JP2019124962A - Conveyance apparatus, exposure apparatus, method of producing device - Google Patents

Conveyance apparatus, exposure apparatus, method of producing device Download PDF

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Publication number
JP2019124962A
JP2019124962A JP2019075822A JP2019075822A JP2019124962A JP 2019124962 A JP2019124962 A JP 2019124962A JP 2019075822 A JP2019075822 A JP 2019075822A JP 2019075822 A JP2019075822 A JP 2019075822A JP 2019124962 A JP2019124962 A JP 2019124962A
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JP
Japan
Prior art keywords
substrate
plate holder
support
table
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2019075822A
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Japanese (ja)
Inventor
麻子 金城
Asako Kaneshiro
麻子 金城
牛島 康之
Yasuyuki Ushijima
康之 牛島
哲嗣 花崎
Tetsutsugu Hanazaki
哲嗣 花崎
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株式会社ニコン
Nikon Corp
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Priority to US30535510P priority Critical
Priority to US30543910P priority
Priority to US61/305,355 priority
Priority to US61/305,439 priority
Application filed by 株式会社ニコン, Nikon Corp filed Critical 株式会社ニコン
Publication of JP2019124962A publication Critical patent/JP2019124962A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063Transporting devices for sheet glass
    • B65G49/064Transporting devices for sheet glass in a horizontal position
    • B65G49/065Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G51/00Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
    • B65G51/02Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases
    • B65G51/03Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04Arrangements of vacuum systems or suction cups
    • B65G2249/045Details of suction cups suction cups

Abstract

To deliver a substrate without causing placement misalignment and deformation.SOLUTION: A conveyance apparatus for conveying a substrate to a support part that a processing device for processing the substrate has, includes: a support device capable of supporting the substrate in a non-contact manner; a carrying-out device for carrying-out a first substrate processed by the processing device, and supported by the support part in the non-contact manner to a support device aligned in a predetermined direction from the upper part of the support part; and a carrying-in device for carrying-in a second substrate different from the first substrate supported in the non-contact manner by the support device onto the support part where the first substrate is carried-out.SELECTED DRAWING: Figure 22D

Description

The present invention relates to a transport apparatus, an exposure apparatus, and a device manufacturing method.
This application claims priority to US Provisional Application Nos. 61 / 305,355 and 61 / 305,439, filed February 17, 2010, the contents of which are incorporated herein by reference.

  In the process of manufacturing an electronic device such as a flat panel display, a large substrate processing apparatus such as an exposure apparatus or an inspection apparatus is used. In the exposure process and inspection process using these processing apparatuses, a transfer apparatus as disclosed in the following patent document for transferring a large substrate (for example, a glass substrate) to the processing apparatus is used.

JP 2001-100169 A

  In the above-described large substrate transport apparatus, when the substrate supported by the substrate supporting member is transferred to the substrate holding unit, the air layer is interposed between the substrate and the substrate holding unit, whereby the substrate after transfer is performed. In some cases, deformation may occur, or misalignment of the substrate may occur with respect to the placement position on the substrate holder. If mounting deviation or deformation occurs on the substrate after delivery, for example, in the exposure apparatus, problems of exposure failure such as the inability to perform predetermined exposure at an appropriate position on the substrate occur. When mounting displacement or deformation of the substrate occurs, for example, the process of the substrate may be delayed by, for example, exchanging the substrate again to solve the problem. In addition, if the transfer speed of the substrate is reduced, for example, so as not to leave the air layer after the transfer, there arises a problem that the processing of the substrate is further delayed.

  An aspect of the present invention is to provide a transfer apparatus, a transfer method, an exposure apparatus, and a device manufacturing method that can transfer a substrate without causing a placement deviation or deformation.

  According to the first aspect of the present invention, a gas is supplied to one surface of a substrate, and the first support portion capable of floatingly supporting the substrate via the gas, and the first surface capable of supporting the one surface of the substrate A driving unit for moving at least one of the two supporting units and the first and second supporting units and arranging the first and second supporting units in the first direction by bringing the first and second supports into close proximity or in contact with each other; There is provided a transfer device including: a transfer unit configured to move the substrate supported by one of the arranged first and second support units to the other side along the first direction.

  According to the second aspect of the present invention, a gas is supplied to one surface of the substrate, and the first support portion capable of floatingly supporting the substrate via the gas, and the first surface capable of supporting the one surface of the substrate A second drive unit configured to move at least one of the first and second supports and move the first and second supports closer to or in contact with each other in the first direction; A second drive unit configured to move at least one of the first and third support units and arrange the first and third support units in a second direction by bringing the first and third support units close to or in contact with each other; and the first drive unit A first transport unit configured to move the substrate supported by the second support arranged in the first support to the first support along the first direction; and the second driving unit The substrate supported by the first support arranged in the third support may be fronted along the second direction. Transport apparatus is provided comprising a second transfer unit for moving the third support part side.

  According to a third aspect of the present invention, there is provided a transfer method for transferring a substrate, comprising: a first support portion capable of floatingly supporting the substrate via a gas supplied to one surface of the substrate; and the one surface of the substrate Moving at least one of the supportable second supports and arranging the first and second supports close to or in contact with each other in a first direction; and Moving the substrate supported by one to the other side along the first direction.

  According to the fourth aspect of the present invention, at least one of a first support capable of floatingly supporting the substrate via a gas supplied to one surface of the substrate and a second support capable of supporting the one surface of the substrate And arranging the first and second supports close to or in contact with each other in a first direction, and the substrate supported by the second support arranged on the first support is Moving to the first support side along a first direction, and moving at least one of the first support and a third support supporting one surface of the substrate; Arranging supporting portions in a second direction by bringing the supporting portions close to or in contact with each other, and supporting the substrate supported by the first supporting portions arranged in the third supporting portion along the second direction as the third support And (c) moving to the department side.

  According to the fifth aspect of the present invention, a gas is supplied to one surface of a substrate, and a first support portion capable of floatingly supporting the substrate via the gas and a second support for supporting the one surface of the substrate A supporting portion, a driving portion moving at least one of the first and second supporting portions, and arranging the first and second supporting portions in proximity to or in contact with each other; (2) A transfer unit that moves the substrate supported by the support unit toward the first support unit along the arrangement direction, and the supply of the gas is stopped to place the substrate on the placement unit of the first support unit A lifting mechanism for supporting the substrate and lifting the substrate above the placement unit; and an unloading mechanism for unloading the substrate supported above the placement unit by the lifting mechanism from the first support unit. A transport device is provided.

  According to a sixth aspect of the present invention, there is provided a transfer method for transferring a substrate, comprising: a first support portion capable of floatingly supporting the substrate via a gas supplied to one surface of the substrate; and the one surface of the substrate Moving at least one of the supportable second supports, arranging the first and second supports close or in contact with each other, and the substrate supported by the arranged second supports; The substrate placed on the placement portion of the first support portion is supported by transferring to the first support portion side along the arrangement direction and stopping the supply of the gas, and the placement There is provided a transfer method including: lifting above a part; and unloading the substrate supported above the placement part from the first support part.

  According to a seventh aspect of the present invention, there is provided an exposure apparatus for exposing a substrate with exposure light, the exposure apparatus including the above-described transfer apparatus for holding the substrate and moving the substrate to the irradiation area of the exposure light. Is provided.

  According to an eighth aspect of the present invention, there is provided a method of transferring the pattern to the substrate using the exposure apparatus described above, and processing the substrate to which the pattern has been transferred based on the pattern. A device manufacturing method is provided.

  According to the aspect of the present invention, the substrate can be delivered without causing the mounting displacement or the deformation.

FIG. 1 is a cross-sectional plan view showing an overall outline of an exposure apparatus. It is an external appearance perspective view which shows the specific structure in a chamber. It is a figure which shows the periphery structure of a plate holder. It is a figure which shows the periphery structure of a plate holder. It is a figure which shows the principal part structure of a carrying-in part. It is a figure which shows the principal part structure of a carrying-in part. It is a figure which shows the principal part structure of a carrying out part. It is a figure which shows the principal part structure of a carrying out part. It is a figure explaining the delivery process of the board | substrate to the table for carrying in. It is explanatory drawing of the conveyance process of the board | substrate between a plate holder and a carrying out part. It is explanatory drawing of the conveyance process of the board | substrate between a plate holder and a carrying out part. It is a figure which shows the state which float-supported the board | substrate on the table for carrying in. FIG. It is a figure explaining the process of conveying the substrate on the table for carrying in. It is a figure explaining the process in which a board | substrate transfers to the plate holder side. It is a figure which shows the state in which the board | substrate was mounted on the plate holder. It is a figure explaining the delivery process of the board | substrate to the table for carrying out. It is a figure which shows the state which float-supported the board | substrate on the plate holder. It is a figure explaining conveyance of the substrate from a plate holder to the delivery part side. It is a figure explaining conveyance of the substrate from a plate holder to the delivery part side. It is a figure explaining conveyance of the substrate from a plate holder to the delivery part side. It is a figure explaining the operation | movement which carries out the board | substrate from a carrying out part. It is a figure which shows the structure of the carrying-in part which concerns on 2nd Embodiment. It is a figure which shows the structure of the carrying-in part which concerns on 2nd Embodiment. It is a figure explaining the composition which conveys a substrate to the plate holder side from a carrying in part. It is a figure for demonstrating the process of following FIG. It is a figure which shows the structure of the plate holder which concerns on 3rd Embodiment. It is a figure explaining the composition which conveys a substrate to the plate holder side from a carrying in part. It is a figure explaining the composition which conveys a substrate to the plate holder side from a carrying in part. It is a figure which shows the structure which concerns on 4th Embodiment. It is a figure explaining delivery operation | movement of the board | substrate which concerns on 4th Embodiment. It is a figure explaining delivery operation | movement of the board | substrate which concerns on 4th Embodiment. It is a figure explaining delivery operation | movement of the board | substrate which concerns on 4th Embodiment. It is a figure explaining delivery operation | movement of the board | substrate which concerns on 4th Embodiment. It is a perspective view which shows the structure inside the chamber which concerns on 5th Embodiment. It is a top view which shows schematic structure of a carrying in / out part. It is a top view which shows schematic structure of a carrying in / out part. It is a figure explaining the carrying in process of the board | substrate which concerns on 5th Embodiment. It is a figure explaining delivery of the board | substrate from the carrying in / out part to the plate holder side. It is a figure explaining delivery of the board | substrate from a plate holder to the carrying in / out part side. FIG. 1 is a cross-sectional plan view showing an overall outline of an exposure apparatus. It is an external appearance perspective view which shows the specific structure in a chamber. It is a figure which shows the periphery structure of a plate holder. It is a figure which shows the periphery structure of a plate holder. It is explanatory drawing of the conveyance process of the board | substrate between a plate holder and a carrying out part. It is explanatory drawing of the conveyance process of the board | substrate between a plate holder and a carrying out part. It is a figure which shows the state which float-supported the board | substrate on the table for carrying in. FIG. It is a figure explaining the process of conveying the substrate on the table for carrying in. It is a figure explaining the process in which a board | substrate transfers to the plate holder side. It is a figure for demonstrating the operation | movement of a carrying out robot. It is a front view explaining the operation | movement which carries out a board | substrate from a plate holder. It is a front view explaining the operation | movement which carries out a board | substrate from a plate holder. It is a side view explaining the operation | movement which carries out a board | substrate from a plate holder. It is a figure which shows the structure of the carrying-in part which concerns on 3rd Embodiment. It is a figure explaining the composition which conveys a substrate to the plate holder side from a carrying in part. It is a figure explaining the composition which conveys a substrate to the plate holder side from a carrying in part. It is a figure which shows the structure of the exposure apparatus main body which concerns on 4th Embodiment. It is a figure which shows the planar structure of a plate holder. It is a side sectional view in a plate holder. It is a side sectional view in a plate holder. It is a figure which shows the structure of a raising / lowering movement part. It is a figure explaining the composition which conveys a substrate to the plate holder side from a carrying in part. It is a figure explaining the composition which conveys a substrate to the plate holder side from a carrying in part. It is a figure which shows the state by which the board | substrate floats and is supported on the table for carrying in. FIG. It is a figure which shows the state which the contact part contacted the edge part of the board | substrate. It is explanatory drawing of the process of moving a board | substrate from the table for carrying in to a plate holder. It is a perspective view for demonstrating the operation | movement of a carrying out robot. It is explanatory drawing of the process of carrying out a board | substrate from a plate holder. It is explanatory drawing of the process of carrying out a board | substrate from a plate holder. It is explanatory drawing of the process of carrying out a board | substrate from a plate holder. It is a top view which shows the structure of the adsorption | suction mechanism which concerns on 5th Embodiment. It is a side view showing the composition of the adsorption mechanism concerning a 5th embodiment. It is a side view explaining the operation | movement which carries out a board | substrate from a plate holder. It is a side view explaining the operation | movement which carries out a board | substrate from a plate holder. It is a figure which shows the structure which concerns on the modification of an adsorption | suction mechanism. It is a figure which shows the structure which concerns on the modification of an adsorption | suction mechanism. It is a flowchart for demonstrating an example of the manufacturing process of a micro device.

  Embodiments of the present invention will be described with reference to the drawings. The present invention is not limited to this. In the following, an exposure apparatus is described which is provided with a transfer device according to the present invention and performs exposure processing for exposing a substrate coated with a photosensitive agent to a liquid crystal display device pattern, and a transfer method and device manufacturing according to the present invention An embodiment of the method is also described.

First Embodiment
FIG. 1 is a sectional plan view showing a schematic configuration of the exposure apparatus of the present embodiment. As shown in FIG. 1, the exposure apparatus 1 includes an exposure apparatus main body 3 that exposes a liquid crystal display device pattern on a substrate, a carry-in unit 4 and a carry-out unit 5, and these are highly cleaned. And in the chamber 2 adjusted to a predetermined temperature. In the present embodiment, the substrate is a large glass plate, and the size of one side thereof is, for example, 500 mm or more.

  FIG. 2 is an external perspective view showing a specific configuration in the chamber 2. As shown in FIG. 2, the exposure apparatus main body 3 includes an illumination system (not shown) that illuminates the mask M with exposure light IL, and a mask stage (not shown) that holds the mask M on which a liquid crystal display device pattern is formed. A projection optical system PL disposed below the mask stage, and a plate holder 9 as a substrate holder movably provided two-dimensionally on a base portion (not shown) disposed below the projection optical system PL. And a first moving mechanism 33 for holding the plate holder 9 and moving the plate holder 9 in the chamber 2.

  In the following description, it is assumed that two-dimensional movement of the plate holder 9 with respect to a base (not shown) provided in the chamber 2 is performed in a horizontal plane, and in this horizontal plane, the X axis is orthogonal to each other. And Y axis is set. The holding surface of the plate holder 9 with respect to the substrate P is parallel to the horizontal plane in a reference state (for example, a state when the substrate P is delivered). Further, the Z axis is set in the direction orthogonal to the X axis and the Y axis, and the optical axis of the projection optical system PL is parallel to the Z axis. The directions around the X axis, the Y axis, and the Z axis are referred to as the θX direction, the θY direction, and the θZ direction, respectively.

  The first moving mechanism 33 has a moving mechanism main body 35 and a holding portion 34 disposed on the moving mechanism main body 35 and holding the plate holder 9. The movement mechanism main body 35 is supported by a gas bearing in a non-contact manner on a guide surface (base portion) (not shown), and is movable in the X and Y directions on the guide surface. Based on such a configuration, the plate holder 9 is movable in a predetermined region of the guide surface on the light emission side (the image surface side of the projection optical system PL) while holding the substrate P.

  The movement mechanism main body 35 is movable in the XY plane on the guide surface by the operation of a coarse movement system including an actuator such as a linear motor, for example. The holding unit 34 is movable in the Z-axis, θX, and θY directions with respect to the moving mechanism main body 35 by the operation of a micromotion system including an actuator such as a voice coil motor, for example. Holding unit 34 holds the substrate P by operation of the substrate stage drive system including the coarse movement system and the fine movement system, and in six directions of the X axis, Y axis, Z axis, θX, θY, and θZ directions. It is movable.

  In the exposure apparatus 1, step-and-scan exposure is performed in a state where the rectangular substrate P is placed on the plate holder 9, and a plurality of patterns formed on the mask M are formed on the substrate P, for example, 4 The image is transferred sequentially to one exposure region (pattern transfer region). That is, in the exposure apparatus 1, the mask M is exposed via the drive system (not shown) by the controller (not shown) in a state where the slit-like illumination area on the mask M is illuminated by the exposure light IL from the illumination system. The pattern of the mask M on one exposure area on the substrate P by synchronously moving the mask stage to be held and the plate holder 9 to hold the substrate P in a predetermined scanning direction (here, the Y-axis direction). Are transferred, that is, scanning exposure is performed. The exposure apparatus 1 according to the present embodiment is a so-called multi-lens type scan in which the projection optical system PL has a plurality of projection optical modules, and the illumination system includes a plurality of illumination modules corresponding to a plurality of projection optical modules. It constitutes an exposure apparatus.

  After the scanning exposure of this one exposure area is completed, a stepping operation is performed to move the plate holder 9 in the X direction by a predetermined amount to the scanning start position of the next exposure area. Then, in the exposure apparatus main body 3, the pattern of the mask M is transferred to the four exposure regions sequentially by repeatedly performing such scanning exposure and stepping operation.

  As shown in FIG. 2, when a substrate P coated with a photosensitive agent is loaded in a coater / developer (not shown) disposed adjacent to the exposure apparatus 1 as shown in FIG. And a second moving mechanism 43 for moving the loading table 40. The loading unit 4 can adjust the temperature of the substrate P loaded onto the loading table 40.

  The second moving mechanism 43 has a moving mechanism main body 45 and a holding unit 44 disposed on the moving mechanism main body 45 and holding the loading table 40. The movement mechanism main body 45 is supported by a gas bearing in a noncontact manner on a guide surface (not shown), and is movable in the X and Y directions on the guide surface. Based on such a configuration, the loading table 40 can move in a predetermined area of the guide surface while holding the substrate P. The support of the moving mechanism main body 45 with respect to the guide surface (not shown) is not limited to the support by the gas bearing, and a known guide mechanism (drive mechanism with respect to the guide surface) different from the gas bearing can be used.

  The moving mechanism main body 45 has the same configuration as the moving mechanism main body 35, and can move in the XY plane on the guide surface. The holding portion 44 has the same configuration as the holding portion 34, and can move in the Z-axis, θX, and θY directions with respect to the moving mechanism main body 45. The holding unit 44 can move in six directions of the X axis, the Y axis, the Z axis, the θX, the θY, and the θZ while holding the substrate P.

  Further, as shown in FIG. 2, the unloading unit 5 supports the one surface (lower surface) of the substrate P when the substrate P subjected to the exposure processing is delivered by the exposure apparatus main body 3. And a third moving mechanism 53 for moving the unloading table 50.

  The third moving mechanism 53 has a moving mechanism main body 55, and a holding unit 54 disposed on the moving mechanism main body 55 and holding the unloading table 50. The moving mechanism main body 55 is supported by a gas bearing in a non-contact manner on a guide surface (not shown), and is movable in the X and Y directions on the guide surface. Based on such a configuration, the unloading table 50 is movable in a predetermined area of the guide surface while holding the substrate P.

  The moving mechanism main body 55 has the same configuration as the moving mechanism main bodies 35 and 45, and can move in the XY plane on the guide surface. The holding portion 54 has the same configuration as the holding portions 34 and 44, and can move in the Z-axis, θX, and θY directions with respect to the moving mechanism main body 55. The holding unit 54 can move in six directions of the X axis, the Y axis, the Z axis, the θX, the θY, and the θZ while holding the substrate P.

  Next, the peripheral configuration of the plate holder 9 will be described with reference to FIGS. 3A and 3B. FIG. 3A is a view showing a planar configuration of the plate holder 9, and FIG. 3B is a view showing a side configuration of the plate holder 9. As shown in FIG. 3A, the plate holder 9 is provided with a substrate placement portion 31 on which the substrate P is placed. The upper surface of the substrate mounting portion 31 is finished so that the substantial holding surface of the plate holder 9 with respect to the substrate P has a good flatness. Furthermore, a plurality of suction holes K1 are provided on the upper surface of the substrate mounting portion 31 for adhering the substrate P along the surface. Each suction hole K1 is connected to a vacuum pump (not shown).

  Further, a plurality of gas injection holes K2 for floatingly supporting the substrate P via the gas is provided on the upper surface of the substrate mounting portion 31 by injecting a gas such as air to the lower surface of the substrate P. . Each gas injection hole K2 is connected to a gas injection pump (not shown). The suction holes K1 and the gas injection holes K2 are arranged in a staggered manner.

  In the peripheral portion of the plate holder 9, a guide pin 36 for guiding the substrate P when the substrate P is loaded, and a positioning pin 37 for defining the position of the substrate P with respect to the substrate mounting portion 31 of the plate holder 9. And are provided. The guide pins 36 and the positioning pins 37 are movable together with the plate holder 9 in the exposure apparatus main body 3.

  The plate holder 9 is provided with the position detection sensor 19 which detects the relative position with the table 40 for carrying in, and the table 50 for carrying out in the side part 9a, as FIG. 3B shows. The position detection sensor 19 includes a distance detection sensor 19 a for detecting a relative distance to the loading table 40 and the unloading table 50, and a height for detecting a relative height to the loading table 40 and the unloading table 50. And a detection sensor 19b. A recessed portion is formed at a position corresponding to the position detection sensor 19 in the loading table 40 and the unloading table 50, whereby the position detection sensor 19 interferes with the loading table 40 and the unloading table 50. To prevent.

  Next, the main configuration of the loading unit 4 will be described with reference to FIGS. 4A and 4B. FIG. 4A is a plan view showing the peripheral configuration of the loading table 40, and FIG. 4B is a view showing a cross section taken along line AA of FIG. 4A.

  As shown in FIGS. 4A and 4B, the loading unit 4 is provided with a first transfer unit 42 that transfers the substrate P from the loading table 40 to the plate holder 9. The first transfer portion 42 includes a guide portion 42 a and an abutting portion 42 b that abuts on the substrate P.

  On the upper surface of the loading table 40, two groove-shaped recessed portions 40a are formed along one direction (Y direction shown in the same drawing). The guide portion 42a is provided in the recess 40a. The contact portion 42 b is attached to the guide portion 42 a in a state of being protruded from the upper surface of the loading table 40. The contact portion 42 b is formed of, for example, an elastic member such as rubber, and can reduce damage to the substrate P at the time of contact.

Further, a plurality of gas injection holes K3 for floatingly supporting the substrate P via the gas are provided on the upper surface of the loading table 40 by injecting a gas such as air to the lower surface of the substrate P.
Each gas injection hole K3 is connected to a gas injection pump (not shown).

Furthermore, a plurality of suction holes K4 are provided on the upper surface of the loading table 40 for bringing the substrate P into close contact with this surface. Each suction hole K4 is connected to a vacuum pump (not shown). The gas injection holes K3 and the suction holes K4 are arranged in a staggered manner along the Y direction.
The gas injection holes K3 and the suction holes K4 are not limited to the staggered arrangement, and may be arranged in various forms (for example, they may be arranged alternately along the Y direction). Further, the gas injection holes K3 and the suction holes K4 are not limited to be provided independently of each other, and the same holes may be used as the gas injection holes K3 and the suction holes K4. In this case, each hole may be connected to be able to switch between the gas injection pump and the vacuum pump as appropriate.

  Further, the loading table 40 is formed with a through hole 47 through which the substrate support pins of the vertical movement mechanism can be inserted for delivering the substrate P with a coater / developer (not shown) as described later. ing.

  Next, the main configuration of the unloading unit 5 will be described with reference to FIGS. 5A and 5B. As shown in FIGS. 5A and 5B, the unloading unit 5 is provided with a second transfer unit 52 that transfers the substrate P from the plate holder 9 to the unloading table 50. The second transfer unit 52 includes a guide unit 52 a and a suction unit 52 b that holds the substrate P by suction.

  On the upper surface of the unloading table 50, two groove-shaped concave portions 50a formed along one direction (Y direction shown in the same drawing) are formed. The guide portion 52a is provided in the recess 50a. The suction portion 52 b is attached to the guide portion 52 a in a state of being protruded from the upper surface of the unloading table 50. The suction unit 52 b includes a vacuum suction pad that holds the substrate P by suction, for example, by vacuum suction.

  Further, the suction portion 52b is provided with a contact portion 58 which is in contact with the substrate P pushed out of the plate holder 9 at the time of unloading the substrate. The contact portion 58 is made of, for example, an elastic member such as rubber.

Further, a plurality of gas injection holes K5 for floatingly supporting the substrate P via the gas are provided on the upper surface of the unloading table 50 by injecting a gas such as air to the lower surface of the substrate P.
Each gas injection hole K5 is connected to a gas injection pump (not shown).

  Furthermore, a plurality of suction holes K6 are provided on the upper surface of the unloading table 50 for bringing the substrate P into close contact with this surface. Each suction hole K6 is connected to a vacuum pump (not shown). The gas injection holes K5 and the suction holes K6 are arranged in a staggered manner.

  Further, as described later, through holes 57 are formed in the unloading table 50, through which the substrate support pins of the vertical movement mechanism can be inserted for transferring the substrate P with a coater / developer (not shown). ing.

  Next, the operation of the exposure apparatus 1 will be described with reference to FIGS. Specifically, the delivery operation of the substrate P between the loading unit 4 and the plate holder 9 and the delivery operation of the substrate P between the plate holder 9 and the unloading unit 5 will be mainly described. In the present embodiment, the loading table 40 of the loading unit 4 and the unloading table 50 of the unloading unit 5 are disposed at different positions in the same horizontal plane. That is, the loading table 40 and the unloading table 50 are disposed at positions not overlapping with each other in a plan view (a view from the + Z direction shown in FIG. 2).

  First, a substrate P coated with a photosensitive agent is loaded into the loading unit 4 by a coater / developer (not shown). At this time, the vertically moving mechanism 49 located below the loading table 40 arranges the substrate support pins 49 a above the loading table 40 via the through holes 47. Subsequently, the arm portion 48 of the coater developer (not shown) is inserted between the substrate support pins 49a as shown in FIG. The arm portion 48 descends to deliver the substrate P to the substrate support pins 49 a, and then retracts from the loading unit 4. The vertical movement mechanism 49 lowers the substrate support pin 49a supporting the substrate P, whereby the loading operation of the substrate P onto the loading table 40 is completed. Thereafter, by driving the vacuum pump, the substrate P is adsorbed and held on the upper surface of the loading table 40 through the suction hole K4.

  Subsequently, as shown in FIG. 7A, the plate holder 9 moves so as to approach the loading table 40 of the loading unit 4. Specifically, the first moving mechanism 33 arranges the plate holder 9 and the loading table 40 in a state in which the plate holder 9 and the loading table 40 are in close proximity to each other in the Y direction. Here, the state in which the plate holder 9 and the loading table 40 are in proximity means a state in which the plate P is separated by a distance such that the movement of the substrate P is smoothly performed when the substrate P described later is delivered.

  In addition, when arranging the loading table 40 and the plate holder 9, the second moving mechanism 43 can also be driven. In this way, the loading table 40 and the plate holder 9 can be moved to the delivery position of the substrate P in a short time, and the time required for the loading operation of the substrate P can be shortened. In this case, the unloading table 50 is retracted to a position not interfering with the loading table 40.

  Further, since the substrate P is held by suction on the upper surface of the loading table 40 through the suction hole K4, the substrate P is prevented from moving on the loading table 40 when the second moving mechanism 43 is driven. be able to.

  In the present embodiment, as shown in FIG. 7B, the substrate P is disposed higher than the plate holder 9 when the plate holder 9 and the loading table 40 are brought close to each other. That is, the first moving mechanism 33 brings the plate holder 9 close to the loading table 40 such that the upper surface of the loading table 40 supporting the substrate P is higher than the upper surface of the plate holder 9. The loading table 40 can also be raised by the second moving mechanism 43 so that the top surface of the loading table 40 is higher than the top surface of the plate holder 9.

  The first moving mechanism 33 can also be arranged in a state in which the plate holder 9 and the loading table 40 are in contact with each other. In this way, the substrate P can be smoothly delivered between the plate holder 9 and the loading table 40 described later.

  Subsequently, as shown in FIG. 8, the loading table 40 sprays gas from the plurality of gas injection holes K3 formed on the upper surface, and supports the substrate P in a floating state via the gas. On the other hand, when receiving the substrate P, the plate holder 9 injects gas from the plurality of gas injection holes K2 formed on the upper surface.

  The loading unit 4 brings the contact portion 42 b into contact with one end portion of the substrate P, as shown in FIG. 9, in a state where the substrate P is floated and supported on the loading table 40. The contact portion 42 b moves the substrate P toward the plate holder 9 by moving along the guide portion 42 a in the recess 40 a.

  Since the substrate P is in a state of floating on the loading table 40, the contact portion 42b can smoothly slide the substrate P to the plate holder 9 side. The upper surface of the plate holder 9 floats and supports the substrate P as described above. Here, the gas injected from the gas injection holes K3 and K2 may have directivity.

  The board | substrate P which slides the upper surface of the table 40 for carrying in by the contact part 42b will be smoothly transferred to the upper surface of the plate holder 9, as FIG. 10 shows. In the present embodiment, since the upper surface of the loading table 40 is higher than the upper surface of the plate holder 9, the substrate P can smoothly transfer onto the plate holder 9 without contacting the side surface of the plate holder 9. it can.

  As shown in FIG. 9, the substrate P slides in a state where the position in the X direction in the figure is defined by the guide pins 36 provided on the peripheral portion of the plate holder 9. The contact portion 42 b moves the substrate P until it abuts on the positioning pin 37 provided on the downstream side in the substrate transport direction in the plate holder 9. The position of the substrate P in the X direction in the figure is defined by the guide pins 36, and the position in the Y direction in the figure is defined by being sandwiched between the positioning pins 37 and the contact portions 42b. The plate holder 9 stops the gas injection from the gas injection holes K2. The board | substrate P is mounted in the state aligned with respect to the board | substrate mounting part 31, as shown in FIG.

  By the way, when mounting a board | substrate to a plate holder conventionally, there existed a possibility that the mounting shift | offset | difference of a board | substrate (position shift from a predetermined mounting position) and a deformation | transformation of a substrate may arise. As one of the causes of this placement deviation, for example, it is conceivable that the substrate is suspended by a thin air layer formed between the substrate and the plate holder immediately before the placement of the substrate. In addition, as one of the causes of the deformation of the substrate, for example, it is conceivable that the substrate is in a state of being inflated by the presence of air stagnation between the substrate and the plate holder after the substrate is placed.

  On the other hand, in the present embodiment, since the substrate P is transported in a floating state by the jet of gas as described above, it is delivered to the plate holder 9 in a state of high flatness without distortion. In addition, since the substrate P is placed on the substrate placement unit 31 from the height at which the substrate P is floated and supported, it is possible to prevent the occurrence of air accumulation or an air layer between the substrate P and the substrate placement unit 31. . Therefore, the substrate P is prevented from being in a bulging state, and the occurrence of the mounting displacement or the deformation of the substrate P can be prevented. Therefore, the substrate P can be placed at a predetermined position with respect to the plate holder 9 in a state of high flatness. Thereafter, the vacuum pump is driven, whereby the substrate P is adsorbed and held on the upper surface of the substrate mounting portion 31 via the suction hole K1.

After placing the substrate P on the plate holder 9, the mask M is illuminated by the exposure light IL from the illumination system. The pattern of the mask M illuminated by the exposure light IL is projected and exposed onto the substrate P mounted on the plate holder 9 through the projection optical system PL.
In the exposure apparatus 1, since the substrate P can be favorably placed on the plate holder 9 as described above, predetermined exposure can be performed with high accuracy at an appropriate position on the substrate P, and the reliability can be improved. High exposure processing can be realized.

  In the present embodiment, while the substrate P is being subjected to the exposure processing, or while the substrate P after the exposure processing is being transported to the unloading unit 5 as described later, the photosensitive agent is removed by the coater developer (not shown). The next applied substrate P can be placed on the loading table 40 of the loading unit 4.

Next, the unloading operation of the substrate P from the plate holder 9 after the end of the exposure processing will be described.
When the exposure processing is completed, the plate holder 9 moves so as to approach the unloading table 50 of the unloading unit 5 as shown in FIG. Specifically, the first moving mechanism 33 arranges the plate holder 9 and the unloading table 50 in a state in which the plate holder 9 and the unloading table 50 approach each other in the Y direction. At this time, since the substrate P is held by suction via the suction holes K1, the substrate P can be prevented from moving on the substrate mounting portion 31 when the first moving mechanism 33 is driven.

  In addition, when arranging the unloading table 50 and the plate holder 9, the third moving mechanism 53 can also be driven. In this way, the loading table 40 and the plate holder 9 can be moved to the delivery position of the substrate P in a short time, and the time required for the unloading operation of the substrate P can be shortened. In this case, the loading table 40 is retracted to a position not interfering with the unloading table 50.

  In the present embodiment, when bringing the plate holder 9 and the unloading table 50 close to each other, similarly to bringing the plate holder 9 and the loading table 40 close to each other, the substrate P is disposed higher than the plate holder 9 corresponding to the transfer destination of the substrate P. doing. That is, the first moving mechanism 33 brings the plate holder 9 close to the unloading table 50 such that the upper surface of the plate holder 9 supporting the substrate P is higher than the upper surface of the unloading table 50. The unloading table 50 can also be lowered by the third moving mechanism 53 such that the upper surface of the unloading table 50 is lower than the upper surface of the plate holder 9.

  The first moving mechanism 33 can also be arranged in a state in which the plate holder 9 and the unloading table 50 are in contact with each other. In this way, the substrate P can be smoothly delivered between the plate holder 9 and the unloading table 50 described later.

  The plate holder 9 stops the drive of the vacuum pump, and releases the suction holding of the substrate P on the substrate placement unit 31 via the suction hole K1. Subsequently, as shown in FIG. 13, the plate holder 9 injects gas from the plurality of gas injection holes K2 formed on the upper surface of the substrate mounting portion 31, and lifts the substrate P through the gas. To support. On the other hand, when receiving the substrate P, the unloading unit 5 jets gas from the plurality of gas injection holes K5 formed on the upper surface of the unloading table 50.

  The unloading unit 5 moves the suction unit 52b of the second transfer unit 52 along the guide unit 52a to the side of the substrate P supported by floating on the substrate mounting unit 31 of the plate holder 9. The positioning pin 37 presses the end portion of the substrate P floating above the substrate mounting portion 31 as shown in FIG. 14A. As a result, the substrate P floating on the substrate mounting portion 31 slides toward the unloading table 50, and contacts the contact portion 58 attached to the suction portion 52b as shown in FIG. 14B. By sliding the substrate P toward the contact portion 58 using the positioning pins 37 in this manner, it is not necessary to move the suction portion 52b along the guide portion 52a to a position on the plate holder 9 facing the substrate P. . After the end portion of the substrate P comes into contact with the contact portion 58, the suction portion 52b holds the substrate P by suction and moves along the guide portion 52a along the Y direction in the figure as shown in FIG. 14C.

At this time, since the substrate P is supported in a floating state on the plate holder 9, the suction unit 52b can smoothly slide the substrate P toward the unloading table 50 side. In addition, the upper surface of the unloading table 50 floats and supports the substrate P as described above.
Here, the gas injected from the gas injection holes K2 and K5 may have directivity.

  The substrate P sliding on the upper surface of the substrate placement unit 31 by the movement of the suction unit 52 b smoothly transfers to the upper surface of the unloading table 50. In this embodiment, since the upper surface of the plate holder 9 is higher than the upper surface of the unloading table 50, the substrate P smoothly transfers onto the unloading table 50 without contacting the side surface of the unloading table 50. be able to.

  After the movement of the substrate P by the adsorbing portion 52b is completed, the unloading table 50 stops the gas injection from the gas injection hole K5, and adsorbs and holds the substrate P through the suction hole K6. The unloading unit 5 drives the third moving mechanism 53 in a state where the substrate P is held by suction, and moves the unloading table 50 to the unloading position of the substrate P.

  After transferring the substrate P from the plate holder 9 to the unloading unit 5, the exposure apparatus 1 moves the plate holder 9 so as to approach the loading table 40 of the loading unit 4. Then, similarly, the substrate P can be delivered between the loading table 40 and the plate holder 9, and the exposure process can be performed on the substrate P placed on the plate holder 9.

  In the present embodiment, while the next substrate P is carried in from the carry-in unit 4 to the plate holder 9, or while the exposure process is performed on the next substrate P, the substrate P is placed on the carry-out table 50. To carry out the exposed substrate P. At this time, the vertically moving mechanism 60 located below the unloading table 50 arranges the substrate support pins 60 a above the unloading table 50 via the through holes 57. As a result, the substrate P is supported by the substrate support pins 60 a and held above the unloading table 50. Subsequently, the arm portion 48 of the coater developer (not shown) is inserted between the substrate support pins 60a as shown in FIG. Thereafter, the substrate P is delivered to the arm portion 48 by lowering the substrate support pin 60a. The arm unit 48 moves the substrate P into a coater / developer (not shown) to perform development processing.

  As described above, the plate holder 9 alternately accesses the transfer unit 4 and the transfer unit 5 by moving in the same horizontal plane (XY plane) with respect to the transfer unit 4 and the discharge unit 5 to perform the transfer operation of the substrate P with respect to the exposure apparatus main body 3. It can be carried out. In the present embodiment, the plate holder 9 is moved in the arrangement direction of the loading and unloading portions 4 and 5, so that the plate holder 9 and the loading and unloading portions 4 and 5 are arranged in proximity or in contact with each other. Can do in a short time. Therefore, the processing time (so-called tact) associated with the loading and unloading operation of the substrate P can be shortened.

  According to the present embodiment, since the substrate P supported by floating can be transported from the loading unit 4 to the plate holder 9 by sliding, air stagnation or air may occur between the substrate P and the substrate mounting unit 31. It is prevented that a layer arises and generation | occurrence | production of the mounting shift | offset | difference of board | substrate P, or a deformation | transformation can be prevented. Therefore, highly reliable exposure processing can be performed.

  In the first embodiment, when the substrate P is transported from the loading table 40 to the plate holder 9, the upper surface of the loading table 40 can be inclined. Specifically, the holding portion 44 of the second moving mechanism 43 moves the upper surface of the loading table 40 for supporting the substrate P in a state of being floated by gas injection from the gas injection hole K3 toward the plate holder 9 side (θY direction). Tilt it. Thereby, the substrate P can be moved to the plate holder 9 side by utilizing the weight of the substrate P.

  Further, when the substrate P is transported from the plate holder 9 to the unloading table 50, the upper surface of the plate holder 9 can be inclined. Specifically, the holding portion 34 of the first moving mechanism 33 inclines the upper surface of the plate holder 9 supporting the substrate P in the state of floating by the gas injection from the gas injection hole K2 toward the unloading table 50 side (θY direction) Let Thus, the substrate P can be moved to the side of the unloading table 50 by using the weight of the substrate P.

Second Embodiment
Subsequently, a configuration according to a second embodiment of the present invention will be described. In the present embodiment, the same components as those of the first embodiment are denoted by the same reference numerals, and the description thereof is omitted. The second embodiment is different from the first embodiment in the configuration of the first transfer unit 149 in the loading unit 104.

  16A and 16B are diagrams showing the configuration of the loading unit 104 according to the present embodiment, FIG. 16A is a plan view of the loading unit 104, and FIG. 16B is an A-in FIG. 16A of the loading unit 104. It is a figure which shows the side cross section by A line arrow.

  As shown in FIGS. 16A and 16B, the first transfer unit 149 of the loading unit 104 according to the present embodiment has a roller mechanism 148 instead of a configuration in which it floats and supports by injecting a gas onto one surface of the substrate P. doing.

  As shown in FIG. 16A, a plurality of notches 141 are formed on one end side of the loading table 140. The roller 142 which comprises the said roller mechanism 148 is rotatably supported by the axis | shaft 143 at each of this notch 141, and the roller 142 is autorotatable by the drive mechanism not shown. As shown in FIG. 16B, the roller mechanism 148 is configured such that the roller 142 can contact or move away from the substrate P.

  Based on such a configuration, the roller mechanism 148 rotates the substrate P in a predetermined direction while bringing the plurality of rollers 142 into contact with the lower surface of the substrate P supported on the loading table 140, thereby the plate holder 9. You can move to the side. As a forming material of the roller 142, for example, an elastic member such as rubber that generates a large frictional force with the substrate P can be used. By forming the roller 142 using such an elastic member, it is possible to prevent damage (such as a scratch) to the substrate P. Further, only the suction hole K4 is provided on the upper surface of the loading table 140.

  Next, the operation of the exposure apparatus 1 in the present embodiment will be described. Specifically, the transfer operation of the substrate P between the loading unit 104 and the plate holder 9 which is different from the first embodiment will be described.

  First, the substrate P coated with a photosensitive agent is carried into the loading unit 104 by a coater / developer (not shown). The substrate P is adsorbed and held on the upper surface of the loading table 140 via the suction hole K4. Thereafter, the plate holder 9 moves so as to approach the loading table 140 (see FIG. 7A).

  Also in this embodiment, it is desirable to bring the plate holder 9 close to the loading table 140 so that the upper surface of the loading table 140 supporting the substrate P is higher than the upper surface of the plate holder 9 (see FIG. 7B) .

  However, in the present embodiment, even if the upper surface of the loading table 140 is lower than the upper surface of the plate holder 9, the substrate mounted on the roller 142 if at least the upper surface of the roller 142 is higher than the upper surface of the plate holder 9. P can be reliably transported from the loading table 40 side to the plate holder 9 side.

  Subsequently, as shown in FIG. 17, the loading table 140 brings the rollers 142 of the roller mechanism 148 into contact with the lower surface of the substrate P, and rotates the rollers 142 in a predetermined direction. On the other hand, when receiving the substrate P, the plate holder 9 injects gas from the plurality of gas injection holes K2 formed on the upper surface. The substrate P slides smoothly toward the plate holder 9 by the frictional force with the roller 142.

Here, in the plate holder 9 which is the transfer destination of the substrate P, the substrate P is floatably supported on the substrate mounting portion 31 by injecting the gas from the gas injection holes K2.
Therefore, the substrate P sliding on the upper surface of the loading table 140 by the roller mechanism 148 smoothly transfers to the upper surface of the plate holder 9.

  The substrate P slides in a state in which the position in the X direction in the figure is defined by the guide pins 36 provided on the peripheral portion of the plate holder 9, as shown in FIG. The roller mechanism 148 moves the substrate P until it abuts against the positioning pin 37 provided on the downstream side of the plate holder 9 in the substrate transfer direction. The position of the substrate P in the X direction in the figure is defined by the guide pins 36, and the position in the Y direction in the figure is defined by being sandwiched between the positioning pins 37 and the contact portions 42b. The plate holder 9 stops the gas injection from the gas injection holes K3. Thus, the substrate P is placed in a state of being aligned with the substrate placement unit 31.

Also in the present embodiment, since the substrate P is transported in a floating state by the jet of gas as described above, it can be delivered to the plate holder 9 in a state of high flatness without distortion and the substrate P and the substrate mounting It is prevented that an air reservoir or an air layer is generated between the holder 31 and the holder 31. Therefore, the substrate P can be placed at a predetermined position with respect to the plate holder 9 in a state of high flatness. Therefore, predetermined exposure can be performed with high accuracy at an appropriate position on the substrate P, and highly reliable exposure processing can be performed.
In addition, about the carrying out operation | movement of the board | substrate P from the plate holder 9 after completion | finish of exposure processing, since it is the same as that of 1st Embodiment, the description shall be abbreviate | omitted.

  Although the case where the roller mechanism 148 is adopted as the first transfer unit 149 of the loading unit 104 has been described in the above description, the roller mechanism can also be adopted as the second transfer unit 52 of the unloading unit 5. Also, as in the first embodiment, a configuration may be adopted in which the substrate P is supported by floating on the loading table 140 by gas injection. According to this configuration, since the substrate P is transported by the roller mechanism 148 in a floating state, the substrate P can be transported smoothly to the plate holder 9 side.

Third Embodiment
Subsequently, a configuration according to a third embodiment of the present invention will be described. In the present embodiment, the same components as those of the first and second embodiments are denoted by the same reference numerals, and the description thereof is omitted. The third embodiment is mainly different in that the plate holder 9 is provided with a first transfer mechanism.

  FIG. 19 is a view showing a configuration of a plate holder 109 according to the present embodiment. The plate holder 109 according to the present embodiment includes a first transfer unit 249 for transferring the substrate P from the loading table 40 to the plate holder 9 as shown in FIG. The first transfer unit 249 includes an adsorption unit 250 that adsorbs and holds both sides in the width direction of the substrate P. The suction unit 250 is freely movable in the XY plane along the surface direction of the substrate P.

  Further, in the present embodiment, a position detection sensor 252 for detecting the position of the substrate P carried in by the first transfer unit 249 with respect to the substrate placement unit 31 is provided at the periphery of the plate holder 9. As the position detection sensor 252, for example, a potentiometer can be exemplified, and in the present invention, either a contact type or non-contact type meter can be used.

  The adsorption unit 250 adsorbs and holds the end of the substrate P floated and supported on the loading table 40 by gas injection from the gas injection holes K3, and moves from the loading table 40 to the plate holder 9 as shown in FIG. 20A. And transport. On the other hand, when receiving the substrate P, the plate holder 9 injects gas from the plurality of gas injection holes K2 formed on the upper surface. At this time, the gas injected from the gas injection holes K2 and K3 may have directivity.

The adsorption unit 250 can detect the positional deviation of the substrate P relative to the substrate placement unit 31 by bringing the edge of the substrate P into contact with the position detection sensor 252 as shown in FIG. 20B. . The suction unit 250 is configured to be driven based on the detection result of the position detection sensor 252.
Therefore, the exposure apparatus 1 can correct the position of the substrate P held by the suction unit 250 with respect to the substrate placement unit 31 based on the detection result of the position detection sensor 252.

Also in the present embodiment, since the substrate P is transported in a floating state by the jet of gas as described above, it can be delivered to the plate holder 9 in a state of high flatness without distortion and the substrate P and the substrate mounting It is prevented that an air reservoir or an air layer is generated between the holder 31 and the holder 31. Therefore, the substrate P can be placed at a predetermined position with respect to the plate holder 9 in a state of high flatness. Therefore, predetermined exposure can be performed with high accuracy at an appropriate position on the substrate P, and highly reliable exposure processing can be performed.
In addition, about the carrying out operation | movement of the board | substrate P from the plate holder 9 after completion | finish of exposure processing, since it is the same as that of 1st Embodiment, the description shall be abbreviate | omitted.

Fourth Embodiment
Subsequently, a configuration according to a fourth embodiment of the present invention will be described. In the present embodiment, the same components as those of the first embodiment are denoted by the same reference numerals, and the description thereof is omitted. The fourth embodiment is mainly different from the first embodiment in that the loading table 40 and the unloading table 50 are disposed at mutually overlapping positions in a plan view, as shown in FIG. That is, when the substrate P is transferred to and from the plate holder 9, the loading table 40 and the unloading table 50 move up and down with respect to the plate holder 9.

Hereinafter, the delivery operation of the substrate P in the present embodiment will be described with reference to FIGS. 22A, 22B, and 22C.
After the exposure processing on the substrate P placed on the plate holder 9 is completed, the unloading table 50 is arranged in the state of being in proximity to the plate holder 9 along the Y direction. In the present embodiment, as shown in FIG. 22A, the unloading table 50 waiting at the lower side of the plate holder 9 is raised to a position where the substrate P can be received. At this time, the upper surface of the unloading table 50 can be disposed lower than the upper surface of the plate holder 9 (see FIG. 13).

  In addition, while the exposure process with respect to the board | substrate P is performed, the following board | substrate P is delivered to the table 40 for carrying in from the coater developer (not shown). Thus, while the substrate P is being unloaded from the plate holder 9 to the unloading table 50, the loading table 40 stands by above the plate holder 9 in a state where the next substrate P is placed.

  The plate holder 9 stops the drive of the vacuum pump, and releases the suction holding of the substrate P on the substrate placement unit 31 via the suction hole K1. Subsequently, the plate holder 9 injects a gas from the gas injection holes K2, and supports the substrate P in a floating state via the gas (see FIGS. 14A to 14C). On the other hand, when receiving the substrate P, the unloading unit 5 jets gas from the plurality of gas injection holes K5 formed on the upper surface of the unloading table 50. At this time, the gas injected from the gas injection holes K2 and K5 may have directivity.

  As shown in FIG. 22B, the unloading unit 5 moves the substrate P held by the suction unit 52b along the Y direction in the drawing, as in the first embodiment. At this time, since the substrate P is supported in a floating state on the plate holder 9, the substrate P slides smoothly on the unloading table 50. In addition, the upper surface of the unloading table 50 floats and supports the substrate P as described above. Therefore, the substrate P smoothly transfers onto the upper surface of the unloading table 50.

  After the movement of the substrate P is completed, the carry-out table 50 stops the gas injection from the gas injection hole K5, and adsorbs and holds the substrate P through the suction hole K6. The unloading table 50 moves the substrate P downward as shown in FIG. 22C in a state where the substrate P is held by suction. In the case where the size of the substrate P is large and placed in a state of protruding from the upper surface of the unloading table 50, the unloading table 50 is from the plate holder 9 so that the substrate P does not interfere with the plate holder 9. In the state of being retracted in the + Y direction in FIG.

  On the other hand, the unloading table 50 starts the lowering operation, and as shown in FIG. 22C, the loading table 40 waiting above the plate holder 9 reaches a position where the substrate P can be delivered to the plate holder 9. Go down. As a result, the plate holder 9 and the loading table 40 are arranged in proximity to each other along the Y direction. At this time, the upper surface of the loading table 40 can be disposed lower than the upper surface of the plate holder 9 (see FIG. 8).

  The loading table 40 injects gas from the plurality of gas injection holes K3 formed on the upper surface, and supports the substrate P in a floating state via the gas. On the other hand, when receiving the substrate P, the plate holder 9 injects gas from the plurality of gas injection holes K2 formed on the upper surface. At this time, the gas injected from the gas injection holes K2 and K3 may have directivity.

  The loading unit 4 brings the contact portion 42 b into contact with one end of the substrate P in a state where the substrate P is supported on the loading table 40 in a floating manner. The contact portion 42b moves the substrate P toward the plate holder 9 by moving along the guide portion 42a in the recess 40a (see FIGS. 9 and 10).

  Since the substrate P is in the state of floating on the loading table 40, it slides smoothly to the plate holder 9 side. Further, since the upper surface of the plate holder 9 floats and supports the substrate P as described above, the substrate P can be smoothly transferred from the loading table 40 to the plate holder 9 as shown in FIG. 22D. It becomes.

  The substrate P can be placed in a state of being aligned at a predetermined position with respect to the substrate placement unit 31 by the guide pins 36 and the positioning pins 37 as in the first embodiment (see FIG. 9). Then, exposure processing is performed on the substrate P.

  In the present embodiment, while the substrate P is being carried in from the carry-in unit 4 to the plate holder 9, or during the exposure process on the substrate P, the substrate P after the exposure processing placed on the unloading table 50 is unloaded. .

  In the present embodiment, the substrate P is carried out with respect to the exposure apparatus main body 3 by moving the loading unit 4 and the unloading unit 5 in the height direction (Z direction) relative to the plate holder 9 and accessing alternately in this manner. Input operation can be performed. Further, the loading unit 4 and the unloading unit 5 stand by above the plate holder 9 when not in use, and can access the plate holder 9 by moving up and down, respectively. Processing time (so-called tact) can be shortened.

  In the above embodiment, the first direction in which the loading table 40 and the plate holder 9 are arranged and the second direction in which the unloading table 50 and the plate holder 9 are arranged are parallel to each other. However, the present invention is not limited to this, and the present invention is also applicable to the case where the first direction and the second direction are different (for example, orthogonal) to each other.

Fifth Embodiment
Subsequently, a configuration according to a fifth embodiment of the present invention will be described. In the present embodiment, the same components as those of the first embodiment are denoted by the same reference numerals, and the description thereof is omitted. The fifth embodiment is mainly different in that a loading / unloading unit functioning as a loading / unloading unit is provided.

FIG. 23 is a perspective view showing the configuration inside the chamber, and FIGS. 24A and 24B are plan views showing a schematic configuration of the loading / unloading unit 400. FIG.
As shown in FIG. 23, the loading / unloading unit 400 includes a substrate mounting table 401 and a moving mechanism 402 for moving the substrate mounting table 401. The moving mechanism 402 has the same configuration as the first and second moving mechanisms 33 and 43 in the first embodiment. Based on such a configuration, the substrate mounting table 401 can move within a predetermined region of the guide surface on the light emission side (image surface side of the projection optical system PL) while holding the substrate P. . The substrate mounting table 401 is also movable along the Z-axis direction. Therefore, the substrate mounting table 401 functions as a loading table and a unloading table.

  As shown in FIGS. 24A and 24B, the loading / unloading unit 400 includes a transfer unit 405 that transfers the substrate P from the substrate mounting table 401 to the plate holder 9. The transfer unit 405 includes a guide unit 406 and a suction unit 408 that holds the substrate P by suction.

  On the upper surface of the substrate mounting table 401, two groove-shaped concave portions 401a formed along one direction (Y direction shown in the same drawing) are formed. The guide portion 406 is provided in the recess 401 a. The suction portion 408 is attached to the guide portion 406 in a state of protruding from the upper surface of the substrate mounting table 401. The suction unit 408 includes a vacuum suction pad that holds the substrate P by suction, for example, by vacuum suction.

  Further, a plurality of gas injection holes K7 for floatingly supporting the substrate P via the gas are provided on the upper surface of the substrate mounting table 401 by injecting a gas such as air to the lower surface of the substrate P. . Each gas injection hole K7 is connected to a gas injection pump (not shown). Furthermore, a plurality of suction holes K8 are provided on the upper surface of the substrate mounting table 401 for bringing the substrate P into close contact with this surface. Each suction hole K8 is connected to a vacuum pump (not shown). The gas injection holes K7 and the suction holes K8 are arranged in a staggered manner.

  Further, the substrate mounting table 401 is formed with a through hole 407 through which the substrate support pins of the vertical movement mechanism can be inserted for delivering the substrate P with a coater / developer (not shown) as described later. It is done.

  The plate holder 9 is provided with the above-mentioned position detection sensor 19 for detecting the relative position with the substrate mounting table 401 on the side surface portion as in the above-described embodiment. Position detection sensor 19 includes a distance detection sensor 19 a for detecting a relative distance to substrate mounting table 401 and a height detection sensor 19 b for detecting a relative height with respect to substrate mounting table 401. (See Figure 3B).

  Next, the transfer operation of the substrate P between the loading / unloading unit 400 and the plate holder 9 will be described with reference to the drawings. First, the substrate P coated with the photosensitive agent is carried into the carrying-in / out unit 400 by a coater / developer (not shown). At this time, the vertical movement mechanism 409 located below the substrate mounting table 401 places the substrate support pins 410 above the substrate mounting table 401 via the through holes 407. Subsequently, the arm portion 48 of the coater developer (not shown) is inserted between the substrate support pins 410 as shown in FIG. The arm unit 48 descends to deliver the substrate P to the substrate support pins 410, and then retracts from the loading / unloading unit 400. The vertical movement mechanism 409 lowers the substrate support pin 410 supporting the substrate P, thereby completing the operation of loading the substrate P onto the substrate mounting table 401. Thereafter, by driving the vacuum pump, the substrate P is adsorbed and held on the upper surface of the substrate mounting table 401 through the suction hole K8.

  Subsequently, the plate holder 9 moves so as to approach the substrate mounting table 401 of the loading / unloading unit 400. When arranging the substrate mounting table 401 and the plate holder 9, the substrate mounting table 401 and the plate holder 9 are moved to the delivery position of the substrate P in a short time by driving the transfer unit 405. The time required for the loading operation may be shortened. In this case, since the substrate P is held by suction on the upper surface of the substrate mounting table 401 via the suction hole K8, the substrate P is prevented from moving on the substrate mounting table 401 when the transfer unit 405 is driven. Ru.

  In the present embodiment, as shown in FIG. 26, the plate holder 9 approaches the substrate mounting table 401 so that the upper surface of the substrate mounting table 401 supporting the substrate P is higher than the upper surface of the plate holder 9. Do. In addition, by arranging the plate holder 9 and the substrate mounting table 401 in contact with each other, the moving distance of the substrate P may be shortened and delivery may be performed more smoothly.

Subsequently, as shown in FIG. 26, the substrate mounting table 401 injects gas from the plurality of gas injection holes K7 formed on the upper surface, and supports the substrate P in a floating state via the gas. .
On the other hand, when receiving the substrate P, the plate holder 9 injects gas from the plurality of gas injection holes K2 formed on the upper surface. At this time, the gas injected from the gas injection holes K2 and K7 may have directivity.

  In a state where the substrate P is floated and supported on the substrate mounting table 401, the loading / unloading unit 400 sucks and holds one end portion of the substrate P by the suction unit 408. The suction unit 408 moves the substrate P toward the plate holder 9 by moving along the guide unit 406 in the recess 401 a (see FIGS. 24A and 24B).

  Since the substrate P is in a state of floating on the substrate mounting table 401, the suction unit 408 can smoothly slide the substrate P to the plate holder 9 side. Further, the upper surface of the plate holder 9 floats and supports the substrate P as described above.

  Therefore, the substrate P sliding on the upper surface of the substrate mounting table 401 by the suction unit 408 smoothly transfers to the upper surface of the plate holder 9. In the present embodiment, as shown in FIG. 26, the upper surface of the substrate mounting table 401 is higher than the upper surface of the plate holder 9, so the substrate P does not contact the side surface of the plate holder 9 and the plate smoothly It can be transferred onto the holder 9.

  The substrate P is brought into a state of being aligned at a predetermined position with respect to the substrate mounting portion 31 by abutting on the guide pins 36 and the positioning pins 37 provided on the periphery of the plate holder 9 (FIG. 9). reference).

  Also in the present embodiment, since the substrate P is transported in a floating state by the injection of gas as described above, it is possible to prevent the formation of an air pool or an air layer between the substrate P and the substrate mounting portion 31. It is possible to prevent the occurrence of mounting displacement or deformation of the substrate P. Therefore, the substrate P can be placed at a predetermined position with respect to the plate holder 9 in a state of high flatness. Thereafter, the vacuum pump is driven, whereby the substrate P is adsorbed and held on the upper surface of the substrate mounting portion 31 via the suction hole K1. Then, after the substrate P is placed on the plate holder 9, the substrate P is subjected to an exposure process.

  When the exposure processing is completed, the plate holder 9 moves so as to approach the substrate mounting table 401 of the loading / unloading unit 400. In the present embodiment, the plate holder 9 and the substrate mounting table 401 are brought close to each other so that the upper surface of the plate holder 9 is higher than the upper surface of the substrate mounting table 401.

  When arranging the substrate mounting table 401 and the plate holder 9, moving the substrate mounting table 401 can shorten the time required for the substrate P unloading operation. Alternatively, the plate holder 9 and the substrate mounting table 401 can be arranged in contact with each other. In this way, a gap is not formed between the plate holder 9 and the substrate mounting table 401, so that the substrate P can be delivered smoothly.

  The plate holder 9 stops the drive of the vacuum pump, and releases the suction holding of the substrate P on the substrate placement unit 31 via the suction hole K1. Subsequently, as shown in FIG. 27, the plate holder 9 ejects gas from the plurality of gas injection holes K2 formed on the upper surface of the substrate mounting portion 31 and lifts the substrate P through the gas. To support. On the other hand, when receiving the substrate P, the unloading unit 5 jets the gas from the plurality of gas injection holes K7 formed on the upper surface of the substrate mounting table 401. At this time, the gas injected from the gas injection holes K2 and K7 may have directivity.

  The loading / unloading unit 400 moves the suction unit 408 of the transfer unit 405 along the guide unit 406 to the side of the substrate P floatingly supported on the substrate placement unit 31 of the plate holder 9. The adsorption unit 408 adsorbs and holds the substrate P, and moves the substrate P along the + Y direction in the drawing (see FIGS. 24A and 24B).

At this time, since the substrate P is supported in a floating state on the plate holder 9, the suction unit 408 can smoothly slide the substrate P toward the substrate mounting table 401.
Further, the upper surface of the substrate mounting table 401 is adapted to float and support the substrate P as described above.

  Therefore, the substrate P sliding on the upper surface of the substrate mounting unit 31 smoothly transfers onto the upper surface of the substrate mounting table 401. In the present embodiment, since the upper surface of the plate holder 9 is higher than the upper surface of the substrate mounting table 401, the substrate P is smoothly on the substrate mounting table 401 without contacting the side surface of the substrate mounting table 401. You can transfer to

After the movement of the substrate P by the suction unit 408 is completed, the substrate placement table 401 stops the gas injection from the gas injection hole K7 and holds the substrate P by suction via the suction hole K8.
The loading / unloading unit 400 drives the transfer unit 405 in a state where the substrate P is held by suction, and moves the substrate mounting table 401 to the unloading position of the substrate P.

  Subsequently, the substrate P having been subjected to the exposure processing to be placed on the substrate placement table 401 is carried out. At this time, the vertical movement mechanism 409 located below the substrate placement table 401 places the substrate support pins 410 above the substrate placement table 401 via the through holes 407. As a result, the substrate P is supported by the substrate support pins 410 and held above the substrate mounting table 401 (see FIG. 25). Subsequently, the arm portion 48 of the coater developer (not shown) is inserted between the substrate support pins 410, and by lowering the substrate support pins 410, the substrate P is delivered to the arm portion 48. The arm unit 48 moves the substrate P into a coater / developer (not shown) to perform development processing.

  According to the present embodiment, since the substrate P floated and supported can be transported from the carry-in / out unit 400 to the plate holder 9 by sliding, air stagnation or air may occur between the substrate P and the substrate mounting unit 31. It is prevented that a layer arises and generation | occurrence | production of the mounting shift | offset | difference of board | substrate P, or a deformation | transformation can be prevented. Therefore, highly reliable exposure processing can be performed. Moreover, since the carry-in / out unit 400 doubles as the carry-in unit 4 and the carry-out unit 5 in the first to third embodiments, the apparatus configuration can be simplified.

  In the fifth embodiment, when the substrate P is transported from the substrate mounting table 401 to the plate holder 9, the upper surface of the substrate mounting table 401 can be inclined. Specifically, the moving mechanism 402 inclines the upper surface of the substrate mounting table 401 supporting the substrate P toward the plate holder 9 (θY direction) in a state of floating by gas injection from the gas injection holes K7. Thereby, the substrate P can be moved to the plate holder 9 side by utilizing the weight of the substrate P.

  Further, when the substrate P is transported from the plate holder 9 to the substrate mounting table 401, the upper surface of the plate holder 9 can be inclined. Specifically, the first moving mechanism 33 (holding unit 34) lifts the upper surface of the plate holder 9 that supports the substrate P in a state of floating by gas injection from the gas injection holes K2 on the substrate mounting table 401 side (θY direction) Tilt to Thereby, the substrate P can be moved to the substrate mounting table 401 side by utilizing the weight of the substrate P.

  In the present embodiment, a roller mechanism 148 as shown in the second embodiment can also be adopted as the transfer unit 405. Further, as shown in the third embodiment, as the transfer unit 405, the suction unit 408 constituting the transfer unit 405 can be provided on the plate holder 9 side.

Sixth Embodiment
Next, a configuration according to a sixth embodiment of the present invention will be described. In the following description, elements that are the same as or similar to the constituent elements of the above-described embodiment are given the same reference numerals, and descriptions thereof will be simplified or omitted.

FIG. 28 is a sectional plan view showing a schematic configuration of the exposure apparatus of the present embodiment, and FIG. 29 is a perspective view showing an overview of the apparatus configuration in the chamber.
As in the embodiment described above, the exposure apparatus 1 includes an exposure apparatus main body 3 and a carry-in unit 4 as shown in FIG. Further, in the present embodiment, the exposure apparatus 1 includes the carry-out robot 205. These are contained in a chamber 2 which is highly cleaned and adjusted to a predetermined temperature.

  As shown in FIG. 29, the carry-out robot 205 has, for example, a horizontal joint type structure, and is connected to the distal end of the arm unit 10 consisting of a plurality of parts connected via a vertical joint axis. And a drive unit 13. The arm unit 10 is movable, for example, in the vertical direction (Z-axis direction) by the drive device 13. The drive of the drive device 13 is controlled by a control device (not shown). Thus, the unloading robot 205 receives the substrate P from the plate holder 9. The unloading robot 205 is not limited to a robot having a horizontal joint type structure, and can be realized by appropriately adopting or combining a known robot (generally, a transport mechanism).

  FIG. 30A is a view showing a plan configuration of the plate holder 9, and FIG. 30B is a view showing a side configuration of the plate holder 9. In the present embodiment, as shown in FIG. 30A, the plate holder 9 is provided with a substrate placement portion 31 on which the substrate P is placed.

  Further, in the present embodiment, the plate holder 9 is formed with a groove portion 30 for accommodating the fork portion 12 of the carry-out robot 205 when the substrate P is carried out. The groove portion 30 is formed along the moving direction (Y direction in the figure) of the fork portion 12. An area other than the groove 30 on the upper surface of the plate holder 9 constitutes the substrate mounting portion 31.

  The thickness of the fork portion 12 is smaller than the depth of the groove portion 30. Thus, after the fork portion 12 is accommodated in the groove portion 30 as described later, the substrate P placed on the substrate placement portion 31 is delivered to the fork portion 12 and placed by being raised. It has become.

  Similar to FIG. 3B, as shown in FIG. 30B, the plate holder 9 is provided with a position detection sensor 19 that detects a relative position with the loading table 40 on the side surface 9a. The position detection sensor 19 includes a distance detection sensor 19 a for detecting a relative distance to the loading table 40, and a height detection sensor 19 b for detecting a relative height to the loading table 40. A recess is formed at a position corresponding to the position detection sensor 19 in the loading table 40, thereby preventing the position detection sensor 19 and the loading table 40 from interfering with each other.

  Next, the operation of the exposure apparatus 1 according to the present embodiment will be described with reference to FIGS. 6, 11, 31A to. Specifically, the delivery operation of the substrate P between the loading unit 4 and the plate holder 9 and the delivery operation of the substrate P between the plate holder 9 and the unloading robot 205 will be mainly described.

  First, a substrate P coated with a photosensitive agent is loaded into the loading unit 4 by a coater / developer (not shown). At this time, the vertically moving mechanism 49 located below the loading table 40 arranges the substrate support pins 49 a above the loading table 40 via the through holes 47. Subsequently, the arm portion 48 of the coater developer (not shown) is inserted between the substrate support pins 49a as shown in FIG. The arm portion 48 descends to deliver the substrate P to the substrate support pins 49 a, and then retracts from the loading unit 4. The vertical movement mechanism 49 lowers the substrate support pin 49a supporting the substrate P, whereby the loading operation of the substrate P onto the loading table 40 is completed. Thereafter, by driving the vacuum pump, the substrate P is adsorbed and held on the upper surface of the loading table 40 through the suction hole K4.

Subsequently, as shown in FIG. 31A, the plate holder 9 moves so as to approach the loading table 40 of the loading unit 4. In FIGS. 31A and 31B, the carry-out robot is not shown.
Specifically, the first moving mechanism 33 arranges the plate holder 9 and the loading table 40 in a state in which the plate holder 9 and the loading table 40 are in close proximity to each other in the Y direction. Here, the state in which the plate holder 9 and the loading table 40 are in proximity means a state in which the plate P is separated by a distance such that the movement of the substrate P is smoothly performed when the substrate P described later is delivered.

  In addition, when arranging the loading table 40 and the plate holder 9, the second moving mechanism 43 can also be driven. In this way, the loading table 40 and the plate holder 9 can be moved to the delivery position of the substrate P in a short time, and the time required for the loading operation of the substrate P can be shortened. At this time, since the substrate P is held by suction on the upper surface of the loading table 40 through the suction hole K4, the substrate P is prevented from moving on the loading table 40 when the second moving mechanism 43 is driven. can do.

  In the present embodiment, as shown in FIG. 31B, the substrate P is arranged higher than the plate holder 9 when the plate holder 9 and the loading table 40 are brought close to each other. That is, the first moving mechanism 33 brings the plate holder 9 close to the loading table 40 such that the upper surface of the loading table 40 supporting the substrate P is higher than the upper surface of the plate holder 9. The loading table 40 can also be raised by the second moving mechanism 43 so that the top surface of the loading table 40 is higher than the top surface of the plate holder 9.

  The first moving mechanism 33 can also be arranged in a state in which the plate holder 9 and the loading table 40 are in contact with each other. In this way, the substrate P can be smoothly delivered between the plate holder 9 and the loading table 40 described later.

  Subsequently, as shown in FIG. 32, the loading table 40 jets gas from the plurality of gas jet holes K3 formed on the upper surface, and supports the substrate P in a floating state via the gas. On the other hand, when receiving the substrate P, the plate holder 9 injects gas from the plurality of gas injection holes K2 formed on the upper surface.

  The loading unit 4 brings the contact portion 42b into contact with one end portion of the substrate P, as shown in FIG. The contact portion 42 b moves the substrate P toward the plate holder 9 by moving along the guide portion 42 a in the recess 40 a.

  Since the substrate P is in a state of floating on the loading table 40, the contact portion 42b can smoothly slide the substrate P to the plate holder 9 side. The upper surface of the plate holder 9 floats and supports the substrate P as described above. Here, the gas injected from the gas injection holes K3 and K2 may have directivity.

  The board | substrate P which slides the upper surface of the table 40 for carrying in by the contact part 42b will be smoothly transferred to the upper surface of the plate holder 9, as FIG. 34 shows. In the present embodiment, since the upper surface of the loading table 40 is higher than the upper surface of the plate holder 9, the substrate P can smoothly transfer onto the plate holder 9 without contacting the side surface of the plate holder 9. it can.

  As shown in FIG. 33, the substrate P slides in a state in which the position in the X direction in the drawing is defined by the guide pins 36 provided on the peripheral portion of the plate holder 9. The contact portion 42 b moves the substrate P until it abuts on the positioning pin 37 provided on the downstream side in the substrate transport direction in the plate holder 9. The position of the substrate P in the X direction in the figure is defined by the guide pins 36, and the position in the Y direction in the figure is defined by being sandwiched between the positioning pins 37 and the contact portions 42b. The plate holder 9 stops the gas injection from the gas injection holes K2. The board | substrate P is mounted in the state aligned with respect to the board | substrate mounting part 31, as shown in FIG.

  By the way, when mounting a board | substrate to a plate holder conventionally, there existed a possibility that the mounting shift | offset | difference of a board | substrate (position shift from a predetermined mounting position) and a deformation | transformation of a substrate may arise. As one of the causes of this placement deviation, for example, it is conceivable that the substrate is suspended by a thin air layer formed between the substrate and the plate holder immediately before the placement of the substrate. In addition, as one of the causes of the deformation of the substrate, for example, it is conceivable that the substrate is in a state of being inflated by the presence of air stagnation between the substrate and the plate holder after the substrate is placed.

  On the other hand, in the present embodiment, since the substrate P is transported in a floating state by the jet of gas as described above, it is delivered to the plate holder 9 in a state of high flatness without distortion. In addition, since the substrate P is placed on the substrate placement unit 31 from the height at which the substrate P is floated and supported, it is possible to prevent the occurrence of air accumulation or an air layer between the substrate P and the substrate placement unit 31. . Therefore, the substrate P is prevented from being in a bulging state, and the occurrence of the mounting displacement or the deformation of the substrate P can be prevented. Therefore, the substrate P can be placed at a predetermined position with respect to the plate holder 9 in a state of high flatness. Thereafter, the vacuum pump is driven, whereby the substrate P is adsorbed and held on the upper surface of the substrate mounting portion 31 via the suction hole K1.

  After placing the substrate P on the plate holder 9, the mask M is illuminated by the exposure light IL from the illumination system. The pattern of the mask M illuminated by the exposure light IL is projected and exposed onto the substrate P mounted on the plate holder 9 through the projection optical system PL.

  As described above, since the substrate P is properly placed on the plate holder 9, the exposure apparatus 1 can perform predetermined exposure at a proper position on the substrate P with high accuracy, and a highly reliable exposure process Can be realized.

  In the present embodiment, while the substrate P is being subjected to the exposure processing, or as described later, while the substrate P which has been subjected to the exposure processing has been carried out, the photosensitive developer is transferred by the coater developer (not shown). The next applied substrate P can be placed on the loading table 40 of the loading unit 4.

Next, the unloading operation of the substrate P from the plate holder 9 after the end of the exposure processing will be described.
Specifically, a method of unloading the substrate P by the unloading robot 205 will be described. FIG. 35 is a perspective view for explaining the operation of the carry-out robot 205, and FIGS. 36A and 36B are cross-sectional views as viewed from the Y-axis direction when carrying out the substrate P from the plate holder 9. These are side views at the time of seeing the operation | work which carries out the board | substrate P from the plate holder 9 from an X-axis direction. In FIG. 35, only the fork unit 12 is illustrated, and the entire configuration of the carry-out robot 205 is omitted. Further, in FIGS. 36A and 36B, for the sake of convenience, the illustration of the fork unit 12 supporting the substrate P is simplified.

  When the exposure process is completed, the suction of the suction hole K1 by the vacuum pump is released, and the suction of the substrate P by the plate holder 9 is released. Subsequently, the carry-out robot 205 inserts the fork portion 12 from the -Y direction side into the groove portion 30 formed in the plate holder 9 as shown in FIG.

  Then, the driving device 13 moves the fork portion 12 upward by a predetermined amount to bring the fork portion 12 into contact with the lower surface of the substrate P as shown in FIG. 36A. Further, as shown in FIG. 36B, the fork portion 12 further moves upward to lift the substrate P above the plate holder 9 and separate it from the substrate placement portion 31.

  In addition, the unloading robot 205 raises (retracts) the fork unit 12 to a height that does not contact the loading table 40 of the loading unit 4 on which the next substrate P coated with the photosensitive agent is placed. After the fork unit 12 ascends to a position where it does not contact the substrate P on the loading table 40, as shown in FIG. 37, the loading table 40 of the loading unit 4 moves so as to approach the plate holder 9 as described above And transport the substrate P to the plate holder 9 side.

While the substrate P is transported from the loading unit 4 to the plate holder 9, the unloading robot 205 moves the substrate P placed on the fork unit 12 into a coater / developer (not shown).
As described above, the unloading operation of the substrate P from the exposure apparatus main body 3 is completed.

  As described above, according to the present embodiment, since the substrate P supported by floating can be transported from the loading unit 4 to the plate holder 9 by sliding, air can be generated between the substrate P and the substrate placement unit 31. It is possible to prevent the occurrence of stagnation or an air layer, and to prevent the occurrence of mounting displacement or deformation of the substrate P. Therefore, highly reliable exposure processing can be performed.

  Further, in the present embodiment, since the substrate P is slid from the loading unit 4 to the plate holder 9 side using gas injection and carried in, the tact time is shorter than the substrate loading into the plate holder using the conventional tray. become longer.

  On the other hand, in the present embodiment, in a state where the fork portion 12 of the carry-out robot 205 is inserted into the groove portion 30 and the substrate P is lifted from the lower surface to retract the substrate P from the plate holder 9 Since P can be carried into the plate holder 9, the overall tact time required for carrying the substrate P in and out of the plate holder 9 can be made substantially equal to that in the case of using a conventional tray. Therefore, the substrate P can be carried into the plate holder 9 in a good state without increasing the tact time when the substrate P is carried in and out.

In the present embodiment, when the substrate P is transported from the loading table 40 to the plate holder 9, the upper surface of the loading table 40 can be inclined. Specifically, the holding portion 44 of the second moving mechanism 43 moves the upper surface of the loading table 40 for supporting the substrate P in a state of being floated by gas injection from the gas injection hole K3 toward the plate holder 9 side (θY direction). Tilt it.
Thereby, the substrate P can be moved to the plate holder 9 side by utilizing the weight of the substrate P.

Seventh Embodiment
Subsequently, a configuration according to a seventh embodiment of the present invention will be described. In the present embodiment, the same components as those of the sixth embodiment are designated by the same reference numerals, and the description thereof is omitted. The seventh embodiment is different from the sixth embodiment in the configuration of the loading unit.

  In the present embodiment, the loading unit 104 is the same as that described with reference to FIGS. 16A and 16B.

  Further, the operation of the exposure apparatus 1 in the present embodiment is the same as that described with reference to FIGS. 17 and 18.

In the present embodiment, since the substrate P is transported in a floating state by the jet of gas as described above, it can be delivered to the plate holder 9 in a state of high flatness without distortion, and the substrate P and the substrate placement It is prevented that an air accumulation and an air layer are generated between the part 31 and the part 31. Therefore, the substrate P can be placed at a predetermined position with respect to the plate holder 9 in a state of high flatness.
Therefore, predetermined exposure can be performed with high accuracy at an appropriate position on the substrate P, and highly reliable exposure processing can be performed.

Eighth Embodiment
Subsequently, a configuration according to an eighth embodiment of the present invention will be described. In the present embodiment, the same components as those of the sixth and seventh embodiments are denoted by the same reference numerals, and the description thereof will be omitted. The eighth embodiment is mainly different from the sixth and seventh embodiments in that the plate holder 9 includes a transfer unit.

  FIG. 38 is a view showing the configuration of the plate holder 109 according to the present embodiment. The plate holder 109 according to the present embodiment includes a first transfer unit 249 for transferring the substrate P from the loading table 40 to the plate holder 9 as shown in FIG. The first transfer unit 249 includes an adsorption unit 250 that adsorbs and holds both sides in the width direction of the substrate P. The suction unit 250 is freely movable in the XY plane along the surface direction of the substrate P.

  Further, in the present embodiment, a position detection sensor 252 for detecting the position of the substrate P carried in by the first transfer unit 249 with respect to the substrate placement unit 31 is provided at the periphery of the plate holder 9. As the position detection sensor 252, for example, a potentiometer can be exemplified, and in the present invention, either a contact type or non-contact type meter can be used.

  The adsorption unit 250 adsorbs and holds the end of the substrate P floated and supported on the loading table 40 by gas injection from the gas injection holes K3, and moves from the loading table 40 to the plate holder 9 as shown in FIG. 39A. And transport. On the other hand, when receiving the substrate P, the plate holder 9 injects gas from the plurality of gas injection holes K2 formed on the upper surface. At this time, the gas injected from the gas injection holes K2 and K3 may have directivity.

As shown in FIG. 39B, the suction unit 250 allows the exposure apparatus 1 to detect positional deviation of the substrate P relative to the substrate placement unit 31 by bringing the end of the substrate P into contact with the position detection sensor 252. . The suction unit 250 is configured to be driven based on the detection result of the position detection sensor 252.
Therefore, the exposure apparatus 1 can correct the position of the substrate P held by the suction unit 250 with respect to the substrate placement unit 31 based on the detection result of the position detection sensor 252.

Also in the present embodiment, since the substrate P is transported in a floating state by the jet of gas as described above, it can be delivered to the plate holder 9 in a state of high flatness without distortion and the substrate P and the substrate mounting It is prevented that an air reservoir or an air layer is generated between the holder 31 and the holder 31. Therefore, the substrate P can be placed at a predetermined position with respect to the plate holder 9 in a state of high flatness. Therefore, predetermined exposure can be performed with high accuracy at an appropriate position on the substrate P, and highly reliable exposure processing can be performed.
In addition, about the carrying out operation | movement of the board | substrate P from the plate holder 9 after completion | finish of exposure processing, since it is the same as that of 1st Embodiment, the description shall be abbreviate | omitted.

The ninth embodiment
Subsequently, a configuration according to a ninth embodiment of the present invention will be described. In the present embodiment, the same components as those of the sixth to eighth embodiments are denoted by the same reference numerals, and the description thereof will be omitted. The sixth embodiment is mainly different from the sixth to eighth embodiments in the configuration of the exposure apparatus main body. FIG. 40 is a perspective view showing a schematic configuration of the exposure apparatus main body 3 according to the present embodiment.

  As shown in FIG. 40, the exposure apparatus main body 3 of the present embodiment includes a plate holder 9, a substrate lifting mechanism 150 provided on the plate holder 9, and a first moving mechanism 33. The substrate lifting mechanism 150 is for lifting the substrate P upward when unloading the substrate P.

  FIG. 41 is a plan view of the plate holder 9, FIGS. 42A and 42B are side sectional views of the plate holder 9, FIG. 42A is a view before delivery of a substrate, and FIG. 42B is a substrate It is a figure which shows the state after delivery of.

  As shown in FIGS. 41, 42A, and 42B, the lifting mechanism 150 includes a plurality of substrate support members 151 for supporting the substrate P, and a vertical movement unit 152 (see FIG. 43) for moving the substrate support member 151 up and down. Is equipped.

  The substrate support member 151 has a first linear member 119 which is provided in the X direction (first direction) in FIG. 41 with respect to the shaft portion (vertical movement member) 155, and in the Y direction (second direction) in FIG. It includes a second linear member 120 to be bridged, and is formed in a substantially lattice shape as a whole. Here, the first linear member 119 and the second linear member (second installation portion) 120 are mutually welded or combined in a grid. Each substrate support member 151 is bridged between a plurality of (for example, six in the present embodiment) shaft portions 155.

  Each lattice shape constituting each substrate support member 151 has a plurality of substantially rectangular openings 121 each smaller than the substrate P. The shape of the substrate support member 151 is not limited to the shape shown in FIG. 41. For example, it may be a frame-shaped single frame in which only one opening 121 is formed.

  In the present embodiment, the four substrate support members 151 are disposed in a state in which the gap S is opened along the extension direction of the second linear member 120 (the Y direction shown in FIG. 41). Such a gap S between the substrate support members 151 is to form a space into which the fork portion 12 is inserted when the substrate P is unloaded from the plate holder 9 as described later.

  In addition, as a forming material of the substrate supporting member 151 (the first linear member 119 and the second linear member 120), when the substrate supporting member 151 supports the substrate P, it is possible to suppress the bending of the substrate P due to its own weight. It is preferable to use possible materials, for example, various synthetic resins or metals can be used. Specifically, nylon, polypropylene, AS resin, ABS resin, polycarbonate, fiber reinforced plastic, stainless steel and the like can be mentioned. Examples of the fiber reinforced plastic include GFRP (Glass Fiber Reinforced Plastic: glass fiber reinforced thermosetting plastic) and CFRP (Carbon Fiber Reinforced Plastic: carbon fiber reinforced thermosetting plastic).

  As shown in FIG. 43, the vertical movement unit 152 has a shaft (vertical movement member) 155 and a drive device 153 for driving the shaft 155 up and down. The drive device 153 is provided for each shaft portion 155, whereby each shaft portion 155 moves up and down independently.

  Based on this configuration, as shown in FIGS. 42A and 42B, the substrate supporting member 151 moves up and down with respect to the substrate mounting portion 31 of the plate holder 9 with the up and down movement of the up and down moving unit 152 (shaft portion 155). It is supposed to be done.

  On the other hand, the plate holder 9 is formed with a recess 130 for accommodating the substrate support member 151. The concave portions 130 are provided in a lattice shape corresponding to the frame structure of the substrate support member 151. A region (partial mounting portion) other than the concave portion 130 on the upper surface of the plate holder 9 constitutes a substrate mounting portion 31 for holding the substrate P.

  The thickness of the substrate support member 151 is smaller than the depth of the recess 130. Thereby, as shown in FIG. 42B, only the substrate P placed on the substrate support member 151 is received by the substrate placement part 31 by placing the substrate support member 151 in the recess 130, and placed. It is supposed to be

  Further, the substrate mounting portion 31 is finished such that the substantial holding surface of the plate holder 9 with respect to the substrate P has a good flatness. Further, a suction port for bringing the substrate P into close contact with the substrate holding surface (upper surface) of the substrate mounting portion 31 or air (gas) is injected at the time of substrate loading, which will be described later. An opening K205 is formed which functions as a gas injection port for floatingly supporting the above-mentioned surface. A vacuum pump and a gas injection pump (not shown) are connected to the opening K205, and the opening K205 can function as a suction port or an injection port as described above by switching the driving of these pumps. .

  At the periphery of the plate holder 9, there are a guide pin 36 for guiding the substrate P when loading the substrate P, and a positioning pin 37 for defining the position of the substrate P with respect to the substrate mounting portion 31 of the plate holder 9. Provided (see FIGS. 44A and 44B). The guide pins 36 and the positioning pins 37 are movable together with the plate holder 9 in the exposure apparatus main body 3.

  Next, the operation of the exposure apparatus 1 of the present embodiment will be described with reference to FIGS. 44A to 50B. Specifically, the delivery operation of the substrate P between the loading unit 4 and the plate holder 9 and the delivery operation of the substrate P between the plate holder 9 and the unloading robot 205 will be mainly described.

  First, in the same manner as in the sixth embodiment, the substrate P coated with the photosensitive agent is carried into the carry-in unit 4 by the coater developer (not shown). At this time, the substrate P is held by suction on the upper surface of the loading table 40 via the suction hole K4.

  Subsequently, as shown in FIG. 44A, the plate holder 9 moves so as to approach the loading table 40 of the loading unit 4. In FIGS. 44A and 44B, the carry-out robot is not shown. Specifically, the first moving mechanism 33 arranges the plate holder 9 and the loading table 40 in a state in which the plate holder 9 and the loading table 40 are in close proximity to each other in the Y direction. At this time, by driving the second moving mechanism 43, the loading table 40 and the plate holder 9 can be moved to the delivery position of the substrate P in a short time, and the time required for the loading operation of the substrate P can be shortened. In addition, since the substrate P is held by suction on the upper surface of the loading table 40 via the suction hole K4, the substrate P does not move on the loading table 40 when the second moving mechanism 43 is driven.

  In the present embodiment, as shown in FIG. 44B, the first moving mechanism 33 carries in the plate holder 9 so that the upper surface of the loading table 40 supporting the substrate P is higher than the upper surface of the plate holder 9. It is made to approach the table 40. The loading table 40 can also be raised by the second moving mechanism 43 so that the top surface of the loading table 40 is higher than the top surface of the plate holder 9. Further, the first moving mechanism 33 can also arrange the plate holder 9 and the loading table 40 in contact with each other, whereby the substrate P can be delivered smoothly.

  Subsequently, as shown in FIG. 45, the loading table 40 jets gas from the plurality of gas jet holes K3 formed on the upper surface, and supports the substrate P in a floating state via the gas. On the other hand, when receiving the substrate P, the plate holder 9 drives a gas injection pump (not shown) to eject air from the opening K 205 provided in the substrate mounting portion 31.

  The loading unit 4 brings the contact portion 42 b into contact with one end of the substrate P, as shown in FIG. The contact portion 42 b moves the substrate P toward the plate holder 9 by moving along the guide portion 42 a in the recess 40 a.

  Since the substrate P is in a state of floating on the loading table 40, the contact portion 42b can smoothly slide the substrate P to the plate holder 9 side. The upper surface of the plate holder 9 floats and supports the substrate P as described above. Here, the gas injected from the gas injection holes K3 and the opening K205 may have directivity.

  As shown in FIG. 47, the substrate P sliding on the upper surface of the loading table 40 by the contact portion 42b smoothly transfers to the upper surface of the plate holder 9. In the present embodiment, since the upper surface of the loading table 40 is higher than the upper surface of the plate holder 9, the substrate P can smoothly transfer onto the plate holder 9 without contacting the side surface of the plate holder 9. it can.

  The position of the substrate P in the X direction in the figure is defined by the guide pins 36, and the position in the Y direction in the figure is defined by being sandwiched between the positioning pins 37 and the contact portions 42b. The plate holder 9 stops the gas injection from the opening K205. Thus, the substrate P is placed in a state of being aligned with the substrate placement unit 31.

In the present embodiment, since the substrate P is transported in a floating state by the jet of gas as described above, the substrate P is delivered to the plate holder 9 in a state of no distortion and high flatness. In addition, since the substrate P is placed on the substrate placement unit 31 from the height at which the substrate P is floated and supported, it is possible to prevent the occurrence of air accumulation or an air layer between the substrate P and the substrate placement unit 31. . Therefore, the substrate P is prevented from being in a bulging state, and the occurrence of the mounting displacement or the deformation of the substrate P can be prevented.
Therefore, the substrate P is placed at a predetermined position with respect to the plate holder 9 in a state of high flatness. Thereafter, by driving the vacuum pump, the substrate P is adsorbed and held on the upper surface of the substrate placement unit 31 via the opening K205.

  After placing the substrate P on the plate holder 9, the mask M is illuminated by the exposure light IL from the illumination system. The pattern of the mask M illuminated by the exposure light IL is projected and exposed onto the substrate P mounted on the plate holder 9 through the projection optical system PL.

  In the exposure apparatus 1 according to the present embodiment, since the substrate P is satisfactorily placed on the plate holder 9 as described above, predetermined exposure can be performed with high accuracy on the appropriate position on the substrate P. Reliable exposure processing can be realized.

Next, the unloading operation of the substrate P from the plate holder 9 after the end of the exposure processing will be described.
Specifically, a method of unloading the substrate P by the unloading robot 205 will be described. FIG. 48 is a perspective view for explaining the operation of the carry-out robot 205, and FIGS. 49A, 49B, and 49C are cross-sectional views as viewed from the Y-axis direction when carrying out the substrate P from the plate holder 9. It is. In FIG. 48, only the fork unit 12 is illustrated, and the entire configuration of the carry-out robot 205 is omitted. The present embodiment corresponds to the shape of the lifting mechanism 150, and the substrate support portion in the fork portion 12 is different from that of the above embodiment. Further, in FIGS. 49A, 49B, and 49C, the illustration of the fork unit 12 supporting the substrate P is simplified for the sake of convenience.

  When the exposure processing is completed, the suction by the vacuum pump via the opening K205 is released, and the suction of the substrate P by the plate holder 9 is released. Subsequently, the lifting mechanism 150 drives the shaft 155 to raise the substrate support member 151. At this time, as shown in FIG. 49A, the substrate P placed on the substrate placement unit 31 together with the substrate support member 151 is lifted upward. At this time, since the substrate P is lifted by being supported by the plurality of substrate supporting members 151, the occurrence of peeling charging can be prevented. In addition, since the substrate P can be supported on a wider surface than in the conventional case where the substrate P is lifted by the pins, the amount of bending produced in the substrate P can be reduced, and cracking of the substrate P can be caused. It can be prevented.

  The carry-out robot 205 drives the fork unit 12 and, as shown in FIG. 48, the fork unit 12 is directed toward the gap S between the substrate support members 151 disposed above the substrate placement unit 31 and both ends in the X axis direction. It moves from the Y direction side, and forks 12 are inserted into the gap S and the both ends (FIG. 49B).

  Then, when the drive device 13 moves the fork portion 12 upward by a predetermined amount, the fork portion 12 abuts on the lower surface of the substrate P. When the fork portion 12 is further moved upward, the substrate P is lifted above the plate holder 9 to be separated from the lifting mechanism 150 as shown in FIG. 49C.

  The lifting mechanism 150 accommodates the substrate support member 151 in the recess 130 after the substrate P is separated. After housing the substrate supporting member 151 in the recess 130, the plate holder 9 moves so as to approach the loading table 40 of the loading unit 4 and transports the substrate P to the plate holder 9 as described above. .

While the substrate P is transported from the loading unit 4 to the plate holder 9, the unloading robot 205 moves the substrate P placed on the fork unit 12 into a coater / developer (not shown).
As described above, the unloading operation of the substrate P from the exposure apparatus main body 3 is completed.

As described above, according to the present embodiment, since the substrate P floated and supported is transported from the loading unit 4 to the plate holder 9 by sliding, it is possible to prevent occurrence of mounting displacement or deformation of the substrate P.
Further, also in the present embodiment, the overall tact time required to carry the substrate P into and out of the plate holder 9 can be made substantially equal to that in the case of using a conventional tray. Therefore, the substrate P can be carried into the plate holder 9 in a good state without increasing the tact time when the substrate P is carried in and out.

  In the above embodiment, the case where the opening K205 as the gas injection port is formed only in the substrate mounting portion 31 has been described, but the gas injection port can also be formed on the upper surface of the substrate support member 151. In this way, when the substrate P is carried into the plate holder 9, the amount of gas injected onto the substrate transport surface increases, so the substrate P can be transported more smoothly.

Tenth Embodiment
Subsequently, a configuration according to a tenth embodiment of the present invention will be described. In the present embodiment, the same components as those of the sixth embodiment are designated by the same reference numerals, and the description thereof is omitted. The tenth embodiment is mainly different from the above embodiments in that an adsorption mechanism for adsorbing the substrate P in a non-contact state is provided as a means for carrying out the substrate P from the plate holder 9.

  The suction mechanism holds the substrate P, lifts the substrate P from the substrate mounting portion 31 of the plate holder 9 upward, and moves the substrate P into a coater / developer (not shown). FIG. 50A shows the structure of the suction surface, and FIG. 50B shows the entire structure of the suction mechanism.

  As shown in FIGS. 50A and 50B, the suction mechanism 350 moves a plurality of holding portions 351 holding the substrate P in a non-contact state, a base portion 352 holding the holding portions 351, and the base portion 352. A possible drive mechanism 355 and a base 352 are provided. The base portion 352 is a plate-like member having substantially the same size as the substrate P. The holding portion 351 is regularly arranged on the base portion 352, whereby the substrate P can be held well.

  As the holder 351, a so-called Bernoulli chuck was used. The holding unit 351 generates compressed negative pressure with the substrate P by injecting compressed air with the substrate P. As a result, a pressing force for pressing the substrate P against the holding portion 351 is generated. On the other hand, when the gap between the holder 351 and the substrate P is reduced, the flow velocity of the compressed air is decreased, and the pressure between the holder 351 and the substrate P is increased. Thereby, a force is generated to try to separate the substrate P from the holding portion 351. The holding unit 351 holds the substrate P in a state in which the distance between the substrate P and the holding unit 351 is kept constant, that is, in a non-contact state, by injecting compressed air so as to balance such two forces. can do.

  Next, the operation of the exposure apparatus 1 will be described with reference to the drawings. In addition, about the delivery operation | movement of the board | substrate P between the carrying-in part 4 and the plate holder 9, since it is the same as that of 1st Embodiment, description is abbreviate | omitted.

  Hereinafter, an operation of unloading the substrate P from the plate holder 9 will be described. Specifically, a method of unloading the substrate P from the plate holder 9 by the suction mechanism 350 will be described. FIG. 51A and FIG. 51B are side views when the operation of unloading the substrate P from the plate holder 9 is viewed from the X-axis direction.

  When the exposure process is completed, the suction of the suction hole K1 by the vacuum pump is released, and the suction of the substrate P by the plate holder 9 is released. Subsequently, the suction mechanism 350 moves above the plate holder 9. Then, the suction mechanism 350 is lowered to a position where the holding unit 351 can hold the substrate P, as shown in FIG. 51A. Then, the plurality of holding portions 351 hold the upper surface of the substrate P in a non-contact state. At this time, the substrates P can be held by simultaneously or sequentially driving the plurality of holders 351.

  While holding the substrate P by the plurality of holders 251, the suction mechanism 350 lifts the substrate P above the plate holder 9 by the drive mechanism 355 and separates the substrate P from the substrate mounting portion 31 as shown in FIG. 51B. At this time, since the holding portion 351 is not in contact with the substrate P, no adsorption mark is left on the substrate P.

  After the suction mechanism 350 ascends to a position where the suction mechanism 350 does not contact the substrate P on the loading table 40, the loading table 40 of the loading unit 4 moves so as to approach the plate holder 9. Then, similarly to the above embodiment, the substrate P is transported from the loading table 40 to the plate holder 9 in a state where the substrate P is floated and supported.

  While the substrate P is transported from the loading unit 4 to the plate holder 9, the suction mechanism 350 moves the substrate P held by the holding unit 351 into a coater / developer (not shown). As described above, the unloading operation of the substrate P from the exposure apparatus main body 3 is completed.

  As shown in FIGS. 52A and 52B, a support member 353 for supporting the lower surface of the substrate P can be provided around the base portion 352. The support member 353 is formed of a frame-like member surrounding the periphery of the substrate P, and includes a plurality of projecting portions 354 protruding in the surface direction of the substrate P. The projecting portion 334 is in contact with the lower surface of the substrate P. According to this configuration, when holding a large substrate that may cause sag of the substrate P, the peripheral end of the substrate P is supported by the overhanging portion 354. Therefore, even in the case of holding a large substrate, the substrate The substrate P can be held in a state of high flatness by the holding portion 351 while preventing the occurrence of sagging at the end portion of P.

  In addition, as the substrate P in the above-described embodiment, not only a glass substrate for display devices but also a semiconductor wafer for manufacturing semiconductor devices, a ceramic wafer for thin film magnetic heads, or an original plate of a mask or reticle used in an exposure apparatus Synthetic quartz, silicon wafer or the like is applied.

  Further, as an exposure apparatus, a step-and-scan type scanning exposure apparatus (scanning stepper) in which the mask P and the substrate P are synchronously moved to scan and expose the substrate P with the exposure light IL through the pattern of the mask M In addition to this, it is also applicable to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the mask M and the substrate P are stationary and the substrate P is sequentially moved stepwise. it can.

  The present invention can also be applied to a twin-stage type exposure apparatus provided with a plurality of substrate stages as disclosed in US Pat. Nos. 6,341,007, 6,208,407, and 6,262,796.

  The present invention also relates to a substrate stage for holding a substrate as disclosed in U.S. Pat. No. 6,889,963 and European Patent Application Publication No. 1713113 etc., and a reference on which a reference mark is formed without holding the substrate. The present invention can also be applied to an exposure apparatus provided with a member and / or a measurement stage on which various photoelectric sensors are mounted. Further, an exposure apparatus provided with a plurality of substrate stages and measurement stages can be employed.

  In the above embodiment, a light transmission type mask in which a predetermined light shielding pattern (or a phase pattern / light reduction pattern) is formed on a light transmitting substrate is used. Instead of this mask, for example, US Pat. As disclosed in US Pat. No. 6778257, a variable-shaped mask (also called an electronic mask, an active mask, or an image generator) that forms a transmission pattern or a reflection pattern or a light emission pattern based on electronic data of a pattern to be exposed ) May be used. Further, instead of the variable molding mask provided with the non-light emitting type image display device, a pattern forming apparatus including a self-light emitting type image display device may be provided.

  The exposure apparatus of the above-described embodiment is manufactured by assembling various subsystems including respective components so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Before and after this assembly, adjustments to achieve optical accuracy for various optical systems, adjustments to achieve mechanical accuracy for various mechanical systems, and various electrical systems to ensure these various accuracies Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, wiring connection of electric circuits, piping connection of pressure circuits, etc. among the various subsystems. It goes without saying that there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the process of assembling the various subsystems into the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. It is desirable that the manufacturing of the exposure apparatus be performed in a clean room in which the temperature, the degree of cleanliness, and the like are controlled.

  A micro device such as a semiconductor device is, as shown in FIG. 53, a step 201 of performing function / performance design of the micro device, a step 202 of manufacturing a mask (reticle) based on this design step, a substrate which is a substrate of the device. Step 203 of manufacturing the substrate, including exposing the substrate with the exposure light using the pattern of the mask and developing the exposed substrate (photosensitizer) according to the embodiment described above. A substrate processing step 204, a device assembly step (including processing steps such as a dicing step, a bonding step, and a package step) 205, an inspection step 206 and the like are performed. In Step 204, the photosensitive agent is developed to form an exposed pattern layer (a developed photosensitive agent layer) corresponding to the pattern of the mask, and processing of the substrate through the exposed pattern layer is included. Be

  In addition, the requirements of the above-mentioned embodiment and modification can be combined suitably. In addition, some components may not be used. In addition, the disclosures of all of the published publications and US patents relating to the exposure apparatus and the like cited in the above-described embodiment and modifications are incorporated as part of the description of the text as far as the laws and regulations permit.

P: substrate, K1, K4, K6, K8: suction hole, K2, K3, K5, K7: gas injection hole, K205: opening portion, 1: exposure device, 4, 104: loading portion, 5: unloading portion, 9 , 109: plate holder, 12: fork portion, 19: position detection sensor, 33: first movement mechanism, 40, 140: loading table, 42, 149, 249: first transfer portion, 43: second movement mechanism, DESCRIPTION OF SYMBOLS 50 ... Delivery table, 52 ... 2nd transfer part, 53 ... 3rd moving mechanism, 109 ... Plate holder, 142 ... Roller, 148 ... Roller mechanism, 149 ... 1st transfer part, 150 ... Lifting mechanism, 205 ... Delivery robot , 250: adsorption unit, 251: holding unit, 252: position detection sensor, 350: adsorption mechanism, 351: holding unit, 401: substrate mounting table, 405: transfer unit, 408: adsorption unit

Claims (16)

  1. A transport apparatus for transporting a substrate to a support portion of a processing apparatus for processing the substrate,
    A supporting device capable of contactlessly supporting the substrate;
    An unloading apparatus for unloading the first substrate processed by the processing apparatus and supported in a noncontacting manner on the support section from the support section to the support apparatus arranged in a predetermined direction;
    And a loading device for loading a second substrate different from the first substrate supported by the supporting device in a non-contact manner on the supporting portion from which the first substrate is unloaded.
  2.   The transfer apparatus according to claim 1, wherein the support device supports the outside of the area of the first substrate supported by the support portion in a non-contact manner during the unloading operation of the first substrate.
  3.   The transport apparatus according to claim 1, wherein the support portion supports the outside of the region of the second substrate supported by the support device in a noncontact manner during the loading operation of the second substrate.
  4.   The said carrying out apparatus moves the said 1st board | substrate relatively with respect to the said support part and the said support apparatus in the said predetermined direction, and carries out the said 1st board | substrate to the said supporting apparatus. The conveyance apparatus as described in a term.
  5.   The said carrying-in apparatus moves the said 2nd board | substrate relatively with respect to the said support apparatus and the said support part in the said predetermined direction, and carries in the said 2nd board | substrate to the said support part. The conveyance apparatus as described in a term.
  6.   The drive part which moves so that one of the said support part and the said support apparatus may be moved to the said predetermined direction, and it may be made to approach or contact the other of the said support part and the said support apparatus is provided. The conveyance apparatus as described in a term.
  7. The support device includes a first table capable of contactlessly supporting the first substrate carried out from the support portion, and a second table capable of contactlessly supporting the second substrate carried into the support portion. Have
    The transport apparatus according to claim 6, wherein the first and second tables are provided side by side in a perpendicular direction orthogonal to the predetermined direction.
  8.   The driving unit moves the support in the orthogonal direction so that the support is arranged in the predetermined direction with the second table when the first substrate is unloaded from the support to the first table. The conveyance apparatus according to claim 7.
  9. The support device includes a first table capable of contactlessly supporting the first substrate carried out from the support portion, and a second table capable of contactlessly supporting the second substrate carried into the support portion. Have
    The transport apparatus according to claim 6, wherein the first and second tables are provided side by side in the vertical direction.
  10.   The driving unit moves the support in the vertical direction so that the support is arranged in the predetermined direction with the second table when the first substrate is unloaded from the support to the first table. The transport apparatus according to claim 9.
  11.   The transfer apparatus according to any one of claims 1 to 10, further comprising: an adjustment unit configured to adjust a position of the second substrate carried by the carry-in device with respect to the support unit.
  12.   The transfer apparatus according to claim 11, wherein the support unit adsorbs and supports the second substrate loaded.
  13. An exposure apparatus for exposing a substrate with exposure light, comprising:
    The exposure apparatus provided with the conveyance apparatus as described in any one of Claims 1-12 which moves the said 2nd board | substrate supported by the said support part to the irradiation area | region of the said exposure light.
  14.   The exposure apparatus according to claim 13, wherein the first and second substrates are substrates used in a flat panel display device.
  15.   15. The exposure apparatus according to claim 13, wherein at least one side of the first and second substrates has a length of 500 mm or more.
  16. And exposing the substrate coated with a photosensitive material using the exposure apparatus according to any one of claims 13 to 15, and transferring a pattern onto the substrate.
    Developing the photosensitive material exposed by the exposure to form an exposed pattern layer corresponding to the pattern;
    Processing the substrate through the exposed pattern layer.
JP2019075822A 2010-02-17 2019-04-11 Conveyance apparatus, exposure apparatus, method of producing device Pending JP2019124962A (en)

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