CN107533303A - Exposure device, the manufacture method of flat-panel screens, manufacturing method and exposure method - Google Patents

Exposure device, the manufacture method of flat-panel screens, manufacturing method and exposure method Download PDF

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Publication number
CN107533303A
CN107533303A CN201680020549.4A CN201680020549A CN107533303A CN 107533303 A CN107533303 A CN 107533303A CN 201680020549 A CN201680020549 A CN 201680020549A CN 107533303 A CN107533303 A CN 107533303A
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CN
China
Prior art keywords
exposure
mark
projection optics
optics system
action
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Granted
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CN201680020549.4A
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Chinese (zh)
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CN107533303B (en
Inventor
内藤夫
内藤一夫
青木保夫
长岛雅幸
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Nikon Corp
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Nikon Corp
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Liquid Crystal (AREA)

Abstract

Illumination light (IL) is irradiated to substrate (P) through projection optics system (30), and projection optics system (PL) is driven to be scanned the liquid crystal exposure apparatus of exposure (10) to substrate (P) is relative, possesses the aligming microscope (62 for the mark detection for carrying out the mark (Mk) located at substrate (P), 64), drive aligming microscope (62, 64) the 1st drivetrain, drive the 2nd drivetrain of projection optics system (40), and first to carry out aligming microscope (62 before the driving of projection optics system (40), 64) mode of driving controls the control device of the 1st and the 2nd drivetrain.In this way, the production time needed for exposure-processed can be suppressed.

Description

Exposure device, the manufacture method of flat-panel screens, manufacturing method and exposure Method
Technical field
The present invention is on exposure device, the manufacture method of flat-panel screens, manufacturing method and exposure method, specifically It, is on scanning in the scan exposure of set scanning direction by entering to be about to energy beam to object, predetermined pattern is formed and existed The manufacturer of exposure device and method on object and the flat-panel screens comprising foregoing exposure device or method or element Method.
Background technology
All the time, in electronic components (microcomponent) such as manufacture liquid crystal display cells, semiconductor elements (integrated circuit etc.) Lithographic manufacturing process, be to use exposure device, this exposure device using energy beam will be formed in light shield or graticule (it is following, Be referred to as " light shield ") pattern be transferred on glass plate or wafer (following, to be referred to as " substrate ").
As such a exposure device, it is known to it is a kind of in the state of making light shield and substrate substantially static, by exposure photograph Scan the scan exposure in set scanning direction, forming the wire harness scan-type of predetermined pattern on substrate according to this in Mingguang City's (energy beam) Device (referring for example to patent document 1).
The exposure device described in patent document 1 is being stated, for the exposure object region and the position of light shield on amendment substrate Error, be make projection optics system past with scanning direction opposite direction during exposure it is mobile, while by projection optics system with Aligming microscope carries out the measurement (to locating tab assembly) of the mark on substrate and on light shield, according to the measurement result amendment substrate and light The site error of cover.Herein, by then passing through the alignment mark on projection optics system measurement substrate, therefore alignment actions and exposure Action is sequentially (serially) implementation, is intended to suppress processing time (production time) right and wrong needed for the exposure-processed of all substrates Often difficult.
Look-ahead technique document Prior Art
[patent document 1] Japanese Unexamined Patent Publication 2000-12422 publications
The content of the invention
To the means to solve the problem
The present invention completes under above-mentioned thing, the exposure device of the 1st viewpoint, is that object illumination is shone through projection optics system Mingguang City, and the relative object drives the projection optics system to be scanned exposure, it possesses：Test section is marked, to be set In the mark detection of the mark of the object；1st drivetrain, it is to drive the mark test section；2nd drivetrain, it is to drive the projection Optical system；And control device, it is in a manner of the driving of the mark test section is first carried out before the driving in the projection optics system Control the 1st and the 2nd drivetrain.
The manufacture method of the flat-panel screens of 2nd viewpoint of the invention, it is included makes the thing using the exposure device of the present invention The action of body exposure and the action for making the object after exposure develop.
The manufacturing method of 3rd viewpoint of the invention, it is included makes what the object exposed using the exposure device of the present invention Action and the action for making the object after exposure develop.
The exposure method of 4th viewpoint of the invention, it is to pass through projection optics system to object illumination illumination light, and the relative object The projection optics system is driven to be scanned exposure, it is included：The mark located at the object carried out using mark test section Mark detection；Use the driving of the mark test section of the 1st drivetrain；Use the driving of the projection optics system of the 2nd drivetrain； And the 1st and the 2nd driving is carried out in a manner of the driving of the mark test section is first carried out before the driving in the projection optics system The control of system.
The manufacture method of the flat-panel screens of 5th viewpoint of the invention, it is included makes the thing using the exposure method of the present invention The action of body exposure and the action for making the object after exposure develop.
The manufacturing method of 6th viewpoint of the invention, it is included makes what the object exposed using the exposure method of the present invention Action and the action for making the object after exposure develop.
Brief description of the drawings
Fig. 1 is the concept map of the liquid crystal exposure apparatus of the 1st embodiment.
Fig. 2 is that the output for showing the main control unit formed centered on the control system of Fig. 1 liquid crystal exposure apparatus is entered the GATT The block diagram of system.
Fig. 3 is to illustrate that projection is the figure of the composition of the measurement system of body and aligming microscope.
Fig. 4 (a)~Fig. 4 (d) is the figure (its 1~its 4) of the action of liquid crystal exposure apparatus when illustrating exposure actions.
Fig. 5 (a)~Fig. 5 (d) is the figure (its 5~its 8) of the action of liquid crystal exposure apparatus when illustrating exposure actions.
Fig. 6 (a)~Fig. 6 (c) be the action of liquid crystal exposure apparatus when illustrating exposure actions figure (its 9~its 11)。
Fig. 7 (a)~Fig. 7 (c) be the action of liquid crystal exposure apparatus when illustrating exposure actions figure (its 12~its 15)。
Fig. 8 (a)~Fig. 8 (d) is the figure (its 1~its 4) of the action for the alignment system for illustrating the 2nd embodiment.
Fig. 9 (a) and Fig. 9 (b) is that (it 1 for the figure of action of the alignment system and projection optics system that illustrate the 3rd embodiment And its 2).
Figure 10 is the figure of the variation (its 1) for the drivetrain for showing projection optics system and alignment system.
Figure 11 is the figure of the variation (its 2) for the drivetrain for showing projection optics system and alignment system.
Figure 12 is the concept map of the module replacing of liquid crystal exposure apparatus.
【Main element symbol description】
10：Liquid crystal exposure apparatus 20：Illumination system
30：Mask stage device 40：Projection optics system
50：Baseplate carrier device 60：Alignment system
M：Light shield P：Substrate
Embodiment
《1st embodiment》
Hereinafter, the 1st embodiment is illustrated using Fig. 1~Fig. 7 (c).
The concept map of the liquid crystal exposure apparatus 10 of the 1st embodiment is shown in Fig. 1.Liquid crystal exposure apparatus 10, it is with for example Glass substrate P (below, only abbreviation substrate P) for the rectangle (square) of liquid crystal display device (flat-panel screens) etc. is exposure The projection aligner of step-scan (step＆scan) mode of object, so-called scanning machine.
Liquid crystal exposure apparatus 10, it is 20 and projected light with the illumination light IL of energy beam illumination to have irradiation as exposure Be 40.Hereinafter, by be from illumination the 20 illumination light IL for being irradiated in substrate P through projection optics systems 40 the parallel side of optical axis To referred to as Z-direction, and X-axis orthogonal in plane orthogonal to Z-axis and Y-axis are set in illustrate.Also, this implementation In the coordinate system of example, Y-axis is substantially parallel with gravity direction.Therefore, XZ planes are substantially parallel with horizontal plane.In addition, with about the z axis Rotation (inclination) direction illustrate for θ z directions.
Herein, be set with the present embodiment, a piece of substrate P multiple exposure object regions (appropriate title zoning region or (shot) region is irradiated to illustrate), sequentially transfer mask pattern in these multiple irradiation areas.Also, the present embodiment, though Illustrated for the situation (the so-called situation for taking 4 faces) that 4 zoning regions are set with substrate P, but the quantity in zoning region This is not limited to, can suitably be changed.
Also, in liquid crystal exposure apparatus 10, though the exposure actions of so-called step-scan mode are carried out, in scan exposure During action, light shield M and substrate P are substantially inactive state, and it is the 20 and relative light shield M of projection optics system 40 (illumination light IL) to illuminate And substrate P is moved (white arrow of reference picture 1) in X-direction (appropriate title scanning direction) with long stroke respectively.In contrast, In the stepwise operation carried out to change the zoning region of exposure object, light shield M is moved in X-direction with predetermined stroke stepping Dynamic, substrate P moves (the black arrow for respectively referring to Fig. 1) in Y direction with predetermined stroke stepping.
In Fig. 2, it is shown that the output for planning as a whole the main control unit 90 in each portion of composition of control liquid crystal exposure apparatus 10 is entered the GATT The block diagram of system.As shown in Fig. 2 liquid crystal exposure apparatus 10 possess illumination be 20, mask stage device 30, projection optics system 40, Baseplate carrier device 50, alignment are 60 etc..
Illumination is 20, and the illumination for possessing the light source (for example, mercury vapor lamp) comprising illumination light IL (reference picture 1) etc. is body 22.When scan exposure acts, the drivetrain 24 such as comprising linear motor is controlled by main control unit 90, according to this will illumination Be body 22 in X-direction with set long stroke turntable driving.Main control unit 90, for example, by including linear encoder etc. Measurement is 26 location informations for obtaining that illumination is the X-direction of body 22, and it is body 22 to be illuminated according to the location information Position controls.In the present embodiment, as illumination light IL, used such as g lines, h lines, i lines.
Mask stage device 30 possesses the microscope carrier body 32 for keeping light shield M.Microscope carrier body 32, can be by for example comprising linear The drivetrain 34 of motor etc. is in the appropriate stepping movement of X-direction and Y direction.Area in X-direction for change exposure object During the stepwise operation in partition domain, main control unit 90 is by control drivetrain 34, by the stepper drive of microscope carrier body 32 in X-axis side To.Also, as described later, the region (position) of exposure is scanned in zoning region of the Y direction for change exposure object During stepwise operation, main control unit 90 is by control drivetrain 34, by the stepper drive of microscope carrier body 32 in Y direction.Drivetrain 34, it can be driven a little in 3DOF (X, Y, θ z) direction in X/Y plane in aftermentioned alignment actions by light shield M is appropriate.Light M location information is covered, such as with the measurement comprising linear encoder etc. is 36 to be obtained.
Projection optics system 40, possesses the upright erect image for including and being tied up to equimultiple in substrate P (reference picture 1) and forming mask pattern The projection of optical system etc. be body 42.Projection is that body 42 configures (reference in the space formed between substrate P and light shield M Fig. 1).When scan exposure acts, main control unit 90 by such as controlling comprising the drivetrain 44 linear motor, with and shine The synchronous mode of bright system's body 22, it is body 42 to be projected in X-direction with set long stroke turntable driving.Main control unit 90, For example, by the measurement comprising linear encoder etc. be 46 obtain projection be location information of the body 42 in X-direction, according to this Location information carries out the position control that projection is body 42.
Return to Fig. 1, in liquid crystal exposure apparatus 10, when with from illumination be 20 illumination light IL illumination light shields M on illumination During the IAM of region, with by light shield M illumination light IL, through projection optics system 40 by the mask pattern in illumination region IAM Projection image's (part erect image), form the irradiation area (exposure region with the illumination light IL of illumination region IAM conjugation in substrate P Domain IA).And relative light shield M and substrate P, illumination light IL (illumination region IAM and exposure area IA) is relatively moved in scanning side To being scanned exposure actions according to this.That is, in liquid crystal exposure apparatus 10, be with illuminate be 20 and projection optics system 40 in substrate Light shield M pattern is generated on P, the exposure of the inductive layer (resist layer) in substrate P is made by illumination light IL, is formed in substrate P The pattern.
Herein, it is the 20 illumination region IAM generated on light shield M with illumination in the present embodiment, is contained in Y direction point From a pair of rectangular areas.The Y direction length of one rectangular area, it is set to the Y direction length of light shield M pattern plane Such as the 1/4 of (that is, the Y direction length in each zoning region being set in substrate P).Also, the interval between a pair of rectangular areas Also such as the 1/4 of the length of the Y direction of the same pattern plane for being set as light shield M.Therefore, the exposure in substrate P is generated Region IA, also same a pair of rectangular areas for being contained in Y direction separation.The present embodiment, for by light shield M pattern fully Substrate P is transferred to, though rescan exposure actions must be carried out for a zoning region, having can make illumination be body 22 and throw The advantages of shadow system body 42 minimizes.The concrete example made on scan exposure Move, is chatted after remaining.
Baseplate carrier device 50, tool are kept the microscope carrier body 52 at the back side (face opposite with plane of exposure) of substrate P.Return to Fig. 2, Y direction change exposure object zoning region stepwise operation when, main control unit 90 by control for example comprising The drivetrain 54 of linear motor etc., by microscope carrier body 52 toward Y direction stepper drive.Drivetrain 54, can be in substrate pair described later Substrate P is driven a little in 3DOF (X, Y, θ z) direction in X/Y plane during quasi- action.The position of substrate P (microscope carrier body 52) Information is put, it with the measurement such as comprising linear encoder is 56 to be obtained to be.
Return to Fig. 1, alignment is 60 for example to possess 2 aligming microscopes 62,64.Aligming microscope 62,64, is configured in base In the space formed between plate P and light shield M (position between the substrate P of Z-direction and light shield M), detection is formed in substrate P Alignment mark Mk (following, only to claim mark Mk) and form mark (not shown) in light shield M.In the present embodiment, mark Mk is each Four near corners in zoning region be respectively formed with 1 (for 1 zoning region, such as 4), light shield M mark, pass through The formation of projection optics system 40 is in position corresponding with mark Mk.Also, quantity and the position of mark Mk and light shield M mark, unlimited Due to this, can suitably change.In addition, in each drawing, for ease of understanding, mark Mk is that the relatively reality shown is big.
An aligming microscope 62 therein configure in projection be body 42+X sides, another aligming microscope 64 then configures Projection is the-X sides of body 42.Aligming microscope 62,64, there are a pair of the detection visual field (detections in Y direction separation respectively Region), it can detect simultaneously in a zoning region in such as 2 mark Mk of Y direction separation.
Also, aligming microscope 62,64, can be simultaneously (in other words, in the situation for the position for not changing aligming microscope 62,64 Under) detect formation in light shield M mark and form the mark Mk in substrate P.Main control unit 90, such as enter every time in light shield M When row X stepwise operations or substrate P carry out Y stepwise operations, obtain to form the mark in light shield M with forming the mark Mk in substrate P Relative offset information, and the relative positioning of substrate P and light shield M in the direction along X/Y plane is carried out, to correct the position Put skew (offset or reduce).Also, aligming microscope 62,64, be by detect the light shield test section of (observation) light shield M mark, The substrate test section of mark Mk with detecting (observation) substrate P is integrally formed by common casing etc., passes through the common case Body is driven by drivetrain 66.Or can also be that light shield test section is made up of with substrate test section individual other casing etc., this Occasion, being preferably constructed can be moved for such as light shield test section and substrate test section by the common drivetrain 66 of essence with equal Moved as characteristic.
Main control unit 90 (reference picture 2), it is the drivetrain 66 by control such as comprising linear motor, alignment is aobvious Micro mirror 62,64 is with the driving independently of set long stroke in X-direction.Also, main control unit 90, for example, by comprising linear The measurement of encoder etc. is 68 to obtain aligming microscope 62, the location information of 64 respective X-directions, according to the location information point The position control of not independent progress aligming microscope 62,64.In addition, projection is body 42 and aligming microscope 62,64, its Y The position of direction of principal axis is almost identical, and mutual mobile range part repeats.
Herein, though alignment is 60 aligming microscope 62,64 and the projection of above-mentioned projection optics system 40 is that body 42 is thing The key element of (mechanically) independent (separation), is driven by main control unit 90 (reference picture 2) in a manner of independent of each other in reason (speed and position) controls, but drives the drivetrain 66 of aligming microscope 62,64 with driving the drivetrain that projection is body 42 44, share the part such as linear motor, linear guide, aligming microscope 62,64 and projection in the drivetrain of X-direction It is the drive characteristic of body 42 or the control characteristic carried out by main control unit 90 is that essence is equal.
Specifically as an example for, for example with moving-coil type linear motor by aligming microscope 62,64, projection be body 42 Drive respectively when the situation of X-direction, above-mentioned drivetrain 66 and drivetrain 44 are to share stator magnetic (such as permanent magnetic Stone etc.) unit.In contrast, can mover coil unit be then in alignment with microscope 62,64, projection be that body 42 independently has Have, main control unit 90 (reference picture 2) is micro- by the supply of electric power carried out individually to the coil unit, independent control alignment Mirror 62,64 is body 42 toward driving (speed and the position of X-direction toward the driving (speed and position) of X-direction, with projection Put).Therefore, it is body 42 that main control unit 90, which changes and (arbitrarily changed) in the aligming microscope 62,64 of X-direction and projection, Interval (distance).In addition, main control unit 90, also can X-direction make aligming microscope 62,64 and projection be body 42 with Different speed movements.
Main control unit 90 (reference picture 2), formed using aligming microscope 62 (or aligming microscope 64) detection in substrate P On multiple mark Mk, reinforced alignment is justified with known holocrystalline according to the testing result (multiple mark Mk location informations) (EGA) mode, the arrangement information in the zoning region of the mark Mk formed with detection object is calculated (comprising the position with zoning region The related information such as (coordinate value), shape).
Specifically, in scan exposure action, when it is to be driven in +X direction that projection, which is body 42, main control unit 90 (reference pictures 2), it is first the aligming microscope 62 of+X sides of body 42 in projection using configuration before scan exposure action Multiple mark Mk position detection is carried out, to calculate the arrangement information in the zoning region of exposure object.Also, acted in scan exposure In, when it is to be driven in -X direction that projection, which is body 42, before scan exposure action, it is in projection using configuration first The aligming microscope 64 of-X sides of body 42 carries out multiple mark Mk position detection, to calculate the zoning region of exposure object Arrangement information.Main control unit 90 is according to the arrangement information calculated, while carrying out the 3DOF side in the X/Y plane of substrate P To careful positioning (base plate alignment action), one side suitable control illumination be that 20 and projection optics system 40 are carried out to object zoning The scan exposure action (transfer of mask pattern) in region.
Secondly, the projection that illustrating to obtain projection optics system 40 has is that the measurement of the location information of body 42 is 46 (reference picture 2) and to obtain the specific composition that the measurement for the location information that alignment is 60 aligming microscopes 62 having is 68.
As shown in figure 3, it is guiding element 80 that body 42 is oriented to scanning direction that liquid crystal exposure apparatus 10, which has that will project,.Lead Part 80 with the component that scanning direction extends in parallel by forming.Guiding element 80 also has shifting of the guiding aligming microscope 62 toward scanning direction Dynamic function.Also, in Fig. 7, though guiding element 80 is shown between light shield M and substrate P, in fact, guiding element 80 is in Y direction Configuration is in the position for the light path for avoiding illumination light IL.
In guiding element 80, it is fixed with and comprises at least with the direction (X-direction) parallel with scanning direction as the anti-of cycle direction The scale 82 of emitting diffraction grating.Also, projection is that body 42 has the read head 84 oppositely disposed with scale 82.In the present embodiment, It is 46 (references formed with the measurement for forming to obtain the location information that projection is body 42 by said scale 82 and read head 84 Encoder system Fig. 2).In addition, aligming microscope 62,64, have respectively the read head 86 oppositely disposed with scale 82 (in Fig. 3, Aligming microscope 64 is not shown).In the present embodiment, show formed with forming to obtain with read head 86 by said scale 82 to be aligned The measurement of the location information of micro mirror 62,64 is the encoder system of 68 (reference pictures 2).Herein, read head 84,86 can be respectively to scale 82 irradiation encoder measurement light beams, and the light beam (in the reflected beams of scale 82) through scale 82 is received, according to the light As a result the relative position information to scale 82 is exported.
As previously discussed, in the present embodiment, scale 82 forms to obtain the measurement that projection is the location information of body 42 Be 46 (reference pictures 2), the measurement that also forms to obtain the location information of aligming microscope 62,64 be 68 (reference pictures 2).Also That is, projection is body 42 and aligming microscope 62,64 is according to common set by the diffraction grating in scale 82 to be formed Coordinate system (survey major axis) carries out position control.Also, to drive projection to be the drivetrain 44 (reference picture 2) of body 42 and use To drive the drivetrain 66 (reference picture 2) of aligming microscope 62,64, its key element can it is a part of it is common, can also be completely self-contained Key element is formed.
Can survey major axis only such as X-direction (scanning side also, forming the encoder system that above-mentioned measurement is 46,68 To) linear (1DOF) encoder system, can also have and most survey major axis.For example, can by by read head 84,86 in Y direction With predetermined distance configure it is multiple, obtain according to this projection be body 42, aligming microscope 62,64 θ z directions rotation amount.Also, also Can form XY2 dimension diffraction gratings in scale 82, there is the 3DOF codings for surveying major axis in the 3DOF direction in X, Y, θ z direction Device system.Furthermore can act also as read head 84,86 can also be carried out with scale face just in addition to direction using multiple except the cycle of diffraction grating Read head is tieed up in known 2 that the survey in the direction of friendship is long, to obtain the 6DOF direction that projection is body 42, aligming microscope 62,64 Location information.
Secondly, the one of the action of the liquid crystal exposure apparatus 10 when illustrating that scan exposure acts using Fig. 4 (a)~Fig. 7 (c) Example.Following exposure actions (include and acted to locating tab assembly) are (in Fig. 4 (a)~Fig. 7 (c) not shown in main control unit 90.Ginseng Zhao Fig. 2) management under carry out.
In the present embodiment, zoning region (following, the 1st irradiation area S of title of exposure order at first1) it is set at substrate P - X sides and-Y sides.Also, assign the symbol S in the zoning region in substrate P2~S4, it is to represent exposure order respectively as the 2nd The irradiation area of~4.
As shown in Fig. 4 (a), before exposure starts, projection is each of body 42 and aligming microscope 62,64, is to overlook Lower configuration is being set in the 1st irradiation area S1- X sides primary position.Now, projection be body 42 with aligming microscope 62, 64 be that proximity configures each other in X-direction.Also, the Y direction position in the detection visual field of aligming microscope 62 with formed the 1st and 4th irradiation area S1、S4Interior mark Mk Y direction position is almost consistent.
Then, main control unit 90, as shown in Fig. 4 (b), aligming microscope 62 is driven and formed in +X direction, detection 1st irradiation area S1Interior such as 4 are marked in Mk, such as 2 mark Mk (reference pictures 4 of the formation near-X side ends (b) the thick line circle mark in.It is as follows).Also, main control unit 90, as shown in Fig. 4 (c), further drives aligming microscope 62 Move in +X direction, formed with detection in the 1st irradiation area S1In such as 4 interior mark Mk, formed near+X side ends Such as 2 mark Mk.Also, in Fig. 4 (b), it is off though projection is body 42, can be proceeded by aligming microscope 62 1 irradiation area S1After interior mark Mk detection, carrying out in mark Mk detection, such as the mark in detection-X sides In being moved to after Mk during the mark Mk of+X sides (specifically, detection+X sides mark Mk eve), start to project It is the acceleration of body 42.
Main control unit 90, according to formation in above-mentioned 1st irradiation area S1The testing result of such as 4 interior mark Mk (location information), obtain the 1st irradiation area S1Arrangement information.Main control unit 90, as shown in Fig. 4 (d), while according to the 1st Irradiation area S1The arrangement information precision positioning in 3DOF direction that carries out in the X/Y plane of substrate P (base plate alignment moves Make), while it is body 42 and to illuminate be that 20 illumination is that body 22 is (in Fig. 4 (d) not shown that will project.Reference picture 1) synchronously drive Move in +X direction, to carry out to the 1st irradiation area S1The scan exposure of the 1st time.
Also, main control unit 90, and to the 1st irradiation area S1The 1st scan exposure action beginning it is parallel, using pair The quasi- detection of microscope 62 is formed in the 4th irradiation area S4(the 1st irradiation area S1+ X sides zoning region) in such as 4 mark Remember in Mk, such as 2 mark Mks of the formation near-X side ends.
Main control unit 90, can be according to the 4th irradiation area S newly obtained4The testing result of such as 2 interior mark Mk, The 1st irradiation area S with obtaining (being stored in memory device (not shown)) before1The testing result of such as 4 interior marks, EGA is carried out to calculate to update the 1st irradiation area S1Arrangement information.Main control unit 90, can be while according to this updated row Row information suitably carries out the precision positioning in the 3DOF direction in the X/Y plane of substrate P, while the 1st irradiation area S that continues1's Scan exposure acts.To obtain the 1st irradiation area S1Arrangement information and use the 4th irradiation area S4Interior mark position information, With according only to being located at the 1st irradiation area S14 mark Mk come obtain arrangement information compare, can obtain and wide scope is considered The arrangement information being statistically inclined to, and can be lifted on the 1st irradiation area S1Alignment precision.
Also, main control unit 90, as shown in Fig. 5 (a), while being that body 42 is driven in +X direction to be scanned by projection Exposure actions, further aligming microscope 62 is driven to be formed in the 4th irradiation area S to detect in +X direction on one side4Interior example As in 4 mark Mk, formed such as 2 near+X side ends mark Mk.Main control unit 90, can be according to newly obtained 4 irradiation area S4The testing result of such as 2 interior mark Mk and the mark Mk obtained before (are the 1st irradiated regions in this example Domain S1Such as 4 interior mark Mk and the 4th irradiation area S4Interior such as 2 marks Mk) testing result carry out EGA calculating, To update the 1st irradiation area S1Arrangement information.Main control unit 90, can be while carry out base according to this updated arrangement information The precision positioning in the 3DOF direction in plate P X/Y plane, while the 1st irradiation area S that continues1Scan exposure action.
As previously discussed, in the present embodiment, it is that body 42 configures in front of scanning direction (+X sides that relative projection, which can be used, To) aligming microscope 62, simultaneously (parallel) examinations compared with exposure area IA (illumination light IL) formed in front of scanning direction The mark Mk of (+X direction) action, with make projection be body 42 scan in +X direction scan exposure action at least one Point.In this way, the time needed for the series of actions comprising alignment actions and scan exposure action can be shortened.In addition, main control Device 90, EGA calculating can be suitably carried out when sequentially measuring the mark Mk for being for example located at diverse location every time, with renewal exposure pair The arrangement information in the zoning region of elephant.Accordingly, the alignment precision in the zoning region of exposure object can be lifted.
Also, main control unit 90, for be scanned exposure actions and when being that body 42 is driven in +X direction by projection, can It is that body 42 configures aligming microscope 64 in scanning direction rear (-X direction) by relative projection, and be body to follow projection 42 mode is driven in +X direction (reference picture 5 (a) and Fig. 5 (b)).Now, main control unit 90, aligming microscope 64 can be used Detection forms the mark Mk in scanning direction rear (-X direction) compared with exposure area IA (illumination light IL), and this testing result is used Calculated in EGA.
As previously discussed, in the present embodiment, due on the illumination region IAM (reference picture 1) and substrate P that are generated on light shield M The exposure area IA of generation, it is in a pair of rectangular areas of Y direction separation, therefore is transferred to base with single pass exposure actions Plate P light shield M pattern image, it is formed in a pair of belt-like zones for extending X-direction (one in Y direction separation A semi-area in the gross area in zoning region) in.
Then, main control unit 90, as shown in Fig. 5 (b), to carry out the 1st irradiation area S1The 2nd time (multiple road) scanning expose Light acts, and substrate P and light shield M is moved (the black arrow of reference picture 5 (b)) toward -Y direction stepping.The stepping of substrate P now Amount of movement is a zoning region in such as 1/4 length of the length of Y direction.Now, in substrate P and the past-Y sides of light shield M To stepping movement in, be desirable in a manner of the relative position relation of substrate P and light shield M will not change (or, can correct The mode of the relative position relation) make its stepping movement preferable.
In the present embodiment, the 1st irradiation area S1The 2nd scan exposure action, be to make projection system sheet as shown in Fig. 5 (c) Body 42 is carried out toward -X direction movement.Main control unit 90, aligming microscope 64 is driven in -X direction, formed with detection 1st irradiation area S1Mark Mk (not shown) near interior such as+X side ends.Main control unit 90, while according to this alignment The testing result of microscope 64 and above-mentioned 1st irradiation area S1Arrangement information carry out substrate P X/Y plane in 3DOF side To precision positioning, while carry out the 1st irradiation area S1The 2nd scan exposure action.Accordingly, as shown in Fig. 5 (d), by The mask pattern and act the mask pattern of transfer i.e. the 1st by the 2nd scan exposure that 1st scan exposure action transfers Irradiation area S1Interior engagement, light shield M pattern entirety are transferred to the 1st irradiation area S1.Also, corresponding 1st irradiation area S1 The alignment actions of 2 scan exposures, due to only needing each 2 points of the mark (+X according to light shield M mark and the mark Mk of substrate P Side marks) position deviation in 3DOF (X, Y, θ z) direction in measurement X/Y plane, therefore compared with the 1st alignment actions, The time needed for alignment can substantially be shortened.
When to the 1st irradiation area S1Scan exposure at the end of, main control unit 90, to carry out to the 2nd irradiation area S2 (the 1st irradiation area S1+ Y sides zoning region) scan exposure action and make substrate P toward -Y direction stepping move after, with With above-mentioned to the 1st irradiation area S1Scan exposure action identical program carry out to the 2nd irradiation area S2Scan exposure.
That is, to the 2nd irradiation area S2The 1st scan exposure action, as shown in Fig. 6 (a), be basis to be aligned it is micro- The 2nd irradiation area S that mirror 62 detects2And the 3rd irradiation area S3(the 2nd irradiation area S2+ X sides zoning region) in mark Mk testing result obtains the 2nd irradiation area S2Arrangement information, according to this arrangement information carry out substrate P X/Y plane in 3 The precision positioning in free degree direction.Wherein, the 3rd irradiation area S3Interior mark Mk detection operation (and renewal of arrangement information) With to the 2nd irradiation area S2Scan exposure action at least a portion be parallel.Also, main control unit 90, makes substrate P And after light shield M moves toward -Y direction stepping, the 2nd irradiation for example formed near+X side ends is detected with aligming microscope 64 Region S2Interior mark Mk (not shown).Main control unit 90, while being shone according to the testing result of this aligming microscope 64 and the 2nd Penetrate region S2Arrangement information carry out substrate P X/Y plane in 3DOF direction precision positioning, while such as Fig. 6 (b) institutes Show, while projection is that body 42 moves toward -X direction, carry out to the 2nd irradiation area S2The 2nd scan exposure move Make.
When to the 2nd irradiation area S2Scan exposure at the end of, main control unit 90, by making, light shield M (reference picture 1) is past +X direction stepping is moved, so that light shield M and the 3rd irradiation area S in substrate P3To.Main control unit 90, it is micro- to be aligned Mirror 62, which detects, for example to be formed in the 3rd irradiation area S3Mark Mk near interior-X side ends.Main control unit 90, in this shape Under state, as shown in Fig. 6 (c), make projection be body 42 toward +X direction it is mobile, while carrying out to the 3rd irradiation area S3The 1st Secondary scan exposure action.Alignment (precision positioning of substrate P) control now, is to regard the 3rd irradiation area S3Arrangement information And the testing result of aligming microscope 62 is carried out.3rd irradiation area S3Arrangement information system according to making the 2nd irradiation area S2Exposure When calculated the 2nd and the 3rd irradiation area S2、S3Interior mark Mk position is calculated, in aligming microscope 62, it is only necessary to root According to making the 3rd irradiation area S3With each 2 points of light shield Ms of the light shield M in the state of oppositely disposed mark and the mark Mk of substrate P Mark, measure X/Y plane in 3DOF (X, Y, θ z) direction position deviation.Therefore, with the 2nd irradiation area S2's Alignment compares, and can substantially shorten the 3rd irradiation area S3Alignment needed for time.
Afterwards, main control unit 90, to carry out to the 3rd irradiation area S3The 2nd scan exposure action, such as Fig. 7 (a) institutes Show, substrate P and light shield M is moved in +Y direction stepping.Accordingly, aligming microscope 64 detection the visual field Y direction position, With being formed in the 2nd and the 3rd irradiation area S2、S3The position of interior mark Mk Y direction is almost consistent.
Main control unit 90, with above-mentioned to the 1st irradiation area S1The 1st scan exposure action identical program (only, The aligming microscope of detection for marking Mk is different), carry out to the 3rd irradiation area S3The 2nd scan exposure action.Also That is, main control unit 90, to the 3rd irradiation area S3The 2nd scan exposure action, be body in projection as shown in Fig. 7 (b) Before 42, detected and formed in the 3rd irradiation area S by aligming microscope 643Such as 4 interior mark Mk, it is main depending on this testing result Control device 90 updates the 3rd irradiation area S3Arrangement information.Main control unit 90, while according to this updated arrangement information Carry out the precision positioning in the 3DOF direction in the X/Y plane of substrate P, while carrying out to the 3rd irradiation area S3Scan exposure Action.Also, parallel with the action of this scan exposure, aligming microscope 64, as shown in Fig. 7 (c), detection is formed in the 2nd irradiation area S2Such as 4 interior mark Mk.Main control unit 90, while according to the irradiation of the mark Mk newly obtained location information renewal the 3rd Region S3Arrangement information, while with this parallel to the 3rd irradiation area S3The 2nd scan exposure action.
Hereinafter, although not shown, but the system of main control unit 90 on one side the appropriate Y stepwise operations for carrying out substrate P, while carrying out pair 4th irradiation area S4Scan exposure.To this 4th irradiation area S4Scan exposure action, because with to the 3rd irradiation area S3's Scan exposure action is roughly the same, and description will be omitted.
Also, to the 3rd and the 4th irradiation area S3、S4Scan exposure action when, can be used together with aligming microscope 64 Mk detection is marked in aligming microscope 62, uses the arrangement in the output renewal zoning region of these aligming microscopes 62,64 Information.In addition, to make the 2nd irradiation area S2Later zoning regional exposure and when seeking the arrangement information in the zoning region, can Calculated mark Mk location information when before use to make zoning regional exposure.Specifically, such as the 4th irradiated region is being sought Domain S4Arrangement information when, though main control unit 90 is to use the 1st and the 4th irradiation area S1、S4Interior mark Mk position money News, but also can be with this and with the 2nd and the 3rd irradiation area S obtained before2、S3Interior mark Mk location information.
The present embodiment from the description above, because aligming microscope 62,64 is that to be that body 42 separates with projection independent Moved toward scanning direction, therefore scan exposure action and at least a portion of alignment actions can carry out (parallel) simultaneously.So as to energy Seek the time needed for the series of actions comprising alignment actions and scan exposure action that is, seek the exposure-processed of substrate P The shortening of required a succession of processing time (production time).
Also, due to be scanning direction in projection be body 42 side and opposite side be each configured with aligming microscope 62nd, 64, therefore the scanning direction (scan toward road and scanned with multiple road) when can be acted with scan exposure is unrelated, shorten comprising being aligned Time of the action needed for the series of actions of scan exposure action.
《2nd embodiment》
Then, using Fig. 8 (a)~Fig. 8 (d), the liquid crystal exposure apparatus of the 2nd embodiment is illustrated.The liquid crystal of 2nd embodiment exposes The composition of electro-optical device, it is all identical with above-mentioned 1st embodiment in addition to the composition of alignment system and action are different, therefore, below, only say Bright dissimilarity, and for having the key element of identical composition and function with above-mentioned 1st embodiment, then assign and above-mentioned 1st embodiment Simultaneously the description thereof will be omitted for identical symbol.
In above-mentioned 1st embodiment, it is that body 42 (+X sides and-X sides) before and after scanning direction is respectively configured to projection to be Aligming microscope 62,64 (reference picture 1), as shown in Fig. 8 (a), it is body only in projection in contrast, in this 2nd embodiment 42+X sides are provided with aligming microscope 162.
Also, the aligming microscope 62,64 for being compared to above-mentioned 1st embodiment has a pair of detections in Y direction separation The visual field (reference picture 4 (b) etc.), aligming microscope 162 then have in such as 4 detection visuals field of Y direction separation.It is aligned micro- Such as 4 detection visuals field possessed by mirror 162, its mutual interval are set to detect simultaneously across formation in Y direction The mark Mk in such as 2 adjacent zoning regions.
In this 2nd embodiment, main control unit 90 (reference picture 2), as shown in Fig. 8 (b) and Fig. 8 (c), in the 1st irradiated region Domain S1Scan exposure action before, while aligming microscope 162 is driven in +X direction, while being formed in substrate P Such as total 16 marks Mk detection, the 1st irradiation area S is obtained according to this mark Mk testing result1Arrangement information, and Depending on the arrangement information carry out substrate P precise position control, while Ru Fig. 8 (d) it is shown by projection be body 42 drive in+ X-direction carries out the 1st irradiation area S1Scan exposure action.
In this 2nd embodiment, due to aligming microscope 162 in Y direction with such as 4 detection visuals field, therefore by Make aligming microscope 62 once, can detect to form that (this 2nd in the mark Mk at the wider place of substrate P toward +X direction movement It is all mark Mk in embodiment).Therefore, compared with the 1st embodiment, the company needed for the exposure-processed of substrate P can be sought The further shortening of string manipulation time (production time).
In this 2nd embodiment, also with above-mentioned 1st embodiment likewise, be by the Y stepwise operations for carrying out substrate P and/ Or light shield M (reference picture 1) X stepwise operations, to be exposed the movement in the zoning region of object.Also, in this 2nd embodiment, Due to being in the 1st irradiation area S1Scan exposure before, detection forms all mark Mk in substrate P, therefore in the 2nd irradiated region Domain S2During later scan exposure, without carrying out EGA calculating again.Certainly, also can be in the 2nd irradiation area S2Later scanning exposes Light time, re-start to locating tab assembly (EGA calculating) to update the arrangement information in each zoning region.
《3rd embodiment》
Then, the liquid crystal exposure apparatus of the 3rd embodiment is illustrated using Fig. 9 (a) and Fig. 9 (b).The liquid crystal of 3rd embodiment exposes The composition of electro-optical device, it is all identical with above-mentioned 1st embodiment in addition to the composition of alignment system and action are different, therefore, below, only say Bright dissimilarity, and for having the key element of identical composition and function with above-mentioned 1st embodiment, then assign and above-mentioned 1st embodiment Simultaneously the description thereof will be omitted for identical symbol.
In above-mentioned 1st embodiment, alignment be 60 be projection be body 42 scanning direction before and after (+X sides and-X sides) have There is aligming microscope 62,64, in contrast, the difference in this 3rd embodiment is, only set in+X the sides that projection is body 42 There is aligming microscope 62.
In this 3rd embodiment, main control unit 90 (reference picture 2), the relative projection of substrate P is set to be that body 42 carries out Y steps It is to make aligming microscope 62 and projection be that body 42 revert to set primary position when entering.Specifically, such as Fig. 9 (a) institutes Show, as the 1st irradiation area S1Scan exposure release when, main control unit 90, with above-mentioned 1st embodiment likewise, such as Shown in Fig. 9 (b), make substrate P toward -Y direction Y stepwise operations (the black arrow of reference picture 9 (b)).
Also, main control unit 90, parallel toward the Y stepwise operations of -Y direction with aforesaid substrate P, respectively by aligming microscope 62 and projection are that body 42 is driven in -X direction, it is returned (white arrow of reference picture 9 (b)) to primary position (reference picture 4 (a)).In the present embodiment, aligming microscope 62 and projection be body 42 primary position, be respective mobile range-X Near side end.Afterwards, main control unit 90, it is respectively that body 42 is driven in +X direction by aligming microscope 62 and projection, according to To carry out to the 1st irradiation area S1The 2nd scan exposure action.In addition, also can before the 2nd scan exposure action herein, with Aligming microscope 62 is formed the detection operation in the mark Mk of substrate P, according to its output, updates the 1st irradiation area S1's Arrange information.
According to this 3rd embodiment, even if aligming microscope 62 only has one, can also obtain same with above-mentioned 1st embodiment Effect.
Also, the composition of the 1st~the 3rd each embodiment described above, can suitably be changed.For example, implement the above-mentioned 2nd Example, can be with above-mentioned 1st embodiment likewise, in scanning direction in the both sides (+X sides and-X sides) configuration pair that projection is body 42 Quasi- microscope 162.This occasion, also can first it be aligned before projection is the movement of body 42 even if scanning direction is -X direction Measurement.
Also, above-mentioned 1st embodiment, though in the 1st irradiation area S1All mark Mk detection terminate after, start this 1 irradiation area S1Scan exposure action, but not limited to this can also be formed at the 1st irradiation area S1Interior multiple mark Mk's In measurement, start the 1st irradiation area S1Scan exposure action.
Also, in the various embodiments described above, though locating tab assembly action is acted with scan exposure be it is parallel to single substrate P, not It is limited to this, also can for example prepares two plate base P, carries out the scan exposure to a substrate P therein, while carrying out to another Substrate P to locating tab assembly.
Also, in the various embodiments described above, though in the 1st irradiation area S1Scan exposure after, be set in the 1st irradiation Region S1+ Y (on) the 2nd irradiation area S of side2Scan exposure, but not limited to this also can be in the 1st irradiation area S1Scanning Next of exposure, is carried out to the 4th irradiation area S4Scan exposure.This occasion, can by using for example with the 1st irradiation area S1 To light shield and with the 4th irradiation area S4To light shield (add up to two pieces of light shields), to the 1st and the 4th irradiation area S1、S4 It is carried out continuously scan exposure.In addition, also can be in the 1st irradiation area S1Scan exposure after, make light shield M toward +X direction stepping move To carry out the 4th irradiation area S4Scan exposure.
Also, in the various embodiments described above, though mark Mk is formed in each zoning region (the 1st~the 4th irradiation area S1~S4) It is interior, but not limited to this, it also may be formed at adjacent region and draw in interregional region (so-called line (scribe line)).
Also, in the various embodiments described above, though a pair of the illumination region IAM, the exposure area IA that are separated in Y direction are distinguished Generation is in light shield M, substrate P (reference picture 1), but illumination region IAM and exposure area IA shape, length not limited to this, can Suitably changed.For example, illumination region IAM, exposure area IA Y direction length, can respectively the pattern plane with light shield M, The Y direction equal length in a zoning region in substrate P.This occasion, 1 scan exposure action is carried out to each zoning region Terminate the transfer of mask pattern.Or illumination region IAM, exposure area IA, can be that Y direction length is respectively light shield M Pattern plane, a region of the half of the Y direction length in a zoning region in substrate P.This occasion, with above-mentioned implementation Example is likewise, 2 scan exposure actions must be carried out to a zoning region.
Also, such as above-mentioned embodiment, for a mask pattern is formed in zoning region, and projection is set to be that body 42 is reciprocal During engage the situation of exposure, the past road in the detection visual field with inequality can be used and multiple road aligming microscope is in scanning Direction (X-direction) configuration is before and after projection is body 42.This occasion, such as can be used toward road and use (the 1st exposure actions use) Aligming microscope detection division region corner mark Mk, use the multiple road aligming microscope of (the 2nd exposure actions use) Detect the mark Mk near junction surface.Herein, so-called junction surface, the region (pattern turn of the scan exposure exposure on conventional road is referred to The region of print) with the bonding part in the region (region of pattern transfer) exposed with the scan exposure on multiple road.It is near as junction surface Other mark Mk, mark Mk, the pattern that can be also completed exposing can be formed as mark Mk in substrate P in advance.In above-mentioned each reality Example is applied, when being that body 42 is driven in +X direction to be scanned exposure actions by projection, is in alignment with toward road with aligming microscope Microscope 62, multiple road are then in alignment with microscope 64 with aligming microscope.In addition, it is being that body 42 is driven in -X direction by projection During being scanned exposure actions, microscope 64 is in alignment with aligming microscope toward road, multiple road is then in alignment with aligming microscope Microscope 62.
Also, in above-described embodiment (and the 1st, the 2nd variation), though the illumination for being directed to drive illumination to be 20 is body 22 drivetrain 24, to drive the drivetrain 34 of the microscope carrier body 32 of mask stage device 30, driving projection optics system The drivetrain 44 of 40 projection optics system body 42, to drive the drivetrain 54 of the microscope carrier body 52 of baseplate carrier device 50, And the situation to drive the drivetrain 66 (respectively referring to Fig. 2) of aligming microscope 62 that alignment is 60 to be respectively linear motor is done Explanation, but be body 22, microscope carrier body 32, projection optics system body 42, microscope carrier body 52 and right to drive above-mentioned illumination The species not limited to this of the actuator of quasi- microscope 62, can suitably be changed, such as can suitably use feed screw (ball screw) The various actuators of device, belt drive etc..
Also, in the various embodiments described above, though projection is body 42 and aligming microscope 62 is the driving for sharing past scanning direction A part (such as linear motor, guiding element etc.) for system, but as long as it is body 42 and aligming microscope 62 that can drive projection individually Words, not limited to this, to drive the drivetrain 66 of aligming microscope 62, with being body to drive the projection of projection optics system 40 42 drivetrain 44 can be completely self-contained composition.That is, as exposure device 10A as shown in Figure 10, can be by projection optics Be 40A with projection optics system body 42 be aligned be 60A with aligming microscope 62, it is unduplicated each other with Y location Mode configures so as to drive the drivetrain 66 of aligming microscope 62 (such as comprising linear motor, guiding element etc.) with driving Dynamic projection is the drivetrain 44 (such as comprising linear motor, guiding element etc.) of body 42, turns into completely self-contained composition.This occasion, By before the action of the scan exposure in the zoning region of exposure object starts, substrate P is set (back and forth to be moved toward Y direction stepping movement It is dynamic), carry out according to this zoning region to locating tab assembly.Also, as exposure device 10B that also can be as shown in figure 11, by will be to The drivetrain 44 (such as comprising linear motor, guiding element etc.) of the projection optics system bodies 42 that have of driving projection optics system 40B, with It will be configured to the drivetrain 66 (such as comprising linear motor, guiding element etc.) for driving alignment to be the aligming microscope 62 that 60B has Do not repeated into Y location, drivetrain 44 and drivetrain 66 is turned into completely self-contained composition.
Also, in the various embodiments described above, though for being that 20 illumination is the position measurement of body 22 to be illuminated Measurement is 26, is 36 to carry out the measurement of the position measurement of the microscope carrier body 32 of mask stage device 30, being projected The measurement of the position measurement of the projection optics system body 42 of optical system 40 is 46, carrying out the microscope carrier sheet of baseplate carrier device 50 The measurement of the position measurement of body 52 is 56 and is 68 to carry out the measurement of the position measurement for the aligming microscope 62 that alignment is 60 (respectively referring to Fig. 2), all situation comprising linear encoder are described, but are body 22, microscope carrier to carry out above-mentioned illumination Body 32, projection are the measuring system of the position measurement of projection optics system body 42, microscope carrier body 52 and aligming microscope 62 Species not limited to this, can suitably it change, such as can be suitably using optical interferometer or and with the survey of linear encoder and optical interferometer The various measuring systems of amount system etc..
Herein, illumination be 20, mask stage device 30, projection optics system 40, baseplate carrier device 50, alignment be 60 can be with It is modular.Hereinafter, it is that the illumination of 20 titles is that module 12M, mask stage device 30 claim mask stage module 14M, projection by illumination Optical system 40 claims projection optics system module 16M, baseplate carrier device 50 to claim baseplate carrier module 18M, alignment to be 60 titles alignment system Module 20M.Hereinafter, though it is appropriate be referred to as " each module 12M~20M ", by pallet 28A~28E corresponding to being placed in, And will physically separate configurations each other.
Therefore, as shown in figure 12, in liquid crystal exposure apparatus 10, can (in Figure 12, be, for example, by above-mentioned each module 12M~20M Baseplate carrier module 18M) in any (1 or multiple) module, with being changed for other module independences.Now, replacing pair The module of elephant is integrally changed with supporting pallet 28A~28E (being pallet 28E in Figure 12) of the module.
Above-mentioned each module 12M~20M replacing action when, as change object each module 12M~20M (and supporting Pallet 28A~28E of the module), it is to be moved along the face on ground 26 toward X-direction.Therefore, in pallet 28A~28E, with provided with Such as can easily it be moved on ground 26 preferable such as wheel or air-flotation type device.As described above, in the liquid of the present embodiment Brilliant exposure device 10, due to the operational blocks which partition system in each module 12M~20M can be made individually to be easily separated with other modules, because This maintenance is excellent.Also, in Figure 12, though display base plate microscope carrier module 18M relative other elements together with pallet 28E (projection optics system module 16M etc.) past +X direction is mobile (on the inside of paper), the aspect separated according to this with his key element, but mobile object The moving direction of module (and pallet) is not limited to this, such as can be -X direction (before paper), can also be +Y direction (paper Above face).In addition, also it can be set to ensure the positioning of position reproduction after settings of each pallet 28A~28E on ground 26 Device.The positioner can be located at each pallet 28A~28E, also by the component for being located at each pallet 28A~28E and can be located at ground The component in face 26 pulls together to act, to reproduce each pallet 28A~28E set location.
Also, the liquid crystal exposure apparatus 10 of the present embodiment, due to be can the above-mentioned each module 12M~20M of independent separate composition, Therefore individually each module 12M~20M can be upgraded.So-called upgrading, except for example in response to the big of exposure object substrate P Outside the upgrading of type etc., although also identical comprising substrate P size, each module 12M~20M is replaced by the feelings of performance better Shape.
Herein, such as when making substrate P maximize, the area for being only substrate P (is X-axis and Y direction in the present embodiment Size) become big, the thickness (size of Z-direction) of usual substrate P is substantially without change.Thus, for example in response to substrate P Maximization and when the baseplate carrier module 18M of liquid crystal exposure apparatus 10 is upgraded, as shown in figure 12, substitute baseplate carrier Module 18M, the baseplate carrier module 18AM newly inserted and supporting substrates microscope carrier module 18AM pallet 28G, although X-axis and/or Y The size of direction of principal axis can change, but the size of Z-direction is substantially without change.Likewise, mask stage module 14M also will not Because the upgrading of the maximization in response to light shield M, make the size substantial variations of Z-direction.
Can be mould by increase illumination also, being, for example, to expand illumination region IAM, exposure area IA (respectively referring to Fig. 1 etc.) The quantity of the quantity of illumination optical system possessed by block 12M, projecting lens module possessed by projection optics system module 16M, come It is that module 12M, projection optics system module 16M are upgraded respectively by illumination.Illumination after upgrading is module, projection optics system mould Block (all not shown) is compared with before upgrading, and only the change in size of X-axis and/or Y direction, the size of Z-direction are substantial not It can change.
Therefore, the liquid crystal exposure apparatus 10 of the present embodiment, each module 12M~20M pallet 28A~28E and supporting are supported The pallet (the pallet 28G of the baseplate carrier module 18AM with reference to shown in supporting Figure 12) of each module, the chi of its Z-direction after upgrading Very little is fixed.Herein, so-called size is fixed, and refers to that the pallet before changing and the pallet after replacing, the size of its Z-direction are total to It is logical, that is, the Z-direction size of the pallet of supporting functions identical module is substantially certain.In this way, the liquid crystal exposure of the present embodiment Device 10, because each pallet 28A~28E Z-direction size is fixed, therefore time when can seek to design each module shortens.
Also, in liquid crystal exposure apparatus 10, because the plane of exposure of substrate P and light shield M pattern plane are put down with gravity direction respectively Row (so-called file configuration), therefore can be by illumination module 12M, mask stage module 14M, projection optics system module 16M and Baseplate carrier module 18M each module, it is in upright arrangement on the face of ground 26 to set.In this way, because above-mentioned each module does not have each other certainly The effect of weight, it is therefore not necessary to such as by for example equivalent to the baseplate carrier device of above-mentioned each module, projection optics system, mask stage Device and illumination are as the known exposure device to be overlapped in gravity direction, set the high rigidity mainframe for supporting each key element (body).Further, since simple structure, the setting engineering of device, each module 12M~20M maintenance operation, replacement operation Deng can all carry out easily and in a short time.Also, due to above-mentioned each module can be configured along ground 26, therefore it is complete to reduce device The height of body.In this way, can minimize the chamber of the above-mentioned each module of collecting, seek cost to reduce and shorten and the duration is set.
It is 20 light sources used and the illumination light IL irradiated from the light source wavelength in illumination also, in the various embodiments described above It is not particularly limited, can is such as ArF PRKs (wavelength 193nm), KrF PRKs (wavelength 248nm) The vacuum-ultraviolet light such as ultraviolet light or F2 laser (wavelength 157nm).
Also, in above-described embodiment, though the illumination comprising light source, which is body 22, is driven in scanning direction, it is not limited to This, also can only make illumination with the exposure device disclosed in such as JP 2000-12422 publications likewise, light source is fixed Light IL is scanned in scanning direction.
Also, illumination region IAM, exposure area IA, it is created as extending the banding of Y direction in the above-described embodiments, But not limited to this, jagged multiple regions can be will be configured to and added disclosed in such as 5,729, No. 331 specifications of U.S. Patent No. With combination.
Also, in the various embodiments described above, though light shield M and substrate P are arranged to (so-called file configuration) orthogonal with horizontal plane, But light shield M and substrate P, can also be configured to and plane-parallel by not limited to this.This occasion, illumination light IL optical axis and gravity side To almost parallel.
Though also, it is according to the result to locating tab assembly in the X/Y plane of substrate P a little determine when scan exposure acts , but also can be parallel with this, (or parallel with scan exposure action) obtains the face position money of substrate P before scan exposure action News, the face position that substrate P is carried out in scan exposure action control (so-called auto-focusing control).
Also, the liquid crystal that the purposes of exposure device is not limited to liquid crystal display cells pattern being transferred to square glass plate exposes Device, can also be widely applicable for for example organic EL (Electro-Luminescence) panel manufacture exposure device, half The exposure device of conductor manufacture, manufacturing the exposure device of film magnetic head, micro-machine and DNA chip etc..In addition, it is not only The microcomponent of semiconductor element etc., also it can be suitably used for be manufactured in light exposure device, EUV exposure devices, X-ray exposure device and electricity The light shield or graticule that sub-line exposure device etc. uses, the exposure that circuit pattern is transferred to glass substrate or Silicon Wafer etc. fill Put.
Also, the object of exposure object is not limited to glass plate, can also be such as wafer, ceramic substrate, film member or light Other objects such as cover motherboard.In addition, when exposure object thing is the situation of flat display panel, the thickness of the substrate has no It is particularly limited to, also comprising such as tablet (flat member with pliability).Also, the exposure device of the present embodiment, is exposing Object be an edge lengths or to angular length in more than 500mm substrate it is especially effective.In addition, the substrate in exposure object is During the situation of the sheet (sheet material) with pliability, the sheet material can be created as drum.This occasion, without relying on microscope carrier dress The stepwise operation put, as long as making reel rotation (winding) (stepping movement) readily can be changed relative to illumination region (illumination light) The zoning region of exposure object.
The electronic component of liquid crystal display cells (or semiconductor element) etc., it is via function, the performance design for entering units The step of, according to this design procedure make light shield (or graticule) the step of, make glass substrate (or wafer) the step of, more than Light shield (graticule) pattern is transferred to the following a lithography step of glass substrate, made by the exposure device and its exposure method for stating each embodiment After exposure glass substrate development development step, by remaining have photoresistance part be subject to the component that exposes of outer portion by means of etching The etching step of removal, by after the completion of etching need not photoresistance removed photoresistance removing step, element number of assembling steps, inspection Check Step etc. and manufactured.This occasion, implement foregoing exposure method using the exposure device of above-described embodiment in following a lithography step, in glass Element pattern is formed on glass substrate, therefore the element of high integration can be manufactured with good productivity.
Industrial applicability
As described above, exposure device of the invention and method are suitable to be scanned object exposure.Also, the present invention The manufacture method of flat-panel screens is suitable to the production of flat-panel screens.In addition, the manufacturing method of the present invention is suitable to microcomponent Production.

Claims (36)

1. a kind of exposure device, it is to pass through projection optics system to object illumination illumination light, and the relative object drives the projected light System is learned to be scanned exposure, it is characterised in that it possesses：
Test section is marked, be located at the detection of the mark of the mark of the object；
1st drivetrain, it is to drive the mark test section；
2nd drivetrain, it is to drive the projection optics system；And
Control device, be controlled in a manner of the driving of the mark test section is first carried out before the driving in the projection optics system this 1 and the 2nd drivetrain.
2. exposure device according to claim 1, it is characterised in that the control device, be with the mark test section wherein After at least one of mark detection carried out terminates, the mode of the projection optics system is driven to control the 1st and the 2nd driving System.
3. exposure device according to claim 1 or 2, it is characterised in that wherein, the mark test section, have and be somebody's turn to do relative Object drives the scanning direction of the projection optics system, is located at the 1st detection means of the side of the projection optics system, with being located at the throwing 2nd detection means of the opposite side of shadow optical system：
The control device, it is with the scan exposure from the opposite side toward the side, according to the detection of the 1st detection means As a result the projection optics system is driven, and in the scan exposure from the side toward the opposite side, then according to the 2nd detection means Testing result drive the mode of the projection optics system to control the 1st and the 2nd drivetrain.
4. exposure device according to claim 3, it is characterised in that wherein, the object at least has the 1st of position inequality And the 2nd zoning region；
The control device, it is before carrying out to the scan exposure from the side toward opposite side in the 2nd zoning region, to incite somebody to action The mode of the position of the mark in 2nd detection means drive control to detectable 2nd zoning region controls the 2nd driving System.
5. the exposure device according to claim 3 or 4, it is characterised in that wherein, the control device is with another from this Side is toward in the scan exposure of side, while the 1st detection means and the projection optics system are driven from the opposite side toward the side Move, while the mode that the 2nd detection means is driven from the opposite side toward the side controls the 1st and the 2nd drivetrain.
6. exposure device according to any one of claim 1 to 5, it is characterised in that the control device, be to wrap wherein At least part of the mark detection operation of the detection containing the mark and the scan exposure action comprising the scan exposure acts parallel Mode is controlled.
7. exposure device according to claim 6, it is characterised in that wherein, the mark detection operation detects comprising the mark Test position shift action of the portion toward the movement for the position for carrying out the mark detection operation；
Scan exposure action includes the shift action of the projection optics system before the scan exposure starts.
8. the exposure device according to claim 6 or 7, it is characterised in that the control device, detected in the mark wherein In the action of at least one party of action and scan exposure action, make the actuating speed and the mark test section of the projection optics system Actuating speed it is different.
9. exposure device according to claim 8, it is characterised in that wherein, the actuating speed of the mark test section, and only Compared during the mark detection operation, it is slower when carrying out the mark detection operation side by side with scan exposure action.
10. exposure device according to any one of claim 1 to 9, it is characterised in that wherein, the mark test section system sets The direction that can detect driving the scanning direction of the projection optics system to intersect with the relative object is set to, with the illumination The length in region compares, if the mark that the distance between multiple marks on the object is longer.
11. exposure device according to claim 10, it is characterised in that wherein, the object has to be handed over the scanning direction The the 1st and the 2nd zoning region that the direction of fork is arranged side by side；
The mark test section is configured in the direction intersected with the scanning direction, while is detected on the 1st zoning region At least one mark at least one mark and the 2nd zoning region.
12. exposure device according to claim 11, it is characterised in that wherein, the control device, the exposure will carried out When the region of action is changed to the situation in the 2nd zoning region from the 1st zoning region, make the object and the projection optics system past with The direction relative movement that the scanning direction intersects, it is parallel with the relative movement, the mark test section is moved with the projection optics system Move to detection starting position.
13. the exposure device according to any one of claim 1 to 12, it is characterised in that wherein, the projection optics system Optical axis and plane-parallel；
The object is to be configured by the plane of exposure of the illumination with respect to the state that the horizontal plane is orthogonal.
14. exposure device according to claim 13, it is characterised in that wherein, the mark test section and the projection optics system It is configured to separate each other.
15. the exposure device according to any one of claim 1 to 14, it is characterised in that wherein, the object is to be used to put down The substrate of face display equipment.
16. exposure device according to claim 15, it is characterised in that wherein, the length or right at least one side of the substrate Angular length is more than 500mm.
17. a kind of manufacture method of flat-panel screens, it is characterised in that it is included：
Exposure device any one of usage right requirement 1 to 16 makes the action that the object exposes；And
The action for making the object after exposure develop.
18. a kind of manufacturing method, it is characterised in that it is included：
Exposure device any one of usage right requirement 1 to 16 makes the action that the object exposes；And
The action for making the object after exposure develop.
19. a kind of exposure method, it is to pass through projection optics system to object illumination illumination light, and the relative object drives the projected light System is learned to be scanned exposure, it is characterised in that it is included：
The mark of the mark located at the object carried out using mark test section is detected；
Use the driving of the mark test section of the 1st drivetrain；
Use the driving of the projection optics system of the 2nd drivetrain；And
The the 1st and the 2nd drivetrain carried out in a manner of the driving of the mark test section is first compared with the driving of the projection optics system Control.
20. exposure method according to claim 19, it is characterised in that be with the mark test section in the control wherein After at least one of mark detection carried out terminates, the mode of the projection optics system is driven to control the 1st and the 2nd driving System.
21. the exposure method according to claim 19 or 20, it is characterised in that wherein, the mark test section, have in phase The scanning direction of the projection optics system is driven to the object, the 1st detection means of the projection optics system side is located at and is located at this 2nd detection means of projection optics system opposite side；
It is with the scan exposure from the opposite side toward the side, according to the detection knot of the 1st detection means in the control Fruit drives the projection optics system, and in the scan exposure from the side toward the opposite side, then according to the 2nd detection means Testing result drives the mode of the projection optics system to control the 1st and the 2nd drivetrain.
22. exposure method according to claim 21, it is characterised in that wherein, the object at least with position inequality the 1 and the 2nd zoning region；
It is with before carrying out to the scan exposure from the side toward opposite side in the 2nd zoning region, by this in the control The mode of the position of the mark in 2nd detection means drive control to detectable 2nd zoning region controls the 2nd driving System.
23. the exposure method according to claim 21 or 22, it is characterised in that be with another from this in the control wherein Side is toward in the scan exposure of side, while by the 1st detection means and the projection optics system from the opposite side toward the side Drive, while the mode that the 2nd detection means is driven from the opposite side toward the side controls the 1st and the 2nd drivetrain.
24. the exposure method according to any one of claim 19 to 23, it is characterised in that wherein, in the control, be with At least part action of mark detection operation comprising mark detection and the scan exposure action comprising the scan exposure is parallel Mode be controlled.
25. exposure method according to claim 24, it is characterised in that wherein, the mark detection operation is examined comprising the mark Test position shift action of the survey portion toward the movement for the position for carrying out the mark detection operation；
Scan exposure action includes the shift action of the projection optics system before the scan exposure starts.
26. the exposure method according to claim 24 or 25, it is characterised in that in the control, examined in the mark wherein In the action at least one party that survey acts and the scan exposure acts, the actuating speed and the mark that make the projection optics system detect The actuating speed in portion is different.
27. exposure method according to claim 26, it is characterised in that wherein, the actuating speed of the mark test section, with Only carry out comparing during the mark detection operation, it is slower when carrying out the mark detection operation side by side with scan exposure action.
28. the exposure method according to any one of claim 19 to 27, it is characterised in that wherein, the mark test section system It is arranged to can detect the direction driving the scanning direction of the projection optics system to intersect with the relative object, with the illumination The length in region compare, if the mark that the distance between multiple marks on the object is longer.
29. exposure method according to claim 28, it is characterised in that wherein, the object has to be handed over the scanning direction The the 1st and the 2nd zoning region that the direction of fork is arranged side by side；
The mark test section is configured in the direction intersected with the scanning direction, while is detected on the 1st zoning region At least one mark at least one mark and the 2nd zoning region.
30. exposure method according to claim 29, it is characterised in that wherein, in the control, moved the exposure will be carried out When the region of work is changed to the situation in the 2nd zoning region from the 1st zoning region, make the object and the projection optics system past and this The direction relative movement that scanning direction intersects, it is parallel with the relative movement, the mark test section is moved with the projection optics system To detection starting position.
31. the exposure method according to any one of claim 19 to 30, it is characterised in that wherein, the projection optics system Optical axis and plane-parallel；
The object is to be configured by the plane of exposure of the illumination with respect to the state that the horizontal plane is orthogonal.
32. exposure method according to claim 31, it is characterised in that wherein, the mark test section and the projection optics system It is configured to separate each other.
33. the exposure method according to any one of claim 19 to 32, it is characterised in that wherein, the object is to be used to put down The substrate of face display equipment.
34. exposure method according to claim 33, it is characterised in that wherein, the length or right at least one side of the substrate Angular length is more than 500mm.
35. a kind of manufacture method of flat-panel screens, it is characterised in that it is included：
Exposure method any one of usage right requirement 19 to 34 makes the action that the object exposes；And
The action for making the object after exposure develop.
36. a kind of manufacturing method, it is characterised in that it is included：
Exposure method any one of usage right requirement 19 to 34 makes the action that the object exposes；And
The action for making the object after exposure develop.
CN201680020549.4A 2015-03-31 2016-03-31 Exposure apparatus, method for manufacturing flat panel display, method for manufacturing device, and exposure method Active CN107533303B (en)

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CN107533303B (en) 2021-04-30
TW201643558A (en) 2016-12-16

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