JP6855008B2 - Exposure equipment, flat panel display manufacturing method, device manufacturing method, and exposure method - Google Patents

Description

The present invention relates to an exposure apparatus, a method for manufacturing a flat panel display, a method for manufacturing a device, and an exposure method, and more specifically, a predetermined pattern is obtained by scanning exposure for scanning an energy beam on an object in a predetermined scanning direction. The present invention relates to an exposure apparatus and method formed on an object, and a method for manufacturing a flat panel display or device including the exposure apparatus or method.

Conventionally, in a lithography process for manufacturing electronic devices (microdevices) such as liquid crystal display elements and semiconductor elements (integrated circuits, etc.), an energy beam is applied to a pattern formed on a mask or reticle (hereinafter collectively referred to as "mask"). An exposure device is used to transfer onto a glass plate or wafer (hereinafter collectively referred to as "substrate").

In this type of exposure apparatus, a beam that forms a predetermined pattern on a substrate by scanning an exposure illumination light (energy beam) in a predetermined scanning direction while the mask and the substrate are substantially stationary. A scanning scanning exposure apparatus is known (see, for example, Patent Document 1).

In the exposure apparatus described in Patent Document 1, in order to correct the positional error between the exposure target area on the substrate and the mask, the projection optical system is moved through the projection optical system while moving in the direction opposite to the scanning direction at the time of exposure. The marks on the substrate and the mask are measured by the alignment microscope (alignment measurement), and the positional error between the substrate and the mask is corrected based on the measurement results. Here, since the alignment mark on the substrate is measured via the projection optical system, the alignment operation and the exposure operation are sequentially (serially) executed, and the processing time (tact time) required for the entire exposure processing of the substrate is determined. It was difficult to suppress.

Japanese Unexamined Patent Publication No. 2000-12422

The present invention has been made under the above-mentioned circumstances, and from the first viewpoint, an object is irradiated with illumination light via a projection optical system, and the projection optical system is relative to the object in the scanning direction. An exposure device that scans and exposes while moving , and a first detection device provided on one side of the projection optical system and a second detection device provided on the other side of the projection optical system in the scanning direction. A mark detection unit that has and detects marks of marks provided on the object, a first drive system that moves the mark detection unit, a second drive system that moves the projection optical system, and the projection optical system. The control device includes a control device that controls the first and second drive systems so as to move the mark detection unit prior to the movement of the control device, and the control device comprises the scanning exposure from the other side to the one side. In, the first detection device is moved from the other side to the one side, and the projection optical system is moved from the other side in the scanning direction to the one side based on the detection result by the first detection device. The second detection device is moved from the other side to the one side while performing the scanning exposure, and is moved to the one side in the scanning exposure from the one side to the other side. To the other side, and based on the detection result by the second detection device, the projection optical system is moved in the scanning direction to control the first and second drive systems so as to perform the scanning exposure. Is.

From a second point of view, the present invention is a method for manufacturing a flat panel display including exposing the object using the exposure apparatus of the present invention and developing the exposed object.

The present invention is, to a third aspect, the method comprising: exposing the object using the exposure HikariSo location of the present invention, a device manufacturing method comprising developing the exposed the object, the.

From the fourth viewpoint, the present invention is an exposure method in which an object is irradiated with illumination light via a projection optical system, and the projection optical system is scanned and exposed while being relatively moved in the scanning direction with respect to the object. , The object is provided with respect to the scanning direction by a mark detection unit having a first detection device provided on one side of the projection optical system and a second detection device provided on the other side of the projection optical system. and line Ukoto mark detection mark, the mark detecting unit, and moving with the first drive system, and that said projection optical system, is moved with the second drive system, the projection optical see containing and controlling the first and second drive system to move the mark detector earlier than the movement of the system, the said than control for that, I said to the one side from the other side In scanning exposure, the first detection device is moved from the other side to the one side, and the projection optical system is moved from the other side in the scanning direction to the one side based on the detection result by the first detection device. The second detection device is moved from the other side to the one side while performing the scanning exposure, and is moved to the one side in the scanning exposure from the one side to the other side. The first and second drive systems are controlled so that the detection device is moved to the other side, the projection optical system is moved in the scanning direction based on the detection result by the second detection device, and the scanning exposure is performed. This is an exposure method.

From a fifth point of view, the present invention is a method for manufacturing a flat panel display including exposing the object using the exposure method of the present invention and developing the exposed object.

From the sixth viewpoint, the present invention is a device manufacturing method including exposing the object using the exposure method of the present invention and developing the exposed object.

It is a conceptual diagram of the liquid crystal exposure apparatus which concerns on 1st Embodiment. It is a block diagram which shows the input / output relation of the main control apparatus which mainly constitutes the control system of the liquid crystal exposure apparatus of FIG. It is a figure for demonstrating the structure of the projection system main body, and the measurement system of an alignment microscope. 4 (a) to 4 (d) are diagrams (Nos. 1 to 4) for explaining the operation of the liquid crystal exposure apparatus during the exposure operation. 5 (a) to 5 (d) are diagrams (Nos. 5 to 8) for explaining the operation of the liquid crystal exposure apparatus during the exposure operation. 6 (a) to 6 (c) are diagrams (No. 9 to No. 11) for explaining the operation of the liquid crystal exposure apparatus during the exposure operation. 7 (a) to 7 (c) are diagrams (12 to 15) for explaining the operation of the liquid crystal exposure apparatus during the exposure operation. 8 (a) to 8 (d) are diagrams (Nos. 1 to 4) for explaining the operation of the alignment system according to the second embodiment. 9 (a) and 9 (b) are diagrams (No. 1 and No. 2) for explaining the operation of the alignment system and the projection optical system according to the third embodiment. It is a figure which shows the modification (the 1) of the drive system of a projection optical system and an alignment system. It is a figure which shows the modification (the 2) of the drive system of a projection optical system and an alignment system. It is a conceptual diagram of a module exchange in a liquid crystal exposure apparatus.

<< First Embodiment >>
Hereinafter, the first embodiment will be described with reference to FIGS. 1 to 7 (c).

FIG. 1 shows a conceptual diagram of the liquid crystal exposure apparatus 10 according to the first embodiment. The liquid crystal exposure device 10 is a step-and-scan method in which a rectangular (square) glass substrate P (hereinafter, simply referred to as a substrate P) used in, for example, a liquid crystal display device (flat panel display) is used as an exposure object. It is a projection exposure device, a so-called scanner.

The liquid crystal exposure apparatus 10 includes an illumination system 20 that irradiates an illumination light IL that is an energy beam for exposure, and a projection optical system 40. Hereinafter, the direction parallel to the optical axis of the illumination light IL irradiated from the illumination system 20 to the substrate P via the projection optical system 40 is referred to as a Z-axis direction, and an X-axis orthogonal to each other in a plane orthogonal to the Z-axis. And the Y-axis will be set for explanation. Further, in the coordinate system of the present embodiment, it is assumed that the Y axis is substantially parallel to the direction of gravity. Therefore, the XZ plane is substantially parallel to the horizontal plane. Further, the rotation (tilt) direction around the Z axis will be described as the θz direction.

Here, in the present embodiment, a plurality of exposure target areas (described as appropriate, referred to as a partition area or a shot area) are set on one substrate P, and the mask pattern is sequentially transferred to these plurality of shot areas. Will be done. In the present embodiment, a case where four partition areas are set on the substrate P (so-called four-chamfering case) will be described, but the number of partition areas is not limited to this and can be changed as appropriate. is there.

Further, in the liquid crystal exposure apparatus 10, a so-called step-and-scan type exposure operation is performed, but during the scan exposure operation, the mask M and the substrate P are substantially in a stationary state, and the illumination system 20 and the projection optical system are in a substantially stationary state. 40 (illumination light IL) moves relative to the mask M and the substrate P in the X-axis direction (appropriately referred to as the scanning direction) with a long stroke (see the white arrow in FIG. 1). On the other hand, during the step operation for changing the section area to be exposed, the mask M steps in the X-axis direction with a predetermined stroke, and the substrate P steps in the Y-axis direction with a predetermined stroke (each diagram). See the black arrow in 1).

FIG. 2 shows a block diagram showing an input / output relationship of the main control device 90 that collectively controls each component of the liquid crystal exposure device 10. As shown in FIG. 2, the liquid crystal exposure device 10 includes an illumination system 20, a mask stage device 30, a projection optical system 40, a substrate stage device 50, an alignment system 60, and the like.

The illumination system 20 includes an illumination system main body 22 including a light source (for example, a mercury lamp) of the illumination light IL (see FIG. 1). During the scan exposure operation, the main control device 90 scans and drives the illumination system main body 22 in the X-axis direction with a predetermined long stroke by controlling the drive system 24 including, for example, a linear motor. The main control device 90 obtains position information in the X-axis direction of the lighting system main body 22 via a measurement system 26 including, for example, a linear encoder, and controls the position of the lighting system main body 22 based on the position information. In the present embodiment, as the illumination light IL, for example, g-line, h-line, i-line and the like are used.

The mask stage device 30 includes a stage body 32 that holds the mask M. The stage main body 32 is configured to be appropriately step-movable in the X-axis direction and the Y-axis direction by a drive system 34 including, for example, a linear motor. During the step operation for changing the section area to be exposed in the X-axis direction, the main control device 90 steps-drives the stage body 32 in the X-axis direction by controlling the drive system 34. Further, as will be described later, during the step operation for changing the scan-exposed area (position) in the section area to be exposed with respect to the Y-axis direction, the main control device 90 controls the drive system 34 to perform the stage. The main body 32 is step-driven in the Y-axis direction. The drive system 34 can also appropriately slightly drive the mask M in the three degrees of freedom (X, Y, θz) direction in the XY plane during the alignment operation described later. The position information of the mask M is obtained by a measurement system 36 including, for example, a linear encoder.

The projection optical system 40 includes a projection system main body 42 including an optical system that forms an erect image of a mask pattern on a substrate P (see FIG. 1) in the same magnification system. The projection system main body 42 is arranged in a space formed between the substrate P and the mask M (see FIG. 1). During the scan exposure operation, the main control device 90 controls the drive system 44 including, for example, a linear motor, so that the projection system main body 42 is synchronized with the illumination system main body 22 by a predetermined length in the X-axis direction. Scan drive with stroke. The main control device 90 obtains position information in the X-axis direction of the projection system main body 42 via a measurement system 46 including, for example, a linear encoder, and controls the position of the projection system main body 42 based on the position information.

Returning to FIG. 1, in the liquid crystal exposure apparatus 10, when the illumination region IAM on the mask M is illuminated by the illumination light IL from the illumination system 20, the illumination light IL passing through the mask M passes through the projection optical system 40. A projected image (partially upright image) of the mask pattern in the illumination region IAM is formed in the illumination region (exposure region IA) of the illumination light IL conjugated to the illumination region IAM on the substrate P. Then, the scanning exposure operation is performed by the illumination light IL (illumination region IAM and exposure region IA) moving relative to the mask M and the substrate P in the scanning direction. That is, in the liquid crystal exposure apparatus 10, a pattern of the mask M is generated on the substrate P by the illumination system 20 and the projection optical system 40, and the sensitive layer (resist layer) on the substrate P is exposed by the illumination light IL on the substrate P. The pattern is formed in.

Here, in the present embodiment, the illumination region IAM generated on the mask M by the illumination system 20 includes a pair of rectangular regions separated in the Y-axis direction. The length of one rectangular region in the Y-axis direction is, for example, 1 of the length of the pattern surface of the mask M in the Y-axis direction (that is, the length of each partition region set on the substrate P in the Y-axis direction). It is set to / 4. Similarly, the distance between the pair of rectangular regions is also set to, for example, 1/4 of the length of the pattern surface of the mask M in the Y-axis direction. Therefore, the exposure region IA generated on the substrate P also includes a pair of rectangular regions separated in the Y-axis direction. In the present embodiment, in order to completely transfer the pattern of the mask M to the substrate P, it is necessary to perform the scanning exposure operation twice for one partition area, but the illumination system main body 22 and the projection system main body 42 There is a merit that can be miniaturized. Specific examples of the scanning exposure operation will be described later.

The substrate stage device 50 includes a stage main body 52 that holds the back surface of the substrate P (the surface opposite to the exposed surface). Returning to FIG. 2, during the step operation for changing the section area to be exposed with respect to the Y-axis direction, the main control device 90 controls the drive system 54 including, for example, a linear motor, to Y the stage main body 52. Step drive in the axial direction. The drive system 54 can also finely drive the substrate P in the three degrees of freedom (X, Y, θz) direction in the XY plane during the substrate alignment operation described later. The position information of the substrate P (stage main body 52) is obtained by a measurement system 56 including, for example, a linear encoder.

Returning to FIG. 1, the alignment system 60 includes, for example, two alignment microscopes 62 and 64. The alignment microscopes 62 and 64 are arranged in the space formed between the substrate P and the mask M (the position between the substrate P and the mask M in the Z-axis direction), and the alignment formed on the substrate P. The mark Mk (hereinafter, simply referred to as the mark Mk) and the mark (not shown) formed on the mask M are detected. In the present embodiment, one mark Mk is formed in each of the vicinity of the four corners of each section region (for example, four marks per section area), and the mark of the mask M is marked via the projection optical system 40. It is formed at a position corresponding to Mk. The number and position of the marks Mk and the marks of the mask M are not limited to this, and can be changed as appropriate. Further, in each drawing, the mark Mk is shown larger than it actually is for easy understanding.

One alignment microscope 62 is arranged on the + X side of the projection system main body 42, and the other alignment microscope 64 is arranged on the −X side of the projection system main body 42. The alignment microscopes 62 and 64 each have a pair of detection fields of view (detection regions) separated in the Y-axis direction, and simultaneously detect, for example, two mark Mks separated in the Y-axis direction in one partition region. You can do it.

Further, the alignment microscopes 62 and 64 can simultaneously detect the mark formed on the mask M and the mark Mk formed on the substrate P (in other words, without changing the positions of the alignment microscopes 62 and 64). It has become. In the main control device 90, for example, each time the mask M performs an X-step operation or the substrate P performs a Y-step operation, the relative positional deviation information between the mark formed on the mask M and the mark Mk formed on the substrate P Is obtained, and the relative positioning of the substrate P and the mask M in the direction along the XY plane is performed so as to correct (cancel or reduce) the misalignment. In the alignment microscopes 62 and 64, the mask detection unit that detects (observes) the mark of the mask M and the substrate detection unit that detects (observes) the mark Mk of the substrate P are integrally formed by a common housing or the like. It is configured and is driven by a drive system 66 (see FIG. 2) via its common housing. Alternatively, the mask detection unit and the substrate detection unit may be configured by separate housings or the like. In that case, for example, the mask detection unit and the substrate detection unit are equivalent by a substantially common drive system 66. It is preferable to configure it so that it can move with operating characteristics.

The main control device 90 (see FIG. 2) independently drives the alignment microscopes 62 and 64 in the X-axis direction with a predetermined long stroke by controlling the drive system 66 including, for example, a linear motor. Further, the main control device 90 obtains position information in the X-axis direction of each of the alignment microscopes 62 and 64 via a measurement system 68 including a linear encoder or the like, and position control of the alignment microscopes 62 and 64 based on the position information. Are performed independently. Further, the projection system main body 42 and the alignment microscopes 62 and 64 have substantially the same positions in the Y-axis direction, and their movable ranges partially overlap with each other.

Here, the alignment microscopes 62 and 64 of the alignment system 60 and the projection system main body 42 of the projection optical system 40 described above are physically (mechanically) independent (separated) elements, and the main control device 90 (FIG. FIG. The drive (speed and position) is controlled independently of each other by (see 2), but the drive system 66 that drives the alignment microscopes 62 and 64 and the drive system 44 that drives the projection system main body 42 are in the X-axis direction. For example, a part of a linear motor, a linear guide, etc. is shared, and the drive characteristics of the alignment microscopes 62 and 64 and the projection system main body 42, or the control characteristics by the main control device 90 are substantially the same. It is configured to be.

To give a specific example, for example, when the alignment microscopes 62 and 64 and the projection system main body 42 are each driven in the X-axis direction by a moving coil type linear motor, a magnetic material (for example, a permanent magnet) that is a stator is used. ) The unit is shared by the drive system 66 and the drive system 44. On the other hand, the coil unit, which is a mover, is independently provided by the alignment microscopes 62 and 64 and the projection system main body 42, and the main control device 90 (see FIG. 2) individually supplies power to the coil unit. The drive of the alignment microscopes 62 and 64 in the X-axis direction (speed and position) and the drive of the projection system main body 42 in the X-axis direction (speed and position) are independently controlled. Therefore, the main control device 90 can make (arbitrarily change) the distance (distance) between the alignment microscopes 62 and 64 and the projection system main body 42 in the X-axis direction. Further, the main control device 90 can also move the alignment microscopes 62 and 64 and the projection system main body 42 at different speeds in the X-axis direction.

The main control device 90 (see FIG. 2) detects a plurality of mark Mk formed on the substrate P by using the alignment microscope 62 (or the alignment microscope 64), and the detection result (position information of the plurality of mark Mk). Based on the known Enhanced Global Alignment (EGA) method, the arrangement information (including information on the position (coordinate value), shape, etc. of the partition area) of the partition area where the mark Mk to be detected is formed is calculated. To do.

Specifically, when the projection system main body 42 is driven in the + X direction in the scanning exposure operation, the main control device 90 (see FIG. 2) is moved to the + X side of the projection system main body 42 prior to the scanning exposure operation. The positions of the plurality of marks Mk are detected using the arranged alignment microscope 62, and the arrangement information of the section area to be exposed is calculated. Further, in the scanning exposure operation, when the projection system main body 42 is driven in the −X direction, a plurality of alignment microscopes 64 arranged on the −X side of the projection system main body 42 are used prior to the scanning exposure operation. The position of the mark Mk of is detected, and the arrangement information of the section area to be exposed is calculated. Based on the calculated arrangement information, the main control device 90 appropriately controls the illumination system 20 and the projection optical system 40 while performing precise positioning (board alignment operation) in the XY plane of the substrate P in the direction of three degrees of freedom. Then, a scanning exposure operation (transfer of the mask pattern) is performed on the target partition area.

Next, the measurement system 46 (see FIG. 2) for obtaining the position information of the projection system main body 42 included in the projection optical system 40, and the measurement system 68 for obtaining the position information of the alignment microscope 62 included in the alignment system 60. Configuration will be described.

As shown in FIG. 3, the liquid crystal exposure apparatus 10 has a guide 80 for guiding the projection system main body 42 in the scanning direction. The guide 80 is composed of a member extending parallel to the scanning direction. The guide 80 also has a function of guiding the movement of the alignment microscope 62 in the scanning direction. Further, in FIG. 3, the guide 80 is shown between the mask M and the substrate P, but in reality, the guide 80 is arranged at a position avoiding the optical path of the illumination light IL in the Y-axis direction. ..

A scale 82 including a reflection type diffraction grating whose periodic direction is at least parallel to the scanning direction (X-axis direction) is fixed to the guide 80. Further, the projection system main body 42 has a head 84 arranged so as to face the scale 82. In the present embodiment, the scale 82 and the head 84 form an encoder system that constitutes a measurement system 46 (see FIG. 2) for obtaining position information of the projection system main body 42. Further, the alignment microscopes 62 and 64 each have a head 86 arranged so as to face the scale 82 (the alignment system 64 is not shown in FIG. 3). In the present embodiment, the scale 82 and the head 86 form an encoder system that constitutes a measurement system 68 (see FIG. 2) for obtaining position information of the alignment microscopes 62 and 64. Here, the heads 84 and 86 irradiate the scale 82 with a beam for encoder measurement, receive a beam through the scale 82 (reflected beam by the scale 82), and the scale 82 is based on the light receiving result. It is possible to output the position information relative to.

As described above, in the present embodiment, the scale 82 constitutes the measurement system 46 (see FIG. 2) for obtaining the position information of the projection system main body 42, and the measurement system for obtaining the position information of the alignment microscopes 62 and 64. It constitutes 68 (see FIG. 2). That is, the position of the projection system main body 42 and the alignment microscopes 62 and 64 is controlled based on a common coordinate system (measurement axis) set by the diffraction grating formed on the scale 82. The drive system 44 for driving the projection system main body 42 (see FIG. 2) and the drive system 66 for driving the alignment microscopes 62 and 64 (see FIG. 2) have some common elements. It may be composed of completely independent elements.

The encoder system constituting the measurement systems 46 and 68 (see FIG. 2 respectively) may be a linear (1DOF) encoder system in which the length measurement axis is, for example, only the X-axis direction (scanning direction). It may have more length measuring axes. For example, the amount of rotation of the projection system main body 42 and the alignment microscopes 62 and 64 in the θz direction may be obtained by arranging a plurality of heads 84 and 86 at predetermined intervals in the Y-axis direction. Further, a 3DOF encoder system in which an XY two-dimensional diffraction grating is formed on the scale 82 and has a length measuring axis in three degrees of freedom directions in the X, Y, and θz directions may be used. Further, by using a plurality of known two-dimensional heads capable of measuring the length in the direction orthogonal to the scale plane in addition to the periodic direction of the diffraction grating as the heads 84 and 86, the projection system main body 42 and the alignment microscopes 62 and 64 can be measured. 6 Position information in the direction of freedom may be obtained.

Next, an example of the operation of the liquid crystal exposure apparatus 10 during the scanning exposure operation will be described with reference to FIGS. 4 (a) to 7 (c). The following exposure operation (including the alignment measurement operation) is performed under the control of the main control device 90 (not shown in FIGS. 4A to 7C. See FIG. 2).

In this embodiment, divided areas exposed order is the first (hereinafter referred to as the first shot area S ₁₎ is set on the -X side and -Y side of the substrate P. Further, the sign of S ₂ to S ₄ attached to the divided areas on the substrate P indicates that each exposure sequence is 2-4-th shot area.

As shown in FIG. 4 (a), before starting exposure, the projection system main body 42, and the alignment microscopes 62 and 64, respectively, to the initial position set in the -X side of the first shot area S ₁ in a plan view Be placed. At this time, the projection system main body 42 and the alignment microscopes 62 and 64 are arranged close to each other in the X-axis direction. Moreover, and Y-axis direction position of the detection field of the alignment microscope 62, and the positions of the first and fourth shot areas S _1, S mark Mk formed within ₄ Y-axis direction substantially coincides with.

Then, the main controller 90, as shown in FIG. 4 (b), to drive the alignment microscope 62 in the + X direction, formed in the first shot area S _1, for example, of the four Mark Mk, For example, two marks Mk formed near the end on the −X side are detected (see the thick circles in FIG. 4 (b); the same applies hereinafter). The main control unit 90, as shown in FIG. 4 (c), by driving further the + X direction of the alignment microscope 62, formed in the first shot area S _1, for example, among the four marks Mk , For example, two marks Mk formed near the end on the + X side are detected. In FIG. 4 (b), the projection system main body 42 is stopped, even after the alignment microscope 62 starts the detection of the mark Mk in the first shot area S _1, the mark Mk detection For example, while moving from the detection of the mark Mk on the −X side to the mark Mk on the + X side (more specifically, immediately before detecting the mark Mk on the + X side), the projection system The main body 42 may start accelerating.

The main control device 90, the formed first shot area S _1, for example based on the four marks Mk detection result (position information) to determine the sequence information of the first shot area S _1. The main control unit 90, as shown in FIG. 4 (d), based on the first shot region the sequence information of the S ₁ 3 precise positioning of the degrees of freedom in the XY plane of the substrate P (substrate alignment operation) while performing, with respect to the illumination system main body 22 (FIG. 4 (d) the not shown. see FIG. 1) and is driven in synchronism with + X direction, the first shot area S ₁ of the projection system main body 42 and the illumination system 20 Perform the first scanning exposure.

The main control unit 90, in parallel with the start of the first scanning exposure operation for the first shot area S _1, the fourth shot area S _{4 (first} shot area S ₁ of the + X side using an alignment microscope 62 Of the four mark Mks formed in the compartment area), for example, two mark Mks formed near the end on the −X side are detected.

The main controller 90, the fourth shot area S ₄ obtained newly, for example, the detection results of the two marks Mk, which (stored in a memory device (not shown)) which previously acquired in the first shot region in S _1, it may update the first sequence information of the shot areas S ₁ by EGA calculation based on the detection result of the example four marks. The main controller 90 while performing the 3 precise positioning of the degrees of freedom in the XY plane of the appropriate substrate P on the basis of the updated sequence information, to continue with scanning exposure operation of the first shot area S ₁ it can. By using the mark position information of the fourth shot area S ₄ in order to obtain the sequence information of the first shot area S _1, the sequence information based only on the four marks Mk provided in the first shot area S ₁ than determined, it is possible to obtain the sequence information in consideration of the statistical trend over a wide range, it is possible to improve the alignment accuracy for the first shot area S _1.

Further, as shown in FIG. 5A, the main control device 90 drives the projection system main body 42 in the + X direction to perform a scanning exposure operation, and further drives the alignment microscope 62 in the + X direction to perform a scan exposure operation. It formed in 4 shot area S _4, for example, among the four marks Mk, formed near the + X side end, for example, to detect the two marks Mk. The main controller 90, the fourth shot area S ₄ obtained newly, for example, the detection results of the two marks Mk, the mark Mk (this example obtained which previously in the first shot area S _1, for example four marks Mk, and the fourth shot area S _4, for example may update the first sequence information of the shot areas S ₁ by EGA calculation based on the detection results of the two marks Mk). The main controller 90 is able to continue the 3 while performing precise positioning of the degrees of freedom, the scanning exposure operation in the first shot area S ₁ in the XY plane of the substrate P on the basis of the updated sequence information ..

As described above, in the present embodiment, the alignment microscope 62 arranged in the front (+ X direction) in the scanning direction with respect to the projection system main body 42 is used in front of the exposure region IA (illumination light IL) in the scanning direction (as described above). At least a part of the operation of detecting the mark Mk formed in the + X direction) and the scanning exposure operation of scanning the projection system main body 42 in the + X direction can be executed simultaneously (in parallel). This makes it possible to shorten the time required for a series of operations including the alignment operation and the scanning exposure operation. Further, the main control device 90 can appropriately perform EGA calculation every time, for example, sequentially measure marks Mk provided at different positions, and update the arrangement information of the section area to be exposed. This makes it possible to improve the alignment accuracy of the section area to be exposed.

Further, when the main control device 90 drives the projection system main body 42 in the + X direction for the scanning exposure operation, the main control device 90 uses an alignment microscope 64 arranged behind the projection system main body 42 in the scanning direction (−X direction). , Drive in the + X direction so as to follow the projection system main body 42 (see FIGS. 5 (a) and 5 (b)). At this time, the main control device 90 uses the alignment microscope 64 to detect the mark Mk formed behind the exposure region IA (illumination light IL) in the scanning direction (−X direction), and obtains this detection result as EGA. It may be used for calculation.

As described above, in the present embodiment, the illumination area IAM (see FIG. 1) generated on the mask M and the exposure area IA generated on the substrate P are a pair of rectangular areas separated in the Y-axis direction. Therefore, the pattern image of the mask M transferred to the substrate P by one scanning exposure operation is a pair of strip-shaped regions extending in the X-axis direction separated in the Y-axis direction (of the total area of one partition region). It is formed within (half the area).

Then, the main controller 90, as shown in FIG. 5 (b), for scanning exposure operation for the second time in the first shot area S ₁ (return path), the step moves the substrate P and the mask M in the -Y direction (See the black arrow in FIG. 5 (b)). The step movement amount of the substrate P at this time is, for example, 1/4 of the length of one section region in the Y-axis direction. Further, in this case, when the substrate P and the mask M are stepped in the −Y direction, the relative positional relationship between the substrate P and the mask M is not changed (or the relative positional relationship can be corrected). ) It is preferable to move the step.

In this embodiment, the second scanning exposure operation of the first shot area S _1, as shown in FIG. 5 (c), performing the projection system main body 42 is moved in the -X direction. The main control device 90, the alignment microscope 64 is driven in the -X direction, which is formed in the first shot area S ₁ is detected, for example, the + X side end mark Mk formed in the vicinity (not shown) .. The main controller 90 while performing a precise positioning of the 3 degrees of freedom in the XY plane of the substrate P based on the detection result and the above-described first arrangement information of the shot areas S ₁ and the alignment microscope 64, the first shot performing second scanning exposure operation region S _1. Thus, as shown in FIG. 5 (d), the mask pattern transferred by the first scanning exposure operation, a mask pattern transferred by the second scanning exposure operation in the first shot in region S ₁ are joined together, the overall pattern of the mask M is transferred onto the first shot area S _1. In the alignment operation corresponding to the second scanning exposure of the first shot area S _1, XY plane based on the marks of the respective two points between the mark Mk mark and the substrate P of the mask M (the mark on the + X side) Since it is only necessary to measure the positional deviation in the three degrees of freedom (X, Y, θz) direction, the time required for alignment can be substantially shortened as compared with the first alignment operation.

When the scanning exposure of the first shot area S ₁ is completed, the main controller 90, for scanning exposure operation for the second shot area S _{2 (partitioned} region of the first shot area S ₁ of the + Y side), the substrate P After the step is moved in the −Y direction, scanning exposure is performed on _{the second shot area S 2} in the same procedure as the scanning exposure operation on _{the first shot area S 1.}

That is, in the first scanning exposure operation for the second shot area S _2, as shown in FIG. 6 (a), the second shot area S _2, and the third shot area S ₃ detected by the alignment microscope 62 ( sequence information of the second shot area S ₂ is obtained based on the second shot area S ₂ of the + divided area X side) in the mark Mk result of detecting, 3 in the XY plane of the substrate P on the basis of this sequence information Precise positioning in the direction of freedom is performed. Among them, the detection operation of the marks Mk third shot area S ₃ (and the update sequence information) is performed in parallel with at least a portion scanning exposure operation for the second shot area S _2. The main control unit 90, after the substrate P and the mask M is moved stepwise in the -Y direction, the alignment microscope 64, for example + mark Mk in the second shot area S ₂ formed in the vicinity of an end of the X-side (Not shown) is detected. The main controller 90 while performing the 3 precise positioning of the degrees of freedom in the XY plane of the substrate P based on the sequence information of the detection result and the second shot area S ₂ of the alignment microscope 64, FIG. 6 (b as shown in), while moving the projection system main body 42 in the -X direction, a second time scanning exposure operation for the second shot area S _2.

When the scanning exposure to the second shot area S ₂ is completed, the main control device 90 steps the mask M (see FIG. 1) in the + X direction to move the mask M and the third shot area S _{3 on the substrate P.} To face each other. The main control device 90, the alignment microscope 62 detects the mark Mk example formed in the vicinity of an end of the -X side of the third shot area S _3. The main control device 90, in this state, as shown in FIG. 6 (c), while moving the projection system main body 42 in the + X direction to perform the first scan exposure operation for the third shot area S _3. (Fine positioning of the substrate P) control alignment at this time is performed in accordance with the detection result of the sequence information of the third shot area S ₃ and alignment microscope 62. The arrangement information of the third shot area S ₃ is calculated based on the mark Mk positions in the second and third shot areas S ₂ and S ₃ obtained when the second shot area S _{2 is exposed, and is aligned.} in the microscope 62, in a state where the mask M third shot area S ₃ were opposed, three degrees of freedom in the XY plane on the basis of the marks of the respective two points between the mark Mk mark and the substrate P of the mask M ( It is only necessary to measure the positional deviation in the X, Y, θz) directions. Therefore, it is possible to shorten the time required for the third alignment shot area S ₃ in comparison with the alignment of the second shot area S ₂ substantially.

Thereafter, the main controller 90, for the second scanning exposure operation for the third shot area S _3, as shown in FIG. 7 (a), moved stepwise substrate P and the mask M in the + Y direction. Accordingly, and Y-axis direction position of the detection field of the alignment microscope 64, a position of the second and third shot area S _2, S mark Mk formed within ₃ Y-axis direction substantially coincide.

The main controller 90, the first shot area S ₁ for the first scanning exposure operation similar procedure described above (however, alignment microscope are different to be used for detection of the mark Mk), the second to the third shot area S ₃ Scanning exposure operation is performed. That is, the main controller 90, the second scanning exposure operation for the third shot area S _3, as shown in FIG. 7 (b), the alignment microscope 64 prior to the projection system main body 42 is a third shot region For example, four mark Mks formed in S ₃ are detected, and the main control device 90 updates the arrangement information of _{the third shot area S 3 according to the detection result.} The main controller 90 while performing a precise positioning of the 3 degrees of freedom in the XY plane of the substrate P, and the scanning exposure operation for the third shot area S ₃ performed on the basis of the updated sequence information. In parallel with the scanning exposure operation, the alignment microscope 64, as shown in FIG. 7 (c), formed in the second shot area S _2, detects, for example four marks Mk. The main controller 90, based on the newly acquired positional information of the mark Mk, while updating the sequence information of the third shot area S _3, the second scanning exposure operation for the third shot area S ₃ in parallel Do.

Hereinafter, although not shown, the main controller 90 while performing the Y stepping of the substrate P as appropriate, performs scanning exposure for the fourth shot area S _4. Since the scanning exposure operation for the fourth shot area S ₄ is substantially the same as the scanning exposure operation for the third shot area S _{3, the description thereof will be omitted.}

At the time of scanning exposure operation for the third and fourth shot area S _3, S _4, performs detection of the mark Mk by the alignment microscope 62 together with the alignment microscope 64, compartment using the output of the alignment microscopes 62 and 64 The array information of the area may be updated. Further, in order to expose the divided area of the second shot area S ₂ and later, when obtaining the sequence information of the divided areas may be using the position information of the mark Mk obtained when exposing the earlier defined areas .. Specifically, for example, for obtaining the sequence information of the fourth shot area S _4, the main controller 90 uses a position information of the mark Mk of the first and fourth shot area S _1, S _4, and this in addition, it may be using the position information of the mark Mk of the second and third shot area S _2, S ₃ determined earlier.

According to the present embodiment described above, since the alignment microscopes 62 and 64 move independently of the projection system main body 42 in the scanning direction, at least a part of the scanning exposure operation and the alignment operation is performed simultaneously (in parallel). be able to. Therefore, it is possible to shorten the time required for a series of operations including the alignment operation and the scanning exposure operation, that is, the series of processing times (tact time) required for the exposure processing of the substrate P.

Further, since the alignment microscopes 62 and 64 are arranged on one side and the other side of the projection system main body 42 with respect to the scanning direction, the alignment operation can be performed regardless of the scanning direction (outward scanning and return scanning) during the scanning exposure operation. It is possible to shorten the time required for a series of operations including the scanning exposure operation.

<< Second Embodiment >>
Next, the liquid crystal exposure apparatus according to the second embodiment will be described with reference to FIGS. 8 (a) to 8 (d). The configuration of the liquid crystal exposure apparatus according to the second embodiment is the same as that of the first embodiment except that the configuration and operation of the alignment system are different. Therefore, only the differences will be described below. The elements having the same configuration and function as those of the first embodiment are designated by the same reference numerals as those of the first embodiment, and the description thereof will be omitted.

In the first embodiment, the alignment microscopes 62 and 64 (see FIG. 1) are arranged before and after the scanning direction (+ X side and −X side) with respect to the projection system main body 42, respectively. In the second embodiment, as shown in FIG. 8A, the alignment microscope 162 is provided only on the + X side of the projection system main body 42.

Further, while the alignment microscopes 62 and 64 of the first embodiment have a pair of detection fields of view separated in the Y-axis direction (see FIG. 4B and the like), the alignment microscope 162 has a Y-axis. It has, for example, four detection fields of view that are spaced apart in the direction. The four detection fields of view of the alignment microscope 162, for example, are spaced apart from each other so as to be able to simultaneously detect mark Mk formed over two compartment regions adjacent to each other in the Y-axis direction. ..

In the second embodiment, the main controller 90 (see FIG. 2), as shown in FIG. 8 (b) and FIG. 8 (c), the prior to the scanning exposure operation of the first shot area S _1, while driving the alignment microscope 162 in the + X direction, formed on the substrate P, for example a total of performs 16 marks Mk detection, the first sequence information of the shot areas S ₁ based on the detection result of the mark Mk determined, the while performing precise position control of the substrate P depending on the sequence information, as shown in FIG. 8 (d), the scanning exposure operation of the projection system main body 42 a + X first shot region is driven in the direction S ₁ I do.

In the second embodiment, since the alignment microscope 162 has four detection fields in the Y-axis direction, for example, by moving the alignment microscope 62 once in the + X direction, a wider area of the substrate P can be located. The mark Mk formed on the surface (all the mark Mk in this second embodiment) can be detected. Therefore, as compared with the first embodiment, it is possible to further shorten the series of processing time (tact time) required for the exposure processing of the substrate P.

Also in the second embodiment, similarly to the first embodiment, the Y-step operation of the substrate P and / or the X-step operation of the mask M (see FIG. 1) is performed to obtain the section area to be exposed. Make a move. Incidentally, in the second embodiment, prior to the scanning exposure of the first shot area S _1, since the detection of all the marks Mk formed on the substrate P, when the second shot area S ₂ and subsequent scanning exposure In addition, it is not necessary to perform the EGA calculation again. At the time of the second shot area S ₂ and subsequent scanning exposure may update the sequence information of the partitioned regions performed again alignment measurement (EGA calculation).

<< Third Embodiment >>
Next, the liquid crystal exposure apparatus according to the third embodiment will be described with reference to FIGS. 9 (a) and 9 (b). The configuration of the liquid crystal exposure apparatus according to the third embodiment is the same as that of the first embodiment except that the configuration and operation of the alignment system and the projection optical system are different. Therefore, only the differences will be described below. , The elements having the same configuration and function as those of the first embodiment are designated by the same reference numerals as those of the first embodiment, and the description thereof will be omitted.

In the first embodiment, the alignment system 60 has alignment microscopes 62 and 64 in front of and behind the scanning direction (+ X side and −X side) of the projection system main body 42, whereas the third embodiment of the present invention. The difference is that the alignment microscope 62 is provided only on the + X side of the projection system main body 42.

In the third embodiment, in the main control device 90 (see FIG. 2), when the substrate P is Y-stepped with respect to the projection system main body 42, the alignment microscope 62 and the projection system main body 42 are set to a predetermined initial stage. Return to the position. Specifically, for example, as shown in FIG. 9 (a), when the scanning exposure operation in the first shot area S ₁ is completed, the main controller 90, as in the first embodiment, FIG. 9 As shown in (b), the substrate P is operated in Y steps in the −Y direction (see the black arrow in FIG. 9 (b)).

Further, the main control device 90 drives the alignment microscope 62 and the projection system main body 42 in the −X direction in parallel with the Y-step operation of the substrate P in the −Y direction, and drives the alignment microscope 62 in the −X direction to the initial position (FIG. 4). (See (a))) (see the white arrow in FIG. 9B). In the present embodiment, the initial positions of the alignment microscope 62 and the projection system main body 42 are near the end on the −X side of each movable range. Thereafter, the main controller 90, by driving the alignment microscope 62, and a projection system main body 42 in the respective + X direction to perform the second scanning exposure operation for the first shot area S _1. Prior to the scanning exposure operation in the second, the alignment microscope 62, performs detection operation of the marks Mk formed on the substrate P, in accordance with the output, and updates the first sequence information of the shot areas S ₁ You may.

According to the third embodiment, even if there is only one alignment microscope 62, the same effect as that of the first embodiment can be obtained.

The configurations of the first to third embodiments described above can be changed as appropriate. For example, in the second embodiment, the alignment microscope 162 may be arranged on both sides (+ X side and −X side) of the projection system main body 42 with respect to the scanning direction as in the first embodiment. In this case, even if the scanning direction is the −X direction, the alignment measurement can be performed prior to the movement of the projection system main body 42.

Further, in the first embodiment, the first shot area S₁After the detection of all the marks Mk of the above is completed, the first shot area S₁However, the scanning exposure operation of the first shot region S is not limited to this.₁During the measurement of the plurality of marks Mk formed in the first shot region S ₁You may start the scanning exposure operation of.

Further, in each of the above embodiments, the alignment measurement operation and the scanning exposure operation are performed in parallel on a single substrate P, but the present invention is not limited to this, and for example, two substrates P are prepared and one of them is prepared. Alignment measurement of the other substrate P may be performed while scanning exposure of the substrate P is performed.

In the above embodiments, after the scanning exposure of the first shot area S _1, were subjected to second scanning exposure for the shot area S ₂ set in the + Y (upper) side of the first shot area S ₁ is not limited to this, the next scanning exposure of the first shot area S ₁ may be performed scanning exposure of the fourth shot area S _4. In this case, the mask facing example in the first shot area S _1, the mask and by using a (two masks in total), the first and fourth shot areas S ₁ corresponding to the fourth shot area S _4, it can be scanned exposing the S ₄ sequentially. Also, may be performed scanning exposure of the fourth shot area S ₄ by step movement of the mask M in the + X direction after the scanning exposure of the first shot area S _1.

In the above embodiments, the mark Mk is formed in each segmented region (first through fourth shot areas S ₁ to S ₄₎ within, not limited to this, the area between the adjacent divided areas (the so-called It may be formed in the scribe line).

Further, in each of the above embodiments, a pair of illumination region IAM and exposure region IA separated in the Y-axis direction are generated on the mask M and the substrate P, respectively (see FIG. 1), but the illumination region IAM and the exposure region IA The shape and length are not limited to this and can be changed as appropriate. For example, the lengths of the illumination region IAM and the exposure region IA in the Y-axis direction may be equal to the lengths of the pattern surface of the mask M and one partition region on the substrate P in the Y-axis direction, respectively. In this case, the transfer of the mask pattern is completed by one scanning exposure operation for each section region. Alternatively, the illumination region IAM and the exposure region IA are one region whose length in the Y-axis direction is half the length in the Y-axis direction of the pattern surface of the mask M and one compartment region on the substrate P, respectively. Is also good. In this case, it is necessary to perform the scanning exposure operation twice for one section region as in the above embodiment.

Further, as in the above embodiment, when the projection system main body 42 is reciprocated to perform joint exposure in order to form one mask pattern in the partition region, the alignment for the outward route and the return route having different detection fields of view from each other. The microscope may be arranged before and after the projection system main body 42 in the scanning direction (X direction). In this case, for example, the alignment microscope for the outward route (for the first exposure operation) detects the mark Mk at the four corners of the compartmentalized area, and the alignment microscope for the return route (for the second exposure operation) detects the mark near the joint. Mk may be detected. Here, the joint portion means a joint portion between the region exposed by the scanning exposure on the outward route (the region where the pattern is transferred) and the region exposed by the scanning exposure on the return route (the region where the pattern is transferred). To do. As the mark Mk in the vicinity of the joint portion, the mark Mk may be formed on the substrate in advance, or the exposed pattern may be used as the mark Mk. In each of the above embodiments, when the projection system main body 42 is driven in the + X direction to perform the scanning exposure operation, the alignment microscope for the outward path is the alignment microscope 62, and the alignment microscope for the return path is the alignment microscope 64. When the projection system main body 42 is driven in the −X direction to perform the scanning exposure operation, the alignment microscope for the outward trip is the alignment microscope 64, and the alignment microscope for the return trip is the alignment microscope 62.

Further, in the above-described embodiment (and the first and second modifications), the drive system 24 for driving the illumination system main body 22 of the illumination system 20 and the drive system 34 for driving the stage main body 32 of the mask stage device 30. , The drive system 44 for driving the projection optical system main body 42 of the projection optical system 40, the drive system 54 for driving the stage main body 52 of the substrate stage device 50, and the alignment microscope 62 for the alignment system 60. The case where the drive system 66 (see FIG. 2 respectively) includes a linear motor has been described, but for driving the illumination system main body 22, the stage main body 32, the projection optical system main body 42, the stage main body 52, and the alignment microscope 62, respectively. The type of the actuator is not limited to this, and can be appropriately changed. For example, various actuators such as a feed screw (ball screw) device and a belt drive device can be appropriately used.

Further, in each of the above embodiments, the projection system main body 42 and the alignment microscope 62 share a part of the drive system in the scanning direction (for example, a linear motor, a guide, etc.), but the projection system main body 42 and the alignment microscope 62 The drive system 66 for driving the alignment microscope 62 and the drive system 44 for driving the projection system main body 42 of the projection optical system 40 are completely independently configured. You may be. That is, as in the exposure apparatus 10A shown in FIG. 10, the projection optical system main body 42 included in the projection optical system 40A and the alignment microscope 62 included in the alignment system 60A are arranged so that the Y positions do not overlap with each other. , The drive system 66 for driving the alignment microscope 62 (including, for example, a linear motor, a guide, etc.) and the drive system 44 for driving the projection system main body 42 (including, for example, a linear motor, a guide, etc.) are completely completed. Can be an independent configuration. In this case, before the start of the scanning exposure operation of the section area to be exposed, the alignment measurement of the section area is performed by step-moving (reciprocating) the substrate P in the Y-axis direction. Further, like the exposure apparatus 10B shown in FIG. 11, the drive system 44 (including, for example, a linear motor, a guide, etc.) for driving the projection optical system main body 42 included in the projection optical system 40B and the alignment system 60B have. By arranging the Y position of the drive system 66 (including, for example, a linear motor, a guide, etc.) for driving the alignment microscope 62 so as not to overlap, the drive system 44 and the drive system 66 are completely independent of each other. It can also be.

Further, in each of the above embodiments, the measurement system 26 for measuring the position of the lighting system main body 22 of the lighting system 20, the measuring system 36 for measuring the position of the stage main body 32 of the mask stage device 30, and the projection optical system 40. To measure the position of the measurement system 46 for measuring the position of the projection optical system main body 42, the measurement system 56 for measuring the position of the stage main body 52 of the substrate stage device 50, and the position measurement of the alignment microscope 62 of the alignment system 60. Although the case where each of the measurement systems 68 (see FIG. 2) of the above includes a linear encoder has been described, the lighting system main body 22, the stage main body 32, the projection system projection optical system main body 42, the stage main body 52, and the alignment microscope 62 have been described. The type of measurement system for performing position measurement is not limited to this, and can be changed as appropriate. For example, various measurement systems such as an optical interferometer or a measurement system using a linear encoder and an optical interferometer are appropriately used. It is possible.

Here, the lighting system 20, the mask stage device 30, the projection optical system 40, the substrate stage device 50, and the alignment system 60 may be modularized. The lighting system 20 is referred to as an illumination system module 12M, the mask stage device 30 is referred to as a mask stage module 14M, the projection optical system 40 is referred to as a projection optical system module 16M, the substrate stage device 50 is referred to as a substrate stage module 18M, and the alignment system 60 is referred to as an alignment system module 20M. .. Hereinafter, they are appropriately referred to as "each module 12M to 20M", but by being mounted on the corresponding pedestals 28A to 28E, they are arranged physically independently of each other.

Therefore, as shown in FIG. 12, in the liquid crystal exposure apparatus 10, any (one or a plurality) of the above modules 12M to 20M (in FIG. 12, the substrate stage module 18M as an example) is used as another module. It can be replaced independently of the module. At this time, the module to be replaced is integrally replaced with the pedestals 28A to 28E (the pedestal 28E in FIG. 12) that support the module.

During the replacement operation of the modules 12M to 20M, the modules 12M to 20M to be replaced (and the pedestals 28A to 28E supporting the modules) move in the X-axis direction along the floor 26 surface. Therefore, the pedestals 28A to 28E may be provided with, for example, wheels or an air caster device so that they can be easily moved on the floor 26, for example. As described above, in the liquid crystal exposure apparatus 10 of the present embodiment, any module among the modules 12M to 20M can be easily separated from the other modules individually, so that the maintainability is excellent. In addition, in FIG. 12, the substrate stage module 18M is separated from other elements by moving together with the gantry 28E in the + X direction (back side of the paper surface) with respect to other elements (projection optical system module 16M, etc.). Although shown, the moving direction of the module (and the gantry) to be moved is not limited to this, and may be, for example, the −X direction (front of the paper) or the + Y direction (above the paper). good. Further, a positioning device for ensuring the position reproducibility after installation of each of the pedestals 28A to 28E on the floor 26 may be provided. The positioning device may be provided on the pedestals 28A to 28E, or the installation positions of the pedestals 28A to 28E may be provided in cooperation with the members provided on the pedestals 28A to 28E and the members provided on the floor 26. May be configured to be reproduced.

Further, since the liquid crystal exposure apparatus 10 of the present embodiment has a configuration in which the modules 12M to 20M can be separated independently, each module 12M to 20M can be upgraded individually. In addition to the upgrade to cope with the increase in size of the substrate P to be exposed, for example, the upgrade is to replace each module 12M to 20M with a module having the same size but having improved performance. Including the case of

Here, for example, when the substrate P becomes large, the area of the substrate P (in the present embodiment, the dimensions in the X-axis and the Y-axis directions) is only increased, and the thickness of the substrate P (the dimensions in the Z-axis direction) is usually increased. , Substantially unchanged. Therefore, for example, when upgrading the substrate stage module 18M of the liquid crystal exposure apparatus 10 in response to an increase in the size of the substrate P, as shown in FIG. 12, the substrate stage module 18AM is newly inserted in place of the substrate stage module 18M. , And the gantry 28G that supports the substrate stage module 18AM changes its dimensions in the X-axis and / or Y-axis directions, but does not substantially change its dimensions in the Z-axis direction. Similarly, the size of the mask stage module 14M in the Z-axis direction does not substantially change due to the upgrade according to the increase in size of the mask M.

Further, for example, in order to expand the illumination area IAM and the exposure area IA (see FIGS. 1 and the like, respectively), the number of illumination optical systems included in the illumination system module 12M and the number of projection lens modules included in the projection optical system module 16M are increased. As a result, the lighting system module 12M and the projection optical system module 16M can be upgraded respectively. The lighting system module and projection optical system module (not shown) after the upgrade only change the dimensions in the X-axis and / or Y-axis directions compared to before the upgrade, and the dimensions in the Z-axis direction do not change substantially. ..

Therefore, in the liquid crystal exposure apparatus 10 of the present embodiment, the gantry 28A to 28E supporting each module 12M to 20M and the gantry supporting each of the upgraded modules (the substrate stage module 18AM shown in FIG. 12 are supported). The gantry 28G) has a standardized dimension in the Z-axis direction. Here, standardization means that the gantry before replacement and the gantry after replacement have the same dimensions in the Z-axis direction, that is, the dimensions in the Z-axis direction of the gantry that supports modules having the same function are substantially constant. Means that As described above, in the liquid crystal exposure apparatus 10 of the present embodiment, since the dimensions of the pedestals 28A to 28E in the Z-axis direction are standardized, it is possible to shorten the time required for designing each module.

Further, in the liquid crystal exposure apparatus 10, since the exposure surface of the substrate P and the pattern surface of the mask M are parallel to each other in the direction of gravity (so-called vertical arrangement), the illumination system module 12M, the mask stage module 14M, and the projection optical system module Each module of 16M and the substrate stage module 18M can be installed in series on the floor 26 surface. In this way, since their own weights do not act on each of the above modules, for example, the substrate stage device, the projection optical system, the mask stage device, and the illumination system corresponding to the above modules are stacked and arranged in the direction of gravity. Unlike conventional exposure equipment, it is not necessary to provide a highly rigid main frame (body) that supports each element. Further, since the structure is simple, it is possible to easily and quickly perform the installation (installation) work of the device, the maintenance work of each module 12M to 20M, the replacement work, and the like. Further, since each of the above modules is arranged along the floor 26 surface, the height of the entire device can be lowered. As a result, the chamber accommodating each of the above modules can be miniaturized, the cost can be reduced, and the installation construction period can be shortened.

Further, in each of the above embodiments, the wavelengths of the light source used in the illumination system 20 and the illumination light IL emitted from the light source are not particularly limited, and are, for example, ArF excimer laser light (wavelength 193 nm) and KrF excimer laser light (wavelength 193 nm). It may be ultraviolet light such as wavelength 248 nm) or vacuum ultraviolet light such as _{F 2 laser light (wavelength 157 nm).}

Further, in the above embodiment, the lighting system main body 22 including the light source is driven in the scanning direction, but the present invention is not limited to this, and the light source is fixed as in the exposure apparatus disclosed in, for example, Japanese Patent Application Laid-Open No. 2000-12422. , Only the illumination light IL may be scanned in the scanning direction.

Further, the illumination region IAM and the exposure region IA are formed in a band shape extending in the Y-axis direction in the above embodiment, but the present invention is not limited to this, and as disclosed in, for example, US Pat. No. 5,729,331. , A plurality of regions arranged in a staggered pattern may be combined.

Further, in each of the above embodiments, the mask M and the substrate P are arranged so as to be orthogonal to the horizontal plane (so-called vertical arrangement), but the present invention is not limited to this, and the mask M and the substrate P are arranged parallel to the horizontal plane. It may be arranged. In this case, the optical axis of the illumination light IL is substantially parallel to the direction of gravity.

Further, during the scanning exposure operation, the substrate P was precisely positioned in the XY plane according to the result of the alignment measurement, but in addition to this, before the scanning exposure operation (or in parallel with the scanning exposure operation), the substrate P was positioned. The surface position information may be obtained, and the surface position control of the substrate P (so-called autofocus control) may be performed during the scanning exposure operation.

Further, the application of the exposure device is not limited to the exposure device for liquid crystal that transfers the liquid crystal display element pattern to a square glass plate, for example, an exposure device for manufacturing an organic EL (Electro-Luminescence) panel, a semiconductor. It can be widely applied to an exposure device for manufacturing, a thin film magnetic head, a micromachine, an exposure device for manufacturing a DNA chip, and the like. Further, in order to manufacture masks or reticle used not only in microdevices such as semiconductor elements but also in optical exposure equipment, EUV exposure equipment, X-ray exposure equipment, electron beam exposure equipment and the like, glass substrates or silicon wafers and the like. It can also be applied to an exposure device that transfers a circuit pattern to a silicon wafer.

Further, the object to be exposed is not limited to the glass plate, and may be another object such as a wafer, a ceramic substrate, a film member, or a mask blank. When the object to be exposed is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and for example, a film-like (flexible sheet-like member) is also included. The exposure apparatus of the present embodiment is particularly effective when a substrate having a side length or a diagonal length of 500 mm or more is an exposure target. Further, when the substrate to be exposed is in the form of a flexible sheet, the sheet may be formed in a roll shape. In this case, the section area to be exposed can be easily changed (stepped) with respect to the illuminated area (illuminated light) by rotating (winding) the roll regardless of the step operation of the stage device. ..

For electronic devices such as liquid crystal display elements (or semiconductor elements), a step of designing the function and performance of the device, a step of manufacturing a mask (or reticle) based on this design step, and a step of manufacturing a glass substrate (or wafer). Except for the etching apparatus of each of the above-described embodiments, the lithography step of transferring the mask (reticle) pattern to the glass substrate by the exposure method, the developing step of developing the exposed glass substrate, and the portion where the resist remains. It is manufactured through an etching step of removing exposed members by etching, a resist removing step of removing a resist that is no longer needed after etching, a device assembly step, an inspection step, and the like. In this case, in the lithography step, the above-mentioned exposure method is executed using the exposure apparatus of the above embodiment, and the device pattern is formed on the glass substrate, so that a device having a high degree of integration can be manufactured with high productivity. ..

As described above, the exposure apparatus and method of the present invention are suitable for scanning and exposing an object. Further, the method for manufacturing a flat panel display of the present invention is suitable for producing a flat panel display. Moreover, the device manufacturing method of the present invention is suitable for the production of microdevices.

10 ... Liquid crystal exposure device, 20 ... Lighting system, 30 ... Mask stage device, 40 ... Projection optical system, 50 ... Substrate stage device, 60 ... Alignment system, M ... Mask, P ... Substrate.

Claims (20)

An exposure device that irradiates an object with illumination light via a projection optical system and scans and exposes the object while moving the projection optical system relative to the object in the scanning direction.
With respect to the scanning direction, a first detection device provided on one side of the projection optical system and a second detection device provided on the other side of the projection optical system are provided, and a mark of a mark provided on the object is provided. Mark detector for detection and
The first drive system that moves the mark detection unit and
The second drive system that moves the projection optical system and
A control device for controlling the first and second drive systems so as to move the mark detection unit before the movement of the projection optical system is provided.
The control device is
In the scanning exposure from the other side to the one side, the first detection device is moved from the other side to the one side, and the projection optical system is scanned based on the detection result by the first detection device. The second detection device is moved from the other side to the one side while performing the scanning exposure by moving the other side in the direction from the other side to the one side.
In the scanning exposure from the one side to the other side, the second detection device moved to the one side is moved to the other side, and the projection optical system is moved based on the detection result by the second detection device. An exposure apparatus that controls the first and second drive systems so as to move in the scanning direction and perform the scanning exposure. The exposure device according to claim 1, wherein the control device controls the first and second drive systems so as to move the projection optical system after at least a part of the mark detection by the mark detection unit is completed. The exposure device according to claim 1 or 2, wherein the control device controls to perform at least a part of a mark detection operation including the mark detection and a scanning exposure operation including the scanning exposure in parallel. The exposure device according to claim 3, wherein the control device makes the moving speed of the projection optical system different from the moving speed of the mark detection unit. The optical axis of the projection optical system is parallel to the horizontal plane,
The exposure apparatus according to any one of claims 1 to 4 , wherein the object is arranged in a state where the exposure surface irradiated with the illumination light is orthogonal to the horizontal plane. The exposure apparatus according to claim 5 , wherein the mark detection unit and the projection optical system are arranged so as to be separable from each other. The exposure device according to any one of claims 1 to 6 , wherein the object is a substrate used for a flat panel display device. The exposure apparatus according to claim 7 , wherein the substrate has at least one side length or a diagonal length of 500 mm or more. Exposing the object using the exposure apparatus according to any one of claims 1 to 8.
A method of manufacturing a flat panel display, comprising developing the exposed object. Exposing the object using the exposure apparatus according to any one of claims 1 to 8.
A device manufacturing method comprising developing the exposed object. An exposure method in which an object is irradiated with illumination light via a projection optical system, and the projection optical system is scanned and exposed while being relatively moved in the scanning direction with respect to the object.
The object is provided with respect to the scanning direction by a mark detection unit having a first detection device provided on one side of the projection optical system and a second detection device provided on the other side of the projection optical system. Mark detection and mark detection
Moving the mark detection unit using the first drive system
To move the projection optical system using the second drive system,
This includes controlling the first and second drive systems so that the mark detection unit is moved before the movement of the projection optical system.
By controlling the above,
In the scanning exposure from the other side to the one side, the first detection device is moved from the other side to the one side, and the projection optical system is scanned based on the detection result by the first detection device. The second detection device is moved from the other side to the one side while performing the scanning exposure by moving the other side in the direction from the other side to the one side.
In the scanning exposure from the one side to the other side, the second detection device moved to the one side is moved to the other side, and the projection optical system is moved based on the detection result by the second detection device. An exposure method in which the first and second drive systems are controlled so as to move in the scanning direction and perform the scanning exposure. The exposure method according to claim 11 , wherein the control controls the first and second drive systems so as to move the projection optical system after at least a part of the mark detection by the mark detection unit is completed. .. The exposure method according to claim 11 or 12 , wherein in the control, at least a part of the mark detection operation including the mark detection and the scanning exposure operation including the scanning exposure are controlled to be performed in parallel. The exposure method according to claim 13 , wherein the control makes the moving speed of the projection optical system different from the moving speed of the mark detection unit. The optical axis of the projection optical system is parallel to the horizontal plane,
The exposure method according to any one of claims 11 to 14 , wherein the object is arranged in a state where the exposure surface irradiated with the illumination light is orthogonal to the horizontal plane. The exposure method according to claim 15 , wherein the mark detection unit and the projection optical system are arranged so as to be separable from each other. The exposure method according to any one of claims 11 to 16 , wherein the object is a substrate used in a flat panel display device. The exposure method according to claim 17 , wherein the substrate has at least one side length or a diagonal length of 500 mm or more. To expose the object by using the exposure method according to any one of claims 11 to 18.
A method of manufacturing a flat panel display, comprising developing the exposed object. To expose the object by using the exposure method according to any one of claims 11 to 18.
A device manufacturing method comprising developing the exposed object.

Images