TW201142977A - Transfer apparatus, transfer method, exposure apparatus, and device manufacturing method - Google Patents

Transfer apparatus, transfer method, exposure apparatus, and device manufacturing method Download PDF

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Publication number
TW201142977A
TW201142977A TW100105223A TW100105223A TW201142977A TW 201142977 A TW201142977 A TW 201142977A TW 100105223 A TW100105223 A TW 100105223A TW 100105223 A TW100105223 A TW 100105223A TW 201142977 A TW201142977 A TW 201142977A
Authority
TW
Taiwan
Prior art keywords
substrate
support
support portion
plate holder
transfer
Prior art date
Application number
TW100105223A
Other languages
Chinese (zh)
Other versions
TWI587430B (en
Inventor
Asako Kinjyo
Yasuyuki Ushijima
Noritsugu Hanazaki
Original Assignee
Nikon Corp
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Publication date
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Application filed by Nikon Corp filed Critical Nikon Corp
Publication of TW201142977A publication Critical patent/TW201142977A/en
Application granted granted Critical
Publication of TWI587430B publication Critical patent/TWI587430B/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G51/00—Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
    • B65G51/02—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases
    • B65G51/03—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Fluid Mechanics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Liquid Crystal (AREA)
  • Attitude Control For Articles On Conveyors (AREA)

Abstract

Disclosed is a transfer apparatus which is provided with: a first supporting section (3), which supplies a gas to one surface of a substrate, and which can float and support the substrate by means of the gas; a second supporting section (400), which can support said surface of the substrate; a drive section (402), which moves the first supporting section and/or the second supporting section, and which arranges the first and the second supporting sections in the first direction by having the supporting sections close to or in contact with each other; and a transfer section, which moves the substrate supported by the first supporting section or the second supporting section to the other supporting section along the first direction, said first supporting section and second supporting section being arranged by the drive section.

Description

201142977 六、發明說明： 【發明所屬之技術領域】 本發明係關於搬送裝置、搬送方法、曝光裴置、以及 元件製造方法。 本申請案，係根據2〇10年2月17日提申之美國暫時 申請第61/ 305，355號、及61/3〇5，439號主張優先權， 並將其内容援用於此。 【先前技術】 在平面面板顯示器等電子元件之製程中，係使用曝光 裝置或檢查裝置等大型基板之處理裝置。在使用此等處理 裝置之曝光步驟、檢查步驟中，係使用用以將大型基板（例 如玻璃基板）搬送至處理裝置之如揭示於下述專利文獻之搬 送裝置。 [專利文獻] [專利文獻1]曰本特開2001 — 1〇〇丨69號公報 【發明内容】 上述之大型基板之搬送裝置中，因在將被基板支承構 件支承之基板往基板保持部移交時基板與基板保持部之間 會介在空氣之層’故有時會有移交後之基板產生變形，或 基板對基板保持部上之載置位置產生載置偏移之情形。若 移交後之基板產生載置偏移或變形，則在例如曝光裝置中 會產生無法對基板上之適當正確之位置進行既定曝光等曝 201142977 光不良之問題。當產生基板之載置偏移或變形時，為了解 除該問題而例如藉由重新進行基板之移交，會產生基板之 處理遲延之問題。又，若為了在移交後不使空氣之層殘留 而例如降低基板之移交速度，則會產生基板之處理更加遲 延之問題。 本發明之態樣，其目的在於提供能在不產生載置偏移 或皮形之情形下進行基板之移交之搬送裝置、搬送方法、 曝光裝置、以及元件製造方法。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conveying apparatus, a conveying method, an exposure apparatus, and a component manufacturing method. This application claims priority based on U.S. Provisional Application Nos. 61/305,355 and 61/3〇5,439, filed on February 17, 2010, and the contents of which are hereby incorporated herein. [Prior Art] In the manufacturing process of an electronic component such as a flat panel display, a processing device of a large substrate such as an exposure device or an inspection device is used. In the exposure step and the inspection step using these processing apparatuses, a transfer apparatus for transporting a large substrate (e.g., a glass substrate) to a processing apparatus as disclosed in the following patent documents is used. [Patent Document 1] [Patent Document 1] Japanese Unexamined Patent Application Publication No. Hei. No. Hei. When the substrate and the substrate holding portion are interposed between the air layers, the substrate after the transfer may be deformed or the substrate may be placed on the substrate holding portion. If the substrate after the transfer is displaced or deformed, for example, in the exposure apparatus, there is a problem in that it is impossible to perform a predetermined exposure such as a predetermined exposure on the substrate at an appropriate position. When the placement of the substrate is shifted or deformed, in order to solve the problem, for example, by re-transferring the substrate, there is a problem that the processing of the substrate is delayed. Further, if the transfer speed of the substrate is lowered, for example, in order to prevent the layer of the air from remaining after the transfer, there is a problem that the processing of the substrate is delayed. An aspect of the present invention is to provide a transfer apparatus, a transfer method, an exposure apparatus, and a device manufacturing method capable of transferring a substrate without causing a shift or a skin shape.

根據本發明之第丨態樣，係提供一種搬送裝置，其具 備第1支承部，係對基板之一面供給氣體，能透過該氣 體心斤支承刚述基板；帛2支承部，能支承前述基板之前 述一面；驅動部，係使前述第1及第2支承部之至少一個 移動使.亥第1及第2支承部彼此接近或接觸並排列於第J 方向；以及移送部’將藉由前述驅動部而排列之前述第1 及第2支承部之一· -fr 6<τ 4： -r 、, 斤支承之剛述基板沿前述第1方向往 另一方側移動。 •根據本發明之第2態樣，係提供-種搬送裝置，其具 第纟承，係對基板之一面供給氣體，能透過該氣 體懸浮支承前述基板；第 ,c ^ , 乐2及第3支承部，能支承前述基 板之别述一面；第i驅動 助邛，係使刖述第1及第2支承部 之至少一個移動， '"第及第2支承部彼此接近或接觸 並排列於第1方向.笛，^ ’第2驅動部，係使前述第1及第3支 承4之至少一個移動， ά m ^ 更w第1及第3支承部彼此接近或 接觸並排列於第2方向； 第1移送。卩，將藉由前述第1驅 201142977 動部而排列於前述第i 前述基板沪針、十，哲 之別达第2支承部所支承之 移送部，料=1方向往前述帛1支承部側移動；第2 之前述第广述第2驅動部而排列於前…支承部 述第3支？ 所支承之前述基板沿前述第2方向往前 禾J支承部側移動。 送基Ϊ據:發明之帛3態樣’係提供-種搬送方法，係搬 ，、包含：使能透過對前述基板之一面供仏1氣體 以懸浮立承铪 1、、，〇之礼體 前述Ϊ Γ 帛1支承部、及能支承前述基板之 支：：支承部之至少一方移動，以使該第1及第2 所_ 或接觸並排列於第1方向之㈣；以及將 戶厅排列之前述第丨 及第2支承部之-方所支承之前述基板 述第1方向往另-方側移動之動作。 ㈣本發明之帛4態樣，係提供—種搬送方法，係搬 板’其包含：使能透過對前述基板之一面供給之氣體 :年支承别述基板之帛t支承部及能支承前述基板之前 —面之帛2支承部之至少一方移動，以使該第i及第2 支：部彼此接近或接觸並排列於帛i方向之動作；將排列 :刖述第1支承部之前述第2支承部所支承之前述基板沿 前述第1方向往前述第i支承部側移動之動作；使前述第厂 支承部及能支承前述基板之前述一面之第3支承部之至少 一方移動，以使該帛丨^ 3 t承部彼此接近或接觸並排 列於第2方向之動作；以及將排列於前述第3支承部之前 述第1支承部所支承之前述基板沿前述第2方向往前述第3 支承部側移動之動作。 201142977 ··· .根據本發明之第5態樣，係提供—種搬送裝置，其具 備：第1支承部，係對基板之一面供給氣體，能透過該氣 體懸浮支承前述基板；帛2支承部，能支承前述基板之前 述一面；驅動部，係使前述第1及第2支承部之至少一個 移動，使該第1及第2支承部彼此接近或接觸並排列；移 送2，將藉由前述驅動部而排列之前述第2支承部所支承 之前述基板沿前述排列方向往前述第i支承部側移動；頂 起機構’係藉由停止前述氣體之供給’支承載置於前述第i 支承部之載置部之前述基板並往該載置部之上方頂起；以 及搬出機構，將藉由該頂起機構而被支承於前述載置部上 方之則述基板挺前述第1支承部搬出。 根據本發明之第6態樣，係提供一種搬送方法係搬 送基板，其包含：使能透過對前述基板之一面供給之氣體 以懸浮支承前述基板之第i支承部及能支承前述基板之前 述一面之第2支承部之至少一方移動，以使該第丨及第2 支承部彼此接近或接觸並排列之動作；將所排列之前述第2 支承部所支承之前述基板沿前述排列方向往前述第丨支承 部侧移送之動作；藉由停止前述氣體之供給，支承載置於 刖述第1支承部之載置部之前述基板並往該載置部之上方 頂起之動作；以及將被支承於前述載置部上方之前述基板 從前述第1支承部搬出之動作。 根據本發明之第7態樣，係提供一種曝光裝置，係以 曝光用光使基板曝光，其具備：保持前述基板並使前述基 板移動至前述曝光用光之照射區域之上述搬送裝置。土 201142977 根據本發明之第8態樣，係提供一種元件製造方法， 其包含.使用上述曝光裝置於前述基板轉印前述圖案之動 作’以及根據該圖案加工轉印有前述圖案之前述基板之動 作。 根據本發明之態樣，能在不產生載置偏移或變形之情 形下進行基板之移交。 【實施方式】 參照圖式說明本發明之實施形態。此外，本發明並不 限定於此。以下，說明具備本發明之搬送裝置且進行曝光 處理（對塗布有感光劑之基板曝光液晶顯示元件用圖案）之 曝光裝置’且說明本發明之搬送方法及元件製造方法之一 實施形態。 (第1實施形態） 圖1係顯示本實施形態之曝光裝置之概略構成之剖面 俯視圖。曝光裝置1如圖1所示具備對基板曝光液晶顯示 元件用圖案之曝光裝置本體3、搬入部4、搬出部5,此等 係被高度潔淨化，且收納於調整成既定溫度之腔室2内。 本實施形態中，基板係大型玻璃板，其一邊之尺寸係例如 50mm以上。 圖2係顯示腔室2内之具體構成之外觀立體圖。曝光 裝置本體3如圖2所示，具備以曝光用光IL照明光罩M之 未圖示照明系統、保持形成有液晶顯示元件用圖案之光罩Μ 之未圖不光罩載台、配置於此光罩載台下方之投影光學系 201142977 統PL、設成能在配置於投 干彳卜-雒弒叙夕& * 尤干糸 '，死PL下方之基部（未圖 不）上—維移動之作為基板保持具之板保持具9、以及伴持 板保持具9且使該板保持具9在腔室 機構33。 秒動之第1移動 之;te::以下說明中’相對設於腔室2之基部(未圖示) 具9之二維移動係在水平面内進行，於在此水平 面内彼此正交之方向芎中v ± 乃门-又疋X軸及γ軸。板保持具 P之保持面，在基準壯能“^野基板 下#丄工進行基板p之移交時之狀態) 7 ^ 在與x軸及Y軸正交之方向設定 ’《光學系統PL之光轴平行於2軸。此外 軸、Y軸及Z軸之各方向分 、、也 』稱為ΘΧ方向、0γ方向及0 乙万向。 第1移動機構33具有務g k h 機構本體35上且保… 5與配置於移動 ^ '、寺板保持具9之保持部34。移動機構本 體35係藉由氣體軸承被 非接觸方式支承於未圖示之導引 面（基部），能在導引面上移動 板保持具9係在保接右其4 XY方向。基於此種構成， 光學系# ..... 土 ρ之狀態下，於光射出側（投影 先干糸統PL之像面側)在導弓I面之既定區域内移動。 移動機構本體3 5能Μ I a Λ 粗動U 包含例如線性馬達等致動器之 3Λ^Γ乍動’在導引面上移動hy平面内。保持部 相tTJll包含例如音圈馬達等致動11之微動系統之作動， 部:移=構本體35移動……、π方向。保持 4由包含㈣系統及微動系統之基板載台驅動系統 動，在保持有基板Ρ之狀態下，移動於X軸、m 201142977 軸、0X、0Y及0Z方向之六個方向。 曝光裝置1係在於上述板保持具9上載置有長方形基 板P之狀L下進行步進掃描方式之曝&，將形成於光罩Μ 之圖案依序轉印至基板Ρ上之複數個例如四個曝光區域（圖 案轉印區域)。亦即’此曝光裝置），係藉由來自照明系統 之曝光用光IL，在光罩Μ上之狹縫狀照明區域被照明之狀 態下’藉由未圖示之控帝j器透過未圖示之驅動系統使保持 光罩Μ之光罩載台與保持基板ρ之板保持具9同步移動於 既定之掃描方向（此處為γ軸方向），而於基板ρ上之一個曝 光區域轉印光罩Μ之圖案、亦即進行掃描曝光。此外，本 實施形態之曝光裝置丨，係構成所謂多透鏡型掃描曝光裝 置，即投影光學系統PL具有複數個投影光學模組、上述照 明系統包含與複數個投影光學模組對應之複數個照明模 組。 在此個曝光區域之掃描曝光結束後，進行使板保持 八9於X方向移動既定量而達次一曝光區域之掃描開始位 置之步進動作。接著，曝光裝置本體3,藉由反覆進行此種 知彻曝光與步進動作，而依序於四個曝光區域轉印光罩Μ 之圖案。 搬入部4’如圖2所示具備在相鄰曝光裝置1而配置之 塗布顯影機（未圖示）搬入有塗布有感光劑之基板Ρ時支承 °亥基板.Ρ之一面（下面）之搬入用台40、以及移動該搬入用 ° 40之第2移動機構43。此外，搬入部4能調整搬入至搬 入用台40之基板卩之溫度。 201142977 第2移動機構43具有移動機構 =本“.上且保持搬入用台4。之保持部44。= 本體45係藉由裔舻缸石、士、，#上 砂助機構 3由孔體軸承被以非接觸方式支承於未圖示之導 面，旎在導引面上移動於χγ 问基於此種構成，搬入 乂 '在保持有基板ρ之狀態下在導引面之既定區域内 夕*夕，相對未圖示導引面之移動機構本體45之支承 不限定於氣體轴承之支承，亦能❹與氣體軸承不同之周 〇之導引機構（相對導引面之驅動機構）。 移動機構本體45與上述移動機構本體 ^能在導引面上移動於ΧΥ平面内。又，保持部44斑上籌 ，保持部34為相同構成，能相對移動機構本㈣移動於ζ :、ΘΧ、ΘΥ方向。保持部44能在保持有基板ρ之狀態 ’移動於X軸、Υ軸、ζ軸、mY及 個方向。 •搬出部5’如圖2所示具備在移交已藉由曝光裝置本體 ^曝光處理之基板P時支承該基板p之—面（下面）之搬 用台5〇、.以及移動該搬出用台5〇之第3移動機構53。 第3移動機構53具有移動機構本體55與配置於移動 2本體55上且保持搬出用台5G之保持部54。移動機構 55係猎由氣體軸承被以非接觸方式支承於未圖示之導 =面’能在導引面上移動於.XY方向。基於此種構成，搬出 移：:。能在保持有基板。之狀態下在導引面之既定區域内 移動機構本體55與上述移動機構本體35、45為相同 11 201142977 構成，能在導引面上移動於灯平面内 上述保持部34、44為相同構成，能相對，持部54與 移動於z轴、θ X、θ γ方㈣持部5 4動：本體5 5According to a third aspect of the present invention, there is provided a conveying apparatus comprising: a first support portion that supplies a gas to one surface of the substrate, and is capable of supporting the substrate by the gas core; and the support portion of the crucible 2 can support the substrate The driving unit is configured to move at least one of the first and second support portions so that the first and second support portions approach or contact each other and are arranged in the J direction; and the transfer portion ′ One of the first and second support portions, which is arranged by the driving portion, -fr 6 < τ 4: -r , and the substrate to be supported by the driver moves to the other side in the first direction. According to a second aspect of the present invention, there is provided a conveying apparatus which is provided with a first bearing for supplying a gas to one surface of a substrate, and capable of suspending and supporting the substrate through the gas; c, , ^ 2 and 3 The support portion can support the other side of the substrate; the ith drive assists the movement of at least one of the first and second support portions, and the '" and the second support portions are adjacent to each other or in contact with each other. The first direction flute, the second drive unit moves at least one of the first and third supports 4, and the first and third support portions approach or contact each other and are arranged in the second direction. ; 1st transfer.排列 排列 排列 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 The second drive unit of the second aspect described above is arranged in the front...the third branch of the support portion is described. The supported substrate moves toward the front side of the support portion J in the second direction. According to the invention: the invention of the 帛3 aspect of the invention provides a method for carrying and transporting, and includes: enabling the supply of 气体1 gas to one side of the substrate to suspend the yoke 1, and the ritual The support portion of the Ϊ 帛 1 and the support for supporting the substrate: at least one of the support portions is moved such that the first and second regions are in contact with each other and arranged in the first direction (four); and the household hall is arranged The substrate supported by the second and second support portions is moved to the other side in the first direction. (4) The 帛4 aspect of the present invention provides a method of transporting a sheet, which comprises: enabling a gas to be supplied through one surface of the substrate: supporting a substrate supporting the substrate and supporting the substrate At least one of the support portions of the front face 2 is moved so that the i-th and the second branch portions approach or contact each other and are arranged in the 帛i direction; and the arrangement is described as follows: The substrate supported by the support portion moves toward the i-th support portion side along the first direction, and at least one of the first factory support portion and the third support portion capable of supporting the one surface of the substrate is moved to帛丨^3 t the operation of the receiving portions being close to or in contact with each other and arranged in the second direction; and the third support supported by the substrate supported by the first support portion arranged in the third support portion along the second direction The movement of the side. According to a fifth aspect of the present invention, there is provided a conveying apparatus comprising: a first supporting portion that supplies a gas to one surface of the substrate, and is capable of supporting the substrate by the gas suspension; and the support portion of the crucible 2; And supporting the one surface of the substrate; the driving unit moves at least one of the first and second support portions, and the first and second support portions are adjacent to or in contact with each other; and the transfer 2 is performed by the foregoing The substrate supported by the second support portion arranged in the driving portion moves toward the i-th support portion side in the arrangement direction, and the jacking mechanism 'supports the supply of the gas to be placed on the i-th support portion The substrate of the mounting portion is lifted up above the mounting portion, and the unloading mechanism lifts the substrate from the first support portion by being supported by the loading portion above the mounting portion. According to a sixth aspect of the present invention, there is provided a transport method for transporting a substrate, comprising: an ith support portion that allows a gas supplied to one surface of the substrate to be suspended to support the substrate, and a surface capable of supporting the substrate At least one of the second support portions moves so that the second and second support portions are close to or in contact with each other, and the substrates supported by the arranged second support portions are moved toward the first direction along the arrangement direction The operation of transferring the side of the support portion; stopping the supply of the gas, supporting the operation of placing the substrate placed on the mounting portion of the first support portion and lifting it up above the mounting portion; and supporting The operation of the substrate above the mounting portion from the first support portion. According to a seventh aspect of the invention, there is provided an exposure apparatus for exposing a substrate by exposure light, comprising: the transfer device that holds the substrate and moves the substrate to an irradiation region of the exposure light. According to an eighth aspect of the present invention, there is provided an apparatus manufacturing method comprising: an operation of transferring the pattern on the substrate by using the exposure device; and an operation of processing the substrate on which the pattern is transferred according to the pattern . According to the aspect of the invention, the transfer of the substrate can be performed without causing displacement or deformation. [Embodiment] An embodiment of the present invention will be described with reference to the drawings. Further, the present invention is not limited to this. In the following, an embodiment of the present invention will be described with respect to an embodiment of the present invention. The present invention is directed to an apparatus for performing exposure processing (a method for exposing a pattern for a liquid crystal display element to a substrate coated with a photosensitive agent). (First Embodiment) Fig. 1 is a cross-sectional plan view showing a schematic configuration of an exposure apparatus according to an embodiment of the present invention. As shown in FIG. 1, the exposure apparatus 1 includes an exposure apparatus main body 3, a loading unit 4, and a carry-out unit 5 for exposing a pattern for a liquid crystal display element to a substrate, and these are highly cleaned and housed in a chamber 2 adjusted to a predetermined temperature. Inside. In the present embodiment, the substrate is a large glass plate, and the size of one side thereof is, for example, 50 mm or more. Fig. 2 is a perspective view showing the appearance of a specific configuration in the chamber 2. As shown in FIG. 2, the exposure apparatus main body 3 includes an illumination system (not shown) that illuminates the mask M with the exposure light IL, and a mask holder that holds the mask 510 in which the pattern for the liquid crystal display element is formed, and is disposed. The projection optical system 201142977 under the mask stage is designed to be able to be placed on the base (not shown) of the dead PL under the drying of the 彳 雒弑 雒弑 雒弑 & amp amp , , 下方 下方 下方 下方The plate holder 9 as the substrate holder and the accompanying plate holder 9 are placed in the chamber mechanism 33. The first movement of the second movement; te:: in the following description, the two-dimensional movement of the base portion (not shown) provided in the chamber 2 is performed in a horizontal plane, and is orthogonal to each other in the horizontal plane.芎中 v ± 乃门-又疋X-axis and γ-axis. The holding surface of the plate holder P, in the state of the base strength "under the substrate", when the substrate p is handed over, 7 ^ is set in the direction orthogonal to the x-axis and the Y-axis "the light of the optical system PL" The axis is parallel to the two axes. The other directions of the axis, the Y axis and the Z axis are also referred to as the ΘΧ direction, the 0 γ direction, and the 0 MW direction. The first moving mechanism 33 has the gkh mechanism body 35 and is protected... 5 and a holding portion 34 disposed on the moving plate and the temple plate holder 9. The moving mechanism main body 35 is supported by a gas bearing in a non-contact manner on a guide surface (base portion) not shown, and can be on the guide surface The moving plate holder 9 is secured to the right 4 XY direction. Based on this configuration, the optical system is in the state of the ground ρ, on the light emitting side (projecting the image side of the pre-drying PL) Moving in a predetermined area of the guide bow I. The moving mechanism body 3 5 can Μ I a 粗 the coarse movement U includes an actuator such as a linear motor that moves in the hy plane on the guiding surface. The part phase tTJ11 includes the actuation of the micro-motion system of the actuation 11 such as a voice coil motor, and the movement: the movement of the body 35 is moved..., the π direction. The holding 4 is driven by the substrate stage driving system including the (4) system and the micro-motion system, and moves in the six directions of the X-axis, the m 201142977 axis, the 0X, the 0Y, and the 0Z direction while maintaining the substrate Ρ. In the above-described plate holder 9 in which the rectangular substrate P is placed, the stepping scanning method is performed, and the pattern formed on the mask 依 is sequentially transferred onto the substrate 之, for example, four exposure regions. (pattern transfer area), that is, 'this exposure apparatus', by the exposure light IL from the illumination system, in a state where the slit-shaped illumination area on the mask 被 is illuminated' by means of not shown The control device drives the mask holder holding the mask 与 in synchronization with the plate holder 9 holding the substrate ρ in a predetermined scanning direction (here, the γ-axis direction) through the driving system (not shown), and the substrate ρ The exposure area of the exposure area is transferred, that is, the scanning exposure is performed. Further, the exposure apparatus of the present embodiment constitutes a so-called multi-lens type scanning exposure apparatus, that is, the projection optical system PL has a plurality of projection optical modes. Group, the above photo The display system includes a plurality of illumination modules corresponding to the plurality of projection optical modules. After the scanning exposure of the exposure area is completed, the scanning of the board is maintained in the X direction and the scanning of the exposure area is started. Stepping operation of the position. Next, the exposure apparatus main body 3 transfers the pattern of the mask 依 in sequence to the four exposure areas by repeating such a clear exposure and stepping operation. The loading unit 4' is as shown in Fig. 2. The loading table 40 that supports one surface (lower surface) of the substrate when the substrate is coated with the photosensitive agent is placed in a coating and developing machine (not shown) disposed adjacent to the exposure device 1 and moves The second moving mechanism 43 of the 40 is moved in. Further, the loading unit 4 can adjust the temperature of the substrate 搬 carried into the loading table 40. 201142977 The second moving mechanism 43 has a moving mechanism = the upper portion of the holding unit 4 that holds the loading table 4. The main body 45 is made of a hole bearing by the 舻 舻 、 stone, stone, and #上砂助机构3 It is supported by a guide surface (not shown) in a non-contact manner, and the 旎 is moved on the guide surface by χγ. Based on such a configuration, the loading 乂' is held in a predetermined area of the guide surface while the substrate ρ is held. Further, the support of the moving mechanism main body 45 with respect to the guide surface not shown is not limited to the support of the gas bearing, and the guide mechanism (the driving mechanism for the opposite guide surface) different from the gas bearing can be used. The body 45 and the moving mechanism body can move in the plane of the plane on the guiding surface. Further, the holding portion 44 is raised, and the holding portion 34 has the same configuration, and can move relative to the moving mechanism (4) to ζ:, ΘΧ, ΘΥ The holding portion 44 can be moved to the X-axis, the x-axis, the x-axis, and the mY in a state in which the substrate ρ is held. The carry-out portion 5' is provided as shown in Fig. 2 by the exposure apparatus body. When the substrate P is exposed, the surface of the substrate p is supported (the lower surface) The moving table 5 and the third moving mechanism 53 that moves the loading and unloading table 5A. The third moving mechanism 53 includes a moving mechanism main body 55 and a holding portion that is disposed on the moving main body 55 and holds the carrying-out table 5G. 54. The moving mechanism 55 is supported by a gas bearing that is non-contactly supported by a guide surface (not shown) that can move in the .XY direction on the guide surface. Based on such a configuration, the movement can be maintained. In the state in which the substrate is provided, the moving mechanism main body 55 is formed in the same area as the moving mechanism bodies 35 and 45 in the predetermined area of the guiding surface, and can be moved on the guiding surface in the plane of the lamp, and the holding portions 34 and 44 are With the same configuration, the holding portion 54 can move relative to the z-axis, θ X, and θ γ square (4) holding portion 5 4: body 5 5

之狀能下似* 在保持有基板P 之“下’移動於X軸、γ軸、z 向之六個方向。 及ΘΖ方 圖3:::照圖3A及圖3B說明板保持具9之周邊構成。 =且係保持具9之俯視構成之圖，圖3B錢示板 之側視構成之圖。如圖3A所示，於板保持具9形 成有載置基板P之基板載置部31。基板載置部^之上部作 士具有板保持具9對基板p之實質保持面為良好之平面 度。再者，於基板載置部31上面設有複數個用以使基板p 仿倣此面而緊貼之吸w κ卜各吸引孔K1連接於未圖示 之真空泵。 又，於基板載置部3 1之上面，言免有複數個#由對基板 P之下面喷射空氣等氣體而透過該氣體懸浮支承基板p之氣 體喷射孔K2。各氣體喷射孔K2連接於未圖示之氣體喷射 用泵。此外，吸引孔K1與氣體喷射孔Κ2交互配置成格子 狀。 又，於板保持具9之周邊部設有在基板ρ搬入時用以 導引該基板Ρ之導引用銷36與規定基板ρ對板保持具9之 基板載置部31之位置之定位銷37。此等導引用銷36及定 位銷37能在曝光裝置本體3内與板保持具9 一起移動。 板保持具9如圖3Β所示，於其側面部9a具備檢測出 與搬入用台40及搬出用台5Q之相對位置之位置檢測感測The shape can be as follows: * The "lower" of the substrate P is held in the six directions of the X-axis, the γ-axis, and the z-direction. And the figure 3::: FIG. 3A and FIG. 3B illustrate the plate holder 9 Fig. 3B is a side view of the structure of the holder 9 and Fig. 3B shows a side view of the board. As shown in Fig. 3A, the board holder 31 is formed with the substrate holder 31 on which the substrate P is placed. The upper portion of the substrate mounting portion has a flatness with respect to the substantial holding surface of the substrate holder 9 for the substrate p. Further, a plurality of the substrate mounting portion 31 are provided on the substrate mounting portion 31 to simulate the substrate p. Each of the suction holes K1 is connected to a vacuum pump (not shown). Further, on the upper surface of the substrate mounting portion 31, a plurality of # are prohibited from being ejected by gas such as air from the lower surface of the substrate P. The gas is suspended in the gas injection hole K2 of the support substrate p. The gas injection holes K2 are connected to a gas injection pump (not shown). The suction holes K1 and the gas injection holes 2 are alternately arranged in a lattice shape. The peripheral portion of 9 is provided with a guide pin 36 for guiding the substrate Ρ when the substrate ρ is loaded, and a predetermined substrate ρ pair The positioning pin 37 holding the position of the substrate mounting portion 31 of the holder 9 is provided. The guiding pin 36 and the positioning pin 37 can be moved together with the plate holder 9 in the exposure device body 3. The plate holder 9 is as shown in Fig. 3A. The side surface portion 9a is provided with position detection sensing for detecting the relative position with the loading table 40 and the carrying-in table 5Q.

S 12 201142977 m 器19位置檢測感測器19包含用以檢測出相對搬入用二 40及搬出用台5〇之相對距離之距離檢測用感測器與用 以檢測出相對搬入用台4〇及搬出用台50之相對高度之高 度檢測用感測器19b。此外，於搬入用台4〇及搬出用台5〇 中之與位置檢測感測器19對應之位置形成有凹部藉此， 防止位置檢測感測器19與搬入用台40及搬出用台5〇干涉。 其次’參照圖4A及圖5B說明搬入部4之主要部位構 成。圖4A係顯示搬入用台4〇之周邊構成之俯視圖，圖4b 係顯示圖4A之A — A線箭視剖面之圖。 如圖4A及4B所示，搬入部4設有將基板p從搬入用 台40往板保持具9移送之第i移送部42。第i移送部u 包含導引部42a與抵接於基板p之抵接部42b。 於搬入用台40之上面形成有沿一方向（該圖所示之γ 方向）形成之兩個槽狀凹部40a。於此凹部4〇a内設有上述 導引部42a。於導引部42a，以從搬入用台4〇上面突出之狀 ’“、女裝有上述抵接部42b。抵接部42b係由例如橡膠等彈性 構件構成，能減低抵接時對基板p之損傷。 又，於搬入用台4〇之上面，設有複數個藉由對基板p 之下面噴射空氣等氣體而透過該氣體懸浮支承基板p之氣 體喷射孔K3。各氣體喷射孔K3連接於未圖示之氣體喷射 用泵。 再者，於搬入用台40之上面設有複數個用以使基板ρ 仿傲此面而緊貼之吸引孔Κ4β各吸引孔Κ4連接於未圖示 之真空泵。氣體喷射孔Κ3與吸引孔Κ4沿γ方向交互配置 13 201142977 成格子狀。此外’氣體喷射孔K3與吸引孔K4不限定於此 種格子狀之配置，亦可以各種形態配置（例如沿γ方向交互 配置）。又，氣體喷射孔Κ3與吸引孔Κ4不限定於彼此獨立 設置，亦可將同一孔兼作為氣體喷射孔Κ3及吸引孔Κ4。 此情形下’可將各孔能適當切換連接於氣體喷射用泵與真 空泵。 又’於搬入用台40形成有貫通孔47，該貫通孔47可 供如後所述用以在與塗布顯影機（未圖示）之間進行基板ρ 之移父之上下動機構之基板支承銷插通。 其次，參照圖5Α及圖5Β說明搬出部50之主要部分構 成。如圖5Α及圖5Β所示，搬出部5〇係將基板ρ從板保持 具9往搬出用台50移送之第2移送部52。第2移送部52 包含導引部52a與吸附保持基板ρ之吸附部5几。 50之上面形成有沿一方向（該圖所示之γ 於搬出用台 方向）形成之兩個槽狀凹部5〇a。於此凹部5〇a内設有上述 ^引。P 52a。於導引部52a，以從搬出用台5〇上面突出之^ 態女裝有上述吸附部52b。吸附部52b包含例如藉由真 附吸附保持基板P之真空吸附墊。 於吸附部52b，設有在基板搬出時與從板保持# 基板P抵接之抵接部58。此抵接部58係由例如榜 專5早性構件構成。 又，於搬出用台5〇之上面 设有複數個藉由對基^ 之下面噴射空氣等氣體而透過該氣體懸浮支承基板ρ , 體喷射孔K5。各氣料射孔K5連接於未圖示之氣體 201142977 用泵。 再者’於搬出用台50之上面設有複數個用以使基板p 仿傲此面而緊貼之吸引孔K6。各吸引孔κ6連接於未圖示 之真空泵。此外，氣體喷射孔Κ5與吸引孔Κ6交互配置成 格子狀。 又，於搬出用台50形成有貫通孔57，該貫通孔57可 供如後所述用以在與塗布顯影機（未圖示）之間進行基板ρ 之移交之上下動機構之基板支承銷插通。 其次，參照圖6〜圖15說明曝光裝置丨之動作。具體 而言，主要說明搬入部4與板保持具9之間之基板ρ之移 父動作、以及板保持具9與搬出部5 〇之間之基板ρ之移交 動作。此外，本實施形態中，搬入部4之搬入用台4〇與搬 出部5之搬出用台50配置於同一水平面内之相異位置。亦 即，搬入用台40與搬出用台50配置於在俯視狀態（從圖2 所示+ Ζ方向觀看之狀態）下彼此不重疊之位置。 首先，對搬入部4搬入在塗布顯影機（未圖示）塗布有感 光劑之基板Ρ。此時，位於搬入用台4〇之下方之上下動機 構49係透過貫通孔47先將基板支承銷49a配置於搬入用台 40上方。其次，塗布顯影機（未圖示）之臂部48係如圖6 = 示插入基板支承銷49a之間。藉由臂部48下降而將基板ρ 往基板支承銷49a移交後，從搬入部4.退離。上下動機構 49藉由使支承有基板P之基板支承銷49a下降而結束基板 P對搬入用台40之搬入動作。其後，藉由驅動真空泵，基 板P透過吸引孔K4被吸附保持於搬入用台4〇之上面。 15 201142977 其·*人’板保持具9係如圖7 A所示，以接近搬入部4之 搬入用台40之方式移動。具體而言，第i移動機構33係 將板保持具9及搬入用台40以沿Y方向接近之狀態排列。 此處’所謂板保持具9及搬入用台4〇接近之狀態，係指在 後述之基板P之移交時分離了基板p之移動可順暢進行之 距離之狀態。 又，在排列搬入用台40與板保持具9時能驅動第2移 動機構43。如此，即能使搬入用台40及板保持具9在短時 間移動至基板P之移交位.置，能縮短基板p之搬入動作所 需之時間。此情形下，搬出用台50係退離至不干涉搬入用 台40之位置。 又’基板P由於透過吸引孔K4被吸附保持於搬入用台 4〇之上面’因此能防止在第2移動機構43之驅動時基板p 在搬入用台40上移動。 本實施形態中，如圖7B所示，在使搬入用台40及板 保持具9接近時’基板p配置成較板保持具9高。亦即， 第1移動機構33係以支承有基板p之搬入用台4〇之上面 較板保持具9之上面高之方式使板保持具9接近搬入用台 4〇 °此外’亦能藉由第2移動機構43使搬入用台4〇上升 以使搬入用台40之上面較板保持具9之上面高。 此外，第1移動機構33亦能將板保持具9及搬入用台 40在接觸之狀態下排列。如此，即能順利地進行後述之板 保持具9及搬入用台40間之基板P之移交。 其-人’搬入用台40係如圖8所示，從形成於上面之複S 12 201142977 m 19 position detecting sensor 19 includes a distance detecting sensor for detecting a relative distance between the loading unit 40 and the carrying-in table 5, and detecting the relative loading table 4 The height detecting sensor 19b that moves the relative height of the table 50 is carried out. Further, a recessed portion is formed at a position corresponding to the position detecting sensor 19 among the loading table 4 and the carrying-in table 5, thereby preventing the position detecting sensor 19, the loading table 40, and the carrying-in table 5 from being placed. put one's oar in. Next, the main part configuration of the loading unit 4 will be described with reference to Figs. 4A and 5B. Fig. 4A is a plan view showing a configuration of the periphery of the loading table 4, and Fig. 4b is a view showing a cross section taken along the line A-A of Fig. 4A. As shown in Figs. 4A and 4B, the loading unit 4 is provided with an i-th transfer unit 42 for transferring the substrate p from the loading table 40 to the plate holder 9. The i-th transfer unit u includes a guide portion 42a and a contact portion 42b that abuts against the substrate p. Two groove-shaped recesses 40a formed in one direction (the γ direction shown in the figure) are formed on the upper surface of the loading table 40. The guide portion 42a is provided in the recess 4a. In the guide portion 42a, the contact portion 42b is formed in a shape that protrudes from the upper surface of the loading table 4, and the contact portion 42b is made of an elastic member such as rubber, and the substrate p can be reduced when the contact is made. Further, a plurality of gas injection holes K3 that are transmitted through the gas suspension support substrate p by blowing a gas such as air onto the lower surface of the substrate p are provided on the upper surface of the loading table 4, and the gas injection holes K3 are connected to each other. a pump for gas injection (not shown). Further, a plurality of suction holes β 4 for attracting the substrate ρ to the surface of the loading table 40 are connected to a vacuum pump (not shown). The gas injection hole 3 and the suction hole 4 are alternately arranged in the γ direction 13 201142977. The gas injection hole K3 and the suction hole K4 are not limited to such a lattice arrangement, and may be arranged in various forms (for example, in the γ direction). Further, the gas injection hole 3 and the suction hole 4 are not limited to being disposed independently of each other, and the same hole may also serve as the gas injection hole 3 and the suction hole 4. In this case, the holes can be appropriately switched and connected. gas An injection pump and a vacuum pump are formed. Further, a through hole 47 is formed in the loading table 40, and the through hole 47 can be used to move the substrate ρ between the coating and developing machine (not shown) as will be described later. The substrate support pin of the vertical movement mechanism is inserted. Next, the main part of the carry-out portion 50 will be described with reference to Figs. 5A and 5B. As shown in Fig. 5A and Fig. 5B, the carry-out portion 5 is configured to move the substrate ρ from the plate holder 9 The second transfer unit 52 is transported by the transfer unit 50. The second transfer unit 52 includes a guide portion 52a and a suction unit 5 that adsorbs the holding substrate ρ. The upper surface of the 50 is formed in one direction (the γ shown in the figure is carried out) Two groove-shaped recesses 5a formed in the table direction. The above-mentioned recesses 5a are provided in the recesses 5a. The guides 52a are protruded from the top of the carry-out table 5 The adsorption unit 52b is provided. The adsorption unit 52b includes a vacuum suction pad that holds the substrate P by, for example, a positive adsorption. The adsorption unit 52b is provided with an abutting portion 58 that comes into contact with the substrate P from the substrate P when the substrate is carried out. The abutting portion 58 is composed of, for example, a member of the front panel 5, and is provided on the top of the unloading table 5 A plurality of gases are ejected through the gas to support the substrate ρ and the body injection hole K5. The gas perforation K5 is connected to a gas (not shown) 201142977. A plurality of suction holes K6 for abutting the substrate p against the surface are provided on the upper surface of the stage 50. Each of the suction holes κ6 is connected to a vacuum pump (not shown). Further, the gas injection holes 5 are alternately arranged with the suction holes Κ6. Further, a through hole 57 is formed in the carry-out table 50, and the through hole 57 can be used to move the mechanism above the transfer of the substrate ρ between the coating and developing machine (not shown) as will be described later. The substrate supporting pin is inserted. Next, the operation of the exposure device 说明 will be described with reference to Figs. 6 to 15 . Specifically, the shifting operation of the substrate ρ between the loading unit 4 and the plate holder 9 and the transfer operation of the substrate ρ between the plate holder 9 and the carrying-out unit 5 are mainly described. Further, in the present embodiment, the loading table 4 of the loading unit 4 and the loading table 50 of the carrying unit 5 are disposed at different positions in the same horizontal plane. In other words, the loading table 40 and the unloading table 50 are disposed at positions that do not overlap each other in a plan view (a state viewed from the + Ζ direction shown in Fig. 2). First, the substrate 4 to which the photosensitive agent is applied to a coating and developing machine (not shown) is carried into the loading unit 4. At this time, the upper and lower movable mechanism 49 located below the loading table 4 is placed above the loading table 40 through the through hole 47. Next, the arm portion 48 of the coating and developing machine (not shown) is inserted between the substrate supporting pins 49a as shown in Fig. 6 = . After the arm portion 48 is lowered, the substrate ρ is transferred to the substrate supporting pin 49a, and then retracted from the loading portion 4. The vertical movement mechanism 49 terminates the loading operation of the substrate P on the loading table 40 by lowering the substrate supporting pin 49a on which the substrate P is supported. Thereafter, by driving the vacuum pump, the substrate P is adsorbed and held on the upper surface of the loading table 4 through the suction hole K4. 15 201142977 The *man's plate holder 9 is moved as it is close to the loading table 40 of the loading unit 4, as shown in Fig. 7A. Specifically, the i-th moving mechanism 33 arranges the plate holder 9 and the loading table 40 in a state of being approached in the Y direction. Here, the state in which the plate holder 9 and the loading table 4 are close to each other is a state in which the movement of the substrate p can be smoothly separated at the time of the transfer of the substrate P to be described later. Further, the second moving mechanism 43 can be driven when the loading table 40 and the plate holder 9 are arranged. In this way, the loading table 40 and the plate holder 9 can be moved to the transfer position of the substrate P in a short time, and the time required for the loading operation of the substrate p can be shortened. In this case, the unloading table 50 is retracted to a position where it does not interfere with the loading table 40. Further, the substrate P is adsorbed and held on the upper surface of the loading table 4 through the suction hole K4. Therefore, it is possible to prevent the substrate p from moving on the loading table 40 when the second moving mechanism 43 is driven. In the present embodiment, as shown in Fig. 7B, when the loading table 40 and the plate holder 9 are brought close to each other, the substrate p is disposed higher than the plate holder 9. In other words, the first moving mechanism 33 can also bring the plate holder 9 closer to the loading table 4° so that the upper surface of the loading table 4 that supports the substrate p is higher than the upper surface of the plate holder 9 The second moving mechanism 43 raises the loading table 4 so that the upper surface of the loading table 40 is higher than the upper surface of the plate holder 9. Further, the first moving mechanism 33 can also arrange the plate holder 9 and the loading table 40 in contact with each other. Thus, the transfer of the substrate P between the plate holder 9 and the loading table 40, which will be described later, can be smoothly performed. The 'person' moving into the table 40 is as shown in Fig. 8, and is formed from the above.

S 16 201142977 數個氣體噴射孔&3噴射氣體，透過該氣體將基板p以懸浮 狀態支承。另一方面，板保持具9在接取基板p時，係先 從形成於上面之複數個氣體噴射孔K2喷射氣體。 搬入部4係在將基板ρ懸浮支承於搬入用台40上之狀 態下，如圖9所示使抵接部42b抵接於基板ρ之一端部。 抵接部42b係藉由沿凹部4〇a内之導引部42a移動而將基板 p往板保持具9側移動。 由於基板P成為懸浮於搬入用台4〇上之狀態，因此抵 接部42b能使基板ρ順利地滑動至板保持具9側。此外， 板保持具9之上面’係如上所述成為懸浮支承基板p<>此處， 亦可使從氣體噴射孔K3，K2噴射之氣體具有指向性。 藉由抵接部42b在搬入用台4〇上面滑動之基板ρ，係 如圖10所不，往板保持具9之上面順利地移載。本實施形 態中，由於搬入用台40之上面較板保持具9之上面高，因 此基板P能在不接觸板保持具9側面之情形下順利地移載 往板保持具9上。 基板P如圖9所示，係在被設於板保持具9周邊部之 導引用銷36規定在該圖中χ方向之位置之狀態下滑動。抵 接。卩42b，係使基板ρ移動至抵接於設於板保持具9中基板 搬送方向下游側之疋位銷3 7。基板p，係被導引用銷3 6規 定在δ玄圖中X方向之位置，且藉由被定位銷37及抵接部42b 挾持而成為該圖中γ方向之位置被規定之狀態。板保持具9 係停止來自氣體噴射孔K2之氣體喷射。基板p係如圖u 所不，在對基板載置部3丨對齊之狀態下被載置。 17 201142977 此外，以往將基板載置於板保持具時，有可能產生基 板之載置偏移（從既定載置位置之位置偏移）或基板之變 形。產生此載置偏移之原因之一，可考量係例如在基板之 載置前-刻因於基板與板保持具之間產生之薄空氣層使基 板成為㈣狀態。X，使基板之變形產生之原因之一，可 考量係例如在載置基板後於基板與板保持具之間介在空氣 滯留而基板成為膨脹之狀態。 相對於此，本實施形態中，由於基板p係如上述在藉 由氣體之喷射而懸浮之狀態下被搬送，因此係無扭曲地在 高平面度狀態下被移交至板保持具9。又，由於基板P係從 被懸浮支承之高度往基板載置部31載置，因此可防止於基 板P與基板載置部31之間產生空氣滞留或空氣層。因此， 可抑制基板p成為膨脹狀態，防止基板p之載置偏移或變 形之產生。因此，能於相對板保持具9之既定位置以平面 度高之狀態載置基板Ρβ其後，藉由驅動真空泵，基板p即 透過吸引孔Κ1被吸附保持於基板載置部3丨之上面。 於板保持具9載置基板ρ後，光罩μ係被以來自照明 系統之曝光用光IL照明。被以曝光用光IL照明之光罩Μ 之圖案，係透過投影光學系統PL投影曝光至載置於板保持 具9之基板P。 曝光裝置1中，由於能如上所述地將基板p良好地載 置於板保持具9上，因此能於基板ρ上之適當位置高精度 地進行既定之曝光，而能實現信賴性高之曝光處理。 本實施形態中’在對基板P進行曝光處理中，或如後S 16 201142977 Several gas injection holes & 3 spray gas, through which the substrate p is supported in a suspended state. On the other hand, when the substrate holder 9 picks up the substrate p, it first ejects gas from a plurality of gas ejection holes K2 formed on the upper surface. The loading unit 4 is in a state in which the substrate ρ is suspended and supported by the loading table 40, and the abutting portion 42b is brought into contact with one end portion of the substrate ρ as shown in Fig. 9 . The abutting portion 42b moves the substrate p toward the plate holder 9 side by moving along the guiding portion 42a in the recessed portion 4a. Since the substrate P is suspended in the loading table 4, the abutting portion 42b can smoothly slide the substrate ρ to the side of the plate holder 9. Further, the upper surface of the plate holder 9 is a suspension supporting substrate p<> as described above. Here, the gas ejected from the gas ejection holes K3, K2 may have directivity. The substrate ρ which is slid on the loading table 4 by the abutting portion 42b is smoothly transferred to the upper surface of the plate holder 9 as shown in Fig. 10 . In the present embodiment, since the upper surface of the loading table 40 is higher than the upper surface of the plate holder 9, the substrate P can be smoothly transferred to the plate holder 9 without contacting the side surface of the plate holder 9. As shown in Fig. 9, the substrate P is slid in a state in which the guide pin 36 provided at the peripheral portion of the plate holder 9 is positioned in the χ direction in the drawing. Abut. In the case of the crucible 42b, the substrate ρ is moved to abut against the clamp pin 37 provided on the downstream side of the substrate holder 9 in the substrate transport direction. The substrate p is guided by the guiding pin 36 in the X direction in the δ magnifying glass, and is held by the positioning pin 37 and the abutting portion 42b so that the position in the γ direction in the figure is defined. The plate holder 9 stops the gas injection from the gas injection hole K2. The substrate p is placed in a state in which the substrate mounting portion 3 is aligned as shown in FIG. 17 201142977 In addition, when the substrate is placed on the plate holder in the past, there is a possibility that the substrate is displaced (shifted from the position of the predetermined mounting position) or the substrate is deformed. One of the causes of this placement offset can be considered, for example, by placing a thin layer of air between the substrate and the plate holder before the substrate is placed so that the substrate is in the (four) state. X. One of the causes of the deformation of the substrate is, for example, a state in which the substrate is inflated between the substrate and the plate holder after the substrate is placed, and the substrate is expanded. On the other hand, in the present embodiment, the substrate p is conveyed in a state of being suspended by the ejection of the gas, and is transferred to the plate holder 9 in a high flatness state without distortion. Further, since the substrate P is placed on the substrate mounting portion 31 from the height at which the substrate is suspended, it is possible to prevent air stagnation or an air layer from being generated between the substrate P and the substrate placing portion 31. Therefore, the substrate p can be suppressed from being in an expanded state, and the occurrence of offset or deformation of the substrate p can be prevented from occurring. Therefore, the substrate Ρβ can be placed in a state where the flatness is high with respect to the predetermined position of the plate holder 9, and then the substrate p is sucked and held by the suction hole Κ1 on the upper surface of the substrate mounting portion 3 by driving the vacuum pump. After the substrate holder 9 is placed on the substrate ρ, the mask μ is illuminated by the exposure light IL from the illumination system. The pattern of the mask 照明 illuminated by the exposure light IL is projected and exposed to the substrate P placed on the board holder 9 by the projection optical system PL. In the exposure apparatus 1, since the substrate p can be satisfactorily placed on the plate holder 9 as described above, the predetermined exposure can be performed with high precision at an appropriate position on the substrate ρ, and the exposure with high reliability can be realized. deal with. In the present embodiment, 'in the exposure processing of the substrate P, or as follows

S 18 201142977 •d 述在將曝光處理完畢之基板p搬送至搬出部5之期間，能 將藉由塗布顯影機（未圖示）而塗布有感光劑之次一基板p 載置於搬入部4之搬入用台40上。 其次’說明曝光處理結束後從板保持具9搬出基板p 之搬出動作。 曝光處理結束後，板保持具9係如圖12所示，以接近 搬出部5之搬出用台50之方式移動。具體而言，第丨移動 機構33係將板保持具9及搬出用台5〇以沿γ方向接近之 狀態排列。此時，基板Ρ由於透過吸引孔K1被吸附保持， 因此能防止在第丨移動機構33之驅動時基板p在基板載置 部3 1上移動。 又，在排列搬出用台50與板保持具9時能驅動第3移 動機構53。如此，即能使搬出用台5〇及板保持具9在短時 間移動至基板P之移交位置，能縮短基板p之搬出動作所 需之時間。此情形下，搬入用台4〇係退離至不干涉搬出用 台50之位置。 本貫施形態中，板保持具9及搬出用台5〇接近時，與 吏板保持具9及搬人用台4G接近時同樣地，將基板p配置 成較相當於基板p之搬送目的地之板保持具9高。亦即， 第^多動機構33係以使支承有基板p之板保持具9之上面 交搬出用台50之上面高之方式使板保持具9接近搬出用台 5〇。此外，亦能藉由第3移動機構53使搬出用台5〇下降 以使搬出用台50之上面較板保持具9之上面低。 第1移動機構33亦能將板保持具9及搬出用台50在 19 201142977 接觸之狀態下排列。如此，即能順利地進行後述之板保持 具9及搬出用台50間之基板P之移交。 板保持具9係停止真空泵之驅動，解除透過吸引孔K1 之基板P對基板載置部3 1之吸附保持。其次，板保持具9 係如圖1 3所示，從形成於基板載置部3 1上面之複數個氣 體喷射孔K2喷射氣體，透過該氣體將基板p以懸浮狀態支 承。另一方面’搬出部5在接取基板P時’係先從形成於 搬出用台50上面之複數個氣體喷射孔K5喷射氣體。 搬出部5係將第2移送部52之吸附部52b沿導引部52a 往板保持具9之基板載置部31上所懸浮支承之基板p側移 動。定位銷37係如圖14A所示按壓懸浮於基板载置部3 i 上之基板P之端部《藉此，懸浮於基板載置部31上之基板 P往搬出用台50側滑動，而如圖14B所示接觸安裝於吸附 邛52b之抵接部5 8。如此，藉由使用定位銷3 7使基板p往 抵接部58側滑動，而無須使吸附部52b沿滑動部52&移動 至與板保持具9上之基板p對向之位置。在基板p之端部 接觸抵接部58後，吸附部52b即吸附保持基板p，如圖i4c 所示沿導引部52a沿該圖中γ方向移動。 此時，由於基板P係以懸浮於板保持具9上之狀熊 支承，因此吸附部52b能使基板P順利地滑動至搬出用 50側。又’搬出用纟50之上面，係如上所述成為懸浮支; 基板p。此處，亦可使從氣體喷射孔K2，K5喷射之氣體具 指向性。 藉由吸附部52b之移動而在基板載置部31上面滑動之S 18 201142977 •d It is described that the substrate p on which the photosensitive agent is applied by a coating and developing machine (not shown) can be placed on the loading unit 4 while the substrate p that has been subjected to the exposure processing is transported to the carrying-out unit 5 It is moved into the table 40. Next, the unloading operation of carrying out the substrate p from the plate holder 9 after the completion of the exposure process will be described. After the exposure process is completed, the plate holder 9 is moved as it is close to the carry-out table 50 of the carry-out unit 5 as shown in Fig. 12 . Specifically, the second moving mechanism 33 is arranged such that the plate holder 9 and the carry-out table 5 are close to each other in the γ direction. At this time, since the substrate yoke is sucked and held by the suction hole K1, it is possible to prevent the substrate p from moving on the substrate placing portion 31 during the driving of the third moving mechanism 33. Further, when the carry-out table 50 and the plate holder 9 are arranged, the third moving mechanism 53 can be driven. Thus, the carry-out table 5 and the plate holder 9 can be moved to the transfer position of the substrate P in a short time, and the time required for the carry-out operation of the substrate p can be shortened. In this case, the loading table 4 is retracted to a position where it does not interfere with the carrying-out table 50. In the present embodiment, when the plate holder 9 and the carry-out table 5 are approached, the substrate p is disposed to correspond to the transfer destination of the substrate p, similarly to the case where the seesaw holder 9 and the transfer table 4G are close to each other. The board retains 9 high. In other words, the second multi-motion mechanism 33 brings the plate holder 9 closer to the carry-out table 5 so that the upper surface of the upper and lower transfer table 50 of the plate holder 9 supporting the substrate p is higher. Further, the carry-out table 5 is lowered by the third moving mechanism 53 so that the upper surface of the carry-out table 50 is lower than the upper surface of the plate holder 9. The first moving mechanism 33 can also arrange the plate holder 9 and the carry-out table 50 in a state in which 19 201142977 is in contact with each other. Thus, the transfer of the substrate P between the plate holder 9 and the carry-out table 50, which will be described later, can be smoothly performed. The plate holder 9 stops the driving of the vacuum pump, and releases the suction holding of the substrate P that has passed through the suction hole K1 to the substrate placing portion 31. Next, as shown in Fig. 13, the plate holder 9 ejects gas from a plurality of gas ejection holes K2 formed on the upper surface of the substrate mounting portion 31, and the substrate p is supported in a suspended state by the gas. On the other hand, when the unloading unit 5 picks up the substrate P, the gas is ejected from a plurality of gas ejecting holes K5 formed on the upper surface of the unloading table 50. The unloading unit 5 moves the suction portion 52b of the second transfer unit 52 along the guide portion 52a toward the substrate p side suspended and supported by the substrate mounting portion 31 of the plate holder 9. The positioning pin 37 presses the end portion of the substrate P suspended on the substrate mounting portion 3 i as shown in FIG. 14A, whereby the substrate P suspended on the substrate mounting portion 31 slides toward the carrying-out table 50 side, and The contact portion 58 which is attached to the adsorption weir 52b is shown in Fig. 14B. Thus, by sliding the substrate p toward the abutting portion 58 side by using the positioning pin 37, it is not necessary to move the adsorption portion 52b along the sliding portion 52& to the position opposite to the substrate p on the plate holder 9. After the end portion of the substrate p contacts the abutting portion 58, the adsorption portion 52b sucks and holds the substrate p, and moves along the guiding portion 52a in the γ direction in the figure as shown in i4c. At this time, since the substrate P is supported by the bear suspended on the plate holder 9, the adsorption portion 52b can smoothly slide the substrate P to the side for carrying out 50. Further, the upper surface of the carrying cassette 50 is suspended as described above; the substrate p. Here, the gas injected from the gas injection holes K2, K5 can also be made to have directivity. Sliding on the substrate mounting portion 31 by the movement of the adsorption portion 52b

S 20 201142977 之上面順利地移載。本實施形態 基板p，係往搬出用台50 中’由於板保持具9之上面較搬出用台5〇之上面高，因此 基板P能在不接觸搬出用台5〇側面之情形下順利地移載往 搬出用台50上。 藉及附52b使基板p之移動結束後，搬出用台係 停止來自氣體喷射孔K5之氣體嘴射，且透過吸引孔K6吸 附保持基板P。搬出部5係在吸附保持有基板p之狀態下， 驅動第3移動機構53，將搬出用台5()往基板p之搬出位置 移動。 曝光裝置1在從板保持具9將基板p往搬出部5移交 後’使板保持具9以接近搬入部4之搬入用台4〇之方式移 動。接著，同樣地，在搬入用台4〇與板保持具9之間進行 基板P之移交，而能對載置於板保持具9之基板p進行曝 光處理。 本實施形態中，在將次一基板p從搬入部4搬入至板 保持具9之期間，或在對該次一基板p進行曝光處理之期 間，係搬出載置於搬出用台.50之曝光處理完畢之基板p。 此時，位於搬出用台50之下方之上下動機構6〇係透過貫 通孔57將基板支承銷60a配置於搬出用台5〇上方。藉此， 基板P因被支承於基板支承銷6〇a而被保持於搬出用台5〇 之上方。其次’塗布顯影機（未圖示）之臂部48係如圖1 5所 示插入基板支承銷60a之間。其後，藉由使基板支承銷6〇& 下降而將基板P移交至臂部48。臂部48，係在塗布顯影機 (未圖示）内移動基板P，以進行顯影處理。 21 201142977 如上述才反保持具9藉由對搬入部4與搬出部$在同 -水平面（XY平面）内移動而交互接續，以進行基板p對曝 光裝置本冑3之搬出入動作。本實施形態中，由於係沿搬 入部4及搬出冑5之排列方向移動板保持具9之構成，因 此能在短時間進行將板保持具9與搬入部4及搬出部5排 列成接近或接觸之狀態。因此，能縮短伴隨基& p之 入動作之處理時間（所謂產距（Takt))。 根據本實施形態，.藉由能使被懸浮支承之基板p滑動 而從搬入部4往板保持具9搬送，因此能防止於基板p與 基板載置部31之間產生空氣滯留或空氣層，能防止基板p 之載置偏移或變形之產生。因此，能進行信賴性高之曝光 處理。 此外’第！.實施形態中，亦能在從搬入用台4〇往板保 持具9搬送基板P時，使搬人用台⑽之上面傾斜。具體而 言，第2移動機構43之保持部料，係使以來自氣體喷射孔 K3之氣體喷射而懸浮之狀態支承基板p之搬入用台4〇之上 面往板保持具9側（ΘΥ)傾斜。藉此，能利用基板p之自重 使該基板P往板保持具9側移動。 又，亦能在從板保持具9往搬出用台5〇搬送基板p時 使板保持具9之上面傾斜。具體而言，第1移_構33之 保持部34’係使以來自氣體喷射孔K2之氣體喷射而懸浮之 狀態支承基板Ρ之板保持具9之上面往搬出以側（Θ Υ)傾斜。藉此，能利用基板ρ之自重使該基板ρ往搬出用 台5 0側移動。The top of S 20 201142977 was successfully transferred. In the substrate p of the present embodiment, since the upper surface of the plate holder 9 is higher than the upper surface of the carry-out table 5, the substrate P can be smoothly moved without contacting the side surface of the carry-out table 5〇. It is carried to the loading and unloading station 50. After the movement of the substrate p is completed by the attachment 52b, the unloading stage stops the gas nozzle from the gas injection hole K5, and the holding substrate P is sucked through the suction hole K6. The unloading unit 5 drives the third moving mechanism 53 while moving and holding the substrate p, and moves the unloading table 5 () to the unloading position of the substrate p. After the exposure apparatus 1 has transferred the substrate p to the carry-out portion 5 from the sheet holder 9, the sheet holder 9 is moved so as to approach the loading table 4 of the loading unit 4. Then, in the same manner, the substrate P is transferred between the loading table 4 and the plate holder 9, and the substrate p placed on the plate holder 9 can be exposed. In the present embodiment, during the period in which the next substrate p is carried from the loading unit 4 to the plate holder 9, or during the exposure processing of the next substrate p, the exposure placed on the carry-out table 50 is carried out. The processed substrate p. At this time, the lower moving mechanism 6 is positioned below the carrying-out table 50, and the substrate supporting pin 60a is placed above the carrying-out table 5A through the through-hole 57. Thereby, the substrate P is held above the carry-out table 5A by being supported by the substrate support pins 6A. Next, the arm portion 48 of the coating and developing machine (not shown) is inserted between the substrate supporting pins 60a as shown in Fig. 15 . Thereafter, the substrate P is transferred to the arm portion 48 by lowering the substrate supporting pins 6 〇 & The arm portion 48 moves the substrate P in a coating and developing machine (not shown) to perform development processing. 21 201142977 As described above, the counter-holding device 9 is alternately connected by moving the loading unit 4 and the unloading unit $ in the same horizontal plane (XY plane) to carry out the loading and unloading operation of the substrate p to the exposure apparatus main unit 3. In the present embodiment, since the plate holder 9 is moved in the direction in which the loading unit 4 and the carrying cassette 5 are arranged, the board holder 9 and the loading unit 4 and the carrying unit 5 can be arranged in close proximity or contact with each other in a short time. State. Therefore, the processing time (so-called distance (Takt)) accompanying the entry operation of the base & p can be shortened. According to the present embodiment, since the substrate p that is suspended and supported can be slid and transferred from the loading unit 4 to the plate holder 9, it is possible to prevent air stagnation or air layer from being generated between the substrate p and the substrate placing portion 31. It is possible to prevent the displacement or deformation of the substrate p from being placed. Therefore, it is possible to perform exposure processing with high reliability. Also 'No! In the embodiment, when the substrate P is transported from the loading table 4 to the plate holder 9, the upper surface of the carrying table (10) can be inclined. Specifically, the holding portion of the second moving mechanism 43 is inclined such that the upper surface of the loading table 4 that supports the substrate p in a state in which the gas is ejected from the gas injection hole K3 is tilted toward the plate holder 9 side (ΘΥ). . Thereby, the substrate P can be moved to the side of the plate holder 9 by the self-weight of the substrate p. Further, when the substrate p is transported from the plate holder 9 to the carry-out table 5, the upper surface of the plate holder 9 can be inclined. Specifically, the holding portion 34' of the first transfer structure 33 is inclined such that the upper surface of the plate holder 9 that supports the substrate 状态 in a state in which the gas is ejected from the gas injection hole K2 is carried out. Thereby, the substrate ρ can be moved to the carry-out stage 50 side by the self-weight of the substrate ρ.

S 22 201142977 (第2實施形態） 其次，說明本發明之第2實施形態之構成。此外，本 實施形態中’係對與第1實施形態之構成要素相同之要素 賦予同一符號’以省略其說明。第2實施形態，搬入部1 〇4 中之第1移送部149之構成係與第1實施形態相異。 圖16A及圖16B，係顯示本實施形態之搬入部1 之 構成之圖’圖16A係顯示搬入部丨〇4之俯視構成之圖，圖 16B係顯示搬入部1 〇4之圖丨6A中a — A線箭視之側剖面之 圖。 本實施形態之搬入部1〇4之第1移送部149係如圖16A 及16B所示，取代藉由對基板p之一面噴射氣體而懸浮支 承之構成而具有滾子機構148。 於搬入用台140之一端側，如圖丨6A所示形成有複數 個缺口 14卜於各缺口 141分別支承有可繞軸143旋轉之構 成上述滾子機構148之滾子142<)滾子142能藉由未圖示之 驅動機構自轉。滾子機構148係如冑湖所示，構成為滾 子142能接觸基板P或從基板p離開。 根據此種構成，滾子機構148藉由一邊使複數個滾子 142接觸於搬入用台14〇上所支承之基板p之下面，一邊使 之旋轉於既定方向，而能將該基板P往板保持具9側移動。 作為滾子142之形成材料，能使用在與基板p之間產生大 摩擦力之例如橡勝等彈性構件。藉由使用此種彈性構件構 成滾子142，而能防止對基板p之損傷（傷痕等）。又，於搬 入用台140之上面僅設有上述吸引孔K4。 、 23 201142977 其次，說明本實施形態之曝光裝置丨之動作。具體而 言，係敘述與第1實施形態相異之在搬入部i 〇4與板保持 具9之間之基板p之移交動作。 首先，對搬入部104搬入在塗布顯影機（未圖示）塗布有 感光劑之基板P 〇基板p透過吸引孔K4被吸附保持於搬入 用台140之上面。其後，板保持具9係以接近搬入用台 之方式移動（參照圖7 Α)。 本實施形S中亦同樣地，最好係以支承有基板ρ之搬 入用台140之上面較板保持具9之上面高之方式使板保持 具9接近搬入用台丨4〇(參照圆7β)。 然而，本實施形態中，假使搬入用台14〇之上面較板 保持具9之上面低，只要至少滾子142上面較板保持具9 之上面高，即能將乘載於滾子142上之基板ρ從搬入用台 140側往板保持具9側確實地搬送。 ^人搬入用台14〇係如圆17所示，使滾子機構148 之滾子142抵接於基板ρ之下面且旋轉於既定方向。另一 方面，板保持| 9在接取基板ρ _，係先從形成於上面之 複數個氣體噴射孔K2lf射氣體。基板ρ藉由與滾子M2之 摩擦力而往板保持具9側順利地滑移。 此處，基板Ρ之搬送目的地即板保持具9，係藉由從氣 體。t射孔Κ2被喷射氣體而使基板ρ懸浮支承於基板載置部 31 V 〇 因此藉由滾子機構148在搬入用台140之上面滑動 之基板Ρ係往板保持具9之上面順利地移載。S 22 201142977 (Second Embodiment) Next, a configuration of a second embodiment of the present invention will be described. In the present embodiment, the same components as those of the first embodiment are denoted by the same reference numerals, and the description thereof will be omitted. In the second embodiment, the configuration of the first transfer unit 149 in the carry-in unit 〇4 is different from that in the first embodiment. Figs. 16A and 16B are views showing a configuration of the loading unit 1 of the embodiment. Fig. 16A is a plan view showing a loading unit 丨〇4, and Fig. 16B is a view showing a loading unit 1 〇4 in Fig. 6A. — A diagram of the side profile of the A-line arrow. The first transfer unit 149 of the carry-in unit 1〇4 of the present embodiment has a roller mechanism 148 instead of the structure in which the gas is ejected from one surface of the substrate p to be suspended as shown in Figs. 16A and 16B. On one end side of the loading table 140, as shown in FIG. 6A, a plurality of notches 14 are formed. Each of the notches 141 supports a roller 142 which is rotatable about a shaft 143 and constitutes the roller mechanism 148. It can be rotated by a drive mechanism not shown. The roller mechanism 148 is as shown in the lagoon, and is configured such that the roller 142 can contact the substrate P or be separated from the substrate p. According to this configuration, the roller mechanism 148 can rotate the substrate P to the board while causing the plurality of rollers 142 to contact the lower surface of the substrate p supported by the loading table 14 旋转 while rotating it in a predetermined direction. Hold the 9 side movement. As the material for forming the roller 142, an elastic member such as rubber or the like which generates a large frictional force with the substrate p can be used. By using the elastic member to constitute the roller 142, damage to the substrate p (scars, etc.) can be prevented. Further, only the suction hole K4 is provided on the upper surface of the loading table 140. 23 201142977 Next, the operation of the exposure apparatus of the present embodiment will be described. Specifically, the transfer operation of the substrate p between the loading unit i 4 and the plate holder 9 which is different from the first embodiment will be described. First, the loading unit 104 carries a substrate P on which a photosensitive agent is applied to a coating and developing machine (not shown). The substrate p is sucked and held by the suction hole K4 and held on the upper surface of the loading table 140. Thereafter, the plate holder 9 is moved so as to approach the loading table (see Fig. 7A). In the same manner as in the embodiment S, it is preferable that the upper surface of the loading table 140 on which the substrate ρ is supported is higher than the upper surface of the plate holder 9 so that the plate holder 9 approaches the loading table 4 (refer to the circle 7β). ). However, in the present embodiment, if the upper surface of the loading table 14 is lower than the upper surface of the plate holder 9, as long as at least the upper surface of the roller holder 142 is higher than the upper surface of the plate holder 9, the roller 142 can be carried. The substrate ρ is reliably conveyed from the loading table 140 side to the plate holder 9 side. The person loading table 14 is as shown by the circle 17, and the roller 142 of the roller mechanism 148 is brought into contact with the lower surface of the substrate ρ and rotated in a predetermined direction. On the other hand, the board holding | 9 picks up the substrate ρ _ first by injecting gas from a plurality of gas injection holes K2 lf formed thereon. The substrate ρ smoothly slides toward the plate holder 9 side by the friction with the roller M2. Here, the plate holder 9 which is the destination of the transfer of the substrate is by the gas. The perforation Κ 2 is ejected by the gas to suspend and support the substrate ρ on the substrate mounting portion 31 V. Therefore, the substrate slid by the roller mechanism 148 on the loading table 140 is smoothly moved over the plate holder 9 Loaded.

S 24 基板P如圖18所示，係在被設於板保持具9周邊部之 導引用銷36規定在該圖中X方向之位置之狀態下滑動。滚 子機構148 ’係使基板p移動至抵接於設於板保持具9中武 板搬送方向下游側之定位銷37。基板p，係被導引用销％ 規定在該圖中X方向之位置，且藉由被定位銷37及抵接部 42b挾持而成為該圖中γ方向之位置被規定之狀態。板保持 具9係停止來自氣體噴射孔K3之氣體喷射。基板p係在對 基板載置部3 1對齊之狀態下被載置。 本實施形態中亦同樣地’由於基板Ρ係如上述在藉由 氣體之喷射而懸浮之狀態下被搬送，因此能無扭曲地在高 平面;度狀態下被移交至板保持具9，可防止於基板ρ與基板 載置部3 1之間產生空氣滯留或空氣層。因此，能於相對板 保持具9之既定位置以平面度高之狀態載置基板ρ。因此， 能於基板Ρ上之適當位置高精度地進行既定之曝光，而能 實現信賴性高之曝光處理。 .此外，曝光處理結束後之自板保持具9之基板ρ搬出 動作由於與第1實施形態相同，因此省略其說明。 此外，上述說明中，雖說明採用滚子機構148作為搬 入部ΗΜ之第1移送部149’但亦能採發子機構作為搬出 部5之第2移送部52。又，搬人用台刚亦能與第i實施 形態同樣地採用藉由氣體喷射懸浮支承基p t構成。藉 由此構成’由於基P係在懸浮之狀態下被滾子機構148 搬送’因此，能將基板P順利地往板保持具9側搬送。 (第3實施形態） ..··· V·. 201142977 25 201142977 其次’說明本發明之第3實施形態之構成。此外，本 實施形態中，係對與第卜2實施形態之構成要素相同之要 素賦予同—符號’以省略其說明。第3實施形態主要差異 點為板保持具1 09具備第1移送機構。 圖19’係顯示本實施形態之板保持具1〇9之構成之圖。 本實施形態之板保持具丨〇9，係如圖丨9所示具備將基板p 從搬入用台40往板保持具1〇9移送之第i移送部249。此 第1移送。卩249包含吸附保持基板p寬度方向之兩側部之 吸附部250。此吸附部25〇能在沿基板p面方向之χγ平面 内自由移動。 又，本實施形態中，係於板保持具1〇9之周邊部設有 用以檢測出藉帛1移送部249搬入之基板ρ相對基板載置 3 1之位置之位置檢測感測器252。作為此位置檢測感測 器252能例示例如電位計，本發明能使用接觸方式或非接 觸方武之任一者之計器。 吸附。卩250，係吸附保持藉由來自氣體噴射孔Κ3之氣 體喷射而被懸浮支承於搬入用台4〇上之基板Ρ之端部，而 如圖20Α所示從搬入用台4〇往板保持具1〇9側搬送。另一 方面，板保持具1〇9在接取基板ρ時，係先從形成於上面 之複數個氣體喷射孔！^喷射氣體。此時，亦可使從氣體喷 射孔Κ2, Κ3喷射之氣體具有指向性。 吸附部250係如圖20Β所示，藉由使基板ρ之端部接 觸位置檢測感測器252,而曝光裝置i能偵測基板ρ相對基 板載置部3 1之位置偏移。此外，，吸附部25〇係構成為根據As shown in Fig. 18, the S 24 substrate P slides in a state where the guide pin 36 provided at the peripheral portion of the plate holder 9 is positioned at the position in the X direction in the drawing. The roller mechanism 148' moves the substrate p to a positioning pin 37 that abuts on the downstream side of the plate holder 9 in the direction of the slab conveyance. The substrate p is defined by the positioning pin 37 in the X direction, and is held by the positioning pin 37 and the abutting portion 42b so that the position in the γ direction in the figure is defined. The plate holder 9 stops the gas injection from the gas injection hole K3. The substrate p is placed in a state in which the substrate mounting portion 31 is aligned. Similarly, in the present embodiment, since the substrate raft is transported in a state of being suspended by the gas jet as described above, it can be transferred to the plate holder 9 in a high plane without distortion, and can be prevented. An air retention or air layer is generated between the substrate ρ and the substrate mounting portion 31. Therefore, the substrate ρ can be placed in a state where the flatness is high with respect to the predetermined position of the plate holder 9. Therefore, the predetermined exposure can be performed with high precision at an appropriate position on the substrate, and the exposure processing with high reliability can be realized. In addition, since the substrate p carry-out operation from the plate holder 9 after the completion of the exposure processing is the same as that of the first embodiment, the description thereof will be omitted. In the above description, the roller mechanism 148 is used as the first transfer unit 149' of the transport unit 但, but the sub-mechanism can be used as the second transfer unit 52 of the carry-out unit 5. Further, the transfer table can also be constructed by the gas jet suspension support base p t in the same manner as the first embodiment. By this, the base P is transported by the roller mechanism 148 in a state of being suspended. Therefore, the substrate P can be smoothly conveyed toward the plate holder 9 side. (Third Embodiment) ..···· V·. 201142977 25 201142977 Next, the configuration of the third embodiment of the present invention will be described. In the present embodiment, the same elements as those of the second embodiment are denoted by the same reference numerals, and the description thereof will be omitted. The main difference in the third embodiment is that the plate holder 109 has a first transfer mechanism. Fig. 19 is a view showing the configuration of the plate holder 1〇9 of the present embodiment. In the plate holding device 9 of the present embodiment, as shown in FIG. 9, the i-th transfer portion 249 for transferring the substrate p from the loading table 40 to the plate holders 1 to 9 is provided. This 1st transfer. The crucible 249 includes an adsorption portion 250 that adsorbs and holds both side portions in the width direction of the substrate p. The adsorption portion 25 is freely movable in the χ γ plane along the p-plane direction of the substrate. Further, in the present embodiment, the position detecting sensor 252 for detecting the position of the substrate ρ carried by the transfer unit 249 with respect to the substrate mounting 31 is provided in the peripheral portion of the plate holder 1〇9. As the position detecting sensor 252, for example, a potentiometer can be exemplified, and the present invention can use either a contact method or a non-contact method. Adsorption. The crucible 250 is adsorbed and held at the end of the substrate raft which is suspended and supported by the loading table 4 by gas injection from the gas injection port 3, and is transferred from the loading table 4 to the plate holder as shown in Fig. 20A. 1〇9 side transport. On the other hand, when the board holder 1〇9 picks up the substrate ρ, it is first formed from a plurality of gas injection holes formed on the upper surface! ^ Jet gas. At this time, the gas ejected from the gas injection holes ,2, Κ3 can also have directivity. As shown in Fig. 20A, the adsorption unit 250 can detect the positional deviation of the substrate ρ with respect to the substrate mounting portion 31 by bringing the end portion of the substrate ρ into contact with the position detecting sensor 252. Further, the adsorption unit 25 is configured to be

S 26 201142977 上述位置檢測感測器252之檢測結果驅動。 因此，曝光裝置1能根據位置檢測感測器2 5 2之檢須,j 結果修正保持於吸附部250之基板P相對基板載置部3 i之 位置。 本實施形態中亦同樣地，由於基板P係如上述在藉由 氣體之喷射而懸浮之狀態下被搬送，因此能無扭曲地在高 平面度狀態下被移交至板保持具109,可防止於基板p與基 板載置部3 1之間產生空氣滯留或空氣層。因此，能於相對 板保持具109之既定位置以平面度高之狀態載置基板p。因 此，能於基板P上之適當位置高精度地進行既定之曝光， 而能實現信賴性高之曝光處理。 此外，曝光處理結束後之自板保持具1〇9之基板p搬 出動作由於與第1實施形態相同，因此省略其說明。 (第4貫施形態） 其次，說明本發明之第4實施形態之構成。此外，本 實施形態中，係對與第丨實施形態之構成要素相同之要素 賦予同一符號，以省略其說明。第4實施形態如圖21所示， /、第1實;％ A態之主要差異點為板搬入用台及搬出用台 配置於在俯視狀態下彼此重疊之位置。亦即，在與板保 持具9之間進行基板p之移交時，搬人用台如及搬出用台 5〇係相對板保持具9進行上下動作。 ® 22A '圖22B '及圖22C說明本實施形態 之基板P之移交動作。 在對載置於板保持具9之基板p之曝光處理結束後， 27 201142977 搬出用台50係排列成沿γ方向接近板保持具9之狀熊、。本 實施形態中’係如圖22Α所示，相對板保持具9使在下方 待機之搬出用台50上升至能接取基板ρ之位置。此時，亦 能將搬出用台50之上面配置成較板保持具9之上面低（參照 圖 1 3)。 此外，在對基板Ρ進行曝光處理之期間，係從塗布顯 影機（未圖示）將次一基板Ρ移交至搬入用台4〇。藉此，搬 入用台40在從板保持具9將基板ρ搬出至搬出用台5〇之 期間’係在載置有次一基板Ρ之狀態下在板保持具9上方 待機。 板保持具9係停止真空泵之驅動，解除透過吸引孔幻 之基板P對基板載置部3丨之吸附保持。其次，板保持具9 係從氣體喷射孔K2喷射氣體，透過該氣體將基板p以懸浮 狀態支承（參照圖14A— 14C)。另一方面，搬出部5在接取 基板P時，係先從形成於搬出用台5〇上面之複數個氣體喷 射孔K5喷射氣體。此時，亦可使從氣體嗔射孔K：2, K5噴 射之氣體具有指向性。 士圖22B所示，搬出部5係與第丄實施形態同樣地， 將吸附部52b所保持之基板p沿該圖中γ方向移動。此時， 由於基板Ρ係以懸浮於板保持具9上之狀態被支承，因此 基板Ρ係順利地滑移於搬出用台上。又，搬出用台50 之上面係如上所述成為懸浮支承基板Ρ。目此，基板Ρ係 順利地移載往搬出用台50之上面。 基板Ρ之移動結束後，搬出用台50係停止來自氣體喷S 26 201142977 The detection result of the position detecting sensor 252 described above is driven. Therefore, the exposure apparatus 1 can correct the position of the substrate P held by the adsorption unit 250 with respect to the substrate placing portion 3 i based on the detection of the position detecting sensor 252. In the same manner as in the present embodiment, the substrate P is transported in a state of being suspended by the gas jet, so that it can be transferred to the plate holder 109 in a high flatness state without distortion, and can be prevented. An air retention or air layer is generated between the substrate p and the substrate mounting portion 31. Therefore, the substrate p can be placed in a state where the flatness is high with respect to the predetermined position of the plate holder 109. Therefore, it is possible to accurately perform a predetermined exposure at an appropriate position on the substrate P, and it is possible to realize an exposure process with high reliability. In addition, since the substrate p carrying operation from the plate holders 1 to 9 after the completion of the exposure processing is the same as that of the first embodiment, the description thereof will be omitted. (Fourth Aspect Mode) Next, the configuration of the fourth embodiment of the present invention will be described. In the present embodiment, the same components as those in the third embodiment are denoted by the same reference numerals, and their description will be omitted. In the fourth embodiment, as shown in Fig. 21, the main difference between the / and the first solid state is that the plate loading table and the carrying-out table are disposed at positions overlapping each other in a plan view. That is, when the transfer of the substrate p is performed between the board holding device 9, the transfer table and the carry-out table 5 are moved up and down with respect to the plate holder 9. Fig. 22B' and Fig. 22C illustrate the transfer operation of the substrate P of the present embodiment. After the exposure processing of the substrate p placed on the plate holder 9 is completed, the 27 201142977 unloading table 50 is arranged so as to approach the plate holder 9 in the γ direction. In the present embodiment, as shown in Fig. 22A, the board holding device 9 is raised to a position at which the substrate 50 that is waiting for the lower side is lifted up to the position where the substrate ρ can be picked up. At this time, the upper surface of the unloading table 50 can be disposed lower than the upper surface of the plate holder 9 (see Fig. 13). Further, during the exposure processing of the substrate ,, the next substrate Ρ is transferred from the coating machine (not shown) to the loading table 4 〇. As a result, the loading table 40 stands by above the plate holder 9 in a state in which the substrate ρ is carried out from the plate holder 9 to the unloading table 5 系 while the next substrate 载 is placed. The plate holder 9 stops the driving of the vacuum pump, and releases the suction holding of the substrate P by the substrate P that has passed through the suction hole. Next, the plate holder 9 ejects gas from the gas injection hole K2, and the substrate p is supported by the gas in a suspended state (see Figs. 14A to 14C). On the other hand, when the substrate 5 is picked up, the carry-out unit 5 first ejects gas from a plurality of gas injection holes K5 formed on the upper surface of the carry-out table 5 . At this time, the gas ejected from the gas ejection holes K: 2, K5 can also have directivity. As shown in FIG. 22B, the unloading unit 5 moves the substrate p held by the adsorption unit 52b in the γ direction in the figure, similarly to the second embodiment. At this time, since the substrate raft is supported in a state of being suspended on the plate holder 9, the substrate raft is smoothly slid on the carry-out table. Further, the upper surface of the unloading stage 50 is a suspension supporting substrate 如上 as described above. Therefore, the substrate raft is smoothly transferred to the upper surface of the unloading table 50. After the movement of the substrate 结束 is completed, the carry-out station 50 stops the gas spray

S 28 201142977 射孔Κ5 <氣體喷射，且透過吸引孔尺6吸附保持基板卜 搬出用台5G係在吸附保持有基板P之狀態下，如圖22C所 不使基板？往下方移動。此外，在基板p之又寸較大而以 從搬出用台50之上面超出之狀態下被載置時，搬出用台50 係以基板h干涉板保持具9之方式以從板保持具9分離 之往㈣中+Y方向退離之狀態進行上述下降動作。 _另-方面，搬出用台50開始下降動作，且如圖22C所 不’在板保持具9上方待機之搬人用台4g係下降至能對板 保持具9移父基板p之位置^藉此，板保持具9及搬入用 台4〇以沿Y方向接近之狀態排列。此時，亦能將搬入用台 40之^面配置成較板保持具9之上面低（參照圖8)。 搬入用σ 40係從形成於上面之複數個氣體喷射孔K3 喷射氣體’透過該氣體將基Ρ以懸浮狀態支承。另一方 面，板保持具9在接取基板p時，係先從形成於上面之複 數個氣體噴射孔K2喷㈣體。此時，亦可使從氣體喷射孔 Κ2, Κ5喷射之氣體具有指向性。 ^搬入部4係在將基板Ρ懸浮支承於搬入用台4〇上之狀 了:使抵接部42b抵接於基板ρ之一端部。抵接部仙 系藉由…凹„P40a内之導引冑42a移動而將基板p往板保持 具9側移動（參照圖9, 1〇)。 由於基板P成為懸浮於搬入用台40上之狀態，因此順 利地滑動至板保持具9側。χ，板保持具9之上面，由於 係如上所述成為懸浮支承基板Ρ，因此基板Ρ係如圖22D 所示從搬入用台40往板保持具9順利地移載。 29 201142977 基板p與第1實施形態同樣地，能藉由導引用銷36及 定位銷37在對基板載置部3丨對齊於既定位置之狀態下載 置（參照圖9)。接著，對基板p進行曝光處理。 本實施形態中，在將基板P從搬入部4搬入至板保持 具9之期間，或在對基板p進行曝光處理之期間，係搬出 載置於搬出用台50之曝光處理完畢之基板p。 本貫施形態中，如上述將搬入部4與搬出部5相對板 保持具9移動於高度方向（z方向）而交互接續，而能進行對 曝光裝置本體3之基板p之搬出入動作。又，由於搬入部4 及搬出部5在非使用時係待機於板保持具9上方，並能藉 由刀別上下動作而對板保持具9接續，因此能縮短伴隨基 板p之搬出入動作之處理時間（所謂產距（Takt))。 此外’上述實施形態中，雖說明搬入用台4〇及板保持 具9所排列之第i方向、與搬出用台5〇及板保持具9所排 列之第2方向係平行，但本發明並不限定於此，本發明亦 月色適用於上述第1方向與第2方向為相異之方向（例如證交） 之情形。 (第5實施形態） 其次，說明本發明之第5實施形態之構成。此外，本 實施形態中，係對與第1實施形態之構成要素相同之要素 賦予同一符號，以省略其說明。第5實施形態，主要差異 點為具備發揮搬入部及搬出部功能之搬出入部。 圖23係顯示腔室内部構成之立體圖，圖24A及圖24b 係顯示搬出入部400之概略構成之俯視圖。S 28 201142977 Perforation Κ 5 < gas injection, and the substrate is adsorbed and held by the suction hole 6 . The stage 5G is in a state in which the substrate P is adsorbed and held, as shown in Fig. 22C. Move below. In addition, when the substrate p is placed in a large state and is placed beyond the upper surface of the unloading table 50, the unloading table 50 is separated from the plate holder 9 so that the substrate h interferes with the plate holder 9. The above-mentioned descending action is performed in the state in which the +Y direction is retracted in (4). On the other hand, the unloading station 50 starts to descend, and as shown in Fig. 22C, the moving table 4g that has stood by above the plate holder 9 is lowered to the position where the board holder 9 can be moved to the parent substrate p. Thereby, the plate holder 9 and the loading table 4 are arranged in a state of being close to each other in the Y direction. At this time, the surface of the loading table 40 can be arranged lower than the upper surface of the plate holder 9 (see Fig. 8). The carry-in σ 40 is used to inject a gas from a plurality of gas injection holes K3 formed on the upper surface, and the base is supported in a suspended state by the gas. On the other hand, when the substrate holder 9 picks up the substrate p, it first ejects the body from a plurality of gas ejection holes K2 formed thereon. At this time, the gas ejected from the gas injection holes Κ2, Κ5 can also have directivity. The loading unit 4 is in a state in which the substrate raft is suspended and supported on the loading table 4: the abutting portion 42b is brought into contact with one end portion of the substrate ρ. The abutting portion is moved by the guide 胄 42a in the concave portion P40a to move the substrate p toward the plate holder 9 side (see Fig. 9, 1). The substrate P is suspended on the loading table 40. The state is thus smoothly slid to the side of the plate holder 9. The upper surface of the plate holder 9 is suspended as a support substrate as described above, so that the substrate is held from the loading table 40 to the plate as shown in Fig. 22D. In the same manner as in the first embodiment, the substrate p can be downloaded by the guide pin 36 and the positioning pin 37 in a state in which the substrate mounting portion 3 is aligned with a predetermined position (see FIG. 9). Then, the substrate p is subjected to exposure processing. In the present embodiment, the substrate P is carried out from the loading unit 4 to the sheet holder 9 or during the exposure processing of the substrate p. The substrate p which has been subjected to the exposure processing of the stage 50. In the present embodiment, as described above, the loading unit 4 and the carrying-out unit 5 are moved in the height direction (z direction) with respect to the plate holder 9 and are alternately connected, thereby enabling the exposure apparatus. The loading and unloading operation of the substrate p of the main body 3 When the loading unit 4 and the carrying-out unit 5 are placed above the plate holder 9 when not in use, and the plate holder 9 can be connected by the vertical movement of the blade, the processing time associated with the loading and unloading operation of the substrate p can be shortened. In the above-described embodiment, the ith direction in which the loading table 4 and the plate holder 9 are arranged, and the arrangement of the carrying-out table 5 and the plate holder 9 are described. The two directions are parallel, but the present invention is not limited thereto, and the moonlight color of the present invention is also applied to the case where the first direction and the second direction are different (for example, a certificate). (Fifth Embodiment) Next, In the fifth embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof will be omitted. In the fifth embodiment, the main difference is that Fig. 23 is a perspective view showing a configuration of the inside of the chamber, and Figs. 24A and 24b are plan views showing a schematic configuration of the loading and unloading unit 400.

S 30 201142977 如圖23.所示，搬出入部4〇〇具備基板載置台4〇1與移 動該基板載置台4〇1之移動機構4〇2。此外，移動機構4〇2 係由與第1實施形態之第！、第2移動機構33, 43相同構成 所構成。基於此種構成，基板載置台401能在保持有基板p 之狀態下，在光射出側（投影光學系統PL之像面側）移動於 導引面之既定區域内。又，基板載置台4〇1亦能沿z軸方 向移動。因此，基板載置台4〇1係發揮搬入用台及搬出用 台之功能。 如圖24A及24B所示，搬出入部4〇〇具備將基板p從 基板載置台401在板保持具9移送之移送部4〇5。移送部 405包含導引部406與吸附保持於基板p之吸附部4〇8。 於基板載置台401上面，形成有沿一方向（該圖所示之 Y方向）形成之兩個槽狀凹部40 la。於此凹部401a内設有上 述導引部406。於導引部406以從基板載置台4〇1上面突出 之狀態安裝有上述吸附部408。吸附部408包含例如藉由真 空吸附吸附保持基板P之真空吸附墊。 又’於基板載置台401之上面設有複數個藉由對基板p 之下面喷射空氣等氣體而透過該氣體懸浮支承基板P之氣 體喷射孔K7。各氣體喷射孔K7連接於未圖示之氣體噴射 用泵。再者，於基板載置台4〇1之上面設有複數個用以使 基板p仿傲此面而緊貼之吸引孔K8。各吸引孔K8連接於 未圖不之真空泵。此外，氣體喷射孔Κ7與吸引孔Κ8交互 配置成格子狀。 於基板載置台401形成有貫通孔407，該貫通孔 31 201142977 407可供如後所述用以在與塗布顯影機（未圖示）之間進行基 板P之移交之上下動機構之基板支承銷插通。 板保持具9與上述實施形態同樣地，於其側面部具備 檢測與基板載置台401之相對位置之上述位置檢測感測器 19。位置檢測感測器19包含用以檢測出相對基板載置台4〇! 之相對距離之距離檢測用感測器〗9a與用以檢測出相對基 板載置台401之相對高度之高度檢測用感測器19b(參照圖 3B)。 其次’參照.圖式說明搬出入部400與板保持具9間之 基板P之移交動作。首先，對搬出入部4〇〇搬入在塗布顯 影機（4圖示）塗布有感光劑之基板p ^此時，位於基板载置 台401之下方之上下動機構409係透過貫通孔407先將基 板支承銷410配置於基板載置台4〇1上方。其次，塗布顯 影機（未圖示）之臂部48係如圖25所示插入基板支承銷410 之間。藉由臂部48下降而將基板P往基板支承銷41〇移交 後，從搬出入部400退離。上下動機構409藉由使支承有 基板P之基板支承銷410下降而結束基板P對基板載置台 40 1之搬入動作。其後’藉由驅動真空泵，基板p透過吸引 孔K 8被吸附保持於基板載置台4 〇 1之上面。 其次’板保持具9係接近搬出入部400之基板載置台 40 1之方式移動。此外’亦可在排列基板載置台4〇丨與板保 持具9時，藉由驅動移送部405使基板載置台401及板保 持具9在短時間移動至基板p之移交位置，而縮短基板p 之搬入動作所需之時間。此情形下，又，基板p由於透過S 30 201142977 As shown in Fig. 23, the loading/unloading unit 4 includes a substrate stage 4〇1 and a moving mechanism 4〇2 that moves the substrate stage 4〇1. In addition, the moving mechanism 4〇2 is the same as that of the first embodiment! The second moving mechanisms 33 and 43 have the same configuration. With this configuration, the substrate stage 401 can be moved in a predetermined region of the guide surface on the light exit side (the image plane side of the projection optical system PL) while the substrate p is held. Further, the substrate stage 4〇1 can also move in the z-axis direction. Therefore, the substrate stage 4〇1 functions as a loading stage and a carry-out stage. As shown in Figs. 24A and 24B, the carry-in/out unit 4A includes a transfer unit 4〇5 that transfers the substrate p from the substrate stage 401 to the board holder 9. The transfer unit 405 includes a guide portion 406 and an adsorption portion 4A8 that is adsorbed and held on the substrate p. On the upper surface of the substrate stage 401, two groove-shaped recesses 40 la formed in one direction (the Y direction shown in the figure) are formed. The guide portion 406 is provided in the recess 401a. The adsorption unit 408 is attached to the guide portion 406 so as to protrude from the upper surface of the substrate stage 4〇1. The adsorption unit 408 includes a vacuum adsorption pad that holds the substrate P by, for example, vacuum adsorption. Further, a plurality of gas ejection holes K7 through which the gas suspension support substrate P is ejected by gas such as air to the lower surface of the substrate p is provided on the upper surface of the substrate stage 401. Each gas injection hole K7 is connected to a pump for gas injection (not shown). Further, a plurality of suction holes K8 for adhering the substrate p to the surface are provided on the substrate mounting table 4'1. Each of the suction holes K8 is connected to a vacuum pump which is not shown. Further, the gas injection holes 7 and the suction holes 8 are alternately arranged in a lattice shape. A through hole 407 is formed in the substrate mounting table 401, and the through hole 31 201142977 407 can be used as a substrate supporting pin for lowering the mechanism above the transfer of the substrate P between the coating and developing machine (not shown) as will be described later. Plug in. Similarly to the above-described embodiment, the plate holder 9 includes the position detecting sensor 19 for detecting the position relative to the substrate stage 401 on the side surface portion. The position detecting sensor 19 includes a distance detecting sensor 9a for detecting a relative distance between the substrate mounting table 4 and a height detecting sensor for detecting a relative height of the opposing substrate mounting table 401. 19b (refer to FIG. 3B). Next, the transfer operation of the substrate P between the loading and unloading portion 400 and the plate holder 9 will be described with reference to the drawings. First, the substrate p^ to which the photosensitive agent is applied in the coating and developing machine (not shown) is carried in the loading/unloading unit 4, and the lowering mechanism 409 is placed below the substrate mounting table 401 to pass through the through hole 407. The underwriter 410 is disposed above the substrate stage 4〇1. Next, the arm portion 48 of the coating machine (not shown) is inserted between the substrate supporting pins 410 as shown in Fig. 25 . The substrate P is transferred to the substrate supporting pin 41 by the lowering of the arm portion 48, and then retracted from the loading/unloading portion 400. The vertical movement mechanism 409 terminates the loading operation of the substrate P to the substrate stage 40 1 by lowering the substrate support pin 410 on which the substrate P is supported. Thereafter, by driving the vacuum pump, the substrate p is adsorbed and held on the substrate mounting table 4 〇 1 through the suction holes K 8 . Next, the plate holder 9 is moved so as to approach the substrate stage 40 1 of the loading and unloading unit 400. In addition, when the substrate mounting table 4 and the plate holder 9 are arranged, the substrate placing table 401 and the plate holder 9 are moved to the transfer position of the substrate p in a short time by the drive transfer unit 405, thereby shortening the substrate p. The time required to move in. In this case, again, the substrate p is transmitted through

S 32 201142977 吸引孔K8被吸附保持於基板載置台4〇1之上面，因此能防 止在移送部405之驅動時基板Ρ在基板載置台4〇丨上移動。 本實施形態中，如圖26所示’以支承有基板ρ之基板 載置台401之上面較板保持具9之上面高之方式使板保持 具9接近基板載置台4〇!。此外，亦能藉由將板保持具9及 基板載置台401以接觸之狀態排列，而縮短基板ρ之移動 距離，以更順利地進行移交。 其次，基板載置台401係如圖26所示，從形成於上面 之複數個氣體噴射孔Κ7喷射氣體’透過該氣體將基板ρ以 懸浮狀態支承。另一方面，板保持具9在接取基板ρ時， 係先從形成於上面之複數個氣體喷射孔Κ2喷射氣體。此 時，亦可使從氣體喷射孔Κ2, Κ7喷射之氣體具有指向性。 搬出入部400係在將基板Ρ懸浮支承於基板载置台4〇 1 上之狀態下，藉由吸附部408吸附保持基板Ρ之一端部。 吸附部408係藉由沿凹部4〇la内之導引部4〇6移動而將基 板ρ往板保持具9側移動（參照圖24A及24B)。 由於基板P成為懸浮於基板载置台4〇1上之狀態，因 此吸附部408b能使基板P順利地滑動至板保持具9側。又， 板保持具9之上面，係如上所述成為懸浮支承基板p。 因此，藉由吸附部408在基板載置台4〇1上面滑動之 基板P’係往板保持具9之上面順利地移載。本實施形態中， 由於如圖26所示基板載置台4〇1之上面較板保持具9之上 面尚，因此基板P能在不接觸板保持具9側面之情形下順 利地移載往板保持具9上。 33 201142977 基板P藉由抵接於設在板保持具9周邊部之導引用銷 36及定位銷37而成為對基板載置部3 1對齊於既定位置之 狀態（參照圖9)。 本實施形態中亦同樣地’由於基板p係如上述在藉由 氣體之喷射而懸浮之狀態下被搬送，因此可防止於基板p 與基板載置部31之間產生空氣滯留或空氣層，能防止基板 P之載置偏移或變形。因此，能於相對板保持具9之既定位 置以平面度高之狀態載置基板p。其後，藉由驅動真空泵， 基板P即透過吸引孔K1被吸附保持於基板載置部3丨之上 面。接著，於板保持具9載置基板P後，對基板p進行曝 光處理。 曝光處理結束後，板保持具9以接近搬出入部4〇〇之 基板載置台401之方式移動。本實施形態中，係以使板保 持具9之上面較基板載置台4〇1之上面高之方式使板保持 具9及基板載置台401接近。 此外’亦能在排列基板載置台401與板保持具9時， 藉由移動基板载置台401以縮短基板p之搬出動作所需之 時間。又’亦能將板保持具9及基板載置台4〇1以接觸狀 態排列。藉此，由於在板保持具9及基板載置台4〇1間不 形成間隙’因此能順利地進行基板p之移交。 板保持具9係停止真空泵之驅動，解除透過吸引孔K1 之基板P對基板載置部31之吸附保持。其次，板保持具9 係如圖27所示從形成於基板載置部3 1上面之複數個氣體 喷射孔K2喷射氣體，透過該氣體將基板p以懸浮狀態支S 32 201142977 The suction hole K8 is adsorbed and held on the upper surface of the substrate stage 4〇1, so that the substrate Ρ can be prevented from moving on the substrate stage 4〇丨 when the transfer unit 405 is driven. In the present embodiment, as shown in Fig. 26, the upper surface of the substrate stage 401 on which the substrate ρ is supported is made higher than the upper surface of the plate holder 9 so that the plate holder 9 approaches the substrate stage 4! Further, by arranging the plate holder 9 and the substrate stage 401 in contact with each other, the moving distance of the substrate ρ can be shortened, and the handover can be performed more smoothly. Next, as shown in Fig. 26, the substrate mounting table 401 ejects gas from a plurality of gas ejection holes 7 formed on the upper surface, and transmits the substrate ρ in a suspended state through the gas. On the other hand, when the substrate holder 9 picks up the substrate ρ, it first ejects gas from a plurality of gas ejection holes 2 formed on the upper surface. At this time, the gas ejected from the gas injection holes ,2, Κ7 can also be made to have directivity. The loading/unloading unit 400 is configured to adsorb and hold one end portion of the substrate 藉 by the adsorption unit 408 while the substrate Ρ is suspended and supported by the substrate stage 4〇1. The adsorption unit 408 moves the substrate ρ toward the plate holder 9 side by moving along the guide portions 4〇6 in the concave portion 4〇1a (see Figs. 24A and 24B). Since the substrate P is suspended in the substrate stage 4〇1, the adsorption unit 408b can smoothly slide the substrate P to the side of the plate holder 9. Further, the upper surface of the plate holder 9 is a suspension supporting substrate p as described above. Therefore, the substrate P' which is slid by the adsorption portion 408 on the substrate stage 4'1 is smoothly transferred to the upper surface of the plate holder 9. In the present embodiment, since the upper surface of the substrate stage 4〇1 is larger than the upper surface of the plate holder 9 as shown in Fig. 26, the substrate P can be smoothly transferred to the plate without contacting the side surface of the plate holder 9. With 9 on. 33 201142977 The substrate P is in a state in which the substrate mounting portion 31 is aligned with a predetermined position by abutting against the guide pin 36 and the positioning pin 37 provided at the peripheral portion of the plate holder 9 (see Fig. 9). In the same embodiment, the substrate p is transported in a state of being suspended by the gas jet as described above, so that air stagnation or an air layer can be prevented from occurring between the substrate p and the substrate mounting portion 31. The placement of the substrate P is prevented from being shifted or deformed. Therefore, the substrate p can be placed in a state where the flatness is high with respect to the positioning of the plate holder 9. Thereafter, by driving the vacuum pump, the substrate P is sucked and held by the suction hole K1 and held on the substrate mounting portion 3A. Next, after the substrate P is placed on the plate holder 9, the substrate p is exposed to light. After the exposure process is completed, the plate holder 9 moves so as to approach the substrate stage 401 of the carry-in/out portion 4〇〇. In the present embodiment, the plate holder 9 and the substrate stage 401 are brought close to each other such that the upper surface of the plate holding member 9 is higher than the upper surface of the substrate stage 4〇1. Further, when the substrate mounting table 401 and the plate holder 9 are arranged, the substrate mounting table 401 can be moved to shorten the time required for the substrate p to be carried out. Further, the plate holder 9 and the substrate stage 4〇1 can be arranged in a contact state. As a result, no gap is formed between the plate holder 9 and the substrate stage 4〇1, so that the transfer of the substrate p can be smoothly performed. The plate holder 9 stops the driving of the vacuum pump, and releases the suction holding of the substrate P that has passed through the suction hole K1 to the substrate placing portion 31. Next, the plate holder 9 ejects gas from a plurality of gas ejection holes K2 formed on the substrate mounting portion 31 as shown in Fig. 27, and the substrate p is suspended in a suspended state by the gas.

S 34 201142977 承。另一方面，搬出部5在接取基板p時，係先從形成於 基板载置台401上面之複數個氣體喷射孔K7噴射氣體。此 時，亦可使從氣體喷射孔Κ2，Κ7喷射之氣體具有指向性。 搬出入部400係將移送部4〇5之吸附部4〇8沿導引部 406往懸浮支承於板保持具9之基板載置部31上之基板ρ 側移動。吸附部408係吸附保持基板Ρ ,沿該圖中+γ方向 移動基板Ρ(參照圖24Α及24Β)。 此時，由於基板Ρ係以懸浮於板保持具9上之狀態被 支承，因此吸附部408能使基板Ρ順利地滑動至基板載置 台401側。又，基板載置台4〇1之上面，係如上所述成為 懸浮支承基板Ρ。 因此’在基板載置部3 1上面滑動之基·板ρ，係往基板 載置台401之上面順利地移載。本實施形態中，由於板保 持具9之上面較基板載置台4〇1之上面高，因此基板ρ能 在不接觸基板載置台40 1側面之情形下順利地移載往基板 載置台401'丄。 藉吸附部408使基板Ρ之移動結束後，基板載置台401 係停止來自氣體喷射孔Κ7之氣體喷射，且透過吸引孔Κ8 吸附保持基板Ρ。搬出入部4〇〇係在吸附保持有基板ρ之狀 態下’驅動移送部405，將基板載置台401往基板Ρ之搬出 位置移動。 其次’搬出載置於基板載置台401之曝光處理完畢之 基板Ρ°此時，位於基板載置台401之下方之上下動機構 409係透過貫通孔407將基板支承銷410配置於基板載置台 35 201142977 401上方。藉此’基板P因被支承於基板支承銷410而被保 持於基板載置台4 〇 1之上方（參照圖2 5)。其次，塗布顯影 機（未圖示）之臂部48係插入基板支承銷410之間，藉由使 基板支承銷410下降而將基板p移交至臂部48。臂部48， 係在塗布顯影機（未圖示）内移動基板P，以進行顯影處理。 根據本實施形態，由於能使被懸浮支承之基板p滑動 而從搬出入部400往板保持具9搬送，因此能防止於基板p 與基板載置部3 1之間產生空氣滞留或空氣層，能防止基板 P之載置偏移或變形之產生。因此，能進行信賴性高之曝光 處理。又，由於搬出入部400兼作為上述第i〜第3實施形 態中之搬入部4及搬出部5，因此能簡化裝置構成。 此外，第5實施形態中，亦能在從基板載置台4〇1往 板保持具9搬送基板P時，使基板載置台4〇1之上面傾斜。 八體而5，移動機構402，係使以來自氣體噴射孔K7之氣 體喷射而懸浮之狀態支承基板ρ之基板載置纟i之上面 往板保持具9側(ΘΥ)傾斜。藉此，能利用基“之自重使 該基板P往板保持具9側移動。 又，亦能在從板保持具9往基板載置台4〇1搬送基板p 時使板保持具9之上面傾斜。具體而言，第丄移動機構33(保 持4 34) ’係使以來自氣體噴射孔K2之氣體喷射而懸浮之 狀態支承基板Ρ之板保持具9之上面往基板載置台4〇1側 (0 Υ)傾斜。藉此’能利用基板ρ之自重使該基板ρ往基板 載置台4 01側移動·。 此外’本實施形態中，亦能採用如第2實施形態所示 36 201142977 之滾子機構148作為移送部405。又，作為移送部4〇5 ,亦 能如第3實施形態所示將構成移送部405之吸附部4〇8 μ 於板保持具9側。 (第6實施形態） 其次，說明本發明之第6實施形態之構成。此外，以 下說明中，係對與上述實施形態之構成要素相同孓要素賦 予同一符號.，以簡化或省略其說明。 圖28係顯示本實施形態之曝光裝置之概略構成之剖面 俯視圖，圖29係顯示腔室内之裝置構成之概略之立體圖。 與上述實施形態同樣地，曝光裝置1如圖28所示具備 曝光裝置本體3與搬入部4。又，本實施形態中，曝光裝置 1具備搬出機械臂205。此等係被收容於被高度淨化且調整 於既定溫度之腔室2内。 ^如圖29所示，搬出機械臂205係例如具有例如水平關 1型構k且具備由透過垂直之關節軸連結之複數部分構 成之臂部ίο、連結於此臂部10之前端之叉部12、驅動裝 置13。臂部10能藉由驅動裝置13移動於例如上下方向（z 軸方向）。驅動裝置！ 3係被未圖示之控制裝置控制其驅動。 藉此’搬出機械臂205係從板保持具9接取基板卜此外， $出機械臂2G5並不限定於水平關節型構造之機械臂，亦 I田採用或組合公知之機械臂（一般而言為搬送機構 實現。S 34 201142977. On the other hand, when the substrate 5 is picked up, the unloading unit 5 first ejects gas from a plurality of gas injection holes K7 formed on the upper surface of the substrate stage 401. At this time, the gas ejected from the gas injection holes Κ2, Κ7 can also be made to have directivity. The loading/unloading unit 400 moves the suction unit 4〇8 of the transfer unit 4〇5 along the guide unit 406 to the substrate ρ side suspended and supported by the substrate mounting unit 31 of the plate holder 9. The adsorption unit 408 adsorbs and holds the substrate Ρ and moves the substrate + in the +γ direction in the figure (see Figs. 24A and 24B). At this time, since the substrate raft is supported in a state of being suspended on the plate holder 9, the suction portion 408 can smoothly slide the substrate 至 to the substrate stage 401 side. Further, the upper surface of the substrate stage 4〇1 is a suspension supporting substrate 如上 as described above. Therefore, the base plate ρ which slides on the upper surface of the substrate mounting portion 31 is smoothly transferred onto the upper surface of the substrate mounting table 401. In the present embodiment, since the upper surface of the plate holder 9 is higher than the upper surface of the substrate stage 4〇1, the substrate ρ can be smoothly transferred to the substrate stage 401' without contacting the side surface of the substrate stage 40 1 . . After the movement of the substrate Ρ by the adsorption unit 408 is completed, the substrate stage 401 stops the gas injection from the gas injection port 7 and sucks and holds the substrate 透过 through the suction hole 8 . The loading/unloading unit 4 drives the transfer unit 405 while adsorbing and holding the substrate ρ, and moves the substrate stage 401 to the unloading position of the substrate. Next, the substrate after the exposure processing on the substrate mounting table 401 is carried out. At this time, the lower moving mechanism 409 is disposed below the substrate mounting table 401, and the substrate supporting pin 410 is placed on the substrate mounting table 35 through the through hole 407. Above 401. Thereby, the substrate P is held above the substrate stage 4 〇 1 by being supported by the substrate supporting pin 410 (see Fig. 25). Next, the arm portion 48 of the coating and developing machine (not shown) is inserted between the substrate supporting pins 410, and the substrate supporting pin 410 is lowered to transfer the substrate p to the arm portion 48. The arm portion 48 moves the substrate P in a coating and developing machine (not shown) to perform development processing. According to the present embodiment, since the substrate p suspended and supported can be slid and transported from the carry-in/out portion 400 to the plate holder 9, it is possible to prevent air stagnation or air layer from being generated between the substrate p and the substrate placing portion 31. The occurrence of offset or deformation of the substrate P is prevented from occurring. Therefore, it is possible to perform exposure processing with high reliability. Further, since the carry-in/out portion 400 also serves as the carry-in portion 4 and the carry-out portion 5 in the above-described i-th to third-th embodiment, the device configuration can be simplified. Further, in the fifth embodiment, when the substrate P is transferred from the substrate mounting table 4〇1 to the plate holder 9, the upper surface of the substrate stage 4〇1 can be inclined. In the eighth body, the moving mechanism 402 tilts the upper surface of the substrate 纟i supported by the substrate ρ in a state where the gas is ejected from the gas injection hole K7 to the side of the plate holder 9. Thereby, the substrate P can be moved toward the plate holder 9 by the self-weight of the base. Further, the upper surface of the plate holder 9 can be tilted when the substrate p is transferred from the plate holder 9 to the substrate stage 4〇1. Specifically, the second moving mechanism 33 (holding 34) holds the upper surface of the plate holder 9 that supports the substrate 状态 in the state of being suspended by the gas from the gas injection hole K2 toward the substrate stage 4〇1 side ( 0 Υ) Tilting, the substrate ρ can be moved to the substrate stage 4 01 side by the self-weight of the substrate ρ. Further, in the present embodiment, the roller of 36 201142977 as shown in the second embodiment can be used. The mechanism 148 serves as the transfer unit 405. Further, as the transfer unit 4〇5, the adsorption unit 4〇8 that constitutes the transfer unit 405 can be placed on the side of the plate holder 9 as in the third embodiment. (Sixth embodiment) In the following description, the same components as those of the above-described embodiments are denoted by the same reference numerals, and the description thereof will be simplified or omitted. FIG. 28 shows the present embodiment. The outline of the exposure device 29 is a perspective view showing the configuration of the apparatus in the chamber. Similarly to the above-described embodiment, the exposure apparatus 1 includes the exposure apparatus main body 3 and the loading unit 4 as shown in Fig. 28. Further, in the present embodiment, the exposure apparatus 1 is provided with the unloading robot arm 205. These are housed in the chamber 2 which is highly purified and adjusted to a predetermined temperature. As shown in Fig. 29, the unloading robot arm 205 has, for example, a horizontally closed type 1 configuration and is provided. An arm portion λ composed of a plurality of portions connected to the vertical joint axis, a fork portion 12 coupled to the front end of the arm portion 10, and a driving device 13. The arm portion 10 can be moved by, for example, the up and down direction (z axis) by the driving device 13. The drive unit 3 is controlled by a control device (not shown). The "moving arm 205" picks up the substrate from the plate holder 9 and the arm 2G5 is not limited to the horizontal joint type. The mechanical arm of the structure is also realized by or in combination with a known mechanical arm (generally a transport mechanism).

一圖3〇A係顯示板保持具9之俯視構成之圖，圖3〇b係 顯不板保持具9之側視構成之圖。本實施形態中，如圖30A 37 201142977 所不，於板保持具9形成有載置基板p之基板載置部31。 又’本實施形態中’於板保持具9形成有在基板P之 搬出時用以收容搬出機械臂2〇5之又部12之槽部3〇。此槽 部30係沿又部丨2之移動方向（該圖γ方向）形成。又部9 之上面中槽部30以外之區域構成上述基板載置部3 i。 此外，叉部12之厚度係較槽部3〇之深度小。藉此， 如後所述地將叉部12收容於槽部3〇内後，藉由使之上升 而使載置於基板載置部31上之基板p被移交載置於叉部 12 ° 與圖3B同樣地，板保持具9如圖3〇B所示，於其側面 部9a具備檢測出與搬入用台4〇之相對位置之位置檢測感測 益19。位置檢測感測器19包含用以檢測出相對搬入用台 4〇之相對距離之距離檢測用感測器19a與用以檢測出相對 搬入用台40之相對高度之高度檢測用感測器i9b。此外， 於搬入用台40中之與位置檢測感測器19對應之位置形成 有凹部，藉此，防止位置檢測感測器19與搬入用台4〇干 涉。 其次，參照圖6、圖Η、31A〜圖34說明本實施形態 之曝光裝f 1之動作。.具體而言’主要說明搬入部4與板 保持具9之間之基板p之移交動作、以及板保持具9與搬 出機械臂205之間之基板p之移交動作。 >首先，對搬入部4搬入在塗布顯影機（未圖示）塗布有感 光劑之基板P。此時，位於搬入用台4〇之下方之上下動機 構49係透過貫通孔47先將基板支承銷配置於搬入用台Fig. 3A shows a plan view of the plate holder 9 in a plan view, and Fig. 3b shows a side view of the plate holder 9. In the present embodiment, as shown in Figs. 30A to 37, 2011, the substrate holder 9 is formed with the substrate holder 31 on which the substrate p is placed. Further, in the present embodiment, the plate holder 3 is formed with a groove portion 3 for accommodating the other portion 12 of the carrying arm 2〇5 when the substrate P is carried out. This groove portion 30 is formed along the moving direction of the other portion ( 2 (the γ direction of the drawing). The region other than the upper groove portion 30 of the other portion 9 constitutes the substrate placing portion 3 i. Further, the thickness of the fork portion 12 is smaller than the depth of the groove portion 3〇. As a result, after the fork portion 12 is housed in the groove portion 3 as described later, the substrate p placed on the substrate mounting portion 31 is transferred and placed on the fork portion 12 ° by raising it. In the same manner, as shown in FIG. 3B, the plate holder 9 has a position detecting sensory benefit 19 in which the side surface portion 9a is detected at a position opposite to the loading table 4'. The position detecting sensor 19 includes a distance detecting sensor 19a for detecting the relative distance with respect to the loading table 4, and a height detecting sensor i9b for detecting the relative height of the opposing loading table 40. Further, a recess is formed in a position corresponding to the position detecting sensor 19 in the loading table 40, whereby the position detecting sensor 19 and the loading table 4 are prevented from interfering. Next, the operation of the exposure apparatus f1 of the present embodiment will be described with reference to Figs. 6, Η, 31A to 34. Specifically, the transfer operation of the substrate p between the loading unit 4 and the plate holder 9 and the transfer operation of the substrate p between the plate holder 9 and the carrying robot 205 will be mainly described. > First, the substrate P to which the photosensitive agent is applied in a coating and developing machine (not shown) is carried into the loading unit 4. At this time, the upper and lower movable mechanism 49 located below the loading table 4 is inserted through the through hole 47 to place the substrate supporting pin on the loading table.

S 38 201142977 40上方。其次’塗布顯影機（未圖示）之臂部48係如圖6所 示插入基板支承銷49a之間。藉由臂部48下降而將基板p 往基板支承銷49a f多交後，從搬入部4退離。上下動機構 49藉由使支承有基板P之基板支承銷叫下降而結束基板 P對搬入用台40之搬入動作。其後，藉由驅動真空系，基 板P透過吸引孔K4被吸附保持於搬入用台4〇之上面。 其次’板保持具9係如圖31A所示’以接近搬入部4 之搬入用台40之方式務動。此外，闇·51λ w 叭秒勒此外，圖3 1A及3 1B中係省略 搬出機械臂之圖示。 具體而言’帛i移動機構33係將板保持具9及搬入用 台40以沿Y方向接近之狀態排列^此處，所謂板保持具g 及搬入用台40接近之狀態，係指在後述之基板p之移交時 分離了基板P之移動可順暢進行之距離之狀態。 又，在排列搬入用台40與板保持具9時能驅動第2移 動機構43。如此，即能使搬入用自4〇及板保持具9在短時 間移動至基板P之移交位置，，能縮短基板p之搬入動作所 需之時間。此時，基板P由於透過吸引孔K4被吸附保持於 搬入用台40.之上面，因此能防止在第2移動機構43之驅 動時基板Ρ在搬入用台40上移動。 本實施形態中，如圖31Β所示，在使板保持具9及搬 入用台40接近時，基板ρ配置成板保持具9高。亦即，第 1移動機構33係以支承有基板ρ之搬入用台4〇之上面較板 保持具9之上面尚之方式使板保持具9接近搬入用台4〇。 此外，亦能藉由第2移動機構43使搬入用台4〇上升以使 39 201142977 搬入用台40之上面較板保持具9之上面高。 又，第1移動機構33亦能將板保持具9及搬入用台40 在接觸之狀態下排列。如此，即能順利地進行後述之板保 持具9及搬入用台40間之基板P之移交》 其次，搬入用台40係如圆32所示，從形成於上面之 複數個氣體喷射孔K3喷射氣體，透過該氣體將基板P以懸 浮狀態支承。另一方面，板保持具9在接取基板P時，係 先從形成於上面之複數個氣體喷射孔K2喷射氣體。 搬入部4係在將基板P懸浮支承於搬入用台40上之狀 態下，如圖3 3所示使抵接部42b抵接於基板p之一端部。 抵接部42b係藉由沿凹部40a内之導引部42a移動而將基板 P往板保持具9側移動。 由於基板P成為懸浮於搬入用台40上之狀態，因此抵 接部42b能使基板p順利地滑動至板保持具9側。此外， 板保持具9之上面，係如上所述成為懸浮支承基板卜此處， 亦可使從氣體喷射孔K3, K2·噴射之氣體具有指向性。 藉由抵接部42b在搬入用台40上面滑動之基板p，係 如圖34所示，往板保持具9之上面順利地移載。本實施形 態中’由於搬入用台40之上面較板保持具9之上面高，因 此基板P能在不接觸板保持具9側面之情形下順利地移載 往板保持具9上。 基板P如圖33所示，係在被設於板保持具9周邊部之 導引用銷36規定在該圖中χ方向之位置之狀態下滑動。抵 接部42b，係使基板Ρ移動至抵接於設於板保持具$中基板S 38 201142977 40 above. Next, the arm portion 48 of the coating and developing machine (not shown) is inserted between the substrate supporting pins 49a as shown in Fig. 6 . When the arm portion 48 is lowered, the substrate p is excessively transferred to the substrate supporting pin 49a f, and then retracted from the loading portion 4. The vertical movement mechanism 49 terminates the loading operation of the substrate P on the loading table 40 by lowering the substrate supporting pin supporting the substrate P. Thereafter, the substrate P is sucked and held by the suction hole K4 on the upper surface of the loading table 4 by driving the vacuum system. Next, the "plate holder 9" is moved as shown in Fig. 31A to approach the loading table 40 of the loading unit 4. In addition, the dark 51 λ w sec second, in addition, in Figs. 3 1A and 3 1B, the illustration of the unloading robot is omitted. Specifically, the 帛i moving mechanism 33 arranges the plate holder 9 and the loading table 40 in a state of being approached in the Y direction. Here, the state in which the plate holder g and the loading table 40 are close to each other is referred to as described later. When the substrate p is transferred, the state in which the movement of the substrate P can be smoothly performed is separated. Further, the second moving mechanism 43 can be driven when the loading table 40 and the plate holder 9 are arranged. As a result, the loading and unloading of the substrate p can be shortened to a position where the substrate P is moved in a short time, and the time required for the loading operation of the substrate p can be shortened. At this time, since the substrate P is adsorbed and held on the upper surface of the loading table 40 by the suction hole K4, it is possible to prevent the substrate Ρ from moving on the loading table 40 during the driving of the second moving mechanism 43. In the present embodiment, as shown in Fig. 31A, when the plate holder 9 and the loading table 40 are brought close to each other, the substrate p is disposed such that the plate holder 9 is high. In other words, the first moving mechanism 33 brings the plate holder 9 closer to the loading table 4 so that the upper surface of the loading table 4 that supports the substrate ρ is closer to the upper surface of the plate holder 9. Further, the loading unit 4 can be raised by the second moving mechanism 43 so that the upper surface of the 39 201142977 loading table 40 is higher than the upper surface of the plate holder 9. Further, the first moving mechanism 33 can also arrange the plate holder 9 and the loading table 40 in contact with each other. In this way, the transfer of the substrate P between the plate holder 9 and the loading table 40, which will be described later, can be smoothly performed. Next, the loading table 40 is ejected from a plurality of gas injection holes K3 formed on the upper surface as indicated by a circle 32. The gas is supported by the substrate P in a suspended state. On the other hand, when the substrate holder 9 picks up the substrate P, it first ejects gas from a plurality of gas ejection holes K2 formed on the upper surface. The loading unit 4 is in a state in which the substrate P is suspended and supported by the loading table 40, and the abutting portion 42b is brought into contact with one end portion of the substrate p as shown in Fig. 3 . The abutting portion 42b moves the substrate P toward the plate holder 9 side by moving along the guiding portion 42a in the recess 40a. Since the substrate P is suspended in the loading table 40, the abutting portion 42b can smoothly slide the substrate p to the side of the plate holder 9. Further, the upper surface of the plate holder 9 is a floating support substrate as described above, and the gas ejected from the gas injection holes K3, K2· can also have directivity. The substrate p that has been slid on the loading table 40 by the abutting portion 42b is smoothly transferred to the upper surface of the plate holder 9 as shown in Fig. 34. In the present embodiment, since the upper surface of the loading table 40 is higher than the upper surface of the plate holder 9, the substrate P can be smoothly transferred to the plate holder 9 without contacting the side surface of the plate holder 9. As shown in Fig. 33, the substrate P is slid in a state where the guide pin 36 provided at the peripheral portion of the plate holder 9 is positioned at the position in the χ direction in the figure. The abutting portion 42b moves the substrate 至 to abut against the substrate provided in the plate holder $

S 40 201142977 ，送方向下游側之定位銷37。基板p，係被導引用銷36規 疋在該圖中X方向之位置，且藉由被定位銷37及抵接部4孔 挟持而成為該®中Υ方向之位置被規定之狀態。板保持具9 係停止來自氣體噴射孔Κ2之氣體喷射。基板ρ係如圖、" 所示，在對基板載置部3丨對齊之狀態下被載置。 此外，以往將基板載置於板保持具時，有可能產生基 板之載置偏移（從既定載置位置之位置偏移）或基板之變 形。產生此載置偏移之原目《—，可彳量係例如在基板之 載置前:刻因於基板與板保持具之間產生之薄空氣層使基 板成為浮游狀態。又，使基板之變形產生之原因之_，可 考里係例如在載置基板後於基板與板保持具之間介在空氣 滯留而基板成為膨脹之狀態。 相對於此，本實施形態中，由於基板ρ係如上述在藉 由氣體之喷射而懸浮之I態下被搬&，因Λ係無扭曲地在 高平面度狀態下被移交至板保持具又，由於基板Ρ係從 被懸浮支承之高度往基板載置部31載置，因此可防止於基 板ρ與基板載置部31之間產生空氣滯留或空氣層。因此， 可抑制基板Ρ成為膨脹狀態，防止基板？之載置偏移或變 形之產生°因此’能於相對板保持具9之既^位置以平面 度高之狀態載置基板卜其後，藉由驅動真空泵，基板ρ即 透過吸引孔Κ1被吸附保持於基板載置部31之上面。 於板保持具9載置基板Ρ後，光罩Μ係被以來自照明 系統之曝光用光IL照明。被以曝光用光IL照明之光罩Μ 之圖案，係透過投影光學系統PL投f彡曝光至載置於板保持 41 201142977 具9之基板p。 由於能如上所述地將基板P良好地載置於板保持具9 上，因此能於基板P上之適當位置高精度地進行既定之曝 光’而能貫現信賴性高之曝光處理。 本實施形態中，在對基板P進行曝光處理中，或如後 述在由搬出機械臂205搬送曝光處理完畢之基板P之期 間，此將藉由塗布顯影機（未圖示）而塗布有感光劑之次一基 板P載置於搬入部4之搬入用台4〇上。 其次，說明曝光處理結束後從板保持具9搬出基板p 之搬出動作。 具體而5，係說明藉由搬出機械臂205搬出基板p之 方法。® 35係用以說日諸出機械臂2〇5之動作之立體圖，S 40 201142977 , the positioning pin 37 of the downstream direction is sent. The substrate p is guided by the guide pin 36 in the X direction in the drawing, and is held by the positioning pin 37 and the contact portion 4 to be in a state in which the position in the middle direction of the ® is defined. The plate holder 9 stops the gas injection from the gas injection port 2 . The substrate ρ is placed in a state in which the substrate mounting portion 3 is aligned as shown in the figure and ". Further, in the conventional case, when the substrate is placed on the plate holder, there is a possibility that the substrate is displaced (shifted from the position of the predetermined placement position) or the substrate is deformed. The original position of the placement offset is - for example, before the substrate is placed: a thin air layer generated between the substrate and the plate holder causes the substrate to float. Further, in the case where the deformation of the substrate is caused, for example, after the substrate is placed, air is trapped between the substrate and the plate holder, and the substrate is inflated. On the other hand, in the present embodiment, the substrate ρ is transferred and moved in the I state suspended by the gas jet, and is transferred to the plate holder in a high flatness state without twisting. Moreover, since the substrate raft is placed on the substrate mounting portion 31 from the height at which the substrate is suspended, it is possible to prevent air stagnation or air layer from occurring between the substrate ρ and the substrate mounting portion 31. Therefore, it is possible to suppress the substrate Ρ from being in an expanded state and preventing the substrate from being formed. The placement offset or deformation is generated. Therefore, the substrate can be placed in a state where the flatness is high with respect to the position of the plate holder 9, and then the substrate ρ is adsorbed through the suction hole Κ1 by driving the vacuum pump. It is held on the upper surface of the substrate mounting portion 31. After the substrate holder 9 is placed on the substrate, the mask is illuminated by the exposure light IL from the illumination system. The pattern of the mask 照明 illuminated by the exposure light IL is exposed through the projection optical system PL to the substrate p placed on the board holding surface 41 201142977. Since the substrate P can be satisfactorily placed on the plate holder 9 as described above, the exposure can be accurately performed at a suitable position on the substrate P with high precision, and the exposure process with high reliability can be realized. In the present embodiment, during the exposure processing of the substrate P, or when the substrate P subjected to the exposure processing is transported by the carry-out robot 205 as will be described later, the sensitizer is applied by a coating and developing machine (not shown). The next substrate P is placed on the loading table 4 of the loading unit 4. Next, the unloading operation of carrying out the substrate p from the plate holder 9 after the completion of the exposure process will be described. Specifically, a method of carrying out the substrate p by moving out the robot arm 205 will be described. The ® 35 is a three-dimensional view of the action of the robot arm 2〇5.

圖A及36B係將基板p從板保持具9搬出時從γ車由方向 觀看時之剖面構成圖，圖37係從χ軸方向觀看將基板？從 板1呆持具9搬出之動作時之側視圖。此外，圖35中僅圖示 叉邛12，搬出機械臂2〇5之整體構成係省略。又，圖“A 及3印中，為了說明方便，係簡化支承基板ρ之又部^ 圖示。 在曝光處理結束後，解除真空泵之吸引孔K1之吸附， :解除板保持具9對基板p之吸附。其次’搬出機械臂 係如圖35所示將又部12從_ γ方向側插入形成於板保持且 9之槽部3 0。 八 接著，驅動裝置13藉由將又部12往上方移動既定量， 而如圖36A所示使又部12抵接於基板p之下面。又，如圖Figs. A and 36B are cross-sectional structural views when the substrate p is carried out from the plate holder 9 as viewed from the direction of the gamma vehicle, and Fig. 37 is a view of the substrate viewed from the x-axis direction. Side view from the action of the board 1 holding the device 9 out. In addition, in Fig. 35, only the fork 12 is illustrated, and the overall configuration of the carry-out robot 2〇5 is omitted. Further, in the drawings "A and 3, for the sake of convenience of explanation, the other portion of the support substrate ρ is simplified. After the exposure process is completed, the suction of the suction hole K1 of the vacuum pump is released, and the plate holder 9 is released from the substrate p. Next, the 'moving arm' system is inserted into the groove portion 30 formed in the plate holding and 9 from the _γ direction side as shown in Fig. 35. Then, the driving device 13 is moved upward by the further portion 12. The movement is both quantitative, and the further portion 12 is abutted under the substrate p as shown in Fig. 36A.

S 42 201142977 36B所不，又部12進一步往上方移動，藉此將基板p頂起 至板保持具9上方而從基板載置部3丨離開。 又，搬出機械臂205 ,係使又部12上升（退離）至不接 觸搬^部4之搬入用台4〇(載置有塗布有感光劑之次一基板 P)之南度。又部12上升至不接觸搬入用台4〇上之基板p 後’如圖37所示’搬入部4之搬入用台4〇以接近板保持 具9之方式移動，如上所述地將基板p往板保持具9侧搬 送。 在從搬入部4往板保持具9搬送基板P之期間，搬出 機械臂205係使載置於叉部12之基板p移動至塗布顯影機 (未圖不）内。以以上方式，從曝光裝置本體3搬出基板p之 搬出動作即結束。 如上述，根據本實施形態，由於能使被懸浮支承之基 板p滑動而從搬入部4往板保持具9搬送，因此能防止於 基板P與基板載置部3 1之間產生空氣滯留或空氣層，能防 止基板P之載置偏移或變形之產生。因此，能進行信賴性 高之曝光處理。 又，本實施形態中，由於係使用氣體喷射將基板p從 搬入邛4往板保持具9滑動並搬入，因此與對使用習知托 盤之板保持具9之基板搬入相較，產距時間變長。 相對於此’本實施形態中，由於能將搬出機械臂205 之又部12插入槽部3〇並在從下面頂起基板p而從板保持 具9使基板p退離之狀態下由搬入部4將次一基板p搬入 板保持具9,因此對板保持具9之基板P之搬出入所需之整 43 201142977 體產距時間能與使用習知托盤之情形大致同等。因此，可 在不增加基板P之搬出入時之產距時間之情形下以良好狀 態將基板P搬入板保持具9。 此外，本實施形態中，在從搬入用台4〇往板保持具9 搬送基板P時，亦能使搬入用台4〇之上面傾斜。具體而>言， 第2移動機構43之保持部44，係使以來自氣體喷射孔 之氣體喷射而懸浮之狀態支承基板ρ之搬入用台4〇之上面 往板保持具9側（0Υ)傾斜。藉此，能利用基板ρ之自重使 該基板Ρ往板保持具9側移動。 (第7實施形態） 其次，說明本發明之第7實施形態之構成。此外，本 實施形態中，係對與第6實施形態之構成要素相同之要素 賦予同一符號，以省略其說明。第7實施形態，搬入部之 構成係與第6實施形態相異。 本實施形態中，搬入部1 〇4係與使用圖丨6Α及圖i 6Β 說明者相同。 又’本實施形態中之曝光裝置1之動作係與使用圖ΐ7 及圖18說明者相同。 本貫施形態中，由於基板Ρ係如上述在藉由氣體之喷 射而懸浮之狀態下被搬送，因此能無扭曲地在高平面度狀 態下被移交至板保持具9，可防止於基板Ρ與基板載置部 31之間產生空氣滯留或空氣層。因此’能於相對板保持具 9之既定位置以平面度高之狀態載置基板ρ。因此，能於基 板Ρ上之適當位置高精度地進行既定之曝光，而能實現作 201142977 賴性高之曝光處理。 (第8實施形態） 其次，說明本發明之第8實施形態之構成。此外，本 實施形態中，係對與第6、7實施形態之構成要素相同之要 素賦予同一符號，以省略其說明。第8實施形態與第6及 第7實施形態主要差異點為板保持具1 〇9具備移送部。 圖38,係顯示本實施形態之板保持具1〇9之構成之圖。 本貫施形態之板保持具109，係如圖3 8所示具備將基板p 從搬入用台40往板保持具109移送之第i移送部249。此 第1移送部249包含吸附保持基板p寬度方向之兩側部之 吸附部250。此吸附部250能在沿基板p面方向之χγ平面 内自由移動。 又，本實施形態中’係於板保持具1〇9之周邊部設有 用以檢測出藉第1移送部249搬入之基板ρ相對基板載置 部31之位置之位置檢測感測器252。作為此位置檢測.感測 252能例示例如電位計，本發明能使用接觸方式或非接 觸方式之任一者之計器。 吸附部250，係吸附保持藉由來自氣體喷射孔Κ3之氣 體喷射而被懸浮支承於搬入用台4〇上之基板ρ之端部，而 如圖39Α所示從搬入用台40往板保持具1〇9側搬送。另一 方面，板保持具109在接取基板ρ時，係先從形成於上面 之複數個氣體喷射孔Κ2噴射氣體。此時，亦可使從氣體喷 射孔Κ2，Κ3喷射之氣體具有指向性。 吸附部250係如圖39Β所示，藉由使基板Ρ之端部接 45 201142977 觸位置檢測感測器252，而曝光裝置1能偵測基板p相對基 板載置部3 1之位置偏移。此外，吸附部250係構成為根據 上述位置檢測感測器252之檢測結果驅動。 因此，曝光裝置1能根據位置檢測感測器252之檢測 結果修正保持於吸附部250之基板P相對基板載置部3 1之 位置。 本實施形態中亦同樣地，由於基板p係如上述在藉由 氣體之喷射而懸浮之狀態下被搬送，因此能無扭曲地在高 平面度狀態下被移交至板保持具1 〇 9 ’可防止於基板p與基 板載置部3 1之間產生空氣滞留或空氣層。因此，能於相對 板保持具109之既定位置以平面度高之狀態載置基板p。因 此’能於基板P上之適當位置高精度地進行既定之曝光， 而能實現信賴性高之曝光處理。 此外，曝光處理結束後之自板保持具109之基板P搬 出動作由於與第1實施形態相同，因此省略其說明。 (第9實施形態） 其次，說明本發明之第9實施形態之構成。此外，本 實施形態中，係對與第6〜8實施形態之構成要素相同之要 素賦予同一符號，以省略其說明。第9實施形態與第6〜8 貫施形態主要差異點為曝光裝置之構成。圖40 係顯示本 貫施形態之曝光裝置本體3之概略構成之立體圊。 如圖40所示，本實施形態之曝光裝置本體3具備板保 持具9、設於該板保持具9之基板頂起機構150、以及第1 移動機構33。基板頂起機構丨5〇係用以在搬出基板p時將S 42 201142977 36B does not, and the further portion 12 is further moved upward, whereby the substrate p is lifted up above the plate holder 9 and separated from the substrate placing portion 3 . Further, when the robot arm 205 is carried out, the further portion 12 is raised (retracted) to the south of the loading table 4 (the substrate P on which the photosensitive agent is applied) on which the movable portion 4 is not touched. When the other portion 12 is raised so as not to contact the substrate p on the loading table 4, the loading table 4 of the loading unit 4 moves as it is close to the plate holder 9 as shown in Fig. 37, and the substrate p is as described above. We carry to the side of the plate holder 9 side. While the substrate P is being transported from the loading unit 4 to the plate holder 9, the unloading robot 205 moves the substrate p placed on the fork portion 12 into the coating and developing machine (not shown). In the above manner, the unloading operation of the substrate p from the exposure apparatus main body 3 is completed. As described above, according to the present embodiment, since the substrate p suspended and supported can be slid and transported from the loading unit 4 to the plate holder 9, it is possible to prevent air from being trapped or air between the substrate P and the substrate placing portion 31. The layer can prevent the displacement or deformation of the substrate P from being placed. Therefore, it is possible to perform exposure processing with high reliability. Further, in the present embodiment, since the substrate p is slid and carried in from the loading cassette 4 to the plate holder 9 by gas jetting, the production time is changed as compared with the substrate loading of the plate holder 9 using the conventional tray. long. In the present embodiment, the second portion 12 of the unloading robot 205 can be inserted into the groove portion 3, and the substrate p can be lifted from the plate holder 9 while the substrate p is lifted from the lower surface. 4 The second substrate p is carried into the plate holder 9, so that the substrate 43 required for the loading and unloading of the substrate P of the plate holder 9 can be substantially equivalent to the case of using a conventional tray. Therefore, the substrate P can be carried into the plate holder 9 in a good state without increasing the production time of the substrate P during loading and unloading. Further, in the present embodiment, when the substrate P is transported from the loading table 4 to the plate holder 9, the upper surface of the loading table 4 can be inclined. Specifically, the holding portion 44 of the second moving mechanism 43 is configured such that the upper surface of the loading table 4 that supports the substrate ρ in a state in which the gas is ejected from the gas injection hole is suspended toward the plate holder 9 side (0). tilt. Thereby, the substrate can be moved toward the plate holder 9 by the self-weight of the substrate ρ. (Seventh embodiment) Next, a configuration of a seventh embodiment of the present invention will be described. In the present embodiment, the same components as those in the sixth embodiment are denoted by the same reference numerals, and their description will be omitted. In the seventh embodiment, the configuration of the loading unit is different from that of the sixth embodiment. In the present embodiment, the loading unit 1 〇 4 is the same as that described in the drawings 6 and 6 . Further, the operation of the exposure apparatus 1 in the present embodiment is the same as that described with reference to Figs. 7 and 18 . In the present embodiment, since the substrate raft is transported in a state of being suspended by the gas jet as described above, it can be transferred to the plate holder 9 in a high flatness state without distortion, and can be prevented from being on the substrate Ρ. An air retention or air layer is generated between the substrate mounting portion 31 and the substrate. Therefore, the substrate ρ can be placed in a state where the flatness is high with respect to the predetermined position of the plate holder 9. Therefore, the predetermined exposure can be performed with high precision at an appropriate position on the substrate, and the exposure processing with high resolution of 201142977 can be realized. (Eighth Embodiment) Next, a configuration of an eighth embodiment of the present invention will be described. In the present embodiment, the same components as those of the sixth and seventh embodiments are denoted by the same reference numerals, and their description will be omitted. The eighth embodiment differs from the sixth and seventh embodiments in that the plate holder 1 〇 9 is provided with a transfer unit. Fig. 38 is a view showing the configuration of the plate holder 1〇9 of the present embodiment. The plate holder 109 of the present embodiment is provided with an i-th transfer portion 249 for transferring the substrate p from the loading table 40 to the plate holder 109 as shown in FIG. The first transfer unit 249 includes an adsorption unit 250 that adsorbs and holds both side portions in the width direction of the substrate p. The adsorption portion 250 is free to move in the χ γ plane along the p-plane direction of the substrate. Further, in the present embodiment, the position detecting sensor 252 for detecting the position of the substrate ρ carried by the first transfer portion 249 with respect to the substrate placing portion 31 is provided in the peripheral portion of the plate holder 1〇9. As the position detection. The sensing 252 can be exemplified by a potentiometer, and the present invention can use either a contact method or a non-contact method. The adsorption unit 250 adsorbs and holds the end portion of the substrate ρ suspended and supported by the loading table 4 by gas injection from the gas injection port 3, and moves from the loading table 40 to the plate holder as shown in FIG. 39A. 1〇9 side transport. On the other hand, when the substrate holder 109 picks up the substrate ρ, it first ejects gas from a plurality of gas ejection holes 2 formed thereon. At this time, the gas ejected from the gas injection holes Κ2, Κ3 can also be made to have directivity. As shown in Fig. 39A, the adsorption unit 250 can contact the position detecting sensor 252 by the end portion of the substrate 45 45 201142977, and the exposure device 1 can detect the positional deviation of the substrate p with respect to the substrate mounting portion 31. Further, the adsorption unit 250 is configured to be driven based on the detection result of the position detecting sensor 252. Therefore, the exposure apparatus 1 can correct the position of the substrate P held by the adsorption unit 250 with respect to the substrate placing portion 31 based on the detection result of the position detecting sensor 252. In the same manner as in the present embodiment, the substrate p is transported in a state of being suspended by the gas jet, so that it can be transferred to the plate holder 1 〇 9 ' in a high flatness state without distortion. Air entrapment or an air layer is prevented from occurring between the substrate p and the substrate mounting portion 31. Therefore, the substrate p can be placed in a state where the flatness is high with respect to the predetermined position of the plate holder 109. Therefore, it is possible to accurately perform a predetermined exposure on an appropriate position on the substrate P, and it is possible to realize an exposure process with high reliability. In addition, since the substrate P carrying operation from the plate holder 109 after completion of the exposure processing is the same as that of the first embodiment, the description thereof will be omitted. (Ninth Embodiment) Next, a configuration of a ninth embodiment of the present invention will be described. In the present embodiment, the same components as those of the sixth to eighth embodiments are denoted by the same reference numerals, and their description will be omitted. The main difference between the ninth embodiment and the sixth to eighth embodiments is the configuration of the exposure apparatus. Fig. 40 is a perspective view showing a schematic configuration of the main body 3 of the exposure apparatus of the present embodiment. As shown in Fig. 40, the exposure apparatus main body 3 of the present embodiment includes a plate holder 9, a substrate lifting mechanism 150 provided in the plate holder 9, and a first moving mechanism 33. The substrate jacking mechanism 丨5〇 is used to carry out the substrate p

S 46 201142977 基板p往上方頂起者β 〃圖41係顯示板保持具9之俯視構成，42Α及圖42β 係板保持具9之側剖面圖，目42Α係顯示基板之移交前之 狀態之圖’圖42Β係'顯示基板之移交後之狀態之圖。 基板頂起機構150係如圖41、42Α及42Β所示，具備 支承基板ρ之複數個基板支承構件151與使該基板支承構 件1 5 1上下動之上下動作部丨5 2 (參照圖* 3)。 基板支承構件151 ’包含對軸部（上下動構件）155架設 於圖41巾Χ方向（第1方向）之第1線狀構件119與架設於 圖41中Υ方向（第2方向）之第2線狀構件12〇，整體形成 為大致格子狀。此“線狀構件119及第2線狀構件（第2 架設部_，在此處係彼此炫接，或組合成格子狀。各基板 支承構件15.1係架設於複數個（本實施形態中為例如六個） 之軸部155間。 構成各基板支承構件151之各格子形狀，均具有較基 板p小之大致矩形之複數個開口部121。此外，基板支承構 件151之形狀不限定於圖41所示之形狀，例如亦可係開口 部121僅形成有一個之框狀單一框架。· 本實施形態中，四個基板支承構件151係以沿第2線 狀構件120之延伸方向（圖41所示之γ方向）空出間隙s之 狀態而配置。上述基板支承構件151間之間隙s係如後所 述用以構成在如後述從板保持具9搬出基板p時供又部12 插入之空間。 此外，作為基板支承構件151(第丨線狀構件119及第2 201142977 線狀構件120)之形成材料，最好係使用在基板支承構件i5i 支承基板P時能抑制因基板P之自重導致之撓曲，能使用 例如各種合成樹脂或金屬。具體而言，可舉出尼龍、聚丙 烯AS知’丨脂' ABS樹脂、聚碳酸酯、纖維強化塑膠、不鏽 鋼等。作為纖維強化塑膠，可舉出GFRp(Glass Fiber Remfoixed Plastic :玻璃纖維強化熱硬化型塑膠）或 CFRP(Carbon Fiber ReinfGlxed Piastie :碳纖維強化熱硬化 型塑膠）。 上下動作部152係如圖43所示具有軸部（上下動構 件）155與上下驅動該軸部155之驅動裝置153。驅動裝置 153係對各軸部155設置，藉此各軸部155獨立進行上下動 作。 基於此構成’基板支承構件151係如圖❿及圖咖 所示’隨著上下動作部152(轴部155)之上下動，相對板保 持具9之基板載置部31進行上下動作。 另一方面，於板保持具9形成有用以收容基板支承構 件151之凹部13〇。此凹部13〇與基板支承構件ΐ5ι之框架 構造對應而設置成格子狀。板保持具9之上面之凹部13〇 以外之區域（部分載置部）構成保持基板P之基板載置部31。 基板支承構件151之厚度較凹部13〇之深度小。藉此， 圖42B所示，藉由基板支承構件i 5 ^被收容於凹部13 〇 内而僅載置於基板支承構件151上之基板p被移交至基板 載置部3 1而載置。 又，基板载置部31作成具有板保持具9對基板p之實S 46 201142977 The substrate p is raised upwards β 〃 Fig. 41 shows the top view of the plate holder 9 , 42 Α and Fig. 42 is a side view of the β plate holder 9 , and the figure 42 shows the state before the substrate is transferred. 'Fig. 42' shows a diagram of the state after the transfer of the substrate. As shown in FIGS. 41, 42A and 42B, the substrate lifting mechanism 150 includes a plurality of substrate supporting members 151 for supporting the substrate ρ and moving the substrate supporting member 15 1 up and down to move the upper and lower operating portions 丨 5 2 (refer to FIG. ). The substrate supporting member 151' includes the first linear member 119 in which the shaft portion (upper and lower moving member) 155 is placed in the frame direction (first direction) of FIG. 41 and the second wire member 119 that is placed in the Υ direction (second direction) in FIG. The linear member 12A is formed in a substantially lattice shape as a whole. The "linear member 119" and the second linear member (the second erected portion _ are spliced together or combined in a lattice shape. The respective substrate supporting members 15.1 are erected in plural (in the present embodiment, for example Each of the grid portions constituting each of the substrate supporting members 151 has a plurality of openings 121 having a substantially rectangular shape smaller than the substrate p. The shape of the substrate supporting member 151 is not limited to that shown in FIG. In the illustrated shape, for example, only one frame-like single frame may be formed in the opening portion 121. In the present embodiment, the four substrate supporting members 151 are oriented along the extending direction of the second linear member 120 (shown in FIG. The γ direction is disposed in a state in which the gap s is left. The gap s between the substrate supporting members 151 is a space for inserting the further portion 12 when the substrate p is carried out from the plate holder 9 as will be described later. Further, as a material for forming the substrate supporting member 151 (the second linear member 119 and the second 201142977 linear member 120), it is preferable to suppress the scratch caused by the self-weight of the substrate P when the substrate supporting member i5i supports the substrate P. Song, can make For example, various synthetic resins or metals, and specific examples thereof include nylon, polypropylene AS known as 'resin' ABS resin, polycarbonate, fiber reinforced plastic, stainless steel, etc. As the fiber reinforced plastic, GFRp (Glass Fiber) is exemplified. Remfoixed Plastic: Glass fiber reinforced thermosetting plastic) or CFRP (Carbon Fiber Reinf Glxed Piastie). The upper and lower operation portions 152 have a shaft portion (up and down moving member) 155 as shown in FIG. The driving device 153 of the shaft portion 155. The driving device 153 is provided for each of the shaft portions 155, whereby the respective shaft portions 155 are independently operated up and down. Based on this, the "substrate supporting member 151 is shown in FIG. The upper and lower operation portions 152 (the shaft portions 155) are moved downward to move up and down with respect to the substrate mounting portion 31 of the plate holder 9. On the other hand, the plate holder 9 is formed with a recess 13b for accommodating the substrate supporting member 151. The concave portion 13A is provided in a lattice shape corresponding to the frame structure of the substrate supporting member ΐ5i. The region (partial mounting portion) other than the concave portion 13〇 on the upper surface of the plate holder 9 The substrate supporting portion 31 of the substrate P is held. The thickness of the substrate supporting member 151 is smaller than the depth of the concave portion 13A. Thereby, as shown in Fig. 42B, the substrate supporting member i 5 ^ is housed in the concave portion 13 而 only The substrate p placed on the substrate supporting member 151 is placed on the substrate mounting portion 31 and placed thereon. Further, the substrate mounting portion 31 is formed to have the plate holder 9 to the substrate p.

S 48 201142977 質保持©為良好之平面度。再者，於基板載置部η之基板 保持面（上面）形成有發揮使基板p仿傲此面而緊貼之吸引 口或藉由在後述之基板搬入時喷射空氣（氣體）以將基板p ‘公浮支承於此面上之氣體喷射口功能之開口部。於開 口邛Κ205分別連接有未圖示之真空泵及氣體喷射用泵，藉 由切換此等泵之驅動而使開口部Κ2〇5如上述地發揮吸引口 或喷射口功能。 於板保持具9之周邊部設有在基板ρ搬入時用以導引 該基板Ρ之導引用銷36與規定基板ρ對板保持具9之基板 載置部3 1之位置之定位銷37(參照圖44Α及圖44β)。此等 導引用銷36及定位銷37能在曝光裝置本體3内與板保持 具9 一起移動。 其次，參照圖44Α〜圖50Β說明本實施形態之曝光裝 置1之動作。具體而言，主要說明搬入部4與板保持具9 之間之基板Ρ之移交動作、以及板保持具9與搬出機械臂 2 〇5之間之基板ρ之移交動作。 首先，與第6實施形態同樣地，對搬入部*搬入在塗 布顯影機（未圖示）塗布有感光劑之基板ρ。此時，此盆 , 可，基 板p透過吸引孔Κ4被吸附保持於搬入用台4〇之上面。 其-欠，板保持具9係如圖44Α所示，以接近搬入邻4 之搬入用台40之方式移動。此外，圖44Α及44Β中係省略 搬出機械臂之圖示。具體而言，第i移動機構33係將板保 持具9及搬入用台40以沿Y方向接近之狀態排列。此時^ 藉由驅動第2移動機構43使搬入用台4〇及板保持具9在 49 201142977 短時間移動至基板P之移交位置，而縮短基板P之搬入動 作所需之時間。此外’基板P由於透過吸引孔K4被吸附保 持於搬入用台40之上面’因此能防止在第2移動機構43 之驅動時基板P在搬入用台40上移動。 本實施形態中，如圖44B所示，第1移動機構33以支 承有基板P之搬入用台40之上面較板保持具9之上面高之 方式使板保持具9接近搬入用台40❶此外，亦能藉由第2 移動機構43使搬入用台40上升以使搬入用台4〇之上面較 板保持具9之上面高。又’第1移動機構33亦能藉由將板 保持具9及搬入用台40以接觸之狀態排列，藉此順利地進 行基板P之移交。 其次’搬入用台40係如圖45所示，從形成於上面之 複數個氣體喷射孔K3喷射氣體，透過該氣體將基板p以懸 浮狀態支承。另一方面，板保持具9在接取基板p時，係 先驅動未圖示之氣體喷射用泵’從設於基板載置部31之開 口部K205喷射空氣。 搬入部4係在將基板p懸浮支承於搬入用台4〇上之狀 態下，如圖46所示使抵接部42b抵接於基板p之一端部。 抵接部42b係藉由沿凹部40a内之導引部42a移動而將基板 P往板保持具9側移動。 由於基板P成為懸浮於搬入用自40上之狀態，因此抵 接部42b能使基板p順利地滑動至板保持具"卜此外， 板保持具9之上面，係如上所述成為懸浮支承基板p。此處， 亦可使從氣體喷射L K3及開口冑K2〇5喷射之氣體具有指S 48 201142977 Quality retention © is good flatness. Further, on the substrate holding surface (upper surface) of the substrate mounting portion η, a suction port that is in close contact with the substrate p is formed, or air (gas) is ejected when the substrate is carried in later to mount the substrate p. 'The male float supports the opening of the gas jet port function on this side. A vacuum pump and a gas injection pump (not shown) are connected to the opening port 205, and by switching the driving of the pumps, the opening portion 〇2〇5 functions as a suction port or an ejection port as described above. A positioning pin 37 for guiding the guiding pin 36 of the substrate 与 and the predetermined substrate ρ to the substrate placing portion 31 of the plate holder 9 when the substrate ρ is loaded is provided in a peripheral portion of the plate holder 9 ( Refer to Fig. 44A and Fig. 44β). The guide pin 36 and the positioning pin 37 can be moved together with the plate holder 9 in the exposure device body 3. Next, the operation of the exposure apparatus 1 of the present embodiment will be described with reference to Figs. 44A to 50B. Specifically, the transfer operation of the substrate 之间 between the loading unit 4 and the plate holder 9 and the transfer operation of the substrate ρ between the plate holder 9 and the carry-out robot 2 〇 5 will be mainly described. First, in the same manner as in the sixth embodiment, the substrate ρ to which the photosensitive agent is applied to the coating and developing machine (not shown) is carried into the loading unit*. At this time, in this basin, the substrate p can be adsorbed and held on the upper surface of the loading table 4 through the suction holes 4. The plate holder 9 is moved so as to be close to the loading table 40 of the adjacent 4 as shown in FIG. 44A. In addition, in Figs. 44A and 44B, the illustration of the unloading robot arm is omitted. Specifically, the i-th moving mechanism 33 arranges the plate holding member 9 and the loading table 40 in a state of being approached in the Y direction. At this time, by driving the second moving mechanism 43, the loading table 4 and the plate holder 9 are moved to the transfer position of the substrate P in a short time at 49 201142977, and the time required for the substrate P to be moved is shortened. Further, the substrate P is adsorbed and held on the upper surface of the loading table 40 by the suction holes K4. Therefore, it is possible to prevent the substrate P from moving on the loading table 40 when the second moving mechanism 43 is driven. In the present embodiment, as shown in FIG. 44B, the first moving mechanism 33 brings the plate holder 9 closer to the loading table 40 so that the upper surface of the loading table 40 on which the substrate P is supported is higher than the upper surface of the plate holder 9. It is also possible to raise the loading table 40 by the second moving mechanism 43 so that the upper surface of the loading table 4 is higher than the upper surface of the plate holder 9. Further, the first moving mechanism 33 can be arranged in a state of being in contact with each other by the plate holder 9 and the loading table 40, whereby the transfer of the substrate P can be smoothly performed. Next, as shown in Fig. 45, the loading table 40 injects gas from a plurality of gas injection holes K3 formed in the upper surface, and the substrate p is supported by the gas in a suspended state. On the other hand, when the substrate holder 9 picks up the substrate p, the gas jet pump ’ (not shown) is ejected from the opening portion K205 provided in the substrate mounting portion 31. The loading unit 4 is in a state in which the substrate p is suspended and supported by the loading table 4, and the abutting portion 42b is brought into contact with one end portion of the substrate p as shown in Fig. 46 . The abutting portion 42b moves the substrate P toward the plate holder 9 side by moving along the guiding portion 42a in the recess 40a. Since the substrate P is suspended in the loading and unloading state 40, the abutting portion 42b can smoothly slide the substrate p to the plate holder. Further, the upper surface of the plate holder 9 is a suspension supporting substrate as described above. p. Here, the gas injected from the gas injection L K3 and the opening 胄K2〇5 may also have a finger

S 50 201142977 向性。 藉由抵接部42b在搬入用台4〇上面滑動之基板p，係 如圖47所不’在板保持具9之上面順利地移載。本實施形 心中由衿搬入用台40之上面較板保持具9之上面高，因 此基板P月匕在不接觸板保持具9側面之情形下順利地移載 往板保持具9上。 基板P係被導引用銷36規定在該圖中χ方向之位置’ 且藉由被定位銷37及抵接部42b挾持而成為該圖中γ方向 之位置被規疋之狀態。板保持具9係停止來自開口部 之氣體喷射。藉此’基板p係在對基板載置部3 i對齊之狀 態下被載置。 本實施形態中，由於基板p係如上述在藉由氣體之喷 #而懸浮之狀態下被搬送，因此係無扭曲地在高平面度狀 態下被移父至板保持具卜又，由於.基板p係從被懸浮支承 之高度往基板載置部31載£，因此可防止於基板p與基板 載置部3 1之間產生空氣滯留或空氣層。因此，可抑制基板 P成為膨脹狀態，防止基板p之載置偏移或變形之產生。因 此，能於相對板保持具9之既定位置以平面度高之狀態載 置基板P。其後，藉由驅動真空泵，基板p即透過開口部 K205被吸附保持於基板載置部M之上面。 於板保持具9載置基板P後，光罩M係被以來自照明S 50 201142977 Towards sex. The substrate p which has been slid on the loading table 4 by the abutting portion 42b is smoothly transferred on the upper surface of the plate holder 9 as shown in Fig. 47. In the present embodiment, since the upper surface of the loading table 40 is higher than the upper surface of the plate holder 9, the substrate P is smoothly transferred to the plate holder 9 without contacting the side surface of the plate holder 9. The substrate P is defined by the positioning pin 36 in the χ direction in the drawing, and is held by the positioning pin 37 and the abutting portion 42b, so that the position in the γ direction in the figure is regulated. The plate holder 9 stops the gas injection from the opening. Thereby, the substrate p is placed in a state in which the substrate mounting portion 3 i is aligned. In the present embodiment, since the substrate p is transported in a state of being suspended by the gas jet # as described above, the substrate p is transferred to the panel in a high flatness state without distortion, because the substrate is Since p is carried to the substrate mounting portion 31 from the height of the suspension support, it is possible to prevent air stagnation or an air layer from being generated between the substrate p and the substrate mounting portion 31. Therefore, it is possible to suppress the substrate P from being in an expanded state, and to prevent the occurrence of offset or deformation of the substrate p. Therefore, the substrate P can be placed in a state where the flatness is high with respect to the predetermined position of the plate holder 9. Then, by driving the vacuum pump, the substrate p is adsorbed and held on the upper surface of the substrate placing portion M through the opening portion K205. After the substrate holder 9 mounts the substrate P, the mask M is illuminated from the illumination.

系統之曝光用光IL照明。被以曝光用光IL照明之光罩M 之圖案，係透過投影光學系統PL投影曝光至載置於板保持 具9之基板P。 51 201142977 本實施形態之曝光裝置1 ’由於能如上所述地將基板p 良好地載置於板保持具9上’因此能於基板p上之適當位 置问精度地進行既定之曝光，而能實現信賴性高之曝光處 理。 其次，說明曝光處理結束後從板保持具9搬出基板p 之搬出動作。 具體而言，係說明藉由搬出機械臂2〇5搬出基板p之 方法。圖48係用以說明搬出機械臂2〇5之動作之立體圖， 圖49A、圖49B、及圖49C係將基板p從板保持具9搬出 時從γ軸方向觀看時之剖面構成圖。此外，圖48中僅圖示 叉部12，搬出機械臂2〇5之整體構成係.省略。本實施形態 中與頂起機構150之形狀對應地，叉部丨2中之基板支承 部係與上述實施形態相異。又，圖49A、圖49B、及圖49C 中為了說明方便，係簡化支承基板p之叉部丨2之圖示。 在曝光處理結束後’解除透過真空泵之開口部K2〇5之 吸附’以解除板㈣具9對基板ρ之吸附。其次，頂起機 構1 5〇係驅動轴# 1 55而使基板支承構件1 5 1上升。此時， 士圖49Α所不，與基板支承構件15 1 —起被載置於基板載 置部31上之基板p係被往上方頂起。此時’基板p由於被 複數個基板支承構# 15丨支承而往上方被頂起，因此能防 止釗離帶電之產生。又’由於與習知般藉由銷頂起基板P 之It形相較能以較寬廣之面支承基板p，因此能減低於基板 p產生之撓曲量，而能防止於基板P產生裂痕。 搬出機械臂205驅動又部12，如圖48所示將叉部12The exposure of the system is illuminated with light IL. The pattern of the mask M illuminated by the exposure light IL is projected and exposed to the substrate P placed on the board holder 9 through the projection optical system PL. 51 201142977 In the exposure apparatus 1' of the present embodiment, since the substrate p can be placed on the plate holder 9 satisfactorily as described above, it is possible to accurately perform the predetermined exposure on the appropriate position on the substrate p. Highly reliable exposure processing. Next, the unloading operation of carrying out the substrate p from the plate holder 9 after the completion of the exposure process will be described. Specifically, a method of carrying out the substrate p by carrying out the robot arm 2〇5 will be described. Fig. 48 is a perspective view for explaining the operation of carrying out the robot arm 2〇5, and Figs. 49A, 49B, and 49C are cross-sectional structural views when the substrate p is taken out from the plate holder 9 as viewed from the γ-axis direction. In addition, in Fig. 48, only the fork portion 12 is shown, and the overall configuration of the unloading robot arm 2〇5 is omitted. In the present embodiment, the substrate supporting portion of the fork portion 2 is different from the above embodiment in accordance with the shape of the jacking mechanism 150. Further, in FIGS. 49A, 49B, and 49C, for convenience of explanation, the illustration of the fork portion 2 of the support substrate p is simplified. After the exposure process is completed, the "adsorption by the opening K2〇5 of the vacuum pump is released" to release the adsorption of the substrate ρ by the plate (4). Next, the jacking mechanism 15 5 drives the shaft #1 55 to raise the substrate supporting member 115. At this time, the substrate p placed on the substrate mounting portion 31 together with the substrate supporting member 15 1 is lifted upward. At this time, the substrate p is supported upward by the support of the plurality of substrate supporting structures #15, so that the occurrence of the separation can be prevented. Further, since it is possible to support the substrate p with a wider surface than the It-shaped surface of the substrate P by the pin, it is possible to reduce the amount of deflection generated by the substrate p and to prevent cracking of the substrate P. The unloading robot arm 205 drives the further portion 12, and the fork portion 12 is as shown in FIG.

S 52 201142977 從—Y方向側往配置於基板載 m間之間隙…轴方向^:二上方之基板支承機構 間隙s及兩端部（圖彻）。㈣動’而將又部12插入 由接著’驅動裝置13藉由將又部12往上方移動既定量， 使又。"2抵接於基板P之下面。進一步使又部η往上方 移動，藉此將基板P頂起至板佴 15〇離開。 &保持具9上方而從頂起機構 頂起機構150在基板p離開後，將基板支承構件151 收容於…㈣。於凹部13〇内收容基板支承構件a 後，板保持具9 '以接近搬入部4之搬入用纟4〇之方式移 動’如上所述地將基板P往板保持具9側搬送.。 在從搬入部4往板保持具9搬送基板p之期間，搬出 機械臂205係使載置於叉部12之基板p移動至塗布顯影機 (未圖示）内。以以上方式，從曝光裝置本體3搬出基板卩之 搬出動作即結束。 如上述，根據本實施形態，由於能使被懸浮支承之基 板P滑動而從搬入部4往板保持具9搬送，因此能防止基 板p之載置偏移或變形之產生。又，本實施形態亦同樣地， 對板保持具9之基板P之搬出入所需之整體產距時間能與 使用習知托盤之情形大致同等。因此，可在不增加基板P 之搬出入時之產距時間之情形下以良好狀態將基板P搬入 板保持具9。 此外，上述實施形態中，說明了僅於基板載置部3 1形 成作為氣體喷射口之開口部Κ205之情形，但亦能於基板支 53 201142977 承構件15 1上面形成氣體喷射口。如此，在將基板p搬入 板保持具9實，由於喷射於基板搬送面之氣體之量增加， 因此能更順利地搬送基板p。 (第10實施形態） 其次’說明本發明之第10實施形態之構成。此外，本 實施形態中，係對與第6實施形態之構成要素相同之要素 賦予同一符號，以省略其說明。第1 〇實施形態與上述實施 形態之主要差異點’為具備以非接觸狀態吸附基板p之吸 附機構作為從板保持具9搬出基板p之手段。 吸附機構係用以保持基板P，將基板P從板保持具9之 基板載置部31往上方頂起，使之移動至塗布顯影機（未圖 不）。圖50A係顯示吸附面之構成，圖5〇B係顯示吸附機構 之整體構成之圖。 如圖50A及圖50B所示，吸附機構35〇具備以非接觸 狀態保持基板P之複數個保持部351、保持此等保持部351 之基部352、能移動該基部352之驅動機構355。基部 係具有與基板P大致同等大小之板狀構件。保持部351於 基部352上規則地配置，藉此能良好地保持基板p。 使用了所謂貝努伊夾頭作為保持部35b保持部351箱 由將壓縮空氣喷射於與基板p之間以使負壓於與基板U 間產生《藉此’產生將基板p按壓於保持部35ι側之按遷 力。另—方面，保持部351在與基板、時，歷 縮空氣之流速係降低，保持部351與基板p間之壓力^ 升。藉此產生使基板P從保持部351離開之力。保持部^S 52 201142977 From the Y-direction side to the gap between the substrate carriers m... The axial direction ^: The substrate support mechanism above the gap s and both ends (Tucher). (4) Moving 'and inserting the further portion 12. The driving device 13 is moved by moving the further portion 12 upwards. "2 abuts below the substrate P. Further, the further portion η is moved upward, whereby the substrate P is lifted up to the plate 佴 15 〇 to leave. & Above the holder 9 from the jacking mechanism The jacking mechanism 150 is placed in the substrate p, and the substrate supporting member 151 is housed in (4). After the substrate supporting member a is accommodated in the recessed portion 13A, the plate holder 9' is moved so as to approach the carrying-in portion 4 of the loading unit 4. The substrate P is conveyed toward the plate holder 9 as described above. While the substrate p is being transported from the loading unit 4 to the plate holder 9, the unloading robot 205 moves the substrate p placed on the fork portion 12 into a coating and developing machine (not shown). In the above manner, the unloading operation of the substrate 搬 from the exposure apparatus main body 3 is completed. As described above, according to the present embodiment, the substrate P that is suspended and supported can be slid and transported from the loading unit 4 to the plate holder 9, so that the displacement or deformation of the substrate p can be prevented from occurring. Further, in the present embodiment as well, the overall production time required for the loading and unloading of the substrate P of the plate holder 9 can be substantially equal to the case of using a conventional tray. Therefore, the substrate P can be carried into the board holder 9 in a good state without increasing the production time of the substrate P during loading and unloading. Further, in the above-described embodiment, the case where the opening portion 205 as the gas ejection port is formed only in the substrate mounting portion 31 is described, but the gas ejection port can be formed on the substrate member 15 1 on the substrate holder 53 201142977. As described above, when the substrate p is carried into the plate holder 9, the amount of gas ejected onto the substrate transfer surface is increased, so that the substrate p can be conveyed more smoothly. (Tenth embodiment) Next, the configuration of the tenth embodiment of the present invention will be described. In the present embodiment, the same components as those in the sixth embodiment are denoted by the same reference numerals, and their description will be omitted. The main difference between the first embodiment and the above embodiment is that the suction mechanism that adsorbs the substrate p in a non-contact state is used as a means for carrying out the substrate p from the plate holder 9. The adsorption mechanism is for holding the substrate P, and the substrate P is lifted upward from the substrate placing portion 31 of the plate holder 9 to be moved to a coating and developing machine (not shown). Fig. 50A shows the configuration of the adsorption surface, and Fig. 5B shows the overall configuration of the adsorption mechanism. As shown in Figs. 50A and 50B, the suction mechanism 35A includes a plurality of holding portions 351 that hold the substrate P in a non-contact state, a base portion 352 that holds the holding portions 351, and a drive mechanism 355 that can move the base portion 352. The base has a plate-like member of substantially the same size as the substrate P. The holding portion 351 is regularly disposed on the base portion 352, whereby the substrate p can be favorably held. A so-called Bernou chuck is used as the holding portion 35b. The holding portion 351 is formed by ejecting compressed air between the substrate and the substrate p so that a negative pressure is generated between the substrate and the substrate U, thereby causing the substrate p to be pressed against the holding portion 35i. The side of the move. On the other hand, when the holding portion 351 is in contact with the substrate, the flow rate of the contracted air is lowered, and the pressure between the holding portion 351 and the substrate p is raised. Thereby, a force that causes the substrate P to be separated from the holding portion 351 is generated. Holder ^

S 54 201142977 此能以 亦即以 係藉由噴射壓縮空氣以取得上述兩個力之平衡，藉 將基板p與保持部351之間隔保持於一定之狀態〇 非接觸狀態保持基板P。 " 其次，參照圖式說明曝光裝^ i之動作。此外，關於 搬入。P 4與板保持具9間之基板p之移交動作，由於與第1 實施形態相同因此省略說明。 以下，說明從板保持具9搬出基板p之動作。具體而 言，係說明藉由上述吸附機構35〇將基板p 搬出之方法。一圖51B係從乂轴方向觀 從板保持具9搬出之動作時之側視圖。 在曝光處理結束後，解除真空泵之吸引孔K1之吸附， 以解除板保持具9對基板P之吸附。其次，吸附機構35〇 係移動至板保持具9上方。接著，吸附機構35〇如圖51A 所示下降至保持部351能保持基板p之位置。接著，藉由 複數個保持部351以非接觸狀態保持基板p之上面。此時， 能使複數個保持部35丨同時驅動或依序驅動以保持基板p。 吸附機構350係以藉由複數個保持部35丨保持基板p 之狀態以驅動機構355將基板p頂起至板保持具9上方， 而如圖51B所示從基板載置部31離開。此時，保持部351 由於與基板P為非接觸，因此於基板p無殘留吸附痕。 在吸附機構350上升至不接觸搬入用台4〇上之基板p 之位置後，搬入部4之搬入用台40係以接近板保持具9之 方式移動。接著，與上述實施形態同樣地，將基板p以懸 浮支承之狀態從搬入用台40往板保持具9搬送。 55 201142977 在將基板P從搬入部4搬入至板保持具9之期間，吸 附機構35G係將保持部35 i所保持之基板p移動至塗布顯 影機（未圖示）。藉由u ^ )稭由以上方式，從曝光裝置本體3搬出基板 P之搬出動作即結束。 匕外如圖52A及圓52B所示，亦能於基部352周圍 。又置支承基板P下面之支承構件353。支承構件353係由包 圍基板P周圍之框狀構件構成，具有複數個伸出於基板p 之面方向之伸出部354。此伸出部354係抵接於基板p之下 面藉由此構成，在保持恐有產生基板p之壓陷之虞之大 型基板時，由於基板P之周端部被伸出部354支承，因此 :使係保持大型基板之情形，亦能防止基板p產生壓陷且 能藉由保持部351以高平面度之狀態保持基板p。 又，作為上述實施形態之基板p，不僅是顯示元件用之 玻璃基板，亦可以是半導體元件製造用之半導體晶圓、薄 膜磁頭用之陶究晶圓、或曝光裝置所使用之光蕈或標線片 之原版（合成石英、矽晶圓）等。 又，作為曝光裝置，除了能適用於使光罩％與基板p 同步移動來以透過對光罩M之圖案之曝光用光化進行基板 P之掃描曝光的步進掃描方式之掃描型以裝置（掃描步進 機）以外，亦能適用於在使光罩厘與基板p靜止之狀態下， 使光罩Μ之圖案一次曝光，並使基板p依序步進移動之步 進重複方式的投影曝光裝置（步進機）。 又，本發明亦能適用於如美國發明專利第6341〇〇7號' 美國發明專利第6208407號、美國發明專利第626279/號 56 201142977 等所揭示之具備複數個基板載台之雙載台型之曝光裝置。 又，本發明亦能適用於如美國發明專利第6897963號、 歐洲發明專利申請第1713113號等所揭示之具備保持基板 之基板載台、以及不保持基板而搭載了形成有基準標記之 基準構件及/或各種光電感測器之测量載台的曝光裝置。 又’亦可採用具備複數個基板載台與測量載台之曝光裝置。 此外，上述實施形態中’雖係使用在光透射性基板上 形成有既定遮光圖案(或相位圖案、減光圖案)之光透射型光 罩，但亦可取代此光罩，使用例如美國發明專利第 號公報所揭示，根據待曝光圖案之電子資料來形成透射圖 案或反射圖案、或形成發光圖案之可變成形光罩(亦稱為電 子光罩主動光罩或影像產生器）。又，亦可取代具備非發 光型影像顯示元件之可變成形光罩，@具備包含自發光型 影像顯示元件之圖案形成裝置。 上述實施形態之曝光裝置，係藉由組裝各種次系統（含 各構成要素以能保持既定之機械精度、電氣精度、光學 精度之方式所製造。為確保此等各種精度，於組裝前後干 係進行對各種光學系統進行用以達成光學精度之調整、對 各種機械系統進行用以達成機械精度之調整、對各種電氣 系統進行用以達成電氣精度之調整。從各種次系統至曝光 裝置之組裝製程，係包含機械連接、電路之配線連接、氣 f k路之配官連接'等。當然，從各種次系統至曝光裝置之 、且裝製耘別，係有各次系統個別之組裝製程。當各種次系 、’先至曝光裝置之組裝製程結束後，即進行综合調整，以確 57 201142977 保曝光裝置EX整體之各種精度。此外，曝光裝置之製造最 好疋在溫度及清潔度等皆受到管理之潔淨室進行。 半導體元件等之微元件，如圖5 3所示，係經進行微元 件之功能、性能設計之步驟2〇1，根據此設計步驟製作光罩 (標線片）之步驟202，製造元件基材之基板之步驟2〇3，包 含依據上述實施形態進行基板處理（曝光處理，包含使用光 罩圖案以曝光用光使基板曝光之動作、以及使曝光後基板 顯影之動作）的基板処理步驟204，元件組裝步驟（包含切割 v驟、纟。合步驟、封裝步驟等之加工製程）2〇5，以及檢査步 驟206等而製造。此外，在步驟2〇4巾，包含藉由使感光 齊J ,.J ’5V而形成與光罩之圖案對應之曝光圖案層（已顯影之 感光劑之層），並透過此曝光圖案層加工基板之動作。 此外’上述各實施形態及變形例之要件可適當加以組 合。又，亦有不使用一部分構成要素之情形。又，在法令 口午可範圍内’援用上述各實施形態及變形例所引用之關於 曝光裝^等之所有公開公報及美國專利之揭示作為本文記 載之一部分。 【圖式簡單說明】 圖1係顯示曝光裝置之整體概略之剖面俯視圖。 圖2係顯示腔室内之具體構成之外觀立體圖。 圖3A係顯示板保持具之周邊構成之圖。 圖3B係顯示板保持具之周邊構成之圖。 圖4A係顯示搬入部之主要部位構成之圖。S 54 201142977 This is to maintain the balance of the above two forces by jetting compressed air, and to maintain the interval between the substrate p and the holding portion 351 in a certain state, and to hold the substrate P in a non-contact state. " Secondly, the action of the exposure device is explained with reference to the drawing. In addition, about moving in. The transfer operation of the substrate p between the P 4 and the plate holder 9 is the same as that of the first embodiment, and thus the description thereof will be omitted. Hereinafter, the operation of carrying out the substrate p from the plate holder 9 will be described. Specifically, a method of carrying out the substrate p by the above-described adsorption mechanism 35 说明 will be described. Fig. 51B is a side view showing the operation of carrying out the plate holder 9 from the direction of the cymbal axis. After the exposure process is completed, the suction of the suction hole K1 of the vacuum pump is released to release the adsorption of the substrate holder P by the plate holder 9. Next, the suction mechanism 35 is moved to the upper side of the plate holder 9. Next, the suction mechanism 35 is lowered as shown in FIG. 51A until the holding portion 351 can hold the position of the substrate p. Next, the upper surface of the substrate p is held in a non-contact state by a plurality of holding portions 351. At this time, the plurality of holding portions 35 can be simultaneously driven or sequentially driven to hold the substrate p. The suction mechanism 350 pushes the substrate p up to the upper side of the plate holder 9 by the drive mechanism 355 in a state in which the substrate p is held by the plurality of holding portions 35, and is separated from the substrate placing portion 31 as shown in FIG. 51B. At this time, since the holding portion 351 is not in contact with the substrate P, there is no residual adsorption mark on the substrate p. After the suction mechanism 350 is raised to a position where the substrate p on the loading table 4 is not touched, the loading table 40 of the loading unit 4 moves so as to approach the plate holder 9. Then, in the same manner as in the above embodiment, the substrate p is transported from the loading table 40 to the plate holder 9 in a state of being suspended and supported. 55 201142977 While the substrate P is carried from the loading unit 4 to the plate holder 9, the suction mechanism 35G moves the substrate p held by the holding unit 35i to a coating machine (not shown). By the above method, the unloading operation of the substrate P is carried out from the exposure apparatus main body 3 as described above. The outer portion can also be surrounded by the base portion 352 as shown in Fig. 52A and circle 52B. The support member 353 under the support substrate P is again placed. The support member 353 is composed of a frame-shaped member surrounding the substrate P, and has a plurality of projecting portions 354 extending in the direction of the surface of the substrate p. The projecting portion 354 is configured to be in contact with the lower surface of the substrate p, and the peripheral end portion of the substrate P is supported by the protruding portion 354 when the large substrate having the collapse of the substrate p is prevented from being held. In the case where the large substrate is held, it is possible to prevent the substrate p from being depressed and to hold the substrate p in a state of high flatness by the holding portion 351. Further, the substrate p of the above-described embodiment is not only a glass substrate for a display element, but also a semiconductor wafer for semiconductor element manufacturing, a ceramic wafer for a thin film magnetic head, or a diaphragm or a label used for an exposure apparatus. The original version of the wire (synthetic quartz, silicon wafer). Further, as an exposure apparatus, in addition to a step-scan type scanning device capable of moving the mask % in synchronization with the substrate p to perform scanning exposure of the substrate P by exposure to the pattern of the mask M ( In addition to the scanning stepper, it can also be applied to the stepwise repeating projection exposure of the mask Μ pattern in a state where the reticle and the substrate p are stationary, and the substrate p is sequentially stepped and moved. Device (stepper). Moreover, the present invention can also be applied to a dual-stage type having a plurality of substrate stages as disclosed in U.S. Patent No. 6,341,7, U.S. Patent No. 6,208,407, U.S. Patent No. 626,279, No. Exposure device. Moreover, the present invention is also applicable to a substrate stage having a holding substrate as disclosed in Japanese Laid-Open Patent Publication No. 6897963, and a European Patent Application No. 1713113, and a reference member on which a reference mark is formed without holding the substrate. / or the exposure device of the measurement stage of various photo-inductors. Further, an exposure apparatus having a plurality of substrate stages and a measurement stage may be used. Further, in the above-described embodiment, a light-transmitting type mask in which a predetermined light-shielding pattern (or a phase pattern or a light-reducing pattern) is formed on a light-transmitting substrate is used, but instead of the mask, for example, a US invention patent may be used. As disclosed in the first publication, a transmissive pattern or a reflective pattern or a variable shaped mask (also referred to as an electro-optic active mask or image generator) that forms a light-emitting pattern is formed according to an electronic material of a pattern to be exposed. Further, instead of a variable molding mask having a non-emissive image display element, a pattern forming apparatus including a self-luminous type image display element can be provided. The exposure apparatus of the above-described embodiment is manufactured by assembling various sub-systems (including various components to maintain predetermined mechanical precision, electrical precision, and optical precision. To ensure these various precisions, it is necessary to perform the pairing before and after assembly. Various optical systems are used to achieve optical precision adjustment, to adjust mechanical precision for various mechanical systems, and to adjust electrical accuracy for various electrical systems. Assembly processes from various subsystems to exposure devices are used. It includes mechanical connection, wiring connection of circuit, distribution connection of gas fk road, etc. Of course, from various subsystems to exposure devices, and assembly, there are separate assembly processes for each system. After the assembly process of the exposure device is completed, comprehensive adjustment is performed to confirm the various precisions of the overall exposure device EX 2011. In addition, the exposure device is preferably cleaned in terms of temperature and cleanliness. The micro component of a semiconductor component, as shown in FIG. 5, is subjected to the function of the micro component. Step 2 of performance design, step 202 of fabricating a mask (reticle) according to the design step, and step 2 of 3 for manufacturing a substrate of the component substrate, including substrate processing according to the above embodiment (exposure processing, including use) The substrate processing step 204 of the mask pattern exposing the substrate by exposure light and the operation for developing the exposed substrate, and the component assembly step (including the processing steps of the cutting step, the bonding step, the packaging step, etc.) 2 〇5, and inspection step 206, etc. Further, in step 2〇4, an exposure pattern layer (developed sensitizer) corresponding to the pattern of the reticle is formed by sensitizing J, J '5V The operation of processing the substrate through the exposure pattern layer. Further, the requirements of the above embodiments and modifications may be combined as appropriate. Further, some components may not be used. The disclosures of all publications and U.S. patents, which are incorporated by reference to each of the above-mentioned embodiments and variations, are incorporated herein by reference. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional plan view showing an overall schematic view of an exposure apparatus. Fig. 2 is a perspective view showing the appearance of a specific structure in a chamber. Fig. 3A is a view showing a configuration of a periphery of a panel holder. Fig. 3B is a display panel. Fig. 4A is a view showing the configuration of the main part of the carrying unit.

S 58 201142977 圖4B係顯示搬入部之主要部位構成之圖。 圖5 A係顯示搬出部之主要部位構成之圖。 圖5B係顯示搬出部之主要部位構成之圖。 圖6係說明基板對搬入用台之移交步驟之圖。 圖7A係板保持具及搬出部間之基板之搬送步驟之說明 圖。 圖7B係板保持具及搬出部間之基板之搬送步驟之說明 圖。 圖8係顯示於搬入用台上懸浮支承有基板之狀態之圖。 圖9係說明搬送搬入用台上之基板之步驟之圖。 圖10係說明基板移載至板保持具側之步驟之圖。 圖11係說明於板保持具上載置有基板之狀態之圖。 圖12係說明基板對搬出用台之移交步驟之圖。 圖1 3係顯示於搬出用台上懸浮支承有基板之狀態之 圖。 圖14A係說明從板保持具往搬出部側之基板搬送之圖。 圖14B係說明從板保持具往搬出部側之基板搬送之圖。 圖1 5係說明從搬出部搬出基板之動作之圖。 圖1 6 A係顯示第2實施形態之搬入部之構成之圖。 圖1 6B係顯示第2實施形態之搬入部之構成之圖。 圖1 7係說明從搬入部往板保持具側搬送基板之構成之 圖。 圖18係用以說明接績於圖1 8之步驟之圖。 圖19係顯示第3實施形態之板保持具構成之圖。 59 201142977 圖20A係說明從搬入部往板保持具側搬送基板之構成 之圖。 圖20B係說明從搬入部往板保持具側搬送基板之構成 之圖。 圖2 1係顯示第4實施形態之構成之圖。 圖22A係說明第4實施形態之基板之移交動作之圖。 圖22B係說明第4實施形態之基板之移交動作之圖。 圖2 2 C係說明第4實施形態之基板之移交動作之圖。 圖22D係說明第4實施形態之基板之移交動作之圖。 圖23係顯示第5實施形態之腔室内部之構成之立體 圖。 圖24A係顯示搬出入部之概略構成之俯視圖。 圖24B係顯示搬出入部之概略構成之俯視圖。 圖25儀說明第5實施形態之基板之搬入步驟之圖。 圖26係說明從搬出入部往板保持具側之基板移交之 圖。 圖27係說明從板保持具往搬出入部側之基板移交之 圖。 圖28係顯示曝光裝置之整體概略之剖面俯視圖。 圖29係顯示腔室内之具體構成之外觀立體圖。 圖30A係顯示板保持具之周邊構成之圖。 圖30B係顯示板保持具之周邊構成之圖。 圖3 1A係板保持具及搬出部間之基板之搬樣步驟之說 明圖。 60 201142977 圖3 1B係板保持具及搬出部間之基板之搬送步驟之說 明圖。 圖32係顯示於搬入用台上懸浮支承有基板之狀態之 之圖。 圖33係說明搬送搬入用台上之基板之步驟之圖。 圖3 5係用以說明搬出機器臂之動作之圖。 圖36A係說明從板保持具搬出基板之動作之前視圖。 圖36B係說明從板保持具搬出基板之動作之前視圖。 圖37係說明從板保持具搬出基板之動作之側視圖。 圖38係顯示第3實施形態之搬入部構成之圖。圖 係說明從搬入部往板保持具側搬送基板之構成 之圖。 圖 係°兒明從搬入部往板保持具侧搬送基棟之構成 圖.40係顯示第4 實施形態之曝光裝置本體之構成之 之圖。S 58 201142977 Fig. 4B is a view showing the configuration of main parts of the loading unit. Fig. 5A is a view showing the configuration of main parts of the carry-out unit. Fig. 5B is a view showing the configuration of a main part of the carry-out portion. Fig. 6 is a view for explaining a process of transferring a substrate to a loading table. Fig. 7A is an explanatory view showing a step of transporting a substrate between the plate holder and the carry-out portion. Fig. 7B is an explanatory view showing a step of transporting the substrate between the plate holder and the carry-out portion. Fig. 8 is a view showing a state in which a substrate is suspended and supported on a loading table. Fig. 9 is a view for explaining a procedure of transporting a substrate on a loading table. Figure 10 is a diagram illustrating the steps of transferring the substrate to the side of the plate holder. Fig. 11 is a view for explaining a state in which a substrate is placed on a plate holder. Fig. 12 is a view for explaining a process of transferring a substrate to a carry-out table. Fig. 1 is a view showing a state in which a substrate is suspended and supported on a carry-out stage. Fig. 14A is a view for explaining the substrate transfer from the plate holder to the carry-out portion side. Fig. 14B is a view for explaining the substrate transfer from the plate holder to the carry-out portion side. Fig. 15 is a view for explaining the operation of carrying out the substrate from the carry-out unit. Fig. 16 is a view showing the configuration of the loading unit of the second embodiment. Fig. 1 is a view showing the configuration of the loading unit of the second embodiment. Fig. 1 is a view showing a configuration in which a substrate is transferred from the loading portion to the plate holder side. Figure 18 is a diagram for explaining the steps of the process of Figure 18. Fig. 19 is a view showing the structure of a plate holder according to a third embodiment. 59 201142977 Fig. 20A is a view showing a configuration in which a substrate is transferred from the loading unit to the plate holder side. Fig. 20B is a view showing a configuration in which a substrate is transferred from the loading unit to the plate holder side. Fig. 2 is a view showing the configuration of the fourth embodiment. Fig. 22A is a view for explaining a handover operation of a substrate in the fourth embodiment. Fig. 22B is a view for explaining the transfer operation of the substrate in the fourth embodiment. Fig. 2 2 is a view showing the transfer operation of the substrate in the fourth embodiment. Fig. 22D is a view for explaining the transfer operation of the substrate in the fourth embodiment. Fig. 23 is a perspective view showing the configuration of the inside of the chamber in the fifth embodiment. Fig. 24A is a plan view showing a schematic configuration of a carry-in/out portion. Fig. 24B is a plan view showing a schematic configuration of the carry-in/out portion. Fig. 25 is a view showing the steps of carrying in the substrate in the fifth embodiment. Fig. 26 is a view for explaining the transfer of the substrate from the carry-in/out portion to the plate holder side. Fig. 27 is a view for explaining the transfer of the substrate from the plate holder to the carry-in/out side. Fig. 28 is a cross-sectional plan view showing the overall outline of the exposure apparatus. Fig. 29 is a perspective view showing the appearance of a specific configuration in the chamber. Fig. 30A is a view showing the configuration of the periphery of the plate holder. Fig. 30B is a view showing the configuration of the periphery of the plate holder. Fig. 3 is an explanatory view showing a step of carrying a sample of a substrate between the holder and the carrying-out portion of the 1A. 60 201142977 Fig. 3 is a diagram showing the steps of transporting the substrate between the 1B-plate holder and the carry-out unit. Fig. 32 is a view showing a state in which a substrate is suspended and supported on a loading table. Fig. 33 is a view for explaining the steps of transporting the substrate on the loading table. Figure 3 is a diagram for explaining the operation of moving out of the robot arm. Fig. 36A is a front view showing the operation of carrying out the substrate from the plate holder. Fig. 36B is a front view showing the operation of carrying out the substrate from the plate holder. Fig. 37 is a side view for explaining the operation of carrying out the substrate from the plate holder. Fig. 38 is a view showing the configuration of the carrying unit in the third embodiment. The figure shows a configuration in which the substrate is transferred from the loading unit to the holder. Fig. 40 is a view showing the configuration of the main body of the exposure apparatus according to the fourth embodiment.

之圖。 具側搬送基板之構成 圖44B係說明從搬 之圖。 入部往板保持具側搬送基板之構成 61 201142977 圖 圖45係顯示於搬入用台上懸浮支承基板之狀態之圖。 圖46係顯示抵接部接處於基板之端部之狀態之圖。 圖47係說明基板從搬入用台移動至板保持具之步驟之 圖 圖 圖48係用以說明搬出機械臂之動作之立體圖。 圖49Α係從板保持具搬出基板之步驟之說明圖。 圖49Β係從板保持具搬出基板之步驟之說明圖。 圖49C係從板保持具搬出基板之步驟之說明圖。 圖50Α係顯示第5實施形態之吸附機構之構成之俯視 圖50Β係顯示第5實施形態之吸附機構之構成之側視 圖51Α係說明從板保持具搬出基板之動作之側視圖 圖51Β係、說明從板保#具搬出基板之動作之側視圖 圖52Α係顯示吸附機構之變形例之構成之圖。 圖52Β係顯示吸附機構之變形例之構成之圖' 圖53係用以說明微型元件之製程一例之流程圖。 【主要元件代表符號】 1 4, 104 5 9, 109 曝光裝置 搬入部 搬出部 板保持具 12 叉部 62 201142977 19 位置檢測感測器 33 第1移動機構 40， 140 搬入用台 42, 149, 249 第1移送部 43 第2移動機構 50 搬出用台 52 第2移送部 53 第3移動機構 142 滾子 148 滾子機構 150 頂起機構 205 搬出機械臂 250 吸附部 251 保持部 252 位置檢測感測器 350 吸附機構 351 保持部 401 基板載置台 405 移送部 408 吸附部 P 基板 Kl, K4, K6, K8 吸引孔 Κ2, Κ3, Κ5, Κ7 氣體喷射孔 Κ205 開口部 63Picture. Structure with side transfer substrate Fig. 44B is a view showing the transfer. Structure of the substrate to be conveyed to the side of the plate holder 61 201142977 Fig. 45 is a view showing a state in which the support substrate is suspended on the loading table. Fig. 46 is a view showing a state in which the abutting portion is attached to the end portion of the substrate. Fig. 47 is a view for explaining the step of moving the substrate from the loading table to the plate holder. Fig. 48 is a perspective view for explaining the operation of carrying out the robot arm. Fig. 49 is an explanatory view showing a step of carrying out the substrate from the plate holder. Fig. 49 is an explanatory view showing a step of carrying out the substrate from the plate holder. Fig. 49C is an explanatory view showing a step of carrying out the substrate from the plate holder. Fig. 50 is a side view showing a configuration of an adsorption mechanism according to a fifth embodiment, showing a side view of a configuration of an adsorption mechanism according to a fifth embodiment, and a side view showing the operation of carrying out the substrate from the plate holder. A side view of the operation of the board holding device with the substrate removed is shown in Fig. 52. Fig. 52 is a view showing a configuration of a modification of the adsorption mechanism. Fig. 53 is a flow chart for explaining an example of the process of the micro component. [Main component representative symbol] 1 4, 104 5 9, 109 Exposure device loading unit Carry-out unit plate holder 12 Fork portion 62 201142977 19 Position detection sensor 33 First moving mechanism 40, 140 Loading table 42, 149, 249 First transfer unit 43 Second moving mechanism 50 Carrying-out table 52 Second transfer unit 53 Third moving mechanism 142 Roller 148 Roller mechanism 150 Lifting mechanism 205 Carry-out robot arm 250 Adsorption unit 251 Holding unit 252 Position detecting sensor 350 suction mechanism 351 holding portion 401 substrate mounting table 405 transfer portion 408 adsorption portion P substrate K1, K4, K6, K8 suction hole 2, Κ3, Κ5, Κ7 gas injection hole 205 opening portion 63

Claims (1)

201142977 七、申請專利範圍： 1.一種搬送裝置，其具備： 第 支氣。卩，係對基板之一面供給氣體，能透過該氣 體懸浮支承前述基板； 第2支承部，能支承前述基板之前述一面； ;驅動部’係使前述第1及第2支承部之至少一哼移動， 使d第1及第2支承部彼此接近或接觸並排列於第^方向； 以及 移送部，將藉由前述驅動部而排列之前述第1及第2 支之方所支承之前述基板沿前述第i方向往另一 側移動。 2.如申請專利範圍第1項之搬送裝置，其中，前述驅 部，係將前述第i Μ 2支承部於前述第i方向排列成 j第1及第2支承部之—方所支承之前述基板，配置於 刖述第1及第2支承部之另一方高之位置。 3:如申請專利範圍第2項之搬送裝置，其中，前述驅 P仏將刖述第i及第2支承部於前述第i方向排列成 承有前述基板之前述第1及第2支承部之-方之上面部 配置於較前述第！及第2支承部之另—方之上面部高之 置。 二如申請專利範圍第1至3項中任-項之搬送裝置， :’前述驅動部係設置成至少一部分與前述第2支承旬 體0 5.如申請專利範圍第丄至4項中任一項之搬送裝置， 64 201142977 =述驅動部係設成至少_部分能與前述第1支承部— 中，前述圍第1f5項中任-項之搬送裝置，其 能透¥ £ 。卩，係對前述基板之前述一面供給氣體， -透過錢體懸浮支承前述基板。 7 ·如申請專利範圍楚 中， 圍第1至6項中任一項之搬送裝置，其 中則逃弟1及第2支承邻孫晰要士、s丨.± 彼此重疊，前…， 部分在俯視下 至少垂直方:係使前述第1及第2支承部移動於 中，前述移送部，呈右以垃細. 1再 之滾子接觸於前述基板下面之狀態旋轉 置之位置規;部;對前述第1或第2支承部之位 前述滾子機構，孫L7姑义.丄. 動前述基板。 係錢^位置規^部抵接之方式移 ^如中請專利範圍第丨幻項中任—項之搬送裝置，盆 :述移送部’具有吸附保持前述基板之端部之吸附機 構與檢測前述基板對前述第 ' ' 檢測部.； 、 戍弟2支承部之位置之位置 前述吸附機構，係根據前述位置檢測部之 動前述基板。 …果移 W如申請專利範圍第項中任一項之搬送裝置， 有使支承前述基板之前述第i或第2支 傾斜之傾斜機構。 上面。P 65 201142977 U.如申請專利範圍第！至1G項中任—項之搬送 其具備檢測前述第1支承部與前述第2支承部之相對， 之位置檢測部。 對位置 12.—種搬送裝置，其具備： 能透過該氣 第 支承。卩，係對基板之一面供給氣體 體懸浮支承前述基板； 第 第 移動， 方向； 2及第3支承部’能支承前述基板之前述一面； 動部’係使前述第i及第2支承部之至少一個 使忒第1及第2支承部彼此接近或接觸並排列於第1 第2驅動部，係使前述第！及第3支承部之至少一個 動使D玄第1及第3支承部彼此接近或接觸並排列2 方向； 第1移送，將藉由前述第！驅動部而排列於前述第1 K 4之月’j述第2支承部所支承之前述基板沿前述第又方 向往前述第1支承部側移動；以及 第2移送。卩，將藉由前述第2驅動部而排列於前述第3 表。Ρ之前述第1支承部所支承之前述基板沿前述第2方 向往前述第3支承部側移動。 3·士申明專利範圍第12項之搬送裝置，其中，前述第 =動。Ρ係將刚述第i及第2支承部於前述第工方向排列 成别述第2支承部所支承之前述基板，配置於較前述第1 支承部尚之位置。 14·如申請專利範圍第13項之搬送裝置，其中，前述第 201142977 1驅動部，係將前述第1及 成支承有前述基板之前述第 胃1方向排列 J 4弟2支承部之上 前述第1支承部之上面部高之位p 己置於較 15. 如申請專利範圍帛12 i 置，其中，前述第2驅動部，係將前述第丨：員=送裝 於前述第2方向排列成前述第丨支承 第3 土承部 板’配置於較前述第3支承部高之位置。7之則述基 16. 如申請專利範圍帛15項之搬送裝置， 一 2驅動部，係將前述第 ，則述第 弟3支承部於前述第2古厶^ 成支承有前述基板之前述第 方向排列 >、+、. 又取4之上面部，两？ ®h 刖述第.3支承部之上面部高之位置。 配置於較 17·如申請專利範圍帛12至16項中 置，复中，箭什铱， 項中任一項之搬送裝 〃、 述第1驅動部係設置成至少一邻八 支承部為一體； 夕邛刀與則述第2 前述第2驅動部係設置成至少 部為一體。 刀一則述第3支承 18·如申請專利範圍第12至17 置，兑由^*、+、& 項中任一項之搬送裝 置“巾，别0丨Μ 2裝 能與前述第丨支承部一體移動。 。又成至>、—部分 19.如申請專利範圍第12至 # , j- μ ^ 員中任一項之搬送穿： 置其中1述第2M3jt 裝 相異位置。 配置於同一水平面内之 置二，專利_ 12至19項中任一項之 ”中1述第2及第3支承部配置成至少一部分在俯 67 201142977 視下彼此重整，前述第1及篦7 弟及弟2駆動部’分別使前述第2 及第3支承部移動於至少垂直方向。 21.如申請專利範圍第12至2〇項中任—項之搬送裝 置’其中，前述第2支承部及前述第3支承部之至少一方， 係對前述基板之前述—面供給氣體，能透過該氣體懸浮支 承前述基板。 22. 如申請專利範圍帛12 i 21㉟中任一項之搬送裝 置，其具有使支承前述基板之前述第2支承部之上面部傾 斜之第1傾斜機構與使支承前述基板之前述第夏支承部之 上面部傾斜之第2傾斜機構。 23. 如申請專利範圍第12至22項中任一項之搬送裝 置，其具備檢測前述第丨支承部與前述第2或前述第3支 承部之相對位置之位置檢測部。 24. 如申請專利範圍第12至23項中任一項之搬送裝 置，其中，前述第1移送部及第2移送部之至少—方，具 有以接觸於前述基板下面之狀態旋轉之滾子機構、與規^ 作為前述基板之移動目的地之前述基板對前述第1支承部 或第2支承部之位置之位置規定部； 則述滾子機構，係以使前述位置規定部抵接之方弋 動前述基板。 X移 如申請專利範圍第12至23項中任一項之搬送裝 置，其中，前述第1移送部及第2移送部之至少—個， 有吸附保持前述基板之端部之吸附機構、與檢測作為&二 基板之移動目的地之前述基板對前述第1支承部或第2支 68 201142977 承。卩之位置之位置檢測部； =吸附機構，係根據前述位置檢測部之檢 動則述基板。 砂 26.如申請專利範圍第12至25項中紅τδ ^ , 置，Α中…" ㉟中任-項之搬送裝 广則迷第！驅動部排列前…及第2支承部之 1方向與刖述第2驅動部排列前述第上及第 邛之前述第2方向係平行。 支承 27·如申請專利範圍第4 2〇項中任—項之搬送裝置， 恭中，前述第丨支承部係停止前述氣體 載置於上面部。 攸肝4基板 28.—種搬送方法，係搬送基板，其包含： 使能透過對前述基板之一面供給之 =之第，、支承部、及能支承前述基板之前 近戈接2至V 一方移動’以使該帛1及第2支承部彼此接 近或接觸並排列於第1方向之動作；以及 接 將所排列之前述第i及第2支承部之 述基板沿前述第丄方向往另一方側移動之動作。7之前 1及二如申請專利範圍第28項之搬送方法，其係將前述第 支承部於前述第丨方向排列成前述 部之一古仏+1及弟2支承 所支承之前述基板，配置於較前述 承部之另-方高之位置。 第1…支 3〇· —種搬送方法，係搬送基板，其包含： 、使《b透過對前述基板之一面供給之氣體以 第1支承邓及能支承前述基板之前述一面之第2 69 201142977 支承部之至少一方移動，以使該第1及第2支承部彼此接 近或接觸並排列於第丨方向之動作； 將排列於前述第1支承部之前述第2支承部所支承之 前述基板沿前述第1方向往前述第！支承部側移動之動作; 使前述第1支承部及能支承前述基板之前述-面之第3 支承部之至少一方移動，以使該第1及第3支承部彼此接 近或接觸並排列於第2方向之動作；以及 將排列於前述第3支承部之前述第ι支承部所支承之 前述基板沿前述第2方向往前述第3支承部側移動之動作。 •如申請專利範圍第3〇項之搬送方法，其係將前述第 及第2支承部於前述第1方向排列成前述第2支承部所支 承之前述基板，配置於較前述第1支承部高之位置。 32. 如申請專㈣圍第3()或31項之搬送方法，並係將 前述第1及第3支承部於前述第2方向排列成前述第丄支 承部所支承之前述基板，配置於較前述第3支承部高之位 置。 33. 如申請專利範圍第3〇至32項中任—項之搬送方 法，其中’前述第1支持部係相對配置於同一水平面内相 異位置之前…支承部及前述第3支承部，沿前述第2 支承部及前述第3支承部之排列方向移動。 34. 如申請專利範圍第3〇至32項中任—項之搬送方 法’其中’藉由前述第i支承部與配置成至少一部分在俯 視下彼此重疊且配置於在垂直方向相異位置之前述第2及 第3支承部進行相對移動，以排列前述第i、及第以第3 201142977 支承部。 35·—種曝光裝置，係以曝光用光使基板曝光，其具備： 保持前述基板並使前述基板移動至前述曝光用光之照 射區域之中請專利範圍第1至27項中任-項之搬送裝置。 36. —種元件製造方法，其包含： 使用申請專利範圍第35項之曝光裝置進行塗布有感光 Μ之刚述基板之曝光，.以於該基板轉印圖.案之動作； 」吏藉由前述曝光而曝光之前述感光劑顯影，以形成對 應前述圖案之曝光圖案層之動作；以及 透過前述曝光圖案層加工前述基板之動作。 37. —種搬送裝置，其具備： 第1支承部，係對基板之一面供給氣體 體懸浮支承前述基板； 亥氣 第2支承部，能支承前述基板之前述一面； :動部:係使前述第丨及第2支承部之至少—個移動， "1及第2支承部彼此接近或接觸並排列； 移送部，將藉由前述驅動部而排列之前述第 :支承之前述基板沿前述排列方向往前述…二: 前述==支π止前述氣體之供給而被載置於 方頂H及 前述基板，並往該載置部之上 搬出機構’將藉由該頂起機構而被支承 上方之前述基板從前述第i支承部搬出。 P 71 201142977 υ . 5ζυ ψ Μ專利範圍第37項之搬送裝置，立中，.前诚 以^構具備··對前述載置部上下動之複數個可動構件 少一 Si:兩個前述可動構件且能支承前述基板之至 =動構件，係以前述支承構件之與前述 觸。請别述載置部突出沒入之方式上下動。 承構範圍第38項之搬送裝置，其中，前述支 複數個第1架前述可動構件架設於第1方向之 形成為格子形狀：一於第2方向之複數個第2架設部， 40·如申請專利範圍第39項之搬送裝置，其卜複數個 ^承構件’係沿前述第丨方向配置於前述格子形狀之 向，並沿前述第2方向彼此相隔間隔配置。 41.如申請專利範圍第38至4〇項中任一項之搬送裝 置’其中，前料動構件設餘前述第丨支承部突出。 如申請專利範圍第38 i 4"員中任一項之搬送裝 ” t ’前述支承構件收納於前述帛丨t承部中與前述 載置部相異之位置。 43·如申請專利範圍第42項之搬送裝置，其中，前述载 置部包含被形成於前述帛！支承部之槽狀凹部區劃之複數 個部分載置部； 别述支承構件收納於前述凹部。 44.如申請專利範圍第43項之搬送裝置，其中，前述可 72 201142977 動構件設成從前述凹部.突出。 45. 如申凊專利範圍第38至44項中任一項之搬送裝 置，其中，别述搬出機構包含承接被前述支承構件支承之 前述基板之又部。 46. 如申請專利範圍第45項之搬送裝置，其中，前述頂 起機構具備複數個前述支承構件； 前述叉部係在相鄰之前述支承構件間支承前述基板。 47. 如申請專利範圍第37項之搬送裝置，其中，前述載 置部包含被形成於前述帛i支承部之槽狀凹部 個部分载置部； ·—夏数 月1J C頂起棧構包含藉由在插入前述凹部之狀態下上为 而支承前述基板之下面之叉部。 〜 48·如申請專利範圍第47項之搬送裝置，其中，前述想 起機構包含：驅動部，係驅動支承前述基板之叉部使其移 =與前述第1支承部相異之位置，該頂起機構兼作為前 述搬出機構。 49·如申請專利範圍第37項之搬送裝置，其中，吁 起機構包含保持前述基板並上升之保持部。 * a j 5〇.如申請專利範圍第49項之搬送裝置.，其中，义 持部係以非接觸狀態保持前述基板。 ' _ 51.如申請專利範圍第49或50項之搬送裝置，其 月』述頂起機構具有複數個前述保持部。 52·如申請專利範圍第49至51項中任— 置，发由 T仕項之搬送^ 〃千，前述頂起機構包含支承前述基板之端部之支7 73 201142977 構件。 置，其中申;專利範圍，49至52項中任一項之搬送裝 基板之前述：持=機構包含：驅動部，係驅動保持前述 置，該頂起機=其移動至與前述第1支承部相異之位 i栈構兼作為前述搬出機構。 置，盆中申^專利範圍第37至53項中任一項之搬送裝 成前述第二動:支：將前述第1及第… 支承部高之位置前述基板’配置於較前述第1 動部圍第54項之搬送裝置，其中，前述驅 之〜笛？ “ 1及第2支承部排列成支承有前述基板 之刖述第2支承邱夕L π Α 低 上面部高之位置 4，配置於較前述第1支承部之 項中任一項之搬送裝 一部分與前述第2支 5 6 ·如申凊專利範圍第3 7至5 5 置其中，則述驅動部係設置成至少 承部為—體。 56項中任一項之搬送裝 一部分能與前述第1支 57.如申請專利範圍第37至 置，其中，前述驅動部係設成至少 承部一體移動。 ^如申，專利範圍第37至57項中任一項之搬送裝 、中刖述第2支承部，係對前述基板之前述-面供 能透_氣_浮支承前述基板。 〃 59.如申:專利範圍第37至58項中任一項之搬送裝 其中，則述移送部，具有以接觸於前述基板之下面之 201142977 狀態旋轉之滾子機構與規定前述基板對前述第丨或第2支 承部之位置之位置規定部； 前述滾子機構，係以使前述位置規定部抵接之方式 動前述基板。 6〇_如申請專利範圍第37至59項中任—項之搬送裳 置，其中，前述移送部，具有吸附保持前述基板之端部: 吸附機構與檢測前述基板對前述帛i或第2支承部之 之位置檢測部； 置 前述吸附機構 動前述基板。 係根據前述位置檢測部之檢測結果移 61.如申請專利範圍第 置，其具有使支承前述基板 面部傾斜之傾斜機構。 37至60項中任一項之搬送裝 之前述第1或第2支承部之上 62.如申請專利範圍 置’其具備檢測前述第 位置之相對位置檢測部 第37至61項中任—項之搬送裝 1支承部與前述第2支承部之相對 63.—種搬送方法，係搬送基板，其包含·· …使能透過對前述基板之—面供給之、氣體以懸浮 述基板之第1支承部及能支& 則 „ 又承刖述基板之前述一面之第2 支承部之至少一方移動，以使該 面之第2 近或接觸並排列之動作； 支承部彼此接 將所排列之前述第2支承部所.支 排列方向往前述第i支承部側移送 .藉由停止前述氣體之供給，支承载置於前述第丨支承 75 201142977 部之載置部之前述基板並往該载置部之上方頂起之動作. 以及 * 將被支承於前述載置部上方之前述基板從前述第丨支 承部搬出之動作。 64.如申請專利範圍第63項之搬送方法，其係將前述第 1及第2支承部排列成前述第2支承部所支承之前述基_ 前述第1支承部高。 65·—種曝光裝置，係以曝光用光使基板曝光，其具備： 保持前述基板並使前述基板移動至前述曝光用光之照 射區域之中請專利範圍帛37纟62帛中卜項之搬送裝置: 66·—種元件製造方法，其包含： 使用申請專利範圍第65項之曝光裝置進行塗布有感光 劑之前述基板之曝光，以於該基板轉印圖案之動作； 使藉由前述曝光而曝光之前述感光劑顯影，以形成對 應刖述圖案之曝光圖案層之動作；以及 透過前述曝光圖案層加工前述基板之動作。 八、圖式： (如次頁） 76201142977 VII. Patent application scope: 1. A conveying device, which has: a first gas.卩 a gas is supplied to one surface of the substrate, and the substrate can be suspended and supported by the gas; the second support portion can support the surface of the substrate; and the drive portion ′ is at least one of the first and second support portions. Moving, the d first and second support portions are arranged close to or in contact with each other and arranged in the second direction; and the transfer portion is configured to support the substrate edge supported by the first and second branches arranged by the drive portion The aforementioned i-th direction moves to the other side. 2. The transport apparatus according to claim 1, wherein the drive unit is configured to support the i-th support portion in the i-th direction so as to be the first and second support portions. The substrate is disposed at a position other than the other height of the first and second support portions. (3) The transport apparatus according to the second aspect of the invention, wherein the first and second support portions are arranged in the i-th direction so as to surround the first and second support portions of the substrate. - The upper face is placed on the face more than the above! And the other side of the second support portion has a higher face. 2. The conveying device according to any one of the claims 1 to 3, wherein: 'the driving portion is provided at least in part with the second supporting body 0. 5. Item conveying device, 64 201142977 = The driving unit is configured to be at least partially capable of communicating with the first supporting portion, and the conveying device of any of the above items 1f5 can be permeable. In other words, a gas is supplied to the one surface of the substrate, and the substrate is suspended and supported by the money. 7 · If you are applying for a patent, the transport device of any one of the first to sixth items, in which the escaped brother 1 and the second support neighbor Sun Xizhi, s丨.± overlap each other, before..., part of At least perpendicular to the vertical view: the first and second support portions are moved therein, and the transfer portion is thinned to the right. The roller is placed in contact with the lower surface of the substrate to position the gauge; The aforementioned roller mechanism is positioned at the position of the first or second support portion, and the substrate is moved by Sun L7. The method of transferring the money ^ position regulation ^ part of the contact method, such as the patent scope, the third item of the illusion item, the transfer device, the basin: the transfer unit has the adsorption mechanism for adsorbing and holding the end of the substrate and detecting the foregoing The substrate is placed on the substrate at a position where the position of the support portion of the first 'detection portion; and the second portion of the support portion 2 is moved by the position detecting portion. The transfer device according to any one of the above claims, wherein the tilting mechanism for supporting the i-th or the second branch of the substrate is inclined. Above. P 65 201142977 U. For example, the scope of patent application! The transport to any of the items 1G includes a position detecting unit that detects the opposing of the first support portion and the second support portion. Position 12. A conveying device comprising: a first support through which the gas can pass.卩 a method of suspending and supporting the substrate on one surface of the substrate; a first movement direction; 2 and a third support portion ′ capable of supporting the one surface of the substrate; and a moving portion ′ for the i-th and second support portions At least one of the first and second support portions is brought close to or in contact with each other and arranged in the first and second drive portions, so that the first! And at least one of the third support portions causes the D-th and the third support portions to approach or contact each other and arrange in two directions; the first transfer is performed by the aforementioned! The drive unit is arranged in the first K 4 month. The substrate supported by the second support portion moves in the first direction toward the first support portion side, and the second transfer. Then, the second drive unit is arranged in the third table. The substrate supported by the first support portion moves toward the third support portion side in the second direction. 3. The conveying device of the claim 12 of the patent scope, wherein the aforementioned movement is the first. In the rafting system, the i-th and second support portions are arranged in the above-described working direction so as to be arranged on the substrate supported by the second support portion, and are disposed at a position further than the first support portion. The transport device according to the thirteenth aspect of the invention, wherein the driving unit of the first and fourth embodiments is configured to arrange the first and second stomachs in the first and second support portions of the substrate. The position of the upper portion of the upper portion of the support portion is set to be higher than that of the upper portion of the support portion, wherein the second drive portion is arranged in the second direction. The third weir support third soil receiving portion plate 'is disposed higher than the third support portion. 7. The base of the invention is as described in claim 15, wherein the second drive unit supports the first substrate, and the second support portion supports the substrate. Directions >, +,. Take 4 faces above, two? ®h Describes the position of the face above the support portion of the .3. It is arranged in the middle of the application, in the range of 12 to 16 of the patent application scope, in the middle of the file, in the middle of the arrow, in the case of any of the items, the first drive unit is arranged to be at least one adjacent and eight support parts. The ceremonial blade and the second driving unit are provided at least in part. The first support 18 of the knives is as described in the 12th to the 17th of the patent application, and the conveying device of any one of the items **, +, & The unit moves in one direction. It becomes into the >, - part 19. As in the patent application range 12 to #, j- μ ^ member of any of the members of the transport: set one of the 2M3jt installed different positions. In the same horizontal plane, the second and third support portions of the "one of the patents _ 12 to 19" are arranged such that at least a portion thereof is reorganized in the view of the spurs 67 201142977, the first and the ninth The second and third support portions move the at least the second and third support portions in at least the vertical direction. The transfer device of any one of the second aspect of the invention, wherein at least one of the second support portion and the third support portion supplies gas to the surface of the substrate The gas suspends the aforementioned substrate. [22] The transfer device according to any one of the above-mentioned claims, wherein the first tilting mechanism that tilts the upper surface of the second support portion that supports the substrate and the first summer support portion that supports the substrate The second tilting mechanism that tilts the upper surface. The conveying device according to any one of claims 12 to 22, further comprising: a position detecting unit that detects a relative position of the second support portion and the second or third support portion. [24] The transfer device of any one of the first transfer unit and the second transfer unit, wherein at least one of the first transfer unit and the second transfer unit has a roller mechanism that rotates in contact with a state under the substrate. And a position defining portion of the position of the first support portion or the second support portion of the substrate as a destination of the substrate; wherein the roller mechanism is abutting the position defining portion The aforementioned substrate is moved. The transfer device of any one of the first transfer unit and the second transfer unit, wherein at least one of the first transfer unit and the second transfer unit has an adsorption mechanism for adsorbing and holding the end portion of the substrate, and detecting The substrate as the destination of the & two substrates is supported by the first support portion or the second branch 68 201142977. The position detecting unit at the position of the ;; the absorbing mechanism is based on the detection of the position detecting unit. Sand 26. If the application of patents in the 12th to 25th items of the red τδ ^, set, Α中..." 35 任任- Item's transport equipment is wide! The direction in which the driving portion is arranged and the second supporting portion are parallel to the second direction in which the second driving portion is arranged in the first and second directions. The carrier device of any one of the above-mentioned claims, wherein the second support portion stops the gas from being placed on the upper surface portion. The sputum liver 4 substrate 28. The method for transporting the substrate is to transport the substrate, comprising: enabling the transmission of the surface of the substrate, the support portion, and the movement of the substrate 2 to V before the substrate can be supported 'the operation of bringing the crucible 1 and the second support portion closer to or in contact with each other and in the first direction; and connecting the substrate of the i-th and second support portions arranged in the first direction to the other side The action of moving. The method of transporting the second support unit according to claim 28, wherein the first support portion is arranged in the first direction, and the substrate supported by one of the parts is supported by the support of the support member. It is higher than the other side of the aforementioned bearing. The first method relates to a method of transporting a substrate, comprising: b passing a gas supplied to one surface of the substrate to a first support Deng and a second surface capable of supporting the substrate; At least one of the support portions moves so that the first and second support portions approach or contact each other in the second direction; and the substrate edge supported by the second support portion arranged in the first support portion The first direction is toward the above! Movement of the support portion side; at least one of the first support portion and the third support portion capable of supporting the surface of the substrate is moved such that the first and third support portions are close to each other or in contact with each other And an operation of moving the substrate supported by the first support portion of the third support portion to the third support portion side in the second direction. The transfer method according to the third aspect of the invention, wherein the first and second support portions are arranged in the first direction so that the substrate supported by the second support portion is disposed higher than the first support portion The location. 32. The method for transporting the third () or the third item of the fourth () or the third support portion, wherein the first and third support portions are arranged in the second direction to be the substrate supported by the second support portion, and arranged in the substrate The third support portion is at a high position. The method of transferring any one of the above-mentioned claims, wherein the first support portion is disposed opposite to the different position in the same horizontal plane, the support portion and the third support portion, along the aforementioned The arrangement direction of the second support portion and the third support portion moves. 34. The method of transporting any one of clauses 1-3 to 32, wherein the ith support portion is disposed in such a manner that at least a portion thereof overlaps each other in plan view and is disposed at a position different from the vertical direction The second and third support portions are relatively moved to arrange the ith and third 201142977 support portions. An exposure apparatus for exposing a substrate by exposure light, comprising: holding the substrate and moving the substrate to an irradiation region of the exposure light, wherein any one of claims 1 to 27 is Transfer device. 36. A method of manufacturing a component, comprising: performing exposure of a substrate coated with a photosensitive paste using an exposure apparatus of claim 35, for transferring the image to the substrate; The exposure of the photosensitive agent exposed by the exposure to form an exposure pattern layer corresponding to the pattern; and the operation of processing the substrate through the exposure pattern layer. 37. A conveying device comprising: a first support portion that suspends and supports the substrate on a surface of a substrate; and a second support portion that supports the surface of the substrate; and a moving portion: At least one movement of the second and second support portions, the "1 and the second support portion are adjacent to or in contact with each other; and the transfer portion is arranged along the aforementioned substrate supported by the drive portion The direction is as described above. (2): The above-mentioned == support π is stopped by the supply of the gas, and is placed on the square top H and the substrate, and the carry-out mechanism to the mounting portion is supported by the jacking mechanism. The substrate is carried out from the i-th support portion. P 71 201142977 υ ζυ ζυ Μ 搬 搬 搬 Μ 37 37 37 37 37 37 搬 37 37 37 37 搬 搬 搬 搬 搬 搬 搬 搬 搬 搬 搬 搬 搬 搬 搬 搬 搬 搬 搬 搬 搬 搬 搬 搬 搬 搬 搬 搬 搬 搬 搬 搬 搬 搬 搬 搬 搬And the support member of the substrate can be supported by the support member and the contact. Please do not mention that the placement section is moving up and down. The conveying device according to Item 38, wherein the plurality of first movable members are formed in a lattice shape in a first direction: a plurality of second mounting portions in the second direction, 40. In the conveying device of the 39th aspect of the invention, the plurality of supporting members ' are disposed in the direction of the lattice shape in the second direction, and are arranged at intervals in the second direction. The conveying device of any one of claims 38 to 4, wherein the front feed member is provided with the aforementioned second support portion protruding. The transfer member of any one of the claims of the invention is incorporated in a position in which the support member is accommodated in the 帛丨t receiving portion at a position different from the mounting portion. 43. In the above-described placing device, the mounting portion includes a plurality of partial placing portions formed in a groove-shaped recess portion formed in the cymbal support portion, and the supporting member is housed in the concave portion. 44. The transporting device of the present invention, wherein the movable member is provided to protrude from the recessed portion. The transporting device according to any one of the items 38 to 44, wherein the carrying-out mechanism includes a receiving The conveying device according to claim 45, wherein the lifting device includes a plurality of the supporting members; and the fork portion is supported between the adjacent supporting members. The substrate according to claim 37, wherein the mounting portion includes a groove-shaped recess portion formed in the 帛i support portion a portion of the carrier that supports the lower surface of the substrate by inserting the recessed portion in the state of the summer months. The above-mentioned mechanism includes a driving unit that drives and drives a fork portion of the substrate to be displaced from a position different from the first support portion, and the jacking mechanism also serves as the carry-out mechanism. 49. The conveying device of the item, wherein the urging means includes a holding portion that holds the substrate and rises. * aj 5 〇. The conveying device of claim 49, wherein the holding portion holds the substrate in a non-contact state ' _ 51. As claimed in claim 49 or 50, the ejector mechanism has a plurality of the aforementioned holding portions. 52. If the application is in the range of items 49 to 51, The above-mentioned lifting mechanism includes a member for supporting the end portion of the substrate 7 73 201142977. The invention is the same as the carrier substrate of any one of items 49 to 52. The holding unit includes: a driving unit that maintains the above-mentioned position, and the jacking machine=moves to a position different from the first supporting unit, and also serves as the carrying-out mechanism. The conveyance according to any one of the items 37 to 53 is the second movement: the conveying means for arranging the substrate "at a position higher than the first and the ... support portions" in the 54th item of the first moving portion circumference In the above-mentioned first support portion, the first support portion is arranged such that the second support portion of the substrate supports the second support portion L π Α lower than the upper surface portion. A part of the transporting apparatus according to any one of the above items is the same as the above-mentioned second branch. 6-7, wherein the driving section is provided such that at least the receiving portion is a body. A part of the transporting apparatus according to any one of the items 56, wherein the driving unit is configured to move at least the receiving portion integrally. The transfer device according to any one of claims 37 to 57, wherein the second support portion is provided to support the substrate on the surface of the substrate. 〃59. The transfer device according to any one of claims 37 to 58, wherein the transfer unit has a roller mechanism that rotates in contact with the lower surface of the substrate in the 201142977 state and defines the substrate to the foregoing a position defining portion at a position of the second support portion; and the roller mechanism moving the substrate such that the position defining portion abuts. 6 〇 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ a position detecting portion of the portion; wherein the adsorption mechanism moves the substrate. According to the detection result of the position detecting portion, the tilting mechanism for tilting the surface of the substrate is provided as in the patent application. The above-mentioned first or second support portion 62 of the transporting device of any one of items 37 to 60. In the case of the patent application, it is provided with any of the items 37 to 61 of the relative position detecting portion for detecting the aforementioned first position. The transporting device 1 and the second supporting portion are opposed to each other. The method of transporting the substrate is to transfer the substrate to the first surface of the substrate by allowing the gas to be supplied through the surface of the substrate. At least one of the support portion and the support portion and the second support portion of the one surface of the substrate are moved so that the second surface of the surface is in contact with or in contact with each other; and the support portions are arranged to be aligned with each other. The second support portion is arranged to be transferred toward the i-th support portion. By stopping the supply of the gas, the substrate placed on the mounting portion of the second support 75 201142977 is supported and placed thereon. And an operation of lifting the upper portion of the substrate supported by the mounting portion from the second support portion. 64. The method for transporting the object of claim 63, wherein 1 and 2 The base portion is arranged such that the base portion supported by the second support portion is higher than the first support portion. The exposure device is configured to expose the substrate by exposure light, and includes: holding the substrate and moving the substrate to Among the irradiation areas for the exposure light, the patent range is 纟37纟62帛中帛的输送装置: 66·-------------------------------------------------------------------------------------------------- Exposing the substrate to transfer the pattern to the substrate; developing the sensitizer exposed by the exposure to form an exposure pattern layer corresponding to the pattern; and processing the foregoing through the exposure pattern layer Action of the substrate. 8. Pattern: (such as the next page) 76
TW100105223A 2010-02-17 2011-02-17 A conveyance device, a conveying method, an exposure apparatus, and an element manufacturing method TWI587430B (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI615255B (en) * 2013-09-18 2018-02-21 Mitsuboshi Diamond Ind Co Ltd Support mechanism and transport device
TWI717947B (en) * 2018-12-20 2021-02-01 大陸商上海微電子裝備（集團）股份有限公司 Substrate transfer device and substrate transfer method

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8699001B2 (en) * 2009-08-20 2014-04-15 Nikon Corporation Object moving apparatus, object processing apparatus, exposure apparatus, object inspecting apparatus and device manufacturing method
WO2013031222A1 (en) * 2011-08-30 2013-03-07 株式会社ニコン Object transportation device, object processing device, exposure device, method for producing flat panel display, method for producing device, method for transporting object, and method for exchanging object
US9360772B2 (en) * 2011-12-29 2016-06-07 Nikon Corporation Carrier method, exposure method, carrier system and exposure apparatus, and device manufacturing method
CN104662478B (en) * 2012-08-08 2017-08-11 株式会社尼康 Object exchange method, object exchange system, exposure device, the manufacture method of flat-panel screens and assembly manufacture method
KR20230055404A (en) * 2012-11-30 2023-04-25 가부시키가이샤 니콘 Transfer system, exposure apparatus, transfer method, exposure method, device manufacturing method, and suction apparatus
JP6095394B2 (en) * 2013-02-13 2017-03-15 東レエンジニアリング株式会社 Substrate processing system and substrate processing method
JP6142217B2 (en) * 2013-02-25 2017-06-07 株式会社ブイ・テクノロジー Substrate transfer device for exposure
CN103824792A (en) * 2014-02-28 2014-05-28 上海和辉光电有限公司 Storage cabinet and control method thereof
EP3218925B1 (en) 2014-11-10 2020-12-30 Brooks Automation, Inc. Tool auto-teach method and apparatus
KR102569618B1 (en) * 2015-03-30 2023-08-22 가부시키가이샤 니콘 Object conveyance apparatus, exposure apparatus, flat panel display production method, device production method, object conveyance method, and exposure method
TWI699582B (en) * 2015-07-01 2020-07-21 日商信越工程股份有限公司 Manufacturing device and manufacturing method of bonded device
CN108139676B (en) * 2015-09-30 2022-03-18 株式会社尼康 Movable body device, exposure device, method for manufacturing flat panel display, and method for manufacturing device
US9776809B1 (en) * 2016-03-31 2017-10-03 Core Flow Ltd. Conveying system with vacuum wheel
JP6773435B2 (en) 2016-03-31 2020-10-21 株式会社オーク製作所 Exposure device
JP6320448B2 (en) * 2016-04-28 2018-05-09 Ｔｏｗａ株式会社 Resin sealing device and resin sealing method
CN105824200B (en) 2016-05-31 2017-08-29 京东方科技集团股份有限公司 A kind of substrate support structure and exposure machine
JP6874314B2 (en) * 2016-09-30 2021-05-19 株式会社ニコン Object holding device, exposure device, flat panel display manufacturing method, and device manufacturing method
JP6905830B2 (en) * 2017-01-11 2021-07-21 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing equipment and substrate processing method
CN108502543B (en) * 2017-02-28 2020-01-24 上海微电子装备（集团）股份有限公司 Substrate transmission device and method
CN111164513B (en) * 2017-09-29 2022-08-16 株式会社尼康 Substrate carrying apparatus, exposure apparatus, substrate carrying method, exposure method, flat panel display, and device manufacturing method
WO2019064576A1 (en) * 2017-09-29 2019-04-04 株式会社ニコン Substrate handing device, exposure device, method for producing flat panel display, device production method, substrate handling method, and exposure method
CN111133383A (en) * 2017-09-29 2020-05-08 株式会社尼康 Substrate transfer apparatus, exposure apparatus, method for manufacturing flat panel display, method for manufacturing device, substrate transfer method, and exposure method
WO2019064585A1 (en) * 2017-09-29 2019-04-04 株式会社ニコン Substrate handling device, exposure device, method for producing flat panel display, device production method, substrate handling method, and exposure method
KR102089350B1 (en) * 2018-04-24 2020-03-16 세메스 주식회사 Apparatus for transferring substrate and Apparatus for processing substrate having the same
KR102054714B1 (en) * 2018-05-09 2019-12-12 주식회사 글로벌시스템즈 A system for processing exact treatment
KR102430391B1 (en) * 2018-05-24 2022-08-05 어플라이드 머티어리얼스, 인코포레이티드 A magnetic levitation system for transporting a carrier, a carrier for a magnetic levitation system, a processing system for vertically processing a substrate, and a method of transporting the carrier
TWI798367B (en) * 2019-02-26 2023-04-11 日商東麗工程股份有限公司 Coating device
JP7196734B2 (en) * 2019-03-29 2022-12-27 株式会社ニコン Substrate transport apparatus, exposure apparatus, flat panel display manufacturing method, device manufacturing method, and exposure method
KR102182632B1 (en) * 2019-06-10 2020-11-24 주식회사 크레셈 Inspection apparatus of Semiconductor substrate
CN110498233B (en) * 2019-07-26 2021-04-27 江苏科技大学 Two-dimensional non-contact conveying platform device
JP7390142B2 (en) * 2019-09-20 2023-12-01 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing equipment and substrate transport method
JP6898488B1 (en) * 2020-03-18 2021-07-07 日東電工株式会社 Transfer device and transfer method for optical laminates
CN112124958A (en) * 2020-09-02 2020-12-25 合肥芯碁微电子装备股份有限公司 Suction cup device and laser imaging device with same
CN115551790A (en) * 2021-04-21 2022-12-30 空气及水麻吉股份有限公司 Elastic sheet conveying device and elastic sheet blanking system
JP7085682B1 (en) * 2021-04-21 2022-06-16 エア・ウォーター・マッハ株式会社 Elastic sheet transfer device
KR102671305B1 (en) * 2021-10-07 2024-05-30 세메스 주식회사 Substrate treating apparatus and substrate treating method using the same
GB202215215D0 (en) * 2022-10-14 2022-11-30 Lam Res Ag Device for conveying a wafer-shaped article
US20240153800A1 (en) * 2022-11-07 2024-05-09 Applied Materials, Inc. Semiconductor process equipment

Family Cites Families (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US100169A (en) 1870-02-22 Harris harding margeson
US3731823A (en) * 1971-06-01 1973-05-08 Ibm Wafer transport system
DE69121201D1 (en) * 1991-08-27 1996-09-05 Ibm Method and device for generating high-resolution optical images
JP2969034B2 (en) * 1993-06-18 1999-11-02 東京エレクトロン株式会社 Transfer method and transfer device
JPH09270383A (en) * 1996-03-29 1997-10-14 Nikon Corp Water transfer apparatus and water transfer method
JPH10169A (en) 1996-06-14 1998-01-06 Matsushita Electric Works Ltd Bathtub device
JP3070006B2 (en) * 1997-02-07 2000-07-24 株式会社オーク製作所 How to transport thin work
JPH10275850A (en) * 1997-03-28 1998-10-13 Nikon Corp Aligner
TW396490B (en) * 1997-11-14 2000-07-01 Dainippon Screen Mfg Wafer processor
JPH11288995A (en) * 1998-04-04 1999-10-19 Tokyo Electron Ltd Transfer system and processing device thereof
KR100825691B1 (en) * 1999-07-26 2008-04-29 가부시키가이샤 니콘 Apparatus for supporting substrate and apparatus of processing substrate
JP4249869B2 (en) * 1999-12-22 2009-04-08 株式会社オーク製作所 Substrate transfer device
JP2001343753A (en) * 2000-05-31 2001-12-14 Orc Mfg Co Ltd Substrate transfer mechanism and aligner
JP2002368065A (en) * 2001-06-08 2002-12-20 Hiroshi Akashi Aligning device
JP2004083180A (en) * 2002-08-26 2004-03-18 Sharp Corp Transporting method and device for sheet-form base board
JP4373125B2 (en) * 2003-05-07 2009-11-25 オリンパス株式会社 Levitation transfer device
JP2005026446A (en) * 2003-07-02 2005-01-27 Nikon Corp Substrate conveying apparatus, exposure device, substrate measuring apparatus, and method for conveying substrate
JP4305918B2 (en) * 2004-01-30 2009-07-29 東京エレクトロン株式会社 Floating substrate transfer processing equipment
JP4626205B2 (en) * 2004-07-28 2011-02-02 シンフォニアテクノロジー株式会社 Substrate delivery method and apparatus
JP2006176255A (en) * 2004-12-21 2006-07-06 Murata Mach Ltd Conveying system
JP4949439B2 (en) * 2004-12-30 2012-06-06 エーエスエムエル ネザーランズ ビー．ブイ． PCB handler
JP4356936B2 (en) * 2005-01-21 2009-11-04 東京エレクトロン株式会社 Coating and developing apparatus and method thereof
JP4349528B2 (en) * 2005-01-25 2009-10-21 大日本印刷株式会社 Substrate transport device, substrate control method, color filter manufacturing method, electronic circuit manufacturing method
JP4378301B2 (en) * 2005-02-28 2009-12-02 東京エレクトロン株式会社 Substrate processing apparatus, substrate processing method, and substrate processing program
JP4571525B2 (en) * 2005-03-10 2010-10-27 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method
JP4529794B2 (en) * 2005-05-19 2010-08-25 シンフォニアテクノロジー株式会社 Gas levitation transfer device
US7576835B2 (en) * 2005-07-06 2009-08-18 Asml Netherlands B.V. Substrate handler, lithographic apparatus and device manufacturing method
JP2007150280A (en) * 2005-11-04 2007-06-14 Dainippon Printing Co Ltd Substrate supporting apparatus, substrate supporting method, substrate processing apparatus, substrate processing method, and method of manufacturing display apparatus constitutional member
JP4745040B2 (en) * 2005-12-05 2011-08-10 東京エレクトロン株式会社 Substrate transport apparatus and substrate processing apparatus
JP4801523B2 (en) * 2006-07-21 2011-10-26 本田技研工業株式会社 Plate material gripping device
JP4842748B2 (en) * 2006-09-22 2011-12-21 オリンパス株式会社 Substrate transfer system
JP4318714B2 (en) * 2006-11-28 2009-08-26 東京エレクトロン株式会社 Coating device
JP4753313B2 (en) * 2006-12-27 2011-08-24 東京エレクトロン株式会社 Substrate processing equipment
KR101111933B1 (en) * 2007-04-03 2012-04-06 닛본 세이고 가부시끼가이샤 Exposure apparatus and exposure method
JP2008300723A (en) * 2007-06-01 2008-12-11 Nec Electronics Corp Processing apparatus
JP2009016388A (en) * 2007-06-29 2009-01-22 Canon Inc Original transfer device, exposure device, and method for manufacturing device
KR101228002B1 (en) * 2007-07-17 2013-02-01 가부시키가이샤 아이에이치아이 Thin board transfer apparatus, thin board processing/transfer system and thin board transfer method
JP5076697B2 (en) * 2007-07-17 2012-11-21 株式会社Ｉｈｉ Thin plate transfer device, thin plate processing transfer system, and thin plate transfer method
JP4798799B2 (en) * 2007-08-20 2011-10-19 Ｎｅｃエンジニアリング株式会社 Plate feeding / discharging device and plate making device using the same
JP2009094184A (en) * 2007-10-05 2009-04-30 Toray Ind Inc Substrate treatment apparatus and treating method
JP4495752B2 (en) * 2007-11-06 2010-07-07 東京エレクトロン株式会社 Substrate processing apparatus and coating apparatus
JP2009168860A (en) * 2008-01-10 2009-07-30 Olympus Corp Stage device for substrate
JP2009295950A (en) * 2008-05-09 2009-12-17 Nsk Ltd Scan exposure equipment and scan exposure method
JP4592787B2 (en) * 2008-07-11 2010-12-08 東京エレクトロン株式会社 Substrate processing equipment
JP5167999B2 (en) * 2008-07-16 2013-03-21 株式会社Ｉｈｉ Substrate transfer system and substrate transfer method
JP4898749B2 (en) * 2008-08-04 2012-03-21 大林精工株式会社 Scanning exposure apparatus and horizontal electric field type liquid crystal display device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI615255B (en) * 2013-09-18 2018-02-21 Mitsuboshi Diamond Ind Co Ltd Support mechanism and transport device
TWI717947B (en) * 2018-12-20 2021-02-01 大陸商上海微電子裝備（集團）股份有限公司 Substrate transfer device and substrate transfer method

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