JP6958354B2 - Exposure equipment, flat panel display manufacturing method, and device manufacturing method - Google Patents

Description

The present invention relates to a mobile device, an exposure device, a method for manufacturing a flat panel display, a device manufacturing method, and a measurement method.

Conventionally, in a lithography process for manufacturing electronic devices (microdevices) such as liquid crystal display elements and semiconductor elements (integrated circuits, etc.), masks or reticle (hereinafter collectively referred to as "masks") and glass plates or wafers (hereinafter referred to as "masks") are used. , "Substrate") are synchronously moved along a predetermined scanning direction, and the pattern formed on the mask is transferred onto the substrate using an energy beam. A so-called scanning stepper (also called a scanner)) or the like is used (see, for example, Patent Document 1).

In this type of exposure apparatus, in order to form a pattern formed on a mask on a substrate with high resolution, the surface position of the substrate (for example, position information in a direction intersecting the horizontal plane of the substrate surface) is measured, and at the same time, Autofocus control is performed to automatically position the surface position of the substrate within the depth of focus of the projection optical system.

Here, in order to reliably perform autofocus control, it is preferable to measure the surface position of the substrate with high accuracy.

U.S. Patent Application Publication No. 2010/0266961

According to the first aspect of the present invention, a first moving body that holds an object and can move in the first direction and a first moving body that is provided so as to face the first moving body and can move in the first direction. It has two moving bodies, a measuring system provided on one of the first and second moving bodies, and a measured system provided on the other moving body, with respect to the measured system. The measurement system includes a measurement unit that irradiates a measurement beam and measures the position of the first moving body in the vertical direction, and the measurement unit refers to the first moving body that has moved in the first direction. A mobile device is provided in which the second moving body moves in the first direction so as to face the first moving body and performs measurement.

According to the second aspect of the present invention, a first moving body that holds an object and can move in the first direction and a first moving body that is provided so as to face the first moving body and can move in the first direction. It has two moving bodies, a measuring system provided on one of the first and second moving bodies, and a measured system provided on the other moving body, with respect to the measured system. Provided is a mobile device including a measurement unit in which the measurement system irradiates a measurement beam and measures the position of the first moving body in the vertical direction.

According to the third aspect of the present invention, an energy beam is emitted to either the mobile device according to the first aspect or the mobile device according to the second aspect and the object held by the first moving object. An exposure apparatus comprising a pattern forming apparatus that is used to form a predetermined pattern is provided.

According to a fourth aspect of the present invention, a method for manufacturing a flat panel display including exposing the object using the exposure apparatus according to the third aspect and developing the exposed object. , Provided.

According to a fifth aspect of the present invention, there is provided a device manufacturing method including exposing the object using the exposure apparatus according to the third aspect and developing the exposed object. NS.

According to a sixth aspect of the present invention, a first moving body that holds an object and can move in the first direction and a second moving body that is provided to face the first moving body and can move in the first direction. The measurement system provided on one side of the moving body is irradiated with the measurement beam by the measuring system provided on the other side of the first moving body and the second moving body, and the upper and lower sides of the first moving body are raised and lowered. Including measuring the position in the direction, in the measurement, the second moving body is the second moving body with respect to the first moving body so as to face the first moving body that has moved in the first direction. A measurement method that moves in one direction and performs the measurement is provided.

It is a figure which shows schematic the structure of the liquid crystal exposure apparatus which concerns on 1st Embodiment. FIG. 1 is a cross-sectional view taken along the line AA of FIG. It is a conceptual diagram of the substrate stage Z tilt position measurement system provided in the liquid crystal exposure apparatus of FIG. It is a block diagram which shows the input / output relation of the main control apparatus which mainly constitutes the control system of a liquid crystal exposure apparatus. It is a figure for demonstrating the operation of the substrate stage apparatus and the substrate stage Z tilt position measurement system at the time of a step operation. 6 (a) and 6 (b) are diagrams (No. 1 and No. 2) for explaining the operation of the substrate stage apparatus and the substrate stage Z tilt position measurement system during the exposure operation. It is a figure (cross-sectional view) which shows the liquid crystal exposure apparatus which concerns on 2nd Embodiment. It is a figure for demonstrating operation of the substrate stage Z tilt position measurement system in 2nd Embodiment. It is a figure (front view) which shows the liquid crystal exposure apparatus which concerns on 3rd Embodiment. It is a conceptual diagram of the substrate stage Z tilt position measurement system in 3rd Embodiment. It is a figure (cross-sectional view) which shows the liquid crystal exposure apparatus which concerns on 3rd Embodiment. It is a figure (front view) which shows the liquid crystal exposure apparatus which concerns on 4th Embodiment. It is a conceptual diagram of the substrate position measurement system in 4th Embodiment. It is a figure (cross-sectional view) which shows the liquid crystal exposure apparatus which concerns on 5th Embodiment. It is a conceptual diagram of the substrate position measurement system in 5th Embodiment. 16 (a) and 16 (b) are views (cross-sectional view and plan view, respectively) showing the substrate stage apparatus according to the sixth embodiment. It is a figure which shows the irradiation point of the measurement beam on the encoder scale.

<< First Embodiment >>
Hereinafter, the first embodiment will be described with reference to FIGS. 1 to 6 (b).

FIG. 1 schematically shows the configuration of the liquid crystal exposure apparatus 10 according to the first embodiment. The liquid crystal exposure apparatus 10 is a step-and-scan projection in which a rectangular (square) glass substrate P (hereinafter, simply referred to as a substrate P) used for a liquid crystal display device (flat panel display) or the like is used as an exposure object. An exposure device, a so-called scanner.

The liquid crystal exposure apparatus 10 is provided on the illumination system 12, the mask stage 14 holding the mask M on which a pattern such as a circuit pattern is formed, the projection optical system 16, the apparatus main body 18, and the surface (the surface facing the + Z side in FIG. 1). It has a substrate stage device 20 for holding a substrate P coated with a resist (sensitizer), a control system for these, and the like. Hereinafter, the direction in which the mask M and the substrate P are relatively scanned with respect to the projection optical system 16 at the time of exposure is defined as the X-axis direction, and the directions orthogonal to the X-axis in the horizontal plane are defined as the Y-axis direction, the X-axis, and the Y-axis. The direction perpendicular to the Z-axis direction will be described as the Z-axis direction. Further, the rotation directions around the X-axis, the Y-axis, and the Z-axis will be described as θx, θy, and θz directions, respectively.

The lighting system 12 is configured in the same manner as the lighting system disclosed in US Pat. No. 5,729,331 and the like. That is, the illumination system 12 emits light emitted from a light source (mercury lamp or the like) (not shown) via a reflector, a dichroic mirror, a shutter, a wavelength selection filter, various lenses, or the like (not shown) for exposure illumination (illumination). Light) Irradiate the mask M as IL. As the illumination light IL, light such as i-line (wavelength 365 nm), g-line (wavelength 436 nm), and h-line (wavelength 405 nm) (or the composite light of the i-line, g-line, and h-line) is used.

The mask stage 14 holds a light-transmitting mask M. The main control device 50 (see FIG. 4) attaches the mask stage 14 (that is, the mask M) to the illumination system 12 (illumination light IL) via the mask stage drive system 52 (see FIG. 4) including the linear motor. It is driven with a predetermined long stroke in the axial direction (scanning direction), and is slightly driven in the Y-axis direction and the θz direction. The position information of the mask stage 14 in the horizontal plane is obtained by the mask stage position measurement system 54 (see FIG. 4) including the laser interferometer.

The projection optical system 16 is arranged below the mask stage 14. The projection optical system 16 is a so-called multi-lens type projection optical system having the same configuration as the projection optical system disclosed in US Pat. No. 6,552,775, and is a bilateral telecentric lens that forms an erect image. It is equipped with multiple optical systems. The optical axis AX of the illumination light IL projected from the projection optical system 16 onto the substrate P is parallel to the Z axis.

In the liquid crystal exposure apparatus 10, when the mask M located in the predetermined illumination region is illuminated by the illumination light IL from the illumination system 12, the illumination light IL passing through the mask M illuminates the mask M via the projection optical system 16. A projected image (partial pattern image) of the mask M pattern in the region is formed in the exposed region on the substrate P. Then, the mask M moves relative to the illumination region (illumination light IL) in the scanning direction, and the substrate P moves relative to the exposure region (illumination light IL) in the scanning direction, so that 1 on the substrate P Scanning exposure of one shot area is performed, and a pattern formed on the mask M (the entire pattern corresponding to the scanning range of the mask M) is transferred to the shot area. Here, the illumination region on the mask M and the exposure region (irradiation region of the illumination light) on the substrate P are optically coupled to each other by the projection optical system 16.

The apparatus main body 18 is a portion that supports the mask stage 14 and the projection optical system 16, and is installed on the floor F of the clean room via a plurality of vibration isolators 18d. The apparatus main body 18 has the same configuration as the apparatus main body disclosed in US Patent Application Publication No. 2008/0030702, and is also referred to as an upper pedestal portion 18a (also referred to as an optical surface plate or the like) that supports the projection optical system 16. It has a pair of lower pedestals 18b (in FIG. 1, one is not shown because they overlap in the depth direction of the paper surface. See FIG. 2), and a pair of middle pedestals 18c.

The substrate stage device 20 is a portion for positioning the substrate P with respect to the projection optical system 16 (illumination light IL) with high accuracy, and the substrate P has a predetermined long stroke along the horizontal plane (X-axis direction and Y-axis direction). It is driven by 6 degrees of freedom and is slightly driven in the direction of 6 degrees of freedom. The configuration of the substrate stage apparatus 20 is not particularly limited, but is a two-dimensional coarse motion stage as disclosed in US Patent Application Publication No. 2008/129762, US Patent Application Publication No. 2012/0057140, and the like. It is preferable to use a stage device having a so-called coarse and fine movement configuration, which includes a fine movement stage that is slightly driven with respect to the two-dimensional coarse movement stage.

As an example, the substrate stage apparatus 20 in the first embodiment has a plurality of (three in this embodiment) base frames 22 (overlapping in the depth direction of the paper surface in FIG. 1; see FIG. 2), Y coarse motion. It is a stage device having a coarse and fine movement configuration including a stage 24, an X coarse movement stage 26, a weight canceling device 28, a Y step guide 30, a fine movement stage 32, a substrate holder 36, and the like.

The base frame 22 is made of a member extending in the Y-axis direction, and is installed on the floor F in a state of being vibrationally insulated from the apparatus main body 18. The three base frames 22 are arranged at predetermined intervals in the X-axis direction (see FIG. 2).

The Y coarse movement stage 24 is mounted on three base frames 22 as shown in FIG. The Y coarse movement stage 24 includes three Y carriages 24a corresponding to the base frame 22 and a pair of Xs mounted on the three Y carriages 24a (one of which is not shown in FIG. 2; see FIG. 1). It has a beam 24b. The Y coarse motion stage 24 has three Y actuators 24c via a plurality of Y actuators 24c which are a part of the substrate stage drive system 56 (not shown in FIG. 2, see FIG. 4) for driving the substrate P in the direction of 6 degrees of freedom. It is driven on the base frame 22 in the Y-axis direction with a predetermined long stroke. Further, the Y coarse movement stage 24 is guided straight in the Y-axis direction via a linear guide device 24d arranged between the Y coarse movement stage 24 and the base frame 22.

Returning to FIG. 1, the X coarse movement stage 26 is mounted on the pair of X beams 24b. The X coarse movement stage 26 is composed of a rectangular plate-shaped member in a plan view (viewed from the + Z direction), and an opening is formed in the center. The X coarse movement stage 26 is driven on the Y coarse movement stage 24 with a predetermined long stroke in the X-axis direction via a plurality of X actuators 26a that are a part of the substrate stage drive system 56 (see FIG. 4). Further, the X coarse movement stage 26 is guided straight in the X-axis direction via a linear guide device 26b arranged between the X coarse movement stage 26 and the Y coarse movement stage 24. Note that FIG. 2 is a diagram showing a state in which the X coarse movement stage 26 is located at the stroke end on the + X side. Further, the X coarse movement stage 26 is mechanically restricted from moving relative to the Y coarse movement stage 24 in the Y-axis direction by the linear guide device 26b, and is integrated with the Y coarse movement stage 24 in the Y-axis direction. Moving. As the Y actuator 24c (see FIG. 2) and the X actuator 26a (see FIG. 1) of the substrate stage drive system 56 described above, a linear motor, a feed screw (ball screw) device, or the like can be used.

The weight canceling device 28 is inserted into the opening formed in the X coarse movement stage 26 as shown in FIG. The weight canceling device 28, also referred to as a central pillar, supports the weight of the system including the fine movement stage 32 and the substrate holder 36 from below. The details of the weight canceling device 28 are disclosed in US Patent Application Publication No. 2010/0018950, and thus the description thereof will be omitted. The weight canceling device 28 is mechanically connected to the X coarse movement stage 26 via a plurality of connecting devices 28a (also referred to as a flexure device), and is pulled by the X coarse movement stage 26. It moves along the XY plane integrally with the X coarse movement stage 26.

The Y step guide 30 is a part that functions as a surface plate when the weight canceling device 28 moves. The Y step guide 30 is composed of a member extending in the X-axis direction, and is mounted on a pair of lower pedestals 18b included in the device main body 18 via a plurality of linear guide devices 30a. The Y step guide 30 is inserted between the pair of X beams 24b included in the Y coarse motion stage 24 (see FIG. 1), and a plurality of connecting devices 30b (not shown in FIG. 2; see FIG. 1) are connected to the Y coarse motion stage 24. ) Is mechanically connected. As a result, the Y step guide 30 moves integrally with the Y coarse movement stage 24 in the Y-axis direction with a predetermined long stroke. The weight canceling device 28 is mounted on the Y step guide 30 in a non-contact state via the air bearing 28b, and when the X coarse movement stage 26 moves only in the X axis direction on the Y coarse movement stage 24. Moves in the X-axis direction on the stationary Y step guide 30, and the X-coarse movement stage 26 moves in the Y-axis direction integrally with the Y-coarse movement stage 24 (may be accompanied by movement in the X-axis direction). In the case of including), it moves in the Y-axis direction integrally with the Y step guide 30 (so as not to fall off from the Y step guide 30).

The fine movement stage 32 is composed of a plate-shaped (or box-shaped) member having a rectangular shape in a plan view, and the weight canceling device 28 is in a state where the central portion can swing (tilt) with respect to the XY plane via the spherical bearing device 34. It is supported from below in a non-contact state (a state in which it can move relative to the XY plane). A substrate holder 36 is fixed on the upper surface of the fine movement stage 32, and the substrate P is placed on the substrate holder 36. The substrate holder 36 is formed in a rectangular plate shape in a plan view, and holds the substrate P by vacuum suction.

The fine movement stage 32 is a part of the substrate stage drive system 56 (not shown in FIGS. 1 and 2; see FIG. 4), and includes a stator included in the X coarse movement stage 26 and a mover included in the fine movement stage 32. It is slightly driven in the direction of 6 degrees of freedom with respect to the X coarse movement stage 26 by the main controller 50 (see FIG. 4) via a plurality of linear motors including. The plurality of linear motors include a plurality of X voice coil motors 56x (not shown in FIG. 1), Y voice coil motors 56y (not shown in FIG. 2), and Z voice coil motors 56z, respectively. Further, in the main control device 50, when the X coarse movement stage 26 moves along the XY plane with a long stroke, the fine movement stage 32 and the X coarse movement stage 26 integrally move along the XY plane with a long stroke. Thrust is applied to the fine movement stage 32 by the plurality of linear motors so as to move. The configuration (excluding the measurement system) of the substrate stage apparatus 20 including the substrate stage drive system 56 and described above is disclosed in US Patent Application Publication No. 2012/0057140 and the like.

As shown in FIG. 4, the position measurement system of the fine movement stage 32 (that is, the substrate P) measures the position in the horizontal plane of the substrate stage for obtaining the position information (including the rotation amount information in the θz direction) of the substrate in the XY plane. System 58 (hereinafter referred to as "horizontal position measurement system 58") and position information in the direction intersecting the horizontal plane of the substrate (position information in the Z-axis direction, rotation amount information in the θx and θy directions, hereinafter “Z tilt position”. It includes a substrate stage Z tilt position measurement system 70 (hereinafter, referred to as “Z tilt position measurement system 70”) for obtaining (referred to as “information”).

Although not shown, the horizontal position measurement system 58 is a bar mirror fixed to the fine movement stage 32 or the substrate holder 36 (see FIG. 1 respectively) (Y bar mirror extending parallel to the X axis and parallel to the Y axis). An optical interferometer system or the like using an extending X-bar mirror) can be used. Details of the position measurement system using the optical interferometer system are disclosed in US Patent Application Publication No. 2010/0018950 and the like, and thus the description thereof will be omitted.

As shown in FIG. 1, the Z tilt position measuring system 70 has a pair of head units (head units 72a and 72b). One head unit 72a is arranged on the + Y side of the projection optical system 16, and the other head unit 72b is arranged on the −Y side of the projection optical system 16 (see FIG. 2). The head units 72a and 72b are substantially the same device except that they are arranged differently.

The head units 72a and 72b measure the Z tilt position information of the substrate P using a pair of targets 38 (target members) included in the substrate stage device 20. Of the pair of targets 38, one is arranged on the + Y side of the substrate holder 36, and the other is arranged on the −Y side of the substrate holder 36. The distance between the pair of targets 38 in the Y-axis direction is set to be substantially the same as the distance between the head units 72a and 72b described above in the Y-axis direction.

As can be seen from FIGS. 1 and 2, the target 38 is composed of a plate-shaped (strip-shaped) member extending in the X-axis direction and parallel to the XY plane. The upper surface of the target 38 is a reflective surface. As the target 38, a plane mirror or the like can be used. The length of the target 38 in the X-axis direction is set to be longer than the length of the board holder 36 (and the board P) in the X-axis direction. In this embodiment, the length of the board holder 36 in the X-axis direction is 1. . It is set to about 1 to 2 times. The length of the target 38 may be shorter than the length of the substrate holder 36 in the X-axis direction. For example, a plurality of targets 38 shorter than the length of the substrate holder 36 in the X-axis direction may be provided according to the location and timing for measuring the Z tilt position information.

The target 38 is placed on the side surface of the substrate holder 36 so that the height position of the upper surface thereof (position in the Z-axis direction) is substantially the same as the height position of the surface of the substrate P mounted on the substrate holder 36. It is attached via the bracket 38a. Therefore, when the substrate holder 36 is driven in a direction intersecting the horizontal plane (movement in the optical axis AX direction and a direction inclining with respect to the horizontal plane), the pair of targets 38 are integrally driven in the horizontal plane with the substrate holder 36. Move in the direction of intersection. As a result, the posture change of the substrate P placed on the substrate holder 36 is reflected on the upper surface (reflection surface) of the target 38. Although the target 38 is attached to the side surface of the substrate holder 36 in FIGS. 1 and 2, the installation position of the target 38 is not particularly limited as long as the posture change of the substrate P can be reflected, and the target 38 is fixed to the fine movement stage 32. It may be attached directly to the upper surface of the substrate holder 36. Further, the Z tilt position information may be measured by targeting at least a part of the upper surfaces of the substrate holder 36, the fine movement stage 32, the substrate P, and the like as the target 38. That is, at least a part of the upper surfaces of the substrate holder 36, the fine movement stage 32, the substrate P, and the like may function in the same manner as the target 38. As a result, it is not necessary to provide the target 38, so that the configuration of the substrate stage device 20 can be simplified.

Next, the head units 72a and 72b will be described. As shown in FIG. 1, the head unit 72a is driven by a Y linear actuator 74 and a Y slider driven by the Y linear actuator 74 with a predetermined stroke in the Y-axis direction with respect to the projection optical system 16 (and the apparatus main body 18). It includes a pair of sensor heads 78 fixed to the 76 and the Y slider 76 (in FIG. 1, they overlap in the depth direction of the paper surface. See FIG. 2). The same applies to the head unit 72b.

The Y linear actuator 74 (drive mechanism) is fixed to the lower surface of the pedestal portion 18a included in the apparatus main body 18. The Y linear actuator 74 includes a linear guide that guides the Y slider 76 in the Y-axis direction, and a drive system that applies thrust to the Y slider 76. The type of linear guide is not particularly limited, but an air bearing having high repeatability is preferable. The type of drive system is not particularly limited, and a linear motor, a belt (or wire) drive device, or the like can be used.

The Y linear actuator 74 is controlled by the main controller 50 (see FIG. 4). In the main control device 50, the moving direction, moving amount, and moving speed of the Y slider 76 in the Y-axis direction are substantially the same as the moving direction, moving amount, and moving speed of the substrate P (fine movement stage 32) in the Y-axis direction. The Y linear actuator 74 is controlled so as to be the same. Further, although not shown in FIGS. 1 and 2, the main control device 50 refers to the device main body 18 (that is, the projection optical system 16) of the Y slider 76 via the Y slider position measurement system 80 (see FIG. 4). Ask for location information. The Y slider position measurement system 80 may be a measurement system such as a linear encoder system, or may be based on an input signal to the Y linear actuator 74 or the like.

The pair of sensor heads 78 are attached to the lower surface of the Y slider 76 so as to be separated from each other in the X-axis direction (see FIG. 2). As shown in FIG. 3, the pair of sensor heads 78 are arranged so as to face the target 38 and face downward (−Z direction). In the present embodiment, a laser displacement meter is used as an example of the sensor head 78, but the type of the sensor head 78 is in the Z-axis direction of the target 38 with reference to the apparatus main body 18 (see FIG. 1). The displacement is not particularly limited as long as it can be measured with desired accuracy (resolution) and without contact.

Here, since the pair of sensor heads 78 of the head units 72a and 72b are separated from each other in the X-axis direction, the main control device 50 (see FIG. 4) averages the outputs of the pair of sensor heads 78. Based on the value, the position (displacement amount) information of the corresponding target 38 in the Z-axis direction can be obtained, and the inclination amount information of the target 38 in the θy direction can be obtained based on the difference between the outputs of the pair of sensor heads 78. can. Further, since the head units 72a and 72b (and the corresponding targets 38) are separated from each other in the Y-axis direction, the main control device 50 has a total of 4 head units 72a and 72b that are not on the same straight line. Based on the outputs of the two sensor heads 78, it is possible to obtain information on the amount of inclination of the substrate holder 36 (see FIG. 1) in the θx direction. When obtaining the position (displacement amount) information of the target 38 in the Z-axis direction, it may be obtained based on the output of one of the pair of sensor heads 78.

FIG. 4 shows a block diagram showing an input / output relationship of a main control device 50 that mainly configures a control system of the liquid crystal exposure apparatus 10 (see FIG. 1) and controls each component in an integrated manner. The main control device 50 includes a workstation (or a microprocessor) and the like, and controls each component of the liquid crystal exposure device 10 in an integrated manner.

In the liquid crystal exposure device 10 (see FIG. 1) configured as described above, the mask M is loaded onto the mask stage 14 by a mask loader (not shown) under the control of the main control device 50 (see FIG. 4). Is performed, and the board P is loaded onto the board stage device 20 (board holder 36) by a board loader (not shown). After that, the main control device 50 executes the alignment measurement using an alignment detection system (not shown), and after the alignment measurement is completed, the multiple shot regions set on the substrate P are sequentially step-and-scan. An exposure operation is performed.

During the scan exposure operation, the main control device 50 (see FIG. 4) is the irradiation region of the illumination light IL (see FIG. 1) on the substrate P based on the output of the Z tilt position measurement system 70 (see FIG. 4). Positioning control (so-called autofocus control) in the Z tilt direction of the substrate P is performed so that (exposure region) is automatically positioned within the depth of focus of the projection optical system 16 (see FIG. 1). As the Z tilt position measurement system of the substrate P, a measurement system (known autofocus sensor) of a method of directly measuring the surface position information of the substrate P in the vicinity of the exposure region is used as the Z tilt position measurement system of the present embodiment. It may be used in combination with 70.

During a series of step-and-scan exposure operations, the main controller 50 (see FIG. 4) uses the substrate P (subject) to move between shots, as shown in FIGS. 5 and 6 (a). When the holder 36) is moved in the Y-axis direction (+ Y direction in FIGS. 5 and 6 (a); see the white arrow), the target corresponding to the measurement light from the sensor head 78 is synchronized with the substrate P. The Y sliders 76 of the head units 72a and 72b are driven in the Y-axis direction (see the black arrows in FIGS. 5 and 6A) so as not to deviate from 38). Thereby, the Z tilt position information of the substrate P can be obtained regardless of the Y position of the substrate P. At this time, the width of the target 38 in the Y-axis direction is set sufficiently wider than the measurement point on the target 38 of the sensor head 78, so that the sensor head 78 and the substrate holder 36 are strictly in the Y-axis direction. The positions of are not required to be synchronized.

On the other hand, as shown in FIG. 6B, during a series of step-and-scan exposure operations, the substrate P (substrate holder 36) is moved in the X-axis direction (FIG. 6) in order to perform the scan exposure operation. In (b), when moving in the −X direction (see the white arrow), the main control device 50 (see FIG. 4) puts the Y sliders 76 of the head units 72a and 72b in a stationary state (the sensor head 78 and the corresponding target 38). The Z tilt position information of the substrate P is obtained. If there is a possibility that it will be difficult to secure the flatness of the surface of the target 38 and the straight-ahead running accuracy of the Y slider 76, the flatness and the straight-ahead running accuracy will be measured in advance to obtain correction information. When actually measuring the Z tilt position information, the output of the sensor head 78 may be corrected by the above correction information.

According to the Z tilt position measurement system 70 according to the first embodiment described above, the posture change of the substrate holder 36 holding the substrate P is directly measured with reference to the apparatus main body 18, so that the Z tilt of the substrate P is measured. Position information can be obtained with high accuracy. Here, it is conceivable to attach a measurement sensor to the board holder 36 and obtain the posture change of the board holder 36 based on the weight canceling device 28 (that is, the Y step guide 30), but the weight canceling device 28 (and the Y step guide 30) ) Is configured to move along the XY plane, so that the measurement accuracy may decrease. On the other hand, in the Z tilt position measurement system 70 of the present embodiment, since the pedestal portion 18a to which the projection optical system 16 is attached is used as a reference, the substrate P can be mounted with high accuracy regardless of the operation of the substrate stage device 20. It is possible to measure changes in posture.

Further, in the Z tilt position measurement system (autofocus sensor) of the method of directly measuring the surface position information of the substrate P in the vicinity of the exposure region described above, as shown in FIG. 2, the substrate holder 36 has a stroke in the X-axis direction. When it is located at the end, since the substrate P is not located below the projection optical system 16, the Z tilt position information of the substrate P cannot be obtained, but the Z tilt position measurement system 70 of the present embodiment is used. This makes it possible to obtain the Z tilt position information of the substrate P regardless of the position of the substrate holder 36 in the X-axis direction.

<< Second Embodiment >>
Next, the liquid crystal exposure apparatus according to the second embodiment will be described with reference to FIGS. 7 and 8. The configuration of the liquid crystal exposure apparatus according to the second embodiment is the same as that of the first embodiment except that the configuration of the measurement system for obtaining the Z tilt position information of the substrate P is different. Only the points will be described, and the elements having the same configuration and function as those of the first embodiment will be designated by the same reference numerals as those of the first embodiment, and the description thereof will be omitted.

In the Z tilt position measurement system 70 of the first embodiment (see FIG. 6A and the like), one head unit (head unit 72a, 72b) is provided on each of the + Y side and the −Y side of the projection optical system 16. In contrast to the arrangement, in the Z tilt position measurement system 170 of the second embodiment, as shown in FIG. 8, two head units 172a and 172c are arranged on the + Y side of the projection optical system 16. At the same time, two head units 172b and 172d are arranged on the −Y side of the projection optical system 16. That is, in the first embodiment, the main control device 50 (see FIG. 4) uses two head units 72a and 72b (that is, a total of four sensor heads 78) to provide Z tilt position information of the substrate P. On the other hand, in the second embodiment, the Z tilt position information of the substrate P is obtained by appropriately using four head units 172a to 172d (that is, eight sensor heads 78 in total). Since the configurations of the head units 172a to 172d are the same as those of the head units 72a and 72b of the first embodiment, the description thereof will be omitted.

Further, as shown in FIGS. 2 and 6A, in the first embodiment, the X positions of the two head units 72a and 72b are substantially the same as the X positions of the projection optical system 16. On the other hand, as shown in FIG. 8, in the second embodiment, one of the two head units 172a and 172c on the + Y side of the projection optical system 16 (head unit 172a) is from the projection optical system 16. Is also arranged on the + X side, and the other (head unit 172c) is arranged on the −X side (that is, on the front side and the back side in the scanning direction) of the projection optical system 16. The same applies to the two head units 172b and 172d on the −Y side of the projection optical system 16. As described above, in the second embodiment, the four head units 172a to 172d are arranged around the projection optical system 16. The target 138 having the reflecting surface extending in the X-axis direction is fixed to the substrate holder 36 via the bracket 138a, which is the same as the first embodiment, but in the second embodiment, the target The dimension of 138 in the X-axis direction is shorter than that of the first embodiment.

Since the operations of the head units 172a to 172d during the scanning exposure operation in the second embodiment are substantially the same as those in the first embodiment, the description thereof will be omitted. That is, the main control device 50 (see FIG. 4) synchronizes with the movement of the board holder 36 (board P) in the Y-axis direction (see the white arrow in FIG. 8), and the Y sliders 76 of the head units 172a to 172d. At least two of the four head units 172a to 172d (head unit 172a and head unit 172b, or head unit 172c and head unit 172d,) while moving in the Y-axis direction (see the black arrow in FIG. 8). Alternatively, the Z tilt position information of the substrate P is obtained based on the output of the sensor head 78 possessed by all the head units 172a to 172d).

The Z tilt position measurement system 170 of the second embodiment described above has two head units (head units 172a and 172b) separated in the Y-axis direction on the + X side and the −X side of the projection optical system 16, respectively. , And the head units 172c, 172d) are arranged, so that the detection region in the X-axis direction is longer than that of the first embodiment. Therefore, as shown in FIG. 7, the length of the target 138 in the X-axis direction can be shortened as compared with the first embodiment (see FIG. 2). As a result, the weight of the fine movement stage 32 can be reduced, so that the position controllability of the substrate P is improved.

<< Third Embodiment >>
Next, the liquid crystal exposure apparatus according to the third embodiment will be described with reference to FIGS. 9 to 11. The configuration of the liquid crystal exposure apparatus according to the third embodiment is the same as that of the first or second embodiment, except that the configuration of the measurement system for obtaining the Z tilt position information of the substrate P is different. Hereinafter, only the differences will be described, and the elements having the same configuration and function as those of the first or second embodiment are designated by the same reference numerals as those of the first or second embodiment and the description thereof will be omitted. ..

In the Z tilt position measurement system 270 of the third embodiment, the point that the tilt amount information with respect to the horizontal plane (XY plane) of the Y slider 76 having the sensor head 78 is obtained by the main control device 50 (see FIG. 4) is described above. It differs from the first and second embodiments. The main control device 50 obtains the Z tilt position information of the substrate P based on the output of the sensor head 78 and the tilt amount information of the Y slider 76 at the time of the output (that is, while correcting the tilt of the Y slider 76). ..

In the third embodiment, four head units 272a to 272d are arranged in the same arrangement as in the second embodiment (that is, around the projection optical system 16) (FIGS. 9 and 9). 11). The configurations of the four head units 272a to 272d are substantially the same, except that they are arranged differently. Not limited to this, two head units may be arranged in the same arrangement as in the first embodiment (that is, at the same X position as the projection optical system 16). In this case, as in the first embodiment, the target 38 (see FIG. 2 and the like) having a longer dimension in the X-axis direction than the target 138 is used.

As shown in FIG. 10, the head unit 272a (the same applies to the head units 272b to 272d) irradiates the target 138 with the measurement light (in the −Z direction) as in the second embodiment. It has a pair of sensor heads 78 (downward heads) separated in the axial direction. The method of obtaining the Z tilt position information of the substrate P by using the pair of sensor heads 78 (eight in total) of each of the four head units 272a to 272d is the same as that of the second embodiment. Is omitted.

Here, in the head unit 272a, the Y slider 76 to which the sensor head 78 is attached (not shown in FIG. 10, see FIG. 9) is configured to be guided straight in the Y-axis direction by the linear guide device, and thus the sensor. Tilt and Z displacement can occur on the head 78 (the optical axis of the measurement light with respect to the corresponding target 138). Therefore, the main control device 50 (see FIG. 4) uses four sensor heads 278 (upward heads) attached to the Y slider 76 to provide information on the amount of tilt (tilt) of the Y slider 76 (in the optical axis direction). The output of the two sensor heads 78 is based on the output of the four sensor heads 278 so as to obtain (including information on the amount of displacement) and cancel the inclination of the Y slider 76 (the deviation of the optical axis of the measurement light). to correct. In the fourth embodiment, the four sensor heads 278 (upward heads) are arranged at four locations that are not on the same straight line, but the present invention is not limited to this, and the three sensor heads 278 are placed on the same straight line. It may be arranged in three places not found in.

In the present embodiment, as the sensor head 278 (upward sensor), a laser displacement meter similar to the sensor head 78 is used as an example, and is fixed to the lower surface of the pedestal portion 18a (see FIGS. 9 and 11). , The target 280 extending in the Y-axis direction is used (that is, with reference to the pedestal portion 18a) to obtain information on the amount of inclination of the Y slider 76. The type of the sensor head 278 is not particularly limited as long as the information regarding the amount of inclination of the Y slider 76 can be obtained with a desired accuracy.

According to the third embodiment described above, the Z tilt information of the substrate P can be obtained with higher accuracy. Further, since the output of the sensor head 78 (downward head) is corrected, the straight-ahead guidance accuracy of the Y slider 76 may be rougher than that of the first and second embodiments.

<< Fourth Embodiment >>
Next, the liquid crystal exposure apparatus according to the fourth embodiment will be described with reference to FIGS. 12 and 13. As shown in FIG. 12, the Z tilt position measurement system 370 in the fourth embodiment is projected with the head unit 372a arranged on the + Y side of the projection optical system 16 as in the first embodiment. A head unit 372b is provided on the −Y side of the optical system 16. Further, a pair of targets 338 are attached to the substrate holder 36 corresponding to the head units 372a and 372b. The length of the target 338 in the X-axis direction is the same as that of the first embodiment.

As shown in FIG. 13, the head unit 372a is a pair of sensor heads 78 (see FIG. 10) for obtaining Z tilt position information of the substrate P (see FIG. 12), similarly to the third embodiment (see FIG. 10). It has a downward head) and four sensor heads 278 (upward heads) for measuring tilt amount information of the pair of sensor heads 78. The procedure for obtaining the Z tilt position information of the substrate P using the sensor heads 78 and 278 is the same as that of the third embodiment, and thus the description thereof will be omitted.

Further, the liquid crystal exposure apparatus of the fourth embodiment has an encoder system as a horizontal plane position measurement system 58 (see FIG. 4), which is a measurement system for obtaining position information of the substrate P in the horizontal plane. .. Hereinafter, the third embodiment will be described with respect to the encoder system, and elements having the same configuration and functions as those of the first to third embodiments are designated by the same reference numerals as those of the first to third embodiments. And the explanation is omitted.

As shown in FIG. 12, the head unit 372a includes a Y linear actuator 74, a Y slider 76 driven by the Y linear actuator 74 with a predetermined stroke in the Y-axis direction with respect to the projection optical system 16, and a Y slider 76. It is equipped with a plurality of measuring heads (details will be described later) fixed to the device. The same applies to the head unit 372b. Since the configuration and function of the Y linear actuator 74 and the Y slider 76 are substantially the same as those of the Y linear actuator 74 and the Y slider 76 included in the head unit 72a (see FIG. 1) of the first embodiment. The explanation is omitted.

As shown in FIG. 13, the head unit 372a has two X encoder heads 384x (downward X heads), two Y encoder heads 384y (downward Y heads), and two X encoder heads as a part of the plurality of measurement heads. It has an encoder head 386x (upward X head) and two Y encoder heads 386y (upward Y head). Further, as described above, the head unit 372a has a pair of sensor heads 78 (downward Z heads) and four sensor heads 278 (upward Z heads) as a part of the plurality of measurement heads. .. Each of the above heads 384x, 384y, 386x, 386y, 78, and 278 is fixed to the Y slider 76 (see FIG. 12). The head unit 372b is also configured in the same manner, except that it is configured symmetrically on the paper surface in FIG. 12. The pair of targets 338 are also symmetrically configured in FIG.

Here, in the fourth embodiment, a plurality of scale plates 340 are attached to the upper surface of the target 338. The scale plate 340 is composed of a plan view band-shaped member extending in the X-axis direction, and is adhered to the upper surface of the target 338. The length of the scale plate 340 in the X-axis direction is shorter than the length of the target 338 in the X-axis direction, and a plurality of scale plates 340 are arranged at predetermined intervals (separate from each other) in the X-axis direction. There is. Further, the scale plate 340 is not attached to the strip-shaped region including the vicinity of the end portion on the −Y side of the upper surface of the target 338, and the strip-shaped region is a pair of sensor heads 78 (downward Z heads). ), And functions as a reflective surface for measuring the Z tilt position of the substrate P, as in the first to third embodiments. The Z tilt position of the substrate P may be measured with the upper surfaces of the plurality of scale plates 340 as reflecting surfaces. As a result, it is not necessary to provide the band-shaped region, so that the configuration of the target 338 can be simplified.

An X scale 342x and a Y scale 342y are formed on the scale plate 340. The X scale 342x is formed in a half region on the −Y side of the scale plate 340, and the Y scale 342y is formed in a half region on the + Y side of the scale plate 340. The X scale 342x has a reflection type X diffraction grating, and the Y scale 342y has a reflection type Y diffraction grating. In FIG. 13, for ease of understanding, the scale plate 340 is shown thicker than it actually is, and the spacing (pitch) between the plurality of grid lines forming the X scale 342x and the Y scale 342y is actually shown. More widely illustrated.

The two X encoder heads 384x irradiate the X scale 342x with the measurement light in a state of being arranged so as to face the X scale 342x. The main control device 50 (see FIG. 4) moves the substrate P (see FIG. 12) in the X-axis direction, and the X of the substrate P responds to the output of the X encoder head 384x based on the light from the X scale 342x. Obtain displacement amount information in the axial direction. Similarly, the two Y encoder heads 384y are arranged to face the Y scale 342y, and the main control device 50 obtains displacement amount information of the substrate P in the Y axis direction according to the output of the Y encoder head 384y. Further, the main control device 50 obtains rotation amount information of the substrate P in the θz direction based on the outputs of the X encoder heads 384x of the head unit 372a and the head unit 372b (see FIG. 12).

Here, the distance between the two X encoder heads 384x and the Y encoder head 384y in the X-axis direction is set wider than the distance between the adjacent scale plates 340. Therefore, regardless of the X position of the substrate P (see FIG. 12), at least one of the two X encoder heads 384x and the Y encoder head 384y always faces the scale plate 340. Thereby, the main control device 50 (see FIG. 4) can obtain the position information of the substrate P based on the average value of one of the two encoder heads 384x and 384y or the two encoder heads 384x and 384y. In the present embodiment, a plurality of scale plates 340 are arranged at predetermined intervals in the X-axis direction, but the present invention is not limited to this, and a long scale plate having a length in the X-axis direction equivalent to that of the target 338 is used. You may use it. In this case, one encoder head (downward X head 384x, downward Y head 384y) for obtaining the position information of the substrate P in the horizontal plane may be provided for each of the head units 372a and 372b.

Further, regarding the position measurement system 58 in the horizontal plane, the X encoder head 384x and the Y encoder head 384y (referred to as a head set on the + X direction side) provided on the + X direction side with respect to the scale plate 380 in FIG. 13 are among the scale plates 340. When moving from the first scale plate 340 to the second scale plate 340 (scale plate 340 adjacent to the first scale plate) and measuring the second scale plate 340, the head set on the + X direction side is Immediately after the measurement operation is possible using the second scale plate 340, the position information regarding the X-axis direction of the substrate P can be measured, but the output of the head set on the + X direction side is an indefinite value (or). Since the count is restarted from zero), it cannot be used to calculate the X position information of the substrate P. Therefore, in this state, it is necessary to connect the outputs of the head sets on the + X direction side. Specifically, as the connection process, the output of the head set on the + X direction side, which is an indefinite value (or zero), is provided to the X encoder head 384x and the Y encoder head provided on the −X direction side with respect to the scale plate 380. A correction process is performed using the output of 384y (referred to as a head set on the −X direction side) (so that the values are the same). The connecting process is completed before the head set on the −X direction side is out of the measurement range of the first scale.

Similarly, when the head set on the -X direction side is out of the measurement range of the first scale plate 340, the output of the head set on the -X direction side is treated as invalid before going out of the measurement range. And. Therefore, the X position information of the substrate P is obtained based on the output of the head set on the + X direction side. Immediately after each of the head sets on the −X direction side can perform the measurement operation using the second scale plate 340, the heads on the + X direction side with respect to the head sets on the −X direction side. Performs connection processing using the output of the set.

The above-mentioned connecting process is based on the premise that the positional relationship between the four heads (head set on the + X direction side and head set on the −X direction side) is known. The positional relationship between the heads can be obtained by using the scale with the four heads facing a common scale, or a measuring device (laser interferometer, distance sensor, etc.) arranged between the heads. Can be obtained using. This connecting process may be performed on the upward X head 386x and the Y head 386y, or may be performed on the downward Z head 78, the upward Z head 278, and the like.

Further, the main control device 50 (see FIG. 4) has a Y slider 76 (see FIG. 12) as the substrate P (see FIG. 12) moves in the Y-axis direction, as in the first to third embodiments. ) Is driven in the Y-axis direction in synchronization with the substrate P. Here, in the horizontal plane position measurement system 58 of the present embodiment, since the position information of the substrate P is obtained based on the outputs of the X encoder head 384x and the Y encoder head 384y of the Y slider 76, the Y slider 76 itself The displacement amount information in the Y-axis direction also needs to be measured with the same accuracy as the substrate P. Therefore, the horizontal position measurement system 58 of the present embodiment uses a scale plate 380 fixed to the lower surface of the pedestal portion 18a (see FIG. 12) as the Y slider position measurement system 80 (see FIG. 4). It further includes an encoder system for determining the displacement of the slider 76.

The scale plate 380 is made of a plate-shaped member extending in the Y-axis direction, and an X scale 382x and a Y scale 382y are formed on the lower surface thereof, similarly to the scale plate 340 described above. Further, two X encoder heads 386x are attached to the Y slider 76 (see FIG. 12) so as to face the X scale 382x so as to be separated from each other in the Y axis direction, and two Y Ys are attached to the Y slider 76 so as to face the Y scale 382y. The encoder head 386y is attached so as to be separated from each other in the Y-axis direction. The scale plate 380 also faces the four sensor heads 278 (upward Z heads), and can also be used as a target (reflection surface) when determining the amount of inclination of the Y slider 76 using the four sensor heads 278. Function.

When the substrate P (see FIG. 12) is moved in the Y-axis direction, the main control device 50 (see FIG. 4) moves the Y slider 76 in the Y-axis direction in synchronization with the substrate P. The main control device 50 obtains the position information of the Y slider 76 in the XY plane at this time based on the outputs of the two X encoder heads 386x and the two Y encoder heads 386y, and obtains the position information of the Y slider 76 and the position information of the Y slider 76. The position information of the substrate P in the XY plane is obtained based on the outputs of the two X encoder heads 384x and the Y encoder head 384y attached to the Y slider 76. As described above, the horizontal plane position measurement system 58 of the present embodiment indirectly obtains the horizontal plane position information of the substrate P with reference to the apparatus main body 18 by the encoder system via the Y slider 76.

According to the fourth embodiment described above, since the position information of the substrate P in the XY plane is obtained by the encoder system, the influence of air fluctuations and the like can be reduced and the measurement accuracy is improved as compared with the optical interferometer system. do. Further, in the encoder system of the present embodiment, since the head moves following the movement of the substrate P in the Y-axis direction, a wide scale plate that covers the entire movement range of the substrate P in the XY plane is prepared. No need.

In the fourth embodiment, the X encoder heads 384x, 386x, and the Y encoder heads 384y and 386y are used to obtain the position information of the substrate P and the Y slider 76 in the XY plane, but in the Z-axis direction. Using a two-dimensional encoder head (XZ encoder head or YZ encoder head) capable of measuring displacement information, the substrate P and Y slider 76 each have position information in the XY plane of the substrate P and Y slider 76, respectively. Z tilt displacement amount information may be obtained. In this case, the sensor heads 78 and 278 for obtaining the Z tilt position information of the substrate P can be omitted. In this case, in order to obtain the Z tilt position information of the substrate P, it is necessary that the two downward Z heads always face the scale plate 340, so that the scale plate 340 has the same length as the target 338. It is preferable that the two-dimensional encoder heads are composed of one long scale plate, or that three or more of the two-dimensional encoder heads are arranged at predetermined intervals in the X-axis direction.

Further, in the fourth embodiment, on the upper surface of the target 338, a scale plate 340 used for obtaining position information in the XY plane of the substrate P and a surface to be measured (scale) for measuring the Z tilt position of the substrate P. Since the strip-shaped region to which the plate 340 is not attached) is provided, the sensor head 78 (downward Z) performs the connecting process when the X encoder head 384x and the Y encoder head 384y straddle between the scale plates 340. There is no need to do about the head). This makes it possible to simply measure the Z tilt position. When measuring the Z tilt position of the substrate P with the upper surfaces of the plurality of scale plates 340 as reflecting surfaces, the sensor head 78 (downward Z head) may also be connected. In this case, since it is not necessary to provide the band-shaped region, the configuration of the target 338 can be simplified.

Here, as described above, during the Y-step operation of the substrate holder 36, in the substrate stage device 20, for example, two Y sliders 76 are driven in the Y-axis direction in synchronization with the substrate holder 36. That is, the main control device 50 (see FIG. 4) drives the board holder 36 to the target position in the Y-axis direction based on the output of the encoder system, and the Y slider position measurement system 80 (see FIG. 4, here, the encoder). The Y slider 76 is driven in the Y-axis direction based on the output of the system). At this time, the main control device 50 drives the Y slider 76 and the substrate holder 36 in synchronization (so that the Y slider 76 follows the substrate holder 36). Further, the main control device 50 controls the position of the Y slider 76 within a range in which at least one of the plurality of heads 384x and 384y does not deviate from the scale plate 340 (does not deviate from the measurable range).

Therefore, regardless of the Y position of the substrate holder 36 (including the movement of the substrate holder 36), the measurement beams emitted from the X head 384x and the Y head 384y (see FIG. 13 respectively) are the X scale 342x and the Y scale, respectively. It does not deviate from 342y (see FIG. 13 respectively). In other words, while the substrate holder 36 is moving in the Y-axis direction (during Y step operation), the measurement beams emitted from the X head 384x and the Y head 384y do not deviate from the X scale 342x and the Y scale 342y, respectively, that is, the X head. For example, the two Y sliders 76 and the substrate holder 36 may be moved in the Y-axis direction in synchronization with each other so that the measurement by the measurement beam from the 384x and the Y head 384y is not interrupted (the measurement can be continued).

At this time, before the substrate holder 36 moves in the step direction (Y-axis direction), the Y slider 76 (X head 384x, 386x, Y head 384y, 386y) may be started to move in the step direction prior to the substrate holder 36. As a result, the acceleration of each head can be suppressed, and the inclination of each head during movement (being leaning forward with respect to the traveling direction) can be suppressed. Alternatively, the Y slider 76 may start moving in the step direction later than the substrate holder 36.

When the Y-step operation of the substrate holder 36 is completed, the mask M (see FIG. 1) is driven in the −X direction based on the output of the mask stage position measurement system 54 (see FIG. 4), and the mask M is driven. Synchronously, the board holder 36 is driven in the −X direction based on the output of the position measurement system in the horizontal plane of the board stage (see FIG. 4, in this case, the encoder system), so that a mask pattern is generated in the shot area on the board P. Transferred. At this time, for example, the two Y sliders 76 are in a stationary state. In the liquid crystal exposure apparatus 10, by appropriately repeating the scanning operation of the mask M, the Y-step operation of the substrate holder 36, and the scanning operation of the substrate holder 36, the mask patterns are sequentially generated for a plurality of shot regions on the substrate P. Transferred. During the above exposure operation, for example, the two Y sliders 76 are said to be in the + Y direction and the −Y direction each time the substrate holder 36 is stepped so as to maintain the facing state with the target 338 (scale plate 340). It is driven in the same direction as the substrate holder 36 and by the same distance.

Here, as described above, the Y scale 342y has a plurality of grid lines extending in the X-axis direction. Further, as shown in FIG. 17, the irradiation point 384y of the measurement beam irradiated from the Y head 384y onto the Y scale 342y (described with the same reference numerals as the Y head for convenience) is elongated in the Y-axis direction. It has an elliptical shape in the axial direction. In the encoder system, when the Y head 384y and the Y scale 342y move relative to each other in the Y axis direction and the measurement beam straddles the grid line, the Y head 384y starts from the Y head 384y based on the phase change of the ± primary diffracted light from the irradiation point. Output changes.

On the other hand, the main control device 50 (see FIG. 4) has the Y held by the Y slider 76 (see FIG. 12) when the substrate holder 36 is driven in the scan direction (X-axis direction) during the scan exposure operation. The step of the Y slider 76 so that the measurement beam from the head 384y does not straddle the plurality of grid lines forming the Y scale 342y, that is, the output of the Y head 384y does not change (change is zero). Control the position in the direction (Y position).

Specifically, for example, the Y position of the Y head 384y is measured by a sensor having a resolution higher than the pitch between the grid lines constituting the Y scale 342y, and the irradiation point of the measurement beam from the Y head 384y makes the grid lines. Immediately before straddling (the output of the Y head 384y is likely to change), the Y position of the Y head 384y is controlled via the Y linear actuator 74 (see FIG. 12). Not limited to this, for example, when the output of the Y head 384y changes due to the measurement beam from the Y head 384y straddling the grid line, the Y head 384y is driven and controlled accordingly. The output from the Y head 384y may be substantially unchanged. In this case, a sensor for measuring the Y position of the Y head 384y is unnecessary.

<< Fifth Embodiment >>
Next, the liquid crystal exposure apparatus according to the fifth embodiment will be described with reference to FIGS. 14 and 15. Similar to the fourth embodiment, the liquid crystal exposure apparatus according to the fifth embodiment obtains the position information of the substrate P in the horizontal plane by using the encoder system, but is used for the encoder system (position measurement system in the horizontal plane). ) And the head unit for the Z tilt position measurement system are independent, which is different from the fourth embodiment. Hereinafter, differences from the fourth embodiment will be described, and elements having the same configuration and functions as those of the fourth embodiment will be designated by the same reference numerals as those of the fourth embodiment, and the description thereof will be omitted. ..

The Z tilt position measurement system in the liquid crystal exposure apparatus of the fifth embodiment is configured in the same manner as the Z tilt position measurement system 270 of the third embodiment. That is, as shown in FIG. 14, four head units 272a to 272d (head units 272b and 272d are not shown in FIG. 12, see FIG. 9 and the like) are attached to the lower surface of the gantry portion 18a. , Z tilt position information of the substrate P is obtained by using the head units 272a to 272d. A target 280 (reflection surface) is fixed to the upper base portion 18a so as to face the head units 272a to 272d. The procedure for obtaining the Z tilt position information of the substrate P using the Z sensor heads 78 and 278 of the four head units 272a to 272d are the same as those in the third embodiment, and thus the description thereof will be omitted.

The encoder system (horizontal plane position measurement system 58) has a pair of head units 472a and 472b with the projection optical system 16 interposed therebetween, as in the fourth embodiment. The head units 472a and 472b have substantially the same configuration except that the arrangement is different. The head unit 472a is arranged between the head unit 272a and the head unit 272c. Although not shown, the head unit 472b is arranged between the head unit 272b and the head unit 272d. The head units 472a and 472b are fixed to the lower surface of the pedestal portion 18a in the same manner as the head units 272a to 272d. Further, a scale plate 380 is fixed to the upper pedestal portion 18a so as to face the head units 472a and 472b.

As shown in FIG. 15, the head unit 472a is obtained by removing a plurality of sensor heads 78 and 278 from the head unit 372a (see FIG. 13) of the fourth embodiment. The procedure for obtaining the position information of the substrate P in the horizontal plane using the head units 472a and 472b (see FIG. 14) in the fifth embodiment is the same as that in the fourth embodiment, and thus the description thereof will be omitted. ..

According to the fifth embodiment, the head unit for the horizontal plane position measurement system of the substrate P and the head unit for the Z tilt position measurement system of the substrate are independent, so that the head unit is compared with the fourth embodiment. , The configuration of the head unit is simple, and the arrangement of each sensor head is easy. Further, the dimension of the target 438 in the X-axis direction can be shortened as compared with the fourth embodiment.

<< Modifications of the Fourth and Fifth Embodiments >>
In each of the fourth and fifth embodiments (the embodiment when the substrate stage horizontal plane position measurement system 58 is an encoder system), the X scale (lattice pattern for X-axis direction measurement shown in the figure). And Y scales (lattice patterns for Y-axis direction measurement shown in the figure) are provided on scale members (for example, a plurality of scale plates arranged on the target 338) that are independent of each other. However, these plurality of grid patterns may be formed separately for each group of grid patterns on the same long scale member. Further, the lattice pattern may be continuously formed on the same long scale member.

Further, on the targets 338 and 438, a plurality of scales (scale rows) in which a plurality of scales are arranged in a row in the X-axis direction with a gap at a predetermined interval are arranged in a plurality of rows at different positions separated from each other in the Y-axis direction. (For example, when arranging on one side (+ Y side) position and the other (-Y side) position with respect to the projection optical system 16), the position of the gap at the predetermined interval between the plurality of rows is the X-axis. It may be arranged so as not to overlap in the direction. When a plurality of scale rows are arranged in this way, the heads arranged corresponding to each other's scale rows do not go out of the measurement range at the same time (in other words, both heads do not face the gap at the same time).

Further, on the targets 338 and 438, a plurality of scales (scale rows) in which a plurality of scales are arranged in a row in the X-axis direction with a gap at a predetermined interval are arranged in a plurality of rows at different positions separated from each other in the Y-axis direction. (For example, when arranging on one side (+ Y side) position and the other (-Y side) position with respect to the projection optical system 16), the plurality of scale groups (plurality of scale rows) are placed on the substrate. It may be configured so that it can be used properly based on the arrangement of shots (shot map) in. For example, if the overall lengths of a plurality of scale rows are different from each other among the scale rows, different shot maps can be supported, and shot areas formed on the substrate such as in the case of 4-chamfering and in the case of 6-chamfering. It can also respond to changes in the number of. In addition to arranging in this way, if the positions of the gaps in each scale row are set to different positions in the X-axis direction, the heads corresponding to the plurality of scale rows will not be out of the measurement range at the same time. It is possible to reduce the number of sensors that have an indefinite value in the above, and it is possible to perform the connection process with high accuracy.

Further, in a scale group (scale row) in which a plurality of scales are arranged in a row on the target 338 and 438 in the X-axis direction with a gap at a predetermined interval, one scale (pattern for X-axis measurement). The length in the X-axis direction is the length of the one-shot region (the length formed on the substrate by irradiating the device pattern when performing scan exposure while moving the substrate on the substrate holder in the X-axis direction). The length may be set so that it can be measured continuously for a minute. In this way, it is not necessary to control the transfer of the head to a plurality of scales during the scan exposure of one shot area, so that the position measurement (position control) of the substrate P (board holder) during the scan exposure can be easily performed. can.

Further, in a scale group (scale sequence) in which a plurality of scales are arranged in a row in the X-axis direction on the target 338 and 438 with a gap at a predetermined interval, the length of each scale is the same in the above embodiment. Although the items are arranged in a row, scales of different lengths may be arranged in a row. For example, in the scale row on the target 338 and 438, the central portion of the scale arranged near both ends in the X-axis direction (the scale arranged at each end in the scale row) rather than the length in the X-axis direction. The scale placed in may be physically longer.

Further, in a scale group (scale sequence) in which a plurality of scales are arranged in a row in the X-axis direction via a gap at a predetermined interval on the target 338 and 438, the distance between the plurality of scales (in other words, the length of the gap). (S), the length of one scale, and two heads that move relative to the scale sequence (heads that are opposed to each other inside one Y slider 76, for example, two heads 384x shown in FIG. 13). Is arranged so as to satisfy the relationship of "one scale length> distance between heads arranged opposite to each other> distance between scales". This relationship applies when the scales provided on the targets 338 and 438 and the corresponding heads 384x and 384y as well as the scale plates 380 provided on the gantry 18a are arranged at predetermined intervals in the Y-axis direction. It is also filled between the scale plate 380 provided on the pedestal portion 18a and the corresponding heads 386x and 386y.

Further, although the pair of X heads 384x and the pair of Y heads 384y are arranged side by side in the X axis direction so as to form a pair one by one (the X head 384x and the Y head 384y are located at the same position in the X axis direction). Although they are arranged), they may be arranged so as to be relatively offset in the X-axis direction.

Further, in the scale plate 340 formed on the targets 338 and 438, the X scale 342x and the Y scale 342y are formed to have the same length in the X-axis direction, but these lengths are made different from each other. You can do it. Further, both may be arranged so as to be relatively offset in the X-axis direction.

Further, when a certain Y slider 76 and a corresponding scale row (a scale row in which a plurality of scales are arranged in a predetermined direction through a predetermined gap) are relatively moving in the X-axis direction, When a set of heads in the Y slider 76 (for example, the X head 384x and the Y head 384y in FIG. 13) simultaneously face the gap between the scales described above and then simultaneously face another scale (heads 384x, 384y). When transferring to another scale), it is necessary to calculate the initial measurement value of the transferred head. At that time, the remaining set of heads (384x, 384y) in the Y slider 76, which is different from the transferred head, and another head (a head separated in the X-axis direction and dropped). The initial value at the time of transfer of the transferred head may be calculated by using the output of (the one arranged at a position where the distance from and is shorter than the scale length). The other head described above may be a position measurement head in the X-axis direction or a position measurement head in the Y-axis direction.

Further, there is a scene explaining that the Y slider 76 moves in synchronization with the board holder 36, which means that the Y slider 76 moves while maintaining a relative positional relationship with respect to the board holder 36. This means that the movement is not limited to the case where the Y slider 76 and the substrate holder 36 are moved in a state in which the positional relationship, the moving direction, and the moving speed are exactly the same.

Further, in the encoder system, in order to acquire the position information while the board stage device 20 moves to the board replacement position with the board loader, the board stage device 20 or another stage device is provided with a scale for board replacement and faces downward. The position information of the board stage device 20 may be acquired by using the head (X head 384x or the like). Alternatively, the board stage device 20 or another stage device may be provided with a board replacement head, and the position information of the board stage device 20 may be acquired by measuring the scale plate 340 or the board replacement scale. Further, a position measurement system (for example, a mark on the stage and an observation system for observing the mark) different from the encoder system may be provided to control (manage) the replacement position of the stage.

Further, the Z sensor is not limited to the encoder system, and may be a laser interferometer, a TOF sensor, or a sensor capable of measuring a distance.

Further, although the scale plate 340 is provided on the targets 338 and 438, the scale may be formed directly on the substrate P by the exposure process. For example, it may be formed on a scribe line between shot areas. In this way, the scale formed on the substrate can be measured, and the nonlinear component error for each shot region on the substrate can be obtained based on the position measurement result, and the exposure can be obtained based on the error. It is also possible to improve the stacking accuracy.

Further, the Y slider 76 and the Y linear actuator 74 are configured to be provided on the lower surface (see FIG. 12) of the upper pedestal portion 18a of the apparatus main body 18, but are provided on the lower pedestal portion 18b and the middle pedestal portion 18c. Is also good.

<< 6th Embodiment >>
Next, the liquid crystal exposure apparatus according to the sixth embodiment will be described with reference to FIGS. 16 (a) and 16 (b). In the liquid crystal exposure apparatus according to the sixth embodiment, the configuration of the substrate stage apparatus 520 for positioning the substrate P with respect to the projection optical system 16 (see FIG. 1) with high accuracy is the above-mentioned first to fifth embodiments. Different from the form. As the configuration of the measurement system for obtaining the position information in the six degrees of freedom direction of the substrate P, a measurement system having the same configuration as any of the measurement systems according to the first to fifth embodiments can be appropriately used. Hereinafter, the sixth embodiment will be described only with respect to the differences from the first to fifth embodiments, and the elements having the same configuration and functions as those with the first to fifth embodiments will be described above. The same reference numerals as those of the first to fifth embodiments are given, and the description thereof will be omitted.

In the first to fifth embodiments, the back surface of the substrate P is vacuum-sucked and held by the substrate holder 36 (see FIG. 1 and the like), whereas the substrate P is shown in FIGS. 16 (a) and 16 (b). As described above, in the substrate stage apparatus 520 according to the sixth embodiment, the substrate holder 540 is formed in a rectangular frame shape (frame shape) in a plan view, and only the vicinity of the end portion of the substrate P is attracted and held. different. Then, almost the entire surface including the central portion of the substrate P is non-contact supported from below by the non-contact table 536 that can be micro-driven in the Z tilt direction with respect to the horizontal plane, so that the flat surface is along the upper surface of the non-contact table 536. Be corrected.

More specifically, the non-contact table 536 is fixed on the upper surface of the fine movement stage 32. In the sixth embodiment, the fine movement stage 32 is mechanically (however, minutely movable in the Z tilt direction) with respect to the X coarse movement stage 26 via a plurality of connecting devices 550 including a ball joint and the like. By being pulled by the X coarse movement stage 26, it moves in the X-axis direction and the Y-axis direction with a predetermined long stroke. Further, the substrate holder 540 has a main body portion 542 formed in a rectangular frame shape in a plan view, and a suction portion 544 fixed to the upper surface of the main body portion 542. Like the main body portion 542, the suction portion 544 is also formed in a rectangular frame shape in a plan view. The substrate P is vacuum-sucked and held by the suction unit 544. The non-contact table 536 is inserted into the opening of the suction portion 544 with a predetermined gap formed in the suction portion 544 of the substrate holder 540. The non-contact table 536 applies a load (preload) to the substrate P by simultaneously ejecting a pressurized gas to the lower surface of the substrate P and sucking the gas to bring the substrate P into a non-contact state (along a horizontal plane). Correct the plane without hindering relative movement.

Further, from the lower surface of the fine movement stage 32, a plurality of guide plates 548 (four in the present embodiment) extend radially along the horizontal plane. The substrate holder 540 has a plurality of pads 546 including an air bearing corresponding to the plurality of guide plates 548, and the static pressure of the pressurized gas ejected from the air bearing onto the upper surface of the guide plate 548 causes the substrate holder 540 to have a plurality of pads 546. , It is placed on the guide plate 548 in a non-contact state. Unlike the first to fifth embodiments, the fine movement stage 32 is minutely driven only in the Z tilt direction with respect to the X coarse movement stage 24. At this time, the plurality of guide plates 548 also move (change their posture) integrally with the fine movement stage 32 in the Z tilt direction. Therefore, when the fine movement stage 32 changes its posture, the fine movement stage 32, the non-contact table 536, and the substrate holder The 540 (that is, the substrate P) integrally changes its posture.

Further, the substrate holder 540 has three degrees of freedom in the horizontal plane with respect to the fine movement stage 32 via a plurality of linear motors 552 (voice coil motors) including a mover included in the substrate holder 540 and a stator included in the fine movement stage 32. It is driven minutely in the degree direction. Further, when the fine movement stage 32 moves along the XY plane with a long stroke, the plurality of linears described above are used so that the fine movement stage 32 and the substrate holder 540 move integrally along the XY plane with a long stroke. Thrust is applied to the substrate holder 540 by the motor 552.

The target 38 is fixed to the substrate holder 540 via the bracket 38a as in the first embodiment. Similar to the first embodiment, the main control device 50 (see FIG. 4) uses a plurality of sensor heads 78 (see FIG. 1 and the like) that irradiate the target 38 with measurement light, and the substrate holder 540 (that is, the substrate). P) Measure the amount of change in posture. The configuration of the Z tilt position measurement system of the substrate P, including the arrangement of the plurality of sensor heads 78, can be modified in the same manner as in the second to fifth embodiments. Further, in the sixth embodiment, the target 38 is fixed to the substrate holder 540 via the bracket 38a, but the present invention is not limited to this, and the target 38 (and the scale plate 340) is directly attached to the upper surface of the substrate holder 540. Alternatively, the upper surface of the substrate holder 540 may be mirror-finished to function in the same manner as the target.

The configurations described in the first to sixth embodiments can be changed as appropriate. For example, in each of the above embodiments, the sensor head 78 (downward head) for obtaining the Z tilt position information of the substrate P transmits the measurement light to the reflective surface of the target 38 (138, 238) attached to the substrate holder 36. If the measurement light emitted from the sensor head 78 can be reflected and the attitude change of the substrate P can be reflected, the target form is not limited to this, and the measurement light is reflected on the substrate P. It may be made to function (that is, the substrate P itself may be made to function as a target). Further, the target 38 or the like of each of the above embodiments may be attached to the fine movement stage 32.

Further, in each of the above embodiments, the sensor head 78 (downward head) moves in the Y-axis direction with respect to the target 38 extending in the X-axis direction (scanning direction), but the present invention is not limited to this, and the target 38 is not limited to this. May extend in another direction (Y-axis direction), and the sensor head 78 may move in a direction orthogonal to the extending direction of the target 38 in the horizontal plane.

Further, in each of the above embodiments, the substrate stage device 20 has a target 38 extending in the X-axis direction, and the sensor head 78 attached to the device main body 18 moves in the Y-axis direction in synchronization with the target 38. However, contrary to this, the substrate stage device 20 has a sensor head 78, and the target 38 attached to the device main body 18 moves in the Y-axis direction in synchronization with the sensor head 78. Is also good. In this case, it is preferable to measure the posture change of the target 38 and correct the output of the sensor head 78 based on the output.

Further, in each of the above embodiments, the weight canceling device 28 is placed on the Y step guide 30 which is a movable surface plate movable in the Y-axis direction, but the present invention is not limited to this, and the XY plane of the weight canceling device 28 is not limited to this. The weight canceling device 28 may be mounted on a fixed surface plate having a guide surface that covers the entire range of movement within.

The wavelength of the light source used in the illumination system 12 and the illumination light IL emitted from the light source is not particularly limited, and ultraviolet light such as ArF excimer laser light (wavelength 193 nm) and KrF excimer laser light (wavelength 248 nm). Alternatively, it may be vacuum ultraviolet light such as F2 laser light (wavelength 157 nm).

Further, in each of the above embodiments, the same magnification system is used as the projection optical system 16, but the present invention is not limited to this, and a reduction system or an expansion system may be used.

Further, the application of the exposure apparatus is not limited to the exposure apparatus for liquid crystal that transfers the liquid crystal display element pattern to a square glass plate, and the exposure apparatus for manufacturing an organic EL (Electro-Luminescence) panel and semiconductor manufacturing. It can be widely applied to an exposure apparatus for manufacturing a thin film magnetic head, a micromachine, a DNA chip, and the like. Further, in order to manufacture masks or reticle used not only in microdevices such as semiconductor elements but also in optical exposure equipment, EUV exposure equipment, X-ray exposure equipment, electron beam exposure equipment and the like, glass substrates or silicon wafers and the like are used. It can also be applied to an exposure apparatus that transfers a circuit pattern to a wafer.

Further, the object to be exposed is not limited to the glass plate, but may be another object such as a wafer, a ceramic substrate, a film member, or a mask blank. When the object to be exposed is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and a film-like (flexible sheet-like member) is also included. The exposure apparatus of the present embodiment is particularly effective when a substrate having a side length or a diagonal length of 500 mm or more is an exposure target. Further, when the substrate to be exposed is in the form of a flexible sheet, the sheet may be formed in a roll shape.

For electronic devices such as liquid crystal display elements (or semiconductor elements), a step of designing the function and performance of the device, a step of manufacturing a mask (or reticle) based on this design step, and a step of manufacturing a glass substrate (or wafer). Except for the etching apparatus of each of the above-described embodiments, the lithography step of transferring the mask (reticle) pattern to the glass substrate by the exposure method, the developing step of developing the exposed glass substrate, and the portion where the resist remains. It is manufactured through an etching step of removing exposed members by etching, a resist removing step of removing a resist that is no longer needed after etching, a device assembly step, an inspection step, and the like. In this case, in the lithography step, the above-mentioned exposure method is executed using the exposure apparatus of the above embodiment, and the device pattern is formed on the glass substrate, so that a device having a high degree of integration can be manufactured with high productivity. ..

It should be noted that the disclosure of all US patent application publication specifications and US patent specifications relating to the exposure apparatus and the like cited in the above embodiment is incorporated as a part of the description of this specification.

As described above, the mobile device and the measuring method of the present invention are suitable for obtaining the position information of the moving body. Further, the exposure apparatus of the present invention is suitable for exposing an object. Further, the method for manufacturing a flat panel display of the present invention is suitable for manufacturing a flat panel display. Further, the vise manufacturing method of the present invention is suitable for manufacturing a microdevice.

10 ... Liquid crystal exposure device, 20 ... Board stage device, 36 ... Board holder, 70 ... Board stage Z tilt position measurement system, 72a, 72b ... Head unit, 74 ... Y linear actuator, 76 ... Y slider, 78 ... Sensor head, P ... Substrate.

Claims (14)

An exposure device that exposes an object with illumination light via a projection optical system.
The first moving body that holds the object,
A first driving unit that moves the first moving body in the first direction and the second direction that intersect each other,
A frame member that supports the projection optical system and
A second moving body provided between the frame member and the first moving body,
A second drive unit that moves the second moving body in the first direction, and
It has a measurement system provided on one of the first and second moving bodies and a measured system provided on the other moving body, and the measuring system measures the measured system. It is provided with a measuring unit that irradiates a beam and measures the position of the first moving body in the vertical direction.
The first and second drive units move the first moving body and the second moving body in the first direction, respectively, during the measurement of the position by the measuring unit.
The first driving unit is an exposure device that moves the first moving body relative to the second moving body in the second direction while the measuring unit measures the position. The exposure according to claim 1, wherein the second driving unit moves the second moving body in the first direction with respect to the first moving body so that the measurement beam does not deviate from the measured system. Device. The measurement system is provided on the second mobile body and is provided on the second moving body.
The measuring unit obtains the amount of inclination of the second moving body with respect to the surface including the axis in the first direction generated by the measurement system provided on the second moving body driven in the first direction. The exposure apparatus according to claim 1 or 2. The exposure apparatus according to any one of claims 1 to 3, wherein the measured system has a length capable of measuring the movable range of the first moving body in a second direction intersecting with the first direction. The first driving unit, said first moving member, such that the measuring beam is not deviated from the object to be measured based, according to claim 4 which makes relative movement in the second direction relative to the second moving member Exposure device. Claim 4 or 5 in which the measuring unit performs measurement without changing the position of the second moving body with respect to the second direction while the first moving body is moving in the second direction by the first driving unit. The exposure apparatus according to. A plurality of the measurement systems are provided.
The exposure apparatus according to any one of claims 4 to 6, wherein the measurement points of the plurality of measurement systems with respect to the system to be measured are located at different positions with respect to the second direction. The measuring unit irradiates the measured system with the measured beam and measures the vertical position of the first moving body based on the return light of the measured beam from the measured system. The exposure apparatus according to any one of 7. The exposure apparatus according to any one of claims 1 to 8 , wherein the frame member is a reference for movement of the first moving body. Further provided with a support portion for non-contact support of the object,
The exposure apparatus according to any one of claims 1 to 9, wherein the first moving body holds the object non-contactly supported by the support portion. The exposure apparatus according to any one of claims 1 to 10, wherein the object is a substrate used for a flat panel display. The exposure apparatus according to claim 11 , wherein the substrate has at least one side length or a diagonal length of 500 mm or more. To expose the object by using the exposure apparatus according to any one of claims 1 to 12.
A method of manufacturing a flat panel display, comprising developing the exposed object. To expose the object by using the exposure apparatus according to any one of claims 1 to 12.
A device manufacturing method comprising developing the exposed object.

Images