TWI777060B - Conveyor device, exposure device, and device manufacturing method - Google Patents

Abstract

The conveying device includes: a first support part for supplying gas to one surface of the substrate, and for supporting the substrate by levitating gas permeable; a second support part for supporting one surface of the substrate; and a driving part for making at least one of the first and second support parts A moving part makes the first and second support parts approach or contact each other and are arranged in the first direction; and a transfer part moves the substrate supported by one of the first and second support parts arranged by the driving part along the first Move the direction to the other side.

Description

Conveyor, exposure device, and device manufacturing method

The present invention relates to a conveying apparatus, a conveying method, an exposure apparatus, and a device manufacturing method.

This application claims priority based on U.S. Provisional Application Nos. 61/305,355 and 61/305,439 filed on February 17, 2010, the contents of which are incorporated herein by reference.

In the manufacturing process of electronic components such as flat panel displays, processing equipment for large substrates such as exposure equipment or inspection equipment is used. In the exposure step and the inspection step using these processing apparatuses, the conveying apparatus disclosed in the following patent documents is used for conveying a large substrate (eg, glass substrate) to the processing apparatus.

[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2001-100169

In the above-mentioned large-sized substrate transfer apparatus, when the substrate supported by the substrate support member is transferred to the substrate holding portion, an air layer is interposed between the substrate and the substrate holding portion, so that the substrate may be deformed after the transfer. Or the placement of the substrate on the substrate holding part is offset. If the board after the transfer is displaced or deformed, problems such as exposure defects such as being unable to perform a predetermined exposure at an appropriate and accurate position on the board may occur in an exposure apparatus, for example. When the placement of the substrate is offset or deformed, in order to solve this problem, for example, by re-loading The handover of the substrate will cause the problem of processing delay of the substrate. In addition, if the transfer speed of the substrate is reduced, for example, in order to prevent the layer of air from remaining after the transfer, the problem of further delay in the processing of the substrate occurs.

In one aspect of the present invention, an object is to provide a transfer apparatus, a transfer method, an exposure apparatus, and a device manufacturing method that can transfer a substrate without causing placement deviation or deformation.

According to a first aspect of the present invention, there is provided a conveying device comprising: a first support part for supplying a gas to one surface of a substrate and capable of levitating and supporting the substrate through the gas; and a second support part for supporting a surface of the substrate the above-mentioned surface; a driving part for moving at least one of the above-mentioned first and second supporting parts so that the first and second supporting parts approach or contact each other and are arranged in the first direction; The said board|substrate supported by one of the said 1st and 2nd support part arranged in the part moves to the other side along the said 1st direction.

According to a second aspect of the present invention, there is provided a conveying device comprising: a first support part for supplying a gas to one surface of a substrate and capable of levitating and supporting the substrate through the gas; and second and third support parts for supporting the substrate the above-mentioned surface of the above-mentioned substrate; a first driving part for moving at least one of the above-mentioned first and second supporting parts so that the first and second supporting parts approach or contact each other and are arranged in a first direction; a second driving part , is to move at least one of the first and third support parts, so that the first and third support parts approach or contact each other and are arranged in the second direction; the first transfer part will be driven by the first drive part. The substrate supported by the second support part arranged on the first support part moves to the first support part side along the first direction; the second transfer part is arranged on the first support part by the second drive part 3. The said board|substrate supported by the said 1st support part of the said support part moves to the said 3rd support part side along the said 2nd direction.

According to a third aspect of the present invention, there is provided a conveyance method for conveying a substrate, comprising: a first support part capable of floatingly supporting the substrate through a gas supplied to one surface of the substrate; and a support capable of supporting the substrate At least one of the second support parts on the one side is moved so that the first and second support parts approach or contact each other and are aligned in the first direction; and one of the aligned first and second support parts An operation of moving the supported substrate to the other side along the first direction.

According to a fourth aspect of the present invention, there is provided a conveyance method for conveying a substrate, comprising: a first support portion capable of suspending the substrate by means of a gas supplied to one surface of the substrate, and a first support portion capable of supporting the substrate At least one of the second support parts on one side moves so that the first and second support parts approach or contact each other and are arranged in the first direction; the second support part arranged on the first support part is supported The action of moving the substrate along the first direction toward the first support portion; at least one of the first support portion and the third support portion capable of supporting the one surface of the substrate is moved, so that the first and second 3. The action of the support parts approaching or contacting each other and aligning in the second direction; and the movement of moving the substrate supported by the first support part arranged in the third support part along the second direction to the third support part side. action.

According to a fifth aspect of the present invention, there is provided a conveying device comprising: a first support part for supplying a gas to one surface of a substrate and capable of levitating and supporting the substrate through the gas; and a second support part for supporting a surface of the substrate The aforesaid surface; the driving part is to move at least one of the first and second support parts so that the first and second support parts come close to or contact with each other and are arranged; The substrate supported by the second support portion moves toward the first support portion in the alignment direction; the jacking mechanism is configured to stop the supply of the gas by supply and support the substrate placed on the placement portion of the first support portion and push up above the placement portion; and an unloading mechanism, which will be supported on the placement portion above the placement portion by the push-up mechanism. The said board|substrate is carried out from the said 1st support part.

According to a sixth aspect of the present invention, there is provided a conveyance method for conveying a substrate, comprising: a first support part capable of suspending the substrate by means of a gas supplied to one surface of the substrate, and the first support part capable of supporting the substrate At least one of the second support parts on one side moves to make the first and second support parts approach or contact each other and are aligned; the substrate supported by the aligned second support parts is moved toward the above-mentioned alignment direction. The operation of transferring the first support portion side; by stopping the supply of the gas, the substrate placed on the placement portion of the first support portion is supported and pushed up above the placement portion; and the supported The operation of unloading the substrate above the mounting portion from the first support portion.

According to a seventh aspect of the present invention, there is provided an exposure apparatus for exposing a substrate with exposure light, including the conveying device that holds the substrate and moves the substrate to an irradiation area of the exposure light.

According to an eighth aspect of the present invention, there is provided a device manufacturing method comprising: an operation of transferring the pattern on the substrate using the exposure apparatus; and an operation of processing the substrate on which the pattern has been transferred according to the pattern.

According to the aspect of the present invention, the transfer of the substrate can be performed without causing a placement offset or deformation.

1‧‧‧Exposure device

2‧‧‧Chamber

3‧‧‧Exposure device body

4,104‧‧‧Moving in

5‧‧‧Removal Department

9,109‧‧‧plate holder

12‧‧‧Fork

19‧‧‧Position detection sensor

31‧‧‧Substrate mounting part

33‧‧‧First moving mechanism

34‧‧‧Maintenance Department

35‧‧‧Movement mechanism body

36‧‧‧Guide pins

37‧‧‧Locating pins

40,140‧‧‧Load table

42,149,249‧‧‧Part 1 Transfer

43‧‧‧Second moving mechanism

44‧‧‧Maintenance Department

45‧‧‧Movement body

50‧‧‧Delivery table

52‧‧‧Second Transfer Section

53‧‧‧The third moving mechanism

54‧‧‧Maintenance Department

55‧‧‧Movement mechanism body

142‧‧‧Rollers

148‧‧‧Roller mechanism

150‧‧‧Jack up mechanism

205‧‧‧Remove the robotic arm

250‧‧‧Adsorption part

251‧‧‧Maintenance Department

252‧‧‧Position detection sensor

350‧‧‧Adsorption mechanism

351‧‧‧Maintenance Department

401‧‧‧Substrate mounting table

405‧‧‧Transfer Department

408‧‧‧Adsorption part

P‧‧‧Substrate

IL‧‧‧Exposure light

M‧‧‧mask

PL‧‧‧Projection Optical System

K,K1,K4,K6,K8‧‧‧Attraction hole

K2,K3,K5,K7‧‧‧Gas injection holes

K205‧‧‧Opening

FIG. 1 is a cross-sectional plan view showing the overall outline of an exposure apparatus.

FIG. 2 is an external perspective view showing the specific structure in the chamber.

FIG. 3A is a diagram showing the peripheral configuration of the panel holder.

FIG. 3B is a diagram showing the peripheral configuration of the panel holder.

FIG. 4A is a diagram showing the configuration of the main parts of the carrying-in portion.

FIG. 4B is a diagram showing the configuration of the main parts of the carry-in portion.

FIG. 5A is a diagram showing the configuration of the main parts of the carry-out portion.

FIG. 5B is a diagram showing the configuration of the main part of the carry-out portion.

FIG. 6 is a diagram illustrating a transfer procedure of the substrate to the table for carrying in. FIG.

FIG. 7A is an explanatory diagram of a transfer procedure of the board between the board holder and the carry-out portion.

FIG. 7B is an explanatory diagram of a transfer procedure of the board between the board holder and the carry-out portion.

FIG. 8 is a view showing a state in which the substrate is suspended and supported on the table for carrying in. FIG.

FIG. 9 is a diagram illustrating a step of conveying the substrate on the table for carrying in. FIG.

FIG. 10 is a diagram illustrating a step of transferring the substrate to the plate holder side.

FIG. 11 is a diagram illustrating a state in which a substrate is placed on the plate holder.

FIG. 12 is a diagram illustrating a transfer procedure of the substrate to the unloading table.

FIG. 13 is a view showing a state in which the substrate is suspended and supported on the unloading table.

FIG. 14A is a diagram illustrating the conveyance of the substrate from the plate holder to the unloading portion side.

FIG. 14B is a view explaining the conveyance of the substrate from the plate holder to the unloading portion side.

FIG. 14C is a diagram for explaining the transfer of the substrate from the board holder to the unloading portion side.

FIG. 15 is a diagram illustrating the operation of unloading the board from the unloading unit.

Fig. 16A is a diagram showing the configuration of the carrying portion of the second embodiment.

Fig. 16B is a diagram showing the configuration of the carrying portion of the second embodiment.

FIG. 17 is a diagram illustrating a configuration in which a substrate is conveyed from the conveying portion to the plate holder side.

FIG. 18 is a diagram for explaining the steps following FIG. 18 .

Fig. 19 is a diagram showing the structure of the plate holder according to the third embodiment.

FIG. 20A is a diagram illustrating a configuration in which a substrate is transported from the loading portion to the plate holder side.

FIG. 20B is a diagram illustrating a configuration in which the substrate is transported from the loading portion to the plate holder side.

Fig. 21 is a diagram showing the configuration of the fourth embodiment.

FIG. 22A is a diagram for explaining the transfer operation of the substrate according to the fourth embodiment.

FIG. 22B is a diagram for explaining the transfer operation of the substrate according to the fourth embodiment.

FIG. 22C is a diagram for explaining the transfer operation of the substrate according to the fourth embodiment.

FIG. 22D is a diagram for explaining the transfer operation of the substrate according to the fourth embodiment.

Fig. 23 is a perspective view showing the configuration of the inside of the chamber according to the fifth embodiment.

FIG. 24A is a plan view showing a schematic configuration of the carry-in/out section.

FIG. 24B is a plan view showing the schematic configuration of the carry-in/out section.

FIG. 25 is a diagram for explaining the carrying-in procedure of the board according to the fifth embodiment.

FIG. 26 is a diagram illustrating the transfer of the board from the carry-in section to the board holder side.

FIG. 27 is a diagram for explaining the transfer of the board from the board holder to the carrying-in/out part side.

FIG. 28 is a cross-sectional plan view showing the overall outline of the exposure apparatus.

FIG. 29 is an external perspective view showing the specific structure of the chamber.

FIG. 30A is a diagram showing the peripheral configuration of the panel holder.

FIG. 30B is a diagram showing the peripheral configuration of the panel holder.

31A is an explanatory diagram of a transfer procedure of the board between the board holder and the carry-out portion.

31B is an explanatory diagram of a transfer procedure of the board between the board holder and the carry-out portion.

FIG. 32 is a view showing a state in which the substrate is suspended and supported on the table for carrying in. FIG.

FIG. 33 is a diagram illustrating a step of conveying the substrate on the carrying-in stage.

FIG. 34 is a diagram illustrating a step of transferring the substrate to the plate holder side.

FIG. 35 is a diagram for explaining the operation of the unloading robot arm.

Fig. 36A is a view before explaining the operation of unloading the substrate from the plate holder.

Fig. 36B is a view before explaining the operation of unloading the substrate from the plate holder.

Fig. 37 is a side view for explaining the operation of taking out the substrate from the plate holder.

Fig. 38 is a diagram showing the configuration of the carrying portion of the third embodiment.

FIG. 39A is a diagram illustrating a configuration in which the substrate is transported from the loading portion to the plate holder side.

FIG. 39B is a diagram illustrating a configuration in which the substrate is transported from the loading portion to the plate holder side.

FIG. 40 is a diagram showing the structure of the exposure apparatus main body of the fourth embodiment.

FIG. 41 is a view showing the plan structure of the panel holder.

Figure 42A is a side sectional view of the plate holder.

Figure 42B is a side sectional view of the plate holder.

FIG. 43 is a diagram showing the structure of the upper and lower moving parts.

FIG. 44A is a diagram illustrating a configuration in which a substrate is transported from the loading portion to the plate holder side.

FIG. 44B is a diagram illustrating a configuration in which the substrate is transported from the loading portion to the plate holder side.

FIG. 45 is a view showing a state in which the substrate is suspended and supported on the table for carrying in. FIG.

FIG. 46 is a view showing a state in which the abutting portion is in contact with the end of the substrate.

FIG. 47 is a diagram illustrating a step of moving the board from the carrying-in stage to the board holder.

FIG. 48 is a perspective view for explaining the movement of the carrying out robot arm.

49A is an explanatory diagram of the step of carrying out the substrate from the plate holder.

49B is an explanatory diagram of the step of carrying out the board from the board holder.

49C is an explanatory diagram of the step of carrying out the board from the board holder.

Fig. 50A is a plan view showing the structure of the suction mechanism of the fifth embodiment.

Fig. 50B is a side view showing the structure of the suction mechanism of the fifth embodiment.

Fig. 51A is a side view illustrating the operation of unloading the substrate from the plate holder.

Fig. 51B is a side view illustrating the operation of unloading the substrate from the plate holder.

FIG. 52A is a diagram showing the configuration of a modification of the suction mechanism.

FIG. 52B is a diagram showing the configuration of a modification of the suction mechanism.

FIG. 53 is a flow chart for explaining an example of the manufacturing process of the micro device.

Embodiments of the present invention will be described with reference to the drawings. In addition, this invention is not limited to this. Hereinafter, the exposure apparatus provided with the conveying apparatus of this invention and performing exposure processing (exposing the pattern for liquid crystal display elements to the board|substrate to which the photosensitive agent was apply|coated) is demonstrated, and one embodiment of the conveying method and the element manufacturing method of this invention is demonstrated.

(first embodiment)

FIG. 1 is a cross-sectional plan view showing a schematic configuration of the exposure apparatus of the present embodiment. The exposure apparatus 1 includes, as shown in FIG. 1 , an exposure apparatus main body 3 for exposing a pattern for liquid crystal display elements to a substrate, a carry-in section 4, and a carry-out section 5, which are highly cleaned and housed in a chamber 2 adjusted to a predetermined temperature. Inside. In the present embodiment, the substrate is a large glass plate, and the size of one side thereof is, for example, 500 mm or more.

FIG. 2 is an external perspective view showing the specific structure of the chamber 2 . As shown in FIG. 2 , the exposure apparatus main body 3 includes an illumination system (not shown) for illuminating the photomask M with exposure light IL, a photomask stage (not shown) that holds the photomask M on which the pattern for liquid crystal display elements is formed, and is arranged on This mask contains The projection optical system PL under the stage, the plate holder 9 serving as a substrate holder which is two-dimensionally movable on a base (not shown) arranged below the projection optical system PL, and the plate holder 9 are held and the plate holder 9 is held. The first moving mechanism 33 for moving the plate holder 9 in the chamber 2 .

In addition, in the following description, the two-dimensional movement relative to the plate holder 9 provided at the base (not shown) of the chamber 2 is performed in a horizontal plane, and the X-axis and the Y-axis are set in directions orthogonal to each other in the horizontal plane. . The holding surface of the board holder 9 with respect to the board|substrate P is parallel to a horizontal surface in a reference state (for example, the state at the time of the handover of the board|substrate P). Furthermore, the Z axis is set in a direction orthogonal to the X axis and the Y axis, and the optical axis of the projection optical system PL is parallel to the Z axis. In addition, the directions around the X axis, the Y axis, and the Z axis are referred to as the θX direction, the θY direction, and the θZ direction, respectively.

The first moving mechanism 33 includes a moving mechanism body 35 and a holding portion 34 that is disposed on the moving mechanism body 35 and that holds the plate holder 9 . The moving mechanism main body 35 is supported on a guide surface (base) not shown in a non-contact manner by a gas bearing, and can move in the XY directions on the guide surface. With such a configuration, the plate holder 9 moves within a predetermined region of the guide surface on the light exit side (the image plane side of the projection optical system PL) in a state where the substrate P is held.

The moving mechanism body 35 can be moved in the XY plane on the guide surface by the action of a coarse motion system including an actuator such as a linear motor. The holding portion 34 can be moved relative to the moving mechanism body 35 in the Z-axis, θX, and θY directions by actuation of a micro-motion system including an actuator such as a voice coil motor. The holding part 34 can move in the six directions of X-axis, Y-axis, Z-axis, θX, θY, and θZ while holding the substrate P by the operation of the substrate stage drive system including the coarse motion system and the fine motion system. direction.

The exposure apparatus 1 performs step-and-scan exposure in a state where the rectangular substrate P is placed on the plate holder 9, and sequentially transfers the pattern formed on the mask M to the substrate. A plurality of, for example, four exposure areas (pattern transfer areas) on the plate P are provided. That is, in this exposure apparatus 1, the slit-shaped illumination region on the mask M is illuminated by the exposure light IL from the illumination system, and is transmitted through the not-shown controller by the not-shown controller. The drive system moves the mask stage holding the mask M and the plate holder 9 holding the substrate P synchronously in a predetermined scanning direction (here, the Y-axis direction), and transfers the mask to an exposure area on the substrate P The pattern of M, that is, scanning exposure is performed. In addition, the exposure apparatus 1 of the present embodiment constitutes a so-called multi-lens type scanning exposure apparatus, that is, the projection optical system PL has a plurality of projection optical modules, and the illumination system includes a plurality of illumination modules corresponding to the plurality of projection optical modules. Group.

After the scanning exposure of the one exposure area is completed, the step operation of moving the plate holder 9 in the X direction by a predetermined amount to the scanning start position of the next exposure area is performed. Next, the exposure apparatus main body 3 transfers the pattern of the photomask M to the four exposure areas in sequence by repeatedly performing such scanning exposure and stepping operations.

As shown in FIG. 2, the carrying section 4 is provided with a carrying table that supports one side (lower surface) of the substrate P when the coating and developing machine (not shown) arranged adjacent to the exposure device 1 carries the substrate P coated with the photosensitive agent. 40 , and a second moving mechanism 43 for moving the carrying-in table 40 . Moreover, the carrying-in part 4 can adjust the temperature of the board|substrate P carried in to the table 40 for carrying-in.

The second moving mechanism 43 includes a moving mechanism main body 45 and a holding portion 44 that is disposed on the moving mechanism main body 45 and holds the table 40 for carrying in. The moving mechanism main body 45 is supported on a guide surface (not shown) in a non-contact manner by a gas bearing, and can move in the XY directions on the guide surface. With such a structure, the table 40 for carrying in can move in the predetermined area|region of a guide surface in the state which hold|maintained the board|substrate P. In addition, the support of the moving mechanism body 45 with respect to the guide surface (not shown) is not limited to the support of the gas bearing, and a well-known guide mechanism different from the gas bearing can also be used (the position relative to the guide surface is Drive mechanism).

The moving mechanism main body 45 has the same structure as the moving mechanism main body 35 described above, and can move in the XY plane on the guide surface. In addition, the holding portion 44 has the same configuration as the holding portion 34 described above, and can move relative to the moving mechanism main body 45 in the Z-axis, θX, and θY directions. The holding portion 44 can move in six directions of the X-axis, Y-axis, Z-axis, θX, θY, and θZ directions in a state where the substrate P is held.

The unloading unit 5 includes, as shown in FIG. 2 , a unloading table 50 that supports one surface (lower surface) of the substrate P when the substrate P that has been subjected to the exposure treatment by the exposure apparatus body 3 is transferred, and a moving table 50 . The third moving mechanism 53 .

The third moving mechanism 53 includes a moving mechanism main body 55 and a holding portion 54 that is arranged on the moving mechanism main body 55 and holds the unloading table 50 . The moving mechanism main body 55 is supported on a guide surface (not shown) in a non-contact manner by a gas bearing, and can move in the XY directions on the guide surface. With such a structure, the table 50 for carrying out can move in the predetermined area|region of a guide surface in the state which hold|maintained the board|substrate P.

The moving mechanism main body 55 has the same structure as the moving mechanism main bodies 35 and 45 described above, and can move in the XY plane on the guide surface. The holding portion 54 has the same configuration as the holding portions 34 and 44 described above, and can move relative to the moving mechanism body 55 in the Z-axis, θX, and θY directions. The holding portion 54 can move in six directions of the X-axis, Y-axis, Z-axis, θX, θY, and θZ directions in a state where the substrate P is held.

Next, the peripheral configuration of the plate holder 9 will be described with reference to FIGS. 3A and 3B . FIG. 3A is a diagram showing a plan structure of the panel holder 9 , and FIG. 3B is a diagram showing a side view structure of the panel holder 9 . As shown to FIG. 3A, the board|substrate mounting part 31 which mounts the board|substrate P is formed in the board holder 9. As shown in FIG. The upper part of the board|substrate mounting part 31 is provided with the board holder 9, and the substantially holding surface of the board|substrate P is made to have favorable flatness. Furthermore, a plurality of suction holes K1 are provided on the upper surface of the substrate placement portion 31 for making the substrate P imitate and closely adhere to this surface. Each suction hole K1 is connected to a vacuum pump not shown.

Moreover, the upper surface of the board|substrate mounting part 31 is provided with several gas injection holes K2 which support the board|substrate P by the gas suspension by injecting gas, such as air, to the lower surface of the board|substrate P, and permeate|transmit. Each gas injection hole K2 is connected to a pump for gas injection (not shown). In addition, the suction holes K1 and the gas injection holes K2 are alternately arranged in a lattice shape.

Further, a guide pin 36 for guiding the substrate P and positioning pins 37 for defining the position of the substrate P with respect to the substrate placement portion 31 of the plate holder 9 are provided on the peripheral portion of the plate holder 9 when the substrate P is loaded in. . These guide pins 36 and positioning pins 37 can move together with the plate holder 9 in the exposure apparatus body 3 .

As shown to FIG. 3B, the board holder 9 is equipped with the position detection sensor 19 which detects the relative position with the table 40 for carrying in and the table 50 for carrying out in the side part 9a. The position detection sensor 19 includes a distance detection sensor 19a for detecting the relative distance with respect to the table 40 for carrying in and the table 50 for carrying out, and a relative height for detecting the relative height with respect to the table 40 for carrying in and the table 50 for carrying out The height detection sensor 19b. Moreover, the recessed part is formed in the position corresponding to the position detection sensor 19 among the table 40 for carrying out and the table 50 for carrying out, thereby preventing the position detection sensor 19 from interfering with the table 40 for carrying in and the table 50 for carrying out.

Next, the configuration of the main parts of the carrying portion 4 will be described with reference to FIGS. 4A and 5B . FIG. 4A is a plan view showing the peripheral configuration of the table 40 for carrying in, and FIG. 4B is a view showing a cross section taken along the line A-A in FIG. 4A .

As shown in FIGS. 4A and 4B , the carrying section 4 is provided with a table 40 for carrying the board P from the carrying in The 1st transfer part 42 which transfers to the board holder 9. The 1st transfer part 42 contains the guide part 42a and the contact part 42b which abuts on the board|substrate P.

Two groove-shaped recessed parts 40a formed in one direction (Y direction shown in the figure) are formed on the upper surface of the table 40 for carrying in. The above-mentioned guide portion 42a is provided in the concave portion 40a. The aforementioned abutting portion 42b is attached to the guide portion 42a in a state of protruding from the upper surface of the table 40 for carrying in. The contact portion 42b is formed of an elastic member such as rubber, and can reduce damage to the substrate P during contact.

In addition, on the upper surface of the table 40 for carrying in, a plurality of gas injection holes K3 for supporting the substrate P through the gas suspension by injecting gas such as air to the lower surface of the substrate P are provided. Each gas injection hole K3 is connected to a pump for gas injection (not shown).

In addition, a plurality of suction holes K4 are provided on the upper surface of the table 40 for carrying in so that the substrate P is closely attached to the surface. Each suction hole K4 is connected to a vacuum pump not shown. The gas injection holes K3 and the suction holes K4 are alternately arranged in a lattice shape along the Y direction. In addition, the gas injection holes K3 and the suction holes K4 are not limited to such a lattice-like arrangement, and may be arranged in various forms (for example, alternately arranged in the Y direction). In addition, the gas injection hole K3 and the suction hole K4 are not limited to be provided independently of each other, and the same hole may also be used as the gas injection hole K3 and the suction hole K4. In this case, each hole can be appropriately switchably connected to the gas injection pump and the vacuum pump.

In addition, through holes 47 are formed in the table 40 for carrying in, and the through holes 47 can be used as substrate support pins of the up-down mechanism for transferring the substrate P between the coating and developing machine (not shown) as described later. plugged in.

Next, the configuration of the main part of the carrying-out portion 50 will be described with reference to FIGS. 5A and 5B . As shown to FIG. 5A and FIG. 5B, the unloading part 50 is the 2nd transfer part 52 which transfers the board|substrate P from the board holder 9 to the stage 50 for unloading. The second transfer portion 52 includes a guide portion 52a and a position between a guide portion 52a and the substrate P that is adsorbed and held. The adsorption part 52b.

Two groove-shaped recessed parts 50a formed in one direction (Y direction shown in the figure) are formed on the upper surface of the table 50 for carrying out. The above-mentioned guide portion 52a is provided in the concave portion 50a. The aforementioned suction portion 52b is attached to the guide portion 52a in a state of protruding from the upper surface of the table 50 for carrying out. The suction part 52b includes, for example, a vacuum suction pad for holding the substrate P by vacuum suction.

Moreover, in the adsorption|suction part 52b, the contact part 58 which abuts the board|substrate P extruded from the board holder 9 at the time of carrying out a board|substrate is provided. The contact portion 58 is formed of an elastic member such as rubber, for example.

Moreover, on the upper surface of the table 50 for carrying out, a plurality of gas injection holes K5 for supporting the substrate P by the gas suspension by injecting gas such as air to the lower surface of the substrate P are provided. Each gas injection hole K5 is connected to a pump for gas injection (not shown).

In addition, a plurality of suction holes K6 are provided on the upper surface of the table 50 for unloading so that the substrate P is closely attached to the surface. Each suction hole K6 is connected to a vacuum pump not shown. In addition, the gas injection holes K5 and the suction holes K6 are alternately arranged in a lattice shape.

In addition, a through hole 57 is formed in the unloading table 50, and the through hole 57 can be used as a substrate support pin of the up-down mechanism for transferring the substrate P between the coating and developing machine (not shown) as described later. plugged in.

Next, the operation of the exposure apparatus 1 will be described with reference to FIGS. 6 to 15 . Specifically, the handover operation of the board P between the carry-in portion 4 and the board holder 9 and the handover operation of the board P between the board holder 9 and the carry-out portion 50 will be mainly described. In addition, in this embodiment, the table 40 for carrying in of the carrying-in part 4 and the table 50 for carrying out of the carrying out part 5 are arrange|positioned in the different position in the same horizontal plane. That is, the table 40 for carrying in and the table 50 for carrying out are arrange|positioned in the position which does not overlap each other in the planar state (the state seen from the +Z direction shown in FIG. 2).

First, the board|substrate P with which the photosensitive agent was apply|coated by the coating developing machine (not shown) is carried into the carrying-in part 4. As shown in FIG. At this time, the up-down movement mechanism 49 located below the table 40 for carrying in first arranges the substrate support pins 49 a above the table 40 for carrying in through the through holes 47 . Next, as shown in FIG. 6, the arm portion 48 of the coater and developing machine (not shown) is inserted between the substrate support pins 49a. After the arm portion 48 is lowered to transfer the substrate P to the substrate support pin 49a, it is withdrawn from the carrying portion 4 . The up-down mechanism 49 completes the carrying-in operation of the board P to the carrying-in table 40 by lowering the board support pins 49a on which the board P is supported. Then, by driving the vacuum pump, the substrate P is sucked and held on the upper surface of the table 40 for carrying in through the suction hole K4.

Next, as shown in FIG. 7A , the plate holder 9 is moved so as to approach the carrying-in table 40 of the carrying-in section 4 . Specifically, the 1st moving mechanism 33 arranges the board holder 9 and the table 40 for carrying in in the state which approached in the Y direction. Here, the state in which the board holder 9 and the table 40 for carrying in are close to each other means a state in which the distance by which the movement of the board P can be smoothly performed is separated at the time of the handover of the board P, which will be described later.

Moreover, the 2nd moving mechanism 43 can be driven when the table 40 for carrying in and the board holder 9 are aligned. Thus, the table 40 for carrying in and the board holder 9 can be moved to the transfer position of the board|substrate P in a short time, and the time required for the carrying-in operation of the board|substrate P can be shortened. In this case, the table 50 for carrying out is withdraw|separated to the position which does not interfere with the table 40 for carrying in.

Moreover, since the board|substrate P is adsorbed and held on the upper surface of the table 40 for carrying in through the suction hole K4, the board|substrate P can be prevented from moving on the table 40 for carrying in when the 2nd moving mechanism 43 is driven.

In the present embodiment, as shown in FIG. 7B , when the table 40 for carrying in and the plate holder 9 are brought close to each other, the substrate P is arranged to be higher than the plate holder 9 . That is, the first moving mechanism 33 is The board holder 9 is brought close to the board 40 for carrying in so that the upper surface of the table 40 for carrying in which supports the board|substrate P may become higher than the upper surface of the board holder 9. Moreover, the table 40 for carrying in can also be raised by the 2nd moving mechanism 43 so that the upper surface of the table 40 for carrying in may become higher than the upper surface of the board holder 9.

Moreover, the 1st moving mechanism 33 can also arrange|align the board holder 9 and the table 40 for carrying in in the state of contacting. In this way, the handover of the board|substrate P between the board holder 9 mentioned later and the table 40 for carrying in can be performed smoothly.

Next, as shown in FIG. 8, the table 40 for carrying in injects gas from a plurality of gas injection holes K3 formed on the upper surface, and supports the substrate P in a floating state through the gas. On the other hand, when the plate holder 9 receives the substrate P, the gas is first injected from the plurality of gas injection holes K2 formed on the upper surface.

The carrying-in part 4 makes the contact part 42b contact with one end of the board|substrate P, as shown in FIG. The contact part 42b moves the board|substrate P to the board holder 9 side by moving along the guide part 42a in the recessed part 40a.

Since the board|substrate P becomes the state which floated on the table 40 for carrying in, the contact part 42b can slide the board|substrate P smoothly to the board holder 9 side. In addition, the upper surface of the board holder 9 becomes the floating support board P as described above. Here, the gas injected from the gas injection holes K3 and K2 can also be made to have directivity.

The board|substrate P sliding on the upper surface of the table 40 for carrying in by the contact part 42b is smoothly transferred to the upper surface of the board holder 9 as shown in FIG. In this embodiment, since the upper surface of the table 40 for carrying in is higher than the upper surface of the panel holder 9 , the substrate P can be smoothly transferred onto the panel holder 9 without touching the side surface of the panel holder 9 .

As shown in FIG. 9 , the substrate P is tied to a guide provided on the peripheral portion of the plate holder 9 The pin 36 is slid in the state of the position in the X direction in the drawing. The contact part 42b moves the board|substrate P to the positioning pin 37 provided in the board holder 9 on the downstream side in the board|substrate conveyance direction. The substrate P is positioned in the X direction in the figure by the guide pins 36, and is held in the Y direction in the figure by the positioning pins 37 and the contact portion 42b. The plate holder 9 stops the gas injection from the gas injection holes K2. As shown in FIG. 11, the board|substrate P is mounted in the state aligned with the board|substrate mounting part 31.

In addition, conventionally, when the substrate is placed on the plate holder, there is a possibility that the placement of the substrate may be shifted (position shifted from a predetermined placement position) or the substrate may be deformed. One of the reasons for this placement deviation is considered to be, for example, that the substrate is in a floating state due to a thin air layer generated between the substrate and the plate holder just before the substrate is placed. In addition, one of the causes of the deformation of the substrate is considered to be, for example, that after the substrate is placed, air is trapped between the substrate and the plate holder, and the substrate is in a state of expansion.

On the other hand, in this embodiment, since the board|substrate P is conveyed in the state floated by the gas injection as mentioned above, it is delivered to the board holder 9 in the state of high flatness without distortion. Moreover, since the board|substrate P is mounted on the board|substrate mounting part 31 from the height which is floated and supported, it can prevent that an air retention or an air layer generate|occur|produces between the board|substrate P and the board|substrate mounting part 31. Therefore, it is possible to prevent the substrate P from being in a swollen state, and to prevent the occurrence of displacement or deformation of the substrate P in placement. Therefore, the board|substrate P can be mounted in the state with high flatness in the predetermined position with respect to the board holder 9. Then, by driving the vacuum pump, the substrate P is sucked and held on the upper surface of the substrate placement portion 31 through the suction hole K1.

After the board|substrate P is mounted on the board holder 9, the mask M is illuminated with the exposure light IL from an illumination system. The pattern of the mask M illuminated with the exposure light IL is projected through The optical system PL is projected and exposed to the board|substrate P mounted on the board holder 9.

In the exposure apparatus 1, since the substrate P can be favorably placed on the plate holder 9 as described above, a predetermined exposure can be performed at an appropriate position on the substrate P with high accuracy, and exposure with high reliability can be realized. deal with.

In the present embodiment, the photosensitive agent can be applied by a coating developer (not shown) during the exposure treatment of the substrate P, or while the substrate P after the exposure treatment is conveyed to the unloading section 5 as will be described later. Next, the substrate P is placed on the carrying table 40 of the carrying part 4 .

Next, the carrying-out operation of carrying out the board|substrate P from the board holder 9 after completion|finish of an exposure process is demonstrated.

After the exposure process is completed, the plate holder 9 is moved so as to approach the unloading table 50 of the unloading section 5 as shown in FIG. 12 . Specifically, the first moving mechanism 33 arranges the plate holder 9 and the table 50 for carrying out in a state of approaching in the Y direction. At this time, since the substrate P is sucked and held through the suction hole K1, the substrate P can be prevented from moving on the substrate placement portion 31 when the first moving mechanism 33 is driven.

Moreover, the 3rd moving mechanism 53 can be driven when the table 50 for carrying out and the board holder 9 are aligned. Thus, the table 50 for carrying out and the board holder 9 can be moved to the transfer position of the board|substrate P in a short time, and the time required for carrying out the board|substrate P can be shortened. In this case, the table 40 for carrying in is withdraw|separated to the position which does not interfere with the table 50 for carrying out.

In the present embodiment, when the board holder 9 and the table 50 for carrying out are brought close to each other, the board P is arranged to hold the board corresponding to the transfer destination of the board P in the same manner as when the board holder 9 and the stage 40 for carrying in are brought close to each other. With 9 high. That is, the 1st moving mechanism 33 brings the board holder 9 close to carrying out so that the upper surface of the board holder 9 which supports the board|substrate P is higher than the upper surface of the table 50 for carrying out. Use table 50. Moreover, the table 50 for carrying out can be lowered|hung by the 3rd moving mechanism 53 so that the upper surface of the table 50 for carrying out may be made lower than the upper surface of the board holder 9.

The first moving mechanism 33 can also align the board holder 9 and the table 50 for carrying out in contact with each other. In this way, the handover of the board|substrate P between the board holder 9 mentioned later and the table 50 for carrying out can be performed smoothly.

The plate holder 9 stops the drive of the vacuum pump, and releases the suction and holding of the substrate P, which has passed through the suction hole K1 , to the substrate placement portion 31 . Next, as shown in FIG. 13, the plate holder 9 injects gas from a plurality of gas injection holes K2 formed on the upper surface of the substrate mounting portion 31, and supports the substrate P in a floating state through the gas. On the other hand, when the unloading part 5 receives the board|substrate P, it injects gas from the gas injection hole K5 formed in the upper surface of the stage 50 for unloading first.

The unloading part 5 moves the suction part 52b of the second transfer part 52 along the guide part 52a to the side of the board P suspended and supported on the board mounting part 31 of the board holder 9 . As shown in FIG. 14A , the positioning pin 37 presses the end of the substrate P floating on the substrate placement portion 31 . Thereby, the board|substrate P floating on the board|substrate mounting part 31 slides toward the table 50 for carrying out, and contacts the contact part 58 attached to the adsorption|suction part 52b as shown to FIG. 14B. In this way, by using the positioning pins 37 to slide the substrate P toward the abutting portion 58 , it is not necessary to move the suction portion 52b along the sliding portion 52a to a position facing the substrate P on the plate holder 9 . After the end portion of the substrate P contacts the contact portion 58, the suction portion 52b sucks and holds the substrate P, and moves along the guide portion 52a in the Y direction in the drawing as shown in FIG. 14C.

At this time, since the board|substrate P is supported in the state which floated on the board holder 9, the adsorption|suction part 52b can slide the board|substrate P smoothly to the table 50 side for carrying out. Moreover, the upper surface of the table 50 for carrying out becomes the floating support board P as mentioned above. Here, the gas injected from the gas injection holes K2 and K5 can also be made to have directivity.

The board|substrate P sliding on the upper surface of the board|substrate mounting part 31 by the movement of the adsorption|suction part 52b is smoothly transferred to the upper surface of the table 50 for carrying out. In this embodiment, since the upper surface of the board holder 9 is higher than the upper surface of the unloading table 50 , the substrate P can be smoothly transferred to the unloading table 50 without touching the side surface of the unloading table 50 .

After the movement of the substrate P is completed by the suction part 52b, the unloading table 50 stops the gas injection from the gas injection hole K5, and the substrate P is sucked and held through the suction hole K6. The unloading part 5 drives the 3rd moving mechanism 53, and moves the unloading table 50 to the unloading position of the board|substrate P in the state which adsorbed and held the board|substrate P.

After the exposure apparatus 1 transfers the board|substrate P to the carry-out part 5 from the board holder 9, it moves the board holder 9 so that the table 40 for carrying in of the carry-in part 4 may be approached. Next, similarly, the transfer of the board|substrate P is performed between the table 40 for carrying in and the board holder 9, and exposure processing can be performed with respect to the board|substrate P mounted on the board holder 9.

In the present embodiment, during the period in which the next substrate P is carried in from the carrying section 4 to the board holder 9 or in the period in which the exposure treatment is performed on the next substrate P, the exposure treatment is carried out and placed on the carrying table 50 . The completed substrate P. At this time, the vertical movement mechanism 60 located below the unloading table 50 arranges the substrate support pins 60 a above the unloading table 50 through the through holes 57 . Thereby, the board|substrate P is supported by the board|substrate support pin 60a, and is hold|maintained above the table 50 for carrying out. Next, as shown in FIG. 15, the arm portion 48 of the coater and developing machine (not shown) is inserted between the substrate support pins 60a. Then, the board|substrate P is handed over to the arm part 48 by lowering the board|substrate support pin 60a. The arm portion 48 moves the substrate P in a coater and developing machine (not shown) to perform development processing.

As described above, the board holder 9 is alternately connected by moving the carry-in section 4 and the carry-out section 5 in the same horizontal plane (XY plane), so that the board P is carried in and out of the exposure apparatus main body 3 . action. In the present embodiment, since the plate holder 9 is moved along the arrangement direction of the carry-in part 4 and the carry-out part 5, the plate holder 9 can be arranged in close proximity to or in contact with the carry-in part 4 and the carry-out part 5 in a short time. state. Therefore, the processing time (so-called takt) accompanying the carrying in and out of the substrate P can be shortened.

According to the present embodiment, since the floating-supported substrate P can be slid and transported from the carrying portion 4 to the plate holder 9 , it is possible to prevent the occurrence of air trapping or air layer between the substrate P and the substrate placing portion 31 . The placement offset or deformation of the substrate P is prevented. Therefore, exposure processing with high reliability can be performed.

Moreover, also in 1st Embodiment, when the board|substrate P is conveyed from the table 40 for carrying in to the board holder 9, the upper surface of the table 40 for carrying in can be inclined. Specifically, the holding portion 44 of the second moving mechanism 43 is inclined toward the plate holder 9 side (θY) from the top surface of the carrying table 40 supporting the substrate P in a floating state by the gas injection from the gas injection hole K3 . Thereby, the board|substrate P can be moved to the board holder 9 side by the self-weight of the board|substrate P.

Moreover, when the board|substrate P is conveyed from the board holder 9 to the table 50 for unloading, the upper surface of the board holder 9 can also be inclined. Specifically, the holding part 34 of the first moving mechanism 33 inclines the upper surface of the plate holder 9 supporting the substrate P in a floating state by the gas injection from the gas injection hole K2 toward the unloading table 50 side (θY). Thereby, this board|substrate P can be moved to the table 50 side for carrying out by the self-weight of the board|substrate P.

(Second Embodiment)

Next, the configuration of the second embodiment of the present invention will be described. In addition, in this embodiment, the same code|symbol is attached|subjected to the same element as the component of 1st Embodiment, and the description is abbreviate|omitted. In the second embodiment, the configuration of the first transfer unit 149 in the carry-in unit 104 is the same as that of the first embodiment. different.

16A and 16B are diagrams showing the structure of the carrying portion 104 of the present embodiment, FIG. 16A is a diagram showing the plan structure of the carrying portion 104 , and FIG. 16B is a view showing the carrying portion 104 on the side of the arrow A-A in FIG. 16A . Sectional drawing.

As shown in FIGS. 16A and 16B , the first transfer unit 149 of the carry-in unit 104 of the present embodiment has a roller mechanism 148 instead of the configuration of being levitated and supported by spraying gas on one surface of the substrate P. As shown in FIG.

On one end side of the table 140 for carrying in, as shown in FIG. 16A , a plurality of notches 141 are formed. The rollers 142 constituting the above-mentioned roller mechanism 148 are respectively supported by the notches 141 , which are rotatable around the shaft 143 . The roller 142 can be rotated by a driving mechanism not shown. As shown in FIG. 16B , the roller mechanism 148 is configured so that the rollers 142 can contact the substrate P or be separated from the substrate P. As shown in FIG.

According to such a configuration, the roller mechanism 148 can hold the substrate P against the plate by rotating the plurality of rollers 142 in contact with the lower surface of the substrate P supported on the carrying table 140 and rotating it in a predetermined direction. With 9 side movements. As a material for forming the roller 142, an elastic member such as rubber that generates a large frictional force with the substrate P can be used. By forming the roller 142 using such an elastic member, damage (scratch, etc.) to the substrate P can be prevented. Moreover, only the said suction hole K4 is provided in the upper surface of the table 140 for carrying in.

Next, the operation of the exposure apparatus 1 of the present embodiment will be described. Specifically, the transfer operation of the board P between the carrying-in portion 104 and the plate holder 9, which is different from the first embodiment, will be described.

First, the board|substrate P with which the photosensitive agent was apply|coated by the coating developing machine (not shown) is carried into the carrying-in part 104. As shown in FIG. The substrate P is sucked and held on the upper surface of the table 140 for carrying in through the suction hole K4. That Then, the board holder 9 is moved so that it may approach the table 140 for carrying in (refer FIG. 7A).

Also in the present embodiment, it is preferable that the board holder 9 is brought close to the board 140 for carrying in so that the upper surface of the carrying stage 140 supporting the substrate P is higher than the upper surface of the board holder 9 (see FIG. 7B ).

However, in the present embodiment, even if the upper surface of the table 140 for carrying in is lower than the upper surface of the plate holder 9, as long as at least the upper surface of the roller 142 is higher than the upper surface of the plate holder 9, the substrate mounted on the roller 142 can be loaded. P is surely conveyed from the carrying table 140 side to the plate holder 9 side.

Next, as shown in FIG. 17, the table 140 for carrying in makes the roller 142 of the roller mechanism 148 contact the lower surface of the board|substrate P, and rotates in a predetermined direction. On the other hand, when the plate holder 9 receives the substrate P, the gas is first injected from the plurality of gas injection holes K2 formed on the upper surface. The substrate P smoothly slides toward the plate holder 9 by the frictional force with the rollers 142 .

Here, the plate holder 9 , which is the destination of the conveyance of the substrate P, is levitated and supported on the substrate placement portion 31 by the gas injected from the gas injection hole K2 .

Therefore, the board|substrate P which slides on the upper surface of the table 140 for carrying in by the roller mechanism 148 is transferred to the upper surface of the board holder 9 smoothly.

As shown in FIG. 18, the board|substrate P slides in the state which is prescribed|regulated by the guide pin 36 provided in the peripheral part of the board holder 9 in the X direction in the figure. The roller mechanism 148 moves the substrate P to come into contact with the positioning pins 37 provided in the plate holder 9 on the downstream side in the substrate conveyance direction. The substrate P is positioned in the X direction in the figure by the guide pins 36, and is held in the Y direction in the figure by the positioning pins 37 and the contact portion 42b. The plate holder 9 stops the gas injection from the gas injection holes K3. The substrate P is placed in a state aligned with the substrate placement portion 31 .

Also in the present embodiment, since the substrate P is conveyed in a state of being suspended by the gas jet as described above, it can be transferred to the plate holder 9 in a state of high flatness without twisting, and it is possible to prevent the Air stagnation or an air layer is generated between the substrate P and the substrate placement portion 31 . Therefore, the board|substrate P can be mounted in the state with high flatness in the predetermined position with respect to the board holder 9. Therefore, a predetermined exposure can be performed with high precision at an appropriate position on the substrate P, and a highly reliable exposure process can be realized.

In addition, since the operation of carrying out the board|substrate P from the board holder 9 after completion|finish of an exposure process is the same as that of 1st Embodiment, the description is abbreviate|omitted.

In addition, in the above description, although the roller mechanism 148 was demonstrated as the 1st transfer part 149 of the carry-in part 104, a roller mechanism can also be used as the 2nd transfer part 52 of the carry-out part 5. FIG. In addition, the table 140 for carrying in can also employ the structure which supports the board|substrate P by the air jet similarly to 1st Embodiment. With this configuration, since the substrate P is conveyed by the roller mechanism 148 in a floating state, the substrate P can be smoothly conveyed to the plate holder 9 side.

(third embodiment)

Next, the configuration of the third embodiment of the present invention will be described. In addition, in this embodiment, the same code|symbol is attached|subjected to the same element as the component of 1st, 2nd embodiment, and the description is abbreviate|omitted. The main difference of the third embodiment is that the plate holder 109 includes a first transfer mechanism.

FIG. 19 is a diagram showing the structure of the plate holder 109 of the present embodiment. The board holder 109 of this embodiment is equipped with the 1st transfer part 249 which transfers the board|substrate P from the table 40 for carrying in to the board holder 109 as shown in FIG. This 1st transfer part 249 contains the suction part 250 which suction-holds the both sides of the board|substrate P in the width direction. The suction part 250 can move freely in the XY plane along the direction of the P surface of the substrate.

Moreover, in this embodiment, the position detection sensor 252 for detecting the position of the board|substrate P carried in by the 1st transfer part 249 with respect to the board|substrate mounting part 31 is provided in the peripheral part of the board holder 109. As the position detection sensor 252, for example, a potentiometer can be used, and the present invention can use a meter of either a contact method or a non-contact method.

The suction part 250 sucks and holds the end of the substrate P which is suspended and supported on the table 40 for carrying in by the gas injection from the gas injection hole K3, and moves from the table 40 for carrying in to the plate holder 109 as shown in FIG. 20A . side transport. On the other hand, when the board holder 109 receives the substrate P, the gas is first injected from the plurality of gas injection holes K2 formed on the upper surface. At this time, the gas injected from the gas injection holes K2 and K3 can also have directivity.

The suction part 250 is shown in FIG. 20B , by making the end of the substrate P contact the position detection sensor 252 , the exposure apparatus 1 can detect the positional displacement of the substrate P relative to the substrate placement part 31 . In addition, the adsorption|suction part 250 is comprised so that it may drive based on the detection result of the said position detection sensor 252.

Therefore, the exposure apparatus 1 can correct the position of the substrate P held in the suction part 250 relative to the substrate placement part 31 according to the detection result of the position detection sensor 252 .

Also in the present embodiment, since the substrate P is conveyed in a state of being suspended by the gas jet as described above, it can be transferred to the plate holder 109 in a state of high flatness without distortion, and it is possible to prevent the Air stagnation or an air layer is generated between the substrate P and the substrate placement portion 31 . Therefore, the board|substrate P can be mounted in the state with high flatness in the predetermined position with respect to the board holder 109. Therefore, a predetermined exposure can be performed with high precision at an appropriate position on the substrate P, and a highly reliable exposure process can be realized.

In addition, the unloading operation of the board P from the board holder 109 after the exposure process is completed Since the first embodiment is the same, the description thereof is omitted.

(4th embodiment)

Next, the configuration of the fourth embodiment of the present invention will be described. In addition, in this embodiment, the same code|symbol is attached|subjected to the same element as the component of 1st Embodiment, and the description is abbreviate|omitted. As shown in FIG. 21 , the fourth embodiment is mainly different from the first embodiment in that the board carrying-in table 40 and the carrying-out table 50 are arranged at positions overlapping each other in a plan view. That is, when transferring the board|substrate P between the board holder 9, the table 40 for carrying in and the table 50 for carrying out move up and down with respect to the board holder 9.

Hereinafter, the transfer operation of the substrate P of the present embodiment will be described with reference to FIGS. 22A , 22B, and 22C.

After the exposure process with respect to the board|substrate P mounted on the board holder 9 is complete|finished, the table 50 for carrying out is arranged in the state which approached the board holder 9 in the Y direction. In this embodiment, as shown in FIG. 22A , with respect to the plate holder 9, the unloading table 50 which is standing by below is raised to a position where the substrate P can be received. At this time, the upper surface of the table 50 for carrying out can also be arrange|positioned lower than the upper surface of the board holder 9 (refer FIG. 13).

In addition, during the exposure process of the board|substrate P, the next board|substrate P is handed over to the table 40 for carrying in from a coating developing machine (not shown). Thereby, the table 40 for carrying in waits above the board holder 9 while carrying out the board|substrate P from the board holder 9 to the table 50 for carrying out, in the state which mounted the next board|substrate P.

The plate holder 9 stops the drive of the vacuum pump, and releases the suction and holding of the substrate P, which has passed through the suction hole K1 , to the substrate placement portion 31 . Next, the plate holder 9 injects gas from the gas injection holes K2, and supports the substrate P in a floating state through the gas (see FIGS. 14A-14C ). On the other hand, when the unloading part 5 receives the board P, it starts from a plurality of pieces formed on the upper surface of the unloading table 50 first. The gas injection hole K5 injects gas. At this time, the gas injected from the gas injection holes K2 and K5 can also have directivity.

As shown in FIG. 22B, the unloading part 5 moves the board|substrate P hold|maintained by the adsorption|suction part 52b to the Y direction in this figure similarly to 1st Embodiment. At this time, since the board|substrate P is supported in the state which floated on the board holder 9, the board|substrate P slides on the table 50 for carrying out smoothly. Moreover, the upper surface of the table 50 for carrying out becomes the floating support board P as mentioned above. Therefore, the board|substrate P is smoothly transferred to the upper surface of the table 50 for unloading.

After the movement of the substrate P is completed, the unloading table 50 stops the gas injection from the gas injection hole K5, and the substrate P is sucked and held through the suction hole K6. The table 50 for carrying out moves the board|substrate P downward as shown to FIG. 22C in the state in which the board|substrate P was adsorbed and held. In addition, when the size of the substrate P is large and is placed in a state protruding from the upper surface of the unloading table 50 , the unloading table 50 is separated from the board holder 9 so that the board P does not interfere with the board holder 9 . The above-mentioned lowering operation is performed in the state of retreating in the +Y direction in the figure.

On the other hand, the table 50 for carrying out starts the descending operation, and as shown in FIG. Thereby, the board holder 9 and the table 40 for carrying in are arranged in the state which approached in the Y direction. At this time, the upper surface of the table 40 for carrying in can also be arrange|positioned lower than the upper surface of the board holder 9 (refer FIG. 8).

The table 40 for carrying in injects gas from a plurality of gas injection holes K3 formed on the upper surface, and supports the substrate P in a floating state through the gas. On the other hand, when the plate holder 9 receives the substrate P, the gas is first injected from the plurality of gas injection holes K2 formed on the upper surface. At this time, the gas injected from the gas injection holes K2 and K5 can also have directivity.

The carrying-in portion 4 is in a state of floating and supporting the board P on the carrying-in table 40 Next, the contact portion 42b is brought into contact with one end portion of the substrate P. As shown in FIG. The contact part 42b moves the board|substrate P to the board holder 9 side by moving along the guide part 42a in the recessed part 40a (refer FIG. 9, 10).

Since the board|substrate P becomes the state which floated on the table 40 for carrying in, it slides smoothly to the board holder 9 side. Moreover, since the upper surface of the board holder 9 becomes the floating support board P as described above, the board P is smoothly transferred from the carrying table 40 to the board holder 9 as shown in FIG. 22D .

The board|substrate P can be mounted in the state aligned with the predetermined position with respect to the board|substrate mounting part 31 by the guide pin 36 and the positioning pin 37 similarly to 1st Embodiment (refer FIG. 9). Next, the substrate P is subjected to exposure processing.

In this embodiment, during the period of carrying the board|substrate P into the board holder 9 from the carrying part 4, or carrying out the exposure process of the board|substrate P, the board|substrate P which the exposure process which mounted on the table 50 for carrying out was carried out.

In this embodiment, the carrying-in part 4 and the carrying-out part 5 are moved in the height direction (Z direction) with respect to the plate holder 9 to be alternately connected as described above, and the carrying-in and unloading operation of the substrate P of the exposure apparatus main body 3 can be performed. In addition, since the carrying-in part 4 and the carrying-out part 5 stand by above the board holder 9 when not in use, and can be connected to the board holder 9 by moving up and down, respectively, the processing associated with the carrying-in-out operation of the substrate P can be shortened. Time (so-called Takt).

In addition, in the above-mentioned embodiment, the first direction in which the table 40 for carrying in and the plate holder 9 are arranged is described as being parallel to the second direction in which the table 50 for carrying out and the plate holder 9 are arranged, but the present invention is not limited to Herein, the present invention can also be applied to the situation in which the first direction and the second direction are different directions (for example, securities exchanges).

(5th embodiment)

Next, the configuration of the fifth embodiment of the present invention will be described. In addition, in this embodiment, the same code|symbol is attached|subjected to the same element as the component of 1st Embodiment, and the description is abbreviate|omitted. In the fifth embodiment, the main difference is that it has a carry-in section that functions as a carry-in section and a carry-out section.

FIG. 23 is a perspective view showing the internal structure of the chamber, and FIGS. 24A and 24B are plan views showing a schematic structure of the carrying-in part 400 .

As shown in FIG. 23 , the carrying-in/out section 400 includes a substrate mounting table 401 and a moving mechanism 402 that moves the substrate mounting table 401 . In addition, the movement mechanism 402 is comprised by the same structure as the 1st, 2nd movement mechanism 33 and 43 of 1st Embodiment. With such a configuration, the substrate stage 401 can move within a predetermined area of the guide surface on the light exit side (the image plane side of the projection optical system PL) in a state where the substrate P is held. In addition, the substrate stage 401 can also be moved in the Z-axis direction. Therefore, the board mounting table 401 functions as a table for carrying in and a table for carrying out.

As shown in FIGS. 24A and 24B , the carrying-in/out unit 400 includes a transfer unit 405 that transfers the substrate P from the substrate mounting table 401 to the plate holder 9 . The transfer part 405 includes a guide part 406 and an adsorption part 408 which is adsorbed and held by the substrate P. As shown in FIG.

On the upper surface of the substrate mounting table 401, two groove-shaped concave portions 401a formed in one direction (Y direction shown in the figure) are formed. The above-mentioned guide portion 406 is provided in the concave portion 401a. The aforementioned suction portion 408 is attached to the guide portion 406 in a state of protruding from the upper surface of the substrate mounting table 401 . The suction part 408 includes, for example, a vacuum suction pad for holding the substrate P by vacuum suction.

In addition, a plurality of gas injection holes K7 for supporting the substrate P through the gas suspension by injecting gas such as air to the lower surface of the substrate P are provided on the upper surface of the substrate mounting table 401 . Each gas injection hole K7 is connected to a gas injection pump (not shown). Furthermore, a plurality of suction holes K8 are provided on the upper surface of the substrate placing table 401 for making the substrate P imitate and closely adhere to this surface. Each suction hole K8 even Connected to a vacuum pump not shown. In addition, the gas injection holes K7 and the suction holes K8 are alternately arranged in a lattice shape.

In addition, through holes 407 are formed in the substrate placing table 401, and the through holes 407 can be used as substrate support pins of the up-down mechanism for transferring the substrate P between the coating and developing machine (not shown) as will be described later. plugged in.

The board holder 9 is equipped with the said position detection sensor 19 which detects the relative position with the board|substrate mounting table 401 in the side part like the said embodiment. The position detection sensor 19 includes a distance detection sensor 19a for detecting a relative distance with respect to the substrate mounting table 401, and a height detection sensor 19b for detecting a relative height with respect to the substrate mounting table 401 (refer to Figure 3B).

Next, the transfer operation of the board|substrate P between the carrying-in part 400 and the board holder 9 is demonstrated with reference to drawings. First, the board|substrate P with which the photosensitive agent was apply|coated by the coating developing machine (not shown) is carried into the carrying-out part 400. At this time, the up-down movement mechanism 409 located below the substrate mounting table 401 firstly disposes the substrate supporting pins 410 above the substrate mounting table 401 through the through holes 407 . Next, as shown in FIG. 25, the arm portion 48 of the coater and developing machine (not shown) is inserted between the substrate support pins 410. After the arm portion 48 is lowered to transfer the substrate P to the substrate support pins 410 , the substrate P is withdrawn from the carrying-in portion 400 . The up-down mechanism 409 lowers the substrate support pins 410 on which the substrate P is supported, and completes the carrying-in operation of the substrate P to the substrate placement table 401 . After that, by driving the vacuum pump, the substrate P is sucked and held on the upper surface of the substrate stage 401 through the suction hole K8.

Next, the board holder 9 is moved so that it may approach the board|substrate mounting table 401 of the carrying-in part 400. In addition, when the substrate placement table 401 and the plate holder 9 are arranged, the substrate placement table 401 and the plate holder 9 may be moved to the substrate P in a short time by driving the transfer unit 405 . The time required for the carrying-in operation of the substrate P is shortened. In this case, since the substrate P is sucked and held on the upper surface of the substrate mounting table 401 through the suction hole K8, the substrate P can be prevented from moving on the substrate mounting table 401 when the transfer unit 405 is driven.

In this embodiment, as shown in FIG. 26, the board holder 9 is brought close to the board holder 9 so that the upper surface of the board holder 401 on which the board P is supported is higher than the board holder 9. As shown in FIG. Moreover, by arranging the board holder 9 and the board|substrate stage 401 in a contact state, the moving distance of the board|substrate P can also be shortened, and it can transfer more smoothly.

Next, as shown in FIG. 26, the substrate mounting table 401 injects gas from a plurality of gas injection holes K7 formed on the upper surface, and supports the substrate P in a floating state through the gas. On the other hand, when the plate holder 9 receives the substrate P, the gas is first injected from the plurality of gas injection holes K2 formed on the upper surface. At this time, the gas injected from the gas injection holes K2 and K7 can also have directivity.

In the carrying-out portion 400 , one end portion of the substrate P is sucked and held by the suction portion 408 in a state where the substrate P is suspended and supported on the substrate mounting table 401 . The adsorption part 408 moves the board|substrate P to the board holder 9 side by moving along the guide part 406 in the recessed part 401a (refer FIG. 24A and 24B).

Since the substrate P is in a state of being suspended on the substrate stage 401, the suction portion 408b can smoothly slide the substrate P to the plate holder 9 side. Moreover, the upper surface of the board holder 9 becomes the floating support board P as mentioned above.

Therefore, the substrate P sliding on the upper surface of the substrate mounting table 401 by the suction portion 408 is smoothly transferred onto the upper surface of the plate holder 9 . In this embodiment, since the upper surface of the substrate mounting table 401 is higher than the upper surface of the plate holder 9 as shown in FIG. 26, the substrate P can be placed without touching the plate. The holder 9 is smoothly transferred to the plate holder 9 while being on the side of the holder 9 .

The board|substrate P is brought into the state aligned with the predetermined position with respect to the board|substrate mounting part 31 by contacting the guide pin 36 and the positioning pin 37 provided in the peripheral part of the board holder 9 (refer FIG. 9).

Also in the present embodiment, since the substrate P is conveyed in a state of being suspended by the gas jet as described above, it is possible to prevent air trapping or an air layer from being generated between the substrate P and the substrate placement portion 31 , thereby enabling The placement of the substrate P is prevented from being offset or deformed. Therefore, the board|substrate P can be mounted in the state with high flatness in the predetermined position with respect to the board holder 9. Then, by driving the vacuum pump, the substrate P is sucked and held on the upper surface of the substrate placement portion 31 through the suction hole K1. Next, after placing the board|substrate P on the board holder 9, the exposure process of the board|substrate P is performed.

After the exposure process is completed, the board holder 9 is moved so as to approach the substrate mounting table 401 of the carry-in section 400 . In the present embodiment, the plate holder 9 and the substrate placement table 401 are brought close to each other so that the upper surface of the plate holder 9 is higher than the upper surface of the substrate placement table 401 .

In addition, when the substrate mounting table 401 and the plate holder 9 are arranged, the time required for the unloading operation of the substrate P can be shortened by moving the substrate mounting table 401 . Moreover, the board holder 9 and the board|substrate stage 401 can also be arranged in a contact state. Thereby, since a gap is not formed between the board holder 9 and the board|substrate mounting table 401, the transfer of the board|substrate P can be performed smoothly.

The plate holder 9 stops the drive of the vacuum pump, and releases the suction and holding of the substrate P, which has passed through the suction hole K1 , to the substrate placement portion 31 . Next, as shown in FIG. 27, the plate holder 9 injects gas from a plurality of gas injection holes K2 formed on the upper surface of the substrate placement portion 31, and supports the substrate P in a floating state through the gas. On the other hand, when the unloading part 5 receives the substrate P, the gas is first injected from the plurality of gas injection holes K7 formed on the upper surface of the substrate mounting table 401 . At this time, the gas injected from the gas injection holes K2 and K7 can also have directivity.

The carrying-in part 400 moves the suction part 408 of the transfer part 405 along the guide part 406 to the side of the board P which is suspended and supported on the board mounting part 31 of the board holder 9 . The suction part 408 suctions and holds the substrate P, and moves the substrate P in the +Y direction in the drawing (see FIGS. 24A and 24B ).

At this time, since the substrate P is supported in a state of being suspended on the plate holder 9 , the suction portion 408 can smoothly slide the substrate P to the substrate stage 401 side. In addition, the upper surface of the substrate mounting table 401 becomes the floating support substrate P as described above.

Therefore, the substrate P sliding on the upper surface of the substrate placing portion 31 is smoothly transferred to the upper surface of the substrate placing table 401 . In this embodiment, since the upper surface of the board holder 9 is higher than the upper surface of the substrate mounting table 401 , the substrate P can be smoothly transferred to the substrate mounting table 401 without contacting the side surface of the substrate mounting table 401 .

After the movement of the substrate P is completed by the suction part 408, the substrate stage 401 stops the gas injection from the gas injection hole K7, and the substrate P is sucked and held through the suction hole K8. The carrying-in section 400 drives the transfer section 405 to move the board mounting table 401 to the carrying-out position of the board P in a state in which the board P is adsorbed and held.

Next, the exposure-processed board|substrate P mounted on the board|substrate stage 401 is carried out. At this time, the vertical movement mechanism 409 located below the substrate mounting table 401 arranges the substrate supporting pins 410 above the substrate mounting table 401 through the through holes 407 . Thereby, the board|substrate P is hold|maintained above the board|substrate stage 401 by being supported by the board|substrate support pin 410 (refer FIG. 25). Next, the arm portion 48 of the coater and developing machine (not shown) is inserted between the substrate support pins 410 , and the substrate P is transferred to the arm portion 48 by lowering the substrate support pins 410 . The arm portion 48 moves the substrate P in a coater and developing machine (not shown) to perform development processing.

According to the present embodiment, since the floating-supported substrate P can be slid, the Since the carrying-in part 400 is carried to the board holder 9 , it is possible to prevent air stagnation or an air layer between the board P and the board mounting part 31 , and to prevent the board P from being misplaced or deformed. Therefore, exposure processing with high reliability can be performed. Moreover, since the carrying-in part 400 also functions as the carrying-in part 4 and the carrying-out part 5 in the said 1st - 3rd embodiment, the apparatus structure can be simplified.

In addition, in the fifth embodiment, when the substrate P is transferred from the substrate mounting table 401 to the plate holder 9, the upper surface of the substrate mounting table 401 can be inclined. Specifically, the moving mechanism 402 inclines the upper surface of the substrate stage 401 supporting the substrate P in a suspended state by the gas injection from the gas injection hole K7 toward the plate holder 9 side (θY). Thereby, the board|substrate P can be moved to the board holder 9 side by the self-weight of the board|substrate P.

Moreover, when the board|substrate P is conveyed from the board holder 9 to the board|substrate mounting table 401, the upper surface of the board holder 9 can also be inclined. Specifically, the first moving mechanism 33 (holding portion 34 ) inclines the upper surface of the plate holder 9 that supports the substrate P in a floating state by the gas injection from the gas injection hole K2 toward the substrate mounting table 401 side (θY) . Thereby, the board|substrate P can be moved to the board|substrate stage 401 side by the self-weight of the board|substrate P.

In addition, in the present embodiment, the roller mechanism 148 shown in the second embodiment can also be used as the transfer portion 405 . Moreover, as the transfer part 405, as shown in 3rd Embodiment, the suction part 408 which comprises the transfer part 405 can also be provided in the plate holder 9 side.

(Sixth Embodiment)

Next, the configuration of the sixth embodiment of the present invention will be described. In addition, in the following description, the same code|symbol is attached|subjected to the component which is the same as the component of the said embodiment, and the description is simplified or abbreviate|omitted.

Fig. 28 is a cross-sectional plan view showing the schematic configuration of the exposure apparatus of the present embodiment Fig. 29 is a schematic perspective view showing the structure of the device in the chamber.

The exposure apparatus 1 is provided with the exposure apparatus main body 3 and the carrying-in part 4 as shown in FIG. 28 similarly to the said embodiment. In addition, in this embodiment, the exposure apparatus 1 is equipped with the carry-out arm 205 . These are housed in a chamber 2 that is highly purified and adjusted to a predetermined temperature.

As shown in FIG. 29 , the unloading arm 205 has, for example, a horizontal joint type structure, and includes an arm portion 10 composed of a plurality of parts connected by a vertical joint axis, a fork portion 12 connected to the front end of the arm portion 10, drive unit 13 . The arm portion 10 can be moved, for example, in the up-down direction (Z-axis direction) by the drive device 13 . The drive device 13 is controlled to be driven by a control device not shown. Thereby, the unloading robot 205 receives the substrate P from the plate holder 9 . In addition, the unloading robot arm 205 is not limited to a robot arm with a horizontal articulated structure, and a known robot arm (generally a conveying mechanism) can be appropriately used or combined to realize it.

FIG. 30A is a diagram showing the plan structure of the panel holder 9 , and FIG. 30B is a diagram showing the side view structure of the panel holder 9 . In this embodiment, as shown to FIG. 30A, the board|substrate mounting part 31 which mounts the board|substrate P is formed in the board holder 9. As shown in FIG.

Moreover, in this embodiment, the groove part 30 which accommodates the fork part 12 of the unloading arm 205 at the time of unloading the board|substrate P is formed in the board holder 9. As shown in FIG. The groove portion 30 is formed along the moving direction of the fork portion 12 (the Y direction in the figure). A region other than the groove portion 30 on the upper surface of the fork portion 9 constitutes the above-mentioned board placement portion 31 .

In addition, the thickness of the fork portion 12 is smaller than the depth of the groove portion 30 . Thereby, after the fork portion 12 is accommodated in the groove portion 30 as will be described later, the substrate P mounted on the substrate mounting portion 31 is transferred and mounted on the fork portion 12 by raising the fork portion 12 .

As shown in FIG. 30B , the plate holder 9 is located on the side surface of the plate holder 9 as in FIG. 3B . 9a is provided with the position detection sensor 19 which detects the relative position with the table 40 for carrying in. The position detection sensor 19 includes a distance detection sensor 19a for detecting a relative distance with respect to the table 40 for carrying in, and a sensor 19b for height detection for detecting a relative height with respect to the table 40 for carrying in. Moreover, the recessed part is formed in the position corresponding to the position detection sensor 19 in the table 40 for carrying in, and the interference of the position detection sensor 19 and the table 40 for carrying in is thereby prevented.

Next, the operation of the exposure apparatus 1 of the present embodiment will be described with reference to FIGS. 6 , 11 , and 31A to 34 . Specifically, the handover operation of the board P between the carry-in unit 4 and the board holder 9 and the handover operation of the board P between the board holder 9 and the carry-out robot 205 will be mainly described.

First, the board|substrate P with which the photosensitive agent was apply|coated by the coating developing machine (not shown) is carried into the carrying-in part 4. As shown in FIG. At this time, the up-down movement mechanism 49 located below the table 40 for carrying in first arranges the substrate support pins 49 a above the table 40 for carrying in through the through holes 47 . Next, as shown in FIG. 6, the arm portion 48 of the coater and developing machine (not shown) is inserted between the substrate support pins 49a. After the arm portion 48 is lowered to transfer the substrate P to the substrate support pin 49a, it is withdrawn from the carrying portion 4 . The up-down mechanism 49 completes the carrying-in operation of the board P to the carrying-in table 40 by lowering the board support pins 49a on which the board P is supported. Then, by driving the vacuum pump, the substrate P is sucked and held on the upper surface of the table 40 for carrying in through the suction hole K4.

Next, as shown in FIG. 31A , the plate holder 9 moves so as to approach the carrying-in table 40 of the carrying-in section 4 . In addition, in FIGS. 31A and 31B, the illustration of the unloading arm is omitted.

Specifically, the 1st moving mechanism 33 arranges the board holder 9 and the table 40 for carrying in in the state which approached in the Y direction. Here, the state in which the board holder 9 and the table 40 for carrying in are close to each other means a state in which the distance by which the movement of the board P can be smoothly performed is separated at the time of the handover of the board P, which will be described later.

Moreover, when the table 40 for carrying in and the board holder 9 are aligned, the second moving machine can be driven Structure 43. Thus, the table 40 for carrying in and the board holder 9 can be moved to the transfer position of the board|substrate P in a short time, and the time required for the carrying-in operation of the board|substrate P can be shortened. At this time, since the substrate P is sucked and held on the upper surface of the carrying table 40 through the suction hole K4, the substrate P can be prevented from moving on the carrying table 40 when the second moving mechanism 43 is driven.

In the present embodiment, as shown in FIG. 31B , when the plate holder 9 and the table 40 for carrying in are brought close to each other, the substrate P is arranged so that the plate holder 9 is high. That is, the 1st moving mechanism 33 makes the board holder 9 approach the table 40 for carrying in so that the upper surface of the table 40 for carrying in which supports the board|substrate P may become higher than the upper surface of the board holder 9. Moreover, the table 40 for carrying in can also be raised by the 2nd moving mechanism 43 so that the upper surface of the table 40 for carrying in may become higher than the upper surface of the board holder 9.

Moreover, the 1st moving mechanism 33 can also align the board holder 9 and the table 40 for carrying in in the state of contacting. In this way, the handover of the board|substrate P between the board holder 9 mentioned later and the table 40 for carrying in can be performed smoothly.

Next, as shown in FIG. 32, the table 40 for carrying in injects gas from a plurality of gas injection holes K3 formed on the upper surface, and supports the substrate P in a floating state through the gas. On the other hand, when the plate holder 9 receives the substrate P, the gas is first injected from the plurality of gas injection holes K2 formed on the upper surface.

The carrying-in part 4 makes the contact part 42b contact with one end of the board|substrate P as shown in FIG. 33 in the state which float-supports the board|substrate P on the table 40 for carrying-in. The contact part 42b moves the board|substrate P to the board holder 9 side by moving along the guide part 42a in the recessed part 40a.

Since the board|substrate P becomes the state which floated on the table 40 for carrying in, the contact part 42b can slide the board|substrate P smoothly to the board holder 9 side. In addition, the upper surface of the board holder 9 becomes the floating support board P as described above. Here, the gas injection holes K3 and K2 may also be used to inject Gas is directional.

The board|substrate P which slides on the upper surface of the table 40 for carrying in by the contact part 42b is smoothly transferred to the upper surface of the board holder 9 as shown in FIG. In this embodiment, since the upper surface of the table 40 for carrying in is higher than the upper surface of the panel holder 9 , the substrate P can be smoothly transferred onto the panel holder 9 without touching the side surface of the panel holder 9 .

As shown in FIG. 33, the board|substrate P slides in the state prescribed|regulated by the guide pin 36 provided in the peripheral part of the board holder 9 in the X direction in the figure. The contact part 42b moves the board|substrate P to the positioning pin 37 provided in the board holder 9 on the downstream side in the board|substrate conveyance direction. The substrate P is positioned in the X direction in the figure by the guide pins 36, and is held in the Y direction in the figure by the positioning pins 37 and the contact portion 42b. The plate holder 9 stops the gas injection from the gas injection holes K2. As shown in FIG. 11, the board|substrate P is mounted in the state aligned with the board|substrate mounting part 31.

In addition, conventionally, when the substrate is placed on the plate holder, there is a possibility that the placement of the substrate may be shifted (position shifted from a predetermined placement position) or the substrate may be deformed. One of the reasons for this placement deviation is considered to be, for example, that the substrate is in a floating state due to a thin air layer generated between the substrate and the plate holder just before the substrate is placed. In addition, one of the causes of the deformation of the substrate is considered to be, for example, that after the substrate is placed, air is trapped between the substrate and the plate holder, and the substrate is in a state of expansion.

On the other hand, in this embodiment, since the board|substrate P is conveyed in the state floated by the gas injection as mentioned above, it is delivered to the board holder 9 in the state of high flatness without distortion. Moreover, since the board|substrate P is mounted on the board|substrate mounting part 31 from the height which is floated and supported, it can prevent that an air retention or an air layer generate|occur|produces between the board|substrate P and the board|substrate mounting part 31. Therefore, it is possible to prevent the substrate P from being in a swollen state, and to prevent the occurrence of displacement or deformation of the substrate P in placement. Therefore, the board|substrate P can be mounted in the state with high flatness in the predetermined position with respect to the board holder 9. Then, by driving the vacuum pump, the substrate P is sucked and held on the upper surface of the substrate placement portion 31 through the suction hole K1.

After the board|substrate P is mounted on the board holder 9, the mask M is illuminated with the exposure light IL from an illumination system. The pattern of the mask M illuminated with the exposure light IL is projected and exposed to the board|substrate P mounted on the board holder 9 through the projection optical system PL.

Since the substrate P can be favorably placed on the plate holder 9 as described above, a predetermined exposure can be performed at an appropriate position on the substrate P with high accuracy, and a highly reliable exposure process can be realized.

In the present embodiment, the photosensitive agent can be applied by a coating developer (not shown) during the exposure treatment of the substrate P, or while the substrate P after the exposure treatment is conveyed by the unloading robot 205 as will be described later. Next, the substrate P is placed on the carrying table 40 of the carrying part 4 .

Next, the carrying-out operation of carrying out the board|substrate P from the board holder 9 after completion|finish of an exposure process is demonstrated.

Specifically, the method of carrying out the board|substrate P by the carrying-out robot 205 is demonstrated. 35 is a perspective view for explaining the operation of the unloading robot 205, FIGS. 36A and 36B are cross-sectional structural views when viewed from the Y-axis direction when the substrate P is unloaded from the board holder 9, and FIG. 37 is a view from the X-axis direction. A side view of the substrate P during the operation of taking out the substrate P from the plate holder 9 . In addition, in FIG. 35, only the fork part 12 is shown, and the whole structure of the carrying-out arm 205 is abbreviate|omitted. In addition, in FIGS. 36A and 36B, for the convenience of description, the illustration of the fork part 12 which supports the board|substrate P is simplified.

After the exposure process is finished, release the suction of the suction hole K1 of the vacuum pump to remove the Remove the adsorption of the substrate P by the plate holder 9 . Next, as shown in FIG. 35 , the unloading arm 205 inserts the fork portion 12 into the groove portion 30 formed in the plate holder 9 from the −Y direction side.

Next, the drive device 13 moves the fork 12 upward by a predetermined amount, so that the fork 12 is brought into contact with the lower surface of the substrate P as shown in FIG. 36A . Moreover, as shown to FIG. 36B, the fork part 12 moves upward further, and by this, the board|substrate P is pushed up above the board holder 9, and it leaves|separates from the board|substrate mounting part 31.

In addition, the unloading arm 205 lifts (retracts) the fork 12 to a height at which the loading stage 40 (on which the next substrate P coated with a photosensitive agent is placed) does not contact the loading section 4 . After the fork portion 12 is raised so as not to contact the board P on the carrying table 40, as shown in FIG. 37, the carrying table 40 of the carrying part 4 moves so as to approach the board holder 9, and the board P is moved to the board as described above. The holder is transported on the 9 side.

While the board P is transferred from the carry-in section 4 to the board holder 9, the carry-out robot 205 moves the board P placed on the fork section 12 into a coating and developing machine (not shown). In the above manner, the unloading operation of unloading the substrate P from the exposure apparatus main body 3 is completed.

As described above, according to the present embodiment, since the floating-supported substrate P can be slid and transported from the carrying portion 4 to the plate holder 9 , it is possible to prevent the occurrence of air stagnation or air layer between the substrate P and the substrate placing portion 31 . , which can prevent the placement of the substrate P from being offset or deformed. Therefore, exposure processing with high reliability can be performed.

Furthermore, in the present embodiment, since the substrate P is slid and loaded from the loading unit 4 to the plate holder 9 using gas jet, the production tact time is changed as compared with the loading of the substrate to the plate holder 9 using a conventional tray. long.

On the other hand, in the present embodiment, since the fork portion of the robot arm 205 can be transported out 12. In the state where the substrate P is pushed up from the bottom and the substrate P is withdrawn from the plate holder 9, the next substrate P is carried into the plate holder 9 by the carrying part 4, so the substrate P of the plate holder 9 is inserted into the groove portion 30. The overall lead time required for P's move in and out can be roughly the same as when using conventional pallets. Therefore, the board|substrate P can be carried into the board holder 9 in a favorable state, without increasing the tact time at the time of carrying out the board|substrate P.

In addition, in this embodiment, when the board|substrate P is conveyed from the table 40 for carrying in to the board holder 9, the upper surface of the table 40 for carrying in can also be inclined. Specifically, the holding portion 44 of the second moving mechanism 43 is inclined toward the plate holder 9 side (θY) from the top surface of the carrying table 40 supporting the substrate P in a floating state by the gas injection from the gas injection hole K3 . Thereby, the board|substrate P can be moved to the board holder 9 side by the self-weight of the board|substrate P.

(Seventh Embodiment)

Next, the configuration of the seventh embodiment of the present invention will be described. In addition, in this embodiment, the same code|symbol is attached|subjected to the same element as the component of 6th Embodiment, and the description is abbreviate|omitted. The seventh embodiment differs from the sixth embodiment in the configuration of the carrying portion.

In this embodiment, the carrying-in portion 104 is the same as that described with reference to FIGS. 16A and 16B .

In addition, the operation|movement of the exposure apparatus 1 in this Embodiment is the same as that demonstrated using FIG.17 and FIG.18.

In the present embodiment, since the substrate P is conveyed in a state of being suspended by the gas injection as described above, it can be transferred to the plate holder 9 in a state of high flatness without twisting, and it is possible to prevent the substrate P and the Air stagnation or an air layer is generated between the substrate placement portions 31 . Therefore, the board|substrate P can be mounted in the state with high flatness in the predetermined position with respect to the board holder 9. Therefore, it can be Predetermined exposure can be performed with high precision at an appropriate position on the substrate P, and a highly reliable exposure process can be realized.

(8th embodiment)

Next, the configuration of the eighth embodiment of the present invention will be described. In addition, in this embodiment, the same code|symbol is attached|subjected to the same element as the component of 6th, 7th embodiment, and the description is abbreviate|omitted. The main difference between the eighth embodiment and the sixth and seventh embodiments is that the plate holder 109 includes a transfer portion.

FIG. 38 is a diagram showing the structure of the plate holder 109 of this embodiment. The board holder 109 of this embodiment is equipped with the 1st transfer part 249 which transfers the board|substrate P from the table 40 for carrying in to the board holder 109 as shown in FIG. This 1st transfer part 249 contains the suction part 250 which suction-holds the both sides of the board|substrate P in the width direction. The suction part 250 can move freely in the XY plane along the direction of the P surface of the substrate.

Moreover, in this embodiment, the position detection sensor 252 for detecting the position of the board|substrate P carried in by the 1st transfer part 249 with respect to the board|substrate mounting part 31 is provided in the peripheral part of the board holder 109. As the position detection sensor 252, for example, a potentiometer can be used, and the present invention can use a meter of either a contact method or a non-contact method.

The suction part 250 sucks and holds the end of the substrate P, which is suspended and supported on the table 40 for carrying in by the gas injection from the gas injection hole K3, and moves from the table 40 for carrying in to the plate holder 109 as shown in FIG. 39A . side transport. On the other hand, when the board holder 109 receives the substrate P, the gas is first injected from the plurality of gas injection holes K2 formed on the upper surface. At this time, the gas injected from the gas injection holes K2 and K3 can also have directivity.

As shown in FIG. 39B, the suction part 250 is formed by contacting the end of the substrate P with the The detection sensor 252 is provided, and the exposure apparatus 1 can detect the positional deviation of the substrate P relative to the substrate placement portion 31 . In addition, the adsorption|suction part 250 is comprised so that it may drive based on the detection result of the said position detection sensor 252.

Therefore, the exposure apparatus 1 can correct the position of the substrate P held in the suction part 250 relative to the substrate placement part 31 according to the detection result of the position detection sensor 252 .

Also in the present embodiment, since the substrate P is conveyed in a state of being suspended by the gas jet as described above, it can be transferred to the plate holder 109 in a state of high flatness without distortion, and it is possible to prevent the Air stagnation or an air layer is generated between the substrate P and the substrate placement portion 31 . Therefore, the board|substrate P can be mounted in the state with high flatness in the predetermined position with respect to the board holder 109. Therefore, a predetermined exposure can be performed with high precision at an appropriate position on the substrate P, and a highly reliable exposure process can be realized.

In addition, since the operation of carrying out the board|substrate P from the board holder 109 after completion|finish of an exposure process is the same as that of 1st Embodiment, the description is abbreviate|omitted.

(Ninth Embodiment)

Next, the structure of the ninth embodiment of the present invention will be described. In addition, in this embodiment, the same code|symbol is attached|subjected to the same element as the component of 6th - 8th embodiment, and the description is abbreviate|omitted. The main difference between the ninth embodiment and the sixth to eighth embodiments is the configuration of the exposure apparatus. FIG. 40 is a perspective view showing a schematic configuration of the exposure apparatus main body 3 of the present embodiment.

As shown in FIG. 40, the exposure apparatus main body 3 of this embodiment is provided with the board holder 9, the board|substrate push-up mechanism 150 provided in the board holder 9, and the 1st moving mechanism 33. As shown in FIG. The substrate lifting mechanism 150 is used to lift the substrate P upward when the substrate P is unloaded.

FIG. 41 shows the plan structure of the panel holder 9, and FIGS. 42A and 42B show the panel As a side sectional view of the holder 9, FIG. 42A is a diagram showing a state before the handover of the substrate, and FIG. 42B is a diagram showing a state after the handover of the substrate.

41, 42A and 42B, the substrate lift mechanism 150 includes a plurality of substrate support members 151 for supporting the substrate P, and a vertical movement portion 152 for moving the substrate support members 151 up and down (see FIG. 43).

The substrate support member 151 includes a first linear member 119 that is installed in the X direction (first direction) in FIG. 41 to the shaft portion (up-down moving member) 155 and a second linear member 119 installed in the Y direction (second direction) in FIG. 41 . The linear member 120 is formed in a substantially lattice shape as a whole. The first linear member 119 and the second linear member (second bridging portion) 120 are welded to each other here, or combined in a lattice shape. Each substrate support member 151 is spanned between a plurality of (for example, six in this embodiment) shaft portions 155 .

Each of the lattice shapes constituting each of the substrate support members 151 has a plurality of openings 121 having a substantially rectangular shape smaller than that of the substrate P. As shown in FIG. In addition, the shape of the board|substrate support member 151 is not limited to the shape shown in FIG. 41, For example, the frame-shaped single frame in which only one opening part 121 is formed may be sufficient.

In the present embodiment, the four substrate support members 151 are arranged in a state where the gap S is vacated along the extending direction (Y direction shown in FIG. 41 ) of the second linear member 120 . The gap S between the above-mentioned board support members 151 is used to constitute a space into which the fork 12 is inserted when the board P is unloaded from the board holder 9 , as will be described later.

In addition, as the material for forming the substrate supporting member 151 (the first linear member 119 and the second linear member 120 ), it is preferable to use one that can suppress the deflection of the substrate P due to its own weight when the substrate supporting member 151 supports the substrate P. , for example, various synthetic resins or metals can be used. Specifically, nylon, polypropylene, AS resin, ABS resin, polycarbonate, fiber-reinforced plastic can be mentioned. glue, stainless steel, etc. Examples of fiber-reinforced plastics include GFRP (Glass Fiber Reinforced Plastic: glass fiber reinforced thermosetting plastic) and CFRP (Carbon Fiber Reinforced Plastic: carbon fiber reinforced thermosetting plastic).

As shown in FIG. 43 , the up-down movement portion 152 has a shaft portion (up-down movement member) 155 and a driving device 153 for driving the shaft portion 155 up and down. The drive device 153 is provided to each shaft portion 155, whereby each shaft portion 155 independently moves up and down.

With this configuration, the substrate support member 151 moves up and down with respect to the substrate placement portion 31 of the plate holder 9 as the up-down movement portion 152 (shaft portion 155 ) moves up and down as shown in FIGS. 42A and 42B .

On the other hand, the plate holder 9 is formed with a concave portion 130 for accommodating the substrate support member 151 . The recesses 130 are provided in a lattice shape corresponding to the frame structure of the substrate support member 151 . Regions (partial placement portions) other than the concave portion 130 on the upper surface of the plate holder 9 constitute the substrate placement portion 31 that holds the substrate P.

The thickness of the substrate support member 151 is smaller than the depth of the recessed portion 130 . Thereby, as shown in FIG. 42B , only the substrate P placed on the substrate support member 151 is transferred to the substrate placement portion 31 and placed by being accommodated in the recessed portion 130 .

Moreover, the board|substrate mounting part 31 is made to have favorable flatness with respect to the substantial holding surface of the board|substrate P by the board holder 9. As shown in FIG. Furthermore, the substrate holding surface (upper surface) of the substrate placement portion 31 is formed with a suction port for making the substrate P imitate this surface and closely adhere to it, or by spraying air (gas) when the substrate is loaded, which will be described later, to remove the substrate. P is suspended and supported on the opening portion K205 of the gas injection port function on this surface. A vacuum pump and a gas ejection pump, not shown, are respectively connected to the opening K205, and the opening K205 functions as a suction port or an ejection port as described above by switching the driving of these pumps.

The peripheral portion of the board holder 9 is provided with a guide pin 36 for guiding the board P and a positioning pin 37 for defining the position of the board P with respect to the board placement portion 31 of the board holder 9 when the board P is carried in (refer to 44A and 44B). These guide pins 36 and positioning pins 37 can move together with the plate holder 9 in the exposure apparatus body 3 .

Next, the operation of the exposure apparatus 1 of the present embodiment will be described with reference to FIGS. 44A to 50B . Specifically, the handover operation of the board P between the carry-in unit 4 and the board holder 9 and the handover operation of the board P between the board holder 9 and the carry-out robot 205 will be mainly described.

First, similarly to the sixth embodiment, the substrate P on which the photosensitive agent is applied by a coating and developing machine (not shown) is loaded into the loading unit 4 . At this time, the substrate P is sucked and held on the upper surface of the table 40 for carrying in through the suction hole K4 at this time.

Next, as shown in FIG. 44A , the plate holder 9 moves so as to approach the carrying-in table 40 of the carrying-in section 4 . In addition, in FIGS. 44A and 44B, the illustration of the unloading arm is omitted. Specifically, the 1st moving mechanism 33 arranges the board holder 9 and the table 40 for carrying in in the state which approached in the Y direction. At this time, by driving the 2nd moving mechanism 43, the table 40 for carrying in and the board holder 9 are moved to the transfer position of the board|substrate P in a short time, and the time required for the carrying-in operation of the board|substrate P is shortened. Moreover, since the board|substrate P is adsorbed and held on the upper surface of the table 40 for carrying in through the suction hole K4, the board|substrate P can be prevented from moving on the table 40 for carrying in when the 2nd moving mechanism 43 is driven.

In this embodiment, as shown in FIG. 44B , the first moving mechanism 33 brings the board holder 9 closer to the carrying table 40 so that the upper surface of the carrying table 40 supporting the substrate P is higher than the upper surface of the board holder 9 . Moreover, the table 40 for carrying in can also be raised by the 2nd moving mechanism 43 so that the upper surface of the table 40 for carrying in may become higher than the upper surface of the board holder 9. Moreover, the 1st moving mechanism 33 can also move the board|substrate P smoothly by arranging the board holder 9 and the table 40 for carrying in in a contact state. handover.

Next, as shown in FIG. 45, the table 40 for carrying in injects gas from a plurality of gas injection holes K3 formed on the upper surface, and supports the substrate P in a floating state through the gas. On the other hand, when the board holder 9 receives the board|substrate P, the pump for gas injection which is not shown in figure is driven first, and air is ejected from the opening part K205 provided in the board|substrate mounting part 31.

The carrying-in part 4 makes the contact part 42b contact with one end of the board|substrate P, as shown in FIG. The contact part 42b moves the board|substrate P to the board holder 9 side by moving along the guide part 42a in the recessed part 40a.

Since the board|substrate P becomes the state which floated on the table 40 for carrying in, the contact part 42b can slide the board|substrate P smoothly to the board holder 9 side. In addition, the upper surface of the board holder 9 becomes the floating support board P as described above. Here, the gas injected from the gas injection holes K3 and the openings K205 may also have directivity.

The board|substrate P sliding on the upper surface of the table 40 for carrying in by the contact part 42b is smoothly transferred to the upper surface of the board holder 9 as shown in FIG. In this embodiment, since the upper surface of the table 40 for carrying in is higher than the upper surface of the panel holder 9 , the substrate P can be smoothly transferred onto the panel holder 9 without touching the side surface of the panel holder 9 .

The position of the substrate P in the X direction in the drawing is defined by the guide pins 36, and the position in the Y direction in the drawing is defined by being held by the positioning pins 37 and the contact portion 42b. The plate holder 9 stops the gas injection from the opening K205. Thereby, the board|substrate P is mounted in the state aligned with the board|substrate mounting part 31.

In the present embodiment, since the substrate P is conveyed in a state of being suspended by the gas injection as described above, it is transferred to the plate holder in a state of high flatness without twisting Tool 9. Moreover, since the board|substrate P is mounted on the board|substrate mounting part 31 from the height which is floated and supported, it can prevent that an air retention or an air layer generate|occur|produces between the board|substrate P and the board|substrate mounting part 31. Therefore, it is possible to prevent the substrate P from being in a swollen state, and to prevent the occurrence of displacement or deformation of the substrate P in placement. Therefore, the board|substrate P can be mounted in the state with high flatness in the predetermined position with respect to the board holder 9. Then, by driving the vacuum pump, the substrate P is sucked and held on the upper surface of the substrate placement portion 31 through the opening portion K205.

After the board|substrate P is mounted on the board holder 9, the mask M is illuminated with the exposure light IL from an illumination system. The pattern of the mask M illuminated with the exposure light IL is projected and exposed to the board|substrate P mounted on the board holder 9 through the projection optical system PL.

In the exposure apparatus 1 of the present embodiment, since the substrate P can be satisfactorily placed on the plate holder 9 as described above, a predetermined exposure can be performed at an appropriate position on the substrate P with high accuracy, and reliability can be achieved. High exposure processing.

Next, the carrying-out operation of carrying out the board|substrate P from the board holder 9 after completion|finish of an exposure process is demonstrated.

Specifically, the method of carrying out the board|substrate P by the carrying-out robot 205 is demonstrated. 48 is a perspective view for explaining the operation of the unloading robot 205 , and FIGS. 49A , 49B, and 49C are cross-sectional configuration diagrams viewed from the Y-axis direction when unloading the substrate P from the plate holder 9 . In addition, in FIG. 48, only the fork part 12 is shown, and the whole structure of the unloading arm 205 is abbreviate|omitted. In the present embodiment, the substrate support portion in the fork portion 12 is different from that in the above-described embodiment in accordance with the shape of the jacking mechanism 150 . In addition, in FIG. 49A, FIG. 49B, and FIG. 49C, the illustration of the fork part 12 which supports the board|substrate P is simplified for the convenience of description.

After the exposure process is completed, the suction through the opening K205 of the vacuum pump is released to release the suction of the substrate P by the plate holder 9 . Next, the jacking mechanism 150 drives the shaft portion 155 to raise the substrate support member 151 . At this time, as shown in FIG. 49A , the substrate P placed on the substrate placement portion 31 together with the substrate support member 151 is lifted upward. At this time, since the board|substrate P is supported by the some board|substrate support member 151, and is pushed up upwards, it can prevent the generation|occurence|production of peeling electrification. Moreover, since the substrate P can be supported with a wider surface than the conventional case where the substrate P is pushed up by pins, the amount of deflection caused by the substrate P can be reduced, and cracks can be prevented from being generated in the substrate P.

The unloading arm 205 drives the fork 12 to move the fork 12 from the −Y direction side to the gap S between the substrate support mechanisms 151 arranged above the substrate placement portion 31 and to both ends in the X-axis direction as shown in FIG. 48 . Then, the fork 12 is inserted into the gap S and both ends ( FIG. 49B ).

Next, the drive device 13 makes the fork 12 abut against the lower surface of the substrate P by moving the fork 12 upward by a predetermined amount. Further, by moving the fork 12 upward, the substrate P is lifted up above the plate holder 9 and separated from the jacking mechanism 150 .

The jack-up mechanism 150 accommodates the substrate support member 151 in the recessed portion 130 after the substrate P is separated. After the board support member 151 is accommodated in the recessed portion 130, the board holder 9 is moved so as to approach the carrying table 40 of the carrying portion 4, and the board P is transferred to the board holder 9 side as described above.

While the board P is transferred from the carry-in section 4 to the board holder 9, the carry-out robot 205 moves the board P placed on the fork section 12 into a coating and developing machine (not shown). In the above manner, the unloading operation of unloading the substrate P from the exposure apparatus main body 3 is completed.

As described above, according to the present embodiment, since the floating-supported substrate P can be slid and transported from the carrying portion 4 to the plate holder 9, the occurrence of displacement or deformation of the substrate P can be prevented. Moreover, this embodiment is also the same as the loading and unloading place of the board|substrate P of the board holder 9. The overall lead time required can be roughly the same as when using conventional pallets. Therefore, the board|substrate P can be carried into the board holder 9 in a favorable state, without increasing the tact time at the time of carrying out the board|substrate P.

In the above-described embodiment, the case where the opening K205 serving as the gas injection port is formed only in the substrate mounting portion 31 has been described, but the gas injection port may be formed on the upper surface of the substrate support member 151 . Thus, when the board|substrate P is conveyed into the board holder 9, since the quantity of the gas injected to the board|substrate conveyance surface increases, the board|substrate P can be conveyed more smoothly.

(Tenth Embodiment)

Next, the structure of the tenth embodiment of the present invention will be described. In addition, in this embodiment, the same code|symbol is attached|subjected to the same element as the component of 6th Embodiment, and the description is abbreviate|omitted. The main point of difference between the tenth embodiment and the above-described embodiment is that a suction mechanism for suctioning the substrate P in a non-contact state is provided as a means for carrying out the substrate P from the plate holder 9 .

The suction mechanism is used to hold the substrate P, and lift the substrate P upward from the substrate placement portion 31 of the plate holder 9 to move it to a coating and developing machine (not shown). FIG. 50A shows the structure of the suction surface, and FIG. 50B shows the overall structure of the suction mechanism.

As shown in FIGS. 50A and 50B , the suction mechanism 350 includes a plurality of holding portions 351 that hold the substrate P in a non-contact state, a base portion 352 that holds the holding portions 351 , and a drive mechanism 355 that can move the base portion 352 . The base portion 352 is a plate-shaped member having substantially the same size as the substrate P. As shown in FIG. The holding parts 351 are regularly arranged on the base part 352 , whereby the substrate P can be held well.

As the holding portion 351, a so-called Benui collet is used. The holding portion 351 generates a negative pressure between the substrate P and the substrate P by spraying compressed air between the substrate P and the holding portion 351 . Thereby, the pressing force which presses the board|substrate P to the holding|maintenance part 351 side is generate|occur|produced. On the other hand, the holding portion 351 is in contact with the substrate P. When the gap becomes smaller, the flow rate of the compressed air decreases, and the pressure between the holding portion 351 and the substrate P increases. Thereby, the force which separates the board|substrate P from the holding|maintenance part 351 is generate|occur|produced. The holding part 351 can achieve a balance between the above two forces by spraying compressed air, thereby keeping the distance between the substrate P and the holding part 351 in a constant state, that is, holding the substrate P in a non-contact state.

Next, the operation of the exposure apparatus 1 will be described with reference to the drawings. In addition, since the transfer operation of the board|substrate P between the carrying-in part 4 and the board holder 9 is the same as that of 1st Embodiment, description is abbreviate|omitted.

Hereinafter, the operation of unloading the board P from the board holder 9 will be described. Specifically, the method of carrying out the board|substrate P from the board holder 9 by the said adsorption|suction mechanism 350 is demonstrated. 51A and 51B are side views when the operation of carrying out the board P from the board holder 9 is viewed from the X-axis direction.

After the exposure process is completed, the suction of the suction hole K1 of the vacuum pump is released to release the suction of the substrate P by the plate holder 9 . Next, the suction mechanism 350 is moved above the plate holder 9 . Next, as shown in FIG. 51A , the suction mechanism 350 is lowered to a position where the holding portion 351 can hold the substrate P. Next, the upper surface of the substrate P is held in a non-contact state by the plurality of holding parts 351 . At this time, the plurality of holding portions 351 can be driven simultaneously or sequentially to hold the substrate P.

The suction mechanism 350 is in a state where the substrate P is held by the plurality of holding portions 351, and the driving mechanism 355 pushes the substrate P above the plate holder 9, and separates from the substrate placement portion 31 as shown in FIG. 51B . At this time, since the holding portion 351 is not in contact with the substrate P, no suction marks remain on the substrate P. As shown in FIG.

After the suction mechanism 350 rises to the position where it does not contact the board|substrate P on the table 40 for carrying in, the table 40 for carrying in of the carrying part 4 moves so that it may approach the board holder 9. Next, similarly to the above-described embodiment, the substrate P is held in a floating state from the carrying table 40 to the plate With 9 conveying.

While the substrate P is carried in from the carrying portion 4 to the plate holder 9, the suction mechanism 350 moves the substrate P held by the holding portion 351 to a coating and developing machine (not shown). In the above manner, the unloading operation of unloading the substrate P from the exposure apparatus main body 3 is completed.

In addition, as shown in FIGS. 52A and 52B , a support member 353 supporting the lower surface of the substrate P may be provided around the base portion 352 . The support member 353 is constituted by a frame-shaped member surrounding the substrate P, and has a plurality of projecting portions 354 extending in the surface direction of the substrate P. As shown in FIG. The protruding portion 354 is in contact with the lower surface of the substrate P. As shown in FIG. With this configuration, when holding a large-sized substrate that may cause the substrate P to collapse, since the peripheral end of the substrate P is supported by the protruding portion 354, even if a large-sized substrate is held, the substrate P can be prevented from being held. Indentation is generated, and the substrate P can be held in a state of high flatness by the holding portion 351 .

In addition, the substrate P of the above-described embodiment may be not only a glass substrate for display elements, but also a semiconductor wafer for manufacturing semiconductor elements, a ceramic wafer for thin-film magnetic heads, or a mask or reticle used for exposure devices. The original plate of the film (synthetic quartz, silicon wafer), etc.

Furthermore, as an exposure apparatus, in addition to being applicable to a scanning exposure apparatus of a step-and-scan method in which the photomask M and the substrate P are moved synchronously to perform scanning exposure of the substrate P through the exposure light IL for the pattern of the photomask M ( In addition to scanning stepper), it can also be applied to the step-and-repeat projection exposure in which the pattern of the mask M is exposed at one time and the substrate P is sequentially moved step by step in the state where the mask M and the substrate P are stationary. device (stepper).

In addition, the present invention can also be applied to a dual-stage exposure apparatus having a plurality of substrate stages as disclosed in US Patent No. 6,341,007, US Patent No. 6,208,407, and US Patent No. 6,262,796.

In addition, the present invention can also be applied to a substrate stage provided with a holding substrate as disclosed in US Patent No. 6897963, European Patent Application No. 1713113, etc., and a reference member on which a reference mark is formed without holding a substrate, and / or exposure devices for measuring stages of various photoelectric sensors. Moreover, you may employ|adopt the exposure apparatus provided with the some board|substrate stage and the measurement stage.

In addition, in the above-mentioned embodiment, although the light-transmitting type mask in which the predetermined light-shielding pattern (or phase pattern, light-reduction pattern) is formed on the light-transmitting substrate is used, it may be replaced by the mask, for example, the US Patent No. 6778257 discloses a variable shape mask (also called electronic mask, active mask or image generator) for forming a transmission pattern or a reflection pattern, or a light emitting pattern according to the electronic data of the pattern to be exposed. Moreover, instead of the variable formable mask provided with the non-luminous image display element, a pattern forming apparatus including the self-luminous image display element may be provided.

The exposure apparatus of the above-described embodiment is manufactured by assembling various sub-systems (including each constituent element) so as to maintain predetermined mechanical precision, electrical precision, and optical precision. To ensure these various precisions, before and after assembly, various optical systems are adjusted to achieve optical precision, various mechanical systems are adjusted to achieve mechanical precision, and various electrical systems are adjusted to achieve electrical precision. Adjustment. The assembly process from various subsystems to exposure devices includes mechanical connections, wiring connections for circuits, and piping connections for air pressure circuits. Of course, before the assembly process from various subsystems to exposure devices, there are individual assembly processes for each subsystem. After the assembly process from various subsystems to the exposure device is completed, comprehensive adjustment is carried out to ensure various precisions of the exposure device EX as a whole. In addition, the manufacturing of the exposure apparatus is preferably carried out in a clean room in which temperature and cleanliness are controlled.

Micro-elements such as semiconductor elements, as shown in Figure 53, go through step 201 of designing the function and performance of the micro-element, and step 202 of making a mask (reticle) according to this design step. Step 203, including substrate treatment step 204 according to the above-mentioned embodiment (exposure treatment, including the action of exposing the substrate with the exposure light using the mask pattern, and the action of developing the substrate after exposure), the component assembly step (including the action of exposing the substrate) Manufactured by cutting steps, bonding steps, packaging steps, etc.) 205, and inspection steps 206, etc. In addition, in step 204, an exposure pattern layer (a layer of the developed photosensitive agent) corresponding to the pattern of the photomask is formed by developing the photosensitive agent, and the substrate is processed through the exposure pattern layer.

In addition, the requirements of each of the above-described embodiments and modifications can be appropriately combined. In addition, there are cases where some of the constituent elements are not used. In addition, to the extent permitted by laws and regulations, the disclosures of all publications and U.S. patents related to exposure apparatuses and the like cited in the above-mentioned embodiments and modifications are incorporated as a part of the description herein.

3‧‧‧Exposure device body

4‧‧‧Moving in

5‧‧‧Removal Department

9‧‧‧Board holder

31‧‧‧Substrate mounting part

33‧‧‧First moving mechanism

34‧‧‧Maintenance Department

35‧‧‧Movement mechanism body

40‧‧‧Load table

43‧‧‧Second moving mechanism

44‧‧‧Maintenance Department

45‧‧‧Movement body

50‧‧‧Delivery table

53‧‧‧The third moving mechanism

54‧‧‧Maintenance Department

55‧‧‧Movement mechanism body

K‧‧‧Attraction hole

IL‧‧‧Exposure light

M‧‧‧mask

P‧‧‧Substrate

PL‧‧‧Projection Optical System

Claims (16)

A conveying device for conveying the substrate with respect to a support part included in a processing device for processing a substrate, comprising: a support device capable of supporting the substrate in a non-contact manner; In a method in which the upper surface of the support device is high, the first substrate processed by the processing device and supported by the support part in a non-contact manner is carried out from the support part to the support device arranged in a predetermined direction; and the load-in device, A second substrate different from the first substrate supported by the support device in a non-contact manner is loaded into the support portion from which the first substrate is carried out so that the upper surface of the support device is higher than the upper surface of the support portion. The conveying apparatus according to claim 1, wherein the supporting means supports non-contactingly outside the area of the first substrate that is non-contactingly supported by the supporting portion during the unloading operation of the first substrate. The conveying device according to claim 1 or 2, wherein the support portion non-contact supports the second substrate outside the area of the second substrate that is non-contact supported by the support device during the carrying-in operation of the second substrate. The transfer device according to claim 1 or 2, wherein the unloading device moves the first substrate relative to the support portion and the support device in the predetermined direction to unload the first substrate to the support device. The conveying device according to claim 1 or 2, wherein the loading device moves the second substrate relative to the support device and the support portion in the predetermined direction to load the second substrate into the support portion. The conveying device according to claim 1 or 2, further comprising a drive part that moves one of the support part and the support device in the predetermined direction, and conventionally the support part and the other of the support device have approached or The manner of contacting makes one of the support portion and the support device move. The transfer device according to claim 6, wherein the support device includes: a first stage capable of supporting the first substrate carried out from the support portion in a non-contact manner; and a second stage capable of non-contact support As for the said 2nd board|substrate carried in by the said support part, the said 1st and 2nd stage are arrange|positioned in parallel in the rectilinear direction orthogonal to the said predetermined direction. The transfer device according to claim 7, wherein when the first substrate is unloaded from the support portion to the first stage, the drive portion is such that the support portion and the second stage are aligned in the predetermined direction The said support part is moved to the said straight direction. The transfer device according to claim 6, wherein the support device includes: a first stage capable of supporting the first substrate carried out from the support portion in a non-contact manner; and a second stage capable of non-contact support As for the said 2nd board|substrate carried in by the said support part, the said 1st and 2nd stage are arranged in parallel in an up-down direction. The transfer device according to claim 9, wherein when the first substrate is unloaded from the support portion to the first stage, the drive portion is such that the support portion and the second stage are aligned in the predetermined direction The said support part is moved to the said up-down direction. The conveying apparatus according to claim 1 or 2, further comprising an adjustment section that adjusts the position of the second substrate carried in by the carrying apparatus with respect to the support section. The conveying apparatus according to claim 11, wherein the supporting portion adsorbs and supports the carried-in second substrate. An exposure apparatus for exposing a substrate with exposure light, comprising: the conveying apparatus according to any one of claims 1 to 12, wherein the second substrate supported by the support portion is directed to the exposure light The irradiated area moves. The exposure apparatus according to claim 13, wherein the first and second substrates are substrates used in a flat panel display device. The exposure apparatus according to claim 13 or 14, wherein the length of at least one side of the first and second substrates is 500 mm or more. A device manufacturing method, comprising: using the exposure apparatus described in any one of claims 13 to 15, exposing the substrate coated with a photosensitive material, and transferring a pattern on the substrate; The exposed photosensitive material is developed to form an exposure pattern layer corresponding to the pattern, and the substrate is processed through the exposure pattern layer.

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