CN107430354A - Exposure device, the manufacture method of flat-panel screens, manufacturing method and exposure method - Google Patents

Exposure device, the manufacture method of flat-panel screens, manufacturing method and exposure method Download PDF

Info

Publication number
CN107430354A
CN107430354A CN201680020548.XA CN201680020548A CN107430354A CN 107430354 A CN107430354 A CN 107430354A CN 201680020548 A CN201680020548 A CN 201680020548A CN 107430354 A CN107430354 A CN 107430354A
Authority
CN
China
Prior art keywords
projection optics
exposure
mark
optics system
test section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201680020548.XA
Other languages
Chinese (zh)
Other versions
CN107430354B (en
Inventor
内藤夫
内藤一夫
青木保夫
长岛雅幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Priority to CN202010960580.4A priority Critical patent/CN112162465B/en
Publication of CN107430354A publication Critical patent/CN107430354A/en
Application granted granted Critical
Publication of CN107430354B publication Critical patent/CN107430354B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Abstract

Illumination light (IL) is irradiated to substrate (P) through projection optics system (40), and drive projection optics system (40) to be scanned the liquid crystal exposure apparatus (10) of exposure by opposing substrate (P), possess the alignment system (60) for detecting the mark (Mk) located at substrate (P), the 1st drivetrain for driving alignment system (60), the 2nd drivetrain for driving projection optics system (40) and the control device for controlling the 1st and the 2nd drivetrain in a manner of system (60) does not contact each other by projection optics system (40) with being aligned.In this way, it is avoided that projection optics system (40) with being directed at the contact of system (60).

Description

Exposure device, the manufacture method of flat-panel screens, manufacturing method and exposure Method
Technical field
The present invention is on exposure device, the manufacture method of flat-panel screens, manufacturing method and exposure method, specifically It, is on scanning in the scan exposure of set scanning direction by entering to be about to energy beam to object, predetermined pattern is formed and existed The manufacturer of exposure device and method on object and the flat-panel screens comprising foregoing exposure device or method or element Method.
Background technology
All the time, in electronic components (microcomponent) such as manufacture liquid crystal display cells, semiconductor elements (integrated circuit etc.) Lithographic manufacturing process, be to use exposure device, this exposure device using energy beam will be formed in light shield or graticule (it is following, Be referred to as " light shield ") pattern be transferred on glass plate or wafer (following, to be referred to as " substrate ").
As such a exposure device, it is known to it is a kind of in the state of making light shield and substrate substantially static, by exposure photograph Scan the scan exposure in set scanning direction, forming the wire harness scan-type of predetermined pattern on substrate according to this in Mingguang City's (energy beam) Device (referring for example to patent document 1).
The exposure device of the record of patent document 1 is being stated, is being missed for the exposure object region on amendment substrate and the position of light shield Difference is to make projection optics system past with scanning direction opposite direction movement during exposure, while by projection optics system with right Quasi- microscope carries out the measurement (to locating tab assembly) of the mark on substrate and on light shield, according to the measurement result amendment substrate and light shield Site error.Herein, by then passing through the alignment mark on projection optics system measurement substrate, therefore alignment actions and exposure are dynamic Work is sequentially (serially) implementation, and the processing time (cycle time) for being intended to suppress needed for the exposure-processed of all substrates is very Difficult.
Look-ahead technique document Prior Art
[patent document 1] Japanese Unexamined Patent Publication 2000-12422 publications
The content of the invention
To the means to solve the problem
The present invention is completed under above-mentioned thing, and the 1st exposure device system of its 1st viewpoint is shone object through projection optics system Illumination light is penetrated, drives the projection optics system with respect to the object to be scanned exposure, it possesses：The object is located to detect The mark test section of mark, drive the 1st drivetrain of the mark test section, drive the projection optics system the 2nd drivetrain and The the 1st and the 2nd drivetrain is controlled to avoid the control device that the projection optics system is in contact with each other with the mark test section.
2nd exposure device of the 2nd viewpoint of the invention, it is to object illumination illumination light, with respect to the thing through projection optics system Body drives the projection optics system to be scanned exposure, and it possesses：To detect be located at the object mark mark test section, The 1st drivetrain of the mark test section is driven, the 2nd drivetrain of the projection optics system is driven and is driven in the scan exposure The projection optics system is moved with controlling the driving of at least one party in the 1st and the 2nd drivetrain in the mark test section during at least one party It is so that the interval of the projection optics system and the mark test section is at a distance of both control devices more than set a distance.
3rd exposure device of the 3rd viewpoint of the invention, it is to object illumination illumination light, with respect to the thing through projection optics system Body drives the projection optics system, and to be scanned exposure actions, it possesses：To detect the inspection of the mark for the mark for being located at the object Survey portion, the 1st drivetrain for driving the mark test section, drive the 2nd drivetrain of the projection optics system and in the scan exposure The the 1st and the 2nd drivetrain is controlled to drive the projection optics respectively with different actuating speed at least part action in action System and the control device of the mark test section.
4th exposure device of the 4th viewpoint of the invention, it is to object illumination illumination light, with respect to the thing through projection optics system Body drives the projection optics system to be scanned exposure, and it possesses：To detect be located at the object mark mark test section, The 1st drivetrain of the mark test section is driven, drive the 2nd drivetrain of the projection optics system and controls the 1st and the 2nd drive Dynamic system makes the powered stop position of projection optics system stopping not weighed with the powered stop position of mark test section stopping Folded control device.
5th exposure device of the 5th viewpoint of the invention, it is to object illumination illumination light, with respect to the thing through projection optics system Body drives the projection optics system to be scanned exposure, and it possesses：To detect be located at the object mark mark test section, The 1st drivetrain of the mark test section is driven, drive the 2nd drivetrain of the projection optics system and controls the 1st and the 2nd drive Dynamic is so that the driving of the projection optics system starts sequential and the driving of the mark test section starts the different control device of sequential.
6th exposure device of the 6th viewpoint of the invention, it is to object illumination illumination light, with respect to the thing through projection optics system Body drives the projection optics system, and to be scanned exposure actions, it possesses：To detect the inspection of the mark for the mark for being located at the object Survey portion and position control is carried out to the projection optics system and the mark test section in the scan exposure so that mutual relative The control device of position relationship.
7th exposure device of the 7th viewpoint of the invention, it is to pass through projection optics system to object illumination illumination light, and by phase The projection optics system is driven in exposure actions of the 1st direction to be exposed by the object, predetermined pattern is formed in the thing On body, it possesses：To detect the mark test section for the mark for being located at the object, drive the mark test section in the 1st side To the 1st drivetrain and by the projection optics system and the 1st drivetrain separate independent driving in the 1st direction the 2nd drive Dynamic system.
The manufacture method of the flat-panel screens of 8th viewpoint of the invention, comprising：Use the 1st~the 7th exposure device of the present invention In the object after any exposure device exposure and exposure of the object that carry out development.
The manufacturing method of 9th viewpoint of the invention, comprising：It is any in the 1st~the 7th exposure device using the present invention Exposure device carry out the object exposure and exposure after the object development.
1st exposure method of the 10th viewpoint of the invention, it is to object illumination illumination light, with respect to the thing through projection optics system Body drives the projection optics system to be scanned exposure, and it is included：Mark located at the object is carried out using mark test section Detection；The driving for using the mark test section the 1st drivetrain to carry out；The projection optics system is carried out using the 2nd drivetrain Driving；And the 1st and the 2nd drivetrain carried out in a manner of the projection optics system and the mark test section do not contact each other Control.
2nd exposure method of the 11st viewpoint of the invention, it is to object illumination illumination light, with respect to the thing through projection optics system Body drives the projection optics system to be scanned exposure, and it is included：Mark located at the object is carried out using mark test section Detection；The driving for using the mark test section the 1st drivetrain to carry out；The projection optics system is carried out using the 2nd drivetrain Driving；And in the scan exposure, when the projection optics system is driven with least one party in the mark test section, with this Projection optics system is spaced in the 1st and the 2nd drivetrain that both mode more than set a distance had been carried out with the mark test section The control of the drivetrain of at least one party.
3rd exposure method of the 12nd viewpoint of the invention, it is to object illumination illumination light, with respect to the thing through projection optics system Body drives the projection optics system to be scanned exposure, and it is included：Mark located at the object is carried out using mark test section Detection；The driving for using the mark test section the 1st drivetrain to carry out；The projection optics system is carried out using the 2nd drivetrain Driving；And at least part action in scan exposure action, with the projection optics system and the mark detection part The control for the 1st and the 2nd drivetrain that the mode not driven by different driving speed is carried out.
4th exposure method of the 13rd viewpoint of the invention, it is to object illumination illumination light, with respect to the thing through projection optics system Body drives the projection optics system to be scanned exposure, and it is included：Mark located at the object is carried out using mark test section Detection；The driving for using the mark test section the 1st drivetrain to carry out；The projection optics system is carried out using the 2nd drivetrain Driving；And with stop the stop position of the driving of the projection optics system, with stop the mark test section driving stopping The control for the 1st and the 2nd drivetrain that the nonoverlapping mode in position is carried out.
5th exposure method of the 14th viewpoint of the invention, it is to object illumination illumination light, with respect to the thing through projection optics system Body drives the projection optics system to be scanned exposure, and it is included：Mark located at the object is carried out using mark test section Detection；The driving for using the mark test section the 1st drivetrain to carry out；The projection optics system is carried out using the 2nd drivetrain Driving；And so that the driving of the projection optics system starts sequential and the driving of the mark test section starts the different side of sequential The control for the 1st and the 2nd drivetrain that formula is carried out.
6th exposure method of the 15th viewpoint of the invention, it is to object illumination illumination light, with respect to the thing through projection optics system Body drives the projection optics system to be scanned exposure, and it is included：Mark located at the object is carried out using mark test section Detection；And in the scan exposure, the position for the projection optics system that the constant mode of the relative position of each other relation is carried out Put the control with the position of the mark test section.
7th exposure method of the 16th viewpoint of the invention, it is to pass through projection optics system to object illumination illumination light, and by phase The projection optics system is driven in exposure actions of the 1st direction to be exposed by the object, predetermined pattern is formed in the thing On body, it is included：The detection carried out to the mark located at the object using mark test section；To the mark test section toward the 1st Direction uses the driving that the 1st drivetrain is carried out；And to the projection optics system with the 1st drivetrain separate it is independent toward this 1 direction uses the driving that the 2nd drivetrain is carried out.
The manufacture method of the flat-panel screens of 17th viewpoint of the invention, comprising：Use the 1st~the 7th exposure side of the present invention The development of the object in method after the exposure and exposure of the object that any exposure method is carried out.
The manufacturing method of 18th viewpoint of the invention, comprising：It is any in the 1st~the 7th exposure method using the present invention The development of the object after the exposure and exposure of the object that the exposure method of kind is carried out.
Brief description of the drawings
Fig. 1 is the concept map of the liquid crystal exposure apparatus of an embodiment.
Fig. 2 is that the output for showing the main control unit formed centered on the control system of Fig. 1 liquid crystal exposure apparatus is entered the GATT The block diagram of system.
Fig. 3 (a)~Fig. 3 (d) is the figure (its 1~its 4) of the action of liquid crystal exposure apparatus when illustrating exposure actions.
Fig. 4 (a)~Fig. 4 (c) is the figure (its 5~its 7) of the action of liquid crystal exposure apparatus when illustrating exposure actions.
Fig. 5 is the figure of the composition for the alignment system for illustrating the 1st variation.
Fig. 6 is the figure of the composition for the alignment system for illustrating the 2nd variation.
Fig. 7 is to illustrate that projection is the figure of the composition of the measurement system of body and aligming microscope.
Fig. 8 is the figure of the variation (its 1) for the drivetrain for showing projection optics system and alignment system.
Fig. 9 is the figure of the variation (its 2) for the drivetrain for showing projection optics system and alignment system.
Figure 10 is the concept map for showing the module replacing in liquid crystal exposure apparatus.
【Main element symbol description】
10：Liquid crystal exposure apparatus 20：Illumination system
30：Mask stage device 40：Projection optics system
50：Baseplate carrier device 60：Alignment system
M：Light shield P：Substrate
Embodiment
Hereinafter, for an embodiment, it is illustrated using Fig. 1~Fig. 7.
The concept map of the liquid crystal exposure apparatus 10 of an embodiment is shown in Fig. 1.Liquid crystal exposure apparatus 10, be with for example with In the glass substrate P (following, only abbreviation substrate P) of the rectangle (square) of liquid crystal display device (flat-panel screens) etc. be exposure pair As the projection aligner of step-scan (step＆scan) mode of thing, so-called scanning machine.
Liquid crystal exposure apparatus 10, it is 20 and projected light with the illumination light IL of energy beam illumination to have irradiation as exposure Be 40.Hereinafter, by be from illumination the 20 illumination light IL for being irradiated in substrate P through projection optics systems 40 the parallel side of optical axis To referred to as Z-direction, and X-axis orthogonal in plane orthogonal to Z-axis and Y-axis are set in illustrate.Also, this implementation In the coordinate system of example, Y-axis is substantially parallel with gravity direction.Therefore, XZ planes are substantially parallel with horizontal plane.In addition, with about the z axis Rotation (inclination) direction illustrate for θ z directions.
Herein, be set with the present embodiment, a piece of substrate P multiple exposure object regions (appropriate title zoning region or (shot) region is irradiated to illustrate), sequentially transfer mask pattern in these multiple irradiation areas.Also, the present embodiment, though Illustrated for the situation (the so-called situation for taking 4 faces) that 4 zoning regions are set with substrate P, but the quantity in zoning region This is not limited to, can suitably be changed.
Also, in liquid crystal exposure apparatus 10, though the exposure actions of so-called step-scan mode are carried out, in scan exposure During action, light shield M and substrate P are substantially inactive state, and it is the 20 and relative light shield M of projection optics system 40 (illumination light IL) to illuminate And substrate P is moved (white arrow of reference picture 1) in X-direction (appropriate title scanning direction) with long stroke respectively.In contrast, In the stepwise operation carried out to change the zoning region of exposure object, light shield M is moved in X-direction with predetermined stroke stepping Dynamic, substrate P moves (the black arrow for respectively referring to Fig. 1) in Y direction with predetermined stroke stepping.
In Fig. 2, it is shown that the output for planning as a whole the main control unit 90 in each portion of composition of control liquid crystal exposure apparatus 10 is entered the GATT The block diagram of system.As shown in Fig. 2 liquid crystal exposure apparatus 10 possess illumination be 20, mask stage device 30, projection optics system 40, Baseplate carrier device 50, alignment are 60 etc..
Illumination is 20, and the illumination for possessing the light source (for example, mercury vapor lamp) comprising illumination light IL (reference picture 1) etc. is body 22.When scan exposure acts, the drivetrain 24 such as comprising linear motor is controlled by main control unit 90, according to this will illumination Be body 22 in X-direction with set long stroke turntable driving.Main control unit 90, for example, by including linear encoder etc. Measurement is 26 location informations for obtaining that illumination is the X-direction of body 22, and it is body 22 to be illuminated according to the location information Position controls.In the present embodiment, as illumination light IL, used such as g lines, h lines, i lines.
Mask stage device 30 possesses the microscope carrier body 32 for keeping light shield M.Microscope carrier body 32, can be by for example comprising linear The drivetrain 34 of motor etc. is in the appropriate stepping movement of X-direction and Y direction.Area in X-direction for change exposure object During the stepwise operation in partition domain, main control unit 90 is by control drivetrain 34, by the stepper drive of microscope carrier body 32 in X-axis side To.Also, as described later, the region (position) of exposure is scanned in zoning region of the Y direction for change exposure object During stepwise operation, main control unit 90 is by control drivetrain 34, by the stepper drive of microscope carrier body 32 in Y direction.Drivetrain 34, it can be driven a little in 3DOF (X, Y, θ z) direction in X/Y plane in aftermentioned alignment actions by light shield M is appropriate.Light M location information is covered, such as with the measurement comprising linear encoder etc. is 36 to be obtained.
Projection optics system 40, possesses the upright erect image for including and being tied up to equimultiple in substrate P (reference picture 1) and forming mask pattern The projection of optical system etc. be body 42.Projection is that body 42 configures (reference in the space formed between substrate P and light shield M Fig. 1).When scan exposure acts, main control unit 90 by such as controlling comprising the drivetrain 44 linear motor, with and shine The synchronous mode of bright system's body 22, it is body 42 to be projected in X-direction with set long stroke turntable driving.Main control unit 90, For example, by the measurement comprising linear encoder etc. be 46 obtain projection be location information of the body 42 in X-direction, according to this Location information carries out the position control that projection is body 42.
Return to Fig. 1, in liquid crystal exposure apparatus 10, when with from illumination be 20 illumination light IL illumination light shields M on illumination During the IAM of region, with by light shield M illumination light IL, through projection optics system 40 by the mask pattern in illumination region IAM Projection image's (part erect image), form the irradiation area (exposure region with the illumination light IL of illumination region IAM conjugation in substrate P Domain IA).And relative light shield M and substrate P, illumination light IL (illumination region IAM and exposure area IA) is relatively moved in scanning side To being scanned exposure actions according to this.That is, in liquid crystal exposure apparatus 10, be with illuminate be 20 and projection optics system 40 in substrate Light shield M pattern is generated on P, the exposure of the inductive layer (resist layer) in substrate P is made by illumination light IL, is formed in substrate P The pattern.
Herein, it is the 20 illumination region IAM generated on light shield M with illumination in the present embodiment, is contained in Y direction point From a pair of rectangular areas.The Y direction length of one rectangular area, it is set to the Y direction length of light shield M pattern plane Such as the 1/4 of (that is, the Y direction length in each zoning region being set in substrate P).Also, the interval between a pair of rectangular areas Also such as the 1/4 of the length of the Y direction of the same pattern plane for being set as light shield M.Therefore, the exposure in substrate P is generated Region IA, also same a pair of rectangular areas for being contained in Y direction separation.The present embodiment, for by light shield M pattern fully Substrate P is transferred to, though rescan exposure actions must be carried out for a zoning region, having can make illumination be body 22 and throw The advantages of shadow system body 42 minimizes.The concrete example made on scan exposure Move, is chatted after remaining.
Baseplate carrier device 50, tool are kept the microscope carrier body 52 at the back side (face opposite with plane of exposure) of substrate P.Return to Fig. 2, Y direction change exposure object zoning region stepwise operation when, main control unit 90 by control for example comprising The drivetrain 54 of linear motor etc., by microscope carrier body 52 toward Y direction stepper drive.Drivetrain 54, can be in substrate pair described later Substrate P is driven a little in 3DOF (X, Y, θ z) direction in X/Y plane during quasi- action.The position of substrate P (microscope carrier body 52) Information is put, it with the measurement such as comprising linear encoder is 56 to be obtained to be.
Return to Fig. 1, alignment is 60 to possess aligming microscope 62.Aligming microscope 62, be configured in substrate P and light shield M it Between in the space that is formed (position between the substrate P of Z-direction and light shield M), detection forms the alignment mark Mk in substrate P The mark (not shown) of (following, only to claim mark Mk) and formation in light shield M.In the present embodiment, mark Mk is in each zoning region Four near corners be respectively formed with 1 (for 1 zoning region, such as 4), light shield M mark, through projection optics system 40 form in position corresponding with mark Mk.Also, quantity and the position of mark Mk and light shield M mark, are not limited to this, can fit Work as change.In addition, in each drawing, for ease of understanding, mark Mk is that the relatively reality shown is big.
Aligming microscope 62 configure projection be body 42+X sides.Aligming microscope 62 has in Y direction separation A pair of detections visual field (detection zone), it can detect simultaneously in a zoning region in such as 2 mark Mk of Y direction separation.
Also, aligming microscope 62, can be detected (in other words, in the case of the position of aligming microscope 62 is not changed) simultaneously Formed in light shield M mark, with forming the mark Mk in substrate P.Main control unit 90, such as X steppings are carried out every time in light shield M Action or substrate P carry out Y stepwise operations when, obtain to be formed light shield M mark with formation substrate P mark Mk it is relative Position offsets information, and carries out substrate P and relative positioning of the light shield M in the direction along X/Y plane, to correct position skew (offset or reduce).Also, aligming microscope 62, is by detecting the light shield test section of (observation) light shield M mark, (being seen with detection Examine) the mark Mk of substrate P substrate test section is integrally formed by common casing etc., by the common casing by drivetrain 66 are driven.Or can also be that light shield test section is made up of with substrate test section individual other casing etc., this occasion is best It is to be configured to such as light shield test section with substrate test section by the common drivetrain 66 of essence with equal acting characteristic to come Move.
Main control unit 90 (reference picture 2), by drivetrain 66 (reference picture 2) of the control such as comprising linear motor, Aligming microscope 62 is driven in X-direction with set long stroke.Also, main control unit 90, for example, by comprising linear The measurement of encoder etc. is the location information of 68 X-directions for obtaining aligming microscope 62, is aligned according to the location information The position control of microscope 62.In addition, drivetrain 66 can also have aligming microscope 62 is driven in Y direction simultaneously Such as linear motor.
Herein, though alignment is 60 aligming microscope 62 and the projection of above-mentioned projection optics system 40 is that body 42 is physically (mechanically) key element of independent (separation), (speed is driven in a manner of independent of each other by main control unit 90 (reference picture 2) Degree and position) control, but the drivetrain 66 of aligming microscope 62 is driven with driving the drivetrain 44 that projection is body 42, in X-axis The drivetrain in direction shares the part such as linear motor, linear guide, and aligming microscope 62 and projection are body 42 Drive characteristic or the control characteristic carried out by main control unit 90 are that essence is equal.
Specifically as an example for, for example with moving-coil type linear motor by aligming microscope 62, projection be that body 42 is distinguished Drive when the situation of X-direction, above-mentioned drivetrain 66 and drivetrain 44 are to share stator magnetic (such as permanet magnet Deng) unit.In contrast, can mover coil unit be then in alignment with microscope 62, projection be that body 42 independently has, master control Device 90 (reference picture 2) processed is by the supply of electric power carried out individually to the coil unit, and independent control aligming microscope 62 is toward X The driving (speed and position) of direction of principal axis and projection are driving (speed and position) of the body 42 toward X-direction.Therefore, it is main Control device 90 modifiable (any change) is in the interval (distance) that aligming microscope 62 and the projection of X-direction are body 42. In addition, main control unit 90, also in X-direction aligming microscope 62 can be made with projection to be that body 42 moves at different rates.
Main control unit 90 (reference picture 2), multiple mark Mk in substrate P are formed using the detection of aligming microscope 62, According to the testing result (multiple mark Mk location informations) in a manner of the reinforced alignment (EGA) of known holocrystalline circle, shape is calculated Arrangement information into the zoning region for the mark Mk for having detection object (includes the position (coordinate value) with zoning region, shape etc. Related information).
Specifically, in scan exposure action, main control unit 90 (reference picture 2), before scan exposure action, The aligming microscope 62 for+X sides for being body 42 is being projected using configuration, is being carried out in the zoning region at least formed at exposure object Such as 4 mark Mk position detection, to calculate the arrangement information in the zoning region.Main control unit 90, according to being calculated Exposure object zoning region arrangement information, determine while carrying out 3DOF direction accurate of the substrate P in X/Y plane Position (base plate alignment action), one side suitable control illumination be 20 and projection optics system 40 carry out to target area partition domain scanning exposure Light acts (transfer of mask pattern).
Secondly, the projection that illustrating to obtain projection optics system 40 has is that the measurement of the location information of body 42 is 46 (reference picture 2) and to obtain the specific composition that the measurement for the location information that alignment is 60 aligming microscopes 62 having is 68.
As shown in fig. 7, it is guiding element 80 that body 42 is oriented to scanning direction that liquid crystal exposure apparatus 10, which has that will project,.Lead Part 80 with the component that scanning direction extends in parallel by forming.Guiding element 80 also has shifting of the guiding aligming microscope 62 toward scanning direction Dynamic function.Also, in Fig. 7, though guiding element 80 is shown between light shield M and substrate P, in fact, guiding element 80 is in Y direction Configuration is in the position for the light path for avoiding illumination light IL.
In guiding element 80, it is fixed with and comprises at least with the direction (X-direction) parallel with scanning direction as the anti-of cycle direction The scale 82 of emitting diffraction grating.Also, projection is that body 42 has the read head 84 oppositely disposed with scale 82.In the present embodiment, It is 46 (references formed with the measurement for forming to obtain the location information that projection is body 42 by said scale 82 and read head 84 Encoder system Fig. 2).In addition, aligming microscope 62 has the read head 86 oppositely disposed with scale 82.In the present embodiment, shape It is 68 (reference pictures into there is the measurement for forming to obtain the location information of aligming microscope 62 by said scale 82 and read head 86 2) encoder system.Herein, read head 84,86 can irradiate encoder measurement light beam to scale 82 respectively, and receive through mark The light beam (in the reflected beams of scale 82) of chi 82, the relative position information according to light result output to scale 82.
As previously discussed, in the present embodiment, scale 82 forms to obtain the measurement that projection is the location information of body 42 Be 46 (reference pictures 2), the measurement that also forms to obtain the location information of aligming microscope 62 be 68 (reference pictures 2).That is, throw Shadow system body 42 with aligming microscope 62 (is surveyed according to form the common coordinate system set by the diffraction grating in scale 82 Major axis) carry out position control.Also, to drive projection to be the drivetrain 44 (reference picture 2) of body 42 and be aligned to drive The drivetrain 66 (reference picture 2) of microscope 62, its key element can it is a part of it is common, can also completely self-contained key element form.
Can survey major axis only such as X also, forming the encoder system that above-mentioned measurement is 46,68 (respectively referring to Fig. 2) Linear (1DOF) encoder system of direction of principal axis (scanning direction), can also have most survey major axis.For example, can be by by read head 84th, 86 is multiple with predetermined distance configuration in Y direction, obtain the θ z directions that projection is body 42, aligming microscope 62 according to this Rotation amount.Also, can also form XY2 dimension diffraction gratings in scale 82, have to survey in the 3DOF direction in X, Y, θ z direction and grow The 3DOF encoder systems of axle.Furthermore can act also as read head 84,86 can also be entered in addition to direction using multiple except the cycle of diffraction grating The long known 2 dimension read head of the survey in the row direction orthogonal with scale face, with obtain project be body 42, aligming microscope 62 6 The location information in free degree direction.
Herein, in the present embodiment, projection is body 42 and aligming microscope 62 is arranged respectively between substrate P and light shield M Space, because the position of its Y direction is almost identical, thus mutual mobile range be part repeat.
Therefore, when projection when such as scan exposure acts is that body 42 is driven in X-direction by main control unit 90, It is the drive control (collision free control) that body 42 collides with aligming microscope 62 that can carry out avoiding projection.In other words, master control Device 90 processed, it to project is body 42 with aligming microscope 62 in a manner of X-direction will not be configured in same position simultaneously to be Control is driven, such as enters to exercise aligming microscope 62 and is moved back from what the mobile route (moving range) that projection is body 42 was kept out of the way Keep away control.
Hereinafter, the liquid crystal exposure apparatus 10 of (keeping out of the way control) is controlled in sweeping for the collision free comprising aligming microscope 62 Action example during exposure actions is retouched, it is illustrated using Fig. 3 (a)~Fig. 4 (c).Following exposure actions (are surveyed comprising alignment Amount acts) it is (in Fig. 3 (a)~Fig. 4 (c) not shown in main control unit 90.Ginseng Zhao Fig. 2) management under carry out.
In the present embodiment, zoning region (following, the 1st irradiation area S of title of exposure order at first1) it is set at substrate P - X sides and-Y sides.Also, in Fig. 3 (a)~Fig. 4 (c), when imparting symbol A rectangular area represents scan exposure action Projection is the moving range (mobile route) of body 42.Projection be the moving range A of body 42 be with such as mechanical system and/ Or electrically mode is set.Also, assign the symbol S in the zoning region in substrate P2~S4, it is to represent respective exposure order as the The irradiation area of 2~4.
As shown in Fig. 3 (a), before exposure starts, projection is each of body 42 and aligming microscope 62, is matched somebody with somebody under overlooking Put in the 1st irradiation area S1- X sides.Under state (primary position) shown in Fig. 3 (a), projection is that body 42 is micro- with being aligned Mirror 62 is that proximity configures each other in X-direction.
Then, main control unit 90, as shown in Fig. 3 (b), aligming microscope 62 is driven toward +X direction.As described above, this reality Example is applied, due to that can be body 42 with the independent drive control of aligming microscope 62 in X-direction (scanning direction), master control by projection Device 90 processed makes projection be in the state of body 42 stops, only to drive aligming microscope 62 in X-direction.Main control unit 90, aligming microscope 62 is displaced into +X direction, while in detection (thick line circle in reference picture 3 (b)) the 1st irradiation area S1After such as 4 interior mark Mk, main control unit 90 calculates the 1st irradiation area S according to the mark testing result1Arrangement money News.
Also, main control unit 90, as shown in Fig. 3 (c), with parallel using the mark detection operation of aligming microscope 62, with The independent projection that starts of aligming microscope 62 is acceleration of the body 42 toward +X direction.Specifically, main control unit 90, such as 1st irradiation area S is detected with aligming microscope 621+ X sides mark Mk eve, it is the past+X sides of body 42 to start projection To acceleration.In this way, in the present embodiment, after movement (mark detection operation) of the aligming microscope 62 toward +X direction, start to throw Movement (scan exposure action) of the shadow system body 42 toward +X direction.Therefore, projection is body 42 and aligming microscope 62 in X-axis side To interval (distance), it is wider compared with the primary position (before alignment actions start) shown in Fig. 3 (a).Also, preferably exist To the 1st irradiation area S1Exposure actions start before, that is, projection is that body 42 starts constant speed movement, illumination light IL and is irradiated to base Plate P (the 1st irradiation area S1) before, terminate the 1st irradiation area S1The detection of such as 4 interior mark Mk, and according to this 4 Mark asks for the 1st irradiation area S1Arrangement information.Main control unit 90, it is body 42 and photograph by projection as shown in Fig. 3 (d) Bright is that 20 illumination is that body 22 (not shown in Fig. 3 (d), reference picture 1) is synchronously driven in +X direction, irradiated to the 1st Region S1The 1st scan exposure.
Also, also can with to the 1st irradiation area S1Scan exposure action it is parallel, by aligming microscope 62 further drive in +X direction, formed with detection in the 4th irradiation area S4(the 1st irradiation area S1+ X sides zoning region) in such as 4 mark Mk.Main control unit 90, can be according to the 4th irradiation area S4The testing result of interior mark, update the 1st irradiation area S1Arrangement Information.To obtain the 1st irradiation area S1Arrangement information and use the 4th irradiation area S4Interior mark position information, with according only to It is located at the 1st irradiation area S14 mark Mk come obtain arrangement information situation compare, can obtain and consider wider scope The arrangement information being statistically inclined to, and lifted on the 1st irradiation area S1Alignment precision.
Main control unit 90, while carrying out the micro-locality control of substrate P, one in response to the result that calculates of above-mentioned arrangement information Side control illumination be 20 through light shield M (not shown in Fig. 3 (d), reference picture 1) and projection be that illumination light IL is projeced into by body 42 In substrate P, a part for mask pattern is formed in the exposure area IA that is generated with illumination light IL in substrate P.As described above, In the present embodiment, due to the exposure area IA generated on the illumination region IAM (reference picture 1) and substrate P that are generated on light shield M, it is In a pair of rectangular areas of Y direction separation, therefore the light shield M of substrate P pattern image is transferred to single pass exposure actions, It is formed in a pair of belt-like zones (one in the gross area in a zoning region for extending X-direction in Y direction separation Semi-area) in.
Herein, as the 1st irradiation area S1The 1st scan exposure at the end of, projection be body 42 by substrate P, move Move near moving range A+X side ends.Now, main control unit 90 enters to exercise aligming microscope 62 and moved back from moving range A The control kept away.For as an example, main control unit 90, as shown in Fig. 4 (a), opposing substrate P by aligming microscope 62 drive in- Y-direction (lower section) is so that it retreats to-Y the sides that projection is the moving range A of body 42.Accordingly, as shown in Fig. 4 (b), projection It is that body 42 will not collide aligming microscope 62, and+Y the sides (top) for passing through the aligming microscope 62.Main control unit 90, When confirming to be driven to the Y direction position not position with the Y direction location overlap of aligming microscope 62 that projection is body 42 When putting, i.e., as shown in Fig. 3 (a), it is the position that body 42 will not contact each other with aligming microscope 62 in projection, is configured with proximity Mode, aligming microscope 62 is driven to moving range A.Therefore, projection is the X-axis side of body 42 and aligming microscope 62 To interval, when being acted with scan exposure compared with, scan exposure action beginning before or terminate after time point (in other words, Projection is before the acceleration of body 42 toward X-direction starts or deceleration terminates afterwards) it is narrower.
Then, main control unit 90, to carry out the 1st irradiation area S1The 2nd scan exposure action, such as Fig. 4 (b) institutes Show, substrate P and light shield M is moved (the black arrow of reference picture 4 (b)) toward -Y direction stepping.The stepping movement of substrate P now Amount is such as 1/4 length of the zoning region in the length of Y direction.Now, in substrate P and light shield M toward -Y direction In stepping movement, be desirable in a manner of the relative position relation of substrate P and light shield M will not change (or, so that the phase can be corrected To the mode of position relationship) make its stepping movement preferable.
Hereinafter, as shown in Fig. 4 (b), projection is that body 42 is driven in -X direction to carry out the 1st photograph by main control unit 90 Penetrate region S1The 2nd time (multiple road) scan exposure action.Accordingly, with the mask pattern of the 1st scan exposure action transfer, with With the mask pattern of the 2nd scan exposure action transfer i.e. in the 1st irradiation area S1It is interior engaged, light shield M pattern entirety quilt It is transferred to the 1st irradiation area S1.Also, main control unit 90, it is body 42 aligming microscope 62 is returned to projection from retreating position Moving range A in, it is that body 42 is driven in -X direction to follow projection.Also, also can be as shown in Fig. 4 (b) make substrate P and After light shield M moves toward -Y direction stepping, before starting to the 2nd scan exposure, substrate P is carried out again and light shield M alignment is surveyed Amount, mutual position alignment is carried out according to the result.In this way, the 1st irradiation area S can be lifted1Alignment precision, the Jin Erti of entirety Rise to the 1st irradiation area S1Light shield M pattern transfer printing precision.Also, this occasion, main control unit 90, so as to temporarily keep out of the way Aligming microscope 62 return to projection be body 42-X sides, and carry out drive control make its carry out equivalent to above-mentioned Fig. 3 (a) ~Fig. 3 (d) and Fig. 4 (a) action (only, be make the action of X-direction invert (contrary sign) action) is preferably.
Hereinafter, although not shown, but main control unit 90 is to the 2nd irradiation area S2(the 1st irradiation area S1+ Y sides area Partition domain) exposure actions are scanned, make substrate P toward -Y direction stepping movement so that the 2nd irradiation area S2With light shield M to. To the 2nd irradiation area S2Scan exposure action (avoidance operation for including aligming microscope 62), because above-mentioned to the 1st irradiated region Domain S1Scan exposure action it is identical, therefore the description thereof will be omitted.Hereinafter, main control unit 90, light shield M X is suitably carried out on one side Stepwise operation and at least one party in the Y stepwise operations of substrate P, while carrying out to the 3rd and the 4th irradiation area S3、S4Scanning expose Light acts.Now, main control unit 90 be also it is same carry out aligming microscope 62 keep out of the way control.Also, to make the 2nd irradiation area S2Later zoning regional exposure, also can be when obtaining the arrangement information in the zoning region, the exposure in the zoning region before use The location information for the mark that light time is obtained.In addition, it can also carry out to the 4th irradiation area S4Alignment when, utilize the above-mentioned 1st shine Penetrate region S1Alignment measurement result (EGA calculate result).This occasion, make the 4th irradiation area S4It is oppositely disposed with light shield M When, it is only necessary to according to light shield M mark and the mark Mk of substrate P each 2 points of mark, measure in X/Y plane 3DOF (X, Y, θ z) direction position skew, can substantially shorten the 4th irradiation area S4Alignment needed for time.
The liquid crystal exposure apparatus 10 of an embodiment from the description above, due to energy independent control aligming microscope 62 and throw The drive control (position and speed) of the scanning direction (X-direction) of shadow system body 42, therefore can be that body 42 is past in projection and sweep Before the movement (acceleration) for retouching direction, Mk detection operation is marked using aligming microscope 62, in required all marks Mk detection starts projection before terminating be acceleration (that is, scan exposure act) of the body 42 toward scanning direction.Accordingly, it is capable to reduce A series of processing time (cycle time) needed for the exposure-processed of substrate P.Also, when not being scanned exposure actions, example As after before the beginning of alignment actions (projection be the acceleration of body 42 before) and scan exposure release (projection is body 42 After deceleration), can be the configuration of the proximity of body 42 by aligming microscope 62 and projection as shown in Fig. 3 (a).Accordingly, it is capable to suppress to X-direction is scanned the plant bulk (area of coverage of exposure device) needed for exposure.Further, since aligming microscope 62 can be made Projection is the moving range A of body 42 when keeping out of the way scan exposure action, therefore is avoided that aligming microscope 62 and projection are body 42 collision.
Herein, illumination be 20, mask stage device 30, projection optics system 40, baseplate carrier device 50, alignment be 60 can be with It is modular.Hereinafter, it is that the illumination of 20 titles is that module 12M, mask stage device 30 claim mask stage module 14M, projection by illumination Optical system 40 claims projection optics system module 16M, baseplate carrier device 50 to claim baseplate carrier module 18M, alignment to be 60 titles alignment system Module 20M.Hereinafter, though it is appropriate be referred to as " each module 12M~20M ", by pallet 28A~28E corresponding to being placed in, And will physically separate configurations each other.
Therefore, as shown in Figure 10, in liquid crystal exposure apparatus 10, can (in Figure 10, be, for example, by above-mentioned each module 12M~20M Baseplate carrier module 18M) in any (1 or multiple) module, with being changed for other module independences.Now, replacing pair The module of elephant is integrally changed with supporting pallet 28A~28E (being pallet 28E in Figure 10) of the module.
Above-mentioned each module 12M~20M replacing action when, as change object each module 12M~20M (and supporting Pallet 28A~28E of the module) it is to be displaced into X-direction along ground 26.Therefore, in pallet 28A~28E, with provided with for example That is easily moved on ground 26 is preferable such as wheel or air-flotation type device.As described above, the liquid crystal in the present embodiment exposes Device 10, due to the operational blocks which partition system in each module 12M~20M can be made individually to be easily separated with other modules, therefore maintain Maintainability is excellent.Also, in Figure 10, though display base plate microscope carrier module 18M relative other element (projected lights together with pallet 28E Be module 16M etc.) toward +X direction (on the inside of paper) movement, the aspect separated according to this with his key element, but mobile object module (and Pallet) moving direction be not limited to this, such as can be -X direction (before paper), can also be +Y direction (paper above). In addition, also it can be set to ensure the positioner of position reproduction after settings of each pallet 28A~28E on ground 26.Should Positioner can be located at each pallet 28A~28E, also each pallet 28A~28E component and can be located at the structure on ground 26 by being located at Part pulls together to act, to reproduce each pallet 28A~28E set location.
Also, the liquid crystal exposure apparatus 10 of the present embodiment, due to be can the above-mentioned each module 12M~20M of independent separate composition, Therefore individually each module 12M~20M can be upgraded.So-called upgrading, except for example in response to the big of exposure object substrate P Outside the upgrading of type etc., although also identical comprising substrate P size, each module 12M~20M is replaced by the feelings of performance better Shape.
Herein, such as when making substrate P maximize, the area for being only substrate P (is X-axis and Y direction in the present embodiment Size) become big, the thickness (size of Z-direction) of usual substrate P is substantially without change.Thus, for example in response to substrate P Maximization and when the baseplate carrier module 18M of liquid crystal exposure apparatus 10 is upgraded, as shown in Figure 10, substitute baseplate carrier Module 18M, the baseplate carrier module 18AM newly inserted and supporting substrates microscope carrier module 18AM pallet 28G, although X-axis and/or Y The size of direction of principal axis can change, but the size of Z-direction is substantially without change.Likewise, mask stage module 14M also will not Because the upgrading of the maximization in response to light shield M, make the size substantial variations of Z-direction.
Can be mould by increase illumination also, being, for example, to expand illumination region IAM, exposure area IA (respectively referring to Fig. 1 etc.) The quantity of the quantity of illumination optical system possessed by block 12M, projecting lens module possessed by projection optics system module 16M, come It is that module 12M, projection optics system module 16M are upgraded respectively by illumination.Illumination after upgrading is module, projection optics system mould Block (all not shown) is compared with before upgrading, and only the change in size of X-axis and/or Y direction, the size of Z-direction are substantial not It can change.
Therefore, the liquid crystal exposure apparatus 10 of the present embodiment, each module 12M~20M pallet 28A~28E and supporting are supported The pallet (the pallet 28G of the baseplate carrier module 18AM with reference to shown in supporting Figure 10) of each module, the chi of its Z-direction after upgrading Very little is fixed.Herein, so-called size is fixed, and refers to that the pallet before changing and the pallet after replacing, the size of its Z-direction are total to It is logical, that is, the Z-direction size of the pallet of supporting functions identical module is substantially certain.In this way, the liquid crystal exposure of the present embodiment Device 10, because each pallet 28A~28E Z-direction size is fixed, therefore time when can seek to design each module shortens.
Also, in liquid crystal exposure apparatus 10, because the plane of exposure of substrate P and light shield M pattern plane are put down with gravity direction respectively Row (so-called file configuration), therefore can be by illumination module 12M, mask stage module 14M, projection optics system module 16M and Baseplate carrier module 18M each module, it is in upright arrangement on the face of ground 26 to set.In this way, because above-mentioned each module does not have each other certainly The effect of weight, it is therefore not necessary to such as by for example equivalent to the baseplate carrier device of above-mentioned each module, projection optics system, mask stage Device and illumination are tied up to as the known exposure device that gravity direction overlaps, and set the high rigidity mainframe for supporting each key element (body).Further, since simple structure, the setting engineering of device, each module 12M~20M maintenance operation, replacement operation Deng can all carry out easily and in a short time.Also, due to configuring above-mentioned each module along ground 26, therefore device entirety can be reduced Height.In this way, can minimize the chamber of the above-mentioned each module of collecting, seek cost to reduce and shorten and the duration is set.
Also, the composition of an embodiment described above can be changed suitably.For example, in above-described embodiment, aligming microscope 62 Though relative to projection be body 42 the past-Y sides movements of moving range A to carry out avoidance operation, but as long as can retreat to projection system If the moving range A of body 42 outside, the direction of keeping out of the way of aligming microscope 62 is not limited to this, such as can be as shown in Figure 5 The 1st variation as, relative projection is that the past directions (X-direction) parallel with scanning direction of moving range A of body 42 is kept out of the way. Likewise, although not shown, but aligming microscope 62 keeps out of the way direction, and it for example with respect to projection is the moving range of body 42 that can be A toward+Y (on) side or+Z sides (light shield side) ,-Z sides (substrate-side).
Also, in above-described embodiment (and the 1st variation), though it is the side of traveling of body 42 that aligming microscope 62, which is past relative projection, To orthogonal direction or parallel direction movement to carry out avoidance operation, but the mobile side of the aligming microscope 62 during avoidance operation To not limited to this, for example, can be as shown in Figure 6 the 2nd variation as, be θ z directions (or other direction of rotation).In addition, when progress During the control for making aligming microscope 62 keep out of the way toward the direction beyond X-direction, projection is body 42 and aligming microscope 62 to Y-axis The relative position relation in direction is possible to different from primary position.Now, main control unit 90, preferably carrying out each time pair During the avoidance operation of quasi- microscope 62, the relative position (relational coordinate) for being body 42 with aligming microscope 62 on projection is carried out Calibration it is preferable.Furthermore in above-described embodiment (and the 1st variation), though be not by the avoidance control of aligming microscope 62 Position in substrate P is carried out, but also can be in the position in substrate P, namely the Y direction position of aligming microscope 62 and X-axis The position of the Y direction position and X-direction location overlap of direction position and substrate P is carried out.
Also, in above-described embodiment (and the 1st, the 2nd variation), though the illumination for being directed to drive illumination to be 20 is body 22 drivetrain 24, to drive the drivetrain 34 of the microscope carrier body 32 of mask stage device 30, driving projection optics system The drivetrain 44 of 40 projection optics system body 42, to drive the drivetrain 54 of the microscope carrier body 52 of baseplate carrier device 50, And the situation to drive the drivetrain 66 (respectively referring to Fig. 2) of aligming microscope 62 that alignment is 60 to be respectively linear motor is done Explanation, but be body 22, microscope carrier body 32, projection optics system body 42, microscope carrier body 52 and right to drive above-mentioned illumination The species not limited to this of the actuator of quasi- microscope 62, can suitably be changed, such as can suitably use feed screw (ball screw) The various actuators of device, belt drive etc..
Also, in above-described embodiment (and the 1st, the 2nd variation), though projection be body 42 with aligming microscope 62 be share it is past A part (such as linear motor, guiding element etc.) for the drivetrain of scanning direction, but as long as can drive individually projection be body 42 with If aligming microscope 62, not limited to this, to drive the drivetrain 66 of aligming microscope 62, with driving projection optics system 40 projection is that the drivetrain 44 of body 42 can be completely self-contained composition.That is, as exposure device 10A as shown in Figure 8, Can by projection optics system 40A with projection optics system body 42 be aligned be 60A with aligming microscope 62, with Y location Unduplicated mode configures each other, so as to drive the drivetrain 66 of aligming microscope 62 (such as comprising linear motor, guiding element Deng) with to drive the drivetrain 44 (such as comprising linear motor, guiding element etc.) that projection is body 42, turning into completely self-contained structure Into.This occasion, by before the action of the scan exposure in the zoning region of exposure object starts, substrate P is set to be moved toward Y direction stepping Dynamic (moving back and forth), carry out according to this zoning region to locating tab assembly.Also, as exposure device 10B that also can be as shown in Figure 9, borrow By by drive the drivetrain 44 of projection optics system body 42 that projection optics system 40B has (such as comprising linear motor, lead Part etc.), with that will be the drivetrain 66 for the aligming microscope 62 that 60B has (such as comprising linear motor, guiding element to drive alignment Deng) be configured to Y location and do not repeat, drivetrain 44 and drivetrain 66 is turned into completely self-contained composition.
Also, in above-described embodiment (and the 1st, the 2nd variation), though for being that 20 illumination is body to be illuminated The measurement of 22 position measurement is 26, carrying out the measurement system of the position measurement of the microscope carrier body 32 of mask stage device 30 36th, it is 46 to carry out the measurement of the position measurement of the projection optics system body 42 of projection optics system 40, carrying out substrate load The measurement of the position measurement of the microscope carrier body 52 of table apparatus 50 be 56 and to carry out alignment be 60 aligming microscope 62 position The measurement for putting measurement is 68 (respectively referring to Fig. 2), and all situations comprising linear encoder are described, but to carry out above-mentioned photograph Bright system's body 22, microscope carrier body 32, projection be projection optics system body 42, microscope carrier body 52 and aligming microscope 62 position survey The species not limited to this of the measuring system of amount, can suitably be changed, such as suitably using optical interferometer or and can use linear encoder With the various measuring systems of the measurement system of optical interferometer etc..
Also, in above-described embodiment (and the 1st, the 2nd variation), it is configured with+X the sides that projection is body 42 with a pair of inspections One group of movable aligming microscope 62 in the visual field is surveyed, but the quantity of movable aligming microscope is not limited to this.Such as it can throw Aligming microscope 62 is respectively configured in+X the sides of shadow system body 42 and-X sides (side of scanning direction and opposite side).This occasion, (that is, projection is set to be that body 42 is carried out toward -X direction movement carrying out the 2nd scan exposure action to each zoning region Scan exposure acts) before, by the detection mark Mk of aligming microscope 62 of use-X sides, the loss of time can suppressed Simultaneously, the 1st irradiation area S is lifted1All alignment precision and then light shield M pattern is lifted to the 1st irradiation area S1Transfer Precision.
Also, above-described embodiment (and include each variation.It is as follows) in, though in the 1st irradiation area S1Scan exposure Afterwards, carry out being set in the 1st irradiation area S1+ Y (on) the 2nd irradiation area S of side2Scan exposure, but not limited to this, also Can be in the 1st irradiation area S1Scan exposure next irradiation area S of carry out the 4th4Scan exposure.This occasion, such as by With the 1st irradiation area S1 to light shield, with the 4th irradiation area S4To light shield (add up to 2 light shields) use, can be continuous Carry out the 1st and the 4th irradiation area S1、S4Scan exposure.In addition, also in the 1st irradiation area S1Scan exposure after make light shield M Toward +X direction stepping movement to carry out the 4th irradiation area S4Scan exposure.
Also, in above-described embodiment, mark Mk is formed in each zoning region (the 1st~the 4th irradiation area S1~S4) in, but Not limited to this, it also may be formed at adjacent region and draw in interregional region (so-called score line).
Also, in above-described embodiment, though a pair of the illumination region IAM, the exposure area IA that are separated in Y direction are given birth to respectively Into in light shield M, substrate P (reference picture 1), but illumination region IAM and exposure area IA shape, length not limited to this, it can fit Work as change.For example, illumination region IAM, exposure area IA Y direction length, can respectively the pattern plane with light shield M, in substrate P A zoning region Y direction equal length.This occasion, single pass exposure actions are carried out to each zoning region and terminated The transfer of mask pattern.Or illumination region IAM, exposure area IA, can be the pattern that Y direction length is respectively light shield M A region of the half of the Y direction length in a zoning region on face, substrate P.This occasion, it is same with above-described embodiment , rescan exposure actions need to be carried out to a zoning region, to carry out engagement exposure.
Also, such as above-mentioned embodiment, projection is set to be body 42 in zoning region in order to which a mask pattern is formed When back and forth to carry out engagement exposure, the past road in the detection visual field with inequality can be used and multiple road aligming microscope is in scanning side To (X-direction) configuration before and after projection is body 42.This occasion, the alignment with (the 1st exposure actions use) toward road can be used The mark Mk of microscope detection division region corner, connect using multiple road with the aligming microscope detection of (the 2nd exposure actions use) Mark Mk near conjunction portion.Herein, so-called junction surface, the region (area of pattern transfer of the scan exposure exposure on conventional road is referred to Domain) with the bonding part in the region (region of pattern transfer) exposed with the scan exposure on multiple road.As the mark near junction surface Remember Mk, mark Mk, the pattern that can be also completed exposing can be formed as mark Mk in substrate P in advance.
It is 20 light sources used and the illumination light IL irradiated from the light source wavelength in illumination also, in the various embodiments described above It is not particularly limited, can is such as ArF PRKs (wavelength 193nm), KrF PRKs (wavelength 248nm) The vacuum-ultraviolet light such as ultraviolet light or F2 laser (wavelength 157nm).
Also, in above-described embodiment, though the illumination comprising light source, which is body 22, is driven in scanning direction, it is not limited to This, also can only make illumination with the exposure device disclosed in such as JP 2000-12422 publications likewise, light source is fixed Light IL is scanned in scanning direction.
Also, illumination region IAM, exposure area IA, it is created as extending the banding of Y direction in the above-described embodiments, But not limited to this, jagged multiple regions can be will be configured to and added disclosed in such as 5,729, No. 331 specifications of U.S. Patent No. With combination.
Also, in the various embodiments described above, though light shield M and substrate P are arranged to (so-called file configuration) orthogonal with horizontal plane, But light shield M and substrate P, can also be configured to and plane-parallel by not limited to this.This occasion, illumination light IL optical axis and gravity side To almost parallel.
Though also, it is according to the result to locating tab assembly in the X/Y plane of substrate P a little determine when scan exposure acts , but also can be parallel with this, (or parallel with scan exposure action) obtains the face position money of substrate P before scan exposure action News, the face position that substrate P is carried out in scan exposure action control (so-called auto-focusing control).
Also, the liquid crystal that the purposes of exposure device is not limited to liquid crystal display cells pattern being transferred to square glass plate exposes Device, can also be widely applicable for for example organic EL (Electro-Luminescence) panel manufacture exposure device, half The exposure device of conductor manufacture, manufacturing the exposure device of film magnetic head, micro-machine and DNA chip etc..In addition, it is not only The microcomponent of semiconductor element etc., also it can be suitably used for be manufactured in light exposure device, EUV exposure devices, X-ray exposure device and electricity The light shield or graticule that sub-line exposure device etc. uses, the exposure that circuit pattern is transferred to glass substrate or Silicon Wafer etc. fill Put.
Also, the object of exposure object is not limited to glass plate, can also be such as wafer, ceramic substrate, film member or light Other objects such as cover motherboard.In addition, when exposure object thing is the situation of flat display panel, the thickness of the substrate has no It is particularly limited to, also comprising such as tablet (flat member with pliability).Also, the exposure device of the present embodiment, is exposing Object be an edge lengths or to angular length in more than 500mm substrate it is especially effective.In addition, the substrate in exposure object is During the situation of the sheet (sheet material) with pliability, the sheet material can be created as drum.This occasion, without relying on microscope carrier dress The stepwise operation put, as long as making reel rotation (winding) (stepping movement) readily can be changed relative to illumination region (illumination light) The zoning region of exposure object.
The electronic component of liquid crystal display cells (or semiconductor element) etc., it is via function, the performance design for entering units The step of, according to this design procedure make light shield (or graticule) the step of, make glass substrate (or wafer) the step of, more than Light shield (graticule) pattern is transferred to the following a lithography step of glass substrate, made by the exposure device and its exposure method for stating each embodiment After exposure glass substrate development development step, by remaining have photoresistance part be subject to the component that exposes of outer portion by means of etching The etching step of removal, by after the completion of etching need not photoresistance removed photoresistance removing step, element number of assembling steps, inspection Check Step etc. and manufactured.This occasion, implement foregoing exposure method using the exposure device of above-described embodiment in following a lithography step, in glass Element pattern is formed on glass substrate, therefore the element of high integration can be manufactured with good productivity.
Industrial applicability
As described above, exposure device of the invention and method are suitable to be scanned object exposure.Also, the present invention The manufacture method of flat-panel screens is suitable to the production of flat-panel screens.In addition, the manufacturing method of the present invention is suitable to microcomponent Production.

Claims (52)

1. a kind of exposure device, it is that the projection optics is driven with respect to the object to object illumination illumination light through projection optics system System is exposed with being scanned, it is characterised in that it possesses：
Test section is marked, to detect the mark for being located at the object；
1st drivetrain, it is to drive the mark test section；
2nd drivetrain, it is to drive the projection optics system；And
Control device, the 1st and the 2nd drivetrain is controlled to avoid the projection optics system from being in contact with each other with the mark test section.
2. a kind of exposure device, it is that the projection optics is driven with respect to the object to object illumination illumination light through projection optics system System is exposed with being scanned, it is characterised in that it possesses：
Test section is marked, to detect the mark for being located at the object；
1st drivetrain, it is to drive the mark test section；
2nd drivetrain, it is to drive the projection optics system；And
Control device, in the scan exposure, drive the projection optics system and during at least one party, control should in the mark test section The drivetrain of at least one party in 1st and the 2nd drivetrain, so that the interval of the projection optics system and the mark test section is at a distance of set It is more than distance.
3. a kind of exposure device, it is that the projection optics is driven with respect to the object to object illumination illumination light through projection optics system It is to be scanned exposure actions, it is characterised in that it possesses：
Test section is marked, to detect the mark for being located at the object；
1st drivetrain, it is to drive the mark test section；
2nd drivetrain, it is to drive the projection optics system；And
Control device, at least part action in scan exposure action, the 1st and the 2nd drivetrain is controlled respectively with phase Different actuating speed drives the projection optics system and the mark test section.
4. a kind of exposure device, it is that the projection optics is driven with respect to the object to object illumination illumination light through projection optics system System is exposed with being scanned, it is characterised in that it possesses：
Test section is marked, to detect the mark for being located at the object；
1st drivetrain, it is to drive the mark test section；
2nd drivetrain, it is to drive the projection optics system；And
Control device, it is that the 1st and the 2nd drivetrain of control makes the projection optics system stop powered stop position and the mark It is not overlapping to remember that test section stops powered stop position.
5. a kind of exposure device, it is that the projection optics is driven with respect to the object to object illumination illumination light through projection optics system System is exposed with being scanned, it is characterised in that it possesses：
Test section is marked, to detect the mark for being located at the object；
1st drivetrain, it is to drive the mark test section；
2nd drivetrain, it is to drive the projection optics system；And
Control device, it is the 1st and the 2nd drivetrain of control so that the driving of the projection optics system starts sequential and detected with the mark It is different that the driving in portion starts sequential.
6. a kind of exposure device, it is that the projection optics is driven with respect to the object to object illumination illumination light through projection optics system System is exposed with being scanned, it is characterised in that it possesses：
Test section is marked, to detect the mark for being located at the object；And
Control device, be in the scan exposure, position control is carried out to the projection optics system and the mark test section so that This relative position relation is constant.
7. exposure device according to any one of claim 1 to 6, it is characterised in that wherein, the object at least has position Put the 1st and the 2nd different zoning region；
The mark test section, there is the scanning direction that the projection optics system is driven in the relative object, be located at the projection optics system Side the 1st detection means and be located at the projection optics system opposite side the 2nd detection means；
The control device, in the scan exposure to the 1st zoning region, while being somebody's turn to do according to the detection of the 1st detection means The testing result of mark drives the projection optics system in the side, while controlling the 1st and the 2nd drivetrain so that the 2nd to be examined Survey the side that device drives past 2nd zoning region in a manner of not contacting the projection optics system.
8. exposure device according to claim 7, it is characterised in that wherein, the control device, to the 2nd zoning region The scan exposure in, the 1st and the 2nd drivetrain is controlled according to the testing result of the mark detected with the 2nd detection means The projection optics system is driven in the opposite side.
9. exposure device according to any one of claim 1 to 8, it is characterised in that wherein, the control device, carrying out 1st state of the scan exposure, with before the beginning of the scan exposure or after terminating not to the 2nd of the object illumination illumination light the State, make the projection optics system and the interval of the mark test section different.
10. exposure device according to claim 9, it is characterised in that wherein, the interval under the 1st state is compared with this The interval under 2nd state is wide.
11. the exposure device according to claim 9 or 10, it is characterised in that wherein, the projection optics under the 2nd state System and the mark test section, it is positioned at the not position with the overlapped object in the direction parallel with the optical axis of the projection optics system.
12. the exposure device according to any one of claim 1 to 11, it is characterised in that wherein, the mark test section quilt Drive a part of nonoverlapping scope in the driving possible range with the projection optics system.
13. exposure device according to claim 12, it is characterised in that wherein, the mark test section is driven in compared with the drive The wide scope of dynamic possible range.
14. the exposure device according to any one of claim 1 to 13, it is characterised in that wherein, the control device is control Mark detection operation of the system comprising the action for detecting the mark, at least part with the scan exposure action comprising the scan exposure Action is parallel.
15. exposure device according to claim 14, it is characterised in that wherein, the mark detection operation is examined comprising the mark Action of the survey portion toward the position movement for detecting the mark；
Scan exposure action includes the shift action of the projection optics system before the scan exposure starts.
16. exposure device according to claim 7, it is characterised in that wherein, the control device make the mark test section from Any mobile possible range in the powered scanning direction of the projection optics system and the direction intersected with the scanning direction is moved back Keep away.
17. exposure device according to claim 16, it is characterised in that wherein, the control device is to make the mark test section Keep out of the way from the movement possible range of the projection optics system, and make it using the direction parallel with the optical axis of the projection optics system as axle Rotation.
18. exposure device according to claim 7, it is characterised in that wherein, the mark test section system is arranged to detect In the direction intersected with the scanning direction, if distance between multiple marks on the object is compared with the region of the illumination Length length mark.
19. exposure device according to claim 18, it is characterised in that wherein, the object has to be handed over the scanning direction 1st and the 2nd zoning region of the direction spread configuration of fork；
The mark test section is arranged in the 2nd direction, at the same detect at least one mark on the 1st zoning region with At least one mark on 2nd zoning region.
20. a kind of exposure device, it is to project this to object illumination illumination light, and by the relative object through projection optics system Optical system is driven in exposure actions of the 1st direction to be exposed, and predetermined pattern is formed on the object, it is characterised in that its Possess：
Test section is marked, to detect the mark for being located at the object；
1st drivetrain, the mark test section is driven in the 1st direction；And
2nd drivetrain, the projection optics system is separated into independent driving in the 1st direction with the 1st drivetrain.
21. the exposure device according to any one of claim 1 to 20, it is characterised in that wherein, the projection optics system Optical axis and plane-parallel；
The object is configured with the state being orthogonal by the plane of exposure of the illumination to the horizontal plane.
22. exposure device according to claim 21, it is characterised in that wherein, the mark test section and the projection optics system It is to be configured in a manner of it can separate each other.
23. the exposure device according to claim 1 to 22, it is characterised in that wherein, the object is to be used for flat-panel screens The substrate of device.
24. exposure device according to claim 23, it is characterised in that wherein, the length or right at least one side of the substrate Angular length is more than 500mm.
25. a kind of manufacture method of flat-panel screens, it is characterised in that it is included：
The exposure for the object that exposure device any one of usage right requirement 1 to 24 is carried out；And
The development of the object after exposure.
26. a kind of manufacturing method, it is characterised in that it is included：
The exposure for the object that exposure device any one of usage right requirement 1 to 24 is carried out；And
The development of the object after exposure.
27. a kind of exposure method, it is that the projection optics is driven with respect to the object to object illumination illumination light through projection optics system System is exposed with being scanned, it is characterised in that it is included：
The detection carried out to the mark located at the object using mark test section；
The driving for using the mark test section the 1st drivetrain to carry out；
The driving for using the projection optics system the 2nd drivetrain to carry out；And
The control of the 1st and the 2nd drivetrain carried out in a manner of the projection optics system and the mark test section do not contact each other.
28. a kind of exposure method, it is that the projection optics is driven with respect to the object to object illumination illumination light through projection optics system System is exposed with being scanned, it is characterised in that it is included：
The detection carried out to the mark located at the object using mark test section；
The driving for using the mark test section the 1st drivetrain to carry out；
The driving for using the projection optics system the 2nd drivetrain to carry out；And
In the scan exposure, when the projection optics system is driven with least one party in the mark test section, with the projected light Learn at least one in interval the 1st and the 2nd drivetrain that apart both mode more than set a distance had been carried out of system and the mark test section The control of the drivetrain of side.
29. a kind of exposure method, it is that the projection optics is driven with respect to the object to object illumination illumination light through projection optics system System is exposed with being scanned, it is characterised in that it is included：
The detection carried out to the mark located at the object using mark test section；
The driving for using the mark test section the 1st drivetrain to carry out；
The driving for using the projection optics system the 2nd drivetrain to carry out；And
It is different respectively with the projection optics system and the mark test section at least part action in scan exposure action The control for the 1st and the 2nd drivetrain that the mode of actuating speed driving is carried out.
30. a kind of exposure method, it is that the projection optics is driven with respect to the object to object illumination illumination light through projection optics system System is exposed with being scanned, it is characterised in that it is included：
The detection carried out to the mark located at the object using mark test section；
The driving for using the mark test section the 1st drivetrain to carry out；
The driving for using the projection optics system the 2nd drivetrain to carry out；And
To stop the stop position of the driving of the projection optics system, not weighed with stopping the stop position of driving of the mark test section The control for the 1st and the 2nd drivetrain that folded mode is carried out.
31. a kind of exposure method, it is that the projection optics is driven with respect to the object to object illumination illumination light through projection optics system System is exposed with being scanned, it is characterised in that it is included：
The detection carried out to the mark located at the object using mark test section；
The driving for using the mark test section the 1st drivetrain to carry out；
The driving for using the projection optics system the 2nd drivetrain to carry out；And
The driving for starting sequential and the mark test section by the driving for making the projection optics system starts to carry out in a manner of sequential is different The the 1st and the 2nd drivetrain control.
32. a kind of exposure method, it is that the projection optics is driven with respect to the object to object illumination illumination light through projection optics system System is exposed with being scanned, it is characterised in that it is included：
The detection carried out to the mark located at the object using mark test section；And
In the scan exposure, the position of the projection optics system carried out in a manner of the relative position of each other relation is constant is with being somebody's turn to do Mark the control of the position of test section.
33. the exposure method according to any one of claim 27 to 32, it is characterised in that wherein, the object at least has The the 1st and the 2nd different zoning region of position；
The mark test section, the scanning direction of the projection optics system is driven in the relative object, has and is located at the projection optics system Side the 1st detection means, be located at the projection optics system opposite side the 2nd detection means；
The control, it is in the scan exposure to the 1st zoning region, while according to being somebody's turn to do with the detection of the 1st detection means The testing result of mark is by the projection optics system toward side driving, while by the 2nd detection means not contact the projected light The mode driven in the case of be toward the side in the 2nd zoning region, controls the 1st and the 2nd drivetrain.
34. exposure method according to claim 33, it is characterised in that be to the 2nd zoning area in the control wherein In the scan exposure in domain, the 1st and the 2nd driving is controlled according to the testing result of the mark detected with the 2nd detection means System drives the projection optics system in the opposite side.
35. the exposure method according to any one of claim 27 to 34, it is characterised in that wherein, in the control, be Carry out the scan exposure the 1st state, with before the beginning of the scan exposure or after terminating not to the object illumination illumination light 2nd state, make the projection optics system and the interval of the mark test section different.
36. exposure method according to claim 35, it is characterised in that wherein, the interval under the 1st state compared with The interval under 2nd state is wide.
37. the exposure method according to claim 35 or 36, it is characterised in that wherein, the projected light under the 2nd state System and the mark test section are learned, is positioned at the not position with the overlapped object in the direction parallel with the optical axis of the projection optics system Put.
38. the exposure method according to any one of claim 27 to 37, it is characterised in that wherein, the mark test section system It is driven in a part of nonoverlapping scope with the driving possible range of the projection optics system.
39. the exposure method according to claim 38, it is characterised in that wherein, the mark test section is driven in compared with the drive The wide scope of dynamic possible range.
40. the exposure method according to any one of claim 27 to 39, it is characterised in that wherein, in the control, be with Mark detection operation comprising the action for detecting the mark, at least part acted with the scan exposure comprising the scan exposure are moved It is controlled as parallel form.
41. exposure method according to claim 40, it is characterised in that wherein, the mark detection operation is examined comprising the mark Action of the survey portion toward the position movement for detecting the mark；
Scan exposure action includes the shift action of the projection optics system before the scan exposure starts.
42. exposure method according to claim 33, it is characterised in that be to make the mark test section in the control wherein Any mobile possible range from the powered scanning direction of the projection optics system and the direction intersected with the scanning direction Keep out of the way.
43. exposure method according to claim 42, it is characterised in that wherein, in the control, to make the mark test section Keep out of the way from the movement possible range of the projection optics system, and make it using the direction parallel with the optical axis of the projection optics system as axle Rotation.
44. exposure method according to claim 33, it is characterised in that wherein, the mark test section system is arranged to detect In the direction intersected with the scanning direction, if distance between multiple marks on the object is compared with the region of the illumination Length length mark.
45. exposure method according to claim 44, it is characterised in that wherein, the object has to be handed over the scanning direction 1st and the 2nd zoning region of the direction spread configuration of fork；
The mark test section is arranged in the 2nd direction, at the same detect at least one mark on the 1st zoning region with At least one mark on 2nd zoning region.
46. a kind of exposure method, it is to project this to object illumination illumination light, and by the relative object through projection optics system Optical system is driven in exposure actions of the 1st direction to be exposed, and predetermined pattern is formed on the object, it is characterised in that its Comprising：
The detection carried out to the mark located at the object using mark test section；
The driving of 1st drivetrain progress is used the mark test section toward the 1st direction；And
To drive of the projection optics system to use the 2nd drivetrain to carry out with separated independent past 1st direction of the 1st drivetrain It is dynamic.
47. the exposure method according to any one of claim 27 to 46, it is characterised in that wherein, the projection optics system Optical axis and plane-parallel；
The object is configured with the state being orthogonal by the plane of exposure of the illumination to the horizontal plane.
48. exposure method according to claim 47, it is characterised in that wherein, the mark test section and the projection optics system It is to be configured in a manner of it can separate each other.
49. the exposure method according to any one of claim 27 to 48, it is characterised in that wherein, the object is to be used to put down The substrate of face display equipment.
50. exposure method according to claim 49, it is characterised in that wherein, the length or right at least one side of the substrate Angular length is more than 500mm.
51. a kind of manufacture method of flat-panel screens, it is characterised in that it is included：
The exposure for the object that exposure method any one of usage right requirement 27 to 50 is carried out；And
The development of the object after exposure.
52. a kind of manufacturing method, it is characterised in that it is included：
The exposure for the object that exposure method any one of usage right requirement 27 to 50 is carried out；And
The development of the object after exposure.
CN201680020548.XA 2015-03-31 2016-03-31 Exposure apparatus, method for manufacturing flat panel display, method for manufacturing device, and exposure method Active CN107430354B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010960580.4A CN112162465B (en) 2015-03-31 2016-03-31 Exposure apparatus, method for manufacturing flat panel display, method for manufacturing device, and exposure method

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015071008 2015-03-31
JP2015-071008 2015-03-31
PCT/JP2016/060593 WO2016159201A1 (en) 2015-03-31 2016-03-31 Exposure device, method for producing flat panel display, method for producing device, and exposure method

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN202010960580.4A Division CN112162465B (en) 2015-03-31 2016-03-31 Exposure apparatus, method for manufacturing flat panel display, method for manufacturing device, and exposure method

Publications (2)

Publication Number Publication Date
CN107430354A true CN107430354A (en) 2017-12-01
CN107430354B CN107430354B (en) 2021-04-06

Family

ID=57005852

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201680020548.XA Active CN107430354B (en) 2015-03-31 2016-03-31 Exposure apparatus, method for manufacturing flat panel display, method for manufacturing device, and exposure method
CN202010960580.4A Active CN112162465B (en) 2015-03-31 2016-03-31 Exposure apparatus, method for manufacturing flat panel display, method for manufacturing device, and exposure method

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202010960580.4A Active CN112162465B (en) 2015-03-31 2016-03-31 Exposure apparatus, method for manufacturing flat panel display, method for manufacturing device, and exposure method

Country Status (5)

Country Link
JP (1) JP6744588B2 (en)
KR (1) KR102560814B1 (en)
CN (2) CN107430354B (en)
TW (2) TW201643557A (en)
WO (1) WO2016159201A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110232867A (en) * 2019-05-13 2019-09-13 深圳市华星光电技术有限公司 The motherboard exposure structure of display panel

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101738882A (en) * 2008-11-14 2010-06-16 优志旺电机株式会社 Alignment mark detecting method and apparatus
CN101738873A (en) * 2008-11-10 2010-06-16 优志旺电机株式会社 Exposure device
JP2013200506A (en) * 2012-03-26 2013-10-03 Nikon Corp Exposure apparatus, exposure method and device manufacturing method
CN103858208A (en) * 2011-08-10 2014-06-11 株式会社V技术 Alignment device and alignment mark for optical exposure device
CN104024943A (en) * 2012-01-06 2014-09-03 V科技股份有限公司 Light exposure device and method for manufacturing exposed material

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4029181B2 (en) * 1996-11-28 2008-01-09 株式会社ニコン Projection exposure equipment
JP2000012422A (en) 1998-06-18 2000-01-14 Nikon Corp Aligner
JP4172204B2 (en) * 2002-05-22 2008-10-29 株式会社ニコン Exposure method, exposure apparatus, and device manufacturing method
TW201806001A (en) * 2003-05-23 2018-02-16 尼康股份有限公司 Exposure device and device manufacturing method
US7804582B2 (en) * 2006-07-28 2010-09-28 Asml Netherlands B.V. Lithographic apparatus, method of calibrating a lithographic apparatus and device manufacturing method
JP2013015761A (en) * 2011-07-06 2013-01-24 Topcon Corp Exposure device
JP6082884B2 (en) * 2012-06-12 2017-02-22 サンエー技研株式会社 Exposure apparatus and exposure method
US9269537B2 (en) * 2013-03-14 2016-02-23 Taiwan Semiconductor Manufacturing Company, Ltd. E-beam lithography with alignment gating

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101738873A (en) * 2008-11-10 2010-06-16 优志旺电机株式会社 Exposure device
CN101738882A (en) * 2008-11-14 2010-06-16 优志旺电机株式会社 Alignment mark detecting method and apparatus
CN103858208A (en) * 2011-08-10 2014-06-11 株式会社V技术 Alignment device and alignment mark for optical exposure device
CN104024943A (en) * 2012-01-06 2014-09-03 V科技股份有限公司 Light exposure device and method for manufacturing exposed material
JP2013200506A (en) * 2012-03-26 2013-10-03 Nikon Corp Exposure apparatus, exposure method and device manufacturing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110232867A (en) * 2019-05-13 2019-09-13 深圳市华星光电技术有限公司 The motherboard exposure structure of display panel
CN110232867B (en) * 2019-05-13 2022-01-04 Tcl华星光电技术有限公司 Mother board exposure structure of display panel

Also Published As

Publication number Publication date
JP6744588B2 (en) 2020-08-19
CN107430354B (en) 2021-04-06
TW201643557A (en) 2016-12-16
CN112162465B (en) 2023-06-20
WO2016159201A1 (en) 2016-10-06
KR20170128600A (en) 2017-11-22
TWI743845B (en) 2021-10-21
TW202040287A (en) 2020-11-01
JPWO2016159201A1 (en) 2018-02-01
KR102560814B1 (en) 2023-07-27
CN112162465A (en) 2021-01-01

Similar Documents

Publication Publication Date Title
CN102549501B (en) Exposure apparatus, exposure method, and device manufacturing method
US4878086A (en) Flat panel display device and manufacturing of the same
CN102625924B (en) Exposure method and exposure device and manufacturing method
CN101680747B (en) Moving body driving system, pattern forming apparatus, exposure apparatus, exposure method and device manufacturing method
CN101796614B (en) Position measuring system and position measuring method, mobile body device, mobile body driving method, exposure device and exposure method, pattern forming device, and device manufacturing method
CN104838469A (en) Exposure device and exposure method, and device-manufacturing method
US4814830A (en) Flat panel display device and manufacturing of the same
TWI703402B (en) Layout method, mark detection method, exposure method, measurement device, exposure apparatus, and device manufacturing method
CN106415397A (en) Mobile body apparatus, exposure apparatus, production method for flat panel display, production method for device, and drive method for mobile body
TWI727975B (en) Exposure apparatus, manufacturing method of flat panel display, and device manufacturing method
CN108139688A (en) Exposure device, the manufacturing method of flat-panel screens, assembly manufacture method and exposure method
CN113267964B (en) Exposure apparatus, exposure method, and method for manufacturing flat panel display
TWI721023B (en) Exposure apparatus and exposure method, and manufacturing method of flat panel display
CN107533303A (en) Exposure device, the manufacture method of flat-panel screens, manufacturing method and exposure method
CN107430354A (en) Exposure device, the manufacture method of flat-panel screens, manufacturing method and exposure method
JP2011211180A (en) Exposure method, exposure apparatus, and device manufacturing method
CN107430357A (en) Exposure device, the manufacture method of flat-panel screens, manufacturing method and exposure method
JP2011211181A (en) Exposure method, exposure apparatus, and device manufacturing method

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
REG Reference to a national code

Ref country code: HK

Ref legal event code: DE

Ref document number: 1239837

Country of ref document: HK

GR01 Patent grant
GR01 Patent grant