KR20180059864A - Moving device, exposure device, flat panel display manufacturing method, device manufacturing method, and measuring method - Google Patents

Abstract

The measurement system for obtaining the positional information in the Z-axis direction of the substrate holder 36 movable in the direction parallel to the XY plane is formed so as to face the substrate holder 36 and is movable in the Y-axis direction in synchronization with the substrate holder 36 A movable Y-slider 76, a sensor head 78 formed on the Y-slider 76, and a Y-slider 76, which are formed on the substrate holder 36 and extend in the X- 38 to obtain position information of the substrate holder 36 in the Z-axis direction by the sensor head 78.

Description

Moving device, exposure device, flat panel display manufacturing method, device manufacturing method, and measuring method

The present invention relates to a mobile apparatus, an exposure apparatus, a method of manufacturing a flat panel display, a device manufacturing method, and a measuring method.

Conventionally, in a lithography process for manufacturing electronic devices (microdevices) such as liquid crystal display devices and semiconductor devices (integrated circuits) and the like, a mask or a reticle (hereinafter collectively referred to as a "mask"), a glass plate, Scanning exposure system (a so-called scanning stepper (hereinafter, referred to as a " scanning stepper ") in which a pattern formed on a mask is transferred onto a substrate using an energy beam while synchronously moving a substrate Scanners)) and the like are used (see, for example, Patent Document 1).

In this type of exposure apparatus, the surface position of the substrate (for example, positional information in a direction crossing the horizontal plane of the substrate surface) is measured in order to image the pattern formed on the mask at high resolution on the substrate, Is automatically positioned within the depth of focus of the projection optical system.

Here, in order to reliably perform the autofocus control, it is preferable to measure the surface position of the substrate with high accuracy.

U.S. Patent Application Publication No. 2010/0266961

According to a first aspect of the present invention, there is provided a mobile terminal comprising a first mobile body holding an object and being movable in a first direction, a second mobile body formed opposite to the first mobile body and movable in the first direction, A measurement system formed on one of the moving bodies of the first and second moving bodies, and a to-be-measured system formed on the other moving body, wherein the measurement system irradiates the measurement system with a measurement beam to measure the position of the first moving body in the up- Wherein the measuring unit is configured to move the second moving body in the first direction so as to face the first moving body with respect to the first moving body moved in the first direction, Is provided.

According to a second aspect of the present invention, there is provided a mobile terminal comprising a first mobile body holding an object and being movable in a first direction, a second mobile body formed opposite to the first mobile body and movable in the first direction, A measurement system formed on one of the moving bodies of the first and second moving bodies, and a to-be-measured system formed on the other moving body, wherein the measurement system irradiates the measurement system with a measurement beam to measure the position of the first moving body in the up- And a measuring unit for measuring a moving speed of the moving body.

According to a third aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: a step of forming a pattern for forming a predetermined pattern by using an energy beam on an object held by the first moving body, There is provided an exposure apparatus having a forming apparatus.

According to a fourth aspect of the present invention, there is provided a method of manufacturing a flat panel display including exposing the object using the exposure apparatus according to the third aspect, and developing the exposed object.

According to a fifth aspect of the present invention, there is provided a device manufacturing method comprising: exposing an object using an exposure apparatus according to the third aspect; and developing the exposed object.

According to a sixth aspect of the present invention, there is provided an apparatus for measuring an object to be measured (hereinafter, referred to as " object to be measured ") formed on one of a first movable body holding an object, a first movable body movable in a first direction, and a second movable body opposed to the first movable body, And a measurement system formed on the other of the first mobile body and the second mobile body irradiates a measurement beam with respect to the system and measuring the position of the first mobile body in a vertical direction, The second moving body moves in the first direction with respect to the first moving body so as to face the first moving body moved in the first direction, and the measurement is performed.

1 is a view schematically showing a configuration of a liquid crystal exposure apparatus according to the first embodiment.
2 is a sectional view taken along the line AA in Fig.
3 is a conceptual diagram of a substrate stage Z tilt position measuring system provided in the liquid crystal exposure apparatus of FIG.
4 is a block diagram showing an input / output relationship of a main controller that constitutes a control system of a liquid crystal exposure apparatus.
5 is a diagram for explaining the operation of the substrate stage apparatus and the substrate stage Z tilt position measuring system in the step operation.
6A and 6B are views (1 and 2) for explaining the operation of the substrate stage apparatus and the substrate stage Z tilt position measuring system in the exposure operation.
7 is a view (cross-sectional view) showing a liquid crystal exposure apparatus according to the second embodiment.
8 is a diagram for explaining the operation of the substrate stage Z tilt position measuring system in the second embodiment.
9 is a view (front view) showing a liquid crystal exposure apparatus according to the third embodiment.
10 is a conceptual diagram of the substrate stage Z tilt position measuring system in the third embodiment.
11 is a view (cross-sectional view) showing a liquid crystal exposure apparatus according to the third embodiment.
12 is a drawing (front view) showing a liquid crystal exposure apparatus according to the fourth embodiment.
13 is a conceptual diagram of a substrate position measuring system in the fourth embodiment.
14 is a view (cross-sectional view) showing a liquid crystal exposure apparatus according to the fifth embodiment.
15 is a conceptual diagram of a substrate position measuring system in the fifth embodiment.
Figs. 16A and 16B are diagrams (sectional views and plan views respectively) showing a substrate stage device according to the sixth embodiment. Fig.
Fig. 17 is a diagram showing irradiation points of the measurement beam on the encoder scale. Fig.

&Quot; First embodiment "

Hereinafter, the first embodiment will be described with reference to Figs. 1 to 6 (b).

Fig. 1 schematically shows the structure of a liquid crystal exposure apparatus 10 according to the first embodiment. The liquid crystal exposure apparatus 10 includes a step of forming a rectangular glass substrate P (hereinafter, simply referred to as a substrate P) used as a liquid crystal display (flat panel display) A projection exposure apparatus of the end scan type, a so-called scanner.

The liquid crystal exposure apparatus 10 includes a mask stage 14 for holding an illumination system 12, a mask M on which a pattern such as a circuit pattern is formed, a projection optical system 16, an apparatus main body 18, A substrate stage device 20 for holding a substrate P coated with a resist (sensitizer) on a surface facing the + Z side, and a control system thereof. Hereinafter, the direction in which the mask M and the substrate P are relatively scanned relative to the projection optical system 16 in the exposure is referred to as the X-axis direction, the direction orthogonal to the X-axis in the horizontal plane is referred to as the Y- And a direction orthogonal to the Y-axis is defined as a Z-axis direction. The rotation directions of the X-axis, Y-axis, and Z-axis rotations are described as? X,? Y, and? Z directions, respectively.

The illumination system 12 is constructed in the same manner as the illumination system disclosed in the specification of U.S. Patent No. 5,729,331. That is, the illumination system 12 irradiates light emitted from a light source (a mercury lamp or the like) (not shown) through a reflector, a dichroic mirror, a shutter, a wavelength selection filter, ) IL to the mask M. As the illumination light IL, light such as i-line (wavelength 365 nm), g-line (wavelength 436 nm) and h-line (wavelength 405 nm) do.

The mask stage 14 holds a mask M of a light transmission type. The main controller 50 (see Fig. 4) drives the mask stage 14 (i.e., the mask M) through the mask stage driving system 52 (see Fig. 4) (Long) strokes in the X-axis direction (scanning direction) with respect to the illumination light IL (illumination light IL), and is finely driven in the Y-axis direction and the? Z direction. The positional information in the horizontal plane of the mask stage 14 is obtained by a mask stage position measuring system 54 (see FIG. 4) including a laser interferometer.

The projection optical system 16 is disposed below the mask stage 14. The projection optical system 16 is a so-called multi-lens type projection optical system having the same configuration as that of the projection optical system disclosed in U.S. Patent No. 6,552,775, etc., and includes a plurality of telecentric optical systems . The optical axis AX of the illumination light IL projected from the projection optical system 16 onto the substrate P is parallel to the Z axis.

In the liquid crystal exposure apparatus 10, when the mask M positioned in a predetermined illumination area is illuminated by the illumination light IL from the illumination system 12, the illumination light IL passing through the mask M is projected A projection image (partial pattern image) of a pattern of the mask M in the illumination area is formed in the exposure area on the substrate P through the optical system 16. The substrate M is moved relative to the illumination area (illumination light IL) in the scanning direction and the substrate P is moved in the scanning direction with respect to the exposure area (illumination light IL) P is performed, and a pattern (entire pattern corresponding to the scanning range of the mask M) formed on the mask M is transferred to the shot area. Here, the illumination region on the mask M and the exposure region (illumination region of the illumination light) on the substrate P are optically conjugated with each other by the projection optical system 16.

The apparatus main body 18 is a portion for supporting the mask stage 14 and the projection optical system 16 and is provided on the floor F of the clean room through a plurality of dustproof devices 18. [ The apparatus main body 18 is constructed in the same manner as the apparatus main body disclosed in the specification of U.S. Patent Application Publication 2008/0030702 and the upper portion supporting the projection optical system 16 is a frame portion 18a A pair of lower portions is referred to as a base portion 18b (in Fig. 1, one side is not shown because it is overlapped in the direction of the ground, see Fig. 2), and a pair of middle portions And a leg portion 18c.

The substrate stage device 20 is a part for precisely positioning the substrate P with respect to the projection optical system 16 (illumination light IL) and has a horizontal plane (X axis direction and Y axis direction) Then, it is driven with a predetermined long stroke and is slightly driven in the six degrees of freedom direction. The configuration of the substrate stage device 20 is not particularly limited, but may be a two-dimensional coarse movement as disclosed in U.S. Patent Application Publication No. 2008/129762, U.S. Patent Application Publication No. 2012/0057140, It is preferable to use a stage device having a so-called coarse fine motion configuration including a stage and a fine moving stage which is slightly driven with respect to the two-dimensional coarse moving stage.

The substrate stage device 20 according to the first embodiment includes, as an example, a plurality of (three in this embodiment) base frames 22 (in Fig. 1, Stage having fine-tune construction including a Y coarse stage 24, an X coarse stage 26, a weight canceling device 28, a Y step guide 30, a fine movement stage 32, a substrate holder 36, Device.

The base frame 22 is formed of a member extending in the Y-axis direction and is provided on the floor F in a state of being vibrationally insulated from the apparatus main body 18. The three base frames 22 are arranged at predetermined intervals in the X-axis direction (see Fig. 2).

The Y coarsening stage 24 is placed on three base frames 22 as shown in Fig. The Y coarse movement stage 24 includes three Y carriages 24a corresponding to the base frame 22 and one set of two Y carriages 24a mounted on the three Y carriages 24a (See Fig. 1). The Y coarse movement stage 24 is driven by a plurality of Y actuators 24c which are a part of a substrate stage drive system 56 (not shown in FIG. 2, see FIG. 4) for driving the substrate P in the six degrees of freedom direction And is driven on the three base frames 22 in the Y-axis direction by a predetermined long stroke. The Y coarse movement stage 24 is linearly guided in the Y-axis direction through a linear guide device 24d disposed between the Y coarse movement stage 24 and the base frame 22.

Returning to Fig. 1, the X coarse movement stage 26 is placed on a pair of X beams 24b. The X coarse movement stage 26 is formed of a quadrangular plate-like member when viewed in a plan view (when viewed in the + Z direction), and has an opening at its center. The X coarse movement stage 26 is driven on the Y coarse movement stage 24 in a predetermined long stroke in the X axis direction through a plurality of X actuators 26a that are part of the substrate stage drive system 56 (see FIG. 4). The X coarse movement stage 26 is linearly guided in the X-axis direction through the linear guide device 26b disposed between the X coarse movement stage 24 and the Y coarse movement stage 24. 2 is a diagram showing a state in which the X coarse movement stage 26 is located at the stroke end on the + X side. The X coarse movement stage 26 is mechanically limited in relative movement with respect to the Y coarse movement stage 24 in the Y axis direction by the linear guide device 26b and is moved integrally with the Y coarse movement stage 24 In the Y-axis direction. A linear motor, a feed screw (ball screw) device, or the like can be used as the Y actuator 24c (see FIG. 2) and the X actuator 26a (see FIG. 1) of the substrate stage driving system 56 described above.

As shown in Fig. 2, the weight canceling device 28 is inserted into an opening portion formed in the X coarse movement stage 26. As shown in Fig. The weight canceling device 28 is also called a core column and supports the weight of the system including the fine movement stage 32 and the substrate holder 36 from below. Details of the weight canceling device 28 are disclosed in the specification of U.S. Patent Application Publication No. 2010/0018950, and a description thereof will be omitted. The weight canceling device 28 is mechanically connected to the X coarse movement stage 26 through a plurality of connection devices 28a (also referred to as a flexure device) and is attracted to the X coarse movement stage 26, And moves along the XY plane integrally with the coarse movement stage 26.

The Y step guide 30 is a part functioning as a base when the weight canceling device 28 moves. The Y step guide 30 is formed of a member extending in the X axis direction and a pair of lower portions of the apparatus main body 18 is placed on the base portion 18b through a plurality of linear guide devices 30a . The Y step guide 30 is inserted between a pair of X beams 24b of the Y coarse movement stage 24 (see FIG. 1), and the Y coarse movement stage 24 is provided with a plurality of connecting devices 30b (Not shown in Fig. 2, see Fig. 1). Thus, the Y step guide 30 moves in the Y axis direction in a predetermined long stroke integrally with the Y coarse movement stage 24. [ The weight canceling device 28 is placed on the Y step guide 30 through the air bearing 28b in a noncontact state and the X coarse movement stage 28 moves only in the X axis direction on the Y coarse movement stage 24 The Y step guide 30 is moved in the X axis direction and the X coarse movement stage 26 is moved in the Y axis direction integrally with the Y coarse movement stage 24 The Y step guide 30 is moved in the Y axis direction integrally with the Y step guide 30 (so as not to fall off from the Y step guide 30).

The fine motion stage 32 is made of a quadrangular plate-like (or box-like) member when viewed from the top and is movable in the central portion through a spherical bearing device 34 so as to be freely swung (tilted) State (in a state in which it can move relative to each other along the XY plane) from underneath to the weight canceling device 28. [ A substrate holder 36 is fixed on the upper surface of the fine movement stage 32 and the substrate P is placed on the substrate holder 36. [ The substrate holder 36 is formed in the shape of a quadrangular plate when seen in plan view, and holds the substrate P by vacuum suction.

The fine motion stage 32 is a part of the substrate stage drive system 56 (not shown in Figs. 1 and 2, see Fig. 4), and the stator of the X coarse motion stage 26 and the fine motion stage 32 Is slightly driven in the six degrees of freedom direction with respect to the X coarse movement stage 26 by the main controller 50 (see Fig. 4) through a plurality of linear motors including mover. A plurality of linear motors include a plurality of X voice coil motors 56x (not shown in Fig. 1), Y voice coil motors 56y (not shown in Fig. 2), and Z voice coil motors 56z do. When the X coarse movement stage 26 moves along the XY plane in the long stroke, the main controller 50 moves the fine movement stage 32 and the X coarse movement stage 26 integrally along the XY plane to the long stroke The thrust is imparted to the fine motion stage 32 by the plurality of linear motors. The configuration (including the measurement system) of the substrate stage device 20 including the substrate stage driving system 56 described above is disclosed in U.S. Patent Application Publication No. 2012/0057140 and the like.

As shown in Fig. 4, the position measuring system of the fine movement stage 32 (that is, the substrate P) includes a substrate stage horizontal surface (hereinafter referred to as " substrate stage " (Hereinafter referred to as " in-plane position measurement system 58 "), position information in the direction crossing the horizontal plane of the substrate (position information in the Z-axis direction, (Hereinafter referred to as "Z tilt position measuring system 70") for obtaining a substrate position Z tilt position information (hereinafter referred to as "Z tilt position information").

A bar mirror (a Y-bar mirror extending parallel to the X-axis and a Y-bar mirror, not shown) fixed to the fine movement stage 32 or the substrate holder 36 An X-bar mirror extending in parallel to the Y-axis), or the like can be used. Details of the position measuring system using the optical interferometer system are disclosed in U.S. Patent Application Publication No. 2010/0018950 and the like, and a description thereof will be omitted.

The Z tilt position measuring system 70 has a pair of head units (head units 72a and 72b) as shown in Fig. One of the head units 72a is disposed on the + Y side of the projection optical system 16 and the other head unit 72b is disposed on the -Y side of the projection optical system 16 (see FIG. 2). The head units 72a and 72b are substantially the same apparatus, except that their positions are different.

The head units 72a and 72b measure Z tilt position information of the substrate P by using a pair of targets 38 (target members) included in the substrate stage device 20. One of the pair of targets 38 is arranged on the + Y side of the substrate holder 36, and the other is arranged on the -Y side of the substrate holder 36. The intervals in the Y-axis direction of the pair of targets 38 are set to be substantially the same as the intervals in the Y-axis direction of the above-described head units 72a and 72b.

As can be seen from Figs. 1 and 2, the target 38 is formed of a plate-shaped (belt-like) member extending in the X-axis direction and parallel to the XY plane. The upper surface of the target 38 is a reflecting surface. As the target 38, a plane mirror or the like can be used. The length of the target 38 in the X axis direction is set to be longer than the length of the substrate holder 36 (and the substrate P) in the X axis direction. In the present embodiment, Is set to be about 1.1 to 2 times as long as the length. Further, the length of the target 38 may be shorter than the length of the substrate holder 36 in the X-axis direction. For example, a plurality of targets 38 shorter than the length of the substrate holder 36 in the X-axis direction may be formed corresponding to the position and timing for measuring the z-tilt position information.

The target 38 is positioned on the side surface of the substrate holder 36 so that the height position of the upper surface thereof (position in the Z axis direction) is substantially equal to the height position of the surface of the substrate P placed on the substrate holder 36 Through a bracket 38a. Therefore, when the substrate holder 36 is driven in the direction of intersecting the horizontal plane (the direction of the optical axis AX) and the inclination direction with respect to the horizontal plane, And moves in a direction intersecting with the horizontal plane integrally. Thus, a change in the posture of the substrate P placed on the substrate holder 36 is reflected on the upper surface (reflecting surface) of the target 38. 1 and 2, the target 38 is mounted on the side surface of the substrate holder 36. However, if the target 38 can reflect a change in the posture of the substrate P, But may be fixed to the fine movement stage 32 or directly mounted on the upper surface of the substrate holder 36. [ The z-tilt position information may be measured using the upper surface of at least a part of the substrate holder 36, the fine movement stage 32, the substrate P, etc. as the target 38. That is, the upper surface of at least a part of the substrate holder 36, the fine movement stage 32, the substrate P, etc. may function equivalently to the target 38. Accordingly, since the target 38 is not required to be formed, the configuration of the substrate stage device 20 can be simplified.

Next, the head units 72a and 72b will be described. 1, the head unit 72a is fixed to the projection optical system 16 (and the apparatus main body 18) in the Y-axis direction by a Y linear actuator 74 and the Y linear actuator 74 A Y-slider 76 driven by a stroke of the Y-slider 76, and a pair of sensor heads 78 fixed to the Y-slider 76 (in FIG. 1, the ground surface is overlapped with the direction shown in FIG. The head unit 72b is also the same.

The Y linear actuator 74 (drive mechanism) is fixed to the lower surface of the base portion 18a of the apparatus main body 18. The Y linear actuator 74 includes a linear guide for guiding the Y slider 76 in the Y axis direction and a drive system for applying thrust to the Y slider 76. [ The type of the linear guide is not particularly limited, but an air bearing with high repeatability is suitable. The type of the driving system is not particularly limited, and a linear motor, a belt (or wire) driving device, or the like can be used.

The Y linear actuator 74 is controlled by the main controller 50 (see Fig. 4). The main control device 50 determines whether or not the moving direction, the moving amount and the moving speed of the Y slider 76 in the Y-axis direction are equal to or greater than the moving direction of the substrate P (fine moving stage 32) in the Y- And controls the Y linear actuator 74 so as to be almost equal to the moving speed. Although not shown in Figs. 1 and 2, the main controller 50 is configured to move the Y-slider 76 to the main body 18 of the Y slider 76 (that is, Optical system 16). The Y slider position measuring system 80 may be a measuring system such as a linear encoder system or may be based on an input signal to the Y linear actuator 74 or the like.

The pair of sensor heads 78 are mounted on the lower surface of the Y-slider 76 in the X-axis direction (see FIG. 2). As shown in Fig. 3, the pair of sensor heads 78 are disposed facing the target 38 in the downward direction (-Z direction). In this embodiment, a laser displacement gauge is used as an example of the sensor head 78, but the type of the sensor head 78 is the same as that of the target 38 (refer to Fig. 1) And is not particularly limited as long as the displacement in the Z-axis direction can be measured with a desired accuracy (resolution) and in a noncontact manner.

Since the pair of sensor heads 78 of each of the head units 72a and 72b are spaced apart in the X axis direction, the main controller 50 (see Fig. 4) (Displacement amount) information of the corresponding target 38 in the Z-axis direction based on the average value of the output of the pair of sensor heads 78 and 78, The inclination amount information in the? Y direction can be obtained. Since the head units 72a and 72b (and the corresponding target 38) are spaced apart in the Y-axis direction, the main controller 50 is provided on the same straight line of the head units 72a and 72b The inclination amount information in the? X direction of the substrate holder 36 (see Fig. 1) can be obtained based on the outputs of the four sensor heads 78 in total. Further, in the case of obtaining the position (displacement amount) information of the target 38 in the Z-axis direction, it may be obtained based on the output of one sensor head of the pair of sensor heads 78. [

Fig. 4 is a block diagram showing the input / output relationship of the main controller device 50 that mainly controls the control system of the liquid crystal exposure apparatus 10 (see Fig. 1) and performs overall control of the respective constituent elements. The main controller 50 includes a work station (or a microcomputer) and controls the components of the liquid crystal exposure apparatus 10 as a whole.

In the liquid crystal exposure apparatus 10 (refer to Fig. 1) configured as described above, the mask stage 14 is moved by the mask loader (not shown) under the control of the main controller 50 The loading of the mask M is carried out and the loading of the substrate P onto the substrate stage device 20 (substrate holder 36) is carried out by a substrate loader (not shown). Thereafter, alignment measurement is performed using an alignment detection system (not shown) by the main controller 50. After completion of the alignment measurement, a plurality of shot areas set on the substrate P are sequentially subjected to a step- A scanning type exposure operation is performed.

The main controller 50 (refer to Fig. 4) in the scan exposure operation is capable of detecting the illumination light IL (see Fig. 4) on the substrate P based on the output of the Z tilt position measuring system 70 Tilt direction positioning control (so-called autofocus) of the substrate P so that the irradiation region (exposure region) of the projection optical system 16 (see FIG. 1) (see FIG. 1) is automatically positioned within the focal depth of the projection optical system 16 Control). As a Z tilt position measuring system of the substrate P, a measuring system (a known autofocus sensor) of a method of directly measuring the surface position information of the substrate P in the vicinity of the exposure area is referred to as Z It may be used in combination with the tilt position measuring system 70.

5 and 6 (a), the main controller 50 (see FIG. 4) performs a series of step-and- (The substrate holder 36) is moved in the Y-axis direction (see the + Y direction and the white arrow in FIGS. 5 and 6A) The Y slider 76 of each of the head units 72a and 72b is driven in the Y axis direction (see the black arrows in Figs. 5 and 6A) so that the measurement light does not deviate from the corresponding target 38). Thus, Z tilt position information of the substrate P can be obtained regardless of the Y position of the substrate P. At this time, the width of the target 38 in the Y-axis direction is set to be sufficiently wider than the measurement point on the target 38 of the sensor head 78, so that the sensor head 78 and the substrate holder 36 , The positions in the Y-axis direction need not be synchronized exactly.

On the other hand, as shown in Fig. 6 (b), in order to perform a scan exposure operation in a series of step-and-scan type exposure operations, the substrate P (substrate holder 36) (See FIG. 6), the main controller 50 (see FIG. 4) moves the Y slider 76 of each of the head units 72a and 72b in the stopped state The sensor head 78 and the corresponding target 38 are opposed to each other) to obtain the Z tilt position information of the substrate P. [ Further, when there is a possibility that it is difficult to ensure the flatness of the surface of the target 38 and the straight running accuracy of the Y slider 76, correction information is obtained by performing measurement in advance in the plan view and the straight running accuracy , And the output of the sensor head 78 may be corrected by the correction information at the time of actual measurement of the Z-tilt position information.

The z-tilt position measuring system 70 according to the first embodiment described above directly measures changes in attitude of the substrate holder 36 holding the substrate P with reference to the apparatus main body 18, Z tilt position information of the substrate P can be obtained with high accuracy. It is also conceivable to mount the measurement sensor on the substrate holder 36 and determine the change in attitude of the substrate holder 36 with reference to the weight canceling device 28 (i.e., the Y step guide 30) Since the apparatus 28 (and the Y step guide 30) is configured to move along the XY plane, there is a possibility that the measurement accuracy is lowered. On the other hand, in the Z tilt position measuring system 70 of the present embodiment, since the upper portion on which the projection optical system 16 is mounted is the base portion 18a as a reference, irrespective of the operation of the substrate stage device 20, The change in attitude of the substrate P can be measured.

2, the Z-tilt position measuring system (autofocus sensor) of the system for directly measuring the surface position information of the substrate P in the vicinity of the above-described exposure area has a structure in which the substrate holder 36 is X The Z-tilt position information of the substrate P can not be obtained because the substrate P is not positioned below the projection optical system 16 in the case where it is located at the stroke end with respect to the axial direction. However, By using the measuring system 70, Z tilt position information of the substrate P can be obtained regardless of the position of the substrate holder 36 in the X-axis direction.

&Quot; Second Embodiment &

Next, the liquid crystal exposure apparatus according to the second embodiment will be described with reference to Figs. 7 and 8. Fig. The configuration of the liquid crystal exposure apparatus according to the second embodiment is the same as that of the first embodiment except that the configuration of the measuring system for obtaining Z tilt position information of the substrate P differs, And the elements having the same configurations and functions as those of the first embodiment are denoted by the same reference numerals as those of the first embodiment, and the description thereof is omitted.

(Head units 72a and 72b) are provided on the + Y side and the -Y side of the projection optical system 16 in the Z tilt position measuring system 70 (see FIG. 6A and the like) The Z tilt position measuring system 170 according to the second embodiment is provided with two head units 172a and 172c on the + Y side of the projection optical system 16, as shown in Fig. 8, And two head units 172b and 172d are disposed on the -Y side of the projection optical system 16 as well. That is, in the first embodiment, the main controller 55 (see Fig. 4) is provided with the head units 72a and 72b (i.e., four sensor heads 78 in total) Z tilt position information of the substrate P is appropriately used by using four head units 172a to 172d (i.e., a total of eight sensor heads 78) in the second embodiment, . The configurations of the head units 172a to 172d are the same as those of the head units 72a and 72b of the first embodiment, and the description is omitted.

2 and 6A, the X position of the two head units 72a and 72b is substantially the same as the X position of the projection optical system 16 in the first embodiment 8, the two head units 172a and 172c on the + Y side of the projection optical system 16 are arranged so that one side (the head unit 172a) X side of the projection optical system 16 and the other side (the head unit 172c) is disposed on the -X side of the projection optical system 16 (i.e., on the front side and the back side in the scanning direction). The two head units 172b and 172d on the -Y side of the projection optical system 16 are also the same. As described above, in the second embodiment, four head units 172a to 172d are arranged around the projection optical system 16. The target 138 having the reflecting surface extending in the X-axis direction is fixed to the substrate holder 36 via the bracket 138a in the same manner as in the first embodiment. The dimension of the target 138 in the X-axis direction is shorter than that of the first embodiment.

The operation of each of the head units 172a to 172d in the scanning exposure operation of the second embodiment is substantially the same as that of the first embodiment, and therefore, the description thereof is omitted. That is, the main controller 50 (see Fig. 4) is arranged to move the head units 172a-172d in synchronization with the movement of the substrate holder 36 (substrate P) in the Y-axis direction (The head unit 172a and the head unit 172b) of the four head units 172a to 172d while moving the Y slider 76 of the head units 172a to 172d in the Y axis direction Tilt position information of the substrate P is obtained on the basis of the output of the sensor head 78 included in the head unit 172a or head unit 172c or the head unit 172d or all the head units 172a to 172d.

The Z tilt position measuring system 170 according to the second embodiment described above has two head units 172a and 172b separated from each other in the Y axis direction on the + X side and the -X side of the projection optical system 16, 172b and the head units 172c, 172d) are disposed, the detection area in the X-axis direction is longer than in the first embodiment. Therefore, as shown in Fig. 7, the length of the target 138 in the X-axis direction can be shortened as compared with the first embodiment (see Fig. 2). Accordingly, since the fine movement stage 32 can be made lightweight, the position controllability of the substrate P is improved.

&Quot; Third Embodiment &

Next, a liquid crystal exposure apparatus according to the third embodiment will be described with reference to Figs. 9 to 11. Fig. The configuration of the liquid crystal exposure apparatus according to the third embodiment is the same as that of the first or second embodiment except that the configuration of the measuring system for obtaining Z tilt position information of the substrate P differs. Only the differences are described, and elements having the same configurations and functions as those of the first or second embodiment are denoted by the same reference numerals as those of the first or second embodiment, and the description thereof will be omitted.

The z-tilt position measuring system 270 of the third embodiment determines whether or not the tilt amount information on the horizontal plane (XY plane) of the Y-slider 76 having the sensor head 78 is greater than the tilt amount information of the main controller 50 ) Is different from the first and second embodiments. The main control device 50 controls the substrate P based on the output of the sensor head 78 and the tilt amount information of the Y slider 76 at the time of outputting (i.e., correcting the slope of the Y slider 76) The Z-tilt position information is obtained.

In the third embodiment, four head units 272a to 272d are arranged in the same arrangement as that of the second embodiment (i.e., around the projection optical system 16) (Figs. 9 and 11 Reference). The configuration of the four head units 272a to 272d is substantially the same except that the arrangement is different. Further, the present invention is not limited to this, and the two head units may be arranged in the same arrangement as the first embodiment (i.e., at the same X position as the projection optical system 16). In this case, similarly to the first embodiment, a target 38 (see Fig. 2, etc.) having a longer dimension in the X-axis direction than the target 138 is used.

10, the head unit 272a (the same applies to the head units 272b to 272d) also irradiates measurement light (in the -Z direction) to the target 138 similarly to the second embodiment And a pair of sensor heads 78 (downward heads) separated in the X-axis direction. The method of obtaining Z tilt position information of the substrate P using a pair of (eight in total, eight) sensor heads 78 included in each of the four head units 272a to 272d is similar to that of the second embodiment The description is omitted.

Here, in the head unit 272a, the Y slider 76 (not shown in Fig. 10, see Fig. 9) on which the sensor head 78 is mounted is linearly guided in the Y-axis direction by the linear guide device There is a possibility that a gradient and a Z displacement occur in the sensor head 78 (the optical axis of the measurement light with respect to the corresponding target 138). Thus, the main controller 50 (refer to Fig. 4) uses four sensor heads 278 (upward head) mounted on the Y slider 76 to adjust the inclination (fallen amount) of the Y slider 76 (Including the information on the amount of displacement in the direction of the optical axis) and to eliminate the inclination of the Y slider 76 (deviation of the optical axis of the measurement light) Based on the output of the sensor heads 278. In the fourth embodiment, four sensor heads 278 (upward head) are disposed at four points that are not on the same straight line. However, the present invention is not limited to this, and three sensor heads 278 , But may be disposed at three points that are not on the same straight line.

In this embodiment, the same laser displacement gauge as the sensor head 78 is used as the sensor head 278 (upward sensor) as an example, and the upper portion is fixed to the lower surface of the boss portion 18a (see Figs. 9 and 11) The information about the tilt amount of the Y slider 76 is obtained by using the target 280 extending in the Y-axis direction (that is, with respect to the upper portion 18a). The kind of the sensor head 278 is not particularly limited as long as information on the tilt amount of the Y slider 76 can be obtained with desired accuracy.

According to the third embodiment described above, Z tilt information of the substrate P can be obtained with higher accuracy. Further, since the output of the sensor head 78 (downward head) is corrected, the straight guidance accuracy of the Y slider 76 may be rough compared to the first and second embodiments.

&Quot; Fourth Embodiment &

Next, the liquid crystal exposure apparatus according to the fourth embodiment will be described with reference to Figs. 12 and 13. Fig. As shown in Fig. 12, the Z tilt position measuring system 370 according to the fourth embodiment includes a head unit 372a disposed on the + Y side of the projection optical system 16, And a head unit 372b on the -Y side of the projection optical system 16. [ The substrate holder 36 is provided with a pair of targets 338 corresponding to the head units 372a and 372b. The length of the target 338 in the X-axis direction is the same as in the first embodiment.

13, the head unit 372a includes a pair of sensor heads (not shown) for obtaining Z tilt position information of the substrate P (see Fig. 12) similarly to the third embodiment 78 (downward head) and four sensor heads 278 (upward head) for measuring the tilt amount information of the pair of sensor heads 78. The order of obtaining the z-tilt position information of the substrate P using the sensor heads 78 and 278 is the same as that of the third embodiment, and thus the description thereof is omitted.

The liquid crystal exposure apparatus of the fourth embodiment has an encoder system as an in-plane position measuring system 58 (see FIG. 4), which is a measuring system for obtaining positional information in the horizontal plane of the substrate P. Hereinafter, the encoder system will be described with respect to the third embodiment, and elements having the same configurations and functions as those of the first to third embodiments will be denoted by the same reference numerals as those of the first to third embodiments, The description will be omitted.

12, the head unit 372a includes a Y linear actuator 74, a Y slider (not shown) driven with a predetermined stroke in the Y axis direction with respect to the projection optical system 16 by the Y linear actuator 74 76), and a plurality of measuring heads (details of which will be described later) fixed to the Y-slider 76. [ The head unit 372b is also the same. The configuration and function of the Y linear actuator 74 and the Y slider 76 are the same as those of the Y linear actuator 74 and the Y slider 76 of the head unit 72a (see Fig. 1) The description is omitted.

13, the head unit 372a includes two X encoder heads 384x (downward X heads), two Y encoder heads 384y (downward Y heads) as part of the plurality of measurement heads, Two X encoder heads 386x (upward X heads), and two Y encoder heads 386y (upward Y heads). As described above, the head unit 372a includes a pair of sensor heads 78 (downward Z heads) and four sensor heads 278 (upward Z heads ). Each of the heads 384x, 384y, 386x, 386y, 78, and 278 described above is fixed to the Y slider 76 (see FIG. 12). The head unit 372b is also configured similarly, except that it is configured to be symmetrical in the left-right direction in FIG. In addition, the pair of targets 338 are also configured symmetrically in Fig.

Here, in the fourth embodiment, a plurality of scale plates 340 are mounted on the upper surface of the target 338. The scale plate 340 is formed of a strip-like member when viewed in a plane extending in the X-axis direction, and is adhered to the upper surface of the target 338. The length of the scale plate 340 in the X-axis direction is shorter than the length of the target 338 in the X-axis direction and the plurality of scale plates 340 are arrayed (spaced apart from each other) . The scale plate 340 is not pasted to the belt-like region including the vicinity of the end on the -Y side in the upper surface of the target 338, and the belt- And functions as a reflecting surface for measuring the Z tilt position of the substrate P, similarly to the first to third embodiments, opposite to the pair of sensor heads 78 (downward Z head). The Z-tilt position measurement of the substrate P may be performed with the upper surface of the plurality of scale plates 340 as a reflection surface. Thus, since it is not necessary to form the band-shaped region, the configuration of the target 338 can be simplified.

In the scale plate 340, an X scale 342x and a Y scale 342y are formed. The X scale 342x is formed in the half of the -Y side of the scale plate 340 and the Y scale 342y is formed in the half of the + Y side of the scale plate 340. [ The X scale 342x has a reflection type X diffraction grating and the Y scale 342y has a reflection type Y diffraction grating. 13, in order to facilitate understanding, the scale plate 340 is shown thicker than the actual size, and the interval (pitch) between a plurality of grid lines forming the X scale 342x and the Y scale 342y is , And is shown wider than actual.

The two X encoder heads 384x irradiate the measurement light with respect to the X scale 342x in a state in which they are disposed opposite to the X scale 342x. The main controller 50 (see Fig. 4) is configured to move the X-encoder head 384x on the basis of the light from the X-scale 342x along with the movement of the substrate P According to the output, displacement amount information on the substrate P in the X-axis direction is obtained. The two Y encoder heads 384y are similarly disposed opposite to the Y scale 342y and the main controller 50 moves in the Y axis direction of the substrate P in accordance with the output of the Y encoder head 384y Is obtained. The main control device 50 also controls the rotation of the substrate P in the? Z direction based on the output of the X encoder head 384x of each of the head unit 372a and the head unit 372b .

Here, the intervals in the X-axis direction of the two X encoder heads 384x and Y encoder heads 384y are set wider than the interval between the adjacent scale plates 340. [ Thus, at least one of the two X encoder heads 384x and Y encoder heads 384y always faces the scale plate 340, regardless of the X position of the substrate P (see Fig. 12). Thus, the main controller 50 (see Fig. 4) determines the position information of the substrate P based on the average value of one or two encoder heads 384x and 384y of the two encoder heads 384x and 384y Can be obtained. In the present embodiment, a plurality of scale plates 340 are arranged at predetermined intervals in the X-axis direction, but the present invention is not limited to this, and the length of the scale plates 340 in the X- A scale plate may be used. In this case, the encoder heads (the downward X head 384x and the downward Y head 384y) for obtaining the positional information in the horizontal plane of the substrate P are respectively formed one for each of the head units 372a and 372b .

With respect to the in-plane position measuring system 58, the X encoder head 384x and the Y encoder head 384y (the headsets on the + X direction side are referred to as " Is moved from the first scale plate 340 to the second scale plate 340 (the scale plate 340 adjacent to the first scale plate) of the scale plate 340 to measure the second scale plate 340 The position information on the X-axis direction of the substrate P can be measured immediately after the head set on the + X direction side becomes the state in which the measurement operation can be performed using the second scale plate 340, but the + X direction side The output of the head set of the substrate P can not be used for calculating the X position information of the substrate P since the count is resumed from the negative value (or zero). Therefore, in this state, connection processing of each output of the head set on the + X direction side is required. Concretely speaking, the output of the head set on the + X direction side, which is a negative value (or zero), is output to the X encoder head 384x and the Y encoder 380x formed on the -X direction side with respect to the scale plate 380 A process of correcting (making the same value) using the output of the head 384y (called a head set on the -X direction side) is performed. The connection processing is completed before the head set on the -X direction side becomes outside the measurement range of the first scale.

Likewise, when the head set on the -X direction side is out of the measurement range of the first scale plate 340, the output of the head set on the -X direction side is invalidated before it comes out of the measurement range. Therefore, the X position information of the substrate P is obtained based on the output of the head set on the + X direction side. Immediately after each of the head sets on the -X direction side can perform the measurement operation using the second scale plate 340, Perform connection processing using output.

The above-described connection processing is premised on that the positional relationship between the four heads (the head set on the + X direction side and the head set on the -X direction side) is already known. The positional relationship between the heads can be determined by using the scale with the four heads facing a common scale or by using a measuring device (laser interferometer, distance sensor, etc.) arranged between the heads It is possible. This connection processing may be performed for the upward X head 386x and the Y head 386y or for the downward Z head 78 and the upward Z head 278. [

The main control device 50 (see Fig. 4), similar to the first to third embodiments described above, moves along the Y-axis direction of the substrate P (see Fig. 12) (See FIG. 12) in the Y-axis direction in synchronization with the substrate P. Here, in the in-plane position measuring system 58 of the present embodiment, the position information of the substrate P is obtained on the basis of the outputs of the X encoder head 384x and the Y encoder head 384y of the Y slider 76 It is necessary to measure displacement amount information in the Y-axis direction of the Y slider 76 itself to the same degree of precision as that of the substrate P. Therefore, the in-plane position measurement system 58 of this embodiment is a Y-slider position measurement system 80 (see Fig. 4), in which the scale plate fixed to the lower surface of the upper portion 18a (380) is used to obtain the displacement of the Y slider (76).

The scale plate 380 is formed of a plate-shaped member extending in the Y-axis direction, and on the lower surface thereof, an X-scale 382x and a Y-scale 382y are formed similarly to the above-described scale plate 340 . Two X encoder heads 386x are mounted apart from each other in the Y axis direction against the X scale 382x and a plurality of X encoder heads 386x are mounted opposite to the Y scale 382y in the Y slider 76 , And two Y encoder heads 386y are mounted apart from each other in the Y axis direction. The scale plate 380 also faces the four sensor heads 278 (upward Z head), and the sensor head 278 is used to detect the inclination of the Y slider 76 (Reflecting surface).

4) moves the Y slider 76 in the Y-axis direction in synchronization with the substrate P when the substrate P (see Fig. 12) is moved in the Y-axis direction . The main controller 50 obtains the positional information of the Y slider 76 in the XY plane at this time based on the outputs of the two X encoder heads 386x and two Y encoder heads 386y, Position information in the XY plane of the substrate P is obtained on the basis of the position information of the XY plane 76 and the outputs of the two X encoder heads 384x and Y encoder heads 384y mounted on the Y slider 76 . In this way, the in-plane position measuring system 58 of the present embodiment is able to measure the position information in the horizontal plane of the substrate P indirectly with reference to the apparatus main body 18 via the Y slider 76 by the encoder system I ask.

According to the fourth embodiment described above, since the position information of the substrate P in the XY plane is obtained by the encoder system, the influence of air blurring or the like can be reduced as compared with the optical interferometer system, and the measurement accuracy is improved. The encoder system according to the present embodiment has a need to prepare a wide scale plate covering the entire movement range of the substrate P in the XY plane since the head moves following the movement of the substrate P in the Y- There is no.

Although the position information in the XY plane of each of the substrate P and the Y slider 76 is obtained by the X encoder heads 384x and 386x and the Y encoder heads 384y and 386y in the fourth embodiment The position information in the XY plane of each of the substrate P and the Y slider 76 as well as the position information in the XY plane of the substrate P and the Y slider 76 are measured by using a two-dimensional encoder head (XZ encoder head or YZ encoder head) capable of measuring displacement amount information in the Z- And the Y-slider 76 may be obtained. In this case, it is possible to omit the sensor heads 78 and 278 for obtaining Z tilt position information of the substrate P. In this case, in order to obtain Z tilt position information of the substrate P, it is necessary to always face two downward Z heads facing the scale plate 340, so that the scale plate 340 is placed in the same position as the target 338 Or two or more of the two-dimensional encoder heads are arranged at a predetermined interval in the X-axis direction.

In the fourth embodiment, on the upper surface of the target 338, there are provided a scale plate 340 used for obtaining positional information in the XY plane of the substrate P, a scale plate 340 used for measuring the Z tilt position of the substrate P (Area in which the scale plate 340 is not pasted) is formed on the side surface of the scale plate 340. The connection processing performed when the X encoder head 384x and the Y encoder head 384y extend between the scale plates 340 , And the sensor head 78 (downward Z head) need not be performed. Thus, the Z tilt position measurement can be simply performed. When the Z-tilt position measurement of the substrate P is performed with the upper surface of the plurality of scale plates 340 as a reflection surface, the sensor head 78 (downward Z head) may be subjected to connection processing . In this case, since it is not necessary to form the band-shaped region, the configuration of the target 338 can be simplified.

As described above, in the Y stage operation of the substrate holder 36, for example, two Y sliders 76 are provided in the substrate stage device 20 in synchronization with the substrate holder 36 And is driven in the Y-axis direction. 4) drives the substrate holder 36 to the target position in the Y-axis direction based on the output of the encoder system, while the Y-slider position measuring system 80 . Here, the Y slider 76 is driven in the Y-axis direction based on the output of the encoder system). At this time, the main controller 50 drives the Y slider 76 and the substrate holder 36 in synchronism with each other (so that the Y slider 76 follows the substrate holder 36). The main control device 50 controls the position of the Y slider 76 in the range in which at least one of the heads 384x and 384y does not deviate from the scale plate 340 Control is performed.

Thus, each of the measurement beams irradiated from the X head 384x, the Y head 384y (see Fig. 13, respectively), regardless of the Y position of the substrate holder 36 (including during the movement of the substrate holder 36) , The X scale 342x, and the Y scale 342y (see Fig. 13, respectively). In other words, when each of the measurement beams irradiated from the X head 384x and the Y head 384y is in the X-scale 342x, the Y-scale 342y, and the Y-axis 342x while moving the substrate holder 36 in the Y- The two Y sliders 76 and the Y head 384y are arranged in such a manner that the measurement by the measurement beam from the X head 384x and the Y head 384y is not interrupted (measurement can be continued) The substrate holder 36 may be moved in the Y-axis direction synchronously.

At this time, before the substrate holder 36 moves in the step direction (Y axis direction), the Y slider 76 (X heads 384x and 386x) and the Y heads 384y and 386y are moved to the substrate holder 36 It may start to move in the step direction in advance. Thus, the acceleration of each head can be suppressed, and the inclination of each head during movement (inclining toward forward direction) can be suppressed. Alternatively, the Y slider 76 may start to move later than the substrate holder 36 in the step direction instead.

When the Y step operation of the substrate holder 36 is completed, the mask M (see FIG. 1) is driven in the -X direction based on the output of the mask stage position measuring system 54 (see FIG. 4) , The substrate holder 36 is driven in the -X direction on the basis of the output of the position measuring system in the horizontal plane of the substrate stage (refer to FIG. 4, here encoder system) in synchronization with the mask M, The mask pattern is transferred to the region. At this time, for example, two Y sliders 76 are in a stopped state. In the liquid crystal exposure apparatus 10, by appropriately repeating the scanning operation of the mask M, the Y step operation of the substrate holder 36, and the scanning operation of the substrate holder 36, The mask pattern is sequentially transferred. In the exposure operation, for example, two Y sliders 76 are arranged in the + Y direction and the -Y direction (the Y direction) so that the substrate holder 36 opposes the target 338 (the scale plate 340) The substrate holder 36 is driven by the same distance in the same direction as that of the substrate holder 36.

Here, as described above, the Y scale 342y has a plurality of grid lines extending in the X axis direction. 17, the irradiation point 384y of the measurement beam irradiated onto the Y scale 342y from the Y head 384y (the same reference numerals as those of the Y head will be described for the sake of simplicity) In the longitudinal direction. In the encoder system, when the Y head 384y and the Y-scale 342y move relative to each other in the Y-axis direction and the measurement beam crosses the lattice line, based on the phase change of the + 1st-order diffracted light from the irradiation point, 384y change.

12) when driving the substrate holder 36 in the scanning direction (X-axis direction) during the scan exposure operation, while the main controller 50 (see Fig. 4) So that the measurement beam from the Y head 384y of the Y head 384y does not spread across a plurality of grid lines forming the Y scale 342y, that is, the output of the Y head 384y does not change (the change is zero) (Y position) of the Y slider 76 in the step direction.

More specifically, for example, the Y position of the Y head 384y is measured by a sensor having a higher resolution than the pitch between the lattice lines constituting the Y scale 342y, and the Y position of the measurement beam from the Y head 384y is measured The Y position of the Y head 384y is controlled via the Y linear actuator 74 (see FIG. 12) immediately before the irradiation point is placed on the grid line (the output of the Y head 384y changes). For example, when the output of the Y head 384y changes due to the measurement beam from the Y head 384y straddling the lattice line, the Y head 384y, So that the output from the Y head 384y can be substantially prevented from changing. In this case, a sensor for measuring the Y position of the Y head 384y is unnecessary.

&Quot; Fifth Embodiment &

Next, a liquid crystal exposure apparatus according to the fifth embodiment will be described with reference to Figs. 14 and 15. Fig. The liquid crystal exposure apparatus according to the fifth embodiment obtains positional information in the horizontal plane of the substrate P using an encoder system in the same manner as in the fourth embodiment, The head unit and the head unit for the Z-tilt position measuring instrument are independent of each other. Hereinafter, differences from the fourth embodiment will be described, and elements having the same configurations and functions as those of the fourth embodiment will be denoted by the same reference numerals as those of the fourth embodiment, and the description thereof will be omitted.

The Z tilt position measuring system in the liquid crystal exposure apparatus of the fifth embodiment is configured similarly to the Z tilt position measuring system 270 of the third embodiment. 14, four head units 272a to 272d (the head units 272b and 272d are not shown in Fig. 12, see Fig. 9 and the like) are provided on the lower surface of the upper portion 18a, And Z tilt position information of the substrate P is obtained by using the head units 272a to 272d. A target 280 (reflecting surface) is fixed to the top portion 18a so as to face the head units 272a to 272d. The procedure of obtaining Z tilt position information of the substrate P by using the Z sensor heads 78 and 278 of each of the four head units 272a to 272d is the same as that of the third embodiment, .

The encoder system (the in-plane position measurement system 58) has a pair of head units 472a and 472b with a projection optical system 16 interposed therebetween as in the fourth embodiment. The head units 472a and 472b have substantially the same configuration, except that their positions are different. The head unit 472a is disposed between the head unit 272a and the head unit 272c. Although not shown, the head unit 472b is disposed between the head unit 272b and the head unit 272d. Like the head units 272a to 272d, the head units 472a and 472b are fixed to the lower surface of the pedestal portion 18a. A scale plate 380 is fixed to the top portion 18a so as to face the head units 472a and 472b.

As shown in Fig. 15, the head unit 472a is obtained by removing a plurality of sensor heads 78, 278 from the head unit 372a (see Fig. 13) of the fourth embodiment. The order and the like of obtaining the position information in the horizontal plane of the substrate P using the head units 472a and 472b (see Fig. 14) in the fifth embodiment are the same as those in the fourth embodiment, .

According to the fifth embodiment, since the head unit of the in-plane position measuring system of the substrate P and the head unit of the Z tilt position measuring instrument of the substrate are independent, the configuration of the head unit This is simple, and arrangement of each sensor head is easy. In addition, compared with the fourth embodiment, the dimension of the target 438 in the X-axis direction can be shortened.

&Quot; Modifications of Fourth and Fifth Embodiments "

In the fourth and fifth embodiments (embodiments in which the substrate stage in-plane position measurement system 58 is an encoder system), the X-scale (X-axis direction measurement grid pattern ) Or a Y scale (a grid pattern for Y-axis direction measurement shown in the drawing) are formed on independent scale members (for example, a plurality of scale plates disposed on the target 338) . However, these plurality of grid patterns may be formed by dividing each group of grid patterns on the same long-scale member. Alternatively, a grid pattern may be continuously formed on the same long-scale member.

It is also possible to arrange a plurality of scales (scale columns) arranged in succession on the targets 338 and 438 with a plurality of scales in the X-axis direction intervening a gap of a predetermined interval in a plurality of rows, (For example, a position on the one side (+ Y side) and the other side (-Y side) with respect to the projection optical system 16), the position of the gap May be arranged so as not to overlap in the X-axis direction. When a plurality of scale arrays are arranged in this way, there is no case in which the heads arranged in correspondence with each other in scale arrays are simultaneously out of the measuring range (in other words, both heads face the gaps at the same time).

It is also possible to arrange a plurality of scales (scale columns) arranged in succession on the targets 338 and 438 with a plurality of scales in the X-axis direction intervening a gap of a predetermined interval in a plurality of rows, (A plurality of scale arrays) in the case of disposing the plurality of scale groups (a plurality of scale arrays) in the case of disposing the plurality of scale groups (Short map) on the substrate, as shown in FIG. For example, if the overall length of a plurality of scale lines is made different from each other in the scale column, it is possible to cope with different short maps, and the number of shot areas formed on the substrate, such as four chamfering and six chamfering It can respond to changes. When the positions of the gaps of the respective scale arrays are different from each other in the X-axis direction, the heads corresponding to the plurality of scale arrays are not simultaneously out of the measurement range, and therefore, It is possible to reduce the number of sensors as the value, and to carry out the connection processing with high precision.

It should be noted that a plurality of scales in the X-axis direction on the targets 338 and 438 are arranged in a scale group (scale array) arranged successively with a gap of a predetermined interval interposed therebetween so that one scale The length in the X-axis direction can be continuously measured by a length of one shot area (a length formed by irradiating the substrate with the substrate pattern on the substrate while scanning exposure is performed while moving the substrate on the substrate holder in the X-axis direction) The length may be any length. In this way, since the head replacement control for the plurality of scales is not performed during the scan exposure in the one shot area, the position measurement (position control) of the substrate P (substrate holder) during the scan exposure is facilitated .

In the scale group (scale array) in which a plurality of scales are successively arranged in the X-axis direction on the targets 338 and 438 with a predetermined gap therebetween, in the above embodiment, However, scales having different lengths may be arranged in a line. For example, in the scale rows on the targets 338 and 438, the lengths in the X-axis direction of scales (scales arranged in each end portion in the scale column) disposed near both ends in the X- May be physically elongated.

In addition, in a scale group (scale column) in which a plurality of scales are successively arranged in the X-axis direction on the targets 338 and 438 with a predetermined gap therebetween, the distance between the plurality of scales (in other words, , The length of one scale and the lengths of two heads (two heads 384x shown in Fig. 13, for example, which are arranged opposite to each other in the inside of one Y slider 76) ) Are arranged so as to satisfy the relationship of " one scale length > distance between opposed heads > distance between scales ". This relationship is obtained by arranging the scale formed on the targets 338 and 438 and the corresponding heads 384x and 384y as well as the scale plate 380 formed on the upper portion 18a at predetermined intervals in the Y axis direction The upper portion thereof is also satisfactorily held between the scale plate 380 formed on the base portion 18a and the heads 386x and 386y corresponding thereto.

Although a pair of X head 384x and a pair of Y heads 384y are arranged side by side in the X axis direction so as to weave pairs one by one (X head 384x and Y head 384y are X They may be disposed so as to be shifted relatively in the X-axis direction).

Although the X scale 342x and the Y scale 342y are formed to have the same length in the X axis direction in the scale plate 340 formed on the targets 338 and 438, You can. Alternatively, they may be arranged so as to be shifted relative to each other in the X-axis direction.

When the Y slider 76 and the corresponding scale line (a plurality of scales arranged in a predetermined direction through a predetermined gap) are relatively moved in the X-axis direction, (For example, the X head 384x and the Y head 384y in Fig. 13) simultaneously face the above-described gap between the scales and then simultaneously face the other scales (the heads 384x, 384y change to a different scale), it is necessary to calculate the measurement initial value of the replacement head. At that time, the remaining one set of heads (384 x, 384 y) in the Y slider (76), which is different from the changed head, and another head (another head And the distance is arranged at a position shorter than the scale length), the initial value at the time of replacement of the replacement head may be calculated. The another head described above may be a position measurement head in the X-axis direction, or a position measurement head in the Y-axis direction.

There is also a scene that describes that the Y slider 76 moves in synchronization with the substrate holder 36 because the Y slider 76 maintains a relative positional relationship with respect to the substrate holder 36 And is not limited to the case where the positional relationship between the Y slider 76 and the substrate holder 36, the moving direction, and the moving speed are strictly matched.

Further, the encoder system forms a scale for exchanging a substrate on the substrate stage device 20 or another stage device in order to acquire positional information while the substrate stage device 20 moves to the substrate exchange position with the substrate loader And the position information of the substrate stage device 20 may be obtained using a downward head (X head 384x, etc.). Alternatively, the position information of the substrate stage device 20 may be obtained by forming a substrate exchange head on the substrate stage device 20 or another stage device, and measuring the scale plate 340 and scale for substrate exchange. Alternatively, a position measurement system (for example, a mark on the stage and an observation system for observing it) may be formed to control the exchange position of the stage different from the encoder system.

The Z sensor is not limited to an encoder system, and may be a laser interferometer, a TOF sensor, or a sensor capable of measuring a distance.

Further, the scale plate 340 is formed on the targets 338 and 438, but the scale may be formed directly on the substrate P by exposure processing. For example, on a scribe line between shot areas. By doing so, it is possible to measure the scale formed on the substrate, calculate the nonlinear component error for each shot area on the substrate based on the result of the position measurement, and improve the overlapping accuracy upon exposure based on the error It is possible.

The Y slider 76 and the Y linear actuator 74 are configured such that the upper portion of the apparatus main body 18 is formed on the lower surface (see FIG. 12) of the upper portion 18a. However, May be formed on the base portion 18c.

&Quot; Sixth Embodiment &

Next, the liquid crystal exposure apparatus according to the sixth embodiment will be described with reference to Figs. 16 (a) and 16 (b). The liquid crystal exposure apparatus according to the sixth embodiment has a configuration in which the substrate stage apparatus 520 for accurately positioning the substrate P with respect to the projection optical system 16 (see Fig. 1) 5 embodiment. The measurement system for obtaining the position information of the substrate P in the six degrees of freedom direction can be suitably used for the measurement system having the same configuration as any of the measurement systems related to the first to fifth embodiments. Hereinafter, the sixth embodiment will be described only in terms of differences from the first to fifth embodiments, and for elements having the same configurations and functions as those of the first to fifth embodiments, The same reference numerals as in the fifth embodiment are given, and the description thereof is omitted.

16 (a) and 16 (b)) in which the back surface of the substrate P is vacuum-adsorbed and held on the substrate holder 36 in the first to fifth embodiments, The substrate holder 540 in the substrate stage apparatus 520 according to the sixth embodiment is formed in a rectangular frame shape (frame shape) when viewed from the top, And only the vicinity of the end portion is adsorbed and held. The substantially entire surface including the central portion of the substrate P is contactless supported from below by the non-contact table 536 which can be finely driven in the Z tilt direction with respect to the horizontal plane, It is corrected.

More specifically, the noncontact table 536 is fixed on the upper surface of the fine motion stage 32. In the sixth embodiment, the fine moving stage 32 is mechanically coupled to the X coarse movement stage 26 through a plurality of connecting devices 550 including a ball joint or the like (in the Z tilt direction, And moves to a predetermined long stroke in the X-axis direction and the Y-axis direction by being pulled by the X coarse movement stage 26. As shown in FIG. The substrate holder 540 has a main body portion 542 formed in a rectangular frame shape when viewed from the top and a suction portion 544 fixed to the upper surface of the main body portion 542. Similarly to the body portion 542, the suction portion 544 is formed in a rectangular frame shape when seen in plan view. The substrate P is vacuum-adsorbed and held on the adsorption section 544. The noncontact table 536 is inserted into the opening of the suction portion 544 in a state in which a predetermined gap is formed in the suction portion 544 of the substrate holder 540. The noncontact table 536 applies a load (preload) to the substrate P by using the ejection of the pressurized gas against the lower surface of the substrate P and the suction of the gas together to bring the substrate P in a noncontact state And the relative movement along the horizontal plane is not inhibited).

A plurality of (four in this embodiment) guide plates 548 extend radially from the lower surface of the fine motion stage 32 along the horizontal plane. The substrate holder 540 has a plurality of pads 546 including air bearings corresponding to the plurality of guide plates 548. The substrate holder 540 includes a plurality of pads 546 that are provided on the upper surface of the guide plate 548, Contact state on the guide plate 548 by the static pressure of the guide plate 548. The fine motion stage 32 is slightly driven only in the Z tilt direction with respect to the X coarse movement stage 24, unlike the first to fifth embodiments. At this time, since the plurality of guide plates 548 also move in the z-tilt direction (change in posture) integrally with the fine motion stage 32, when the fine movement stage 32 changes posture, The table 536, and the substrate holder 540 (i.e., the substrate P) integrally change in attitude.

The substrate holder 540 is fixed to the fine moving stage 32 through a plurality of linear motors 552 (voice coil motors) including the mover of the substrate holder 540 and the stator of the fine moving stage 32. [ In the direction of three degrees of freedom in the horizontal plane. When the fine motion stage 32 moves along the XY plane in the long stroke, the fine motion stage 32 and the substrate holder 540 move integrally along the XY plane so that the plurality of linear motors Thrust is imparted to the substrate holder 540 by means of the guide pins 552 and 552.

The target 38 is fixed to the substrate holder 540 through a bracket 38a as in the first embodiment. 4) is provided with a plurality of sensor heads 78 (see Fig. 1, etc.) for irradiating measurement light to the target 38, as in the first embodiment, 540) (i.e., the substrate P). The configuration of the measurement system of the z-tilt position of the substrate P including the arrangement of the plurality of sensor heads 78 can be modified in the same manner as in the second to fifth embodiments. In the sixth embodiment, the target 38 is fixed to the substrate holder 540 through the bracket 38a. However, the present invention is not limited to this, and the target 38 Scale plate 340) may be affixed to the upper surface of the substrate holder 540, and the upper surface of the substrate holder 540 may be mirror-finished to function equivalently to the target.

The configuration described in each of the first to sixth embodiments can be appropriately changed. For example, in each of the above-described embodiments, the sensor head 78 (downward head) for obtaining Z tilt position information of the substrate P includes a target 38 (138, 238) mounted on the substrate holder 36, The shape of the target can be limited only to this, as long as it can reflect the measurement light irradiated from the sensor head 78 and reflect the change in attitude of the substrate P. And the measurement light is reflected on the substrate P (that is, the substrate P itself functions as the target). The target 38 or the like of each of the above-described embodiments may be mounted on the fine moving stage 32.

In the above-described embodiments, the sensor head 78 (downward head) is configured to move in the Y-axis direction with respect to the target 38 extending in the X-axis direction (scanning direction). However, The sensor head 78 may be configured so that the target 38 extends in the other direction (Y-axis direction), and the sensor head 78 moves in a direction perpendicular to the direction in which the target 38 extends.

In each of the above embodiments, the substrate stage device 20 has the target 38 extending in the X-axis direction, and the sensor head 78 mounted on the apparatus main body 18 in synchronization with the target 38 The substrate stage device 20 has the sensor head 78 and the target 38 mounted on the apparatus main body 18 in synchronism with the sensor head 78 is moved in the Y axis direction, Axis direction may move in the Y-axis direction. In this case, the posture change of the target 38 may be measured, and the output of the sensor head 78 may be corrected based on the output.

In the above-described embodiments, the weight canceling device 28 is mounted on the Y step guide 30, which is a movable platen movable in the Y-axis direction. However, the present invention is not limited to this, The weight canceling device 28 may be placed on a fixed platen having a guide surface covering the entire movement range in the XY plane.

The wavelength of the light source used in the illumination system 12 and the illumination light IL irradiated from the light source is not particularly limited and may be ArF excimer laser light (wavelength 193 nm), KrF excimer laser light (wavelength 248 nm) Or a vacuum ultraviolet light such as F2 laser light (wavelength 157 nm).

In each of the above-described embodiments, a back-projection system is used as the projection optical system 16, but the present invention is not limited to this, and a reduction system or an enlargement system may be used.

The use of the exposure apparatus is not limited to a liquid crystal exposure apparatus for transferring a liquid crystal display element pattern to a rectangular glass plate, but may be applied to an exposure apparatus for manufacturing an organic EL (Electro-Luminescence) panel, an exposure apparatus , A thin film magnetic head, a micromachine, a DNA chip, and the like. In addition, in order to manufacture a mask or a reticle used in not only a micro device such as a semiconductor device but also a light exposure device, EUV exposure device, X-ray exposure device, and electron beam exposure device, a circuit pattern is transferred onto a glass substrate or a silicon wafer It is also applicable to an exposure apparatus.

The object to be exposed is not limited to a glass plate but may be another object such as a wafer, a ceramic substrate, a film member, a mask blank, or the like. When the object to be exposed is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and may be a film-like (sheet-like member having flexibility). Further, the exposure apparatus of the present embodiment is particularly effective when the substrate having a length of one side or a diagonal length of 500 mm or more is an object to be exposed. When the substrate to be exposed is a flexible sheet, the sheet may be formed in a roll shape.

An electronic device such as a liquid crystal display element (or a semiconductor element) has a function of designing a function and a performance of a device, a step of manufacturing a mask (or a reticle) based on the design step, a step of manufacturing a glass substrate , A lithography step of transferring the pattern of the mask (reticle) onto the glass substrate by the exposure apparatus of each of the embodiments described above, and the exposure method thereof, a development step of developing the exposed glass substrate, An etching step of removing the exposed member of the portion by etching, a resist removing step of removing the unnecessary resist after etching, a device assembling step, and an inspection step. In this case, in the lithography step, the above-described exposure method is carried out using the exposure apparatus of the above-described embodiment, and the device pattern is formed on the glass substrate, so that a highly integrated device can be manufactured with good productivity.

Further, the disclosure of all the U.S. patent application publications and the U.S. patent specification relating to the exposure apparatuses and the like cited in the above-mentioned embodiments are referred to as described in the present specification.

Industrial availability

INDUSTRIAL APPLICABILITY As described above, the mobile object apparatus and the measurement method of the present invention are suitable for obtaining positional information of a mobile object. Further, the exposure apparatus of the present invention is suitable for exposing an object. In addition, the method of manufacturing a flat panel display of the present invention is suitable for manufacturing a flat panel display. Further, the device manufacturing method of the present invention is suitable for manufacturing micro devices.

10: liquid crystal exposure apparatus
20: substrate stage device
36: substrate holder
70: substrate stage Z tilt position measuring system
72a, 72b: head unit
74: Y linear actuator
76: Y Slider
78: Sensor head
P: substrate

Claims (21)

A first moving body that holds an object and is movable in a first direction,
A second moving body that is formed opposite to the first moving body and is movable in the first direction,
A measuring system formed on one of the moving bodies of the first and second moving bodies and a to-be-measured system formed on the other moving body, wherein the measuring system irradiates the measuring system with a measuring beam, And a measuring unit for measuring a position,
Wherein the metering section moves the second moving body in the first direction so as to face the first moving body with respect to the first moving body moved in the first direction and performs the measurement. The method according to claim 1,
And the second moving member moves in the first direction with respect to the first moving member so that the measuring beam does not deviate from the measurement system. 3. The method according to claim 1 or 2,
Wherein the measuring system is formed on the second moving body,
Wherein the measuring unit compensates for a measurement error in the rotational direction about the vertical direction generated by the measurement system formed in the second moving body due to driving in the first direction, Of the moving object. 4. The method according to any one of claims 1 to 3,
Wherein the measurement system has a length capable of measuring a movable range of the first movable body with respect to a second direction intersecting with the first direction. 5. The method of claim 4,
And the first moving member moves in the second direction so that the measuring beam does not deviate from the measurement system. The method according to claim 4 or 5,
Wherein the metering section performs the metering without changing the position of the second moving body in the second direction when the first moving body moves in the second direction. 7. The method according to any one of claims 4 to 6,
The measurement system includes a plurality of measurement systems,
Wherein the measurement points of the plurality of measurement systems with respect to the measurement target are different in position with respect to the second direction. 8. The method according to any one of claims 1 to 7,
And the metering section irradiates the measurement beam to the measurement system and measures the position of the first moving body in the vertical direction based on the return light from the measurement system of the measurement beam. 9. The method according to any one of claims 1 to 8,
Further comprising a reference member which is a reference for movement of the first moving body,
And the second moving body is disposed between the first moving body and the reference member with respect to the up and down direction. 10. The method according to any one of claims 1 to 9,
A first measuring system for obtaining positional information of the second moving body in the first direction,
A diffraction grating formed on one of the moving bodies of the first moving body and the second moving body and a diffraction grating formed on the other moving body of the first moving body and the second moving body, And an encoder head for obtaining position information in a two-dimensional plane including a direction of the second measurement system,
And obtains position information in the two-dimensional plane of the first mobile body based on outputs of the first and second measurement systems. 11. The method according to any one of claims 1 to 10,
Further comprising a support for non-contacting the object,
Wherein the first moving body holds the object not supported by the supporting portion. A first moving body that holds an object and is movable in a first direction,
A second moving body that is formed opposite to the first moving body and is movable in the first direction,
A measuring system formed on one of the moving bodies of the first and second moving bodies and a to-be-measured system formed on the other moving body, wherein the measuring system irradiates the measuring system with a measuring beam, And a measuring unit for measuring a position of the moving object. 13. A mobile communication device comprising: a mobile device according to any one of claims 1 to 12;
And a pattern forming device for forming a predetermined pattern using an energy beam with respect to an object held by the first moving body. 14. The method of claim 13,
Wherein the object is a substrate used in a flat panel display. The method according to claim 13 or 14,
Wherein the substrate has a length or a diagonal length of at least one side of 500 mm or more. A method for exposing an object using the exposure apparatus according to any one of claims 13 to 15,
And developing the exposed object. ≪ Desc / Clms Page number 19 > A method for exposing an object using the exposure apparatus according to any one of claims 13 to 15,
And developing the exposed object. A first moving body that holds an object and is movable in a first direction and a second moving body that is formed to face the first moving body and is movable in the first direction, And measuring the position of the first moving body in the up-and-down direction by irradiating the measuring beam to the measuring system formed on the other of the second moving bodies,
Wherein in the measurement, the second moving body moves in the first direction with respect to the first moving body so as to face the first moving body moved in the first direction, and the measurement is performed. 19. The method of claim 18,
And the second moving body moves in the first direction with respect to the first moving body so that the measuring beam does not deviate from the measurement system. 20. The method according to claim 18 or 19,
Wherein the measuring system is formed on the second moving body,
Wherein the measurement is performed by compensating a measurement error in the rotational direction about the up and down direction caused by the measurement system formed on the second mobile body moving in the first direction, And measuring a position in one direction. 21. The method according to any one of claims 18 to 20,
Wherein the measurement system has a length capable of measuring a movable range of the first movable body with respect to a second direction intersecting with the first direction.

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