JP6701597B2 - Exposure apparatus, exposure method, flat panel display manufacturing method, and device manufacturing method - Google Patents

Description

The present invention relates to an exposure apparatus, an exposure method, a flat panel display manufacturing method, and a device manufacturing method, and more specifically, a predetermined pattern is formed by scanning exposure of an object with an energy beam in a predetermined scanning direction. The present invention relates to an exposure apparatus and method for forming on an object, and a method for manufacturing a flat panel display or device using the exposure apparatus or the exposure method.

  Conventionally, in a lithography process for manufacturing an electronic device (micro device) such as a liquid crystal display device or a semiconductor device (an integrated circuit or the like), a pattern formed on a mask or a reticle (hereinafter referred to as “mask”) There is used an exposure apparatus which is used to transfer onto a glass plate or a wafer (hereinafter collectively referred to as “substrate”).

  This type of exposure apparatus is a beam that forms a predetermined pattern on a substrate by scanning exposure illumination light (energy beam) in a predetermined scanning direction with the mask and the substrate substantially stationary. A scan type scanning exposure apparatus is known (for example, refer to Patent Document 1).

  In the exposure apparatus described in Patent Document 1, in order to correct the positional error between the exposure target area on the substrate and the mask, the projection optical system is moved through the projection optical system while moving in the direction opposite to the scanning direction at the time of exposure. The alignment microscope measures the marks on the substrate and the mask (alignment measurement), and the positional error between the substrate and the mask is corrected based on the measurement result. Here, in order to improve the exposure accuracy, it is desirable to measure more marks, but there is a risk that throughput will decrease.

JP, 2000-12422, A

According to the first aspect of the present invention, scanning exposure is performed while illuminating a pattern included in a mask with illumination light and projecting a projected image of the pattern onto each of a plurality of divided areas provided on an object. An exposure apparatus comprising: an illumination system that emits the illumination light to the object; a projection system that projects the projection image onto the object ; and a plurality of first units that are formed on the mask and are separated from each other in a scanning direction. A detection unit that detects a mark and a plurality of second marks that are formed on the object in the scanning direction and are separated from each other; and a plurality of first marks and a plurality of second marks that are detected. A detection unit drive system that moves the detection unit in the scanning direction, and a first partitioned region on the object whose relative position with respect to the mask is adjusted based on the detection result of the detection unit so that the scanning exposure is performed. with respect to the first divided area and the mask facing each other, the illumination system and the projection system positioned on one side of the scanning direction, a driving system for relatively moving to the other side of the scanning direction, wherein said Relative movement of the mask in the scanning direction with respect to the object so that the mask facing the one partitioned area faces a second partitioned area provided on one side of the first partitioned area in the scanning direction. And a mask drive system for driving the mask, wherein the drive system is located on the other side of the first partitioned region with respect to the scanning direction during relative movement of the mask in the scanning direction with respect to the object by the mask driving system. The illumination system and the projection system are moved to one side, and the detection unit drive system is configured to detect the detection unit for the illumination system and the projection system in the scanning direction before the scanning exposure for the second partitioned area. that spacing is changed, the exposure detecting unit Before moving to the scanning direction device is provided.

According to the second aspect of the present invention, the scanning exposure is performed while illuminating the pattern of the mask with illumination light and projecting a projected image of the pattern onto each of a plurality of divided areas provided on the object. An exposure method , wherein a plurality of first marks are formed on the mask so as to be separated from each other in the scanning direction while moving the detection unit in the scanning direction, and are formed on the object so as to be separated from each other in the scanning direction. Detecting a plurality of second marks, and based on the detection results of the first mark and the second mark , the first partitioned area on the object and the relative position of the first partition and the relative position of the second mark on the object are adjusted. The illumination system and the projection system located on one side in the scanning direction with respect to the mask are relatively moved to the other side in the scanning direction to perform the scanning exposure of the first partitioned area; The mask is opposed to the object in the scanning direction so that the mask facing the first partitioned area faces a second partitioned area provided on one side of the first partitioned area in the scanning direction. Moving and moving the illumination system and the projection system located on the other side of the first partitioned area with respect to the scanning direction to one side during relative movement of the mask with respect to the object in the scanning direction. Prior to the scanning exposure of the second partitioned area, the detection unit is moved in the scanning direction so that the interval of the detection unit with respect to the illumination system and the projection system is changed with respect to the scanning direction. Detecting the plurality of first marks and a plurality of third marks formed on the object in the scanning direction so as to be separated from each other, and the illumination system and the projection system with respect to the scanning direction. An exposure method is provided, which comprises moving from the other side to the one side of the two-partitioned region and performing the scanning exposure of the second parted region facing the mask.

According to a third aspect of the present invention, exposing a substrate coated with a resist used in a flat panel display by using the exposure apparatus according to the first aspect or the exposure method according to the second aspect, and And a method of manufacturing a flat panel display, the method including: developing the formed substrate.

According to a fourth aspect of the present invention, exposing the object coated with the resist using the exposure apparatus according to the first aspect or the exposure method according to the second aspect, and exposing the exposed object. A device manufacturing method is provided that includes developing.

It is a conceptual diagram of the liquid crystal exposure apparatus which concerns on 1st Embodiment. FIG. 2 is a block diagram showing an input/output relationship of a main control device which mainly constitutes a control system of the liquid crystal exposure apparatus of FIG. 1. It is a figure for demonstrating the structure of a projection system main body and the measurement system of an alignment microscope. 4A to 4E are views (No. 1 to No. 5) for explaining the operation of the liquid crystal exposure apparatus during scanning exposure of the substrate. FIGS. 5A to 5D are views (No. 6 to No. 9) for explaining the operation of the liquid crystal exposure apparatus during scanning exposure of the substrate. FIGS. 6A to 6D are views (No. 1 to No. 4) for explaining the relationship between the illumination area and the mask in the second embodiment. 7A to 7E are views (No. 1 to No. 5) for explaining the operation at the time of scanning exposure of the liquid crystal exposure apparatus according to the second embodiment. FIG. 8A to FIG. 8D are views (No. 1 to No. 4) for explaining the relationship between the illumination area and the mask in the third embodiment. 9A to 9E are views (No. 1 to No. 5) for explaining the operation during scanning exposure of the liquid crystal exposure apparatus according to the third embodiment.

<<First Embodiment>>
Hereinafter, the first embodiment will be described with reference to FIGS. 1 to 5D.

  FIG. 1 shows a conceptual diagram of a liquid crystal exposure apparatus 10 according to the first embodiment. The liquid crystal exposure apparatus 10 is of a step-and-scan type in which a rectangular (square) glass substrate P (hereinafter, simply referred to as a substrate P) used in, for example, a liquid crystal display device (flat panel display) is an exposure target. It is a projection exposure apparatus, a so-called scanner.

  The liquid crystal exposure apparatus 10 includes an illumination system 20 that emits illumination light IL that is an energy beam for exposure, and a projection optical system 40. Hereinafter, a direction parallel to the optical axis of the illumination light IL emitted from the illumination system 20 to the substrate P via the projection optical system 40 will be referred to as a Z-axis direction, and X-axes orthogonal to each other in a plane orthogonal to the Z-axis. And the Y-axis will be set and explained. Further, in the coordinate system of the present embodiment, the Y axis is assumed to be substantially parallel to the direction of gravity. Therefore, the XZ plane is substantially parallel to the horizontal plane. Further, the rotation (tilt) direction around the Z axis will be described as the θz direction.

  Here, in the present embodiment, a plurality of exposure target areas (which will be appropriately referred to as partition areas or shot areas) are set on one substrate P, and a mask pattern is sequentially transferred to these plurality of shot areas. To be done. In addition, in the present embodiment, a case will be described in which four partitioned areas are set on the substrate P (so-called four-chamfering), but the number of partitioned areas is not limited to this and can be appropriately changed.

  Further, in the liquid crystal exposure apparatus 10, a so-called step-and-scan type exposure operation is performed. During the scan exposure operation, the mask M and the substrate P are kept substantially stationary, and the illumination system 20 and the projection optical system. 40 (illumination light IL) relatively moves with respect to the mask M and the substrate P in a long stroke in the X-axis direction (appropriately referred to as a scanning direction) (see the white arrow in FIG. 1 ). On the other hand, during the step operation for changing the divided area of the exposure target, the mask M is step-moved in the X-axis direction by a predetermined stroke, and the substrate P is step-moved in the Y-axis direction by a predetermined stroke (respectively). (Refer to the black arrow in FIG. 1).

  FIG. 2 is a block diagram showing an input/output relationship of a main controller 90 that integrally controls each component of the liquid crystal exposure apparatus 10. As shown in FIG. 2, the liquid crystal exposure apparatus 10 includes an illumination system 20, a mask stage device 30, a projection optical system 40, a substrate stage device 50, an alignment system 60 and the like.

  The illumination system 20 includes an illumination system main body 22 including a light source (for example, a mercury lamp) of the illumination light IL (see FIG. 1). During the scan exposure operation, main controller 90 controls drive system 24 including, for example, a linear motor to scan drive illumination system main body 22 in the X-axis direction with a predetermined long stroke. The main controller 90 obtains position information in the X-axis direction of the illumination system main body 22 via the measurement system 26 including, for example, a linear encoder, and controls the position of the illumination system main body 22 based on the position information. In the present embodiment, for example, g-line, h-line, i-line, etc. are used as the illumination light IL.

  The mask stage device 30 includes a stage body 32 that holds the mask M. The stage main body 32 is configured to be capable of stepwise movement in the X-axis direction and the Y-axis direction by a drive system 34 including, for example, a linear motor. During a step operation for changing the partitioned area to be exposed in the X-axis direction, main controller 90 controls drive system 34 to step-drive stage body 32 in the X-axis direction. Further, as will be described later, during a step operation for changing the area (position) to be scanned and exposed in the partitioned area to be exposed in the Y-axis direction, main controller 90 controls drive system 34 to cause the stage to move. The main body 32 is step-driven in the Y-axis direction. The drive system 34 can also appropriately finely drive the mask M in the three-degree-of-freedom (X, Y, θz) directions in the XY plane during the alignment operation described later. The position information of the mask M is obtained by the measurement system 36 including, for example, a linear encoder.

  The projection optical system 40 includes a projection system main body 42 including an optical system that forms an erect image of the mask pattern on the substrate P (see FIG. 1) in the unity magnification system. The projection system main body 42 is arranged in a space formed between the substrate P and the mask M (see FIG. 1). During the scan exposure operation, main controller 90 controls drive system 44 including, for example, a linear motor to cause projection system main body 42 to have a predetermined length in the X-axis direction so as to synchronize with projection system main body 22. Scan drive by stroke. The main controller 90 obtains position information in the X-axis direction of the projection system body 42 via a measurement system 46 including a linear encoder or the like, and controls the position of the projection system body 42 based on the position information.

  Returning to FIG. 1, in the liquid crystal exposure apparatus 10, when the illumination area IL on the mask M is illuminated by the illumination light IL from the illumination system 20, the illumination light IL that has passed through the mask M passes through the projection optical system 40. The projected image (partial erect image) of the mask pattern in the illumination area IAM is formed in the irradiation area (exposure area IA) of the illumination light IL that is conjugate with the illumination area IAM on the substrate P. Then, the scanning exposure operation is performed by the illumination light IL (the illumination area IAM and the exposure area IA) moving relative to the mask M and the substrate P in the scanning direction. That is, in the liquid crystal exposure apparatus 10, the pattern of the mask M is generated on the substrate P by the illumination system 20 and the projection optical system 40, and the sensitive layer (resist layer) on the substrate P is exposed by the illumination light IL to expose the substrate P. The pattern is formed on the.

  The substrate stage device 50 includes a stage body 52 that holds the back surface (the surface opposite to the exposure surface) of the substrate P. Returning to FIG. 2, during the step operation for changing the partitioned area to be exposed in the Y-axis direction, the main controller 90 controls the drive system 54 including, for example, a linear motor to move the stage main body 52 to the Y direction. Step drive in the axial direction. The drive system 54 can also finely drive the substrate P in the three degrees of freedom (X, Y, θz) directions in the XY plane during the substrate alignment operation described later. The position information of the substrate P (stage main body 52) is obtained by the measurement system 56 including, for example, a linear encoder.

  Returning to FIG. 1, the alignment system 60 includes, for example, two alignment microscopes 62 and 64. The alignment microscopes 62 and 64 are arranged in a space formed between the substrate P and the mask M (a position between the substrate P and the mask M in the Z-axis direction), and the alignment formed on the substrate P. The mark Mk (hereinafter, simply referred to as the mark Mk) and the mark (not shown) formed on the mask M are detected. In the present embodiment, one mark Mk is formed in the vicinity of the four corners of each partitioned region (for example, four for each partitioned region), and the mark of the mask M is a mark formed through the projection optical system 40. It is formed at a position corresponding to Mk. The numbers and positions of the marks Mk and the marks of the mask M are not limited to this, and can be changed as appropriate. Further, in each drawing, the mark Mk is shown larger than it actually is in order to facilitate understanding.

  One alignment microscope 62 is arranged on the +X side of the projection system main body 42, and the other alignment microscope 64 is arranged on the −X side of the projection system main body 42. The alignment microscopes 62 and 64 each have a pair of detection fields (detection regions) separated in the Y-axis direction, and simultaneously detect, for example, two marks Mk that are separated in the Y-axis direction in one partitioned region. You can do it.

  Further, the alignment microscopes 62 and 64 can simultaneously detect the mark formed on the mask M and the mark Mk formed on the substrate P (in other words, without changing the positions of the alignment microscopes 62 and 64). Has become. The main controller 90, for example, each time the mask M performs the X-step operation or the substrate P performs the Y-step operation, the relative positional deviation information between the mark formed on the mask M and the mark Mk formed on the substrate P. And the relative positioning of the substrate P and the mask M in the directions along the XY plane is performed so as to correct (cancel or reduce) the positional deviation. In the alignment microscopes 62 and 64, a mask detection unit that detects (observes) the mark of the mask M and a substrate detection unit that detects (observes) the mark Mk of the substrate P are integrally formed by a common housing or the like. It is configured and driven by the drive system 66 via the common housing. Alternatively, the mask detection unit and the substrate detection unit may be configured by separate housings or the like. In that case, for example, the mask detection unit and the substrate detection unit are substantially equivalent by a common drive system 66. It is preferable to be configured so that it can move with operating characteristics.

  Main controller 90 (see FIG. 2) controls alignment microscopes 62 and 64 independently by a predetermined long stroke in the X-axis direction by controlling drive system 66 (see FIG. 2) including, for example, a linear motor. To drive. The main controller 90 also obtains position information in the X-axis direction of each of the alignment microscopes 62 and 64 via a measurement system 68 including a linear encoder, and controls the position of the alignment microscopes 62 and 64 based on the position information. Each independently. The drive system 66 also has, for example, a linear motor for driving the alignment microscopes 62 and 64 in the Y-axis direction.

  Here, the alignment microscopes 62 and 64 of the alignment system 60 and the projection system main body 42 of the projection optical system 40 described above are elements that are physically (mechanically) independent (separated), and the main controller 90 (see FIG. Drive (speed and position) control is performed independently of each other (see 2), but the drive system 66 that drives the alignment microscopes 62 and 64 and the drive system 44 that drives the projection system body 42 are in the X-axis direction. In regard to the drive of, for example, a part of a linear motor, a linear guide, etc. is shared, and the drive characteristics of the alignment microscopes 62, 64 and the projection system main body 42 or the control characteristics by the main controller 90 are substantially equal. Is configured to be.

  As a specific example, when the alignment microscopes 62 and 64 and the projection system main body 42 are driven in the X-axis direction by, for example, a moving coil type linear motor, a magnetic body (for example, a permanent magnet or the like) that is a stator is used. The unit is shared by the drive system 66 and the drive system 44. On the other hand, in the coil unit which is the mover, the alignment microscopes 62 and 64 and the projection system main body 42 are independently provided, and the main controller 90 (see FIG. 2) individually supplies power to the coil unit. By doing so, the driving (speed and position) of the alignment microscopes 62 and 64 in the X-axis direction and the driving (speed and position) of the projection system main body 42 in the X-axis direction are independently controlled. Therefore, main controller 90 can change (arbitrarily change) the distance (distance) between alignment microscopes 62 and 64 and projection system main body 42 in the X-axis direction. Further, main controller 90 can also move alignment microscopes 62 and 64 and projection system body 42 at different speeds in the X-axis direction.

  Main controller 90 (see FIG. 2) detects a plurality of marks Mk formed on substrate P using at least one of alignment microscopes 62 and 64, and uses the detection result (positional information of a plurality of marks Mk) as the detection result. Based on this, the array information (including information on the position (coordinate value), shape, etc. of the partitioned area) of the partitioned area in which the mark Mk to be detected is formed is calculated by the known enhanced global alignment (EGA) method. ..

  Specifically, in the scanning exposure operation, the main control device 90 (see FIG. 2) uses the alignment microscope 62 arranged on the +X side of the projection system main body 42 to expose at least the exposure target, prior to the scanning exposure operation. The position information of, for example, four marks Mk formed in the partitioned area is detected to calculate the array information of the partitioned area. The main controller 90 performs precise positioning (substrate alignment operation) of the substrate P in the three-degree-of-freedom directions in the XY plane based on the calculated array information of the partitioned areas to be exposed, and the illumination system 20 and the projection. By appropriately controlling the optical system 40, the scanning exposure operation (transfer of the mask pattern) is performed on the target partitioned area.

  Next, a measurement system 46 (see FIG. 2) for obtaining the position information of the projection system body 42 of the projection optical system 40, and a measurement system 68 for obtaining the position information of the alignment microscopes 62, 64 of the alignment system 60. The specific configuration of will be described.

  As shown in FIG. 3, the liquid crystal exposure apparatus 10 has a guide 80 for guiding the projection system main body 42 in the scanning direction. The guide 80 is composed of a member extending parallel to the scanning direction. The guide 80 also has a function of guiding the movement of the alignment microscope 62 in the scanning direction. Further, although the guide 80 is shown between the mask M and the substrate P in FIG. 3, the guide 80 is actually arranged in a position avoiding the optical path of the illumination light IL in the Y-axis direction. ..

  A scale 82 including a reflection type diffraction grating having a periodic direction at least in a direction parallel to the scanning direction (X-axis direction) is fixed to the guide 80. Further, the projection system main body 42 has a head 84 which is arranged so as to face the scale 82. In the present embodiment, the scale 82 and the head 84 form an encoder system that constitutes a measurement system 46 (see FIG. 2) for obtaining position information of the projection system body 42. The alignment microscopes 62 and 64 each have a head 86 arranged to face the scale 82 (the alignment microscope 64 is not shown in FIG. 3). In the present embodiment, the scale 82 and the head 86 form an encoder system that constitutes a measurement system 68 (see FIG. 2) for obtaining the position information of the alignment microscopes 62 and 64. Here, the heads 84 and 86 respectively irradiate the scale 82 with a beam for encoder measurement, receive a beam that has passed through the scale 82 (a reflected beam by the scale 82), and based on the light reception result, the scale 82. It is possible to output position information relative to.

  As described above, in the present embodiment, the scale 82 constitutes the measurement system 46 (see FIG. 2) for obtaining the position information of the projection system main body 42, and the measurement system for obtaining the position information of the alignment microscopes 62 and 64. 68 (see FIG. 2). That is, the projection system body 42 and the alignment microscopes 62 and 64 are position-controlled based on a common coordinate system (measurement axis) set by the diffraction grating formed on the scale 82. The drive system 44 (see FIG. 2) for driving the projection system main body 42 and the drive system 66 (see FIG. 2) for driving the alignment microscopes 62 and 64 may have some common elements. It may be good or may be composed of completely independent elements.

  The encoder system that constitutes the measurement systems 46 and 68 (see FIG. 2 respectively) may be a linear (1 DOF) encoder system in which the length measurement axis is only in the X-axis direction (scanning direction), for example. It may have more length measurement axes. For example, by arranging a plurality of heads 84 and 86 at predetermined intervals in the Y-axis direction, the rotation amount of the projection system main body 42 and the alignment microscopes 62 and 64 in the θz direction may be obtained. Further, an XY two-dimensional diffraction grating may be formed on the scale 82, and a 3DOF encoder system having a length measuring axis in the three degrees of freedom in the X, Y, and θz directions may be used. Further, as the heads 84 and 86, by using a plurality of known two-dimensional heads capable of measuring the length in the direction orthogonal to the scale surface together with the periodic direction of the diffraction grating, the projection system main body 42 and the alignment microscope 62 can be freely moved. The position information in the degree direction may be obtained.

  Next, a step-and-scan type exposure operation using the liquid crystal exposure apparatus 10 will be described with reference to FIGS. 4(a) to 5(d). The following exposure operation (including alignment operation) is performed under the control of main controller 90. 4(a) to 5(d) for explaining the relationship between the substrate P and the mask M during the exposure operation, the circuit pattern formed on the substrate P is indicated by F in order to facilitate understanding. It shall be explained in letters.

  Further, in reality, when the illumination light IL (see FIG. 1) is not irradiated, the exposure area IA is not generated on the substrate P, but here, for ease of understanding, FIG. 4A to FIG. In d), when the exposure area IA is illustrated as white, it is assumed that the exposure area IA is generated on the substrate P by the illumination light IL from the illumination system 20 (see FIG. 1), and the exposure area IA is black. In the illustrated case, it is assumed that the illumination light IL is not emitted.

As shown in FIG. 4A, in this embodiment, the partitioned area having the first exposure order (hereinafter referred to as the first shot area S ₁ ) is set on the −X side and the −Y side of the substrate P. Has been done. The mask M faces the first shot region S ₁ of the substrate P. The main controller 90 (not shown in FIGS. 4A to 5D, see FIG. 2) uses the alignment microscope 62 (see FIG. 2) to move the mask M and the first shot region S ₁ relative to each other. The correct positioning. Specifically, main controller 90 drives alignment microscope 62 in the +X direction to detect mark Mk (not shown) formed in first shot region S ₁ . Main controller 90 performs precise positioning of substrate P in the three degrees of freedom in the XY plane based on the detection result of alignment microscope 62. The main controller 90 detects the mark Mk by driving the pre-exposure alignment microscope 62 in the X-axis direction even when exposing another shot area, and finely positions the substrate P based on the detection result. However, the description is omitted below.

  Thereafter, as shown in FIG. 4B, main controller 90 causes illumination system main body 22 and projection system main body 42 (so that exposure area IA moves on substrate P in the +X direction at a constant speed. 1 and 2) are synchronously driven in the +X direction.

FIG. 4C shows a state immediately after the exposure operation to the first shot area S ₁ is completed. Next, the main controller 90 performs the exposure operation on the second shot area S ₂ set on the +Y side of the first shot area S ₁ to expose the substrate P as shown in FIG. 4D. Is driven in the Y direction in the Y step (see the black arrow in FIG. 4D). As a result, the mask M faces the second shot region S ₂ on the substrate P.

After that, the main controller 90 synchronously drives the illumination system main body 22 and the projection system main body 42 (see FIGS. 1 and 2 respectively) in the −X direction to perform the exposure operation to the second shot area S ₂ . .. As described above, in the present embodiment, the scanning direction of the illumination light IL (exposure area IA) is reversed between the first exposure operation and the second exposure operation.

Next, as shown in FIG. 5A, the main controller 90 sets the mask M to +X in order to perform the exposure operation on the third shot area S ₃ (+X side of the second shot area S ₁ ). X step drive in the direction (see the black arrow in FIG. 5A). In this state, as shown in FIG. 5B, the illumination light IL (exposure area IA) is scanned in the +X direction, whereby the pattern of the mask M is transferred to the third shot area S ₃ . From the state shown in FIG. 4E, when the mask M is driven in the +X direction by X steps, the illumination system main body 22 and the projection system main body 42 are completed by the X step driving in the +X direction of the mask M. Immediately after that, it may be driven to a position where the pattern of the mask M is easily transferred to the third shot area S ₃ . In other words, while the mask M is being driven in the X direction by X steps, the illumination system main body 22 and the projection system main body 42 are previously driven to the exposure start position of the third shot region S ₃ . In addition, it is possible to shorten the time until the exposure of the third shot area S ₃ is started.

In FIG. 5C, the substrate P is moved from the state shown in FIG. 5B in order to perform the exposure operation on the fourth shot area S ₄ (−Y side of the third shot area S ₃ ). The state where Y steps are driven in the +Y direction is shown. In this state, as shown in FIG. 5D, the illumination light IL (exposure area IA) is scanned in the −X direction, whereby the pattern of the mask 2 is transferred to the fourth shot area S ₄ .

  According to the liquid crystal exposure apparatus 10 according to the first embodiment described above, when performing scanning exposure on two partitioned areas that are adjacent in the scanning direction, the mask M does not change the position of the substrate P in the X-axis direction. Is moved in the scanning direction (X-axis direction), it is possible to suppress an increase in the footprint of the substrate stage device 50 (see FIG. 1), that is, the installation area of the liquid crystal exposure device 10. Therefore, the entire liquid crystal exposure apparatus 10 can be made compact.

  Further, since the substrate P can be moved in Y steps, the positions of the illumination system main body 22 and the projection system main body 42 (that is, the optical axis of the illumination light IL) with respect to the Y-axis direction can be changed with respect to the Y-axis direction. The scanning exposure operation can be performed on the divided areas at different positions. Accordingly, the illumination system 20 and the projection optical system 40 can be configured as a single-axis (X-axis) stage device, and the device configuration is simplified. Further, the position controllability of the illumination system body 22 and the projection system body 42 is improved.

<<Second Embodiment>>
Next, a liquid crystal exposure apparatus according to the second embodiment will be described with reference to FIGS. 6(a) to 7(e). In the configuration of the liquid crystal exposure apparatus according to the second embodiment, the illumination area formed on the mask M and the exposure area formed on the substrate P have different shapes, and the illumination system 20 and the projection optical system 40 are different. It is the same as the first embodiment except that it can be moved stepwise in the Y-axis direction, so only the differences will be described below, and regarding the elements having the same configurations and functions as the first embodiment, The same reference numerals as those in the first embodiment are given and the description thereof is omitted.

  As shown in FIG. 6A, in the second embodiment, the illumination area IAM is formed by, for example, two rectangular areas that are separated in the Y-axis direction. The length in the Y-axis direction of each of the two rectangular regions forming the illumination region IAM is set to, for example, about 1/4 of the length of the mask M in the Y-axis direction. Further, the interval between, for example, two rectangular regions forming the illumination area IAM is also set to, for example, about 1/4 of the length of the mask M in the Y-axis direction.

  In the second embodiment, as shown in FIG. 6B, the lower end of the mask M (the end on the −Y side) and the lower end of the illumination region IAM (the end on the −Y side) are substantially aligned. In this state, the illumination light IL (illumination area IAM) is scanned in the +X direction. As a result, for example, two strip-shaped regions that are separated from each other in the Y-axis direction on the mask M are illuminated. The substrate P (not shown in FIG. 6B, see FIG. 1) is exposed in, for example, two strip-shaped regions corresponding to these regions and separated in the Y-axis direction.

  Further, in order to expose the remaining portion of the mask pattern that has not been transferred by the scanning exposure, in the second embodiment, as shown in FIG. 6C, the illumination area IAM (and the exposure not shown) The area IA) moves Y steps in the Y-axis direction (see the white arrow in FIG. 6C). Specifically, the illumination system main body 22 and the projection system main body 42 (see FIG. 1 and FIG. 2, respectively) are synchronously moved in the Y-axis direction by drive systems 24 and 44 (see FIG. 2, respectively). Is controlled by the main controller 90 (see FIG. 2). At this time, the main controller 90 positions the illumination area IAM in the Y-axis direction so that the positions of the unexposed area on the mask M and the illumination area IAM substantially coincide with each other in the Y-axis direction. Specifically, the main controller 90 uses the alignment microscope 62 to relatively position the illumination system body 22, the projection system body 42, the mask M, and the substrate P. The main controller 90 uses the alignment microscope 62 to move the illumination system main body 22 and the projection system main body 42 each time the drive systems 24 and 44 synchronously move in the Y-axis direction. The relative positioning of 22, the projection system main body 42, the mask M, and the substrate P is performed, but the description thereof is omitted below.

  Thereafter, as shown in FIG. 6D, the illumination light IL (illumination area IAM) is scanned in the −X direction. As a result, the mask pattern that could not be transferred to the substrate P (see FIG. 1) in the first scanning exposure operation is transferred to the substrate P. As described above, in the second embodiment, in order to form a desired pattern in one divided area on the substrate P (see FIG. 1), the scanning exposure operation is performed, for example, twice in total. That is, in order to form a desired circuit pattern in the partitioned area, the projection system main body 42 is reciprocally driven in the X direction to perform stitching exposure.

Next, the scanning exposure operation in the second embodiment will be described with reference to FIGS. 7(a) to 7(e). In FIG. 7 (a), in order to perform the exposure operation for the first shot area S _1, and positioned state is shown as the mask M is opposed to the first shot region S ₁ on the substrate P There is. In this state, as shown in FIG. 7B, the illumination light IL (exposure area IA) is scanned in the +X direction, and as a result, a partial area of the first shot area S ₁ (in the Y-axis direction, each other A part of the pattern of the mask M is transferred to spaced apart (for example, two strip-shaped regions). Hereinafter, as shown in FIG. 7C, the illumination system main body 22 and the projection system main body 42 (see FIG. 1 and FIG. 2, respectively) move Y steps in the +Y direction (see the black arrow in FIG. 7C). Then, thereafter, as shown in FIG. 7D, the illumination light IL (exposure area IA) is scanned in the −X direction. As a result, the mask pattern is transferred to the first shot area S ₁ .

Hereinafter, for the scanning exposure operation for the second shot area S ₂ , the substrate P is driven in Y steps in the −Y direction (see FIG. 7E), and for the scanning exposure operation for the third shot area S ₃ . The point at which the mask M is driven in X steps in the +X direction (not shown) and the point in which the substrate P is driven in Y steps in the +Y direction due to the scanning exposure operation for the fourth shot region S ₄ (not shown) are respectively. The description is omitted because it is similar to the first embodiment.

  According to the second embodiment described above, since the illumination area IAM and the exposure area IA (cross-sectional area of the luminous flux of the illumination light IL) are narrower than those in the first embodiment, the illumination system main body 22 and the projection system are provided. It is possible to reduce the size and weight of the main body 42 (see FIG. 1, respectively). As a result, the position controllability of the illumination system main body 22 and the projection system main body 42 is improved, so that high-speed and high-precision scanning exposure operation is possible.

<<Third Embodiment>>
Next, a third embodiment will be described with reference to FIGS. 8(a) to 9(e). The configuration of the liquid crystal exposure apparatus according to the third embodiment is the same as that of the above-described second embodiment, except that the illumination area formed on the mask M and the exposure area formed on the substrate P have different shapes. Therefore, only the differences will be described below, and elements having the same configurations and functions as those of the first or second embodiment will be designated by the same reference numerals as those of the first or second embodiment. The description is omitted.

  In the second embodiment, the illumination area IAM formed on the mask M and the exposure area IA formed on the substrate P are formed by two areas (FIG. 6A and FIG. On the other hand, in the third embodiment, as shown in FIG. 8A, the illumination area IAM has a rectangular shape extending in the Y-axis direction as in the first embodiment. Is formed by the area. However, in the first embodiment described above, the length of the illumination area IAM is almost the same as the length of the mask M in the Y-axis direction (see FIG. 1 and the like), whereas in the third embodiment, illumination is performed. The length of the region IAM is approximately half the length of the mask M in the Y-axis direction. Also in the third embodiment, as in the second embodiment, the illumination system main body 22 and the projection system main body 42 (see FIG. 1) can be moved stepwise in the Y-axis direction.

  As shown in FIG. 8B, in the third embodiment as well, as in the second embodiment, the lower end of the mask M (the end on the −Y side) and the lower end of the illumination area IAM (the −Y side). Illumination light IL (illumination area IAM) is scanned in the +X direction in such a manner that the edge of the mask M is almost coincident with the edge of the mask M and the mask pattern of the lower half (−Y side) of the mask M is formed on the substrate (not shown). Transcribed. After that, the illumination system main body 22 and the projection system main body 42 (see FIG. 1 respectively) are driven in the +Y direction by the Y step (see the white arrow in FIG. 8C), and as shown in FIG. 8D. In addition, the illumination light IL (illumination area IAM) is scanned in the −X direction (see the black arrow in FIG. 8D), so that the remaining portion (upper side (+Y side) half) of the mask pattern is not exposed on the substrate (non-exposed). (Shown).

Next, the scanning exposure operation in the third embodiment will be described with reference to FIGS. 9(a) to 9(e). FIG. 9 (a), in order to perform the exposure operation for the first shot area S _1, the mask M is shown positioned state so as to face the first shot area S ₁ on the substrate P There is. In this state, as shown in FIG. 9B, the illumination light IL (exposure area IA) is scanned in the +X direction, whereby the lower half area (−Y side) of the first shot area S ₁ is scanned. A part of the pattern of the mask M is transferred. Thereafter, as shown in FIG. 9C, the illumination system main body 22 and the projection system main body 42 (see FIG. 1 respectively) move Y steps in the +Y direction (see the black arrow in FIG. 9C). After that, as shown in FIG. 9D, the illumination light IL (exposure area IA) is scanned in the −X direction. As a result, the mask pattern is transferred to the first shot area S ₁ .

Hereinafter, for the scanning exposure operation for the second shot area S ₂ , the substrate P is driven in Y steps in the −Y direction (see FIG. 9E), and for the scanning exposure operation for the third shot area S ₃ . The point at which the mask M is driven in X steps in the +X direction (not shown) and the point in which the substrate P is driven in Y steps in the +Y direction due to the scanning exposure operation for the fourth shot region S ₄ (not shown) are respectively. The description is omitted because it is similar to the first and second embodiments. The third embodiment described above can also obtain the same effect as that of the second embodiment.

  The configurations according to the first to third embodiments described above can be modified as appropriate. For example, in each of the above-described embodiments, the mask pattern is transferred to, for example, each of two partitioned areas adjacent to each other in the X-axis direction by moving the mask M in the X-axis direction (scanning direction, scanning direction) by X steps. The mask pattern may be transferred to, for example, each of three or more divided areas that are adjacent in the axial direction. Further, in the above-described embodiment, the substrate P is moved in the Y-axis direction by Y steps. However, if the mask pattern can be transferred to each of a plurality of partitioned regions adjacent in the X-axis (scan) direction, the step driving mechanism of the substrate P is The position of the substrate P is not always necessary and may be fixed.

  When performing the joint exposure, the forward and backward alignment microscopes 62 may be arranged before and after the projection system main body 42 with respect to the exposure direction. In this case, the mark Mk for relative positioning between the mask M and the substrate P is detected by the forward path (for the first exposure scanning) alignment microscope, and the return path (for the second exposure scanning) alignment microscope is used. The mark near the joint may be detected. As the mark near the joint, a mark may be formed on the substrate in advance, or an exposed pattern may be used as the mark.

  The main controller 90 does not use the measurement result of the alignment microscope 62 to position the illumination area IAM in the Y-axis direction, but uses an encoder or the like (not shown) to control the illumination system main body 22 and the projection system main body 42. Positioning in the Y-axis direction may be performed.

  In the second and third embodiments, the illumination system 20 (illumination system main body 22) and the projection optical system 40 (projection system main body 42) can be moved stepwise in the Y-axis direction. However, the present invention is not limited to this. Instead, the stage body 32 of the mask stage device 30 may be movable in the Y-axis direction, and the mask M and the substrate P may be moved in Y steps.

Further, in each of the above embodiments, the wavelength of the light source used in the illumination system 20 and the illumination light IL emitted from the light source is not particularly limited, and for example, ArF excimer laser light (wavelength 193 nm), KrF excimer laser light ( It may be ultraviolet light having a wavelength of 248 nm) or vacuum ultraviolet light such as F ₂ laser light (having a wavelength of 157 nm).

  Further, in the above-described embodiment, the illumination system main body 22 including the light source is driven in the scanning direction. However, the present invention is not limited to this, and the light source is fixed like the exposure apparatus disclosed in JP 2000-12422A, for example. Alternatively, only the illumination light IL may be scanned in the scanning direction.

  Further, in each of the above-described embodiments, the same magnification system is used as the projection optical system 40, but the present invention is not limited to this, and a reduction system or an enlargement system may be used. Further, the projection optical system may not be provided.

  Further, although the illumination area IAM and the exposure area IA are formed in a band shape extending in the Y-axis direction in the above-mentioned embodiment, the invention is not limited to this, and as disclosed in, for example, US Pat. No. 5,729,331. Alternatively, a plurality of areas arranged in a staggered pattern may be combined.

  Further, in each of the above-described embodiments, the mask M and the substrate P are arranged so as to be orthogonal to the horizontal plane (so-called vertical arrangement), but the present invention is not limited to this, and the mask M and the substrate P are parallel to the horizontal plane. It may be arranged. In this case, the optical axis of the illumination light IL is substantially parallel to the gravity direction.

  Further, during the scanning exposure operation, the fine positioning in the XY plane of the substrate P was performed according to the result of the alignment measurement. Together with this, the surface of the substrate P before the scanning exposure operation (or in parallel with the scanning exposure operation). The position information may be obtained and surface position control of the substrate P (so-called autofocus control) may be performed during the scanning exposure operation.

Further, when the projection system main body 42 is reciprocated to perform the stitching exposure in order to form one mask pattern in the divided area as in the above-described embodiment, the forward and backward alignments having different detection fields of view are performed. The microscope is arranged in front of and behind the projection system main body 42 with respect to the scanning direction (X direction). In this case, the marks Mk at the four corners of the divided region are detected by the alignment microscope for the forward path (for the first exposure operation), and the marks Mk near the joint are detected by the alignment microscope for the backward path (for the second exposure operation). May be detected. Here, the spliced portion means a spliced portion of the area exposed by the forward scanning exposure (the area where the pattern is transferred) and the area exposed by the backward scanning exposure (the area where the pattern is transferred). To do. As the mark Mk near the joint portion, the mark Mk may be formed on the substrate P in advance, or an exposed pattern may be used as the mark Mk. The same applies to the case where joint exposure is performed not only in the first shot area S ₁ but also in another shot area. In the above embodiment, when the projection system main body 42 is driven in the +X direction to perform the scanning exposure operation, the forward path alignment microscope is the alignment microscope 62, and the backward path alignment microscope is the alignment microscope 64. When the scanning exposure operation is performed by driving the projection system main body 42 in the −X direction, the forward path alignment microscope is the alignment microscope 64, and the backward path alignment microscope is the alignment microscope 62.

  Further, the application of the exposure apparatus is not limited to the exposure apparatus for liquid crystal that transfers the liquid crystal display element pattern to the rectangular glass plate, and for example, the exposure apparatus for manufacturing an organic EL (Electro-Luminescence) panel, the semiconductor It can be widely applied to an exposure apparatus for manufacturing, a thin film magnetic head, an exposure apparatus for manufacturing a micromachine, a DNA chip and the like. Further, not only microdevices such as semiconductor elements, but also glass substrates or silicon wafers for manufacturing masks or reticles used in light exposure apparatuses, EUV exposure apparatuses, X-ray exposure apparatuses, electron beam exposure apparatuses, etc. It can also be applied to an exposure device that transfers a circuit pattern onto a substrate.

  The object to be exposed is not limited to the glass plate, and may be another object such as a wafer, a ceramic substrate, a film member, or a mask blank. When the exposure target is a flat panel display substrate, the thickness of the substrate is not particularly limited, and includes, for example, a film-shaped (flexible sheet-shaped member). The exposure apparatus of this embodiment is particularly effective when a substrate having a side length or a diagonal length of 500 mm or more is an exposure target. Further, when the substrate to be exposed has a flexible sheet shape, the sheet may be formed in a roll shape. In this case, it is possible to easily change (step move) the division area of the exposure target with respect to the illumination area (illumination light) by rotating (rolling) the roll regardless of the step operation of the stage device. ..

  For electronic devices such as liquid crystal display elements (or semiconductor elements), the step of designing the function/performance of the device, the step of manufacturing a mask (or reticle) based on this design step, the step of manufacturing a glass substrate (or wafer) The exposure apparatus of each of the above-described embodiments, and the lithography step of transferring the pattern of the mask (reticle) to the glass substrate by the exposure method, the developing step of developing the exposed glass substrate, and the portion other than the portion where the resist remains It is manufactured through an etching step of removing an exposed member of a portion by etching, a resist removing step of removing unnecessary resist after etching, a device assembling step, an inspection step and the like. In this case, in the lithography step, the above-described exposure method is executed by using the exposure apparatus of the above-described embodiment, and the device pattern is formed on the glass substrate, so that a highly integrated device can be manufactured with high productivity. ..

  As described above, the exposure apparatus and method of the present invention are suitable for scanning and exposing an object. Further, the method for manufacturing a flat panel display of the present invention is suitable for producing a flat panel display. Moreover, the device manufacturing method of the present invention is suitable for the production of microdevices.

  10... Liquid crystal exposure device, 20... Illumination system, 30... Mask stage device, 40... Projection optical system, 50... Substrate stage device, 60... Alignment system, M... Mask, P... Substrate.

Claims (20)

An exposure device that irradiates a pattern of a mask with illumination light and performs scanning exposure while projecting a projected image of the pattern on each of a plurality of partitioned areas provided on an object,
An illumination system that emits the illumination light to the object,
A projection system for projecting the projection image onto the object;
A detection unit that detects a plurality of first marks formed on the mask and separated from each other in the scanning direction, and a plurality of detection units that detect a plurality of second marks formed on the object and separated from each other in the scanning direction;
A detection unit drive system that moves the detection unit in the scanning direction so as to detect the plurality of first marks and the plurality of second marks;
As the first divided area on the object the relative positions are adjusted relative to the mask based on a detection result of the detecting unit is the scanning exposure, with respect to the first divided area and the mask facing each other, scanning A drive system that relatively moves the illumination system and the projection system located on one side in the direction to the other side in the scanning direction;
The mask is opposed to the object in the scanning direction so that the mask opposes the second partitioned area provided on one side of the first partitioned area in the scanning direction. And a mask drive system for relative movement,
The drive system includes the projection system and the illumination system located on the other side of the first partitioned area in the scanning direction during relative movement of the mask in the scanning direction with respect to the object by the mask driving system. Move it to one side ,
The detection unit drive system moves the detection unit in the scanning direction so that the distance between the detection unit and the illumination system and the projection system with respect to the scanning direction is changed before the scanning exposure for the second partitioned area. It is not Ru exposure device moving to. The drive system moves the illumination system and the projection system with respect to the scanning direction so that the scanning exposure is performed on the second partitioned area whose relative position with respect to the mask is adjusted based on the detection result of the detection unit. The exposure apparatus according to claim 1, wherein the exposure apparatus is moved from the other side to the one side of the second partitioned area.   With respect to the mask, the mask facing the scan-exposed second partitioned area faces the third partitioned area whose position is different from that of the second partitioned area in the non-scanning direction intersecting the scanning direction. The exposure apparatus according to claim 2, further comprising an object drive system that relatively moves the object in the non-scanning direction.   The drive system moves the illumination system and the projection system in the non-scanning direction with respect to the object and the mask on which the projected image of a part of the pattern is scan-exposed on a part of the partitioned area. The exposure apparatus according to claim 3, wherein the exposure apparatus is moved relatively.   The driving system relatively moves the illumination system and the projection system, which are relatively moved in the non-scanning direction, in the scanning direction so that the projected image of the other part of the pattern is scanned and exposed on the other part of the divided area. The exposure apparatus according to claim 4, wherein the exposure apparatus is moved.   5. The projection system projects a projection image of a part of the pattern, which has a half length of the partitioned area in the non-scanning direction, onto the object in the scanning exposure of a part of the partitioned area. The exposure apparatus according to item 5.   5. The projection system projects a projection image of a part of the pattern, which is composed of a plurality of regions separated by a predetermined interval in the non-scanning direction, onto the object in the scanning exposure of a part of the partitioned region. The exposure apparatus according to item 5. The direction in which the illumination light is applied to the object is parallel to a horizontal plane,
The exposure apparatus according to any one of claims 1 to 7, wherein the object is arranged such that a surface to be scanned and exposed is orthogonal to the horizontal plane. The drive system includes a first drive unit that drives the illumination system, and a second drive unit that drives the projection system,
9. The exposure apparatus according to claim 1, wherein the first and second driving units move the illumination system and the projection system in synchronization with each other in the scanning exposure.   The exposure apparatus according to claim 1, wherein the object is a substrate used for a flat panel display.   The exposure apparatus according to claim 10, wherein the substrate has a length of one side or a diagonal length of 500 mm or more. Exposing the substrate coated with a resist using the exposure apparatus according to claim 10 or 11;
Developing the exposed substrate, and manufacturing a flat panel display. Exposing the object coated with the resist using the exposure apparatus according to any one of claims 1 to 9;
Developing the exposed object. An exposure method of irradiating a pattern of a mask with illumination light and performing scanning exposure while projecting a projected image of the pattern on each of a plurality of divided areas provided on an object,
A plurality of first marks formed on the mask so as to be separated from each other in the scanning direction while moving the detection unit in the scanning direction, and a plurality of second marks formed on the object so as to be separated from each other in the scanning direction. To detect and
Based on the detection result of the first mark and the second mark, it is located on one side in the scanning direction with respect to the first divided area on the object and the mask whose relative positions are adjusted to face each other. Performing the scanning exposure of the first partitioned area by relatively moving the illumination system and the projection system to the other side in the scanning direction;
The mask is opposed to the object in the scanning direction so that the mask opposes the second partitioned area provided on one side of the first partitioned area in the scanning direction. To move it relative to
Moving the illumination system and the projection system located on the other side of the first partitioned area with respect to the scanning direction to one side during relative movement of the mask with respect to the object in the scanning direction;
Prior to the scanning exposure of the second partitioned area, the detection unit is moved in the scanning direction so that the intervals of the detection unit with respect to the illumination system and the projection system with respect to the scanning direction are changed, and Detecting a first mark and a plurality of third marks formed on the object and spaced apart from each other in the scanning direction;
Moving the illumination system and the projection system from the other side to the one side of the second partitioned area in the scanning direction, and performing the scanning exposure of the second partitioned area facing the mask. An exposure method including.   With respect to the mask, the mask facing the scan-exposed second partitioned area faces the third partitioned area whose position is different from that of the second partitioned area in the non-scanning direction intersecting the scanning direction. 15. The exposure method according to claim 14, further comprising: relatively moving the object in the non-scanning direction. Exposing the projected image of a part of the pattern to a part of the divided area;
Moving the illumination system and the projection system relative to the non-scanning direction with respect to the object and the mask, in which a projected image of a part of the pattern is scan-exposed on a part of the partitioned area; ,
The illumination system and the projection system relatively moved in the non-scanning direction are relatively moved in the scanning direction, and the projection image of the other part of the pattern is scanned and exposed to the other part of the divided area; The exposure method according to claim 14, further comprising:   The exposure method according to any one of claims 14 to 16, wherein the object is a substrate used for a flat panel display.   18. The exposure method according to claim 17, wherein the substrate has a length of at least one side or a diagonal length of 500 mm or more. Exposing the substrate coated with a resist using the exposure method according to claim 17 or 18;
Developing the exposed substrate, and manufacturing a flat panel display. Exposing the object coated with a resist using the exposure method according to any one of claims 14 to 16;
Developing the exposed object.

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