AU2828900A - Exposure method, exposure device, exposure system, mask and device manufacturingmethod - Google Patents

Exposure method, exposure device, exposure system, mask and device manufacturingmethod

Info

Publication number
AU2828900A
AU2828900A AU28289/00A AU2828900A AU2828900A AU 2828900 A AU2828900 A AU 2828900A AU 28289/00 A AU28289/00 A AU 28289/00A AU 2828900 A AU2828900 A AU 2828900A AU 2828900 A AU2828900 A AU 2828900A
Authority
AU
Australia
Prior art keywords
exposure
mask
manufacturingmethod
exposure method
exposure system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU28289/00A
Inventor
Naomasa Shiraishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of AU2828900A publication Critical patent/AU2828900A/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70433—Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70466—Multiple exposures, e.g. combination of fine and coarse exposures, double patterning or multiple exposures for printing a single feature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70475—Stitching, i.e. connecting image fields to produce a device field, the field occupied by a device such as a memory chip, processor chip, CCD, flat panel display
AU28289/00A 1999-04-28 2000-03-06 Exposure method, exposure device, exposure system, mask and device manufacturingmethod Abandoned AU2828900A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP12185499 1999-04-28
JP11/121854 1999-04-28
JP11/139850 1999-05-20
JP13985099 1999-05-20
PCT/JP2000/001310 WO2000067302A1 (en) 1999-04-28 2000-03-06 Exposure method, exposure device, exposure system, mask and device manufacturing method

Publications (1)

Publication Number Publication Date
AU2828900A true AU2828900A (en) 2000-11-17

Family

ID=26459117

Family Applications (1)

Application Number Title Priority Date Filing Date
AU28289/00A Abandoned AU2828900A (en) 1999-04-28 2000-03-06 Exposure method, exposure device, exposure system, mask and device manufacturingmethod

Country Status (3)

Country Link
AU (1) AU2828900A (en)
TW (1) TW494468B (en)
WO (1) WO2000067302A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4540327B2 (en) 2003-11-06 2010-09-08 ルネサスエレクトロニクス株式会社 Photomask pattern forming method
JP2006203032A (en) * 2005-01-21 2006-08-03 Victor Co Of Japan Ltd Method of manufacturing element
US8728722B2 (en) * 2010-09-30 2014-05-20 Truesense Imaging, Inc. Stitching methods using multiple microlithographic expose tools
US9196515B2 (en) 2012-03-26 2015-11-24 Taiwan Semiconductor Manufacturing Co., Ltd. Litho cluster and modulization to enhance productivity
US8903532B2 (en) * 2012-03-26 2014-12-02 Taiwan Semiconductor Manufacturing Co., Ltd. Litho cluster and modulization to enhance productivity
US9958787B2 (en) 2012-09-21 2018-05-01 Asml Netherlands B.V. Lithographic method and apparatus
JP6701596B2 (en) * 2015-03-31 2020-05-27 株式会社ニコン Exposure apparatus, exposure method, flat panel display manufacturing method, and device manufacturing method
JP6701597B2 (en) * 2015-03-31 2020-05-27 株式会社ニコン Exposure apparatus, exposure method, flat panel display manufacturing method, and device manufacturing method
US10861698B2 (en) 2017-08-29 2020-12-08 Taiwan Semiconductor Manufacturing Co., Ltd. Pattern fidelity enhancement
CN109491218B (en) * 2018-12-29 2019-10-01 成都中电熊猫显示科技有限公司 Reduce the method and device of exposure figure stitching portion color difference
JP7022807B2 (en) * 2020-11-02 2022-02-18 キヤノン株式会社 Pattern forming method, lithography equipment, and article manufacturing method
CN117274366B (en) * 2023-11-22 2024-02-20 合肥晶合集成电路股份有限公司 Line edge distance determining method and device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2902506B2 (en) * 1990-08-24 1999-06-07 キヤノン株式会社 Semiconductor device manufacturing method and semiconductor device
JPH07211622A (en) * 1994-01-27 1995-08-11 Nikon Corp Method and system for exposure
JPH08236433A (en) * 1994-12-28 1996-09-13 Nikon Corp Exposing method
JP4075019B2 (en) * 1996-01-10 2008-04-16 株式会社ニコン Solid-state imaging device
JP2822969B2 (en) * 1996-01-29 1998-11-11 日本電気株式会社 Verification method of integrated circuit mask pattern
JP4014694B2 (en) * 1997-07-23 2007-11-28 シャープ株式会社 Exposure method and apparatus

Also Published As

Publication number Publication date
TW494468B (en) 2002-07-11
WO2000067302A1 (en) 2000-11-09

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase