CN106876311B

CN106876311B - Transfer apparatus, transfer method, exposure apparatus, and device manufacturing method

Info

Publication number: CN106876311B
Application number: CN201611216877.XA
Authority: CN
Inventors: 金城麻子; 牛岛康之; 花崎哲嗣
Original assignee: Nikon Corp
Current assignee: Nikon Corp
Priority date: 2010-02-17
Filing date: 2011-02-17
Publication date: 2021-01-05
Anticipated expiration: 2031-02-17
Also published as: TW201838076A; JP2017207779A; JP6512248B2; KR102023655B1; TWI777060B; TWI631649B; WO2011102410A1; CN107017191B; KR20180088493A; CN102763209A; JP2015008334A; JP2016157133A; TW201933520A; JP2019124962A; TW201731009A; CN107017191A; KR101883319B1; TWI661505B; JP2017059852A; KR20190108202A

Abstract

A conveying device is provided with: a 1 st support part (3) for supplying gas to one surface of the substrate and supporting the substrate by gas suspension; a 2 nd support part (400) capable of supporting one surface of the substrate; a drive unit (402) for moving at least one of the 1 st and 2 nd support units so that the 1 st and 2 nd support units are arranged in the 1 st direction while being brought into proximity or contact with each other; and a transfer unit for moving the substrate supported by one of the 1 st and 2 nd support units arranged by the driving unit in the 1 st direction to the other side.

Description

Transfer apparatus, transfer method, exposure apparatus, and device manufacturing method

The present application is a divisional application of a patent application having an application date of 2011, 2, 17, and an application number of 201180009815.0, entitled "transfer apparatus, transfer method, exposure apparatus, and device manufacturing method".

Technical Field

The invention relates to a transfer apparatus, a transfer method, an exposure apparatus, and a device manufacturing method.

This application claims priority from U.S. provisional applications nos. 61/305, 355 and 61/305, 439, filed on 17.2010, 2.355, and the contents of which are incorporated herein by reference.

Background

In the process of manufacturing electronic devices such as flat panel displays, large-sized substrates are processed using an exposure apparatus, an inspection apparatus, or the like. In the exposure step and the inspection step using these processing apparatuses, a transfer apparatus disclosed in the following patent documents is used to transfer a large substrate (for example, a glass substrate) to the processing apparatus.

[ patent document ]

[ patent document 1] Japanese patent application laid-open No. 2001-100169

Disclosure of Invention

In the above-described large-sized substrate transfer apparatus, when transferring the substrate supported by the substrate support member to the substrate holding portion, a layer of air is interposed between the substrate and the substrate holding portion, and therefore, the substrate after the transfer may be deformed or the substrate may be displaced from the mounting position on the substrate holding portion. If the substrate after the transfer is displaced or deformed, for example, an exposure apparatus may cause a problem of poor exposure such as failure to perform a predetermined exposure to an appropriate and accurate position on the substrate. When the substrate is displaced or deformed, the substrate is transferred again to solve the problem, and thus, the substrate processing is delayed. Further, if the substrate transfer speed is reduced, for example, in order to prevent the air layer from remaining after the transfer, the substrate processing is further delayed.

An aspect of the present invention is to provide a transfer apparatus, a transfer method, an exposure apparatus, and a device manufacturing method, which can transfer a substrate without causing a mounting deviation or deformation.

According to a 1 st aspect of the present invention, there is provided a conveyance device including: a 1 st support unit configured to supply a gas to one surface of a substrate and support the substrate by the gas in a floating manner; a 2 nd support portion capable of supporting the one surface of the substrate; a driving part for moving at least one of the 1 st and 2 nd supporting parts to enable the 1 st and 2 nd supporting parts to approach or contact with each other and arrange in the 1 st direction; and a transfer unit that moves the substrate supported by one of the 1 st and 2 nd support units arranged by the driving unit in the 1 st direction toward the other side.

According to a 2 nd aspect of the present invention, there is provided a conveyance device including: a 1 st support unit configured to supply a gas to one surface of a substrate and support the substrate by the gas in a floating manner; a 2 nd and a 3 rd support parts capable of supporting the one surface of the substrate; a 1 st driving part for moving at least one of the 1 st and 2 nd supporting parts to enable the 1 st and 2 nd supporting parts to approach or contact with each other and arrange in a 1 st direction; a 2 nd driving part for moving at least one of the 1 st and 3 rd supporting parts to enable the 1 st and 3 rd supporting parts to approach or contact with each other and arrange in the 2 nd direction; a 1 st transfer unit configured to move the substrate supported by the 2 nd support unit arranged on the 1 st support unit by the 1 st drive unit in the 1 st direction toward the 1 st support unit; and a 2 nd transfer unit configured to move the substrate supported by the 1 st support unit arranged on the 3 rd support unit by the 2 nd drive unit in the 2 nd direction to the 3 rd support unit side.

According to a 3 rd aspect of the present invention, there is provided a method of transferring a substrate, comprising: an operation of moving at least one of a 1 st support portion capable of supporting the substrate in a floating manner by a gas supplied to one surface of the substrate and a 2 nd support portion capable of supporting the one surface of the substrate so that the 1 st and 2 nd support portions are brought into proximity or contact with each other and arranged in a 1 st direction; and an operation of moving the substrate supported by one of the 1 st and 2 nd support parts arranged to the other side in the 1 st direction.

According to a 4 th aspect of the present invention, there is provided a method of transferring a substrate, comprising: an operation of moving at least one of a 1 st support portion capable of supporting the substrate in a floating manner by a gas supplied to one surface of the substrate and a 2 nd support portion capable of supporting the one surface of the substrate so that the 1 st and 2 nd support portions are brought into proximity or contact with each other and arranged in a 1 st direction; moving the substrate supported by the 2 nd supporting part arranged in the 1 st supporting part toward the 1 st supporting part in the 1 st direction; moving at least one of the 1 st support part and the 3 rd support part capable of supporting the one surface of the substrate so that the 1 st and 3 rd support parts are close to or in contact with each other and arranged in the 2 nd direction; and moving the substrate supported by the 1 st supporting part arranged in the 3 rd supporting part toward the 3 rd supporting part in the 2 nd direction.

According to a 5 th aspect of the present invention, there is provided a conveyance device including: a 1 st support unit configured to supply a gas to one surface of a substrate and support the substrate by the gas in a floating manner; a 2 nd support portion capable of supporting the one surface of the substrate; a driving part for moving at least one of the 1 st and 2 nd supporting parts to make the 1 st and 2 nd supporting parts approach or contact with each other and arrange; a transfer unit that moves the substrate supported by the 2 nd support unit arranged by the drive unit in the arrangement direction toward the 1 st support unit; a jack-up mechanism for supporting the substrate placed on the placement portion of the 1 st support portion and jacking up the substrate above the placement portion by stopping the supply of the gas; and a carrying-out mechanism for carrying out the substrate supported above the mounting part by the jack-up mechanism from the 1 st supporting part.

According to a 6 th aspect of the present invention, there is provided a method of transferring a substrate, comprising: a movement of moving at least one of a 1 st support part capable of supporting the substrate in a floating manner by a gas supplied to one surface of the substrate and a 2 nd support part capable of supporting the one surface of the substrate so that the 1 st and 2 nd support parts are arranged in proximity to each other or in contact with each other; a step of transferring the substrate supported by the arranged 2 nd support unit to the 1 st support unit side along the arrangement direction; stopping the supply of the gas to support the substrate placed on the placement portion of the 1 st support portion and lift the substrate up above the placement portion; and an operation of carrying out the substrate supported above the mounting portion from the 1 st supporting portion.

According to a 7 th aspect of the present invention, there is provided an exposure apparatus for exposing a substrate with exposure light, comprising: and a transfer device for holding the substrate and moving the substrate to an irradiation region of the exposure light.

According to an 8 th aspect of the present invention, there is provided a device manufacturing method comprising: an operation of transferring the pattern on the substrate by using the exposure apparatus; and processing the substrate transferred with the pattern according to the pattern.

According to the aspect of the present invention, the substrate can be transferred without causing a mounting deviation or deformation.

Drawings

Fig. 1 is a sectional plan view showing an overall outline of an exposure apparatus.

Fig. 2 is an external perspective view showing a specific configuration in the chamber.

Fig. 3A is a diagram showing the peripheral configuration of the panel holder.

Fig. 3B is a diagram showing the peripheral configuration of the panel holder.

Fig. 4A is a diagram showing a configuration of a main part of the loading unit.

Fig. 4B is a diagram showing a configuration of a main part of the loading unit.

Fig. 5A is a diagram showing a configuration of a main part of the carrying-out section.

Fig. 5B is a diagram showing a configuration of a main part of the carrying-out section.

Fig. 6 is a diagram illustrating a transfer procedure of a substrate to a loading station.

Fig. 7A is an explanatory view of a step of conveying the substrate between the board holder and the carrying-out section.

Fig. 7B is an explanatory view of a step of conveying the substrate between the plate holder and the carrying-out section.

Fig. 8 is a view showing a state where a substrate is suspended and supported on the carrying-in table.

Fig. 9 is a diagram illustrating a step of conveying the substrate on the loading stage.

Fig. 10 is a diagram illustrating a step of transferring a substrate to the board holder side.

Fig. 11 is a view illustrating a state where a substrate is placed on the plate holder.

Fig. 12 is a diagram illustrating a procedure of transferring a substrate to a carrying-out stage.

Fig. 13 is a view showing a state where a substrate is suspended and supported on the carrying-out table.

Fig. 14A is a diagram illustrating substrate conveyance from the board holder to the carry-out section.

Fig. 14B is a diagram illustrating substrate conveyance from the board holder to the carry-out section.

Fig. 14C is a diagram illustrating substrate conveyance from the board holder to the carry-out section.

Fig. 15 is a diagram for explaining an operation of carrying out the substrate from the carrying-out section.

Fig. 16A is a diagram showing a configuration of the carry-in section according to embodiment 2.

Fig. 16B is a diagram showing the structure of the carry-in section according to embodiment 2.

Fig. 17 is a diagram illustrating a configuration of transferring a substrate from the carry-in portion to the board holder side.

FIG. 18 is a diagram illustrating steps following FIG. 18.

Fig. 19 is a view showing a structure of a plate holder according to embodiment 3.

Fig. 20A is a diagram illustrating a configuration of transferring a substrate from the carry-in part to the board holder side.

Fig. 20B is a diagram illustrating a configuration of transferring a substrate from the carry-in part to the board holder side.

Fig. 21 is a diagram showing the structure of embodiment 4.

Fig. 22A is a diagram illustrating a substrate transfer operation according to embodiment 4.

Fig. 22B is a diagram illustrating a substrate transfer operation according to embodiment 4.

Fig. 22C is a diagram illustrating a substrate transfer operation according to embodiment 4.

Fig. 22D is a diagram illustrating a substrate transfer operation according to embodiment 4.

Fig. 23 is a perspective view showing the internal structure of the chamber according to embodiment 5.

Fig. 24A is a plan view showing a schematic configuration of the carrying in/out portion.

Fig. 24B is a plan view showing a schematic configuration of the carrying in/out portion.

Fig. 25 is a diagram illustrating a substrate loading step according to embodiment 5.

Fig. 26 is a diagram illustrating transfer of a substrate from the carry-in/out section to the substrate holder side.

Fig. 27 is a diagram illustrating transfer of a substrate from the board holder to the carry-in/out portion.

Fig. 28 is a sectional plan view showing an outline of the whole exposure apparatus.

Fig. 29 is an external perspective view showing a specific configuration in the chamber.

Fig. 30A is a diagram showing the peripheral configuration of the panel holder.

Fig. 30B is a diagram showing the peripheral configuration of the panel holder.

Fig. 31A is an explanatory view of a step of conveying a substrate between the plate holder and the carrying-out section.

Fig. 31B is an explanatory view of a step of conveying the substrate between the plate holder and the carrying-out section.

Fig. 32 is a view showing a state where a substrate is suspended and supported on the carrying-in table.

Fig. 33 is a diagram illustrating a step of conveying the substrate on the carrying-in table.

Fig. 34 is a diagram illustrating a step of transferring a substrate to the board holder side.

Fig. 35 is a diagram for explaining the operation of the carrying-out robot arm.

Fig. 36A is a front view illustrating an operation of carrying out a substrate from the board holder.

Fig. 36B is a front view illustrating an operation of carrying out the substrate from the board holder.

Fig. 37 is a side view for explaining an operation of carrying out a substrate from the plate holder.

Fig. 38 is a view showing the configuration of the loading unit according to embodiment 3.

Fig. 39A is a diagram illustrating a configuration of transferring a substrate from the carry-in part to the board holder side.

Fig. 39B is a diagram illustrating a configuration of transferring a substrate from the carry-in part to the board holder side.

Fig. 40 is a diagram showing the configuration of the exposure apparatus main body according to embodiment 4.

Fig. 41 is a plan view of the display panel holder.

Fig. 42A is a side cross-sectional view of a plate holder.

Fig. 42B is a side cross-sectional view of a plate holder.

Fig. 43 is a diagram showing the structure of the vertical movement portion.

Fig. 44A is a diagram illustrating a configuration of transferring a substrate from the carry-in part to the board holder side.

Fig. 44B is a diagram illustrating a configuration of transferring a substrate from the carry-in part to the board holder side.

Fig. 45 is a view showing a state where the support substrate is suspended on the carrying-in table.

Fig. 46 is a view showing a state where the abutting portion is in contact with an end portion of the substrate.

Fig. 47 is a diagram illustrating a step of moving a substrate from a loading stage to a plate holder.

Fig. 48 is a perspective view for explaining the operation of the carrying-out robot.

Fig. 49A is an explanatory view of a step of carrying out a substrate from the board holder.

Fig. 49B is an explanatory view of a step of carrying out the substrate from the plate holder.

Fig. 49C is an explanatory view of a step of carrying out the substrate from the plate holder.

Fig. 50A is a plan view showing the configuration of the suction mechanism according to embodiment 5.

Fig. 50B is a side view showing the configuration of the adsorption mechanism of embodiment 5.

Fig. 51A is a side view illustrating an operation of carrying out a substrate from the plate holder.

Fig. 51B is a side view illustrating an operation of carrying out the substrate from the plate holder.

Fig. 52A is a diagram showing a configuration of a modification of the suction mechanism.

Fig. 52B is a diagram showing a configuration of a modification of the suction mechanism.

FIG. 53 is a flowchart for explaining an example of the process of the microdevice.

Reference numerals:

p substrate

K1, K4, K6 and K8 suction holes

K2, K3, K5 and K7 gas injection holes

K205 opening part

1 Exposure device

4, 104 carry-in part

5 carrying-out part

9,109 plate holder

12 fork part

19 position detecting sensor

33 No. 1 moving mechanism

40, 140 carry-in table

42, 249 No. 1 transfer part

43 nd 2 movement mechanism

50 carry-out table

53 No. 3 moving mechanism

142 roller

148 roller mechanism

150 jacking mechanism

205 carry-out robot arm

250 adsorption part

252 position detecting sensor

350 adsorption mechanism

351 holding part

401 substrate mounting table

408 adsorption part

Detailed Description

Embodiments of the present invention will be described with reference to the drawings. The present invention is not limited to this. The following describes an exposure apparatus including the transport apparatus of the present invention and performing an exposure process (exposing a pattern for a liquid crystal display element to a substrate coated with a photosensitive agent), and an embodiment of the transport method and the element manufacturing method of the present invention.

(embodiment 1)

Fig. 1 is a sectional plan view showing a schematic configuration of an exposure apparatus according to the present embodiment. As shown in fig. 1, the exposure apparatus 1 includes an exposure apparatus main body 3 for exposing a pattern for a liquid crystal display element to a substrate, a carrying-in section 4, and a carrying-out section 5, which are highly cleaned and are housed in a chamber 2 adjusted to a predetermined temperature. In the present embodiment, the substrate is a large glass plate, and the size of one side thereof is, for example, 500mm or more.

Fig. 2 is an external perspective view showing a specific structure in the chamber 2. As shown in fig. 2, the exposure apparatus main body 3 includes an unillustrated illumination system for illuminating the mask M with the exposure light IL, an unillustrated mask stage for holding the mask M on which the pattern for the liquid crystal display element is formed, a projection optical system PL disposed below the mask stage, a plate holder 9 as a substrate holder provided to be two-dimensionally movable on a base (not shown) disposed below the projection optical system PL, and a 1 st moving mechanism 33 for holding the plate holder 9 and moving the plate holder 9 in the chamber 2.

In the following description, the two-dimensional movement of the plate holder 9 provided at the base (not shown) of the chamber 2 is performed in a horizontal plane, and the X axis and the Y axis are set in directions orthogonal to each other in the horizontal plane. The plate holder 9 is parallel to the horizontal plane in a reference state (for example, a state when the substrate P is transferred) with respect to the holding surface of the substrate P. The Z axis is set in a direction orthogonal to the X axis and the Y axis, and the optical axis of the projection optical system PL is parallel to the Z axis. The directions around the X, Y, and Z axes are referred to as the θ X, θ Y, and θ Z directions, respectively.

The 1 st moving mechanism 33 includes a moving mechanism body 35 and a holding portion 34 that is disposed on the moving mechanism body 35 and holds the plate holder 9. The moving mechanism body 35 is supported by a guide surface (base portion), not shown, in a non-contact manner via a gas bearing, and is movable in the XY direction on the guide surface. With this configuration, the plate holder 9 moves on the light emitting side (image surface side of the projection optical system PL) within a predetermined region of the guide surface while holding the substrate P.

The moving mechanism body 35 can move on the guide surface in the XY plane by the operation of a coarse movement system including an actuator such as a linear motor. The holding portion 34 can be moved in the Z-axis direction, the θ X direction, and the θ Y direction with respect to the moving mechanism body 35 by the operation of a micro-motion system including an actuator such as a voice coil motor. The holding unit 34 can move in six directions, i.e., X, Y, Z, θ X, θ Y, and θ Z directions, while holding the substrate P by the operation of a substrate stage driving system including a coarse movement system and a fine movement system.

The exposure apparatus 1 performs step-and-scan exposure in a state where a rectangular substrate P is placed on the plate holder 9, and sequentially transfers a pattern formed on the mask M to a plurality of, for example, four exposure regions (pattern transfer regions) on the substrate P. That is, in the exposure apparatus 1, in a state where the slit-shaped illumination region on the mask M is illuminated by the exposure light IL from the illumination system, the mask stage holding the mask M and the plate holder 9 holding the substrate P are moved in synchronization with each other in a predetermined scanning direction (here, the Y-axis direction) by a not-shown controller via a not-shown drive system, and the pattern of the mask M is transferred to one exposure region on the substrate P, that is, scanning exposure is performed. The exposure apparatus 1 of the present embodiment is configured as a so-called multi-lens scanning exposure apparatus, in which the projection optical system PL includes a plurality of projection optical modules, and the illumination system includes a plurality of illumination modules corresponding to the plurality of projection optical modules.

After the scanning exposure of the one exposure region is completed, a stepping operation is performed to move the board holder 9 in the X direction by a predetermined amount to reach the scanning start position of the next exposure region. Then, the exposure apparatus body 3 repeats the scanning exposure and the stepping operation, thereby sequentially transferring the pattern of the mask M to the four exposure regions.

As shown in fig. 2, the carrying-in section 4 includes a carrying-in table 40 for supporting one surface (lower surface) of a substrate P coated with a photosensitive agent when the substrate P is carried in by a coating and developing machine (not shown) disposed adjacent to the exposure apparatus 1, and a 2 nd moving mechanism 43 for moving the carrying-in table 40. The loading unit 4 can adjust the temperature of the substrate P loaded onto the loading table 40.

The 2 nd moving mechanism 43 includes a moving mechanism main body 45 and a holding portion 44 disposed on the moving mechanism main body 45 and holding the loading table 40. The moving mechanism body 45 is supported by a guide surface, not shown, in a non-contact manner via a gas bearing, and is movable in the XY direction on the guide surface. With this configuration, the carrying-in table 40 can move in a predetermined area of the guide surface while holding the substrate P. The support of the moving mechanism body 45 with respect to the guide surface (not shown) is not limited to the support of the gas bearing, and a known guide mechanism (drive mechanism for the guide surface) different from the gas bearing may be used.

The moving mechanism body 45 has the same structure as the moving mechanism body 35 and can move on the guide surface in the XY plane. The holding portion 44 has the same configuration as the holding portion 34, and is movable in the Z-axis direction, the θ X direction, and the θ Y direction with respect to the moving mechanism body 45. The holding portion 44 is movable in six directions of the X-axis, Y-axis, Z-axis, θ X, θ Y, and θ Z directions while holding the substrate P.

As shown in fig. 2, the carry-out section 5 includes a carry-out table 50 for supporting one surface (lower surface) of the substrate P subjected to the exposure process by the exposure apparatus main body 3 when the substrate P is transferred, and a 3 rd moving mechanism 53 for moving the carry-out table 50.

The 3 rd moving mechanism 53 includes a moving mechanism main body 55 and a holding portion 54 that is disposed on the moving mechanism main body 55 and holds the carrying-out table 50. The moving mechanism main body 55 is supported by a guide surface, not shown, in a non-contact manner via a gas bearing, and is movable in the XY direction on the guide surface. With this configuration, the carrying-out table 50 can move in a predetermined area of the guide surface while holding the substrate P.

The moving mechanism main body 55 has the same structure as the moving mechanism main bodies 35 and 45 and is movable in the XY plane on the guide surface. The holding portion 54 has the same configuration as the holding

portions

34 and 44, and is movable in the Z-axis direction, the θ X direction, and the θ Y direction with respect to the movement mechanism main body 55. The holding portion 54 can move in six directions of the X-axis, Y-axis, Z-axis, θ X, θ Y, and θ Z directions while holding the substrate P.

Next, the peripheral structure of the board holder 9 will be described with reference to fig. 3A and 3B. Fig. 3A shows a plan view of the holder 9, and fig. 3B shows a side view of the holder 9. As shown in fig. 3A, a substrate mounting portion 31 for mounting the substrate P is formed on the board holder 9. The substrate mounting portion 31 is formed to have a good flatness at the upper portion thereof with respect to the substantial holding surface of the substrate P by the substrate holder 9. Furthermore, a plurality of suction holes K1 are provided on the substrate mounting portion 31 for closely contacting the substrate P in a manner to follow the surface. Each suction hole K1 is connected to a vacuum pump not shown.

Further, a plurality of gas ejection holes K2 through which the substrate P is supported by gas levitation by ejecting gas such as air to the lower surface of the substrate P are provided on the upper surface of the substrate mounting portion 31. Each gas ejection hole K2 is connected to a gas ejection pump not shown. The suction holes K1 and the gas injection holes K2 are arranged in a lattice shape.

Further, a guide pin 36 for guiding the substrate P when the substrate P is carried in and a positioning pin 37 for specifying the position of the substrate placing portion 31 of the substrate P to the board holder 9 are provided at the peripheral portion of the board holder 9. These guide pins 36 and positioning pins 37 can move together with the plate holder 9 in the exposure apparatus body 3.

As shown in fig. 3B, the plate holder 9 includes a position detection sensor 19 on a side surface portion 9a thereof, which detects a relative position to the loading table 40 and the unloading table 50. The position detection sensor 19 includes a distance detection sensor 19a for detecting a relative distance to the loading table 40 and the unloading table 50, and a height detection sensor 19b for detecting a relative height to the loading table 40 and the unloading table 50. Further, a concave portion is formed at a position corresponding to the position detection sensor 19 in the carry-in table 40 and the carry-out table 50, thereby preventing the position detection sensor 19 from interfering with the carry-in table 40 and the carry-out table 50.

Next, the main part structure of the loading unit 4 will be described with reference to fig. 4A and 5B. Fig. 4A is a plan view showing the peripheral structure of the carry-in table 40, and fig. 4B is a view showing an arrow section a-a of fig. 4A.

As shown in fig. 4A and 4B, the carry-in portion 4 is provided with a 1 st transfer portion 42 that transfers the substrate P from the carry-in table 40 to the board holder 9. The 1 st transfer portion 42 includes a guide portion 42a and an abutting portion 42b abutting against the substrate P.

Two groove-like recesses 40a formed in one direction (Y direction in the figure) are formed on the upper surface of the loading table 40. The guide portion 42a is provided in the recess 40 a. The abutting portion 42b is attached to the guide portion 42a in a state of protruding from the upper surface of the loading table 40. The contact portion 42b is made of an elastic member such as rubber, and can reduce damage to the substrate P during contact.

The upper surface of the loading table 40 is provided with a plurality of gas ejection holes K3 through which the substrate P is supported by gas levitation by ejecting gas such as air to the lower surface of the substrate P. Each gas ejection hole K3 is connected to a gas ejection pump not shown.

Further, a plurality of suction holes K4 for closely adhering the substrate P to the carrying-in table 40 in a manner to face the surface are provided. Each suction hole K4 is connected to a vacuum pump not shown. The gas injection holes K3 and the suction holes K4 are arranged in a grid pattern alternately in the Y direction. The gas injection holes K3 and the suction holes K4 are not limited to the lattice arrangement, and may be arranged in various forms (for example, arranged alternately in the Y direction). The gas injection hole K3 and the suction hole K4 are not limited to being provided independently of each other, and the same hole may be used as both the gas injection hole K3 and the suction hole K4. In this case, each hole can be appropriately connected to the gas injection pump and the vacuum pump in a switchable manner.

The carrying-in table 40 is formed with through holes 47, and substrate support pins of an up-and-down movement mechanism for transferring the substrate P between the substrate support pins and a coating and developing machine (not shown) are inserted through the through holes 47 as will be described later.

Next, the main part structure of the carry-out section 50 will be described with reference to fig. 5A and 5B. As shown in fig. 5A and 5B, the carry-out section 50 is a 2 nd transfer section for transferring the substrate P from the plate holder 9 to the carry-out table 50. The 2 nd transfer unit includes a guide portion 52a and an adsorption portion 52b for adsorbing and holding the substrate P.

Two groove-like recesses 50a formed in one direction (Y direction in the figure) are formed on the upper surface of the carrying-out table 50. The guide portion 52a is provided in the recess 50 a. The suction portion 52b is attached to the guide portion 52a in a state of protruding from the upper surface of the carry-out table 50. The suction portion 52b includes a vacuum suction pad for holding the substrate P by vacuum suction, for example.

The suction portion 52b is provided with a contact portion 58 that comes into contact with the substrate P pushed out from the plate holder 9 when the substrate is carried out. This abutting portion 58 is constituted by an elastic member such as rubber.

Further, a plurality of gas ejection holes K5 through which the substrate P is supported by gas levitation by ejecting gas such as air to the lower surface of the substrate P are provided on the upper surface of the carrying-out table 50. Each gas ejection hole K5 is connected to a gas ejection pump not shown.

Furthermore, a plurality of suction holes K6 for closely adhering the substrate P to the carrying-out table 50 in a manner similar to the surface are provided on the carrying-out table. Each suction hole K6 is connected to a vacuum pump not shown. The gas injection holes K5 and the suction holes K6 are arranged in a grid pattern.

The carrying-out table 50 is formed with through holes 57 through which substrate support pins of an up-and-down movement mechanism for transferring the substrate P to and from a coating and developing machine (not shown) can be inserted as described later.

Next, the operation of the exposure apparatus 1 will be described with reference to fig. 6 to 15. Specifically, the transfer operation of the substrate P between the carry-in unit 4 and the plate holder 9 and the transfer operation of the substrate P between the plate holder 9 and the carry-out unit 50 will be mainly described. In the present embodiment, the carrying-in table 40 of the carrying-in section 4 and the carrying-out table 50 of the carrying-out section 5 are disposed at different positions in the same horizontal plane. That is, the carrying-in table 40 and the carrying-out table 50 are disposed at positions not overlapping each other in a plan view (a state viewed from the + Z direction shown in fig. 2).

First, the substrate P coated with the photosensitive agent by a coater/developer (not shown) is carried into the carry-in section 4. At this time, the vertical movement mechanism 49 located below the loading table 40 first arranges the substrate support pins 49a above the loading table 40 through the through holes 47. Next, the arm 48 of the coating and developing machine (not shown) is inserted between the substrate support pins 49a as shown in fig. 6. The arm 48 moves down to transfer the substrate P to the substrate support pin 49a, and then, the substrate P is removed from the carry-in section 4. The vertical movement mechanism 49 lowers the substrate support pins 49a supporting the substrate P, thereby ending the loading operation of the substrate P into the loading table 40. Thereafter, the vacuum pump is driven, and the substrate P is sucked and held on the upper surface of the carry-in table 40 through the suction hole K4.

Next, as shown in fig. 7A, the board holder 9 moves so as to approach the loading table 40 of the loading unit 4. Specifically, the 1 st moving mechanism 33 arranges the plate holder 9 and the carrying-in table 40 in a state of approaching in the Y direction. Here, the state where the board holder 9 and the carrying-in table 40 are close to each other means a state where the board P is separated by a distance by which the movement of the board P can be smoothly performed at the time of transfer of the board P to be described later.

The 2 nd moving mechanism 43 can be driven when the loading table 40 and the plate holder 9 are aligned. In this way, the loading table 40 and the board holder 9 can be moved to the transfer position of the substrate P in a short time, and the time required for the loading operation of the substrate P can be shortened. In this case, the carrying-out table 50 is retracted to a position not interfering with the carrying-in table 40.

Further, since the substrate P is sucked and held on the upper surface of the loading table 40 through the suction holes K4, the substrate P can be prevented from moving on the loading table 40 when the 2 nd moving mechanism 43 is driven.

In the present embodiment, as shown in fig. 7B, when the loading table 40 and the plate holder 9 are brought close to each other, the substrate P is arranged higher than the plate holder 9. That is, the 1 st moving mechanism 33 brings the plate holder 9 close to the carry-in table 40 such that the upper surface of the carry-in table 40 on which the substrate P is supported is higher than the upper surface of the plate holder 9. Further, the carrying-in table 40 may be raised by the 2 nd moving mechanism 43 so that the upper surface of the carrying-in table 40 is higher than the upper surface of the board holder 9.

The 1 st moving mechanism 33 can also align the plate holder 9 and the carrying-in table 40 in a state of contact. In this way, the transfer of the substrate P between the board holder 9 and the loading table 40, which will be described later, can be smoothly performed.

Next, as shown in fig. 8, the carrying-in table 40 ejects a gas from the plurality of gas ejection holes K3 formed in the upper surface, and supports the substrate P in a floating state by the gas. On the other hand, when the plate holder 9 receives the substrate P, the gas is first ejected from the plurality of gas ejection holes K2 formed in the upper surface.

The carry-in section 4 causes the contact portion 42b to contact one end portion of the substrate P as shown in fig. 9 in a state where the substrate P is supported on the carry-in table 40 in a floating manner. The contact portion 42b moves the substrate P toward the board holder 9 by moving along the guide portion 42a in the recess 40 a.

Since the substrate P is suspended on the carrying-in table 40, the contact portion 42b can smoothly slide the substrate P to the plate holder 9 side. The upper surface of the plate holder 9 is the floating support substrate P as described above. Here, the gas ejected from the gas ejection holes K3 and K2 may have directivity.

The substrate P sliding on the carry-in table 40 by the contact portion 42b is smoothly transferred to the upper surface of the board holder 9 as shown in fig. 10. In the present embodiment, since the upper surface of the loading table 40 is higher than the upper surface of the board holder 9, the substrate P can be smoothly transferred onto the board holder 9 without contacting the side surface of the board holder 9.

As shown in fig. 9, the substrate P slides while being regulated at a position in the X direction in the drawing by a guide pin 36 provided at the peripheral portion of the board holder 9. The contact portion 42b moves the substrate P to contact the positioning pin 37 provided on the downstream side in the substrate conveyance direction in the board holder 9. The substrate P is positioned in the X direction in the drawing by the guide pins 36, and is sandwiched between the positioning pins 37 and the contact portion 42b, so that the position in the Y direction in the drawing is defined. The plate holder 9 stops the gas injection from the gas injection hole K2. As shown in fig. 11, the substrate P is placed in alignment with the substrate placing unit 31.

In addition, when a substrate is mounted on a conventional board holder, there is a possibility that a mounting deviation of the substrate (a positional deviation from a predetermined mounting position) or a deformation of the substrate may occur. One of the causes of the mounting offset is to cause the substrate to float due to a thin air layer generated between the substrate and the plate holder immediately before the substrate is mounted. Further, one of the causes of the substrate deformation may be, for example, a state in which the substrate is inflated by air remaining between the substrate and the plate holder after the substrate is placed.

In contrast, in the present embodiment, the substrate P is conveyed in a floating state by the gas jet as described above, and thus is transferred to the plate holder 9 in a high flatness state without distortion. Further, since the substrate P is placed on the substrate placing portion 31 from the height at which the substrate P is suspended and supported, it is possible to prevent air stagnation and an air layer from being generated between the substrate P and the substrate placing portion 31. Therefore, the substrate P is prevented from being in an expanded state, and the occurrence of displacement or deformation of the substrate P during mounting is prevented. Therefore, the substrate P can be placed in a highly planar state at a predetermined position with respect to the board holder 9. Thereafter, the vacuum pump is driven, so that the substrate P is sucked and held on the upper surface of the substrate mounting portion 31 through the suction holes K1.

After the substrate P is placed on the plate holder 9, the mask M is illuminated with the exposure light IL from the illumination system. The pattern of the mask M illuminated with the exposure light IL is projection-exposed to the substrate P placed on the plate holder 9 by the projection optical system PL.

In the exposure apparatus 1, since the substrate P can be favorably placed on the plate holder 9 as described above, a predetermined exposure can be performed with high accuracy at an appropriate position on the substrate P, and a highly reliable exposure process can be realized.

In the present embodiment, during the exposure process of the substrate P or during the period of time when the substrate P after the exposure process is conveyed to the carry-in section 5 as will be described later, the next substrate P on which the photosensitive agent is applied by the coating and developing machine (not shown) can be placed on the carry-in stage 40 of the carry-in section 4.

Next, a carrying-out operation of carrying out the substrate P from the board holder 9 after the exposure processing is completed will be described.

After the exposure process is completed, the plate holder 9 moves to approach the carry-out table 50 of the carry-out section 5 as shown in fig. 12. Specifically, the 1 st moving mechanism 33 arranges the plate holder 9 and the carrying-out table 50 in a state of approaching in the Y direction. At this time, since the substrate P is sucked and held through the suction holes K1, the substrate P can be prevented from moving on the substrate placement unit 31 when the 1 st moving mechanism 33 is driven.

The 3 rd moving mechanism 53 can be driven when the carrying-out table 50 and the board holder 9 are aligned. Thus, the carrying-out table 50 and the board holder 9 can be moved to the transfer position of the substrate P in a short time, and the time required for the carrying-out operation of the substrate P can be shortened. In this case, the carrying-in table 40 is retracted to a position not interfering with the carrying-out table 50.

In the present embodiment, when the board holder 9 and the carrying-out table 50 are brought close to each other, the board P is arranged higher than the board holder 9 corresponding to the transfer destination of the board P, similarly to when the board holder 9 and the carrying-in table 40 are brought close to each other. That is, the 1 st moving mechanism 33 brings the plate holder 9 close to the carrying-out table 50 so that the upper surface of the plate holder 9 supporting the substrate P is higher than the upper surface of the carrying-out table 50. Further, the 3 rd moving mechanism 53 may lower the carrying-out table 50 so that the upper surface of the carrying-out table 50 is lower than the upper surface of the plate holder 9.

The 1 st moving mechanism 33 can also align the plate holder 9 and the carrying-out table 50 in a state of contact. In this way, the transfer of the substrate P between the plate holder 9 and the carry-out table 50, which will be described later, can be smoothly performed.

The plate holder 9 stops the driving of the vacuum pump, and releases the suction holding of the substrate P passing through the suction hole K1 to the substrate mounting portion 31. Next, as shown in fig. 13, the plate holder 9 ejects a gas from a plurality of gas ejection holes K2 formed in the upper surface of the substrate mounting portion 31, and supports the substrate P in a floating state by the gas. On the other hand, when the carrying-out section 5 receives the substrate P, the gas is first ejected from the plurality of gas ejection holes K5 formed in the upper surface of the carrying-out table 50.

The carry-out section 5 moves the suction section 52b of the 2 nd transfer section along the guide section 52a toward the substrate P suspended and supported on the substrate placing section 31 of the board holder 9. As shown in fig. 14A, the positioning pins 37 press the end of the substrate P suspended on the substrate mounting portion 31. As a result, the substrate P suspended on the substrate mounting portion 31 slides toward the carrying-out stage 50, and contacts the contact portion 58 attached to the suction portion 52B as shown in fig. 14B. In this way, by sliding the substrate P toward the contact portion 58 using the positioning pins 37, it is not necessary to move the suction portion 52b to a position facing the substrate P on the plate holder 9 along the sliding portion 52 a. After the end of the substrate P contacts the contact portion 58, the suction portion 52b sucks and holds the substrate P, and moves in the Y direction in the figure along the guide portion 52a as shown in fig. 14C.

At this time, since the substrate P is supported in a state of being suspended on the plate holder 9, the suction portion 52b can smoothly slide the substrate P to the carrying-out table 50 side. The upper surface of the carry-out table 50 supports the substrate P in a floating manner as described above. Here, the gas ejected from the gas ejection holes K2 and K5 may have directivity.

The substrate P sliding on the upper surface of the substrate mounting portion 31 by the movement of the suction portion 52b is smoothly transferred to the upper surface of the carrying-out table 50. In the present embodiment, since the upper surface of the board holder 9 is higher than the upper surface of the carrying-out table 50, the board P can be smoothly transferred onto the carrying-out table 50 without contacting the side surface of the carrying-out table 50.

After the movement of the substrate P is completed by the adsorption unit 52b, the carrying-out stage 50 stops the gas injection from the gas injection holes K5, and adsorbs and holds the substrate P through the suction holes K6. The carry-out section 5 drives the 3 rd moving mechanism 53 to move the carry-out table 50 to the carry-out position of the substrate P in a state where the substrate P is held by suction.

After transferring the substrate P from the plate holder 9 to the carry-out section 5, the exposure apparatus 1 moves the plate holder 9 so as to approach the carry-in table 40 of the carry-in section 4. Subsequently, similarly, the substrate P is transferred between the loading table 40 and the plate holder 9, and the exposure process can be performed on the substrate P placed on the plate holder 9.

In the present embodiment, the substrate P after the exposure process carried on the carrying-out stage 50 is carried out while the next substrate P is carried from the carrying-in section 4 to the plate holder 9 or while the next substrate P is subjected to the exposure process. At this time, the vertical movement mechanism 60 located below the carrying-out table 50 disposes the substrate support pin 60a above the carrying-out table 50 through the through hole 57. Thus, the substrate P is supported by the substrate support pins 60a and is held above the carrying-out table 50. Next, the arm 48 of the coating and developing machine (not shown) is inserted between the substrate support pins 60a as shown in fig. 15. Thereafter, the substrate P is transferred to the arm portion 48 by lowering the substrate support pins 60 a. The arm 48 moves the substrate P in a coater/developer (not shown) to perform a developing process.

As described above, the board holders 9 move in the same horizontal plane (XY plane) with respect to the carry-in section 4 and the carry-out section 5, and are alternately connected to each other, so that the substrate P is carried into and out of the exposure apparatus main body 3. In the present embodiment, since the plate holder 9 is moved in the arrangement direction of the carry-in section 4 and the carry-out section 5, the plate holder 9 can be arranged in a state of being close to or in contact with the carry-in section 4 and the carry-out section 5 in a short time. Therefore, the processing time (so-called Takt) associated with the carrying in/out operation of the substrate P can be shortened.

According to the present embodiment, since the substrate P supported in a floating manner can be carried from the carry-in section 4 to the plate holder 9 by sliding, it is possible to prevent air stagnation or an air layer from occurring between the substrate P and the substrate mounting section 31, and to prevent the substrate P from being displaced or deformed. Therefore, highly reliable exposure processing can be performed.

In embodiment 1, the upper surface of the loading table 40 may be inclined when the substrate P is transported from the loading table 40 to the plate holder 9. Specifically, the holding portion 44 of the 2 nd transfer mechanism 43 inclines the upper surface of the carry-in table 40 supporting the substrate P in a floating state by gas injection from the gas injection hole K3 toward the plate holder 9 (θ Y). Thereby, the substrate P can be moved toward the board holder 9 by the self-weight of the substrate P.

Further, the upper surface of the board holder 9 can be inclined when the substrate P is conveyed from the board holder 9 to the carry-out table 50. Specifically, the holding portion 34 of the 1 st movement mechanism 33 inclines the upper surface of the plate holder 9 supporting the substrate P in a floating state by gas injection from the gas injection hole K2 toward the carrying-out table 50 (θ Y). Thus, the substrate P can be moved toward the carrying-out stage 50 by the weight of the substrate P.

(embodiment 2)

Next, the configuration of embodiment 2 of the present invention will be described. In the present embodiment, the same components as those in embodiment 1 are denoted by the same reference numerals, and description thereof will be omitted. Embodiment 2 differs from embodiment 1 in the configuration of the 1 st transfer unit in the loading unit 104.

Fig. 16A and 16B are views showing the structure of the loading unit 104 according to the present embodiment, fig. 16A is a view showing the top structure of the loading unit 104, and fig. 16B is a view showing a side cross section of the loading unit 104 as seen by an arrow a-a in fig. 16A.

As shown in fig. 16A and 16B, the 1 st transfer unit of the carry-in unit 104 of the present embodiment includes a roller mechanism 148 instead of a configuration in which the substrate P is suspended and supported by jetting gas onto one surface thereof.

As shown in fig. 16A, a plurality of notches 141 are formed in one end of the loading table 140. The roller 142 constituting the roller mechanism 148 is supported by each notch 141 so as to be rotatable about the shaft 143. The roller 142 can rotate by a drive mechanism not shown. As shown in fig. 16B, the roller mechanism 148 is configured such that the rollers 142 can contact the substrate P or be separated from the substrate P.

According to this configuration, the roller mechanism 148 can move the substrate P toward the plate holder 9 by rotating the plurality of rollers 142 in a predetermined direction while contacting the lower surface of the substrate P supported on the carrying-in table 140. As a material for forming the roller 142, an elastic member such as rubber, for example, which generates a large frictional force with the substrate P can be used. By forming the roller 142 using such an elastic member, damage (scratches and the like) to the substrate P can be prevented. Only the suction hole K4 is provided on the upper surface of the loading table 140.

Next, the operation of the exposure apparatus 1 according to the present embodiment will be described. Specifically, the transfer operation of the substrate P between the loading unit 104 and the plate holder 9, which is different from that in embodiment 1, will be described.

First, the substrate P coated with the photosensitive agent by a coater/developer (not shown) is carried into the carrying-in section 104. The substrate P is sucked and held on the upper surface of the carry-in table 140 through the suction holes K4. Thereafter, the board holder 9 is moved to approach the loading table 140 (see fig. 7A).

In the present embodiment as well, it is preferable that the plate holder 9 is brought close to the loading table 140 so that the upper surface of the loading table 140 supporting the substrate P is higher than the upper surface of the plate holder 9 (see fig. 7B).

However, in the present embodiment, if the upper surface of the loading table 140 is lower than the upper surface of the board holder 9, the substrate P loaded on the rollers 142 can be reliably transported from the loading table 140 side to the board holder 9 side as long as at least the upper surfaces of the rollers 142 are higher than the upper surface of the board holder 9.

Next, as shown in fig. 17, the carry-in table 140 rotates in a predetermined direction with the rollers 142 of the roller mechanism 148 in contact with the lower surface of the substrate P. On the other hand, when the plate holder 9 receives the substrate P, the gas is first ejected from the plurality of gas ejection holes K2 formed in the upper surface. The substrate P smoothly slides toward the plate holder 9 by the frictional force with the roller 142.

Here, the plate holder 9, which is a destination of the substrate P, suspends and supports the substrate P on the substrate mounting portion 31 by being injected with gas from the gas injection holes K2.

Therefore, the substrate P sliding on the upper surface of the loading table 140 by the roller mechanism 148 is smoothly transferred to the upper surface of the board holder 9.

As shown in fig. 18, the substrate P slides while being regulated at a position in the X direction in the drawing by a guide pin 36 provided at the peripheral portion of the plate holder 9. The roller mechanism 148 moves the substrate P to contact the positioning pins 37 provided on the downstream side in the substrate conveyance direction in the substrate holder 9. The substrate P is positioned in the X direction in the drawing by the guide pins 36, and is sandwiched between the positioning pins 37 and the contact portion 42b, so that the position in the Y direction in the drawing is defined. The plate holder 9 stops the gas injection from the gas injection hole K3. The substrate P is placed in alignment with the substrate placing unit 31.

In the present embodiment as well, since the substrate P is conveyed in a floating state by the gas injection as described above, the substrate P can be transferred to the plate holder 9 in a highly planar state without distortion, and air stagnation or an air layer can be prevented from being generated between the substrate P and the substrate mounting portion 31. Therefore, the substrate P can be placed in a highly planar state at a predetermined position with respect to the board holder 9. Therefore, a predetermined exposure can be performed at an appropriate position on the substrate P with high accuracy, and a highly reliable exposure process can be realized.

Note that the operation of carrying out the substrate P from the plate holder 9 after the completion of the exposure processing is the same as that in embodiment 1, and therefore, the description thereof is omitted.

In the above description, although the roller mechanism 148 is described as the 1 st transfer part of the carry-in part 104, a roller mechanism may be employed as the 2 nd transfer part of the carry-out part 5. The carrying-in table 140 may be configured to support the substrate P by gas jetting in a floating manner, as in embodiment 1. With this configuration, since the substrate P is conveyed by the roller mechanism 148 in a floating state, the substrate P can be smoothly conveyed toward the board holder 9.

(embodiment 3)

Next, the structure of embodiment 3 of the present invention will be described. In the present embodiment, the same reference numerals are given to the same components as those in embodiments 1 and 2, and the description thereof will be omitted. The main difference between the embodiment 3 and the embodiment is that the plate holder 109 includes the 1 st transfer mechanism.

Fig. 19 is a diagram showing a structure of the plate holder 109 according to the present embodiment. As shown in fig. 19, the board holder 109 of the present embodiment includes a 1 st transfer unit 249 that transfers the substrate P from the loading table 40 to the board holder 109. The 1 st transfer unit 249 includes an adsorption unit 250 for adsorbing and holding both sides of the substrate P in the width direction. The suction portion 250 is movable in the XY plane in the P-plane direction of the substrate.

In the present embodiment, a position detection sensor 252 for detecting the position of the substrate P carried in by the 1 st transfer unit 249 relative to the substrate placement unit 31 is provided at the peripheral portion of the plate holder 109. The position detecting sensor 252 may be exemplified by a potentiometer, and the present invention may employ a contact type or a non-contact type.

The adsorption unit 250 adsorbs and holds an end portion of the substrate P suspended and supported on the carrying-in table 40 by gas injection from the gas injection hole K3, and conveys the substrate P from the carrying-in table 40 to the plate holder 109 as shown in fig. 20A. On the other hand, when the plate holder 109 receives the substrate P, the gas is first ejected from the plurality of gas ejection holes K2 formed in the upper surface. In this case, the gas ejected from the gas ejection holes K2 and K3 may have directivity.

As shown in fig. 20B, the suction unit 250 allows the exposure apparatus 1 to detect a positional deviation of the substrate P with respect to the substrate mounting unit 31 by bringing the end of the substrate P into contact with the position detection sensor 252. The suction unit 250 is configured to be driven based on the detection result of the position detection sensor 252.

Therefore, the exposure apparatus 1 can correct the position of the substrate P held by the suction unit 250 with respect to the substrate placement unit 31 based on the detection result of the position detection sensor 252.

In the present embodiment as well, since the substrate P is conveyed in a floating state by the gas jet as described above, the substrate P can be transferred to the plate holder 109 in a highly planar state without distortion, and air stagnation or an air layer can be prevented from being generated between the substrate P and the substrate mounting portion 31. Therefore, the substrate P can be placed in a highly planar state at a predetermined position relative to the board holder 109. Therefore, a predetermined exposure can be performed at an appropriate position on the substrate P with high accuracy, and a highly reliable exposure process can be realized.

Note that the operation of carrying out the substrate P from the plate holder 109 after the exposure processing is completed is the same as that in embodiment 1, and therefore, the description thereof is omitted.

(embodiment 4)

Next, the structure of embodiment 4 of the present invention will be described. In the present embodiment, the same components as those in embodiment 1 are denoted by the same reference numerals, and description thereof will be omitted. As shown in fig. 21, the main difference between the 4 th embodiment and the 1 st embodiment is that the board loading table 40 and the loading table 50 are disposed at positions overlapping each other in a plan view. That is, when transferring the substrate P to and from the board holder 9, the carry-in table 40 and the carry-out table 50 move up and down with respect to the board holder 9.

Next, the transfer operation of the substrate P according to the present embodiment will be described with reference to fig. 22A, 22B, and 22C.

After the exposure process for the substrate P placed on the plate holder 9 is completed, the carry-out stage 50 is aligned in a state of approaching the plate holder 9 in the Y direction. In the present embodiment, as shown in fig. 22A, the opposite board holder 9 raises the carrying-out table 50 waiting at the bottom to a position where the substrate P can be received. At this time, the upper surface of the carry-out table 50 can be disposed lower than the upper surface of the board holder 9 (see fig. 13).

While the substrate P is subjected to the exposure process, the next substrate P is transferred from the coater/developer (not shown) to the loading table 40. Thus, the carry-in table 40 waits above the board holder 9 while the next substrate P is placed thereon while the substrate P is carried out from the board holder 9 to the carry-out table 50.

The plate holder 9 stops the driving of the vacuum pump, and releases the suction holding of the substrate P passing through the suction hole K1 to the substrate mounting portion 31. Next, the plate holder 9 ejects a gas from the gas ejection holes K2, and the substrate P is supported in a floating state by the gas (see fig. 14A to 14C). On the other hand, when the carrying-out section 5 receives the substrate P, the gas is first ejected from the plurality of gas ejection holes K5 formed in the upper surface of the carrying-out table 50. In this case, the gas ejected from the gas ejection holes K2 and K5 may have directivity.

As shown in fig. 22B, the carry-out section 5 moves the substrate P held by the suction section 52B in the Y direction in the figure, as in embodiment 1. At this time, since the substrate P is supported in a state of being suspended on the plate holder 9, the substrate P smoothly slides on the carrying-out table 50. The upper surface of the carry-out table 50 supports the substrate P in a floating manner as described above. Therefore, the substrate P is smoothly transferred to the upper surface of the carrying-out table 50.

After the movement of the substrate P is completed, the carrying-out stage 50 stops the gas injection from the gas injection holes K5, and holds the substrate P by suction through the suction holes K6. The carry-out stage 50 moves the substrate P downward as shown in fig. 22C in a state where the substrate P is held by suction. When the substrate P is placed in a state of being large in size and protruding from the upper surface of the carry-out table 50, the carry-out table 50 performs the lowering operation in a state of being separated from the plate holder 9 and retreated in the + Y direction in the drawing so that the substrate P does not interfere with the plate holder 9.

On the other hand, the carry-out table 50 starts a lowering operation, and as shown in fig. 22C, the carry-in table 40 waiting above the board holder 9 is lowered to a position where the substrate P can be transferred to the board holder 9. Thereby, the board holder 9 and the carrying-in table 40 are arranged in a state of being close to each other in the Y direction. At this time, the upper surface of the carrying-in table 40 can be disposed lower than the upper surface of the board holder 9 (see fig. 8).

The carrying-in table 40 ejects a gas from the plurality of gas ejection holes K3 formed in the upper surface, and supports the substrate P in a floating state by the gas. On the other hand, when the plate holder 9 receives the substrate P, the gas is first ejected from the plurality of gas ejection holes K2 formed in the upper surface. In this case, the gas ejected from the gas ejection holes K2 and K5 may have directivity.

The carry-in section 4 brings the contact portion 42b into contact with one end portion of the substrate P in a state where the substrate P is supported on the carry-in table 40 in a floating manner. The contact portion 42b moves along the guide portion 42a in the recess 40a to move the substrate P toward the board holder 9 (see fig. 9 and 10).

Since the substrate P is suspended on the carrying-in table 40, it smoothly slides to the plate holder 9 side. Since the upper surface of the board holder 9 supports the substrate P in a floating manner as described above, the substrate P is smoothly transferred from the loading table 40 to the board holder 9 as shown in fig. 22D.

As in embodiment 1, the substrate P can be placed in a predetermined position on the substrate placement unit 31 by the guide pins 36 and the positioning pins 37 (see fig. 9). Next, the substrate P is subjected to exposure processing.

In the present embodiment, the substrate P after the exposure process carried on the carrying-out stage 50 is carried out while the substrate P is carried from the carrying-in section 4 to the board holder 9 or while the substrate P is subjected to the exposure process.

In the present embodiment, the carry-in section 4 and the carry-out section 5 are alternately connected to each other by moving in the height direction (Z direction) with respect to the board holder 9 as described above, and the carry-in and carry-out operation of the substrate P to and from the exposure apparatus main body 3 can be performed. Further, since the carry-in section 4 and the carry-out section 5 stand by above the board holder 9 when not in use and can be connected to the board holder 9 by respective vertical movements, a processing time (so-called Takt) associated with the carry-in and carry-out movement of the substrate P can be shortened.

In the above embodiment, the 1 st direction in which the loading table 40 and the board holder 9 are arranged is described as being parallel to the 2 nd direction in which the unloading table 50 and the board holder 9 are arranged, but the present invention is not limited thereto, and the present invention can also be applied to a case where the 1 st direction and the 2 nd direction are different directions (for example, intersect).

(embodiment 5)

Next, the structure of embodiment 5 of the present invention will be described. In the present embodiment, the same components as those in embodiment 1 are denoted by the same reference numerals, and description thereof will be omitted. The embodiment 5 is mainly different in that it is a carrying in/out section having functions of a carrying in section and a carrying out section.

Fig. 23 is a perspective view showing the internal structure of the chamber, and fig. 24A and 24B are plan views showing the schematic structure of the carrying in/out section 400.

As shown in fig. 23, the carrying in/out section 400 includes a substrate mounting table 401 and a moving mechanism 402 for moving the substrate mounting table 401. The moving mechanism 402 is configured in the same manner as the 1 st and 2

nd moving mechanisms

33 and 43 of embodiment 1. With this configuration, the substrate mounting table 401 can move on the light exit side (the image plane side of the projection optical system PL) within a predetermined region of the guide surface while holding the substrate P. Further, the substrate mounting table 401 can also move in the Z-axis direction. Therefore, the substrate mounting table 401 functions as a carrying-in table and a carrying-out table.

As shown in fig. 24A and 24B, the carry-in/out unit 400 includes a transfer unit that transfers the substrate P from the substrate mounting table 401 to the board holder 9. The transfer unit includes a guide 406 and a suction unit 408 that sucks and holds the substrate P.

Two groove-like recesses 401a formed in one direction (Y direction in the figure) are formed on the upper surface of the substrate mounting table 401. The guide 406 is provided in the recess 401 a. The suction unit 408 is attached to the guide 406 in a state of protruding from the upper surface of the substrate mounting table 401. The suction unit 408 includes a vacuum suction pad for holding the substrate P by vacuum suction, for example.

A plurality of gas ejection holes K7 through which the substrate P is supported by gas levitation by ejecting gas such as air to the lower surface of the substrate P are provided on the upper surface of the substrate mounting table 401. Each gas ejection hole K7 is connected to a gas ejection pump not shown. Further, a plurality of suction holes K8 are provided on the upper surface of the substrate mounting table 401 so that the substrate P is closely adhered to the upper surface in a manner similar to the surface. Each suction hole K8 is connected to a vacuum pump not shown. The gas injection holes K7 and the suction holes K8 are arranged in a grid pattern.

A through hole 407 is formed in the substrate mounting table 401, and a substrate support pin of an up-and-down movement mechanism for transferring the substrate P to and from a coating and developing machine (not shown) is inserted through the through hole 407 as will be described later.

The plate holder 9 is provided with the position detection sensor 19 on the side surface thereof for detecting the relative position with respect to the substrate mounting table 401, as in the above-described embodiment. The position detection sensor 19 includes a distance detection sensor 19a for detecting a relative distance to the substrate mounting table 401 and a height detection sensor 19B for detecting a relative height to the substrate mounting table 401 (see fig. 3B).

Next, the transfer operation of the substrate P between the carrying in/out section 400 and the board holder 9 will be described with reference to the drawings. First, the substrate P coated with the photosensitive agent by a coating and developing machine (not shown) is carried into the carry-in/out section 400. At this time, the vertical movement mechanism 409 positioned below the substrate mounting table 401 first disposes the substrate support pin 410 above the substrate mounting table 401 through the through hole 407. Next, the arm 48 of the coating and developing machine (not shown) is inserted between the substrate support pins 410 as shown in fig. 25. When the arm 48 is lowered, the substrate P is transferred to the substrate support pins 410, and then is removed from the carry-in/out section 400. The vertical movement mechanism 409 lowers the substrate support pins 410 supporting the substrate P, thereby completing the loading operation of the substrate P onto the substrate mounting table 401. Thereafter, the vacuum pump is driven, and the substrate P is sucked and held on the upper surface of the substrate mounting table 401 through the suction hole K8.

Next, the board holder 9 is moved so as to approach the substrate mounting table 401 of the carrying in/out section 400. In addition, when the substrate mounting table 401 and the plate holder 9 are arranged, the transfer unit may be driven to move the substrate mounting table 401 and the plate holder 9 to the transfer position of the substrate P in a short time, thereby shortening the time required for the loading operation of the substrate P. In this case, since the substrate P is sucked and held on the upper surface of the substrate mounting table 401 through the suction holes K8, the substrate P can be prevented from moving on the substrate mounting table 401 when the transfer unit is driven.

In the present embodiment, as shown in fig. 26, the plate holder 9 is brought close to the substrate mounting table 401 such that the upper surface of the substrate mounting table 401 supporting the substrate P is higher than the upper surface of the plate holder 9. Further, the plate holder 9 and the substrate mounting table 401 are arranged in a contact state, so that the moving distance of the substrate P can be shortened and the transfer can be performed more smoothly.

Next, as shown in fig. 26, the substrate mounting table 401 ejects a gas from a plurality of gas ejection holes K7 formed in the upper surface, and supports the substrate P in a floating state by the gas. On the other hand, when the plate holder 9 receives the substrate P, the gas is first ejected from the plurality of gas ejection holes K2 formed in the upper surface. In this case, the gas ejected from the gas ejection holes K2 and K7 may have directivity.

The carrying in/out unit 400 holds one end of the substrate P by suction by the suction unit 408 in a state where the substrate P is supported on the substrate mounting table 401 in a floating manner. The suction portion 408 moves along the guide portion 406 in the recess 401a to move the substrate P toward the board holder 9 (see fig. 24A and 24B).

Since the substrate P is suspended on the substrate mounting table 401, the suction portion 408 can smoothly slide the substrate P to the plate holder 9 side. The upper surface of the plate holder 9 is the floating support substrate P as described above.

Therefore, the substrate P sliding on the upper surface of the substrate mounting table 401 by the suction unit 408 is smoothly transferred onto the upper surface of the substrate holder 9. In the present embodiment, as shown in fig. 26, the upper surface of the substrate placement table 401 is higher than the upper surface of the plate holder 9, and therefore the substrate P can be smoothly transferred onto the plate holder 9 without contacting the side surface of the plate holder 9.

The substrate P is brought into a state of being aligned at a predetermined position with respect to the substrate mounting portion 31 by coming into contact with the guide pins 36 and the positioning pins 37 provided at the peripheral portion of the board holder 9 (see fig. 9).

In the present embodiment as well, since the substrate P is conveyed in a floating state by the gas injection as described above, it is possible to prevent air stagnation or an air layer from being generated between the substrate P and the substrate mounting portion 31, and to prevent the substrate P from being displaced or deformed during mounting. Therefore, the substrate P can be placed in a highly planar state at a predetermined position with respect to the board holder 9. Thereafter, the vacuum pump is driven, so that the substrate P is sucked and held on the upper surface of the substrate mounting portion 31 through the suction holes K1. Next, after the substrate P is placed on the plate holder 9, the substrate P is subjected to exposure processing.

After the exposure process is completed, the plate holder 9 is moved to be close to the substrate mounting table 401 of the carrying in/out section 400. In the present embodiment, the plate holder 9 and the substrate mounting table 401 are brought close to each other so that the upper surface of the plate holder 9 is higher than the upper surface of the substrate mounting table 401.

Further, when the substrate mounting table 401 and the plate holder 9 are arranged, the time required for the carrying-out operation of the substrate P can be shortened by moving the substrate mounting table 401. Further, the plate holder 9 and the substrate mounting table 401 may be arranged in a contact state. Thus, since no gap is formed between the board holder 9 and the substrate mounting table 401, the transfer of the substrate P can be smoothly performed.

The plate holder 9 stops the driving of the vacuum pump, and releases the suction holding of the substrate P passing through the suction hole K1 to the substrate mounting portion 31. Next, as shown in fig. 27, the plate holder 9 ejects a gas from a plurality of gas ejection holes K2 formed in the upper surface of the substrate mounting portion 31, and supports the substrate P in a floating state by the gas. On the other hand, when the carrying-out section 5 receives the substrate P, the gas is first ejected from the plurality of gas ejection holes K7 formed on the upper surface of the substrate mounting table 401. In this case, the gas ejected from the gas ejection holes K2 and K7 may have directivity.

The carrying in/out unit 400 moves the suction unit 408 of the transfer unit along the guide 406 toward the substrate P supported on the substrate placement unit 31 of the board holder 9 in a floating manner. The suction unit 408 sucks and holds the substrate P, and moves the substrate P in the + Y direction in the figure (see fig. 24A and 24B).

At this time, since the substrate P is supported in a state of being suspended on the plate holder 9, the suction portion 408 can smoothly slide the substrate P to the substrate mounting table 401 side. As described above, the upper surface of the substrate mounting table 401 supports the substrate P in a floating manner.

Therefore, the substrate P sliding on the upper surface of the substrate mounting portion 31 is smoothly transferred onto the upper surface of the substrate mounting table 401. In this embodiment, since the upper surface of the plate holder 9 is higher than the upper surface of the substrate mounting table 401, the substrate P can be smoothly transferred onto the substrate mounting table 401 without contacting the side surface of the substrate mounting table 401.

After the movement of the substrate P is completed by the adsorption unit 408, the substrate mounting table 401 stops the gas injection from the gas injection holes K7, and adsorbs and holds the substrate P through the suction holes K8. The carrying in/out unit 400 drives the transfer unit to move the substrate mounting table 401 to the carrying out position of the substrate P in a state where the substrate P is held by suction.

Next, the substrate P after the exposure process placed on the substrate placing table 401 is carried out. At this time, the vertical movement mechanism 409 positioned below the substrate mounting table 401 disposes the substrate support pin 410 above the substrate mounting table 401 through the through hole 407. Thereby, the substrate P is supported by the substrate support pins 410 and is held above the substrate mounting table 401 (see fig. 25). Next, the arm 48 of the coating and developing machine (not shown) is inserted between the substrate support pins 410, and the substrate P is transferred to the arm 48 by lowering the substrate support pins 410. The arm 48 moves the substrate P in a coater/developer (not shown) to perform a developing process.

According to the present embodiment, since the substrate P supported in a floating manner can be carried from the carry-in/out section 400 to the plate holder 9 by sliding, it is possible to prevent air stagnation or an air layer from occurring between the substrate P and the substrate mounting section 31, and to prevent the substrate P from being displaced or deformed. Therefore, highly reliable exposure processing can be performed. Further, since the carrying in/out section 400 also serves as the carrying in section 4 and the carrying out section 5 in the above embodiments 1 to 3, the apparatus configuration can be simplified.

In embodiment 5, the upper surface of the substrate mounting table 401 may be inclined when the substrate P is transferred from the substrate mounting table 401 to the plate holder 9. Specifically, the moving mechanism 402 tilts the upper surface of the substrate mounting table 401 supporting the substrate P in a floating state by gas injection from the gas injection holes K7 toward the plate holder 9 (θ Y). Thereby, the substrate P can be moved toward the board holder 9 by the self-weight of the substrate P.

Further, the upper surface of the board holder 9 can be inclined when the board P is transported from the board holder 9 to the board placing table 401. Specifically, the 1 st movement mechanism 33 (holding unit 34) tilts the upper surface of the plate holder 9 supporting the substrate P in a floating state by gas injection from the gas injection hole K2 toward the substrate mounting table 401 (θ Y). Thus, the substrate P can be moved toward the substrate mounting table 401 by the weight of the substrate P.

In this embodiment, the roller mechanism 148 as shown in embodiment 2 can be used as the transfer unit. As the transfer portion, as shown in embodiment 3, the suction portion 408 constituting the transfer portion may be provided on the side of the plate holder 9.

(embodiment 6)

Next, the structure of embodiment 6 of the present invention will be described. In the following description, the same components as those of the above embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

Fig. 28 is a sectional plan view showing a schematic configuration of an exposure apparatus according to the present embodiment, and fig. 29 is a schematic perspective view showing a configuration of the apparatus in the chamber.

As in the above-described embodiment, the exposure apparatus 1 includes an exposure apparatus main body 3 and a loading unit 4 as shown in fig. 28. In the present embodiment, the exposure apparatus 1 includes the carrying-out robot 205. These are housed in a chamber 2 which is highly purified and adjusted to a predetermined temperature.

As shown in fig. 29, the unloading robot 205 has, for example, a horizontal joint structure, and includes an arm 10 composed of a plurality of parts connected by vertical joint axes, a fork 12 connected to the tip of the arm 10, and a drive device 13. The arm 10 is movable in, for example, the vertical direction (Z-axis direction) by a driving device 13. The driving device 13 is controlled to be driven by a control device not shown. Thereby, the carry-out robot 205 takes the substrate P from the plate holder 9. The carrying-out robot 205 is not limited to a robot having a horizontal joint structure, and may be realized by appropriately using or combining a known robot (generally, a transfer mechanism).

Fig. 30A shows a plan view of the holder 9, and fig. 30B shows a side view of the holder 9. In the present embodiment, as shown in fig. 30A, a substrate mounting portion 31 for mounting the substrate P is formed on the board holder 9.

In the present embodiment, the plate holder 9 is formed with a groove 30 for receiving the fork 12 of the carrying-out robot 205 when the substrate P is carried out. This groove portion 30 is formed along the moving direction of the fork 12 (Y direction in the figure). The region other than the groove portion 30 on the upper surface of the fork portion 9 constitutes the substrate mounting portion 31.

The thickness of the fork 12 is smaller than the depth of the groove 30. Thus, after the fork 12 is accommodated in the groove 30 as described later, the substrate P placed on the substrate placement unit 31 is transferred to the fork 12 by raising the fork.

As shown in fig. 30B, the plate holder 9 includes a position detection sensor 19 on a side surface portion 9a thereof for detecting a relative position with respect to the carry-in table 40, as in fig. 3B. The position detection sensor 19 includes a distance detection sensor 19a for detecting a relative distance to the loading table 40 and a height detection sensor 19b for detecting a relative height to the loading table 40. Further, a concave portion is formed at a position corresponding to the position detection sensor 19 in the carry-in table 40, thereby preventing the position detection sensor 19 from interfering with the carry-in table 40.

Next, the operation of the exposure apparatus 1 according to the present embodiment will be described with reference to fig. 6, 11, 31A to 34. Specifically, the transfer operation of the substrate P between the loading unit 4 and the plate holder 9 and the transfer operation of the substrate P between the plate holder 9 and the unloading robot 205 will be mainly described.

Next, as shown in fig. 31A, the board holder 9 moves so as to approach the loading table 40 of the loading unit 4. In fig. 31A and 31B, illustration of the carrying-out robot is omitted.

Specifically, the 1 st moving mechanism 33 arranges the plate holder 9 and the carrying-in table 40 in a state of approaching in the Y direction. Here, the state where the board holder 9 and the carrying-in table 40 are close to each other means a state where the board P is separated by a distance by which the movement of the board P can be smoothly performed at the time of transfer of the board P to be described later.

The 2 nd moving mechanism 43 can be driven when the loading table 40 and the plate holder 9 are aligned. In this way, the loading table 40 and the board holder 9 can be moved to the transfer position of the substrate P in a short time, and the time required for the loading operation of the substrate P can be shortened. At this time, since the substrate P is sucked and held on the upper surface of the loading table 40 through the suction holes K4, the substrate P can be prevented from moving on the loading table 40 when the 2 nd moving mechanism 43 is driven.

In the present embodiment, as shown in fig. 31B, when the plate holder 9 and the carrying-in table 40 are brought close to each other, the substrate P is disposed so that the plate holder 9 is high. That is, the 1 st moving mechanism 33 brings the plate holder 9 close to the carry-in table 40 such that the upper surface of the carry-in table 40 on which the substrate P is supported is higher than the upper surface of the plate holder 9. Further, the carrying-in table 40 may be raised by the 2 nd moving mechanism 43 so that the upper surface of the carrying-in table 40 is higher than the upper surface of the board holder 9.

Next, as shown in fig. 32, the carrying-in table 40 ejects a gas from the plurality of gas ejection holes K3 formed in the upper surface, and supports the substrate P in a floating state by the gas. On the other hand, when the plate holder 9 receives the substrate P, the gas is first ejected from the plurality of gas ejection holes K2 formed in the upper surface.

As shown in fig. 33, the carry-in section 4 brings the contact portion 42b into contact with one end portion of the substrate P in a state where the substrate P is supported on the carry-in table 40 in a floating manner. The contact portion 42b moves the substrate P toward the board holder 9 by moving along the guide portion 42a in the recess 40 a.

The substrate P sliding on the carry-in table 40 by the contact portion 42b is smoothly transferred to the upper surface of the board holder 9 as shown in fig. 34. In the present embodiment, since the upper surface of the loading table 40 is higher than the upper surface of the board holder 9, the substrate P can be smoothly transferred onto the board holder 9 without contacting the side surface of the board holder 9.

As shown in fig. 33, the substrate P slides while being regulated at a position in the X direction in the drawing by a guide pin 36 provided at the peripheral portion of the board holder 9. The contact portion 42b moves the substrate P to contact the positioning pin 37 provided on the downstream side in the substrate conveyance direction in the board holder 9. The substrate P is positioned in the X direction in the drawing by the guide pins 36, and is sandwiched between the positioning pins 37 and the contact portion 42b, so that the position in the Y direction in the drawing is defined. The plate holder 9 stops the gas injection from the gas injection hole K2. As shown in fig. 11, the substrate P is placed in alignment with the substrate placing unit 31.

Since the substrate P can be favorably placed on the plate holder 9 as described above, a predetermined exposure can be performed with high accuracy at an appropriate position on the substrate P, and a highly reliable exposure process can be realized.

In the present embodiment, during the exposure process of the substrate P or during the period when the substrate P after the exposure process is carried by the carrying-out robot 205 as described later, the next substrate P on which the photosensitive agent is applied by the coating and developing machine (not shown) can be placed on the carrying-in stage 40 of the carrying-in section 4.

Specifically, a method of carrying out the substrate P by the carrying-out robot 205 will be described. Fig. 35 is a perspective view for explaining the operation of the carrying-out robot 205, fig. 36A and 36B are sectional views when viewed from the Y-axis direction when the substrate P is carried out from the plate holder 9, and fig. 37 is a side view when viewed from the X-axis direction when the substrate P is carried out from the plate holder 9. In fig. 35, only the fork 12 is illustrated, and the entire configuration of the carrying-out robot arm 205 is omitted. In fig. 36A and 36B, the fork 12 supporting the substrate P is simplified for the sake of convenience of description.

After the exposure process is completed, the suction of the suction holes K1 of the vacuum pump is released to release the suction of the substrate P by the plate holder 9. Next, the carrying-out robot arm 205 inserts the fork 12 into the groove 30 formed in the plate holder 9 from the-Y direction side as shown in fig. 35.

Next, the driving device 13 moves the fork 12 upward by a predetermined amount, thereby bringing the fork 12 into contact with the lower surface of the substrate P as shown in fig. 36A. As shown in fig. 36B, the fork 12 further moves upward, thereby lifting the substrate P above the substrate holder 9 and separating it from the substrate mounting portion 31.

The carry-out robot 205 raises (retreats) the fork 12 to a height at which the carry-in table 40 (on which the next substrate P coated with the photosensitive agent is placed) does not contact the carry-in section 4. After the fork 12 is raised so as not to contact the substrate P on the carry-in table 40, as shown in fig. 37, the carry-in table 40 of the carry-in section 4 moves so as to approach the board holder 9, and the substrate P is carried to the board holder 9 side as described above.

While the substrate P is being conveyed from the carry-in section 4 to the plate holder 9, the carry-out robot 205 moves the substrate P placed on the fork 12 into a coating and developing machine (not shown). In this way, the carrying-out operation of carrying out the substrate P from the exposure apparatus main body 3 is completed.

As described above, according to the present embodiment, since the substrate P supported in a floating manner can be carried from the carrying-in section 4 to the plate holder 9 by sliding, it is possible to prevent the occurrence of air stagnation or an air layer between the substrate P and the substrate mounting section 31, and to prevent the occurrence of displacement or deformation of the substrate P. Therefore, highly reliable exposure processing can be performed.

In the present embodiment, since the substrate P is carried in by sliding from the carrying-in section 4 to the plate holder 9 by using gas injection, the throughput time is longer than that for carrying in a substrate using the plate holder 9 of the conventional tray.

In contrast, in the present embodiment, since the next substrate P can be carried into the board holder 9 by the carry-in portion 4 in a state where the fork portion 12 of the carry-out robot 205 is inserted into the groove portion 30 and the substrate P is lifted from the lower surface and retreated from the board holder 9, the total throughput time required for carrying in and out the substrate P to and from the board holder 9 can be substantially the same as that in the case of using the conventional tray. Therefore, the substrate P can be carried into the plate holder 9 in a good state without increasing the throughput time at the time of carrying in and out the substrate P.

In the present embodiment, the upper surface of the loading table 40 can be inclined even when the substrate P is transported from the loading table 40 to the plate holder 9. Specifically, the holding portion 44 of the 2 nd transfer mechanism 43 inclines the upper surface of the carry-in table 40 supporting the substrate P in a floating state by gas injection from the gas injection hole K3 toward the plate holder 9 (θ Y). Thereby, the substrate P can be moved toward the board holder 9 by the self-weight of the substrate P.

(embodiment 7)

Next, the structure of embodiment 7 of the present invention will be described. In the present embodiment, the same components as those in embodiment 6 are denoted by the same reference numerals, and description thereof will be omitted. Embodiment 7 is different from embodiment 6 in the configuration of the loading unit.

In the present embodiment, the carrying-in unit 104 is the same as that described with reference to fig. 16A and 16B.

The operation of the exposure apparatus 1 according to the present embodiment is the same as that described with reference to fig. 17 and 18.

In the present embodiment, since the substrate P is conveyed in a floating state by the gas injection as described above, the substrate P can be transferred to the plate holder 9 in a high flatness state without distortion, and air stagnation or an air layer can be prevented from being generated between the substrate P and the substrate mounting portion 31. Therefore, the substrate P can be placed in a highly planar state at a predetermined position with respect to the board holder 9. Therefore, a predetermined exposure can be performed at an appropriate position on the substrate P with high accuracy, and a highly reliable exposure process can be realized.

(embodiment 8)

Next, the structure of embodiment 8 of the present invention will be described. In the present embodiment, the same components as those in

embodiments

6 and 7 are denoted by the same reference numerals, and description thereof will be omitted. The main difference between embodiment 8 and

embodiments

6 and 7 is that the plate holder 109 includes a transfer portion.

Fig. 38 is a diagram showing a structure of the plate holder 109 according to the present embodiment. As shown in fig. 38, the board holder 109 of the present embodiment includes a 1 st transfer unit 249 that transfers the substrate P from the loading table 40 to the board holder 109. The 1 st transfer unit 249 includes an adsorption unit 250 for adsorbing and holding both sides of the substrate P in the width direction. The suction portion 250 is movable in the XY plane in the P-plane direction of the substrate.

The adsorption unit 250 adsorbs and holds an end portion of the substrate P suspended and supported on the carrying-in table 40 by gas injection from the gas injection hole K3, and conveys the substrate P from the carrying-in table 40 to the plate holder 109 as shown in fig. 39A. On the other hand, when the plate holder 109 receives the substrate P, the gas is first ejected from the plurality of gas ejection holes K2 formed in the upper surface. In this case, the gas ejected from the gas ejection holes K2 and K3 may have directivity.

As shown in fig. 39B, the suction unit 250 allows the exposure apparatus 1 to detect a positional deviation of the substrate P with respect to the substrate mounting unit 31 by bringing the end of the substrate P into contact with the position detection sensor 252. The suction unit 250 is configured to be driven based on the detection result of the position detection sensor 252.

(embodiment 9)

Next, the structure of embodiment 9 of the present invention will be described. In the present embodiment, the same reference numerals are given to the same components as those in embodiments 6 to 8, and the description thereof will be omitted. The main difference between the 9 th embodiment and the 6 th to 8 th embodiments is the structure of the exposure device. Fig. 40 is a perspective view showing a schematic configuration of the exposure apparatus main body 3 according to the present embodiment.

As shown in fig. 40, the exposure apparatus main body 3 of the present embodiment includes a plate holder 9, a substrate lift mechanism 150 provided in the plate holder 9, and a 1 st moving mechanism 33. The substrate lifting mechanism 150 is used to lift the substrate P upward when the substrate P is carried out.

Fig. 41 shows a plan view configuration of the plate holder 9, fig. 42A and 42B are side sectional views of the plate holder 9, fig. 42A is a view showing a state before transfer of a substrate, and fig. 42B is a view showing a state after transfer of the substrate.

As shown in fig. 41, 42A, and 42B, the substrate lift mechanism 150 includes a plurality of substrate support members 151 for supporting the substrate P, and an up-down operation portion 152 (see fig. 43) for moving the substrate support members 151 up and down.

The substrate supporting member 151 includes a 1 st linear member 119 extending in the X direction (1 st direction) in fig. 41 with respect to a shaft portion (up-down moving member) 155 and a 2 nd linear member 120 extending in the Y direction (2 nd direction) in fig. 41, and is formed in a substantially lattice shape as a whole. The 1 st linear member 119 and the 2 nd linear member (2 nd bridging portion) 120 are welded to each other or combined in a lattice shape. Each substrate support member 151 is disposed between a plurality of (for example, six in the present embodiment) shaft portions 155.

Each of the lattice shapes constituting each substrate support member 151 has a plurality of substantially rectangular openings 121 smaller than the substrate P. The shape of the substrate support member 151 is not limited to the shape shown in fig. 41, and may be, for example, a single frame in the shape of a frame in which only one opening 121 is formed.

In the present embodiment, the four substrate supporting members 151 are arranged with a gap S in the extending direction (Y direction shown in fig. 41) of the 2 nd linear member 120. The gap S between the substrate support members 151 is used to form a space into which the fork 12 is inserted when the substrate P is carried out from the plate holder 9 as described later.

Further, as a material for forming the substrate supporting member 151 (the 1 st linear member 119 and the 2 nd linear member 120), it is preferable to use various synthetic resins or metals which can suppress the deflection due to the self weight of the substrate P when the substrate supporting member 151 supports the substrate P. Specific examples thereof include nylon, polypropylene, AS resin, ABS resin, polycarbonate, fiber-reinforced plastic, and stainless steel. Examples of the Fiber-Reinforced Plastic include GFRP (Glass Fiber Reinforced Plastic: Glass Fiber Reinforced thermosetting Plastic) and CFRP (Carbon Fiber Reinforced Plastic: Carbon Fiber Reinforced thermosetting Plastic).

As shown in fig. 43, the vertical movement portion 152 includes a shaft portion (vertical movement member) 155 and a driving device 153 for driving the shaft portion 155 vertically. The driving device 153 is provided to each shaft 155, and each shaft 155 independently moves up and down.

With this configuration, as shown in fig. 42A and 42B, the substrate supporting member 151 moves up and down with respect to the substrate placing portion 31 of the substrate holder 9 in accordance with the up-down movement of the up-down movement portion 152 (the shaft portion 155).

On the other hand, a recess 130 for accommodating the substrate support member 151 is formed in the plate holder 9. The concave portions 130 are provided in a lattice shape corresponding to the frame structure of the substrate support member 151. The region (partial mounting portion) other than the recess 130 on the upper surface of the board holder 9 constitutes a board mounting portion 31 for holding the board P.

The thickness of the substrate supporting member 151 is smaller than the depth of the recess 130. As a result, as shown in fig. 42B, only the substrate P placed on the substrate supporting member 151 is transferred to the substrate placing portion 31 and placed by the substrate supporting member 151 being housed in the recess 130.

The substrate mounting portion 31 is formed to have a good flatness with respect to the substantial holding surface of the substrate P by the plate holder 9. Further, an opening K205 that functions as a suction port for bringing the substrate P into close contact with the substrate holding surface (upper surface) of the substrate mounting portion 31 in a manner to follow the surface, or as a gas injection port for injecting air (gas) at the time of carrying the substrate to be described later to suspend and support the substrate P on the surface is formed. A vacuum pump and a gas injection pump, not shown, are connected to the opening K205, and the opening K205 is caused to function as a suction port or an injection port as described above by switching the driving of these pumps.

A guide pin 36 for guiding the substrate P when the substrate P is carried in and a positioning pin 37 for specifying the position of the substrate placing portion 31 of the substrate P to the board holder 9 are provided at the peripheral portion of the board holder 9 (see fig. 44A and 44B). These guide pins 36 and positioning pins 37 can move together with the plate holder 9 in the exposure apparatus body 3.

Next, the operation of the exposure apparatus 1 according to the present embodiment will be described with reference to fig. 44A to 50B. Specifically, the transfer operation of the substrate P between the loading unit 4 and the plate holder 9 and the transfer operation of the substrate P between the plate holder 9 and the unloading robot 205 will be mainly described.

First, as in embodiment 6, the substrate P coated with the photosensitive agent by the coater/developer (not shown) is carried into the carrying-in section 4. At this time, the substrate P is sucked and held on the upper surface of the carry-in table 40 through the suction holes K4.

Next, as shown in fig. 44A, the board holder 9 moves so as to approach the loading table 40 of the loading unit 4. Note that fig. 44A and 44B do not illustrate the carrying-out robot. Specifically, the 1 st moving mechanism 33 arranges the plate holder 9 and the carrying-in table 40 in a state of approaching in the Y direction. At this time, the 2 nd moving mechanism 43 is driven to move the loading table 40 and the board holder 9 to the transfer position of the substrate P in a short time, thereby shortening the time required for the loading operation of the substrate P. Further, since the substrate P is sucked and held on the upper surface of the loading table 40 through the suction holes K4, the substrate P can be prevented from moving on the loading table 40 when the 2 nd moving mechanism 43 is driven.

In the present embodiment, as shown in fig. 44B, the 1 st moving mechanism 33 brings the plate holder 9 close to the carry-in table 40 such that the upper surface of the carry-in table 40 on which the substrate P is supported is higher than the upper surface of the plate holder 9. Further, the carrying-in table 40 may be raised by the 2 nd moving mechanism 43 so that the upper surface of the carrying-in table 40 is higher than the upper surface of the board holder 9. The 1 st moving mechanism 33 can also smoothly transfer the substrate P by arranging the plate holder 9 and the carrying-in table 40 in a contact state.

Next, as shown in fig. 45, the carrying-in table 40 ejects a gas from the plurality of gas ejection holes K3 formed in the upper surface, and supports the substrate P in a floating state by the gas. On the other hand, when the substrate P is picked up, the plate holder 9 drives a gas injection pump, not shown, to inject air from the opening K205 provided in the substrate mounting portion 31.

As shown in fig. 46, the carry-in section 4 causes the contact portion 42b to contact one end of the substrate P in a state where the substrate P is supported on the carry-in table 40 in a floating manner. The contact portion 42b moves the substrate P toward the board holder 9 by moving along the guide portion 42a in the recess 40 a.

Since the substrate P is suspended on the carrying-in table 40, the contact portion 42b can smoothly slide the substrate P to the plate holder 9 side. The upper surface of the plate holder 9 is the floating support substrate P as described above. Here, the gas ejected from the gas ejection hole K3 and the opening K205 may have directivity.

The substrate P sliding on the carry-in table 40 by the contact portion 42b is smoothly transferred to the upper surface of the board holder 9 as shown in fig. 47. In the present embodiment, since the upper surface of the loading table 40 is higher than the upper surface of the board holder 9, the substrate P can be smoothly transferred onto the board holder 9 without contacting the side surface of the board holder 9.

The substrate P is defined at a position in the X direction in the drawing by the guide pins 36, and is sandwiched between the positioning pins 37 and the contact portion 42b, so that a position in the Y direction in the drawing is defined. The plate holder 9 stops the gas ejection from the opening K205. Thereby, the substrate P is placed in alignment with the substrate placing section 31.

In the present embodiment, the substrate P is conveyed in a floating state by the gas jet as described above, and thus transferred to the plate holder 9 in a high flatness state without distortion. Further, since the substrate P is placed on the substrate placing portion 31 from the height at which the substrate P is suspended and supported, it is possible to prevent air stagnation and an air layer from being generated between the substrate P and the substrate placing portion 31. Therefore, the substrate P is prevented from being in an expanded state, and the occurrence of displacement or deformation of the substrate P during mounting is prevented. Therefore, the substrate P can be placed in a highly planar state at a predetermined position with respect to the board holder 9. Thereafter, the vacuum pump is driven, so that the substrate P is sucked and held on the upper surface of the substrate mounting portion 31 through the opening K205.

Since the exposure apparatus 1 of the present embodiment can favorably place the substrate P on the plate holder 9 as described above, a predetermined exposure can be performed at an appropriate position on the substrate P with high accuracy, and a highly reliable exposure process can be realized.

Specifically, a method of carrying out the substrate P by the carrying-out robot 205 will be described. Fig. 48 is a perspective view for explaining the operation of the carrying-out robot 205, and fig. 49A, 49B, and 49C are sectional views when viewed from the Y-axis direction when the substrate P is carried out from the plate holder 9. In fig. 48, only the fork 12 is illustrated, and the entire configuration of the carrying-out robot arm 205 is omitted. In the present embodiment, the board support portion in the fork portion 12 is different from the above-described embodiments in accordance with the shape of the jack-up mechanism 150. In fig. 49A, 49B, and 49C, the fork portion 12 for supporting the substrate P is simplified for the sake of convenience of description.

After the exposure process is completed, the suction through the opening K205 of the vacuum pump is released to release the suction of the substrate P by the plate holder 9. Next, the jack-up mechanism 150 raises the substrate support member 151 for the drive shaft portion 155. At this time, as shown in fig. 49A, the substrate P placed on the substrate placing portion 31 together with the substrate supporting member 151 is pushed upward. At this time, the substrate P is supported by the plurality of substrate supporting members 151 and lifted upward, so that the occurrence of peeling electrification can be prevented. Further, since the substrate P can be supported by a wider surface than in the case of lifting up the substrate P by the conventional pins, the amount of deflection occurring in the substrate P can be reduced, and the substrate P can be prevented from being cracked.

The carrying-out robot 205 drives the fork 12, moves the fork 12 from the-Y direction side to both ends in the gap S and the X-axis direction between the substrate support mechanisms 151 disposed above the substrate placement unit 31 as shown in fig. 48, and inserts the fork 12 into the gap S and both ends (fig. 49B).

Next, the driving device 13 moves the fork 12 upward by a predetermined amount, so that the fork 12 abuts against the lower surface of the substrate P. Further, the fork 12 is moved upward, so that the substrate P is lifted up above the board holder 9 and separated from the lift mechanism 150.

The lift-up mechanism 150 accommodates the substrate support member 151 in the concave portion 130 after the substrate P is separated. After the substrate support member 151 is accommodated in the concave portion 130, the plate holder 9 is moved so as to approach the loading table 40 of the loading unit 4, and the substrate P is conveyed toward the plate holder 9 as described above.

As described above, according to the present embodiment, since the substrate P supported in a floating manner can be transported from the carry-in section 4 to the plate holder 9 by sliding, it is possible to prevent the occurrence of displacement or deformation of the substrate P. In the present embodiment, the overall throughput time required for carrying in and out the substrates P with respect to the board holder 9 can be substantially the same as that in the case of using the conventional tray. Therefore, the substrate P can be carried into the plate holder 9 in a good state without increasing the throughput time at the time of carrying in and out the substrate P.

In the above embodiment, the opening K205 as a gas ejection port is formed only in the substrate mounting portion 31, but a gas ejection port may be formed in the upper surface of the substrate support member 151. In this way, when the substrate P is carried into the plate holder 9, the amount of the gas injected to the substrate carrying surface is increased, and therefore the substrate P can be carried more smoothly.

(embodiment 10)

Next, the structure of embodiment 10 of the present invention will be described. In the present embodiment, the same components as those in embodiment 6 are denoted by the same reference numerals, and description thereof will be omitted. The main difference between the 10 th embodiment and the above embodiments is that an adsorption mechanism for adsorbing the substrate P in a non-contact state is provided as a means for carrying out the substrate P from the plate holder 9.

The suction mechanism holds the substrate P, and pushes up the substrate P from the substrate placing portion 31 of the plate holder 9 upward to move the substrate P to a coating and developing machine (not shown). Fig. 50A shows a configuration of the suction surface, and fig. 50B shows an overall configuration of the suction mechanism.

As shown in fig. 50A and 50B, the suction mechanism 350 includes a plurality of holding portions 351 for holding the substrate P in a non-contact state, a base portion 352 for holding the holding portions 351, and a drive mechanism 355 for moving the base portion 352. The base portion 352 has a plate-like member having a size substantially equal to the substrate P. The holding portions 351 are regularly arranged on the base portion 352, thereby holding the substrate P well.

A so-called bernoulli cartridge is used as the holding portion 351. The holding portion 351 generates a negative pressure between the substrate P and the substrate P by injecting compressed air between the substrate P and the holding portion 351. Thereby, a pressing force for pressing the substrate P against the holding portion 351 side is generated. On the other hand, when the gap between the holding portion 351 and the substrate P is reduced, the flow velocity of the compressed air is reduced, and the pressure between the holding portion 351 and the substrate P is increased. Thereby generating a force for separating the substrate P from the holding portion 351. The holding portion 351 can hold the substrate P in a non-contact state, in which the substrate P is held in a fixed state with respect to the holding portion 351 by ejecting compressed air to balance the two forces.

Next, the operation of the exposure apparatus 1 will be described with reference to the drawings. Note that the transfer operation of the substrate P between the carry-in section 4 and the plate holder 9 is the same as that of embodiment 1, and therefore, the description thereof is omitted.

Next, the operation of carrying out the substrate P from the board holder 9 will be described. Specifically, a method of carrying out the substrate P from the plate holder 9 by the suction mechanism 350 will be described. Fig. 51A and 51B are side views of the substrate P when the substrate P is carried out from the plate holder 9 in the X-axis direction.

After the exposure process is completed, the suction of the suction holes K1 of the vacuum pump is released to release the suction of the substrate P by the plate holder 9. Next, the suction mechanism 350 is moved to above the board holder 9. Next, the suction mechanism 350 is lowered to a position where the holding portion 351 can hold the substrate P as shown in fig. 51A. Then, the upper surface of the substrate P is held in a non-contact state by the plurality of holding portions 351. At this time, the plurality of holding portions 351 can be driven simultaneously or sequentially to hold the substrate P.

The suction mechanism 350 holds the substrate P by the plurality of holding portions 351 and the drive mechanism 355 lifts the substrate P above the board holder 9, and separates the substrate P from the substrate mounting portion 31 as shown in fig. 51B. At this time, the holding portion 351 is not in contact with the substrate P, and therefore no suction mark remains on the substrate P.

After the suction mechanism 350 is raised to a position not to contact the substrate P on the carry-in table 40, the carry-in table 40 of the carry-in section 4 moves so as to approach the substrate holder 9. Next, as in the above embodiment, the substrate P is transported from the loading table 40 to the plate holder 9 in a floating state.

While the substrate P is being carried from the carry-in section 4 to the plate holder 9, the suction mechanism 350 moves the substrate P held by the holding section 351 to a coating and developing machine (not shown). In this way, the carrying-out operation of carrying out the substrate P from the exposure apparatus main body 3 is completed.

As shown in fig. 52A and 52B, a support member 353 for supporting the lower surface of the substrate P may be provided around the base portion 352. The support member 353 is a frame-shaped member surrounding the substrate P, and has a plurality of protruding portions 354 protruding in the surface direction of the substrate P. The protruding portion 354 abuts on the lower surface of the substrate P. With this configuration, when holding a large substrate in which there is a concern that the substrate P may be depressed, the peripheral end portion of the substrate P is supported by the protruding portion 354, and therefore, even when holding a large substrate, the substrate P can be held in a highly planar state by the holding portion 351 while preventing the substrate P from being depressed.

The substrate P of the above embodiment may be not only a glass substrate for a display device but also a semiconductor wafer for manufacturing a semiconductor device, a ceramic wafer for a thin film magnetic head, a mask used in an exposure apparatus, a reticle original plate (synthetic quartz, silicon wafer), or the like.

Further, the exposure apparatus can be applied not only to a step-and-scan type exposure apparatus (scanning stepper) that performs scanning exposure of the substrate P with the exposure light IL for exposing the pattern of the mask M by moving the mask M and the substrate P in synchronization, but also to a step-and-repeat type projection exposure apparatus (stepper) that performs step-and-repeat of the substrate P in sequence by exposing the pattern of the mask M at one time while keeping the mask M and the substrate P stationary.

The present invention is also applicable to a dual stage type exposure apparatus including a plurality of substrate stages as disclosed in U.S. patent No. 6341007, U.S. patent No. 6208407, and U.S. patent No. 6262796.

The present invention is also applicable to an exposure apparatus including a substrate stage for holding a substrate and a measurement stage on which a reference member and/or various types of photosensors are mounted without holding the substrate, as disclosed in U.S. patent No. 6897963 and european patent application No. 1713113. Further, an exposure apparatus including a plurality of substrate stages and a measurement stage may be employed.

In the above embodiment, a light transmissive mask in which a predetermined light shielding pattern (or phase pattern or dimming pattern) is formed on a light transmissive substrate is used, but instead of this mask, for example, a variable shaped mask (also referred to as an electronic mask, an active mask or an image generator) in which a transmission pattern or a reflection pattern is formed or a light emitting pattern is formed based on electronic data of a pattern to be exposed as disclosed in U.S. patent No. 6778257 may be used. Instead of the variable-shape mask having the non-light-emitting image display element, a pattern forming apparatus including a self-light-emitting image display element may be provided.

The exposure apparatus according to the above-described embodiment is manufactured by assembling various subsystems (including various components) so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. To ensure these various accuracies, before and after assembly, adjustment for achieving optical accuracy is performed on various optical systems, adjustment for achieving mechanical accuracy is performed on various mechanical systems, and adjustment for achieving electrical accuracy is performed on various electrical systems. The assembly process from various subsystems to the exposure apparatus includes mechanical connection, wiring connection of circuits, piping connection of pneumatic circuits, and the like. Of course, there is a separate assembly process for each subsystem before the assembly process from each subsystem to the exposure apparatus. When the assembly process from the various subsystems to the exposure apparatus is completed, the overall adjustment is performed to ensure various accuracies of the entire exposure apparatus EX. Further, it is preferable that the exposure apparatus is manufactured in a clean room in which temperature, cleanliness, and the like are controlled.

As shown in fig. 53, the microdevice such as a semiconductor device is manufactured by performing a step 201 of designing the function and performance of the microdevice, a step 202 of manufacturing a mask (reticle) based on the designing step, a step 203 of manufacturing a substrate as a device base material, a substrate processing step 204 including substrate processing (exposure processing including an operation of exposing the substrate with exposure light using a mask pattern and an operation of developing the substrate after exposure) according to the above-described embodiment, a device assembling step (a processing process including a dicing step, a bonding step, a packaging step, and the like) 205, an inspection step 206, and the like. In step 204, an exposure pattern layer (a layer of developed photosensitive agent) corresponding to the pattern of the mask is formed by developing the photosensitive agent, and the substrate is processed by the exposure pattern layer.

In addition, the requirements of the above embodiments and modifications can be combined as appropriate. In some cases, some of the components are not used. Further, the disclosures of all publications and U.S. patents on exposure apparatuses and the like cited in the above embodiments and modifications are incorporated as a part of the present disclosure within the scope of the statutory approval.

Claims

1. A conveying device is provided with:

the 1 st holding device can suspend and hold the 1 st object;

a 2 nd holding device provided at a position different from the 1 st holding device in a predetermined direction and capable of suspending and holding a 2 nd object different from the 1 st object;

a support portion arranged above the 1 st holding device to separate the 1 st object held by the 1 st holding device from the 1 st holding device; and

a transfer unit that moves the 2 nd object in the predetermined direction between the 1 st object supported by the support unit and the 1 st holding device so that the 2 nd object held by the 2 nd holding device is held by the 1 st holding device,

the transfer unit moves the 2 nd object suspended by at least one of the 1 st and 2 nd holding devices.

2. The conveying device according to claim 1, wherein the transfer unit moves the 2 nd object along a predetermined plane formed by the 1 st holding device and the 2 nd holding device.

3. The conveying device according to claim 1, wherein the transfer unit grips an end of the 2 nd object on the 2 nd holding device and moves the 2 nd object to the 1 st holding device.

4. The conveying device according to claim 3, wherein the transfer unit is provided outside the 2 nd holding device.

5. The conveying device according to any one of claims 1 to 4, wherein the support portion moves closer to the 1 st holding device so as to support the 1 st object in a vertical direction, and moves away from the 1 st holding device after supporting the 1 st object.

6. The handling device according to any one of claims 1 to 4, wherein the support portion supports a 2 nd surface different from the 1 st surface of the 1 st object held by the 1 st holding device.

7. The conveying device according to claim 6, wherein the support portion supports the 2 nd surface in a non-contact manner.

8. The handling device according to claim 7, wherein the support portion has a support surface that supports the 2 nd surface in a non-contact manner, and a holding portion that contacts and holds the 1 st surface of the 1 st object whose 2 nd surface is supported on the support surface in a non-contact manner.

9. The handling device according to any one of claims 1 to 4, wherein the 2 nd holding device is moved in the predetermined direction so as to approach the 1 st holding device.

10. An exposure apparatus includes:

the handling device of any one of claims 1 to 9; and

and a processing device for performing a predetermined process on the 1 st object or the 2 nd object held by the 1 st holding device.

11. The exposure apparatus according to claim 10, wherein the processing device is a device that exposes the 1 st object or the 2 nd object with a predetermined pattern using an energy beam.

12. The exposure apparatus according to claim 11, wherein the 1 st object and the 2 nd object are substrates having a side length of 500mm or more.

13. The exposure apparatus according to claim 12, wherein the 1 st object and the 2 nd object are substrates for a flat panel display device.

14. A method of manufacturing a flat panel display, comprising:

an operation of exposing the substrate using the exposure apparatus according to claim 13; and

and developing the substrate.

15. A device manufacturing method, comprising:

an act of exposing the 1 st object or the 2 nd object using the exposure apparatus according to any one of claims 10 to 12; and

and developing the 1 st object or the 2 nd object.

16. A conveying method, comprising:

an operation of supporting the 1 st object held by the 1 st holding device from the 1 st holding device on the support portion; and

an operation of moving the 2 nd object between the 1 st object and the 1 st holding device so that the 2 nd object held by the 2 nd holding device is held by the 1 st holding device,

the moving operation is to move the 2 nd object levitated by at least one of the 1 st holding device and the 2 nd holding device.

17. The conveyance method according to claim 16, wherein the movement is performed to move the 2 nd object along a predetermined surface formed by the 1 st holding device and the 2 nd holding device.

18. The conveyance method according to claim 16 or 17, wherein the supporting operation is such that the supporting portion moves closer to the 1 st holding device so as to support the 1 st object, and moves away from the 1 st holding device after supporting the 1 st object.

19. The conveyance method according to claim 16 or 17, wherein the supporting operation is to support a 2 nd surface of the 1 st object held by the 1 st holding device, the 2 nd surface being different from the 1 st surface.

20. A conveying method according to claim 19, wherein the supporting operation is to support the 2 nd surface in a non-contact manner by a supporting device.

21. The conveying method according to claim 20, wherein the supporting operation is to support the 2 nd surface of the 1 st object by a supporting surface in a non-contact manner, and to contact and hold the 1 st surface of the 1 st object supported by the supporting surface in a non-contact manner by a holding portion.

22. An exposure method, comprising:

the conveyance method according to any one of claims 16 to 21; and

a processing method of performing a predetermined process on the 1 st object or the 2 nd object held by the 1 st holding device.

23. The exposure method according to claim 22, wherein the processing method is processing for exposing the 1 st object or the 2 nd object to a predetermined pattern using an energy beam.

24. A method of manufacturing a flat panel display, comprising:

exposing the substrate by using the exposure method according to claim 23; and

and developing the substrate.

25. A device manufacturing method, comprising:

an act of exposing the 1 st object or the 2 nd object using the exposure method according to claim 23; and

and developing the 1 st object or the 2 nd object.