity of the first and second support regions
The first substrate holding means supporting the first substrate holding means.
A second support area different from the first support area
First and second substrate holding means so that the holding means supports
May be configured respectively.

(9) In the above-described first to third embodiments, the first substrate holding means of the present invention supports the back surface of the substrate and efficiently adheres the back surface of the substrate to stains. However, in order to support the end surface of the substrate and efficiently remove the dirt attached to the end surface of the substrate, the following configuration may be adopted. That is, a mechanical chuck (not shown) for gripping the end surface of the substrate is used as the coating dedicated unit 16 of the first embodiment, for example.
Coating unit 16 instead of the spin chuck 19
In preparation for this, the back rinse nozzle 26 of the dedicated rinse unit 17 may be configured to supply the rinse liquid R to the back surface and the end surface of the substrate W. In this case, the dirt attached to the end surface of the substrate can be efficiently removed. The dedicated coating unit 16 corresponds to the third processing section of the present invention, and the mechanical chuck that holds the end surface of the substrate corresponds to the third substrate holding means of the present invention.

[0094]

As is apparent from the above description, according to the present invention, the coating process for coating the front surface of the substrate is performed by the first processing section to clean and remove the dirt adhering to the back surface of the substrate. The first and second processing units are provided with first and second substrate holding means for holding the substrate in a horizontal posture, respectively, and are supported by the first substrate holding means. Since the second substrate holding means supports the second supporting area different from the first supporting area, the removal ability of the coating liquid can be improved. As a result, the substrate coating process can be performed accurately.

[Brief description of drawings]

FIG. 1 is a plan block diagram of a main part of a substrate processing apparatus using a coating processing apparatus according to first and second embodiments.

FIG. 2 is a side view showing a specific configuration of a coating-only unit according to the first and second embodiments.

FIG. 3 is a side view showing a specific configuration of a rinse only unit according to the first embodiment.

FIG. 4 is a flowchart showing a series of substrate processing.

FIG. 5 is a side view showing a specific configuration of a rinse only unit according to the second embodiment.

FIG. 6 is a side view showing a specific configuration of a rinse only unit and a transfer mechanism according to the third embodiment.

FIG. 7 is a side view showing a state in which the substrate is turned upside down and the substrate is replaced when the back rinse treatment is performed immediately after the coating treatment.

FIG. 8 is a side view showing a state in which the substrate is turned upside down and the substrate is replaced when the back rinse treatment is performed immediately after the coating treatment.

FIG. 9 is a side view showing a state in which the substrate is turned upside down and the substrate is replaced when the back rinse process is performed immediately after the coating process.

FIG. 10 is a side view showing a state in which the substrate is turned upside down and the substrate is replaced when the back rinse treatment is performed immediately after the coating treatment.

[Explanation of symbols]

2 ... Indexer 4 ... Interface 10 ... Coating processing unit 13 ... Processing transport mechanism 15 ... Coating transport mechanism 16 ... Coating dedicated unit 17 ... Rinsing dedicated unit 19, 25 ... Spin chuck 20 ... Coating nozzle 21 ... Edge rinse nozzle 26 Back rinse nozzle P Photoresist liquid R Rinse liquid W Substrates S ₁ , S ₂ Area

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Masakazu Sanada             4-chome Tenjin, which runs up to Teranouchi, Horikawa-dori, Kamigyo-ku, Kyoto             1 Kitamachi No. 1 Dai Nippon Screen Manufacturing Co., Ltd.             Inside the company (72) Inventor Yoshihisa Yamada             4-chome Tenjin, which runs up to Teranouchi, Horikawa-dori, Kamigyo-ku, Kyoto             1 Kitamachi No. 1 Dai Nippon Screen Manufacturing Co., Ltd.             Inside the company F-term (reference) 2H025 AB14 AB16 EA05                 4F042 AA02 AA06 BA08 CC04 CC09                       DF09 DF25 DF32 EB01 EB09                 5F046 JA15 LA02 LA05

Claims (12)

[Claims] 1. A coating processing apparatus comprising: a first processing unit for supplying a coating liquid onto a substrate; and a second processing unit for supplying a cleaning liquid to the substrate processed by the first processing unit. The first processing unit supports a back surface of the substrate in a first supporting region and holds the substrate in a horizontal posture, and a substrate held by the first substrate holding unit. Coating solution supply means for supplying a coating solution to the surface of the substrate, and the second processing section holds the substrate in a horizontal posture while supporting a second support area different from the first support area. A second substrate holding means and a cleaning liquid supply means for supplying a cleaning liquid so as to clean a part or all of the first support region on the back surface of the substrate held by the second substrate holding means. A coating treatment apparatus characterized by the above. 2. The coating processing apparatus according to claim 1, wherein the first substrate holding means is configured to hold the substrate in a horizontal posture by supporting the vicinity of the center of the back surface of the substrate, and The coating processing apparatus, wherein the second substrate holding means is configured to hold the substrate in a horizontal posture by supporting the edge of the substrate. 3. The coating processing apparatus according to claim 1, wherein the first substrate holding means is configured to hold the substrate by supporting the first substrate holding means in a first supporting region including a vicinity of a center of a back surface of the substrate. In addition, the coating processing apparatus is configured to hold the substrate by supporting the second substrate holding means in a second supporting region including the vicinity of the center of the back surface of the substrate. 4. The coating processing apparatus according to claim 1, wherein the first substrate holding means holds the substrate in a horizontal posture by suctioning and supporting the vicinity of the center of the back surface of the substrate. A coating processing apparatus comprising a vacuum chuck for 5. The coating processing apparatus according to claim 3, wherein the area of the second support region is smaller than the area of the first support region. And a coating treatment device. 6. The coating processing apparatus according to claim 5, wherein the first and second substrate holding means are vacuum chucks that hold the substrate in a horizontal posture by suction-supporting the vicinity of the center of the back surface of the substrate. A coating treatment apparatus, wherein each of the vacuum chucks has a diameter smaller than that of the vacuum chuck constituting the first substrate holding means. 7. The coating processing apparatus according to claim 1, further comprising transfer means for reversing the substrate between the first and second processing units to transfer the substrate. The second substrate holding means holds the substrate in a horizontal posture while supporting the second supporting area different from the first supporting area by performing the reverse of the substrate by the transfer means. A coating treatment apparatus characterized by the above. 8. The coating processing apparatus according to claim 1, wherein the edge cleaning means for cleaning the edge of the substrate is either the first processing section or the second processing section. A coating treatment apparatus comprising at least a crab. 9. The coating processing apparatus according to claim 8, wherein the edge cleaning means is provided in the first processing section, and an edge of a substrate is supported to support the first processing section and the second processing section. A first transporting unit for transporting the substrate to and from the processing unit, and the first processing unit performs the coating process on the surface of the substrate and the edge cleaning process for cleaning the edge of the substrate. The substrate subjected to the coating process and the edge cleaning process is transferred from the first processing unit to the second processing unit by the first transfer unit.
And carrying out a cleaning process for cleaning a part or all of the first supporting region on the back surface of the substrate in the second processing unit for the substrate transferred by the first transfer means. A coating treatment apparatus characterized by the above. 10. A substrate processing apparatus using the coating processing apparatus according to any one of claims 1 to 9, comprising: a first processing unit configured to supply a coating liquid onto the substrate; A second processing unit that supplies a cleaning liquid to the substrate processed by the processing unit, and a second processing unit that performs the substrate processing, including the first and second processing units, transfers the substrate between the second processing unit and the second processing unit. The first processing unit includes a transport unit, and the first processing unit holds the substrate in a horizontal posture while supporting the back surface of the substrate in the first support region, and the first substrate holding unit. A coating solution supply means for supplying a coating solution to the surface of the substrate held by the means, wherein the second processing section horizontally supports a second support area different from the first support area. Second substrate holding means for holding the substrate in an attitude, and the second substrate holding means In the rear surface of the substrate to be lifting, the substrate processing apparatus, characterized in that it comprises a cleaning liquid supply means for supplying a cleaning liquid to clean a part or the whole of the first support region. 11. A substrate processing apparatus using the coating processing apparatus according to claim 1, wherein the first processing section supplies a coating liquid onto the substrate, and the first processing section. A second processing unit that supplies a cleaning liquid to the substrate processed by the processing unit, and a second processing unit that performs the substrate processing, including the first and second processing units, transfers the substrate between the second processing unit and the second processing unit. The first processing unit includes a transfer unit, an external processing apparatus that is provided in series with the substrate processing apparatus, and an interface that relays the transfer of the substrate between the processing unit and the external processing apparatus. Supporting the substrate in the first supporting region while holding the substrate in a horizontal posture, and a coating liquid supplying device for supplying the coating liquid to the surface of the substrate held by the first substrate holding device. And the second processing unit includes: The first substrate holding means for holding the substrate in a horizontal posture while supporting the second support area different from the holding area, and the first substrate on the back surface of the substrate held by the second substrate holding means. A substrate processing apparatus comprising: a cleaning liquid supply unit that supplies a cleaning liquid so as to clean a part or all of the support region. 12. The substrate processing apparatus according to claim 11, wherein the external processing apparatus is an exposure apparatus that performs an exposure process on a substrate on which a coating process has been performed.