CN108139676B

CN108139676B - Movable body device, exposure device, method for manufacturing flat panel display, and method for manufacturing device

Info

Publication number: CN108139676B
Application number: CN201680057153.7A
Authority: CN
Inventors: 青木保夫
Original assignee: Nikon Corp
Current assignee: Nikon Corp
Priority date: 2015-09-30
Filing date: 2016-09-28
Publication date: 2022-03-18
Anticipated expiration: 2036-09-28
Also published as: WO2017057465A1; HK1249191A1; TW202044465A; CN108139676A; JPWO2017057465A1; JP6958354B2; KR20180059864A; TWI841764B; TW201729321A

Abstract

A measurement system for determining positional information in a Z-axis direction of a substrate holder (36) that is movable in a direction parallel to an XY plane, the measurement system comprising: a Y slider (76) which is arranged opposite to the substrate holder (36) and can move synchronously with the substrate holder (36) in the Y-axis direction, a sensor head (78) arranged on the Y slider (76), and a control system which controls the Y slider (76) and uses a target (38) which is arranged on the substrate holder (36) and extends in the X-axis direction to obtain the position information of the substrate holder (36) in the Z-axis direction through the sensor head (78).

Description

Movable body device, exposure device, method for manufacturing flat panel display, and method for manufacturing device

Technical Field

The invention relates to a movable body device, an exposure device, a method for manufacturing a flat panel display, a method for manufacturing a device, and a method for measuring.

Background

Conventionally, in a photolithography process for manufacturing electronic components (micro-components) such as liquid crystal display devices and semiconductor devices (integrated circuits, etc.), an exposure apparatus (so-called scanning stepper (also called scanner)) of a step & scan method for transferring a pattern formed on a mask onto a substrate using an energy beam while moving the mask or reticle (hereinafter, collectively referred to as "mask") and a glass plate or wafer (hereinafter, collectively referred to as "substrate") in synchronization with a predetermined scanning direction has been used (for example, see patent document 1).

In such an exposure apparatus, in order to form an image of a pattern formed on a mask on a substrate with high resolution, the surface position of the substrate (for example, positional information of the substrate surface in a direction intersecting the horizontal plane) is measured, and autofocus control is performed so that the surface position of the substrate is automatically located within the depth of focus of the projection optical system.

In this case, in order to perform the autofocus control reliably, it is preferable that the surface position of the substrate can be measured with high accuracy.

Prior art documents

Patent document

[ patent document 1] specification of U.S. patent application publication No. 2010/0266961

Disclosure of Invention

A first aspect of the present invention provides a mobile device including: a 1 st moving body that holds an object and is movable in a 1 st direction; a 2 nd movable body provided opposite to the 1 st movable body and movable in the 1 st direction; and a measuring section having a measuring system provided in one of the 1 st and 2 nd moving bodies and a measuring system provided in the other moving body, the measuring system irradiating the measuring system with a measuring beam to measure a position of the 1 st moving body in an up-down direction; the measuring unit moves the 2 nd movable body in the 1 st direction so as to face the 1 st movable body with respect to the 1 st movable body moving in the 1 st direction, and performs measurement.

The present invention according to claim 2 provides a mobile device including: a 1 st moving body that holds an object and is movable in a 1 st direction; a 2 nd movable body provided opposite to the 1 st movable body and movable in the 1 st direction; and a measuring section having a measuring system provided in one of the 1 st and 2 nd moving bodies and a measuring system provided in the other moving body, the measuring system irradiating the measuring system with a measuring beam to measure a position of the 1 st moving body in an up-down direction.

An exposure apparatus according to claim 3 of the present invention includes one of the movable body apparatus according to claim 1 and the movable body apparatus according to claim 2, and a patterning device configured to form a predetermined pattern on an object held by the movable body apparatus according to claim 1 using an energy beam.

The invention provides a method for manufacturing a flat panel display, comprising: exposing the object by using the exposure apparatus of the 3 rd aspect; and an operation of developing the exposed object.

The invention according to claim 5 provides a method for manufacturing a device, comprising: exposing the object by using the exposure apparatus of the 3 rd aspect; and an operation of developing the exposed object.

The present invention according to claim 6 provides a measurement method including: an operation of irradiating a measuring beam from a measuring system provided on one of a 1 st moving body movable in a 1 st direction and a 2 nd moving body provided opposite to the 1 st moving body and movable in the 1 st direction with respect to a measuring system provided on the other of the 1 st moving body and the 2 nd moving body to measure a position of the 1 st moving body in a vertical direction; in the measurement operation, the 2 nd movable body moves in the 1 st direction with respect to the 1 st movable body so as to oppose the 1 st movable body moving in the 1 st direction, and the measurement is performed.

Drawings

Fig. 1 is a view schematically showing the configuration of a liquid crystal exposure apparatus according to embodiment 1.

Fig. 2 is a sectional view taken along line a-a of fig. 1.

Fig. 3 is a conceptual diagram of a substrate stage Z tilt position measurement system provided in the liquid crystal exposure apparatus of fig. 1.

Fig. 4 is a block diagram showing the input/output relationship of a main controller configured with the control system of the liquid crystal exposure apparatus as the center.

Fig. 5 is a diagram for explaining the operation of the substrate stage device and the substrate stage Z tilt position measurement system during the stepping operation.

Fig. 6(a) and 6(b) are diagrams (1 and 2) for explaining the operations of the substrate stage device and the substrate stage Z tilt position measurement system during the exposure operation.

Fig. 7 is a view (sectional view) showing a liquid crystal exposure apparatus according to embodiment 2.

Fig. 8 is a diagram for explaining the operation of the substrate stage Z tilt position measurement system according to embodiment 2.

Fig. 9 is a view (front view) showing a liquid crystal exposure apparatus of embodiment 3.

Fig. 10 is a conceptual diagram of a system for measuring the tilt position of substrate stage Z according to embodiment 3.

Fig. 11 is a view (sectional view) showing a liquid crystal exposure apparatus according to embodiment 3.

Fig. 12 is a view (front view) showing a liquid crystal exposure apparatus of embodiment 4.

Fig. 13 is a conceptual diagram of a substrate position measurement system according to embodiment 4.

Fig. 14 is a view (sectional view) showing a liquid crystal exposure apparatus according to embodiment 5.

Fig. 15 is a conceptual diagram of a substrate position measuring system according to embodiment 5.

Fig. 16(a) and 16(b) are views (sectional view and plan view, respectively) showing a substrate stage device according to embodiment 6.

Fig. 17 is a diagram showing an irradiated spot of a measuring beam on an encoder scale.

Detailed Description

EXAMPLE 1 embodiment

Hereinafter, embodiment 1 will be described with reference to fig. 1 to 6 (b).

Fig. 1 schematically shows a configuration of a liquid crystal exposure apparatus 10 according to embodiment 1. The liquid crystal exposure apparatus 10 is, for example, a projection exposure apparatus of a step-and-scan method, a so-called scanner, in which a rectangular (square) glass substrate P (hereinafter, simply referred to as a substrate P) used in a liquid crystal display device (flat panel display) or the like is used as an exposure object.

Liquid crystal exposure apparatus 10 includes illumination system 12, mask stage device 14 for holding mask M on which a circuit pattern or the like is formed, projection optical system 16, apparatus main body 18, substrate stage device 20 for holding substrate P whose surface (surface facing + Z side in fig. 1) is coated with photoresist (sensitive agent), and a control system for these components. Hereinafter, the direction in which the mask M and the substrate P are respectively scanned with respect to the projection optical system 16 during exposure is referred to as the X-axis direction, the direction orthogonal to the X-axis in the horizontal plane is referred to as the Y-axis direction, and the direction orthogonal to the X-axis and the Y-axis is referred to as the Z-axis direction. The directions of rotation about the X, Y, and Z axes are referred to as θ X, θ Y, and θ Z directions, respectively.

The illumination system 12 has the same structure as that disclosed in, for example, U.S. Pat. No. 5,729,331. The illumination system 12 irradiates the mask M with light emitted from a light source (mercury lamp, etc.) not shown as exposure illumination light (illumination light) IL through a mirror, a dichroic mirror, a curtain, a filter, various lenses, etc., not shown. The illumination light IL is, for example, light of i-line (wavelength 365nm), g-line (wavelength 436nm), h-line (wavelength 405nm), or the like (or a composite light of the i-line, g-line, and h-line).

The mask stage 14 holds a light-transmissive mask M. The main controller 50 (see fig. 4) drives the mask stage 14 (i.e., the mask M) in the X-axis direction (scanning direction) by a predetermined stroke with respect to the illumination system 12 (the illumination light IL) through a mask stage drive system 52 (see fig. 4) including a linear motor, and slightly drives the mask stage in the Y-axis direction and the θ z direction. The positional information of mask stage 14 in the horizontal plane is obtained by mask stage position measurement system 54 (see fig. 4) including a laser interferometer.

Projection optical system 16 is disposed below mask stage device 14. The projection optical system 16 is a so-called multi-lens (multi-lens) projection optical system having the same configuration as that of the projection optical system disclosed in, for example, U.S. Pat. No. 6,552,775 and includes a plurality of optical systems that are telecentric on both sides and form an erect image. The optical axis AX of the illumination light IL projected from the projection optical system 16 toward the substrate P is parallel to the Z axis.

In the liquid crystal exposure apparatus 10, when the mask M positioned in a predetermined illumination area is illuminated with illumination light IL from the illumination system 12, a projection image (partial erected image) of the mask M in the illumination area is formed on an exposure area on the substrate P by the illumination light passing through the mask M through the projection optical system 16. The mask M is moved in the scanning direction with respect to the illumination region (illumination light IL) and the substrate P is moved in the scanning direction with respect to the exposure region (illumination light IL), so that scanning exposure is performed on one shot region on the substrate P, and the pattern formed on the mask M (the entire pattern corresponding to the scanning range of the mask M) is transferred to the shot region. Here, the illumination region on mask M and the exposure region on substrate P (illumination region of illumination light) are optically conjugate with each other by projection optical system 16.

The apparatus main body 18 is a part supporting the mask stage 14 and the projection optical system 16, and is installed on the floor surface F of the clean room through a plurality of vibration isolators 18 d. The apparatus main body 18 has the same configuration as that disclosed in U.S. patent application publication No. 2008/0030702, and includes an upper mount 18a (also referred to as an optical table or the like) for supporting the projection optical system 16, a pair of lower mounts 18b (one of which is not shown in fig. 2 because it overlaps in the depth direction of the paper in fig. 1), and a pair of intermediate mounts 18 c.

The substrate stage device 20 is a portion for positioning the substrate P with high precision with respect to the projection optical system 16 (illumination light IL), and drives the substrate P in a predetermined long stroke along a horizontal plane (X-axis direction and Y-axis direction) and in a direction of 6 degrees of freedom in a very small width. Although the configuration of substrate stage device 20 is not particularly limited, it is preferable to use a stage device including a 2-dimensional coarse movement stage and a fine movement stage that is driven slightly with respect to the 2-dimensional coarse movement stage, as disclosed in, for example, U.S. patent application publication No. 2008/129762 or U.S. patent application publication No. 2012/0057140.

Substrate stage device 20 in embodiment 1 is, for example, a stage device having a coarse/fine movement configuration including a plurality of (3 in this embodiment) bases 22 (overlapped in the depth direction of the paper in fig. 1, see fig. 2), Y coarse movement stage 24, X coarse movement stage 26, weight cancelling device 28, Y step guide 30, fine movement stage 32, substrate holder 36, and the like.

The base 22 is formed of a member extending in the Y-axis direction, and is provided on the floor surface F in a state of being vibrationally insulated from the apparatus main body 18. The 3 bases 22 are arranged at predetermined intervals in the X-axis direction (see fig. 2).

Y coarse movement stage 24 is mounted on 3 bases 22 as shown in fig. 2. Y coarse movement stage 24 includes 3Y brackets 24a corresponding to base 22, and a pair of X beams 24b (one is not shown in fig. 2, see fig. 1) placed on the 3Y brackets 24 a. Y coarse movement stage 24 is driven in the Y axis direction over 3 bases 22 by a predetermined long stroke through a plurality of Y actuators 24c that are part of substrate stage drive system 56 (not shown in fig. 2, see fig. 4) for driving substrate P in the 6-degree-of-freedom direction. Y coarse movement stage 24 is guided straight in the Y axis direction by a linear guide 24d disposed between the base 22 and the base.

Returning to fig. 1, X coarse movement stage 26 is mounted on a pair of X beams 24 b. X coarse movement stage 26 is formed of a plate-like member having a rectangular shape in plan view (as viewed from the + Z direction), and has an opening formed at the center. X coarse movement stage 26 is driven in the X-axis direction by a predetermined long stroke on Y coarse movement stage 24 by a plurality of X actuators 26a that are part of substrate stage drive system 56 (see fig. 4). X coarse movement stage 26 is linearly guided in the X-axis direction by a linear guide 26b disposed between Y coarse movement stage 24 and it. Fig. 2 is a diagram showing a state in which X coarse movement stage 26 is positioned at the stroke end point on the + X side. Further, X coarse movement stage 26 is mechanically restricted from relative movement in the Y axis direction with respect to Y coarse movement stage 24 by linear guide 26b, and moves in the Y axis direction integrally with Y coarse movement stage 24. The Y actuator 24c (see fig. 2) and the X actuator 26a (see fig. 1) included in the substrate stage drive system 56 may be linear motors, feed screw (ball screw) devices, or the like.

Weight cancel device 28 is inserted into an opening formed in X coarse movement stage 26, as shown in fig. 2. The weight compensation device 28 is also called a stem, and supports the weight of the system including the fine movement stage 32 and the substrate holder 36 from below. The details of the weight canceling device 28 are disclosed in U.S. patent application publication No. 2010/0018950, and thus, the description thereof is omitted. Weight canceling device 28 is mechanically connected to X coarse movement stage 26 via a plurality of connection devices 28a (also referred to as Flexure (Flexure) devices), and is moved along the XY plane integrally with X coarse movement stage 26 by being pulled by X coarse movement stage 26.

Y-step guide 30, which is part of the platform as the weight-cancelling arrangement 28 moves. The Y-step guide 30 is composed of a member extending in the X-axis direction, and is mounted on a pair of lower table portions 18b of the apparatus main body 18 through a plurality of linear guide devices 30 a. Y stepping guide 30 is inserted between a pair of X beams 24b (see fig. 1) of Y coarse movement stage 24, and is mechanically connected to Y coarse movement stage 24 via a plurality of connection devices 30b (not shown in fig. 2, see fig. 1). Accordingly, Y step guide 30 moves in the Y axis direction by a predetermined long stroke integrally with Y coarse movement stage 24. Weight cancel device 28 is mounted on Y step guide 30 in a non-contact state via air bearing 28b, and when X coarse movement stage 26 moves only in the X-axis direction on Y coarse movement stage 24, moves in the X-axis direction on Y step guide 30 in a stationary state, and when X coarse movement stage 26 moves in the Y-axis direction integrally with Y coarse movement stage 24 (including the case of movement in the X-axis direction), moves in the Y-axis direction integrally with Y step guide 30 (prevents separation from Y step guide 30).

The fine movement stage 32 is formed of a plate-like (or box-like) member having a rectangular shape in plan view, and is supported from below by the weight cancellation device 28 in a non-contact state (a state in which it is relatively movable along the XY plane) in a state in which the center portion is free to swing (tilt) with respect to the XY plane through the spherical bearing device 34. A substrate holder 36 is fixed to the upper surface of the fine movement stage 32, and a substrate P is placed on the substrate holder 36. The substrate holder 36 is formed in a rectangular plate shape in a plan view, and holds the substrate P by vacuum suction.

Fine movement stage 32 is a part of substrate stage drive system 56 (not shown in fig. 1 and 2, see fig. 4) described above, and is controlled by main control device 50 (see fig. 4) to be driven in a 6-degree-of-freedom direction with respect to X coarse movement stage 26 by a plurality of linear motors including a stator provided to X coarse movement stage 26 and a mover provided to fine movement stage 32. The plurality of linear motors include a plurality of X voice coil motors 56X (not shown in fig. 1), Y voice coil motors 56Y (not shown in fig. 2), and Z voice coil motors 56Z, respectively. Further, when X coarse movement stage 26 moves in a long stroke along the XY plane, main controller 50 applies thrust to fine movement stage 32 by the plurality of linear motors so that fine movement stage 32 and X coarse movement stage 26 move in a long stroke along the XY plane integrally. The configuration of substrate stage device 20 described above (except for the measurement system) including substrate stage drive system 56 is disclosed in, for example, U.S. patent application publication No. 2012/0057140.

As shown in fig. 4, the position measurement system of fine movement stage 32 (i.e., substrate P) includes a substrate stage horizontal plane position measurement system 58 (hereinafter, referred to as "horizontal plane position measurement system 58") for obtaining position information of the substrate in the XY plane (including rotation amount information in the θ Z direction), and a substrate stage Z tilt position measurement system 70 (hereinafter, referred to as "Z tilt position measurement system 70") for obtaining position information of the substrate in a direction intersecting the horizontal plane (position information in the Z axis direction, rotation amount information in the θ x and θ y directions).

As the horizontal in-plane position measuring system 58, although not shown, an optical interferometer system using a rod mirror (a Y rod mirror extending parallel to the X axis and an X rod mirror extending parallel to the Y axis) fixed to the fine movement stage 32 and the substrate holder 36 (see fig. 1, respectively) and the like can be used. The position measurement system using the optical interferometer system is disclosed in U.S. patent application publication No. 2010/0018950, and the description thereof is omitted.

As shown in fig. 1, the Z tilt position measurement system 70 includes a pair of head units (

head units

72a and 72 b). One head unit 72a is disposed on the + Y side of the projection optical system 16, and the other head unit 72b is disposed on the-Y side of the projection optical system 16 (see fig. 2). The

head units

72a and 72b are substantially the same except for different arrangements.

The

head units

72a and 72b measure Z tilt position information of the substrate P using a pair of targets 38(target, target member) included in the substrate stage device 20. One of the pair of targets 38 is disposed on the + Y side of the substrate holder 36, and the other is disposed on the-Y side of the substrate holder 36. The distance between the pair of targets 38 in the Y axis direction is set to be substantially the same as the distance between the

head units

72a and 72b in the Y axis direction.

As can be seen from fig. 1 and 2, the target 38 is formed of a plate-like (belt-like) member extending in the X-axis direction and parallel to the XY plane. The upper surface of the target 38 is a reflective surface. As the target 38, a flat mirror or the like can be used. The length of the target 38 in the X-axis direction is set to be longer than the length of the substrate holder 36 (and the substrate P) in the X-axis direction, and in the present embodiment, is set to be about 1.1 to 2 times the length of the substrate holder 36 in the X-axis direction. The length of the target 38 may be shorter than the length of the substrate holder 36 in the X-axis direction. For example, a plurality of targets 38 having a length shorter than the X-axis direction of the substrate holder 36 may be provided in accordance with the field and timing for measuring the Z tilt position information.

The target 38 is attached to the side surface of the substrate holder 36 via a bracket 38a so that the height position (position in the Z-axis direction) of the upper surface thereof is substantially the same as the height position of the surface of the substrate P placed on the substrate holder 36. Therefore, when the substrate holder 36 is driven in a direction intersecting the horizontal plane (movement in the direction of the optical axis AX and a direction inclined with respect to the horizontal plane), the pair of targets 38 moves in the direction intersecting the horizontal plane integrally with the substrate holder 36. Accordingly, the posture change of the substrate P placed on the substrate holder 36 is reflected on the upper surface (reflection surface) of the target 38. Although the target 38 is attached to the side surface of the substrate holder 36 in fig. 1 and 2, the position where the target 38 is installed is not particularly limited as long as the change in the posture of the substrate P is reflected, and the target may be fixed to the fine movement stage 32 or may be directly attached to the upper surface of the substrate holder 36. Further, the Z tilt position information may be measured by using at least a part of the upper surface of the substrate holder 36, the fine movement stage 32, the substrate P, and the like as the target 38. That is, at least a part of the upper surfaces of the substrate holder 36, the fine movement stage 32, the substrate P, and the like can be made to have the same function as the target 38. In this way, the configuration of substrate stage device 20 can be simplified, even if target 38 is not provided.

Next, the

head units

72a and 72b will be described. As shown in fig. 1, the head unit 72a includes a Y linear actuator 74, a Y slider 76 that is driven by the Y linear actuator 74 with a predetermined stroke in the Y axis direction with respect to the projection optical system 16 (and the apparatus main body 18), and a pair of sensor heads 78 (overlapped in the depth direction of the sheet in fig. 1, see fig. 2) fixed to the Y slider 76. The same applies to the head unit 72 b.

The Y linear actuator 74 (driving mechanism) is fixed to the lower surface of the upper frame 18a of the apparatus main body 18. The Y linear actuator 74 includes a linear guide for guiding the Y slider 76 in the Y axis direction, and a drive system for applying a thrust force to the Y slider 76. The type of the linear guide is not particularly limited, but an air bearing having high reproducibility is preferable. The type of the drive system is not particularly limited, and a linear motor, a belt (or wire) drive device, or the like can be used.

The Y linear actuator 74 is controlled by the main control device 50 (see fig. 4). Main controller 50 controls Y linear actuator 74 such that the moving direction, moving amount, and moving speed of Y slider 76 in the Y axis direction are substantially the same as the moving direction, moving amount, and moving speed of substrate P (fine movement stage 32) in the Y axis direction. In addition, although not shown in fig. 1 and 2, the main control device 50 obtains positional information of the Y-slider 76 with respect to the device main body 18 (i.e., the projection optical system 16) through the Y-slider position measurement system 80 (see fig. 4). The Y-slide position measurement system 80 may be a linear encoder system or may be based on input signals to the Y-linear actuator 74.

The pair of sensor heads 78 are mounted separately in the X-axis direction below the Y-slider 76 (see fig. 2). The pair of sensor heads 78 are disposed facing the target 38 and facing downward (-Z direction), as shown in fig. 3. In the present embodiment, a laser displacement meter is used as the sensor head 78, but the type of the sensor head 78 is not particularly limited as long as it can measure the displacement of the target 38 in the Z-axis direction with respect to the apparatus main body 18 (see fig. 1) with a desired accuracy (analysis capability) in a non-contact manner.

Here, since the pair of sensor heads 78 included in each

head unit

72a, 72b are separated in the X axis direction, the main control device 50 (see fig. 4) can obtain Z axis direction position (displacement amount) information of the corresponding target 38 from an average value of outputs of the pair of sensor heads 78, and can obtain tilt amount information of the target 38 in the θ y direction from a difference between the outputs of the pair of sensor heads 78. Further, since the

head units

72a and 72b (and the corresponding targets 38) are separated in the Y-axis direction, the main controller 50 can obtain the tilt amount information in the θ x direction of the substrate holder 36 (see fig. 1) from the outputs of the total of 4 sensor heads 78 on different straight lines included in the

head units

72a and 72 b. In addition, when the Z-axis direction position (displacement amount) information of the target 38 is obtained, it can be obtained from the outputs of 1 sensor head out of the pair of sensor heads 78.

Fig. 4 is a block diagram showing the input/output relationship of the main controller 50 configured to collectively control each part, which is configured mainly by the control system of the liquid crystal exposure apparatus 10 (see fig. 1). The main control device 50 includes a workstation (or a microcomputer) and the like, and integrally controls each component of the liquid crystal exposure apparatus 10.

In the liquid crystal exposure apparatus 10 (see fig. 1) configured as described above, under the management of the main control device 50 (see fig. 4), the mask M is loaded onto the mask stage 14 by a mask loader (not shown), and the substrate P is loaded onto the substrate stage device 20 (substrate holder 36) by a substrate loader (not shown). Thereafter, the main controller 50 performs alignment measurement using an unillustrated alignment detection system, and after the alignment measurement is completed, a step & scan (step & scan) type exposure operation is sequentially performed on a plurality of irradiation regions set on the substrate P.

During the above-described scanning exposure operation, the main controller 50 (see fig. 4) performs positioning control in the Z tilt direction of the substrate P (so-called autofocus control) so that the irradiation region (exposure region) of the illumination light IL (see fig. 1) on the substrate P is automatically located within the depth of focus of the projection optical system 16 (see fig. 1) based on the output of the Z tilt position measurement system 70 (see fig. 4). As the Z tilt position measurement system of the substrate P, a measurement system (a known autofocus sensor) of a system of directly measuring the surface position information of the substrate P in the vicinity of the exposure area may be used in combination with the Z tilt position measurement system 70 of the present embodiment.

In a series of step & scan exposure operations, as shown in fig. 5 and 6a, when the main controller 50 (see fig. 4) moves the substrate P (substrate holder 36) in the Y-axis direction (the + Y direction in fig. 5 and 6a, see the white arrow) to move between shots, the Y sliders 76 of the

head units

72a and 72b are driven in the Y-axis direction in synchronization with the substrate P (so that the measurement light from the sensor head 78 does not deviate from the corresponding target 38) (see the black arrow in fig. 5 and 6 a). In this way, the Z tilt position information of the substrate P can be obtained regardless of the Y position of the substrate P. At this time, since the Y-axis width of the target 38 is set sufficiently larger than the measurement point of the sensor head 78 on the target 38, the positions of the sensor head 78 and the substrate holder 36 in the Y-axis direction may not be precisely synchronized.

On the other hand, as shown in fig. 6b, when the substrate P (substrate holder 36) is moved in the X-axis direction (the-X direction in fig. 6b, see the white arrow) to perform the scanning exposure operation in the exposure operation of the step-and-scan method in a series, the main controller 50 (see fig. 4) determines Z tilt position information of the substrate P by causing the Y sliders 76 of the

head units

72a and 72b to be in a stationary state (a state in which the sensor head 78 faces the corresponding target 38). In addition, when it may be difficult to ensure the flatness of the surface of the target 38 and the straight accuracy of the Y slider 76, the flatness and the straight accuracy may be measured in advance to obtain correction information, and the output of the sensor head 78 may be corrected based on the correction information when the actual Z tilt position information is measured.

According to the Z tilt position measurement system 70 of embodiment 1 described above, since the change in the posture of the substrate holder 36 holding the substrate P is directly measured with reference to the apparatus main body 18, the Z tilt position information of the substrate P can be obtained with high accuracy. Here, it is conceivable to mount a measurement sensor on the substrate holder 36 and determine the change in the posture of the substrate holder 36 with reference to the weight cancelling device 28 (i.e., the Y step guide 30), but since the weight cancelling device 28 (and the Y step guide 30) is configured to move along the XY plane, the measurement accuracy may be reduced. In contrast, in Z tilt position measurement system 70 of the present embodiment, since the upper stage 18a on which projection optical system 16 is mounted is used as a reference, the change in the posture of substrate P can be measured with high accuracy regardless of the operation of substrate stage device 20.

In addition, in the Z tilt position measurement system (autofocus sensor) of the system for directly measuring the surface position information of the substrate P in the vicinity of the exposure area, as shown in fig. 2, when the substrate holder 36 is positioned at the stroke end in the X-axis direction, the Z tilt position information of the substrate P cannot be obtained because the substrate P is not positioned below the projection optical system 16, but the Z tilt position information of the substrate P can be obtained regardless of the X-axis direction position of the substrate holder 36 by using the Z tilt position measurement system 70 of the present embodiment.

EXAMPLE 2 EXAMPLE

Next, a liquid crystal exposure apparatus according to embodiment 2 will be described with reference to fig. 7 and 8. The configuration of the liquid crystal exposure apparatus according to embodiment 2 is the same as that of embodiment 1 except for the configuration of the measurement system for obtaining Z tilt position information of the substrate P, and therefore only differences will be described below, and elements having the same configuration and function as those of embodiment 1 are given the same reference numerals as those of embodiment 1, and description thereof will be omitted.

In the Z tilt position measurement system 170 according to

embodiment

2, 1 head unit (

head units

72a and 72b) is disposed on the + Y side and the-Y side of the projection optical system 16, respectively, with respect to the Z tilt position measurement system 70 according to embodiment 1 (see fig. 6a and the like), and 2

head units

172a and 172c are disposed on the + Y side of the projection

optical system

16, and 2

head units

172b and 172d are also disposed on the-Y side of the projection optical system 16, as shown in fig. 8. That is, the main controller 50 (see fig. 4) obtains Z tilt position information of the substrate P using 2

head units

72a and 72b (i.e., 4 sensor heads 78 in total) in the above-described embodiment 1, whereas the Z tilt position information of the substrate P is suitably obtained using 4 head units 172a to 172d (i.e., 8 sensor heads 78 in total) in the present embodiment 2. The head units 172a to 172d have the same configuration as the

head units

72a and 72b of embodiment 1, and therefore, the description thereof is omitted.

Further, as shown in fig. 2, 6a, etc., with respect to the above-described embodiment 1, the X positions of the 2

head units

72a, 72b are substantially the same as the X position of the projection optical system 16, and as shown in fig. 8, in embodiment 2, the 2

head units

172a, 172c on the + Y side of the projection optical system 16 are arranged such that one (head unit 172a) is arranged on the + X side of the projection optical system 16 and the other (head unit 172c) is arranged on the-X side (i.e., the front side and the inner side in the scanning direction) of the projection optical system 16. The same applies to the 2

head units

172b and 172d on the-Y side of the projection optical system 16. As described above, in embodiment 2, 4 head units 172a to 172d are arranged around the projection optical system 16. Note that, although the point where the target 138 having a reflecting surface extending in the X-axis direction is fixed to the substrate holder 36 via the bracket 138a is the same as in the above-described embodiment 1, in the present embodiment 2, the X-axis dimension of the target 138 is shorter than that in the above-described embodiment 1.

The operation of each head unit 172a to 172d in the scanning exposure operation in embodiment 2 is substantially the same as that in embodiment 1, and therefore, the description thereof is omitted. That is, the main controller 50 (see fig. 4) obtains Z tilt position information of the substrate P from outputs of the sensor heads 78 included in at least 2 head units (head unit 172a and head unit 172b, head unit 172c and head unit 172d, or all head units 172a to 172d) among the 4 head units 172a to 172d while moving the Y slider 76 of each head unit 172a to 172d in the Y axis direction (see black arrow in fig. 8) in synchronization with the movement of the substrate holder 36 (substrate P) in the Y axis direction (see white arrow in fig. 8).

In the Z tilt position measurement system 170 according to embodiment 2 described above, since 2 head units (

head units

172a and 172b, and

head units

172c and 172d) separated in the Y axis direction are arranged on the + X side and the-X side of the projection optical system 16, respectively, the detection region in the X axis direction is longer than that in embodiment 1 described above. Accordingly, as shown in fig. 7, the length of the target 138 in the X-axis direction can be made shorter than that in embodiment 1 (see fig. 2). In this way, fine movement stage 32 can be reduced in weight, and therefore the positional controllability of substrate P can be improved.

EXAMPLE 3

Next, a liquid crystal exposure apparatus according to embodiment 3 will be described with reference to fig. 9 to 11. The configuration of the liquid crystal exposure apparatus according to embodiment 3 is the same as that of

embodiment

1 or 2 described above except for the configuration of the measurement system for obtaining Z tilt position information of the substrate P, and therefore only differences will be described below, and elements having the same configuration and function as those of

embodiment

1 or 2 described above will be given the same reference numerals as those of

embodiment

1 or 2 described above, and their description will be omitted.

The Z tilt position measurement system 270 according to embodiment 3 is different from the above-described

embodiments

1 and 2 in that tilt amount information of the Y-slider 76 having the sensor head 78 with respect to a horizontal plane (XY plane) is obtained by the main control device 50 (see fig. 4). The main controller 50 obtains Z tilt position information of the substrate P from the output of the sensor head 78 and tilt amount information of the Y slider 76 at the time of the output (that is, while correcting the tilt of the Y slider 76).

In embodiment 3, 4 head units 272a to 272d (see fig. 9 and 11) are arranged in the same arrangement as in embodiment 2 (that is, around the projection optical system 16). The 4 head units 272a to 272d have substantially the same configuration except for different arrangements. Further, without being limited thereto, 2 head units may be arranged in the same arrangement as in embodiment 1 (that is, at the same X position as projection optical system 16). In this case, as in embodiment 1, a target 38 (see fig. 2 and the like) longer than the target 138 in the X-axis direction is used.

As shown in fig. 10, the head unit 272a (as are the head units 272b to 272 d) includes a pair of sensor heads 78 (downward heads) that irradiate the target 138 (in the-Z direction) with the measurement beam and are separated in the X axis direction, as in the case of embodiment 2 described above. A method of obtaining Z tilt position information of the substrate P using a pair of (8 in total) sensor heads 78 provided in each of the 4 head units 272a to 272d is the same as that in embodiment 2 described above, and therefore, the description thereof is omitted.

Here, in the head unit 272a, the Y slider 76 (not shown in fig. 10, see fig. 9) to which the sensor head 78 is attached is configured to be guided straight in the Y axis direction by a linear guide device, and the sensor head 78 (the optical axis of the measurement light with respect to the corresponding target 138) may be inclined and Z-displaced. Therefore, the main control device 50 (see fig. 4) uses the 4 sensor heads 278 (upward heads) attached to the Y slider 76 to obtain information on the amount of tilt (tilt) of the Y slider 76 (including information on the amount of displacement in the optical axis direction), and corrects the outputs of the 2 sensor heads 78 based on the outputs of the 4 sensor heads 278 to cancel the tilt of the Y slider 76 (the shift of the optical axis of the measurement light). In embodiment 4, 4 sensor heads 278 (upward heads) are arranged at 4 positions different from the straight line, but the present invention is not limited to this, and 3 sensor heads 278 may be arranged at 3 positions different from the straight line.

In the present embodiment, as the sensor head 278 (upward sensor), for example, a laser displacement meter similar to the sensor head 78 is used, and information on the tilt amount of the Y slider 76 is obtained using a target 280 (that is, with reference to the upper stage 18 a) extending in the Y axis direction and fixed to the lower surface of the upper stage 18a (see fig. 9 and 11). The type of the sensor head 278 is not particularly limited as long as information on the tilt amount of the Y slider 76 can be obtained with a desired accuracy.

According to embodiment 3 described above, Z tilt information of the substrate P can be obtained with higher accuracy. Since the output of the sensor head 78 (downward reading head) is corrected, the accuracy of the linear guide of the Y slider 76 can be rougher than in the above-described

embodiments

1 and 2.

EXAMPLE 4 embodiment

Next, a liquid crystal exposure apparatus according to embodiment 4 will be described with reference to fig. 12 and 13. As shown in fig. 12, the Z tilt position measurement system 370 according to embodiment 4 includes a head unit 372a disposed on the + Y side of the projection optical system 16 and a head unit 372b disposed on the-Y side of the projection optical system 16, as in embodiment 1. A pair of targets 338 are mounted on the substrate holder 36 so as to correspond to the

head units

372a and 372 b. The length of target 338 in the X-axis direction is the same as that of embodiment 1.

As shown in fig. 13, the head unit 372a includes a pair of sensor heads 78 (downward head) for obtaining Z tilt position information of the substrate P (see fig. 12) and 4 sensor heads 278 (upward head) for measuring tilt amount information of the pair of sensor heads 78, as in the above-described embodiment 3 (see fig. 10). The procedure for obtaining the Z tilt position information of the substrate P using the sensor heads 78 and 278 is the same as in embodiment 3, and therefore, the description thereof is omitted.

The liquid crystal exposure apparatus according to embodiment 4 includes an encoder system as a horizontal plane position measurement system 58 (see fig. 4) for obtaining positional information of the substrate P in the horizontal plane. Hereinafter, embodiment 3 will be described with respect to an encoder system, and elements having the same configurations and functions as those of embodiments 1 to 3 are given the same reference numerals as those of embodiments 1 to 3, and description thereof will be omitted.

As shown in fig. 12, the head unit 372a includes a Y linear actuator 74, a Y slider 76 driven by the Y linear actuator 74 at a predetermined stroke in the Y axis direction with respect to the projection optical system 16, and a plurality of measurement heads fixed to the Y slider 76 (described later in detail). The head unit 372b is also the same. The structures and functions of the Y linear actuator 74 and the Y slider 76 are substantially the same as those of the Y linear actuator 74 and the Y slider 76 of the head unit 72a (see fig. 1) of embodiment 1 described above, and therefore, the description thereof is omitted.

As shown in fig. 13, head unit 372a includes, as a part of the plurality of measurement heads, 2X encoder heads 384X (downward X head), 2Y encoder heads 384Y (downward Y head), 2X encoder heads 386X (upward X head), and 2Y encoder heads 386Y (upward Y head). As described above, the head unit 372a includes the pair of sensor heads 78 (downward Z head) and the 4 sensor heads 278 (upward Z head) as a part of the plurality of measurement heads. The

heads

384x, 384Y, 386x, 386Y, 78, 278 are fixed to the Y slider 76 (see fig. 12). The head unit 372b is configured in the same manner as in fig. 12 except that it is configured to be symmetrical with respect to the paper surface. In fig. 12, the pair of targets 338 are formed symmetrically.

In embodiment 4, a plurality of scale plates 340 are attached to the upper surface of the target 338. The scale plate 340 is a strip-shaped member extending in the X-axis direction in a plan view, and is then placed on the upper surface of the target 338. The length of the scale plate 340 in the X-axis direction is shorter than the length of the target 338 in the X-axis direction, and a plurality of scale plates 340 are arranged at predetermined intervals (separated from each other) in the X-axis direction. Further, the scale plate 340 is not attached to a band-shaped region including the vicinity of the-Y-side end portion of the upper surface of the target 338, which is opposed to the pair of sensor heads 78 (downward Z head), and functions as a reflection surface for measuring the Z tilt position of the substrate P, as in the above-described embodiments 1 to 3. Further, the Z tilt position of the substrate P can be measured by using the upper surfaces of the scale plates 340 as reflection surfaces. This eliminates the need to provide such a band-shaped region, and thus simplifies the structure of the target 338.

An X scale 342X and a Y scale 342Y are formed on the scale plate 340. The X scale 342X is formed in a half area of the-Y side of the scale plate 340, and the Y scale 342Y is formed in a half area of the + Y side of the scale plate 340. The X scale 342X has a reflective X diffraction grating, and the Y scale 342Y has a reflective Y diffraction grating. In fig. 13, the scale plate 340 is shown to be substantially thicker and the intervals (pitches) between the plurality of grid lines forming the X-scale 342X and the Y-scale 342Y are shown to be substantially wider for the sake of understanding.

The 2X encoder heads 384X irradiate the X scale 342X with the measurement beam in a state of being arranged facing the X scale 342X. The main controller 50 (see fig. 4) obtains displacement amount information of the substrate P in the X-axis direction based on the output of the X encoder head 384X of the light from the X scale 342X in response to the movement of the substrate P (see fig. 12) in the X-axis direction. The 2Y encoder heads 384Y are also arranged to face the Y scale 342Y in the same manner, and the main controller 50 obtains displacement amount information of the substrate P in the Y axis direction in response to the output of the Y encoder heads 384Y. Further, main controller 50 obtains rotation amount information of substrate P in the θ z direction from the output of X encoder head 384X of head unit 372a and head unit 372b (see fig. 12).

Here, the interval between the 2X encoder heads 384X and the Y encoder head 384Y in the X axis direction is set to be wider than the interval between the adjacent scale plates 340. Therefore, regardless of the X position of the substrate P (see fig. 12), at least one of the 2X encoder heads 384X and the Y encoder head 384Y always faces the scale plate 340. Accordingly, the main controller 50 (see fig. 4) can obtain the position information of the substrate P from one of the 2

encoder heads

384x and 384y or the average value of the 2

encoder heads

384x and 384 y. In the present embodiment, the scale plates 340 are arranged at predetermined intervals in the X-axis direction, but the present invention is not limited thereto, and a long scale plate having the same length in the X-axis direction as the target 338 may be used. In this case, 1 encoder head (downward X head 384X, downward Y head 384Y) for obtaining positional information of substrate P in the horizontal plane may be provided for each of 1

head unit

372a and 372 b.

In the horizontal in-plane position measuring system 58, when the X encoder head 384X and the Y encoder head 384Y (called a head group on the + X direction side) provided on the + X direction side with respect to the scale plate 380 in fig. 13 are moved from the 1 st scale plate 340 to the 2 nd scale plate 340 (the scale plate 340 adjacent to the 1 st scale plate) in the scale plate 340 to measure the 2 nd scale plate 340, the head group on the + X direction side can measure the position information of the substrate P in the X axis direction immediately after the measurement operation possible state using the 2 st scale plate 340, but the output of the head group on the + X direction is counted again from a non-constant value (or zero), and therefore cannot be used for calculating the X position information of the substrate P. Therefore, in this state, the output of each of the + X direction side head groups needs to be processed successively. As the subsequent processing, specifically, processing is performed in which the output of the + X direction side head group of an indefinite value (or zero) is corrected (so as to be the same value) using the outputs of the X encoder head 384X and the Y encoder head 384Y (referred to as the-X direction side head group) provided on the-X direction side with respect to the scale plate 380. The continuation processing is ended before the head group on the-X direction side comes out of the measurement range of the 1 st scale.

Likewise, in the case where the head group on the-X direction side reaches outside the measurement range of the 1 st scale plate 340, the output of the head group on the-X direction side is regarded as invalid before reaching outside the measurement range. Therefore, the X position information of the substrate P is obtained from the output of the + X direction side head group. Then, immediately after the measurement operation using the 2 nd scale plate 340 is performed for each of the-X direction side head groups, the continuation process using the output of the + X direction side head group is performed for the-X direction side head group.

The following process is premised on that the positional relationship between the 4 heads (+ the head group on the X direction side and the head group on the X direction side) is known. The positional relationship between the heads can be determined by using the scale in a state where the 4 heads face the common scale, or by using a measuring device (such as a laser interferometer and a distance sensor) disposed between the heads. This subsequent process may be performed for upward X heads 386X and Y heads 386Y, or for downward Z heads 78 and upward Z heads 278, and the like.

As in the case of embodiments 1 to 3, the main controller 50 (see fig. 4) drives the Y slider 76 (see fig. 12) in the Y-axis direction in synchronization with the movement of the substrate P (see fig. 12) in the Y-axis direction. At this time, since the horizontal in-plane position measurement system 58 of the present embodiment obtains the position information of the substrate P from the outputs of the X encoder head 384X and the Y encoder head 384Y of the Y slider 76, the displacement amount information of the Y slider 76 itself in the Y axis direction needs to be measured with the same degree of accuracy as that of the substrate P. Therefore, the horizontal in-plane position measuring system 58 of the present embodiment further includes an encoder system for obtaining the displacement of the Y-slider 76 using a scale plate 380 fixed to the lower surface of the upper table portion 18a (see fig. 12) as the Y-slider position measuring system 80 (see fig. 4).

The scale plate 380 is formed of a plate-like member extending in the Y-axis direction, and an X scale 382X and a Y scale 382Y are formed on the lower surface thereof in the same manner as the scale plate 340. Further, in Y slider 76 (see fig. 12), 2X encoder heads 386X separated in the Y axis direction are attached to face X scale 382X, and 2Y encoder heads 386Y separated in the Y axis direction are attached to face Y scale 382Y. The scale plate 380 also faces the 4 sensor heads 278 (upward Z heads), and also functions as a target (reflection surface) when the inclination amount of the Y slider 76 is determined using the 4 sensor heads 278.

When the main controller 50 (see fig. 4) moves the substrate P (see fig. 12) in the Y-axis direction, the Y-slider 76 is moved in the Y-axis direction in synchronization with the substrate P. The main controller 50 obtains position information of the Y slider 76 in the XY plane at this time from the outputs of the 2X encoder heads 386X and the 2Y encoder heads 386Y, and obtains position information of the substrate P in the XY plane from the position information of the Y slider 76 and the outputs of the 2X encoder heads 384X and the Y encoder heads 384Y attached to the Y slider 76. As described above, the horizontal in-plane position measuring system 58 of the present embodiment obtains the position information of the substrate P in the horizontal plane by the encoder system indirectly with reference to the apparatus main body 18 through the Y slider 76.

According to embodiment 4 described above, since the positional information of the substrate P in the XY plane is obtained by the encoder system, the influence of air fluctuation and the like can be reduced and the measurement accuracy can be improved as compared with the optical interferometer system. In the encoder system of the present embodiment, since the head moves following the movement of the substrate P in the Y-axis direction, it is not necessary to prepare a large scale plate that can cover the entire movement range of the substrate P in the XY plane.

In embodiment 4, position information in the XY plane of each of the substrate P and the Y slider 76 is obtained by the X encoder heads 384X, 386X and the Y encoder heads 384Y, 386Y, but Z tilt displacement information of each of the substrate P and the Y slider 76 may be obtained together with position information in the XY plane of each of the substrate P and the Y slider 76 by using a 2-dimensional encoder head (an XZ encoder head or a YZ encoder head) that can measure displacement information in the Z axis direction. In this case, the sensor heads 78 and 278 for obtaining the Z tilt position information of the substrate P may be omitted. In this case, in order to obtain Z tilt position information of the substrate P, it is necessary that 2 downward Z heads always face the scale plate 340, and therefore, it is preferable that the scale plate 340 is configured by 1 long scale plate having a length similar to that of the target 338, or the 2-dimensional encoder heads are arranged at predetermined intervals in the X-axis direction by 3 or more.

In embodiment 4, since the scale plate 340 used for obtaining the positional information of the substrate P in the XY plane and the surface to be measured for measuring the Z tilt position of the substrate P (the belt-shaped region to which the scale plate 340 is not attached) are provided on the upper surface of the target 338, the sensor head 78 (the downward Z head) does not need the connection process performed when the X encoder head 384X and the Y encoder head 384Y are positioned between the scale plate 340. Thus, the Z-tilt position measurement can be simply performed. Further, when the Z tilt position of the substrate P is measured by using the upper surfaces of the scale plates 340 as reflection surfaces, the sensor head 78 (downward Z head) may be also subjected to the subsequent processing. In this case, the band-shaped region may not be provided, and therefore the structure of the target 338 can be simplified.

Here, as described above, in the substrate stage device 20, for example, the 2Y sliders 76 are driven in the Y axis direction in synchronization with the substrate holder 36 during the Y step operation of the substrate holder 36. That is, the main control device 50 (see fig. 4) drives the Y slider 76 in the Y-axis direction based on the output of the Y slider position measurement system 80 (see fig. 4, here, the encoder system) while driving the substrate holder 36 in the Y-axis direction to the target position based on the output of the encoder system. At this time, the main controller 50 synchronously drives the Y-slider 76 and the substrate holder 36 (so that the Y-slider 76 follows the substrate holder 36). The main controller 50 controls the position of the Y slider 76 in a range where at least 1 of the plurality of heads 384x and 384Y does not come out of the scale plate 340 (does not fall outside the measurable range).

Therefore, the measurement beams respectively emitted from the X head 384X and the Y head 384Y (see fig. 13, respectively) do not deviate from the X scale 342X and the Y scale 342Y (see fig. 13, respectively) regardless of the Y position of the substrate holder 36 (including the movement of the substrate holder 36). In other words, it is sufficient to move, for example, 2Y sliders 76 in the Y axis direction in synchronization with the substrate holder 36 to such an extent that the respective measuring beams irradiated from the X head 384X and the Y head 384Y do not deviate from the X scale 342X and the Y scale 342Y (during the Y step operation), that is, the measurement using the measuring beams from the X head 384X and the Y head 384Y is not interrupted (measurement can be continued).

At this time, before the substrate holder 36 moves in the step direction (Y-axis direction), the Y slider 76(X heads 384X, 386X, Y heads 384Y, 386Y) can be moved in the step direction before the substrate holder 36 moves. In this way, the acceleration of each head can be suppressed, and the inclination of each head during movement (the inclination with respect to the direction of travel) can be further suppressed. Alternatively, the Y-slide 76 may start moving in the stepping direction slower than the substrate holder 36.

When the Y-step operation of the substrate holder 36 is completed, the mask M (see fig. 1) is driven in the-X direction based on the output of the mask stage position measurement system 54 (see fig. 4) and, in synchronization with the mask M, the substrate holder 36 is driven in the-X direction based on the output of the substrate stage horizontal plane position measurement system (see fig. 4, here, an encoder system) to transfer the mask pattern to the shot (shot) area on the substrate P. At this time, for example, 2Y sliders 76 are in a stationary state. In the liquid crystal exposure apparatus 10, the mask pattern is sequentially transferred to the plurality of shot areas on the substrate P by appropriately repeating the scanning operation of the mask M, the Y stepping operation of the substrate holder 36, and the scanning operation of the substrate holder 36. In the exposure operation, for example, 2Y sliders 76 are driven in the same direction and at the same distance from the substrate holder 36 every time the substrate holder 36 is moved in the + Y direction and the-Y direction in order to maintain the state of facing the target 338 (scale plate 340).

Here, as described above, the Y scale 342Y has a plurality of grid lines extending in the X-axis direction. As shown in fig. 17, an irradiation point 384Y (for convenience, the same reference numeral as that of the Y head is given for explanation) of the measurement beam irradiated from the Y head 384Y onto the Y scale 342Y is an elliptical shape having the Y axis direction as the major axis direction. In the encoder system, when the Y head 384Y and the Y scale 342Y are moved relative to each other in the Y axis direction and the measuring beam crosses the grid line, the output from the Y head 384Y changes in accordance with the phase change of the ± 1-time diffracted light from the irradiation point.

On the other hand, when the substrate holder 36 is driven in the scanning direction (X-axis direction) in the scanning exposure operation, the main controller 50 (see fig. 4) controls the position (Y position) of the Y slider 76 in the stepping direction so that the measurement beam from the Y head 384Y included in the Y slider 76 (see fig. 12) does not cross the plurality of grid lines forming the Y scale 342Y, that is, so that the output of the Y head 384Y does not change (changes to zero).

Specifically, for example, the Y position of the Y head 384Y is measured by a sensor having higher resolution than the pitch between the lattice lines constituting the Y scale 342Y, and the Y position of the Y head 384Y is controlled by the Y linear actuator 74 (see fig. 12) immediately before the irradiation point of the measuring beam from the Y head 384Y crosses the lattice line (immediately before the output of the Y head 384Y changes). Further, not limited to this, for example, when the output of the Y head 384Y changes due to the measurement beam from the Y head 384Y crossing the grid line, the output from the Y head 384Y may be substantially unchanged by driving and controlling the Y head 384Y in response to this. In this case, a sensor for measuring the Y position of the Y head 384Y is not necessary.

EXAMPLE 5 EXAMPLE

Next, a liquid crystal exposure apparatus according to embodiment 5 will be described with reference to fig. 14 and 15. The liquid crystal exposure apparatus according to embodiment 5 obtains positional information of the substrate P in the horizontal plane using an encoder system as in embodiment 4, but differs from embodiment 4 in that a head unit for the encoder system (horizontal in-plane position measurement system) and a head unit for the Z tilt position measurement system are independent points. Hereinafter, the points of difference from embodiment 4 will be described, and elements having the same configuration and function as those of embodiment 4 will be given the same reference numerals as those of embodiment 4, and their description will be omitted.

The Z tilt position measurement system in the liquid crystal exposure apparatus according to embodiment 5 is configured in the same manner as the Z tilt position measurement system 270 according to embodiment 3. That is, as shown in fig. 14, 4 head units 272a to 272d (in fig. 12,

head units

272b and 272d are not shown, see fig. 9, etc.) are attached to the lower surface of the upper frame 18a, and Z tilt position information of the substrate P is obtained using the head units 272a to 272 d. A target 280 (reflection surface) is fixed to the upper frame portion 18a so as to face the head units 272a to 272 d. The procedure for obtaining Z tilt position information of the substrate P using the Z sensor heads 78 and 278 included in the 4 head units 272a to 272d is the same as that of embodiment 3, and therefore, the description thereof is omitted.

The encoder system (horizontal in-plane position measurement system 58) has a pair of

head units

472a, 472b with projection optical system 16 interposed therebetween, as in embodiment 4. The

head units

472a and 472b have substantially the same configuration except for different arrangements. The head unit 472a is disposed between the head unit 272a and the head unit 272 c. Although not shown, the head unit 472b is disposed between the

head units

272b and 272 d.

Head units

472a and 472b are fixed to the lower surface of the upper stage 18a, similarly to head units 272a to 272 d. The scale plate 380 is fixed to the upper frame 18a so as to face the

head units

472a and 472 b.

As shown in fig. 15, the head unit 472a is a head unit obtained by removing the plurality of sensor heads 78 and 278 from the head unit 372a (see fig. 13) of embodiment 4. A procedure for obtaining positional information of substrate P in the horizontal plane using

head units

472a and 472b (see fig. 14) in embodiment 5 is the same as that in embodiment 4, and therefore, the description thereof is omitted.

According to embodiment 5, since the head unit of the system for measuring the in-horizontal-plane position of the substrate P and the head unit of the system for measuring the Z tilt position of the substrate are independent from each other, the head unit is simpler in structure and the arrangement of the sensor heads is easier as compared with embodiment 4. Further, the dimension of the target 438 in the X-axis direction can be reduced compared to that in embodiment 4.

Modifications of embodiments 4 and 5

In each of the above-described embodiments 4 and 5 (embodiments in which the substrate stage horizontal in-plane position measurement system 58 is an encoder system), the X scale (the grid pattern for X-axis direction measurement shown in the figure) and the Y scale (the grid pattern for Y-axis direction measurement shown in the figure) are provided on scale members (e.g., a plurality of scale plates disposed on the target 338) that are independent of each other. However, these plural lattice patterns may be formed in a lattice pattern divided into a group on the same long scale member. Alternatively, a lattice pattern may be continuously formed on the same long scale member.

When a group of scales (scale rows) in which a plurality of scales are arranged in series in the X-axis direction on the

targets

338 and 438 through a gap of a predetermined interval is arranged in a plurality of rows at different positions (for example, a position on one side (+ Y side) and a position on the other side (-Y side) of the projection optical system 16) apart from each other in the Y-axis direction, the positions of the gap of the predetermined interval may be arranged so as not to overlap in the X-axis direction between the plurality of rows. When the plurality of scale rows are arranged in this manner, the heads arranged corresponding to the scale rows do not simultaneously reach the outside of the measurement range (in other words, the two heads simultaneously face the gap).

When a group of scales (a scale row) in which a plurality of scales in the X-axis direction are arranged on

targets

338 and 438 so as to be connected to each other with a gap of a predetermined interval therebetween is arranged in a plurality of rows at different positions (for example, a position on one side (+ Y side) and a position on the other side (-Y side) with respect to projection optical system 16) apart from each other in the Y-axis direction, the plurality of groups of scales (the plurality of scale rows) can be configured to be used in a manner distinguishable according to the arrangement of irradiation on the substrate (shot map). For example, if the lengths of the entire plurality of scale rows are different from one another, the number of irradiation regions formed on the substrate can be changed depending on different irradiation patterns, such as 4-plane irradiation and 6-plane irradiation. Further, if the positions of the gaps of the respective scale rows are arranged in this manner and are different from each other in the X-axis direction, the heads corresponding to the respective plurality of scale rows do not simultaneously fall outside the measurement range, and therefore the number of sensors regarded as indeterminate values in the subsequent processing can be reduced, and the subsequent processing can be performed with high accuracy.

In the scale group (scale row) in which a plurality of scales in the X-axis direction are arranged in series with each other with a gap of a predetermined interval therebetween on the

targets

338 and 438, the length of 1 scale (pattern for X-axis measurement) in the X-axis direction can be made a length that can continuously measure the length of 1 shot region (length formed on the substrate by the module pattern being shot when the substrate on the substrate holder is moved in the X-axis direction and scanning exposure is performed). In this way, in the scanning exposure of the 1 shot region, since it is not necessary to perform continuous control of the heads with respect to the plurality of scales, it is possible to easily perform position measurement (position control) of the substrate P (substrate holder) during the scanning exposure.

In the scale group (scale row) in which a plurality of scales are arranged in series in the X-axis direction through a gap of a predetermined interval on the

targets

338 and 438, in the above embodiment, the scales having the same length are arranged in series, but scales having different lengths may be arranged in series. For example, among the scale rows on the

targets

338 and 438, the length of the scale disposed at the center portion in the X-axis direction may be physically made longer than the length of the scale disposed closer to each end portion (in the scale rows, the scales disposed at each end portion).

In the scale group (scale row) in which the

targets

338 and 438 are arranged so as to be connected in the X-axis direction through the plurality of scales with a predetermined gap therebetween, the distance between the plurality of scales (in other words, the gap length), the length of 1 scale, and the 2 heads (heads arranged to face each other inside the 1Y slider 76, for example, 2 heads 384X shown in fig. 13) that move relative to the scale row are arranged so as to satisfy the relationship "1 scale length > the distance between the heads arranged to face each other > the distance between the scales". This relationship is satisfied not only when the scale plate 380 provided on the upper stage 18a is disposed at a predetermined interval in the Y-axis direction, but also when the scale plates 384x and 384Y provided on the

targets

338 and 438 and the heads 384x and 384Y corresponding thereto are disposed on the upper stage 18 a.

The pair of X heads 384X and the pair of Y heads 384Y are arranged in the X axis direction so that 1 of the X heads 384X and the pair of Y heads 384Y are paired with each other (the X heads 384X and the Y heads 384Y are arranged at the same position in the X axis direction).

In the scale plate 340 formed on the

targets

338 and 438, the X scale 342X and the Y scale 342Y are formed to have the same length in the X axis direction, but these lengths may be different from each other. In addition, the two may be arranged in a staggered manner in the X-axis direction.

When a certain Y slider 76 and a corresponding scale row (a scale row in which a plurality of scales are arranged in a predetermined direction with a predetermined gap therebetween) are moved relative to each other in the X-axis direction, when a certain group of heads (for example, the X head 384X and the Y head 384Y in fig. 13) in the Y slider 76 simultaneously face the gap between the scales and then simultaneously face the other scale (when the heads 384X and 384Y are connected to the other scale), it is necessary to calculate an initial measurement value of the connected head. In this case, the initial value of the following head in the following state can be calculated using the outputs of a set of heads (384X, 384Y) remaining in the Y slider 76 and different from the following head (positioned apart in the X-axis direction and at a shorter distance from the head that is separated therefrom than the scale length). The further head may be a position measuring head in the X-axis direction or a position measuring head in the Y-axis direction.

In the above description, "the Y slider 76 moves in synchronization with the substrate holder 36", which means that the Y slider 76 moves in a state in which the relative positional relationship with the substrate holder 36 is substantially maintained, and is not limited to a case in which the positional relationship, the moving direction, and the moving speed between the Y slider 76 and the substrate holder 36 move in a state in which they are exactly matched.

In order to acquire position information during the period in which substrate stage device 20 moves to the substrate exchange position with the substrate loader, the encoder system may be provided with a scale for substrate exchange on substrate stage device 20 or another stage device, and may acquire position information of substrate stage device 20 using a downward-facing head (X head 384X or the like). Alternatively, a head for substrate replacement is provided in substrate stage device 20 or another stage device, and position information of substrate stage device 20 is acquired by measuring scale plate 340 or a scale for substrate replacement. Further, another position measurement system (for example, a mark on the stage and an observation system for observing the mark) different from the encoder system is provided to control (manage) the replacement position of the stage.

The Z sensor is not limited to the encoder system, and may be a laser interferometer, a TOF sensor, or a sensor capable of measuring a distance.

Further, although the scale plate 340 is provided on the

targets

338 and 438, the scale may be formed directly on the substrate P by exposure processing. For example, scribe lines between the irradiated regions may be formed. In this way, the scale formed on the substrate can be measured, and the nonlinear component error of each irradiation region on the substrate can be obtained from the position measurement result.

The Y slider 76 and the Y linear actuator 74 are provided on the lower surface of the upper frame 18a of the apparatus main body 18 (see fig. 12), but may be provided on the lower frame 18b or the intermediate frame 18 c.

EXAMPLE 6 EXAMPLE

Next, a liquid crystal exposure apparatus according to embodiment 6 will be described with reference to fig. 16(a) and 16 (b). The liquid crystal exposure apparatus according to embodiment 6 is different from the above-described embodiments 1 to 5 in the configuration of substrate stage device 520 for positioning substrate P with high accuracy with respect to projection optical system 16 (see fig. 1). As the configuration of the measurement system for obtaining the positional information of the substrate P in the 6-degree-of-freedom direction, the same configuration as that of any of the measurement systems of the above-described embodiments 1 to 5 can be suitably used. Hereinafter, in embodiment 6, only the differences from embodiments 1 to 5 will be described, and the same reference numerals as those in embodiments 1 to 5 will be given to the same elements having the same configurations and functions as those in embodiments 1 to 5, and the description thereof will be omitted.

While in embodiments 1 to 5, substrate P is held by vacuum suction on its back surface by substrate holder 36 (see fig. 1 and the like), substrate stage device 520 in embodiment 6 is different in that substrate holder 540 is formed in a rectangular frame shape (frame shape) in plan view, and only the point near the end of substrate P is held by suction, as shown in fig. 16 a and 16 b. Further, the entire surface including the center portion of the substrate P is supported from below in a non-contact manner by the non-contact stage 536 which is slightly driven in the Z-tilt direction with respect to the horizontal plane, and is thereby flat-rectified along the upper surface of the non-contact stage 536.

To explain in further detail, the noncontact stage 536 is fixed to the upper surface of the fine movement stage 32. In embodiment 6, fine movement stage 32 is mechanically (however, in a state of being slightly movable in the Z tilt direction) connected to X coarse movement stage 26 via a plurality of link devices 550 including a ball joint or the like, and is moved in the X axis direction and the Y axis direction by a predetermined long stroke by being pulled by X coarse movement stage 26. The substrate holder 540 includes a main body 542 formed in a rectangular frame shape in a plan view, and an adsorption portion 544 fixed to an upper surface of the main body 542. The suction portion 544 is also formed into a rectangular frame shape in a plan view, similarly to the main body portion 542. The substrate P is vacuum sucked and held by the suction portion 544. The noncontact stage 536 is inserted into an opening of the suction portion 544 of the substrate holder 540 in a state where a predetermined gap is formed with respect to the suction portion 544. The non-contact stage 536 applies a load (pre-load) to the substrate P by a combination of the ejection of the pressurized gas and the suction of the gas to the lower surface of the substrate P, and thereby performs the surface correction of the substrate P in a non-contact state (a state in which the relative movement along the horizontal plane is not hindered).

Further, from the lower surface of fine movement stage 32, a plurality of guide plates 548 (4 in the present embodiment) radially extend along the horizontal plane. The substrate holder 540 has a plurality of pads 546 including air bearings corresponding to the plurality of guide plates 548, and is placed on the guide plates 548 in a non-contact state by the static pressure of the pressurized gas ejected from the air bearings onto the upper surfaces of the guide plates 548. Fine movement stage 32 is slightly driven in the Z tilt direction with respect to coarse X movement stage 24, unlike in the above-described embodiments 1 to 5. At this time, since the plurality of guide plates 548 also move in the Z tilt direction (change in posture) integrally with the fine movement stage 32, when the posture of the fine movement stage 32 changes, the posture of the fine movement stage 32, the noncontact stage 536, and the substrate holder 540 (i.e., the substrate P) changes integrally.

The substrate holder 540 is driven to a 3-degree-of-freedom direction in a horizontal plane with respect to the fine movement stage 32 by a fine movement via a plurality of linear motors 552 (voice coil motors) including a movable element provided in the substrate holder 540 and a fixed element provided in the fine movement stage 32. Further, when the fine movement stage 32 moves in a long stroke along the XY plane, a thrust force is applied to the substrate holder 540 by the plurality of linear motors 552 so that the fine movement stage 32 and the substrate holder 540 can move in a long stroke along the XY plane integrally.

The target 38 is fixed to the substrate holder 540 through the bracket 38a, as in embodiment 1. The main controller 50 (see fig. 4) measures the amount of change in the posture of the substrate holder 540 (i.e., the substrate P) using the plurality of sensor heads 78 (see fig. 1 and the like) that irradiate the target 38 with the measurement light, as in the above-described embodiment 1. The configuration of the measurement system including the arrangement of the plurality of sensor heads 78 and the Z tilt position of the substrate P can be modified in the same manner as in the above-described embodiments 2 to 5. In embodiment 6, the target 38 is fixed to the substrate holder 540 through the bracket 38a, but the present invention is not limited thereto, and the target 38 (and the scale plate 340) may be directly attached to the upper surface of the substrate holder 540, or the upper surface of the substrate holder 540 may be mirror-finished so as to have a function equivalent to that of the target.

The structure described in each of embodiments 1 to 6 can be modified as appropriate. For example, in each of the above embodiments, the sensor head 78 (downward head) for obtaining Z tilt position information of the substrate P irradiates the measurement light onto the reflection surface of the target 38(138, 238) mounted on the substrate holder 36, but the form of the target is not limited thereto, and the measurement light may be reflected by the substrate P (that is, the substrate P itself may function as a target) as long as the measurement light irradiated from the sensor head 78 can be reflected and the change in the posture of the substrate P can be reflected. The target 38 and the like of the above embodiments may be mounted on the fine movement stage 32.

In the above embodiments, the sensor head 78 is configured to move in the Y-axis direction (downward head) with respect to the target 38 extending in the X-axis direction (scanning direction), but the present invention is not limited thereto, and the target 38 may extend in another direction (Y-axis direction), and the sensor head 78 may move in a direction perpendicular to the extending direction of the target 38 in the horizontal plane.

In each of the above embodiments, substrate stage device 20 has target 38 extending in the X-axis direction, and sensor head 78 attached to device main body 18 moves in the Y-axis direction in synchronization with target 38, but substrate stage device 20 may have sensor head 78, and target 38 attached to device main body 18 moves in the Y-axis direction in synchronization with sensor head 78. In this case, the attitude change of the target 38 may be measured, and the output of the sensor head 78 may be corrected based on the measured attitude change.

In the above embodiments, the weight cancellation device 28 is mounted on the Y step guide 30 of the movable stage that is movable in the Y axis direction, but the present invention is not limited thereto, and the weight cancellation device 28 may be mounted on a fixed stage having a guide surface that covers the entire movement range of the weight cancellation device 28 in the XY plane.

The wavelength of the light source used in the illumination system 12 and the illumination light IL emitted from the light source are not particularly limited, and may be ultraviolet light such as ArF excimer laser light (wavelength 193nm) and KrF excimer laser light (wavelength 248nm), or F₂Vacuum ultraviolet light such as laser light (wavelength 157 nm).

In the above embodiments, the projection optical system 16 is used in an equal magnification system, but is not limited to this, and a reduction system or an enlargement system may be used.

The exposure apparatus is not limited to an exposure apparatus for liquid crystal that transfers a liquid crystal display device pattern to a square glass plate, and can be widely applied to an exposure apparatus for manufacturing an organic EL (Electro-Luminescence) panel, an exposure apparatus for manufacturing a semiconductor, and an exposure apparatus for manufacturing a thin film magnetic head, a micromachine, a DNA chip, and the like. Further, not only microdevices such as semiconductor devices, but also exposure apparatuses that transfer a circuit pattern to a glass substrate, a silicon wafer, or the like for manufacturing a reticle or a mask used in a light exposure apparatus, an EUV exposure apparatus, an X-ray exposure apparatus, an electron beam exposure apparatus, or the like are also applicable.

The object to be exposed is not limited to a glass plate, but may be another object such as a wafer, a ceramic substrate, a film member, or a reticle (photomask blank). When the exposure target is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and the substrate may be, for example, a film (flexible sheet member). The exposure apparatus of the present embodiment is particularly effective when the exposure object is a substrate having a side length or diagonal length of 500mm or more. In the case where the substrate to be exposed is a flexible sheet, the sheet may be formed into a roll shape.

An electronic device such as a liquid crystal display device (or a semiconductor device) is manufactured through a step of designing the functional performance of the device, a step of fabricating a mask (or a reticle) based on the designing step, a step of fabricating a glass substrate (or a wafer), a photolithography step of transferring the pattern of the mask (reticle) to the glass substrate by the exposure apparatus and the exposure method thereof according to the above embodiments, a development step of developing the exposed glass substrate, an etching step of removing the exposed member except for the remaining resist portion by etching, a resist removal step of removing the unnecessary resist after etching, a device assembly step, an inspection step, and the like. In this case, since the exposure method is performed in the photolithography step using the exposure apparatus of the above embodiment to form a device pattern on a glass substrate, a device with high integration can be manufactured with good productivity.

Further, the disclosures of all U.S. patent application publications and U.S. patent applications relating to exposure apparatuses and the like cited in the above embodiments are incorporated as a part of the present specification.

Industrial applicability

As described above, the mobile body apparatus and the measurement method according to the present invention are suitable for obtaining position information of a mobile body. The exposure apparatus of the present invention is suitable for exposing an object. In addition, the manufacturing method of the flat panel display is suitable for manufacturing the flat panel display. Furthermore, the device manufacturing method of the present invention is suitable for the manufacture of microcomponents.

[ notation ] to show

10: liquid crystal exposure device

20: substrate carrying platform device

36: substrate holder

70: z tilt position measuring system for substrate stage

72a, 72 b: reading head unit

74: y-shaped linear actuator

76: y slide

78: sensor head

P: a substrate.

Claims

1. A mobile device is provided with:

a 1 st moving body that holds an object and is movable in a 1 st direction;

a reference member that is a reference of movement of the 1 st mobile body;

a 2 nd movable body which is disposed between the 1 st movable body and the reference member in the vertical direction, is provided so as to face the 1 st movable body, and is movable in the 1 st direction;

a 1 st measurement system that obtains positional information of the 2 nd movable body with respect to the reference member in the 1 st direction; and

a 2 nd measurement system including an encoder head provided on one of the 1 st and 2 nd moving bodies and a diffraction grating provided on the other of the 1 st and 2 nd moving bodies, the encoder head irradiating a measuring beam onto the diffraction grating to measure a position of the 1 st moving body in the 1 st direction with respect to the 2 nd moving body and measuring a position of the 1 st moving body in the up-down direction based on return light from the diffraction grating of the measuring beam;

the moving body device obtains position information of the 1 st moving body in a 2-dimensional plane according to the outputs of the 1 st measurement system and the 2 nd measurement system;

the 2 nd measurement is performed by moving the 2 nd moving body in the 1 st direction so as to face the 1 st moving body with respect to the 1 st moving body moving in the 1 st direction;

the 1 st measurement is performed by moving the 2 nd movable body in the 1 st direction with respect to the reference member so as to face the reference member.

2. The movable body apparatus according to claim 1 wherein the 2 nd movable body moves in the 1 st direction with respect to the 1 st movable body so that the measurement beam does not escape from the diffraction grating.

3. The movable body apparatus according to claim 1 or 2 wherein the encoder head is provided to the 2 nd movable body;

the 2 nd measurement system compensates for a measurement error in the 1 st direction caused by driving of the encoder head provided to the 2 nd movable body in the 1 st direction, and measures a position of the 1 st movable body in the 1 st direction.

4. The movable body apparatus according to claim 1 or 2 wherein the diffraction grating has a length that can measure a movable range of the 1 st movable body in a 2 nd direction intersecting the 1 st direction.

5. The movable body apparatus according to claim 4 wherein the 1 st movable body moves in the 2 nd direction so that the measuring beam does not escape from the diffraction grating.

6. The movable body apparatus according to claim 4 wherein the 2 nd measurement is performed without changing a position of the 2 nd movable body in the 2 nd direction when the 1 st movable body moves in the 2 nd direction.

7. The movable body apparatus according to claim 4 wherein the encoder head is provided in plurality;

the positions of the measuring points of the diffraction gratings by the plurality of encoder readheads are different in the 2 nd direction.

8. The movable body apparatus according to claim 1 or 2 further comprising a support portion that supports the object in a non-contact manner;

the 1 st moving body holds the object supported by the support portion in a non-contact manner.

9. An exposure apparatus includes:

the mobile body apparatus according to any one of claims 1 to 8; and

and a patterning device configured to form a predetermined pattern on the object held by the 1 st moving body using an energy beam.

10. The exposure apparatus according to claim 9, wherein the object is a substrate for a flat panel display.

11. The exposure apparatus according to claim 10, wherein at least one side or diagonal of the substrate has a length of 500mm or more.

12. A method for manufacturing a flat panel display, comprising:

a step of exposing the object using the exposure apparatus according to any one of claims 9 to 11; and

and developing the exposed object.

13. A method of manufacturing a component, comprising:

and developing the exposed object.