CN108139676A - Mobile body device, exposure device, the manufacturing method of flat-panel screens, assembly manufacture method and measuring method - Google Patents

Mobile body device, exposure device, the manufacturing method of flat-panel screens, assembly manufacture method and measuring method Download PDF

Info

Publication number
CN108139676A
CN108139676A CN201680057153.7A CN201680057153A CN108139676A CN 108139676 A CN108139676 A CN 108139676A CN 201680057153 A CN201680057153 A CN 201680057153A CN 108139676 A CN108139676 A CN 108139676A
Authority
CN
China
Prior art keywords
moving body
substrate
measurement
mobile
measure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201680057153.7A
Other languages
Chinese (zh)
Other versions
CN108139676B (en
Inventor
青木保夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of CN108139676A publication Critical patent/CN108139676A/en
Application granted granted Critical
Publication of CN108139676B publication Critical patent/CN108139676B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70775Position control, e.g. interferometers or encoders for determining the stage position
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2002Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825Mounting of individual elements, e.g. mounts, holders or supports
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention the substrate holding (36) that can be moved in the direction parallel with X/Y plane is obtained in the measuring system of the location information of Z-direction, have:With substrate holding (36) be arranged oppositely can in Y direction and the synchronization-moving Y saddles (76) of substrate holding (36), be located at the sensor head (78) of Y saddles (76) and control Y saddles (76) and using the control system for being located at the target (38) for extending X-direction of substrate holding (36) by sensor head (78) and being obtained location information of the substrate holding (36) in Z-direction.

Description

Mobile body device, exposure device, the manufacturing method of flat-panel screens, component manufacturer Method and measuring method
Technical field
The present invention is about mobile body device, exposure device, the manufacturing method of flat-panel screens, assembly manufacture method and surveys Amount method.
Background technology
All the time, manufacturing the electronic building bricks (micro-groups such as LCD assembly, semiconductor subassembly (integrated circuit etc.) Part) micro-photographing process in, using one side make light shield or graticule (hereinafter, being referred to as " light shield "), with glass plate or wafer etc. (with Under, it is referred to as " substrate ") along set scanning direction synchronizing moving, the pattern for being formed in light shield is transferred to using energy beam on one side The exposure device ((example such as so-called scanning stepper (also known as scanning machine) of step-scan (step&scan) mode on substrate Such as, referring to patent document 1).
In such exposure device, in order to which the pattern of light shield will be formed in high-resolution imaging on substrate, substrate is measured Surface location (for example, the location information of substrate surface in the direction intersected with horizontal plane) go forward side by side exercise the substrate surface position Put the auto-focusing control automatically in the depth of focus of projection optics system.
At this point, positively to carry out auto-focusing control, it is desirable to measure the surface location of substrate with high precision.
Citation
Patent document
No. 2010/0266961 specification of [patent document 1] U.S. Patent Application Publication No.
Invention content
1st mode of the invention provides a kind of mobile body device, has:1st moving body keeps object, can be moved toward the 1st direction It is dynamic;2nd moving body, it is opposite to be set in the 1st moving body, it can be moved toward the 1st direction;And measurement portion, have and be located at the 1st And the 2nd one of moving body moving body measurement system, the measured system with being located at another moving body, which is measured this Measuring beam is irradiated to measure the 1st moving body in the position of upper and lower directions in system;The measurement portion is moved relative to toward the 1st direction The 1st moving body, the 2nd moving body is made to be moved toward the 1st direction in a manner that opposite direction is in the 1st moving body, measured.
2nd mode of the invention provides a kind of mobile body device, has:1st moving body keeps object, can be toward the 1st direction It is mobile;2nd moving body, it is opposite to be set in the 1st moving body, it can be moved toward the 1st direction;And measurement portion, have and be located at this Measurement system, the measured system with being located at another moving body of one of 1st and the 2nd moving body moving body, the measurement system is to the quilt System's irradiation measuring beam is measured to measure the 1st moving body in the position of upper and lower directions.
3rd mode of the invention provides a kind of exposure device, has the mobile body device of the 1st mode and the shifting of the 2nd mode Pattern that is any and forming predetermined pattern using energy beam to the object that the 1st moving body is kept in kinetoplast device Forming apparatus.
4th mode of the invention provides a kind of manufacturing method of flat-panel screens, it includes:It is filled using the exposure of the 3rd mode Put the action for exposing the object;And the action that the object after exposure is made to develop.
5th mode of the invention provides a kind of assembly manufacture method, it includes:Exposure device using the 3rd mode makes the object The action of body exposure;And the action that the object after exposure is made to develop.
6th mode of the invention provides a kind of measuring method, comprising:Keep object can be toward the 1st of the movement of the 1st direction the to being located at Moving body with and the 1st moving body be arranged oppositely can toward the square measured system of one of the 2nd moving body of the 1st direction movement, Measuring beam is irradiated from the measurement system for the opposing party being located in the 1st moving body and the 2nd moving body, to measure the 1st movement Body is in the action of the position of upper and lower directions;It is acted in the measurement, with the 1st moving body opposite direction with past 1st direction movement Mode, the 2nd moving body are moved relative to the 1st moving body toward the 1st direction, carry out the measurement.
Description of the drawings
Fig. 1 is the figure of the composition for the liquid crystal exposure apparatus that outline shows the 1st embodiment.
Fig. 2 is the line A-A sectional view of Fig. 1.
Fig. 3 is the concept map that the baseplate carrier Z obliquities that the liquid crystal exposure apparatus of Fig. 1 has measure system.
Fig. 4 is to show the side of the import and export relationship of main control unit formed centered on the control system of liquid crystal exposure apparatus Block diagram.
Fig. 5 is the action of the baseplate carrier device and baseplate carrier Z obliquities measurement system when illustrating stepwise operation Figure.
Fig. 6 (a) and Fig. 6 (b) is the baseplate carrier device and the survey of baseplate carrier Z obliquities when illustrating exposure actions Measure the figure (its 1 and its 2) of the action of system.
Fig. 7 is the figure (sectional view) for the liquid crystal exposure apparatus for showing the 2nd embodiment.
Fig. 8 is to illustrate that the baseplate carrier Z obliquities of the 2nd embodiment measure the figure of the action of system.
Fig. 9 is the figure (front view) for the liquid crystal exposure apparatus for showing the 3rd embodiment.
Figure 10 is that the baseplate carrier Z obliquities of the 3rd embodiment measure the concept map of system.
Figure 11 is the figure (sectional view) for the liquid crystal exposure apparatus for showing the 3rd embodiment.
Figure 12 is the figure (front view) for the liquid crystal exposure apparatus for showing the 4th embodiment.
Figure 13 is that the substrate position of the 4th embodiment measures the concept map of system.
Figure 14 is the figure (sectional view) for the liquid crystal exposure apparatus for showing the 5th embodiment.
Figure 15 is that the substrate position of the 5th embodiment measures the concept map of system.
Figure 16 (a) and Figure 16 (b) is that the figure for the baseplate carrier device for showing the 6th embodiment (is respectively sectional view, overlooks Figure).
Figure 17 is the figure for showing point of irradiation of the measuring beam in encoder.
Specific embodiment
《1st embodiment》
Hereinafter, for the 1st embodiment, it is illustrated using Fig. 1~Fig. 6 (b).
The composition of the liquid crystal exposure apparatus 10 for showing the 1st embodiment of outline in Fig. 1.Liquid crystal exposure apparatus 10, example It is for rectangle (square) the glass substrate P (hreinafter referred to as substrate P) of liquid crystal display (flat-panel screens) etc. in this way The projection aligner of the step-scan mode of exposure object object, so-called scanning machine.
Liquid crystal exposure apparatus 10 has the mask stage device that illumination is the light shield M that 12, holding is formed with circuit pattern etc. 14th, projection optics system 16, device body 18, holding surface are coated with photoresist (sensing agent) (towards the face of+Z sides in Fig. 1) The baseplate carrier device 20 of substrate P and these control system etc..Hereinafter, light shield M projected lights opposite with substrate P when will expose Be 16 respectively scanned direction be set as X-direction, direction orthogonal to X-axis in horizontal plane for Y direction, with X-axis and Y-axis Orthogonal direction is illustrated for Z-direction.In addition, by θ x, θ y and θ z is set to around the direction that X-axis, Y-axis and Z axis rotate Direction illustrates.
Illumination is 12, and it is identical to have with the illumination disclosed by such as 5,729, No. 331 specifications of U.S. Patent No. etc. It forms.Illumination is 12, by from light source (not shown) (mercury vapor lamp etc.) project light, respectively through speculum (not shown), color separation Mirror, window shade, wave filter, various lens etc. are irradiated in light shield M as exposure with illumination light (illumination light) IL.Illumination light IL is used Such as light (or the conjunction of above-mentioned i lines, g lines, h lines of i lines (wavelength 365nm), g lines (wavelength 436nm), h lines (wavelength 405nm) etc. Cheng Guang).
Mask stage 14 maintains the light shield M of light penetrating type.Main control unit 50 penetrates (with reference to Fig. 4) and includes linear motor Mask stage driving be 52 (with reference to Fig. 4) by the opposite illumination of mask stage 14 (that is, light shield M) be the past X-axis of 12 (illumination light IL) Direction (scanning direction) is driven with set long stroke and is driven a little in Y direction and θ z directions.Mask stage 14 is in water Location information in plane is 54 to be obtained (with reference to Fig. 4) by the mask stage position measurement comprising laser interferometer.
16 configuration of projection optics system is in the lower section of mask stage device 14.Projection optics system 16 is and such as United States Patent (USP) The revealed projection optics systems such as No. 6,552,775 specification have identical composition, so-called poly-lens (multi- Lens) projection optics system has a plurality of optical systems for the both sides telecentricity to form upright erect image.From 16 projection of projection optics system to The optical axis AX of the illumination light IL of substrate P is parallel with Z axis.
In liquid crystal exposure apparatus 10, when be from illumination 12 light of the illumination light IL illuminations position in set illumination region When covering M, by the illumination light by light shield M, through projection optics system 16 by the (portion of projection image of the light shield M in the illumination region Divide erect image), it is formed in the exposure area in substrate P.And opposite illumination region (illumination light IL) makes light shield M be moved in scanning direction Dynamic and relative exposure region (illumination light IL) makes substrate P be moved in scanning direction, carries out an irradiation in substrate P according to this (shot) scan exposure in region, the pattern that light shield M is formed in irradiation area transfer (correspond to the scanning range of light shield M Pattern is all).Herein, the exposure area (irradiation area of illumination light) in the illumination region and substrate P on light shield M, be by Projection optics system 16 and be each optically conjugate relation.
Device body 18 is the part of the above-mentioned mask stage 14 of bearing and projection optics system 16, through a plurality of antihunting devices 18d is arranged on the ground F of dust free room.Device body 18 is said with No. 2008/0030702 with U.S. Patent Application Publication No. The identical composition of the bright revealed device body of book has upper pallet portion 18a (the also known as optics for supporting above-mentioned projection optics system 16 Platform etc.), (in Fig. 1, because in the overlapping of paper depth direction, therefore a side is not shown by a pair of lower pallet portion 18b.With reference to Fig. 2) and One centering pallet portion 18c.
Baseplate carrier device 20 is substrate P is subject to high accuracy positioning with respect to projection optics system 16 (illumination light IL) Part, by substrate P, (X-direction and Y direction) is driven with set long stroke and is driven a little in 6 along the horizontal plane Degree of freedom direction.Though the composition of baseplate carrier device 20 is not particularly limited, to use such as U.S. Patent Application Publication No. No. 2012/0057140 specification of No. 2008/129762 specification or U.S. Patent Application Publication No. etc. is revealed to include 2 dimensions The bearing table device that coarse motion microscope carrier, the so-called rough micro-moving mechanism of fine motion microscope carrier driven a little with the opposite 2 dimension coarse motion microscope carrier are formed Preferably.
Baseplate carrier device 20 in this 1st embodiment, as an example for, be have it is a plurality of (in present embodiment Be 3) pedestal 22 (in Fig. 1 in paper depth direction overlap.With reference to Fig. 2), Y coarse motions microscope carrier 24, X coarse motions microscope carrier 26, weight supports The bearing table device that the rough micro-moving mechanism of pin assembly 28, Y steppings guiding element 30, fine motion microscope carrier 32, substrate holding 36 etc. is formed.
Pedestal 22 is made of the component for extending Y direction, is set with the state to insulate in vibration with device body 18 On the F of ground.3 pedestals 22 are configured (with reference to Fig. 2) in X-direction with predetermined distance.
Y coarse motions microscope carrier 24, as shown in Fig. 2, being positioned on 3 pedestals 22.Y coarse motions microscope carrier 24 has and above-mentioned pedestal 22 Corresponding 3 Y brackets 24a, (side is not shown in Fig. 2 with a pair for being positioned on 3 Y brackets 24a.With reference to Fig. 1) X beams 24b.Y coarse motions microscope carrier 24, through being 56 (not scheme in Fig. 2 by baseplate carrier driving of the substrate P driving in 6DOF direction Show.With reference to Fig. 4) a part a plurality of Y actuators 24c, Y-axis side is driven in set long stroke on 3 pedestals 22 To.Also, linear guide apparatus 24d of the Y coarse motions microscope carrier 24 through configuration between pedestal 22, Y direction is guided in by straight.
Fig. 1 is returned to, X coarse motions microscope carrier 26 is positioned on a pair of of X beams 24b.X coarse motions microscope carrier 26 (is seen by overlooking from +Z direction Examine) tabular component of rectangle forms, it is formed with opening portion in center.X coarse motions microscope carrier 26 is 56 (ginsengs through baseplate carrier driving According to Fig. 4) a part a plurality of X actuators 26a, X-direction is driven in set long stroke on Y coarse motions microscope carrier 24. Also, X coarse motions microscope carrier 26, through linear guide apparatus 26b of the configuration between Y coarse motions microscope carrier 24, X-axis side is guided in by straight To.Also, Fig. 2 is to show that X coarse motions microscope carrier 26 is located at the figure of the state of the stroke end of+X sides.Also, X coarse motions microscope carrier 26, by upper State linear guide apparatus 26b with respect to Y coarse motions microscope carrier 24 toward Y direction relative movement by mechanical limitation, and with Y coarse motions The past Y direction movement of 24 one of microscope carrier.The driving of aforesaid substrate microscope carrier is that Y actuators 24c possessed by 56 (with reference to Fig. 2), X are caused Dynamic device 26a (with reference to Fig. 1), can be used linear motor, feed screw (ball screw) device etc..
Weight offsets device 28, is formed in the opening portion of X coarse motions microscope carrier 26 as shown in Fig. 2, being inserted into.Weight offsets device 28 are also known as stem, support the dead weight of fine motion microscope carrier 32 and the system comprising substrate holding 36 from below.It is offseted about weight The details of device 28, because being exposed in No. 2010/0018950 specification of U.S. Patent Application Publication No., therefore the description thereof will be omitted. Weight offsets device 28, and through a plurality of attachment device 28a (also known as bend (Flexure) device), mechanical to be connected to X thick Dynamic load platform 26 is drawn by X coarse motions microscope carrier 26 and is moved with X coarse motions microscope carrier 26 one along X/Y plane.
Y steppings guiding element 30, the part of platform when being moved as weight payment device 28.Y steppings guiding element 30 is by extending It is formed in the component of X-direction, a pair of of undercarriage possessed by device body 18 is positioned in through a plurality of linear guide apparatus 30a On platform portion 18b.Y steppings guiding element 30 is inserted between a pair of X beams 24b possessed by Y coarse motions microscope carrier 24 (with reference to Fig. 1) and through plural number A attachment device 30b is (not shown in Fig. 2.With reference to Fig. 1) mechanical it is connected to Y coarse motions microscope carrier 24.Accordingly, Y steppings guiding element 30 Past Y direction i.e. with 24 one of Y coarse motions microscope carrier is moved with set long stroke.Weight offsets device 28, through air bearing 28b Be positioned on Y steppings guiding element 30 with contactless state, X coarse motions microscope carrier 26 on Y coarse motions microscope carrier 24 only toward X-direction move During situation, moved on the Y steppings guiding element 30 of stationary state toward X-direction, and in X coarse motions microscope carrier 26 and Y coarse motions microscope carrier 24 1 During the movement of past Y direction (also including the situation with the movement toward X-direction) situation of body, then with Y steppings guiding element 30 integrally (avoiding coming off from Y steppings guiding element 30) toward Y direction move.
Fine motion microscope carrier 32 is made of plate (or box-shaped) component of vertical view rectangle, and spherical bearing arrangement 34 is penetrated with central portion The state of (tilting action) freely is swung with respect to X/Y plane, it from below (can be along XY with contactless state by weight payment device 28 The state of plane relative movement) bearing.Substrate holding 36 is fixed in fine motion microscope carrier 32, on the substrate holding 36 Load substrate P.Substrate holding 36 is formed as overlooking the plate of rectangle, and substrate P is kept in a manner of vacuum suction.
It is (not shown in Fig. 1 and Fig. 2 that fine motion microscope carrier 32 is that the driving of aforesaid substrate microscope carrier is 56.With reference to Fig. 4) a part, thoroughly Cross comprising possessed by stator possessed by X coarse motions microscope carrier 26 and fine motion microscope carrier 32 can mover a plurality of linear motors, by The opposite X coarse motions microscope carrier 26 of main control unit 50 (with reference to Fig. 4) control is driven a little in 6DOF direction.A plurality of linear horses It reaches, respectively comprising a plurality of X voice coil motors 56x (in Fig. 1 not shown), Y voice coil motors 56y (in Fig. 2 not shown), Z voice coil horses Up to 56z.Also, main control unit 50, when X coarse motions microscope carrier 26 is moved along X/Y plane with long stroke, by above-mentioned a plurality of linear Motor assigns thrust to fine motion microscope carrier 32, so that 26 one of fine motion microscope carrier 32 and X coarse motions microscope carrier is moved along X/Y plane with long stroke It is dynamic.It is the composition (except measurement system) of 56 baseplate carrier device 20 described above comprising baseplate carrier driving, to be disclosed in No. 2012/0057140 specification of U.S. Patent Application Publication No. etc..
The position measurement system of fine motion microscope carrier 32 (that is, substrate P), as shown in figure 4, comprising substrate is obtained in X/Y plane Position measurement is 58 (hereinafter, claiming " horizontal in the baseplate carrier horizontal plane of interior location information (the rotation amount information in the directions of z containing θ) Position measurement is 58 " in face) and substrate is obtained in the location information (position of Z-direction in the direction intersected with horizontal plane Information, the rotation amount information in θ x and θ y directions.Hereinafter, claim " Z obliquities information ") baseplate carrier Z obliquities measure system 70 (hereinafter, claiming " Z obliquity measurements are 70 ").
It is 58 as position measurement in horizontal plane, although not shown, but use can be used and be fixed on fine motion microscope carrier 32, substrate guarantor Hold rodlike speculum (the rodlike speculums of Y extended in parallel with X-axis and the X extended in parallel with Y-axis of tool 36 (respectively referring to Fig. 1) Rodlike speculum) optical interferometer system etc..About the details for the position measurement system for using optical interferometer system, because being exposed in No. 2010/0018950 specification of U.S. Patent Application Publication No. etc., and the description is omitted.
Z obliquity measurements are 70, as shown in Figure 1, with a pair of of pickup unit (pickup unit 72a, 72b).One read head - Y sides (the reference in projection optics system 16 is configured in+Y the sides of projection optics system 16, another pickup unit 72b in unit 72a configurations Fig. 2).Pickup unit 72a, 72b are substantially identical device in addition to difference is configured.
Pickup unit 72a, 72b are measured using target 38 (target, target structure) a pair of of possessed by baseplate carrier device 20 The Z obliquity information of substrate P.In a pair of of target 38, a configuration is kept in+Y the sides of substrate holding 36, another configuration in substrate - Y the sides of tool 36.A pair of of target 38 is set as the Y direction interval with above-mentioned pickup unit 72a, 72b in the interval of Y direction It is roughly the same.
Target 38, by Fig. 1 and Fig. 2 it is found that by extending X-direction and the plate parallel with X/Y plane (band-like) component structure Into.It is reflecting surface above target 38.As target 38, plane mirror etc. can be used.The X-direction length of target 38 is set to compared with substrate The X-direction length for keeping 36 (and substrate Ps) of tool is long, in present embodiment, is set as the X-direction length of substrate holding 36 1.1~2 times of degree.Also, the length of target 38 also can be short compared with the X-direction length of substrate holding 36.For example, measurement can be corresponded to The place of Z obliquity information and sequential set a plurality of targets 38 short compared with the X-direction length of substrate holding 36.
Target 38, with the height and position (position of Z-direction) above it and the substrate P table being positioned on substrate holding 36 The roughly the same mode of the height and position in face is mounted on the side of substrate holding 36 through bracket 38a.Therefore, when substrate is protected It holds tool 36 and is driven in the direction intersected with horizontal plane (toward the movement in optical axis AX directions and the inclined direction of relative level) When, a pair of of target 38 is to be moved with the past direction intersected with horizontal plane of 36 one of substrate holding.Accordingly, it is positioned in substrate guarantor The postural change for holding the substrate P on tool 36 is reflected in above target 38 (reflecting surface).Also, in Fig. 1 and Fig. 2, although target 38 is pacified Mounted in the side of substrate holding 36, but as long as if reflecting the postural change of substrate P, the installation position of target 38 has no especially It limits, fine motion microscope carrier 32 can be fixed on, also can be directly mounted at the upper surface of substrate holding 36.In addition, substrate can also be kept Target 38 is used as above at least part of tool 36, fine motion microscope carrier 32, substrate P etc., to measure Z obliquity information.It also that is, can Make to have the function of above at least part of substrate holding 36, fine motion microscope carrier 32, substrate P etc. equal with target 38.In this way, Even if be not provided with target 38 also can, therefore the composition of baseplate carrier device 20 can be simplified.
Secondly, illustrate pickup unit 72a, 72b.Pickup unit 72a, as shown in Figure 1, having Y linear actuators 74, with this Y linear actuators 74 is with respect to the Y saddles that projection optics system 16 (and device body 18) is driven in Y direction with predetermined stroke 76 and be fixed on Y saddles 76 a pair of sensors head 78 (in Fig. 1 in paper depth direction overlap.With reference to Fig. 2).Pickup unit 72b is also same.
Y linear actuators 74 (driving mechanism) is fixed on possessed by device body 18 below upper pallet portion 18a.Y lines Property actuator 74, have the linear guide for guiding Y saddles 76 toward Y direction, with assigning the driving system of thrust to Y saddles 76. Though the type of linear guide is not particularly limited, preferable with the air bearing that reproducibility repeatedly is high.The type of system is driven also without spy It does not limit, linear motor, belt (or metal wire) driving device etc. can be used.
Y linear actuators 74 is by main control unit 50 (with reference to Fig. 4) control.Main control unit 50 controls Y linear actuators 74, so that Y saddles 76 are toward the moving direction of Y direction, amount of movement and movement speed and substrate P (fine motion microscope carrier 32) toward Y-axis side To moving direction, amount of movement and movement speed it is roughly the same.Though also, non-icon in Fig. 1 and Fig. 2, main control unit 50 penetrates Y Saddle position measurement is 80 (with reference to Fig. 4), and the position letter of 76 opposite sets ontology 18 (that is, projection optics system 16) of Y saddles is obtained Breath.It is 80 as Y saddle position measurements, can is such as the measuring system as linear encoder system, can also be based on to Y lines The object of the input signal of property actuator 74 etc..
A pair of sensors head 78 is separately installed (with reference to Fig. 2) in X-direction below Y saddles 76.A pair of sensors head 78, as shown in figure 3, with target 38 is opposite, (-Z direction) is configured downward.In present embodiment, as sensor head 78, example Such as using laser extensometer, but the type of sensor head 78, as long as can be with the precision (analytic ability) that is intended to and with non-contact side Formula measure target 38 on the basis of device body 18 (with reference to Fig. 1) toward Z-direction displacement if, be not particularly limited.
Herein, a pair of sensors head 78 possessed by each pickup unit 72a, 72b, due to being detached in X-direction, The Z axis of corresponding target 38 according to the average value of the output of a pair of sensors head 78, can be obtained (with reference to Fig. 4) in main control unit 50 Direction position (addendum modification) information and can be obtained according to the difference of the output of a pair of sensors head 78 target 38 θ y directions inclination Measure information.Also, due to pickup unit 72a, 72b (and corresponding target 38) in Y direction detach, main control unit 50 can Substrate is not obtained with the always on output for adding up to 4 sensor heads 78 according to possessed by the pickup unit 72a, 72b Keep the amount of tilt information in the θ x directions of tool 36 (with reference to Fig. 1).In addition, in Z-direction position (addendum modification) letter that target 38 is obtained During breath, it can be obtained according to the output of 1 sensor head in a pair of sensors head 78.
It shows in Fig. 4 and is formed centered on the control system of liquid crystal exposure apparatus 10 (with reference to Fig. 1), plan as a whole control and form respectively The block diagram of the import and export relationship of the main control unit 50 in portion.Main control unit 50 includes work station (or micro computer) etc., plans as a whole Control each portion of composition of liquid crystal exposure apparatus 10.
The liquid crystal exposure apparatus 10 (with reference to Fig. 1) formed in the above described manner, in the management of main control unit 50 (with reference to Fig. 4) Under, light shield M is carried out toward the loading on mask stage 14 and by substrate (not shown) loading by light shield loader (not shown) Device carries out substrate P toward the loading on baseplate carrier device 20 (substrate holding 36).Later, by main control unit 50, using not The alignment detection system of icon is implemented to locating tab assembly, after this is to locating tab assembly, to a plurality of irradiation areas being set in substrate P Gradually carry out the exposure actions of step-scan (step&scan) mode.
When above-mentioned scan exposure acts, main control unit 50 (with reference to Fig. 4) is 70 (references according to Z obliquity measurements Output Fig. 4) is automatically located at projected light with the irradiation area (exposure area) of the illumination light IL (with reference to Fig. 1) in substrate P Be the mode in the depth of focus of 16 (with reference to Fig. 1), carries out location control (the so-called auto-focusing control of the Z inclined directions of substrate P System).Also, the Z obliquities as substrate P measure system, the face position of substrate P will can be directly measured near above-mentioned exposure area The measurement system (well known autofocus sensor) of the mode of confidence breath, the Z obliquity measurements with present embodiment are 70 simultaneously With.
In the exposure actions of a series of step-scan (step&scan) mode, main control unit 50 (with reference to Fig. 4), As shown in Fig. 5, Fig. 6 (a), make substrate P (substrate holding 36) toward Y direction (Fig. 5, Fig. 6 to be moved between being irradiated (a) it is +Y direction in.With reference to white arrow) it is mobile when, (the measurement light from sensor head 78 in a manner of synchronous with the substrate P Without departing from the mode of corresponding target 38), by pickup unit 72a, 72b each Y saddles 76 toward Y direction driving (with reference to figure 5th, the black arrow of Fig. 6 (a)).In this way, can be unrelated with the Y location of substrate P, the Z obliquity information of substrate P is obtained.This When, the Y direction width of target 38 is adequately big compared with measurement point of the sensor head 78 on target 38 due to being set to, sensing Even if device head 78 is not rigorous synchronous also may be used in the position of Y direction with substrate holding 36.
In contrast, as shown in Fig. 6 (b), in the exposure actions of a series of step-scan mode, exposed to be scanned Light act and make substrate P (substrate holding 36) toward X-direction (in Fig. 6 (b) be -X direction.With reference to white arrow) it is mobile when, it is main Control device 50 (with reference to Fig. 4) is the Y saddles 76 that make pickup unit 72a, 72b each stationary state (sensor head 78 with it is right The opposite state of the target 38 answered) under, the Z obliquity information of substrate P is obtained.Also, in the flatness on 38 surface of target and Y saddles 76 Straight trip precision ensure be possible to difficulty situation when, about above-mentioned flatness, keep straight on precision, can measure in advance in the hope of Go out update information, when the measurement of the Z obliquity information of reality, the output of sensor head 78 is corrected according to above-mentioned update information .
The Z obliquity measurements of the 1st embodiment from the description above are 70, due to being for base with device body 18 Standard, directly measures the postural change for the substrate holding 36 for keeping substrate P, therefore the Z obliquities of substrate P can be obtained in high precision Information.Herein, though it is contemplated that measurement sensor is installed in substrate holding 36, with weight payment (that is, the Y stepping guiding elements of device 28 30) postural change of substrate holding 36 is obtained on the basis of, but because weight payment device 28 (and Y steppings guiding element 30) is along XY The composition of planar movement, therefore measurement accuracy is likely to decrease.In contrast, the Z obliquity measurements of present embodiment are 70, Because be on the basis of the upper pallet portion 18a for installing projection optics system 16, therefore can be unrelated with the action of baseplate carrier device 20, The postural change of substrate P is measured with high precision.
Also, the Z obliquities that the mode of the face location information of substrate P is directly measured near above-mentioned exposure area measure system (autofocus sensor), as shown in Fig. 2, when substrate holding 36 is located at the stroke end of X-direction, due to substrate P not In the lower section of projection optics system 16, therefore the Z obliquity information of substrate P can not be obtained, but be tilted by the Z of present embodiment Position measurement is 70 use, can be unrelated with the X-direction position of substrate holding 36, and the Z obliquities letter of substrate P is obtained Breath.
《2nd embodiment》
Secondly, using Fig. 7 and Fig. 8, illustrate the liquid crystal exposure apparatus of the 2nd embodiment,.The liquid crystal of 2nd embodiment exposes The composition of electro-optical device in addition to the composition difference of the measurement system of the Z obliquity information of substrate P is obtained, is implemented with the above-mentioned 1st Mode is identical, therefore, is illustrated below only for dissimilarity, has identical composition and work(for above first embodiment The element of energy assigns the symbol identical with above first embodiment and the description thereof will be omitted.
Z obliquity measurements relative to above first embodiment are 70 (with reference to Fig. 6 (a) etc.), in projection optics system 16 + Y sides and-Y sides difference 1 pickup unit (pickup unit 72a, 72b) of each configuration, tilt position in the Z of this 2nd embodiment It is 170 to put measurement, as shown in figure 8,2 pickup units 172a, 172c are configured in+Y the sides of projection optics system 16 and in projected light Be that 16-Y sides are also configured with 2 pickup units 172b, 172d.Also that is, main control unit 50 (with reference to Fig. 4) is in the above-mentioned 1st Embodiment is that the Z obliquities of substrate P are obtained using 2 pickup units 72a, 72b (also that is, adding up to 4 sensor heads 78) Information is then 4 pickup unit 172a~172d of appropriate use (also that is, total 8 in contrast, in this 2nd embodiment A sensor head 78) the Z obliquity information of substrate P is obtained.The composition of pickup unit 172a~172d, because with it is the above-mentioned 1st real Pickup unit 72a, the 72b for applying mode are identical, therefore the description thereof will be omitted.
Also, as shown in Fig. 2, Fig. 6 (a) etc., relative in above first embodiment, the X positions of 2 pickup units 72a, 72b Put it is roughly the same with the X position of projection optics system 16, as shown in figure 8, in this 2nd embodiment ,+Y the sides of projection optics system 16 2 pickup units 172a, 172c, one of them (pickup unit 172a) is another in+X sides compared with 16 configuration of projection optics system (pickup unit 172c) is then configured in-X the sides of projection optics system 16 (that is, front side and inside of scanning direction).Projection optics Be 16-Y sides 2 pickup units 172b, 172d it is also same.In this way, in this 2nd embodiment, in the week of projection optics system 16 It encloses and is configured with 4 pickup unit 172a~172d.In addition, prolong about fixing to have through bracket 138a in substrate holding 36 The point of the target 138 of the reflecting surface of X-direction is stretched in, though it is identical with above first embodiment, in this 2nd embodiment, target 138 X-direction size is short compared with above first embodiment.
The action of each pickup unit 172a~172d in this 2nd embodiment when scan exposure acts, because with it is above-mentioned 1st embodiment is roughly the same, therefore the description thereof will be omitted.Also that is, main control unit 50 (with reference to Fig. 4), makes each pickup unit on one side The Y saddles 76 of 172a~172d are synchronous (with reference to the white arrow of Fig. 8) with the movement of substrate holding 36 (substrate P) toward Y direction Toward Y direction movement (with reference to the black arrow of Fig. 8), on one side at least two read head list in 4 pickup unit 172a~172d Member (pickup unit 172a and pickup unit 172b or pickup unit 172c and pickup unit 172d or all pickup units 172a ~172d) output of sensor head 78 that has, the Z obliquity information of substrate P is obtained.
The Z obliquity measurements of described above the 2nd embodiment are 170, due to being+the X in projection optics system 16 Side and-X sides are each configured with 2 pickup units (pickup unit 172a, 172b and pickup units being detached in Y direction 172c, 172d), therefore compared with above first embodiment, it is longer in the detection zone of X-direction.So as to, as shown in fig. 7, It is compared with above first embodiment (with reference to Fig. 2), the X-direction length of target 138 can be made shorter.In this way, fine motion can be carried 32 lightweight of platform, therefore the position controlling of substrate P can be promoted.
《3rd embodiment》
Secondly, the liquid crystal exposure apparatus of the 3rd embodiment is illustrated using Fig. 9~Figure 11.The liquid crystal exposure of 3rd embodiment The composition of device, in addition to the composition difference of the measurement system of the Z obliquity information of substrate P is obtained, with the above-mentioned 1st or the 2nd Embodiment is identical, therefore, is illustrated below only for dissimilarity, pair with above-mentioned 1st or the 2nd embodiment have phase isomorphism Into and function element, assigning the symbol identical with above-mentioned 1st or the 2nd embodiment, simultaneously the description thereof will be omitted.
The Z obliquity measurements of this 3rd embodiment are 270, have 76 relative level of Y saddles of sensor head 78 The amount of tilt information of (X/Y plane) be the point being obtained (with reference to Fig. 4) by main control unit 50 with above-mentioned 1st and the 2nd embodiment not Together.Main control unit 50, according to exporting for sensor head 78 and the amount of tilt information of the Y saddles 76 during the output (also that is, on one side Correct the inclination of Y saddles 76) the Z obliquity information of substrate P is obtained.
Also, this 3rd embodiment, with the configuration identical with above-mentioned 2nd embodiment (also that is, in projection optics system 16 Around), it is configured with 4 pickup unit 272a~272d (with reference to Fig. 9 and Figure 11).The composition of 4 pickup unit 272a~272d, It is substantially identical in addition to difference is configured.Also, without being limited thereto, can also be with the configuration identical with above first embodiment (also that is, In the X position identical with projection optics system 16), the composition of 2 pickup units of configuration.It is at this point, similary with above first embodiment , using the size of X-direction compared with the target 38 that target 138 is grown (with reference to Fig. 2 etc.).
As shown in Figure 10, pickup unit 272a (pickup unit 272b~272d is also same) is similary with above-mentioned 2nd embodiment , have and light, a pair of sensors head 78 (read head downward) in X-direction separation are measured to target 138 (toward -Z direction) irradiation. The Z that substrate P is obtained in a pair (the 8 total) sensor head 78 respectively being had using 4 pickup unit 272a~272d tilts position The gimmick of confidence breath, because identical with above-mentioned 2nd embodiment, description will be omitted.
Herein, in pickup unit 272a, the Y saddles 76 for being equipped with sensor head 78 are (not shown in Figure 10.With reference to Fig. 9) be By linear guide apparatus by the straight composition for being guided in Y direction, sensor head 78 (measures the relatively corresponding target 138 of light Optical axis) it is possible that generating inclination and Z displacements.Therefore, main control unit 50 (with reference to Fig. 4) uses 4 biographies mounted on Y saddles 76 Sensor head 278 (read head upward), the information that inclination (toppling over) amount about Y saddles 76 is obtained (are also included about optical axis direction The information of addendum modification) and according to the output for exporting 2 sensor heads 78 of amendment of 4 sensor heads 278, to offset the Y saddles 76 inclination (offset for measuring the optical axis of light).Also, in this 4th embodiment, 4 sensor heads 278 (read head upward) though match It puts or not with 4 always on positions, but not limited to this, 3 sensor heads 278 can be also configured or not with existing always At the 3 of line.
In present embodiment, as sensor head 278 (sensor upward), such as the thunder identical with sensor head 78 is used Penetrate extensometer, using be fixed on upper pallet portion 18a (with reference to Fig. 9, Figure 11) below extend Y direction target 280 (that is, with On the basis of upper pallet portion 18a), the relevant information of tilt quantity of Y saddles 76 is obtained.As long as it also, can be obtained with the precision being intended to If the information of tilt quantity about Y saddles 76, the type of sensor head 278 is not particularly limited.
The Z inclination informations of substrate P can be obtained in the 3rd embodiment from the description above with higher precision.Also, because passing The output of sensor head 78 (read head downward) is corrected, therefore the straight guidance accuracy of Y saddles 76, is implemented with the above-mentioned 1st and the 2nd Mode is compared can be more coarse.
《4th embodiment》
Secondly, the liquid crystal exposure apparatus of the 4th embodiment is illustrated using Figure 12 and Figure 13.Z in this 4th embodiment inclines Oblique position measurement is 370, as shown in figure 12, with above first embodiment likewise, with the+Y being configured in projection optics system 16 The pickup unit 372a of side, with configuration the-Y sides of projection optics system 16 pickup unit 372b.Also, in substrate holding 36, It is corresponding with pickup unit 372a, 372b that a pair of of target 338 is installed.The X-direction length of target 338 and above first embodiment phase Together.
As shown in figure 13, pickup unit 372a, with above-mentioned 3rd embodiment (with reference to Figure 10) likewise, with in the hope of Go out a pair of sensors head 78 (read head downward) of the Z obliquity information of substrate P (with reference to Figure 12) and to measure a pair of of sensing 4 sensor heads 278 (read head upward) of the amount of tilt information of device head 78.Substrate P is obtained about sensor head 78,278 is used The program of Z obliquity information etc., because identical with above-mentioned 3rd embodiment, therefore the description thereof will be omitted.
Also, the liquid crystal exposure apparatus of this 4th embodiment, as substrate P is obtained in the location information in horizontal plane Measurement system horizontal plane in position measurement be 58 (with reference to Fig. 4), there is encoder system.Hereinafter, about this 3rd embodiment To be illustrated for encoder system, and pair with above-mentioned 1st~the 3rd embodiment have the function of it is identical composition and element, It assigns the symbol identical with above-mentioned 1st~the 3rd embodiment and the description thereof will be omitted.
As shown in figure 12, pickup unit 372a has Y linear actuators 74, is projected by the Y linear actuators 74 is opposite Optical system 16 is in Y direction by the Y saddles 76 that are driven with predetermined stroke and a plurality of measurement read heads for being fixed on Y saddles 76 (being chatted after details).Pickup unit 372b is also identical.The composition and function of Y linear actuators 74 and Y saddles 76, because with the above-mentioned 1st The Y linear actuators 74 and Y saddles 76 that the pickup unit 72a of embodiment has (with reference to Fig. 1) are substantially identical, therefore omit and say It is bright.
As shown in figure 13, pickup unit 372a as the above-mentioned a plurality of parts for measuring read head, has 2 X encoders Read head 384x (X read heads downward), 2 Y encoder heads 384y (Y read heads downward), (X is read 2 X encoder heads 386x upward Head) and 2 Y encoder heads 386y (Y read heads upward).Also, as described above, pickup unit 372a, as above-mentioned a plurality of surveys A part for read head is measured, there are a pair of sensors head 78 (Z read heads downward) and 4 sensor heads 278 (Z read heads upward).More than Each read head 384x, 384y, 386x, 386y, 78,278 be fixed on Y saddles 76 (with reference to Figure 12).Except be in Figure 12 be configured in Into symmetrical outer, pickup unit 372b is also equally constituted paper.In addition, a pair of of target 338, is configured to left and right pair in Figure 12 Claim.
Herein, in this 4th embodiment, a plurality of Measure Boards 340 are installed above target 338.Measure Board 340 is by prolonging The band-like component composition of the vertical view of X-direction is stretched in, then above target 338.The X-direction length of Measure Board 340, with target 338 X-direction length compare it is shorter, a plurality of Measure Boards 340 in X-direction with predetermined distance (being separated from each other) arrange.Also, In above the target 338, comprising the belt-like zone near-Y side ends, do not post Measure Board 340, the belt-like zone opposite direction in A pair of sensors head 78 (Z read heads downward), with above-mentioned 1st~the 3rd embodiment likewise, its function is the Z as substrate P The measuring reflecting surface of obliquity.It also, also can be using the upper surface of a plurality of Measure Boards 340 as reflecting surface, to carry out substrate P Z obliquities measure.Accordingly, because the belt-like zone need not be set, therefore the composition of target 338 can be simplified.
X scales 342x and Y scales 342y are formed in Measure Board 340.X scales 342x is formed in the-Y sides of Measure Board 340 Half region, Y scales 342y is then formed in the half region of+Y sides of Measure Board 340.X scales 342x has the X of reflection-type Diffraction grating, Y scales 342y have the Y diffraction gratings of reflection-type.Also, in Figure 13, for ease of understanding, Measure Board 340 is shown It is relatively practical thick, and form the relatively practical of interval (spacing) display between a plurality of grid lines of X scale 342x, Y scales 342y It is wide.
2 X encoder heads 384x in the state of X scales 342x configurations, irradiate X scales 342x and measure in opposite direction Light.(with reference to Fig. 4) reaction of main control unit 50 is as substrate P (with reference to Figure 12) is toward the movement of X-direction, based on from X scales Substrate P is obtained in the addendum modification information of X-direction in the output of the X encoder heads 384x of the light of 342x.2 Y encoder heads 384y is also similarly oppositely disposed with Y scales 342y, and main control unit 50 reacts the output of Y encoder heads 384y, is obtained Substrate P is in the addendum modification information of Y direction.Also, main control unit 50 is according to pickup unit 372a and pickup unit 372b (references Substrate P is obtained in the rotation amount information in θ z directions in Figure 12) output of each X encoder heads 384x.
Herein, 2 X encoder heads 384x and Y encoder head 384y are set as more adjacent in the interval of X-direction Measure Board 340 between interval it is wide.Therefore, it is unrelated with the X position of substrate P (with reference to Figure 12), 2 X encoder heads 384x, At least one party in Y encoder heads 384y is opposite with Measure Board 340 always.Accordingly, main control unit 50 can root (with reference to Fig. 4) According to the side in 2 encoder heads 384x, 384y or the average value of 2 encoder heads 384x, 384y, substrate P is obtained Location information.Also, in present embodiment, though a plurality of Measure Boards 340 are configured in X-direction with predetermined distance, but not limited to this, X-direction length and the equal strip Measure Board of target 338 can be used.This occasion, substrate P is obtained in horizontal plane The encoder head (X read heads 384x, downward Y read head 384y downward) of location information for 1 pickup unit 372a, 372b, divides It She Zhi not be 1.
Also, being 58 about position measurement in horizontal plane, the X that +X direction side is set in the Measure Board 380 of opposite Figure 13 is encoded Device read head 384x and Y encoder heads 384y (the read head group for claiming +X direction side) is past from the 1st Measure Board 340 in Measure Board 340 When the movement of 2nd Measure Board 340 (Measure Board 340 adjacent with the 1st Measure Board) is to measure 2 Measure Board 340, the reading of +X direction side Head group, though substrate P can be measured in X-direction after the 2nd Measure Board 340 is used to act possible state into measurement Location information, but the output of the read head group of +X direction side is started counting up once again, therefore be not used to base from underrange (or zero) The calculating of the X position information of plate P.Therefore, in this case, the processing that continues for the output for needing +X direction side read head group each. As the processing that continues, specifically, into the output for the +X direction side read head group for being about to underrange (or zero), opposite Measure Board is used 380 are located at the output of the X encoder heads 384x and Y encoder heads 384y (the read head group for claiming -X direction side) of -X direction side Corrected the processing of (become with value).The read head group of the processing in -X direction side that continue reaches the measurement range of the 1st scale Terminate before outer.
Likewise, when the read head group of -X direction side reaches the situation outside the measurement range of the 1st Measure Board 340, reach Before outside the measurement range, the output of -X direction side read head group is considered as in vain.Therefore, the X position information of substrate P be according to+ The output of X-direction side read head group is obtained.Then, the 2nd mark and then can be used in each become of -X direction side read head group After ruler plate 340 measures action, the read head group of p- X-direction side continued using the output of +X direction side read head group Processing.
Also, the premise of the above-mentioned processing that continues is, 4 read heads (the read head group of +X direction side, the read head group of -X direction side) Mutual position relationship is known.Position relationship between this each read head, can be in above-mentioned 4 read head opposite directions in the shape of common scale It is obtained using the scale or is added using measuring device (laser interferometer and range sensor etc.) of the configuration between each read head under state To be obtained.This processing that continues can be carried out with regard to X read heads 386x upward and Y read heads 386y, also can just Z read heads 78 and Z is read upward downward First 278 grade carries out.
Also, main control unit 50 (with reference to Fig. 4), with above-mentioned 1st~the 3rd embodiment likewise, with substrate P (reference Figure 12) toward the movement of Y direction, Y saddles 76 (with reference to Figure 12) past Y direction synchronous with substrate P is driven.At this point, this implementation Position measurement is 58 X encoder head 384x, Y encoder heads 384y being had according to Y saddles 76 in the horizontal plane of mode The location information of substrate P is obtained in output, and therefore, Y saddles 76 itself, also must be with same with substrate P toward the addendum modification information of Y direction The precision of degree is measured.Therefore, position measurement is 58 in the horizontal plane of present embodiment, as Y saddle position measurements system 80 (with reference to Fig. 4) are further equipped with that Y saddles are obtained using being fixed on the Measure Boards 380 of pallet portion 18a (with reference to Figure 12) below The encoder system of 76 displacement.
Measure Board 380 is made of the tabular component for extending Y direction, similary with said scale plate 340 in below , it is formed with X scale 382x and Y scales 382y.Also, in Y saddles 76 (with reference to Figure 12), with X scales 382x it is opposite, be equipped with 2 A X encoder head 386x in Y direction separation, and it is opposite with Y scales 382y, 2 Y detached in Y direction are installed Encoder head 386y.Also, Measure Board 380 is also opposite with 4 sensor heads 278 (Z read heads upward), also there is conduct to use The function of target (reflecting surface) when 4 sensor heads 278 are obtained the tilt quantity of Y saddles 76.
Main control unit 50 (with reference to Fig. 4), it is same with the substrate P when substrate P (with reference to Figure 12) is made to be moved toward Y direction Step makes Y saddles 76 be moved toward Y direction.Main control unit 50 is according to 2 X encoder heads 386x and 2 Y encoder heads Y saddles 76 at this time are obtained in the location information in X/Y plane in the output of 386y, and according to the location informations of the Y saddles 76 with Mounted on the output of 2 X encoder head 384x, Y encoder heads 384y of Y saddles 76, substrate P is obtained in X/Y plane Location information.As previously discussed, position measurement is 58 in the horizontal plane of present embodiment, through Y saddles 76, indirectly with device On the basis of ontology 18, substrate P is obtained in the location information in horizontal plane with encoder system.
The 4th embodiment from the description above is that substrate P is obtained with encoder system in the position in X/Y plane to believe Breath, therefore compared with optical interferometer system, the influence of airwaves etc., improving measurement accuracy can be reduced.In addition, present embodiment Encoder system, read head follows substrate P and moved toward the movement of Y direction, and there is no need to prepare that substrate P can be covered to put down in XY The big Measure Board of full moving range in face.
Also, in this 4th embodiment, it is obtained by X encoder head 384x, 386x and Y encoder heads 384y, 386y Location information in substrate P and each X/Y plane of Y saddles 76, but also can be used measurable Z-direction addendum modification information 2 Tie up encoder head (XZ encoder heads or YZ encoder heads), the position with substrate P and Y saddles 76 in each X/Y plane Information, is obtained substrate P together and each Z of Y saddles 76 tilts addendum modification information.This occasion can omit that substrate P is obtained The sensor head 78,278 of Z obliquity information.Also, this occasion, for the Z obliquity information of substrate P, 2 Z readings downward are obtained Head must be opposite always in Measure Board 340, therefore, by by Measure Board 340 with 1 strip with target 338 with the length of degree Measure Board is configured 3 or more preferably in X-direction to form or tie up encoder heads by above-mentioned 2 with predetermined distance.
Also, in this 4th embodiment, it is equipped with to obtain substrate P in the location information in X/Y plane above target 338 And the Measure Board 340 and the measuring measured surface of Z obliquities of substrate P used (does not post the banded regions of Measure Board 340 Domain), the place that continues that there is no need to by X encoder heads 384x and Y encoder head 384y across between Measure Board 340 when carries out Reason is carried out for sensor head 78 (Z read heads downward).In this way, it can simply carry out Z obliquity measurements.Also, it can will also answer As reflecting surface above several Measure Boards 340, in the situation that the Z obliquities for carrying out substrate P measure, for sensor head 78 (Z read heads downward) also carry out the processing that continues.This occasion due to that can be not provided with the belt-like zone, can simplify the structure of target 338 Into.
Herein, as described above, when aforesaid substrate keeps the Y stepwise operations of tool 36, in baseplate carrier device 20, such as 2 A Y saddles 76 and substrate holding 36 synchronize be driven in Y direction.Also that is, main control unit 50 (with reference to Fig. 4) basis on one side The output of encoder system drives substrate holding 36 to target location toward Y direction, on one side according to Y saddle position measurements system 80 (with reference to Fig. 4.Encoder system herein) output Y saddles 76 are driven in Y direction.At this point, main control unit 50 is same Step driving Y saddles 76 and substrate holding 36 (in a manner that Y saddles 76 follow substrate holding 36).Also, main control unit 50 It is that at least one read head in a plurality of read head 384x, 384y will not be detached from (will not to measurable range outside) from Measure Board 340 Range, carry out the position control of Y saddles 76.
Therefore, it is unrelated (in the movement also comprising substrate holding 36) with the Y location of substrate holding 36, from X read heads The measuring beam that 384x, Y read head 384y (respectively referring to Figure 13) irradiate respectively, will not be from X scale 342x, Y scales 342y (respectively With reference to Figure 13) it is detached from.In other words, if make substrate holding 36 toward Y direction movement in (in Y stepwise operations) from X read heads Each degree that will not be detached from from X scale 342x, Y scales 342y of the measuring beam of 384x, Y read head 384y irradiations, even if also The measurement carried out with the measuring beam from X read head 384x, Y read heads 384y will not interrupt (sustainable measurement) degree, make such as 2 A Y saddles 76 are synchronous with substrate holding 36 to be moved toward Y direction.
At this point, can before substrate holding 36 is mobile toward step direction (Y direction), make Y saddles 76 (X read heads 384x, 386x, Y read head 384y, 386y) first start to move toward step direction compared with substrate holding 36.In this way, it can inhibit adding for each read head Speed further suppresses the inclination of each read head on the move (with respect to the inclined situation of direction of travel).In addition, this is also may replace, Y saddles 76 is made to start to move toward step direction slowly compared with substrate holding 36.
Also, at the end of the Y stepwise operations of substrate holding 36, i.e., it is 54 (reference figures according to mask stage position measurement 4) output drives light shield M in -X direction, and synchronous with light shield M (with reference to Fig. 1), according to position in baseplate carrier horizontal plane Measurement system is put (with reference to Fig. 4.Encoder system herein) output substrate holding 36 is driven in -X direction, according to this by light Cover pattern is transferred to irradiation (shot) region in substrate P.At this point, for example 2 Y saddles 76 are stationary state.It is exposed in liquid crystal Device 10, by the suitably scanning motion of above-mentioned light shield M, the Y stepwise operations of substrate holding 36 and substrate holding 36 repeatedly Scanning motion, mask pattern is sequentially transferred to a plurality of irradiation areas in substrate P according to this.When above-mentioned exposure actions, example Such as 2 Y saddles 76, to maintain the opposite state with target 338 (Measure Board 340), and in substrate holding 36 every time toward +Y direction And during -Y direction stepping, driven with the substrate holding 36 toward equidirectional, same distance.
Herein, as described above, Y scales 342y has a plurality of grid lines for extending X-direction.In addition, such as Figure 17 institutes Show, the point of irradiation 384y that the measuring beam on Y scales 342y is exposed to from Y read heads 384y (for convenience, is assigned and Y read heads The same symbol illustrates), it is the ellipticity using Y direction as long axis direction.In encoder system, as Y read heads 384y and Y Scale 342y in Y direction relatively move and measuring beam across grid line when, the output from Y read heads 384y is according to coming from The phase change of ± 1 diffraction light of above-mentioned point of irradiation and change.
In contrast, main control unit 50 (with reference to Fig. 4), in the action of above-mentioned scan exposure, substrate holding 36 is driven It moves when scanning direction (X-direction), to come from the measuring beam of Y read heads 384y possessed by Y saddles 76 (with reference to Figure 12) not Can across the mode for a plurality of grid lines for forming Y scales 342y, also that is, will not change using the output of Y read heads 384y (variation as Zero) mode, the position (Y location) of the step direction of control Y saddles 76.
Specifically, for example with sensor of the analytic ability higher than the spacing between the grid line for being formed Y scales 342y The Y location of Y read heads 384y is measured, it will be across grid line (Y read heads in the point of irradiation of the measuring beam from Y read heads 384y The output of 384y will change) eve, through the Y location of Y linear actuators 74 (with reference to Figure 12) control Y read heads 384y. In addition, it is without being limited thereto, also for example it can cause Y read heads 384y's due to the measuring beam from Y read heads 384y is across grid line When exporting the situation of variation, this is reacted on, by control is driven to Y read heads 384y, substantive makes from Y read heads 384y Output do not change.This occasion does not need to measure the sensor of the Y location of Y read heads 384y.
《5th embodiment》
Secondly, the liquid crystal exposure apparatus of the 5th embodiment is illustrated using Figure 14 and Figure 15.The liquid crystal of this 5th embodiment Exposure device and above-mentioned 4th embodiment likewise, substrate P is obtained in the location information in horizontal plane using encoder system, But the encoder system measures the pickup unit of system with the pickup unit of (position measurement system in horizontal plane), with Z obliquities It is independent point, it is different from above-mentioned 4th embodiment.Hereinafter, explanation and the dissimilarity of the 4th embodiment, for the above-mentioned 4th Embodiment have the function of identical composition and element, assigning the symbol identical with above-mentioned 4th embodiment, simultaneously the description thereof will be omitted.
Z obliquities in the liquid crystal exposure apparatus of this 5th embodiment measure system, incline with the Z of above-mentioned 3rd embodiment Oblique position measurement is 270 to equally constitute.Also that is, as shown in figure 14,4 pickup units are equipped with below upper pallet portion 18a (in Figure 12, pickup unit 272b, 272d are not shown by 272a~272d.With reference to Fig. 9 etc.), use pickup unit 272a~272d The Z obliquity information of substrate P is obtained.In upper pallet portion 18a, it is fixed in a manner of with pickup unit 272a~272d opposite directions Target 280 (reflecting surface).Substrate P is obtained about the Z sensor head 78,278 that 4 pickup unit 272a~272d is used to be respectively provided with The program of Z obliquity information etc., because identical with above-mentioned 3rd embodiment, description will be omitted.
Encoder system (position measurement is 58 in horizontal plane), with above-mentioned 4th embodiment likewise, across projection optics It is 16 there is a pair of of pickup unit 472a, 472b.Pickup unit 472a, 472b in addition to difference is configured, substantially have phase isomorphism Into.Pickup unit 472a is configured between pickup unit 272a and pickup unit 272c.Though in addition, non-icon, pickup unit 472b is configured between pickup unit 272b and pickup unit 272d.Pickup unit 472a, 472b and pickup unit 272a~ 272d is likewise, be fixed below pallet portion 18a.Also, consolidate in upper pallet portion 18a and pickup unit 472a, 472b opposite direction Surely there is Measure Board 380.
As shown in figure 15, pickup unit 472a is to be gone from the pickup unit 372a of above-mentioned 4th embodiment (with reference to Figure 13) Except the object of a plurality of sensor heads 78,278.About pickup unit 472a, the 472b used in this 5th embodiment (with reference to figure 14) substrate P is obtained in program of the location information in horizontal plane etc., because identical with above-mentioned 4th embodiment, description will be omitted.
According to this 5th embodiment, incline due to the pickup unit of position measurement system in the horizontal plane of substrate P, with the Z of substrate The pickup unit of oblique position measurement system is independent, therefore compared with above-mentioned 4th embodiment, the composition letter of pickup unit The configuration of single and each sensor head is easy.In addition, being compared with above-mentioned 4th embodiment, the X-direction ruler of target 438 can be shortened It is very little.
《The variation of 4th and the 5th each embodiment》
(position measurement is 58 in baseplate carrier horizontal plane when being encoder system also, above-mentioned 4th and the 5th each embodiment Embodiment) in, by X scales (the measuring grid pattern of X-direction shown in figure) and Y scales (Y-axis shown in figure The grid pattern of orientation measurement) being arranged on scale component independent of each other, (example is such as disposed in a plurality of scales on target 338 Plate).It however, also can be by these a plurality of grid patterns, to be separated into the group of grid of a group on same long scale component The mode of pattern is formed.It alternatively, also can be in same long scale with being formed continuously grid pattern on component.
It also, will be on target 338,438, in a plurality of scales of X-direction through the mark of the gap connection configuration of predetermined distance Ruler group (scale row), with a plurality of row configurations each other in the different location of Y direction separation (such as opposite projection optics system 16 Side (+Y sides) position, with the position of opposite side (- Y sides)) situation when, can be configured between a plurality of row, be above-mentioned set The position in the gap at interval is not repeated in X-direction.If a plurality of scale row are configured by this method, i.e., do not have and correspond to each other The read head of scale row configuration reaches the situation of measurement range outer (in other words, two read heads are opposite in gap simultaneously) simultaneously.
Also, it will be configured on target 338,438 in a plurality of scales of X-direction through the gap connection of predetermined distance Scale group (scale row), with a plurality of row configurations each other in the different location of Y direction separation (such as opposite projection optics system The position of 16 side (+Y sides), with the position of opposite side (- Y sides)) situation when, can be (a plurality of by this plurality of scale group Scale arranges) it is configured to that use can be distinguish according to the configuration (irradiation figure, shot map) of the irradiation on substrate.It for example, will The whole length of a plurality of scales row is made between scale row if inequality, can be in response to different irradiation figures, also can be in response to taking The situation in 4 faces is with taking the quantity of the irradiation area formed on the substrates such as the situation in 6 faces to change.In addition, it is configured and makes by this method The position in the gap of each scale row is if X-direction is the position of inequality, because corresponding to each read head of a plurality of scales row respectively It does not have while as the situation outside measurement range, therefore the number for the sensor for being considered as underrange in the processing that continues can be reduced Amount, carries out the processing that continues with high precision.
Also, configuration can will be connected through the gap of predetermined distance on target 338,438 in a plurality of scales of X-direction Scale group (scale row) in, 1 scale (the measuring pattern of X-axis) in the length of X-direction, make can METHOD FOR CONTINUOUS DETERMINATION 1 shine Penetrate region length (the substrate on making substrate holding on one side toward X-direction it is mobile, while be scanned exposure when, component The length that pattern is illuminated and is formed on substrate) amount length.Thus, in the scan exposure of 1 irradiation area, without The control that continues of the relatively a plurality of scales of read head is carried out, therefore (substrate is kept the substrate P that can be readily scanned in exposure Tool) position measurement (position control).
Also, the scale that a plurality of scales are configured in the gap through predetermined distance on target 338,438 in X-direction connection In group's (scale row), in the above embodiment, though the identical person of the length of each scale is connected into configuration, it also can be by length inequality Scale connection configuration.For example, during can the scale on target 338,438 be arranged, the length in the scale of central portion is configured in X-direction It is long physically to make the X-direction of scale (in scale row, the scale in each end is configured) that closer both ends are respectively configured Degree length.
Also, through a plurality of scales in the gap of predetermined distance in the scale group of X-direction connection configuration on target 338,438 In (scale row), distance (in other words, gap length) between a plurality of scales, the length of 1 scale and with the opposite scale 2 mobile read heads of row (in the read head that the inside of 1 Y saddle 76 is configured opposite to each other, such as 2 read heads shown in Figure 13 384x), it is in a manner of meeting the relationship of " distance between distance > scales between read head oppositely disposed 1 length of the scale > " Configuration.This relationship is not only the scale being located on target 338,438 and read head 384x, 384y correspondingly, will be set on restocking The Measure Board 380 of platform portion 18a is located at the Measure Board of pallet portion 18a on this when the situation that Y direction is configured with predetermined distance Also meet above-mentioned relation between 380 and read head 386x, 386y correspondingly.
Though also, a pair of X read heads 384x and a pair of Y read heads 384y are arranged (X in a manner that each 1 pairs of in X-direction Though read head 384x and Y read heads 384y is configured in X-direction in same position), this can also be matched equal to X-direction relative misalignment It puts.
Also, in the Measure Board 340 being formed on target 338,438, though X scales 342x and Y scales 342y in X-direction with same One length is formed, but can also make this equal length inequality.In addition, the two can also be configured in X-direction relative misalignment.
Also, scale row in a certain Y saddles 76 and correspondingly are (through given clearance by a plurality of scales in set direction The scale row of connection configuration) when X-direction relatively moves, a certain group of read head in Y saddles 76 (such as the X read heads of Figure 13 384x and Y read head 384y) opposite direction (is read when the situation of another scale simultaneously again behind the opposite gap between said scale at the same time When head 384x, 384y are routed to the situation of another scale), it is necessary to calculate the measurement initial value of the read head to continue.At this point, it can make With another one group of read head (384x, 384y) remaining in Y saddles 76 different from the read head to continue and unlike this another The output of read head (detached in X-direction and the position person short compared with length of the scale of the distance between the read head of disengaging is configured), comes Calculate initial value of the read head to continue when continuing.Above-mentioned another read head can be the position measurement read head, also of X-direction It can be the position measurement read head of Y direction.
Also, in the situation for being described " Y saddles 76 and 36 synchronizing moving of substrate holding " above, this is to represent Y saddles 76 Substantially to maintain the meaning of the state movement to the relative position relation of substrate holding 36, it is not limited to Y saddles 76, substrate is protected Hold the situation that 36 position relationship, moving direction and movement speed between the two of tool is moved with tight consistent state.
Also, encoder system, is moved to and the substrate of substrate loader replacement position to obtain baseplate carrier device 20 The location information of period can set the scale of substrate replacement, using downward in baseplate carrier device 20 or other bearing table devices Read head (X read heads 384x etc.) obtains the location information of baseplate carrier device 20.Alternatively, in baseplate carrier device 20 or other loads Table apparatus sets the read head of substrate replacement, by surveyors' staff plate 340 or substrate replacement scale, obtains baseplate carrier dress according to this Put 20 location information.In addition, the setting another location different from encoder system measures and is (such as the label on microscope carrier and sight Examine the observation system of this label) control (management) to carry out the replacement position of microscope carrier.
Also, Z sensor is not limited to encoder system, it can be laser interferometer, TOF sensor, can also can measure The sensor of distance.
Though also, be on target 338,438 set Measure Board 340 composition, also can be by scale with the direct shape of exposure-processed Into in substrate P.For example, the delineation between may be formed at irradiation area is online.In this way, the scale being formed on substrate can be measured, According to the position measurements, the non-linear ingredient error of each irradiation area on substrate is obtained, in addition, also can be according to the error Promote overlapping precision during exposure.
Also, though Y saddles 76, Y linear actuators 74 are located at below the upper pallet portion 18a of device body 18 (with reference to figure 12) it may be provided at, but also lower pallet portion 18b or middle pallets portion 18c.
《6th embodiment》
Secondly, the liquid crystal exposure apparatus of the 6th embodiment is illustrated using Figure 16 (a) and Figure 16 (b).This 6th embodiment Liquid crystal exposure apparatus, the baseplate carrier substrate P to be carried out to high accuracy positioning with respect to projection optics system 16 (with reference to Fig. 1) fills 520 composition is put, it is different with above-mentioned 1st~the 5th embodiment.The location information in the 6DOF direction of substrate P is obtained The composition of system is measured, the measurement for measuring the identical composition of any one of system with above-mentioned 1st~the 5th embodiment can be suitably used System.Hereinafter, about this 6th embodiment, the only dissimilarity of explanation and above-mentioned 1st~the 5th embodiment, for the above-mentioned 1st ~the 5 embodiment have the function of identical composition and element, assign the symbol identical with above-mentioned 1st~the 5th embodiment simultaneously The description thereof will be omitted.
In above-mentioned 1st~the 5th embodiment, substrate P is to be held in (the ginseng of substrate holding 36 by vacuum suction with its back side According to Fig. 1 etc.), in contrast, as shown in Figure 16 (a) and Figure 16 (b), the baseplate carrier device 520 in this 6th embodiment, base Plate keeps tool 540 to be formed as overlooking rectangular box-like (picture frame shape), and it is different that only absorption, which keeps the point near the end of substrate P,. In addition, comprising substrate P central portion substantially comprehensively, by can driven a little in Z inclined directions non-contact 536 of relative level Non-contact bearing from below, according to this along the upper surface of this non-contact 536 by plane rectification.
If further description, non-contact 536 is fixed on above fine motion microscope carrier 32.In this 6th implementation Mode, fine motion microscope carrier 32 (but, are tilted through a plurality of linked sets 550 comprising globe joint etc. are mechanical with energy toward Z The state that direction is moved a little) X coarse motions microscope carrier 26 is linked to, it is drawn by by the X coarse motions microscope carrier 26, and past X-direction and Y-axis It is moved with set long stroke in direction.Also, substrate holding 540, has and is formed as overlooking rectangular box-like body part 542 and consolidate It is scheduled on the adsorption section 544 above the body part 542.Adsorption section 544 is also with body part 542 likewise, be formed as overlooking rectangle frame Shape.Substrate P is held in adsorption section 544 by vacuum suction.Above-mentioned non-contact 536, with the adsorption section to substrate holding 540 544 are formed with the state of given clearance, are inserted into possessed by the adsorption section 544 in opening.Non-contact 536, by and with pair The ejection of gas-pressurized below substrate P and the attraction of gas make load (pre-load) act on substrate P, by the substrate P with Contactless state (state for not interfering relative movement along the horizontal plane) is subject to plane rectification.
Also, below fine motion microscope carrier 32, plural pieces (being 4 in present embodiment) guide plate 548 is along the horizontal plane into radiation Shape extends.Substrate holding 540, corresponding above-mentioned plural pieces guide plate 548, has a plurality of pads 546 comprising air bearing, by The static pressure of the gas-pressurized above guide plate 548 is sprayed to from the air bearing, is positioned on guide plate 548 with contactless state.It is micro- Dynamic load platform 32, it is different from above-mentioned 1st~the 5th embodiment, it is only driven a little in Z inclined directions with respect to X coarse motions microscope carrier 24. At this point, since past Z inclined direction of the above-mentioned plural pieces guide plate 548 also with 32 one of fine motion microscope carrier moves (postural change), When fine motion 32 postural change of microscope carrier, the fine motion microscope carrier 32, non-contact 536 and substrate holding 540 (that is, substrate P) i.e. one The postural change of body.
Also, substrate holding 540, through comprising the substrate holding 540 with can mover and fine motion microscope carrier 32 with Stator a plurality of linear motors 552 (voice coil motor), with respect to fine motion microscope carrier 32 driven a little in 3 in horizontal plane from By spending direction.In addition, when fine motion microscope carrier 32 is moved along X/Y plane with long stroke, with fine motion microscope carrier 32 and the substrate holding 540 can one along X/Y plane in a manner that long stroke moves, by above-mentioned a plurality of linear motors 552 to substrate holding 540 assign thrust.
In substrate holding 540, with above first embodiment likewise, being fixed with target 38 through bracket 38a.Main control Device 50 (with reference to Fig. 4), with above first embodiment likewise, using a plurality of sensor heads for measuring light are irradiated to target 38 78 (with reference to Fig. 1 etc.) measure the postural change amount of substrate holding 540 (that is, substrate P).Also, include a plurality of sensor heads 78 configuration, the composition of the measurement system of the Z obliquities of substrate P can similarly be deformed with above-mentioned 2nd~the 5th embodiment.This Outside, in this 6th embodiment, though target 38 is fixed through bracket 38a in substrate holding 540, but not limited to this, can it is protected in substrate It holds and target 38 (and Measure Board 340) is directly attached above tool 540, can also carry out mirror finish to the upper surface of substrate holding 540, To make it have the function equal with target.
Also, the composition illustrated in above-mentioned 1st~the 6th each embodiment, can suitably change.For example, above-mentioned each embodiment party It is to being mounted on substrate holding the sensor head 78 (read head downward) of the Z obliquity information of substrate P is obtained in formula Reflecting surface irradiation measures light possessed by 36 target 38 (138,238), but as long as the measurement irradiated from sensor head 78 can be reflected Light and if reflecting the postural change of substrate P, the form of target is without being limited thereto, can also make substrate P reflection measurement light (also That is, substrate P is made to play the function of target in itself).In addition, target 38 of the respective embodiments described above etc. can also be mounted in fine motion microscope carrier 32。
It is with respect to the target 38 for extending X-direction (scanning direction), 78 (court of sensor head also, in the respective embodiments described above Lower read head) toward Y direction movement composition, but not limited to this, can also be that target 38 extends other directions (Y direction), pass The composition that sensor head 78 is moved relative to the extending direction of the target 38 in direction orthogonal in horizontal plane.
It is that baseplate carrier device 20 has the target 38 for extending X-direction, mounted on dress also, in the respective embodiments described above Put the composition of the past Y direction movement synchronous with the target 38 of sensor head 78 of ontology 18, but also can be on the contrary, baseplate carrier device 20 have sensor head 78, mounted on the composition of the target 38 of device body 18 past Y direction movement synchronous with the sensor head 78. This occasion measures the postural change of target 38, and the output of sensor head 78 is corrected according to the output.
Also, in the respective embodiments described above, weight payment device 28 is positioned in can be toward the Y of the movable platform of Y direction movement On stepping guiding element 30, but not limited to this, can also be with can cover weight offset device 28 in the full movement in X/Y plane Weight payment device 28 is loaded on the fixed platform of the guiding face of range.
Also, be that light source used in 12 and the wavelength of illumination light IL irradiated from the light source are not particularly limited in illuminating, it can To be ultraviolet light, the F of ArF excimer laser light (wavelength 193nm), KrF excimer laser light (wavelength 248nm) etc.2Laser light The vacuum-ultraviolet light of (wavelength 157nm) etc..
Also, in the respective embodiments described above, though it is to use equimultiple system as projection optics system 16, but not limited to this, can also it make It is with reducing system or amplifying.
Also, the liquid crystal that the purposes of exposure device is not limited to LCD assembly pattern being transferred to square glass sheet exposes Electro-optical device, can also be widely suitable for for example organic EL (Electro-Luminescence) panel manufacture exposure device, The exposure device of semiconductor manufacturing, the exposure device to manufacture film magnetic head, micro-machine and DNA chip etc..In addition, not only Only it is the micromodule of semiconductor subassembly etc., for manufacture light exposure device, EUV exposure devices, X-ray exposure device and electron beam exposure Graticule or light shield used in device etc., and circuit pattern is transferred to the exposure device of glass substrate or Silicon Wafer etc., also It can be applicable in.
Also, the object as exposure object is not limited to glass plate, can also be for example wafer, ceramic substrate, film member, Or other objects such as light shield motherboard (blank light shield).In addition, when exposure object object is the situation of flat-panel monitor substrate, the base The thickness of plate is not particularly limited, and also includes such as film-form (flexible flat member).Also, the exposure dress of present embodiment It puts, is particularly effective when exposure object object is an edge lengths or the substrate to more than angular length 500mm.In addition, in exposure object When substrate is the situation with flexible sheet, which can be created as scroll-like.
The electronic building bricks such as LCD assembly (or semiconductor subassembly) are the steps designed via the functional performance for carrying out component Suddenly the step of, making light shield (or graticule) according to this design procedure makes the step of glass substrate (or wafer), with above-mentioned each The pattern of light shield (graticule) is transferred to the following a lithography step, right of glass substrate by the exposure device and its exposure method of embodiment Development step that glass substrate after exposure develops, by the exposing component of the part other than remaining Resist portions to etch The etching step that is removed, by after etching should not the resist that removes of resist remove step and cell assembling step, Checking step etc. and produce.This occasion implements aforementioned exposure side in following a lithography step using the exposure device of the above embodiment Method in formation component pattern on glass substrate, therefore can manufacture the component of high integrated degree with good productivity.
Also, quote all U.S. Patent Application Publication specifications about the exposure device cited in the above embodiment etc. And the announcement of US Patent specification, the part recorded as this specification.
Industrial applicibility
As described above, mobile body device of the invention and measuring method are suitable for being obtained the location information of moving body.Also, The exposure device of the present invention is suitable for exposing object.In addition, the manufacturing method of the flat-panel screens of the present invention shows suitable for plane The manufacture of device.Furthermore assembly manufacture method of the invention is suitable for the manufacture of micromodule.
【Symbol description】
10:Liquid crystal exposure apparatus
20:Baseplate carrier device
36:Substrate holding
70:Baseplate carrier Z obliquities measure system
72a、72b:Pickup unit
74:Y linear actuators
76:Y saddles
78:Sensor head
P:Substrate

Claims (21)

1. a kind of mobile body device, has:
1st moving body keeps object, can be moved to the 1st direction;
2nd moving body, it is opposite disposed with the 1st moving body, it can be moved to the 1st direction;And
Measurement portion has the measurement system being located on a moving body in the 1st moving body and the 2nd moving body, with being located at Measured system on another moving body, the system that measures moves measured system's irradiation measuring beam to measure the described 1st The position of kinetoplast in the up-down direction,
The measurement portion measures in the following manner, i.e., relative to the 1st moving body moved to the 1st direction, with The mode opposed with the 1st moving body makes the 2nd moving body be moved to the 1st direction.
2. mobile body device as described in claim 1, wherein, the 2nd moving body will not be from described with the measuring beam The mode that system is detached from is measured, is moved relative to the 1st moving body to the 1st direction.
3. mobile body device as claimed in claim 1 or 2, wherein, the system that measures is set on the 2nd moving body;
The measurement portion compensation generates due to the measurement for being set on the 2nd moving body is the driving to the 1st direction Using the upper and lower directions as the measurement error of the direction of rotation of axis, to measure position of the 1st moving body on the 1st direction It puts.
4. mobile body device as claimed any one in claims 1 to 3, wherein, described in the measured system has and can measure The length of mobile range of 1st moving body on the 2nd direction intersected with the 1st direction.
5. mobile body device as claimed in claim 4, wherein, the 1st moving body will not be from described with the measuring beam The mode that system is detached from is measured to move to the 2nd direction.
6. mobile body device as described in claim 4 or 5, wherein, when the 1st moving body is moved to the 2nd direction, The measurement portion measures in the case of the 2nd moving body is not changed in the position on the 2nd direction.
7. the mobile body device as described in any one of claim 4 to 6, wherein, the system that measures is equipped with multiple;
Multiple measurement systems position inequality on the 2nd direction to the measurement point of the measured system.
8. the mobile body device as described in any one of claim 1 to 7, wherein, the measurement portion shines the measured system It penetrates the measuring beam and according to the return light from the measured system of the measuring beam, measures the 1st moving body Position in the upper and lower directions.
9. such as mobile body device described in any item of the claim 1 to 8, it is further equipped with as the 1st moving body The reference feature of mobile benchmark;
2nd moving body is configured in the upper and lower directions between the 1st moving body and the reference feature.
10. mobile body device as claimed in any one of claims 1-9 wherein, has:
1st measures system, location information of the 2nd moving body on the 1st direction is obtained;And
2nd measure system, comprising on a moving body being located in the 1st moving body and the 2nd moving body diffraction grating, And it is obtained on another moving body being located in the 1st moving body and the 2nd moving body and using the diffraction grating The encoder head of location information of 1st moving body in 2 dimensional planes comprising the 1st direction;
The output for measuring system and the 2nd measurement system according to the described 1st, is obtained position of the 1st moving body in 2 dimensional plane Information.
11. the mobile body device as described in any one of claims 1 to 10 is further equipped with supporting institute in a non contact fashion State the supporting part of object;
1st moving body keeps the object by the non-contact bearing of the supporting part.
12. a kind of mobile body device, has:
1st moving body keeps object, can be moved to the 1st direction;
2nd moving body, it is opposite disposed with the 1st moving body, it can be moved to the 1st direction;And
Measurement portion has the measurement system being located on a moving body in the 1st moving body and the 2nd moving body, with being located at Measured system on another moving body, the system that measures moves measured system's irradiation measuring beam to measure the described 1st The position of kinetoplast in the up-down direction.
13. a kind of exposure device, has:
Mobile body device described in any one of claim 1 to 12;And
The patterning device of predetermined pattern is formed using energy beam to the object that the 1st moving body is kept.
14. exposure device as claimed in claim 13, wherein, the object is the substrate for flat-panel screens.
15. the exposure device as described in claim 13 or 14, wherein, the length at least one side of the substrate or diagonal a length of More than 500mm.
16. a kind of manufacturing method of flat-panel screens, it includes:
The step of exposing the object using the exposure device described in any one of claim 13 to 15;And
The step of object after exposure is made to develop.
17. a kind of assembly manufacture method, it includes:
The step of exposing the object using the exposure device described in any one of claim 13 to 15;And
The step of object after exposure is made to develop.
18. a kind of measuring method, comprising:
Keep object simultaneously can be opposite disposed to the 1st moving body that the 1st direction is moved and with the 1st moving body and can be to being located at The measured system on a side in 2nd moving body of the 1st direction movement, moves from the 1st moving body is located at the described 2nd Measurement system irradiation measuring beam on the opposing party in kinetoplast, to measure the position of the 1st moving body in the up-down direction Step;
In the step of carrying out the measurement, in a manner that the 1st moving body with being moved to the 1st direction is opposed, institute It states the 2nd moving body to move to the 1st direction relative to the 1st moving body, carries out the measurement.
19. measuring method as claimed in claim 18, wherein, the 2nd moving body will not be from described with the measuring beam The mode that system is detached from is measured to move to the 1st direction relative to the 1st moving body.
20. the measuring method as described in claim 18 or 19, wherein, the system that measures is set on the 2nd moving body;
In the step of carrying out the measurement, compensate because the measurement set on the 2nd moving body is to the 1st direction It is mobile and generation using the upper and lower directions as the measurement error of the direction of rotation of axis, to measure the 1st moving body described Position on 1st direction.
21. the measuring method as described in any one of claim 18 to 20, wherein, described in the measured system has and can measure The length of mobile range of 1st moving body on the 2nd direction intersected with the 1st direction.
CN201680057153.7A 2015-09-30 2016-09-28 Movable body device, exposure device, method for manufacturing flat panel display, and method for manufacturing device Active CN108139676B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015-192793 2015-09-30
JP2015192793 2015-09-30
PCT/JP2016/078636 WO2017057465A1 (en) 2015-09-30 2016-09-28 Mobile device, exposure device, method for manufacturing flat panel display, method for manufacturing device, and measuring method

Publications (2)

Publication Number Publication Date
CN108139676A true CN108139676A (en) 2018-06-08
CN108139676B CN108139676B (en) 2022-03-18

Family

ID=58427727

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680057153.7A Active CN108139676B (en) 2015-09-30 2016-09-28 Movable body device, exposure device, method for manufacturing flat panel display, and method for manufacturing device

Country Status (6)

Country Link
JP (1) JP6958354B2 (en)
KR (1) KR20180059864A (en)
CN (1) CN108139676B (en)
HK (1) HK1249191A1 (en)
TW (2) TW202044465A (en)
WO (1) WO2017057465A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180059812A (en) * 2015-09-30 2018-06-05 가부시키가이샤 니콘 EXPOSURE APPARATUS AND EXPOSURE METHOD,
WO2017057465A1 (en) * 2015-09-30 2017-04-06 株式会社ニコン Mobile device, exposure device, method for manufacturing flat panel display, method for manufacturing device, and measuring method
JP6855009B2 (en) * 2015-09-30 2021-04-07 株式会社ニコン Exposure equipment and exposure method, and flat panel display manufacturing method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003100627A (en) * 2002-08-28 2003-04-04 Nikon Corp Scanning exposure device and manufacturing method therefor
CN101533228A (en) * 2008-03-11 2009-09-16 Asml荷兰有限公司 Method and lithographic apparatus for measuring and acquiring height data relating to a substrate surface
CN101689024A (en) * 2007-11-09 2010-03-31 株式会社尼康 Movable body apparatus
CN102566287A (en) * 2010-12-16 2012-07-11 上海微电子装备有限公司 Vertical direction control device and method for photoetching machine

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3258194B2 (en) * 1995-03-02 2002-02-18 キヤノン株式会社 Exposure apparatus and exposure method
JP2001004357A (en) * 1999-06-22 2001-01-12 Yaskawa Electric Corp Method for detecting approaching position of mobile object
JP2006156508A (en) * 2004-11-26 2006-06-15 Nikon Corp Method of deciding target value, moving method, exposing method, exposing device, and lithography system
EP3064999B1 (en) * 2006-08-31 2017-07-26 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
JPWO2009028157A1 (en) * 2007-08-24 2010-11-25 株式会社ニコン MOBILE BODY DRIVING METHOD, MOBILE BODY DRIVING SYSTEM, PATTERN FORMING METHOD, AND PATTERN FORMING DEVICE
TW201100975A (en) 2009-04-21 2011-01-01 Nikon Corp Moving-object apparatus, exposure apparatus, exposure method, and device manufacturing method
JP5578485B2 (en) * 2009-10-14 2014-08-27 株式会社ニコン MOBILE DEVICE, EXPOSURE APPARATUS, AND DEVICE MANUFACTURING METHOD
US20110141448A1 (en) * 2009-11-27 2011-06-16 Nikon Corporation Substrate carrier device, substrate carrying method, substrate supporting member, substrate holding device, exposure apparatus, exposure method and device manufacturing method
TWI777060B (en) * 2010-02-17 2022-09-11 日商尼康股份有限公司 Conveyor device, exposure device, and device manufacturing method
JP6132079B2 (en) * 2012-04-04 2017-05-24 株式会社ニコン Exposure apparatus, flat panel display manufacturing method, and device manufacturing method
JP5910992B2 (en) * 2012-04-04 2016-04-27 株式会社ニコン Mobile device, exposure apparatus, flat panel display manufacturing method, and device manufacturing method
JP5494755B2 (en) * 2012-08-03 2014-05-21 株式会社ニコン Mark detection method and apparatus, position control method and apparatus, exposure method and apparatus, and device manufacturing method
CN104838469B (en) * 2012-10-02 2018-04-24 株式会社尼康 Exposure device and exposure method and device making method
JP2014098731A (en) * 2012-11-13 2014-05-29 Nikon Corp Movable body apparatus, exposure apparatus, method for manufacturing flat panel display, and device manufacturing method
KR101448509B1 (en) * 2013-12-04 2014-10-13 순환엔지니어링 주식회사 Dynamic and thermal error real time compensation system for linear motion single-plane gantry stage, stage apparatus and manufacturing, measuring and inspecting equipment
KR102254557B1 (en) * 2014-03-28 2021-05-21 가부시키가이샤 니콘 Mobile body apparatus, exposure apparatus, production method for flat panel display, production method for device, and drive method for mobile body
WO2017057465A1 (en) * 2015-09-30 2017-04-06 株式会社ニコン Mobile device, exposure device, method for manufacturing flat panel display, method for manufacturing device, and measuring method
US20180356739A1 (en) * 2015-09-30 2018-12-13 Nikon Corporation Exposure apparatus, manufacturing method of flat-panel display, device manufacturing method, and exposure method
KR20180059813A (en) * 2015-09-30 2018-06-05 가부시키가이샤 니콘 EXPOSURE DEVICE, METHOD OF MANUFACTURING FLAT PANEL DISPLAY, DEVICE MANUFACTURING METHOD,

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003100627A (en) * 2002-08-28 2003-04-04 Nikon Corp Scanning exposure device and manufacturing method therefor
CN101689024A (en) * 2007-11-09 2010-03-31 株式会社尼康 Movable body apparatus
CN101533228A (en) * 2008-03-11 2009-09-16 Asml荷兰有限公司 Method and lithographic apparatus for measuring and acquiring height data relating to a substrate surface
CN102566287A (en) * 2010-12-16 2012-07-11 上海微电子装备有限公司 Vertical direction control device and method for photoetching machine

Also Published As

Publication number Publication date
JP6958354B2 (en) 2021-11-02
TW202044465A (en) 2020-12-01
JPWO2017057465A1 (en) 2018-07-19
WO2017057465A1 (en) 2017-04-06
TW201729321A (en) 2017-08-16
KR20180059864A (en) 2018-06-05
CN108139676B (en) 2022-03-18
HK1249191A1 (en) 2018-10-26

Similar Documents

Publication Publication Date Title
CN105842995B (en) Exposure device, mobile body device, the manufacturing method of flat-panel monitor and manufacturing method
CN104698772B (en) Exposure device, exposure method and assembly manufacture method
CN106415397B (en) Mobile body device, exposure device, the manufacturing method of flat-panel monitor, assembly manufacture method and mobile body drive method
CN104221128B (en) Mobile body device, exposure device, the manufacture method of flat-panel screens and manufacturing method
CN101611470A (en) The manufacture method and the mobile body drive method of mobile body device, pattern formation device and pattern formation method, device manufacturing method, mobile body device
CN101405837A (en) Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
CN111965948B (en) Exposure apparatus, exposure method, method for manufacturing flat panel display, and method for manufacturing device
CN107407893A (en) Exposure device, the manufacture method of flat-panel monitor, device making method and exposure method
CN108139688A (en) Exposure device, the manufacturing method of flat-panel screens, assembly manufacture method and exposure method
US11187999B2 (en) Movable body apparatus, moving method, exposure apparatus, exposure method, flat-panel display manufacturing method, and device manufacturing method
US11392042B2 (en) Exposure apparatus and exposure method, and flat panel display manufacturing method
TWI726917B (en) Exposure apparatus and exposure method, and manufacturing method of flat panel display
CN108139677A (en) Exposure device, the manufacturing method of flat-panel screens and manufacturing method
CN108139685A (en) Exposure device, the manufacturing method of flat-panel screens, assembly manufacture method and exposure method
US20210072651A1 (en) Movable body apparatus, moving method, exposure apparatus, exposure method, flat-panel display manufacturing method, and device manufacturing method
CN108139676A (en) Mobile body device, exposure device, the manufacturing method of flat-panel screens, assembly manufacture method and measuring method
CN108139678A (en) Mobile body device, exposure device, the manufacturing method of flat-panel screens and the moving method of manufacturing method and object
TWI721023B (en) Exposure apparatus and exposure method, and manufacturing method of flat panel display
CN108139683A (en) Exposure device and exposure method and manufacture of planar display
CN100549835C (en) The manufacture method of exposure device and exposure method and microcomponent
US20210048754A1 (en) Movable body apparatus, moving method, exposure apparatus, exposure method, flat-panel display manufacturing method, and device manufacturing method
US20200249586A1 (en) Movable body apparatus, moving method, exposure apparatus, exposure method, flat-panel display manufacturing method, and device manufacturing method
CN108139679B (en) Exposure apparatus, method for manufacturing flat panel display, method for manufacturing device, and exposure method

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
REG Reference to a national code

Ref country code: HK

Ref legal event code: DE

Ref document number: 1249191

Country of ref document: HK

SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant