JPWO2016159201A1 - Exposure apparatus, flat panel display manufacturing method, device manufacturing method, and exposure method - Google Patents

Abstract

A liquid crystal exposure apparatus (10) that performs scanning exposure by irradiating the substrate (P) with illumination light (IL) through the projection optical system (40) and driving the projection optical system (40) relative to the substrate (P). Includes an alignment system (60) for detecting a mark (Mk) provided on the substrate (P), a first drive system for driving the alignment system (60), and a second drive for driving the projection optical system (40). And a control device that controls the first and second drive systems so that the projection optical system (40) and the alignment system (60) do not contact each other. This avoids contact between the projection optical system (40) and the alignment system (60).

Description

  The present invention relates to an exposure apparatus, a flat panel display manufacturing method, a device manufacturing method, and an exposure method. More specifically, the present invention relates to an exposure apparatus that scans an energy beam in a predetermined scanning direction to form a predetermined pattern. The present invention relates to an exposure apparatus and method for forming on an object, and a method of manufacturing a flat panel display or device including the exposure apparatus or method.

  2. Description of the Related Art Conventionally, in a lithography process for manufacturing electronic devices (microdevices) such as liquid crystal display elements and semiconductor elements (such as integrated circuits), an energy beam is applied to a pattern formed on a mask or reticle (hereinafter collectively referred to as “mask”) An exposure apparatus is used for transferring onto a glass plate or a wafer (hereinafter collectively referred to as “substrate”).

  In this type of exposure apparatus, a beam that forms a predetermined pattern on a substrate by scanning exposure illumination light (energy beam) in a predetermined scanning direction while the mask and the substrate are substantially stationary. A scanning-type scanning exposure apparatus is known (see, for example, Patent Document 1).

  In the exposure apparatus described in Patent Document 1, in order to correct the position error between the exposure target region on the substrate and the mask, the projection optical system is moved through the projection optical system while moving in the direction opposite to the scanning direction at the time of exposure. Then, the mark on the substrate and the mask is measured (alignment measurement) by the alignment microscope, and the position error between the substrate and the mask is corrected based on the measurement result. Here, since the alignment mark on the substrate is measured via the projection optical system, the alignment operation and the exposure operation are executed sequentially (serially), and the processing time (tact time) required for the entire exposure processing of the substrate is calculated. It was difficult to suppress.

JP 2000-12422 A

  The present invention has been made under the above circumstances. From the first viewpoint, the object is irradiated with illumination light through the projection optical system, and the projection optical system is driven relative to the object. An exposure apparatus that performs scanning exposure, a mark detection unit that detects a mark provided on the object, a first drive system that drives the mark detection unit, a second drive system that drives the projection optical system, And a control device that controls the first and second drive systems so that the projection optical system and the mark detection unit do not contact each other.

  According to a second aspect of the present invention, there is provided an exposure apparatus that irradiates an object with illumination light through a projection optical system and performs scanning exposure by relatively driving the projection optical system with respect to the object. A mark detection unit that detects a mark provided on the first detection system, a first drive system that drives the mark detection unit, a second drive system that drives the projection optical system, and the projection optical system and the A control device that controls at least one of the first and second drive systems such that a distance between the projection optical system and the mark detection unit is greater than a predetermined distance when at least one of the mark detection unit is driven. And a second exposure apparatus.

  From a third viewpoint, the present invention is an exposure apparatus that irradiates an object with illumination light through a projection optical system and performs a scanning exposure operation by relatively driving the projection optical system with respect to the object. A mark detection unit that detects a mark provided on the object, a first drive system that drives the mark detection unit, a second drive system that drives the projection optical system, and at least a part during the scanning exposure operation And a control device for controlling the first and second drive systems so that the projection optical system and the mark detection unit are driven at different drive speeds.

  According to a fourth aspect of the present invention, there is provided an exposure apparatus for irradiating an object with illumination light through a projection optical system and performing scanning exposure by relatively driving the projection optical system with respect to the object. A mark detection unit that detects a mark provided on the first detection system, a first drive system that drives the mark detection unit, a second drive system that drives the projection optical system, and a stop position at which the projection optical system stops driving And a control device that controls the first and second drive systems so that the stop position where the mark detection unit stops driving does not overlap.

  According to a fifth aspect of the present invention, there is provided an exposure apparatus that irradiates an object with illumination light through a projection optical system and performs scanning exposure by relatively driving the projection optical system with respect to the object. A mark detection unit that detects a mark provided on the first detection system, a first drive system that drives the mark detection unit, a second drive system that drives the projection optical system, drive start timing of the projection optical system, and the mark And a control device that controls the first and second drive systems so that the drive start timing of the detection unit is different.

  According to a sixth aspect of the present invention, there is provided an exposure apparatus that irradiates an object with illumination light through a projection optical system and performs scanning exposure by relatively driving the projection optical system with respect to the object. A mark detection unit that detects a mark provided on the control unit, and a control device that controls the position of the projection optical system and the mark detection unit so that the relative positional relationship does not change in the scanning exposure. Exposure apparatus.

  According to a seventh aspect of the present invention, there is provided an exposure operation in which an object is irradiated with illumination light through a projection optical system, and exposure is performed by relatively driving the projection optical system in the first direction to expose the object. An exposure apparatus for forming a pattern on the object, wherein the mark detection unit detects a mark provided on the object, a first drive system that drives the mark detection unit in the first direction, and the projection optics And a second drive system that drives the system in the first direction independently of the first drive system.

  According to an eighth aspect of the present invention, there is provided a flat including: exposing the object using any one of the exposure apparatuses according to any one of the first to seventh aspects of the present invention; and developing the exposed object. It is a manufacturing method of a panel display.

  According to a ninth aspect of the present invention, there is provided a device comprising: exposing the object using the exposure apparatus according to any one of the first to seventh aspects of the present invention; and developing the exposed object. It is a manufacturing method.

  According to a tenth aspect of the present invention, there is provided an exposure method in which scanning exposure is performed by irradiating an object with illumination light through a projection optical system and driving the projection optical system relative to the object. Detecting a mark provided on the mark using a mark detection unit, driving the mark detection unit using a first drive system, and driving the projection optical system using a second drive system. , Controlling the first and second drive systems so that the projection optical system and the mark detection unit do not contact each other.

  According to an eleventh aspect of the present invention, there is provided an exposure method in which scanning exposure is performed by irradiating an object with illumination light through a projection optical system and driving the projection optical system relative to the object. Detecting a mark provided on the mark using a mark detection unit, driving the mark detection unit using a first drive system, and driving the projection optical system using a second drive system. In the scanning exposure, when at least one of the projection optical system and the mark detection unit is driven, the first and second drives are performed so that the projection optical system and the mark detection unit are spaced apart by a predetermined distance or more. Controlling at least one drive system of the system.

  According to a twelfth aspect of the present invention, there is provided an exposure method in which scanning exposure is performed by irradiating an object with illumination light through a projection optical system and driving the projection optical system relative to the object. Detecting a mark provided on the mark using a mark detection unit, driving the mark detection unit using a first drive system, and driving the projection optical system using a second drive system. And controlling the first and second drive systems so that the projection optical system and the mark detection unit are driven at different drive speeds in at least a part of the operations during the scanning exposure operation. Third exposure method.

  According to a thirteenth aspect of the present invention, there is provided an exposure method in which scanning exposure is performed by irradiating an object with illumination light through a projection optical system, and driving the projection optical system relative to the object. Detecting a mark provided on the mark using a mark detection unit, driving the mark detection unit using a first drive system, and driving the projection optical system using a second drive system. And controlling the first and second drive systems so that the stop position at which the projection optical system stops driving and the stop position at which the mark detection unit stops driving overlap. Is the method.

  According to a fourteenth aspect of the present invention, there is provided an exposure method in which scanning exposure is performed by irradiating an object with illumination light via a projection optical system and driving the projection optical system relative to the object. Detecting a mark provided on the mark using a mark detection unit, driving the mark detection unit using a first drive system, and driving the projection optical system using a second drive system. And controlling the first and second drive systems so that the drive start timing of the projection optical system and the drive start timing of the mark detection unit are different.

  According to a fifteenth aspect of the present invention, there is provided an exposure method in which scanning exposure is performed by irradiating an object with illumination light via a projection optical system and driving the projection optical system relative to the object. Detecting a mark provided on the mark using a mark detection unit, and controlling the position of the projection optical system and the position of the mark detection unit so that the relative positional relationship with each other does not change in the scanning exposure. And a sixth exposure method.

  According to a sixteenth aspect of the present invention, there is provided an exposure operation in which an object is irradiated with illumination light through a projection optical system, and exposure is performed by relatively driving the projection optical system in the first direction to expose the object. An exposure method for forming a pattern on the object, wherein a mark provided on the object is detected using a mark detection unit, and the mark detection unit is used in the first direction using a first drive system. And driving the projection optical system in the first direction using the second drive system independently of the first drive system.

  According to a seventeenth aspect of the present invention, there is provided a flat including: exposing the object using any one of the first to seventh exposure methods of the present invention; and developing the exposed object. It is a manufacturing method of a panel display.

  According to an eighteenth aspect of the present invention, there is provided a device comprising: exposing the object using any one of the first to seventh exposure methods of the present invention; and developing the exposed object. It is a manufacturing method.

It is a conceptual diagram of the liquid crystal exposure apparatus which concerns on one Embodiment. FIG. 2 is a block diagram showing an input / output relationship of a main controller that mainly constitutes a control system of the liquid crystal exposure apparatus of FIG. 1. FIGS. 3A to 3D are views (No. 1 to No. 4) for explaining the operation of the liquid crystal exposure apparatus during the exposure operation. 4A to 4C are views (Nos. 5 to 7) for explaining the operation of the liquid crystal exposure apparatus during the exposure operation. It is a figure for demonstrating the structure of the alignment system which concerns on a 1st modification. It is a figure for demonstrating the structure of the alignment system which concerns on a 2nd modification. It is a figure for demonstrating the structure of the measurement system of a projection system main body and an alignment microscope. It is a figure which shows the modification (the 1) of the drive system of a projection optical system and an alignment system. It is a figure which shows the modification (the 2) of the drive system of a projection optical system and an alignment system. It is a conceptual diagram of module replacement | exchange in a liquid crystal exposure apparatus.

  Hereinafter, an embodiment will be described with reference to FIGS.

  FIG. 1 shows a conceptual diagram of a liquid crystal exposure apparatus 10 according to an embodiment. The liquid crystal exposure apparatus 10 employs a step-and-scan method in which a rectangular (square) glass substrate P (hereinafter simply referred to as a substrate P) used in, for example, a liquid crystal display device (flat panel display) is an exposure object. A projection exposure apparatus, a so-called scanner.

  The liquid crystal exposure apparatus 10 includes an illumination system 20 that irradiates illumination light IL that is an energy beam for exposure, and a projection optical system 40. Hereinafter, the direction parallel to the optical axis of the illumination light IL applied to the substrate P from the illumination system 20 via the projection optical system 40 is referred to as the Z-axis direction, and the X-axis is orthogonal to each other in a plane orthogonal to the Z-axis. The explanation will be given with the Y axis set. In the coordinate system of the present embodiment, it is assumed that the Y axis is substantially parallel to the direction of gravity. Therefore, the XZ plane is substantially parallel to the horizontal plane. The rotation (tilt) direction around the Z axis will be described as the θz direction.

  Here, in this embodiment, a plurality of exposure target areas (which will be referred to as partition areas or shot areas as appropriate) are set on one substrate P, and a mask pattern is sequentially transferred to the plurality of shot areas. Is done. In the present embodiment, a case where four partition areas are set on the substrate P (so-called four-chamfering) will be described, but the number of partition areas is not limited to this and can be changed as appropriate. is there.

  The liquid crystal exposure apparatus 10 performs a so-called step-and-scan exposure operation. During the scan exposure operation, the mask M and the substrate P are substantially stationary, and the illumination system 20 and the projection optical system. 40 (illumination light IL) moves relative to the mask M and the substrate P with a long stroke in the X-axis direction (referred to as the scanning direction as appropriate) (see the white arrow in FIG. 1). On the other hand, at the time of the step operation for changing the partition area to be exposed, the mask M is stepped with a predetermined stroke in the X-axis direction, and the substrate P is stepped with a predetermined stroke in the Y-axis direction (see FIGS. 1 black arrow).

  FIG. 2 is a block diagram showing the input / output relationship of the main controller 90 that performs overall control of each component of the liquid crystal exposure apparatus 10. As shown in FIG. 2, the liquid crystal exposure apparatus 10 includes an illumination system 20, a mask stage apparatus 30, a projection optical system 40, a substrate stage apparatus 50, an alignment system 60, and the like.

  The illumination system 20 includes an illumination system body 22 including a light source (for example, a mercury lamp) of illumination light IL (see FIG. 1). During the scan exposure operation, the main controller 90 scans the illumination system main body 22 with a predetermined long stroke in the X-axis direction by controlling the drive system 24 including, for example, a linear motor. The main controller 90 obtains position information of the illumination system body 22 in the X-axis direction via the measurement system 26 including, for example, a linear encoder, and performs position control of the illumination system body 22 based on the position information. In the present embodiment, for example, g-line, h-line, i-line or the like is used as the illumination light IL.

  The mask stage apparatus 30 includes a stage main body 32 that holds the mask M. The stage main body 32 is configured to be appropriately step-movable in the X-axis direction and the Y-axis direction by a drive system 34 including, for example, a linear motor. During the step operation for changing the exposure target partition area with respect to the X-axis direction, the main controller 90 controls the drive system 34 to step-drive the stage body 32 in the X-axis direction. Further, as will be described later, during the step operation for changing the scanning exposure region (position) in the Y-axis direction in the partition region to be exposed, the main controller 90 controls the drive system 34 to control the stage. The main body 32 is step-driven in the Y-axis direction. The drive system 34 can also appropriately finely drive the mask M in the direction of three degrees of freedom (X, Y, θz) in the XY plane during an alignment operation described later. The position information of the mask M is obtained by a measurement system 36 including a linear encoder, for example.

  The projection optical system 40 includes a projection system main body 42 including an optical system that forms an erect image of a mask pattern on a substrate P (see FIG. 1) in the same magnification system. The projection system main body 42 is disposed in a space formed between the substrate P and the mask M (see FIG. 1). During the scan exposure operation, the main controller 90 controls the drive system 44 including, for example, a linear motor, so that the projection system main body 42 has a predetermined length in the X-axis direction so as to synchronize with the illumination system main body 22. Scan drive with stroke. The main controller 90 obtains position information in the X-axis direction of the projection system main body 42 via the measurement system 46 including, for example, a linear encoder, and controls the position of the projection system main body 42 based on the position information.

  Returning to FIG. 1, in the liquid crystal exposure apparatus 10, when the illumination area IAM on the mask M is illuminated by the illumination light IL from the illumination system 20, the illumination light IL that has passed through the mask M passes through the projection optical system 40. A projection image (partial upright image) of the mask pattern in the illumination area IAM is formed in the irradiation area (exposure area IA) of the illumination light IL conjugate to the illumination area IAM on the substrate P. Then, the scanning light exposure operation is performed when the illumination light IL (the illumination area IAM and the exposure area IA) moves relative to the mask M and the substrate P in the scanning direction. That is, in the liquid crystal exposure apparatus 10, the pattern of the mask M is generated on the substrate P by the illumination system 20 and the projection optical system 40, and the sensitive layer (resist layer) on the substrate P is exposed by the illumination light IL. The pattern is formed.

  Here, in the present embodiment, the illumination area IAM generated on the mask M by the illumination system 20 includes a pair of rectangular areas that are separated in the Y-axis direction. The length in the Y-axis direction of one rectangular area is, for example, 1 in the length in the Y-axis direction of the pattern surface of the mask M (that is, the length in the Y-axis direction of each partition area set on the substrate P). / 4 is set. Similarly, the distance between the pair of rectangular areas is set to, for example, 1/4 of the length of the pattern surface of the mask M in the Y-axis direction. Accordingly, the exposure area IA generated on the substrate P similarly includes a pair of rectangular areas spaced apart in the Y-axis direction. In the present embodiment, in order to completely transfer the pattern of the mask M onto the substrate P, it is necessary to perform two scanning exposure operations for one partition region. However, the illumination system main body 22 and the projection system main body 42 are required. There is an advantage that can be downsized. A specific example of the scanning exposure operation will be described later.

  The substrate stage apparatus 50 includes a stage main body 52 that holds the back surface of the substrate P (the surface opposite to the exposure surface). Returning to FIG. 2, during the step operation for changing the section area to be exposed in the Y-axis direction, the main controller 90 controls the drive system 54 including, for example, a linear motor to move the stage main body 52 to the Y-direction. Step drive in the axial direction. The drive system 54 can also minutely drive the substrate P in the direction of three degrees of freedom (X, Y, θz) in the XY plane during a substrate alignment operation described later. The position information of the substrate P (stage main body 52) is obtained by a measurement system 56 including, for example, a linear encoder.

  Returning to FIG. 1, the alignment system 60 includes an alignment microscope 62. The alignment microscope 62 is arranged in a space formed between the substrate P and the mask M (position between the substrate P and the mask M with respect to the Z-axis direction), and the alignment mark Mk formed on the substrate P. (Hereinafter simply referred to as a mark Mk) and a mark (not shown) formed on the mask M are detected. In the present embodiment, one mark Mk is formed near each of the four corners of each partition area (for example, four for each partition area), and the mark on the mask M is marked via the projection optical system 40. It is formed at a position corresponding to Mk. Note that the numbers and positions of the marks Mk and the marks of the mask M are not limited to this, and can be changed as appropriate. In each drawing, the mark Mk is shown larger than the actual size for easy understanding.

  The alignment microscope 62 is disposed on the + X side of the projection system main body 42. The alignment microscope 62 has a pair of detection visual fields (detection areas) separated in the Y-axis direction, and can simultaneously detect, for example, two marks Mk separated in the Y-axis direction in one partition area. It is like that.

  The alignment microscope 62 can simultaneously detect the mark formed on the mask M and the mark Mk formed on the substrate P (in other words, without changing the position of the alignment microscope 62). . For example, each time the mask M performs an X-step operation or the substrate P performs a Y-step operation, the main controller 90 performs information on the relative displacement between the mark formed on the mask M and the mark Mk formed on the substrate P. Then, relative positioning of the substrate P and the mask M in the direction along the XY plane is performed so as to correct (cancel or reduce) the positional deviation. In the alignment microscope 62, a mask detection unit for detecting (observing) the mark on the mask M and a substrate detection unit for detecting (observing) the mark Mk on the substrate P are integrally configured by a common housing or the like. And is driven by a drive system 66 through the common housing. Alternatively, the mask detection unit and the substrate detection unit may be configured by separate housings, and in that case, for example, the mask detection unit and the substrate detection unit are substantially equivalent by a common drive system 66. It is preferable to be configured so that it can move with operating characteristics.

  The main controller 90 (see FIG. 2) drives the alignment microscope 62 with a predetermined long stroke in the X-axis direction by controlling a drive system 66 (see FIG. 2) including, for example, a linear motor. Further, the main controller 90 obtains position information of the alignment microscope 62 in the X-axis direction via a measurement system 68 including, for example, a linear encoder, and performs position control of the alignment microscope 62 based on the position information. The drive system 66 also includes, for example, a linear motor for driving the alignment microscope 62 in the Y-axis direction.

  Here, the alignment microscope 62 of the alignment system 60 and the projection system main body 42 of the above-described projection optical system 40 are physically (mechanically) independent (separated) elements, and the main controller 90 (see FIG. 2). The driving system 66 that drives the alignment microscope 62 and the driving system 44 that drives the projection system main body 42 are related to driving in the X-axis direction. For example, a part of a linear motor, a linear guide, etc. is shared, and the drive characteristics of the alignment microscope 62 and the projection system main body 42 or the control characteristics of the main controller 90 are configured to be substantially equal. Yes.

  Specifically, for example, when each of the alignment microscope 62 and the projection system main body 42 is driven in the X-axis direction by a moving coil type linear motor, a magnetic body unit (for example, a permanent magnet) unit that is a stator. Is shared by the drive system 66 and the drive system 44. On the other hand, the alignment unit 62 and the projection system main body 42 each independently have a coil unit that is a mover, and the main controller 90 (see FIG. 2) individually supplies power to the coil unit. Thus, the drive (speed and position) of the alignment microscope 62 in the X-axis direction and the drive (speed and position) of the projection system main body 42 in the X-axis direction are controlled independently. Therefore, the main controller 90 can change (arbitrarily change) the interval (distance) between the alignment microscope 62 and the projection system main body 42 in the X-axis direction. The main controller 90 can also move the alignment microscope 62 and the projection system main body 42 at different speeds in the X-axis direction.

  Main controller 90 (see FIG. 2) detects a plurality of marks Mk formed on substrate P using alignment microscope 62, and based on the detection results (position information of the plurality of marks Mk), Arrangement information (including information on the position (coordinate value), shape, etc. of the partition area) of the partition area in which the mark Mk to be detected is formed is calculated by an enhanced global alignment (EGA) method.

  Specifically, in the scanning exposure operation, the main controller 90 (see FIG. 2) uses the alignment microscope 62 arranged on the + X side of the projection system main body 42 prior to the scanning exposure operation to at least expose the object. The position information of, for example, four marks Mk formed in the divided area is detected, and the arrangement information of the divided areas is calculated. The main controller 90 performs precise positioning (substrate alignment operation) in the three degrees of freedom in the XY plane of the substrate P based on the calculated arrangement information of the partition areas to be exposed, the illumination system 20, and the projection The optical system 40 is controlled as appropriate to perform a scanning exposure operation (mask pattern transfer) on the target partition region.

  Next, a measurement system 46 (see FIG. 2) for obtaining position information of the projection system main body 42 included in the projection optical system 40 and a measurement system 68 for obtaining position information of the alignment microscope 62 included in the alignment system 60 will be described. A typical configuration will be described.

  As shown in FIG. 7, the liquid crystal exposure apparatus 10 has a guide 80 for guiding the projection system main body 42 in the scanning direction. The guide 80 is made of a member extending in parallel with the scanning direction. The guide 80 also has a function of guiding the movement of the alignment microscope 62 in the scanning direction. In FIG. 7, the guide 80 is illustrated between the mask M and the substrate P. Actually, however, the guide 80 is disposed at a position avoiding the optical path of the illumination light IL in the Y-axis direction. .

  A scale 82 including a reflective diffraction grating having a periodic direction at least in a direction parallel to the scanning direction (X-axis direction) is fixed to the guide 80. In addition, the projection system main body 42 has a head 84 disposed so as to face the scale 82. In the present embodiment, the scale 82 and the head 84 form an encoder system that constitutes a measurement system 46 (see FIG. 2) for obtaining position information of the projection system main body 42. Further, the alignment microscope 62 has a head 86 that is disposed to face the scale 82. In the present embodiment, the scale 82 and the head 86 form an encoder system that constitutes a measurement system 68 (see FIG. 2) for obtaining positional information of the alignment microscope 62. Here, the heads 84 and 86 respectively irradiate the scale 82 with a beam for encoder measurement, receive a beam through the scale 82 (a reflected beam by the scale 82), and based on the light reception result, the scale 82. Relative position information can be output.

  Thus, in this embodiment, the scale 82 constitutes the measurement system 46 (see FIG. 2) for obtaining the position information of the projection system main body 42, and the measurement system 68 (for obtaining the position information of the alignment microscope 62). (See FIG. 2). That is, the position control of the projection system main body 42 and the alignment microscope 62 is performed based on a common coordinate system (measurement axis) set by the diffraction grating formed on the scale 82. The drive system 44 (see FIG. 2) for driving the projection system main body 42 and the drive system 66 (see FIG. 2) for driving the alignment microscope 62 may have some common elements. It may be constituted by completely independent elements.

  The encoder system constituting the measuring systems 46 and 68 (see FIG. 2 respectively) may be a linear (1 DOF) encoder system whose length measuring axis is only in the X-axis direction (scanning direction), for example. There may be more measuring axes. For example, the rotation amounts of the projection system main body 42 and the alignment microscope 62 in the θz direction may be obtained by arranging a plurality of heads 84 and 86 at predetermined intervals in the Y-axis direction. Alternatively, an XY two-dimensional diffraction grating may be formed on the scale 82, and a 3DOF encoder system having measurement axes in the three degrees of freedom in the X, Y, and θz directions may be used. Furthermore, by using a plurality of known two-dimensional heads capable of measuring in the direction orthogonal to the scale surface in addition to the periodic direction of the diffraction grating as the heads 84 and 86, the freedom of the projection system main body 42 and the alignment microscope 62 can be reduced. Position information in the degree direction may be obtained.

  Here, in the present embodiment, the projection system main body 42 and the alignment microscope 62 are respectively disposed in the space between the substrate P and the mask M, and their positions in the Y-axis direction are substantially the same. The movable range partially overlaps.

  Therefore, the main controller 90 performs drive control (collision avoidance control) that does not cause the projection system main body 42 and the alignment microscope 62 to collide, for example, when the projection system main body 42 is driven in the X-axis direction during a scanning exposure operation. In other words, the main controller 90 performs drive control so that the projection system main body 42 and the alignment microscope 62 are not simultaneously disposed in the same position in the X-axis direction. For example, from the movement path (movement range) of the projection system main body 42, Retraction control for retracting the alignment microscope 62 is performed.

  Hereinafter, an example of the operation of the liquid crystal exposure apparatus 10 during the scanning exposure operation, including collision avoidance control (retraction control) of the alignment microscope 62, will be described with reference to FIGS. 3 (a) to 4 (c). The following exposure operations (including alignment measurement operations) are performed under the control of the main controller 90 (not shown in FIGS. 3A to 4C, see FIG. 2).

In this embodiment, divided areas exposed order is the first (hereinafter referred to as the first shot area S ₁₎ is set on the -X side and -Y side of the substrate P. In FIGS. 3A to 4C, a rectangular area denoted by reference symbol A indicates the movement range (movement path) of the projection system main body 42 during the scanning exposure operation. The movement range A of the projection system main body 42 is set, for example, mechanically and / or electrically. Further, the symbols S _{2 to} S ₄ given to the partitioned areas on the substrate P indicate that the exposure areas are the second to fourth shot areas, respectively.

As shown in FIG. 3 (a), before starting exposure, the projection system main body 42, and the alignment microscope 62, respectively, are disposed on the -X side of the first shot area S ₁ in a plan view. In the state (initial position) shown in FIG. 3A, the projection system main body 42 and the alignment microscope 62 are arranged close to each other in the X-axis direction.

Next, the main controller 90 drives the alignment microscope 62 in the + X direction as shown in FIG. As described above, in this embodiment, since the projection system main body 42 and the alignment microscope 62 can be independently driven and controlled in the X-axis direction (scanning direction, scanning direction), the main controller 90 controls the projection system main body 42. In the stopped state, only the alignment microscope 62 is driven in the X-axis direction. The main control device 90, while moving the alignment microscope 62 in the + X direction, of the first shot area S _1, after for example detects the four marks Mk (see heavy line circle in FIG. 3 (b)), the main controller 90, based on the mark detection result to calculate a first sequence information of the shot areas S _1.

Further, as shown in FIG. 3C, the main controller 90 starts accelerating the projection system main body 42 in the + X direction independently of the alignment microscope 62 in parallel with the mark detection operation by the alignment microscope 62. Let Specifically, the main controller 90, for example, just before the mark Mk of the first shot area S ₁ of the + X side is detected by the alignment microscope 62, to initiate acceleration in the + X direction of the projection system main body 42. Thus, in this embodiment, the movement of the projection system main body 42 in the + X direction (scan exposure operation) is started after the movement of the alignment microscope 62 in the + X direction (mark detection operation). Therefore, the distance (distance) in the X-axis direction between the projection system main body 42 and the alignment microscope 62 is wider than the initial position (before the start of the alignment operation) shown in FIG. Note that before the exposure operation for the first shot region S ₁ is started, that is, before the illumination light IL is irradiated onto the substrate P (first shot region S ₁ ) after the projection system body 42 starts moving at a constant speed. the first shot area S _1, for example, completed four marks Mk detection, it is desirable that the sequence information of the first shot area S ₁ based on the four marks are required. As shown in FIG. 3D, the main controller 90 synchronizes the projection system main body 42 and the illumination system main body 22 of the illumination system 20 (not shown in FIG. 3D, see FIG. 1) + X and driven in the direction, performs first scanning exposure for the first shot area S _1.

In parallel with the scanning exposure operation for the first shot area S _1, driven further in the + X direction of the alignment microscope 62, the fourth shot area S ₄ in the _(divided area of the first shot area S ₁ of the + X side) For example, four formed marks Mk may be detected. The main control unit 90 can be based on the detection result of the mark in the fourth shot area S _4, and updates the first sequence information of the shot areas S _1. By using the mark position information of the fourth shot area S ₄ in order to obtain the sequence information of the first shot area S _1, the sequence information based only on the four marks Mk provided in the first shot area S ₁ than determined, it is possible to obtain the sequence information in consideration of the statistical trend over a wide range, it is possible to improve the alignment accuracy for the first shot area S _1.

  The main controller 90 controls the illumination system 20 while controlling the minute position of the substrate P according to the calculation result of the array information, and the illumination light IL is not shown in the mask M (not shown in FIG. 3D). And a part of the mask pattern is formed in the exposure area IA generated on the substrate P by the illumination light IL. As described above, in this embodiment, the illumination area IAM (see FIG. 1) generated on the mask M and the exposure area IA generated on the substrate P are a pair of rectangular areas separated in the Y-axis direction. Therefore, the pattern image of the mask M transferred to the substrate P by one scanning exposure operation is a band-like region extending in the X-axis direction and separated from the Y-axis direction (of the total area of one partition region). Half area).

Here, the first scanning exposure of the first shot area S ₁ is completed, the projection system main body 42 passes over the substrate P, and moves to the end portion of the + X side of the movement range A. Therefore, the main controller 90 performs control to retract the alignment microscope 62 from the movement range A. As an example, the main controller 90 drives the alignment microscope 62 in the −Y direction (downward) with respect to the substrate P, as shown in FIG. 4A, and −Y in the movement range A of the projection system main body 42. Evacuate to the side. Thereby, as shown in FIG. 4B, the projection system main body 42 passes through the + Y side (upward) of the alignment microscope 62 without colliding with the alignment microscope 62. When it is confirmed that the main controller 90 has been driven to a position where the position of the projection system main body 42 in the Y-axis direction does not overlap with the position of the alignment microscope 62 in the Y-axis direction, as shown in FIG. In addition, the alignment microscope 62 is driven into the movement range A so that the projection system main body 42 and the alignment microscope 62 are arranged close to each other at a position where they are not in contact with each other. Therefore, the distance between the projection system main body 42 and the alignment microscope 62 in the X-axis direction is the time before the start of the scanning exposure operation or after the end of the scanning exposure operation (in other words, the projection system main body 42 is in the X-axis direction). Before starting acceleration or after completing deceleration).

Then, the main controller 90 for the second scanning exposure operation of the first shot area S _1, as shown in FIG. 4 (b), moved stepwise substrate P and the mask M in the -Y direction (FIG. 4 (b) black arrow). The step movement amount of the substrate P at this time is, for example, 1/4 of the length of one partition region in the Y-axis direction. In this case, in the step movement of the substrate P and the mask M in the −Y direction, the step is performed so that the relative positional relationship between the substrate P and the mask M is not changed (or the relative positional relationship can be corrected). It is preferable to move.

Hereinafter, as shown in FIG. 4 (c), the main controller 90 performs the scanning exposure operation of the second projection system first shot by driving the main body 42 in the -X direction area S ₁ (backward). Thus, the mask pattern transferred by the first scanning exposure operation, a mask pattern transferred by the second time of the scanning exposure operation is joined together with the first shot in region S _1, the overall pattern of the mask M It is transferred to the first shot area _{S 1.} The main controller 90 returns the alignment microscope 62 from the retracted position to the movement range A of the projection system main body 42 and drives it in the −X direction following the projection system main body 42. As shown in FIG. 4B, after the substrate P and the mask M are moved stepwise in the −Y direction, the alignment measurement between the substrate P and the mask M is performed again until the second scanning exposure is started. Based on the result, mutual alignment may be performed. Thus, the first shot area S ₁ overall alignment accuracy, it is possible to turn improve the pattern transfer accuracy of the mask M to the first shot area S _1. In this case, the main controller 90 returns the once retracted alignment microscope 62 to the −X side of the projection system main body 42, and corresponds to the above-described FIGS. 3 (a) to 3 (d) and FIG. 4 (a). The drive control may be performed so as to perform the operation (however, the operation in which the movement in the X-axis direction is reversed (reverse sign)).

Hereinafter, although not shown, the main controller 90 moves the substrate P to −Y in order to perform the scanning exposure operation on the second shot region S ₂ (the partition region on the + Y side of the first shot region S ₁ ). direction moved stepwise to oppose the second shot area S ₂ and the mask M have. Scanning exposure operation for the second shot area S ₂ (including the save operation of the alignment microscope 62) will be omitted because it is identical to the scanning exposure operation for the first shot area S ₁ described above. Thereafter, the main controller 90 performs the scanning exposure operation on the third and fourth shot regions S ₃ and S ₄ while appropriately performing at least one of the X step operation of the mask M and the Y step operation of the substrate P. Also at this time, the main controller 90 similarly performs retraction control of the alignment microscope 62. In order to expose the divided area of the second shot area S ₂ and later, when obtaining the sequence information of the divided areas may be using the position information of the mark obtained on exposing the earlier defined areas. Further, when performing alignment for the fourth shot area S _4, it may be utilized first shot area S ₁ of the alignment measurement results described above (EGA result of the calculation). In that case, when the opposite is arranged a mask M fourth shot area S ₄ are three degrees of freedom in the XY plane on the basis of the marks of the respective two points between the mark Mk mark and the substrate P of the mask M ( It is only necessary to measure the positional deviation in the X, Y, θz) direction, and the time required for the alignment of the fourth shot region S4 can be substantially shortened.

  According to the liquid crystal exposure apparatus 10 according to the embodiment described above, the drive control (position and speed) in the scanning direction (X-axis direction) of the alignment microscope 62 and the projection system main body 42 can be controlled independently. Prior to the movement (acceleration) of the system main body 42 in the scanning direction, the mark Mk can be detected using the alignment microscope 62, and the projection system main body 42 can be obtained before completing the detection of all the required marks Mk. In the scanning direction (that is, scanning exposure operation) can be started. Therefore, a series of processing time (tact time) required for the exposure processing of the substrate P can be reduced. When the scanning exposure operation is not performed, for example, before the start of the alignment operation (before acceleration of the projection system main body 42) and after the end of the scanning exposure operation (after deceleration of the projection system main body 42), as shown in FIG. As described above, the alignment microscope 62 and the projection system main body 42 can be arranged close to each other. Therefore, the apparatus size (footprint of the exposure apparatus) necessary for scanning exposure in the X-axis direction can be suppressed. Further, since the alignment microscope 62 can be retracted from the movement range A of the projection system main body 42 during the scanning exposure operation, collision between the alignment microscope 62 and the projection system main body 42 can be avoided.

  Here, the illumination system 20, the mask stage device 30, the projection optical system 40, the substrate stage device 50, and the alignment system 60 may be modularized. The illumination system 20 is called the illumination system module 12M, the mask stage device 30 is called the mask stage module 14M, the projection optical system 40 is called the projection optical system module 16M, the substrate stage device 50 is called the substrate stage module 18M, and the alignment system 60 is called the alignment system module 20M. . Hereinafter, although appropriately referred to as “each module 12M to 20M”, the modules are placed on the corresponding bases 28A to 28E so as to be physically independent from each other.

  Therefore, as shown in FIG. 10, in the liquid crystal exposure apparatus 10, any (one or a plurality) of the modules 12 </ b> M to 20 </ b> M (the substrate stage module 18 </ b> M as an example in FIG. 10) is replaced with another module. Can be replaced independently of the module. At this time, the module to be exchanged is exchanged integrally with the gantry 28A to 28E (the gantry 28E in FIG. 10) that supports the module.

  During the replacement operation of the modules 12M to 20M, the modules 12M to 20M (and the mounts 28A to 28E that support the modules) to be replaced move in the X-axis direction along the floor 26 surface. For this reason, for example, wheels or an air caster device may be provided on the bases 28A to 28E so as to be easily movable on the floor 26, for example. As described above, in the liquid crystal exposure apparatus 10 according to the present embodiment, an arbitrary module among the modules 12M to 20M can be easily separated from other modules, so that it is excellent in maintainability. In FIG. 10, the substrate stage module 18M is separated from the other elements by moving in the + X direction (the back side of the drawing) with respect to the other elements (such as the projection optical system module 16M) together with the gantry 28E. Although shown, the moving direction of the module to be moved (and the gantry) is not limited to this, and may be, for example, the −X direction (front of the paper) or the + Y direction (upward on the paper). good. Moreover, you may provide the positioning apparatus for ensuring the position reproducibility after installation on the floor | bed 26 of each mount frame 28A-28E. The positioning device may be provided on each of the bases 28A to 28E, or the installation position of each of the bases 28A to 28E by cooperation of a member provided on each of the bases 28A to 28E and a member provided on the floor 26. May be configured to be reproduced.

  In addition, since the liquid crystal exposure apparatus 10 of the present embodiment is configured to be able to separate the modules 12M to 20M, the modules 12M to 20M can be individually upgraded. The upgrade refers to, for example, an upgrade to cope with an increase in the size of the substrate P to be exposed, etc. In addition to the same size of the substrate P, the modules 12M to 20M are replaced with ones with improved performance. This includes cases where

  Here, for example, when the substrate P is increased in size, only the area of the substrate P (in this embodiment, the dimensions in the X-axis and Y-axis directions) is increased, and the thickness of the normal substrate P (the dimension in the Z-axis direction) is Does not change substantially. Accordingly, for example, when the substrate stage module 18M of the liquid crystal exposure apparatus 10 is upgraded in response to an increase in the size of the substrate P, as shown in FIG. 10, a substrate stage module 18AM newly inserted instead of the substrate stage module 18M is used. The gantry 28G that supports the substrate stage module 18AM changes in the X-axis and / or Y-axis direction dimensions, but the Z-axis direction dimension does not change substantially. Similarly, the dimension in the Z-axis direction of the mask stage module 14M is not substantially changed by the upgrade corresponding to the increase in the size of the mask M.

  For example, in order to enlarge the illumination area IAM and the exposure area IA (see FIG. 1 and the like), the number of illumination optical systems included in the illumination system module 12M and the number of projection lens modules included in the projection optical system module 16M are increased. Thus, each of the illumination system module 12M and the projection optical system module 16M can be upgraded. The illumination system module and the projection optical system module (not shown) after the upgrade only change the dimensions in the X-axis and / or Y-axis direction compared to before the upgrade, and the dimensions in the Z-axis direction do not substantially change. .

  For this reason, in the liquid crystal exposure apparatus 10 of the present embodiment, the bases 28A to 28E that support the modules 12M to 20M and the bases that support the upgraded modules (the substrate stage module 18AM shown in FIG. 10 are supported). The gantry 28G) is sized in the Z-axis direction. Here, the term “scaling” means that the dimensions in the Z-axis direction are the same for the base before and after the replacement, that is, the dimensions in the Z-axis direction of the base supporting the module having the same function are substantially constant. It means that. As described above, in the liquid crystal exposure apparatus 10 of the present embodiment, since the dimensions in the Z-axis direction of each of the mounts 28A to 28E are standardized, it is possible to reduce the time for designing each module.

  Further, in the liquid crystal exposure apparatus 10, since the exposure surface of the substrate P and the pattern surface of the mask M are parallel to the direction of gravity (so-called vertical arrangement), the illumination system module 12M, the mask stage module 14M, and the projection optical system module Each module of 16M and the substrate stage module 18M can be installed in series on the floor 26 surface. As described above, since each module does not have its own weight, for example, the substrate stage device, the projection optical system, the mask stage device, and the illumination system corresponding to each module are stacked in the direction of gravity. Unlike the conventional exposure apparatus, it is not necessary to provide a high-rigidity main frame (body) that supports each element. Further, since the structure is simple, installation (installation) of the apparatus, maintenance work of each module 12M to 20M, replacement work, etc. can be performed easily and in a short time. Moreover, since each said module is a structure arrange | positioned along the floor 26 surface, the height of the whole apparatus can be made low. Thereby, the chamber which accommodates each said module can be reduced in size, cost can be reduced, and an installation construction period can be shortened.

  Note that the configuration of the embodiment described above can be changed as appropriate. For example, in the above embodiment, the alignment microscope 62 performs the retreat operation by moving to the −Y side with respect to the movement range A of the projection system main body 42, but retreats outside the movement range A of the projection system main body 42. If possible, the retracting direction of the alignment microscope 62 is not limited to this. For example, as in the first modification shown in FIG. 5, the direction parallel to the scanning direction with respect to the movement range A of the projection system main body 42 (X-axis) Direction). Similarly, although not shown, the retraction direction of the alignment microscope 62 may be, for example, on the + Y (up) side, the + Z side (mask side), or − with respect to the movement range A of the projection system main body 42. It may be on the Z side (substrate side).

  In the above-described embodiment (and the first modification), the alignment microscope 62 performs the retreat operation by moving in a direction orthogonal to the traveling direction of the projection system main body 42 or in a parallel direction. The moving direction of the alignment microscope 62 during the retraction operation is not limited to this, and may be the θz direction (or other rotational direction) as in the second modification example shown in FIG. If the control for retracting the alignment microscope 62 in a direction other than the X-axis direction is performed, the relative positional relationship between the projection system main body 42 and the alignment microscope 62 in the Y-axis direction may be different from the initial position. In that case, it is preferable that the main controller 90 performs calibration related to the relative position (relative coordinates) between the projection system main body 42 and the alignment microscope 62 every time the alignment microscope 62 is retracted. In the above embodiment (and the first modification), the retraction control of the alignment microscope 62 is performed at a position not on the substrate P. However, the position on the substrate P, that is, the position of the alignment microscope 62 in the Y-axis direction. The position in the X-axis direction, the position in the Y-axis direction of the substrate P, and the position in the X-axis direction may be overlapped.

  In the above-described embodiment (and the first and second modifications), the drive system 24 for driving the illumination system body 22 of the illumination system 20 and the drive system 34 for driving the stage body 32 of the mask stage apparatus 30 are used. A drive system 44 for driving the projection optical system main body 42 of the projection optical system 40, a drive system 54 for driving the stage main body 52 of the substrate stage apparatus 50, and an alignment microscope 62 for driving the alignment system 60. The case where each of the drive systems 66 (see FIG. 2) includes a linear motor has been described. However, in order to drive the illumination system main body 22, the stage main body 32, the projection optical system main body 42, the stage main body 52, and the alignment microscope 62. The type of the actuator is not limited to this, and can be changed as appropriate. For example, a feed screw (ball screw) device, a belt drive, etc. It is possible to use various actuators such devices appropriately.

  In the above-described embodiments (and the first and second modifications), the projection system main body 42 and the alignment microscope 62 share a part of the drive system in the scanning direction (for example, a linear motor, a guide, etc.) If the projection system main body 42 and the alignment microscope 62 can be driven individually, the present invention is not limited to this. A drive system 66 for driving the alignment microscope 62 and a drive system 44 for driving the projection system main body 42 of the projection optical system 40. However, it may be configured completely independently. That is, like the exposure apparatus 10A shown in FIG. 8, the projection optical system main body 42 included in the projection optical system 40A and the alignment microscope 62 included in the alignment system 60A are arranged so that the Y positions do not overlap each other. A drive system 66 (including a linear motor, a guide, etc.) for driving the alignment microscope 62 and a drive system 44 (eg, including a linear motor, a guide, etc.) for driving the projection system main body 42 are completely provided. It can be set as an independent structure. In this case, before the start of the scanning exposure operation for the partitioned area to be exposed, the substrate P is moved stepwise (reciprocated) in the Y-axis direction to measure alignment of the partitioned area. Further, like the exposure apparatus 10B shown in FIG. 9, the alignment system 60B includes a drive system 44 (including a linear motor, a guide, and the like) for driving the projection optical system main body 42 of the projection optical system 40B. The drive system 44 and the drive system 66 are completely independent by arranging the Y positions so as not to overlap with a drive system 66 (including a linear motor, a guide, etc.) for driving the alignment microscope 62. It can also be.

  Moreover, in the said embodiment (and 1st, 2nd modification), in order to measure the position of the measurement system 26 for performing the position measurement of the illumination system main body 22 of the illumination system 20, and the stage main body 32 of the mask stage apparatus 30. Measurement system 36, measurement system 46 for measuring the position of projection optical system main body 42 of projection optical system 40, measurement system 56 for measuring the position of stage main body 52 of substrate stage apparatus 50, and alignment system 60. The case where the measurement systems 68 (see FIG. 2) for measuring the position of the alignment microscope 62 each include a linear encoder has been described. However, the illumination system body 22, the stage body 32, the projection system projection optical system body 42, The type of measurement system for measuring the position of the stage main body 52 and the alignment microscope 62 is not limited to this, and can be changed as appropriate. For example optical interferometer, or can be used as appropriate various measuring systems such as a linear encoder and the measurement system using a combination of optical interferometer.

In the above-described embodiment (and the first and second modified examples), a pair of movable alignment microscopes 62 having a pair of detection visual fields are arranged on the + X side of the projection system main body 42. The number of microscopes is not limited to this. For example, the alignment microscopes 62 may be arranged on the + X side and the −X side (one side and the other side in the scanning direction) of the projection system main body 42, respectively. In this case, before the second scanning exposure operation (that is, the scanning exposure operation performed by moving the projection system main body 42 in the −X direction) for each divided region, the mark Mk is placed using the −X side alignment microscope 62. by detecting the first shot area S ₁ overall alignment accuracy while suppressing temporal loss, it is possible to improve the pattern transfer accuracy of the mask M to the first shot area S ₁ therefore.

Further, in the above embodiments (and. The same applies hereinafter each variation), after the scanning exposure of the first shot area S _1, the first shot area S ₁ of the + Y second shot that is set to (upper) side were subjected to scanning exposure in the region S _2, not limited to this, the next scanning exposure of the first shot area S ₁ may be performed scanning exposure of the fourth shot area S _4. In this case, for example, by using a mask facing the first shot region S ₁ and a mask corresponding to the fourth shot region S ₄ (two masks in total), the first and fourth shot regions S ₁ , it can be scanned exposing the S ₄ sequentially. Also, it may be performed scanning exposure of the fourth shot area S ₄ by step movement of the mask M in the + X direction after the scanning exposure of the first shot area S _1.

In the above embodiment, the mark Mk is formed in each partition region (first to fourth shot regions S _{1 to} S ₄ ). However, the present invention is not limited to this, and a region (so-called scribe) between adjacent partition regions. Line).

  In the above embodiment, a pair of illumination area IAM and exposure area IA spaced apart in the Y-axis direction are generated on the mask M and the substrate P (see FIG. 1), but the shapes of the illumination area IAM and exposure area IA The length is not limited to this and can be changed as appropriate. For example, the length of the illumination area IAM and the exposure area IA in the Y-axis direction may be equal to the pattern surface of the mask M and the length of one partition area on the substrate P in the Y-axis direction, respectively. In this case, the transfer of the mask pattern is completed with a single scanning exposure operation for each partitioned region. Alternatively, the illumination area IAM and the exposure area IA are one area whose length in the Y-axis direction is half the length in the Y-axis direction of one partition area on the pattern surface of the mask M and the substrate P, respectively. Also good. In this case, similarly to the above-described embodiment, it is necessary to perform the scanning exposure operation twice for one partitioned area and perform the joint exposure.

  Further, as in the above-described embodiment, when joint exposure is performed by reciprocating the projection system main body 42 in order to form a single mask pattern in a partitioned area, alignment for the forward path and the backward path having different detection fields of view. You may arrange | position a microscope before and behind the projection system main body 42 regarding a scanning direction (X direction). In this case, the mark Mk at the four corners of the partition area is detected by the alignment microscope for the forward path (for the first exposure operation), and the mark Mk near the joint is detected by the alignment microscope for the backward path (for the second exposure operation). May be detected. Here, the joint portion means a joint portion between an area exposed by the forward scanning exposure (area where the pattern is transferred) and an area exposed by the backward scanning exposure (the area where the pattern is transferred). To do. As the mark Mk in the vicinity of the joint portion, the mark Mk may be formed on the substrate P in advance, or an exposed pattern may be used as the mark Mk.

Moreover, in each said embodiment, the wavelength of the light source used in the illumination system 20 and the illumination light IL irradiated from this light source is not specifically limited, For example, ArF excimer laser light (wavelength 193 nm), KrF excimer laser light ( Ultraviolet light having a wavelength of 248 nm) or vacuum ultraviolet light such as F ₂ laser light (wavelength 157 nm) may be used.

  In the above embodiment, the illumination system main body 22 including the light source is driven in the scanning direction. However, the present invention is not limited to this. For example, as in the exposure apparatus disclosed in Japanese Patent Laid-Open No. 2000-12422, the light source is fixed. Only the illumination light IL may be scanned in the scanning direction.

  Further, in the above embodiment, the illumination area IAM and the exposure area IA are formed in a strip shape extending in the Y-axis direction. However, the present invention is not limited to this. For example, as disclosed in US Pat. No. 5,729,331. A plurality of regions arranged in a staggered pattern may be combined.

  In each of the above embodiments, the mask M and the substrate P are arranged so as to be orthogonal to the horizontal plane (so-called vertical arrangement). However, the present invention is not limited to this, and the mask M and the substrate P are parallel to the horizontal plane. It may be arranged. In this case, the optical axis of the illumination light IL is substantially parallel to the direction of gravity.

  In addition, fine positioning in the XY plane of the substrate P was performed in accordance with the alignment measurement result during the scanning exposure operation. In addition to this, the surface of the substrate P before the scanning exposure operation (or in parallel with the scanning exposure operation). Position information may be obtained, and surface position control (so-called autofocus control) of the substrate P may be performed during the scanning exposure operation.

  Further, the use of the exposure apparatus is not limited to an exposure apparatus for liquid crystal that transfers a liquid crystal display element pattern onto a square glass plate. For example, an exposure apparatus for manufacturing an organic EL (Electro-Luminescence) panel, a semiconductor The present invention can be widely applied to an exposure apparatus for manufacturing, an exposure apparatus for manufacturing a thin film magnetic head, a micromachine, a DNA chip, and the like. Moreover, in order to manufacture not only microdevices such as semiconductor elements but also masks or reticles used in light exposure apparatuses, EUV exposure apparatuses, X-ray exposure apparatuses, electron beam exposure apparatuses, etc., glass substrates, silicon wafers, etc. The present invention can also be applied to an exposure apparatus that transfers a circuit pattern.

  The object to be exposed is not limited to a glass plate, and may be another object such as a wafer, a ceramic substrate, a film member, or mask blanks. Moreover, when the exposure target is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and includes, for example, a film-like (flexible sheet-like member). The exposure apparatus of the present embodiment is particularly effective when a substrate having a side length or diagonal length of 500 mm or more is an exposure target. Further, when the substrate to be exposed is a flexible sheet, the sheet may be formed in a roll shape. In this case, the partition area to be exposed can be easily changed (stepped) with respect to the illumination area (illumination light) by rotating (winding) the roll regardless of the step operation of the stage device. .

  For electronic devices such as liquid crystal display elements (or semiconductor elements), the step of designing the function and performance of the device, the step of producing a mask (or reticle) based on this design step, and the step of producing a glass substrate (or wafer) A lithography step for transferring a mask (reticle) pattern to a glass substrate by the exposure apparatus and the exposure method of each embodiment described above, a development step for developing the exposed glass substrate, and a portion where the resist remains. It is manufactured through an etching step for removing the exposed member of the portion by etching, a resist removing step for removing a resist that has become unnecessary after etching, a device assembly step, an inspection step, and the like. In this case, in the lithography step, the above-described exposure method is executed using the exposure apparatus of the above embodiment, and a device pattern is formed on the glass substrate. Therefore, a highly integrated device can be manufactured with high productivity. .

  As described above, the exposure apparatus and method of the present invention are suitable for scanning exposure of an object. Moreover, the manufacturing method of the flat panel display of this invention is suitable for production of a flat panel display. The device manufacturing method of the present invention is suitable for the production of micro devices.

  DESCRIPTION OF SYMBOLS 10 ... Liquid crystal exposure apparatus, 20 ... Illumination system, 30 ... Mask stage apparatus, 40 ... Projection optical system, 50 ... Substrate stage apparatus, 60 ... Alignment system, M ... Mask, P ... Substrate.

Claims (52)

An exposure apparatus that irradiates an object with illumination light via a projection optical system, scans and exposes the object by relatively driving the projection optical system,
A mark detection unit for detecting a mark provided on the object;
A first drive system for driving the mark detection unit;
A second drive system for driving the projection optical system;
An exposure apparatus comprising: a control device that controls the first and second drive systems so that the projection optical system and the mark detection unit do not contact each other. An exposure apparatus that irradiates an object with illumination light via a projection optical system, scans and exposes the object by relatively driving the projection optical system,
A mark detection unit for detecting a mark provided on the object;
A first drive system for driving the mark detection unit;
A second drive system for driving the projection optical system;
In the scanning exposure, when at least one of the projection optical system and the mark detection unit is driven, the first and second drive systems are arranged such that a distance between the projection optical system and the mark detection unit is more than a predetermined distance. An exposure apparatus comprising: a control device that controls at least one of the drive systems. An exposure apparatus that performs a scanning exposure operation by irradiating an object with illumination light through a projection optical system and relatively driving the projection optical system with respect to the object,
A mark detection unit for detecting a mark provided on the object;
A first drive system for driving the mark detection unit;
A second drive system for driving the projection optical system;
A control device that controls the first and second drive systems so that the projection optical system and the mark detection unit are driven at different drive speeds in at least some of the operations during the scanning exposure operation. Exposure device. An exposure apparatus that irradiates an object with illumination light via a projection optical system, scans and exposes the object by relatively driving the projection optical system,
A mark detection unit for detecting a mark provided on the object;
A first drive system for driving the mark detection unit;
A second drive system for driving the projection optical system;
An exposure apparatus comprising: a control device that controls the first and second drive systems such that a stop position where the projection optical system stops driving and a stop position where the mark detection unit stops driving overlap. An exposure apparatus that irradiates an object with illumination light via a projection optical system, scans and exposes the object by relatively driving the projection optical system,
A mark detection unit for detecting a mark provided on the object;
A first drive system for driving the mark detection unit;
A second drive system for driving the projection optical system;
An exposure apparatus comprising: a control device that controls the first and second drive systems so as to make the drive start timing of the projection optical system different from the drive start timing of the mark detection unit. An exposure apparatus that irradiates an object with illumination light via a projection optical system, scans and exposes the object by relatively driving the projection optical system,
A mark detection unit for detecting a mark provided on the object;
An exposure apparatus comprising: a control device that controls the position of the projection optical system and the mark detection unit so that the relative positional relationship does not change in the scanning exposure. The object has at least first and second partition regions having different positions,
The mark detection unit is provided on a first detection device provided on one side of the projection optical system and on the other side of the projection optical system with respect to a scanning direction in which the projection optical system is relatively driven with respect to the object. A second detection device,
The control device drives the projection optical system to the one side based on a detection result of the mark by the first detection device in the scanning exposure for the first partition region, and moves the second detection device to the one side. The exposure apparatus according to claim 1, wherein the first and second drive systems are controlled so as to be driven to the one side of the second partition region so as not to contact the projection optical system.   The controller drives the first and second drives to drive the projection optical system to the other side based on a detection result of the mark by the second detector in the scanning exposure for the second partition region. 8. The exposure apparatus according to claim 7, which controls the system.   The control device includes a first state in which the scanning exposure is performed and a second state in which the illumination light is not irradiated on the object before or after the start of the scanning exposure. The exposure apparatus according to claim 1, wherein the intervals are different.   The exposure apparatus according to claim 9, wherein the interval in the first state is wider than the interval in the second state.   11. The exposure apparatus according to claim 9, wherein the projection optical system and the mark detection unit in the second state are in positions that do not overlap the object in a direction parallel to the optical axis of the projection optical system.   The exposure apparatus according to claim 1, wherein the mark detection unit drives a range that does not partially overlap a driveable range of the projection optical system.   The exposure apparatus according to claim 12, wherein the mark detection unit drives a range wider than the drivable range.   14. The control device according to claim 1, wherein the control device performs control so that at least a part of a mark detection operation including an operation of detecting the mark and a scanning exposure operation including the scanning exposure are performed in parallel. The exposure apparatus described in 1. The mark detection operation includes an operation in which the mark detection unit moves to a position where the mark is detected,
The exposure apparatus according to claim 14, wherein the scanning exposure operation includes a movement operation of the projection optical system before the start of the scanning exposure.   The exposure apparatus according to claim 7, wherein the control device retracts the mark detection unit from a movable range of either the scanning direction driven by the projection optical system or a direction intersecting the scanning direction.   The exposure apparatus according to claim 16, wherein the control device rotates the mark detection unit around a direction parallel to the optical axis of the projection optical system in order to retract the mark detection unit from the movable range of the projection optical system.   The mark detection unit is provided to detect a mark having a distance between the plurality of marks provided on the object that is longer than a length of a region irradiated with the illumination light in a direction intersecting the scanning direction. The exposure apparatus according to claim 7. The object has first and second partition regions provided side by side in a direction intersecting the scanning direction,
19. The mark detection unit according to claim 18, wherein the mark detection unit is provided so as to be capable of simultaneously detecting at least one of the marks on the first partition area and at least one of the marks on the second partition area in the second direction. The exposure apparatus described. An exposure apparatus that irradiates an object with illumination light through a projection optical system and forms a predetermined pattern on the object by an exposure operation in which the projection optical system is relatively driven in the first direction to expose the object. There,
A mark detection unit for detecting a mark provided on the object;
A first drive system for driving the mark detection unit in the first direction;
An exposure apparatus comprising: a second drive system that drives the projection optical system in the first direction independently of the first drive system. The optical axis of the projection optical system is parallel to a horizontal plane;
The exposure apparatus according to any one of claims 1 to 20, wherein the object is disposed in a state where an exposure surface irradiated with the illumination light is orthogonal to the horizontal plane.   The exposure apparatus according to claim 21, wherein the mark detection unit and the projection optical system are arranged to be separable from each other.   The exposure apparatus according to claim 1, wherein the object is a substrate used in a flat panel display device.   The exposure apparatus according to claim 23, wherein the substrate has a length of at least one side or a diagonal length of 500 mm or more. Exposing the object using the exposure apparatus according to any one of claims 1 to 24;
Developing the exposed object. A method of manufacturing a flat panel display. Exposing the object using the exposure apparatus according to any one of claims 1 to 24;
Developing the exposed object. An exposure method of irradiating an object with illumination light through a projection optical system, and performing scanning exposure by relatively driving the projection optical system with respect to the object,
Detecting a mark provided on the object using a mark detection unit;
Driving the mark detection unit using a first drive system;
Driving the projection optical system using a second drive system;
Controlling the first and second drive systems such that the projection optical system and the mark detection unit do not contact each other. An exposure method of irradiating an object with illumination light through a projection optical system, and performing scanning exposure by relatively driving the projection optical system with respect to the object,
Detecting a mark provided on the object using a mark detection unit;
Driving the mark detection unit using a first drive system;
Driving the projection optical system using a second drive system;
In the scanning exposure, when at least one of the projection optical system and the mark detection unit is driven, the first and second drive systems are arranged such that a distance between the projection optical system and the mark detection unit is more than a predetermined distance. Controlling at least one of the drive systems. An exposure method of irradiating an object with illumination light through a projection optical system, and performing scanning exposure by relatively driving the projection optical system with respect to the object,
Detecting a mark provided on the object using a mark detection unit;
Driving the mark detection unit using a first drive system;
Driving the projection optical system using a second drive system;
Controlling the first and second drive systems such that the projection optical system and the mark detection unit are driven at different drive speeds in at least a part of the scanning exposure operation. Method. An exposure method of irradiating an object with illumination light through a projection optical system, and performing scanning exposure by relatively driving the projection optical system with respect to the object,
Detecting a mark provided on the object using a mark detection unit;
Driving the mark detection unit using a first drive system;
Driving the projection optical system using a second drive system;
An exposure method comprising: controlling the first and second drive systems so that a stop position at which the projection optical system stops driving and a stop position at which the mark detection unit stops driving are not overlapped. An exposure method of irradiating an object with illumination light through a projection optical system, and performing scanning exposure by relatively driving the projection optical system with respect to the object,
Detecting a mark provided on the object using a mark detection unit;
Driving the mark detection unit using a first drive system;
Driving the projection optical system using a second drive system;
Controlling the first and second drive systems so as to make the drive start timing of the projection optical system different from the drive start timing of the mark detection unit. An exposure method of irradiating an object with illumination light through a projection optical system, and performing scanning exposure by relatively driving the projection optical system with respect to the object,
Detecting a mark provided on the object using a mark detection unit;
An exposure method comprising: controlling the position of the projection optical system and the position of the mark detection unit so that the relative positional relationship does not change in the scanning exposure. The object has at least first and second partition regions having different positions,
The mark detection unit is provided on a first detection device provided on one side of the projection optical system and on the other side of the projection optical system with respect to a scanning direction in which the projection optical system is relatively driven with respect to the object. A second detection device,
In the control, in the scanning exposure for the first partition region, the second detection device is driven while driving the projection optical system to the one side based on the detection result of the mark by the first detection device. The exposure method according to any one of claims 27 to 32, wherein the first and second drive systems are controlled so as to be driven to the one side of the second partition region so as not to contact the projection optical system.   In the control, the first and second projection optical systems are driven to the other side based on a detection result of the mark by the second detection device in the scanning exposure for the second partition region. The exposure method according to claim 33, wherein the exposure system is controlled.   In the control, the projection optical system, the mark detection unit, and the first state in which the scanning exposure is performed and the second state in which the illumination light is not irradiated onto the object before or after the start of the scanning exposure 35. The exposure method according to any one of claims 27 to 34, wherein the intervals are different.   36. The exposure method according to claim 35, wherein the interval in the first state is wider than the interval in the second state.   37. The exposure method according to claim 35 or 36, wherein the projection optical system and the mark detection unit in the second state are in positions that do not overlap the object in a direction parallel to the optical axis of the projection optical system.   38. The exposure method according to any one of claims 27 to 37, wherein the mark detection unit drives a range that does not partially overlap a driveable range of the projection optical system.   39. The exposure method according to claim 38, wherein the mark detection unit drives a range wider than the drivable range.   40. The control according to claim 27, wherein at least a part of the mark detection operation including the operation of detecting the mark and the scanning exposure operation including the scanning exposure are controlled in parallel. The exposure method according to item. The mark detection operation includes an operation in which the mark detection unit moves to a position where the mark is detected,
41. The exposure method according to claim 40, wherein the scanning exposure operation includes a movement operation of the projection optical system before the start of the scanning exposure.   34. The exposure method according to claim 33, wherein the control causes the mark detection unit to be retracted from any movable range of the scanning direction driven by the projection optical system and a direction intersecting the scanning direction.   43. The exposure method according to claim 42, wherein in the control, the mark detection unit is rotated about a direction parallel to the optical axis of the projection optical system in order to retract the mark detection unit from the movable range of the projection optical system.   The mark detection unit is provided to detect a mark having a distance between the plurality of marks provided on the object that is longer than a length of a region irradiated with the illumination light in a direction intersecting the scanning direction. The exposure method according to claim 33. The object has first and second partition regions provided side by side in a direction intersecting the scanning direction,
45. The mark detection unit according to claim 44, wherein the mark detection unit is provided so as to be capable of simultaneously detecting at least one of the marks on the first partition area and at least one of the marks on the second partition area in the second direction. The exposure method as described. An exposure method in which a predetermined pattern is formed on the object by an exposure operation in which the object is irradiated with illumination light through a projection optical system, and the projection optical system is driven relative to the object in a first direction for exposure. There,
Detecting a mark provided on the object using a mark detection unit;
Driving the mark detector in the first direction using a first drive system;
Driving the projection optical system using the second drive system in the first direction independently of the first drive system. The optical axis of the projection optical system is parallel to a horizontal plane;
47. The exposure method according to any one of claims 27 to 46, wherein the object is arranged in a state where an exposure surface irradiated with the illumination light is orthogonal to the horizontal plane.   48. The exposure method according to claim 47, wherein the mark detection unit and the projection optical system are arranged to be separable from each other.   49. The exposure method according to any one of claims 27 to 48, wherein the object is a substrate used in a flat panel display device.   The exposure method according to claim 49, wherein the substrate has a length of at least one side or a diagonal length of 500 mm or more. Exposing the object using the exposure method according to any one of claims 27 to 50;
Developing the exposed object. A method of manufacturing a flat panel display. Exposing the object using the exposure method according to any one of claims 27 to 50;
Developing the exposed object.

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