CN101261306B - Full-automatic wafer test method and equipment accomplishing the method - Google Patents

Full-automatic wafer test method and equipment accomplishing the method Download PDF

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Publication number
CN101261306B
CN101261306B CN 200810023656 CN200810023656A CN101261306B CN 101261306 B CN101261306 B CN 101261306B CN 200810023656 CN200810023656 CN 200810023656 CN 200810023656 A CN200810023656 A CN 200810023656A CN 101261306 B CN101261306 B CN 101261306B
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China
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wafer
provided
negative pressure
device
thimble
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CN 200810023656
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Chinese (zh)
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CN101261306A (en
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巴雅日图
陈仲宇
周骅
戴京东
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无锡市易控系统工程有限公司
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Priority to CN 200810023656 priority Critical patent/CN101261306B/en
Publication of CN101261306A publication Critical patent/CN101261306A/en
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Publication of CN101261306B publication Critical patent/CN101261306B/en

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Abstract

The invention discloses a full automatic wafer test method and a device to realize the test method. The method includes the following steps: scanning a spool box, drawing chips, rough adjusting, sending the chips, accuracy alignment, testing and replacing the wafer. The device to realize the full automatic wafer test method consists of a chip placing and counting device arranged on a stander, a wafer transmission device arranged on a stander at one side of the chip placing and counting device, and a wafer test platform device arranged at one side of the wafer transmission device and matched with the transmission device. The method has the advantages of high efficiency, low test cost, high automation and accurate test result.

Description

Full-automatic wafer test method and realize the equipment of this method of testing

Technical field

The invention belongs to the semiconductor test technical field, disclose a kind of full-automatic wafer test method, the invention also discloses the equipment of realizing this method of testing.

Background technology

The semiconducter IC measuring technology, the different phase according to IC makes is divided into two kinds of chip testing and finished product tests.The former still is in the crystal grain good and the bad test that wafer carried out during the fabrication phase with probe at product.Reduce testing cost and become the primary goal of development IC test, the demand of volume chip littler, with better function is just being promoted the development of IC industry, also promoting the development of IC design and test simultaneously.For the test of System on Chip/SoC (SOC), its cost almost accounts for half of chip cost.The ultimate challenge that future, IC testing apparatus manufacturer faced is how to reduce testing cost.

Improving test speed and testing intellectuality is the necessary ways that reduce the cost.Test machine and the method for testing that generally adopts is manual test or semi-automatic test at present.Manual test is artificial each wafer of placing, with manual test behind each tube core of optics microscope alignment.Semi-automatic test is for manually being placed on wafer on the test board, again by optical microscope scanning, manual adjustment wafer angle, first die site etc.Each tube core on the test wafer successively after adjusting.Manually wafer is put back in the film magazine after testing each wafer, got next wafer again and repeat said process.Manually-operated has increased the wafer sort time greatly like this, and must manual adjustment to the probe on new when changing the different kinds of chips test, again by parameter manually is set.The accuracy that test process is got ready also can't be judged.

Summary of the invention

The objective of the invention is to overcome the deficiencies in the prior art, provide a kind of efficient height, testing cost is cheap, automaticity is high, accurate test result full-automatic wafer test method.

Another object of the present invention provides a kind of equipment of realizing above-mentioned method of testing.

According to technical scheme provided by the invention, described full-automatic wafer test method order is as follows carried out:

A, scanning film magazine: the relative probe of wafer sensor of film magazine moves up and down, and the probe of wafer sensor detects in the film magazine and sends signal to controller behind the wafer, and controller writes down movement position and the sequence number and the thickness of current wafer;

B, get sheet: get the sheet pincers and put in and wait in the film magazine to get below the wafer, film magazine is got the sheet pincers relatively and is moved down a small distance, wafer disengaging film magazine is stayed and is got on the sheet pincers, the negative pressure hole of getting on the sheet pincers holds wafer, getting the sheet pincers delivers to wafer on the Acetabula device that detects the setting of rotating shaft top, get the vacuum release wafer that sheet clamps, wafer left on the Acetabula device of getting the sheet pincers and staying detection rotating shaft top setting and prepares coarse regulation after rotary unit rose;

C, coarse adjustment: detect the Acetabula device drive wafer rotation that the rotating shaft top is provided with, optical system responds to whether wafer has entered in the optical detection scope in the rotary course, optical sensor is responded to wafer and is sent signal to controller, movement position and time during the optical sensor of controller record wafer incision simultaneously investigative range; Detect two signals to be adjusted such as circumference after date of Acetabula device rotation that the rotating shaft top is provided with, controller calculates centrifugal coordinate of wafer and angle according to record data, at last result of calculation is converted to movement instruction and send to electric-motor drive unit, move then and get the sheet pincers and detect the Acetabula device that the rotating shaft top is provided with, make wafer stay and get the reservation position on the sheet pincers and prepare to send sheet;

D, send sheet: get the sheet pincers and be stretched over above the wafer test platform device, the vacuum of getting on the sheet pincers discharges wafer, thimble on the wafer test platform device rises to and can leave wafer and stay above the thimble from getting the sheet pincers, get sheet pincers withdrawal initial point, thimble moves down the back wafer is stayed on the wafer test platform device, and the test bench wafer suction disc device on the wafer test platform device holds wafer and prepares and accurately aims at;

E, the accurate aligning: wafer test platform device moves to below the interior optical system lens of mounting groove, image collecting device is gathered wafer image, computing machine is set up template to the image that collects, template matches, result is converted into kinematic parameter sends to motion control card, motion control card control motor-driven mechanism makes wafer test platform device move, diverse location is carried out image acquisition and processing, till meeting the demands;

F, test: laterally line slideway moves to vertical line slideway and sliding driving device thereof and makes wafer to send the beginning test signal to testing tool with computing machine after the probe position contacting, testing tool test finishing backcasting machine sends test and finishes and the test mode signal, computing machine is checked the test mode signal after obtaining to test the signal that finishes, according to status signal output test report and next tube core is contacted with probe, the circulation said process up to whole wafer all test finish till;

G, put back to wafer: wafer test platform device and under horizontal line slideway and vertically line slideway and sliding driving device thereof wafer that test is finished give and get the sheet pincers, getting sheet pincers delivers to wafer in the film magazine and gets next wafer to be measured, repeat above-mentioned 7 steps, wafer is all till tested the finishing in whole film magazine.

In step a: the relative probe of wafer sensor of film magazine rack moves up and down, the probe of wafer sensor sends signal to controller after detecting wafer coboundary in the film magazine and lower limb in the moving process, the position and the sequence number of the relative optical detector of record film magazine when controller is caught the signal that optical detector sends, calculate the thickness of wafer again, do not report to the police if thickness meets.

In step b: rotary unit drives the wafer rotation, the controller record anglec of rotation and run duration when photoelectric sensor is responded to wafer in the rotary course, controller calculates time scale and the position relation that interior optical sensor of circumference phase of rotary unit rotation is sensed wafer, calculate wafer type, crystal circle center departs from coordinate, the breach direction at rotation platform center, controller is controlled motor-driven mechanism according to the result who calculates and is adjusted wafer coordinate, repeats said process till satisfaction.

Accurate aligning at step e carries out as follows in proper order:

(1), the wafer test platform device center moves under the camera lens;

(2), this position is set is wafer test platform device transverse movement coordinate and lengthwise movement origin, the computer acquisition image is set up template;

(3), mobile wafer test platform device is to each wafer die site from the initial point upper and lower, left and right, carries out images acquired and search pattern then;

(4), the template image coordinate that searches by calculating is adjusted the wafer test platform device angle;

(5), after images acquired, greyscale transformation, the image projection point of crossing of block between block between the two line pipe cores of wafer and two row is moved to the initial point of the coordinates of motion;

(6), the initial point of the new coordinates of motion is set, images acquired is set up new template;

(7), relatively and the edge of four wafers in upper and lower, left and right in the wafer center of circle move to and carry out images acquired below the camera lens, carry out search pattern, rim detection then, determine edge coordinate;

(8), repeat said process up to the coordinate of the level angle of adjusting wafer with the relative wafer of the coordinate position center of circle in vertical angle and definite wafer center of circle with tube core.

Test at step f is carried out as follows in proper order:

(1), wafer test platform device drive wafer moves to below the probe;

(2), wafer test platform device rises, and makes probe contact with the wafer tube core;

(3), send the beginning test signal to tester;

(4), wait for the testing end signal and the status signal of tester;

(5), the query State signal, if test otherwise is marked to the wafer tube core by forwarding for (6) step to;

(6), wafer test platform device moves down and move next wafer tube core below probe, and probe is contacted with the wafer tube core;

(7), change delegation's wafer below probe if probe exceeds crystal round fringes;

(8), repeat said process up to the tube core on the whole wafer is all tested finish till.

Realize above-mentioned method of testing equipment it be included in be provided with on the frame put sheet and piece counting apparatus, on the frame of putting sheet and piece counting apparatus one side, be provided with the wafer transfer device, be provided with the wafer test platform device that is mated in wafer transfer device one side, the film magazine rack is set on the frame, film magazine and probe of wafer sensor are set on the film magazine rack, be provided with the optical sensor mounting disc near on the frame of wafer test platform device, in it optical sensor can be installed, this optical sensor joins by image collecting device and image processing apparatus, described wafer transfer device is included in the rotating disk that is provided with on the turning axle, rotating disk is provided with support, on support, laterally set up some one slide rails, on slide rail, be slidingly connected and get the sheet pincers, be provided with lifter plate and lifting drive thereof below getting the sheet pincers, lifter plate and the guide rod that fixedly installs are slidingly connected, and are rotatably connected to the detection rotating shaft on lifter plate, the top ends that detects rotating shaft is provided with Acetabula device, detects rotating shaft and links to each other with its device of rotation driving; Described wafer test platform device is included in the horizontal line slideway that is provided with on the underframe, laterally line slideway is provided with the base plate that is slidingly connected with it, on support, be provided with the sliding driving device of base plate, on base plate, be provided with and the horizontal vertical vertical line slideway of line slideway, vertically slidely connect support plate and sliding driving device thereof on the line slideway, support plate is provided with wafer absorption and lowering device, above wafer absorption and lowering device, be hinged with probe carriage, on the support of wafer absorption and lowering device one side, be provided with the mounting groove of optical alignment recognition device.

Acetabula device upper surface in the wafer transfer device is provided with some negative pressure air drains, in the negative pressure air drain, be provided with the negative pressure pore that is communicated with the negative pressure air drain, be provided with the negative pressure gas-tpe fitting in the turning axle bottom, described negative pressure gas-tpe fitting is communicated with the negative pressure pore, the concentric circles cell body that described negative pressure air drain is offered for the Acetabula device upper surface, the sheet pincers of getting in the wafer transfer device are provided with several at slide rail, they are layered laminate and are arranged in the same perpendicular, the lower end of getting the sheet pincers is fixed with the slide block that is slidingly connected with slide rail, side at slide block is provided with the intermediate plate that stretches out, described intermediate plate clamping is on rotating band, be provided with the negative pressure joint getting sheet pincers rearward end, offer the negative pressure hole that is communicated with the negative pressure joint at the caliper position of getting the sheet pincers, the lifting drive of lifter plate is the screw mandrel that is arranged between rotating disk and the support, respectively establishes a guide rod in the both sides of screw mandrel.

The wafer suction disc device that the cover top is provided with in the tubulose that the longitudinal direction that wafer absorption in the wafer test platform device and lowering device comprise frame is provided with, cover links to each other with whirligig with jacking gear in described, this wafer suction disc device is included in the well heater that is provided with between negative pressure sucker and the thermal insulating disc, be provided with some negative pressure air drains at the negative pressure sucker upper surface, in negative pressure sucker, be provided with the negative pressure pore that is communicated with the negative pressure air drain, on negative pressure sucker, be provided with the negative pressure gas-tpe fitting, described negative pressure gas-tpe fitting is communicated with the negative pressure pore, on negative pressure sucker, be provided with and run through negative pressure sucker, the dumping pit of well heater and thermal insulating disc, be provided with thimble and thimble apparatus for controlling of lifting in the dumping pit, the concentric circles cell body that negative pressure air drain in wafer absorption and the lowering device is offered for the negative pressure sucker upper surface, between negative pressure sucker and well heater, be provided with hot buffer disc, place, interior cover bottom outer wall is provided with ball sliding bush, the ball sliding bush outer wall is with chuck, described chuck is located in the overcoat that fixedly installs and with overcoat and is rotationally connected, the cover bottom linked to each other with its drive unit in longitudinal leadscrew withstood on, in put and be provided with the rocking bar that crosses out, the other end of rocking bar links to each other with whirligig, be provided with tie-plate below the wafer suction disc device in wafer absorption and lowering device, be set with thimble upper plate and thimble lower plate below the tie-plate, plate in the thimble is slidingly connected between thimble upper plate and the thimble lower plate, in thimble plate on Plane Installation be fixed with ejector retainner plate, plate is by the thimble leading screw in the thimble, this thimble leading screw links to each other with its drive unit, be provided with the thimble installing plate on the thimble upper plate in wafer absorption and lowering device, on the thimble installing plate, be fixed with the thimble that inserts in the dumping pit, be socketed with back-moving spring outside the thimble between thimble installing plate and negative pressure sucker.

Be provided with cover plate between well heater in wafer absorption and lowering device and the thermal insulating disc, wafer suction disc device is provided with the lower convex ring that stretches out to thermal insulating disc at the lower surface of negative pressure sucker, correspondingly the thermal insulating disc upper surface be provided with to negative pressure sucker stretch out on bulge loop, the lower surface of lower convex ring contacts with last bulge loop upper surface and hot heater, buffer disc and cover plate is contained in it.

That puts that sheet and piece counting apparatus fixedly install on screw mandrel puts the sheet platform, be provided with film magazine putting on the sheet platform, and describedly put sheet and piece counting apparatus has two groups, they are separately positioned on the both sides of wafer transfer device and are oppositely arranged, and are provided with cushion blocking at the place, bottom of underframe.

Method efficient height of the present invention, testing cost is cheap, automaticity is high, test result is accurate.

Description of drawings

The wafer ATE (automatic test equipment) example structure block diagram that Fig. 1 adopts for the inventive method.

Fig. 2 is an one-piece construction synoptic diagram of realizing the equipment of method of testing of the present invention.

Fig. 3 is the wafer test platform device one-piece construction synoptic diagram of realizing in the equipment of method of testing of the present invention.

Fig. 4 is wafer absorption and the lowering device one-piece construction synoptic diagram among Fig. 3.

Fig. 5 is the wafer suction disc device structural representation among Fig. 3.

Fig. 6 is the wafer transfer device one-piece construction synoptic diagram of realizing in the equipment of method of testing of the present invention.

Fig. 7 is the rotating disk among Fig. 6, the structural representation of detection rotating shaft.

Fig. 8 realizes putting sheet and piece counting apparatus one-piece construction synoptic diagram in the equipment of method of testing of the present invention.

Embodiment

The invention will be further described below in conjunction with concrete drawings and Examples.

Described full-automatic wafer test method comprises: film magazine rack 7 is used to carry wafer film magazine 103; Probe of wafer sensor 10 is used for recording box wafer position and quantity; Get sheet pincers 205, be used to carry wafer; Detect the Acetabula device 209 that rotating shaft 208 tops are provided with, be used to rotate wafer; Optical sensor mounting disc 11 is used to place the optical sensor of the centrifugal degree that detects wafer; Optical system is used to produce the imaging of the different multiples of wafer; Image collecting device is used to obtain wafer image; Computing machine is used for image data processing and exercise data; The motion control card that is connected with computing machine is used to control motor-driven mechanism; Motor-driven mechanism is used to obtain movement instruction and drive motor.

As Fig. 1, main frame is connected with tester, and with motion controller and image pick-up card communication, motion control card is responsible for controlling the motion of probe station and logistics system simultaneously; Testing tool is connected with probe, and probe is installed on the probe; Before and after the probe station or move up and down the wafer that makes on the probe station and contact with probe; Image collecting device is sent to main frame after obtaining wafer image on the probe station, sends motion command to controller after the host process view data.

Step 1: place film magazine 103 in the full-automatic wafer test device of the present invention as shown in Figure 1, 2, 3 on the film magazine rack 7, this film magazine rack 7 rises to and gets the film magazine position under no film magazine situation, test process or up and down in the sheet process these film magazine rack 7 strap boxes 103 steadily move up and down.Induction film magazine sensor 10 notification controller film magazine states on film magazine rack 7.If there is new film magazine to place, controller is learnt by induction pick-up, and control film magazine clamp device 8 clamps film magazine 103.Film magazine 103 clamped back controllers make film magazine rack 1 drive film magazine 103 and move up and down.Wafer position in 9 pairs of film magazines of probe of wafer sensor that this moment, installed on film magazine 103 both sides positions with thickness and detects, and determines wafer number in the film magazine simultaneously.

Step 2: the sheet got in the full-automatic wafer test device clamps below 205 wafers to be measured that put in the film magazine among the present invention as shown in Figure 6, the film magazine rack moves down a small distance, at this moment wafer is stayed and is got on the sheet pincers 205, getting negative pressure hole 217 on the sheet pincers 205 holds and gets sheet pincers 205 behind the wafer and wafer is placed on detects on the Acetabula device 209 that rotating shaft 208 tops are provided with, the vacuum of getting on the sheet pincers 205 discharges wafer, and the rotary unit back wafer that rises leaves and gets sheet pincers 205 and stay to detect on the Acetabula device 209 that rotating shaft 208 tops are provided with and prepares coarse regulation; Controller control motor drives mechanism and makes rotating disk 202 rotations, the motion state of superincumbent light sensors wafer is installed, controller real time record optical sensor state and movement position, and calculate centrifugal degree of wafer and gap position, adjust the wafer position according to result of calculation;

Step 3: adjust finish back rotating disk 202 drive get sheet clamp 205 and Acetabula device 209 rotate together, getting sheet pincers 205 is placed into wafer on the test bench wafer suction disc device 329 of wafer test platform device 3 again, the thimble of installing on the wafer test platform device 3 230 is responsible for and is got sheet pincers 205 handing-over wafers to be measured and surveyed wafer, and wafer test platform device 3 is received to move to behind the wafer and carried out optics amplification and image acquisition below the optical system; Optical system has high-amplification-factor and low enlargement factor working method, and any working method is used in host software control;

Step 4: move to wafer image below the optical system and amplified by high power and be sent to computing machine by camera and capture card, it is zero-bit that computing machine at first is provided with platform dish position, images acquired and set up template then, the transfer table dish is to the first from left die site, search pattern after the images acquired obtains template position and record, equally the platform dish is moved to each die site up and down of zero-bit, and images acquired and search pattern, adjust platform dish angle according to template matching results again; Projection after near the images acquired zero-bit, according to result and preset parameters relatively and according to projection result transfer table dish to position, crossroad, wafer block; Crossroad place images acquired is set up template, transfer table dish successively up and down again, and each displacement is a die site, images acquired and search pattern are till search is less than template and be labeled as the edge in the moving process;

Step 5: optical system is aimed at the back controller control test board dish that finishes and is moved to below the probe, controller control desk dish rises to chip pin and probe contact position, send the beginning test signal by host software to tester again, tester test finishing back sends test result and testing end signal to host software.Host software carries out respective handling to different test results.Processing mode is provided with according to the user and decides.Host software different modes on main interface shows test mode, character for example, and figure etc., host software is preserved test mode in real time and is derived the test mode figure simultaneously.Host software also will be controlled tapper according to user's setting and test result.This moment, controller moved to next one chip to be measured below the probe.Repeat said process till whole tested the finishing of all chips on the wafer.

Step 6: after all chip testings on the wafer finish, detect getting situation ready if desired, then wafer test platform device 3 moves to the situation of getting ready below optical system identification and contrast with test result automatically.Otherwise wafer test platform device 3 moves to send the sheet position and get sheet pincers 205 and joins.Delivery unit carries out angular setting from wafer being delivered to Acetabula device 209 after probe station obtains wafer.At last wafer is sent back to original position.

Step 7: till all tested the finishing of repetitive cycling said process all wafers in film magazine.

As shown in Figure 2: the equipment of described full-automatic wafer test method is applicable to the test of each specification (as 4 cun, 5 cun, 6 cun and 8 cun) wafer, and it comprises automatically puts sheet and piece counting apparatus 1, wafer transfer device 2 and wafer test platform device 3 among Fig. 4.Judge the quality of wafer, and stamp sign, make the operating result of wafer sort meet the product standard of wafer.At first film magazine among Figure 10 103 is placed on and automatically puts on sheet and the piece counting apparatus 1, put sheet platform 102 and film magazine 103 by the mobile drive of screw mandrel about in the of 101 and move together, determine the quantity and the position of the wafer in the film magazine 103 by Fibre Optical Sensor.Making wafer in the film magazine 103 rest among Fig. 7 wafer transfer device 2 accurately by Fibre Optical Sensor and screw mandrel again gets on the position of wafer.In the production of reality, equally install two in can image pattern 2 and automatically put sheet and piece counting apparatus 1, utilize the rotatability of wafer transfer device 2, further improved testing efficiency in order further to improve testing efficiency.

Wafer test platform device 3 shown in Figure 2 is included in the horizontal line slideway 305 that is provided with on the underframe 302, laterally line slideway 305 is provided with the base plate 309 that is slidingly connected with it, on support 304, be provided with the sliding driving device of base plate 309, on base plate 309, be provided with the vertical line slideway 312 vertical with horizontal line slideway 305, vertically slidely connect support plate 314 and sliding driving device thereof on the line slideway 312, support plate 314 is provided with wafer absorption and lowering device 6, above wafer absorption and lowering device 6, be hinged with probe carriage 301, probe carriage 301 is provided with probe 12, is provided with the mounting groove 303 of optical alignment recognition device on the support 304 of wafer absorption and lowering device 6 one sides.

The course of work of wafer test platform device 3 is as follows:

Arranged a tube-in-tube structure of overcoat 610, chuck 609, interior cover 601 three-layer types longitudinally above the support plate 614 in surface level, overcoat 610 maintains static as shoring of foundation, chuck 609 plays the middle transition effect, chuck 609 is connected by deep groove ball bearing 608 with overcoat 610, and chuck 609 can only rotate with respect to overcoat 610; Chuck 609 is connected by ball sliding bush 615 transition with interior cover 601, simultaneously chuck 609 and vertical diametrically three groups of guide rods, 624 linear bearings 623 that are evenly equipped with of interior cover 601 so just make and interiorly overlap 601 and can only do sliding up and down of relative vertical direction when can rotate together with chuck 609.Sliding up and down of interior cover 601 is to drive leading screws 617 transmissions realization by motor 611 by rotating band 613, and leading screw 617 is fixed on the chuck 609 by vertical by leading screw seat, deep groove ball bearing 618 and hexagonal nut 619.The rectilinear motion that utilizes lead screw transmission to produce has stationarity and accuracy preferably, and this helps the wafer sort demand.This transmission utilizes ball sliding bush 615 and three groups of guide rod 624 linear bearings 623 as guiding, has improved the stationarity and the accuracy of motion widely, has also dwindled parts overall dimensions diametrically simultaneously effectively.

Test bench wafer suction disc device 629 is a disc, assemble by multilayer, this device is overlapped 601 upper surface in being fixed on together by tie-plate 628 transition, tie-plate 628 adopts aluminium oxide ceramics to make, and its material properties can separate the temperature that test bench wafer suction disc device 629 produces effectively with other parts.Below tie-plate 628, be mounted with plate 604 and thimble lower plate 607 in thimble upper plate 603, the thimble, thimble upper plate 603 and thimble lower plate 607 maintain static with respect to tie-plate 628, the last Plane Installation of plate 604 is fixed with ejector retainner plate 627 in the thimble, and plate 604 is done oscilaltion by the driving drive ejector retainner plate 627 of thimble leading screw 605 together in the thimble between thimble upper plate 603 and thimble lower plate 607.Top on can be with guide rod 633 when ejector retainner plate 627 rises is because thimble 630, thimble installing plate 632 and guide rod 633 threes are mounted to one, so thimble 630 is also upwards ejected; When ejector retainner plate 627 descended, thimble 630 descended under the effect of back-moving spring 631.

In sum, test bench wafer suction disc device 629 and thimble parts are done cover 601 upper surfaces in as a whole being installed in, and so just can realize vertical lifting of wafer by longitudinal leadscrew 617 transmissions.Realize the correction of horizontal direction drift angle and the compensation of wafer by rocking bar control gear 322 control rocking bars 621.Push pin device can be with longitudinal axis lifting and energy relatively independent ground execution.

For preferably laminar wafer being fixed, consider fixing firmly and factor such as even, the present invention takes the mode of vacuum suction, be about to go out for example ten concentric circular negative pressure air drains 638 in order to negative pressure sucker 635 surface working of absorption wafer, each negative pressure air drain 638 all has a negative pressure pore 639, also can be divided into three groups to these ten negative pressure air drains 638 in addition, every group has independent gas circuit air feed, connect negative pressure pore 639 by negative pressure gas-tpe fitting 640 and connect, so just formed vacuum suction system by three gas circuit controls with outside tracheae.Firm and the uniform and stable of this system's absorption in test process, can be carried out the gentle pressure-controlled of switch respectively to these three gas circuits according to the difference of wafer specification.Location for ease of test is shaped on identification marking at the center of negative pressure sucker 635.Based on the needs of wafer, on negative pressure sucker 635, be processed with dumping pit 641 last and the thimble lifting of when unloading.

Temperature requirement when satisfying wafer sort, it takes electrically heated mode, this heating action is finished by well heater 637, on the extension line of well heater, temperature detect switch (TDS) is installed, and the temperature sensor of packing in negative pressure sucker 635 is monitored temperature, be able to switch control to be implemented in when too high or too low for temperature, make wafer sort in the temperature environment of expection, to finish.

Well heater cover plate 645 can be fixed on well heater 637 glands on the negative pressure sucker 635, has ground wire to draw on the well heater cover plate 645, the security when guaranteeing to test.Consider the requirement of wafer sort simultaneously to the stability of temperature, hot buffer disc 642 and thermal insulating disc 636 have been involved in the device of the present invention, hot buffer disc 642 and thermal insulating disc 636 are to be made by a kind of thermosetting plastics DMC, it absorbs heat slow and the slow material properties of heat release has the function that preferably temperature is stored, and has also played heat-blocking action preferably simultaneously when installing with outside parts.

Full-automatic each specification wafer test and discriminating gear, it be included on the frame 4 be provided with put sheet and piece counting apparatus 1, on the frame 4 of putting sheet and piece counting apparatus 1 one sides, be provided with wafer transfer device 2, be provided with the wafer test platform device 3 that is mated in wafer transfer device 2 one sides, Fig. 6, the described wafer transfer device 2 of Fig. 7 is included in the rotating disk 202 that is provided with on the turning axle 201, rotating disk 202 is provided with support 203, on support 203, laterally set up some one slide rails 204, on slide rail 204, be slidingly connected and get sheet pincers 205, below getting sheet pincers 205, be provided with lifter plate 206 and lifting drive thereof, lifter plate 206 and the guide rod 207 that fixedly installs are slidingly connected, on lifter plate 206, be rotatably connected to and detect rotating shaft 208, the top ends that detects rotating shaft 208 is provided with Acetabula device 209, detects rotating shaft 208 and links to each other with its device of rotation driving.

Acetabula device 209 upper surfaces in the wafer transfer device 2 are provided with some negative pressure air drains 210, in negative pressure air drain 210, be provided with the negative pressure pore 211 that is communicated with negative pressure air drain 210, be provided with negative pressure gas-tpe fitting 212 in turning axle 201 bottoms, described negative pressure gas-tpe fitting 212 is communicated with negative pressure pore 211, the concentric circles cell body that described negative pressure air drain 210 is offered for Acetabula device 209 upper surfaces.The sheet pincers 205 got in the wafer transfer device 2 are provided with several at slide rail 204, they are layered laminate and are arranged in the same perpendicular, the lower end of getting sheet pincers 205 is fixed with the slide block 213 that is slidingly connected with slide rail 204, side at slide block 213 is provided with the intermediate plate 214 that stretches out, described intermediate plate 214 clampings are on rotating band 215, clamp 205 rearward end and be provided with negative pressure joint 216 getting sheet, offer the negative pressure hole 217 that is communicated with negative pressure joint 216 at the caliper position of getting sheet pincers 205, the lifting drive of lifter plate 206 is the screw mandrel 218 that is arranged between rotating disk 202 and the support 203, respectively establishes a guide rod 207 in the both sides of screw mandrel 218.

The course of work of this wafer transfer device 2 is as follows:

Referring to shown in Figure 6, to get sheet pincers 205 and be slidingly connected by slide block 213 and slide rail 204, intermediate plate 214 clampings that slide block 213 is provided with by its side are on rotating band 215, and rotating band 215 drive motor link to each other.Getting negative pressure joint 216 and the negative pressure hole 217 at the caliper position of getting sheet pincers 205 offered of sheet pincers 205 by its rear end gets wafer on the sheet pincers 205 from being adsorbed on after film magazine takes off, take off wafer from film magazine and get back to the prealignment device position, prealignment device links to each other with drive motor by detecting rotating shaft 208, detecting rotating shaft 208 is fixed on the lifter plate 206, lifter plate 206 and guide rod 207 are slidingly connected by slide block, and lifter plate 206 is provided with leading screw 218 and driving mechanism thereof.When wafer during in the prealignment device position, leading screw 218 and driving mechanism thereof drive lifter plate 206, detecting rotating shaft 208 rises wafer to be adsorbed on detect to break away from the rotating shaft 208 in conjunction with vacuum control unit and gets sheet pincers 205, drive the wafers rotation and make wafer and get sheet pincers 205 and reach appointed positions in conjunction with getting sheet retractor device 201 again by detecting rotating shaft 208 in conjunction with the optical identification positioning system, leading screw 218 and driving mechanism thereof drive lifter plate 206 then, detection rotating shaft 208 declines make wafer disengaging prealignment detection rotating shaft 208 that wafer is adsorbed onto in conjunction with vacuum control unit and get on the sheet pincers 205.Get sheet retractor device 201 and prealignment device and be separately fixed on the rotating disk 202, rotating disk 202 is connected with drive motor by turning axle 201, and rotating disk 202 drives and gets the sheet retractor device, prealignment device horizontally rotates detection platform by getting the sheet position of platform.Drive by telescopic arm 206 again and get sheet arm 204 and wafer is put on the test platform in conjunction with vacuum control unit.

After getting sheet and finishing, get sheet pincers 205 and return to original position and get back to the film magazine position by rotating disk 202 rotations and repeat just now the sheet process of getting.When wafer detects the back that finishes by getting sheet pincers 205 in conjunction with vacuum control unit, on detection platform, wafer is taken away, get sheet pincers 205 simultaneously and got the wafer that sheet gets in conjunction with the vacuum control unit handle and be put on the detection platform.Getting sheet pincers 205 gets back to the film magazine position and repeats the prealignment process by prealignment device in conjunction with the optical identification positioning system and make wafer and get sheet pincers 205 and reach assigned address.Prealignment is finished, and in conjunction with vacuum control unit wafer is put back to the film magazine original place by getting sheet pincers 205, gets sheet pincers 205 another wafer of taking off film magazine simultaneously and repeats just now process, has realized the full automatic transmission course of getting sheet and film releasing to wafer.In the process of getting sheet and film releasing, need in conjunction with vacuum control unit still relieving of wafer absorption.

The wafer suction disc device 629 that cover 601 tops are provided with in the tubulose that the longitudinal direction that wafer absorption in the wafer test platform device 3 and lowering device 6 comprise frame is provided with, cover 601 links to each other with whirligig with jacking gear in described, this wafer suction disc device 629 is included in the well heater 637 that is provided with between negative pressure sucker 635 and the thermal insulating disc 636, be provided with some negative pressure air drains 638 at negative pressure sucker 635 upper surfaces, in negative pressure sucker 635, be provided with the negative pressure pore 639 that is communicated with negative pressure air drain 638, on negative pressure sucker 635, be provided with negative pressure gas-tpe fitting 640, described negative pressure gas-tpe fitting 640 is communicated with negative pressure pore 639, on negative pressure sucker 635, be provided with and run through negative pressure sucker 635, the dumping pit 641 of well heater 637 and thermal insulating disc 636 is provided with thimble 630 and thimble apparatus for controlling of lifting in the dumping pit 641.

The concentric circles cell body that negative pressure air drain 638 in wafer absorption and the lowering device 6 is offered for negative pressure sucker 635 upper surfaces, between negative pressure sucker 635 and well heater 637, be provided with hot buffer disc 642, place, interior cover 601 bottoms outer wall is provided with ball sliding bush 615, ball sliding bush 615 outer walls are with chuck 609, described chuck 609 is located in the overcoat 610 that fixedly installs and with overcoat 610 and is rotationally connected, cover 601 bottoms linked to each other with its drive unit in longitudinal leadscrew 617 withstood on, interior cover 601 is provided with the rocking bar 621 that crosses out, and the other end of rocking bar 621 links to each other with whirligig.Be provided with tie-plate 628 below the wafer suction disc device 629 in wafer absorption and lowering device 6, be set with thimble upper plate 603 and thimble lower plate 607 below the tie-plate 628, plate 604 in the thimble is slidingly connected between thimble upper plate 603 and the thimble lower plate 607, in thimble plate 604 on Plane Installation be fixed with ejector retainner plate 627, plate 604 is by thimble leading screw 605 in the thimble, and this thimble leading screw 605 links to each other with its drive unit.Be provided with thimble installing plate 632 on the thimble upper plate 603 in wafer absorption and lowering device 6, on thimble installing plate 632, be fixed with the thimble 630 that inserts in the dumping pit 641, be socketed with back-moving spring 631 outside the thimble 630 between thimble installing plate 632 and negative pressure sucker 635.Be provided with cover plate 645 between well heater 637 in wafer absorption and lowering device 6 and the thermal insulating disc 637, wafer suction disc device 629 is provided with the lower convex ring 643 that stretches out to thermal insulating disc 636 at the lower surface of negative pressure sucker 635, correspondingly thermal insulating disc 636 upper surfaces be provided with to negative pressure sucker 635 stretch out on bulge loop 644, the lower surface of lower convex ring 643 contacts with last bulge loop 644 upper surfaces and hot heater 637, buffer disc 642 and cover plate 645 is contained in it.

The wafer absorption in the wafer test platform device 3 and the course of work of lowering device 6 are as follows:

Above the support plate 614 of longitudinal axis, arranged the tube-in-tube structure of an overcoat 610, chuck 609, interior cover 601 three-layer types, overcoat 610 maintains static as shoring of foundation, chuck 609 plays the middle transition effect, chuck 609 is connected by deep groove ball bearing 608 with overcoat 610, and chuck 609 can only rotate with respect to overcoat 610; Chuck 609 is connected by ball sliding bush 615 transition with interior cover 601, simultaneously chuck 609 and vertical diametrically three groups of guide rods, 624 linear bearings 623 that are evenly equipped with of interior cover 601 so just make and interiorly overlap 601 and can only be relative Z when can rotate together with chuck 609 and slide up and down.Sliding up and down of interior cover 1 is to drive Z axial filament thick sticks 617 transmissions realization by Z spindle motor 611 by rotating band 613.

Waist at interior cover 1 is equipped with a rocking bar 621 that can cause overcoat 610 outsides, at its homonymy rocking bar control gear 622 is installed, this mechanism utilizes the feed screw nut transmission principle to produce rectilinear motion, rocking bar 621 is connected with θ axle control gear 622, rocking bar control gear 622 can clamp rocking bar 621 and do the interior surface level circumferencial direction rotation of certain angle scope, and then makes chuck 609, interior cover 601 and test bench wafer suction disc device 629 rotate together.

Below tie-plate 628, be mounted with plate 604 and thimble lower plate 607 in thimble upper plate 603, the thimble, thimble upper plate 603 and thimble lower plate 607 maintain static with respect to tie-plate 628, the last Plane Installation of plate 604 is fixed with ejector retainner plate 627 in the thimble, and plate 604 is done oscilaltion by the driving drive ejector retainner plate 627 of thimble leading screw 605 together in the thimble between thimble upper plate 603 and thimble lower plate 607.Top on can be with guide rod 633 when ejector retainner plate 627 rises is because thimble 630, thimble installing plate 632 and guide rod 633 threes are mounted to one, so thimble 630 is also upwards ejected; When ejector retainner plate 627 descended, thimble 630 descended under the effect of back-moving spring 631.

Arranged a tube-in-tube structure of overcoat 610, chuck 609, interior cover 601 three-layer types longitudinally above the support plate 614 in surface level, overcoat 610 maintains static as shoring of foundation, middle cover 609 plays the middle transition effect, chuck 609 is connected by deep groove ball bearing 608 with overcoat 610, and chuck 609 can only rotate with respect to overcoat 610; Chuck 609 is connected by ball sliding bush 615 transition with interior cover 601, simultaneously chuck 609 and vertical diametrically three groups of guide rods, 624 linear bearings 623 that are evenly equipped with of interior cover 601 so just make and interiorly overlap 601 and can only do relative sliding up and down when can rotate together with chuck 609.Sliding up and down of interior cover 601 is to drive longitudinal leadscrews 617 transmissions realization by motor 611 by rotating band 613, and longitudinal leadscrew 617 is fixed on the chuck 609 by vertical by leading screw seat, deep groove ball bearing 618 and hexagonal nut 619.The rectilinear motion that utilizes lead screw transmission to produce has stationarity and accuracy preferably, and this helps the wafer sort demand.This transmission utilizes ball sliding bush 615 and three groups of guide rod 624 linear bearings 623 as guiding, has improved the stationarity and the accuracy of motion widely, has also dwindled parts overall dimensions diametrically simultaneously effectively.

Test bench wafer suction disc device 629 is a disc, assemble by multilayer, this device is overlapped 601 upper surface in being fixed on together by tie-plate 628 transition, tie-plate 628 adopts aluminium oxide ceramics to make, and its material properties can separate the temperature that test bench wafer suction disc device 629 produces effectively with other parts.Below tie-plate 628, be mounted with plate 604 and thimble lower plate 607 in thimble upper plate 603, the thimble, thimble upper plate 603 and thimble lower plate 607 maintain static with respect to tie-plate 628, the last Plane Installation of plate 604 is fixed with ejector retainner plate 627 in the thimble, and plate 604 is done oscilaltion by the driving drive ejector retainner plate 627 of thimble leading screw 605 together in the thimble between thimble upper plate 603 and thimble lower plate 607.Top on can be with guide rod 633 when ejector retainner plate 627 rises is because thimble 630, thimble installing plate 632 and guide rod 633 threes are mounted to one, so thimble 630 is also upwards ejected; When ejector retainner plate 627 descended, thimble 630 descended under the effect of back-moving spring 631.

In sum, test bench wafer suction disc device 629 and thimble parts are done cover 601 upper surfaces in as a whole being installed in, and so just can realize vertical lifting of wafer by longitudinal leadscrew 617 transmissions.Realize the correction of horizontal direction drift angle and the compensation of wafer by rocking bar control gear 622 control rocking bars 621.Push pin device can be with longitudinal axis lifting and energy relatively independent ground execution.

That puts that sheet and piece counting apparatus 1 fixedly install on screw mandrel 101 puts sheet platform 102, is provided with film magazine 103 on the sheet platform 102 putting, and describedly puts sheet and piece counting apparatus 1 has two groups, and they are separately positioned on the both sides of wafer transfer device 2 and are oppositely arranged.Place, bottom at support 304 is provided with cushion blocking 310.

Claims (10)

1. full-automatic wafer test method, it is characterized in that this method as follows order carry out:
A, scanning film magazine: the relative probe of wafer sensor of film magazine moves up and down, and the probe of wafer sensor detects in the film magazine and sends signal to controller behind the wafer, and controller writes down movement position and the sequence number and the thickness of current wafer;
B, get sheet: get the sheet pincers and put in and wait in the film magazine to get below the wafer, film magazine is got the sheet pincers relatively and is moved down a small distance, wafer disengaging film magazine is stayed and is got on the sheet pincers, the negative pressure hole of getting on the sheet pincers holds wafer, getting the sheet pincers delivers to wafer on the Acetabula device that detects the setting of rotating shaft top, get sheet and clamp vacuum release wafer, wafer left on the Acetabula device of getting the sheet pincers and staying detection rotating shaft top setting and prepares coarse regulation after rotary unit rose;
C, coarse adjustment: detect the Acetabula device drive wafer rotation that the rotating shaft top is provided with, optical system responds to whether wafer has entered in the optical detection scope in the rotary course, in the time of in wafer has entered the optical detection scope, optical sensor is responded to wafer and is sent signal to controller, movement position and time during the optical sensor of controller record wafer incision simultaneously investigative range; Detect two signals to be adjusted such as circumference after date of Acetabula device rotation that the rotating shaft top is provided with, controller calculates centrifugal coordinate of wafer and angle according to record data, at last result of calculation is converted to movement instruction and send to electric-motor drive unit, move then and get the sheet pincers and detect the Acetabula device that the rotating shaft top is provided with, make wafer stay and get the precalculated position on the sheet pincers and prepare to send sheet;
D, send sheet: get the sheet pincers and be stretched over above the wafer test platform device, get sheet pincers vacuum and discharge wafer, thimble on the wafer test platform device rises to and can leave wafer and stay above the thimble from getting the sheet pincers, get sheet pincers withdrawal initial point, thimble moves down the back wafer is stayed on the wafer test platform device, and the test bench wafer suction disc device on the wafer test platform device holds wafer and prepares and accurately aims at;
E, the accurate aligning: wafer test platform device moves to below the interior optical system lens of mounting groove, image collecting device is gathered wafer image, computing machine is set up template to the image that collects, template matches, result is converted into kinematic parameter sends to motion control card, motion control card control motor-driven mechanism makes wafer test platform device move, diverse location is carried out image acquisition and processing, till meeting the demands;
F, test: laterally line slideway moves to vertical line slideway and sliding driving device thereof and makes wafer to send the beginning test signal to testing tool with computing machine after the probe position contacting, testing tool test finishing backcasting machine sends test and finishes and the test mode signal, computing machine is checked the test mode signal after obtaining to test the signal that finishes, according to status signal output test report and next tube core is contacted with probe, the circulation said process up to whole wafer all test finish till;
G, put back to wafer: wafer test platform device and under horizontal line slideway and vertically line slideway and sliding driving device thereof wafer that test is finished give and get the sheet pincers, getting sheet pincers delivers to wafer in the film magazine and gets next wafer to be measured, repeat above-mentioned 7 steps, wafer is all till tested the finishing in whole film magazine.
2. full-automatic wafer test method as claimed in claim 1, it is characterized in that in step a: the relative probe of wafer sensor of film magazine rack moves up and down, the probe of wafer sensor sends signal to controller after detecting wafer coboundary in the film magazine and lower limb in the moving process, the position and the sequence number of the relative probe of wafer sensor of record film magazine when controller is caught the signal that the wafer acquisition sensor sends, calculate the thickness of wafer again, do not report to the police if thickness meets.
3. full-automatic wafer test method as claimed in claim 1, it is characterized in that in step c: the Acetabula device that detects the top ends of rotating shaft drives the wafer rotation, the controller record anglec of rotation and run duration when optical sensor is responded to wafer in the rotary course, controller calculates time scale and the position relation that interior optical sensor of circumference phase of rotary unit rotation is sensed wafer, calculate wafer type, crystal circle center departs from the coordinate at rotation platform center, the breach direction, controller is controlled motor-driven mechanism according to the result who calculates and is adjusted wafer coordinate, repeats said process up to the wafer center of circle till overlapping and breach direction reaches predefined angle with the center of detecting rotating shaft.
4. full-automatic wafer test method as claimed in claim 1 is characterized in that carrying out in proper order as follows at the accurate aligning of step e:
(1), the wafer test platform device center moves under the camera lens;
(2), this position is set is wafer test platform device transverse movement coordinate and lengthwise movement origin, the computer acquisition image is set up template;
(3), mobile wafer test platform device is to each wafer die site from the initial point upper and lower, left and right, carries out images acquired and search pattern then;
(4), the template image coordinate that searches by calculating is adjusted the wafer test platform device angle;
(5), after images acquired, greyscale transformation, the image projection point of crossing of block between block between the two line pipe cores of wafer and two row is moved to the initial point of the coordinates of motion;
(6), the initial point of the new coordinates of motion is set, images acquired is set up new template;
(7), relatively and the edge of four wafers in upper and lower, left and right in the wafer center of circle move to and carry out images acquired below the camera lens, carry out search pattern, rim detection then, determine edge coordinate;
(8), repeat said process up to the coordinate of the level angle of adjusting wafer with the relative wafer of the coordinate position center of circle in vertical angle and definite wafer center of circle with tube core.
5. full-automatic wafer test method as claimed in claim 1 is characterized in that carrying out in proper order as follows in the test of step f:
(1), wafer test platform device drive wafer moves to below the probe;
(2), wafer test platform device rises, and makes probe contact with the wafer tube core;
(3), send the beginning test signal to tester;
(4), wait for the testing end signal and the status signal of tester;
(5), the query State signal, if test otherwise is marked to the wafer tube core by forwarding for (6) step to;
(6), wafer test platform device moves down and move next wafer tube core below probe, and probe is contacted with the wafer tube core;
(7), change delegation's wafer below probe if probe exceeds crystal round fringes;
(8), repeat said process up to the tube core on the whole wafer is all tested finish till.
6. realize the equipment of described full-automatic wafer test method any among the claim 1-5, what be included in that frame (4) go up to be provided with puts sheet and piece counting apparatus (1), it is characterized in that: on the frame (4) of putting sheet and piece counting apparatus (1) one side, be provided with wafer transfer device (2), be provided with the wafer test platform device (3) that is mated in wafer transfer device (2) one sides, film magazine rack (7) is set on the frame (4), film magazine (103) and probe of wafer sensor (10) are set on film magazine rack (7), be provided with optical sensor mounting disc (11) near on the frame (4) of wafer test platform device (3), in it optical sensor can be installed, this optical sensor joins by image collecting device and image processing apparatus, described wafer transfer device (2) is included in turning axle (201) and goes up the rotating disk (202) that is provided with, rotating disk (202) is provided with support (203), on support (203), laterally set up some one slide rails (204), on slide rail (204), be slidingly connected and get sheet pincers (205), below getting sheet pincers (205), be provided with lifter plate (206) and lifting drive thereof, lifter plate (206) and the guide rod (207) that fixedly installs are slidingly connected, on lifter plate (206), be rotatably connected to and detect rotating shaft (208), the top ends that detects rotating shaft (208) is provided with Acetabula device (209), detects rotating shaft (208) and links to each other with its device of rotation driving; Described wafer test platform device (3) is included in underframe (302) and goes up the horizontal line slideway (305) that is provided with, laterally line slideway (305) is provided with the base plate (309) that is slidingly connected with it, on support (304), be provided with the sliding driving device of base plate (309), on base plate (309), be provided with and the horizontal vertical vertical line slideway (312) of line slideway (305), vertically slidely connect support plate (314) and sliding driving device thereof on the line slideway (312), support plate (314) is provided with wafer absorption and lowering device (6), top at wafer absorption and lowering device (6) is hinged with probe carriage (301), is provided with the mounting groove (303) of optical alignment recognition device on the support (304) of wafer absorption and lowering device (6) one sides.
7. the equipment of full-automatic wafer test method as claimed in claim 6, it is characterized in that: Acetabula device (209) upper surface in the wafer transfer device (2) is provided with some first negative pressure air drains (210), in the first negative pressure air drain (210), be provided with the negative pressure pore (211) that is communicated with the first negative pressure air drain (210), be provided with negative pressure gas-tpe fitting (212) in turning axle (201) bottom, described negative pressure gas-tpe fitting (212) is communicated with negative pressure pore (211), the concentric circles cell body that the described first negative pressure air drain (210) is offered for Acetabula device (209) upper surface, the sheet pincers (205) of getting in the wafer transfer device (2) are provided with several at slide rail (204), they are layered laminate and are arranged in the same perpendicular, the lower end of getting sheet pincers (205) is fixed with the slide block (213) that is slidingly connected with slide rail (204), side at slide block (213) is provided with the intermediate plate (214) that stretches out, described intermediate plate (214) clamping is on rotating band (215), be provided with negative pressure joint (216) getting sheet pincers (205) rearward end, offer the negative pressure hole (217) that is communicated with negative pressure joint (216) at the caliper position of getting sheet pincers (205), the lifting drive of lifter plate (206) is respectively established a guide rod (207) for being arranged on the screw mandrel (218) between rotating disk (202) and the support (203) in the both sides of screw mandrel (218).
8. the equipment of full-automatic wafer test method as claimed in claim 6, it is characterized in that: the wafer suction disc device (629) that cover (601) top is provided with in the tubulose that the longitudinal direction that wafer absorption in the wafer test platform device (3) and lowering device (6) comprise frame is provided with, cover (601) links to each other with whirligig with jacking gear in described, this wafer suction disc device (629) is included in the well heater (637) that is provided with between negative pressure sucker (635) and the thermal insulating disc (636), be provided with some second negative pressure air drains (638) at negative pressure sucker (635) upper surface, in negative pressure sucker (635), be provided with the negative pressure pore (639) that is communicated with the second negative pressure air drain (638), on negative pressure sucker (635), be provided with negative pressure gas-tpe fitting (640), described negative pressure gas-tpe fitting (640) is communicated with negative pressure pore (639), on negative pressure sucker (635), be provided with and run through negative pressure sucker (635), the dumping pit (641) of well heater (637) and thermal insulating disc (636), be provided with thimble (630) and thimble apparatus for controlling of lifting in the dumping pit (641), the concentric circles cell body that the second negative pressure air drain (638) in wafer absorption and the lowering device (6) is offered for negative pressure sucker (635) upper surface, between negative pressure sucker (635) and well heater (637), be provided with hot buffer disc (642), place, interior cover (601) bottom outer wall is provided with ball sliding bush (615), ball sliding bush (615) outer wall is with chuck (609), described chuck (609) is located in the overcoat (610) that fixedly installs and with overcoat (610) and is rotationally connected, longitudinal leadscrew (617) withstands on interior cover (601) bottom and links to each other with its drive unit, interior cover (601) is provided with the rocking bar (621) that crosses out, the other end of rocking bar (621) links to each other with whirligig, wafer suction disc device (629) below in wafer absorption and lowering device (6) is provided with tie-plate (628), be set with thimble upper plate (603) and thimble lower plate (607) below the tie-plate (628), plate (604) in the thimble is slidingly connected between thimble upper plate (603) and the thimble lower plate (607), the last Plane Installation of plate in thimble (604) is fixed with ejector retainner plate (627), plate in the thimble (604) is by thimble leading screw (605), this thimble leading screw (605) links to each other with its drive unit, be provided with thimble installing plate (632) on the thimble upper plate (603) in wafer absorption and lowering device (6), on thimble installing plate (632), be fixed with the thimble (630) that inserts in the dumping pit (641), be socketed with back-moving spring (631) outside the thimble (630) between thimble installing plate (632) and negative pressure sucker (635).
9. the equipment of full-automatic wafer test method as claimed in claim 8, it is characterized in that: be provided with cover plate (645) between well heater (637) in wafer absorption and lowering device (6) and the thermal insulating disc (636), wafer suction disc device (629) is provided with the lower convex ring (643) that stretches out to thermal insulating disc (636) at the lower surface of negative pressure sucker (635), correspondingly be provided with the last bulge loop (644) that stretches out to negative pressure sucker (635) at thermal insulating disc (636) upper surface, the lower surface of lower convex ring (643) contacts with last bulge loop (644) upper surface and with well heater (637), buffer disc (642) contains in it with cover plate (645).
10. the equipment of full-automatic wafer test method as claimed in claim 6, it is characterized in that: that puts that sheet and piece counting apparatus (1) fixedly install on screw mandrel (101) puts sheet platform (102), be provided with film magazine (103) on the sheet platform (102) putting, and describedly put sheet and piece counting apparatus (1) has two groups, they are separately positioned on the both sides of wafer transfer device (2) and are oppositely arranged, and are provided with cushion blocking (310) at the place, bottom of underframe (302).
CN 200810023656 2008-04-14 2008-04-14 Full-automatic wafer test method and equipment accomplishing the method CN101261306B (en)

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