TWI841764B - Movable body apparatus, exposure apparatus, manufacturing method of flat panel display and device manufacturing method, and measurement method - Google Patents

Abstract

The present invention is a measurement system for obtaining position information of a substrate holder (36) that can move in a direction parallel to an XY plane in the Z-axis direction, comprising: a Y slide (76) that is arranged opposite to the substrate holder (36) and can move synchronously with the substrate holder (36) in the Y-axis direction, a sensor head (78) arranged on the Y slide (76), and a control system that controls the Y slide (76) and uses a target (38) that is arranged on the substrate holder (36) and extends in the X-axis direction to obtain position information of the substrate holder (36) in the Z-axis direction through the sensor head (78).

Description

Moving body device, exposure device, flat panel display manufacturing method, element manufacturing method, and measurement method

The present invention relates to a moving body device, an exposure device, a manufacturing method of a flat panel display, a component manufacturing method, and a measuring method.

In the lithography process for manufacturing electronic components (micro components) such as liquid crystal display components and semiconductor components (integrated circuits, etc.), a step-and-scan exposure device (so-called scanning stepper (also called scanner)) is used to synchronously move a mask (mask) or a reticle (hereinafter, collectively referred to as a "mask") and a glass plate or a wafer (hereinafter, collectively referred to as a "substrate") along a predetermined scanning direction while transferring a pattern formed on the mask to the substrate using an energy beam (for example, refer to Patent Document 1).

In such an exposure device, in order to image the pattern formed on the mask on the substrate with high resolution, the surface position of the substrate (for example, position information of the substrate surface in a direction intersecting the horizontal plane) is measured and automatic focus control is performed to automatically position the surface position of the substrate within the focal depth of the projection optical system.

At this time, in order to accurately perform autofocus control, it is best to be able to measure the surface position of the substrate with high precision.

[Patent Document 1] U.S. Patent Application Publication No. 2010/0266961

The first aspect of the present invention provides a moving body device, comprising: a first moving body, which holds an object and can move in a first direction; a second moving body, which is arranged opposite to the first moving body and can move in the first direction; and a measuring unit, which has a measuring system arranged on one of the first and second moving bodies, and a measured system arranged on the other moving body, the measuring system irradiates a measuring light beam to the measured system to measure the position of the first moving body in the up and down directions; the measuring unit, relative to the first moving body moving in the first direction, moves the second moving body in the first direction in a manner opposite to the first moving body to perform measurement.

The second aspect of the present invention provides a moving body device, which comprises: a first moving body, which holds an object and can move in a first direction; a second moving body, which is arranged opposite to the first moving body and can move in the first direction; and a measuring part, which has a measuring system arranged on one of the first and second moving bodies, and a measured system arranged on the other moving body, and the measuring system irradiates a measuring light beam to the measured system to measure the position of the first moving body in the up and down directions.

A third aspect of the present invention provides an exposure device comprising any one of the moving body device of the first aspect and the moving body device of the second aspect, and a pattern forming device for forming a predetermined pattern on an object held by the first moving body using an energy beam.

The fourth aspect of the present invention provides a method for manufacturing a flat panel display, which includes: exposing the object using the exposure device of the third aspect; and developing the exposed object.

The fifth aspect of the present invention provides a device manufacturing method, which includes: exposing the object using the exposure device of the third aspect; and developing the exposed object.

The sixth aspect of the present invention provides a measurement method, comprising: irradiating a measurement beam from a measurement system disposed on one of the first and second moving bodies to a measured system disposed on a first moving body that holds an object and can move in a first direction, so as to measure the movement of the first moving body's position in a vertical direction; in the measurement movement, the second moving body moves in the first direction relative to the first moving body in a manner opposite to the first moving body that moves in the first direction, and the measurement is performed.

《First Implementation Form》 The following will explain the first implementation form using Figures 1 to 6 (b).

Fig. 1 schematically shows the structure of a liquid crystal exposure device 10 of the first embodiment. The liquid crystal exposure device 10 is a projection exposure device of a step-and-scan method, a so-called scanner, which uses a rectangular (square) glass substrate P (hereinafter referred to as substrate P) used in a liquid crystal display device (flat panel display) or the like as an exposure object.

The liquid crystal exposure device 10 comprises an illumination system 12, a mask stage device 14 for holding a mask M on which a circuit pattern or the like is formed, a projection optical system 16, a device body 18, a substrate stage device 20 for holding a substrate P on the surface of which a photoresist (sensing agent) is applied (the surface facing the +Z side in FIG. 1), and a control system thereof, etc. In the following, the directions in which the mask M and the substrate P are scanned by the projection optical system 16 during exposure are respectively defined as the X-axis direction, the direction orthogonal to the X-axis in the horizontal plane is defined as the Y-axis direction, the direction orthogonal to the X-axis and the Y-axis is defined as the Z-axis direction, and the directions of rotation around the X-axis, the Y-axis, and the Z-axis are defined as the θx, θy, and θz directions, respectively. In addition, positions in the X-axis, Y-axis, and Z-axis directions are referred to as X position, Y position, and Z position, respectively, for explanation.

The illumination system 12 has the same configuration as the illumination system disclosed in the specification of U.S. Patent No. 5,729,331. The illumination system 12 transmits light emitted from a light source (such as a mercury lamp) not shown in the figure through a reflective mirror, a dichroic mirror, a curtain, a filter, various lenses, etc. not shown in the figure, and irradiates the mask M as exposure illumination light (illumination light) IL. The illumination light IL uses, for example, i-line (wavelength 365nm), g-line (wavelength 436nm), h-line (wavelength 405nm) and the like (or a composite light of the above i-line, g-line, and h-line).

The mask stage 14 holds a light-transmitting mask M. The main control device 50 (see FIG. 4 ) drives the mask stage 14 (i.e., the mask M) relative to the illumination system 12 (illumination light IL) in the X-axis direction (scanning direction) with a predetermined length stroke through the mask stage driving system 52 (see FIG. 4 ) including a linear motor, and drives it slightly in the Y-axis direction and the θz direction. The position information of the mask stage 14 in the horizontal plane is obtained by the mask stage position measurement system 54 (see FIG. 4 ) including a laser interferometer.

The projection optical system 16 is disposed below the photomask stage device 14. The projection optical system 16 is a so-called multi-lens projection optical system having the same structure as the projection optical system disclosed in the specification of U.S. Patent No. 6,552,775, etc., and has a plurality of optical systems that form an erect image with, for example, two telecentric equal-magnification systems. The optical axis AX of the illumination light IL projected from the projection optical system 16 to the substrate P is parallel to the Z axis.

In the liquid crystal exposure device 10, when the illumination light IL from the illumination system 12 illuminates the mask M in a predetermined illumination area, the illumination light passing through the mask M forms a projection image (partial erect image) of the mask M in the illumination area through the projection optical system 16 to form an exposure area on the substrate P. The mask M is moved in a scanning direction relative to the illumination area (illumination light IL) and the substrate P is moved in a scanning direction relative to the exposure area (illumination light IL), thereby performing a scanning exposure of an irradiation (shot) area on the substrate P, and the pattern formed on the mask M (the entire pattern corresponding to the scanning range of the mask M) is transferred in the irradiation area. Here, the illumination area on the mask M and the exposure area (irradiation area of the illumination light) on the substrate P are optically conjugated to each other through the projection optical system 16.

The device body 18 is a part that supports the above-mentioned mask carrier 14 and the projection optical system 16, and is installed on the floor F of the clean room through a plurality of anti-vibration devices 18d. The device body 18 has the same structure as the device body disclosed in the specification of U.S. Patent Application Publication No. 2008/0030702, and has an upper stand 18a (also called an optical platform, etc.) that supports the above-mentioned projection optical system 16, a pair of lower stand 18b (in FIG. 1, one of them is not shown because they overlap in the depth direction of the paper surface. Refer to FIG. 2), and a pair of middle stand 18c.

The substrate stage device 20 is a part for positioning the substrate P with high precision relative to the projection optical system 16 (illumination light IL), and drives the substrate P along the horizontal plane (X-axis direction and Y-axis direction) with a predetermined long stroke and slightly drives it in the 6-degree-of-freedom direction. Although the structure of the substrate stage device 20 is not particularly limited, it is preferably a stage device with a so-called coarse and fine motion structure including a 2D coarse motion stage and a fine motion stage slightly driven relative to the 2D coarse motion stage as disclosed in, for example, U.S. Patent Application Publication No. 2008/129762 or U.S. Patent Application Publication No. 2012/0057140.

The substrate stage device 20 in the first embodiment, for example, is a stage device having a coarse and fine motion structure including a plurality of (three in the present embodiment) bases 22 (overlapping in the depth direction of the paper in FIG. 1 ; see FIG. 2 ), a Y coarse motion stage 24, an X coarse motion stage 26, a weight compensation device 28, a Y stepping guide 30, a fine motion stage 32, a substrate holder 36, and the like.

The base 22 is composed of a member extending in the Y-axis direction, and is placed on the ground F in a vibration-insulated state from the device body 18. Three bases 22 are arranged at predetermined intervals in the X-axis direction (see FIG. 2 ).

As shown in FIG2 , the Y coarse motion stage 24 is mounted on three bases 22. The Y coarse motion stage 24 has three Y brackets 24a corresponding to the above-mentioned bases 22, and a pair (one of which is not shown in FIG2 , refer to FIG1 ) of X beams 24b mounted on the three Y brackets 24a. The Y coarse motion stage 24 is driven in the Y-axis direction with a predetermined long stroke on the three bases 22 through a plurality of Y actuators 24c that are part of a substrate stage driving system 56 (not shown in FIG2 , refer to FIG4 ) for driving the substrate P in the 6-degree-of-freedom direction. In addition, the Y coarse motion stage 24 is linearly guided in the Y-axis direction through a linear guide device 24d disposed between the Y coarse motion stage 24 and the base 22.

Returning to FIG. 1 , the X coarse motion stage 26 is mounted on a pair of X beams 24b. The X coarse motion stage 26 is formed of a rectangular plate-shaped member in a top view (viewed from the +Z direction), and an opening is formed in the center. The X coarse motion stage 26 is driven in the X-axis direction on the Y coarse motion stage 24 with a predetermined long stroke through a plurality of X actuators 26a that are part of the substrate stage drive system 56 (see FIG. 4 ). Furthermore, the X coarse motion stage 26 is linearly guided in the X-axis direction through a linear guide device 26b disposed between the X coarse motion stage 24 and the Y coarse motion stage 24. FIG. 2 is a diagram showing a state where the X coarse motion stage 26 is located at the end of the stroke on the +X side. Furthermore, the X coarse motion stage 26 is mechanically restricted in its relative movement in the Y-axis direction with respect to the Y coarse motion stage 24 by the linear guide device 26b, and moves in the Y-axis direction integrally with the Y coarse motion stage 24. The Y actuator 24c (see FIG. 2 ) and the X actuator 26a (see FIG. 1 ) of the substrate stage drive system 56 may use a linear motor, a feed screw (ball screw) device, or the like.

As shown in FIG. 2 , the weight offset device 28 is inserted into the opening of the X coarse motion stage 26. The weight offset device 28 is also called a core column, and supports the weight of the fine motion stage 32 and the system including the substrate holder 36 from below. The details of the weight offset device 28 are disclosed in the specification of U.S. Patent Application Publication No. 2010/0018950, so the description thereof is omitted. The weight offset device 28 is mechanically connected to the X coarse motion stage 26 through a plurality of connecting devices 28a (also called flexure devices), and is pulled by the X coarse motion stage 26 to move integrally with the X coarse motion stage 26 along the XY plane.

The Y step guide 30 is a part of the platform when the weight compensation device 28 moves. The Y step guide 30 is composed of a component extending in the X-axis direction, and is mounted on a pair of lower platform parts 18b of the device body 18 through a plurality of linear guide devices 30a. The Y step guide 30 is inserted between a pair of X beams 24b of the Y coarse motion stage 24 (refer to Figure 1), and is mechanically connected to the Y coarse motion stage 24 through a plurality of connecting devices 30b (not shown in Figure 2. Refer to Figure 1). Accordingly, the Y step guide 30 moves in the Y-axis direction with a predetermined long stroke as a whole with the Y coarse motion stage 24. The weight offset device 28 is mounted on the Y step guide 30 in a non-contact state through the air bearing 28b. When the X coarse motion stage 26 moves only in the X-axis direction on the Y coarse motion stage 24, the weight offset device 28 moves in the X-axis direction on the Y step guide 30 in a stationary state. When the X coarse motion stage 26 and the Y coarse motion stage 24 move in the Y-axis direction as a whole (including the case of accompanying the movement in the X-axis direction), the weight offset device 28 moves in the Y-axis direction as a whole (to avoid falling off from the Y step guide 30).

The fine motion stage 32 is composed of a rectangular plate (or box) component in a top view, and is supported by a weight offset device 28 from below in a non-contact state (a state in which it can move relatively along the XY plane) in a state in which the central part can swing (tilt) freely relative to the XY plane through a spherical bearing device 34. A substrate holder 36 is fixed on the fine motion stage 32, and a substrate P is placed on the substrate holder 36. The substrate holder 36 is formed in a rectangular plate shape in a top view, and holds the substrate P by vacuum adsorption.

The fine motion stage 32 is a part of the substrate stage driving system 56 (not shown in FIG. 1 and FIG. 2 , see FIG. 4 ), and is slightly driven in the 6-DOF direction relative to the X coarse motion stage 26 by the main control device 50 (see FIG. 4 ) through a plurality of linear motors including a stator of the X coarse motion stage 26 and a mover of the fine motion stage 32. The plurality of linear motors include a plurality of X voice coil motors 56x (not shown in FIG. 1 ), Y voice coil motors 56y (not shown in FIG. 2 ), and Z voice coil motors 56z. Furthermore, when the X coarse motion stage 26 moves along the XY plane with a long stroke, the main control device 50 applies thrust to the fine motion stage 32 through the plurality of linear motors, so that the fine motion stage 32 and the X coarse motion stage 26 move along the XY plane with a long stroke as a whole. The structure of the substrate stage device 20 described above including the substrate stage drive system 56 (excluding the measurement system) is disclosed in the specification of U.S. Patent Application Publication No. 2012/0057140, etc.

The position measurement system of the fine-motion stage 32 (i.e., the substrate P), as shown in FIG4 , includes a substrate stage horizontal plane position measurement system 58 (hereinafter referred to as the "horizontal plane position measurement system 58") for obtaining the position information of the substrate in the XY plane (including the rotation information in the θz direction), and a substrate stage Z tilt position measurement system 70 (hereinafter referred to as the "Z tilt position measurement system 70") for obtaining the position information of the substrate in a direction intersecting the horizontal plane (position information in the Z-axis direction, rotation information in the θx and θy directions. hereinafter referred to as the "Z tilt position information").

As the horizontal plane position measurement system 58, although not shown, an optical interferometer system using rod-shaped mirrors (Y rod-shaped mirrors extending parallel to the X axis and X rod-shaped mirrors extending parallel to the Y axis) fixed to the fine motion stage 32 and the substrate holder 36 (refer to FIG. 1 , respectively) can be adopted. The details of the position measurement system using the optical interferometer system are disclosed in the specification of U.S. Patent Application Publication No. 2010/0018950, etc., and therefore the description thereof is omitted.

As shown in FIG1 , the Z tilt position measurement system 70 has a pair of read head units (read head units 72a and 72b). One read head unit 72a is arranged on the +Y side of the projection optical system 16, and the other read head unit 72b is arranged on the -Y side of the projection optical system 16 (see FIG2 ). The read head units 72a and 72b are substantially the same devices except for their different configurations.

The head units 72a and 72b use a pair of targets 38 (target components) provided in the substrate stage device 20 to measure the Z tilt position information of the substrate P. One of the pair of targets 38 is arranged on the +Y side of the substrate holder 36, and the other is arranged on the -Y side of the substrate holder 36. The interval between the pair of targets 38 in the Y-axis direction is set to be substantially the same as the interval between the head units 72a and 72b in the Y-axis direction.

As can be seen from Figures 1 and 2, the target 38 is composed of a plate-like (strip-like) member extending in the X-axis direction and parallel to the XY plane. The top surface of the target 38 is a reflective surface. As the target 38, a plane mirror or the like can be used. The length of the target 38 in the X-axis direction is set to be longer than the length of the substrate holder 36 (and the substrate P) in the X-axis direction. In this embodiment, it is set to be about 1.1 to 2 times the length of the substrate holder 36 in the X-axis direction. In addition, the length of the target 38 can also be shorter than the length of the substrate holder 36 in the X-axis direction. For example, a plurality of targets 38 whose length in the X-axis direction is shorter than that of the substrate holder 36 can be set corresponding to the location and timing of measuring the Z tilt position information.

The target 38 is mounted on the side of the substrate holder 36 through the bracket 38a in such a way that the height position of the upper surface (the position in the Z-axis direction) is roughly the same as the height position of the surface of the substrate P mounted on the substrate holder 36. Therefore, when the substrate holder 36 is driven in a direction intersecting the horizontal plane (moving in the direction of the optical axis AX and in a direction inclined relative to the horizontal plane), the pair of targets 38 move in the direction intersecting the horizontal plane together with the substrate holder 36. Accordingly, the posture change of the substrate P mounted on the substrate holder 36 is reflected on the upper surface (reflection surface) of the target 38. In addition, although the target 38 is mounted on the side of the substrate holder 36 in FIG. 1 and FIG. 2 , the location of the target 38 is not particularly limited as long as it can reflect the change in the posture of the substrate P. The target 38 can be fixed on the fine motion stage 32 or directly mounted on the substrate holder 36. In addition, at least a portion of the surface of the substrate holder 36, the fine motion stage 32, the substrate P, etc. can be used as the target 38 to measure the Z tilt position information. That is, at least a portion of the surface of the substrate holder 36, the fine motion stage 32, the substrate P, etc. can have the same function as the target 38. In this way, even if the target 38 is not set, the structure of the substrate stage device 20 can be simplified.

Next, the head units 72a and 72b are described. As shown in FIG1 , the head unit 72a includes a Y linear actuator 74, a Y slide 76 driven by the Y linear actuator 74 with a predetermined stroke in the Y axis direction relative to the projection optical system 16 (and the device body 18), and a pair of sensor heads 78 fixed to the Y slide 76 (overlapping in the paper depth direction in FIG1 ; see FIG2 ). The head unit 72b is the same.

The Y linear actuator 74 (driving mechanism) is fixed to the bottom of the upper stand 18a of the device body 18. The Y linear actuator 74 has a linear guide for guiding the Y slider 76 in the Y-axis direction and a driving system for applying thrust to the Y slider 76. The type of the linear guide is not particularly limited, but an air bearing with high repeatability is preferred. The type of the driving system is also not particularly limited, and a linear motor, a belt (or metal wire) driving device, etc. can be used.

The Y linear actuator 74 is controlled by the main control device 50 (see FIG. 4 ). The main control device 50 controls the Y linear actuator 74 so that the moving direction, moving amount and moving speed of the Y slide 76 in the Y axis direction are substantially the same as the moving direction, moving amount and moving speed of the substrate P (micro-motion stage 32) in the Y axis direction. In addition, although not shown in FIG. 1 and FIG. 2 , the main control device 50 obtains the position information of the Y slide 76 relative to the device body 18 (i.e., the projection optical system 16) through the Y slide position measurement system 80 (see FIG. 4 ). The Y slide position measurement system 80 may be a measurement system such as a linear encoder system, or may be based on an input signal to the Y linear actuator 74.

A pair of sensor heads 78 are installed separately in the X-axis direction under the Y slide 76 (see FIG. 2 ). As shown in FIG. 3 , the pair of sensor heads 78 are arranged to face the target 38 and face downward (in the −Z direction). In the present embodiment, a laser displacement meter is used as the sensor head 78 , for example, but the type of the sensor head 78 is not particularly limited as long as it can measure the displacement of the target 38 in the Z-axis direction based on the device body 18 (see FIG. 1 ) with the desired accuracy (resolution) and in a non-contact manner.

Here, since the pair of sensor heads 78 of each read head unit 72a, 72b are separated in the X-axis direction, the main control device 50 (refer to FIG. 4 ) can obtain the Z-axis direction position (displacement) information of the corresponding target 38 based on the average value of the output of the pair of sensor heads 78, and can obtain the θy direction tilt amount information of the target 38 based on the difference of the output of the pair of sensor heads 78. In addition, since the read head units 72a, 72b (and the corresponding target 38) are separated in the Y-axis direction, the main control device 50 can obtain the θx direction tilt amount information of the substrate holder 36 (refer to FIG. 1 ) based on the output of the total of four sensor heads 78 of the read head units 72a, 72b that are not on the same straight line. In addition, when obtaining the Z-axis direction position (displacement) information of the target 38, it can be obtained based on the output of one sensor head in the pair of sensor heads 78.

FIG4 shows a block diagram of the input/output relationship of a main control device 50 that coordinates and controls each component of the liquid crystal exposure device 10 (see FIG1 ) with the control system as the core. The main control device 50 includes a workstation (or microcomputer) and the like, and coordinates and controls each component of the liquid crystal exposure device 10.

The liquid crystal exposure device 10 (see FIG. 1 ) constructed in the above manner is managed by the main control device 50 (see FIG. 4 ), and the mask M is loaded onto the mask stage 14 by the mask loader (not shown), and the substrate P is loaded onto the substrate stage device 20 (substrate holder 36) by the substrate loader (not shown). After that, the main control device 50 uses the alignment detection system (not shown) to perform alignment measurement. After the alignment measurement is completed, the exposure operation of the step & scan method is performed successively on the plurality of irradiation areas set on the substrate P.

During the above-mentioned scanning exposure operation, the main control device 50 (see FIG. 4 ) performs positioning control (so-called auto focus control) of the Z tilt direction of the substrate P in such a manner that the irradiation area (exposure area) of the illumination light IL (see FIG. 1 ) on the substrate P is automatically positioned within the focal depth of the projection optical system 16 (see FIG. 1 ) according to the output of the Z tilt position measurement system 70 (see FIG. 4 ). In addition, as the Z tilt position measurement system of the substrate P, a measurement system (known auto focus sensor) that directly measures the surface position information of the substrate P near the above-mentioned exposure area can be used in conjunction with the Z tilt position measurement system 70 of the present embodiment.

During a series of exposure operations in the step & scan method, the main control device 50 (see FIG. 4 ) drives the Y slider 76 of each of the head units 72a and 72b in the Y axis direction (see the black arrow in FIG. 5 and FIG. 6 (a) ) in synchronization with the substrate P (substrate holder 36) to move in the Y axis direction (see the +Y direction in FIG. 5 and FIG. 6 (a) ) for irradiation (see the black arrow in FIG. 5 and FIG. 6 (a) ). In this way, the Z tilt position information of the substrate P can be obtained independently of the Y position of the substrate P. At this time, since the width of the target 38 in the Y-axis direction is set to be sufficiently larger than the measurement point of the sensor head 78 on the target 38, the positions of the sensor head 78 and the substrate holder 36 in the Y-axis direction do not need to be strictly synchronized.

In contrast, as shown in FIG6(b), during a series of exposure operations of the step-scan method, when the substrate P (substrate holder 36) is moved in the X-axis direction (-X direction in FIG6(b), see the white arrow) for performing the scanning exposure operation, the main control device 50 (see FIG4) makes the Y slider 76 of each of the head units 72a and 72b in a stationary state (a state where the sensor head 78 faces the corresponding target 38) to obtain the Z tilt position information of the substrate P. In addition, when it may be difficult to ensure the flatness of the surface of the target 38 and the straightness accuracy of the Y slider 76, the above-mentioned flatness and straightness accuracy can be measured in advance to obtain correction information, and when the actual Z tilt position information is measured, the output of the sensor head 78 can be corrected according to the above-mentioned correction information.

According to the Z tilt position measuring system 70 of the first embodiment described above, since the posture change of the substrate holder 36 holding the substrate P is directly measured based on the device body 18, the Z tilt position information of the substrate P can be obtained with high accuracy. Here, although it is conceivable to install a measuring sensor on the substrate holder 36 and obtain the posture change of the substrate holder 36 based on the weight compensation device 28 (that is, the Y step guide 30), since the weight compensation device 28 (and the Y step guide 30) are configured to move along the XY plane, the measurement accuracy may be reduced. In contrast, the Z tilt position measurement system 70 of the present embodiment is based on the upper stage 18a on which the projection optical system 16 is mounted, and can therefore measure the posture change of the substrate P with high precision regardless of the movement of the substrate stage device 20.

In addition, the Z tilt position measurement system (autofocus sensor) that directly measures the surface position information of the substrate P near the above-mentioned exposure area, as shown in Figure 2, when the substrate holder 36 is located at the end of the stroke in the X-axis direction, since the substrate P is not below the projection optical system 16, the Z tilt position information of the substrate P cannot be obtained. However, by using the Z tilt position measurement system 70 of this embodiment, the Z tilt position information of the substrate P can be obtained regardless of the X-axis position of the substrate holder 36.

《Second Implementation》 Next, the second implementation is described using FIG. 7 and FIG. 8 . The configuration of the second implementation is the same as that of the first implementation except that the configuration of the measurement system for obtaining the Z tilt position information of the substrate P is different. Therefore, only the differences are described below. For elements having the same configuration and function as the first implementation, the same symbols as those of the first implementation are assigned and their description is omitted.

Compared to the Z-tilt position measurement system 70 of the first embodiment (see FIG. 6 (a) etc.), one read head unit (read head units 72a, 72b) is respectively arranged on the +Y side and the -Y side of the projection optical system 16. In the Z-tilt position measurement system 170 of the second embodiment, as shown in FIG. 8 , two read head units 172a, 172c are arranged on the +Y side of the projection optical system 16, and two read head units 172b, 172d are also arranged on the -Y side of the projection optical system 16. That is, the main control device 50 (refer to FIG. 4 ) uses two head units 72a and 72b (i.e., a total of four sensor heads 78) in the first embodiment to obtain the Z tilt position information of the substrate P. In contrast, in the second embodiment, four head units 172a to 172d (i.e., a total of eight sensor heads 78) are appropriately used to obtain the Z tilt position information of the substrate P. The configuration of the head units 172a to 172d is the same as that of the head units 72a and 72b in the first embodiment, so the description thereof is omitted.

As shown in FIG. 2 and FIG. 6 (a), the X positions of the two read head units 72a and 72b in the first embodiment are substantially the same as the X position of the projection optical system 16. As shown in FIG. 8, in the second embodiment, the two read head units 172a and 172c on the +Y side of the projection optical system 16, one of which (the read head unit 172a) is arranged on the +X side of the projection optical system 16, and the other (the read head unit 172c) is arranged on the -X side (i.e., the front side and the inner side in the scanning direction) of the projection optical system 16. The same is true for the two read head units 172b and 172d on the -Y side of the projection optical system 16. Thus, in the second embodiment, four head units 172a to 172d are arranged around the projection optical system 16. In addition, although the target 138 having a reflection surface extending in the X-axis direction is fixed to the substrate holder 36 via the bracket 138a, it is the same as the first embodiment, but in the second embodiment, the X-axis dimension of the target 138 is shorter than that of the first embodiment.

The operation of each reading head unit 172a to 172d during the scanning exposure operation in the second embodiment is substantially the same as that in the first embodiment, and thus the description thereof is omitted. That is, the main control device 50 (see FIG. 4 ) causes the Y slide 76 of each read head unit 172a to 172d to move in the Y-axis direction (see the black arrow in FIG. 8 ) synchronously with the movement of the substrate holder 36 (substrate P) in the Y-axis direction (see the white arrow in FIG. 8 ), and at the same time obtains the Z tilt position information of the substrate P based on the output of the sensor head 78 possessed by at least two of the four read head units 172a to 172d (the read head unit 172a and the read head unit 172b, or the read head unit 172c and the read head unit 172d, or all the read head units 172a to 172d).

The Z tilt position measuring system 170 of the second embodiment described above is configured with two read head units (read head units 172a, 172b, and read head units 172c, 172d) separated in the Y-axis direction on the +X side and the -X side of the projection optical system 16, respectively. Therefore, compared with the first embodiment described above, the detection area in the X-axis direction is longer. Therefore, as shown in FIG. 7, compared with the first embodiment described above (refer to FIG. 2), the length of the target 138 in the X-axis direction can be made shorter. In this way, the micro-motion stage 32 can be made lighter, so the position controllability of the substrate P can be improved.

《Third Implementation》 Next, the third implementation is described using FIGS. 9 to 11 . The third implementation is identical to the first or second implementation except for the measurement system for obtaining the Z tilt position information of the substrate P. Therefore, only the differences are described below. Elements having the same structure and function as the first or second implementation are given the same symbols as those of the first or second implementation and their description is omitted.

The Z tilt position measuring system 270 of the third embodiment is different from the first and second embodiments in that the tilt amount information of the Y slide 76 with the sensor head 78 relative to the horizontal plane (XY plane) is obtained by the main control device 50 (see FIG. 4 ). The main control device 50 obtains the Z tilt position information of the substrate P based on the output of the sensor head 78 and the tilt amount information of the Y slide 76 at the time of the output (that is, while correcting the tilt of the Y slide 76).

In addition, in the third embodiment, four head units 272a to 272d are arranged in the same configuration as the second embodiment (i.e., around the projection optical system 16) (see Fig. 9 and Fig. 11). The four head units 272a to 272d are substantially the same except for the different configurations. In addition, without limitation thereto, two head units may be arranged in the same configuration as the first embodiment (i.e., at the same X position as the projection optical system 16). In this case, as in the first embodiment, a target 38 having a size in the X-axis direction longer than the target 138 is used (see Fig. 2, etc.).

As shown in FIG. 10 , the head unit 272a (the same applies to the head units 272b to 272d) is the same as the second embodiment described above, and has a pair of sensor heads 78 (downward facing head) separated in the X-axis direction for irradiating the target 138 (toward the -Z direction) with measurement light. The method of obtaining the Z tilt position information of the substrate P using the four head units 272a to 272d each having a pair of sensor heads 78 (a total of eight) is the same as the second embodiment described above, so the description is omitted.

Here, in the read head unit 272a, the Y slide 76 (not shown in FIG. 10 , refer to FIG. 9 ) on which the sensor head 78 is mounted is guided in the Y-axis direction by a linear guide device, and the sensor head 78 (the optical axis of the target 138 corresponding to the measuring light) may be tilted and displaced in Z. Therefore, the main control device 50 (refer to FIG. 4 ) uses the four sensor heads 278 (upward read heads) mounted on the Y slide 76 to obtain information about the tilt (tilt) amount of the Y slide 76 (including information about the displacement amount in the optical axis direction), and corrects the output of the two sensor heads 78 based on the output of the four sensor heads 278 to offset the tilt of the Y slide 76 (the displacement of the optical axis of the measuring light). Furthermore, in the fourth embodiment, the four sensor heads 278 (upward reading heads) are arranged at four positions that are not on the same straight line, but the present invention is not limited to this, and the three sensor heads 278 may be arranged at three positions that are not on the same straight line.

In this embodiment, as the sensor head 278 (upward sensor), for example, a laser displacement meter similar to the sensor head 78 is used, and the information related to the inclination amount of the Y slider 76 is obtained using a target 280 (that is, based on the upper platform 18a) fixed below the upper platform 18a (refer to Figures 9 and 11) and extending in the Y-axis direction. In addition, the type of the sensor head 278 is not particularly limited as long as the information on the inclination amount of the Y slider 76 can be obtained with a desired accuracy.

According to the third embodiment described above, the Z tilt information of the substrate P can be obtained with higher accuracy. In addition, since the output of the sensor head 78 (downward reading head) is corrected, the straight-line guidance accuracy of the Y slider 76 can be rougher than that of the first and second embodiments described above.

《Fourth Implementation》 Next, the liquid crystal exposure device of the fourth implementation is described using FIG. 12 and FIG. 13. The Z tilt position measurement system 370 in the fourth implementation is shown in FIG. 12. It has a read head unit 372a disposed on the +Y side of the projection optical system 16 and a read head unit 372b disposed on the -Y side of the projection optical system 16, as in the first implementation. In addition, a pair of targets 338 are mounted on the substrate holder 36 corresponding to the read head units 372a and 372b. The length of the target 338 in the X-axis direction is the same as that of the first implementation.

As shown in FIG13, the head unit 372a, like the third embodiment (see FIG10), has a pair of sensor heads 78 (downward reading heads) for obtaining Z tilt position information of the substrate P (see FIG12), and four sensor heads 278 (upward reading heads) for measuring tilt amount information of the pair of sensor heads 78. The procedure for obtaining Z tilt position information of the substrate P using the sensor heads 78 and 278 is the same as that of the third embodiment, so the description thereof is omitted.

Furthermore, the liquid crystal exposure apparatus of the fourth embodiment has an encoder system as a horizontal plane position measurement system 58 (see FIG. 4 ) for obtaining position information of the substrate P in the horizontal plane. Hereinafter, the third embodiment will be described with reference to the encoder system, and elements having the same configuration and function as those of the first to third embodiments are given the same reference numerals as those of the first to third embodiments, and their descriptions are omitted.

As shown in FIG. 12 , the head unit 372a includes a Y linear actuator 74, a Y slide 76 driven by the Y linear actuator 74 with a predetermined stroke in the Y-axis direction relative to the projection optical system 16, and a plurality of measuring heads fixed to the Y slide 76 (details will be described later). The head unit 372b is the same. The configuration and function of the Y linear actuator 74 and the Y slide 76 are substantially the same as the Y linear actuator 74 and the Y slide 76 of the head unit 72a of the first embodiment (see FIG. 1 ), and therefore, the description thereof is omitted.

As shown in FIG. 13 , the head unit 372a, as a part of the plurality of measuring heads, has two X encoder heads 384x (downward X heads), two Y encoder heads 384y (downward Y heads), two X encoder heads 386x (upward X heads) and two Y encoder heads 386y (upward Y heads). Also, as described above, the head unit 372a, as a part of the plurality of measuring heads, has a pair of sensor heads 78 (downward Z heads) and four sensor heads 278 (upward Z heads). Each of the above-mentioned heads 384x, 384y, 386x, 386y, 78, 278 is fixed to the Y slide 76 (refer to FIG. 12 ). In addition to being configured to be symmetrical on the paper surface in Figure 12, the head unit 372b is also configured in the same manner. In addition, a pair of targets 338 are configured to be symmetrical on the paper surface in Figure 12.

Here, in the fourth embodiment, a plurality of scale plates 340 are mounted on the target 338. The scale plate 340 is formed of a strip-shaped member extending in the X-axis direction, and is connected to the target 338. The length of the scale plate 340 in the X-axis direction is shorter than the length of the target 338 in the X-axis direction, and the plurality of scale plates 340 are arranged at a predetermined interval (separated from each other) in the X-axis direction. In addition, in the upper surface of the target 338, including the strip-shaped area near the -Y side end, the scale plate 340 is not attached. The strip-shaped area faces a pair of sensor heads 78 (downward Z reading heads), and its function is to serve as a reflection surface for measuring the Z tilt position of the substrate P, similar to the first to third embodiments described above. Furthermore, the upper surfaces of the plurality of scale plates 340 may be used as a reflective surface to measure the Z tilt position of the substrate P. Accordingly, since the strip-shaped region does not need to be provided, the structure of the target 338 can be simplified.

An X scale 342x and a Y scale 342y are formed on the scale plate 340. The X scale 342x is formed on the half area of the -Y side of the scale plate 340, and the Y scale 342y is formed on the half area of the +Y side of the scale plate 340. The X scale 342x has a reflective X diffraction grating, and the Y scale 342y has a reflective Y diffraction grating. In FIG. 13 , for ease of understanding, the scale plate 340 is shown thicker than it actually is, and the intervals (spacing) between the multiple grid lines forming the X scale 342x and the Y scale 342y are shown wider than they actually are.

The two X encoder heads 384x are arranged opposite to the X scale 342x, and irradiate the X scale 342x with measuring light. The main control device 50 (see FIG. 4 ) responds to the movement of the substrate P (see FIG. 12 ) in the X-axis direction, and obtains the displacement information of the substrate P in the X-axis direction based on the output of the X encoder head 384x from the light of the X scale 342x. The two Y encoder heads 384y are also arranged opposite to the Y scale 342y, and the main control device 50 responds to the output of the Y encoder head 384y to obtain the displacement information of the substrate P in the Y-axis direction. Furthermore, the main control device 50 obtains information on the rotation amount of the substrate P in the θz direction based on the output of the X encoder head 384x of each of the head unit 372a and the head unit 372b (see FIG. 12 ).

Here, the interval between the two X encoder heads 384x and the Y encoder heads 384y in the X-axis direction is set to be wider than the interval between the adjacent scale plates 340. Therefore, regardless of the X position of the substrate P (see FIG. 12), at least one of the two X encoder heads 384x and the Y encoder heads 384y is always facing the scale plate 340. Based on this, the main control device 50 (see FIG. 4) can obtain the position information of the substrate P based on one of the two encoder heads 384x and 384y or the average value of the two encoder heads 384x and 384y. In this embodiment, the plurality of scale plates 340 are arranged at predetermined intervals in the X-axis direction, but the present invention is not limited thereto, and a long scale plate having the same length in the X-axis direction as the target 338 may be used. In this case, the encoder read heads (downward X read head 384x, downward Y read head 384y) for obtaining the position information of the substrate P in the horizontal plane may be provided one each for each read head unit 372a, 372b.

In addition, regarding the horizontal plane position measurement system 58, when the X encoder head 384x and the Y encoder head 384y (referred to as the head set on the +X direction side) provided on the +X direction side relative to the scale plate 380 of FIG. 13 move from the first scale plate 340 to the second scale plate 340 (the scale plate 340 adjacent to the first scale plate) to measure the second scale plate 340, the head set on the +X direction side can measure the position information of the substrate P in the X-axis direction immediately after the second scale plate 340 is used to achieve a state in which the measurement action is possible, but the output of the head set on the +X direction side starts counting again from an indefinite value (or zero), and therefore cannot be used for calculating the X position information of the substrate P. Therefore, in this state, the output of each head group on the +X direction side needs to be processed. Specifically, the output of the +X direction side head group with an indefinite value (or zero) is corrected (to the same value) using the output of the X encoder head 384x and the Y encoder head 384y (referred to as the head group on the -X direction side) provided on the -X direction side relative to the scale plate 380. This processing is completed before the head group on the -X direction side reaches the outside of the measurement range of the first scale.

Similarly, when the head group on the -X direction side reaches the outside of the measurement range of the first scale plate 340, the output of the head group on the -X direction side is considered invalid before reaching the outside of the measurement range. Therefore, the X position information of the substrate P is obtained based on the output of the head group on the +X direction side. Then, immediately after each of the head groups on the -X direction side becomes capable of performing measurement using the second scale plate 340, the head group on the -X direction side is processed using the output of the head group on the +X direction side.

Furthermore, the above-mentioned subsequent processing is based on the premise that the positional relationship between the four read heads (the read head group on the +X direction side and the read head group on the -X direction side) is known. The positional relationship between the read heads can be obtained by using the common scale when the four read heads are facing the scale, or by using a measuring device (laser interferometer and distance sensor, etc.) arranged between the read heads. This subsequent processing can be performed on the upward X read head 386x and the Y read head 386y, and can also be performed on the downward Z read head 78 and the upward Z read head 278, etc.

In addition, the main control device 50 (see FIG. 4 ) drives the Y slider 76 (see FIG. 12 ) in the Y-axis direction in synchronization with the substrate P as the substrate P (see FIG. 12 ) moves in the Y-axis direction, similarly to the first to third embodiments described above. At this time, the horizontal plane position measurement system 58 of this embodiment obtains the position information of the substrate P based on the outputs of the X encoder head 384x and the Y encoder head 384y of the Y slider 76. Therefore, the displacement information of the Y slider 76 itself in the Y-axis direction must also be measured with the same degree of accuracy as that of the substrate P. Therefore, the horizontal plane position measurement system 58 of this embodiment, as the Y slide position measurement system 80 (refer to Figure 4), further has an encoder system for calculating the displacement of the Y slide 76 using a scale plate 380 fixed under the upper platform 18a (refer to Figure 12).

The scale plate 380 is formed of a plate-shaped member extending in the Y-axis direction, and an X scale 382x and a Y scale 382y are formed on the bottom thereof, similarly to the scale plate 340 described above. In addition, two X encoder heads 386x separated in the Y-axis direction are mounted on the Y slider 76 (refer to FIG. 12 ) opposite to the X scale 382x, and two Y encoder heads 386y separated in the Y-axis direction are mounted opposite to the Y scale 382y. In addition, the scale plate 380 is also opposed to the four sensor heads 278 (upward Z heads), and also has a function as a target (reflection surface) when the inclination amount of the Y slider 76 is obtained using the four sensor heads 278.

When the substrate P (see FIG. 12 ) is moved in the Y-axis direction, the main control device 50 moves the Y slide 76 in the Y-axis direction in synchronization with the substrate P. The main control device 50 obtains the position information of the Y slide 76 in the XY plane at this time based on the outputs of the two X encoder heads 386x and the two Y encoder heads 386y, and obtains the position information of the substrate P in the XY plane based on the position information of the Y slide 76 and the outputs of the two X encoder heads 384x and the Y encoder heads 384y mounted on the Y slide 76. As described above, the horizontal plane position measurement system 58 of the present embodiment obtains the position information of the substrate P in the horizontal plane by the encoder system through the Y slide 76 and indirectly based on the device body 18.

According to the fourth embodiment described above, the position information of the substrate P in the XY plane is obtained by the encoder system, so compared with the optical interferometer system, the influence of air fluctuations can be reduced and the measurement accuracy can be improved. In addition, in the encoder system of this embodiment, the reading head moves along with the movement of the substrate P in the Y-axis direction, so there is no need to prepare a large scale plate that can cover the full movement range of the substrate P in the XY plane.

In the fourth embodiment, the position information of the substrate P and the Y slider 76 in the XY plane is obtained by the X encoder head 384x, 386x and the Y encoder head 384y, 386y, but a two-dimensional encoder head (XZ encoder head or YZ encoder head) that can measure the displacement information in the Z axis direction can also be used to obtain the Z tilt displacement information of the substrate P and the Y slider 76 together with the position information of the substrate P and the Y slider 76 in the XY plane. In this case, the sensor heads 78, 278 for obtaining the Z tilt position information of the substrate P can be omitted. Furthermore, in this case, in order to obtain the Z tilt position information of the substrate P, the two downward Z reading heads must always face the scale plate 340. Therefore, it is better to construct the scale plate 340 with a long strip scale plate of the same length as the target 338, or to arrange more than three of the above-mentioned two-dimensional encoder reading heads at a predetermined interval in the X-axis direction.

Furthermore, in the fourth embodiment, a scale plate 340 used to obtain position information of the substrate P in the XY plane and a measured surface for measuring the Z tilt position of the substrate P (a strip-shaped area without the scale plate 340 attached) are provided on the target 338, so there is no need to perform a connection process when the X encoder head 384x and the Y encoder head 384y are placed across the scale plate 340, and the connection process is performed on the sensor head 78 (Z head facing downward). In this way, the Z tilt position measurement can be performed simply. Furthermore, the top surfaces of the plurality of scale plates 340 can be used as a reflection surface, and when the Z tilt position of the substrate P is measured, the connection process is also performed on the sensor head 78 (Z head facing downward). In this case, since the strip-shaped region need not be provided, the structure of the target 338 can be simplified.

Here, as described above, during the Y stepping motion of the substrate holder 36, in the substrate stage device 20, for example, two Y slides 76 are driven in the Y-axis direction synchronously with the substrate holder 36. That is, the main control device 50 (refer to FIG. 4 ) drives the substrate holder 36 to the target position in the Y-axis direction according to the output of the encoder system, and drives the Y slide 76 in the Y-axis direction according to the output of the Y slide position measurement system 80 (refer to FIG. 4 . Here, it is the encoder system). At this time, the main control device 50 drives the Y slide 76 and the substrate holder 36 synchronously (in a manner that the Y slide 76 follows the substrate holder 36). Furthermore, the main control device 50 controls the position of the Y slide 76 so that at least one of the plurality of read heads 384x, 384y will not separate from the scale plate 340 (will not be outside the measurable range).

Therefore, the measurement beams irradiated from the X read head 384x and the Y read head 384y (see FIG. 13 ) independently of the Y position of the substrate holder 36 (including during the movement of the substrate holder 36 ) will not deviate from the X scale 342x and the Y scale 342y (see FIG. 13 ). In other words, as long as the measurement beams irradiated from the X head 384x and the Y head 384y do not deviate from the X scale 342x and the Y scale 342y while the substrate holder 36 is moved in the Y-axis direction (in the Y stepping action), that is, as long as the measurement using the measurement beams from the X head 384x and the Y head 384y is not interrupted (continuous measurement), for example, the two Y slides 76 can be moved synchronously with the substrate holder 36 in the Y-axis direction.

At this time, before the substrate holder 36 moves in the stepping direction (Y-axis direction), the Y slider 76 (X heads 384x, 386x, Y heads 384y, 386y) can start moving in the stepping direction before the substrate holder 36. In this way, the acceleration of each head can be suppressed, and the tilt of each head in motion (the tilt relative to the moving direction) can be further suppressed. In addition, instead of this, the Y slider 76 can start moving in the stepping direction slower than the substrate holder 36.

Furthermore, when the Y stepping motion of the substrate holder 36 is completed, the mask M (see FIG. 1 ) is driven in the -X direction according to the output of the mask stage position measurement system 54 (see FIG. 4 ), and synchronously with the mask M, the substrate holder 36 is driven in the -X direction according to the output of the substrate stage horizontal plane position measurement system (see FIG. 4 . Here, it is the encoder system), so as to transfer the mask pattern to the irradiation (shot) area on the substrate P. At this time, for example, the two Y slides 76 are in a stationary state. In the liquid crystal exposure device 10, the above-mentioned scanning motion of the mask M, the Y stepping motion of the substrate holder 36, and the scanning motion of the substrate holder 36 are appropriately repeated, so as to sequentially transfer the mask pattern to the plurality of irradiation areas on the substrate P. During the above exposure operation, for example, the two Y sliders 76 are maintained facing the target 338 (scale plate 340), and are driven in the same direction and distance as the substrate holder 36 each time the substrate holder 36 steps in the +Y direction and the -Y direction.

Here, as described above, the Y scale 342y has a plurality of grid lines extending in the X-axis direction. In addition, as shown in FIG. 17 , the irradiation point 384y (for convenience, the same symbol as the Y read head is given for explanation) of the measurement beam irradiated from the Y read head 384y to the Y scale 342y is elliptical with the Y-axis direction as the major axis direction. In the encoder system, when the Y read head 384y and the Y scale 342y move relative to each other in the Y-axis direction and the measurement beam crosses the grid lines, the output from the Y read head 384y changes according to the phase change of the ±1st diffracted light from the above-mentioned irradiation point.

In contrast, the main control device 50 (see FIG. 4 ) controls the position (Y position) of the Y slide 76 in the stepping direction when the substrate holder 36 is driven in the scanning direction (X-axis direction) during the above-mentioned scanning exposure operation, in such a manner that the measuring beam from the Y read head 384y of the Y slide 76 (see FIG. 12 ) does not cross over the plurality of grid lines forming the Y scale 342y, that is, in such a manner that the output of the Y read head 384y does not change (changes to zero).

Specifically, for example, the Y position of the Y head 384y is measured by a sensor having a higher resolution than the spacing between the grid lines constituting the Y scale 342y, and the Y position of the Y head 384y is controlled by the Y linear actuator 74 (see FIG. 12 ) just before the irradiation point of the measurement beam from the Y head 384y is about to cross the grid line (the output of the Y head 384y is about to change). In addition, without limitation to this, for example, when the output of the Y head 384y changes due to the measurement beam from the Y head 384y crossing the grid line, the output from the Y head 384y can be substantially kept unchanged by driving and controlling the Y head 384y in response to this. In this case, a sensor for measuring the Y position of the Y reading head 384y is not required.

《Fifth Implementation》 Next, the liquid crystal exposure device of the fifth implementation is described using Figures 14 and 15. The liquid crystal exposure device of the fifth implementation is the same as the fourth implementation in that the encoder system is used to obtain the position information of the substrate P in the horizontal plane, but the reader unit for the encoder system (horizontal position measurement system) and the reader unit for the Z tilt position measurement system are independent, which is different from the fourth implementation. The following describes the differences from the fourth implementation, and the elements having the same structure and function as the fourth implementation are given the same symbols as the fourth implementation and their description is omitted.

The Z tilt position measuring system in the liquid crystal exposure device of the fifth embodiment is constructed in the same manner as the Z tilt position measuring system 270 of the third embodiment. That is, as shown in FIG14, four read head units 272a to 272d are installed below the upper stage 18a (in FIG12, the read head units 272b and 272d are not shown. See FIG9, etc.), and the Z tilt position information of the substrate P is obtained using the read head units 272a to 272d. A target 280 (reflection surface) is fixed on the upper stage 18a in a manner opposite to the read head units 272a to 272d. The procedure of obtaining the Z tilt position information of the substrate P using the Z sensor heads 78 and 278 respectively provided in the four head units 272a to 272d is the same as that in the third embodiment described above, so the description thereof is omitted.

The encoder system (horizontal plane position measurement system 58) is similar to the fourth embodiment described above, and has a pair of head units 472a and 472b across the projection optical system 16. The head units 472a and 472b have substantially the same structure except for their different configurations. The head unit 472a is arranged between the head unit 272a and the head unit 272c. In addition, although not shown, the head unit 472b is arranged between the head unit 272b and the head unit 272d. The head units 472a and 472b are fixed below the upper platform 18a, similar to the head units 272a to 272d. Furthermore, a scale plate 380 is fixed to the upper platform 18a opposite to the reading head units 472a and 472b.

As shown in FIG15, the head unit 472a is obtained by removing a plurality of sensor heads 78, 278 from the head unit 372a (see FIG13) of the fourth embodiment. The procedure for obtaining the position information of the substrate P in the horizontal plane using the head units 472a, 472b (see FIG14) in the fifth embodiment is the same as that in the fourth embodiment, so the description is omitted.

According to the fifth embodiment, since the head unit of the horizontal plane position measurement system of the substrate P and the head unit used for the Z tilt position measurement system of the substrate are independent, the structure of the head unit is simpler and the arrangement of each sensor head is easier than in the fourth embodiment. In addition, the X-axis dimension of the target 438 can be shortened compared to the fourth embodiment.

《Variations of the 4th and 5th embodiments》 In addition, in the above-mentioned 4th and 5th embodiments (the embodiments when the substrate stage horizontal plane position measurement system 58 is an encoder system), the X scale (the grid pattern for measuring in the X-axis direction shown in the figure) and the Y scale (the grid pattern for measuring in the Y-axis direction shown in the figure) are set on independent scale components (for example, a plurality of scale plates arranged on the target 338). However, these plurality of grid patterns can also be formed on the same long scale component in a manner of dividing into groups of grid patterns. Alternatively, the grid pattern can also be formed continuously on the same long scale component.

Furthermore, when a scale group (scale row) in which a plurality of scales are connected and arranged in the X-axis direction through a gap with a predetermined interval on the target 338, 438, is arranged in a plurality of rows at different positions separated from each other in the Y-axis direction (for example, a position on one side (+Y side) and a position on the other side (-Y side) relative to the projection optical system 16), it can be arranged so that the positions of the gaps with the predetermined intervals between the plurality of rows do not overlap in the X-axis direction. If a plurality of scale rows are arranged in this way, there will be no situation where the read heads arranged in the corresponding scale rows reach outside the measurement range at the same time (in other words, the two read heads face the gap at the same time).

Furthermore, when a scale group (scale row) in which a plurality of scales are connected and arranged in the X-axis direction through a gap at a predetermined interval on the target 338, 438, is arranged in a plurality of rows at different positions separated from each other in the Y-axis direction (for example, a position on one side (+Y side) and a position on the other side (-Y side) relative to the projection optical system 16), the plurality of scale groups (a plurality of scale rows) can be configured to be used differently according to the configuration (irradiation map, shot map) of irradiation on the substrate. For example, if the length of the entire plurality of scale rows is made different between the scale rows, it is possible to respond to different irradiation maps and also to respond to changes in the number of irradiation areas formed on the substrate, such as when four surfaces are taken and when six surfaces are taken. Furthermore, by configuring the gaps between the scale rows in this manner so that they are located at different positions in the X-axis direction, the reading heads corresponding to the plurality of scale rows will not be out of the measurement range at the same time. This can reduce the number of sensors that are considered as uncertain values in subsequent processing, allowing subsequent processing to be performed with high precision.

Furthermore, the length of one scale (a pattern for measuring the X-axis) in the X-axis direction in a scale group (scale row) in which a plurality of scales are connected and arranged through gaps at predetermined intervals on the targets 338 and 438 can be made to be a length that can continuously measure the length of one irradiation area (the length formed on the substrate by the device pattern being irradiated while the substrate on the substrate holder is moved in the X-axis direction and scanning exposure is performed). In this way, in the scanning exposure of one irradiation area, it is not necessary to perform continuous control of the read head relative to the plurality of scales, so that the position measurement (position control) of the substrate P (substrate holder) during scanning exposure can be easily performed.

In addition, in the scale group (scale row) on the targets 338 and 438, which is a plurality of scales connected in the X-axis direction through a predetermined interval, in the above-mentioned embodiment, scales of the same length are connected, but scales of different lengths may be connected. For example, the length of the scales arranged in the center in the X-axis direction in the scale row on the targets 338 and 438 may be physically made longer in the X-axis direction than the lengths of the scales arranged at the ends (the scales arranged at the ends in the scale row).

Furthermore, in a scale group (scale row) on targets 338 and 438 in which a plurality of scales are connected in the X-axis direction with gaps at predetermined intervals, the distance between the plurality of scales (in other words, the gap length), the length of one scale, and two read heads (read heads arranged opposite to each other inside one Y slide 76, such as the two read heads 384x shown in FIG. 13 ) that move relative to the scale row are arranged in a manner that satisfies the relationship of “one scale length > distance between read heads arranged opposite to each other > distance between scales”. This relationship applies not only to the scale plate 380 provided on the targets 338 and 438 and the corresponding read heads 384x and 384y, but also to the scale plate 380 provided on the upper platform 18a and the corresponding read heads 386x and 386y when the scale plate 380 provided on the upper platform 18a is arranged at a predetermined interval in the Y-axis direction.

In addition, although the pair of X read heads 384x and the pair of Y read heads 384y are arranged in pairs in the X-axis direction (the X read heads 384x and the Y read heads 384y are arranged at the same position in the X-axis direction), they may be arranged staggered relative to each other in the X-axis direction.

Furthermore, although the X scale 342x and the Y scale 342y are formed with the same length in the X-axis direction in the scale plate 340 formed on the targets 338 and 438, they may be formed with different lengths. In addition, the two may be arranged staggered relative to each other in the X-axis direction.

Furthermore, when a certain Y slider 76 and a corresponding scale row (a scale row in which a plurality of scales are connected and arranged in a predetermined direction via a predetermined gap) move relative to each other in the X-axis direction, when a certain set of read heads in the Y slider 76 (e.g., the X read head 384x and the Y read head 384y in FIG. 13 ) simultaneously face the gap between the above-mentioned scales and then simultaneously face another scale (when the read heads 384x and 384y are connected to another scale), the initial measurement value of the connected read head must be calculated. At this time, the output of a set of read heads (384x, 384y) remaining in the Y slide 76 different from the read heads to be connected and another read head different from this (separated in the X-axis direction and arranged at a position where the distance between the read head and the separated read head is shorter than the scale length) can be used to calculate the initial value of the read head to be connected. The above-mentioned another read head can be a read head for measuring the position in the X-axis direction or a read head for measuring the position in the Y-axis direction.

In addition, the above description states that "the Y slide 76 and the substrate holder 36 move synchronously." This means that the Y slide 76 moves in a state of roughly maintaining the relative position relationship with the substrate holder 36, and is not limited to the situation where the position relationship, movement direction and movement speed between the Y slide 76 and the substrate holder 36 are strictly consistent.

Furthermore, the encoder system can obtain the position information of the substrate stage device 20 during the period when the substrate stage device 20 moves to the substrate exchange position with the substrate loader, by installing a scale for substrate exchange on the substrate stage device 20 or other stage devices, and using a downward reading head (X reading head 384x, etc.) to obtain the position information of the substrate stage device 20. Alternatively, a reading head for substrate exchange is installed on the substrate stage device 20 or other stage devices, and the position information of the substrate stage device 20 is obtained by measuring the scale plate 340 or the scale for substrate exchange. In addition, another position measurement system different from the encoder system (for example, a mark on the stage and an observation system for observing the mark) is set to control (manage) the exchange position of the stage.

Furthermore, the Z sensor is not limited to the encoder system, and can be a laser interferometer, a TOF sensor, or a sensor that can measure distance.

Furthermore, although the scale plate 340 is disposed on the target 338, 438, the scale may be directly formed on the substrate P by exposure processing. For example, it may be formed on the ruled line between the irradiated areas. In this way, the scale formed on the substrate can be measured, and the non-linear error of each irradiated area on the substrate can be obtained based on the position measurement result. In addition, the overlay accuracy during exposure can be improved based on the error.

Furthermore, although the Y slide 76 and the Y linear actuator 74 are disposed below the upper platform portion 18a of the device body 18 (see FIG. 12), they may also be disposed on the lower platform portion 18b or the middle platform portion 18c.

《Sixth Implementation》 Next, the liquid crystal exposure device of the sixth implementation is described using FIG. 16 (a) and FIG. 16 (b). The liquid crystal exposure device of the sixth implementation is different from the first to fifth implementations in that the substrate stage device 520 used to position the substrate P with high precision relative to the projection optical system 16 (see FIG. 1) is configured. The measurement system used to obtain the position information of the substrate P in the six degrees of freedom direction can be appropriately used as a measurement system having the same structure as any one of the measurement systems of the first to fifth implementations. In the following, with respect to the sixth implementation, only the differences from the first to fifth implementations are described, and the elements having the same structure and function as the first to fifth implementations are given the same symbols as the first to fifth implementations and their description is omitted.

In the above-mentioned first to fifth embodiments, the substrate P is held on the substrate holder 36 (see FIG. 1 etc.) by vacuum adsorption with its back side. In contrast, as shown in FIG. 16 (a) and FIG. 16 (b), the substrate stage device 520 in the sixth embodiment has a substrate holder 540 formed in a rectangular frame shape (picture frame shape) in top view, and only the point near the end of the substrate P that is adsorbed and held is different. In addition, the substantially entire surface including the central portion of the substrate P is non-contactly supported from below by a non-contact stage 536 that can be slightly driven in the Z tilt direction relative to the horizontal plane, and is plane-corrected along the upper surface of the non-contact stage 536.

To explain in more detail, the non-contact stage 536 is fixed on the upper surface of the fine motion stage 32. In the sixth embodiment, the fine motion stage 32 is mechanically connected to the X coarse motion stage 26 (however, in a state where it can be slightly moved in the Z tilt direction) through a plurality of connection devices 550 including ball joints, etc., and is pulled by the X coarse motion stage 26 to move in the X-axis direction and the Y-axis direction with a predetermined long stroke. In addition, the substrate holder 540 has a main body 542 formed in a rectangular frame shape when viewed from above, and an adsorption portion 544 fixed on the main body 542. The adsorption portion 544 is also formed in a rectangular frame shape when viewed from above, similar to the main body 542. The substrate P is held by the adsorption portion 544 by vacuum adsorption. The non-contact stage 536 is inserted into the opening of the adsorption portion 544 of the substrate holder 540 with a predetermined gap therebetween. The non-contact stage 536 applies a pre-load to the substrate P by ejecting pressurized gas from the bottom of the substrate P and by suctioning the gas, thereby correcting the plane of the substrate P in a non-contact state (a state that does not hinder relative movement along the horizontal plane).

Furthermore, a plurality of (four in this embodiment) guide plates 548 extend radially along a horizontal plane from the bottom of the fine motion stage 32. The substrate holder 540 has a plurality of pads 546 including air bearings corresponding to the plurality of guide plates 548, and is placed on the guide plates 548 in a non-contact state by static pressure of pressurized gas sprayed from the air bearings to the top of the guide plates 548. The fine motion stage 32 is different from the first to fifth embodiments in that it is only slightly driven in the Z tilt direction relative to the X coarse motion stage 24. At this time, since the above-mentioned multiple guide plates 548 also move in the Z tilt direction (posture change) together with the fine-motion stage 32, when the posture of the fine-motion stage 32 changes, the posture of the fine-motion stage 32, the non-contact table 536 and the substrate holder 540 (that is, the substrate P) also changes.

Furthermore, the substrate holder 540 is slightly driven in the three-degree-of-freedom directions in the horizontal plane relative to the fine-motion stage 32 through a plurality of linear motors 552 (voice coil motors) including a movable element of the substrate holder 540 and a stator of the fine-motion stage 32. Furthermore, when the fine-motion stage 32 moves along the XY plane with a long stroke, the fine-motion stage 32 and the substrate holder 540 can move along the XY plane with a long stroke as a whole, and the plurality of linear motors 552 are used to apply thrust to the substrate holder 540.

The target 38 is fixed to the substrate holder 540 through the bracket 38a as in the first embodiment. The main control device 50 (see FIG. 4 ) measures the amount of change in the posture of the substrate holder 540 (i.e., the substrate P) using a plurality of sensor heads 78 (see FIG. 1 , etc.) that irradiate the target 38 with measurement light as in the first embodiment. In addition, the configuration of the plurality of sensor heads 78 and the measurement system of the Z tilt position of the substrate P can be modified in the same manner as in the second to fifth embodiments. In addition, in the sixth embodiment, although the target 38 is fixed to the substrate holder 540 through the bracket 38a, the present invention is not limited thereto, and the target 38 (and the scale plate 340) can be directly attached to the upper surface of the substrate holder 540, or the upper surface of the substrate holder 540 can be mirror-processed so that it has the same function as the target.

Furthermore, the configurations described in the first to sixth embodiments may be appropriately modified. For example, in the above embodiments, the sensor head 78 (downward reading head) used to obtain the Z tilt position information of the substrate P irradiates the measuring light to the reflecting surface of the target 38 (138, 238) mounted on the substrate holder 36. However, as long as the measuring light irradiated from the sensor head 78 can be reflected and the posture change of the substrate P can be reflected, the target is not limited to this, and the substrate P may also reflect the measuring light (that is, the substrate P itself may function as a target). In addition, the target 38 of the above embodiments may also be mounted on the micro-motion stage 32.

Furthermore, in the above-mentioned embodiments, the sensor head 78 (downward reading head) moves in the Y-axis direction relative to the target 38 extending in the X-axis direction (scanning direction), but it is not limited to this. The target 38 may extend in other directions (Y-axis direction), and the sensor head 78 may move in a direction orthogonal to the extension direction of the target 38 in the horizontal plane.

In the above-mentioned embodiments, the substrate stage device 20 has a target 38 extending in the X-axis direction, and the sensor head 78 mounted on the device body 18 moves in the Y-axis direction synchronously with the target 38. However, the substrate stage device 20 may have a sensor head 78, and the target 38 mounted on the device body 18 moves in the Y-axis direction synchronously with the sensor head 78. In this case, the change in the posture of the target 38 is measured, and the output of the sensor head 78 is corrected according to the output.

Furthermore, in the above-mentioned embodiments, the weight compensation device 28 is mounted on the Y stepping guide 30 of a movable platform that can move in the Y-axis direction, but is not limited to this. The weight compensation device 28 can also be mounted on a fixed platform having a guide surface that can cover the entire moving range of the weight compensation device 28 in the XY plane.

In addition, the wavelength of the light source used in the illumination system 12 and the illumination light IL irradiated from the light source is not particularly limited, and can be ultraviolet light such as ArF excimer laser light (wavelength 193nm), KrF excimer laser light (wavelength 248nm), vacuum ultraviolet light such as _F2 laser light (wavelength 157nm).

Furthermore, in the above-mentioned embodiments, although an equal-magnification system is used as the projection optical system 16, the present invention is not limited to this, and a reduction system or an enlargement system may also be used.

Furthermore, the use of the exposure device is not limited to the exposure device for liquid crystal that transfers the pattern of liquid crystal display elements to a square glass plate, but can also be widely applied to exposure devices for manufacturing organic EL (Electro-Luminescence) panels, exposure devices for manufacturing semiconductors, exposure devices for manufacturing thin-film magnetic heads, microcomputers, and DNA chips, etc. In addition, not only micro-elements such as semiconductor elements, but also exposure devices for transferring circuit patterns to glass substrates or silicon wafers, etc., for manufacturing optical exposure devices, EUV exposure devices, X-ray exposure devices, and electron beam exposure devices, etc., can also be applied.

Furthermore, the object to be exposed is not limited to a glass plate, and may be other objects such as a wafer, a ceramic substrate, a film component, or a photomask motherboard (blank photomask). Furthermore, when the object to be exposed is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and may include, for example, a film (a flexible sheet-like component). Furthermore, the exposure device of this embodiment is particularly effective when the object to be exposed is a substrate with a side length or a diagonal length of 500 mm or more. Furthermore, when the substrate to be exposed is a flexible sheet-like object, the sheet-like object may be formed into a roll shape.

Electronic components such as liquid crystal display components (or semiconductor components) are manufactured through the steps of designing the functional performance of the components, manufacturing a mask (or reticle) according to the design steps, manufacturing a glass substrate (or wafer), transferring the pattern of the mask (reticle) to the glass substrate by using the exposure device and the exposure method of the above-mentioned embodiments, developing the exposed glass substrate, etching to remove the exposed components other than the residual resist, removing the resist that is not needed after etching, as well as component assembly steps, inspection steps, etc. In this case, the exposure method is implemented in the lithography step using the exposure device of the above-mentioned embodiment to form a device pattern on the glass substrate, thereby being able to manufacture high-integration devices with good productivity.

In addition, all disclosures of the U.S. patent application publications and U.S. patent specifications concerning the exposure device cited in the above-mentioned embodiments are incorporated by reference as part of the description of this specification.

As described above, the moving body device and the measuring method of the present invention are suitable for obtaining the position information of the moving body. Furthermore, the exposure device of the present invention is suitable for exposing an object. In addition, the manufacturing method of the flat panel display of the present invention is suitable for manufacturing a flat panel display. Furthermore, the component manufacturing method of the present invention is suitable for manufacturing micro components.

10: Liquid crystal exposure device 12: Illumination system 14: Mask stage 16: Projection optical system 18: Device body 18a: Upper stage 18b: Lower stage 18c: Middle stage 18d: Anti-vibration device 20: Substrate stage device 22: Base 24: Y coarse motion stage 24a: Y bracket 24b: X beam 24c: Y actuator 24 d: Linear guide device 26: X coarse motion stage 26a: X actuator 26b: Linear guide device 28: Weight offset device 28a: Connecting device 28b: Air bearing 30: Y stepping guide 30b: Connecting device 32: Fine motion stage 34: Spherical bearing device 36: Substrate holder 38, 138, 280, 338: Target 38 a, 138a: bracket 50: main control device 56x: X voice coil motor 56y: Y voice coil motor 56z: Z voice coil motor 58: substrate carrier horizontal plane position measurement system 70, 170, 270: substrate carrier Z tilt position measurement system 72a, 72b, 172a, 172b, 272a~272d, 372a, 372b, 472a, 472b: Reading head unit 74: Y linear actuator 76: Y slide 78, 278: Sensor head 80: Y slide position measurement system 340: 1st scale plate 380: Scale plate 384x: X encoder reading head 384y: Y encoder reading head AX: Optical axis F: Ground IL: Illumination light M: Mask P: Substrate

[FIG. 1] is a diagram schematically showing the configuration of the liquid crystal exposure device of the first embodiment. [FIG. 2] is a cross-sectional view taken along the line A-A of FIG. 1. [FIG. 3] is a conceptual diagram of the substrate stage Z tilt position measurement system provided in the liquid crystal exposure device of FIG. 1. [FIG. 4] is a block diagram showing the input/output relationship of the main control device configured around the control system of the liquid crystal exposure device. [FIG. 5] is a diagram for explaining the operation of the substrate stage device and the substrate stage Z tilt position measurement system during stepping operation. [FIG. 6] (a) and (b) are diagrams (part 1 and part 2) for explaining the operation of the substrate stage device and the substrate stage Z tilt position measurement system during exposure operation. [FIG. 7] is a diagram (cross-sectional view) showing the liquid crystal exposure device of the second embodiment. [Figure 8] is a diagram for explaining the operation of the substrate stage Z tilt position measurement system of the second embodiment. [Figure 9] is a diagram showing the liquid crystal exposure device of the third embodiment (front view). [Figure 10] is a conceptual diagram of the substrate stage Z tilt position measurement system of the third embodiment. [Figure 11] is a diagram showing the liquid crystal exposure device of the third embodiment (cross-sectional view). [Figure 12] is a diagram showing the liquid crystal exposure device of the fourth embodiment (front view). [Figure 13] is a conceptual diagram of the substrate position measurement system of the fourth embodiment. [Figure 14] is a diagram showing the liquid crystal exposure device of the fifth embodiment (cross-sectional view). [Figure 15] is a conceptual diagram of the substrate position measurement system of the fifth embodiment. [Figure 16] (a) and Figure 16 (b) are diagrams showing the substrate stage device of the sixth embodiment (a cross-sectional view and a top view, respectively). [Figure 17] is a diagram showing the irradiation point of the measurement beam on the encoder scale.

10: Liquid crystal exposure device

12: Lighting Department

14: Mask carrier

16: Projection Optics Department

18: Device body

18a: Upper platform

18b: Lower the platform

18c: Middle frame

18d: Anti-vibration device

20: Substrate carrier device

22: Base

24:Y coarse motion stage

24a:Y bracket

24b:X beam

26: X coarse motion stage

26a:X actuator

26b: Linear guidance device

28: Weight offset device

28b: Air bearing

30: Y step guide

30b: Connecting device

32: Micro-motion stage

34: Spherical bearing device

36: Substrate holder

38: Target

38a: Bracket

56y:Y voice coil motor

56z:Z voice coil motor

70: Substrate stage Z tilt position measurement system

72a, 72b: Reading unit

74:Y linear actuator

76:Y slide

78:Sensor head

AX: optical axis

F: Ground

IL: Illumination light

M: Mask

P: Substrate

Claims (18)

A mobile body device comprises: a first mobile body that holds an object and moves it in a first direction and a second direction intersecting the first direction; a second mobile body that is arranged between a reference member that serves as a reference for the movement of the first mobile body and the first mobile body, and is arranged opposite to the first mobile body and can move in the first direction; and a measuring unit that has a measuring system arranged on one of the first and second mobile bodies and a measuring system arranged on the other mobile body. The measuring system irradiates the measuring system with a measuring beam to measure the position of the first moving body in the up-down direction; the measuring unit moves the second moving body in the first direction in a manner opposite to the first moving body when the first moving body moves in the first direction to perform measurement; the measuring unit performs measurement without changing the position of the second moving body in the second direction when the first moving body moves in the second direction. A moving body device as claimed in claim 1, wherein the second moving body moves in the first direction relative to the first moving body in such a way that the measuring beam does not separate from the measured system. A moving body device as claimed in claim 1 or 2, wherein the measuring system is provided on the second moving body; the measuring unit compensates for the measurement error in the rotation direction about the up-down direction caused by the driving of the measuring system provided on the second moving body in the first direction, so as to measure the position of the first moving body in the first direction. A mobile body device as claimed in claim 1 or 2, wherein the measured object has a length capable of measuring the movable range of the first mobile body in a second direction intersecting the first direction. A moving body device as claimed in claim 4, wherein the first moving body moves in the second direction in such a way that the measuring beam does not separate from the measured system. As in claim 4, the mobile device has a plurality of measuring systems; the measuring points of the measured system of the plurality of measuring systems are at different positions in the second direction. The moving body device of claim 1 or 2, wherein the measuring unit irradiates the measured system with the measuring beam and measures the position of the first moving body in the vertical direction based on the return light of the measuring beam from the measured system. A moving body device as claimed in claim 1 or 2, comprising: a first measuring system for obtaining the position information of the second moving body in the first direction; and a second measuring system including a diffraction grating provided on one of the first moving body and the second moving body, and an encoder head provided on the other of the first moving body and the second moving body and using the diffraction grating to obtain the position information of the first moving body in a two-dimensional plane including the first direction; and obtaining the position information of the first moving body in the two-dimensional plane based on the outputs of the first and second measuring systems. The mobile body device of claim 1 or 2 further comprises a supporting portion for supporting the object in a non-contact manner; the first mobile body holds the object supported in a non-contact manner by the supporting portion. An exposure device comprising: a moving body device according to any one of the first to ninth patent application scopes; and a pattern forming device for forming a predetermined pattern on an object held by the first moving body using an energy beam. An exposure device as claimed in claim 10, wherein the object is a substrate for a flat panel display. An exposure device as claimed in claim 10 or 11, wherein the length or diagonal length of at least one side of the substrate is greater than 500 mm. A method for manufacturing a flat panel display, comprising: exposing the object using an exposure device of any one of items 10 to 12 of the patent application; and developing the exposed object. A device manufacturing method, comprising: exposing the object using an exposure device of any one of items 10 to 12 of the patent application; and developing the exposed object. A measuring method, comprising: a first moving body that holds an object and moves it in a first direction and a second direction intersecting the first direction, and a second moving body that is disposed between the first moving body and a reference member that serves as a reference for the movement of the first moving body and is disposed opposite to the first moving body and can move in the first direction; and a measuring system disposed on one of the first moving body and the second moving body, The measurement of the other side of the second moving body is to irradiate the measuring beam to measure the movement of the position of the first moving body in the up-down direction; In the measurement movement, when the first moving body moves in the first direction, the second moving body is moved in the first direction in a manner opposite to the first moving body to perform the measurement, and when the first moving body moves in the second direction, the measurement is performed without changing the position of the second moving body in the second direction. The measurement method of claim 15, wherein the second moving body moves in the first direction relative to the first moving body in such a way that the measurement beam does not separate from the measured system. The measurement method of claim 15 or 16, wherein the measurement system is disposed on the second moving body; during the measurement operation, the measurement error in the rotation direction with the up-down direction as the axis caused by the movement of the measurement system disposed on the second moving body in the first direction is compensated to measure the position of the first moving body in the first direction. The measurement method of claim 15 or 16, wherein the measured object has a length capable of measuring the movable range of the first moving body in the second direction intersecting the first direction.